TW201706319A - (meth)acrylate resin and optical member - Google Patents
(meth)acrylate resin and optical member Download PDFInfo
- Publication number
- TW201706319A TW201706319A TW105113067A TW105113067A TW201706319A TW 201706319 A TW201706319 A TW 201706319A TW 105113067 A TW105113067 A TW 105113067A TW 105113067 A TW105113067 A TW 105113067A TW 201706319 A TW201706319 A TW 201706319A
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- acrylate
- acrylate resin
- resin
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
Abstract
Description
本發明係關於一種硬化物之耐熱性或耐吸濕性、耐黃變性優異之(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及光學構件。 The present invention relates to a (meth) acrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of a cured product, a photocurable composition containing the same, a cured product thereof, and an optical member.
搭載於CCD或CMOS等影像感測器之晶載透鏡(on-chip lens)廣泛利用藉由對熱塑性樹脂賦予點圖案,並利用熱流使之球面透鏡形狀化之熔融法所製造者,但球面透鏡由於色像差較大,故而高精細、高感度化存在極限。又,難以利用該熔融法實現窄間隙之透鏡賦形。作為可減少色像差且可實現窄間隙之透鏡賦形之技術,提出有藉由非球面透鏡形狀之模對光硬化性樹脂進行賦形之形狀轉印法。光硬化性樹脂係由具有(甲基)丙烯醯基等光聚合性基之樹脂或單體等構成,藉由包含大量低分子量成分而可實現低黏度化,故而係可實現微細之形狀賦形之材料。然而,於用於晶載透鏡用途時耐熱性或耐濕性並不足而容易產生黃變或變形。 An on-chip lens mounted on an image sensor such as a CCD or a CMOS is widely used by a melting method in which a dot pattern is applied to a thermoplastic resin and a spherical lens is shaped by heat flow, but a spherical lens is used. Since the chromatic aberration is large, there is a limit to high definition and high sensitivity. Moreover, it is difficult to achieve lens formation with a narrow gap by this melting method. As a technique for reducing the chromatic aberration and achieving lens formation with a narrow gap, a shape transfer method in which a photocurable resin is shaped by a mold having an aspherical lens shape has been proposed. The photocurable resin is composed of a resin or a monomer having a photopolymerizable group such as a (meth) acrylonitrile group, and can have a low viscosity by containing a large amount of a low molecular weight component, so that a fine shape can be formed. Material. However, when used for a crystal-loaded lens, heat resistance or moisture resistance is insufficient and yellowing or deformation is likely to occur.
作為耐吸濕性等優異之光硬化性樹脂,例如已知有使雙酚A型環氧樹脂與甲基丙烯酸酐反應而獲得之光硬化性樹脂(參照專利文獻1)。此種芳香環含有率較高之樹脂雖表現出相對較高之耐熱性,但於用於 晶載透鏡用途時耐熱性及耐濕性均不足而容易產生黃變或變形。 For example, a photocurable resin obtained by reacting a bisphenol A epoxy resin with methacrylic anhydride is known as a photocurable resin which is excellent in moisture absorption resistance (see Patent Document 1). Such a resin having a high aromatic ring content exhibits relatively high heat resistance, but is used for When the crystal lens is used, the heat resistance and the moisture resistance are insufficient, and yellowing or deformation is likely to occur.
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2008-038029號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-038029
因此,本發明所欲解決之課題在於提供一種硬化物之耐熱性或耐吸濕性、耐黃變性優異之(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及光學構件。 Therefore, an object of the present invention is to provide a (meth) acrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of a cured product, a photocurable composition containing the same, a cured product thereof, and an optical member. .
本發明者等人為了解決上述課題而進行了努力研究,結果發現,使芳香族二環氧丙醚化合物與(甲基)丙烯酸及甲基丙烯酸酐反應而獲得之甲基丙烯酸酯樹脂其硬化物之耐熱性或耐吸濕性、耐黃變性優異,從而完成了本發明。 In order to solve the above problems, the inventors of the present invention have conducted an effort to find a cured product of a methacrylate resin obtained by reacting an aromatic diglycidyl ether compound with (meth)acrylic acid and methacrylic anhydride. The present invention has been completed in that it is excellent in heat resistance, moisture absorption resistance, and yellowing resistance.
即,本發明係關於一種(甲基)丙烯酸酯樹脂,其特徵在於:其係將芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)作為必需之反應成分的反應物。 That is, the present invention relates to a (meth) acrylate resin characterized by comprising an aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C). ) a reactant as an essential reaction component.
本發明進而係關於一種(甲基)丙烯酸酯樹脂,其特徵在於:具有下述通式(1)所表示之分子結構,
(式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,n為1~4之整數) (wherein R 2 is each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; and R 3 is independently a carbon number; Any of an alkyl group of 1 to 4, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and n is an integer of 1 to 4)
Y為氫原子或甲基丙烯醯基],且樹脂中所存在之Y之至少一個為甲基丙烯醯基。 Y is a hydrogen atom or a methacryl fluorenyl group, and at least one of Y present in the resin is a methacryl fluorenyl group.
本發明進而係關於一種含有上述(甲基)丙烯酸酯樹脂、及光聚合起始劑之光硬化性組成物。 The present invention further relates to a photocurable composition containing the above (meth) acrylate resin and a photopolymerization initiator.
本發明進而係關於一種上述硬化性組成物之硬化物。 The present invention further relates to a cured product of the above curable composition.
本發明進而係關於一種使用硬化性組成物而成之光學構件。 The present invention further relates to an optical member in which a curable composition is used.
根據本發明,可提供一種硬化物之耐熱性或耐吸濕性、耐黃變性優異之(甲基)丙烯酸酯樹脂、含有其之光硬化性組成物與其硬化物、及光學構件。 According to the present invention, a (meth) acrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of a cured product, a photocurable composition containing the same, a cured product thereof, and an optical member can be provided.
圖1係於實施例1中獲得之(甲基)丙烯酸酯樹脂(1)之GPC圖。 Fig. 1 is a GPC chart of the (meth) acrylate resin (1) obtained in Example 1.
以下,對本發明詳細地進行說明。 Hereinafter, the present invention will be described in detail.
本發明之(甲基)丙烯酸酯樹脂之特徵在於:其係將芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)作為必需之反應成分的反應物。即,本發明藉由將(甲基)丙烯酸(B)與甲基丙烯酸酐(C)併用作為芳香族二環氧丙醚化合物(A)之(甲基)丙烯酸酯化劑,而與習知之所謂環氧丙烯酸酯樹脂相比,成功地實現了硬化物之耐熱性或耐吸濕性、耐黃變性優異之光硬化性樹脂材料。 The (meth) acrylate resin of the present invention is characterized in that it is an essential reaction of an aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C). The reactants of the ingredients. That is, the present invention is conventionally used by using (meth)acrylic acid (B) and methacrylic anhydride (C) as a (meth) acrylate-forming agent of the aromatic diglycidyl ether compound (A). The photocurable resin material which is excellent in heat resistance, moisture absorption resistance, and yellowing resistance of the cured product is successfully obtained as compared with the epoxy acrylate resin.
本發明所使用之芳香族二環氧丙醚化合物(A)例如可列舉:雙酚型環氧樹脂、聯苯型環氧樹脂、苯醚型環氧樹脂、萘醚型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯-苯酚加 成反應型環氧樹脂等,更具體而言,可列舉下述結構式(3-1)~(3-8)之任一者所表示之化合物等。 Examples of the aromatic diglycidyl ether compound (A) used in the present invention include a bisphenol epoxy resin, a biphenyl epoxy resin, a phenyl ether epoxy resin, a naphthalene ether epoxy resin, and a phenol aryl group. Alkyl epoxy resin, naphthol aralkyl epoxy resin, dicyclopentadiene-phenol plus More specifically, a compound represented by any one of the following structural formulae (3-1) to (3-8), and the like can be mentioned.
式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,G表示環氧丙基,又,n為1~4之整數) In the formula, R 2 is each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and R 3 is independently a carbon number of 1 Any of an alkyl group of ~4, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, G represents an epoxypropyl group, and n is an integer of 1 to 4)
該等既可分別單獨使用,亦可併用2種以上。其中,就獲得硬化物之耐熱性或耐吸濕性、耐黃變性優異之甲基丙烯酸酯樹脂之方面而言,較佳為上述結構式(3-1)表示之化合物。 These may be used alone or in combination of two or more. In particular, the compound represented by the above structural formula (3-1) is preferred from the viewpoint of obtaining a methacrylate resin excellent in heat resistance, moisture absorption resistance, and yellowing resistance of the cured product.
上述(甲基)丙烯酸(B)可為丙烯酸或甲基丙烯酸之任一者,亦可併用兩者。其中,就成為硬化物之耐熱性優異之(甲基)丙烯酸酯樹脂之方面而言,較佳為甲基丙烯酸。又,就對硬化物進行加熱時不易產生氣體之方面而言,較佳為丙烯酸。 The (meth)acrylic acid (B) may be either acrylic acid or methacrylic acid, or both may be used in combination. Among them, methacrylic acid is preferred in terms of a (meth) acrylate resin which is excellent in heat resistance of a cured product. Further, acrylic acid is preferred in that it is hard to generate a gas when the cured product is heated.
於本發明之(甲基)丙烯酸酯樹脂之製造中,關於上述芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)之反應比率,相對於芳香族二環氧丙醚化合物(A)中之環氧基1莫耳,較佳為於合計為0.9~1.1莫耳之範圍內使用(甲基)丙烯酸(B)與甲基丙烯酸酐(C)。 In the production of the (meth) acrylate resin of the present invention, the reaction ratio of the above aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C), It is preferred to use (meth)acrylic acid (B) and methacrylic anhydride in a range of from 0.9 to 1.1 moles in total with respect to the epoxy group 1 mole in the aromatic diglycidyl ether compound (A). (C).
又,就成為硬化物之耐熱性或耐吸濕性、耐黃變性優異之甲基丙烯酸酯樹脂之方面而言,較佳為(甲基)丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]之值為1/9~6/4之範圍。 Further, in terms of a methacrylate resin which is excellent in heat resistance, moisture absorption resistance and yellowing resistance of a cured product, it is preferably (meth)acrylic acid (B) and methacrylic anhydride (C). The ratio of the ear ratio [(B)/(C)] is in the range of 1/9 to 6/4.
於本發明中,(甲基)丙烯酸酯樹脂之製造方法並無特別限定,例如可列舉如下方法,即:於酯化反應觸媒、抗氧化劑、聚合抑制劑之存在下視需要使用有機溶劑,使芳香族二環氧丙醚化合物(A)、(甲基)丙烯酸(B)、及甲基丙烯酸酐(C)於100~150℃之溫度範圍內反應5~12小時左右。 In the present invention, the method for producing the (meth) acrylate resin is not particularly limited, and examples thereof include an organic solvent in the presence of an esterification reaction catalyst, an antioxidant, and a polymerization inhibitor, if necessary. The aromatic diglycidyl ether compound (A), (meth)acrylic acid (B), and methacrylic anhydride (C) are reacted in a temperature range of 100 to 150 ° C for about 5 to 12 hours.
利用此種方法製造之本發明之(甲基)丙烯酸酯樹脂例如可列舉具有下述通式(1)所表示之分子結構,
[式中,R1為氫原子或甲基,X為下述通式(2-1)~(2-8)之任一者所表示之結構部位,
(式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,n為1~4之整數) (wherein R 2 is each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; and R 3 is independently a carbon number; Any of an alkyl group of 1 to 4, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and n is an integer of 1 to 4)
Y為氫原子或甲基丙烯醯基],且樹脂中所存在之Y之至少一個為甲基丙烯醯基者。 Y is a hydrogen atom or a methacryl fluorenyl group, and at least one of Y present in the resin is a methacryl oxime group.
具有上述通式(1)所表示之分子結構之樹脂成分具體而言可列舉下述通式(1-1)~(1-3)之任一者所表示之化合物。 Specific examples of the resin component having the molecular structure represented by the above formula (1) include compounds represented by any one of the following formulae (1-1) to (1-3).
[式中,R1為氫原子或甲基,X為下述通式(2-1)~(2-8)之任一者所表示之結構部位,
(式中,R2分別獨立地為氫原子、碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,R3分別獨立地為碳原子數1~4之烷基、碳原子數1~4之烷氧基、苯基之任一者,n為1~4之整數)] (wherein R 2 is each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; and R 3 is independently a carbon number; Any of an alkyl group of 1 to 4, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group, and n is an integer of 1 to 4)]
就硬化物之耐熱性或耐吸濕性、耐黃變性優異之方面而言,本發明之甲基丙烯酸酯樹脂根據原料之添加量而算出之(甲基)丙烯醯基當量較佳為160~230g/當量之範圍。 The methacrylate resin of the present invention preferably has a (meth) acrylonitrile equivalent of 160 to 230 g, which is calculated based on the amount of the raw material added, in terms of heat resistance, moisture absorption resistance, and yellowing resistance of the cured product. / range of equivalents.
本發明之光硬化性組成物含有上述甲基丙烯酸酯樹脂與光聚合起始劑。 The photocurable composition of the present invention contains the above methacrylate resin and a photopolymerization initiator.
此處所使用之光聚合起始劑例如可列舉:如二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、苯偶醯二甲基縮酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮、1-羥基環己基苯基酮、2-甲基-2-嗎啉基(4-硫代甲基苯基)丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)丁酮之苯乙酮系;如安息香、安息香甲醚、安息香異丙醚之安息香類;如2,4,6-三甲基安息香二苯基氧化膦之醯基氧化膦系;苯偶醯、苯甲醯甲酸甲酯等分子內鍵裂解型光聚合起始劑;或如二苯甲酮、鄰苯甲醯基苯甲酸甲酯-4-苯基二苯甲酮、4,4'-二氯二苯甲酮、羥基二苯甲酮、4-苯甲醯基-4'-甲基-二苯硫醚、丙烯基化二苯甲酮、3,3',4,4'-四(過氧化第三丁基羰基)二苯甲酮、3,3'-二甲基-4-甲氧基二苯甲酮之二苯甲酮系;如2-異丙基9-氧硫、2,4-二甲基9-氧硫、2,4-二乙基9-氧硫、2,4-二氯9-氧硫之9-氧硫系;如米其勒酮、4,4'-二乙基胺基二苯甲酮之胺基二苯甲酮系;及10-丁基-2-氯吖啶酮、2-乙基蒽醌、9,10-菲醌、樟腦醌等分子內奪氫型光聚合起始劑。該等既可分別單獨使用,亦可併用2 種以上。 The photopolymerization initiator used herein may, for example, be diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one or benzoin dimethyl ketal. 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl) ketone , 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-morpholinyl (4-thiomethylphenyl)propan-1-one, 2-benzyl-2-dimethylamino-1 -(4-morpholinylphenyl)butanone of acetophenone; such as benzoin, benzoin methyl ether, benzoin of benzoin isopropyl ether; such as 2,4,6-trimethylbenzoin diphenylphosphine oxide a fluorenylphosphine oxide system; an intramolecular bond cleavage type photopolymerization initiator such as benzophenone or methyl benzoate; or a benzophenone or methyl benzoyl benzoate-4-phenyl Benzene, 4,4'-dichlorobenzophenone, hydroxybenzophenone, 4-benzylidene-4'-methyl-diphenyl sulfide, acrylated benzophenone, 3, 3',4,4'-tetra(perbutyl peroxide) benzophenone, 3,3'-dimethyl-4-methoxybenzophenone benzophenone; -isopropyl 9-oxosulfur 2,4-dimethyl 9-oxosulfur 2,4-diethyl 9-oxosulfur 2,4-dichloro 9-oxosulfur 9-oxygen sulfur Aminobenzophenone series such as mazinone, 4,4'-diethylaminobenzophenone; and 10-butyl-2-chloroacridone, 2-ethylhydrazine , 9,10-phenanthrenequinone, camphorquinone and other intramolecular hydrogen abstraction photopolymerization initiator. These may be used alone or in combination of two or more.
該等光聚合起始劑之市售品例如可列舉:「Irgacure-184」、「Irgacure-149」、「Irgacure-261」、「Irgacure-369」、「Irgacure-500」、「Irgacure-651」、「Irgacure-754」、「Irgacure-784」、「Irgacure-819」、「Irgacure-907」、「Irgacure-1116」、「Irgacure-1664」、「Irgacure-1700」、「Irgacure-1800」、「Irgacure-1850」、「Irgacure-2959」、「Irgacure-4043」、「Darocure-1173」(Ciba Specialty Chemicals公司製造)、「Lucirin TPO」(BASF公司製造)、「Kayacure-DETX」、「Kayacure-MBP」、「Kayacure-DMBI」、「Kayacure-EPA」、「Kayacure-OA」(日本化藥股份有限公司製造)、「Vicure-10」、「Vicure-55」(Stauffer Chemical公司製造)、「Trigonal P1」(akzo公司製造)、「Sandray 1000」(SANDOZ公司製造)、「DEAP」(Upjohn公司製造)、「Quantacure-PDO」、「Quantacure-ITX」、「Quantacure-EPD」(Ward Blenkinsop公司製造)等。 Commercial products of such photopolymerization initiators include, for example, "Irgacure-184", "Irgacure-149", "Irgacure-261", "Irgacure-369", "Irgacure-500", "Irgacure-651". , Irgacure-754, Irgacure-784, Irgacure-819, Irgacure-907, Irgacure-1116, Irgacure-1664, Irgacure-1700, Irgacure-1800, Irgacure-1850", "Irgacure-2959", "Irgacure-4043", "Darocure-1173" (manufactured by Ciba Specialty Chemicals), "Lucirin TPO" (manufactured by BASF), "Kayacure-DETX", "Kayacure-MBP" "Kayacure-DMBI", "Kayacure-EPA", "Kayacure-OA" (manufactured by Nippon Kayaku Co., Ltd.), "Vicure-10", "Vicure-55" (manufactured by Stauffer Chemical Co., Ltd.), "Trigonal P1" (made by akzo), "Sandray 1000" (made by SANDOZ), "DEAP" (made by Upjohn), "Quantacure-PDO", "Quantacure-ITX", "Quantacure-EPD" (made by Ward Blenkinsop), etc. .
上述光聚合起始劑之添加量例如係於相對於光硬化性組成物100質量份為1~20質量份之範圍內使用。 The amount of the photopolymerization initiator to be added is, for example, 1 to 20 parts by mass based on 100 parts by mass of the photocurable composition.
本發明之光硬化性組成物此外亦可含有上述甲基丙烯酸酯樹脂以外之其他(甲基)丙烯酸酯化合物或光敏劑、硬化促進劑、有機溶劑、非反應性樹脂、填料、無機填充劑、有機填充劑、偶合劑、黏著賦予劑、消泡劑、調平劑、密接助劑、脫模劑、潤滑劑、紫外線吸收劑、抗氧化劑、熱穩定劑、塑化劑、難燃劑、顏料、染料等添加劑成分。 The photocurable composition of the present invention may further contain a (meth) acrylate compound or a photosensitizer other than the above methacrylate resin, a curing accelerator, an organic solvent, a non-reactive resin, a filler, an inorganic filler, Organic filler, coupling agent, adhesion-imparting agent, antifoaming agent, leveling agent, adhesion aid, mold release agent, lubricant, ultraviolet absorber, antioxidant, heat stabilizer, plasticizer, flame retardant, pigment Additives such as dyes.
上述其他(甲基)丙烯酸酯化合物例如可列舉:(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正戊酯、
(甲基)丙烯酸正己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環氧丙酯、嗎福啉(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-丁氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸2-(2-乙氧基乙氧基)乙酯、4-壬基苯氧基乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸四氫糠酯、己內酯改質(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸環己基甲酯、(甲基)丙烯酸環己基乙酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸二環戊氧基乙酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯氧基2-甲基乙酯、(甲基)丙烯酸苯氧基乙氧基乙酯、(甲基)丙烯酸對異丙苯基苯氧基乙酯、(甲基)丙烯酸苯氧基苄酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、(甲基)丙烯酸苯基苄酯、丙烯酸苯基苯氧基乙酯、六氫鄰苯二甲酸2-丙烯醯氧基乙酯、下述通式(4)或(5)所表示之含茀骨架之單(甲基)丙烯酸酯化合物等單(甲基)丙烯酸酯化合物;
[式中,X為氫原子或羥基,R1及R4分別獨立地為氫原子或碳原子數為1~3之烷基,R2為氫原子或甲基,R3為直接鍵或亞甲基,m為0或1] Wherein X is a hydrogen atom or a hydroxyl group, and R 1 and R 4 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; R 2 is a hydrogen atom or a methyl group; and R 3 is a direct bond or a sub Methyl, m is 0 or 1]
[式中,2個X分別獨立地為氫原子或羥基,2個R1分別獨立地為氫原子或碳原子數為1~3之烷基,R2為氫原子或甲基,m及n分別獨立地為0或1] [wherein, two X's are each independently a hydrogen atom or a hydroxyl group, and two R 1 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and R 2 is a hydrogen atom or a methyl group, m and n Independently 0 or 1]
乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、雙酚A二(甲基)丙烯酸酯、雙酚F二(甲基)丙烯酸酯、二(甲基)丙烯酸雙環戊酯、二(甲基)丙烯酸甘油酯、新戊二醇羥基新戊酸酯二(甲基)丙烯酸酯、己內酯改質羥基新戊酸新戊二醇二(甲基)丙烯酸酯、四溴雙酚A二(甲基)丙烯酸酯、羥基新戊醛改質三羥甲基丙烷二(甲基)丙烯酸酯、1,4-環己烷二甲醇二(甲基)丙烯酸酯、雙[(甲基)丙烯醯基甲基]聯苯、下述通式(6)或(7)所表示之含茀骨架之二(甲基)丙烯酸酯化合物等二(甲基)丙烯酸酯化合物;
[式中,X分別獨立地為氫原子或羥基,R1分別獨立地為氫原子或碳原子數為1~3之烷基,R2分別獨立地為氫原子或甲基,R3分別獨立地為直接鍵或亞甲基,m及n分別獨立地為0或1] [wherein, X is each independently a hydrogen atom or a hydroxyl group, and R 1 is each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and R 2 is independently a hydrogen atom or a methyl group, and R 3 is independently The ground is a direct bond or a methylene group, and m and n are each independently 0 or 1]
[式中,2個X分別獨立地為氫原子或羥基,2個R1分別獨立地為氫原子或碳原子數為1~3之烷基,2個R2分別獨立地為氫原子或甲基,m及n分別獨立地為0或1] [wherein, two X are each independently a hydrogen atom or a hydroxyl group, and two R 1 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and two R 2 are each independently a hydrogen atom or a Base, m and n are independently 0 or 1]
三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、三(甲基)丙烯酸甘油酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等3官能以上之(甲基)丙烯酸酯化合物;使丁烷-1,4-二異氰酸酯、六亞甲基二異氰酸酯、2,2,4-三甲基六亞甲基二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯、苯二甲基二異氰酸酯、間四甲基苯二甲基二異氰酸酯、環己烷-1,4-二異氰酸酯、異佛爾酮二異氰酸酯、離胺酸二異氰酸酯、二環己基甲烷-4,4'-二異氰酸酯、1,3-雙(異氰酸酯基甲基)環己烷、甲基環己烷二異氰酸酯、1,5-萘二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、2,2'-雙(對苯基異氰酸酯)丙烷、4,4'-二苄基二異氰酸酯、二烷基二苯甲烷二異氰酸酯、四烷基二苯甲烷二異氰酸酯、1,3-苯二異氰酸酯、1,4-苯二異氰酸酯、甲苯二異氰酸酯等二異氰酸酯化合物或該等之尿酸酯改質體與丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、丙烯酸4-羥基丁酯、二丙烯酸甘油酯、三羥甲基丙烷二丙烯酸酯、新戊四醇三丙烯酸酯、二新戊四醇五丙烯酸酯等含羥基之(甲基)丙烯酸酯化合物反應而獲得之(甲基)丙 烯酸胺酯等。該等其他(甲基)丙烯酸酯化合物既可分別單獨使用,亦可併用2種以上。 Trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tris(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, two a trifunctional or higher (meth) acrylate compound such as pentaerythritol penta (meth) acrylate or dipentaerythritol hexa (meth) acrylate; butane-1,4-diisocyanate, hexa Methyl diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, benzodimethyl diisocyanate, m-tetramethylbenzene Methyl diisocyanate, cyclohexane-1,4-diisocyanate, isophorone diisocyanate, diazonic acid diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, 1,3-bis(isocyanate group) Methyl)cyclohexane, methylcyclohexane diisocyanate, 1,5-naphthalene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,2'-bis(p-phenylisocyanate)propane, 4, 4'-dibenzyldiisocyanate, dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate, 1,3-benzenediisocyanate, 1,4-phenylene diisocyanate, toluene diisocyanate Diisocyanate compounds such as esters or such urate modified bodies with 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, glyceryl diacrylate, trimethylolpropane diacrylate (meth) propyl obtained by reacting a hydroxyl group-containing (meth) acrylate compound such as pentaerythritol triacrylate or dipentaerythritol pentaacrylate Ethyl amide and the like. These other (meth) acrylate compounds may be used alone or in combination of two or more.
本發明之光硬化性組成物其硬化物尤其表現出較高之耐熱性、耐濕性及耐黃變性,因此可用於電子零件或成形品用途、塗佈用途等各種用途。尤其是可有效利用耐黃變性優異之特徵而較佳地用於光學構件用途。作為光學構件,例如可列舉:眼鏡透鏡、CCD或CMOS等影像感測器用晶載透鏡、菲涅耳透鏡、稜鏡透鏡等塑膠透鏡;及光學用保護劑、硬塗劑、抗反射膜、光纖、光波導、全像圖、稜鏡透鏡、LED密封材料、太陽光電池用塗佈材等。 The cured product of the photocurable composition of the present invention exhibits high heat resistance, moisture resistance, and yellowing resistance, and thus can be used for various applications such as electronic parts, molded articles, and coating applications. In particular, it is effective to utilize the characteristics excellent in yellowing resistance and is preferably used for optical member applications. Examples of the optical member include a lens lens, a crystal lens for an image sensor such as a CCD or a CMOS, a plastic lens such as a Fresnel lens or a 稜鏡 lens, and an optical protective agent, a hard coating agent, an anti-reflection film, and an optical fiber. , optical waveguides, holograms, 稜鏡 lenses, LED sealing materials, coating materials for solar cells, etc.
上述晶載透鏡或稜鏡透鏡例如係藉由使用了形成有透鏡圖案之模具或者樹脂模等賦形模之形狀轉印法而製造。具體而言,可列舉如下方法,即:將光硬化性組成物塗佈於賦形模,使透明基材重疊於組成物表面,並自該透明基材側照射活性能量線而使之硬化。此處所使用之透明基材可列舉由丙烯酸樹脂、聚碳酸酯樹脂、聚酯樹脂、聚苯乙烯樹脂、氟樹脂、聚醯亞胺樹脂構成之塑膠基材或玻璃等。 The crystal carrier lens or the ruthenium lens is produced, for example, by a shape transfer method using a mold such as a mold or a resin mold in which a lens pattern is formed. Specifically, a method in which a photocurable composition is applied to a shaping die, a transparent substrate is superposed on the surface of the composition, and an active energy ray is irradiated from the transparent substrate side to be cured. The transparent substrate used herein may, for example, be a plastic substrate made of an acrylic resin, a polycarbonate resin, a polyester resin, a polystyrene resin, a fluororesin or a polyimide resin, or glass.
利用該方法製造之透鏡薄片既可貼附於透明基材而直接使用,亦可將透明基材剝離後以透鏡單獨之狀態使用。於貼附於透明基材而直接使用之情形時,為了提高透鏡與透明基材之接著性,較佳為預先對透明基材表面實施底塗處理等接著性提高處理。另一方面,於將透明基材剝離後使用之情形時,較佳為以可容易地將該透明基材剝離之方式利用聚矽氧或氟系剝離劑對透明基材之表面預先進行處理。 The lens sheet produced by this method can be directly used by being attached to a transparent substrate, or the transparent substrate can be peeled off and used as a lens alone. In the case of being directly applied to a transparent substrate, in order to improve the adhesion between the lens and the transparent substrate, it is preferred to perform an adhesion improving treatment such as a primer treatment on the surface of the transparent substrate in advance. On the other hand, in the case where the transparent substrate is used after being peeled off, it is preferred that the surface of the transparent substrate is treated in advance by a polyfluorene oxide or a fluorine-based release agent so that the transparent substrate can be easily peeled off.
於將本發明之光硬化性組成物用於此種賦形透鏡用之情形 時,較理想為併用本發明之甲基丙烯酸酯樹脂與上述其他(甲基)丙烯酸酯化合物,並將光硬化性組成物之黏度(25℃)調整為成為100mPa‧s~800mPa‧s之範圍。所使用之其他(甲基)丙烯酸酯化合物係根據所需之性能而適當選擇,例如較理想為以硬化物之折射率成為1.5560以上之方式進行調整。 In the case where the photocurable composition of the present invention is used for such a shaped lens Preferably, the methacrylate resin of the present invention and the above other (meth) acrylate compound are used in combination, and the viscosity (25 ° C) of the photocurable composition is adjusted to be in the range of 100 mPa ‧ to 800 mPa ‧ s . The other (meth) acrylate compound to be used is appropriately selected depending on the desired properties. For example, it is preferred to adjust the refractive index of the cured product to 1.5560 or more.
[實施例] [Examples]
以下,利用實施例及比較例對本發明更詳細地進行說明。 Hereinafter, the present invention will be described in more detail by way of examples and comparative examples.
實施例1(甲基)丙烯酸酯樹脂(1)之製造 Production of Example 1 (meth) acrylate resin (1)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸86質量份、甲基丙烯酸酐154質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(1)。根據(甲基)丙烯酸酯樹脂(1)之原料之添加量而算出之(甲基)丙烯醯基當量為205g/當量。再者,甲基丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為5/5。 374 parts by mass of bisphenol A type epoxy resin ("EPICLON 850-S" epoxy equivalent 187 g/eq. by DIC Co., Ltd.) was added to a flask equipped with a thermometer, a stirrer, and a reflux cooler, and added as an anti-antibody. 0.6 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 86 parts by mass of methacrylic acid, 154 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine were added. The (meth) acrylate resin (1) was obtained by performing an esterification reaction at 110 ° C for 10 hours while blowing air. The (meth)acryl oxime equivalent calculated from the amount of the raw material of the (meth) acrylate resin (1) was 205 g/eq. Further, the molar ratio [(B)/(C)] of methacrylic acid (B) to methacrylic anhydride (C) was 5/5.
實施例2(甲基)丙烯酸酯樹脂(2)之製造 Example 2 Production of (meth) acrylate resin (2)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸52質量份、甲基丙烯酸酐216質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(2)。根據(甲基)丙烯酸酯樹 脂(2)之原料之添加量而算出之(甲基)丙烯醯基當量為188g/當量。再者,甲基丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為3/7。 374 parts by mass of bisphenol A type epoxy resin ("EPICLON 850-S" epoxy equivalent 187 g/eq. by DIC Co., Ltd.) was added to a flask equipped with a thermometer, a stirrer, and a reflux cooler, and added as an anti-antibody. 0.6 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 52 parts by mass of methacrylic acid, 216 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine were added. The (meth) acrylate resin (2) was obtained by blowing air at 110 ° C for 10 hours for esterification. According to the (meth) acrylate tree The (meth)acryl oxime equivalent calculated from the amount of the raw material of the fat (2) was 188 g/eq. Further, the molar ratio [(B)/(C)] of methacrylic acid (B) to methacrylic anhydride (C) was 3/7.
實施例3(甲基)丙烯酸酯樹脂(3)之製造 Production of Example 3 (meth) acrylate resin (3)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.7質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸17質量份、甲基丙烯酸酐278質量份、三苯基膦2.0質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(3)。根據(甲基)丙烯酸酯樹脂(3)之原料之添加量而算出之(甲基)丙烯醯基當量為176g/當量。再者,甲基丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為1/9。 374 parts by mass of bisphenol A type epoxy resin ("EPICLON 850-S" epoxy equivalent 187 g/eq. by DIC Co., Ltd.) was added to a flask equipped with a thermometer, a stirrer, and a reflux cooler, and added as an anti-antibody. 0.7 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 17 parts by mass of methacrylic acid, 278 parts by mass of methacrylic anhydride, and 2.0 parts by mass of triphenylphosphine were added. The (meth) acrylate resin (3) was obtained by blowing air at 110 ° C for 10 hours for esterification. The (meth) acrylonitrile equivalent calculated from the amount of the raw material of the (meth) acrylate resin (3) was 176 g/eq. Further, the molar ratio [(B)/(C)] of methacrylic acid (B) to methacrylic anhydride (C) was 1/9.
實施例4(甲基)丙烯酸酯樹脂(4)之製造 Production of Example 4 (meth) acrylate resin (4)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸72質量份、甲基丙烯酸酐154質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(4)。根據(甲基)丙烯酸酯樹脂(4)之原料之添加量而算出之(甲基)丙烯醯基當量為200g/當量。再者,丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為5/5。 374 parts by mass of bisphenol A type epoxy resin ("EPICLON 850-S" epoxy equivalent 187 g/eq. by DIC Co., Ltd.) was added to a flask equipped with a thermometer, a stirrer, and a reflux cooler, and added as an anti-antibody. 0.6 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 72 parts by mass of acrylic acid, 154 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine were added and blown. The air was subjected to an esterification reaction at 110 ° C for 10 hours to obtain a (meth) acrylate resin (4). The (meth)acryl oxime equivalent calculated from the amount of the raw material of the (meth) acrylate resin (4) was 200 g/eq. Further, the molar ratio [(B)/(C)] of the acrylic acid (B) to the methacrylic anhydride (C) was 5/5.
實施例5(甲基)丙烯酸酯樹脂(5)之製造 Production of Example 5 (meth) acrylate resin (5)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹 脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.6質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸43質量份、甲基丙烯酸酐216質量份、三苯基膦1.8質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(5)。根據(甲基)丙烯酸酯樹脂(5)之原料之添加量而算出之(甲基)丙烯醯基當量為186g/當量。再者,丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為3/7。 Adding a bisphenol A type epoxy tree to a flask equipped with a thermometer, a stirrer, and a reflux cooler 374 parts by mass of "EPICLON 850-S" epoxy equivalent 187 g/eq. manufactured by DIC Co., Ltd., and 0.6 parts by mass of dibutylhydroxytoluene as an antioxidant, p-methoxyphenol as a thermal polymerization inhibitor After 0.2 parts by mass, 43 parts by mass of acrylic acid, 216 parts by mass of methacrylic anhydride, and 1.8 parts by mass of triphenylphosphine were added, and the mixture was subjected to an esterification reaction at 110 ° C for 10 hours while blowing air to obtain (meth)acrylic acid. Ester resin (5). The (meth)acryl oxime equivalent calculated from the amount of the raw material of the (meth) acrylate resin (5) was 186 g/eq. Further, the molar ratio [(B)/(C)] of the acrylic acid (B) to the methacrylic anhydride (C) was 3/7.
實施例6(甲基)丙烯酸酯樹脂(6)之製造 Production of Example 6 (meth) acrylate resin (6)
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.7質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸14質量份、甲基丙烯酸酐278質量份、三苯基膦2.0質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(6)。根據(甲基)丙烯酸酯樹脂(6)之原料之添加量而算出之(甲基)丙烯醯基當量為175g/當量。再者,丙烯酸(B)與甲基丙烯酸酐(C)之莫耳比[(B)/(C)]為1/9。 374 parts by mass of bisphenol A type epoxy resin ("EPICLON 850-S" epoxy equivalent 187 g/eq. by DIC Co., Ltd.) was added to a flask equipped with a thermometer, a stirrer, and a reflux cooler, and added as an anti-antibody. 0.7 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 14 parts by mass of acrylic acid, 278 parts by mass of methacrylic anhydride, and 2.0 parts by mass of triphenylphosphine were added and blown. The air was subjected to an esterification reaction at 110 ° C for 10 hours to obtain a (meth) acrylate resin (6). The (meth) acrylonitrile equivalent calculated from the amount of the raw material of the (meth) acrylate resin (6) was 175 g/eq. Further, the molar ratio [(B)/(C)] of the acrylic acid (B) to the methacrylic anhydride (C) was 1/9.
比較製造例1(甲基)丙烯酸酯樹脂(1')之製造 Comparative Production Example 1 (Meth) acrylate resin (1')
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.5質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加甲基丙烯酸172質量份、三苯基膦1.6質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲 基)丙烯酸酯樹脂(1')。根據(甲基)丙烯酸酯樹脂(1')之原料之添加量而算出之(甲基)丙烯醯基當量為273g/當量。 374 parts by mass of bisphenol A type epoxy resin ("EPICLON 850-S" epoxy equivalent 187 g/eq. by DIC Co., Ltd.) was added to a flask equipped with a thermometer, a stirrer, and a reflux cooler, and added as an anti-antibody. 0.5 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 172 parts by mass of methacrylic acid and 1.6 parts by mass of triphenylphosphine were added, and the air was blown at 110 ° C while blowing air. It is subjected to an esterification reaction for 10 hours to obtain (A Base) acrylate resin (1'). The (meth)acryl oxime equivalent calculated from the amount of the raw material of the (meth) acrylate resin (1') was 273 g/eq.
比較製造例2(甲基)丙烯酸酯樹脂(2')之製造 Comparative Production Example 2 (Meth) acrylate resin (2')
向具備溫度計、攪拌器、及回流冷卻器之燒瓶中加入雙酚A型環氧樹脂(DIC股份有限公司製造之「EPICLON 850-S」環氧當量187g/當量)374質量份,並添加作為抗氧化劑之二丁基羥基甲苯0.5質量份、作為熱聚合抑制劑之對甲氧苯酚0.2質量份後,添加丙烯酸144質量份、三苯基膦1.6質量份,一面吹送空氣一面於110℃使其等進行10小時酯化反應,獲得(甲基)丙烯酸酯樹脂(2')。根據(甲基)丙烯酸酯樹脂(2')之原料之添加量而算出之(甲基)丙烯醯基當量為259g/當量。 374 parts by mass of bisphenol A type epoxy resin ("EPICLON 850-S" epoxy equivalent 187 g/eq. by DIC Co., Ltd.) was added to a flask equipped with a thermometer, a stirrer, and a reflux cooler, and added as an anti-antibody. 0.5 parts by mass of dibutylhydroxytoluene as an oxidizing agent and 0.2 parts by mass of p-methoxyphenol as a thermal polymerization inhibitor, 144 parts by mass of acrylic acid and 1.6 parts by mass of triphenylphosphine were added, and the air was blown at 110 ° C while being blown. The esterification reaction was carried out for 10 hours to obtain a (meth) acrylate resin (2'). The (meth)acryl oxime equivalent calculated from the amount of the raw material of the (meth) acrylate resin (2') was 259 g/eq.
實施例7~12、比較例1、2 Examples 7 to 12, Comparative Examples 1, 2
使用實施例1~6及比較製造例1、2中所獲得之(甲基)丙烯酸酯樹脂並根據下述要領製備硬化性組成物及硬化物,進行各種評價試驗。將結果示於表1。 Using the (meth) acrylate resins obtained in Examples 1 to 6 and Comparative Production Examples 1 and 2, a curable composition and a cured product were prepared in accordance with the following procedures, and various evaluation tests were carried out. The results are shown in Table 1.
硬化性組成物之製備 Preparation of hardenable composition
向(甲基)丙烯酸酯樹脂100g中添加光聚合起始劑(BASF公司製造之『Irgacure184D』)1g,製備硬化性組成物。 1 g of a photopolymerization initiator ("Irgacure 184D" manufactured by BASF Corporation) was added to 100 g of the (meth) acrylate resin to prepare a curable composition.
玻璃轉移溫度之測定 Determination of glass transition temperature
將先前所獲得之硬化性組成物以膜厚成為100μm之方式塗佈於丙烯酸板上,並利用高壓水銀燈照射2000mJ/cm2之紫外線而獲得硬化物。 The curable composition obtained previously was applied onto an acrylic plate so as to have a film thickness of 100 μm, and irradiated with ultraviolet rays of 2000 mJ/cm 2 by a high pressure mercury lamp to obtain a cured product.
自所獲得之硬化物切出6mm×25mm之試片,使用黏彈性測定裝置(DMA:Rheometrics公司製造之固體黏彈性測定裝置「RSA-G2」,拉伸法: 頻率1Hz,升溫速度3℃/min)將彈性模數變化成為最大(tan δ變化率最大)之溫度評價為玻璃轉移溫度。 A test piece of 6 mm × 25 mm was cut out from the obtained cured product, and a viscoelasticity measuring device (DMA: solid viscoelasticity measuring device "RSA-G2" manufactured by Rheometrics Co., Ltd., stretching method was used: The temperature at which the frequency was changed to 1 Hz and the temperature rise rate was 3 ° C/min. The temperature at which the change in the elastic modulus was maximum (the maximum rate of change of tan δ) was evaluated as the glass transition temperature.
吸水率之測定 Determination of water absorption
自與玻璃轉移溫度之測定所使用者相同之硬化物切出6mm×25mm之試片,並將其於23℃之水中浸漬24小時。將浸漬前後之重量變化率評價為吸水率。 A 6 mm × 25 mm test piece was cut out from the same cured product as the glass transition temperature, and immersed in water at 23 ° C for 24 hours. The weight change rate before and after the immersion was evaluated as the water absorption rate.
耐黃變性之評價 Evaluation of yellowing resistance
將先前所獲得之硬化性組成物以膜厚成為100μm之方式塗佈於玻璃板上,並利用高壓水銀燈照射2000mJ/cm2之紫外線而獲得積層膜。 The curable composition obtained previously was applied onto a glass plate so as to have a film thickness of 100 μm, and an ultraviolet film of 2000 mJ/cm 2 was irradiated with a high-pressure mercury lamp to obtain a laminated film.
將所獲得之積層膜於265℃之烘箱中加熱3分鐘。針對加熱前後之試片測定420nm光之穿透率(%),並根據兩值之差量進行評價。 The obtained laminated film was heated in an oven at 265 ° C for 3 minutes. The transmittance (%) of 420 nm light was measured for the test piece before and after heating, and evaluated based on the difference between the two values.
產生氣體之評價 Gas generation evaluation
將先前所獲得之硬化性組成物以膜厚成為100μm之方式塗佈於玻璃板上,並利用高壓水銀燈照射1000mJ/cm2或2000mJ/cm2之紫外線而獲得積層膜。 The curable composition obtained previously was applied onto a glass plate so as to have a film thickness of 100 μm, and an ultraviolet film of 1000 mJ/cm 2 or 2000 mJ/cm 2 was irradiated with a high-pressure mercury lamp to obtain a laminated film.
將所獲得之積層膜於265℃之加熱板上加熱3分鐘。目視觀察此時是否產生氣體並進行評價。未產生氣體:○,產生氣體且存在發泡:× The obtained laminated film was heated on a hot plate at 265 ° C for 3 minutes. It was visually observed whether or not gas was generated at this time and evaluated. No gas is produced: ○, gas is generated and foaming is present: ×
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2015-098216 | 2015-05-13 | ||
JP2015098216 | 2015-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201706319A true TW201706319A (en) | 2017-02-16 |
TWI688581B TWI688581B (en) | 2020-03-21 |
Family
ID=57248831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105113067A TWI688581B (en) | 2015-05-13 | 2016-04-27 | (Meth)acrylate resin manufacturing method, optical member manufacturing method, curable composition manufacturing method, cured product manufacturing method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6168241B2 (en) |
CN (1) | CN107531831A (en) |
TW (1) | TWI688581B (en) |
WO (1) | WO2016181784A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7146409B2 (en) * | 2018-02-20 | 2022-10-04 | ヘンケルジャパン株式会社 | UV thermosetting adhesive composition |
JP7310802B2 (en) * | 2018-04-10 | 2023-07-19 | Dic株式会社 | Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512043B2 (en) * | 1972-10-28 | 1980-03-29 | ||
AT346268B (en) * | 1975-02-08 | 1978-11-10 | Werner & Pfleiderer | DEVICE FOR TRANSMITTING PIECES OF DUG FROM A FIRST TO A FOLLOWING SECOND CONVEYOR BELT |
JP3543409B2 (en) * | 1995-03-24 | 2004-07-14 | 大日本インキ化学工業株式会社 | Active energy ray-curable epoxy acrylate resin composition |
KR100351074B1 (en) * | 2000-07-05 | 2002-09-05 | 주식회사 덴키스트 | Photopolymerizable Composite Resin Compositions for Dental Restoration |
JP4687004B2 (en) * | 2003-04-30 | 2011-05-25 | Dic株式会社 | Curable resin composition, molding material and fuel cell separator |
CN1826361B (en) * | 2003-04-30 | 2010-06-09 | Dic株式会社 | Curable resin composition |
JP4873714B2 (en) * | 2007-01-12 | 2012-02-08 | 株式会社リコー | Electrophotographic photosensitive member, image forming method using the same, image forming apparatus, and process cartridge for image forming apparatus |
JP5057907B2 (en) * | 2007-09-11 | 2012-10-24 | 株式会社リコー | Electrophotographic apparatus and process cartridge |
WO2012165697A1 (en) | 2011-06-01 | 2012-12-06 | 주식회사 라온테크 | Solar cell module support assembly |
-
2016
- 2016-04-21 WO PCT/JP2016/062613 patent/WO2016181784A1/en active Application Filing
- 2016-04-21 CN CN201680027788.2A patent/CN107531831A/en active Pending
- 2016-04-21 JP JP2016560023A patent/JP6168241B2/en active Active
- 2016-04-27 TW TW105113067A patent/TWI688581B/en active
Also Published As
Publication number | Publication date |
---|---|
JPWO2016181784A1 (en) | 2017-05-25 |
TWI688581B (en) | 2020-03-21 |
WO2016181784A1 (en) | 2016-11-17 |
JP6168241B2 (en) | 2017-07-26 |
CN107531831A (en) | 2018-01-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4003800B2 (en) | Active energy ray-curable resin composition for film protective layer and film using the same | |
JP5141074B2 (en) | Impact-resistant adhesive layer, impact-resistant adhesive laminate, and display device | |
TWI551645B (en) | Radical-polymerizable composition, cured article and plastic lens | |
JP5189379B2 (en) | Resin composition, film using the same, and method for producing film | |
JPWO2014133052A1 (en) | Curable composition, transparent heat resistant material and use thereof | |
TWI417306B (en) | Curable sheet composition | |
KR102141376B1 (en) | Active energy ray-curable resin composition, cured product and lamination body | |
WO2010095475A1 (en) | (meth)acrylate resin and process for producing same, and curable resin composition, cured object obtained therefrom, and plastic lens | |
TWI655459B (en) | Light control panel and light imaging device | |
TWI688581B (en) | (Meth)acrylate resin manufacturing method, optical member manufacturing method, curable composition manufacturing method, cured product manufacturing method | |
WO2010137501A1 (en) | Energy ray-curable resin composition for optical lens sheet and cured product thereof | |
JPWO2007083749A1 (en) | Resin composition and optical member using cured product thereof | |
JP2020040869A (en) | Resin composition for laminated glass interlayer, laminated glass interlayer, film material for laminated glass interlayer, laminated glass, and laminated glass manufacturing method, image display device, resin composition for impact-resistant member, impact-resistant film and film material for impact-resistant film | |
JP6075443B2 (en) | Active energy ray-curable coating composition | |
JP2019112548A (en) | (meth)acrylate resin and optical member | |
JP2017090761A (en) | Protective sheet and manufacturing method of the same | |
JP2011033875A (en) | Energy ray curing type resin composition for optical lens, and optical lens | |
WO2014168173A1 (en) | Curable resin composition | |
JP2011037941A (en) | Curable resin composition, cured article thereof, and plastic lens | |
JP4952337B2 (en) | Impact-resistant adhesive laminate and display device | |
JP2014145051A (en) | Active energy ray-polymerizable resin composition and optical article | |
JP7363029B2 (en) | Resin composition for display substrates | |
JP2013043902A (en) | Curable resin composition and cured product | |
JP7072452B2 (en) | Photocurable composition | |
TWI708808B (en) | Active energy ray curable resin composition, cured product and optical sheet for optical articles |