TW201632836A - Magnetic sensor and motor - Google Patents
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Abstract
Description
本發明係關於一種具有磁阻效應元件之磁性感測器。並且,本發明關於一種具有該磁性感測器之馬達。 The present invention relates to a magnetic sensor having a magnetoresistance effect element. Moreover, the present invention relates to a motor having the magnetic sensor.
目前公知有帶有編碼器之馬達(例如,參照專利文獻1)。於專利文獻1記載之馬達中,編碼器具有:感測磁鐵,其固定於旋轉軸之軸端;磁性感測器,其與感測磁鐵相向配置;感測器基板,其供裝配磁性感測器;以及基板保持架,其固定感測器基板。基板保持架係固定於馬達殼體。磁性感測器具有磁阻效應元件。並且,先前,作為磁性感測器,公知有具有磁阻效應元件及形成有磁阻效應元件之元件基板的磁性感測器(例如,參照專利文獻2)。 A motor with an encoder is known (for example, refer to Patent Document 1). In the motor described in Patent Document 1, the encoder includes: a sensing magnet fixed to a shaft end of the rotating shaft; a magnetic sensor disposed opposite to the sensing magnet; and a sensor substrate for mounting magnetic sensing And a substrate holder that fixes the sensor substrate. The substrate holder is fixed to the motor housing. The magnetic sensor has a magnetoresistance effect element. In addition, a magnetic sensor having a magnetoresistance effect element and an element substrate on which a magnetoresistance effect element is formed is known as a magnetic sensor (see, for example, Patent Document 2).
專利文獻1:日本專利特開2012-168016號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2012-168016
專利文獻2:國際公開第2014/155886號 Patent Document 2: International Publication No. 2014/155886
於專利文獻1記載之馬達中,若自旋轉軸之軸向觀察時感測磁鐵之中心與磁阻效應元件之磁感應區域之中心的偏移量大,則編碼器之檢測精度會降低。因此,較佳為,在該馬達中,自旋轉軸之軸向觀察時感測磁鐵之中心與磁阻效應元件之磁感應區域之中心的偏移量小。 In the motor described in Patent Document 1, when the distance between the center of the sensing magnet and the center of the magnetic induction region of the magnetoresistance effect element is large when viewed from the axial direction of the rotating shaft, the detection accuracy of the encoder is lowered. Therefore, in the motor, it is preferable that the amount of shift of the center of the sensing magnet and the center of the magnetic induction region of the magnetoresistance effect element is small when viewed from the axial direction of the rotating shaft.
因此,本發明之課題在於提供一種具有磁阻效應元件之磁性感測器,於該磁性感測器被應用在感測磁鐵被固定於旋轉軸之軸端之馬達之情形時,能夠降低自旋轉軸之軸向觀察時感測磁鐵之中心與磁阻效應元件之磁感應區域之中心的偏移量。並且,本發明之課題在於提供一種具有該磁性感測器之馬達。 Accordingly, an object of the present invention is to provide a magnetic sensor having a magnetoresistance effect element which can be used to reduce spin when a magnet is sensed to be fixed to a motor of a shaft end of a rotating shaft. The axial displacement of the rotating shaft senses the offset of the center of the magnet from the center of the magnetic sensing region of the magnetoresistance effect element. Further, an object of the present invention is to provide a motor having the magnetic sensor.
為了解決上述課題,本發明之磁性感測器具有磁阻效應元件,上述磁性感測器之特徵在於,其具有:元件基板,其形成有磁阻效應元件;箱狀的封裝體本體,其容納元件基板;以及透明的密封部件,其將形成於封裝體本體之開口部封閉從而對元件基板進行密封;於元件基板形成有位置對準用標記,該標記係用於使磁阻效應元件相對於安裝有磁性感測器之安裝部件進行位置對準。 In order to solve the above problems, the magnetic sensor of the present invention has a magnetoresistive effect element, and the magnetic sensor is characterized in that it has an element substrate formed with a magnetoresistance effect element, and a box-shaped package body that accommodates a component substrate; and a transparent sealing member that seals an opening formed in the body of the package to seal the element substrate; and a mark for alignment is formed on the element substrate, the mark is used to mount the magnetoresistance effect element relative to the device The mounting parts of the magnetic sensor are aligned.
本發明之磁性感測器中,於形成有磁阻效應元件之元件基板形成有位置對準用標記,該標記係用於使磁阻效應元件相對於安裝有磁性感測器之安裝部件進行位置對準。並且,本發明中,對元件基板進行密封之密封部件為透明的。因此,本發明中,於將磁性感測器安裝於安裝部件時,能夠一邊確認位置對準用標記,一邊使磁阻效應元件相對於安裝部件進行位置對準。因此,本發明中,能夠精確地將磁阻效應元件安裝於安裝部件。其結果是,本發明中,於磁性感測器被應用在感測磁鐵固定於旋轉軸之軸端之馬達之情形時,若精確地將安裝部件安裝於旋轉軸,則能夠降低自旋轉軸之軸向觀察時感測磁鐵之中心與磁阻效應元件之磁感應區域之中心的偏移量。 In the magnetic sensor of the present invention, the element substrate on which the magnetoresistance effect element is formed is formed with a mark for alignment, which is used to position the magnetoresistance effect element relative to the mounting member on which the magnetic sensor is mounted. quasi. Further, in the present invention, the sealing member that seals the element substrate is transparent. Therefore, in the present invention, when the magnetic sensor is attached to the mounting member, the magnetoresistance effect element can be aligned with respect to the mounting member while confirming the alignment mark. Therefore, in the present invention, it is possible to accurately mount the magnetoresistance effect element to the mounting member. As a result, in the present invention, when the magnetic sensor is applied to a motor in which the sensing magnet is fixed to the shaft end of the rotating shaft, if the mounting member is accurately attached to the rotating shaft, the self-rotating shaft can be lowered. The offset of the center of the sensing magnet from the center of the magnetic sensing region of the magnetoresistance effect element when viewed axially.
本發明中,較佳為,密封部件為以將封裝體本體之開口部封閉的方式固定於封裝體本體的透明的玻璃製蓋。若如此構成,則與密封部件為以將開口部封閉的方式填充至封裝體本體的樹脂之情形相比,能夠抑制磁阻效應元件之檢測精度降低。亦即,磁阻效應元件之檢測 精度會因作用於磁阻效應元件的應力的影響、濕度的影響而降低,但於密封部件為填充至封裝體本體的樹脂之情形時,有可能存在磁阻效應元件之檢測精度因該樹脂受作用於磁阻效應元件的應力的影響、樹脂吸收濕氣的影響而降低的問題。針對於此,若密封部件為以封閉開口部的方式固定於封裝體本體的的透明的玻璃製蓋,則不會產生此種問題。因此,能夠抑制磁阻效應元件之檢測精度降低。並且,若密封部件為以封閉開口部的方式固定於封裝體本體的透明的玻璃製蓋,例如於藉由接著將蓋固定於封裝體本體時,能夠確認蓋是否切實地接著並固定於封裝體本體。因此,能夠藉由蓋切實地對元件基板進行密封。 In the present invention, it is preferable that the sealing member is a transparent glass cover that is fixed to the package body so as to close the opening of the package body. According to this configuration, it is possible to suppress a decrease in the detection accuracy of the magnetoresistance effect element as compared with a case where the sealing member fills the resin of the package body so as to close the opening. That is, the detection of the magnetoresistance effect element The accuracy is lowered by the influence of the stress acting on the magnetoresistance effect element and the influence of the humidity. However, when the sealing member is filled with the resin of the package body, there is a possibility that the detection accuracy of the magnetoresistance effect element is affected by the resin. The effect of the stress acting on the magnetoresistance effect element and the effect of the resin absorbing moisture. On the other hand, if the sealing member is a transparent glass cover that is fixed to the package body so as to close the opening, such a problem does not occur. Therefore, it is possible to suppress a decrease in the detection accuracy of the magnetoresistance effect element. Further, when the sealing member is a transparent glass cover that is fixed to the package body so as to close the opening, for example, when the cover is fixed to the package body, it is possible to confirm whether or not the cover is securely attached and fixed to the package. Ontology. Therefore, the element substrate can be reliably sealed by the cover.
本發明中,較佳為,自元件基板之厚度方向觀察時,標記形成於通過磁阻效應元件之磁感應區域之中心的第一假想線上的兩個部位及通過磁感應區域之中心的與第一假想線不同的第二假想線上的兩個部位的合計四個部位。若如此構成,則能夠根據形成於四個部位之標記來檢測磁感區域之中心。並且,若如此構成,則與在磁感應區域之中心的一個部位形成標記之情形相比,能夠將標記形成於元件基板上之容易形成標記的部位。因此,能夠容易地將標記形成於元件基板。並且,若如此構成,則還能夠於將磁性感測器安裝於安裝部件時,調整磁性感測器的以自元件基板之厚度方向觀察時之磁感應區域之中心為中心的旋轉方向。 In the present invention, it is preferable that the mark is formed at two portions on the first imaginary line passing through the center of the magnetic induction region of the magnetoresistance effect element and the first imaginary passing through the center of the magnetic induction region when viewed from the thickness direction of the element substrate The total of the two parts of the second imaginary line different in the line is four parts. According to this configuration, the center of the magnetic induction region can be detected based on the marks formed on the four portions. Further, according to this configuration, the mark can be formed on the element substrate at a position where the mark is easily formed, compared with the case where the mark is formed at one portion of the center of the magnetic induction region. Therefore, the mark can be easily formed on the element substrate. Further, in this configuration, when the magnetic sensor is attached to the mounting member, the direction of rotation of the magnetic sensor centered on the center of the magnetic sensing region when viewed from the thickness direction of the element substrate can be adjusted.
本發明中,自元件基板之厚度方向觀察時,標記亦可形成於磁阻效應元件之磁感應區域之中心。於此情形時,能夠將標記之形成部位設定在最小限度。 In the present invention, the mark may be formed at the center of the magnetic induction region of the magnetoresistance effect element when viewed from the thickness direction of the element substrate. In this case, the formation portion of the mark can be set to a minimum.
本發明之磁性感測器能夠應用於馬達,該馬達具有:轉子,其具有旋轉軸;定子;馬達殼體,其容納定子;感測磁鐵,其固定於旋轉軸之軸端;感測器基板,其裝配有磁性感測器;以及作為安裝部件 之基板保持架,其供固定感測器基板並固定於馬達殼體。於此情形時,磁性感測器以旋轉軸之軸向與元件基板之厚度方向一致的方式與感測磁鐵相向配置。該馬達中,於將裝配有磁性感測器之感測器基板安裝於基板保持架時,能夠一邊確認位置對準用標記,一邊使磁阻效應元件相對於基板保持架進行位置對準。因此,能夠精確地將磁阻效應元件安裝於基板保持架。其結果是,藉由將基板保持架精確地安裝於馬達殼體,能夠降低自旋轉軸之軸向觀察時感測磁鐵之中心與磁阻效應元件之磁感應膜之中心的偏移量。 The magnetic sensor of the present invention can be applied to a motor having: a rotor having a rotating shaft; a stator; a motor housing accommodating the stator; a sensing magnet fixed to the shaft end of the rotating shaft; and a sensor substrate , equipped with a magnetic sensor; and as a mounting component A substrate holder for fixing the sensor substrate and being fixed to the motor housing. In this case, the magnetic sensor is disposed to face the sensing magnet such that the axial direction of the rotating shaft coincides with the thickness direction of the element substrate. In the motor, when the sensor substrate on which the magnetic sensor is mounted is mounted on the substrate holder, the magnetoresistive element can be aligned with respect to the substrate holder while checking the alignment mark. Therefore, it is possible to accurately mount the magnetoresistance effect element to the substrate holder. As a result, by accurately attaching the substrate holder to the motor casing, it is possible to reduce the amount of shift of the center of the sensing magnet and the center of the magnetic induction film of the magnetoresistance effect element when viewed from the axial direction of the rotating shaft.
本發明中,較佳為,自軸向觀察時,於基板保持架的旋轉軸之徑向上之外周側,形成有成為基板保持架於徑向上相對於馬達殼體之定位基準的圓形的基準面或複數個圓弧狀的基準面,自軸向觀察時,基準面之曲率中心與磁感應區域之中心一致。若如此構成,則能夠於旋轉軸之徑向上將磁阻效應元件精確地安裝於馬達殼體。因此,能夠有效地降低自旋轉軸之軸向觀察時感測磁鐵之中心與磁阻效應元件之磁感應區域之中心的偏移量。 In the present invention, it is preferable that a circular reference which is a positioning reference of the substrate holder in the radial direction with respect to the motor case is formed on the outer peripheral side in the radial direction of the rotation axis of the substrate holder when viewed in the axial direction. The plane or a plurality of arc-shaped reference planes, the center of curvature of the reference plane coincides with the center of the magnetic induction region when viewed from the axial direction. According to this configuration, the magnetoresistance effect element can be accurately mounted to the motor casing in the radial direction of the rotating shaft. Therefore, it is possible to effectively reduce the amount of shift of the center of the sensing magnet and the center of the magnetic sensing region of the magnetoresistive effect element when viewed from the axial direction of the rotating shaft.
在本發明中,較佳為,於基板保持架形成有在軸向上朝向感測器基板突出之複數個銷,於感測器基板形成有供銷貫穿插入的貫通孔,於銷之外周面與貫通孔之內周面之間形成有用於調整磁阻效應元件相對於基板保持架之位置的間隙。若如此構成,則於將裝配有磁性感測器之狀態的感測器基板安裝於基板保持架時,能夠於銷已貫穿插入至貫通孔中之狀態下調整感測器基板相對於基板保持架之安裝位置。因此,於一邊調整感測器基板相對於基板保持架之安裝位置,一邊將感測器基板安裝於基板保持架時,感測器基板相對於基板保持架不會產生較大偏移。其結果是,能夠容易地實施向基板保持架安裝感測器基板之安裝操作。 In the present invention, it is preferable that a plurality of pins projecting toward the sensor substrate in the axial direction are formed in the substrate holder, and a through hole through which the pin is inserted is formed in the sensor substrate, and the peripheral surface of the pin is penetrated A gap for adjusting the position of the magnetoresistance effect element relative to the substrate holder is formed between the inner peripheral surfaces of the holes. According to this configuration, when the sensor substrate in which the magnetic sensor is mounted is mounted on the substrate holder, the sensor substrate can be adjusted relative to the substrate holder while the pin has been inserted into the through hole. The installation location. Therefore, when the sensor substrate is mounted on the substrate holder while the mounting position of the sensor substrate with respect to the substrate holder is adjusted, the sensor substrate does not have a large offset with respect to the substrate holder. As a result, the mounting operation of mounting the sensor substrate to the substrate holder can be easily performed.
在本發明中,較佳為,銷以銷之前端側自感器基板之一個面突 出之方式貫穿插入至貫通孔中,且以遍佈自感測器基板突出之銷之前端側與感測器基板之一個面的方式塗敷接著劑。若如此構成,由於能夠一邊確認塗敷之接著劑一邊實施接著操作,故而,例如與使接著劑流入至感測器基板的另一面與基板保持架之間之情形相比,能夠容易實施接著操作。並且,若如此構成,則能夠在一邊確認位置對準用標記,一邊對磁阻效應元件相對於基板保持架進行位置對準之後,藉由接著劑來暫時固定感測器基板與基板保持架。 In the present invention, it is preferable that the pin protrudes from the front side of the pin to the side of the sensor substrate. The method is inserted through the through hole, and the adhesive is applied in such a manner that the front end side of the pin protruding from the sensor substrate and one surface of the sensor substrate are applied. According to this configuration, since the subsequent operation can be performed while confirming the application of the adhesive, for example, it is possible to easily perform the subsequent operation as compared with the case where the adhesive flows into the other surface of the sensor substrate and the substrate holder. . Further, according to this configuration, the sensor substrate and the substrate holder can be temporarily fixed by the adhesive after the alignment of the magnetoresistance effect element with respect to the substrate holder while checking the alignment mark.
如上所述,在本發明之磁性感測器中,於應用在感測磁鐵被固定於旋轉軸之軸端之馬達之情形時,能夠降低自旋轉軸之軸向觀察時的感測磁鐵之中心與磁阻效應元件的磁感膜之中心的偏移量。並且,在本發明之馬達中,能夠降低自旋轉軸之軸向觀察時感測磁鐵之中心與磁阻效應元件的磁感膜之中心的偏移量。 As described above, in the magnetic sensor of the present invention, when the sensing magnet is fixed to the motor of the shaft end of the rotating shaft, the center of the sensing magnet when viewed from the axial direction of the rotating shaft can be reduced. The offset from the center of the magneto-sensitive film of the magnetoresistance effect element. Further, in the motor of the present invention, it is possible to reduce the amount of shift between the center of the sensing magnet and the center of the magnetic resonance film of the magnetoresistance effect element when viewed from the axial direction of the rotating shaft.
1‧‧‧馬達 1‧‧‧Motor
2‧‧‧旋轉軸 2‧‧‧Rotary axis
3‧‧‧馬達殼體 3‧‧‧Motor housing
4‧‧‧檢測機構 4‧‧‧Testing agency
6‧‧‧殼本體 6‧‧‧Shell body
7、8‧‧‧罩部件 7, 8‧‧ ‧ cover parts
8a‧‧‧貫通孔 8a‧‧‧through hole
8b‧‧‧基準面 8b‧‧‧ datum
10‧‧‧感測磁鐵 10‧‧‧Sensor magnet
10a‧‧‧磁鐵片 10a‧‧‧Magnetic piece
11‧‧‧磁性感測器 11‧‧‧Magnetic sensor
12‧‧‧殼體 12‧‧‧ housing
13‧‧‧感測器基板 13‧‧‧Sensor substrate
13a‧‧‧狹縫 13a‧‧‧slit
13b‧‧‧貫通孔 13b‧‧‧through hole
13c‧‧‧缺口部 13c‧‧‧Gap section
14‧‧‧基板保持架(安裝部件) 14‧‧‧Substrate holder (mounting parts)
14a‧‧‧筒部 14a‧‧‧ Tube
14b‧‧‧突出部 14b‧‧‧Protruding
14c、14d‧‧‧凸部 14c, 14d‧‧‧ convex
14e‧‧‧銷 14e‧‧ sales
14f‧‧‧階差面 14f‧‧ ‧ step surface
14g‧‧‧貫通孔 14g‧‧‧through hole
14h‧‧‧外周面(基準面) 14h‧‧‧outer surface (reference surface)
15‧‧‧連接器 15‧‧‧Connector
18、20‧‧‧螺釘 18, 20‧‧‧ screws
19‧‧‧接著劑 19‧‧‧Adhesive
23‧‧‧MR元件(磁阻效應元件) 23‧‧‧MR components (magnetoresistive effect elements)
24‧‧‧元件基板 24‧‧‧ element substrate
25‧‧‧封裝體本體 25‧‧‧Package body
26‧‧‧玻璃蓋(密封部件、蓋) 26‧‧‧ glass cover (sealing parts, cover)
29‧‧‧溫度監測用電阻膜 29‧‧‧Resistance film for temperature monitoring
30‧‧‧加熱用電阻膜 30‧‧‧Resistance film for heating
31、32‧‧‧A相(SIN)磁感應膜 31, 32‧‧‧A phase (SIN) magnetic induction film
33、34‧‧‧B相(COS)磁感應膜 33, 34‧‧‧B phase (COS) magnetic induction film
36‧‧‧磁感應區域 36‧‧‧Magnetic sensing area
-A、+A、-B、+B‧‧‧輸出端子 -A, +A, -B, +B‧‧‧ output terminals
C1‧‧‧外周面之曲率中心(基準面之曲率中心) C1‧‧‧Center of curvature of the outer perimeter (center of curvature of the reference plane)
C2‧‧‧磁感應區域之中心 C2‧‧‧The center of the magnetic sensing area
GNDA、GNDB‧‧‧接地端子 GNDA, GNDB‧‧‧ Ground Terminal
L1、L11‧‧‧第一假想線 L1, L11‧‧‧ first imaginary line
L2、L12‧‧‧第二假想線 L2, L12‧‧‧ second imaginary line
M1、M11‧‧‧標記 M1, M11‧‧‧ mark
VccA、VccB、VccH、VccS‧‧‧電源端子 VccA, VccB, VccH, VccS‧‧‧ power terminals
圖1(A)為本發明之實施形態之馬達的立體圖,圖1(B)為自圖1(A)所示之馬達取下殼體後之狀態的立體圖。 Fig. 1(A) is a perspective view of a motor according to an embodiment of the present invention, and Fig. 1(B) is a perspective view showing a state in which the casing is removed from the motor shown in Fig. 1(A).
圖2為圖1所示之罩部件的立體圖。 Figure 2 is a perspective view of the cover member shown in Figure 1.
圖3為固定於圖1(B)所示之旋轉軸之輸出相反側端的感測磁鐵以及磁性感測器的立體圖。 Fig. 3 is a perspective view of a sensing magnet and a magnetic sensor fixed to the opposite side end of the output shaft of the rotating shaft shown in Fig. 1(B).
圖4為圖1所示之檢測機構之立體圖。 4 is a perspective view of the detecting mechanism shown in FIG. 1.
圖5為圖4所示之檢測機構之分解立體圖。 Fig. 5 is an exploded perspective view of the detecting mechanism shown in Fig. 4.
圖6為自輸出側示出圖1所示之磁性感測器以及感測器基板的平面圖。 Fig. 6 is a plan view showing the magnetic sensor and the sensor substrate shown in Fig. 1 from the output side.
圖7為自輸出側示出圖1所示之基板保持架的平面圖。 Fig. 7 is a plan view showing the substrate holder shown in Fig. 1 from the output side.
圖8為圖4所示之感測器基板與銷的接著部位的剖視圖。 Figure 8 is a cross-sectional view of the sensor substrate and the subsequent portion of the pin shown in Figure 4.
圖9為自輸出側示出圖3所示之磁性感測器的立體圖。 Fig. 9 is a perspective view showing the magnetic sensor shown in Fig. 3 from the output side.
圖10為被容納於圖9所示之封裝體本體的元件基板的平面圖。 Fig. 10 is a plan view showing an element substrate housed in the package body shown in Fig. 9.
圖11為用於說明將圖5所示之感測器基板安裝於基板保持架時的安裝方法的圖。 Fig. 11 is a view for explaining a mounting method when the sensor substrate shown in Fig. 5 is mounted on a substrate holder.
以下,參照附圖對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
(馬達之整體構成) (The overall composition of the motor)
圖1(A)為本發明之實施形態之馬達1的立體圖,圖1(B)為自圖1(A)所示之馬達1取下殼體12後之狀態的立體圖。圖2為圖1所示之罩部件8的立體圖。圖3為固定於圖1(B)所示之旋轉軸2之輸出相反側端的感測磁鐵10以及磁性感測器11的立體圖。 Fig. 1(A) is a perspective view of a motor 1 according to an embodiment of the present invention, and Fig. 1(B) is a perspective view showing a state in which the casing 12 is removed from the motor 1 shown in Fig. 1(A). Fig. 2 is a perspective view of the cover member 8 shown in Fig. 1. 3 is a perspective view of the sensing magnet 10 and the magnetic sensor 11 fixed to the opposite side end of the output shaft 2 of the rotating shaft 2 shown in FIG. 1(B).
本實施形態之馬達1為內轉子型馬達。該馬達1具有:定子(省略圖示),其形成為大致圓筒狀;轉子,其具有旋轉軸2且配置於定子之內周側;以及馬達殼體3,其容納定子。定子或轉子中之一者具有驅動用磁鐵(省略圖示),定子或轉子中之另一者具有驅動用線圈(省略圖示)。在本實施形態中,轉子具有驅動用磁鐵,定子具有驅動用線圈。並且,馬達1具有用於檢測轉子之旋轉位置的檢測機構4。 The motor 1 of the present embodiment is an inner rotor type motor. The motor 1 includes a stator (not shown) formed in a substantially cylindrical shape, a rotor having a rotating shaft 2 and disposed on an inner peripheral side of the stator, and a motor housing 3 accommodating the stator. One of the stator or the rotor has a driving magnet (not shown), and the other of the stator or the rotor has a driving coil (not shown). In the present embodiment, the rotor has a driving magnet, and the stator has a driving coil. Further, the motor 1 has a detecting mechanism 4 for detecting the rotational position of the rotor.
於以下之說明中,以旋轉軸2之徑向(即,轉子之徑向)為“徑向”,以旋轉軸2之圓周方向(即,轉子之圓周方向)為“圓周方向”,以旋轉軸2之軸向(即,轉子之軸向)為“軸向”。並且,以軸向上的旋轉軸2之輸出側(圖1等之Z1方向側)為“前”側,以軸向上的旋轉軸2之輸出相反側(圖1等之Z2方向側)為“後”側。 In the following description, the radial direction of the rotating shaft 2 (ie, the radial direction of the rotor) is "radial direction", and the circumferential direction of the rotating shaft 2 (ie, the circumferential direction of the rotor) is "circumferential direction" to rotate The axial direction of the shaft 2 (i.e., the axial direction of the rotor) is "axial". Further, the output side of the rotating shaft 2 in the axial direction (the Z1 direction side in Fig. 1 and the like) is the "front" side, and the opposite side of the output of the rotating shaft 2 in the axial direction (the side in the Z2 direction of Fig. 1 and the like) is "after "side.
如圖1所示,馬達殼體3具有:筒狀的殼本體6,其構成馬達殼體3之側面;罩部件7,其固定於殼本體6之前端;以及罩部件8,其固定於殼本體6之後端。如圖2所示,於徑向上的罩部件8之中心形成有於軸向上貫通的貫通孔8a。貫通孔8a形成為帶階差之圓孔狀。貫通孔8a之後端側部分之內周面成為基準面8b,該基準面8b係用於於徑向上對 構成檢測機構4之後述的基板保持架14進行定位。基準面8b形成為圓筒面狀。亦即,自軸向上觀察時基準面8b之形狀形成為圓形。於貫通孔8a之前端側部分安裝有可旋轉地支承旋轉軸2的軸承(省略圖示),自軸向上觀察時,基準面8b之中心與旋轉軸2之中心一致。另外,於圖1中,省略貫通孔8a之圖示。 As shown in Fig. 1, the motor housing 3 has a cylindrical casing body 6 constituting a side surface of the motor casing 3, a cover member 7 fixed to the front end of the casing body 6, and a cover member 8 fixed to the casing. The rear end of the body 6. As shown in Fig. 2, a through hole 8a penetrating in the axial direction is formed at the center of the cover member 8 in the radial direction. The through hole 8a is formed in a circular hole shape with a step. The inner peripheral surface of the end side portion after the through hole 8a serves as a reference surface 8b for the radial direction The substrate holder 14 which will be described later, which constitutes the detecting means 4, is positioned. The reference surface 8b is formed in a cylindrical shape. That is, the shape of the reference surface 8b is formed in a circular shape when viewed in the axial direction. A bearing (not shown) that rotatably supports the rotating shaft 2 is attached to the end side portion of the through hole 8a, and the center of the reference surface 8b coincides with the center of the rotating shaft 2 when viewed in the axial direction. In addition, in FIG. 1, the illustration of the through-hole 8a is abbreviate|omitted.
檢測機構4為磁式旋轉編碼器,如圖3所示,檢測機構4具有:感測磁鐵10;以及磁性感測器11,其與感測磁鐵10相向配置。該檢測機構4配置於較之轉子以及定子更靠後側之位置。檢測機構4如圖1(A)所示,被固定於罩部件8之殼體12覆蓋。磁性感測器11裝配於感測器基板13。感測器基板13固定於基板保持架14。基板保持架14固定於罩部件8。本實施形態之基板保持架14為供磁性感測器11安裝之安裝部件,磁性感測器11經由感測器基板13安裝於基板保持架14。關於磁性感測器11、感測器基板13以及基板保持架14之具體構成將於下文敍述。 The detecting mechanism 4 is a magnetic rotary encoder. As shown in FIG. 3, the detecting mechanism 4 has a sensing magnet 10 and a magnetic sensor 11 disposed opposite to the sensing magnet 10. The detecting mechanism 4 is disposed at a position closer to the rear side than the rotor and the stator. As shown in FIG. 1(A), the detecting mechanism 4 is covered by a casing 12 fixed to the cover member 8. The magnetic sensor 11 is mounted on the sensor substrate 13. The sensor substrate 13 is fixed to the substrate holder 14 . The substrate holder 14 is fixed to the cover member 8. The substrate holder 14 of the present embodiment is a mounting member to which the magnetic sensor 11 is attached, and the magnetic sensor 11 is attached to the substrate holder 14 via the sensor substrate 13. The specific configuration of the magnetic sensor 11, the sensor substrate 13, and the substrate holder 14 will be described later.
感測磁鐵10係形成為圓板狀的永久磁鐵。感測磁鐵10直接或經由特定的磁鐵保持架(省略圖示)而固定於旋轉軸2之軸端(具體而言為旋轉軸2之後端),且感測磁鐵10之後表面隔以特定的間隙與磁性感測器11相向。並且,自軸向觀察時,感測磁鐵10係以感測磁鐵10之中心與旋轉軸2之中心一致的方式固定於旋轉軸2。 The sensing magnet 10 is formed as a disk-shaped permanent magnet. The sensing magnet 10 is fixed to the shaft end of the rotating shaft 2 (specifically, the rear end of the rotating shaft 2) directly or via a specific magnet holder (not shown), and the surface of the magnet 10 is sensed with a specific gap. It faces the magnetic sensor 11. Further, the sensing magnet 10 is fixed to the rotating shaft 2 such that the center of the sensing magnet 10 coincides with the center of the rotating shaft 2 when viewed in the axial direction.
於感測磁鐵10的與磁性感測器11相向的面(即,感測磁鐵10之後表面),沿圓周方向逐極地磁化為N極及S極。亦即,感測磁鐵10的與磁性感測器11之相向面沿圓周方向被磁化為兩極。本實施形態之感測磁鐵10係由形成為半圓板狀的兩個磁鐵片10a構成,兩個磁鐵片10a中之一個磁鐵片10a之後表面被磁化為N極,另一個磁鐵片10a之後表面被磁化為S極。另外,感測磁鐵10亦可由形成為圓板狀的一個磁鐵片構成。 The surface of the sensing magnet 10 facing the magnetic sensor 11 (that is, the surface of the sensing magnet 10) is magnetized to the N pole and the S pole in a circumferential direction. That is, the opposing faces of the sensing magnet 10 and the magnetic sensor 11 are magnetized into two poles in the circumferential direction. The sensing magnet 10 of the present embodiment is composed of two magnet pieces 10a formed in a semicircular plate shape, and one of the two magnet pieces 10a is magnetized to an N pole, and the other surface of the other magnet piece 10a is Magnetization is S pole. Further, the sensing magnet 10 may be composed of one magnet piece formed in a disk shape.
(感測器基板、基板保持架之構成) (Configuration of sensor substrate and substrate holder)
圖4為圖1所示之檢測機構4的立體圖。圖5為圖4所示之檢測機構4的分解立體圖。圖6為自輸出側示出圖1所示之磁性感測器11以及感測器基板13的平面圖。圖7為自輸出側示出圖1所示之基板保持架14的平面圖。圖8為圖4所示之感測器基板13與銷14e之接著部位的剖視圖。 4 is a perspective view of the detecting mechanism 4 shown in FIG. 1. Fig. 5 is an exploded perspective view of the detecting mechanism 4 shown in Fig. 4. Fig. 6 is a plan view showing the magnetic sensor 11 and the sensor substrate 13 shown in Fig. 1 from the output side. Fig. 7 is a plan view showing the substrate holder 14 shown in Fig. 1 from the output side. Figure 8 is a cross-sectional view of the subsequent portion of the sensor substrate 13 and the pin 14e shown in Figure 4 .
感測器基板13為形成為平板狀的印刷配線基板。該感測器基板13係以感測器基板13之厚度方向與軸向一致的方式配置。磁性感測器11被裝配於感測器基板13之前表面之中心。於感測器基板13,以包圍磁性感測器11的方式形成有兩個狹縫13a。並且,於感測器基板13,形成有於軸向上(即,感測器基板13之厚度方向)貫通的貫通孔13b及自或測器基板13之外周端向中心側切削而成的缺口部13c。 The sensor substrate 13 is a printed wiring board formed in a flat shape. The sensor substrate 13 is disposed such that the thickness direction of the sensor substrate 13 coincides with the axial direction. The magnetic sensor 11 is mounted at the center of the front surface of the sensor substrate 13. Two slits 13a are formed in the sensor substrate 13 so as to surround the magnetic sensor 11. Further, the sensor substrate 13 is formed with a through hole 13b penetrating in the axial direction (that is, in the thickness direction of the sensor substrate 13) and a notch portion cut from the outer peripheral end of the detector substrate 13 toward the center side. 13c.
狹縫13a係以於軸向上貫通於感測器基板13的方式形成,且形成為大致L形狀。貫通孔13b形成為圓孔狀且形成於感測器基板13之外周端的附近。並且,貫通孔13b形成於三個部位。三個貫通孔13b係形成於自軸向觀察時以由三個貫通孔13b連成之假想線形成大致直角三角形的方式彼此分開的位置。缺口部13c形成為U形。該缺口部13c以夾著磁性感測器13的方式形成於兩個部位。另外,於感測器基板13之後表面裝配有連接器15。 The slit 13a is formed to penetrate the sensor substrate 13 in the axial direction, and is formed in a substantially L shape. The through hole 13b is formed in a circular hole shape and formed in the vicinity of the outer peripheral end of the sensor substrate 13. Further, the through hole 13b is formed in three places. The three through holes 13b are formed at positions separated from each other in such a manner that the imaginary lines connected by the three through holes 13b form a substantially right-angled triangle when viewed from the axial direction. The notch portion 13c is formed in a U shape. The notch portion 13c is formed at two locations so as to sandwich the magnetic sensor 13. In addition, a connector 15 is mounted on the surface behind the sensor substrate 13.
基板保持架14係由樹脂材料形成。該基板保持架14具有:形成為筒狀的筒部14a;以及自筒部14a之外周面之前端側向徑向外側突出之三個突出部14b。筒部14a之內周面呈圓筒面。亦即,自軸向觀察時筒部14a之內周面呈圓形。筒部14a之後端面形成為與軸向正交的平面狀。感測器基板13固定於筒部14a之後端側。 The substrate holder 14 is formed of a resin material. The substrate holder 14 has a cylindrical portion 14a formed in a tubular shape, and three protruding portions 14b projecting outward in the radial direction from the front end side of the outer peripheral surface of the cylindrical portion 14a. The inner peripheral surface of the tubular portion 14a has a cylindrical surface. That is, the inner peripheral surface of the tubular portion 14a is circular when viewed from the axial direction. The rear end surface of the tubular portion 14a is formed in a planar shape orthogonal to the axial direction. The sensor substrate 13 is fixed to the rear end side of the cylindrical portion 14a.
於筒部14a之後端面形成有:向後側突出之圓筒狀的兩個凸部14c;以及向後側突出之圓柱狀的一個凸部14d。凸部14c、14d之前端 面形成為與軸向正交的平面狀。感測器基板13之前表面與凸部14c、14d之前端面抵接。於凸部14c之內周面形成有螺紋孔。於該螺紋孔處,卡合有用於將感測器基板13固定於基板保持架14的螺釘18。螺釘18以穿過感測器基板13之缺口部13c的方式配置。 The rear end surface of the tubular portion 14a is formed with two cylindrical convex portions 14c projecting toward the rear side, and a cylindrical convex portion 14d protruding toward the rear side. Front end of convex portion 14c, 14d The surface is formed in a planar shape orthogonal to the axial direction. The front surface of the sensor substrate 13 is in contact with the front end faces of the convex portions 14c and 14d. A screw hole is formed in the inner circumferential surface of the convex portion 14c. At the screw hole, a screw 18 for fixing the sensor substrate 13 to the substrate holder 14 is engaged. The screw 18 is disposed to pass through the notch portion 13c of the sensor substrate 13.
並且,於筒部14a之後端面形成有三個銷14e,上述銷14e於軸向上朝向感測器基板13突出(即,向後側突出)。銷14e形成為帶階差的圓柱狀,於銷14e形成有與軸向正交之圓環狀的階差面14f。三個銷14e被分別員穿插入至感測器基板13之三個貫通孔13b中。具體而言,感測器基板13之前表面與階差面14f抵接,且銷14e之前端側貫穿插入至貫通孔13b中。並且,銷14e之前端側較之感測器基板13之後表面更向後側突出。 Further, three pins 14e are formed on the end surface of the cylindrical portion 14a, and the pin 14e protrudes toward the sensor substrate 13 in the axial direction (that is, protrudes toward the rear side). The pin 14e is formed in a columnar shape with a step, and a stepped surface 14f having an annular shape orthogonal to the axial direction is formed in the pin 14e. The three pins 14e are respectively inserted into the three through holes 13b of the sensor substrate 13. Specifically, the front surface of the sensor substrate 13 is in contact with the step surface 14f, and the front end side of the pin 14e is inserted into the through hole 13b. Further, the front end side of the pin 14e protrudes further toward the rear side than the rear surface of the sensor substrate 13.
如圖8所示,於貫穿插入至貫通孔13b中的銷14e之前端側之外周面與貫通孔13b之內周面之間形成有間隙。具體而言,於與軸向正交之方向上,用於調整感測器基板13相對於基板保持架14之固定位置的間隙係形成於銷14e之前端側之外周面與貫通孔13b之內周面之間。更具體而言,用於在與軸向正交之方向上調整被裝配於感測器基板13之磁性感測器11的後述的磁阻效應元件23之位置的間隙係形成於銷14e之前端側之外周面與貫通孔13b之內周面之間。 As shown in FIG. 8, a gap is formed between the outer peripheral surface of the end side before the pin 14e inserted into the through hole 13b and the inner peripheral surface of the through hole 13b. Specifically, a gap for adjusting the fixed position of the sensor substrate 13 with respect to the substrate holder 14 is formed in the outer peripheral surface of the front end side of the pin 14e and the through hole 13b in the direction orthogonal to the axial direction. Between the weeks. More specifically, a gap for adjusting the position of the magnetoresistance effect element 23 to be described later of the magnetic sensor 11 mounted on the sensor substrate 13 in the direction orthogonal to the axial direction is formed at the front end of the pin 14e. The outer peripheral surface of the side and the inner peripheral surface of the through hole 13b.
在本實施形態中,感測器基板13於藉由螺釘18固定於基板保持架14之前,利用接著劑19暫時固定於基板保持架14。如圖8所示,接著劑19以遍佈較之感測器基板13之後表面更向後側突出的銷14e之前端側及感測器基板13之後表面的方式塗覆。該接著劑19例如,為紫外線(UV)硬化型接著劑。 In the present embodiment, the sensor substrate 13 is temporarily fixed to the substrate holder 14 by the adhesive 19 before being fixed to the substrate holder 14 by the screws 18. As shown in FIG. 8, the adhesive 19 is applied in such a manner as to extend over the front end side of the pin 14e and the rear surface of the sensor substrate 13 which protrude further toward the rear side than the rear surface of the sensor substrate 13. The adhesive 19 is, for example, an ultraviolet (UV) curable adhesive.
當自軸向觀察時,三個突出部14b係以大致120度的間距相對於筒部14a之內周面之中心配置。於突出部14b形成有貫通孔14g,該貫通孔14g供用於將基板保持架14固定於罩部件8的螺釘20(參照圖4)貫 穿插入。另外,於罩部件8形成有卡合螺釘20之螺釘孔,但於圖2中,省略螺釘孔之圖示。 When viewed from the axial direction, the three protruding portions 14b are disposed at a pitch of approximately 120 degrees with respect to the center of the inner peripheral surface of the tubular portion 14a. A through hole 14g is formed in the protruding portion 14b, and the through hole 14g is provided with a screw 20 (refer to FIG. 4) for fixing the substrate holder 14 to the cover member 8. Wear inserts. Further, a screw hole for engaging the screw 20 is formed in the cover member 8, but in FIG. 2, the illustration of the screw hole is omitted.
突出部14b之外周面14h的自軸向觀察時的形狀係形成為呈圓弧狀之曲面狀。如圖7所示,自軸向觀察時,三個突出部14b之外周面14h之曲率中心C1一致。在本實施形態中,突出部14b之外周面14h成為基板保持架14於徑向上相對於罩部件8之定位基準的基準面,於將基板保持架14固定於罩部件8時,藉由罩部件8之基準面8b及突出部14b之外周面14h來決定基板保持架14於徑向上相對於罩部件8的位置。亦即,在本實施形態中,自軸向觀察時,於基板保持架14之徑向上之外周側形成有成為基板保持架14於徑向上相對於馬達殼體3之定位基準的複數個圓弧狀的基準面。 The shape of the outer peripheral surface 14h of the protruding portion 14b when viewed from the axial direction is formed into a curved shape having an arc shape. As shown in Fig. 7, the center of curvature C1 of the outer peripheral surface 14h of the three protruding portions 14b coincides when viewed in the axial direction. In the present embodiment, the outer peripheral surface 14h of the protruding portion 14b serves as a reference surface for the positioning of the substrate holder 14 in the radial direction with respect to the cover member 8, and when the substrate holder 14 is fixed to the cover member 8, the cover member is used. The reference surface 8b of 8 and the outer peripheral surface 14h of the protruding portion 14b determine the position of the substrate holder 14 in the radial direction with respect to the cover member 8. In other words, in the present embodiment, a plurality of arcs which are the positioning reference of the substrate holder 14 in the radial direction with respect to the motor housing 3 are formed on the outer peripheral side in the radial direction of the substrate holder 14 when viewed in the axial direction. Shaped datum.
於基板保持架14被固定於罩部件8之狀態下,自軸向觀察時,三個突出部14b之外周面14h之曲率中心C1與基準面8b之中心一致。如上所述,由於自軸向觀察時,基準面8b之中心與旋轉軸2之中心一致,因此,自軸向觀察時,三個突出部14b之外周面14h之曲率中心C1與旋轉軸2之中心一致。並且,自軸向觀察時,三個突出部14b之外周面14h之曲率中心C1與筒部14a之內周面之中心一致。 In a state where the substrate holder 14 is fixed to the cover member 8, the center of curvature C1 of the outer peripheral surface 14h of the three protruding portions 14b coincides with the center of the reference surface 8b when viewed in the axial direction. As described above, since the center of the reference surface 8b coincides with the center of the rotating shaft 2 when viewed from the axial direction, the center of curvature C1 and the rotating shaft 2 of the outer peripheral surface 14h of the three protruding portions 14b are viewed from the axial direction. The center is consistent. Further, when viewed in the axial direction, the center of curvature C1 of the outer peripheral surface 14h of the three protruding portions 14b coincides with the center of the inner peripheral surface of the tubular portion 14a.
(磁性感測器之構成) (Composition of magnetic sensor)
圖9為自輸出側示出圖3所示之磁性感測器11的立體圖。圖10為被容納於圖9所示之封裝體本體25之元件基板24的平面圖。 Fig. 9 is a perspective view showing the magnetic sensor 11 shown in Fig. 3 from the output side. FIG. 10 is a plan view of the element substrate 24 housed in the package body 25 shown in FIG.
磁性感測器11具有:磁阻效應元件23(以下稱作“MR元件23”);元件基板24,其形成有MR元件23;箱狀的封裝體本體25,其容納元件基板24;以及密封部件26,其將封裝體本體25之開口部封閉,從而對元件基板24進行密封(即,將MR元件23密封)。封裝體本體25形成為前端側呈開口之長方體的箱狀。本實施形態之密封部件26為透明的玻璃製的蓋(玻璃蓋)。因此,以下將密封部件26稱作“玻璃蓋26”。 The magnetic sensor 11 has: a magnetoresistive effect element 23 (hereinafter referred to as "MR element 23"); an element substrate 24 formed with an MR element 23; a box-shaped package body 25 accommodating the element substrate 24; and a seal The member 26 closes the opening of the package body 25 to seal the element substrate 24 (i.e., seal the MR element 23). The package body 25 is formed in a box shape having a rectangular parallelepiped shape on the front end side. The sealing member 26 of the present embodiment is a transparent glass cover (glass cover). Therefore, the sealing member 26 will hereinafter be referred to as a "glass cover 26".
玻璃蓋26形成為大致矩形的平板狀。該玻璃蓋26以將封裝體本體25之開口部封閉的方式固定於封裝體本體25之前端。並且,玻璃蓋26藉由接著而固定於封裝體本體25之前端,且由封裝體本體25及玻璃蓋26形成容納元件基板24之密閉空間。在容納於封裝體本體25之元件基板24與玻璃蓋26之間形成有間隙,且元件基板24與玻璃蓋26不接觸。由於玻璃蓋26為透明的,因此若自前表面側觀察磁性感測器11,則能夠看到被容納於封裝體本體25之元件基板24之前表面。 The glass cover 26 is formed in a substantially rectangular flat plate shape. The cover glass 26 is fixed to the front end of the package body 25 so as to close the opening of the package body 25. Further, the glass cover 26 is fixed to the front end of the package body 25 by the subsequent step, and the package body 25 and the glass cover 26 form a sealed space for accommodating the element substrate 24. A gap is formed between the element substrate 24 housed in the package body 25 and the glass cover 26, and the element substrate 24 is not in contact with the glass cover 26. Since the glass cover 26 is transparent, when the magnetic sensor 11 is viewed from the front surface side, the front surface of the element substrate 24 accommodated in the package body 25 can be seen.
元件基板24係形成為矩形之平板狀的印刷配線基板。該元件基板24係以元件基板24之厚度方向與軸向一致的方式配置。於元件基板24不僅形成有MR元件23,還形成有溫度監測用電阻膜29及加熱用電阻膜30。MR元件23、溫度監測用電阻膜29以及加熱用電阻膜30形成於元件基板24之前表面。MR元件23、溫度監測用電阻膜29以及加熱用電阻膜30被絕緣膜覆蓋。 The element substrate 24 is formed into a rectangular flat printed wiring board. The element substrate 24 is disposed such that the thickness direction of the element substrate 24 coincides with the axial direction. The element substrate 24 is formed not only with the MR element 23 but also with the temperature monitoring resistive film 29 and the heating resistive film 30. The MR element 23, the temperature monitoring resistive film 29, and the heating resistive film 30 are formed on the front surface of the element substrate 24. The MR element 23, the temperature monitoring resistive film 29, and the heating resistive film 30 are covered with an insulating film.
MR元件23具有A相(SIN)磁感應膜31、32及B相(COS)磁感應膜33、34。磁感應膜31至34係形成於元件基板24之中心。在本實施形態中,如圖10所示,由磁感應膜31至34形成圓形之磁感應區域36。A相磁感應膜31、32之相位與B相磁感應膜33、34之相位相差90度。亦即,A相磁感應膜31、32與B相磁感應膜33、34具有90度之相位差。並且,就A相而言,磁感應膜31之相位與磁感應膜32之相位相差180度,就B相而言,磁感應膜33之相位與磁感應膜34之相位相差180度。 The MR element 23 has phase A (SIN) magnetic induction films 31 and 32 and phase B (COS) magnetic induction films 33 and 34. The magnetic induction films 31 to 34 are formed at the center of the element substrate 24. In the present embodiment, as shown in Fig. 10, a circular magnetic induction region 36 is formed by the magnetic induction films 31 to 34. The phases of the A-phase magnetic induction films 31 and 32 are different from the phase of the B-phase magnetic induction films 33 and 34 by 90 degrees. That is, the A-phase magnetic induction films 31, 32 and the B-phase magnetic induction films 33, 34 have a phase difference of 90 degrees. Further, in the phase A, the phase of the magnetic induction film 31 is different from the phase of the magnetic induction film 32 by 180 degrees, and in the phase B, the phase of the magnetic induction film 33 is different from the phase of the magnetic induction film 34 by 180 degrees.
磁感應膜31、32構成橋式電路,且該橋式電路之一端與電源端子VccA連接,另一端與接地端子GNDA連接。並且,磁感應膜31之中點位置與輸出端子+A連接,磁感應膜32之中點位置與輸出端子-A連接。同樣,磁感應膜33、34構成橋式電路,且該橋式電路之一端與電源端子VccB連接,另一端與接地端子GNDB連接。並且,磁感應膜33 之中點位置與輸出端子+B連接,磁感應膜34之中點位置與輸出端子-B連接。 The magnetic induction films 31 and 32 constitute a bridge circuit, and one end of the bridge circuit is connected to the power supply terminal VccA, and the other end is connected to the ground terminal GNDA. Further, the position of the magnetic induction film 31 is connected to the output terminal +A, and the position of the magnetic induction film 32 is connected to the output terminal -A. Similarly, the magnetic induction films 33 and 34 constitute a bridge circuit, and one end of the bridge circuit is connected to the power supply terminal VccB, and the other end is connected to the ground terminal GNDB. Also, the magnetic induction film 33 The midpoint position is connected to the output terminal +B, and the dot position of the magnetic induction film 34 is connected to the output terminal -B.
加熱用電阻膜30形成為矩形的框狀。並且,加熱用電阻膜30沿著元件基板24之端面形成,且以包圍磁感應區域36的方式配置。加熱用電阻膜30與電源端子VccH連接,且與接地端子GNDA連接。溫度監測用電阻膜29配置於磁感應區域36與加熱用電阻膜30之間。溫度監測用電阻膜29與電源端子VccS連接且與接地端子GNDB連接。在本實施形態中,基於溫度監測用電阻膜29之電阻變化,來實施控制向加熱用電阻膜30之供電的溫度控制。 The heating resistive film 30 is formed in a rectangular frame shape. Further, the heating resistive film 30 is formed along the end surface of the element substrate 24, and is disposed to surround the magnetic induction region 36. The heating resistive film 30 is connected to the power supply terminal VccH and to the ground terminal GNDA. The temperature monitoring resistive film 29 is disposed between the magnetic induction region 36 and the heating resistive film 30. The temperature monitoring resistive film 29 is connected to the power supply terminal VccS and to the ground terminal GNDB. In the present embodiment, temperature control for controlling the supply of power to the heating resistor film 30 is performed based on the change in resistance of the temperature monitoring resistive film 29.
並且,於元件基板24形成有用於使MR元件23相對於基板保持架14進行位置對準的標記M1。具體而言,於與軸向正交之方向上(徑向)用於使MR元件23相對於基板保持架14進行位置對準的標記M1形成於元件基板24。標記M1形成於元件基板24之前表面。如圖10所示,自元件基板24之厚度方向觀察時,若以通過磁感應區域36之中心C2的假想線為假想線L1,以通過磁感應區域36之中心C2且與假想線L1不同的假想線為假想線L2,則自元件基板24之厚度方向觀察時,標記M1形成於假想線L1上的兩個部位及假想線L2上的兩個部位的合計四個部位。在本實施形態中,假想線L1、L2彼此正交且與元件基板24之端面平行。並且,形成於假想線L1上的兩個部位的標記M1以夾著磁感應區域36的方式形成,形成於假想線L2上的兩個部位的標記M1以夾著磁感應區域36的方式形成。本實施形態之假想線L1為第一假想線,假想線L2為第二假想線。 Further, a mark M1 for aligning the MR element 23 with respect to the substrate holder 14 is formed on the element substrate 24. Specifically, a mark M1 for aligning the MR element 23 with respect to the substrate holder 14 in the direction orthogonal to the axial direction (radial direction) is formed on the element substrate 24. The mark M1 is formed on the front surface of the element substrate 24. As shown in FIG. 10, when viewed from the thickness direction of the element substrate 24, the imaginary line passing through the center C2 of the magnetic induction region 36 is the imaginary line L1, and the imaginary line passing through the center C2 of the magnetic induction region 36 and different from the imaginary line L1. When the imaginary line L2 is viewed from the thickness direction of the element substrate 24, the mark M1 is formed in two places on the imaginary line L1 and the total of the two parts on the imaginary line L2. In the present embodiment, the imaginary lines L1, L2 are orthogonal to each other and parallel to the end faces of the element substrate 24. Further, the marks M1 of the two portions formed on the imaginary line L1 are formed so as to sandwich the magnetic induction region 36, and the marks M1 of the two portions formed on the imaginary line L2 are formed to sandwich the magnetic induction region 36. The imaginary line L1 of the present embodiment is the first imaginary line, and the imaginary line L2 is the second imaginary line.
(感測器基板向基板保持架之安裝方法) (Method of mounting the sensor substrate to the substrate holder)
圖11為用於說明將圖5所示之感測器基板13安裝於基板保持架14時的安裝方法的圖。 FIG. 11 is a view for explaining a mounting method when the sensor substrate 13 shown in FIG. 5 is mounted on the substrate holder 14.
於將裝配有磁性感測器11之狀態的感測器基板13安裝於基板保持 架14時,首先,將基板保持架14之銷14e貫穿插入至裝配有磁性感測器11之狀態的感測器基板13之貫通孔13b中。具體而言,將銷14e插入至貫通孔13b中直至感測器基板13之前表面與銷14e之階差面14f抵接為止。之後,藉由圖像處理,計算出自軸向觀察時的三個突出部14b之外周面14h之曲率中心C1,並使用四個標記M1,藉由圖像處理,計算出自軸向觀察時之磁感應區域36之中心C2。 Mounting the sensor substrate 13 in a state in which the magnetic sensor 11 is mounted on the substrate holding At the time of the frame 14, first, the pin 14e of the substrate holder 14 is inserted into the through hole 13b of the sensor substrate 13 in a state in which the magnetic sensor 11 is mounted. Specifically, the pin 14e is inserted into the through hole 13b until the front surface of the sensor substrate 13 abuts against the step surface 14f of the pin 14e. Thereafter, by the image processing, the center of curvature C1 of the outer peripheral surface 14h of the three protruding portions 14b when viewed from the axial direction is calculated, and the magnetic induction when viewed from the axial direction is calculated by image processing using four marks M1. Center C2 of area 36.
此後,如圖11所示,自軸向觀察時,以外周面14h之曲率中心C1與磁感應區域36之中心C2一致的方式,使感測器基板13於與軸向正交之平面內相對於基板保持架14活動。自軸向觀察時,若外周面14h之曲率中心C1與磁感應區域36之中心C2一致,則以遍佈較之感測器基板13之後表面更向後側突出之銷14e之前端側與感測器基板13之後表面的方式塗覆接著劑19,從而將感測器基板13暫時固定於基板保持架14。此後,利用螺釘18,將感測器基板13固定於基板保持架14。 Thereafter, as shown in FIG. 11, the center of curvature C1 of the outer peripheral surface 14h coincides with the center C2 of the magnetic induction region 36 as viewed in the axial direction, so that the sensor substrate 13 is opposed to the plane orthogonal to the axial direction. The substrate holder 14 is active. When viewed from the axial direction, if the center of curvature C1 of the outer peripheral surface 14h coincides with the center C2 of the magnetic sensing region 36, the front end side of the pin 14e protruding from the rear surface of the sensor substrate 13 and the sensor substrate The adhesive 19 is applied in a manner of 13 after the surface, thereby temporarily fixing the sensor substrate 13 to the substrate holder 14. Thereafter, the sensor substrate 13 is fixed to the substrate holder 14 by the screws 18.
如此一來,由於裝配有磁性感測器11之狀態的感測器基板13被安裝於基板保持架14,因此,若裝配有磁性感測器11之狀態的感測器基板13被安裝於基板保持架14,則自軸向觀察時,外周面14h之曲率中心C1與磁感應區域36之中心C2一致。 In this way, since the sensor substrate 13 in the state in which the magnetic sensor 11 is mounted is mounted on the substrate holder 14, the sensor substrate 13 in the state in which the magnetic sensor 11 is mounted is mounted on the substrate. When the holder 14 is viewed from the axial direction, the center of curvature C1 of the outer peripheral surface 14h coincides with the center C2 of the magnetic induction region 36.
(本實施形態之主要效果) (Main effects of this embodiment)
如上述說明,在本實施形態中,於形成有MR元件23之元件基板24之前表面形成有用於使MR元件23相對於基板保持架14進行位置對準的位置對準用標記M1。並且,在本實施形態中,固定於容納有元件基板24之封裝體本體25的玻璃蓋26為透明的,若自前表面側觀察磁性感測器11,則能夠看到被容納於封裝體本體25之元件基板24之前表面。因此,在本實施形態中,如上所述,於將裝配有磁性感測器11之感測器基板13安裝於基板保持架14時,能利用標記M1,以自軸向觀察時外周面14h之曲率中心C1與磁感應區域36之中心C2一致的方式, 調整MR元件23相對於基板保持架14的位置。因此,在本實施形態中,能夠精確地將MR元件23安裝於基板保持架14。 As described above, in the present embodiment, the alignment mark M1 for aligning the MR element 23 with respect to the substrate holder 14 is formed on the surface of the element substrate 24 on which the MR element 23 is formed. Further, in the present embodiment, the glass cover 26 fixed to the package body 25 in which the element substrate 24 is housed is transparent, and when the magnetic sensor 11 is viewed from the front surface side, it can be seen and accommodated in the package body 25. The front surface of the component substrate 24. Therefore, in the present embodiment, as described above, when the sensor substrate 13 to which the magnetic sensor 11 is mounted is mounted on the substrate holder 14, the outer peripheral surface 14h can be viewed from the axial direction by the mark M1. The manner in which the center of curvature C1 coincides with the center C2 of the magnetic sensing region 36, The position of the MR element 23 relative to the substrate holder 14 is adjusted. Therefore, in the present embodiment, the MR element 23 can be accurately mounted on the substrate holder 14.
並且,在本實施形態中,感測磁鐵10係以自軸向觀察時,突出部14b之外周面14h之曲率中心C1與旋轉軸2之中心一致且感測磁鐵10之中心與旋轉軸2之中心一致的方式固定於旋轉軸2。綜上所述,在本實施形態中,能夠降低自軸向觀察時感測磁鐵10之中心與磁感應區域36之中心C2的偏移量。 Further, in the present embodiment, when the sensing magnet 10 is viewed from the axial direction, the center of curvature C1 of the outer peripheral surface 14h of the protruding portion 14b coincides with the center of the rotating shaft 2, and the center of the magnet 10 and the rotating shaft 2 are sensed. The center is fixed to the rotating shaft 2 in a consistent manner. As described above, in the present embodiment, it is possible to reduce the amount of shift between the center of the sensing magnet 10 and the center C2 of the magnetic sensing region 36 when viewed from the axial direction.
在本實施形態中,封裝體本體25之前端側的開口被玻璃蓋26封閉,並於被容納於封裝體本體25之元件基板24與玻璃蓋26之間形成有間隙。因此,在本實施形態中,與封閉元件基板24之密封部件為填充至封裝體本體25的樹脂之情形相比,能夠抑制MR元件23之檢測精度降低。亦即,MR元件23之檢測精度會因作用於MR元件23之應力的影響、濕度的影響而降低,但於密封部件為填充至封裝體本體25的樹脂之情形時,因該樹脂而作用於MR元件23之應力的影響、樹脂吸收之濕氣的影響而有使MR元件23之檢測精度降低之虞。相對於此,在本實施形態中,由於在被容納於封裝體本體25之元件基板24與玻璃蓋26之間形成有間隙,因此不會產生此種問題。因此,在本實施形態中,能夠抑制MR元件23之檢測精度降低。 In the present embodiment, the opening on the front end side of the package body 25 is closed by the cover glass 26, and a gap is formed between the element substrate 24 accommodated in the package body 25 and the cover glass 26. Therefore, in the present embodiment, it is possible to suppress a decrease in the detection accuracy of the MR element 23 as compared with a case where the sealing member of the closing element substrate 24 is a resin filled in the package body 25. In other words, the detection accuracy of the MR element 23 is lowered by the influence of the stress acting on the MR element 23 and the influence of the humidity. However, when the sealing member is filled with the resin of the package body 25, the resin acts on the resin. The influence of the stress of the MR element 23 and the influence of the moisture absorbed by the resin may reduce the detection accuracy of the MR element 23. On the other hand, in the present embodiment, since a gap is formed between the element substrate 24 accommodated in the package main body 25 and the cover glass 26, such a problem does not occur. Therefore, in the present embodiment, it is possible to suppress a decrease in the detection accuracy of the MR element 23.
並且,在本實施形態中,由於利用透明的玻璃蓋26將封裝體本體25之前端側的開口封閉,因此,於藉由接著將玻璃蓋26固定於封裝體本體25時,能夠確認玻璃蓋26是否被確實地接著並固定於封裝體本體25。因此,能夠藉由玻璃蓋26確實地密封元件基板24。 Further, in the present embodiment, since the opening on the front end side of the package main body 25 is closed by the transparent glass cover 26, when the glass cover 26 is subsequently fixed to the package main body 25, the glass cover 26 can be confirmed. Whether it is reliably followed and fixed to the package body 25. Therefore, the element substrate 24 can be surely sealed by the glass cover 26.
在本實施形態中,於基板保持架14之銷14e之前端側之外周面與感測器基板13之貫通孔13b之內周面之間,形成有用於在與軸向正交之方向上調整MR元件23之位置的間隙。因此,在本實施形態中,如上所述,於將裝配有磁性感測器11之狀態的感測器基板13安裝於基板 保持架14時,能夠於銷14e已貫穿插入至貫通孔13b中之狀態下調整感測器基板13相對於基板保持架14之安裝位置。因此,在本實施形態中,於一邊調整感測器基板13相對於基板保持架14之安裝位置,一邊將感測器基板13安裝於基板保持架14時,感測器基板13相對於基板保持架14不會產生較大偏移。其結果是,在本實施形態中,能夠容易地實施感測器基板13向基板保持架14之安裝操作。 In the present embodiment, between the outer peripheral surface of the front end side of the pin 14e of the substrate holder 14 and the inner peripheral surface of the through hole 13b of the sensor substrate 13, an adjustment is made in a direction orthogonal to the axial direction. The gap of the position of the MR element 23. Therefore, in the present embodiment, as described above, the sensor substrate 13 in a state in which the magnetic sensor 11 is mounted is mounted on the substrate. In the case of the holder 14, the mounting position of the sensor substrate 13 with respect to the substrate holder 14 can be adjusted in a state where the pin 14e has been inserted into the through hole 13b. Therefore, in the present embodiment, while the sensor substrate 13 is mounted on the substrate holder 14 while the mounting position of the sensor substrate 13 with respect to the substrate holder 14 is adjusted, the sensor substrate 13 is held relative to the substrate. The frame 14 does not create a large offset. As a result, in the present embodiment, the mounting operation of the sensor substrate 13 to the substrate holder 14 can be easily performed.
在本實施形態中,以遍佈較之感測器基板13之後表面更向後側突出之銷14e之前端側及感測器基板13之後表面的方式塗敷接著劑19。因此,在本實施形態中,能夠一邊確認所塗敷的接著劑19,一邊實施接著操作。因此,例如與使接著劑流入基板保持架14之筒部14a之後端面與感測器基板13之前表面之間的情形、以及使接著劑流入基板保持架14的階差面14f之後端面與感測器基板13之前表面之間的情形相比,能夠容易地實施接著操作。 In the present embodiment, the adhesive 19 is applied so as to extend over the front end side of the pin 14e and the rear surface of the sensor substrate 13 which protrude further toward the rear side than the rear surface of the sensor substrate 13. Therefore, in the present embodiment, the subsequent operation can be performed while confirming the applied adhesive 19. Therefore, for example, the situation between the end surface after the adhesive agent flows into the cylindrical portion 14a of the substrate holder 14 and the front surface of the sensor substrate 13, and the end face and the sensing after the adhesive flows into the step surface 14f of the substrate holder 14 The subsequent operation can be easily performed as compared with the case between the front surfaces of the substrate 13.
(其他實施形態) (Other embodiments)
上述之實施形態係本發明之較佳之實施形態之一例,但並不限定於此,能夠於不改變本發明之主旨的範圍內實施各種變化。 The embodiment described above is an example of a preferred embodiment of the present invention, and the present invention is not limited thereto, and various modifications can be made without departing from the spirit and scope of the invention.
於上述之實施形態中,通過磁感應區域36之中心C2的假想線L1、L2彼此正交且與元件基板24之端面平行。除此之外,例如,如圖10所示,通過磁感應區域36之中心C2的假想線L11、L12亦可與形成為矩形之框狀的加熱用電阻膜30之對角線大致一致。於此情形時,於假想線L11上的兩個部位及假想線L12上的兩個部位的合計四個部位,形成有用於使MR元件23相對於基板保持架14進行位置對準的標記M11。並且,於此情形時,假想線L11為第一假想線,假想線L12為第二假想線。並且,用於使MR元件23相對於基板保持架14進行位置對準的標記既可形成於一個部位、兩個部位或三個部位,亦可形成於五個以上的部位。例如,於自元件基板24之厚度方向觀察時,標記亦 可形成於磁感應區域36之中心C2的一個部位。於此情形時,能夠最小限度地設置標記之形成部位。 In the above embodiment, the imaginary lines L1, L2 passing through the center C2 of the magnetic induction region 36 are orthogonal to each other and parallel to the end faces of the element substrate 24. In addition, for example, as shown in FIG. 10, the imaginary lines L11 and L12 passing through the center C2 of the magnetic induction region 36 may substantially coincide with the diagonal lines of the heating resistive film 30 formed in a rectangular frame shape. In this case, a mark M11 for aligning the MR element 23 with respect to the substrate holder 14 is formed at four locations on the imaginary line L11 and the two locations on the imaginary line L12. Further, in this case, the imaginary line L11 is the first imaginary line, and the imaginary line L12 is the second imaginary line. Further, the mark for aligning the MR element 23 with respect to the substrate holder 14 may be formed in one portion, two portions, or three portions, or may be formed in five or more portions. For example, when viewed from the thickness direction of the element substrate 24, the mark is also It can be formed at one portion of the center C2 of the magnetic induction region 36. In this case, the formation portion of the mark can be provided to a minimum.
另外,於假想線L1上的兩個部位與假想線L2上的兩個部位合計四個部位形成標記M1的情形、以及於假想線L11上的兩個部位及假想線L12上的兩個部位的合計四個部位形成標記M11之情形時,與於磁感應區域36之中心C2的一個部位形成標記之情形相比,能夠將標記M1、M11形成於元件基板24上之容易形成標記M1、M11的部位。因此,能夠容易地於元件基板24形成標記M1、M11。 In addition, the case where the mark M1 is formed in four places on the imaginary line L1 and the two parts on the imaginary line L2, and the two parts on the imaginary line L11 and the two parts on the imaginary line L12 When the mark M11 is formed in four places in total, the marks M1 and M11 can be formed on the element substrate 24 to form the marks M1 and M11 as compared with the case where the mark is formed in one portion of the center C2 of the magnetic induction region 36. . Therefore, the marks M1 and M11 can be easily formed on the element substrate 24.
在上述之實施形態中,於自軸向觀察時,在基板保持架14之徑向上之外周側形成有複數個圓弧狀的基準面(外周面14h),該基準面成為基板保持架14相對於馬達殼體3於徑向上之定位基準。除此之外,例如自軸向觀察時,既可於基板保持架14之徑向上之外周側形成作為基板保持架14相對於馬達殼體於徑向上之定位基準的圓形的基準面,亦可於基板保持架14之外周側形成作為基板保持架14相對於馬達殼體3於徑向上之定位基準的複數個凸部。並且,在上述之實施形態中,密封部件26為透明的玻璃製蓋(玻璃蓋),但密封部件26亦可為填充至封裝體本體25之透明的樹脂。並且,在上述之實施形態中,於基板保持架14形成有銷14e,於感測器基板13形成有供銷14e貫穿插入之貫通孔13b,但亦可不形成銷14e以及貫通孔13b。並且,在上述之實施形態中,接著劑19為紫外線硬化型接著劑,但接著劑19亦可為流入基板保持架14之階差面14f之後端面與感測器基板13之前表面之間、以及流入基板保持架14之凸部14c、14d之後端面與感測器基板13之前表面之間的瞬間接著劑。 In the above-described embodiment, when viewed in the axial direction, a plurality of arc-shaped reference faces (outer peripheral faces 14h) are formed on the outer peripheral side in the radial direction of the substrate holder 14, and the reference faces are the substrate holders 14 opposed to each other. Positioning reference of the motor housing 3 in the radial direction. In addition, for example, when viewed from the axial direction, a circular reference surface which is a reference position for the radial direction of the substrate holder 14 with respect to the motor housing can be formed on the outer circumferential side of the substrate holder 14 in the radial direction. A plurality of convex portions which are positioning references of the substrate holder 14 with respect to the motor housing 3 in the radial direction can be formed on the outer peripheral side of the substrate holder 14. Further, in the above embodiment, the sealing member 26 is a transparent glass cover (glass cover), but the sealing member 26 may be a transparent resin filled in the package body 25. Further, in the above-described embodiment, the pin 14e is formed in the substrate holder 14, and the through hole 13b through which the pin 14e is inserted is formed in the sensor substrate 13, but the pin 14e and the through hole 13b may not be formed. Further, in the above-described embodiment, the adhesive 19 is an ultraviolet curable adhesive, but the adhesive 19 may be between the end surface after flowing into the step surface 14f of the substrate holder 14 and the front surface of the sensor substrate 13, and An instantaneous adhesive agent flows between the end surface of the convex portion 14c, 14d of the substrate holder 14 and the front surface of the sensor substrate 13.
11‧‧‧磁性感測器 11‧‧‧Magnetic sensor
13‧‧‧感測器基板 13‧‧‧Sensor substrate
13a‧‧‧狹縫 13a‧‧‧slit
13b‧‧‧貫通孔 13b‧‧‧through hole
13c‧‧‧缺口部 13c‧‧‧Gap section
14‧‧‧基板保持架(安裝部件) 14‧‧‧Substrate holder (mounting parts)
14a‧‧‧筒部 14a‧‧‧ Tube
14b‧‧‧突出部 14b‧‧‧Protruding
14g‧‧‧貫通孔 14g‧‧‧through hole
14h‧‧‧外周面(基準面) 14h‧‧‧outer surface (reference surface)
24‧‧‧元件基板 24‧‧‧ element substrate
25‧‧‧封裝體本體 25‧‧‧Package body
26‧‧‧玻璃蓋(密封部件、蓋) 26‧‧‧ glass cover (sealing parts, cover)
36‧‧‧磁感應區域 36‧‧‧Magnetic sensing area
C1‧‧‧外周面之曲率中心(基準面之曲率中心) C1‧‧‧Center of curvature of the outer perimeter (center of curvature of the reference plane)
C2‧‧‧磁感應區域之中心 C2‧‧‧The center of the magnetic sensing area
M1‧‧‧標記 M1‧‧‧ mark
Claims (8)
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JP2015048360A JP2016169966A (en) | 2015-03-11 | 2015-03-11 | Magnetic sensor and motor |
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TWI679401B TWI679401B (en) | 2019-12-11 |
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KR (1) | KR20160110157A (en) |
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US11050326B2 (en) * | 2016-11-04 | 2021-06-29 | Nidec Corporation | Reluctance motor and motor system including reluctance motor |
JP2018194458A (en) * | 2017-05-18 | 2018-12-06 | 矢崎総業株式会社 | Magnetic detector |
CN110651416B (en) * | 2017-05-26 | 2022-07-29 | 三菱电机株式会社 | Rotating electrical machine |
CN107607867B (en) * | 2017-08-09 | 2020-04-28 | 杭州威衡科技有限公司 | Device and method for detecting rotation direction of motor stator magnetic field |
FR3080233B1 (en) * | 2018-04-17 | 2021-04-16 | Valeo Equip Electr Moteur | SET INCLUDING A ROTATING ELECTRIC MACHINE AND A BELT TENSIONER |
CN112262296A (en) * | 2018-06-12 | 2021-01-22 | 三菱电机株式会社 | Encoders and Servo Motors |
JP2020012730A (en) * | 2018-07-18 | 2020-01-23 | 多摩川精機株式会社 | Magnetic encoder and method for attaching the same |
CN112534287B (en) * | 2018-09-05 | 2024-05-31 | 阿尔卑斯阿尔派株式会社 | Mounting structure of sensor element, movement amount detecting device, and manufacturing method thereof |
CN109666586B (en) * | 2018-12-31 | 2021-12-10 | 陈科 | Device capable of automatically cleaning articles for detecting viscosity of materials |
JP7295686B2 (en) * | 2019-03-29 | 2023-06-21 | ミネベアミツミ株式会社 | absolute encoder |
US11509193B2 (en) * | 2019-12-19 | 2022-11-22 | Black & Decker Inc. | Power tool with compact motor assembly |
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JPS5949963U (en) * | 1982-09-27 | 1984-04-03 | 日本精機株式会社 | rotation detection device |
JPH02139980A (en) * | 1988-11-19 | 1990-05-29 | Midori Sokki:Kk | Magnetoresistance device with built-in static shield |
JPH0560568A (en) * | 1991-08-30 | 1993-03-09 | Toshiba Corp | Magnetic sensor |
JP2001227902A (en) * | 2000-02-16 | 2001-08-24 | Mitsubishi Electric Corp | Semiconductor device |
CN100429799C (en) * | 2002-10-18 | 2008-10-29 | 雅马哈株式会社 | Magnetic inductor and its manufacturing method |
JP2006086439A (en) * | 2004-09-17 | 2006-03-30 | Nidec Sankyo Corp | Magnetoresistive element |
JP5330930B2 (en) * | 2008-09-05 | 2013-10-30 | 日本電産サンキョー株式会社 | Magnetic rotation detection device and manufacturing method thereof |
JP2011033601A (en) * | 2009-08-06 | 2011-02-17 | Koyo Electronics Ind Co Ltd | Method for fixing magnet in magnetic encoder and magnetic encoder using the same |
JP2011055598A (en) * | 2009-08-31 | 2011-03-17 | Nidec Sankyo Corp | Stepping motor |
JP5718081B2 (en) | 2011-02-14 | 2015-05-13 | 日本電産サンキョー株式会社 | Motor with magnetic sensor unit and encoder |
US20130335072A1 (en) * | 2012-06-15 | 2013-12-19 | Wolfram Malzfeldt | Steering torque angle sensor having a processor and a magneto-resistive element configured in a monolithic architecture |
JP2014107903A (en) * | 2012-11-26 | 2014-06-09 | Nidec Sankyo Corp | Motor |
JP6151544B2 (en) | 2013-03-28 | 2017-06-21 | 日本電産サンキョー株式会社 | Magnetic sensor device and rotary encoder |
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KR20160110157A (en) | 2016-09-21 |
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