TW201630103A - Purge device, purge stocker, and purge abnormality detection method - Google Patents
Purge device, purge stocker, and purge abnormality detection method Download PDFInfo
- Publication number
- TW201630103A TW201630103A TW105103581A TW105103581A TW201630103A TW 201630103 A TW201630103 A TW 201630103A TW 105103581 A TW105103581 A TW 105103581A TW 105103581 A TW105103581 A TW 105103581A TW 201630103 A TW201630103 A TW 201630103A
- Authority
- TW
- Taiwan
- Prior art keywords
- flow rate
- purification
- control device
- container
- flow
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明係關於淨化裝置、淨化貯藏庫、及淨化異常檢測方法。 The present invention relates to a purification device, a purification storage, and a purification abnormality detecting method.
收容晶圓或光柵等的FOUP、SMIF Pod、光柵Pod等容器係在保管時,藉由淨化裝置,在容器內填充清淨乾燥空氣或氮氣等淨化氣體,以抑制收容物的污染或氧化等。該淨化裝置已知配備在用以保管容器的淨化貯藏庫。已提出一種若發生藉由淨化裝置所為之淨化氣體的供給不足等淨化異常,由於發生收容物的污染等,因此測定被供給至容器的淨化氣體的流量,檢測淨化異常的技術(參照例如專利文獻1)。在專利文獻1中,藉由感測器測定被供給至容器內部的淨化氣體的流量,判定是否進行良好的淨化。 When a container such as a FOUP, a SMIF Pod, or a grating Pod that accommodates a wafer or a grating is stored, the container is filled with a clean gas such as dry air or nitrogen gas by a purification device to suppress contamination or oxidation of the stored product. The purification device is known to be equipped with a purification reservoir for storing containers. In the case where a purification abnormality such as a shortage of the purge gas by the purification device occurs, and the contamination of the stored product occurs, the flow rate of the purge gas supplied to the container is measured, and the purification abnormality is detected (refer to, for example, the patent document). 1). In Patent Document 1, the flow rate of the purge gas supplied to the inside of the container is measured by a sensor, and it is determined whether or not good purification is performed.
[專利文獻1]日本專利第4670808號說明書 [Patent Document 1] Japanese Patent No. 4670808
如專利文獻1所示,為進行淨化的良否判定,在使用專用的流量測定單元的手法中,構成感測器等單元的零件數變多,不僅構成變得複雜,還有裝置成本上升的問題。此外,在淨化貯藏庫中按每個棚架配置流量測定單元的感測器的構成中,必須要有感測器等的配置空間,有貯藏庫大型化的問題。 As shown in the patent document 1, in order to determine whether or not the purification is performed, the number of components constituting the sensor or the like is increased in the method of using the dedicated flow rate measuring means, which not only complicates the configuration but also increases the cost of the device. . Further, in the configuration of the sensor in which the flow rate measuring unit is disposed for each scaffold in the purification storage, it is necessary to have a space for arranging the sensor or the like, and there is a problem that the storage size is increased.
本發明係鑑於上述情形而完成者,目的在提供可容易且確實地檢測淨化異常,而且可抑制裝置成本上升的淨化裝置、淨化貯藏庫、及淨化異常檢測方法。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a purification apparatus, a purification storage, and a purification abnormality detecting method which can easily and surely detect a purification abnormality and can suppress an increase in the cost of the apparatus.
本發明之淨化裝置係具備有:流量控制裝置,其係控制與容器相連接的配管中的淨化氣體的流量;及判定部,其係根據流量控制裝置的輸出訊號,進行對容器的淨化的良否判定。 The purification apparatus according to the present invention includes: a flow rate control device that controls a flow rate of the purge gas in the pipe connected to the container; and a determination unit that performs the purification of the container based on the output signal of the flow rate control device determination.
此外,亦可具備有報知部,其係報知判定部的判定結果。此外,亦可流量控制裝置係具備有:流量控制閘,其係調整配管中的淨化氣體的流量;及流量計,其係測定流量控制閘中的淨化氣體的流量,輸出表示流量控制閘的狀態或流量計的檢測結果的訊號作為輸出訊號。此外,亦可流量控制裝置係輸出對流量控制閘的施加電壓作 為輸出訊號,判定部係若施加電壓低於預定值時,即判定淨化為不良。此外,亦可判定部係當流量控制閘的開度被設定為預定值時,將流量計的檢測結果與預定值相比較來進行淨化的良否判定。此外,亦可流量控制裝置係按照來自判定部的輸出指令,來輸出輸出訊號。 Further, a notification unit may be provided, which is a result of the determination by the notification unit. Further, the flow control device may include a flow control gate that adjusts a flow rate of the purge gas in the pipe, and a flow meter that measures a flow rate of the purge gas in the flow control gate and outputs a state indicating the flow control gate Or the signal of the flowmeter detection result is used as the output signal. In addition, the flow control device may also output an applied voltage to the flow control gate. In the case of the output signal, the determination unit determines that the purification is defective if the applied voltage is lower than the predetermined value. Further, when the opening degree of the flow rate control gate is set to a predetermined value, the determination unit may determine the quality of the purification by comparing the detection result of the flow meter with a predetermined value. Further, the flow rate control device may output an output signal in accordance with an output command from the determination unit.
此外,本發明之淨化貯藏庫係具備有:上述淨化裝置;及棚架,其係保持藉由該淨化裝置所被淨化的容器。 Further, the purification storage of the present invention is provided with: the above-described purification device; and a scaffold which holds a container which is purified by the purification device.
此外,本發明之淨化異常檢測方法係包含:藉由流量控制裝置,控制與容器相連接的配管中的淨化氣體的流量的步驟;及根據流量控制裝置的輸出訊號,進行對容器之淨化的良否判定的步驟。 Further, the method for detecting an abnormality of purification according to the present invention includes: a step of controlling a flow rate of a purge gas in a pipe connected to a container by a flow rate control device; and a purification of the container according to an output signal of the flow control device The step of the decision.
藉由本發明之淨化裝置,根據控制淨化氣體的流量的流量控制裝置的輸出訊號,判定部進行對容器的淨化的良否判定,因此可抑制被使用在淨化異常檢測的感測器的增加。此外,由於可抑制被使用在淨化異常檢測的感測器的增加,因此可抑制裝置成本上升。 According to the purification apparatus of the present invention, the determination unit performs the determination of whether or not the container is cleaned based on the output signal of the flow rate control device that controls the flow rate of the purge gas. Therefore, the increase in the sensor used for the detection of the purge abnormality can be suppressed. Further, since the increase in the sensor used for the detection of the cleaning abnormality can be suppressed, the increase in the cost of the device can be suppressed.
此外,若為具備有報知判定部的判定結果的報知部者,操作員等可容易判斷淨化的判定結果。此外,若為流量控制裝置具備有:調整配管中的淨化氣體的流量的流量控制閘;及測定流量控制閘中的淨化氣體的流量的流量計,輸出表示流量控制閘的狀態或流量計的檢測結果 的訊號作為輸出訊號者,係可根據流量控制閘的狀態或流量計的檢測結果來進行淨化的良否判定,因此可精度佳地進行良否判定。此外,若為流量控制裝置輸出對流量控制閘的施加電壓作為輸出訊號,判定部係若施加電壓低於預定值時,即判定為淨化不良者,係將表示流量控制閘的狀態的施加電壓與預定值相比較,來判定淨化是否為不良,因此可容易且高精度地進行良否判定。此外,若為判定部係當流量控制閘的開度被設定為預定值時,將流量計的檢測結果與預定值相比較來進行淨化的良否判定者,係藉由將對流量控制閘的開度的流量與預定值相比較,來進行良否判定,因此可容易且高精度地進行良否判定。此外,若為流量控制裝置按照來自判定部的輸出指令來輸出輸出訊號者,係可在任意時序進行淨化的良否判定。 In addition, if the notification unit includes the determination result of the notification determination unit, the operator or the like can easily determine the determination result of the purification. Further, the flow rate control device includes a flow rate control gate that adjusts a flow rate of the purge gas in the pipe, and a flow rate meter that measures a flow rate of the purge gas in the flow rate control gate, and outputs a flow rate control gate or a flow meter detection. result The signal as the output signal can be judged based on the state of the flow control gate or the detection result of the flow meter, so that the quality can be accurately determined. Further, when the flow rate control device outputs an applied voltage to the flow rate control gate as an output signal, the determination unit determines that the purge voltage is poor if the applied voltage is lower than a predetermined value, and the applied voltage indicating the state of the flow control gate is The predetermined value is compared to determine whether or not the purification is defective, so that the quality determination can be easily and accurately performed. Further, when the degree of opening of the flow rate control gate is set to a predetermined value for the determination unit, the quality of the flow rate control gate is controlled by comparing the detection result of the flow rate with the predetermined value to perform the purification. Since the flow rate of the degree is compared with the predetermined value to determine the quality, the quality determination can be easily and accurately performed. Further, if the flow rate control device outputs an output signal in accordance with an output command from the determination unit, the quality of the purification can be determined at any timing.
此外,藉由本發明之淨化貯藏庫,可抑制因淨化裝置的設置而裝置成本變高的情形,而且,可抑制感測器的配置空間增加,因此可防止貯藏庫大型化。 Further, according to the purification storage container of the present invention, it is possible to suppress a situation in which the device cost is increased by the installation of the purification device, and it is possible to suppress an increase in the arrangement space of the sensor, thereby preventing an increase in the size of the storage.
此外,藉由本發明之淨化異常檢測方法,根據控制淨化氣體的流量的流量控制裝置的輸出訊號,進行對容器的淨化的良否判定,因此可容易且確實地檢測淨化的異常。 Further, according to the purification abnormality detecting method of the present invention, the quality of the purification of the container is determined based on the output signal of the flow rate control device that controls the flow rate of the purge gas, so that the abnormality of the purification can be easily and surely detected.
1‧‧‧淨化貯藏庫 1‧‧‧purification storage
2‧‧‧框體 2‧‧‧ frame
2a‧‧‧內部空間 2a‧‧‧Internal space
3‧‧‧保管棚架 3‧‧‧Storage scaffolding
4‧‧‧淨化裝置 4‧‧‧purification device
5‧‧‧堆高式起重機 5‧‧‧Head height crane
6‧‧‧控制裝置 6‧‧‧Control device
7‧‧‧輸入部 7‧‧‧ Input Department
8‧‧‧顯示部 8‧‧‧Display Department
10‧‧‧行走台車 10‧‧‧ Walking trolley
11‧‧‧支持柱 11‧‧‧Support column
12‧‧‧支持台 12‧‧‧Support desk
13‧‧‧移載裝置 13‧‧‧Transfer device
14‧‧‧車輪 14‧‧‧ Wheels
15‧‧‧軌道 15‧‧‧ Track
20‧‧‧銷 20‧‧ ‧ sales
21‧‧‧本體部 21‧‧‧ Body Department
21a‧‧‧開口 21a‧‧‧ Opening
22‧‧‧蓋部 22‧‧‧ 盖部
23‧‧‧凹部 23‧‧‧ recess
24‧‧‧氣體導入口 24‧‧‧ gas inlet
25‧‧‧止回閥 25‧‧‧ check valve
26‧‧‧排氣口 26‧‧‧Exhaust port
27‧‧‧止回閥 27‧‧‧ check valve
28‧‧‧凸緣部 28‧‧‧Flange
30‧‧‧供給噴嘴 30‧‧‧Supply nozzle
31‧‧‧排氣噴嘴 31‧‧‧Exhaust nozzle
32‧‧‧流量控制裝置 32‧‧‧Flow control device
33‧‧‧判定部 33‧‧‧Decision Department
34‧‧‧配管 34‧‧‧Pipe
35‧‧‧配管 35‧‧‧Pipe
36‧‧‧配管 36‧‧‧Pipe
40‧‧‧淨化氣體源 40‧‧‧ Purified gas source
41‧‧‧淨化氣體排氣 41‧‧‧ Purified gas exhaust
50、51‧‧‧連接部 50, 51‧‧‧ Connections
52‧‧‧管路 52‧‧‧pipe
53‧‧‧流量計 53‧‧‧ flowmeter
54‧‧‧流量控制閘 54‧‧‧Flow control gate
55‧‧‧控制電路 55‧‧‧Control circuit
56‧‧‧流量測定部 56‧‧‧Flow Measurement Department
57‧‧‧旁通部 57‧‧‧ Bypass
58‧‧‧層流元件 58‧‧‧ laminar flow components
60、61‧‧‧電阻 60, 61‧‧‧ resistance
62‧‧‧橋式電路 62‧‧‧Bridge Circuit
63‧‧‧放大器 63‧‧‧Amplifier
65‧‧‧電源 65‧‧‧Power supply
66‧‧‧報知部 66‧‧‧Reporting Department
F‧‧‧容器 F‧‧‧ Container
Fa‧‧‧內部 Fa‧‧‧ internal
圖1係顯示具備本實施形態之淨化裝置的淨化貯藏庫 之一例的圖。 Fig. 1 is a view showing a purification storage unit including the purification apparatus of the embodiment. A diagram of an example.
圖2係顯示流量控制裝置之一例的圖。 Fig. 2 is a view showing an example of a flow rate control device.
圖3係顯示進行淨化時的施加電壓的時間變化之一例的圖。 Fig. 3 is a view showing an example of temporal changes in applied voltage when performing purification.
圖4係顯示進行淨化時的流量的檢測值的時間變化之一例的圖。 Fig. 4 is a view showing an example of temporal changes in the detected value of the flow rate at the time of purifying.
圖5係顯示本實施形態之淨化異常檢測方法之一例的流程圖。 Fig. 5 is a flow chart showing an example of the purification abnormality detecting method of the embodiment.
圖6係顯示異常判定方法的變形例的流程圖。 Fig. 6 is a flow chart showing a modification of the abnormality determining method.
圖7係顯示對應圖6的淨化貯藏庫的動作的圖。 Fig. 7 is a view showing the operation corresponding to the purification storage of Fig. 6.
以下一邊參照圖示,一邊說明實施形態。此外,為了在圖示中說明實施形態,將一部分放大或強調記載等適當變更縮尺來表現。在以下各圖中,使用XYZ座標系,說明圖中的方向。在該XYZ座標系中,將鉛直方向設為Z方向,將水平方向設為X方向、Y方向。X方向、Y方向及Z方向的各個係設為圖中箭號方向為+方向,與箭號方向為相反的方向為-方向者來進行說明。 Hereinafter, embodiments will be described with reference to the drawings. In addition, in order to demonstrate the embodiment in the drawing, a part of the scale is enlarged or emphasized, and the scale is appropriately changed and expressed. In the following figures, the direction in the figure is illustrated using the XYZ coordinate system. In the XYZ coordinate system, the vertical direction is the Z direction, and the horizontal direction is the X direction and the Y direction. The respective directions in the X direction, the Y direction, and the Z direction are set such that the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction.
圖1(A)係顯示本實施形態之淨化貯藏庫1之一例的圖,圖1(B)係顯示容器F及淨化裝置4之一例的圖。淨化貯藏庫1係保管收容例如被使用在製造半導體元件的晶圓或光柵等物品的容器F的自動倉庫。容器F係例如FOUP、SMIF Pod、光柵Pod等。 Fig. 1(A) is a view showing an example of the purification storage 1 of the present embodiment, and Fig. 1(B) is a view showing an example of the container F and the purification device 4. The purification storage 1 stores an automatic warehouse that stores, for example, a container F used for manufacturing a wafer or a grating of a semiconductor element. The container F is, for example, a FOUP, a SMIF Pod, a grating Pod, or the like.
如圖1(A)所示,淨化貯藏庫1係具備有:框體2、複數保管棚架3、複數淨化裝置4、作為搬運裝置的堆高式起重機5、控制裝置6、輸入部7、及顯示部8。框體2係具有可相對外部作隔離的內部空間2a。框體2係具備有:在框體2的外部與內部空間2a收授容器F的入出庫埠(未圖示)。複數保管棚架3、複數淨化裝置4、及堆高式起重機5係被配置在框體2的內部空間2a。控制裝置6係控制淨化裝置4及堆高式起重機5。其中,控制淨化裝置4的控制裝置、及控制堆高式起重機5的控制裝置亦可個別設置。 As shown in Fig. 1(A), the purification storage 1 includes a housing 2, a plurality of storage racks 3, a plurality of purification devices 4, a stacking crane 5 as a conveying device, a control device 6, and an input unit 7, And the display unit 8. The frame 2 has an internal space 2a that is separable from the outside. The housing 2 is provided with an inlet/outlet container (not shown) for receiving the container F outside the housing 2 and the internal space 2a. The plurality of storage scaffolding 3, the plurality of purification devices 4, and the stacking crane 5 are disposed in the internal space 2a of the casing 2. The control device 6 controls the purification device 4 and the stacker crane 5. Among them, the control device for controlling the purification device 4 and the control device for controlling the stacker crane 5 may be separately provided.
堆高式起重機5係可朝X方向、Y方向、及Z方向的各方向搬運容器F,例如在入出庫埠與保管棚架3之間、或由保管棚架3對其他保管棚架3搬運容器F。堆高式起重機5係例如具備有:行走台車10、支持柱11、支持台12、及移載裝置13。行走台車10係具有複數車輪14,沿著被設在框體2的底面的軌道15,以水平方向(X方向)移動。 The stacker 5 can transport the container F in the X direction, the Y direction, and the Z direction, for example, between the storage tray and the storage rack 3, or the storage rack 3 can be transported to the other storage rack 3 Container F. The stacker 5 includes, for example, a traveling carriage 10, a support column 11, a support table 12, and a transfer device 13. The traveling vehicle 10 has a plurality of wheels 14 that move in a horizontal direction (X direction) along a rail 15 provided on a bottom surface of the casing 2.
支持柱11係由行走台車10的上面朝鉛直方向(Z方向)延伸設置。支持台12係被支持柱11支持,以可沿著支持柱11朝Z方向滑動的方式而設。移載裝置13係例如具備有:可伸縮的臂部、及可在上面載置容器F的載置部。其中,容器F的搬運亦可為例如把持配備在容器F的上部的凸緣部28(參照圖1(b)),懸掛容器F來進行搬運者、或把持容器F的側面來進行搬運者,來取 代堆高式起重機5。此外,在圖1中係圖示1台堆高式起重機5,惟被配置在框體2內的堆高式起重機5亦可為2台以上。 The support column 11 is extended from the upper surface of the traveling carriage 10 in the vertical direction (Z direction). The support table 12 is supported by the support column 11 so as to be slidable along the support column 11 in the Z direction. The transfer device 13 is provided with, for example, a telescopic arm portion and a mounting portion on which the container F can be placed. In the conveyance of the container F, for example, the flange portion 28 (see FIG. 1(b)) provided in the upper portion of the container F may be gripped, and the container F may be suspended to carry the carrier or the side surface of the container F to be transported. Come to Generation of high-rise cranes 5. In addition, in FIG. 1, one stacker 5 is shown, but the stacker 5 arrange|positioned in the frame 2 may be two or more.
保管棚架3係以高度方向(Z方向)排列複數段來作配置,且以水平方向(X方向)排列複數列來作配置。在複數保管棚架3係可分別載置容器F。如圖1(B)所示,在保管棚架3的上面係設有銷20,被利用在容器F的定位。容器F係在圖1(B)中顯示FOUP之一例,具備有:具有開口21a的箱狀的本體部21、及閉塞開口21a的蓋部22。晶圓等物品係透過開口21a而被收容在容器F的內部Fa。本體部21係在其底面側具備定位用凹部23。凹部23為例如由本體部21的底面的中心以放射狀延伸的溝槽。在該凹部23係進入配備在移載裝置13的載置台的未圖示的銷,進行搬運容器F時的定位。 The storage scaffolding 3 is arranged in a plurality of stages in the height direction (Z direction), and is arranged in a plurality of rows in the horizontal direction (X direction). The container F can be placed on each of the plurality of storage racks 3 . As shown in Fig. 1(B), a pin 20 is attached to the upper surface of the storage rack 3, and is used for positioning of the container F. The container F is an example of a FOUP shown in FIG. 1(B), and includes a box-shaped main body portion 21 having an opening 21a and a lid portion 22 that closes the opening 21a. An article such as a wafer is housed in the interior Fa of the container F through the opening 21a. The main body portion 21 is provided with a positioning recess 23 on the bottom surface side thereof. The recess 23 is, for example, a groove that radially extends from the center of the bottom surface of the body portion 21. The recessed portion 23 enters a pin (not shown) provided on the mounting table of the transfer device 13 to perform positioning when the container F is transported.
保管棚架3係具有:移載裝置13的載置台可朝鉛直方向通行的切口(未圖示)。移載裝置13係將載置台由保管棚架3的上方朝下方通過切口部而移動,藉此在保管棚架3的上面移載容器F。此時,容器F係藉由保管棚架3的銷20被插入在凹部23,相對保管棚架3作定位。本體部21係在底面側具備有:氣體導入口24、止回閥25、排氣口26、及止回閥27。導入口24及排氣口26係分別與本體部21的內部Fa與外部相連通。止回閥25、27係分別被設在導入口24、排氣口26。 The storage scaffolding 3 has a slit (not shown) through which the mounting table of the transfer device 13 can pass in the vertical direction. The transfer device 13 moves the mounting table on the upper surface of the storage rack 3 by moving the mounting table downward from the upper side of the storage rack 3 through the notch portion. At this time, the container F is inserted into the concave portion 23 by the pin 20 of the storage shelving 3, and is positioned relative to the storage shelf 3. The main body portion 21 is provided with a gas introduction port 24, a check valve 25, an exhaust port 26, and a check valve 27 on the bottom surface side. The inlet port 24 and the exhaust port 26 are in communication with the interior Fa of the body portion 21 and the outside, respectively. The check valves 25 and 27 are provided in the inlet port 24 and the exhaust port 26, respectively.
淨化裝置4係具備有:供給噴嘴30、排氣噴 嘴31、流量控制裝置32、及判定部33。供給噴嘴30及排氣噴嘴31係被設在保管棚架3的上面。供給噴嘴30及排氣噴嘴31係當在保管棚架3載置容器F時,以分別與導入口24、排氣口26相連接的方式作配置。容器F的導入口24係當在保管棚架3載置容器F時,透過供給噴嘴30而與配管34相連接,另外透過流量控制裝置32而與淨化氣體源40相連接。排氣噴嘴31係透過配管35而與淨化氣體的排氣路徑(淨化氣體排氣41)相連接。 The purification device 4 is provided with a supply nozzle 30 and an exhaust gas spray The nozzle 31, the flow rate control device 32, and the determination unit 33. The supply nozzle 30 and the exhaust nozzle 31 are provided on the upper surface of the storage rack 3. The supply nozzle 30 and the exhaust nozzle 31 are disposed so as to be connected to the inlet port 24 and the exhaust port 26 when the container rack F is placed on the storage rack 3 . When the container F is placed on the storage rack 3, the inlet port 24 of the container F is connected to the pipe 34 through the supply nozzle 30, and is connected to the purge gas source 40 through the flow rate control device 32. The exhaust nozzle 31 is connected to the exhaust gas path (purified gas exhaust gas 41) of the purge gas through the pipe 35.
淨化氣體源40係供給例如氮氣等相對所收納的物品為惰性的氣體作為淨化氣體。淨化氣體係對應被收容在容器F的物品來作選擇,使用例如對物品的氧化抑制、抑制分子污染等的氣體、或使容器F內的水分減少的氣體等。淨化氣體係使用氮氣或清淨乾燥空氣(CDA)等。淨化氣體源40可為淨化貯藏庫1的一部分,亦可為淨化貯藏庫1的外部的裝置,亦可利用例如配置淨化貯藏庫1的工廠內的設備。 The purge gas source 40 supplies, for example, a gas inert to the stored article such as nitrogen as a purge gas. The purge gas system is selected in accordance with the article accommodated in the container F, and for example, a gas which suppresses oxidation of the article, suppresses molecular contamination, or a gas which reduces water in the container F, or the like is used. The purge gas system uses nitrogen or clean dry air (CDA) or the like. The purge gas source 40 may be a part of the purification storage 1, or may be an apparatus for purifying the exterior of the storage 1, or may be, for example, a facility in the factory in which the storage storage 1 is disposed.
在將容器F淨化時,來自淨化氣體源40的淨化氣體係透過流量控制裝置32及配管34,由容器F的導入口24被供給至內部Fa,且被填充在容器F的內部Fa。此外,內部Fa的氣體係由排氣口26被排出至容器F的外部,透過配管35,藉由淨化氣體排氣41而被排氣至外部。其中,淨化氣體排氣41亦可設置藉由泵等來吸引氣體的裝置。 When the container F is purified, the purge gas system from the purge gas source 40 passes through the flow rate control device 32 and the pipe 34, is supplied to the inside Fa by the introduction port 24 of the container F, and is filled in the interior Fa of the container F. Further, the gas system of the internal Fa is discharged to the outside of the container F through the exhaust port 26, passes through the pipe 35, and is exhausted to the outside by the purge gas exhaust 41. Among them, the purge gas exhaust gas 41 may be provided with a device that attracts a gas by a pump or the like.
流量控制裝置32為例如質流控制器,藉由控 制配管34中的淨化氣體的流量,來控制由淨化氣體源40被供給至供給噴嘴30的淨化氣體的流量。流量控制裝置32係以可進行通訊的方式與控制裝置6相連接,控制裝置6係對流量控制裝置32供給流量的設定值。流量控制裝置32係以使淨化氣體的流量接近設定值的方式進行控制。 The flow control device 32 is, for example, a mass flow controller, controlled by The flow rate of the purge gas in the piping 34 is controlled to control the flow rate of the purge gas supplied to the supply nozzle 30 by the purge gas source 40. The flow rate control device 32 is connected to the control device 6 in a communicable manner, and the control device 6 supplies the flow rate control device 32 with a set value of the flow rate. The flow rate control device 32 controls so that the flow rate of the purge gas approaches a set value.
圖2係顯示流量控制裝置32之一例的圖。流量控制裝置32係具備有:連接部50、51、管路52、流量計53、流量控制閘54、及控制電路55。連接部50、51為例如流體接頭。連接部50係透過配管36而與淨化氣體源40相連接,連接部51係透過配管34而與供給噴嘴30相連接。 FIG. 2 is a view showing an example of the flow rate control device 32. The flow rate control device 32 includes connection portions 50 and 51, a line 52, a flow meter 53, a flow rate control gate 54, and a control circuit 55. The connecting portions 50, 51 are, for example, fluid joints. The connection portion 50 is connected to the purge gas source 40 through the pipe 36, and the connection portion 51 is connected to the supply nozzle 30 through the pipe 34.
管路52係其內部形成為將連接部50及連接部51相連結的流路。管路52係分岔為流量測定部56及旁通部57。流量測定部56為毛細管等,經由流量計53的位置而與旁通部57合流。旁通部57係設有層流元件58,在流量測定部56係流通藉由層流元件58而形成為層流狀的淨化氣體。流量測定部56中的流量與旁通部57中的流量的流量比(分流比)係預先設定,檢測流量測定部56中的流量,藉由使用上述流量比,可測定管路52中的流量。 The conduit 52 is formed as a flow passage that connects the connection portion 50 and the connection portion 51. The line 52 is branched into a flow rate measuring unit 56 and a bypass unit 57. The flow rate measuring unit 56 is a capillary tube or the like and merges with the bypass portion 57 via the position of the flow meter 53. The bypass unit 57 is provided with a laminar flow element 58, and the flow rate measuring unit 56 is configured to flow a purge gas formed into a laminar flow by the laminar flow element 58. The flow rate ratio (split ratio) of the flow rate in the flow rate measuring unit 56 and the flow rate in the bypass unit 57 is set in advance, and the flow rate in the flow rate measuring unit 56 is detected, and the flow rate in the line 52 can be measured by using the flow rate ratio. .
流量控制閘54係在管路52中被設在旁通部57的下游側。流量控制閘54係調整透過管路52而流至連接部50的淨化氣體的流量。流量控制閘54為電磁閥 等,開度(流路剖面積)依施加電壓而改變。流量控制閘54係若例如施加電壓為最小(例如0)時,形成為開度為最小的閉狀態(例如全閉),隨著施加電壓增加,開度變大。流量計53係藉由檢測流量測定部56中的流量,來測定管路52中的流量。流量計53為例如熱式流量計(thermal flowmeter),具備有:設在流量測定部56的電阻60、61、橋式電路62、及放大器63。 The flow rate control gate 54 is provided on the downstream side of the bypass portion 57 in the line 52. The flow rate control gate 54 adjusts the flow rate of the purge gas flowing through the line 52 to the connection portion 50. The flow control gate 54 is a solenoid valve Etc., the opening degree (flow path sectional area) changes depending on the applied voltage. The flow control gate 54 is formed to have a closed state in which the opening degree is the smallest (for example, fully closed) when the applied voltage is the minimum (for example, 0), and the opening degree is increased as the applied voltage is increased. The flow meter 53 measures the flow rate in the line 52 by detecting the flow rate in the flow rate measuring unit 56. The flow meter 53 is, for example, a thermal flow meter, and includes resistors 60 and 61 provided in the flow rate measuring unit 56, a bridge circuit 62, and an amplifier 63.
電阻60、61為自我發熱型電阻體,電阻60係被設在電阻61的上游側。電阻60、61係分別與橋式電路62相連接。若在對電阻60、61供給電力的狀態下,淨化氣體流至流量測定部56時,熱由電阻60被奪取,因此在電阻60、61產生溫度差。橋式電路62係檢測因電阻60、61的溫度差所致之電阻值的差。橋式電路62係與放大器63相連接,將表示電阻60、61的電阻值的差的訊號,亦即對應流量測定部56中的流量的訊號輸出至放大器63。放大器63係將由橋式電路62被輸出的訊號放大。流量計53係例如將流量測定部56中的流量對應流量測定部56與旁通部57的流量比來進行轉換,生成表示管路52中的流量(例如公升/分鐘)的流量訊號。流量計53係將流量訊號輸出至控制電路55。 The resistors 60 and 61 are self-heating resistors, and the resistor 60 is provided on the upstream side of the resistor 61. The resistors 60, 61 are connected to the bridge circuit 62, respectively. When the purge gas flows to the flow rate measuring unit 56 while the electric power is supplied to the resistors 60 and 61, the heat is taken up by the resistor 60, so that a temperature difference occurs between the resistors 60 and 61. The bridge circuit 62 detects the difference in resistance values due to the temperature difference between the resistors 60, 61. The bridge circuit 62 is connected to the amplifier 63, and outputs a signal indicating the difference in resistance between the resistors 60 and 61, that is, a signal corresponding to the flow rate in the flow rate measuring unit 56, to the amplifier 63. The amplifier 63 amplifies the signal output by the bridge circuit 62. The flow rate meter 53 converts the flow rate corresponding to the flow rate measuring unit 56 and the bypass unit 57 by the flow rate measuring unit 56, for example, and generates a flow rate signal indicating the flow rate (for example, liters/minute) in the line 52. The flow meter 53 outputs a flow signal to the control circuit 55.
控制電路55係藉由控制對流量控制閘54的施加電壓,來控制流量控制閘54的開度,且控制管路52中的流量。控制電路55係使用藉由流量計53所得之流量的檢測值,以管路52中的流量接近設定值的方式將流量 控制閘54進行回授控制。例如,控制電路55係若檢測值比流量的設定值還小,以流量增加的方式使對流量控制閘54的施加電壓增加,若檢測值比流量的設定值還大,則以流量減少的方式使對流量控制閘54的施加電壓減少。其中,將流量測定部56中的流量換算成管路52中的流量的換算部可設在控制電路55,亦可為流量計53的一部分。此外,流量計53為例如科里奧利(Coriolis)式流量計、或噴嘴式流量計。 The control circuit 55 controls the opening of the flow control gate 54 by controlling the applied voltage to the flow control gate 54, and controls the flow rate in the line 52. The control circuit 55 uses the detected value of the flow rate obtained by the flow meter 53, and the flow rate in the line 52 approaches the set value. The control gate 54 performs feedback control. For example, the control circuit 55 increases the applied voltage to the flow rate control gate 54 so that the flow rate increases as the detected value is smaller than the set value of the flow rate, and decreases the flow rate when the detected value is larger than the set value of the flow rate. The applied voltage to the flow control gate 54 is reduced. Here, the conversion unit that converts the flow rate in the flow rate measuring unit 56 into the flow rate in the line 52 may be provided in the control circuit 55 or may be a part of the flow meter 53. Further, the flow meter 53 is, for example, a Coriolis type flow meter or a nozzle type flow meter.
流量控制裝置32係藉由來自電源65的電力,提供在流量計53、控制電路55、流量控制閘54等被消耗的電力。例如,流量控制裝置32係包含調整由電源65被供給的電力的電流值或電壓值的電源電路,電力由該電源電路被供給至流量控制裝置32的各部。控制電路55係例如藉由調整由電源電路被供給至流量控制閘54的電力的電壓,來控制流量控制閘54。其中,上述電源電路可設在控制電路55,亦可有別於控制電路55而另外設置。 The flow rate control device 32 supplies electric power consumed by the flow meter 53, the control circuit 55, the flow rate control gate 54, and the like by the electric power from the power source 65. For example, the flow rate control device 32 includes a power supply circuit that adjusts a current value or a voltage value of electric power supplied from the power source 65, and the electric power is supplied from the power supply circuit to each unit of the flow rate control device 32. The control circuit 55 controls the flow rate control gate 54 by, for example, adjusting the voltage of the power supplied to the flow control gate 54 by the power supply circuit. The power supply circuit may be provided in the control circuit 55 or may be separately provided separately from the control circuit 55.
此外,流量控制裝置32係由控制裝置6接受設定有流量的設定值的流量設定訊號,以使流量接近設定值的方式進行控制。此外,流量控制裝置32係由控制裝置6接受動作指令,進行各種動作。動作指令係例如控制流量控制裝置32之接通關斷(ON/OFF)的命令、指定流量控制閘54的狀態(例如開度)的命令、由流量控制裝置32要求各種輸出訊號的輸出的命令等。流量控制裝置 32的輸出訊號係例如表示管路52中的流量的檢測值的流量訊號、表示流量控制閘54的狀態(例如施加電壓、開度)的狀態訊號等。流量控制裝置32係若例如接受到圖求訊號輸出的動作指令時,將輸出訊號輸出至控制裝置6作為對動作指令的響應。 Further, the flow rate control device 32 receives the flow rate setting signal in which the set value of the flow rate is set by the control device 6, and controls the flow rate so as to approach the set value. Further, the flow rate control device 32 receives an operation command from the control device 6, and performs various operations. The operation command is, for example, a command for controlling ON/OFF of the flow control device 32, a command for designating a state of the flow control gate 54 (for example, an opening degree), and a command for requesting output of various output signals by the flow control device 32. Wait. Flow control device The output signal of 32 is, for example, a flow signal indicating a detected value of the flow rate in the line 52, a state signal indicating a state of the flow control gate 54 (for example, an applied voltage, an opening degree), and the like. The flow rate control device 32 outputs an output signal to the control device 6 as a response to the operation command when, for example, an operation command for outputting the signal is received.
在控制裝置6係連接有輸入部7及顯示部8。輸入部7為例如操作面板、觸控面板、鍵盤、滑鼠、軌跡球等。輸入部7係檢測來自操作員的輸入,將所被輸入的資訊供給至控制裝置6。例如,操作員係可藉由操作輸入部7,來設定、變更淨化氣體的流量等。顯示部8為例如液晶顯示器等,顯示由控制裝置6被供給的畫像。例如,控制裝置6係使表示淨化貯藏庫1的動作狀況、各種設定、淨化狀態的畫像等顯示在顯示部8。 The input unit 7 and the display unit 8 are connected to the control device 6. The input unit 7 is, for example, an operation panel, a touch panel, a keyboard, a mouse, a trackball, or the like. The input unit 7 detects an input from an operator and supplies the input information to the control device 6. For example, the operator can set and change the flow rate of the purge gas or the like by operating the input unit 7. The display unit 8 is, for example, a liquid crystal display or the like, and displays an image that is supplied by the control device 6. For example, the control device 6 displays an image indicating the operation state of the purification storage 1 , various settings, and a cleaned state on the display unit 8 .
當容器F被連接在淨化裝置4時,有因容器F與淨化裝置4的位置偏移等,而發生容器F的導入口24與供給噴嘴30的連接不良的可能性。此時,因淨化氣體由導入口24與供給噴嘴30的間隙漏洩,被供給至容器F的內部Fa的淨化氣體會不足,而發生淨化不良。此外,在配管34、35發生堵塞等,或淨化氣體由容器F的蓋部22與本體部21的間隙等漏洩時,亦發生淨化不良。在本實施形態中,使用流量控制裝置32的功能,進行淨化的良否判定。 When the container F is connected to the purification device 4, there is a possibility that the connection between the inlet port 24 of the container F and the supply nozzle 30 is defective due to the positional deviation of the container F and the purification device 4. At this time, since the purge gas leaks from the gap between the introduction port 24 and the supply nozzle 30, the purge gas supplied to the inside Fa of the container F is insufficient, and purification failure occurs. In addition, when the pipes 34 and 35 are clogged or the like, or the purge gas leaks from the gap between the lid portion 22 of the container F and the main body portion 21, the purification failure also occurs. In the present embodiment, the function of the flow rate control device 32 is used to determine whether or not the purification is good.
判定部33係根據流量控制裝置32的輸出訊號,進行對容器F的淨化的良否判定。控制裝置6係使判 定部33的判定結果顯示在顯示部8。顯示部8係作為報知判定部33的判定結果的報知部66來發揮功能。其中,報知部66亦可非為顯示部8,例如可藉由LED等光源所發出的光的顏色的變化或亮滅來報知判定結果,亦可藉由聲音等來報知判定結果。此外,判定部33亦可為例如將何時在哪個淨化裝置4有淨化不良等的判定結果留在記錄(log)者,此時,亦可未設置報知部66。 The determination unit 33 determines whether or not the container F is cleaned based on the output signal of the flow rate control device 32. Control device 6 The determination result of the fixed portion 33 is displayed on the display unit 8. The display unit 8 functions as the notification unit 66 that is the determination result of the notification determination unit 33. The notification unit 66 may not be the display unit 8. For example, the determination result may be reported by the change or the brightness of the light emitted by the light source such as an LED, and the determination result may be reported by sound or the like. Further, the determination unit 33 may be, for example, a result of a determination as to whether or not the purification device 4 has a purification failure or the like, and may not be provided with the notification unit 66.
判定部33係根據例如流量控制裝置32所輸出的狀態訊號或流量訊號,進行淨化的良否判定。例如流量控制裝置32係輸出表示對流量控制閘54的施加電壓的訊號,作為狀態訊號,判定部33係藉由該施加電壓與預定值(臨限值)的比較,進行良否判定。此時,控制裝置6係將要求流量控制閘54的施加電壓的輸出的命令傳送至流量控制裝置32,流量控制裝置32係將表示施加電壓的訊號輸出至控制裝置6,作為對該命令的響應。其中,判定部33亦可有別於控制裝置6而另外形成,來取代形成在控制裝置6。 The determination unit 33 determines whether or not the purification is good or not based on, for example, a status signal or a flow signal output from the flow rate control device 32. For example, the flow rate control device 32 outputs a signal indicating the voltage applied to the flow rate control gate 54 as a status signal, and the determination unit 33 determines whether or not the voltage is compared with a predetermined value (threshold value). At this time, the control device 6 transmits a command requesting the output of the applied voltage of the flow control gate 54 to the flow rate control device 32, and the flow rate control device 32 outputs a signal indicating the applied voltage to the control device 6 as a response to the command. . However, the determination unit 33 may be formed separately from the control device 6 instead of being formed in the control device 6.
圖3(A)~(D)係顯示進行淨化時的施加電壓的時間變化之一例的圖。其中,在圖3(A)~(D)中,忽略比流量控制裝置32更為上游側(淨化氣體源40側)的供給壓力的變動等而概念顯示。圖3(A)係淨化為正常時之例。時刻t0係預定與淨化裝置4相連接的容器F(以下稱為預定連接的容器)被搬運至堆高式起重機5之前的時刻,淨化裝置4係在時刻t0形成為待機狀態。 例如,在時刻t0,流量控制閘係施加電壓為0而形成為閉狀態。 3(A) to 3(D) are diagrams showing an example of temporal changes in applied voltage when performing purification. In the drawings (A) to (D), the fluctuation of the supply pressure on the upstream side (the side of the purge gas source 40) from the flow rate control device 32 is ignored and the concept is displayed. Fig. 3(A) shows an example in which the purification is normal. At time t0, the time before the container F (hereinafter referred to as the container to be connected) connected to the purification device 4 is transported to the stacker 5 is started, and the purification device 4 is placed in the standby state at time t0. For example, at time t0, the flow control gate applies a voltage of 0 to form a closed state.
時刻t1係淨化裝置4開始供給淨化氣體的時刻。時刻t1係例如預定連接的容器F由入出庫埠等開始被搬運的時刻。例如,在時刻t1,控制裝置6係對堆高式起重機5傳送使搬運開始的指令,並且對淨化裝置4傳送使淨化氣體的供給開始的動作指令(命令)。在時刻t1,流量控制裝置32係流量控制閘54的施加電壓成為V1,以設定值的流量的淨化氣體被供給至供給噴嘴30的方式控制淨化氣體的流量。 Time t1 is the time at which the purification device 4 starts supplying the purge gas. The time t1 is, for example, the time at which the container F that is to be connected is started to be transported by the entrance or exit. For example, at time t1, the control device 6 transmits a command to start the conveyance to the stacker crane 5, and transmits an operation command (command) for starting the supply of the purge gas to the purification device 4. At the time t1, the flow rate control device 32 sets the applied voltage of the flow rate control gate 54 to V1, and controls the flow rate of the purge gas so that the purge gas of the flow rate of the set value is supplied to the supply nozzle 30.
時刻t2係容器F被連接在淨化裝置4的時刻。在時刻t2,因淨化氣體由供給噴嘴30流入至容器F的內部Fa時的壓力損失,流量會減少,因此流量控制裝置32係使對流量控制閘54的施加電壓增加至V2,且加大流量控制閘54的開度來對應。此外,在時刻t2之後,容器F的內壓伴隨淨化氣體的填充而上升,流量控制裝置32係以補充因容器F的內壓上升所致之流量減少的方式,使對流量控制閘54的施加電壓逐漸增加。時刻t3係在容器F充滿淨化氣體的時刻,在時刻t3之後,因對容器F的淨化氣體的流入量與排出量相稱,施加電壓在V3呈安定。 The time t2 is the time at which the container F is connected to the purification device 4. At the time t2, the flow rate is reduced by the pressure loss when the purge gas flows into the interior Fa of the container F from the supply nozzle 30, so that the flow rate control device 32 increases the applied voltage to the flow control gate 54 to V2, and increases the flow rate. The opening of the control gate 54 is corresponding. Further, after time t2, the internal pressure of the container F rises with the filling of the purge gas, and the flow rate control device 32 applies the flow rate control gate 54 so as to compensate for the decrease in the flow rate due to the increase in the internal pressure of the container F. The voltage gradually increases. At time t3, when the container F is filled with the purge gas, after the time t3, the inflow amount of the purge gas to the container F is proportional to the discharge amount, and the applied voltage is stabilized at V3.
圖3(B)係因容器F與淨化裝置4的連接不良,淨化為異常時之例。此時,在容器F與淨化裝置4相連接的時刻t2之後,因淨化氣體由供給噴嘴30漏洩至容 器F的外部,施加電壓係成為未達V2的值(例如V1)。 Fig. 3(B) shows an example in which the cleaning of the container F and the purification device 4 is poor, and the cleaning is abnormal. At this time, after the time t2 at which the container F is connected to the purification device 4, the purge gas leaks from the supply nozzle 30 to the volume. Outside the device F, the applied voltage is a value that does not reach V2 (for example, V1).
圖3(C)係在流量控制裝置32與供給噴嘴30之間的配管34等發生堵塞等,淨化為異常時之例。此時,由流量控制裝置32開始供給淨化氣體的時刻t1,由於淨化氣體難以流動,因此施加電壓係成為例如比V3為更高的V4。此外,即使在流量控制裝置32與淨化氣體源40之間的配管36發生堵塞的情形下,亦由於對流量控制裝置32的流入量不足,因此成為相同。 (C) is an example in which the piping 34 or the like between the flow rate control device 32 and the supply nozzle 30 is clogged or the like, and the cleaning is abnormal. At this time, since the flow rate control device 32 starts the supply of the purge gas at time t1, since the purge gas is difficult to flow, the applied voltage is, for example, V4 higher than V3. Further, even when the piping 36 between the flow rate control device 32 and the purge gas source 40 is clogged, the amount of inflow to the flow rate control device 32 is insufficient, and therefore the same.
圖3(D)係在容器F的排氣側的配管35等發生堵塞等,淨化為異常時之例。此時,關於至淨化氣體充滿容器F為止的時刻t3為止,與淨化為正常(參照圖3(A))的情形相同,但是在時刻t3之後,因淨化氣體難以由容器F被排出,容器F的內壓上升,且施加電壓上升。 (D) is an example in which the piping 35 or the like on the exhaust side of the container F is clogged or the like, and the cleaning is abnormal. At this time, the time t3 until the purge gas is filled in the container F is the same as the case where the purification is normal (see FIG. 3(A)), but after the time t3, the purge gas is difficult to be discharged from the container F, and the container F The internal pressure rises and the applied voltage rises.
判定部33係藉由如上所述之施加電壓的變化,進行淨化是否為正常的判定(淨化的良否判定)。例如,判定部33係在時刻t2之後,若施加電壓為未達預定值,即判定出淨化為異常(不良)。該預定值係例如被設定為大於V1、小於V2的電壓。此時,判定部33係可判定為正常的淨化(參照圖3(A))、或為異常的淨化(參照圖3(B))。如上所示,判定部33係可判定對容器F的淨化氣體供給異常。 The determination unit 33 determines whether or not the purification is normal (the determination of the quality of the purification) by the change in the applied voltage as described above. For example, the determination unit 33 determines that the purge is abnormal (bad) if the applied voltage is less than the predetermined value after the time t2. The predetermined value is, for example, set to a voltage greater than V1 and less than V2. At this time, the determination unit 33 can determine that the normal purification (see FIG. 3(A)) or the abnormal purification (see FIG. 3(B)). As described above, the determination unit 33 can determine that the purge gas supply to the container F is abnormal.
判定部33進行判定的時刻係例如在容器F的搬運從開始起至完成的時間加上裕度(margin)而設定。 例如,若容器F的搬運所需時間為30秒、裕度為30秒時,判定部33係使用從搬運被開始起1分鐘後的施加電壓,進行良否判定。其中,判定部33亦可若相對超出V3的臨限值,時刻t3之後的施加電壓為超出預定值,即判定出淨化為異常(不良)。此時,判定部33係可判定為正常的淨化、或為圖3(C)或圖3(D)的異常的淨化。 The timing at which the determination unit 33 performs the determination is set, for example, by adding a margin to the time from the start to the completion of the conveyance of the container F. For example, when the time required for the conveyance of the container F is 30 seconds and the margin is 30 seconds, the determination unit 33 uses the applied voltage one minute after the start of the conveyance to determine the quality. However, the determination unit 33 may determine that the purge is abnormal (defective) if the applied voltage after the time t3 exceeds a predetermined value if the threshold value of V3 is relatively exceeded. At this time, the determination unit 33 can determine that the cleaning is normal or the cleaning of the abnormality of FIG. 3(C) or FIG. 3(D).
其中,判定部33亦可使用2種類以上的預定值,來進行淨化的判定(異常檢測)。例如,判定部33係將大於V1、小於V2的預定值、與時刻t2之後的施加電壓相比較,檢測如圖3(B)所示之淨化異常,而且將大於V3的預定值、與時刻t3之後的施加電壓相比較,來檢測如圖3(C)、圖3(D)所示之淨化異常。 In addition, the determination unit 33 may perform the determination (abnormality detection) of the purification using two or more predetermined values. For example, the determination unit 33 compares the predetermined value greater than V1 and smaller than V2 with the applied voltage after the time t2, detects a purification abnormality as shown in FIG. 3(B), and sets a predetermined value greater than V3 with the time t3. The subsequent applied voltages are compared to detect the purification abnormalities as shown in Figs. 3(C) and 3(D).
此外,判定部33亦可將流量計53的檢測結果與預定值相比較,進行良否判定。此時,控制裝置6係對流量控制裝置32傳送要求將流量控制閘54的開度固定為預定值的命令。此外,控制裝置6係對流量控制裝置32傳送要求藉由流量計53所得之流量的檢測值的輸出的命令,流量控制裝置32係將表示流量的檢測值的流量訊號輸出至控制裝置6,作為對該命令的響應。 Further, the determination unit 33 may compare the detection result of the flow meter 53 with a predetermined value to determine the quality. At this time, the control device 6 transmits a command to the flow rate control device 32 to fix the opening degree of the flow rate control gate 54 to a predetermined value. Further, the control device 6 transmits a command for outputting the detected value of the flow rate obtained by the flow meter 53 to the flow rate control device 32, and the flow rate control device 32 outputs a flow rate signal indicating the detected value of the flow rate to the control device 6, as The response to the command.
圖4(A)~(D)係顯示進行淨化時的流量的檢測值的時間變化之一例的圖。其中,在圖4(A)~(D)中,忽視比流量控制裝置32更為上游側(淨化氣體源40側)中的供給壓力的變動等而以概念顯示。圖4(A)係淨化為正常時(對應圖3(A))之例。流量係在 時刻t0的待機狀態例如為0,在時刻t1,若藉由流量控制裝置32所為之淨化氣體的供給被開始,即成為Q3。此外,流量係在時刻t2,若容器F與供給噴嘴30相連接,即因壓力損失而減少至Q2。此外,在時刻t2之後,由於因填充淨化氣體所致之容器F的內壓上升,流量會減少。此外,流量在充滿淨化氣體的時刻t3之後,在Q1呈安定。 4(A) to 4(D) are diagrams showing an example of temporal changes in the detected value of the flow rate at the time of purifying. In the case of FIG. 4 (A) to (D), the fluctuation of the supply pressure in the upstream side (the purge gas source 40 side) of the flow rate control device 32 is ignored, and the concept is displayed. Fig. 4(A) shows an example in which the purification is normal (corresponding to Fig. 3(A)). Traffic is in The standby state at time t0 is, for example, 0. At time t1, when the supply of the purge gas by the flow rate control device 32 is started, it becomes Q3. Further, the flow rate is at time t2, and if the container F is connected to the supply nozzle 30, it is reduced to Q2 due to pressure loss. Further, after the time t2, since the internal pressure of the container F due to the filling of the purge gas rises, the flow rate is reduced. Further, the flow rate is stabilized at Q1 after time t3 when the purge gas is full.
圖4(B)係因容器F與淨化裝置4的連接不良,淨化為異常時(對應圖3(B))之例。此時,流量係在時刻t2(容器F與淨化裝置4相連接時)之後,亦因淨化氣體漏洩,而成為比Q2為更多的值(例如Q3)。 Fig. 4(B) shows an example in which the connection between the container F and the purification device 4 is poor and the cleaning is abnormal (corresponding to Fig. 3(B)). At this time, after the flow rate is at time t2 (when the container F is connected to the purification device 4), the purge gas leaks more than Q2 (for example, Q3).
圖4(C)係在流量控制裝置32與供給噴嘴30之間的配管34等發生堵塞等,淨化為異常時(對應圖3(C))之例。此時,由時刻t1,由於淨化氣體因堵塞而不易流動,因此成為比Q3為更低的值(例如0)。 FIG. 4(C) shows an example in which the piping 34 or the like between the flow rate control device 32 and the supply nozzle 30 is clogged or the like, and the cleaning is abnormal (corresponding to FIG. 3(C)). At this time, since the purge gas does not easily flow due to clogging at time t1, it is a value lower than Q3 (for example, 0).
圖4(D)係在容器F的排氣側的配管35等發生堵塞等,淨化為異常時(對應圖3(D))之例。此時,關於至淨化氣體充滿容器F為止的時刻t3為止,與淨化為正常(參照圖4(A))時為相同,但是在時刻t3之後,因淨化氣體難以由容器F被排出,流量會減少。 Fig. 4(D) shows an example in which the piping 35 or the like on the exhaust side of the container F is clogged or the like, and the cleaning is abnormal (corresponding to Fig. 3(D)). At this time, the time t3 until the purge gas is filled in the container F is the same as when the purge is normal (see FIG. 4(A)). However, after the time t3, the purge gas is hard to be discharged from the container F, and the flow rate is high. cut back.
判定部33係依如上所述之流量的檢測值的變化,進行淨化是否為正常的判定(淨化的良否判定)。例如,判定部33係在時刻t2之後,若流量的檢測值超出預定值,即判定淨化為異常(不良)。該預定值係被設定為 例如大於Q1、小於Q2的流量。此時,判定部33係可判定為正常的淨化(參照圖4(A))、或為異常的淨化(參照圖4(B))。 The determination unit 33 determines whether or not the purification is normal (the determination of the quality of the purification) based on the change in the detected value of the flow rate as described above. For example, the determination unit 33 determines that the purge is abnormal (bad) if the detected value of the flow rate exceeds a predetermined value after time t2. The predetermined value is set to For example, traffic greater than Q1 and less than Q2. At this time, the determination unit 33 can determine that it is normal purification (see FIG. 4(A)) or abnormal cleaning (see FIG. 4(B)).
其中,判定部33係相對小於Q1的預定值,若時刻t3之後的流量小於預定值,亦可判定淨化為異常(不良)。此時,判定部33係可判定為正常的淨化、或為圖4(C)或圖4(D)的異常的淨化。其中,預定值係與使用施加電壓的情形同樣地,可為1種類,亦可為2種類以上。 However, the determination unit 33 is relatively smaller than the predetermined value of Q1, and if the flow rate after the time t3 is smaller than the predetermined value, it can be determined that the purification is abnormal (bad). At this time, the determination unit 33 can determine that the cleaning is normal or the cleaning of the abnormality of FIG. 4(C) or FIG. 4(D). However, the predetermined value may be one type or two or more types as in the case of using the applied voltage.
其中,使用在良否判定的參數(例如施加電壓、流量的檢測值)係有受到比流量控制裝置32更為上游側的壓力變動的影響的情形。例如,若在複數淨化裝置4,淨化氣體的供給系統為共通時,對流量控制裝置32的供給壓力會依其他淨化裝置4的動作狀況(運轉台數)而變動,其結果,有施加電壓改變的情形。此時,例如亦可預先準備因應淨化裝置4的運轉狀況的複數種類的預定值,依進行良否判定時的運轉狀況,來切換預定值。此外,亦可在流量控制閘54的上游側設置壓力調整閘,抑制比流量控制閘54更為上游側中的壓力變動。 However, the parameter (for example, the applied voltage and the detected value of the flow rate) used for the determination of the quality is affected by the pressure fluctuation on the upstream side of the flow rate control device 32. For example, when the supply system of the purge gas is common to the plurality of purification devices 4, the supply pressure to the flow rate control device 32 varies depending on the operation state (the number of operation units) of the other purification devices 4, and as a result, the applied voltage changes. The situation. In this case, for example, a predetermined number of predetermined values in response to the operation state of the purification device 4 may be prepared in advance, and the predetermined value may be switched in accordance with the operation state at the time of the determination of the quality. Further, a pressure adjustment gate may be provided on the upstream side of the flow rate control gate 54, and the pressure fluctuation in the upstream side of the flow rate control gate 54 may be suppressed.
圖5(A)係顯示本實施形態之淨化異常檢測方法之一例的流程圖。如圖5(A)所示,在步驟S1中,控制裝置6係使淨化裝置4開始供給淨化氣體。接著,在步驟S2中,流量控制裝置32係控制淨化氣體的流量。接著,在步驟S3中,首先,控制裝置6係對流量控制裝置 32傳送要求輸出訊號的命令。流量控制裝置32對控制裝置6輸出輸出訊號,藉此,判定部33係取得流量控制裝置32的輸出訊號。接著,在步驟S4中,判定部33係藉由在圖3或圖4中所說明的手法,根據輸出訊號,進行淨化的良否判定。接著,在步驟S5中,報知部66係藉由例如顯示判定結果,來報知良否判定的結果。 Fig. 5(A) is a flowchart showing an example of the purification abnormality detecting method of the embodiment. As shown in FIG. 5(A), in step S1, the control device 6 causes the purification device 4 to start supplying the purge gas. Next, in step S2, the flow rate control device 32 controls the flow rate of the purge gas. Next, in step S3, first, the control device 6 is paired with the flow control device. 32 transmits a command requesting an output signal. The flow rate control device 32 outputs an output signal to the control device 6, whereby the determination unit 33 acquires the output signal of the flow rate control device 32. Next, in step S4, the determination unit 33 determines whether or not the purification is based on the output signal by the method described in FIG. 3 or FIG. Next, in step S5, the notification unit 66 reports the result of the determination of the result of the determination by, for example, displaying the determination result.
圖5(B)係顯示淨化異常檢測方法的變形例的流程圖。在圖5(B)中,步驟S10的處理係接續圖5(A)所示之步驟S1~S3的處理。在步驟S10中,判定部33係與例如圖5(A)的步驟S4同樣地,判定淨化是否為正常(進行良否判定)。若判定部33判定出淨化非為正常(步驟S10;No),在步驟S5中,報知部66係報知判定結果。此外,若判定部33判定出淨化為正常(步驟S10;Yes),報知部66無須報知判定結果,即結束一連串處理。如上所示,報知部66亦可僅在被判定出淨化非為正常(異常、不良)時,報知判定結果。 Fig. 5(B) is a flowchart showing a modification of the purification abnormality detecting method. In FIG. 5(B), the processing of step S10 is followed by the processing of steps S1 to S3 shown in FIG. 5(A). In the step S10, the determination unit 33 determines whether or not the purification is normal (determination of the quality or not), similarly to, for example, step S4 of FIG. 5(A). When the determination unit 33 determines that the purification is not normal (step S10; No), the notification unit 66 notifies the determination result in step S5. Further, when the determination unit 33 determines that the purification is normal (step S10; Yes), the notification unit 66 does not need to report the determination result, that is, ends the series of processing. As described above, the notification unit 66 may notify the determination result only when it is determined that the purification is not normal (abnormal or defective).
圖6係顯示淨化異常檢測方法之其他變形例的流程圖,圖7係顯示對應圖6的淨化貯藏庫1的動作的圖。一邊適當參照圖7,一邊說明圖6的流程圖。其中,在圖7中,符號Fx係表示被判定出淨化為異常時的容器F。在圖6中,步驟S20的處理係接續圖5(A)所示之步驟S1~S3的處理。在步驟S20中,判定部33係與例如圖5(A)的步驟S4同樣地,判定淨化是否為正常。控制裝置6係若判定部33判定出淨化為正常(步驟S20; Yes),即結束一連串處理。 Fig. 6 is a flowchart showing another modification of the purification abnormality detecting method, and Fig. 7 is a view showing the operation corresponding to the purification storage 1 of Fig. 6. The flowchart of Fig. 6 will be described with reference to Fig. 7 as appropriate. In FIG. 7, the symbol Fx indicates the container F when it is determined that the purification is abnormal. In Fig. 6, the processing of step S20 is followed by the processing of steps S1 to S3 shown in Fig. 5(A). In step S20, the determination unit 33 determines whether or not the purification is normal, similarly to, for example, step S4 of FIG. 5(A). The control device 6 determines that the purification is normal if the determination unit 33 (step S20; Yes), that is, a series of processing ends.
控制裝置6係若判定部33判定出淨化非為正常時(步驟S20;No),在步驟S21中,藉由堆高式起重機5,將容器F與淨化裝置4再連接。如圖7所示,堆高式起重機5係將容器Fx由保管棚架3上舉,且再度載置在該保管棚架3。接著,在步驟S22中,控制裝置6係在容器Fx與淨化裝置4再連接之後,藉由淨化裝置4,對容器Fx進行淨化。接著,在步驟S23中,判定部33係與例如圖5(A)的步驟S4同樣地,判定步驟S22的淨化是否為正常。控制裝置6係若判定部33判定出淨化為正常時(步驟S23;Yes),即結束一連串處理。 When the determination unit 33 determines that the purification is not normal (step S20; No), the control device 6 reconnects the container F and the purification device 4 by the stacking crane 5 in step S21. As shown in Fig. 7, the stacker crane 5 lifts the container Fx from the storage rack 3 and places it on the storage rack 3 again. Next, in step S22, after the container Fx is reconnected to the purification device 4, the control device 6 purifies the container Fx by the purification device 4. Next, in step S23, the determination unit 33 determines whether or not the purification in step S22 is normal, similarly to, for example, step S4 in Fig. 5(A). When the determination unit 33 determines that the purification is normal (step S23; Yes), the control unit 6 ends the series of processes.
控制裝置6係若判定部33判定出淨化非為正常時(步驟S23;No),在步驟S24中,判斷重試(步驟S21~S23的處理)是否至規定次數結束。控制裝置6係若判斷出重試(retry)至規定次數未結束時(步驟S24;No),再次進行步驟S21~步驟S23的處理。此外,控制裝置6係若判定出重試至規定次數結束時(步驟S24;Yes),在步驟S5中,使報知部66報知良否判定的結果,且結束一連串處理。 When the determination unit 33 determines that the purification is not normal (step S23; No), the control unit 6 determines whether or not the retry (the processing of steps S21 to S23) is completed a predetermined number of times in step S24. When the control device 6 determines that the retry has not been completed until the predetermined number of times has elapsed (step S24; No), the processing of steps S21 to S23 is performed again. When the control device 6 determines that the retry has been completed until the predetermined number of times has elapsed (step S24; Yes), the notification unit 66 is notified of the result of the quality determination in step S5, and the series of processes is terminated.
其中,淨化裝置4係如圖1所示,係按每個保管棚架3而設,但是亦可未設在一部分保管棚架3。例如,淨化裝置4係可在以X方向或Z方向排列的複數保管棚架3(1段保管棚架群)之中,設為1個,亦可設為2個以上。若為不具淨化裝置4的保管棚架3,堆高式起 重機5亦可在具有淨化裝置4的保管棚架3載置容器F,且將藉由該淨化裝置4被施行淨化後的容器F,載置於不具淨化裝置4的保管棚架3。此外,淨化裝置4亦可設在保管棚架3以外。 Among them, the purification device 4 is provided for each storage shelf 3 as shown in FIG. 1, but may not be provided in a part of the storage shelf 3. For example, the plurality of storage racks 3 (one-stage storage racks) arranged in the X direction or the Z direction may be one or two or more. If the storage rack 3 does not have the purification device 4, the stacking height is The heavy machine 5 can also mount the container F on the storage rack 3 having the purification device 4, and place the container F purified by the purification device 4 on the storage rack 3 without the purification device 4. Further, the purification device 4 may be provided outside the storage rack 3 .
其中,容器F亦可在導入口24與排氣口26的至少一方未具有止回閥。例如,亦可在導入口24設置過濾器來取代止回閥25。此時,當容器F與淨化裝置4相連接時,因在過濾器的壓力損失,流量發生變化,可使用因應該流量變化的流量控制閘54的施加電壓、或藉由流量計53所得之流量的檢測值等,進行良否判定。 However, the container F may not have a check valve in at least one of the inlet port 24 and the exhaust port 26. For example, a filter may be provided at the inlet port 24 instead of the check valve 25. At this time, when the container F is connected to the purification device 4, the flow rate changes due to the pressure loss of the filter, and the applied voltage of the flow control gate 54 due to the flow rate change or the flow rate obtained by the flow meter 53 can be used. The detection value, etc., is judged whether it is good or not.
其中,流量控制裝置32亦可為若施加電壓為最小時,流量控制閘54形成為全開狀態,隨著施加電壓增加,流量控制閘54的開度減少者。此時,將被使用在良否判定的預定值,依施加電壓的變化變更。此外,流量控制裝置32可為控制電路55輸出各種輸出訊號者,亦可為由有別於控制電路55的其他構成要素而進行輸出者。例如,流量控制裝置32亦可為流量計53輸出流量訊號者。 However, the flow rate control device 32 may be such that when the applied voltage is minimum, the flow rate control gate 54 is formed in a fully open state, and as the applied voltage increases, the opening degree of the flow rate control gate 54 decreases. At this time, the predetermined value used for the determination of the quality is changed according to the change in the applied voltage. Further, the flow rate control device 32 may output various output signals to the control circuit 55, or may be outputted by other components different from the control circuit 55. For example, the flow control device 32 can also output a flow signal to the flow meter 53.
以上說明本發明之實施形態,惟本發明之技術範圍並非限定於上述實施形態或變形例。此外,在上述實施形態或變形例中所說明的要件係可作適當組合。 The embodiment of the present invention has been described above, but the technical scope of the present invention is not limited to the above embodiment or modification. Further, the elements described in the above embodiment or modification can be combined as appropriate.
1‧‧‧淨化貯藏庫 1‧‧‧purification storage
2‧‧‧框體 2‧‧‧ frame
2a‧‧‧內部空間 2a‧‧‧Internal space
3‧‧‧保管棚架 3‧‧‧Storage scaffolding
4‧‧‧淨化裝置 4‧‧‧purification device
5‧‧‧堆高式起重機 5‧‧‧Head height crane
6‧‧‧控制裝置 6‧‧‧Control device
7‧‧‧輸入部 7‧‧‧ Input Department
8‧‧‧顯示部 8‧‧‧Display Department
10‧‧‧行走台車 10‧‧‧ Walking trolley
11‧‧‧支持柱 11‧‧‧Support column
12‧‧‧支持台 12‧‧‧Support desk
13‧‧‧移載裝置 13‧‧‧Transfer device
14‧‧‧車輪 14‧‧‧ Wheels
15‧‧‧軌道 15‧‧‧ Track
20‧‧‧銷 20‧‧ ‧ sales
21‧‧‧本體部 21‧‧‧ Body Department
21a‧‧‧開口 21a‧‧‧ Opening
22‧‧‧蓋部 22‧‧‧ 盖部
23‧‧‧凹部 23‧‧‧ recess
24‧‧‧氣體導入口 24‧‧‧ gas inlet
25‧‧‧止回閥 25‧‧‧ check valve
26‧‧‧排氣口 26‧‧‧Exhaust port
27‧‧‧止回閥 27‧‧‧ check valve
28‧‧‧凸緣部 28‧‧‧Flange
30‧‧‧供給噴嘴 30‧‧‧Supply nozzle
31‧‧‧排氣噴嘴 31‧‧‧Exhaust nozzle
32‧‧‧流量控制裝置 32‧‧‧Flow control device
33‧‧‧判定部 33‧‧‧Decision Department
34‧‧‧配管 34‧‧‧Pipe
35‧‧‧配管 35‧‧‧Pipe
36‧‧‧配管 36‧‧‧Pipe
40‧‧‧淨化氣體源 40‧‧‧ Purified gas source
41‧‧‧淨化氣體排氣 41‧‧‧ Purified gas exhaust
66‧‧‧報知部 66‧‧‧Reporting Department
F‧‧‧容器 F‧‧‧ Container
Fa‧‧‧內部 Fa‧‧‧ internal
Claims (8)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015025128 | 2015-02-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201630103A true TW201630103A (en) | 2016-08-16 |
Family
ID=56615613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105103581A TW201630103A (en) | 2015-02-12 | 2016-02-03 | Purge device, purge stocker, and purge abnormality detection method |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW201630103A (en) |
WO (1) | WO2016129170A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107808844A (en) * | 2016-09-09 | 2018-03-16 | 株式会社大福 | Container accommodates equipment |
TWI726146B (en) * | 2016-09-09 | 2021-05-01 | 日商大福股份有限公司 | Article storage facility |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6614174B2 (en) * | 2017-02-08 | 2019-12-04 | 株式会社ダイフク | Flow measurement system |
JP2024040529A (en) * | 2021-01-21 | 2024-03-26 | 村田機械株式会社 | Purge device and conveyance system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06102068A (en) * | 1992-09-18 | 1994-04-12 | Hitachi Ltd | Flow rate abnormality checking system |
JP3543532B2 (en) * | 1997-01-30 | 2004-07-14 | 株式会社島津製作所 | Gas chromatograph |
JP2008101842A (en) * | 2006-10-19 | 2008-05-01 | Jfe Steel Kk | Abnormality detecting method of combustion device |
JP6044467B2 (en) * | 2013-06-26 | 2016-12-14 | 株式会社ダイフク | Storage system |
WO2015005192A1 (en) * | 2013-07-09 | 2015-01-15 | 株式会社日立国際電気 | Substrate processing device, gas-purging method, method for manufacturing semiconductor device, and recording medium containing anomaly-processing program |
-
2015
- 2015-12-03 WO PCT/JP2015/084020 patent/WO2016129170A1/en active Application Filing
-
2016
- 2016-02-03 TW TW105103581A patent/TW201630103A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107808844A (en) * | 2016-09-09 | 2018-03-16 | 株式会社大福 | Container accommodates equipment |
TWI726146B (en) * | 2016-09-09 | 2021-05-01 | 日商大福股份有限公司 | Article storage facility |
CN107808844B (en) * | 2016-09-09 | 2023-06-06 | 株式会社大福 | Container accommodating apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2016129170A1 (en) | 2016-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI699847B (en) | Purification device, purification storage and purification method | |
TW201630103A (en) | Purge device, purge stocker, and purge abnormality detection method | |
US10818529B2 (en) | Purge device, purge stocker, and purge method | |
JP6468358B2 (en) | Purge stocker and purge gas supply method in purge stocker | |
JP6217281B2 (en) | Automatic warehouse and gas supply method | |
KR101807822B1 (en) | Purging device and purging method | |
TWI594936B (en) | Measurement unit and purge gas flow measurement method | |
KR102564752B1 (en) | Flow rate measurement system | |
TWI715802B (en) | Flow measuring device and flow measuring system | |
JP2016218603A (en) | Flow control device, purge device, and purge stocker | |
KR20180005792A (en) | System and Method for for measuring density of chemical solution and Measuring method for level of chemical solution using the same | |
KR101708806B1 (en) | Flow meters for foup purging module | |
KR20070053011A (en) | Mass flow controller having a display unit |