TW201702606A - Cantilever-type high-frequency probe card capable of switching the signal path automatically for detecting the electronic connection among electronic members - Google Patents
Cantilever-type high-frequency probe card capable of switching the signal path automatically for detecting the electronic connection among electronic members Download PDFInfo
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- TW201702606A TW201702606A TW104121724A TW104121724A TW201702606A TW 201702606 A TW201702606 A TW 201702606A TW 104121724 A TW104121724 A TW 104121724A TW 104121724 A TW104121724 A TW 104121724A TW 201702606 A TW201702606 A TW 201702606A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
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- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本發明係與探針卡有關;特別是指一種懸臂式高頻探針卡。 The invention relates to a probe card; in particular to a cantilevered high frequency probe card.
按,用以檢測電子產品之各精密電子元件間的電性連接是否確實的方法,部分是以使用懸臂式探針之探針卡作為一檢測機與待測電子物件之間的檢測訊號與電源訊號之傳輸介面。 According to the method for detecting whether the electrical connection between the precision electronic components of the electronic product is true, the detection card and the power source between the detecting device and the electronic object to be tested are partly used as the probe card using the cantilever probe. Signal transmission interface.
懸臂式探針卡主要是由相互電性連接之探針與剛性的多層印刷電路板所構成,且探針用以點觸待測電子物件之待測部位,多層印刷電路板則與檢測機之訊號端子接觸,而多層印刷電路板上為方便電路佈局與設計,其上通常設置有許多貫孔,作為不同層的電路線傳導電氣訊號之用。但隨著數位科技的進步,待測電子物件的運算速度與每秒的訊號傳輸量日益增大,貫孔於高頻時將產生貫孔效應(Via stub effect)造成整體的電感量提升,而檢測訊號頻率越高,其電感的阻抗值則會因高頻之訊號通過而提高,造成高頻的檢測訊號無法順利通過,而容易有測試誤判的情形產生。 The cantilever probe card is mainly composed of a probe electrically connected to each other and a rigid multilayer printed circuit board, and the probe is used to touch the portion to be tested of the electronic object to be tested, and the multilayer printed circuit board and the detector are The signal terminals are in contact, and the multilayer printed circuit board is convenient for circuit layout and design, and a plurality of through holes are usually provided thereon for conducting electrical signals for different layers of circuit lines. However, with the advancement of digital technology, the computing speed of the electronic object to be tested and the amount of signal transmission per second are increasing. When the through hole is at a high frequency, the Via stub effect will increase the overall inductance. The higher the frequency of the detection signal, the higher the impedance value of the inductor will be due to the high-frequency signal passing, which will result in the high-frequency detection signal not passing smoothly, and it is easy to have a test misjudgment.
另外,隨著待測電子物件的運算速度與每秒的訊號傳輸量亦日益增大,檢測機之處理器所產生之檢測訊號之頻率,並無法滿足待測電子物件所需之高頻檢測訊號的訊號傳輸量需求。為解決上述困擾,大多利用待測電子物件來產生所需之高頻檢測訊號,再透過探針卡傳送回待測電子物 件進行檢測,進而達到高頻測試之目的。但回授元件通常設至於多層印刷電路板之表層(即朝向檢測機的面)上,而使得回授檢測訊號上之電路路徑較長,不僅使得檢測訊號容易受到多層印刷電路板上的其他線路或元件影響,也會造成電路路徑的具有較高的微量電感,使得電路的阻抗值會因為檢測訊號頻率越高而大幅提升,同樣會造成高頻的檢測訊號無法順利通過的情形,而容易有誤判檢測訊號之情形產生。 In addition, as the computing speed of the electronic object to be tested and the amount of signal transmission per second are also increasing, the frequency of the detection signal generated by the processor of the detecting machine cannot satisfy the high frequency detecting signal required for the electronic object to be tested. The amount of signal transmission required. In order to solve the above problems, most of the electronic objects to be tested are used to generate the required high-frequency detection signals, and then the probes are transmitted back to the electronic objects to be tested. The parts are tested to achieve the purpose of high frequency testing. However, the feedback component is usually disposed on the surface of the multilayer printed circuit board (ie, facing the surface of the detector), so that the circuit path on the feedback detection signal is long, which not only makes the detection signal susceptible to other lines on the multilayer printed circuit board. Or component influence, it will also cause a high micro-inductance of the circuit path, so that the impedance value of the circuit will be greatly improved due to the higher frequency of the detection signal, which will also cause the high-frequency detection signal to pass smoothly, and it is easy to have The situation of misjudging the detection signal is generated.
有鑑於此,本發明之目的用於提供一種懸臂式高頻探針卡,可有效地傳輸高頻檢測訊號,且可依據檢測訊號之頻率自動地切換訊號路徑。 In view of the above, the object of the present invention is to provide a cantilever type high frequency probe card capable of efficiently transmitting a high frequency detection signal and automatically switching the signal path according to the frequency of the detection signal.
緣以達成上述目的,本發明所提供懸臂式高頻探針卡,用以設置於一待測電子物件上方,且包含有一載板、一針座、二探針與一電容性元件,其中該針座設於該載板上,且以絕緣材料製成;該二探針以導電材料製成;各該探針具有相連接的一懸臂段與一針尖段,該懸臂段與該針座連接,而該針尖段則用以點觸該待測電子物件之待測部位;該電容性元件具有兩端分別電性連接該二探針,該電容性元件位於該針座外部且鄰近該針座;藉此,當該待測電子物件產生高頻之檢測訊號而傳導至其中一該探針時,高頻之檢測訊號經過該電容性元件而傳導至另一該探針,進而回流至該待測電子物件。 In order to achieve the above object, the present invention provides a cantilever type high frequency probe card for being disposed above an electronic object to be tested, and includes a carrier, a pin holder, two probes and a capacitive component, wherein The needle holder is disposed on the carrier plate and is made of an insulating material; the two probes are made of a conductive material; each of the probes has a connected cantilever segment and a tip segment, and the cantilever segment is connected to the needle holder And the pin tip segment is used to touch the portion to be tested of the electronic object to be tested; the capacitive component has two ends electrically connected to the two probes, and the capacitive component is located outside the needle holder and adjacent to the needle seat Thereby, when the electronic object to be tested generates a high frequency detection signal and is transmitted to one of the probes, the high frequency detection signal is transmitted to the other probe through the capacitive element, and then flows back to the standby Measure electronic objects.
本發明另提供一種懸臂式高頻探針卡,用以設置於一待測電子物件上方,且包含有一載板、一針座、二探針與一電路板,其中該針座設於該載板上,且以絕緣材料製成;該二探針以導電材料製成;各該探針具有相連接的一懸臂段與一針尖段,該懸臂段與該針座連接,而該針尖段則用 以點觸該待測電子物件之待測部位;該電路板設置有二第一導線,該二第一導線彼此靠近但不接觸,該二第一導線分別電性連接該二探針;藉此,當該待測電子物件產生高頻之檢測訊號而傳導至其中一該探針時,高頻之檢測訊號通過該二導線而傳導至另一該探針,進而回流至該待測電子物件。 The present invention further provides a cantilever type high frequency probe card for being disposed above an electronic object to be tested, and comprising a carrier board, a needle holder, two probes and a circuit board, wherein the needle holder is disposed on the carrier a plate made of an insulating material; the two probes are made of a conductive material; each of the probes has a cantilever segment and a tip segment connected thereto, the cantilever segment is connected to the hub, and the tip segment is connected use Touching the portion to be tested of the electronic object to be tested; the circuit board is provided with two first wires, the two first wires are close to each other but not in contact, and the two first wires are electrically connected to the two probes respectively; When the electronic object to be tested generates a high frequency detection signal and is transmitted to one of the probes, the high frequency detection signal is transmitted to the other probe through the two wires, and then returned to the electronic object to be tested.
如此一來,透過上述之設計,該懸臂式高頻探針卡不僅可有效地傳輸高頻檢測訊號,並可依據檢測訊號之頻率自動地切換訊號路徑。 In this way, the cantilever type high frequency probe card can not only effectively transmit the high frequency detection signal but also automatically switch the signal path according to the frequency of the detection signal.
1‧‧‧懸臂式高頻探針卡 1‧‧‧Cantilever type high frequency probe card
10‧‧‧載板 10‧‧‧ Carrier Board
10a‧‧‧上表面 10a‧‧‧ upper surface
10b‧‧‧下表面 10b‧‧‧ lower surface
10c‧‧‧穿孔 10c‧‧‧Perforation
12‧‧‧針座 12‧‧‧ needle seat
122‧‧‧第一面 122‧‧‧ first side
124‧‧‧第二面 124‧‧‧ second side
126‧‧‧第三面 126‧‧‧ third side
14‧‧‧探針 14‧‧‧ probe
142‧‧‧針尖段 142‧‧‧needle section
144‧‧‧懸臂段 144‧‧‧Cantilever section
16‧‧‧電傳輸件 16‧‧‧Electrical transmission parts
162‧‧‧訊號傳輸線路 162‧‧‧Signal transmission line
18‧‧‧電容性元件 18‧‧‧Capacitive components
2‧‧‧懸臂式高頻探針卡 2‧‧‧Cantilever type high frequency probe card
20‧‧‧電感性元件 20‧‧‧Inductive components
3‧‧‧懸臂式高頻探針卡 3‧‧‧Cantilever type high frequency probe card
22‧‧‧探針 22‧‧‧ probe
222‧‧‧懸臂段 222‧‧‧Cantilever segment
222a‧‧‧第一段 222a‧‧‧ first paragraph
222b‧‧‧第二段 222b‧‧‧second paragraph
224‧‧‧針尖段 224‧‧‧needle section
24‧‧‧針座 24‧‧‧ needle seat
242‧‧‧第二面 242‧‧‧ second side
25‧‧‧電容性元件 25‧‧‧Capacitive components
26‧‧‧電感性元件 26‧‧‧Inductive components
28‧‧‧連接線 28‧‧‧Connecting line
30‧‧‧載板 30‧‧‧ Carrier Board
302‧‧‧接點 302‧‧‧Contacts
4‧‧‧懸臂式高頻探針卡 4‧‧‧Cantilever type high frequency probe card
32‧‧‧電感性元件 32‧‧‧Inductive components
34‧‧‧連接線 34‧‧‧Connecting line
5‧‧‧懸臂式高頻探針卡 5‧‧‧Cantilever type high frequency probe card
36‧‧‧電容性元件 36‧‧‧Capacitive components
38‧‧‧針座 38‧‧‧ needle seat
382‧‧‧第二面 382‧‧‧ second side
384‧‧‧第三面 384‧‧‧ third side
386‧‧‧第一面 386‧‧‧ first side
40‧‧‧電感性元件 40‧‧‧Inductive components
42‧‧‧連接線 42‧‧‧Connecting line
8‧‧‧懸臂式高頻探針卡 8‧‧‧Cantilever type high frequency probe card
44‧‧‧印刷電路板 44‧‧‧Printed circuit board
46‧‧‧針座 46‧‧‧ needle seat
462‧‧‧第二面 462‧‧‧ second side
464‧‧‧第一面 464‧‧‧ first side
466‧‧‧第三面 466‧‧‧ third side
48‧‧‧電容性元件 48‧‧‧Capacitive components
50‧‧‧電感性元件 50‧‧‧Inductive components
52‧‧‧印刷電路板 52‧‧‧Printed circuit board
54‧‧‧第一導線 54‧‧‧First wire
56‧‧‧第二導線 56‧‧‧second wire
562‧‧‧線段 562‧‧‧ line segment
58‧‧‧接點 58‧‧‧Contacts
58'‧‧‧接點 58'‧‧‧Contacts
60‧‧‧電容性元件 60‧‧‧Capacitive components
62‧‧‧電感性元件 62‧‧‧Inductive components
62‧‧‧軟性電路板 62‧‧‧Soft circuit board
64‧‧‧訊號傳輸線路 64‧‧‧Signal transmission line
64'‧‧‧訊號傳輸線路 64'‧‧‧Signal transmission line
66‧‧‧第一導線 66‧‧‧First wire
68‧‧‧第二導線 68‧‧‧Second wire
70‧‧‧探針 70‧‧‧ probe
702‧‧‧懸臂段 702‧‧‧Cantilever section
100‧‧‧檢測機 100‧‧‧Detector
110‧‧‧檢測端子 110‧‧‧Test terminals
200‧‧‧待測電子物件 200‧‧‧Electronic objects to be tested
圖1係本發明第一較佳實施例懸臂式高頻探針卡之結構圖。 1 is a structural view of a cantilever type high frequency probe card according to a first preferred embodiment of the present invention.
圖2用以揭示圖1之電容性元件與探針連接示意圖。 FIG. 2 is a schematic diagram showing the connection of the capacitive element and the probe of FIG. 1.
圖3用以揭示圖1於傳輸低頻訊號時的訊號流向示意圖。 FIG. 3 is a schematic diagram showing the flow of signals in FIG. 1 when transmitting a low frequency signal.
圖4用以揭示圖1於傳輸高頻訊號時的訊號流向示意圖。 FIG. 4 is a schematic diagram showing the flow of signals in FIG. 1 when transmitting a high frequency signal.
圖5係本發明第二較佳實施例懸臂式高頻探針卡之結構圖。 Fig. 5 is a structural view showing a cantilever type high frequency probe card according to a second preferred embodiment of the present invention.
圖6用以揭示圖5之電容性元件、電感性元件與探針連接示意圖。 FIG. 6 is a schematic diagram showing the connection of the capacitive element, the inductive element and the probe of FIG. 5.
圖7用以揭示圖5於傳輸高頻訊號時的訊號流向示意圖。 FIG. 7 is a schematic diagram showing the flow of signals in FIG. 5 when transmitting a high frequency signal.
圖8用以揭示圖5於傳輸高頻訊號時的訊號流向示意圖。 FIG. 8 is a schematic diagram showing the flow of signals in FIG. 5 when transmitting a high frequency signal.
圖9係本發明第三較佳實施例懸臂式高頻探針卡之結構圖。 Figure 9 is a structural view of a cantilever type high frequency probe card according to a third preferred embodiment of the present invention.
圖10係本發明第四較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 10 is a partial structural view showing a cantilever type high frequency probe card according to a fourth preferred embodiment of the present invention.
圖11係本發明第五較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 11 is a partial structural view showing a cantilever type high frequency probe card according to a fifth preferred embodiment of the present invention.
圖12係本發明第六較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 12 is a partial structural view showing a cantilever type high frequency probe card according to a sixth preferred embodiment of the present invention.
圖13係本發明第七較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 13 is a partial structural view showing a cantilever type high frequency probe card according to a seventh preferred embodiment of the present invention.
圖14係本發明第八較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 14 is a partial structural view showing a cantilever type high frequency probe card according to an eighth preferred embodiment of the present invention.
圖15係本發明第九較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 15 is a partial structural view showing a cantilever type high frequency probe card according to a ninth preferred embodiment of the present invention.
圖16係本發明第十較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 16 is a partial structural view showing a cantilever type high frequency probe card according to a tenth preferred embodiment of the present invention.
圖17係本發明第十一較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 17 is a partial structural view showing a cantilever type high frequency probe card according to an eleventh preferred embodiment of the present invention.
圖18係本發明第十二較佳實施例懸臂式高頻探針卡之局部結構圖。 Figure 18 is a partial structural view showing a cantilever type high frequency probe card according to a twelfth preferred embodiment of the present invention.
為能更清楚地說明本發明,茲舉較佳實施例並配合圖示詳細說明如後。請參圖1所示,本發明第一較佳實施例之懸臂式高頻探針卡1係設置於一檢測機100以及一待測電子物件200之間,用以將該檢測機100之檢測訊號傳輸予該待測電子物件200。該懸臂式高頻探針卡1包含有一載板10、一針座12、二探針14、一電傳輸件、一電容性元件18,其中:該載板10為一剛性之印刷電路板,且佈設有 電路佈局(圖未示)。該載板10具有一上表面10a以及一下表面10b,該上表面10a朝向該檢測機100,而該下表面10b朝向該待測電子物件200,且該載板10上具有複數個貫穿該上表面10a與該下表面10b之穿孔10c。 In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings. As shown in FIG. 1 , the cantilever type high frequency probe card 1 of the first preferred embodiment of the present invention is disposed between a detecting machine 100 and an electronic object 200 to be tested for detecting the detecting machine 100. The signal is transmitted to the electronic object 200 to be tested. The cantilever type high-frequency probe card 1 includes a carrier 10, a hub 12, two probes 14, an electrical transmission member, and a capacitive component 18. The carrier 10 is a rigid printed circuit board. And cloth Circuit layout (not shown). The carrier 10 has an upper surface 10a facing the detector 100, and a lower surface 10b facing the electronic object 200 to be tested, and the carrier 10 has a plurality of through the upper surface. 10a and the perforation 10c of the lower surface 10b.
該針座12係設於該載板10之下表面且位於一該穿孔10c之附近,該針座12具有相背對的一第一面122與一第二面124,以及一第三面126位於該第一面122與該第二面124之間且朝向該待測電子物件200。本實施例中,該針座12係以環氧樹脂(Epoxy)製成而具有絕緣及吸震之特性。當然,在其他實施態樣中,亦可選用其他絕緣材料。 The needle holder 12 is disposed on the lower surface of the carrier 10 and located adjacent to the through hole 10c. The needle holder 12 has a first surface 122 and a second surface 124 opposite to each other, and a third surface 126. Located between the first surface 122 and the second surface 124 and facing the electronic object 200 to be tested. In this embodiment, the needle holder 12 is made of epoxy resin and has the characteristics of insulation and shock absorption. Of course, in other embodiments, other insulating materials may also be used.
該二探針14係以導電材料製成,且各該探針14具有相連接一針尖段142與一懸臂段144,該針尖段142用以點觸該待測電子物件200之待測部位(圖未示)。該懸臂段144之一部分埋設於該針座12中,另一部分自該針座12的第一面突伸出該針座12外,使該針座12的第一面122朝向該針尖段142。 The two probes 14 are made of a conductive material, and each of the probes 14 has a tip portion 142 and a cantilever portion 144 for contacting the portion to be tested of the electronic object to be tested 200 ( The figure is not shown). One portion of the cantilever segment 144 is embedded in the hub 12, and the other portion projects from the first face of the hub 12 beyond the hub 12 such that the first face 122 of the hub 12 faces the tip segment 142.
該電傳輸件16具可撓性,而於本實施例中,該電傳輸件16係選用軟性電路板(Flexible Printed Circuit,FPC)製成,並佈設有複數訊號傳輸線路162(圖2參照)。該電傳輸件16設於該載板10上並穿過一該穿孔10c,使該電傳輸件16上之訊號傳輸線路162的其中一端位於該上表面所在側,而該些訊號傳輸線路162的另一端則位於該下表面10b的所在側,並穿過該針座12的第二面124而埋設於該針座12中,且該些訊號傳輸線路162各別電性連接各該探針的懸臂段144。 The electrical transmission member 16 is flexible. In the embodiment, the electrical transmission member 16 is made of a flexible printed circuit (FPC) and is provided with a plurality of signal transmission lines 162 (refer to FIG. 2). . The electrical transmission member 16 is disposed on the carrier 10 and passes through the through hole 10c such that one end of the signal transmission line 162 on the electrical transmission member 16 is located on the side of the upper surface, and the signal transmission lines 162 The other end is located on the side of the lower surface 10b, and is embedded in the needle holder 12 through the second surface 124 of the socket 12, and the signal transmission lines 162 are electrically connected to the probes. Cantilever segment 144.
該電容性元件18在本實施例中為一電容,該電容性元件18係焊設於該電傳輸件16上鄰近該針座12之位置處,而位於該針座12外部。該電容性元件18的兩端分別與該電傳輸件16之訊號傳輸線路162電性連接。 In the present embodiment, the capacitive component 18 is a capacitor that is soldered to the electrical transmission member 16 adjacent to the hub 12 and external to the hub 12 . Both ends of the capacitive element 18 are electrically connected to the signal transmission line 162 of the electrical transmission member 16 respectively.
請參閱圖3,當該檢測機100之檢測端子110輸出低頻或直流之檢測訊號時,該電容性元件18呈現斷路或是高阻抗之狀態,使得該檢測端子110輸出之低頻或直流檢測訊號將經由一該訊號傳輸線路162至其中一該探針14並輸出至該待測電子物件200,而後,由另一該探針接收並傳導該待測電子物件200回傳之低頻或直流檢測訊號,並透過另一該訊號傳輸線路162回流至該檢測機100。 Referring to FIG. 3, when the detecting terminal 110 of the detecting machine 100 outputs a low frequency or direct current detecting signal, the capacitive element 18 exhibits an open circuit or a high impedance state, so that the low frequency or direct current detecting signal outputted by the detecting terminal 110 will be Passing through the signal transmission line 162 to one of the probes 14 and outputting to the electronic object 200 to be tested, and then receiving and transmitting the low frequency or DC detection signal returned by the electronic object to be tested 200 by another probe. And returning to the detector 100 through another signal transmission line 162.
另外,請參閱圖4,當該待測電子物件200欲執行自我檢測之程序而輸出之高頻(如12Gbps)檢測訊號時,該電容性元件18將呈短路或低阻抗之狀態,該待測電子物件200輸出的高頻檢測訊號傳輸至其中一探針14後,便透過該電傳輸件16上之訊號傳輸線路162與該電容性元件18傳導至另一該探針14,藉以透過較短之傳輸路徑快速地回流至該待測電子物件200,進而達到自我檢測之目的。 In addition, referring to FIG. 4, when the electronic object to be tested 200 is to perform a self-detection process and outputs a high-frequency (eg, 12 Gbps) detection signal, the capacitive element 18 will be in a short-circuit or low-impedance state. After the high frequency detection signal outputted by the electronic object 200 is transmitted to one of the probes 14, the signal transmission line 162 on the electrical transmission member 16 and the capacitive element 18 are conducted to the other of the probes 14 for short transmission. The transmission path is quickly returned to the electronic object 200 to be tested, thereby achieving the purpose of self-detection.
如此一來,透過上述之設計,除可達到避免電性干擾、以及不會有貫孔效應產生之優點外,更可有效地縮短訊號回授時的傳導路徑,進而有效地縮減路徑上的微量電阻與電感,使高頻檢測訊號能順利地回授至該待測電子物件200,而不會有訊號誤判的情形產生。 In this way, through the above design, in addition to the advantages of avoiding electrical interference and having no through-hole effect, the conduction path during signal feedback can be effectively shortened, thereby effectively reducing the micro-resistance on the path. With the inductor, the high-frequency detection signal can be smoothly returned to the electronic object 200 to be tested without a signal misjudgment.
圖5所示為本發明第二較佳實施例之懸臂式高頻探針卡2,其係以第一實施例為基礎,更包含有二電感性元件20,本實施例中,各該電感性元件為一扼流圈(choke)。該些電感性元件20銲設於該電傳輸件16且位於鄰近該電容性元件18之位置。請配合圖6,該些電感性元件20一端分別透過該訊號傳輸線路162電性連接該些探針14之懸臂段144,而另一端則電性連接至該檢測機100。實施上,除了採用扼流圈之外,亦可使用線圈(coil)、繞組(Winding)或磁珠(Bead)等具有電感特性之元件代替,但使用扼流圈之好處在於其體積較小,而可輕易地設於該載 板10上,亦不會增加整體之體積,而可有效地使整體結構達到薄型化之目的。 FIG. 5 shows a cantilever type high frequency probe card 2 according to a second preferred embodiment of the present invention, which is based on the first embodiment and further includes two inductive elements 20. In this embodiment, each of the batteries The inductive element is a choke. The inductive components 20 are soldered to the electrical transmission member 16 and located adjacent to the capacitive component 18. With reference to FIG. 6 , one end of the inductive component 20 is electrically connected to the cantilever segment 144 of the probes 14 through the signal transmission line 162 , and the other end is electrically connected to the detector 100 . In addition to the use of chokes, coils, windings, or beads (Bead) can be used instead of inductive components, but the advantage of using chokes is that they are small. And can be easily set in the load On the board 10, the overall volume is not increased, and the overall structure can be effectively made thin.
請參閱圖7,當該檢測機100之檢測端子110輸出低頻或直流之檢測訊號時,該二電感性元件20係呈短路或低阻抗之狀態,而該電容性元件18則呈現斷路或是高阻抗之狀態,使得該檢測端子110輸出之低頻或直流檢測訊號將透過其中一該電感性元件20而經由一該訊號傳輸線路162傳導至其中一該探針並輸出至該待測電子物件200,而後,由另一該探針14接收並傳導待測電子物件200回傳之低頻或直流檢測訊號,並透過另一該訊號傳輸線路162傳導至另外一該電感性元件20,進而回流至該檢測機100。 Referring to FIG. 7, when the detecting terminal 110 of the detecting machine 100 outputs a low frequency or direct current detecting signal, the two inductive elements 20 are in a short circuit or low impedance state, and the capacitive element 18 is open or high. The state of the impedance is such that the low frequency or DC detection signal outputted by the detecting terminal 110 is transmitted through one of the inductive components 20 to one of the probes via the signal transmission line 162 and output to the electronic object 200 to be tested. Then, the low frequency or DC detection signal transmitted by the other electronic device 200 is received and transmitted by another probe 14 and transmitted to the other inductive component 20 through the other signal transmission line 162, thereby returning to the detection. Machine 100.
另外,請參閱圖8,當該待測電子物件200欲執行自我檢測之程序而輸出高頻檢測訊號時,該電容性元件18將呈短路或低阻抗之狀態,而該二電感性元件20則呈現斷路或是高阻抗之狀態,使得高頻檢測訊號傳輸至其中一探針後,便透過訊號傳輸線路162與該電容性元件18傳導至另一探針14,藉以透過較短之傳輸路徑快速地回傳至該待測電子物件200,進而達到自我檢測之目的。 In addition, referring to FIG. 8, when the electronic object to be tested 200 is to perform a self-testing process and outputs a high-frequency detection signal, the capacitive element 18 will be in a short-circuit or low-impedance state, and the two inductive components 20 In the state of being open or high impedance, the high frequency detection signal is transmitted to one of the probes, and then transmitted to the other probe 14 through the signal transmission line 162 and the capacitive element 18, thereby transmitting through a short transmission path. The ground is transmitted back to the electronic object 200 to be tested, thereby achieving the purpose of self-detection.
圖9所示為本發明第三較佳實施例之懸臂式高頻探針卡3,其具有大致相同於前述第二實施例之結構,不同的是,本實施例的各探針22的懸臂段222包括一第一段222a與一第二段222b,該第一段222a與針尖段224相連,該第二段222b係自針座的第二面242突伸出該針座24外。此外,本實施例的電容性元件25的兩端分別銲設於該二探針22的第二段222b且分別電性連接該二探針22。而二電感性元件26係結合於該針座24的第二面242上。本實施例的電傳輸件係由複數條連接線28構成,該些連接線28各別形成訊號傳輸線路。各該電感性元件26係透過二該連接線28分別電性連接一該探針22的懸臂段222之第二段222b 及載板30上的接點302。藉此,檢測機100的檢測端子110與該二接點302接觸後,即可進行檢測。 FIG. 9 shows a cantilever type high-frequency probe card 3 according to a third preferred embodiment of the present invention, which has substantially the same structure as the second embodiment, except that the cantilever of each probe 22 of the present embodiment is The segment 222 includes a first segment 222a that is coupled to the tip segment 224 and a second segment 222b that projects from the second face 242 of the hub to the outside of the hub 24. In addition, the two ends of the capacitive element 25 of the present embodiment are respectively soldered to the second segment 222b of the two probes 22 and electrically connected to the two probes 22 respectively. The two inductive elements 26 are coupled to the second face 242 of the hub 24. The electric transmission member of this embodiment is composed of a plurality of connecting wires 28, each of which forms a signal transmission line. Each of the inductive elements 26 is electrically connected to the second segment 222b of the cantilever segment 222 of the probe 22 through the two connecting wires 28 respectively. And a contact 302 on the carrier 30. Thereby, the detection terminal 110 of the detector 100 can be detected after being in contact with the two contacts 302.
圖10所示為本發明第四較佳實施例之懸臂式高頻探針卡4,其具有大致相同於前述第三實施例之結構,不同的是,二電感性元件32是分別銲設於該些探針22之第二段222b上,使該些電感性元件32一端各別電性連接該些探針22,而該二電感性元件32之另一端透過二連接線34連接至檢測機100。 FIG. 10 shows a cantilever type high frequency probe card 4 according to a fourth preferred embodiment of the present invention, which has substantially the same structure as the third embodiment, except that the two inductive elements 32 are respectively soldered to The second portion 222b of the probes 22 is electrically connected to the probes 22 at one end of the inductive components 32, and the other end of the two inductive components 32 is connected to the detector through the two connecting wires 34. 100.
圖11所示為本發明第五較佳實施例之懸臂式高頻探針卡5,其具有大致相同於前述第三實施例之結構,不同的是,電容性元件36係結合於針座38的第二面382上,且該二電容性元件36的兩端分別連接二個電感性元件40,並透過連接於該二電感性元件40的連接線42電性連接至探針22上。 FIG. 11 shows a cantilever type high frequency probe card 5 according to a fifth preferred embodiment of the present invention, which has a structure substantially the same as that of the foregoing third embodiment, except that the capacitive element 36 is coupled to the hub 38. The second surface 382 of the second capacitive element 36 is connected to the two inductive elements 40 respectively, and is electrically connected to the probe 22 through a connecting line 42 connected to the two inductive elements 40.
上述第五實施例之電容性元件36及電感性元件40的設置位置亦可設計為如圖12所示之第六較佳實施例,結合於針座38的第三面384上;亦或是如圖13所示之第七較佳實施例,結合於針座38的第一面386上。當然,亦可以將電容性元件36及電感性元件40分別設置於針座38不同的面上。 The position of the capacitive element 36 and the inductive element 40 of the fifth embodiment may also be designed as a sixth preferred embodiment as shown in FIG. 12, coupled to the third surface 384 of the hub 38; The seventh preferred embodiment, shown in FIG. 13, is coupled to the first face 386 of the hub 38. Of course, the capacitive element 36 and the inductive element 40 may be disposed on different faces of the hub 38, respectively.
圖14為本發明第八較佳實施例之懸臂式高頻探針卡8,其具有大致相同於第五實施例之結構,不同的是,該懸臂式高頻探針卡8更包含有一印刷電路板44,該印刷電路板44係結合於針座46的第二面462上。而電容性元件48及電感性元件50係銲設於該印刷電路板44上,藉以透過該印刷電路板44設置於該針座46。實務上,印刷電路板44亦可以結合於針座46的第一面464或第三面466上。 14 is a cantilever type high frequency probe card 8 according to an eighth preferred embodiment of the present invention, which has a structure substantially the same as that of the fifth embodiment, except that the cantilever type high frequency probe card 8 further includes a printing. A circuit board 44 is bonded to the second side 462 of the hub 46. The capacitive element 48 and the inductive element 50 are soldered to the printed circuit board 44, and are disposed on the header 46 through the printed circuit board 44. In practice, the printed circuit board 44 can also be bonded to the first side 464 or the third side 466 of the hub 46.
圖15為本發明第九較佳實施例,其揭示以線路佈局的方式達成電容性元件及電感性元件的作用。詳而言 之,印刷電路板52上佈設有二第一導線54與二第二導線56,該二第一導線54彼此平行且相靠近但不接觸,該二第一導線54分別電性連接二接點58,該二接點58係供連接線(圖未示)分別電性連接至二探針(圖未示)上。各該第二導線56具有一蜿延的線段562位於其兩端之間,本實施例中該線段562係以蛇形線的方式左右蜿蜒地佈設於該印刷電路板52上。該二第二導線56之一端分別電性連接該二第一導線54,另一端電性連接至另二接點58’,該另二接點58’透過另外的連接線電性連接至檢測機100。 Figure 15 is a ninth preferred embodiment of the present invention, which discloses the function of a capacitive element and an inductive element in a line layout. In detail The printed circuit board 52 is provided with two first wires 54 and two second wires 56. The two first wires 54 are parallel to each other and are not in contact with each other. The two first wires 54 are electrically connected to the two contacts 58 respectively. The two contacts 58 are electrically connected to two probes (not shown) for connecting wires (not shown). Each of the second wires 56 has a line segment 562 extending between the two ends. In this embodiment, the line segment 562 is disposed on the printed circuit board 52 in a serpentine manner. One end of the two second wires 56 is electrically connected to the two first wires 54 respectively, and the other end is electrically connected to the other two contacts 58'. The other two contacts 58' are electrically connected to the detecting machine through another connecting wire. 100.
藉此,該檢測機100之檢測端子110輸出低頻或直流之檢測訊號時,該二第一導線54之間現斷路或是高阻抗之狀態,使得該檢測端子110輸出之低頻或直流檢測訊號將透過其中一該第二導線56而傳導至其中一該探針並輸出至該待測電子物件200,而後,由另一該探針接收並傳導待測電子物件200回傳之低頻或直流檢測訊號,並透過另一該第二導線56回流至該檢測機100。 Therefore, when the detecting terminal 110 of the detecting machine 100 outputs a low frequency or direct current detecting signal, the two first wires 54 are disconnected or in a high impedance state, so that the low frequency or direct current detecting signal outputted by the detecting terminal 110 will be Conducted by one of the second wires 56 to one of the probes and outputted to the electronic object 200 to be tested, and then received and transmitted by the other probe to transmit low frequency or DC detection signals of the electronic object 200 to be tested. And returning to the detector 100 through another second wire 56.
另外,當該待測電子物件200欲執行自我檢測之程序而輸出高頻檢測訊號時,該二第一導線54之間將呈短路或低阻抗之狀態,而該二第二導線56則呈現斷路或是高阻抗之狀態,使得高頻檢測訊號傳輸至其中一探針後,通過該二第一導線54傳導至另一探針,藉以透過較短之傳輸路徑快速地回傳至該待測電子物件200,進而達到自我檢測之目的。 In addition, when the electronic object to be tested 200 is to perform a self-testing process to output a high-frequency detection signal, the two first wires 54 will be in a short-circuit or low-impedance state, and the two second wires 56 will be in an open circuit. Or a high-impedance state, after the high-frequency detection signal is transmitted to one of the probes, and then transmitted to the other probe through the two first wires 54, so as to be quickly transmitted back to the electronic device to be tested through a short transmission path. The object 200, in turn, achieves the purpose of self-testing.
圖16為本發明第十較佳實施例,其具有大致相同於第九實施例之結構,不同的是,本實施例是採用一電容性元件60取代二條第一導線54,將該電容性元件60兩端分別與該二第二導線56之一端電性連接。如此,同樣可達到依據檢測訊號之頻率而改變訊號路徑的功效。該電容性元件60位於針座的外部 Figure 16 is a tenth preferred embodiment of the present invention, which has substantially the same structure as the ninth embodiment. The difference is that the first embodiment uses a capacitive element 60 instead of two first leads 54, and the capacitive element The two ends of the 60 are electrically connected to one ends of the two second wires 56 respectively. In this way, the effect of changing the signal path according to the frequency of detecting the signal can also be achieved. The capacitive element 60 is located outside the hub
圖17為本發明第十一較佳實施例,其具有大致相同於第九實施例之結構,不同的是,本實施例是採用二電感性元件62分別取代二條第二導線56,將該二電感性元件62之一端分別與該二第一導線54電性連接,藉此達到依據檢測訊號之頻率而改變訊號路徑的功效。該二電感性元件62位於針座的外部。 17 is an eleventh preferred embodiment of the present invention, which has substantially the same structure as the ninth embodiment. The difference is that the second inductive component 62 replaces two second wires 56, respectively. One end of the inductive component 62 is electrically connected to the two first wires 54 respectively, thereby achieving the effect of changing the signal path according to the frequency of detecting the signal. The two inductive elements 62 are located outside of the hub.
依據上述構思,第二實施例同樣可以線路佈局的方式達成電容性元件及電感性元件的作用。請參圖18所示之第十二較佳實例,其中軟性電路板62上除了佈設有訊號傳輸線路64,64’之外,更佈設有二第一導線66及二第二導線68,該二第一導線66及該二第二導線68之結構與第九實施例相同。該二第一導線66透過訊號傳輸線路64電性連接探針70的懸臂段702,各該第二導線68的一端電性連接各該第一導線66,另一端透過訊號傳輸線路64’電性連接至檢測機100。實務上,亦可同第十實施例以一電容性元件取代該二第一導線,或以二電感性元件分別取代該二第二導線。 According to the above concept, the second embodiment can also achieve the functions of the capacitive element and the inductive element in a line layout manner. Referring to the twelfth preferred embodiment shown in FIG. 18, in addition to the signal transmission lines 64, 64' disposed on the flexible circuit board 62, two first wires 66 and two second wires 68 are disposed. The structure of the first wire 66 and the two second wires 68 is the same as that of the ninth embodiment. The two first wires 66 are electrically connected to the cantilever segment 702 of the probe 70 through the signal transmission line 64. One end of each of the second wires 68 is electrically connected to each of the first wires 66, and the other end is electrically connected to the signal transmission line 64'. Connected to the detector 100. In practice, the two first wires may be replaced by a capacitive component, or the two second wires may be replaced by two inductive components, respectively.
此外,第一實施例的電容性元件亦可採二第一導線佈局的方式來取代。 In addition, the capacitive element of the first embodiment can also be replaced by a second lead layout.
據上所述,本發明將電容性元件設置針於座外部且鄰近針座之位置,可以達到有效地縮減路徑上的微量電阻與電感外、亦不會有貫孔效應的產生,進而增加檢測時的可靠度。而將電感性元件設置於鄰近電容性元件之位置,可避免高頻檢測訊號在電容性元件與電感性元件之間產生振盪,而影響訊號的誤讀。此外,以線路佈局的方式同樣可以達到相同之作用。 According to the above description, the capacitive element is disposed on the outside of the seat and adjacent to the position of the needle seat, so as to effectively reduce the micro-resistance and inductance on the path, and the occurrence of the through-hole effect, thereby increasing the detection. Time reliability. The inductive component is disposed adjacent to the capacitive component to prevent the high frequency detection signal from oscillating between the capacitive component and the inductive component, thereby affecting the misreading of the signal. In addition, the same effect can be achieved in the form of a line layout.
以上所述僅為本發明較佳可行實施例而已,舉凡應用本發明說明書及申請專利範圍所為之等效變化,理應包含在本發明之專利範圍內。 The above is only a preferred embodiment of the present invention, and equivalent changes to the scope of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.
1‧‧‧懸臂式高頻探針卡 1‧‧‧Cantilever type high frequency probe card
10‧‧‧載板 10‧‧‧ Carrier Board
10a‧‧‧上表面 10a‧‧‧ upper surface
10b‧‧‧下表面 10b‧‧‧ lower surface
10c‧‧‧穿孔 10c‧‧‧Perforation
12‧‧‧針座 12‧‧‧ needle seat
122‧‧‧第一面 122‧‧‧ first side
124‧‧‧第二面 124‧‧‧ second side
126‧‧‧第三面 126‧‧‧ third side
14‧‧‧探針 14‧‧‧ probe
142‧‧‧針尖段 142‧‧‧needle section
144‧‧‧懸臂段 144‧‧‧Cantilever section
16‧‧‧電傳輸件 16‧‧‧Electrical transmission parts
162‧‧‧訊號傳輸線路 162‧‧‧Signal transmission line
18‧‧‧電容性元件 18‧‧‧Capacitive components
Claims (20)
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TW104121724A TWI576590B (en) | 2015-07-03 | 2015-07-03 | Cantilever high frequency probe card |
CN201610516239.3A CN106324301A (en) | 2015-07-03 | 2016-07-01 | Cantilever type high-frequency probe card |
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TW104121724A TWI576590B (en) | 2015-07-03 | 2015-07-03 | Cantilever high frequency probe card |
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TWI576590B TWI576590B (en) | 2017-04-01 |
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TW104121724A TWI576590B (en) | 2015-07-03 | 2015-07-03 | Cantilever high frequency probe card |
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US4746855A (en) * | 1984-03-14 | 1988-05-24 | Teradyne, Inc. | Relay multiplexing for circuit testers |
TW583395B (en) * | 2002-03-13 | 2004-04-11 | Scs Hightech Inc | Method for producing micro probe tips |
TW200804822A (en) * | 2006-07-06 | 2008-01-16 | Microelectonics Technology Inc | High-frequency probe card and transmission line for high-frequency probe card |
SG153689A1 (en) * | 2007-12-17 | 2009-07-29 | Test Max Mfg Pte Ltd | Contactor assembly for integrated circuit testing |
TW201239365A (en) * | 2011-03-22 | 2012-10-01 | Mpi Corp | High frequency coupling signal adjustment manner and test device thereof |
CN102736007A (en) * | 2011-04-07 | 2012-10-17 | 旺矽科技股份有限公司 | Adjusting method and testing device of high-frequency coupling signals |
TWI512300B (en) * | 2013-07-15 | 2015-12-11 | Mpi Corp | Cantilever high frequency probe card |
TWI493194B (en) * | 2013-07-15 | 2015-07-21 | Mpi Corp | Probe module with feedback test function |
TWI564571B (en) * | 2014-11-14 | 2017-01-01 | Mpi Corp | Cantilever high frequency probe card |
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