TW201703961A - Method of forming vertical crack of brittle material substrate and dividing method of brittle material substrate capable of forming a vertical crack at the predetermined breaking position - Google Patents

Method of forming vertical crack of brittle material substrate and dividing method of brittle material substrate capable of forming a vertical crack at the predetermined breaking position Download PDF

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TW201703961A
TW201703961A TW105113935A TW105113935A TW201703961A TW 201703961 A TW201703961 A TW 201703961A TW 105113935 A TW105113935 A TW 105113935A TW 105113935 A TW105113935 A TW 105113935A TW 201703961 A TW201703961 A TW 201703961A
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line
brittle material
vertical crack
forming
material substrate
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TW105113935A
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Chinese (zh)
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TWI695768B (en
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岩坪佑磨
曽山浩
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三星鑽石工業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0207Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)

Abstract

The invention provides a method of forming a vertical crack with high certainty on the brittle substrate. The method of forming a vertical crack on the brittle substrate comprises: a trench-line forming step of forming a trench-line as a line-like groove portion at a main surface; and an assistant line forming step of forming an assistant line intersecting the trench-line by enabling the scribing roller to press and roll, and an outer periphery portion of the scribing roller having an blade front end; in the trench-line forming step, forming the trench-line by a way of retaining crackles state at a lower side; in the assistant line forming step, forming the assistant line under the state of enabling the scribing roller with an established angle of inclination from a moving direction of formation relative to the assistant line in the water level surface; and taking the intersection of the trench-line and the assistant line as a starting point to produce an extension of the vertical line starting from the trench line.

Description

脆性材料基板之垂直裂紋之形成方法及脆性材料基板之分斷方法 Method for forming vertical crack of brittle material substrate and method for breaking brittle material substrate

本發明係關於一種用於分斷脆性材料基板之方法,尤其是關於一種在脆性材料基板之分斷時形成垂直裂紋之方法。 The present invention relates to a method for breaking a substrate of a brittle material, and more particularly to a method of forming a vertical crack when the brittle material substrate is broken.

平面顯示器面板或太陽電池面板等之製造程序,一般而言包含將玻璃基板、陶瓷基板、半導體基板等由脆性材料構成之基板(母基板)加以分斷之步驟。於該分斷中,廣泛地使用以下手法,即,使用鑽石尖點(鑽石尖刀)或刀輪等刻劃工具在基板表面形成刻劃線,使裂紋(垂直裂紋)從該刻劃線往基板厚度方向伸展。在形成刻劃線時,雖會有垂直裂紋往厚度方向完全地伸展而將基板加以分斷的情形,亦有垂直裂紋僅往厚度方向局部伸展的情形。於後者時,在形成刻劃線後,進行稱為裂斷步驟之應力施加。藉由裂斷步驟使垂直裂紋往厚度方向完全伸展,據此沿刻劃線將基板分斷。 The manufacturing procedure of a flat display panel or a solar cell panel generally includes a step of dividing a substrate (mother substrate) made of a brittle material such as a glass substrate, a ceramic substrate, or a semiconductor substrate. In this breaking, the following method is widely used, that is, a scribing tool is formed on the surface of the substrate by using a scoring tool such as a diamond tip (diamond knife) or a cutter wheel to cause a crack (vertical crack) from the score line to the substrate Stretch in the thickness direction. When the scribe line is formed, although the vertical crack is completely extended in the thickness direction to break the substrate, there is a case where the vertical crack is locally extended only in the thickness direction. In the latter case, after the scribe line is formed, stress application called a cleavage step is performed. The vertical crack is completely extended in the thickness direction by the breaking step, whereby the substrate is broken along the scribe line.

作為上述之藉由形成刻劃線使垂直裂紋伸展之手法,有以下公知的手法,其係形成亦稱為輔助線、在垂直裂紋伸展時作為起點(觸發)之線狀加工痕(例如,參照專利文獻1)。 As a method of forming a vertical crack by forming a scribe line, there is a known method of forming a linear processing mark which is also referred to as an auxiliary line as a starting point (trigger) when a vertical crack is stretched (for example, reference) Patent Document 1).

專利文獻1:日本特開2015-74145號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2015-74145

例如專利文獻1揭示之利用輔助線之手法,與不利用其之手法相較,具有以下優點,亦即,在形成分斷用刻劃線時,可將刀輪或鑽石 尖點等之刻劃工具對基板施加之力(衝擊)設得較小。例如,即便是使垂直裂紋難以伸展之較弱的力(負載)作用以形成刻劃線之態樣,亦能夠以輔助線作為觸發從刻劃線起使垂直裂紋適當地伸展。 For example, the technique using the auxiliary line disclosed in Patent Document 1 has the advantage that it can be used to form a cutter wheel or a diamond when forming a scribe line for breaking, compared with a technique that does not utilize the same. The force (impact) applied to the substrate by the scoring tool such as a sharp point is set small. For example, even if a weak force (load) that makes vertical cracks difficult to stretch acts to form a score line, the vertical crack can be appropriately extended from the score line with the auxiliary line as a trigger.

然而,尤其是在量產品之製造步驟中所進行的脆性材料基板之分斷,在被要求高良率(確實的分斷)的情形下,專利文獻1中揭示之技術,針對以輔助線為起點之垂直裂紋之伸展,未必能保證其確實性(可靠度)。 However, in particular, in the case where the breaking of the brittle material substrate is performed in the manufacturing step of the mass product, in the case where high yield (definite breaking) is required, the technique disclosed in Patent Document 1 is directed to the auxiliary line as a starting point. The extension of the vertical crack does not necessarily guarantee its reliability (reliability).

本發明係有鑑於上述課題而完成,其目的在提供一種能夠在脆性材料基板之預定分斷位置以高確定性形成垂直裂紋的方法。 The present invention has been made in view of the above problems, and an object thereof is to provide a method capable of forming a vertical crack with high certainty at a predetermined breaking position of a brittle material substrate.

為了解決上述課題,請求項1之發明,係在將脆性材料基板於厚度方向加以分斷時在分斷位置形成垂直裂紋之方法,其特徵在於,具備:溝槽線形成步驟,在該脆性材料基板之一主面形成線狀槽部的溝槽線;及輔助線形成步驟,藉由使刻劃輪於該一主面壓接滾動,形成與該溝槽線交叉之加工痕的輔助線,該刻劃輪在外周部全周具備刃前端;於該溝槽線形成步驟中,以在該溝槽線下方維持無裂紋狀態之方式形成該溝槽線;於該輔助線形成步驟中,以使該刻劃輪於水平面內相對該輔助線之形成行進方向傾斜既定傾斜角之狀態形成該輔助線;以該溝槽線與該輔助線之交點為起始點,使垂直裂紋從該溝槽線往該脆性材料基板之厚度方向伸展。 In order to solve the above problems, the invention of claim 1 is a method for forming a vertical crack at a breaking position when the brittle material substrate is divided in the thickness direction, and is characterized in that the groove line forming step is performed on the brittle material. a groove line forming a linear groove portion on one main surface of the substrate; and an auxiliary line forming step of forming an auxiliary line of the processing mark intersecting the groove line by pressing the scribing wheel on the one main surface The scribing wheel has a blade tip end on the entire circumference of the outer peripheral portion; in the groove line forming step, the groove line is formed to maintain a crack-free state below the groove line; in the auxiliary line forming step, Forming the auxiliary line in a state in which the marking wheel is inclined at a predetermined inclination angle with respect to a direction in which the auxiliary line is formed in the horizontal plane; starting from a point of intersection of the groove line and the auxiliary line, causing a vertical crack from the groove The wire extends in the thickness direction of the brittle material substrate.

請求項2之發明,係在請求項1記載之脆性材料基板之垂直裂紋之形成方法中,於該輔助線形成步驟中,伴隨該輔助線之形成,在該輔助線之一側方區域產生輔助裂紋從該輔助線起朝向該脆性材料基板內部偏在;以該輔助裂紋之偏在區域成為該溝槽線上之垂直裂紋之預定伸展方向側的方式,決定該溝槽線與該輔助線之形成位置。 The invention of claim 2 is the method for forming a vertical crack of a brittle material substrate according to claim 1, wherein in the auxiliary line forming step, an auxiliary line is generated in a side region of the auxiliary line. The crack is offset from the auxiliary line toward the inside of the brittle material substrate, and the position at which the groove line and the auxiliary line are formed is determined such that the auxiliary crack is located on the side of the predetermined extension direction of the vertical crack on the groove line.

請求項3之發明,係在請求項2記載之脆性材料基板之垂直裂紋之形成方法中,以在該溝槽線上之垂直裂紋之預定伸展方向相反側附近與該溝槽線交叉之方式形成該輔助線。 According to a third aspect of the invention, in the method of forming a vertical crack of the brittle material substrate according to the second aspect of the invention, the method of forming the vertical crack in the groove line on the groove line intersects the groove line Auxiliary line.

請求項4之發明,係在請求項2或請求項3記載之脆性材料基板之垂直裂紋之形成方法中,於該輔助線形成步驟中,使該刻劃輪之行進方向前側於水平面內從該輔助線之形成行進方向朝向該溝槽線上之垂直裂紋之預定伸展方向側傾斜。 The invention of claim 4 is the method for forming a vertical crack of a brittle material substrate according to claim 2 or claim 3, wherein in the auxiliary line forming step, the front side of the direction of travel of the scoring wheel is in a horizontal plane from the The formation direction of the auxiliary line is inclined toward the predetermined extension direction side of the vertical crack on the groove line.

請求項5之發明,係在請求項1至請求項4中任一項記載之脆性材料基板之垂直裂紋之形成方法中,該傾斜角係1.0°以上5.0°以下。 The method of forming a vertical crack of a brittle material substrate according to any one of claims 1 to 4, wherein the inclination angle is 1.0° or more and 5.0° or less.

請求項6之發明,係在請求項5記載之脆性材料基板之垂直裂紋之形成方法中,該傾斜角係2.5°以上5.0°以下。 The invention of claim 6 is the method for forming a vertical crack of the brittle material substrate according to claim 5, wherein the inclination angle is 2.5° or more and 5.0° or less.

請求項7之發明,係在請求項1至請求項6中任一項記載之脆性材料基板之垂直裂紋之形成方法中,於形成該溝槽線後,形成該輔助線。 The invention of claim 7 is the method for forming a vertical crack of a brittle material substrate according to any one of claims 1 to 6, wherein the auxiliary line is formed after the groove line is formed.

請求項8之發明,係將脆性材料基板於厚度方向加以分斷之方法,其特徵在於,具備:垂直裂紋形成步驟,係以請求項1至請求項7中任一項之垂直裂紋之形成方法,在該脆性材料基板形成垂直裂紋;及裂斷步驟,沿該垂直裂紋使該脆性材料基板裂斷。 The invention of claim 8 is a method for dividing a brittle material substrate in a thickness direction, comprising: a vertical crack forming step, and a method of forming a vertical crack according to any one of claims 1 to 7. Forming a vertical crack on the brittle material substrate; and a cracking step of breaking the brittle material substrate along the vertical crack.

根據請求項1至請求項8之發明,由於能夠在脆性材料基板之預先決定之分斷位置以高確定性使垂直裂紋伸展,因此能夠於該分斷位置確實地分斷脆性材料基板。 According to the inventions of claim 1 to claim 8, since the vertical crack can be stretched with high certainty at a predetermined breaking position of the brittle material substrate, the brittle material substrate can be reliably separated at the breaking position.

1‧‧‧平台 1‧‧‧ platform

2‧‧‧刻劃頭 2‧‧‧Scratch

50、150‧‧‧刻劃工具 50, 150‧‧‧ scribing tools

51‧‧‧刻劃輪 51‧‧‧Scratch

52‧‧‧銷 52‧‧ ‧ sales

53‧‧‧保持具 53‧‧‧Holding

100‧‧‧刻劃裝置 100‧‧‧ scoring device

151‧‧‧鑽石尖點 151‧‧‧Diamond Point

152‧‧‧柄 152‧‧‧ handle

A1‧‧‧(輔助線AL之)起始點 Starting point of A1‧‧‧ (auxiliary line AL)

A2‧‧‧(輔助線AL之)終點 A2‧‧‧ (Auxiliary line AL) end point

AC‧‧‧輔助裂紋 AC‧‧‧Auxiliary crack

AL‧‧‧輔助線 AL‧‧‧Auxiliary line

AX‧‧‧軸中心 AX‧‧‧Axis Center

C‧‧‧(溝槽線TL與輔助線AL之)交點 C‧‧‧ (the intersection of the groove line TL and the auxiliary line AL)

DP‧‧‧刻劃方向 DP‧‧‧ scoring direction

PF‧‧‧(刻劃輪51之)刃前端 PF‧‧‧ (marking wheel 51) blade front end

SF1‧‧‧(脆性材料基板W之)一主面(上面) SF1‧‧‧ (brittle material substrate W) one main surface (top)

SF2‧‧‧(脆性材料基板W之)另一主面(下面) SF2‧‧‧ (the brittle material substrate W) the other main surface (below)

T1‧‧‧(溝槽線TL之)起始點 Starting point of T1‧‧‧ (groove line TL)

T2‧‧‧(溝槽線TL之)終點 End point of T2‧‧‧ (groove line TL)

TL‧‧‧溝槽線 TL‧‧‧ trench line

VC‧‧‧垂直裂紋 VC‧‧‧ vertical crack

W‧‧‧脆性材料基板 W‧‧‧Battery material substrate

圖1,係概略顯示刻劃裝置100之構成的圖。 Fig. 1 is a view schematically showing the configuration of the scribing device 100.

圖2,係顯示關於刻劃裝置100中的刻劃輪51之姿勢的圖。 2 is a diagram showing the posture of the scoring wheel 51 in the scoring apparatus 100.

圖3,係顯示溝槽線TL形成後之狀態的脆性材料基板W之俯視圖。 FIG. 3 is a plan view showing the brittle material substrate W in a state in which the groove line TL is formed.

圖4,係概略顯示於溝槽線TL之形成中使用之鑽石尖點150之構成的圖。 Fig. 4 is a view schematically showing the configuration of the diamond cusp 150 used in the formation of the groove line TL.

圖5,係包含溝槽線TL之垂直剖面的zx局部剖面圖。 Figure 5 is a partial zx cross-sectional view of a vertical section including trench lines TL.

圖6,係例示輔助線AL形成時之狀態的脆性材料基板W之俯視圖。 Fig. 6 is a plan view showing the brittle material substrate W in a state in which the auxiliary line AL is formed.

圖7,係例示伴隨於輔助線AL之形成的垂直裂紋VC之伸展之狀態的脆性材料基板W之俯視圖。 FIG. 7 is a plan view showing the brittle material substrate W in a state in which the vertical crack VC is formed in association with the formation of the auxiliary line AL.

圖8,係例示伴隨於輔助線AL之形成的垂直裂紋VC之伸展之狀態的脆性材料基板W之俯視圖。 FIG. 8 is a plan view showing the brittle material substrate W in a state in which the vertical crack VC is formed in association with the formation of the auxiliary line AL.

圖9,係包含溝槽線TL與垂直裂紋VC之垂直剖面的zx局部剖面圖。 Figure 9 is a partial zx cross-sectional view of a vertical section including a groove line TL and a vertical crack VC.

圖10,係顯示形成垂直裂紋VC時之輔助線AL附近之狀態的示意圖。 Fig. 10 is a view showing a state in the vicinity of the auxiliary line AL when the vertical crack VC is formed.

圖11,係形成有輔助線AL之脆性材料基板W之攝影例。 Fig. 11 is a photographing example of the brittle material substrate W on which the auxiliary line AL is formed.

圖12,係以不同的傾斜角θ形成之輔助線AL之局部放大影像。 Fig. 12 is a partially enlarged image of the auxiliary line AL formed at different inclination angles θ.

圖13,係針對實施例1之不同的各傾斜角θ,將VC成立率相對在輔助線AL形成時施加之負載所描繪出的圖。 Fig. 13 is a view showing the VC establishment rate with respect to the load applied when the auxiliary line AL is formed, for each of the inclination angles θ different from the first embodiment.

圖14,係針對實施例2之不同的各傾斜角θ,將VC成立率相對在輔助線AL形成時施加之負載所描繪出的圖。 Fig. 14 is a view showing the VC establishment rate with respect to the load applied when the auxiliary line AL is formed, for each of the inclination angles θ of the second embodiment.

<刻劃裝置> <scratching device>

圖1,係概略顯示本發明之實施形態中使用之刻劃裝置100之構成的圖。刻劃裝置100,一般而言,雖係在將玻璃基板、陶瓷基板、半導體基板等脆性材料基板W在既定之分斷位置於厚度方向DT加以分斷以進行小尺寸化時使用,但本實施形態中,主要是將刻劃裝置100設定為用於在脆性材料基板W之一主面SF1側之分斷位置使垂直裂紋伸展而進行的輔助線AL(參照圖6等)之形成中使用。又,本實施形態中,所謂的輔助線AL,係以使其與形成在主面SF1側之分斷位置的溝槽線TL(參照圖3等)交叉之態樣形成於主面SF1上之、於溝槽線TL之下方使垂直裂紋伸展時作為起點(觸發)之加工痕。此外,所謂的溝槽線TL,係緊靠其下方成為垂直裂紋之形成位置的微細的線狀槽部(凹部)。關於輔助線AL與溝槽線TL之細節將於以下說明。 Fig. 1 is a view schematically showing the configuration of a scribing device 100 used in an embodiment of the present invention. The scribing device 100 is generally used when the brittle material substrate W such as a glass substrate, a ceramic substrate, or a semiconductor substrate is divided in the thickness direction DT at a predetermined breaking position to reduce the size. In the embodiment, the scribing device 100 is mainly used for forming the auxiliary line AL (see FIG. 6 and the like) for extending the vertical crack at the breaking position on the main surface SF1 side of the brittle material substrate W. In the present embodiment, the auxiliary line AL is formed on the main surface SF1 so as to intersect the groove line TL (see FIG. 3 and the like) formed at the breaking position on the main surface SF1 side. A processing mark that serves as a starting point (trigger) when the vertical crack is stretched below the groove line TL. In addition, the groove line TL is a fine linear groove portion (concave portion) which is a position at which the vertical crack is formed next to the groove line TL. Details regarding the auxiliary line AL and the groove line TL will be described below.

刻劃裝置100,主要具備供載置脆性材料基板W之平台1、與用於保持刻劃工具50之刻劃頭2。 The scribing device 100 mainly includes a stage 1 on which the brittle material substrate W is placed, and a scribing head 2 for holding the scribing tool 50.

刻劃裝置100,具備未圖示之平台移動機構及刻劃頭移動機構之一方或兩方,藉由具備該等機構,在刻劃裝置100中,刻劃頭2能夠在保持刻劃工具50之狀態下相對平台1於水平面內移動。以下,為簡化說明,於進行刻劃動作時,使刻劃頭2朝向圖1所示之刻劃方向DP相對平台1進行移動。 The scribing device 100 includes one or both of a platform moving mechanism and a scoring head moving mechanism (not shown). By providing such a mechanism, in the scoring device 100, the scribing head 2 can hold the scribing tool 50 In the state, the platform 1 moves in the horizontal plane. Hereinafter, for simplification of description, when the scribing operation is performed, the scribing head 2 is moved relative to the stage 1 toward the scribing direction DP shown in FIG.

刻劃工具50,係用於進行對脆性材料基板W刻劃的工具。刻劃工具50,具有刻劃輪(刀輪)51、銷52、及保持具53。 The scoring tool 50 is used to perform a tool for scribing the brittle material substrate W. The scoring tool 50 has a scoring wheel (cutter wheel) 51, a pin 52, and a holder 53.

刻劃輪51為圓盤狀(算盤珠狀),沿其外周全周具備剖面觀察呈大致三角形狀之(由稜線與夾著稜線之一對傾斜面構成之)刃前端PF。 刻劃輪51,典型上具有數mm程度之直徑。銷52,垂直插通於刻劃輪51之軸中心AX之位置。保持具53,以刻劃頭2保持,並且以刻劃輪51可繞軸中心AX旋轉之態樣,支承插通於刻劃輪51之銷52。亦即,保持具53,將與銷52成為一體之刻劃輪51以可繞軸中心AX旋轉之方式加以軸支。更詳細而言,保持具53,以刻劃輪51之刃前端PF(外周部)所形成之面往鉛直方向延伸之方式,將銷52呈水平地支承。 The scribing wheel 51 has a disk shape (abacus bead shape), and has a blade tip end PF having a substantially triangular cross section (the ridge line and one of the ridge lines sandwiching the slanted surface) along the entire circumference of the outer circumference. The scoring wheel 51 typically has a diameter of a few mm. The pin 52 is vertically inserted into the position of the axis center AX of the scoring wheel 51. The holder 53 is held by the scribing head 2, and supports the pin 52 inserted through the scoring wheel 51 in such a manner that the scoring wheel 51 is rotatable about the axis center AX. That is, the holder 53 pivots the scribing wheel 51 integral with the pin 52 so as to be rotatable about the axis center AX. More specifically, the holder 53 supports the pin 52 horizontally so that the surface formed by the tip end PF (outer peripheral portion) of the scoring wheel 51 extends in the vertical direction.

刃前端PF,例如係使用超硬合金、燒結鑽石、多結晶鑽石或單結晶鑽石等之硬質材料形成。就使上述稜線及傾斜面之表面粗糙度小的觀點而言,刻劃輪51整體亦可由單結晶鑽石作成。 The tip end PF is formed, for example, of a hard material such as a cemented carbide, a sintered diamond, a polycrystalline diamond, or a single crystal diamond. The scoring wheel 51 as a whole can also be made of a single crystal diamond from the viewpoint of making the surface roughness of the ridge line and the inclined surface small.

於具有如上述構成的刻劃裝置100,在使刻劃輪51壓接於以另一主面SF2作為載置面而水平載置固定於平台1上的脆性材料基板W之一主面(以下,亦稱上面)SF1的狀態下,使保持有刻劃工具50之刻劃頭2往刻劃方向DP移動。據此,使壓接於脆性材料基板W之狀態之刻劃輪51,在刃前端PF稍微侵入於脆性材料基板W之狀態下往箭頭RT所示之方向繞軸中心AX滾動。藉此,在脆性材料基板W之上面SF1,伴隨該刻劃輪51之壓接滾動產生沿刻劃輪51之移動方向之塑性變形。本實施形態中,將使該塑性變形產生的刻劃輪51之壓接滾動動作,稱為刻劃輪51之刻劃動作。又,在使刻劃輪51壓接於上面SF1時,刻劃輪51施加於脆性材料基板之負載,可藉由刻劃頭2所具備之未圖示之負載調整機構加以調整。 In the scribing device 100 having the above-described configuration, the scribing wheel 51 is press-contacted to one main surface of the brittle material substrate W that is horizontally placed and fixed on the stage 1 with the other main surface SF2 as a mounting surface (hereinafter In the state of SF1, the head 2 of the scribing tool 50 is moved to the scoring direction DP. As a result, the scribe wheel 51 that is in a state of being pressed against the brittle material substrate W is rolled around the axis center AX in a direction indicated by an arrow RT while the blade tip end PF slightly enters the brittle material substrate W. Thereby, plastic deformation along the moving direction of the scoring wheel 51 is generated on the upper surface SF1 of the brittle material substrate W by the pressure-contact rolling of the scribing wheel 51. In the present embodiment, the pressure rolling operation of the scribing wheel 51 caused by the plastic deformation is referred to as a scoring operation of the scoring wheel 51. Further, when the scribing wheel 51 is pressed against the upper surface SF1, the load applied to the brittle material substrate by the scribing wheel 51 can be adjusted by a load adjusting mechanism (not shown) provided in the scribing head 2.

圖2,係顯示關於刻劃裝置100中的刻劃輪51之姿勢(傾斜)的圖。本實施形態中,以刻劃方向DP作為基準方向,將刻劃輪51在保持於刻劃頭2之狀態下相對於刻劃方向DP於水平面內繞順時針方向傾斜角度 θ時之角度θ,定義為刻劃輪51之傾斜角。傾斜角θ,亦為刻劃輪51之刃前端PF(稜線)形成之鉛直面與水平面之正交軸之延伸方向D1與刻劃方向DP所夾之角。 2 is a view showing the posture (tilt) of the scoring wheel 51 in the scoring device 100. In the present embodiment, the scoring wheel DP is inclined in the clockwise direction with respect to the scoring direction DP in the state of being held by the scribing head 2 with the scribing direction DP as the reference direction. The angle θ at θ is defined as the inclination angle of the scoring wheel 51. The inclination angle θ is also the angle between the extending direction D1 of the orthogonal axis formed by the front end PF (ridge line) of the cutting wheel 51 and the orthogonal direction of the horizontal plane and the scribing direction DP.

本實施形態中,如上所述,在對一脆性材料基板W進行分斷時,雖形成輔助線AL,但將該輔助線AL形成時之傾斜角θ刻意地設定為大於0°的值。亦即,輔助線AL之形成,係在使刻劃輪51刻意地於水平面內從刻劃方向DP傾斜之狀態下進行。又,藉由以該態樣決定傾斜角θ,輔助線AL形成具有固有的性質與狀態,其細節於以下說明。 In the present embodiment, as described above, when the brittle material substrate W is divided, the auxiliary line AL is formed, but the inclination angle θ at the time of forming the auxiliary line AL is intentionally set to a value larger than 0°. That is, the formation of the auxiliary line AL is performed in a state where the scribing wheel 51 is intentionally tilted from the scribing direction DP in the horizontal plane. Further, by determining the inclination angle θ in this aspect, the auxiliary line AL is formed to have inherent properties and states, and the details thereof will be described below.

具體而言,在輔助線AL之形成中,使用傾斜角θ設定於1.0°~5.0°之範圍的刻劃裝置100。較佳為,將傾斜角θ設定於2.5°~5.0°之範圍。 Specifically, in the formation of the auxiliary line AL, the scribing device 100 having the inclination angle θ set in the range of 1.0° to 5.0° is used. Preferably, the inclination angle θ is set in the range of 2.5° to 5.0°.

又,該刻劃輪51之傾斜,可為藉由將刻劃頭2傾斜而實現之態樣,亦可為藉由改變刻劃工具50相對於刻劃頭2之安裝角度而實現之態樣,或亦可為以其他態樣實現之態樣。 Moreover, the inclination of the engraving wheel 51 can be realized by tilting the scribing head 2, or can be realized by changing the mounting angle of the scoring tool 50 with respect to the scribing head 2. Or it can be implemented in other ways.

<垂直裂紋之形成順序> <Formation order of vertical cracks>

接下來,說明本實施形態中進行之利用輔助線AL於分斷位置形成垂直裂紋之順序。圖3至圖9,係階段性地顯示該垂直裂紋形成之狀態的圖。以下,以對矩形狀之脆性材料基板W預先設定與一組對邊平行之複數個分斷位置(分斷線)的情形為例進行說明。此外,於各圖中,標記以輔助線AL之形成行進方向作為x軸正方向、以溝槽線TL之形成行進方向作為y軸正方向、以鉛直上方作為z軸正方向的右手系xyz座標。 Next, the procedure for forming vertical cracks at the breaking position by the auxiliary line AL in the present embodiment will be described. 3 to 9 are diagrams showing the state of the vertical crack formation in stages. Hereinafter, a case where a plurality of breaking positions (breaking lines) parallel to a pair of opposite sides are set in advance to the rectangular brittle material substrate W will be described as an example. Further, in each of the drawings, the mark is formed by the direction in which the auxiliary line AL is formed as the positive direction of the x-axis, the direction in which the groove line TL is formed as the positive direction of the y-axis, and the direction above the vertical line as the positive z-axis of the z-axis. .

首先,形成溝槽線TL。圖3,係例示溝槽線TL形成後之狀 態的脆性材料基板W之俯視圖(xy平面圖)。圖4,係概略顯示使用於溝槽線TL之形成的刻劃工具150之構成的圖。圖5,係包含溝槽線TL之垂直剖面的zx局部剖面圖。圖3中所示之溝槽線TL之形成位置,相當於對脆性材料基板W從其上面SF1側俯視觀察時之分斷位置。 First, the groove line TL is formed. Figure 3 is a view showing the shape of the groove line TL Top view of the brittle material substrate W (xy plan view). Fig. 4 is a view schematically showing the configuration of the scribing tool 150 used for forming the groove line TL. Figure 5 is a partial zx cross-sectional view of a vertical section including trench lines TL. The position where the groove line TL is formed in FIG. 3 corresponds to the breaking position when the brittle material substrate W is viewed from the upper surface SF1 side.

本實施形態中,使用具備鑽石尖點151之刻劃工具150於溝槽線TL之形成。鑽石尖點151,例如如圖4所示般形成角錐梯形狀,設有頂面SD1(第1面)、及圍繞頂面SD1之複數個面。更詳細而言,如圖4(b)所示,該等複數個面包含側面SD2(第2面)及側面SD3(第3面)。頂面SD1、側面SD2及SD3,朝向互異之方向,且彼此相鄰。在鑽石尖點151,藉由由側面SD2及SD3構成之稜線PS、以及頂面SD1、側面SD2及SD3之三個面相交之頂點PP形成刃前端PF2。鑽石尖點151,如圖4(a)所示,以頂面SD1成為最下端部之態樣被保持於形成棒狀(柱狀)之柄152之一端部側。 In the present embodiment, the scribing tool 150 having the diamond pointed point 151 is used to form the groove line TL. The diamond cusp 151 has, for example, a pyramid shape as shown in FIG. 4, and has a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. More specifically, as shown in FIG. 4( b ), the plurality of surfaces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and the SD3 are oriented in mutually different directions and adjacent to each other. At the diamond cusp 151, the blade tip end PF2 is formed by the ridge line PS composed of the side faces SD2 and SD3 and the apex PP where the three faces of the top face SD1, the side faces SD2 and SD3 intersect. As shown in FIG. 4(a), the diamond cusp 151 is held on one end side of the rod-shaped (columnar) shank 152 in such a manner that the top surface SD1 becomes the lowermost end portion.

在使用刻劃工具150之情形時,如圖4(a)所示,以使柄152之軸方向AX2從垂直方向朝向移動方向DA前方(y軸正方向)傾斜既定角度之狀態,也就是使頂面SD1朝向移動方向DA後方(y軸負方向)之姿勢,使鑽石尖點151抵接於脆性材料基板W之上面SF1。然後,一邊保持該抵接狀態一邊使刻劃工具150往移動方向DA前方移動,藉此使鑽石尖點151之刃前端PF2滑動。藉此,產生沿鑽石尖點151之移動方向DA之塑性變形。本實施形態中,亦將使該塑性變形產生之鑽石尖點151之滑動動作,稱為鑽石尖點151之刻劃動作。 In the case where the scribing tool 150 is used, as shown in FIG. 4(a), the state in which the axial direction AX2 of the shank 152 is inclined from the vertical direction toward the front of the moving direction DA (the positive direction of the y-axis) is a state of a predetermined angle, that is, The posture of the top surface SD1 toward the rear of the movement direction DA (negative direction of the y-axis) causes the diamond pointed point 151 to abut against the upper surface SF1 of the brittle material substrate W. Then, while the contact state is maintained, the scribing tool 150 is moved forward in the moving direction DA, whereby the tip end PF2 of the diamond tip 151 is slid. Thereby, plastic deformation along the moving direction DA of the diamond tip 151 is generated. In the present embodiment, the sliding operation of the diamond cusp 151 caused by the plastic deformation is also referred to as the scoring operation of the diamond cusp 151.

如圖3及圖5所示,溝槽線TL,係在脆性材料基板W之上面SF1以沿y軸方向延伸之方式形成之微細線狀槽部。溝槽線TL,係在使 刻劃工具150之姿勢相對於移動方向DA呈對稱之狀態下,使鑽石尖點151滑動以在脆性材料基板W之上面SF1產生塑性變形而形成。此時,如圖5中以示意方式所示,溝槽線TL,係形成為大致上與其延伸方向垂直之剖面之形狀為線對稱之槽部。 As shown in FIG. 3 and FIG. 5, the groove line TL is a fine linear groove portion formed on the upper surface SF1 of the brittle material substrate W so as to extend in the y-axis direction. The groove line TL is In a state where the posture of the scribing tool 150 is symmetrical with respect to the moving direction DA, the diamond pointed point 151 is slid to be plastically deformed on the upper surface SF1 of the brittle material substrate W. At this time, as schematically shown in FIG. 5, the groove line TL is formed as a groove portion having a line symmetry in a shape substantially perpendicular to the extending direction thereof.

溝槽線TL,如圖3所示,係在脆性材料基板W之上面SF1規定之分斷位置,從起始點T1起往以箭頭AR1所示之y軸正方向形成至終點T2。以下,亦將在溝槽線TL中相對接近起始點T1之範圍稱為上游側,將相對接近終點T2之範圍稱為下游側。 As shown in FIG. 3, the groove line TL is formed at a breaking position defined by the upper surface SF1 of the brittle material substrate W, and is formed from the starting point T1 to the end point T2 in the positive direction of the y-axis indicated by the arrow AR1. Hereinafter, the range relatively close to the starting point T1 in the groove line TL is referred to as the upstream side, and the range relatively close to the end point T2 is referred to as the downstream side.

又,圖3中,雖將溝槽線TL之起始點T1及終點T2設定於稍微遠離脆性材料基板W之端部的位置,但此並非為必需之態樣,亦可根據作為分斷對象之脆性材料基板W的種類或分斷後之單片的用途等,適當地將任一方或兩方設定於脆性材料基板W之端部位置。但是,將起始點T1設於脆性材料基板W之端部的態樣,與如圖3例示之將稍微遠離端部之位置作為起始點T1的情形相較,由於施加於刻劃工具150之刃前端PF2的衝擊變大,因此就刃前端PF2壽命、及可能引起預料外之垂直裂紋產生等觀點,必須加以留意。 In addition, in FIG. 3, the starting point T1 and the end point T2 of the groove line TL are set to a position slightly away from the end of the brittle material substrate W, but this is not an essential aspect, and may be used as a breaking object. One or both of them are set to the end position of the brittle material substrate W as appropriate, such as the type of the brittle material substrate W or the use of the single piece after the division. However, the case where the starting point T1 is provided at the end portion of the brittle material substrate W is compared with the case where the position slightly away from the end portion as the starting point T1 is illustrated as shown in FIG. 3, since it is applied to the scribing tool 150. Since the impact of the front end PF2 becomes large, it is necessary to pay attention to the viewpoint of the life of the front end PF2 and the occurrence of an unexpected vertical crack.

此外,複數個分斷位置各個之溝槽線TL之形成,可以是於具備一刻劃工具150之未圖示的加工裝置中使用刻劃工具150依序形成之態樣,亦可以是使用複數個溝槽線TL形成用之加工裝置同時並行地形成之態樣。 In addition, the formation of the groove lines TL of the plurality of breaking positions may be sequentially formed by using the scribing tool 150 in a processing device (not shown) having a scribing tool 150, or may be a plurality of The trench lines TL form a pattern in which the processing devices are simultaneously formed in parallel.

在溝槽線TL之形成時,以溝槽線TL之形成能確實進行但在脆性材料基板W之厚度方向DT不產生從該溝槽線TL起之垂直裂紋之伸 展的方式,設定刻劃工具150施加之負載(相當於將刻劃工具150從垂直上方壓入脆性材料基板W之上面SF1的力)(圖5)。 When the trench line TL is formed, the formation of the trench line TL can be surely performed, but the vertical crack from the trench line TL does not occur in the thickness direction DT of the brittle material substrate W. In the manner of setting, the load applied by the scribing tool 150 is set (corresponding to the force of pressing the scribing tool 150 from the upper side into the upper surface SF1 of the brittle material substrate W) (Fig. 5).

換言之,溝槽線TL之形成,係以在溝槽線TL之下方維持脆性材料基板W在與溝槽線TL交叉之方向連續地相連之狀態(無裂紋狀態)的方式進行。又,在以上述方式形成溝槽線TL時,於脆性材料基板W之溝槽線TL附近(從溝槽線TL起大致5μm~10μm程度內之範圍),作為塑性變形的結果會殘留內部應力。 In other words, the formation of the groove line TL is performed in a state in which the brittle material substrate W is continuously connected in the direction intersecting the groove line TL (no crack state) under the groove line TL. Further, when the groove line TL is formed as described above, the internal stress is left as a result of plastic deformation in the vicinity of the groove line TL of the brittle material substrate W (in the range of approximately 5 μm to 10 μm from the groove line TL). .

該溝槽線TL之形成,例如係藉由將刻劃工具150施加之負載設定為小於在使用相同刻劃工具150形成伴隨垂直裂紋伸展之刻劃線的情形時的值,來加以實現。 The formation of the groove line TL is achieved, for example, by setting the load applied by the scoring tool 150 to a value smaller than when the same scoring tool 150 is used to form a scribe line accompanying vertical crack extension.

無裂紋狀態下,即使形成有溝槽線TL亦不會有自該溝槽線TL起之垂直裂紋之伸展,因此即使假設彎曲力矩作用於脆性材料基板W,與形成有垂直裂紋的情形相較,亦難以產生沿溝槽線TL之分斷。 In the crack-free state, even if the groove line TL is formed, there is no extension of the vertical crack from the groove line TL, so even if a bending moment is applied to the brittle material substrate W, compared with the case where the vertical crack is formed It is also difficult to generate a break along the groove line TL.

形成溝槽線TL之後,藉由具備傾斜角θ設定為1.0°~5.0°之範圍(較佳為2.5°~5.0°之範圍)之刻劃工具50的刻劃裝置100,形成輔助線AL。圖6,係例示輔助線AL形成時之狀態的脆性材料基板W之俯視圖。圖7及圖8,係例示伴隨輔助線AL之形成的垂直裂紋VC伸展之狀態的脆性材料基板W之俯視圖。圖9,係包含溝槽線TL與垂直裂紋VC之垂直剖面的zx局部剖面圖。 After the groove line TL is formed, the auxiliary line AL is formed by the scribing device 100 having the scoring tool 50 having the inclination angle θ set to the range of 1.0° to 5.0° (preferably, the range of 2.5° to 5.0°). Fig. 6 is a plan view showing the brittle material substrate W in a state in which the auxiliary line AL is formed. FIGS. 7 and 8 are plan views showing the brittle material substrate W in a state in which the vertical crack VC is formed along with the formation of the auxiliary line AL. Figure 9 is a partial zx cross-sectional view of a vertical section including a groove line TL and a vertical crack VC.

本實施形態中,輔助線AL,如圖6所示,係在溝槽線TL之下游側附近,往以箭頭AR2所示之x軸正方向(以與溝槽線TL正交之方式),藉由在從起始點A1至終點A2之範圍內於脆性材料基板W之上面SF1 產生塑性變形而形成之加工痕。 In the present embodiment, as shown in FIG. 6, the auxiliary line AL is in the positive x-axis direction (which is orthogonal to the groove line TL) indicated by an arrow AR2 in the vicinity of the downstream side of the groove line TL. By SF1 above the brittle material substrate W in the range from the starting point A1 to the end point A2 A processing mark formed by plastic deformation.

更詳細而言,輔助線AL之形成,係以使箭頭AR2所示之輔助線AL之形成行進方向與刻劃方向DP(x軸正方向)一致之態樣進行。因此,輔助線AL之形成,係在刻劃輪51之行進方向前方傾斜向較輔助線AL形成位置更上游側之y軸負方向側的狀態下進行。 More specifically, the formation of the auxiliary line AL is performed in such a manner that the formation traveling direction of the auxiliary line AL indicated by the arrow AR2 coincides with the scribe direction DP (the positive direction of the x-axis). Therefore, the formation of the auxiliary line AL is performed in a state in which the forward direction of the scribing wheel 51 is inclined forward to the y-axis negative direction side on the upstream side of the auxiliary line AL forming position.

此時,係在刻劃輪51壓接於脆性材料基板W之上面SF1的狀態下,刻劃頭2往刻劃方向DP進行移動,因此產生刻劃輪51之滾動。然而,由於傾斜角θ非為0°,因此形成刃前端PF之一對斜面分別所承受的力不同。具體而言,係以朝向y軸正方向之斜面從脆性材料基板W承受較朝向y軸負方向之斜面更大之抵抗力的狀態,使刻劃輪51往刻劃方向DP移動。因此,輔助線AL,形成傾斜角θ越大則寬度越寬之加工痕(參照圖12),其剖面形狀為非對稱。又,輔助線AL之形成,亦與形成溝槽線TL之情形同樣地,非以緊靠其下方使垂直裂紋伸展為目的,因此在形成輔助線AL時刻劃輪51所施加之負載,亦可設定為比使用相同之刻劃輪51形成伴隨有垂直裂紋伸展之刻劃線時更小的值。 At this time, in a state where the scribing wheel 51 is pressed against the upper surface SF1 of the brittle material substrate W, the scribing head 2 is moved in the scoring direction DP, and thus the rolling of the scribing wheel 51 is generated. However, since the inclination angle θ is not 0°, one of the blade front end PFs is formed to have a different force against the inclined surface. Specifically, the scribing wheel 51 is moved in the scoring direction DP from the slanting surface facing the y-axis positive direction from the brittle material substrate W to a greater resistance against the inclined surface in the negative direction of the y-axis. Therefore, the auxiliary line AL forms a processing mark (see FIG. 12) having a wider width when the inclination angle θ is larger, and the cross-sectional shape thereof is asymmetrical. Further, the formation of the auxiliary line AL is also not intended to extend the vertical crack immediately below the groove line TL. Therefore, the load applied by the row wheel 51 at the time of forming the auxiliary line AL may be It is set to a smaller value than when the same scribing wheel 51 is used to form a scribing line with a vertical crack extension.

當在刻劃輪51施加之負載為既定閾值以上之條件下,進行如以上態樣之輔助線AL之形成時,輔助線AL與溝槽線TL交叉時,如圖7中以箭頭AR3所示,從與各個溝槽線TL之交點C的位置朝向垂直裂紋VC之預定伸展方向(若為圖7之情形,則為溝槽線TL之上游側)依序地產生如圖9所示之從溝槽線TL往脆性材料基板W之厚度方向DT的垂直裂紋VC之伸展。 When the formation of the auxiliary line AL as described above is performed under the condition that the load applied by the scribing wheel 51 is equal to or higher than a predetermined threshold, when the auxiliary line AL intersects the groove line TL, as shown by an arrow AR3 in FIG. From the position of the intersection C with each groove line TL toward the predetermined extension direction of the vertical crack VC (if the case of FIG. 7 is the upstream side of the groove line TL), the slaves as shown in FIG. 9 are sequentially generated. The groove line TL is stretched toward the vertical crack VC in the thickness direction DT of the brittle material substrate W.

最後,如圖8所示,在所有的分斷位置,產生從溝槽線TL 起之垂直裂紋VC之伸展。亦即,以輔助線AL之形成(輔助線AL成為觸發(trigger))為契機,在至此為止形成有溝槽線TL但為無裂紋狀態的脆性材料基板W之各分斷位置,形成從溝槽線TL延伸之垂直裂紋VC。 Finally, as shown in Figure 8, at all the break positions, the groove line TL is generated. The extension of the vertical crack VC. In other words, in the formation of the auxiliary line AL (the auxiliary line AL is a trigger), the groove line TL is formed, but the breaking position of the brittle material substrate W in the crack-free state is formed, and the groove is formed. The vertical crack VC extending from the groove line TL.

此係由於在使用具備鑽石尖點151之刻劃工具150形成有溝槽線TL的情形下,在緊靠著溝槽線TL下方產生之垂直裂紋VC具有往頂面SD1側伸展的性質。亦即,在輔助線AL附近產生的垂直裂紋VC,具有往特定一方向伸展之性質。以在溝槽線TL上之上游側配置鑽石尖點之頂面SD1的態樣形成溝槽線TL的本實施形態中,於輔助線AL形成後,在溝槽線TL之上游側垂直裂紋VC雖會伸展,但在相反方向則難以伸展。 This is because the vertical crack VC generated immediately below the groove line TL has a property of extending toward the top surface SD1 side in the case where the groove line TL is formed using the scribing tool 150 having the diamond cusp 151. That is, the vertical crack VC generated in the vicinity of the auxiliary line AL has a property of stretching in a specific direction. In the present embodiment in which the groove line TL is formed in a state in which the top surface SD1 of the diamond apex is disposed on the upstream side of the groove line TL, after the auxiliary line AL is formed, the vertical crack VC is formed on the upstream side of the groove line TL. Although it stretches, it is difficult to stretch in the opposite direction.

以該態樣在分斷位置形成有垂直裂紋VC之脆性材料基板W,被送往未圖示之既定的裂斷裝置。在裂斷裝置中,藉由所謂的三點彎曲或四點彎曲之方法,使彎曲力矩作用於脆性材料基板W,藉此進行使垂直裂紋VC伸展至脆性材料基板W之下面SF2的裂斷步驟。經由該裂斷步驟,將脆性材料基板W於分斷位置加以分斷。 The brittle material substrate W having the vertical crack VC formed at the breaking position in this manner is sent to a predetermined breaking device (not shown). In the breaking device, a bending moment is applied to the brittle material substrate W by a so-called three-point bending or four-point bending method, thereby performing a cracking step of stretching the vertical crack VC to the lower surface SF2 of the brittle material substrate W. . Through the breaking step, the brittle material substrate W is divided at the breaking position.

如以上順序的情形,由於分斷位置之溝槽線TL之形成並不伴隨垂直裂紋VC之伸展,因此與習知之和刻劃線之形成同時形成垂直裂紋之方式對分斷位置進行刻劃的情形相較,具有能夠降低由刻劃工具50施加之負載的優點。該優點,有助於在分斷位置之分斷中使用之刻劃工具50長壽化。 As in the case of the above sequence, since the formation of the groove line TL of the breaking position is not accompanied by the stretching of the vertical crack VC, the breaking position is scribed in a manner of forming a vertical crack simultaneously with the formation of the conventional scribe line. In contrast, there is an advantage that the load applied by the scoring tool 50 can be reduced. This advantage contributes to the longevity of the scoring tool 50 used in the breaking of the breaking position.

<垂直裂紋伸展之細節> <Details of vertical crack stretching>

圖10,係顯示接續溝槽線TL之形成後藉由形成輔助線AL以形成垂直裂紋VC時之輔助線AL附近之狀態的示意圖。此外,圖11,係形成有輔助 線AL之脆性材料基板W之攝影例。 Fig. 10 is a view showing a state in the vicinity of the auxiliary line AL when the auxiliary line AL is formed to form the vertical crack VC after the formation of the succeeding groove line TL. In addition, Figure 11 is formed with assistance. A photographing example of the brittle material substrate W of the line AL.

如圖10(a)所示,當於刻劃方向DP即x軸正方向(與y軸垂直之方向)形成輔助線AL時,於其形成位置全域,在脆性材料基板W之內部、輔助線AL之y軸方向負側(圖10中,為輔助線AL之下側)的側方區域,以輔助線AL為起始點之無數的裂紋即輔助裂紋AC隨機地產生。此亦可從例如觀察脆性材料基板W之剖面的圖11(b)確認。另外,在觀察上面SF1的圖11(a)中除了確認輔助線AL外,於以封閉曲線圍繞之輔助線AL下方的區域RE,於脆性材料基板W之內部,呈線狀連續之輔助裂紋AC稍微透過。 As shown in FIG. 10(a), when the auxiliary line AL is formed in the scribe direction DP, that is, the positive direction of the x-axis (the direction perpendicular to the y-axis), the entire position is formed in the interior of the brittle material substrate W, and the auxiliary line In the lateral region of the negative side of the y-axis direction of AL (the lower side of the auxiliary line AL in Fig. 10), an infinite number of cracks, i.e., auxiliary cracks AC, starting from the auxiliary line AL are randomly generated. This can also be confirmed from, for example, FIG. 11(b) for observing the cross section of the brittle material substrate W. In addition, in FIG. 11(a) for observing the above SF1, in addition to the confirmation of the auxiliary line AL, in the region RE below the auxiliary line AL surrounded by the closed curve, in the interior of the brittle material substrate W, the line-shaped continuous auxiliary crack AC Slightly through.

更詳細而言,輔助裂紋AC大致上係以輔助線AL之任意位置為起始點,以往(+x、-y、-z)之方向伸展之態樣產生。概略而言,係在俯視觀察上面SF1的情形下,從輔助線AL起,於輔助線AL之y軸負方向偏在於大約數十μm程度之範圍。惟,圖10中雖省略圖示,但因輔助裂紋AC之形成係一機率產生之現象,因此雖然比率小,但於其他範圍亦會產生輔助裂紋AC。 More specifically, the auxiliary crack AC is substantially generated by the arbitrary position of the auxiliary line AL as a starting point, and the conventional (+x, -y, -z) direction is extended. Roughly speaking, in the case where the upper surface SF1 is viewed in a plan view, the y-axis negative direction of the auxiliary line AL is in the range of about several tens of μm from the auxiliary line AL. Although not shown in FIG. 10, the formation of the auxiliary crack AC is a phenomenon that occurs at a high probability. Therefore, although the ratio is small, the auxiliary crack AC is generated in other ranges.

由於輔助裂紋AC之偏在,係產生於輔助線AL全域,因此輔助裂紋AC亦在輔助線AL與溝槽線TL交叉處附近以較高的機率產生。如上所述,由於在溝槽線TL附近殘留內部應力,因此在以輔助裂紋AC形成於垂直裂紋VC之預定伸展方向側之方式形成輔助線AL的情形時,趁著輔助裂紋AC到達殘留內部應力之存在區域,溝槽線TL附近之殘留內部應力獲得解放。其結果,如於圖10(b)中以箭頭AR4所示,朝向垂直裂紋VC之預定伸展方向(在本實施形態中為溝槽線TL之上游側),產生從溝槽線TL起之垂直裂紋VC之伸展。以上,係利用上述本實施形態之方法產生垂直裂 紋VC之伸展的細節。 Since the offset of the auxiliary crack AC is generated in the entire area of the auxiliary line AL, the auxiliary crack AC is also generated with a high probability in the vicinity of the intersection of the auxiliary line AL and the groove line TL. As described above, since the internal stress is left in the vicinity of the groove line TL, when the auxiliary line AL is formed in such a manner that the auxiliary crack AC is formed on the predetermined extension direction side of the vertical crack VC, the auxiliary crack AC reaches the residual internal stress. In the region where it exists, the residual internal stress near the groove line TL is released. As a result, as shown by an arrow AR4 in Fig. 10(b), the vertical direction toward the vertical crack VC (in the present embodiment, the upstream side of the groove line TL), the vertical direction from the groove line TL is generated. The extension of the crack VC. In the above, the vertical crack is generated by the method of the above embodiment. Details of the stretch of the VC.

此外,本實施形態之方法,藉由使用如上所述將傾斜角θ設為1.0°~5.0°(較佳為2.5°~5.0°)而刻意傾斜之刻劃輪51形成輔助線AL,以使多數個輔助裂紋AC偏在於刻劃輪51朝行進方向前方傾斜之側,並且以分斷位置於形成該輔助裂紋AC之側延伸之方式,設定輔助線AL與溝槽線TL之形成位置。藉此,提高於分斷位置之從溝槽線TL起之垂直裂紋VC之伸展的確實性。亦即,本實施形態中採用之使用刻意傾斜之刻劃輪51的輔助線AL之形成,具有限定垂直裂紋VC之伸展處,並且提高其伸展之確實性的效果。亦即,在分斷脆性材料基板W時,根據其分斷位置,決定刻劃輪51之傾斜方向、輔助線AL之形成位置與溝槽線TL之形成位置,藉此可於該分斷位置使垂直裂紋VC確實地伸展。 Further, in the method of the present embodiment, the auxiliary line AL is formed by using the scribing wheel 51 which is intentionally inclined by setting the inclination angle θ to 1.0° to 5.0° (preferably 2.5° to 5.0°) as described above. The plurality of auxiliary cracks AC are offset on the side of the scribing wheel 51 that is inclined forward in the traveling direction, and the positions at which the auxiliary line AL and the groove line TL are formed are set such that the breaking position extends on the side where the auxiliary crack AC is formed. Thereby, the reliability of the extension of the vertical crack VC from the groove line TL at the breaking position is improved. That is, the formation of the auxiliary line AL using the intentionally inclined scribing wheel 51 employed in the present embodiment has an effect of defining the extension of the vertical crack VC and improving the reliability of the extension. That is, when the brittle material substrate W is separated, the inclination direction of the scribing wheel 51, the formation position of the auxiliary line AL, and the formation position of the groove line TL are determined according to the breaking position thereof, whereby the breaking position can be determined. The vertical crack VC is surely stretched.

又,在傾斜角θ小於1.0°的情形,由於並不產生輔助裂紋AC之偏在,且裂紋伸展之確實性降低,因此較為不佳。此外,傾斜角θ越大,則有形成輔助線AL時之刻劃輪51之滾動變困難的傾向。 Further, in the case where the inclination angle θ is less than 1.0°, the unevenness of the auxiliary crack AC is not generated, and the reliability of crack propagation is lowered, which is not preferable. Further, as the inclination angle θ is larger, there is a tendency that the rolling of the scribe wheel 51 becomes difficult when the auxiliary line AL is formed.

如以上之說明,根據本實施形態,於預先決定之分斷位置將脆性材料基板加以分斷時,於對應該分斷位置之形成位置,進行在下方不產生垂直裂紋之條件下的溝槽線之形成、與使用於水平面內刻意傾斜而成之刻劃輪使輔助裂紋往垂直裂紋VC之預定伸展方向即偏在於溝槽線之上游側之態樣下的輔助線之形成,藉此能夠於該分斷位置確實地使垂直裂紋伸展。藉由確實地形成垂直裂紋,能夠於下段步驟即裂斷步驟中,於該分斷位置確實地將脆性材料基板加以分斷。於此情形中,能夠將在形成溝槽線與輔助線時刻劃輪所施加之負載,設定成較進行伴隨垂直裂紋伸展之刻 劃動作時小的值。 As described above, according to the present embodiment, when the brittle material substrate is divided at a predetermined breaking position, the groove line under the condition that no vertical crack occurs under the position where the breaking position is formed is performed. Forming and forming a guide line which is intentionally inclined in the horizontal plane, so that the auxiliary crack is formed in the predetermined extension direction of the vertical crack VC, that is, the auxiliary line under the condition of the upstream side of the groove line, thereby being able to This breaking position does stretch the vertical crack. By reliably forming the vertical crack, the brittle material substrate can be reliably separated at the breaking position in the lower step, that is, the breaking step. In this case, the load applied by the rower at the time of forming the groove line and the auxiliary line can be set to be more similar to the vertical crack extension. A small value when scratching.

<實施例1> <Example 1>

藉由改變輔助線AL之形成條件進行複數次以上述實施形態中所示順序進行之溝槽線TL與輔助線AL之形成,對垂直裂紋VC之伸展之產生狀況進行了評價。作為脆性材料基板W,係使用0.2mm厚的玻璃基板。 The formation of the groove line TL and the auxiliary line AL which were sequentially performed in the order shown in the above embodiment was carried out by changing the formation conditions of the auxiliary line AL, and the occurrence of the extension of the vertical crack VC was evaluated. As the brittle material substrate W, a 0.2 mm thick glass substrate was used.

具體而言,藉由傾斜角θ在0°、1.2°、2.0°之三個水準的變化,及施加於刻劃輪51之負載在0.4N、0.8N、1.1N、1.5N、1.9N、2.3N、2.6N之七個水準的變化,以總共21種條件形成了輔助線AL。刻劃頭2之移動速度設為100mm/sec。又,作為刻劃輪51,係使用輪徑為2.0mm、厚度為0.65mm、銷52之插通孔之直徑為0.8mm、刃前端角度為100°者。圖12,係將刻劃輪51施加之負載設為1N時之以各個傾斜角θ形成之輔助線AL之局部放大影像。 Specifically, the variation of the tilt angle θ at three levels of 0°, 1.2°, and 2.0°, and the load applied to the scoring wheel 51 are 0.4N, 0.8N, 1.1N, 1.5N, 1.9N, The seven levels of 2.3N and 2.6N changed to form the auxiliary line AL in a total of 21 conditions. The moving speed of the scribing head 2 is set to 100 mm/sec. Further, as the scribing wheel 51, a wheel diameter of 2.0 mm, a thickness of 0.65 mm, a diameter of the insertion hole of the pin 52 of 0.8 mm, and a tip end angle of 100° were used. Fig. 12 is a partially enlarged image of the auxiliary line AL formed at each inclination angle θ when the load applied by the scoring wheel 51 is set to 1N.

此外,溝槽線TL,係固定施加於刻劃工具150之負載,就輔助線AL之每一形成條件,各形成100條。 Further, the groove line TL fixes the load applied to the scribing tool 150, and each of the forming conditions of the auxiliary line AL is formed into 100 pieces.

圖13,係分別針對三種傾斜角θ,對輔助線AL之形成時施加之負載畫出從總共100條之溝槽線TL起之垂直裂紋VC之伸展之產生率(以下,稱為VC成立率)的圖表。 FIG. 13 is a graph showing the generation rate of the extension of the vertical crack VC from the total of 100 groove lines TL for the load applied at the time of formation of the auxiliary line AL for the three inclination angles θ (hereinafter, referred to as VC establishment rate). ) the chart.

如圖13所示,在傾斜角θ為0°的情形時,最高也只獲得60%程度之VC成立率(負載為1.5N時),相對於此,在傾斜角θ為1.2°的情形時,於刻劃輪51施加之負載設為1.9N以上時可獲得95%以上之VC成立率,在傾斜角θ為2.0°的情形時,於刻劃輪51施加之負載設為1.5N以上的情形下可獲得100%之VC成立率。 As shown in Fig. 13, when the inclination angle θ is 0°, only the VC establishment rate of 60% is obtained at the highest (when the load is 1.5 N), whereas the inclination angle θ is 1.2°. When the load applied to the scoring wheel 51 is 1.9 N or more, a VC establishment rate of 95% or more can be obtained, and when the inclination angle θ is 2.0°, the load applied to the scoring wheel 51 is set to 1.5 N or more. In this case, a 100% VC establishment rate can be obtained.

此等結果顯示,在傾斜角θ為1.2°的情形時,若於刻劃輪51施加至少1.9N之負載,則能夠大致確實地從溝槽線TL使垂直裂紋VC伸展,進一步地,在傾斜角θ為2.0°的情形時,若於刻劃輪51施加至少1.5N之負載,則能夠確實地從溝槽線TL使垂直裂紋VC伸展。 These results show that when the inclination angle θ is 1.2°, when a load of at least 1.9 N is applied to the scribing wheel 51, the vertical crack VC can be substantially reliably extended from the groove line TL, and further, at the inclination When the angle θ is 2.0°, when a load of at least 1.5 N is applied to the scribing wheel 51, the vertical crack VC can be surely extended from the groove line TL.

此外,若使用相同條件之刻劃輪51進行刻劃動作,欲與刻劃線之形成一起地使垂直裂紋伸展,則必須施加至少3~4N左右之負載,因此,本實施例之結果亦顯示,輔助線AL之形成,能夠以施加較在伴隨垂直裂紋伸展的刻劃動作時刻劃輪51施加之負載更小的負載來進行。若進一步說明,溝槽線TL之形成,可以與輔助線AL之形成時相同程度或更小的負載之施加來進行,因此,上述實施形態之方法,與藉由刻劃動作直接使垂直裂紋伸展之方法相較,亦可以說是能夠以低負載之施加使垂直裂紋伸展的方法。 Further, if the scribing wheel 51 is used to perform the scribing operation using the same condition, and the vertical crack is to be stretched together with the formation of the scribing line, a load of at least about 3 to 4 N must be applied. Therefore, the result of the present embodiment is also displayed. The formation of the auxiliary line AL can be performed by applying a load smaller than the load applied by the row wheel 51 at the time of the scribing operation with the vertical crack extension. Further, the formation of the groove line TL can be performed with the same degree or less as the application of the auxiliary line AL. Therefore, the method of the above embodiment directly stretches the vertical crack by the scribing action. The method can also be said to be a method capable of stretching vertical cracks with application of a low load.

<實施例2> <Example 2>

為了調查刻劃輪51之傾斜方向與垂直裂紋VC的關係,針對將傾斜角θ設定為-1.2°的情形,評價VC成立率。傾斜角θ以外之條件,設為與實施例1相同。另外,傾斜角θ為負的情形,例如若根據圖2進行說明的話,係相當於以刻劃輪51之刃前端PF(外周部)形成之鉛直面與水平面之正交軸之延伸方向D1相對於圖2所示之刻劃方向DP朝向相反側之方式,使刻劃輪51傾斜的情形,若根據圖3進行說明,相當於以刻劃輪51之行進方向前方往輔助線AL之形成位置更下游側即y軸正方向之側傾斜之狀態進行的情形。 In order to investigate the relationship between the inclination direction of the scribing wheel 51 and the vertical crack VC, the VC establishment rate was evaluated for the case where the inclination angle θ was set to -1.2°. The conditions other than the inclination angle θ are the same as in the first embodiment. Further, the case where the inclination angle θ is negative, for example, as described with reference to Fig. 2, corresponds to the direction in which the vertical plane formed by the tip end PF (outer peripheral portion) of the scoring wheel 51 is opposite to the extending direction D1 of the orthogonal axis of the horizontal plane. The state in which the scoring wheel 51 is inclined toward the opposite side as shown in FIG. 2, when the scoring wheel 51 is inclined, as described with reference to FIG. 3, corresponds to the position in which the direction of the scribing wheel 51 advances toward the auxiliary line AL. Further, the downstream side is a state in which the side in the positive direction of the y-axis is inclined.

圖14,係分別針對傾斜角θ為-1.2°的情形、與實施例1所 示之1.2°的情形,畫出VC成立率相對於輔助線AL之形成時施加之負載的圖表。 Fig. 14 is a case where the inclination angle θ is -1.2°, respectively, and the embodiment 1 In the case of 1.2°, a graph plotting the VC establishment rate with respect to the load applied when the auxiliary line AL is formed is plotted.

如圖14所示,傾斜角θ為-1.2°的情形,刻劃輪51施加之負載越大則VC成立率越高,但即便是2.6N也只有70%左右。此為較在實施例1中所示之、刻劃輪51施加之負載若至少為1.9N則可獲得95%以上之VC成立率的傾斜角θ為1.2°的情形差的結果。 As shown in Fig. 14, in the case where the inclination angle θ is -1.2°, the larger the load applied by the scoring wheel 51 is, the higher the VC establishment rate is, but even 2.6 N is only about 70%. This is a result of a case where the load applied to the scoring wheel 51 shown in the first embodiment is at least 1.9 N, and the inclination angle θ of the VC establishment rate of 95% or more is obtained as 1.2°.

該結果顯示,藉由在形成輔助線AL時將使刻劃輪51傾斜之方向設為垂直裂紋之預定伸展方向側,即便是較往相反側傾斜之情形更小的負載之施加,亦能夠確實地從溝槽線TL使垂直裂紋VC伸展。 As a result, it is shown that the direction in which the scribing wheel 51 is inclined when the auxiliary line AL is formed is set as the predetermined extending direction side of the vertical crack, and even if the load is applied to the opposite side to the opposite side, the load can be confirmed. The vertical crack VC is stretched from the groove line TL.

<變形例> <Modification>

上述實施形態中,雖在形成溝槽線TL後形成輔助線AL,但溝槽線TL與輔助線AL之形成順序可相反。 In the above embodiment, the auxiliary line AL is formed after the groove line TL is formed, but the order in which the groove line TL and the auxiliary line AL are formed may be reversed.

此外,上述實施形態中,雖使溝槽線TL與輔助線AL於脆性材料基板W之上面SF1正交,但此並非為必須之態樣,只要能適當實現伴隨輔助線AL之形成的從溝槽線TL起之垂直裂紋之伸展,則可以是溝槽線TL與輔助線AL傾斜交叉之態樣。 Further, in the above-described embodiment, the groove line TL and the auxiliary line AL are orthogonal to the upper surface SF1 of the brittle material substrate W. However, this is not essential, as long as the groove accompanying the formation of the auxiliary line AL can be appropriately realized. The extension of the vertical crack from the groove line TL may be such that the groove line TL and the auxiliary line AL are obliquely intersected.

又,上述實施形態中,使刻劃工具150進行的溝槽線TL之形成,雖藉由在使柄152之軸方向AX2朝向移動方向DA前方傾斜之狀態下,也就是以使頂面SD1朝向移動方向DA後方之姿勢,使鑽石尖點151滑動據以進行,但可取代此,藉由在使柄152之軸方向AX2朝向移動方向DA後方傾斜之狀態下,也就是以使頂面SD1朝向移動方向DA前方之姿勢,使鑽石尖點151滑動據以形成溝槽線TL。 Further, in the above-described embodiment, the formation of the groove line TL by the scribing tool 150 is performed in a state where the axial direction AX2 of the shank 152 is inclined forward in the moving direction DA, that is, the top surface SD1 is oriented. In the posture in the rear direction of the movement direction DA, the diamond cusp 151 is slid according to the movement, but instead, the state of the top surface SD1 is oriented by tilting the axial direction AX2 of the shank 152 toward the rear of the movement direction DA. The posture in front of the moving direction DA causes the diamond cusp 151 to slide to form the groove line TL.

或者,上述實施形態中,雖使用鑽石尖點151於溝槽線TL之形成,但可取代此,為藉由使刻劃裝置100之刻劃輪51壓接滾動以形成溝槽線TL之態樣。此可藉由例如個別地準備已預先將傾斜角θ固定設定為0°而成之溝槽線TL形成用之刻劃裝置100、與已將傾斜角θ固定設定於1.0°~5.0°之範圍(較佳為2.5°~5.0°之範圍)而成之輔助線AL形成用之刻劃裝置100,分別使用該等刻劃裝置來形成溝槽線TL與輔助線AL而加以實現。或者,亦可藉由一刻劃裝置100具備溝槽線TL形成用之刻劃工具50與輔助線AL形成用之刻劃工具50而加以實現。或者,進一步地,亦可藉由於刻劃裝置100設置未圖示之傾斜角可變手段,於輔助線AL之形成時設定成既定之傾斜角θ而實現之態樣。但是,在溝槽線TL之形成時,傾斜角θ並不限於0°。 Alternatively, in the above embodiment, the diamond cusp 151 is used to form the groove line TL, but instead of rolling the scribe wheel 100 by the scriber 100, the groove line TL is formed. kind. For example, the scribe apparatus 100 for forming the groove line TL in which the inclination angle θ is fixed to 0° in advance is prepared separately, and the inclination angle θ is fixed to be set in the range of 1.0° to 5.0°. The scribing device 100 for forming the auxiliary line AL (preferably in the range of 2.5 to 5.0) is realized by forming the groove line TL and the auxiliary line AL using the scribing means, respectively. Alternatively, the scribing device 100 may be provided with the scribing tool 50 for forming the groove line TL and the scribing tool 50 for forming the auxiliary line AL. Alternatively, the scriber 100 may be provided with a tilt angle variable means (not shown) to achieve a predetermined tilt angle θ when the auxiliary line AL is formed. However, at the time of formation of the groove line TL, the inclination angle θ is not limited to 0°.

但是,若為後二者之態樣時,與上述實施形態不同,垂直裂紋之預定伸展方向成為溝槽線TL之下游側。因此,於此等態樣中,以與上述實施例2同樣地以傾斜角θ為負的方式使刻劃輪51傾斜之狀態下,於溝槽線TL之上游側附近形成輔助線AL。更詳細而言,只要以刻劃輪51之行進方向前方往輔助線AL之形成位置更下游側即y軸負方向之側傾斜之狀態,進行輔助線AL之形成即可。 However, in the case of the latter two, unlike the above embodiment, the predetermined extension direction of the vertical crack becomes the downstream side of the groove line TL. Therefore, in the same manner as in the above-described second embodiment, the auxiliary line AL is formed in the vicinity of the upstream side of the groove line TL in a state where the scribe wheel 51 is inclined such that the inclination angle θ is negative. More specifically, the auxiliary line AL may be formed in a state where the forward direction of the scribing wheel 51 is inclined toward the downstream side of the formation position of the auxiliary line AL, that is, the side in the negative direction of the y-axis.

此時,與上述實施形態同樣地,以使輔助裂紋AC偏在於垂直裂紋VC之預定伸展方向、即溝槽線TL之下游側之態樣形成輔助線AL,藉此,於垂直裂紋VC之預定伸展方向適當地產生從溝槽線TL起之垂直裂紋之伸展。其結果,能夠在形成有溝槽線TL之分斷位置,以高確定性使垂直裂紋VC伸展。 At this time, as in the above-described embodiment, the auxiliary line AL is formed such that the auxiliary crack AC is biased in the predetermined extending direction of the vertical crack VC, that is, on the downstream side of the groove line TL, whereby the vertical crack VC is predetermined. The direction of extension suitably produces the extension of the vertical crack from the groove line TL. As a result, the vertical crack VC can be stretched with high certainty at the position where the groove line TL is formed.

51‧‧‧刻劃輪 51‧‧‧Scratch

52‧‧‧銷 52‧‧ ‧ sales

AX‧‧‧軸中心 AX‧‧‧Axis Center

DP‧‧‧刻劃方向 DP‧‧‧ scoring direction

PF‧‧‧(刻劃輪51之)刃前端 PF‧‧‧ (marking wheel 51) blade front end

D1‧‧‧刻劃輪51之刃前端PF(外周部)形成之鉛直面與水平面之正交軸之延伸方向 D1‧‧‧The direction of the orthogonal axis of the vertical plane formed by the front end PF (outer peripheral portion) of the scriber wheel 51

θ‧‧‧傾斜角 θ‧‧‧Tilt angle

Claims (8)

一種脆性材料基板之垂直裂紋之形成方法,係在將脆性材料基板於厚度方向加以分斷時在分斷位置形成垂直裂紋,其特徵在於,具備:溝槽線形成步驟,在該脆性材料基板之一主面形成線狀槽部的溝槽線;及輔助線形成步驟,藉由使刻劃輪於該一主面壓接滾動,形成與該溝槽線交叉之加工痕的輔助線,該刻劃輪在外周部全周具備刃前端;於該溝槽線形成步驟中,以在該溝槽線下方維持無裂紋狀態之方式形成該溝槽線;於該輔助線形成步驟中,以使該刻劃輪於水平面內相對該輔助線之形成行進方向傾斜既定傾斜角之狀態形成該輔助線;以該溝槽線與該輔助線之交點為起始點,使垂直裂紋從該溝槽線往該脆性材料基板之厚度方向伸展。 A method for forming a vertical crack of a brittle material substrate, wherein a vertical crack is formed at a breaking position when the brittle material substrate is divided in a thickness direction, and is characterized in that: a groove line forming step is performed on the brittle material substrate a groove line forming a linear groove portion on a main surface; and an auxiliary line forming step of forming an auxiliary line of a process mark intersecting the groove line by pressing the scribe wheel on the one main surface by rolling The rowing wheel has a blade tip end in the outer peripheral portion; in the groove line forming step, the groove line is formed to maintain a crack-free state below the groove line; in the auxiliary line forming step, the The scribing wheel forms the auxiliary line in a state in which the traveling direction of the auxiliary line is inclined with a predetermined inclination angle in the horizontal plane; the intersection of the groove line and the auxiliary line is used as a starting point, and the vertical crack is made from the groove line The brittle material substrate is stretched in the thickness direction. 如申請專利範圍第1項之脆性材料基板之垂直裂紋之形成方法,其中,於該輔助線形成步驟中,伴隨該輔助線之形成,在該輔助線之一側方區域產生輔助裂紋從該輔助線起朝向該脆性材料基板內部之偏在;以該輔助裂紋之偏在區域成為該溝槽線上之垂直裂紋之預定伸展方向側的方式,決定該溝槽線與該輔助線之形成位置。 The method for forming a vertical crack of a brittle material substrate according to claim 1, wherein in the auxiliary line forming step, an auxiliary crack is generated from a side region of the auxiliary line along with the auxiliary line formation. The line is oriented toward the inside of the brittle material substrate; and the position at which the groove line and the auxiliary line are formed is determined such that the auxiliary crack is located on the side of the predetermined extension direction of the vertical crack on the groove line. 如申請專利範圍第2項之脆性材料基板之垂直裂紋之形成方法,其中,以在該溝槽線上之垂直裂紋之預定伸展方向相反側附近與該溝槽線交叉之方式形成該輔助線。 A method of forming a vertical crack of a brittle material substrate according to claim 2, wherein the auxiliary line is formed so as to intersect the groove line in the vicinity of a side opposite to a predetermined extension direction of the vertical crack on the groove line. 如申請專利範圍第2或3項之脆性材料基板之垂直裂紋之形成方 法,其中,於該輔助線形成步驟中,使該刻劃輪之行進方向前側於水平面內從該輔助線之形成行進方向朝向該溝槽線上之垂直裂紋之預定伸展方向側傾斜。 The formation of a vertical crack of a brittle material substrate as claimed in claim 2 or 3 In the auxiliary line forming step, the front side of the traveling direction of the scribing wheel is inclined in a horizontal plane from a direction in which the auxiliary line is formed toward a predetermined direction of extension of the vertical crack on the groove line. 如申請專利範圍第1至3項中任一項之脆性材料基板之垂直裂紋之形成方法,其中,該傾斜角係1.0°以上5.0°以下。 The method for forming a vertical crack of a brittle material substrate according to any one of claims 1 to 3, wherein the inclination angle is 1.0 or more and 5.0 or less. 如申請專利範圍第5項之脆性材料基板之垂直裂紋之形成方法,其中,該傾斜角係2.5°以上5.0°以下。 A method of forming a vertical crack of a brittle material substrate according to claim 5, wherein the inclination angle is 2.5 or more and 5.0 or less. 如申請專利範圍第1至3項中任一項之脆性材料基板之垂直裂紋之形成方法,其中,於形成該溝槽線後,形成該輔助線。 The method of forming a vertical crack of a brittle material substrate according to any one of claims 1 to 3, wherein the auxiliary line is formed after the groove line is formed. 一種脆性材料基板之分斷方法,係將脆性材料基板於厚度方向加以分斷,其特徵在於,具備:垂直裂紋形成步驟,係以申請專利範圍第1至7項中任一項之垂直裂紋之形成方法,在該脆性材料基板形成垂直裂紋;及裂斷步驟,沿該垂直裂紋使該脆性材料基板裂斷。 A method for breaking a substrate of a brittle material by dividing a substrate of a brittle material in a thickness direction, comprising: a vertical crack forming step, which is a vertical crack of any one of claims 1 to 7. a method of forming a vertical crack on the brittle material substrate; and a cracking step of breaking the brittle material substrate along the vertical crack.
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Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01271178A (en) * 1988-04-21 1989-10-30 Mitsubishi Electric Corp Dicing blade for semiconductor wafer
JP2003183040A (en) * 2001-12-18 2003-07-03 Oputo System:Kk Point cutter, method of use and apparatus
US20080110952A1 (en) * 2006-11-15 2008-05-15 Marvin William Kemmerer Sheet separation through fluid impact
JP5450964B2 (en) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 Scribing apparatus and scribing method
JP5528904B2 (en) * 2010-05-20 2014-06-25 株式会社ディスコ Method for dividing sapphire wafer
JP5210356B2 (en) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 Method for scribing a brittle material substrate
JP5067457B2 (en) * 2010-07-29 2012-11-07 三星ダイヤモンド工業株式会社 Scribing wheel, scribing device, and scribing method
JP5310787B2 (en) * 2011-05-31 2013-10-09 三星ダイヤモンド工業株式会社 Scribing method
US20140219556A1 (en) * 2011-12-29 2014-08-07 Intel Corporation Generalized robust multichannel feature detector
KR20150014458A (en) * 2012-04-24 2015-02-06 가부시키가이샤 토쿄 세이미쯔 Dicing blade
TWI589420B (en) * 2012-09-26 2017-07-01 Mitsuboshi Diamond Ind Co Ltd Metal multilayer ceramic substrate breaking method and trench processing tools
CN102910809B (en) * 2012-10-24 2015-04-15 深圳市华星光电技术有限公司 Base plate and cutting method thereof
JP2015034111A (en) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 Segmentation method of laminated ceramic substrate
JP6201608B2 (en) * 2013-10-08 2017-09-27 三星ダイヤモンド工業株式会社 Scribing method
KR101847921B1 (en) * 2014-03-31 2018-04-11 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for cutting brittle-material substrate
JP6432245B2 (en) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 Substrate cutting method
TWI609754B (en) * 2015-09-29 2018-01-01 三星鑽石工業股份有限公司 Fragmentation method of brittle substrate

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