TW201628774A - Burr removal device and burr removal method - Google Patents

Burr removal device and burr removal method Download PDF

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Publication number
TW201628774A
TW201628774A TW104136899A TW104136899A TW201628774A TW 201628774 A TW201628774 A TW 201628774A TW 104136899 A TW104136899 A TW 104136899A TW 104136899 A TW104136899 A TW 104136899A TW 201628774 A TW201628774 A TW 201628774A
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abrasive grains
processed articles
workpiece
processed
processing container
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TW104136899A
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Chinese (zh)
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TWI673140B (en
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Kazuyoshi Maeda
Norihito Shibuya
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Sintokogio Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/08Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
    • B24C1/083Deburring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00Abrasive blasting machines or devices; Plants
    • B24C3/18Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions
    • B24C3/26Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions the work being supported by barrel cages, i.e. tumblers; Gimbal mountings therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00Abrasive blasting machines or devices; Plants
    • B24C3/32Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00Devices or accessories for generating abrasive blasts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C9/00Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C9/00Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
    • B24C9/003Removing abrasive powder out of the blasting machine

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A burr removal method including: a step in which a burr removal device and a plurality of articles to be processed are prepared, said burr removal device including a processing container and a suction mechanism that generates suction force; a step in which the plurality of articles to be processed are set in the processing container; a step in which the plurality of articles to be processed, which have been set in the processing container, are agitated; and a step in which abrasive grains, released towards the plurality of articles to be processed that are in an agitated state, are accelerated to a prescribed speed by an air current generated by the action of the suction mechanism, the abrasive grains are caused to come in contact with or collide with the plurality of articles to be processed, thereby removing burrs on the plurality of articles to be processed.

Description

去毛刺裝置及毛刺之去除方法 Deburring device and method for removing burrs

本揭示係關於一種將被處理品之毛刺去除之去毛刺裝置及毛刺之去除方法。 The present disclosure relates to a deburring device and a method for removing burrs for removing burrs of a processed article.

電子零件於智慧型電話、平板終端、及隨身聽等較多之電子機器中廣泛應用。尤其近年來,隨著電子機器之小型化,而業者期望更小型之電子零件。 Electronic components are widely used in electronic devices such as smart phones, tablet terminals, and walkmans. In particular, in recent years, with the miniaturization of electronic equipment, the industry has expected smaller electronic parts.

作為該等電子零件,使用將陶瓷或磁性材料等硬脆材料之原料粉末藉由加壓成形法、刮刀法、或射出成形法等而成形之後,燒成而成者。若構成該電子零件之成形體存在毛刺,則例如成為藉由自動安裝機而進行之安裝步驟中之毛刺之缺漏所致之電子機器之性能降低、及毛刺所致之安裝不良等之原因,故而於安裝之前進行毛刺之去除。 As the electronic component, a raw material powder of a hard and brittle material such as ceramic or a magnetic material is molded by a press molding method, a doctor blade method, or an injection molding method, and then fired. When there is a burr in the molded body constituting the electronic component, for example, the performance of the electronic device due to the burr in the mounting step by the automatic mounting machine is degraded, and the mounting failure due to burrs is caused. Remove the burrs before installation.

作為將構成電子零件之成形體之毛刺去除之方法,於專利文獻1中揭示有利用濕式之圓筒研磨方法將毛刺去除之方法。於專利文獻1中揭示有如下方法:將包含原料之漿料成形為片狀而產生生片,利用藉由濕式之圓筒研磨而進行之研磨使將生片切斷所得之生晶片之毛刺去除。濕式之圓筒研磨方法為研磨能力相對較高之研磨方法,故而根據成形體之強度不同而過剩地研磨而對電子零件之尺寸精度產生影響。又,由於必須進行藉由研磨而產生之廢水之處理、及研磨後之成形體之乾燥等,故而製造成本增加。 As a method of removing burrs of a molded body constituting an electronic component, Patent Document 1 discloses a method of removing burrs by a wet cylindrical polishing method. Patent Document 1 discloses a method in which a slurry containing a raw material is formed into a sheet shape to produce a green sheet, and the raw wafer is burred by polishing by wet cylindrical polishing to cut the green sheet. Remove. Since the wet cylindrical polishing method is a polishing method having a relatively high polishing ability, it is excessively polished depending on the strength of the molded body to affect the dimensional accuracy of the electronic component. Further, since the treatment of the waste water generated by the polishing and the drying of the molded body after the polishing are necessary, the manufacturing cost increases.

作為將構成電子零件之成形體之毛刺去除之其他方法,考慮使 用空氣噴擊裝置之方法(例如,專利文獻2之段落0002)。一般而言,空氣噴擊裝置將研磨粒與0.2MPa以上之非常高之壓力之壓縮空氣一起作為氣固兩相流而對工件噴射。因此,於藉由研磨而將如電子零件般之小型之工件之毛刺去除之情形時,藉由該氣固兩相流而工件本身飛散至周圍。又,於使用空氣噴擊裝置之方法中,由於研磨力較上述圓筒研磨方法更強,故而存在根據工件之強度不同而產生破裂、及缺漏等缺陷之虞。 As another method of removing the burrs of the molded body constituting the electronic component, it is considered A method of squirting a device with air (for example, paragraph 0002 of Patent Document 2). In general, the air blasting device sprays the abrasive grains together with the compressed air of a very high pressure of 0.2 MPa or more as a gas-solid two-phase flow. Therefore, in the case where the burr of a small workpiece such as an electronic component is removed by grinding, the workpiece itself is scattered to the surroundings by the gas-solid two-phase flow. Further, in the method using the air blasting device, since the polishing force is stronger than the above-described cylindrical polishing method, there are defects such as cracking and missing defects depending on the strength of the workpiece.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

專利文獻1:日本專利特開2008-227314號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-227314

專利文獻2:日本專利特開2010-188470號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-188470

於本技術領域中,業者期望一種將被處理品之毛刺去除之新的去毛刺裝置及毛刺之去除方法。 In the art, a new deburring device and a method for removing burrs for removing burrs of a processed article are desired.

於本發明之一態樣中,提供一種將被處理品之毛刺去除之毛刺之去除方法。該毛刺之去除方法包含下述(1)~(4)之步驟。 In one aspect of the invention, a method of removing burrs for removing burrs of a treated article is provided. The method for removing the burr includes the following steps (1) to (4).

(1)準備去毛刺裝置及複數個被處理品之步驟,該去毛刺裝置包含加工容器及產生抽吸力之抽吸機構。 (1) A step of preparing a deburring device and a plurality of processed articles, the deburring device comprising a processing container and a suction mechanism for generating a suction force.

(2)將複數個被處理品設置於加工容器之步驟。 (2) A step of placing a plurality of processed articles in a processing container.

(3)對設置於加工容器之複數個被處理品進行攪拌之步驟。 (3) A step of stirring a plurality of processed articles placed in the processing vessel.

(4)利用由抽吸機構之作動產生之氣流,而使朝向被攪拌之狀態之複數個被處理品投入之研磨粒加速至特定之速度,且使研磨粒與複數個被處理品接觸或碰撞而將複數個被處理品之毛刺去除之步驟。 (4) using the airflow generated by the action of the suction mechanism, the abrasive grains input to the plurality of processed articles in the agitated state are accelerated to a specific speed, and the abrasive grains are brought into contact with or collided with the plurality of processed articles. And the step of removing the burrs of the plurality of processed articles.

根據一態樣之毛刺之去除方法,朝向被處理品投入之研磨粒利 用由抽吸機構之作動產生之氣流,而被加速至特定之速度(於一實施形態中,研磨粒與複數個被處理品接觸或碰撞時之研磨粒之速度為5~30m/sec)。藉由該加速,而研磨粒具有適合於將毛刺去除之運動能量,故而於研磨粒與被處理品接觸或碰撞時不會過剩地切削被處理品,而可將毛刺自被處理品去除。此時,設置於加工容器之複數個被處理品被攪拌,故而可將毛刺自所有被處理品均等地去除。再者,此處所言之「研磨粒之投入」,係指僅將研磨粒朝向被處理品無初速度地供給,或者將研磨粒朝向被處理品以非常小之初速度供給,與如噴擊加工裝置般將研磨粒朝向被處理品噴射或投射不同。例如,既可藉由使研磨粒自由掉落而將研磨粒朝向被處理品供給,亦可以不飛散至周圍或不對毛刺之去除處理帶來影響之程度之較弱之風量將研磨粒朝向被處理品供給。 According to the method of removing the burr of one aspect, the abrasive grain invested in the processed product The airflow generated by the action of the suction mechanism is accelerated to a specific speed (in one embodiment, the speed of the abrasive grains when the abrasive grains come into contact with or collide with a plurality of processed articles is 5 to 30 m/sec). By this acceleration, the abrasive grains have kinetic energy suitable for removing the burrs. Therefore, when the abrasive grains come into contact with or collide with the workpiece, the workpiece is not excessively cut, and the burrs can be removed from the workpiece. At this time, since a plurality of processed articles provided in the processing container are stirred, the burrs can be uniformly removed from all the processed articles. In addition, the term "input of the abrasive grains" as used herein means that the abrasive grains are supplied only at an initial velocity toward the workpiece, or the abrasive grains are supplied at a very small initial velocity toward the workpiece, and such as a spray. The processing device sprays or projects the abrasive grains differently toward the workpiece. For example, the abrasive grains may be supplied toward the object to be treated by freely dropping the abrasive grains, or the abrasive grains may be oriented toward the treated air without being scattered to the surroundings or to a degree that does not affect the removal process of the burrs. Product supply.

一實施形態之毛刺之去除方法中,複數個被處理品之各者亦可藉由將原料粉末成形,或將原料粉末成形之後煅燒而獲得。例如,如生晶片般將原料粉末成形之成形體,或將原料粉末成形之後煅燒之成形體,即燒成形成燒結體之前之狀態之成形體與燒結體相比毛刺之強度相對較低。因此,藉由將成形體作為毛刺之去除對象,可良好地去除毛刺。此處,所謂燒成,係指使將原料粒子加壓而成形之成形體加熱,使鄰接之原料粒子接著而使粒子間之間隙減小,而燒結凝固。 In the method for removing burrs according to an embodiment, each of the plurality of processed articles may be obtained by molding the raw material powder or by calcining the raw material powder. For example, a molded body obtained by molding a raw material powder like a green wafer, or a molded body obtained by molding a raw material powder, that is, a molded body in a state before being fired to form a sintered body, has a relatively low burr strength compared with a sintered body. Therefore, the burr can be satisfactorily removed by using the formed body as the object of removing the burr. Here, the term "baking" refers to heating of a molded body formed by pressurizing the raw material particles, and the adjacent raw material particles are subsequently reduced to reduce the gap between the particles, thereby sintering and solidifying.

一實施形態之毛刺之去除方法中,複數個被處理品之各者亦可為由壓粉成形法而成形之陶瓷或磁性材料。被處理品之成形方法並不特別限定,由壓粉成形法而成形之被處理品中,於可成為製品之部分與毛刺部分中,相互鄰接之原料粒子未藉由加熱而接著。因此,可將存在於被處理品之毛刺特別良好地去除。 In the method for removing burrs according to an embodiment, each of the plurality of processed articles may be a ceramic or a magnetic material formed by a powder molding method. The molding method of the article to be treated is not particularly limited, and in the article to be processed which is formed by the powder molding method, the raw material particles adjacent to each other in the portion which can be a product and the burr portion are not heated by heating. Therefore, the burrs existing in the article to be treated can be removed particularly well.

一實施形態之毛刺之去除方法中,於對複數個被處理品進行攪拌之步驟中,亦可藉由使設置於加工容器之複數個被處理品為流動狀 態而對複數個被處理品進行攪拌。被處理品為相對較小之尺寸(例如,一邊為100~1600μm),故而藉由使複數個被處理品為流動狀態進行攪拌,可均等地分散。 In the method for removing burrs according to an embodiment, in the step of stirring a plurality of processed articles, a plurality of processed articles disposed in the processing container may be fluidized. The plurality of processed articles are stirred. Since the object to be treated has a relatively small size (for example, 100 to 1600 μm on one side), it is possible to uniformly disperse a plurality of processed articles by stirring them in a flowing state.

一實施形態之毛刺之去除方法中,加工容器亦可具備加工盤及框體。加工盤亦可具備第一面及第一面之相反側之面即第二面。亦可於加工盤設置有於自第一面朝向第二面之方向貫通加工盤之複數個貫通孔。複數個貫通孔之各者亦可具有能夠供研磨粒通過且無法供複數個被處理品之各者通過之大小。框體亦可於加工盤之第一面中,包圍加工盤之周緣。又,於將複數個被處理品設置於加工容器之步驟中,亦可將複數個被處理品載置於第一面。於該情形時,不損害毛刺去除能力,即可將被處理品設置於加工容器,且良好地攪拌。 In the method for removing burrs according to an embodiment, the processing container may be provided with a processing disk and a frame. The processing disk may also have a second surface opposite to the first side and the first side. The processing disk may be provided with a plurality of through holes penetrating through the processing disk in a direction from the first surface toward the second surface. Each of the plurality of through holes may have a size that allows the abrasive particles to pass therethrough and cannot pass through each of the plurality of processed articles. The frame may also surround the periphery of the processing disk in the first side of the processing disk. Further, in the step of providing a plurality of processed articles in the processing container, a plurality of processed articles may be placed on the first surface. In this case, the processed article can be placed in the processing container without damaging the burr removal ability, and stirred well.

一實施形態之毛刺之去除方法中,加工盤之厚度亦可為30~100μm,加工盤之第一面與框體所成之稜角部亦可被加工為半徑0.5~5.0mm之R面。根據該構成,可抑制被處理品滯留於加工容器之稜角部,或者可抑制夾持於形成加工容器之各構件之間。 In the method for removing the burr according to the embodiment, the thickness of the processing disk may be 30 to 100 μm, and the edge portion formed by the first surface of the processing disk and the frame may be processed into an R surface having a radius of 0.5 to 5.0 mm. According to this configuration, it is possible to suppress the workpiece from remaining in the corner portion of the processing container or to prevent the member from being sandwiched between the members forming the processing container.

一實施形態之毛刺之去除方法中,抽吸機構亦可配置於第二面側。而且,氣流亦可為自第一面朝向第二面之氣流。根據該構成,於被處理品之附近,即加工容器內產生自第一面側朝向第二面側之氣流,故而可藉由該氣流而將被處理品之毛刺良好地去除。 In the method of removing burrs according to an embodiment, the suction mechanism may be disposed on the second surface side. Moreover, the air flow may also be a gas flow from the first side toward the second side. According to this configuration, the airflow from the first surface side toward the second surface side is generated in the vicinity of the workpiece, that is, in the processing container, so that the burr of the workpiece can be favorably removed by the air current.

一實施形態之毛刺之去除方法亦可進而包含回收研磨粒之步驟。於將複數個被處理品之毛刺去除之步驟中,研磨粒亦可自第一面側朝向複數個被處理品投入。於回收研磨粒之步驟中,亦可利用抽吸機構抽吸到達第二面之研磨粒而加以回收。研磨粒、及微粒子(將該等研磨粒及微粒子於以下總稱為「粉塵」)朝向抽吸機構前進,故而可抑制粉塵飛散至進行毛刺之去除之區域以外。微粒子包含產生破裂或缺漏之研磨粒、及藉由毛刺之去除處理而產生之切削粉。 The method of removing burrs of one embodiment may further comprise the step of recovering abrasive particles. In the step of removing the burrs of the plurality of processed articles, the abrasive grains may be supplied from the first surface side toward the plurality of processed articles. In the step of recovering the abrasive grains, the abrasive particles reaching the second surface may be suctioned by a suction mechanism to be recovered. The abrasive grains and the fine particles (the above-mentioned abrasive grains and fine particles are collectively referred to as "dust" in the following) are advanced toward the suction mechanism, so that the dust can be prevented from scattering to the outside of the region where the burrs are removed. The microparticles include abrasive particles that cause cracks or omissions, and cutting powders that are produced by the removal of burrs.

一實施形態之毛刺之去除方法中,每單位時間到達第二面之研磨粒之量相對於每單位時間自第一面側朝向被攪拌之複數個被處理品投入之研磨粒之量之比例(通過比例)亦可為80~95重量%。藉由使通過比例為該範圍,而不妨礙研磨粒之加速,即可抑制使研磨粒與被處理品抵接之頻度為固定以上。因此,研磨粒被良好地加速,能夠將被處理品之毛刺良好地去除。 In the method for removing burrs according to an embodiment, the amount of the abrasive grains reaching the second surface per unit time is proportional to the amount of the abrasive grains which are supplied from the first surface side to the plurality of workpieces to be agitated per unit time ( The ratio can also be 80 to 95% by weight. By setting the passage ratio to this range without impeding the acceleration of the abrasive grains, it is possible to suppress the frequency at which the abrasive grains come into contact with the workpiece to be fixed or more. Therefore, the abrasive grains are favorably accelerated, and the burrs of the workpiece can be removed well.

一實施形態之毛刺之去除方法中,每單位時間自第一面側朝向複數個被處理品投入之研磨粒之體積相對於每單位時間由抽吸機構抽吸之抽吸流量之比例(抽吸比例)亦可為10~50體積%。藉由使抽吸比例為該範圍,而不妨礙研磨粒之加速,即可設為毛刺之去除可充分進行之程度之研磨粒之量。又,藉由使抽吸比例為上述範圍,可藉由抽吸機構而充分抽吸朝向複數個被處理品投入之研磨粒。因此,研磨粒被良好地加速,又能夠使研磨粒及微粒子飛散至周圍之可能性降低。 In the method for removing burrs according to an embodiment, the ratio of the volume of the abrasive grains injected from the first surface side toward the plurality of processed articles per unit time with respect to the suction flow rate sucked by the suction mechanism per unit time (suction The ratio) may also be 10 to 50% by volume. By setting the suction ratio to this range without impeding the acceleration of the abrasive grains, it is possible to set the amount of the abrasive grains to the extent that the removal of the burrs can be sufficiently performed. Further, by setting the suction ratio to the above range, it is possible to sufficiently suck the abrasive grains that are supplied toward the plurality of processed articles by the suction mechanism. Therefore, the abrasive grains are well accelerated, and the possibility that the abrasive grains and the fine particles are scattered to the surroundings is lowered.

一實施形態之毛刺之去除方法中,於對複數個被處理品進行攪拌之步驟中,亦可藉由對複數個被處理品進行攪拌,而毛刺之固著力變弱。藉由被處理品中之毛刺部分與其他被處理品及加工容器接觸,而誘發成為疲勞破壞之起點之裂痕。其結果,能夠使藉由研磨粒而進行之毛刺之去除更容易地進行。 In the method of removing burrs according to an embodiment, in the step of stirring a plurality of processed articles, the squeezing force may be weakened by stirring a plurality of processed articles. When the burr portion of the workpiece is brought into contact with other processed articles and processing containers, cracks which are the starting point of fatigue damage are induced. As a result, the removal of the burrs by the abrasive grains can be performed more easily.

一實施形態之毛刺之去除方法亦可進而包含對氣流進行整流之步驟。於整流步驟中,亦可藉由對氣流進行整流,而控制研磨粒與複數個被處理品接觸或碰撞之態樣。藉由對氣流進行整流,可控制相對於被處理品之研磨粒之行為,變更去毛刺之形態。藉此,可配合被處理品之強度及形態、以及毛刺之去除容易度等而變更研磨粒之行為。 The burr removal method of one embodiment may further comprise the step of rectifying the gas flow. In the rectifying step, the surface of the abrasive particles contacting or colliding with the plurality of processed articles may also be controlled by rectifying the airflow. By rectifying the airflow, it is possible to control the behavior of the abrasive particles with respect to the object to be treated, and to change the shape of the deburring. Thereby, the behavior of the abrasive grains can be changed in accordance with the strength and form of the article to be processed, the ease of removal of the burrs, and the like.

一實施形態之毛刺之去除方法中,於對複數個被處理品進行攪拌之步驟中,亦可藉由使加工容器以特定之角度(一實施形態中為30~70°)傾斜配置,且使該加工容器旋轉(一實施形態中,加工容器之 旋轉速度為臨界旋轉速度之5~50%),而對複數個被處理品進行攪拌。於該情形時,對被處理品附加藉由加工容器之旋轉而產生之離心力與沿著加工盤之重力之分力。藉由控制加工容器之傾斜角度及轉數,可利用該等力使複數個被處理品為流動狀態,並良好地進行攪拌。 In the method for removing burrs according to an embodiment, in the step of stirring a plurality of processed articles, the processing container may be inclined at a specific angle (30 to 70° in one embodiment), and The processing container is rotated (in one embodiment, the processing container The rotation speed is 5 to 50% of the critical rotation speed, and a plurality of processed articles are stirred. In this case, the centrifugal force generated by the rotation of the processing container and the component force of gravity along the processing disk are added to the processed article. By controlling the inclination angle and the number of revolutions of the processing container, it is possible to use these forces to make a plurality of processed articles into a flowing state and to perform a good stirring.

於本發明之另一態樣中,提供用以將被處理品之毛刺去除之去毛刺裝置。該去毛刺裝置具備:加工容器,其用以設置複數個被處理品;攪拌機構,其對設置於加工容器之複數個被處理品進行攪拌;研磨粒供給機構,其朝向藉由攪拌機構而攪拌之狀態之複數個被處理品投入研磨粒;及抽吸機構,其藉由抽吸力而於自研磨粒供給機構朝向加工容器之方向產生氣流。抽吸機構使藉由研磨粒供給機構朝向複數個被處理品投入之研磨粒藉由氣流而加速至特定之速度,且使經加速之研磨粒與複數個被處理品接觸或碰撞,藉此將複數個被處理品之毛刺去除。 In another aspect of the invention, a deburring device for removing burrs of a treated article is provided. The deburring device includes: a processing container for arranging a plurality of processed articles; a stirring mechanism for stirring a plurality of processed articles disposed in the processing container; and an abrasive grain supplying mechanism that is stirred toward the stirring mechanism The plurality of processed articles are loaded into the abrasive grains; and the suction mechanism generates an air flow in a direction from the abrasive grain supply mechanism toward the processing container by the suction force. The suction mechanism accelerates the abrasive grains injected into the plurality of processed articles by the abrasive grain supply mechanism to a specific speed by the air flow, and causes the accelerated abrasive grains to contact or collide with the plurality of processed articles, thereby The burrs of a plurality of processed articles are removed.

根據另一態樣之去毛刺裝置,朝向被處理品投入之研磨粒由藉由抽吸機構之作動而產生之氣流,加速至特定之速度。藉由該加速,到達被處理品之研磨粒具有適合於毛刺之去除之運動能量。因此,於研磨粒與被處理品碰撞或接觸時不會過剩地切削被處理品,可將毛刺自被處理品去除。此時,設置於加工容器之複數個被處理品被攪拌,故而可將毛刺自所有被處理品均等地去除。 According to another aspect of the deburring device, the abrasive grains thrown toward the workpiece are accelerated to a specific speed by the airflow generated by the action of the suction mechanism. By this acceleration, the abrasive grains reaching the object to be treated have kinetic energy suitable for the removal of the burrs. Therefore, when the abrasive grains collide or come into contact with the workpiece, the workpiece is not excessively cut, and the burr can be removed from the workpiece. At this time, since a plurality of processed articles provided in the processing container are stirred, the burrs can be uniformly removed from all the processed articles.

根據本發明之各種態樣及各實施形態,能夠獲得毛刺被良好地去除之被處理品。 According to various aspects and embodiments of the present invention, it is possible to obtain a processed article in which the burr is well removed.

01‧‧‧去毛刺裝置 01‧‧‧Deburring device

10‧‧‧加工容器 10‧‧‧Processing containers

11‧‧‧加工盤 11‧‧‧Processing tray

11a‧‧‧第一面 11a‧‧‧ first side

11b‧‧‧第二面 11b‧‧‧ second side

12‧‧‧框體 12‧‧‧ frame

20‧‧‧攪拌機構 20‧‧‧Agitating mechanism

21‧‧‧保持構件 21‧‧‧ Keeping components

22‧‧‧旋轉機構 22‧‧‧Rotating mechanism

22a‧‧‧馬達 22a‧‧‧Motor

22b‧‧‧旋轉力傳遞構件 22b‧‧‧Rotary force transmission member

30‧‧‧研磨粒供給機構 30‧‧‧Abrasive grain supply mechanism

31‧‧‧貯存槽 31‧‧‧ Storage tank

32‧‧‧搬出部 32‧‧‧ Moving out

32a‧‧‧排出口 32a‧‧‧Export

40‧‧‧抽吸機構 40‧‧‧sucking mechanism

41‧‧‧抽吸部 41‧‧‧Sucking Department

42‧‧‧集塵器 42‧‧‧dust collector

43‧‧‧軟管 43‧‧‧Hose

43a‧‧‧第一軟管 43a‧‧‧First hose

43b‧‧‧第二軟管 43b‧‧‧second hose

50‧‧‧篩選機構 50‧‧‧ screening agency

A‧‧‧加速區域 A‧‧‧ Accelerated area

F(F1、F2、F3)‧‧‧研磨粒之行為 F (F1, F2, F3) ‧ ‧ the behavior of abrasive particles

G‧‧‧研磨粒 G‧‧‧ abrasive grain

S01~S09‧‧‧步驟 S01~S09‧‧‧Steps

W‧‧‧工件 W‧‧‧Workpiece

圖1係用以說明本發明之實施形態中所使用之去毛刺裝置之模式圖。 Fig. 1 is a schematic view for explaining a deburring device used in an embodiment of the present invention.

圖2係用以說明本發明之實施形態中之毛刺之去除之機制之模式圖。 Fig. 2 is a schematic view for explaining the mechanism of removal of burrs in the embodiment of the present invention.

圖3係表示本發明之實施形態中之毛刺之去除步驟之流程圖。 Fig. 3 is a flow chart showing the steps of removing the burrs in the embodiment of the present invention.

參照圖對本發明之去毛刺裝置及毛刺之去除方法之一例進行說明。於以下之說明中,作為工件(被處理品),使用將原料粉末成形而凝固者,即燒成形成燒結體之前之狀態之成形體。於以下之說明中,上下左右之方向只要未特別說明則係指圖中之方向。再者,本發明並不限定於本實施形態之構成,可根據需要適當變更。 An example of the deburring device and the method for removing the burr of the present invention will be described with reference to the drawings. In the following description, as the workpiece (treated product), a molded body in which the raw material powder is molded and solidified, that is, in a state before being sintered to form a sintered body, is used. In the following description, the directions of the up, down, left, and right directions refer to the directions in the drawings unless otherwise specified. Furthermore, the present invention is not limited to the configuration of the embodiment, and can be appropriately changed as needed.

本實施形態中所使用之去毛刺裝置01如圖1所示,具備加工容器10、攪拌機構20、研磨粒供給機構30、抽吸機構40、及篩選機構50。 As shown in FIG. 1, the deburring device 01 used in the present embodiment includes a processing container 10, a stirring mechanism 20, an abrasive grain supply mechanism 30, a suction mechanism 40, and a screening mechanism 50.

加工容器10係用以收容工件W之構件。工件W係被處理品,例如,係構成電子零件之成形體。作為電子零件,可列舉電容器、電阻器、電感器、變阻器、帶通濾波器、及壓電元件等。工件W亦可為藉由將原料粉末成形,或將原料粉末成形之後進行煅燒而獲得之成形體。工件W亦可為由壓粉成形法而成形之陶瓷或磁性材料。工件W之形狀亦可為長方體,工件W之一邊例如亦可為100~1600μm左右。加工容器10具備加工盤11。加工盤11具有載置工件W之面即第一面11a(載置面)及第一面11a之相反側之面即第二面11b。加工盤11具有複數個開口部,該等開口部具有通氣性且可使研磨粒通過,但能夠不使工件W通過而滯留於第一面11a側。具體而言,於加工盤11設置有於自第一面11a朝向第二面11b之方向貫通加工盤11之複數個貫通孔。複數個貫通孔之各者具有能夠供研磨粒G通過且無法供工件W通過之大小。加工盤11例如既可為構成為網狀之盤,亦可為穿孔金屬,亦可為設置有複數個狹縫之盤。又,加工盤11之形狀並不特別限定。 The processing container 10 is a member for accommodating the workpiece W. The workpiece W is a processed article, for example, a molded body of an electronic component. Examples of the electronic component include a capacitor, a resistor, an inductor, a varistor, a band pass filter, and a piezoelectric element. The workpiece W may be a molded body obtained by molding a raw material powder or molding a raw material powder and then calcining the raw material powder. The workpiece W may also be a ceramic or magnetic material formed by a powder molding method. The shape of the workpiece W may be a rectangular parallelepiped, and one side of the workpiece W may be, for example, about 100 to 1600 μm. The processing container 10 is provided with a processing disk 11. The processing disk 11 has a first surface 11a (mounting surface) on which the workpiece W is placed, and a second surface 11b which is a surface opposite to the first surface 11a. The processing disk 11 has a plurality of openings, and the openings have air permeability and can pass the abrasive grains, but can stay on the first surface 11a side without passing the workpiece W. Specifically, the processing disk 11 is provided with a plurality of through holes penetrating through the processing disk 11 from the first surface 11 a toward the second surface 11 b. Each of the plurality of through holes has a size that allows the abrasive grains G to pass therethrough and cannot pass the workpiece W. The processing disk 11 may be, for example, a disk formed in a mesh shape, a perforated metal, or a disk provided with a plurality of slits. Further, the shape of the processing disk 11 is not particularly limited.

本實施形態之加工容器10具備構成為網狀之圓盤形狀之加工盤11 及固定於加工盤11之外緣部之框體12。框體12於至少加工盤11之第一面11a中,包圍加工盤11之周緣。即,本實施形態之加工容器10具有加工盤11之上方(第一面11a側)開放之圓筒形狀。 The processing container 10 of the present embodiment includes a processing disk 11 in the shape of a disk having a mesh shape. And a frame 12 fixed to the outer edge portion of the processing disk 11. The frame 12 surrounds at least the periphery of the processing disk 11 in at least the first surface 11a of the processing disk 11. In other words, the processing container 10 of the present embodiment has a cylindrical shape in which the upper side (the first surface 11a side) of the processing disk 11 is opened.

攪拌機構20連接於加工容器10,以使收容(設置)於加工容器10之複數個工件W成為流動狀態之方式進行攪拌。只要可對工件W進行攪拌則攪拌機構20之構成並不特別限定。例如,攪拌機構20既可以使加工容器10旋轉之方式構成,亦可以使加工容器10振動之方式構成。作為攪拌機構20,亦可使用其他公知之構成。於本實施形態中,攪拌機構20以加工盤11之平面中心為軸心而使加工容器10旋轉。具體而言,攪拌機構20具備保持構件21及旋轉機構22。保持構件21於使加工容器10以特定之傾斜角度α傾斜之狀態下,以可旋轉地保持加工容器10。 The stirring mechanism 20 is connected to the processing container 10 so as to stir a plurality of workpieces W accommodated (provided) in the processing container 10 in a flowing state. The configuration of the stirring mechanism 20 is not particularly limited as long as the workpiece W can be stirred. For example, the agitation mechanism 20 may be configured to rotate the processing container 10 or to vibrate the processing container 10. As the stirring mechanism 20, other known configurations can also be used. In the present embodiment, the agitation mechanism 20 rotates the processing container 10 with the center of the plane of the processing disk 11 as the axis. Specifically, the stirring mechanism 20 includes a holding member 21 and a rotating mechanism 22 . The holding member 21 rotatably holds the processing container 10 in a state where the processing container 10 is inclined at a specific inclination angle α.

旋轉機構22為使加工容器10以特定之速度旋轉之機構。旋轉機構22具備產生旋轉力之馬達22a及將馬達22a之旋轉力傳遞至加工容器10之旋轉力傳遞構件22b。 The rotating mechanism 22 is a mechanism that rotates the processing container 10 at a specific speed. The rotation mechanism 22 includes a motor 22a that generates a rotational force, and a rotational force transmitting member 22b that transmits the rotational force of the motor 22a to the processing container 10.

研磨粒供給機構30係用以將研磨粒G朝向工件W投入之機構。研磨粒供給機構30包含貯存槽31及搬出部32。貯存槽31係用以貯存研磨粒G之槽。於搬出部32設置有排出口32a。以排出口32a位於加工盤11之第一面11a之上方之方式,配置搬出部32。搬出部32亦可以可將貯存槽31(漏斗)內之研磨粒G自排出口32a以定量排出之方式構成。搬出部32例如亦可具備搬送螺桿及內包該搬送螺桿之槽,且以使貯存槽31內之研磨粒G朝向設置於該槽之排出口32a前進之方式構成。又,搬出部32亦可具備圓盤狀之底盤及以該底盤之中心為軸心水平旋轉之刮板(未圖示)。於該情形時,搬出部32亦可以如下方式構成:藉由使貯存槽31之底面稍微離開該底盤配置而利用靜止角使特定量之研磨粒G堆積於該底盤,並利用該刮板將其朝向排出口32a刮出。作為搬出部32,亦可使用其他公知之構成。於本實施形態中,搬出部32具備前者 之構成。 The abrasive grain supply mechanism 30 is a mechanism for feeding the abrasive grains G toward the workpiece W. The abrasive grain supply mechanism 30 includes a storage tank 31 and a carry-out portion 32. The storage tank 31 is a tank for storing the abrasive grains G. A discharge port 32a is provided in the carry-out portion 32. The carry-out portion 32 is disposed such that the discharge port 32a is positioned above the first surface 11a of the processing disk 11. The carry-out portion 32 may be configured to discharge the abrasive grains G in the storage tank 31 (funnel) from the discharge port 32a in a quantitative manner. The carry-out portion 32 may include, for example, a transfer screw and a groove in which the transfer screw is housed, and the polishing grain G in the storage tank 31 may be formed to advance toward the discharge port 32a provided in the groove. Further, the carry-out portion 32 may include a disk-shaped chassis and a squeegee (not shown) that is horizontally rotated about the center of the chassis. In this case, the carry-out portion 32 may be configured such that a predetermined amount of the abrasive grains G are deposited on the chassis by the angle of repose by slightly lowering the bottom surface of the storage tank 31 from the chassis, and the scraper is used to dispose the same. It is scraped toward the discharge port 32a. As the carry-out unit 32, other known configurations can be used. In the present embodiment, the carry-out unit 32 has the former The composition.

抽吸機構40兼備使研磨粒G加速之功能及抽吸之功能。抽吸機構40具備軟管43及集塵器42。軟管43之一端面(於本實施形態中為抽吸部41)設置於加工盤11之第二面11b之下,且與第二面11b隔開。集塵器42連結於軟管43。 The suction mechanism 40 has both a function of accelerating the abrasive grains G and a function of suction. The suction mechanism 40 is provided with a hose 43 and a dust collector 42. One end surface of the hose 43 (in the present embodiment, the suction portion 41) is disposed below the second surface 11b of the processing disk 11, and is spaced apart from the second surface 11b. The dust collector 42 is coupled to the hose 43.

篩選機構50係自粉塵篩選能夠再使用之研磨粒之機構。又,篩選機構50配置於自抽吸部41朝向集塵器42之路徑之中途。即,一端面形成抽吸部41之第一軟管43a連結於篩選機構50,篩選機構50藉由第二軟管43b而與集塵器42連結。篩選機構50如下所述,係將粉塵分離為能夠再利用之研磨粒與除此以外之微粒子(產生破裂或缺漏之研磨粒、及藉由毛刺之去除而產生之工件之切削粉)之機構。篩選機構50亦可以利用粉塵之比重差及氣流進行分級之方式構成。作為篩選機構50,例如,亦可使用旋風分離器、離心分級機、或其他公知之構成。於本實施形態中,作為篩選機構50,使用旋風分離器,且旋風分離器之底部連結於貯存槽31。 The screening mechanism 50 is a mechanism for screening abrasive particles that can be reused from dust. Further, the screening mechanism 50 is disposed in the middle of the path from the suction unit 41 toward the dust collector 42. That is, the first hose 43a that forms the suction portion 41 on one end surface is coupled to the screening mechanism 50, and the screening mechanism 50 is coupled to the dust collector 42 by the second hose 43b. The screening mechanism 50 is a mechanism for separating dust into reusable abrasive grains and other fine particles (abrasive grains which generate cracks or leaks, and cutting powder of a workpiece which is produced by removal of burrs). The screening mechanism 50 can also be constructed by using the difference in the specific gravity of the dust and the classification of the airflow. As the screening means 50, for example, a cyclone separator, a centrifugal classifier, or other known structures may be used. In the present embodiment, a cyclone separator is used as the screening mechanism 50, and the bottom of the cyclone separator is coupled to the storage tank 31.

其次,進而使用圖2及圖3,對毛刺之去除方法進行說明。 Next, a method of removing the burr will be described with reference to FIGS. 2 and 3.

(S01:準備步驟) (S01: preparation step)

準備去毛刺裝置01及複數個工件W。預先將研磨粒G裝入至圖1所示之貯存槽31。本實施形態中所使用之研磨粒G之材質可配合工件W之材質及形狀、以及加工目的而適當選擇。例如,研磨粒G可自金屬或非金屬之粒子(珠粒、砂粒、及鋼線粒)、陶瓷系粒子(Al2O3、SiC、及ZrO2等)、天然石之粒子(金剛砂、矽石、及金剛石等)、植物系粒子(核桃殼、桃核、及杏核等)、以及樹脂系粒子(尼龍、三聚氰胺、及尿素等)選擇。 A deburring device 01 and a plurality of workpieces W are prepared. The abrasive grains G are previously charged into the storage tank 31 shown in Fig. 1. The material of the abrasive grain G used in the present embodiment can be appropriately selected in accordance with the material and shape of the workpiece W and the purpose of processing. For example, the abrasive grains G may be derived from metal or non-metal particles (beads, sand grains, and steel wire particles), ceramic-based particles (Al 2 O 3 , SiC, and ZrO 2 , etc.), natural stone particles (mound, vermiculite). And diamonds, etc., plant particles (walnut shell, peach core, and apricot core), and resin particles (nylon, melamine, urea, etc.) are selected.

又,研磨粒G之粒徑亦可配合工件W之材質及形狀、以及加工目的而適當選擇。但是,研磨粒G之粒徑必須以成為可使加工容器10之 開口部(貫通孔)通過之直徑之方式選擇。例如,於使陶瓷系粒子作為研磨粒G之情形時,研磨粒G之粒徑係以JIS(Japanese Indusrial Standards,日本工業標準)R6001;1998規定之粒度為F220或# 240以上# 1000以下,且成為可使加工容器10之開口部(貫通孔)通過之直徑之方式選擇。 Further, the particle size of the abrasive grains G can be appropriately selected in accordance with the material and shape of the workpiece W and the purpose of processing. However, the particle size of the abrasive particles G must be such that the processing container 10 can be made. The opening (through hole) is selected by the diameter. For example, when ceramic particles are used as the abrasive grains G, the particle size of the abrasive grains G is J220 (Japanese Indusrial Standards) R6001; 1998, and the particle size is F220 or #240 or more and 1000 or less. It is selected so that the diameter of the opening (through hole) of the processing container 10 can pass.

(S02:將工件收容於加工容器之步驟) (S02: Step of accommodating the workpiece in the processing container)

藉由將複數個工件W載置於加工盤11之第一面11a,而將複數個工件W收容(設置)於加工容器10。工件W之收容量係配合工件W之性狀及加工容器10之尺寸而適當選擇,以可由加工容器10保持工件W,且可良好地使工件W為流動狀態而進行攪拌。再者,於圖2中,為了方便起見記載有1個工件W。 A plurality of workpieces W are housed (arranged) in the processing container 10 by placing a plurality of workpieces W on the first surface 11a of the processing disk 11. The capacity of the workpiece W is appropriately selected in accordance with the properties of the workpiece W and the size of the processing container 10, so that the workpiece W can be held by the processing container 10, and the workpiece W can be satisfactorily stirred and flowed. In addition, in FIG. 2, one workpiece W is described for convenience.

(S03:攪拌工件之步驟) (S03: Step of stirring the workpiece)

使馬達22a作動,而使加工容器10旋轉。收容於加工容器10之工件W追隨加工容器10之旋轉而沿著框體12移動。由於加工容器10被傾斜地保持,故而對工件W附加有朝向框體12之方向之離心力與沿著加工盤11之重力之分力。若工件W移動(上升)至特定之位置,則重力之分力較離心力變大,故而工件W自框體12離開,沿著加工盤11朝向下方掉落。如此,工件W之移動與掉落連續地進行,藉此複數個工件W成為流動狀態,被攪拌。為了實現該流動狀態,加工容器10之傾斜角度α相對於水平面既可設為30~70°,亦可設為40~60°。若加工容器10之傾斜角度α過小,則重力之流動化之促進之效果較少。若加工容器10之傾斜角度α過大,則相對於離心力而重力之分力變得過大,故而難以追隨加工容器10之旋轉而使工件W移動。 The motor 22a is actuated to rotate the processing vessel 10. The workpiece W housed in the processing container 10 moves along the frame 12 following the rotation of the processing container 10. Since the processing container 10 is held obliquely, the workpiece W is added with a centrifugal force in the direction toward the frame 12 and a component of gravity along the processing disk 11. When the workpiece W moves (rises) to a specific position, the component force of gravity becomes larger than the centrifugal force, so that the workpiece W is separated from the casing 12 and falls downward along the processing disk 11. In this manner, the movement and the falling of the workpiece W are continuously performed, whereby the plurality of workpieces W are in a flowing state and are stirred. In order to achieve this flow state, the inclination angle α of the processing container 10 may be set to 30 to 70 degrees or 40 to 60 degrees with respect to the horizontal plane. If the inclination angle α of the processing container 10 is too small, the effect of promoting the fluidization of gravity is small. When the inclination angle α of the processing container 10 is too large, the component force of gravity is excessively large with respect to the centrifugal force, so that it is difficult to follow the rotation of the processing container 10 to move the workpiece W.

又,若加工容器10之旋轉速度過大則離心力變得過強,故而難以藉由重力之分力而使工件W掉落。相反,若加工容器10之旋轉速度過小則離心力變得過弱,故而難以藉由加工容器10之旋轉而使工件W 移動。於任一之情形時,均無法良好地使工件W為流動狀態。為了使複數個工件W為流動狀態而良好地進行攪拌,而加工容器10之旋轉速度既可設為臨界旋轉速度之5~50%,亦可設為10~30%。所謂臨界旋轉速度,係指於使加工容器10之旋轉速度上升時,附加至工件W之離心力大於重力之分力,工件W不會掉落而與框體12一起旋轉之時間點之速度。於加工容器10之旋轉速度過慢之情形時,相對於離心力而重力之影響過大,故而工件W沿著加工容器10之框體12之移動無法充分進行,其結果,工件W之掉落之流動無法充分進行。於加工容器10之旋轉速度過快之情形時,相對於離心力而重力過小,故而會存在保持壓抵於加工容器10之框體12之狀態不掉落之工件W,而流動無法充分進行。 Further, if the rotational speed of the processing container 10 is too large, the centrifugal force becomes too strong, so that it is difficult to drop the workpiece W by the component force of gravity. On the contrary, if the rotational speed of the processing container 10 is too small, the centrifugal force becomes too weak, so that it is difficult to make the workpiece W by the rotation of the processing container 10. mobile. In either case, the workpiece W cannot be satisfactorily flowed. In order to stir a plurality of workpieces W in a flowing state, the rotation speed of the processing vessel 10 may be set to 5 to 50% of the critical rotation speed, or may be 10 to 30%. The critical rotational speed is the speed at which the centrifugal force of the workpiece W is greater than the component force of gravity when the rotational speed of the processing container 10 is increased, and the workpiece W does not fall and rotates together with the casing 12. When the rotation speed of the processing container 10 is too slow, the influence of gravity with respect to the centrifugal force is excessively large, so that the movement of the workpiece W along the frame 12 of the processing container 10 cannot be sufficiently performed, and as a result, the flow of the workpiece W falls. Not fully implemented. When the rotation speed of the processing container 10 is too fast, the gravity is too small with respect to the centrifugal force, so that the workpiece W that is pressed against the frame 12 of the processing container 10 does not fall, and the flow cannot be sufficiently performed.

進而,藉由使工件W為流動狀態進行攪拌而工件W彼此碰撞,形成於工件W之毛刺之固著力變弱,藉此容易將毛刺自工件W去除。 Further, by stirring the workpiece W in a flowing state, the workpieces W collide with each other, and the fixing force of the burrs formed on the workpiece W is weakened, whereby the burrs are easily removed from the workpiece W.

(S04:產生氣流之步驟) (S04: Step of generating airflow)

若使集塵器42作動,則於加工盤11附近產生自第一面11a朝向第二面11b之氣流。 When the dust collector 42 is actuated, an air flow from the first surface 11a toward the second surface 11b is generated in the vicinity of the processing disk 11.

(S05:整流步驟) (S05: Rectification step)

藉由對氣流之流動進行整流,可有意地變更(控制)研磨粒G與工件W碰撞或接觸之態樣。該步驟例如可藉由變更抽吸部41之位置及大小、以及集塵器42之抽吸流量等而進行。又,如下所述,由於研磨粒G與工件W碰撞或接觸時之研磨粒G之速度非常低,故而可藉由整流步驟(S05)而容易地變更研磨粒G與工件W碰撞或接觸之態樣。再者,整流步驟S05亦可省略。 By rectifying the flow of the gas stream, it is possible to intentionally change (control) the manner in which the abrasive grain G collides or contacts the workpiece W. This step can be performed, for example, by changing the position and size of the suction unit 41, the suction flow rate of the dust collector 42, and the like. Further, as described below, since the speed of the abrasive grains G when the abrasive grains G collide or contact with the workpiece W is extremely low, the state in which the abrasive grains G collide with or contact with the workpiece W can be easily changed by the rectifying step (S05). kind. Furthermore, the rectification step S05 can also be omitted.

(S06:投入研磨粒之步驟) (S06: Step of inputting abrasive grains)

若使研磨粒供給機構30作動,則裝入至貯存槽31之研磨粒G自排出口32a以定量排出,朝向工件W投入(於本實施形態之情形時為掉 落)。研磨粒G自排出口32a排出時之朝向工件W之方向之研磨粒G之速度為0m/sec或非常小之速度,即便研磨粒G為自由掉落之狀態不施加抽吸力等外力而與工件W碰撞或接觸,亦可將工件W之毛刺去除。 When the abrasive grain supply mechanism 30 is actuated, the abrasive grains G loaded in the storage tank 31 are discharged from the discharge port 32a and are discharged toward the workpiece W (in the case of the present embodiment, it is dropped). drop). The speed of the abrasive grains G in the direction toward the workpiece W when the abrasive grains G are discharged from the discharge port 32a is 0 m/sec or a very small speed, and even if the abrasive grains G are freely dropped, no external force such as suction force is applied. When the workpiece W collides or contacts, the burr of the workpiece W can also be removed.

(S07:使研磨粒加速之步驟) (S07: Step of accelerating the abrasive grains)

自排出口32a排出之研磨粒G藉由產生氣流之步驟(S04)中所產生之氣流,如圖2所示,自由掉落地到達加速區域A(於第一面11a側產生該氣流之區域)。到達加速區域A之研磨粒G以與工件W碰撞或接觸時之速度成為特定之速度之方式,朝向抽吸部41加速。該特定之速度亦可為能夠將工件W之毛刺良好去除,且不對工件W產生損傷及研磨粒G之刺進之速度。例如,於工件W之維氏硬度(由JIS Z2244;2009規定)為3~200Hv(試驗力為0.2N)之情形時,該特定之速度既可為5~30m/sec,亦可為10~20m/sec。該特定之速度係為了藉由研磨粒之接觸或碰撞而進行毛刺之去除而非常低之速度,於先前之毛刺之去除方法中無法實現。例如,於藉由噴擊加工裝置而進行之研削中,噴射壓力為高壓(例如0.2MPa以上),故而無法實現如上述特定之速度般之非常慢之速度。假設於為了使研磨粒之速度為該特定之速度而使噴射壓力非常低之情形時,來自噴嘴之噴射材之噴射量不穩定,故而於工件之完成程度產生不均。藉由本實施形態之毛刺之去除方法,可使研磨粒G與工件W碰撞或接觸時之研磨粒G之速度為非常低之速度,故而可利用非常低之速度之研磨粒G將工件W之毛刺去除。該速度之調整可藉由集塵器42之抽吸流量之調整以及抽吸部41之尺寸及形狀之變更等而進行。集塵器42之抽吸流量之調整例如可藉由變更內置於集塵器42之馬達之轉數,或於軟管43設置用以抽吸外部氣體之阻尼器,調整阻尼器之開度等而進行。 The airflow generated in the step (S04) of generating the air granules discharged from the discharge port 32a is freely dropped to reach the acceleration region A as shown in FIG. 2 (the region where the airflow is generated on the side of the first surface 11a) ). The abrasive grains G that have reached the acceleration region A are accelerated toward the suction portion 41 so that the speed at which the workpiece W collides or comes into contact with the workpiece W. This specific speed may also be a speed at which the burrs of the workpiece W can be removed well without causing damage to the workpiece W and the penetration of the abrasive grains G. For example, when the Vickers hardness of the workpiece W (specified by JIS Z2244; 2009) is 3 to 200 Hv (test force is 0.2 N), the specific speed may be 5 to 30 m/sec or 10 to 20m/sec. This particular speed is a very low speed for burr removal by contact or collision of abrasive particles, which was not possible with previous methods of removing burrs. For example, in the grinding by the jet processing apparatus, the injection pressure is a high pressure (for example, 0.2 MPa or more), so that a very slow speed such as the above-described specific speed cannot be achieved. It is assumed that when the injection pressure is extremely low in order to set the speed of the abrasive grains to the specific speed, the injection amount of the spray material from the nozzle is unstable, so that the degree of completion of the workpiece is uneven. According to the burr removal method of the present embodiment, the speed of the abrasive grains G when the abrasive grains G collide with or contact with the workpiece W can be made at a very low speed, so that the workpiece W can be burred with the abrasive grains G at a very low speed. Remove. The adjustment of the speed can be performed by adjusting the suction flow rate of the dust collector 42 and changing the size and shape of the suction portion 41. The suction flow rate of the dust collector 42 can be adjusted, for example, by changing the number of revolutions of the motor built in the dust collector 42, or by providing a damper for sucking outside air in the hose 43, adjusting the opening degree of the damper, etc. And proceed.

(S08:將工件之毛刺去除之步驟) (S08: Step of removing the burr of the workpiece)

到達加速區域A之研磨粒G一面被加速一面朝向抽吸部41前進, 到達工件W之被加工面。然後,研磨粒G與工件W碰撞或接觸之後,朝向抽吸部41進而前進。圖2所示之行為F表示研磨粒G之行為。將研磨粒G與工件W碰撞或接觸之態樣之一例作為行為F1、F2、F3而進行說明。 The abrasive grains G that have reached the acceleration region A are accelerated toward the suction portion 41 while being accelerated. Arrives at the machined surface of the workpiece W. Then, after the abrasive grain G collides with or comes into contact with the workpiece W, it proceeds further toward the suction portion 41. The behavior F shown in Fig. 2 indicates the behavior of the abrasive grains G. An example in which the abrasive grains G collide or contact with the workpiece W will be described as the behaviors F1, F2, and F3.

行為F1:研磨粒G與工件W之毛刺直線地碰撞之後,回彈。藉由研磨粒G與毛刺碰撞時之衝擊力而將毛刺去除。 Behavior F1: After the abrasive grain G collides linearly with the burr of the workpiece W, it rebounds. The burr is removed by the impact force of the abrasive grain G when it collides with the burr.

行為F2:研磨粒G與工件W之上表面碰撞之後,沿著上表面前進。藉由研磨粒G與工件W碰撞時之衝擊力及研磨粒G沿著上表面前進時之摩擦力而將毛刺去除。 Behavior F2: After the abrasive grain G collides with the upper surface of the workpiece W, it proceeds along the upper surface. The burr is removed by the impact force when the abrasive grain G collides with the workpiece W and the frictional force of the abrasive grain G as it advances along the upper surface.

行為F3:研磨粒G以沿著工件W之稜角部之方式前進。藉由研磨粒G與工件W之稜角部碰撞時之衝擊力或通過稜角部時之摩擦力之至少任一者而將毛刺去除。 Behavior F3: The abrasive grain G advances along the angular portion of the workpiece W. The burr is removed by at least one of an impact force when the abrasive grain G collides with the edge portion of the workpiece W or a frictional force when passing through the edge portion.

(S09:回收研磨粒之步驟) (S09: Step of recovering abrasive grains)

與工件W碰撞或接觸之研磨粒G通過加工盤11移動至第二面11b側。移動至第二面11b側之研磨粒G自抽吸部41藉由集塵器42而抽吸。此時,上述微粒子亦通過加工盤11,自抽吸部41被抽吸。研磨粒G及微粒子之粉塵通過第一軟管43a被移送至篩選機構50。於篩選機構50為旋風分離器之情形時,自旋風分離器之上部沿著壁面導入之粉塵螺旋狀地掉落。於該過程中,作為質量較輕之粒子之上述微粒子向上方浮游,通過連接於旋風分離器之頂部之第二軟管43b由集塵器42捕集。另一方面,作為質量較重之粒子之能夠再利用之研磨粒G朝向篩選機構50之底部移動,貯存於連結於篩選機構50之底部之貯存槽31。該研磨粒G再次自排出口32a朝向工件W投入。 The abrasive grains G that collide or contact with the workpiece W are moved to the second surface 11b side by the processing disk 11. The abrasive grains G moved to the side of the second surface 11b are sucked from the suction portion 41 by the dust collector 42. At this time, the fine particles are also sucked from the suction portion 41 through the processing disk 11. The dust of the abrasive grains G and the fine particles is transferred to the screening mechanism 50 through the first hose 43a. When the screening mechanism 50 is a cyclone separator, the dust introduced into the upper portion of the cyclone separator along the wall surface is spirally dropped. In the process, the fine particles, which are light-weight particles, float upward, and are collected by the dust collector 42 through a second hose 43b connected to the top of the cyclone. On the other hand, the reusable abrasive grains G, which are heavy mass particles, move toward the bottom of the screening mechanism 50, and are stored in the storage tank 31 connected to the bottom of the screening mechanism 50. This abrasive grain G is again supplied from the discharge port 32a toward the workpiece W.

如以上般,自配置於第一面11a側之研磨粒供給機構30中之排出口32a投入,由藉由集塵器42而產生之抽吸力加速至特定之速度之研磨粒G與工件W碰撞或接觸,藉此將工件W之毛刺去除。與工件W碰 撞或接觸之後之研磨粒G由配置於第二面11b側之抽吸部41抽吸。藉此,不會如先前之毛刺之去除方法即噴擊加工法般研磨粒G飛散至周圍。又,由於可使研磨粒G與工件W碰撞或接觸時之研磨粒G之速度非常慢,故而即便於將硬度相對較低之工件W之毛刺去除之情形時,亦不會對工件W產生損傷,可良好地將工件W之毛刺去除。例如,於使構成電子零件之成形體作為工件W之情形時,可製造可靠性較高之電子零件。 As described above, the discharge port 32a in the abrasive grain supply mechanism 30 disposed on the first surface 11a side is loaded, and the abrasive grains G and the workpiece W are accelerated by the suction force generated by the dust collector 42 to a specific speed. Collision or contact, thereby removing the burrs of the workpiece W. Touching the workpiece W The abrasive grains G after the collision or contact are sucked by the suction portion 41 disposed on the second surface 11b side. Thereby, the abrasive grain G is not scattered to the surroundings as in the prior art method of removing the burrs, that is, the spray processing method. Further, since the speed of the abrasive grains G when the abrasive grains G collide or come into contact with the workpiece W is very slow, even if the burrs of the workpiece W having a relatively low hardness are removed, the workpiece W is not damaged. The burr of the workpiece W can be removed well. For example, when a molded body constituting an electronic component is used as the workpiece W, an electronic component having high reliability can be manufactured.

此處,加工盤11之厚度亦可為30~100μm。若加工盤11之厚度過薄,則存在於將毛刺去除之期間加工盤11破裂之虞。若加工盤11之厚度過厚,則研磨粒G通過加工盤11之距離過長,故而產生堵塞之可能性變高,或藉由壓力損耗而於加速區域A研磨粒G無法充分被加速。又,加工盤11之第一面11a與框體12所成之稜角之半徑之大小(稜角半徑)亦可為0.5~5.0mm。即,加工盤11之第一面11a與框體12所成之稜角部亦可被加工為半徑0.5~5.0mm之R面。若稜角半徑過小,則工件W被稜角部分夾持之可能性變高,若稜角半徑過大,則工件W難以停留於加工容器10內。 Here, the thickness of the processing disk 11 may also be 30 to 100 μm. If the thickness of the processing disk 11 is too thin, there is a possibility that the processing disk 11 is broken during the removal of the burrs. When the thickness of the processing disk 11 is too thick, the distance between the abrasive grains G and the processing disk 11 is too long, so that the possibility of clogging becomes high, or the abrasive grains G cannot be sufficiently accelerated in the acceleration region A by pressure loss. Further, the radius (angular radius) of the corner formed by the first surface 11a of the processing disk 11 and the frame 12 may be 0.5 to 5.0 mm. That is, the edge portion formed by the first surface 11a of the processing disk 11 and the frame 12 can be processed into an R surface having a radius of 0.5 to 5.0 mm. If the angular radius is too small, the possibility that the workpiece W is sandwiched by the angular portion becomes high, and if the angular radius is too large, the workpiece W hardly stays in the processing container 10.

又,於本實施形態中規定了「抽吸比例」與「通過比例」之兩個值。此處,所謂「抽吸比例」,係指每單位時間自研磨粒供給機構30投入之研磨粒之體積(體積/秒)相對於每單位時間由抽吸機構40抽吸之抽吸流量(體積/秒)之比例。所謂「通過比例」,係指每單位時間到達第二面11b側之研磨粒G之量(克/秒)相對於每單位時間自第一面11a側朝向流動狀態之複數個工件W投入之研磨粒G之量(克/秒)之比例。此處,所謂自第一面11a側朝向流動狀態之複數個工件W投入之研磨粒G之量(克),係指自排出口32a排出之研磨粒G之重量。又,所謂到達第二面11b側之研磨粒G之量(克),係指通過加工盤11由抽吸機構40抽吸之研磨粒G之重量。 Further, in the present embodiment, two values of "pumping ratio" and "passing ratio" are defined. Here, the "pumping ratio" means the volume (volume/second) of the abrasive grains injected from the abrasive grain supply mechanism 30 per unit time with respect to the suction flow rate (volume drawn by the suction mechanism 40 per unit time). / sec) ratio. The "passing ratio" means the amount of the abrasive grains G (g/s) which reaches the second surface 11b side per unit time with respect to the grinding of the plurality of workpieces W from the first surface 11a side toward the flow state per unit time. The ratio of the amount of granule G (g/s). Here, the amount (gram) of the abrasive grains G that are input from the first surface 11a side toward the plurality of workpieces W in the flow state refers to the weight of the abrasive grains G discharged from the discharge port 32a. Further, the amount (gram) of the abrasive grains G reaching the side of the second surface 11b means the weight of the abrasive grains G sucked by the suction mechanism 40 through the processing disk 11.

抽吸比例亦可為10~50體積%之範圍內。若抽吸比例過低,則相對於由抽吸機構40抽吸之抽吸流量而自排出口32a排出之研磨粒G之量較少,無法充分進行複數個工件W之毛刺之去除。又,若抽吸比例過高,則相對於由抽吸機構40抽吸之抽吸流量而自排出口32a排出之研磨粒G之量較多,於加速區域A內,無法使研磨粒G充分加速至可將工件W之毛刺去除之速度為止。又,研磨粒G及微粒子飛散至周圍。 The suction ratio may also be in the range of 10 to 50% by volume. When the suction ratio is too low, the amount of the abrasive grains G discharged from the discharge port 32a with respect to the suction flow rate sucked by the suction mechanism 40 is small, and the burrs of the plurality of workpieces W cannot be sufficiently removed. Further, when the suction ratio is too high, the amount of the abrasive grains G discharged from the discharge port 32a with respect to the suction flow rate sucked by the suction mechanism 40 is large, and in the acceleration region A, the abrasive grains G cannot be sufficiently obtained. Accelerate to a speed at which the burrs of the workpiece W can be removed. Further, the abrasive grains G and the fine particles are scattered to the surroundings.

通過加工容器10內之複數個工件W間之距離越長,則研磨粒G滯留於複數個工件W間之時間越長,通過比例越低。通過比例亦可為80~95重量%之範圍內。若通過比例過高,則研磨粒G通過複數個工件W間之距離過短,故而研磨粒G與工件W抵接之頻度變低,無法良好地進行工件W之毛刺之去除。又,若通過比例過低,則研磨粒G通過複數個工件W間之距離過長,故而於複數個工件W間,研磨粒G未由氣流加速而滯留之時間變長,妨礙工件W之毛刺之去除。 The longer the distance between the plurality of workpieces W in the processing vessel 10, the longer the abrasive grain G stays between the plurality of workpieces W, and the lower the pass ratio. The pass ratio can also be in the range of 80 to 95% by weight. When the ratio is too high, the distance between the plurality of workpieces W by the abrasive grains G is too short. Therefore, the frequency at which the abrasive grains G come into contact with the workpiece W becomes low, and the burrs of the workpiece W cannot be satisfactorily removed. Further, when the ratio is too low, the distance between the plurality of workpieces W by the abrasive grains G is too long, so that the polishing particles G are not accelerated by the air flow and become longer between the plurality of workpieces W, which hinders the burr of the workpiece W. Removal.

其次,對藉由上述去毛刺裝置而將工件W之毛刺去除之結果進行說明。此處,作為工件W選擇下述之2種,將稜角部之毛刺之去除設為加工目的。 Next, the result of removing the burrs of the workpiece W by the above-described deburring device will be described. Here, the following two types are selected as the workpiece W, and the removal of the burrs of the corner portions is made for processing.

工件A:工件A為將複合材料(SiC/Al2O3)藉由壓縮成型而成形之陶瓷之燒成前之成形品。工件A之尺寸為0.5mm×0.5mm×1.0mm,工件A之維氏硬度為Hv100。 Workpiece A: The workpiece A is a molded article before firing of a ceramic formed by compression molding of a composite material (SiC/Al 2 O 3 ). The size of the workpiece A was 0.5 mm × 0.5 mm × 1.0 mm, and the Vickers hardness of the workpiece A was Hv 100.

工件B:工件B為將具有尖晶石型結晶構造之鐵氧體粉末藉由壓縮成型而成形之陶瓷之燒成前之成形品。工件B之尺寸為0.5mm×0.5mm×1.0mm,工件B之維氏硬度為Hv20。 Workpiece B: The workpiece B is a molded article before firing of a ceramic formed by compression molding of a ferrite powder having a spinel crystal structure. The size of the workpiece B is 0.5 mm × 0.5 mm × 1.0 mm, and the Vickers hardness of the workpiece B is Hv20.

作為裝置,使用上述實施形態之去毛刺裝置。又,作為比較例,使用作為先前技術之噴擊加工裝置(將新東工業股份有限公司製MY-30C型之圓筒型噴擊加工裝置改造)。 As the device, the deburring device of the above embodiment is used. Moreover, as a comparative example, the spray processing apparatus of the prior art (renovation of the cylindrical type squirting apparatus of the MY-30C type manufactured by Shinto Industries Co., Ltd.) was used.

於本實施例中,利用研磨粒A及研磨粒B分別進行工件W之毛刺 之去除。研磨粒A係平均粒徑為18μm之氧化鋁質之粒子(新東工業股份有限公司製之WA # 800),研磨粒A之視密度為4.0g/cm3。研磨粒B係平均粒徑為14μm鐵氧體質之粒子,研磨粒B之視密度為2.5g/cm3In the present embodiment, the burrs of the workpiece W are removed by the abrasive grains A and the abrasive grains B, respectively. The abrasive grain A was an alumina-based particle having an average particle diameter of 18 μm (WA #800, manufactured by Shinto Industries Co., Ltd.), and the apparent density of the abrasive grain A was 4.0 g/cm 3 . The abrasive grain B was a particle having an average particle diameter of 14 μm ferrite, and the apparent density of the abrasive grain B was 2.5 g/cm 3 .

使去毛刺裝置或噴擊加工裝置作動30分鐘而進行工件W之毛刺之去除之後,評價工件W之加工狀態。加工狀態之評價係利用由顯微鏡(股份有限公司KEYENCE製VHX-2000)分別觀察成為觀察之對象之工件而進行。成為觀察之對象之工件係於將加工容器之容積之1/5之量之工件收容於加工容器而將工件之毛刺去除之後(裝置之作動結束後)自全量之工件取樣之20個工件。加工狀態之評價基準如下所述。 After the deburring device or the jetting device was operated for 30 minutes to remove the burrs of the workpiece W, the processing state of the workpiece W was evaluated. The evaluation of the processing state was carried out by observing the workpiece to be observed by a microscope (VHX-2000, manufactured by KEYENCE Co., Ltd.). The workpiece to be observed is a workpiece in which a workpiece of one-fifth of the volume of the processing container is stored in the processing container to remove the burr of the workpiece (after the operation of the device is completed) from the workpiece of the full amount. The evaluation criteria of the processing state are as follows.

○‧‧‧於所有工件中,毛刺被去除,且無工件之損傷(破裂及缺漏、以及研磨粒之刺進)。 ○‧‧‧In all workpieces, the burrs were removed and there was no damage to the workpiece (broken and missing, and the penetration of the abrasive particles).

△‧‧‧存在稍微殘留有毛刺之工件,但所有工件無損傷。 △‧‧‧ There are workpieces with slight burrs remaining, but all workpieces are not damaged.

×‧‧‧較多之毛刺未被去除。或者存在受損傷之工件。 ×‧‧‧More burrs were not removed. Or there is a damaged workpiece.

又,於藉由上述實施形態之去毛刺裝置而進行工件W之毛刺之去除之後觀察加工容器10之周邊。於藉由噴擊加工裝置而進行工件W之毛刺之去除之後觀察圓筒之周邊。而且,於加工容器10之周邊或圓筒之周邊未確認研磨粒之附著之情形時將研磨粒之飛散之評價設為「○」,於加工容器10之周邊或圓筒之周邊確認有研磨粒之附著之情形時將研磨粒之飛散之評價設為「×」。同樣地,於加工容器10之周邊或圓筒之周邊未確認工件之情形時將工件之飛散之評價設為「○」,於加工容器10之周邊或圓筒之周邊確認有工件之情形時將工件之飛散之評價設為「×」。 Further, after the burr of the workpiece W is removed by the deburring device of the above-described embodiment, the periphery of the processing container 10 is observed. The periphery of the cylinder was observed after the burr of the workpiece W was removed by the jet processing apparatus. In addition, when the adhesion of the abrasive grains is not confirmed in the vicinity of the processing container 10 or the periphery of the cylinder, the evaluation of the scattering of the abrasive grains is "○", and the abrasive grains are confirmed around the periphery of the processing container 10 or around the cylinder. In the case of adhesion, the evaluation of the scattering of the abrasive grains is set to "x". Similarly, when the workpiece is not confirmed around the processing container 10 or around the cylinder, the evaluation of the scattering of the workpiece is "○", and the workpiece is confirmed when the workpiece is in the vicinity of the processing container 10 or around the cylinder. The evaluation of the scattering is set to "X".

將各條件之上述評價之結果示於表1。關於表1之裝置之項目,「傾斜角度」如圖1所示,於上述實施形態之去毛刺裝置中表示加工容器10相對於水平面之傾斜角度α(°),於噴擊加工裝置中表示圓筒相對於水平面之傾斜角度。又,「旋轉速度」係表示相對於臨界旋轉速 度之旋轉速度之比例(%)。又,於研磨粒之「速度」中,記載有利用流速測量系統(股份有限公司FLOWTECH RESEARCH製PIV系統)預先測定各條件下之與工件W接觸之前之研磨粒之粒體速度之結果。進而,「厚度」係表示加工盤11之厚度(μm),「稜角半徑」係表示加工盤11之第一面11a與框體12所形成之稜角之半徑之大小(mm)。 The results of the above evaluation of each condition are shown in Table 1. With respect to the item of the apparatus of Table 1, the "inclination angle" is as shown in Fig. 1, and the deburring device of the above embodiment shows the inclination angle α (°) of the processing container 10 with respect to the horizontal plane, and represents the circle in the squirting apparatus. The angle of inclination of the barrel relative to the horizontal plane. Also, "rotational speed" means relative to the critical rotational speed The ratio of the rotational speed of the degree (%). In addition, in the "speed" of the abrasive grains, the result of measuring the granule speed of the abrasive grains before the contact with the workpiece W under each condition is measured in advance using a flow rate measuring system (PIV system manufactured by FLOWTECH RESEARCH Co., Ltd.). Further, the "thickness" indicates the thickness (μm) of the processing disk 11, and the "angular radius" indicates the size (mm) of the radius of the edge formed by the first surface 11a of the processing disk 11 and the frame 12.

藉由使自第一面11a側朝向流動狀態之複數個工件W投入之研磨粒之量(克/秒)變化,而使抽吸比例變化。 The suction ratio is changed by changing the amount (g/sec) of the abrasive grains which are input from the first surface 11a side toward the flow state of the plurality of workpieces W.

藉由預先測定每單位時間自第一面11a側朝向流動狀態之複數個工件W投入之研磨粒之量、及每單位時間到達第二面11b側之研磨粒之量,而算出通過比例。具體而言,藉由測定使無毛刺之工件A之燒成品作為工件而使去毛刺裝置作動1分鐘時之下述(1)、(2),而算出通過比例。 The passing ratio is calculated by measuring in advance the amount of the abrasive grains to be fed from the first surface 11a side toward the flow state and the amount of the abrasive grains per unit time to the second surface 11b side. Specifically, the passing ratio is calculated by measuring the following (1) and (2) when the deburring device is operated for one minute by using the burr-free workpiece A as a workpiece.

(1)自研磨粒供給機構30之排出口32a排出之研磨粒之量(每單位時間自第一面11a側朝向流動狀態之複數個工件W投入之研磨粒之量) (1) The amount of the abrasive grains discharged from the discharge port 32a of the abrasive grain supply mechanism 30 (the amount of the abrasive grains input from the first surface 11a side toward the flow state of the plurality of workpieces W per unit time)

(2)通過複數個工件W及加工盤11由抽吸機構40抽吸之研磨粒之量(每單位時間到達第二面11b側之研磨粒之量) (2) The amount of abrasive grains sucked by the suction mechanism 40 through the plurality of workpieces W and the processing disk 11 (the amount of abrasive grains reaching the second surface 11b side per unit time)

此處,使無毛刺之工件A之燒成品作為工件W係為了使工件W之毛刺等切削粉難以產生。 Here, the burned product of the burr-free workpiece A is used as the workpiece W in order to prevent the cutting powder such as the burr of the workpiece W from being generated.

首先,於上述實施形態之去毛刺裝置中,將使加工容器10之傾斜角度為45°,使旋轉速度為30%,使加工盤11之厚度為40μm,使加工盤11之稜角半徑為1.0mm,使研磨粒之速度為15m/sec,使抽吸比例為30%之條件設為基準條件。於上述實施形態之去毛刺裝置中,使基準條件中抽吸比例於5~60體積%之間變化,使用研磨粒A進行工件A之毛刺之去除(實施例1~5)。又,於上述實施形態之去毛刺裝置中,使基準條件中抽吸比例於5~60體積%之間變化,使用研磨粒B進行工件B之毛刺之去除(實施例17~21)。於抽吸比例為10~50體積%之間,無論工件之種類如何加工狀態之評價均為「○」或「△」(實施例1~3及實施例17~19)。另一方面,若抽吸比例脫離10~50體積%之範圍,則加工狀態之評價成為「×」(實施例4、5及實施例20、21)。 First, in the deburring device of the above embodiment, the inclination angle of the processing container 10 is 45°, the rotation speed is 30%, the thickness of the processing disk 11 is 40 μm, and the angular radius of the processing disk 11 is 1.0 mm. The conditions of the abrasive grain rate of 15 m/sec and the suction ratio of 30% were set as the reference conditions. In the deburring device of the above embodiment, the suction ratio in the reference condition is changed between 5 and 60% by volume, and the burr of the workpiece A is removed by using the abrasive particles A (Examples 1 to 5). Further, in the deburring device of the above-described embodiment, the suction ratio in the reference condition is changed between 5 and 60% by volume, and the burr of the workpiece B is removed by using the abrasive particles B (Examples 17 to 21). Regarding the suction ratio of 10 to 50% by volume, the evaluation of the state of the workpiece regardless of the type of the workpiece was "○" or "△" (Examples 1 to 3 and Examples 17 to 19). On the other hand, when the suction ratio is out of the range of 10 to 50% by volume, the evaluation of the processing state is "x" (Examples 4 and 5 and Examples 20 and 21).

其次,自上述基準條件使「傾斜速度」、「旋轉速度」、「速度」、「厚度」、及「稜角半徑」之任一者依序變化,進行工件A及工件B之毛刺之去除(實施例6~15及實施例22~31)。再者,工件A之毛刺之去除使用研磨粒A,工件B之毛刺之去除使用研磨粒B。其結果,加工狀態之評價均為「○」或「△」。於加工狀態之評價為「△」之實施例中,為於工件稍微殘留有毛刺之狀態,且工件不受損傷,故而顯示藉由使處理時間更長,而加工狀態之評價可成為「○」之情況。 Then, any one of the "tilt speed", "rotation speed", "speed", "thickness", and "angular radius" is sequentially changed from the above-mentioned reference conditions, and the burrs of the workpiece A and the workpiece B are removed (implementation) Examples 6 to 15 and Examples 22 to 31). Further, the removal of the burrs of the workpiece A uses the abrasive grains A, and the removal of the burrs of the workpiece B uses the abrasive grains B. As a result, the evaluation of the processing state was "○" or "△". In the embodiment in which the evaluation state of the processing state is "△", the burr is slightly left in the workpiece, and the workpiece is not damaged. Therefore, the processing time can be changed to "○" by displaying the processing time longer. The situation.

上述之實施例1~15及實施例17~31中,關於加工狀態之評價為「○」或「△」之實施例(實施例1~3、實施例6~19、實施例22~31),通過比例為80~95重量%。因此,以該範圍中之通過比例,可良好地進行毛刺之去除。 In the above-described Examples 1 to 15 and Examples 17 to 31, the examples in which the evaluation of the processing state was "○" or "△" (Examples 1 to 3, Examples 6 to 19, and Examples 22 to 31) The passage ratio is 80 to 95% by weight. Therefore, the burr removal can be performed favorably in the ratio of the passage in this range.

於上述實施形態之去毛刺裝置中,使用作為與工件A之材料即氧化鋁質不同材質之材料之鐵氧體質之研磨粒B,以上述基準條件進行工件A之毛刺之去除,結果由於氧化鋁較鐵氧體更硬,故而研磨粒不 會刺進工件而可良好地進行毛刺之去除(實施例16)。另一方面,使用作為與工件B之材料即鐵氧體質不同材質之材料之氧化鋁質之研磨粒A,以上述基準條件進行工件B之毛刺之去除,結果確認有研磨粒之刺進(實施例32)。認為其原因在於鐵氧體較氧化鋁更軟。因此,判明於將鐵氧體質之工件之毛刺去除時,使用作為相同材質之材料之鐵氧體質之研磨粒或由較鐵氧體更軟之材質而製成之研磨粒可良好地將毛刺去除。 In the deburring device of the above-described embodiment, the ferrite-based abrasive grains B which are materials different from the alumina material of the workpiece A are used, and the burrs of the workpiece A are removed under the above-described reference conditions. As a result, alumina is removed. Harder than ferrite, so the abrasive particles are not The burr can be removed well by piercing the workpiece (Example 16). On the other hand, the abrasive grain A of the alumina which is a material different from the material of the workpiece B, that is, the ferrite material, was used to remove the burr of the workpiece B under the above-mentioned standard conditions. Example 32). The reason is considered to be that ferrite is softer than alumina. Therefore, it has been found that when the burr of the ferrite material is removed, the abrasive grains prepared by using ferrite as the material of the same material or the abrasive grains made of a softer material than the ferrite can well remove the burrs. .

又,於實施例1~32中,於毛刺之去除處理後對加工容器10之周圍進行觀察之結果,於加工容器10之周圍未確認研磨粒之附著及工件W之掉落。藉此,判斷上述實施形態之去毛刺裝置不會使研磨粒飛散至周圍,又不會吹散工件,可將毛刺自工件W去除。 Further, in Examples 1 to 32, as a result of observing the periphery of the processing container 10 after the burr removal process, the adhesion of the abrasive grains and the dropping of the workpiece W were not confirmed around the processing container 10. Thereby, it is judged that the deburring device of the above embodiment does not scatter the abrasive grains to the surroundings, and does not blow the workpiece, and the burr can be removed from the workpiece W.

另一方面,於藉由噴擊加工裝置而進行工件W之毛刺之去除處理之情形時,工件W之毛刺被去除,但產生工件W之損傷,加工狀態之評價成為「×」(比較例1及比較例2)。又,若於毛刺之去除處理後對圓筒之周邊,即加工室內進行觀察,則於噴擊加工室之壁面確認有研磨粒之附著,研磨粒之飛散之評價成為「×」。進而,若對連結於噴擊加工裝置之分級機構進行確認,則確認有工件W之混合存在。其表示根據工件W之性狀,而於毛刺之去除處理中工件被自圓筒吹散。 On the other hand, when the burr removal processing of the workpiece W is performed by the squeegee processing apparatus, the burr of the workpiece W is removed, but the damage of the workpiece W is caused, and the evaluation of the processing state is "x" (Comparative Example 1) And Comparative Example 2). In addition, when the burr was removed and the periphery of the cylinder, that is, the processing chamber, was observed, the adhesion of the abrasive grains was confirmed on the wall surface of the blast processing chamber, and the evaluation of the scattering of the abrasive grains was "x". Further, when the classification mechanism connected to the jet processing apparatus is confirmed, it is confirmed that the workpiece W is mixed. It indicates that the workpiece is blown away from the cylinder in the burr removal process in accordance with the properties of the workpiece W.

[產業上之可利用性] [Industrial availability]

根據上述實施形態,可提供新的毛刺之去除方法。於該毛刺之去除方法中,藉由氣流而將研磨粒加速至特定之速度並將適合於毛刺之去除之運動能量賦予至研磨粒,具有該運動能量之研磨粒與工件碰撞或接觸,藉此將毛刺自工件去除。而且,該研磨粒及微粒子之全量由抽吸構件回收。藉此,獲得如下之效果。 According to the above embodiment, a new method of removing burrs can be provided. In the method for removing the burr, the abrasive particles are accelerated to a specific speed by a gas flow and the kinetic energy suitable for the removal of the burr is imparted to the abrasive particles, and the abrasive particles having the kinetic energy collide or contact with the workpiece. Remove the burrs from the workpiece. Further, the entire amount of the abrasive grains and the fine particles is recovered by the suction member. Thereby, the following effects are obtained.

(1)研磨粒不會飛散至周圍。 (1) The abrasive grains do not scatter to the surroundings.

(2)工件於毛刺之去除處理中不會飛出至加工容器外。 (2) The workpiece does not fly out of the processing container during the burr removal process.

(3)研磨粒之速度為10~30m/sec左右,可利用非常低之速度之研磨粒進行工件之毛刺之去除處理,故而可特別良好地進行燒成而形成燒結體之前之狀態之工件之毛刺之去除。 (3) The speed of the abrasive grains is about 10 to 30 m/sec, and the burrs of the workpiece can be removed by the abrasive grains having a very low speed, so that the workpieces before the sintering can be formed in a particularly good manner. Removal of burrs.

又,一實施形態之毛刺之去除方法亦可良好地應用於硬度相對較低之工件(例如,銅或鋁等)。 Further, the method of removing the burr of one embodiment can be favorably applied to a workpiece having a relatively low hardness (for example, copper or aluminum).

01‧‧‧去毛刺裝置 01‧‧‧Deburring device

10‧‧‧加工容器 10‧‧‧Processing containers

11‧‧‧加工盤 11‧‧‧Processing tray

11a‧‧‧第一面 11a‧‧‧ first side

11b‧‧‧第二面 11b‧‧‧ second side

12‧‧‧框體 12‧‧‧ frame

20‧‧‧攪拌機構 20‧‧‧Agitating mechanism

21‧‧‧保持構件 21‧‧‧ Keeping components

22‧‧‧旋轉機構 22‧‧‧Rotating mechanism

22a‧‧‧馬達 22a‧‧‧Motor

22b‧‧‧旋轉力傳遞構件 22b‧‧‧Rotary force transmission member

30‧‧‧研磨粒供給機構 30‧‧‧Abrasive grain supply mechanism

31‧‧‧貯存槽 31‧‧‧ Storage tank

32‧‧‧搬出部 32‧‧‧ Moving out

32a‧‧‧排出口 32a‧‧‧Export

40‧‧‧抽吸機構 40‧‧‧sucking mechanism

41‧‧‧抽吸部 41‧‧‧Sucking Department

42‧‧‧集塵器 42‧‧‧dust collector

43‧‧‧軟管 43‧‧‧Hose

43a‧‧‧第一軟管 43a‧‧‧First hose

43b‧‧‧第二軟管 43b‧‧‧second hose

50‧‧‧篩選機構 50‧‧‧ screening agency

G‧‧‧研磨粒 G‧‧‧ abrasive grain

W‧‧‧工件 W‧‧‧Workpiece

Claims (18)

一種毛刺之去除方法,其係將被處理品之毛刺去除者,且包含如下步驟:準備去毛刺裝置及複數個被處理品,該去毛刺裝置包含加工容器及產生抽吸力之抽吸機構;將上述複數個被處理品設置於上述加工容器;對設置於上述加工容器之上述複數個被處理品進行攪拌;使朝向被攪拌之狀態之上述複數個被處理品投入之研磨粒利用由上述抽吸機構之作動產生之氣流而加速至特定之速度,且使上述研磨粒與上述複數個被處理品接觸或碰撞而將上述複數個被處理品之毛刺去除。 A method for removing burrs, which is a burr remover of a processed article, and comprising the steps of: preparing a deburring device and a plurality of processed articles, the deburring device comprising a processing container and a suction mechanism for generating a suction force; The plurality of processed articles are placed in the processing container; the plurality of processed articles disposed in the processing container are stirred; and the plurality of processed articles placed in the agitated state are used for the polishing particles The airflow generated by the actuation of the suction mechanism is accelerated to a specific speed, and the abrasive grains are brought into contact with or collided with the plurality of processed articles to remove the burrs of the plurality of processed articles. 如請求項1之毛刺之去除方法,其中上述複數個被處理品之各者係藉由將原料粉末成形、或於將原料粉末成形之後煅燒而獲得。 The method for removing burrs of claim 1, wherein each of the plurality of processed articles is obtained by molding a raw material powder or calcining the raw material powder. 如請求項2之毛刺之去除方法,其中上述複數個被處理品之各者係由壓粉成形法而成形之陶瓷或磁性材料。 The method of removing burrs of claim 2, wherein each of the plurality of processed articles is a ceramic or magnetic material formed by a powder molding method. 如請求項1至3中任一項之毛刺之去除方法,其中於對上述複數個被處理品進行攪拌之步驟中,藉由使設置於上述加工容器之上述複數個被處理品為流動狀態而對上述複數個被處理品進行攪拌。 The method for removing burrs according to any one of claims 1 to 3, wherein, in the step of stirring the plurality of processed articles, the plurality of processed articles disposed in the processing container are in a flowing state The plurality of processed articles are stirred. 如請求項1至4中任一項之毛刺之去除方法,其中上述加工容器具備:加工盤,其具有第一面及上述第一面之相反側之面即第二面;及框體,其於上述加工盤之上述第一面中,包圍上述加工盤之 周緣;於上述加工盤,設置有於自上述第一面朝向上述第二面之方向貫通上述加工盤之複數個貫通孔,上述複數個貫通孔之各者具有能夠供上述研磨粒通過且無法供上述複數個被處理品之各者通過之大小,於將上述複數個被處理品設置於上述加工容器之步驟中,係將上述複數個被處理品載置於上述第一面。 The method of removing a burr according to any one of claims 1 to 4, wherein the processing container includes: a processing disk having a first surface and a surface opposite to the first surface, that is, a second surface; and a frame body Surrounding the processing disk in the first surface of the processing disk a plurality of through holes penetrating through the processing disk in a direction from the first surface toward the second surface, wherein each of the plurality of through holes has a passage for the polishing particles to be supplied In the step of providing the plurality of processed articles in the processing container by the size of each of the plurality of processed articles, the plurality of processed articles are placed on the first surface. 如請求項5之毛刺之去除方法,其中上述加工盤之厚度為30~100μm,上述加工盤之上述第一面與上述框體所成之稜角部係加工為半徑0.5~5.0mm之R面。 The method for removing burrs according to claim 5, wherein the processing disk has a thickness of 30 to 100 μm, and the first surface of the processing disk and the edge portion formed by the frame are processed into an R surface having a radius of 0.5 to 5.0 mm. 如請求項5或6之毛刺之去除方法,其中上述抽吸機構配置於上述第二面側,上述氣流為自上述第一面朝向上述第二面之氣流。 The method of removing burrs according to claim 5 or 6, wherein the suction mechanism is disposed on the second surface side, and the air flow is an air flow from the first surface toward the second surface. 如請求項5至7中任一項之毛刺之去除方法,其進而包含回收上述研磨粒之步驟,於將上述複數個被處理品之毛刺去除之步驟中,上述研磨粒係自上述第一面側朝向上述複數個被處理品投入,於回收上述研磨粒之步驟中,將到達上述第二面之上述研磨粒由上述抽吸機構抽吸並加以回收。 The method for removing burrs according to any one of claims 5 to 7, further comprising the step of recovering the abrasive particles, wherein the polishing particles are from the first surface in the step of removing the burrs of the plurality of processed articles The side is directed toward the plurality of processed articles, and in the step of recovering the abrasive grains, the abrasive grains reaching the second surface are sucked by the suction mechanism and recovered. 如請求項5至8中任一項之毛刺之去除方法,其中每單位時間到達上述第二面之上述研磨粒之量相對於每單位時間自上述第一面側朝向被攪拌之上述複數個被處理品投入之上述研磨粒之量之比例為80~95重量%。 The method for removing burrs according to any one of claims 5 to 8, wherein the amount of the abrasive grains reaching the second surface per unit time is a plurality of the above-mentioned plurality of being agitated from the first surface side with respect to the unit surface time. The ratio of the amount of the above-mentioned abrasive grains to which the treated product is charged is 80 to 95% by weight. 如請求項5至9中任一項之毛刺之去除方法,其中每單位時間自上述第一面側朝向上述複數個被處理品投入之上述研磨粒之體 積相對於每單位時間由上述抽吸機構抽吸之抽吸流量之比例為10~50體積%。 The method for removing burrs according to any one of claims 5 to 9, wherein the body of the abrasive grains which is supplied from the first face side toward the plurality of processed articles per unit time The ratio of the suction flow rate by the suction mechanism per unit time is 10 to 50% by volume. 如請求項1至10中任一項之毛刺之去除方法,其中於對上述複數個被處理品進行攪拌之步驟中,藉由對上述複數個被處理品進行攪拌,而上述毛刺之固著力變弱。 The method for removing burrs according to any one of claims 1 to 10, wherein in the step of stirring the plurality of processed articles, the squeezing force of the burrs is changed by stirring the plurality of processed articles weak. 如請求項1至11中任一項之毛刺之去除方法,其中上述研磨粒與上述複數個被處理品接觸或碰撞時之上述研磨粒之速度為5~30m/sec。 The method for removing burrs according to any one of claims 1 to 11, wherein the abrasive grains have a velocity of 5 to 30 m/sec when the abrasive grains are in contact with or collided with the plurality of processed articles. 如請求項1至12中任一項之毛刺之去除方法,其進而包含對上述氣流進行整流之步驟,於上述整流步驟中,藉由對上述氣流進行整流,而控制上述研磨粒與上述複數個被處理品接觸或碰撞之態樣。 The method for removing burrs according to any one of claims 1 to 12, further comprising the step of rectifying said gas stream, wherein said refining step controls said abrasive grains and said plurality of particles in said rectifying step The contact or collision of the treated product. 如請求項1至13中任一項之毛刺之去除方法,其中於對上述複數個被處理品進行攪拌之步驟中,藉由使上述加工容器以特定之角度傾斜配置,使上述加工容器旋轉,而對上述複數個被處理品進行攪拌。 The method for removing burrs according to any one of claims 1 to 13, wherein in the step of stirring the plurality of processed articles, the processing container is rotated by arranging the processing container at a specific angle, The plurality of processed articles are stirred. 如請求項14之毛刺之去除方法,其中上述特定之角度為30~70°。 The method of removing burrs of claim 14, wherein the specific angle is 30 to 70 degrees. 如請求項14或15之毛刺之去除方法,其中上述加工容器之旋轉速度為臨界旋轉速度之5~50%。 The method for removing burrs of claim 14 or 15, wherein the processing vessel has a rotational speed of 5 to 50% of the critical rotational speed. 如請求項1至16中任一項之毛刺之去除方法,其中上述複數個被處理品之各者之一邊為100~1600μm。 The method of removing burrs according to any one of claims 1 to 16, wherein one of the sides of the plurality of processed articles is 100 to 1600 μm. 一種去毛刺裝置,其係用以將被處理品之毛刺去除者,且具備:加工容器,其用以設置複數個被處理品;攪拌機構,其對設置於上述加工容器之上述複數個被處理品 進行攪拌;研磨粒供給機構,其朝向藉由上述攪拌機構而攪拌之狀態之上述複數個被處理品投入研磨粒;及抽吸機構,其藉由抽吸力而於自上述研磨粒供給機構朝向上述加工容器之方向產生氣流;上述抽吸機構使藉由上述研磨粒供給機構朝向上述複數個被處理品投入之上述研磨粒藉由上述氣流而加速至特定之速度,且使經加速之上述研磨粒與上述複數個被處理品接觸或碰撞,藉此將上述複數個被處理品之毛刺去除。 A deburring device for removing a burr of a processed article, and comprising: a processing container for arranging a plurality of processed articles; and a stirring mechanism for processing the plurality of the plurality of processed containers disposed in the processing container Product Stirring; an abrasive grain supply mechanism that applies the abrasive grains to the plurality of processed articles in a state of being stirred by the stirring mechanism; and a suction mechanism that is oriented by the suction force from the abrasive grain supply mechanism An air flow is generated in a direction of the processing container, and the suction mechanism accelerates the polishing particles introduced into the plurality of processed articles by the polishing grain supply mechanism to a specific speed by the air flow, and accelerates the polishing. The granules are in contact with or collided with the plurality of processed articles, whereby the burrs of the plurality of processed articles are removed.
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JPWO2016092975A1 (en) 2017-09-14
KR102432764B1 (en) 2022-08-17
EP3231556A1 (en) 2017-10-18
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JP6489131B2 (en) 2019-03-27
TWI673140B (en) 2019-10-01

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