TW201643992A - Substrate holding method and substrate processing apparatus - Google Patents

Abstract

A substrate holding method is to horizontally hold a substrate, and includes a positioning step of positioning a substrate by moving a substrate transfer mechanism and by allowing the peripheral edge of the substrate to come into contact with the plurality of positioning pins, a substrate grasping step of bringing the plurality of grasping pins into a closed state after completing the positioning step so that the substrate held by the plurality of positioning pins and the plurality of grasping pins, and a transfer mechanism receding step of allowing the substrate transfer mechanism to recede from above the spin base after completing the substrate grasping step.

Description

Substrate holding method and substrate processing apparatus

The present invention relates to a method of holding a substrate on a substrate holding rotating device having a spin base, and a substrate processing device including the substrate holding rotating device and the substrate conveying mechanism. The substrate to be processed includes a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a substrate for a photomask, a substrate for a disk, a substrate for a disk, a substrate for a disk, and a FED (Field). Emission Display: Various substrates such as a substrate, a ceramic substrate, and a solar cell substrate.

A substrate processing apparatus for processing a substrate such as a semiconductor wafer can be roughly classified into a batch processing apparatus that processes a plurality of substrates in batches, and a one-chip processing apparatus that processes a substrate to be processed one by one in a processing chamber. . In a general single-chip processing apparatus, one substrate is held horizontally in a processing chamber, and the substrate is rotated in accordance with the content of the processing, or a processing liquid is supplied to the substrate.

The monolithic processing apparatus is provided with a spin chuck. A plurality of chuck pins are arranged on the upper surface of the rotary base of the rotary chuck at equal intervals along the circumferential direction. Each of the clamping pins is designed to be capable of switching between the following two operating states: a closed state in contact with a peripheral portion of the substrate; And an open state that does not contact the peripheral portion of the substrate. The substrate is sandwiched in a horizontal direction by a plurality of clamping pins, whereby the substrate can be held by the rotating chuck.

The holding of the substrate to the rotating chuck is performed by the action of the clamping pin and the horizontal support pin. An example of the substrate holding operation by the rotary chuck is disclosed in Japanese Laid-Open Patent Publication No. 2014-45028. In Japanese Laid-Open Patent Publication No. 2014-45028, the rotary chuck in the substrate processing apparatus includes a disk-shaped rotary susceptor and a plurality of holding pedestals spaced apart along a circumference corresponding to the outer peripheral shape of the substrate. Disposed on a peripheral portion of the upper surface of the rotating base; and a spin motor for rotating the rotating base about a vertical axis of rotation passing through the center of the rotating base. The holding base has a horizontal support pin for supporting the substrate from the lower surface of the substrate, and a clamping pin for clamping the substrate from the side of the substrate.

However, in Japanese Laid-Open Patent Publication No. 2014-45028, in order to sandwich the substrate from the side surface of the substrate, it is necessary to support the lower portion of the substrate by the horizontal support pin. Therefore, a horizontal support pin and a mechanism for moving the horizontal support pin are required, and as a result, it is difficult to downsize the substrate processing apparatus. Further, since the lower portion of the substrate needs to be placed on the horizontal support pin before the substrate is sandwiched, it is difficult to perform the step from the time when the substrate is transported until the substrate is sandwiched from the side surface in a short time.

It is desirable to have a technique in which the substrate is held in a horizontal direction by a simple configuration without holding the horizontal support pins or the moving mechanism thereof in the substrate holding rotation mechanism (rotary chuck).

In view of the above, it is an object of the present invention to provide a substrate holding method and a substrate processing apparatus which can hold a substrate from a horizontal direction with a simple configuration while maintaining a high positioning accuracy while holding a substrate.

A first aspect of the present invention provides a substrate holding method for holding a substrate at a level, comprising: a placing step of loading a substrate on a substrate carrying mechanism; and a first preparation step of being above the rotating base a first region of the peripheral portion of the surface, a plurality of positioning pins arranged along the circumferential direction are set to a closed state; and a second preparation step of not overlapping the first region in the peripheral portion of the upper surface of the rotating base a plurality of gripping pins disposed along the circumferential direction in an open state in a second region in the circumferential direction; and a positioning step of the placing step, the first preparing step, and the second preparing step The substrate transport mechanism moves such that a peripheral portion of the substrate abuts against a plurality of the positioning pins, thereby positioning the substrate, and a substrate holding step of setting a plurality of the holding pins to a closed state after the positioning step Thereby, the plurality of the positioning pins and the plurality of the holding pins are used to hold the substrate; and the transport mechanism retreating step is performed on the substrate After the step, the substrate transfer mechanism from the upper side of the spin base is retracted.

According to this method, the step of once placing the substrate on the horizontal support pin or the like from the substrate transport mechanism can be omitted. Further, since the positioning pin is set to the closed state in advance, and the position of the positioning pin in the closed state is used as the positioning reference of the substrate to the rotating base, the positioning accuracy can be ensured. That is, in the substrate holding depending on the rotating chuck, the positioning accuracy of the substrate can be ensured while being While reducing the steps.

Further, in an embodiment of the present invention, the plurality of positioning pins are disposed in the first region within a distribution angle of 180 degrees.

In the case where the distribution angle of the positioning pin has exceeded 180 degrees, in the present invention, since the positioning pin has become closed, it is difficult to substantially abut the substrate regardless of whether the holding pin is in an open state or a closed state. Locating pin. Therefore, as in the present method, it is possible to avoid such a problem by arranging a plurality of positioning pin systems within a range of 180 degrees of the distribution angle.

Further, the plurality of positioning pins may be always kept in a closed state between the second preparation step, the positioning step, the substrate holding step, and the transport mechanism retracting step.

According to this method, when the positioning pin is configured to be opened and closed between the open state and the closed state, the step of changing the opening and closing state of the positioning pin can be omitted.

A second aspect of the present invention provides a substrate processing apparatus including a substrate holding rotating device for holding a substrate to be rotated horizontally, and a substrate carrying mechanism for transporting the substrate, and for processing the substrate, the substrate The holding rotating device includes: a rotating base rotatable about a rotating shaft; a rotation driving mechanism for rotating the rotating base; and a plurality of positioning pins on a peripheral portion of the upper surface of the rotating base The first region is disposed along the circumferential direction, and a plurality of gripping pins are disposed along the circumferential direction in a second region of the peripheral surface of the upper surface of the spin base that does not overlap the first region in the circumferential direction And a holding pin opening and closing mechanism for closing and holding a plurality of the aforementioned holding pins Switching between the activated states; and a control unit for controlling the operations of the substrate transporting mechanism, the rotational driving mechanism, and the holding pin opening and closing mechanism.

According to this configuration, the mechanism for placing the horizontal support pin or the like of the substrate once can be omitted from the configuration of the substrate holding and rotating device. Further, since the positioning pin is set to the closed state in advance, and the position of the positioning pin in the closed state is used as the positioning reference of the substrate to the rotating base, the positioning accuracy can be ensured. In other words, in the substrate holding by the spin chuck, it is possible to reduce the mechanism such as the horizontal support pin while ensuring the positioning accuracy of the substrate.

Further, in an embodiment of the present invention, the plurality of positioning pins are disposed in the first region within a distribution angle of 180 degrees.

In the case where the distribution angle of the positioning pin has exceeded 180 degrees, in the present invention, since the positioning pin has become closed, it is difficult to substantially abut the substrate regardless of whether the holding pin is in an open state or a closed state. Locating pin. Therefore, as in the present configuration, it is possible to avoid such a problem by arranging a plurality of positioning pin systems within a range of 180 degrees within the distribution angle.

A plurality of the aforementioned positioning pins can also be kept in a closed state at all times. According to this configuration, since the positioning pin can be maintained in the closed state, for example, the mechanism for switching the open state and the closed state can be omitted.

The above and other objects, features, and advantages of the invention will be apparent from the description and appended claims.

1‧‧‧Substrate processing unit

2‧‧‧Rotating chuck (substrate holding rotating device)

5‧‧‧Substrate handling mechanism

6‧‧‧Robot mechanism

10‧‧‧Processing room

11‧‧‧ chamber wall

11A‧‧‧Sports Department

15‧‧‧Processing liquid nozzle

16‧‧‧ gas nozzle

21‧‧‧Spinning base

21B‧‧‧First Area

21C‧‧‧Second area

22‧‧‧Rotary motor (rotary drive mechanism)

50A, 50B, 50C‧‧‧ positioning pins

51A, 51B, 51C‧‧‧ positioning pin base

52‧‧‧ Joint Department

52A, 52B, 52C‧‧‧ Guidance Department

53‧‧‧Mask

53A, 53B, 53C‧‧‧ Abutment

54A, 54B, 54C‧‧‧ Locating Pin Drive Mechanism

60A, 60B, 60C‧‧‧

61A, 61B, 61C‧‧‧ handle pin base

62A, 62B, 62C‧‧‧ guidance

63A, 63B, 63C‧‧‧ abutment

66‧‧‧Up and down drive mechanism

67‧‧‧ Joint Department

68‧‧‧Mechanical arm

70‧‧‧Control Department (Control Unit)

80‧‧‧Memory Department

91‧‧‧First chuck opening and closing unit

92‧‧‧Second chuck opening and closing unit (holding pin opening and closing mechanism)

101‧‧‧Substrate processing unit

102‧‧‧Rotary chuck

111‧‧‧ chamber wall

111A‧‧ ‧ door

115‧‧‧Processing liquid nozzle

116‧‧‧ gas nozzle

121‧‧‧Spinning base

121A‧‧‧ upper board

130‧‧‧clamping pin

131‧‧‧Base section

132‧‧‧ Guidance Department

133‧‧‧Apartment

140‧‧‧ horizontal support pin

141‧‧‧ horizontal support pin drive mechanism

L1‧‧‧ axis of rotation

W‧‧‧Substrate

Fig. 1 is a schematic view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.

2A is a plan view of a spin chuck in the substrate processing apparatus.

2B is a plan view of the spin chuck in the substrate processing apparatus.

Fig. 3A is a block diagram for explaining an electrical configuration of a main part of a substrate processing apparatus.

3B is a flow chart showing the flow of the substrate carry-in/out operation performed in the substrate processing apparatus.

4A is a schematic view of a substrate processing apparatus for explaining step S1 of the foregoing flowchart.

4B is a schematic view for explaining the substrate processing apparatus of the step S2 of the aforementioned flowchart.

4C is a schematic view for explaining the substrate processing apparatus of the step S3 of the aforementioned flowchart.

4D is a schematic view for explaining the substrate processing apparatus of the step S4 of the aforementioned flowchart.

4E is a schematic view for explaining the substrate processing apparatus of the step S5 of the aforementioned flowchart.

4F is a schematic view for explaining the substrate processing apparatus of the step S6 of the aforementioned flowchart.

4G is a schematic view for explaining the substrate processing apparatus of the step S7 of the aforementioned flowchart.

4H is a schematic view for explaining the substrate processing apparatus of step S8 of the aforementioned flowchart.

4I is a schematic view for explaining the substrate processing apparatus of the step S9 of the aforementioned flowchart.

4J is a schematic view for explaining the substrate processing apparatus of the step S10 of the aforementioned flowchart.

Fig. 5 is a schematic perspective view for explaining a configuration of a substrate transport mechanism.

Fig. 6 is a schematic side view of a substrate processing apparatus of another embodiment.

Fig. 1 is a schematic view showing a schematic configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 includes a processing chamber 10 surrounded by a chamber wall 11 . The processing chamber 10 is provided with a rotary chuck (substrate holding rotating device) 2. A shutter portion 11A capable of opening and closing the opening is provided on a side surface of the chamber wall 11. The robot mechanism 6 of the substrate transport mechanism 5 shown in FIG. 5 can be moved forward and backward through the opening.

The substrate processing apparatus 1 is provided with a processing liquid nozzle 15 and/or a gas nozzle 16 . The processing liquid nozzle 15 or the gas nozzle 16 is normally retracted to the retracted position except for the substrate processing, and can be moved to a predetermined position above the substrate W by a moving mechanism (not shown) during substrate processing.

The rotary chuck 2 includes a disk-shaped rotary base 21 and a rotary motor (rotary drive mechanism) 22 that rotates the rotary base 21. The rotary motor 22 is disposed below the spin base 21 . In the peripheral portion of the upper surface of the spin base 21, a plurality of positioning pin base portions 51A, 51B, and 51C are disposed at substantially equal intervals in the circumferential direction. The plurality of positioning pin base portions 51A, 51B, and 51C are disposed in a first region 21B composed of a range of about 120 degrees (a predetermined angle within 180 degrees) of the peripheral portion of the upper surface of the spin base 21 (refer to FIG. 2A). ). That is, the positioning pin base portions 51A, 51B, and 51C are separated from each other. Configured at 60 degree intervals. That is, the distribution angle of the plurality of positioning pin base portions 51A, 51B, 51C (hereinafter referred to as the positioning pins 50A, 50B, 50C) is about 120 degrees (a specified angle within 180 degrees).

Locating pins 50A, 50B, and 50C that are radially movable (or rotatable) with respect to the positioning pin base portions 51A, 51B, and 51C are provided on the upper portions of the positioning pin base portions 51A, 51B, and 51C, respectively. . The first chuck opening and closing unit 91 is connected to each of the positioning pins 50A, 50B, and 50C. As the power source of the first chuck opening and closing unit 91, various types of power sources using an electric motor or an electromagnet can be applied. By the first chuck opening and closing unit 91, the positioning pins 50A, 50B, and 50C can move between a contact position that is in contact with the peripheral edge portion of the substrate W and an open position that is farther from the rotation axis L1 than the contact position. The state in which the positioning pins 50A, 50B, 50C are in the contact position is referred to as the closed position of the positioning pins 50A, 50B, 50C; the state in which the positioning pins 50A, 50B, 50C are in the open position is referred to as the opening of the positioning pins 50A, 50B, 50C. position.

A plurality of grip pin base portions 61A, 61B, and 61C are disposed at substantially equal intervals along the circumferential direction on the peripheral portion of the upper surface of the spin base 21. The plurality of gripping pin base portions 61A, 61B, and 61C are disposed in a second region 21C composed of a range of about 120 degrees (a predetermined angle within 180 degrees) of the peripheral edge portion of the upper surface of the spin base 21 (refer to the figure). 2A). The second region 21C is on the peripheral edge portion of the upper surface of the spin base 21, and does not overlap the first region 21B in the circumferential direction.

That is, the grip pin base portions 61A, 61B, and 61C are arranged at intervals of about 60 degrees. That is, a plurality of holding pin base portions 61A, 61B, The distribution angle of the 61C (the holding pins 60A, 60B, and 60C described below) is about 120 degrees (a specified angle within 180 degrees).

The upper portion of each of the grip pin base portions 61A, 61B, and 61C is provided with a grip pin 60A that is movable (or rotatable) in the radial direction with respect to the grip pin base portions 61A, 61B, and 61C, 60B, 60C. A second chuck opening/closing unit (holding pin opening and closing mechanism) 92 is connected to each of the grip pins 60A, 60B, and 60C. As the power source of the second chuck opening and closing unit 92, various types of power sources using an electric motor or an electromagnet can be applied. By the second chuck opening and closing unit 92, the holding pins 60A, 60B, and 60C can move between a contact position that is in contact with the peripheral edge portion of the substrate W and an open position that is farther from the rotation axis L1 than the contact position. In the present embodiment, the open positions of the grip pins 60A, 60B, and 60C and the open positions of the positioning pins 50A, 50B, and 50C are located on the circumference centering on the rotation axis L1. The state in which the holding pins 60A, 60B, and 60C are in the contact position is referred to as the closed position of the holding pins 60A, 60B, and 60C, and the state in which the holding pins 60A, 60B, and 60C are in the open position is referred to as the holding pins 60A and 60B. , 60C open position.

In addition, in FIG. 1, in order to make it easy to understand a figure, the positioning pin base part, the positioning pin, the holding pin base part, and the holding pin are not shown in all, but only the positioning pin is shown. 50B and a positioning pin base portion 51B corresponding to the positioning pin 50B, a holding pin 60B, and a holding pin base portion 61B corresponding to the holding pin 60B. The same description is omitted in FIGS. 4A to 4J which will be described later.

Each of the positioning pins 50A, 50B, and 50C has an abutting portion 53A, 53B and 53C are formed in a columnar shape so as to be in contact with the peripheral edge portion (peripheral end surface) of the substrate W, and have an arc shape in plan view; and guide portions 52A, 52B, and 52C facing the abutting portion The lower part of 53A, 53B, 53C extends obliquely. In the present embodiment, the positioning pins 50A, 50B, and 50C are set to the rotating base 21 so as to always be in a closed state regardless of the processing state of the substrate W.

Each of the grip pins 60A, 60B, 60C basically has the same shape as the positioning pins 50A, 50B, 50C. In other words, each of the holding pins 60A, 60B, and 60C has the abutting portions 63A, 63B, and 63C in the same manner as the positioning pins 50A, 60B, and 60C, and is in contact with the peripheral edge portion (peripheral end surface) of the substrate W. It is formed in a columnar shape and has an arc shape in plan view, and guide portions 62A, 62B, and 62C that extend obliquely toward the lower portion of the abutting portion. The grip pins 60A, 60B, and 60C are radially opposed to the upper surface of the spin base 21 by the pin drive mechanisms 64 on the grip pin base portions 61A, 61B, and 61C of the grip pins 60A, 60B, and 60C. Move horizontally. In the open state, the upper surface of the rotating base 21 is horizontally moved (or rotated) toward the outer peripheral side, and in the closed state, horizontally moved (or rotated) with respect to the upper surface of the rotating base 21 toward the slightly outer peripheral side. .

2A and 2B are plan views of the spin chuck 2 in the substrate processing apparatus 1 according to the embodiment of the present invention. In Fig. 2A, all of the plurality of positioning pins 50A, 50B, and 50C are in a closed state, and all of the plurality of holding pins 60A, 60B, and 60C are in an open state. 2B shows that all of the plurality of positioning pins 50A, 50B, 50C are in a closed state, and all of the plurality of holding pins 60A, 60B, 60C are also closed. The state of the state. As described above, the rotary chuck 2 according to the embodiment of the present invention has two types of pins of the positioning pins 50A, 50B, and 50C and the total of the holding pins 60A, 60B, and 60C, and in the steps of the present embodiment, only The grip pins 60A, 60B, 60C are displaced to the position of the open state and the position of the closed state.

3A is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus 1.

The substrate processing apparatus 1 includes a control unit (control unit) 70 for controlling the operation of the substrate processing apparatus 1. The control unit 70 is configured using, for example, a microcomputer. The control unit 70 includes an arithmetic unit such as a CPU (central processing unit), a memory unit 80 such as a fixed memory device and a hard disk drive device, and an input/output unit. The program executed by the arithmetic unit is stored in the memory unit.

The control unit 70 controls the operations of the rotary motor 22, the first chuck opening/closing unit 91, the second chuck opening/closing unit 92, the substrate transport mechanism 5, and the like in accordance with a predetermined program.

3B is a flowchart showing a procedure of the substrate processing apparatus 1 according to the embodiment of the present invention after the substrate W is carried into the processing chamber 10 until it is carried out. Hereinafter, the description of the steps of the embodiment of the present invention will be made with reference to Figs. 1 to 3B.

First, each step (S1 to S6) until the substrate W is carried into the processing chamber 10 to a state in which various processes in the processing chamber can be performed will be described.

[Step S1]

4A is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S1.

The device configuration of the substrate transport mechanism 5 is shown in FIG. The substrate transport mechanism 5 includes a mechanical arm portion 68 that is freely bendable in the horizontal direction with the joint portion 67 as an axis, and a robot mechanism 6 that is coupled to the mechanical arm portion 68 and that carries the substrate W on the upper portion thereof; The vertical drive mechanism 66 is configured to vertically connect the joint portion 52, the mechanical arm portion 53, and the robot mechanism 6 in the vertical direction. The control unit 70 (see FIG. 3A) controls the substrate transport mechanism 5 to move the robot mechanism 6 in the vertical direction (ie, the vertical direction). The position of the robot mechanism 6 in these movements is determined by using a dummy wafer or the like in advance, and is determined by a so-called teaching (teaching), and is a series of processing step parameters of the substrate processing apparatus 1. It is stored in the memory unit 80 (see FIG. 3A).

The control unit 70 (see FIG. 3A) transmits an instruction regarding the position of the appropriately appropriate robot mechanism 6 from the storage unit 80 to the substrate transport mechanism 5 in accordance with the respective steps. In step S1, the substrate transport mechanism 5 receives the substrate W from a loader/unloader portion (not shown) outside the processing chamber 10, and mounts the substrate W on the upper portion of the robot mechanism 6 (the substrate carries Set the step). In this state, it moves toward the upper side of the rotary chuck 2, and in a plan view, the robot mechanism 6 is placed closer to the holding pin 60B than the center portion of the rotary chuck 2 at the center of the mounted substrate W. stop.

[Step S2]

4B is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S2. In step S2, the holding pin 60A, All of 60B and 60C are turned on. In the substrate processing apparatus 1, when the substrate W has not been processed before, it is possible to investigate whether or not the holding pins 60A, 60B, 60C are located at the spin base 21 by opening and closing the sensor (not shown). To the outer peripheral side. Then, when the grip pins 60A, 60B, and 60C are located on the inner peripheral side in the radial direction of the spin base 21 (that is, when the grip pins 60A, 60B, and 60C are in the closed state), the control unit 70 controls the first The second chuck opening and closing unit 92 sets the holding pins 60A, 60B, and 60C to an open state (second preparation step). When the previous substrate W in the substrate processing apparatus 1 has been processed, the previous substrate W that has been processed is carried out until the next substrate W is carried in, because the holding pins 60A, 60B, 60C are held. Since the ON state set when the previous substrate W is carried out is maintained, it is not necessary to reset to the ON state.

[Step S3]

4C is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S3. In step S3, the control unit 70 controls the first chuck opening and closing unit 91 so that the positions of the positioning pins 50A, 50B, and 50C are in a closed state (first preparation step). The position of the positioning pins 50A, 50B, and 50C in the closed state with respect to the rotating base 21 is set to be the center position of the substrate W when the substrate W is held by the holding pins 60A, 60B, 60C in the step S6 described later. It intersects the axis of rotation of the rotating base 21. In the substrate processing example, the positions of the positioning pins 50A, 50B, and 50C with respect to the spin base 21 are not displaced until the moment when the substrate W is carried out. Further, in the substrate processing example, since it is not necessary to displace the positioning pins 50A, 50B, and 50C to the spin base 21, the positioning pins may be formed. The device having the drive mechanisms 54A, 54B, and 54C omitted is configured. Further, in the substrate processing example, since the positions of the positioning pins 50A, 50B, and 50C have been closed at the stage of step S1, the positions of the positioning pins 50A, 50B, and 50C have not changed from step S1 to step S2.

[Step S4]

4D is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S4. In step S4, the substrate W is brought into contact with the positioning pins 50A, 50B, 50C. More specifically, the control unit 70 controls the substrate transport mechanism 5 to lower the robot mechanism 6, thereby bringing the peripheral edge portion (peripheral end surface) of the substrate W placed on the robot mechanism 6 into contact with the positioning pin 50A, Guide portions 52A, 52B, and 52C of 50B and 50C and guide portions 62A, 62B, and 62C for holding pins. Thereby, the peripheral edge portion (peripheral end surface) of the substrate W can be positioned (positioning step).

[Step S5]

4E is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S5. In step S5, all of the grip pins 60A, 60B, and 60C are moved from the open state to the closed state. In other words, all of the grip pins 60A, 60B, and 60C are moved by a predetermined distance toward the radial direction of the center of the spin base 21. By this movement, the peripheral portion of the substrate W can be inclined along the guiding portions 52A, 52B, 52C of the positioning pins 50A, 50B, 50C and the guiding portions 62A, 62B, 62C of the holding pins 60A, 60B, 60C. Face movement. This movement continues until the substrate W collides with the abutting portions 53A, 53B, 53C of the positioning pins 50A, 50B, 50C and the abutting portions 63A, 63B, 63C of the holding pins 60A, 60B, 60C. Result, in rotation The chuck 2 has a form in which the substrate W is sandwiched by the positioning pins 50A, 50B, and 50C and the holding pins 60A, 60B, and 60C.

Here, the position where the positioning pins 50A, 50B, 50C are in the closed state on the spin base 21 is adjusted for the purpose of accurately positioning the substrate W on the spin base 21. In other words, in a state where the peripheral surface (peripheral end surface) of the substrate W is in contact with the abutting portions 53A, 53B, and 53C of the positioning pins 50A, 50B, and 50C, the center of the substrate W coincides with the center of the spin base 21. The way to adjust. Since the positioning pins 50A, 50B, and 50C have such a purpose, it is preferable that the relative position on the rotary base 21 does not fluctuate in the closed state. In other words, the positioning pins 50A, 50B, and 50C are on the spin base 21 in the closed state, and the "void" of the so-called position is preferably the lesser.

On the other hand, the holding pins 60A, 60B, and 60C can have a "space" at a plurality of positions by a spring mechanism or the like in a relative position opposed to the rotating base 21 in the closed state. At the time point when the step S5 is completed, it is preferable that the abutting portions 63A, 63B, and 63C of the holding pins 60A, 60B, and 60C convey the peripheral edge portion (peripheral end portion) of the substrate W toward the rotary chuck. The specified tightening force in the radial direction of the center of 2. In other words, the positions of the holding pins 60A, 60B, and 60C in the closed state are set to be slightly closer to the center of the rotating base 21 than the positioning pins 50A, 50B, and 50C, and are carried out from the holding pins 60A, 60B, and 60C. In terms of the task, it is preferable that the holding pins 60A, 60B, and 60C have a plurality of gaps that can move in the radial direction of the rotating base 21 even in the closed state.

[Step S6]

4F is a view for explaining the rotary chuck 2 and the substrate W in the step S6. A side view of the relationship of the rotating collet 2. In step S6, the control unit 70 controls the substrate transport mechanism 5 to retract the robot mechanism 6 from the lower surface of the substrate W (transport mechanism retracting step). When the robot mechanism 6 is retracted from the lower surface of the substrate W, the substrate W is held by the positioning pins 50A, 50B, 50C and the holding pins 60A, 60B, 60C above the rotating base 21. . Thereafter, the entire substrate transport mechanism 5 including the robot mechanism 6 is retracted from the processing chamber 10 through the shutter portion 11A on the chamber wall 11.

[Step S7]

4G is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S7. In step S7, the control unit 70 performs various substrate processing of the substrate W in accordance with a recipe read from the storage unit 80. Examples of the substrate treatment herein include etching, washing, drying, and the like of the substrate W. In the substrate processing, the control unit 70 discharges the designated processing liquid from the processing liquid nozzle 15 based on the recipe program, discharges the designated processing gas from the gas nozzle 16, and causes the substrate to be rotated by the specified number of rotations determined by the recipe program. Rotate.

Next, after the processing of the substrate W is completed, the steps (S8 to S11) until the substrate W is delivered to the robot mechanism 6 of the substrate conveyance mechanism 5 and carried out from the processing chamber 10 will be described.

[Step S8]

4H is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S8. In step S8, the control unit 70 controls the substrate transport mechanism 5 so that the robot without the substrate W is placed thereon. The mechanism 6 enters the processing chamber 10 through the door portion 11A on the chamber wall 11.

Next, the control unit 70 controls the substrate transport mechanism 5 to move the robot mechanism 6 to the lower surface of the substrate W sandwiched by the positioning pins 50A, 50B, and 50C and the holding pins 60A, 60B, and 60C, and the spin base. The designated position between the upper surfaces of the seats 21 causes the robot mechanism 6 to rise to a position where the upper surface of the robot mechanism 6 is almost in contact with the lower surface of the substrate W.

[Step S9]

4I is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S9.

In step S9, all of the holding pins 60A, 60B, and 60C are turned on. Thereby, the substrate W is oriented toward the guide portions 62A, 62B, 62C of the grip pins 60A, 60B, 60C and the guide portions 52A, 52B, 52C of the positioning pins 50A, 50B, 50C by their own weight. Move below. As a result, the lower surface of the substrate W is in contact with the upper surface of the robot mechanism 6. As a result, the lower surface of the substrate W is in a state of being supported by the upper surface of the robot mechanism 6. Thereby, the substrate W can be delivered to the robot mechanism 6.

[Step S10]

4J is a side view of the rotary chuck 2 for explaining the relationship between the rotary chuck 2 and the substrate W in the step S10.

In step S10, the control unit 70 controls the substrate transport mechanism 5 to move the robot mechanism 6 in the vertical direction with respect to the spin chuck 2. Thereby, the contact with the positioning pins 50A, 50B, and 50C and the holding pins 60A, 60B, and 60C is cut, and the state in which the bottom is supported by the robot mechanism 6 can be realized. After the lower surface of the robot mechanism 6 becomes higher than the positioning pins 50A, 50B, 50C and the holding pins 60A, 60B, 60C, the robot mechanism 6 is retracted from above the spin base 21 by horizontal movement. open. Thereafter, the robot mechanism 6 delivers the mounted substrate W to a loading/unloading unit (not shown).

Although the description of the embodiments of the present invention is as described above, the present invention may be further embodied in another form.

For example, in the above-described embodiment, the positioning pins 50A, 50B, and 50C and the holding pins 60A, 60B, and 60C are configured to be in a closed state or an open state by the radial movement of the spin base 21. However, as a configuration for realizing the closed state or the open state, it is also possible to switch the positioning pins 50A, 50B, and 50C and the holding pins 60A, 60B, and 60C to the vertical direction and the vertical direction. The state in which the opening and closing state is switched in a state of being vertically inclined, or the positioning pins 50A, 50B, and 50C and the holding pins 60A, 60B, and 60C are rotated to change the abutting state with the substrate W, thereby switching the opening and closing state. Form and so on.

Fig. 6 is a schematic side view of a substrate processing apparatus 101 of another embodiment. The substrate processing apparatus 101 includes a processing space surrounded by the chamber wall 111, and the chamber wall 111 is provided with a shutter portion 111A for moving and retracting a robot mechanism (not shown) of a substrate transport mechanism (not shown). In the processing space, a rotary chuck 102, a processing liquid nozzle 115 for supplying a processing liquid, a gas nozzle 116 for supplying a gas, and the like are housed. The spin base 121 has a disk-shaped upper plate 121A. A plurality of clamp pins 130 are disposed at substantially equal angular intervals in the peripheral portion of the upper plate 121A. Respective pin 130 The base portion 131 is fixed to the upper plate 121A of the rotating base 121; the guiding portion 132 is connected above the base portion 131 and extends along the vertical oblique direction of the clamping pin 130; a connecting portion 133 connected to the guiding portion 132 and forming a vertical; and a clamping pin driving mechanism not shown for moving the guiding portion 132 and the abutting portion 133 relative to the base portion 131 The pin 130 is switched to an open state and a closed state. A plurality of horizontal support pins 140 are disposed on the inner peripheral side of the upper plate 121A at substantially equal angular intervals. These horizontal support pins 140 can be vertically moved up and down with respect to the upper plate 121A by the horizontal support pin drive mechanism 141.

Although the embodiments of the present invention have been described in detail, these are merely intended to be illustrative of specific embodiments of the invention, and the invention should not be construed as It is only limited by the scope of the appended patent application.

This application is in accordance with the special wishes 2015-066241 submitted to the Japan Patent Office on March 27, 2015 and the special offer 2016-11694 submitted to the Japan Patent Office on January 25, 2016, respectively. All content is incorporated herein by reference.

2‧‧‧Rotating chuck (substrate holding rotating device)

21‧‧‧Spinning base

50A, 50B, 50C‧‧‧ positioning pins

53A, 53B, 53C‧‧‧ Abutment

60A, 60B, 60C‧‧‧

63A, 63B, 63C‧‧‧ abutment

L1‧‧‧ axis of rotation

W‧‧‧Substrate

Claims (6)

A substrate holding method for holding a substrate at a level, comprising: a placing step of loading a substrate on a substrate carrying mechanism; and a first preparation step of first at a peripheral portion of the upper surface of the rotating base a region in which a plurality of positioning pins arranged along the circumferential direction are set to be in a closed state; and a second preparation step in which the second peripheral portion of the upper surface of the rotating base does not overlap the first region in the circumferential direction a region in which a plurality of gripping pins arranged along the circumferential direction are in an open state; and a positioning step of moving the substrate transporting mechanism after the placing step, the first preparing step, and the second preparing step Positioning the substrate by abutting a peripheral portion of the substrate against the plurality of positioning pins, and a substrate holding step of setting a plurality of the holding pins to a closed state after the positioning step, thereby using a plurality of The positioning pin and the plurality of the holding pins hold the substrate; and the transporting mechanism retracting step, after the substrate holding step, the front Substrate transfer mechanism from the upper side of the spin base is retracted. The substrate holding method according to claim 1, wherein the plurality of the positioning pins are disposed in the first region within an angle of 180 degrees. The substrate holding method according to claim 1 or 2, wherein the plurality of the positioning pins are always kept in a closed state between the second preparation step, the positioning step, the substrate holding step, and the transport mechanism retracting step. A substrate processing apparatus includes a substrate holding rotating device for holding a substrate to be rotated horizontally, and a substrate carrying mechanism for transporting the substrate, and for processing the substrate; the substrate holding rotating device includes: a rotating base Rotating drive mechanism for rotating the rotating base; a plurality of positioning pins on the first region of the peripheral surface of the upper surface of the rotating base, along the circumferential direction And a plurality of holding pins disposed in a circumferential direction of a second region of the peripheral surface of the upper surface of the rotating base that does not overlap the first region in the circumferential direction; and a pin opening and closing mechanism for holding The plurality of the holding pins are switched between a closed state and an open state, and the control unit is configured to control the operations of the substrate transporting mechanism, the rotation driving mechanism, and the holding pin opening and closing mechanism. The substrate processing apparatus according to claim 4, wherein the plurality of the positioning pins are disposed in the first region within a distribution angle of 180 degrees. The substrate processing apparatus according to claim 4, wherein the plurality of the positioning pin systems are always kept in a closed state.