TW201643981A - Wafer probing device - Google Patents

Abstract

A wafer probing device is provided. The wafer probing device includes a base, a probe platen, an extension arm, a platen lifting rod, and a stopper. The base includes a top surface and a lateral surface. A bump is disposed at the lateral surface, and the probe platen is disposed on the base and is capable of lifting and descending between a first position, a second position and a third position. The extension arm is pivoted to the lateral surface and connects to the probe platen. The platen lifting rod is pivoted to the extension arm and controlling the lifting and descending of the probe platen by rotating the extension arm. The stopper is disposed at where the platen lifting rod being pivoted to the extension arm and is capable of rotating between a receiving position and a stop position. When the probe platen is located at the third position and the stopper is located at the stop position, the stopper props one end of the bump so as to prevent the probe platen from moving to the second position or the first position.

Description

Wafer needle measuring device

The present invention relates to a wafer needle measuring device.

The invention of the integrated circuit not only accelerates the growth of technology in various industries, but also greatly improves the lives of human beings. The integrated circuit is usually formed on the surface of the wafer through lithography process technology. However, since each integrated circuit is quite precise, even hundreds of yellow light procedures are required, and any one of the links in the middle is only slightly biased. Let the entire integrated circuit become a defective product. In order to be able to screen out defective products before shipment, the integrated circuit is usually tested at a specific process level with a wafer needle tester to verify that its function is in line with expectations, thereby controlling the yield of the integrated circuit.

A conventional wafer probe device for single wafer testing generally includes a wafer stage, a probe platform, and a handle for controlling the lift of the probe platform. During the test, the wafer to be tested is placed on the wafer stage, and then the operator controls the probe platform through the handle so that the tip of the probe on the probe platform can be outputted with the signal of the integrated circuit on the wafer to be tested. The pads (I/O pad) are in contact. Then, the test signal is supplied to the integrated circuit, and the test result generated by the integrated circuit is sent back to the test machine for analysis.

However, the handle of the conventional wafer needle measuring device used to control the probe platform is often placed very close to the operator. If the operator accidentally hits the handle, it may cause the probe platform to drop instantaneously, which may result in The probe or integrated circuit is damaged.

In view of the above, the present invention provides a wafer needle measuring device comprising a base body, a probe platform, an extension arm, a platform lifting control lever and a blocking piece; the base body comprises an upper surface and a side surface The side surface is provided with a bump; the probe platform is disposed on the base body and can be raised and lowered relative to the upper surface of the base body at a first position, a second position and a third position, and the third position is higher than the second position Position, the second position is higher than the first position; the extension arm is pivotally connected to the side surface of the base body and connected to the probe platform; the platform lifting control rod is pivotally connected to the extension arm, and the lifting and lowering arm is used to control the lifting and lowering of the probe platform The blocking piece is disposed at a pivotal connection between the platform lifting control rod and the extending arm, and is rotatable between a receiving position and a stopping position; wherein when the probe platform is in the third position and the blocking piece is in the stopping position, the blocking piece is blocked One end of the sheet abutting projection prevents the probe platform from moving to the second position or the first position.

One of the concepts of the present invention is that the wafer needle measuring device further includes a wafer holder disposed on the body and located between the probe platform and the upper surface of the body.

One of the concepts of the present invention is that the extension arm has a first end and a second end. The extension arm is pivotally connected to the side surface of the base body at a first end, and the platform lift control lever is pivotally connected to the second end of the extension arm.

One of the concepts of the present invention is that when the probe platform is in the first position, the length direction of the extension arm is perpendicular to the length direction of the bump, and the platform lifting control rod is parallel to the length direction of the bump.

One of the concepts of the present invention is that the flap is received in the second end of the extension arm when the flap is in the stowed position.

One of the concepts of the present invention is that the extending arm is pivotally connected to the side surface of the base body along a first axis direction, and the platform lifting control rod is pivotally connected to the second end of the extending arm in a second axial direction.

One of the concepts of the present invention is that the first axial direction is perpendicular to the second axial direction.

One of the concepts of the present invention is that in the first axial direction, the sum of the width of the second end of the extension arm and the thickness of the projection is less than the width of the first end of the extension arm.

One of the concepts of the present invention is that a groove is disposed between the two ends of the bump, and when the probe platform is in the second position, the shutter is rotatable to the stop position to be engaged with the groove.

One of the concepts of the present invention is that the extension arm is provided with at least one indicator light, and the indicator lamp displays different lamps according to the position of the flap in the storage position or the stop position.

In summary, the wafer needle measuring device of the present invention has a special safety design. When the probe platform is located at a specific position, the bump is abutted against the bump on the seat body, and even if the platform lifting control lever is received External force impact will not cause the platform lift lever or extension arm to rotate, ensuring that the position of the probe platform is changed as expected. Therefore, the present invention can effectively solve the problem that the operator of the wafer needle measuring device collides with the wafer to be tested due to not colliding with the platform lifting control rod when installing or replacing the wafer to be tested, thereby causing the wafer to be tested or The problem of damage to the probe.

The drawings referred to in the following embodiments are illustrated with a card type coordinate, including an X-axis direction, a Y-axis direction, and a Z-axis direction, which are merely used as a reference for describing the relative relationship of components, and are not intended to be used to refer to the present invention. Azimuth restrictions.

Please refer to FIG. 1 to FIG. 4 , which are respectively a perspective view, a partial enlarged view (1), a probe platform lifting diagram and a partial enlarged view (2) of the first embodiment of the present invention, and a wafer needle measuring device 1 is disclosed. It mainly includes a base 11, a probe platform 12, an extension arm 13, a platform lifting control lever 14, a blocking piece 15, and a wafer holder 16, which are described in detail below.

The base 11 is a plate body having a considerable weight and stably placed on a table, and has an upper surface 11a and a side surface 11b, and the side surface 11b is provided with a projection 112. Wherein the upper surface 11a is parallel to the X-Y plane of the reference coordinate in the drawing, and the side surface 11b is parallel to the Y-Z plane of the reference coordinate.

As shown in FIG. 3, the probe platform 12 is disposed on the base 11 and is movable relative to the upper surface 11a of the base 11, that is, along the Z axis, to a first position L1, a second position L2, and a first Between the three positions L3, wherein the third position L3 is higher than the second position L2, and the second position L2 is higher than the first position L1.

As shown in FIGS. 1 and 2, the extension arm 13 is pivotally connected to the side surface 11b of the base 11 and is coupled to the probe platform 12 via a gear transmission mechanism (not shown), so that the extension arm 13 is in the YZ plane. When it is turned up, it will drive the rise or fall of the probe platform 12. The platform lifting control lever 14 is pivotally connected to the extension arm 13. When the operator applies force to the platform lifting control lever 14, the extension arm 13 is driven to rotate, thereby achieving the purpose of controlling the lifting and lowering of the probe platform 12. In the present embodiment, in the X-axis direction, the sum of the width of the second end 13b of the extension arm 13 and the thickness of the projection 112 is smaller than the width of the first end 13a of the extension arm 13, so that the extension arm 13 is rotating. There is no interference from the bumps 112 during the process.

As shown in FIG. 4, the blocking piece 15 is disposed at a pivotal connection between the platform lifting control lever 14 and the extension arm 13, and is rotatable relative to the pivotal position between a receiving position and a stopping position. In Fig. 4, the flap is in the stop position, and in Fig. 2, the flap 15 is in the stowed position. In the present embodiment, the flap 15 can be rotated to the stop position only when the probe platform 12 is at the third position L3, and when the probe platform 12 is not at the third position L3, since the bump 112 is in the block position. The flap 15 is in the path of rotation so that the flap 15 is subject to interference by the projection 112 and cannot be rotated to the stop position. In this embodiment, the platform lift lever 14 is pivoted relative to the extension arm 13 to drive the flap 15 to rotate between a storage position and a stop position.

As shown in FIG. 1 , the probe platform 12 of the present embodiment can move up and down relative to the upper surface 11 a of the base 11 along the Z axis. The wafer mount 16 is disposed on the base 11 and located on the probe platform 12 and Between the upper surface 11a of the seat body 11. The center of the probe platform 12 has an opening 121 facing the wafer holder 16, so that the probe 122 fixed to the probe platform 12 can be fixed to the wafer holder 16 via the opening 121. The wafer 161 (eg, signal I/O formed on the surface of the wafer) is subjected to needle testing. In other embodiments of the present embodiment, the diameter of the opening 121 of the probe platform 12 may be 6 吋, 8 吋, 12 吋 or more depending on the size of the wafer 161 to be tested.

In this embodiment, in addition to being movable along the Z-axis direction, the probe platform 12 can be further moved in the X-axis direction or the Y-axis direction by adding a gear mechanism and a slide rail mechanism, thereby improving the operator's operation. The degree of freedom of the wafer needle measuring device 1. Similarly, the present embodiment also moves the wafer holder 16 in the X-axis direction, the Y-axis direction, or the Z-axis direction through the gear mechanism and the slide mechanism.

As shown in FIGS. 1 and 2, the extension arm 13 has a first end 13a and a second end 13b. The extension arm 13 is pivotally connected to the first end 13a in a first axial direction (for example, an X-axis direction). The side surface 11b of the seat body 11 and the first end 13a of the extension arm 13 are wider in the X-axis direction than the second end 13b of the extension arm 13. As shown in FIGS. 1 and 2, the platform lifting control lever 14 is pivotally connected to the second end 13b of the extension arm 13 in a second axial direction (for example, the Y-axis direction), when the operator moves the platform lifting lever At 1400, the platform lifting control lever 14 drives the extension arm 13 to rotate in the YZ plane with respect to the X-axis direction, thereby controlling the lifting and lowering of the probe platform 12. In this embodiment, the first axis direction and the second axis direction are respectively two coordinate axes of the card type coordinate, and thus are perpendicular to each other, but in other embodiments, the first axis direction and the second axis direction may also be They are two axial directions that are sharply angled or obtuse to each other.

Referring to FIG. 3, since the probe platform 12 can be raised and lowered according to the position of the platform lifting control lever 14 in the Z-axis direction between the first position L1, the second position L2 and the third position L3, the platform lifting control lever 14 also corresponds to the first position L1, the second position L2 and the third position L3 of the probe platform 12, and has a first gear position G1, a second gear position G2 and a third gear position G3. That is, when the platform lifting control lever 14 is located at the first gear position G1, the probe platform 12 is located at the first position L1, and when the platform lifting control lever 14 is located at the second gear position G2, the probe platform 12 is located at the second position L2, and the platform is lifted and lowered. When the lever 14 is in the third gear position G3, the probe platform 12 is in the third position L3. When the platform lift lever 14 is located in one of the gear positions, the pivoting of the extension arm 13 and the seat body 11 provides a resistance that provides an operator's operational feel in gear shifting.

In the present embodiment, the second position L2 is 300 micrometers higher than the first position L1, and the third position L3 is 3000 micrometers higher than the first position L1, but the invention is not limited thereto. According to different wafer pinning devices, the third position L3 and the second position L2 may have other different heights than the first position L1. When the operator wants to perform the needle test, the wafer 161 to be tested is first fixed on the wafer holder 16. At this time, the operator needs to first turn the platform lifting control lever 14 to the third gear position G3 to allow the probe platform 12 to be Raising to the third position L3, the distance between the large probe platform 12 and the wafer holder 16 is increased to facilitate the operator to perform wafer placement and fixing operations. After the wafer 161 to be tested is fixed, the operator can move the platform lifting control lever 14 to the second gear position G2 to lower the probe platform 12 to the second position L2, and the tip of the probe 122 will be relatively close to the needle tip. The signal output of the wafer 161 is input to the pad (for example, the distance is slightly less than 300 microns). The operator can fine tune the horizontal position of the probe platform 12 or the wafer holder 16 at a close distance to ensure that the tip of the probe 122 is aligned with the signal output of the wafer 161 to be tested. After the operator completes the alignment of the tip of the probe 122 with the signal output pad of the wafer 161 to be tested, the platform lifting lever 14 can be lowered to the first gear G1, and the probe platform 12 is lowered to The first position L1 causes the tip of the probe 122 to be slightly inserted into the surface of the signal output pad of the wafer 161 to be tested, and then the test signal is supplied to the wafer to be tested 161 and then the feedback from the wafer 161 to be tested is received. The signal is used to perform a needle test of each die on the wafer 161 to be tested one by one. After the test is completed, the operator can set the platform lifting control lever 14 to the third gear position G3, and the probe platform 12 is raised back to the third position L3, and the tested wafer 161 to be tested can be removed and the next piece can be installed. The wafer to be tested 161.

In the above, when the operator 甫 installs the wafer 161 to be tested or prepares to remove the wafer 161 to be tested that has been tested, the platform lifting control lever 14 is then dialed to the third gear G3, the probe The platform 12 will be raised to the highest third position L3. If the operator accidentally collides with the platform lifting control lever 14 during the process, the probe platform 12 may instantaneously descend to the first position L1, causing the tip of the probe 122 to strike the wafer 161 to be tested, resulting in the wafer 161 to be tested. Or the damage of the probe 122 may even cause injury to the operator.

With this embodiment, the operator can turn the flap 15 to the stop position when the probe platform 12 is at the third position L3, so that the flap 15 abuts against one end of the projection 112, as shown in FIG. In this way, the platform lifting control lever 14 does not rotate even if it is impacted, which can effectively prevent the operator from accidentally touching the platform lifting control lever 14 during the wafer mounting operation or the wafer replacement operation, so that the probe platform 12 is instantaneously lowered. The occurrence of the wafer 161 or the probe 122 to be tested is damaged, and even the operator is injured. After the wafer mounting operation or the wafer replacement operation is completed, the operator can rotate the shutter 15 to the storage position to release the platform lifting control lever 14.

In the present embodiment, when the probe platform 12 is in the first position, as shown in FIG. 1 or FIG. 2, the length direction of the extension arm 13 is exactly perpendicular to the length direction of the projection 112, and the platform lifting control lever 14 is just Parallel to the length direction of the bump 112. Further, when the flap 15 is in the storage position, the flap 15 is received in the second end 13b of the extension arm 13.

Referring to FIG. 5, a partial enlarged view of a second embodiment of the present invention is shown. The main difference between the present embodiment and the first embodiment is that the positions at which the blocking piece 15 and the protruding block 112 abut each other are different. In the first embodiment, as shown in FIG. 4, when the platform lifting control lever 14 is located at the third gear position G3, the blocking piece 15 is abutted on the one end of the bump 112 closer to the operator, as shown in the figure. The card coordinates are defined to correspond to the end of the bump 112 pointing in the positive Y-axis direction. However, in the second embodiment, as shown in FIG. 5, when the platform lifting control lever 14 is located at the third gear position G3, the blocking piece 15 abuts against the projection 112 away from one end of the operator. The card coordinate in the middle is defined to correspond to the end of the bump 112 pointing in the negative Y-axis direction.

Please refer to FIG. 6 , which is a partial enlarged view of a third embodiment of the present invention. The main difference between this embodiment and the first embodiment is that a recess 112G is disposed between the two ends of the bump 112 . As described above, when the probe platform 12 is in the second position, the tip of the probe 122 is relatively close to the surface of the wafer 161 to be tested, and if the operator or other personnel inadvertently collide with the platform lifting lever 14, it may also lead to exploration. The needle platform 12 instantaneously drops to cause the wafer 161 to be tested or the probe 122 to be damaged. In the present embodiment, when the probe platform 12 is located at the second position L2, that is, when the platform lifting control lever 14 is located at the second gear position G2, the groove 112G is located on the rotation path of the flap 15, so that the flap 15 is rotated to In the stop position, the flap 15 will be screwed into the recess 112G to engage the recess 112G. In this way, the platform lifting control lever 14 does not suddenly drop from the second gear position G2 to the first gear position G1 even if it is subjected to a collision, thereby effectively preventing the operator from performing the signal output of the probe tip of the probe 122 and the wafer 161 to be tested. When the pad is placed in the position, the platform lifting control lever 14 is not accidentally touched, so that the probe platform 12 is instantaneously lowered to cause the wafer 161 or the probe 122 to be damaged to be damaged.

In the above embodiments, the extension arm 13 can be further provided with a display lamp 13c as shown in FIG. 4, and the display lamp 13c can display different lamp numbers according to the blocking piece 15 at the storage position or the stop position, so that the wafer needle is The operator of the measuring device 1 or the person next to it can judge whether the platform lifting control lever 14 is in the safe locking state based on the display lamp 13c. In addition to this, the display lamp 13c may display different lamp numbers depending on whether the shutter 15 abuts the bump 112 in the positive Y-axis direction or the negative Y-axis direction.

In the above embodiments, the wafer needle measuring device 1 can further be provided with the observation module 17 as shown in FIG. 1 , which has the effect of magnifying the image, and the operator can observe the tip of the probe 122 through the observation module 17 . The signal from the wafer 161 to be tested is output to the pad so that the tip of the probe 122 appropriately contacts the signal output pad of the wafer 161 to be tested.

In summary, the wafer needle measuring device according to the present invention restricts the movement of the platform lifting and lowering control lever by the stopper abutting projection, thereby effectively preventing the operator of the wafer needle measuring device from being When the wafer to be tested is installed or replaced, the probe and the wafer to be tested collide with each other due to inadvertent collision with the platform lifting lever, resulting in damage to the wafer to be tested, resulting in an increase in test cost, or avoiding the wafer needle measuring device. The operator is injured by a probe collision.

The present invention has been disclosed in the above embodiments, and it is not intended to limit the present invention. Any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended patent application.

1‧‧‧ wafer needle measuring device
11‧‧‧
11a‧‧‧ upper surface
11b‧‧‧ side surface
112‧‧‧Bumps
112G‧‧‧ Groove
12‧‧‧Probe platform
121‧‧‧ openings
122‧‧‧Probe
13‧‧‧Extension arm
13a‧‧‧ first end
13b‧‧‧second end
13c‧‧‧ display lights
14‧‧‧ platform lift control lever
15‧‧ ‧Flap
16‧‧‧ Wafer mount
161‧‧‧ wafer under test
17‧‧‧Observation module
L1‧‧‧ first position
L2‧‧‧ second position
L3‧‧‧ third position
G1‧‧‧ first gear
G2‧‧‧ second gear
G3‧‧‧ third gear

[Fig. 1] is a perspective view showing a first embodiment of the present invention. Fig. 2 is a partial enlarged view (1) of the first embodiment of the present invention. [Fig. 3] Fig. 3 is a schematic view showing the lifting of the probe platform according to the first embodiment of the present invention. [Fig. 4] is a partially enlarged view (2) of the first embodiment of the present invention. Fig. 5 is a partially enlarged view showing a second embodiment of the present invention. Fig. 6 is a partially enlarged view showing a third embodiment of the present invention.

1‧‧‧ wafer needle measuring device

11‧‧‧

11a‧‧‧ upper surface

11b‧‧‧ side surface

112‧‧‧Bumps

12‧‧‧Probe platform

121‧‧‧ openings

122‧‧‧Probe

13‧‧‧Extension arm

14‧‧‧ platform lift control lever

16‧‧‧ Wafer mount

161‧‧‧ wafer under test

17‧‧‧Observation module

Claims (11)

A wafer needle measuring device comprising: a body comprising an upper surface and a side surface, the side surface is provided with a bump; a probe platform disposed on the base body and movable up and down relative to the upper surface a position, a second position and a third position, the third position being higher than the second position, the second position being higher than the first position; an extension arm pivotally connected to the side of the seat a surface of the probe platform; a platform lifting control lever pivotally connected to the extension arm, the rotation of the extension arm controls the lifting and lowering of the probe platform; and a blocking piece disposed on the platform lifting control rod The pivoting portion of the extending arm is rotatable between a receiving position and a stopping position; wherein the blocking piece abuts when the probe platform is in the third position and the blocking piece is in the stopping position One end of the bump prevents the probe platform from moving to the second position or the first position. The wafer pinning device of claim 1, further comprising a wafer holder disposed on the body between the probe platform and the upper surface. The wafer testing device of claim 2, wherein the extending arm has a first end and a second end, the extending arm is pivotally connected to the side surface of the base body, and the platform is raised and lowered. The control rod is pivotally connected to the second end of the extension arm. The wafer needle measuring device of claim 3, wherein when the probe platform is in the first position, the length direction of the extending arm is perpendicular to the length direction of the bump, and the platform lifting control rod is parallel to the convex The length direction of the block. The wafer pinning device of claim 3, wherein the baffle is received in the second end of the extension arm when the baffle is in the stowed position. The wafer needle measuring device of claim 3, wherein the extending arm is pivotally connected to the side surface of the seat body along a first axis direction, and the platform lifting control lever is along a second axis The direction is pivotally connected to the second end of the extension arm. The wafer pinning device of claim 6, wherein the sum of the width of the second end and the thickness of the bump is less than the width of the first end in the direction of the first axis. The wafer transduction device of claim 6, wherein the first axis direction is perpendicular to the second axis direction. The wafer needle measuring device of claim 2, wherein a groove is disposed between the two ends of the bump, and when the probe platform is in the second position, the shutter is rotatable to the stop position. The groove is engaged. The wafer needle measuring device according to any one of claims 1 to 9, wherein the extension arm is provided with at least one indicator light, and the at least one indicator light is displayed differently according to whether the shutter is located at the storage position or the stop position. The light. The wafer needle measuring device of claim 1, wherein the length direction of the bump is defined as a Y-axis direction, and the shutter abuts one end of the bump to point to the positive Y-axis direction or the negative Y-axis end. .