TW201623413A - Resin composition, resin film, resin cured product, electronic component, and method for manufacturing electronic component - Google Patents

Abstract

A resin composition containing a (meth)acrylic polymer as a component (A), a polymerizable compound as a component (B), and a polymerization initiator as a component (C), the component (B) including a (meth)acrylic-modified siloxane oligomer.

Description

Resin composition, resin film, resin cured product, electronic parts and electronic zero Manufacturing method

The present invention relates to a resin composition, a resin film, a cured resin, an electronic component, and a method of producing an electronic component.

Conventionally, an optical device material, a material for an optical component, or a sealing material (particularly, a sealing material for a light-emitting diode (LED) device) is generally an epoxy resin.

In recent years, when white LEDs are attracting attention, epoxy resin sealing materials have caused the following problems and it is urgent to cope with such problems: yellowing due to ultraviolet rays, etc., and an increase in heat generation due to miniaturization Cracking, etc., have not been considered a problem so far. In response to such a problem, attempts have been made to use a silicone resin as a molding material for an LED element (see Patent Document 1, Patent Document 2) or a color filter material (see Patent Document 3), but the actual use example is very less. Further, research has been conducted on a cured product of a silicone resin having a large amount of a phenyl group in its molecule (see Patent Document 4).

[Previous Technical Literature] (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open No. Hei 10-228249

Patent Document 2: Japanese Patent Laid-Open No. Hei 10-242513

Patent Document 3: Japanese Laid-Open Patent Publication No. 2000-123981

Patent Document 4: Japanese Laid-Open Patent Publication No. 2010-180323

The following advantages are sought for the sealing material: no matter what the hardened state (thermal hardening, photohardening, etc.), cracking is unlikely to occur even if it hardens in a short time. However, the conventional silicone resin causes cracking and film loss due to rapid hardening at high temperatures. Thus, a sealing material which is less prone to cracking even if it hardens in a short time is sought. Further, for the sealing material, there is sought an advantage that transparency can be ensured even if an electronic component (LED or the like) becomes high temperature.

The present invention has been made in view of the problems of the above-described conventional techniques, and an object thereof is to provide a resin composition which is less likely to be cracked even if it is hardened in a short period of time, and which is excellent in transparency even when exposed to high temperatures. Moreover, an object of the present invention is to provide a resin film, a cured resin, an electronic component, and a method of producing an electronic component, which use the resin composition described above.

One aspect of the present invention relates to a resin composition comprising: (A) component: (meth)acrylic polymer; (B) component: poly And a component (C): a polymerization initiator; and the component (B) contains a (meth)acrylic modified alkoxysilane oligomer.

The resin composition according to the above aspect of the present invention is less likely to be cracked even if it is hardened in a short period of time, and is excellent in transparency even when exposed to high temperatures. Such a resin composition can be cured in a short time and is excellent in transparency. Further, such a resin composition can be used as a transparent sealing material (for example, a transparent sealing material for LEDs).

The weight average molecular weight of the aforementioned component (A) may be from 100,000 to 800,000. Thereby, the resin composition can be easily formed into a film shape by coating or the like, and can be easily handled.

The (meth)acrylic modified alkoxysilane oligomer may have a contact angle with water of from 60 to 100.

The (meth)acryl-based modified methoxy olefin oligomer may have a (meth) acrylonitrile group and an alkoxy group.

The resin composition according to the above aspect of the invention may further contain a phosphor.

Another aspect of the invention relates to a resin film comprising a support and a resin composition layer, wherein the resin composition layer is disposed on the support, and the resin composition layer contains the resin composition.

Another aspect of the invention relates to a cured resin comprising a cured product of the above resin composition or a cured product of the resin composition of the resin film.

Another aspect of the present invention relates to an electronic component including an optical component and a sealing member, the optical component being one of a light emitting component and a light receiving component, the sealing component for sealing the optical component, and the sealing The member includes the resin composition, the resin composition of the resin film, or the cured resin.

According to another aspect of the invention, there is provided a method of producing an electronic component, comprising the steps of: sealing a light-emitting element or a light-receiving element by using the resin composition or the resin composition of the resin film; and a step of hardening the aforementioned resin composition.

Another aspect of the present invention relates to an electronic component comprising: the structure obtained by the method of manufacturing the electronic component.

According to the present invention, it is possible to provide a resin composition which is less likely to be cracked even in a short period of time (for example, preferably within about 2 hours, more preferably within about 30 minutes), and is transparent even when exposed to high temperatures. Sexuality is still excellent. Further, an object of the present invention is to provide a resin film, a cured resin, an electronic component, and a method of producing an electronic component, which use the above resin composition. Moreover, according to the present invention, it is possible to manufacture an electronic component which is excellent in productivity and heat resistance.

According to the invention, it is possible to provide a resin composition or a resin film which is applied to the production of electronic parts by using a resin composition or a resin film. According to the present invention, it is possible to provide a resin composition, a resin film or a cured resin which is applied to a light-emitting element or a light-receiving element by using a resin composition, a resin film or a resin cured product. seal. According to the present invention, it is possible to provide a use of a cured resin which is applied to an electronic component.

2‧‧‧Support

4‧‧‧Resin composition layer (film-like curable resin composition)

4a‧‧‧The outer edge of the resin composition layer

4b‧‧‧The main surface of the resin composition layer opposite to the substrate

4c‧‧‧ wall of resin composition

4d‧‧‧ Sealing member

6‧‧‧Laminated film

8‧‧‧Fertior

10‧‧‧Substrate

12‧‧‧Adhesive

14‧‧‧Light components

16‧‧‧ Gold wire

18‧‧‧Component components

18a‧‧‧ Surface of the light element side of the component member

20‧‧‧Electronic parts

30‧‧‧LED package

31‧‧‧ lead frame

32‧‧‧Silver-plated reflective material

33‧‧‧Core material

34‧‧‧LED components

35‧‧‧ Gold wire

36‧‧‧ reflector

Fig. 1 is a flow chart showing an embodiment of a method of manufacturing an LED package using a resin film.

Fig. 2 is a cross-sectional view showing the structure of an LED package used in the examples and the comparative examples.

[Preferred form of implementing the invention]

Hereinafter, embodiments of the present invention will be described in detail. Other embodiments can be studied and produced without departing from the scope and spirit of the invention. Therefore, the following "embodiment" should not be construed as meaning limiting.

In the present specification, the term "(meth)acrylic" means "acrylic" or "methacrylic" corresponding thereto. Other similar performances such as (meth)acrylonitrile are also the same. Further, "(meth)acrylic acid..." is sometimes referred to as "(meth)acrylic acid ester].

In the present specification, the "substituent" may further include, for example, a halogen atom such as a fluorine atom or a chlorine atom; an alkyl group, an allyl group, an ether group, an ester group, a carboxyl group, a cyano group or the like.

In the present specification, the term "transparency" means the penetration of visible light. In addition, the term "heat resistance" means the visible light transmittance of the cured product of the resin composition after heating at 200 ° C for 72 hours.

In the present specification, the term "layer" includes a structure formed in a part of a shape other than the structure formed on the entire surface in a plan view.

In this specification, the term "step" is used in this term as long as it can not be clearly distinguished from other steps, as long as it can achieve the intended purpose of the step.

In the present specification, the numerical range expressed by "~" is a range indicating the values indicated before and after the "~" as the minimum value and the maximum value, respectively. In the numerical range described in stages in this specification, the upper or lower limit of the numerical range of a certain stage may be replaced with the upper or lower limit of the numerical range of the other stage. In the numerical ranges described in the specification, the upper limit or the lower limit of the numerical range may be replaced with the values disclosed in the examples. The "A or B" may include either A or B, and may include both A and B. In the present specification, the content of each component in the composition, when a plurality of substances corresponding to the respective components are present in the composition, unless otherwise specified, means the total amount of the plurality of substances present in the composition. In the present specification, "room temperature" means 25 °C.

<Resin composition and cured resin>

The resin composition of the present embodiment contains: (A) component: (meth)acrylic polymer; (B) component: a polymerizable compound; and (C) component: a polymerization initiator; and (B) The component contains a (meth)acrylic modified siloxane oligomer. In the present specification, these components may be simply referred to as "(A) component", "(B) component", "(C) component", and the like.

By using the resin composition containing the component (A) to the component (C), it is possible to form a transparent sealing material which is less likely to crack even if it is hardened in a short time, and has high transparency even when exposed to high temperatures. .

Here, the inventors believe that the reason why the above-described excellent effects can be obtained is as follows. In general, a (meth)acrylic polymer has high transparency, but may have poor heat resistance.

Then, the inventors of the present invention have made efforts to carry out research, and have found out the fact that a (meth)acrylic polymer, a polymerizable compound, and a polymerization initiator are used, and the polymerizable compound contains (meth)acrylic acid. The fluorene oxide oligomer is excellent in initial transparency (transparency before exposure to high temperature), and is excellent in transparency (that is, heat resistance) even when exposed to high temperatures. In our opinion, the network of the decane bond in the (meth)acrylic modified oxene oxide oligomer protects the resin composition and is excellent in heat resistance. In addition, we believe that the aforementioned network of siloxane chains protects the resin composition and inhibits cracking even in a short period of time. Furthermore, we believe that when a radical polymerization initiator is used to generate a radical polymerization reaction, it is easy to harden in a short time.

The resin composition of the present embodiment can be cured in a short period of time and has excellent transparency, and is excellent in transparency (heat resistance) when exposed to a high temperature. In other words, the resin composition and the cured product of the present embodiment are not easily turbid (the change in transparency before and after exposure to high temperatures is small), and therefore can be suitably used for a sealing material for an LED element, a material for an optical lens, and an optical member. (light guide plate, etc.), etc. In other words, the resin composition and the cured product of the present embodiment can be used for optical (especially for optical member sealing) and can be used to form an optical member.

Further, the resin composition of the present embodiment can contain other components as needed.

Each component contained in the resin composition of the present embodiment will be described below.

((A) component: (meth)acrylic polymer)

The "(meth)acrylic polymer" is, for example, a polymer (homopolymer) having a structure obtained by polymerizing one type of (meth)acrylic monomer, a polymer having a structure in which one or more (meth)acrylic monomers are combined and copolymerized by copolymerization of two or more kinds of the (meth)acrylic monomers (copolymerization) Or a polymer (copolymer) having a structure obtained by copolymerizing the above (meth)acrylic monomer with another monomer. The monomer copolymerizable with the (meth)acrylic monomer may, for example, be a compound having two or more (meth)acrylonium groups in the molecule; one polymerizable unsaturated bond in the molecule and not a polymerizable compound having a (meth) acrylonitrile group (for example, (meth)acrylonitrile, styrene, and ethyl acetate An ester and an olefin (such as ethylene or propylene); a polymerizable compound (divinylbenzene or the like) having two or more polymerizable unsaturated bonds in the molecule and having no (meth) acrylonitrile group.

When it is based on the total amount of the component (A), the component (A) preferably contains from 1 to 100% by mass of a structural unit derived from a (meth)acrylic monomer, from the viewpoint of low elasticity and excellentness. The (meth)acrylic monomer has one (meth)acryl fluorenyl group in the molecule. When it is based on the total amount of the component (A), the component (A) preferably contains 50 to 100% by mass of a structural unit derived from a (meth)acrylic monomer, from the viewpoint of excellent compatibility. The (A) component is more preferably a structural unit derived from a (meth)acrylic monomer, and the (meth)acrylic monomer is contained in an amount of 70 to 100% by mass in terms of compatibility and storage stability. There is one (meth) acrylonitrile group in the molecule.

From the viewpoint of further improving the transparency, the component (A) is preferably a structural unit represented by the following formula (I), (II) or (III). The structural unit represented by the formula (II) excludes the structural unit represented by the formula (I). The structural unit represented by the formula (III) is excluded from the structural unit represented by the formula (I) or (II).

In the formula (1), X represents a substituent containing an alicyclic hydrocarbon group having 5 to 22 carbon atoms; and R ₁ represents a hydrogen atom or a methyl group.

In the formula (II), Y represents a substituent containing a hydrocarbon group having 1 to 10 carbon atoms, and is not limited to a substituent of X of the formula (I); and R ₂ represents a hydrogen atom or a methyl group.

In the formula (III), Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amine group, a decylamino group, an epoxy group, and a nitrile group, but is equivalent to X of the formula (1) or a substituent of Y of the formula (II); R ₃ represents a hydrogen atom or a methyl group.

From the viewpoint of further improving heat resistance, the component (A) is preferably a structural unit represented by the formula (I). From the viewpoint of further reducing the elastic modulus of the cured product in order to reduce the stress generated by the hardening, the component (A) is preferably a structural unit represented by the formula (II). From the viewpoint of further improving the gas barrier properties of the cured product to the adherend, it is preferred to have a structural unit represented by the formula (III).

The structural unit represented by the formula (I) may also be referred to as a structural unit derived from an alicyclic monomer (a monomer capable of obtaining a structural unit represented by the formula (I), hereinafter the same) (derived from The ester-bonded moiety has a structural unit of a (meth) acrylate containing a substituent of an alicyclic hydrocarbon group having 5 to 22 carbon atoms. The structural unit represented by the formula (II) may also be referred to as a structural unit derived from a (meth) acrylate having a substituent having a hydrocarbon group having 1 to 10 carbon atoms bonded to the ester group. The structural unit represented by the formula (III) may also be referred to as a structural unit derived from a functional group-containing monomer (a monomer capable of obtaining a structural unit represented by the formula (III), the same applies hereinafter). The ester-bonded moiety has a structural unit of a (meth) acrylate of a functional group represented by Z of the formula (III). The "parts bonded to an ester group" means ^a portion of R ^b in [R ^a -C(=O)-OR ^b ] containing an ester bond, and as long as the group of the object is directly or indirectly bonded to the ester group The oxygen atom can be bonded.

In the general formula (I), from the viewpoint of further excellent heat resistance, an alicyclic hydrocarbon group having 5 to 22 carbon atoms is derived from a cyclohexyl group, a cyclopentyl group, an isobornyl group, a norbornyl group, and a tricyclic ring. At least one selected from the group consisting of a group and an adamantyl group is preferred, and a tricyclic fluorenyl group is preferred.

From the viewpoint of low elasticity and more excellent, the structural unit represented by the formula (II) preferably has a hydrocarbon group having 1 to 10 carbon atoms in a portion directly bonded to the ester group, and is directly bonded to the ester group. It is preferred that the knot portion has a linear hydrocarbon group or a branched hydrocarbon group having 1 to 10 carbon atoms. Among them, from the viewpoint of further lowering the modulus of elasticity, the structural unit represented by the formula (II) preferably has a branched hydrocarbon group having 1 to 10 carbon atoms in a portion directly bonded to the ester group. From the same viewpoint, the branched hydrocarbon group is preferably a structural unit represented by the following formula (IV). From the viewpoint of further improving the transparency, the carbon number of the alkyl group of R ₅ and R ₆ is preferably from 1 to 5, more preferably from 2 to 4.

In the formula (IV), R ₄ represents a hydrogen atom or a methyl group; and R ₅ and R ₆ each independently represent a linear alkyl group.

In the general formula (III), the component (A) preferably has an epoxy group from the viewpoint of further excellent heat resistance of the cured product and further reduction of odor. Thereby, as the epoxide is subjected to ring-opening polymerization, gas barrier properties are more excellent.

The alicyclic monomer may, for example, be a tricyclo[5.sup.1] ( ^2,6 ] y-8-ester, a cyclohexyl (meth) acrylate or a norbornyl (meth) acrylate. And adamantyl (meth)acrylate. The (meth) acrylate having a substituent having a hydrocarbon group having 1 to 10 carbon atoms bonded to the ester group may, for example, be an alkyl (meth)acrylate (butyl (meth)acrylate, (A) Base) 2-ethylhexyl acrylate, etc.). Examples of the functional group-containing monomer include glycidyl (meth)acrylate, hydroxyl group-containing (meth)acrylic acid (2-hydroxymethyl (meth)acrylate), and amino group-containing (meth)acrylic acid ( (ethylaminoethyl (meth) acrylate), etc.).

A cyanoethylene compound (nitrile monomer) such as acrylonitrile or methacrylonitrile is colored in combination with moisture in the air, and therefore it is preferably not used in the component (A). In other words, component (A) has nitrogen The content of the structural unit of the atomic group may be 5% by mass or less of the entire component (A), may be 3% by mass or less of the entire component (A), or may be 1% by mass or less of the entire component (A). The component (A) may not contain a structural unit having a nitrogen atom-containing group.

The component (A) can be used alone or in combination of two or more. The component (A) can be synthesized, for example, by the following method, but is not limited thereto.

300 g of tricyclo [5.2.1.0 ^2,6 ]癸-8-ester ("FA-513A (Hitachi Kasei Co., Ltd.)"), 350 g of butyl acrylate (BA), and 300 g of butyl methacrylate (BMA) 50 g of glycidyl methacrylate (GMA) and 50 g of 2-ethylhexyl methacrylate (2EHMA) were mixed to obtain a monomer mixture. Further, 5 g of lauryl peroxide and 0.45 g of n-octyl mercaptan (chain transfer agent) were dissolved in the obtained monomer mixture to obtain a mixed liquid.

Into a 5 L autoclave equipped with a stirrer and a cooler, 0.04 g of polyvinyl alcohol as a suspending agent and 2000 g of ion-exchanged water were added and stirred. Then, the mixed liquid was added while stirring, and polymerization was carried out at 60 ° C for 5 hours in a nitrogen atmosphere at a stirring speed of 250 min ^-1 , and then polymerization was carried out at 90 ° C for 2 hours to obtain resin particles. The resin particles are washed with water, dehydrated, and dried, whereby the component (A) can be obtained.

In the component (A), the mixing ratio of each monomer (the monomer capable of obtaining the structural unit of the component (A)) is preferably a ratio such that the total mass of the monomer of the structural unit capable of obtaining the component (A) is obtained. Become 100 quality In the manner of 5 to 94.5 parts by mass of the alicyclic monomer, 5 to 70 parts by mass of the (meth) acrylate having a substituent of a hydrocarbon group having 1 to 10 carbon atoms bonded to the ester group, and a functional group The base monomer is mixed in an amount of 0.5 to 30 parts by mass and 0 to 90 parts by mass of the monomer copolymerizable therewith.

In the component (A), the content of the alicyclic monomer (the monomer capable of obtaining the structural unit represented by the formula (I)) is 5 parts by mass based on 100 parts by mass of the monomer capable of obtaining the structural unit of the component (A). It is preferably 9 to 9 parts by mass, and more preferably 10 to 80 parts by mass from the viewpoint of further improving moisture absorption and mechanical strength. When the content of the alicyclic monomer is 5 parts by mass or more, the hygroscopicity can be further improved. When the content is 94.5 parts by mass or less, the mechanical strength can be further improved.

In the component (A), (meth)acrylic acid having a substituent having a hydrocarbon group having 1 to 10 carbon atoms in a portion bonded to the ester group with respect to 100 parts by mass of the monomer capable of obtaining the structural unit of the component (A) The content of the ester (the monomer capable of obtaining the structural unit represented by the formula (II)) is preferably from 5 to 70 parts by mass, and from the viewpoint of further improving the electric corrosion resistance and further reducing the elastic modulus, ~65 parts by mass is preferred. When the content of the (meth) acrylate having a substituent having a hydrocarbon group having 1 to 10 carbon atoms in the portion bonded to the ester group is 5 parts by mass or more, the electrolytic corrosion resistance can be further improved. When the content is 70 parts by mass or less, the glass transition temperature can be sufficiently increased.

In the component (A), the functional group-containing monomer is contained in an amount of 100 parts by mass based on the monomer capable of obtaining the structural unit of the component (A). The content of the monomer of the structural unit shown in (III) is preferably 0.5 to 30 parts by mass, more preferably 1 to 20 parts by mass. When the content of the functional group-containing monomer is 0.5 parts by mass or more, the adhesion and strength can be further improved. When the content is 30 parts by mass or less, the crosslinking reaction is less likely to occur at the time of copolymerization, and the storage stability can be improved.

From the viewpoint of further improving the transparency, the weight average molecular weight (Mw) of the component (A) is preferably from 100,000 to 1,000,000, more preferably from 100,000 to 800,000. The weight average molecular weight is within this range, that is, the resin composition can be easily formed into a film shape, and the light-emitting element or the light-receiving element (for example, the light-emitting element or the upper portion of the light-receiving element provided on the substrate) can be easily sealed. Among them, from the viewpoint of further improving the handleability of the film, the weight average molecular weight of the component (A) is preferably from 150,000 to 750,000. In particular, the upper limit of the weight average molecular weight of the component (A) may be 600,000, 500,000 or 400,000 from the viewpoint of improving the filling property of the transmitting element or the light receiving element.

The above weight average molecular weight (Mw) was measured in the following manner. The weight average molecular weight was determined by using a tetrahydrofuran (THF) as a solution and measuring by a gel permeation chromatography (GPC) method, and converting it into standard polystyrene. The details of the above GPC method are as follows.

‧Device name: HLC-8220GPC (product name, manufactured by TOSOH Co., Ltd.)

‧Tube: Gelpack R-420, R-430, R-440 (product name, manufactured by Hitachi Chemical Co., Ltd.)

‧Detector: Refractive Index (RI) Detector

‧column temperature: 40 ° C

‧Solution: tetrahydrofuran (THF)

‧ Flow rate: 1mL / minute

‧Standard material: polystyrene

The commercially available product of the component (A) is, for example, HTR-860P-3 (Mw = 700,000 to 900,000, manufactured by Nagase ChemteX Co., Ltd.).

((B) component: polymerizable compound)

The "polymerizable compound" is not particularly limited as long as it is a compound capable of being polymerized, and examples thereof include a photopolymerizable compound and a thermally polymerizable compound. The photopolymerizable compound may, for example, be a compound having at least one unsaturated bond or the like.

The resin composition of the present embodiment contains a (meth)acrylic modified naphthenic compound as a polymerizable compound. As the (meth)acrylic modified siloxane derivative, a (meth)acrylic modified methoxy olefin oligomer can be used. The (meth)acrylic modified methoxy olefin oligomer can also be referred to as a methoxy olefin oligomer having a (meth) acrylonitrile group. By using a (meth)acrylic modified siloxane oligomer, the compatibility with the component (A) can be improved, and transparency and heat resistance can be improved. The aforementioned alkoxysilane oligomer may also be a sesquioxane. The aforementioned (meth)acrylic acid reform The oxime oxime oligomer can be used alone or in combination of two or more.

In the present specification, "oligomer" is understood to mean that the molecular weight is easily distinguished from the "polymer". The "oligomer" means a compound having a weight average molecular weight (Mw) of 1,000 or more and 10,000 or less. The term "polymer" means a high molecular weight compound having a Mw of more than 10,000.

The upper limit of the weight average molecular weight of the (meth)acrylic modified alkoxysilane oligomer is preferably less than 10,000, more preferably 9,000 or less, still more preferably 8,000 or less. The lower limit of the weight average molecular weight is preferably 1,000 or more, more preferably 2,000 or more, and still more preferably 3,000 or more. When the weight average molecular weight is within these ranges, the compatibility with the component (A) can be improved, and the transparency is further improved.

From the viewpoint of further increasing the hardness of the cured product, the (meth)acrylic modified alkoxysilane oligomer preferably has a structure represented by the following formula (1). The (meth)acryl-based modified methoxy olefin oligomer may have a hydroxyl group which is formed by bonding a hydrogen atom to an oxygen atom in the formula (1). The (meth)acrylic modified siloxane oxide oligomer may have an alkoxy group which is an alkyl group (for example, an alkyl group having 1 to 4 carbon atoms) and an oxygen atom bond in the formula (1). Formed by the knot.

In the formula (1), R represents an alkyl group, a group represented by the following formula (1a) (a group having a (meth)acrylinyl group), or a group represented by the following formula (1b) (having oxygen) The alkyl group of the heterocyclobutane group; the alkyl group may, for example, be an alkyl group having 1 to 6 carbon atoms.

In the formula (1a), R ^1a represents a hydrogen atom or a methyl group; and m1 represents 0 to 20.

In the formula (1b), m2 represents 0 to 20.

M1 and m2 represent the number of structural units of the structural unit. Therefore, m1 and m2 represent integer values in a single base, and are rational numbers representing average values in a plurality of sets of bases. In the formula (1a) and the formula (1b), m1 and m2 may be independently 15 or less or 10 or less, from the viewpoint of further improving the hardness even if the curing time is short. From From the viewpoint of excellent long-term storage stability, m1 and m2 may be independently 1 or more or 2 or more.

From the viewpoint of further improving the hue and transparency of the cured product, in the formula (1), R may be a group represented by the formula (1a). From the viewpoint of further increasing the hardness, in the formula (1), R may be a group represented by the formula (1b).

From the viewpoint of further increasing the crosslinking density and further increasing the hardness of the cured product, the number of (meth)acrylonitrile groups in the (meth)acrylic modified alkoxysilane oligomer may be 3 or more. 10 or more. The number of the aforementioned (meth) acrylonitrile groups may be 5,000 or less or 3,000 or less.

From the viewpoint of excellent long-term storage stability, the total number of alkoxy groups and hydroxyl groups bonded to a ruthenium atom in the (meth)acrylic modified siloxane oxide oligomer is one atom per atom. The average number may be two or less, 1.5 or less, one or less, or 0.5 or less.

The (meth)acrylic modified alkoxysilane oligomer may have a contact angle with respect to water of 60° to 100°, may be 55° to 95°, or may be 60° to 90°. The component (B) contains a (meth)acrylic modified siloxane compound having a contact angle within such a range, that is, the compatibility with the component (A) can be further improved, and the transparency and heat resistance are further improved. In particular, when the weight average molecular weight of the component (A) is from 100,000 to 800,000, the contact angle of the (meth)acrylic modified alkoxysilane oligomer to water is within the above range, that is, the transparency and heat resistance can be further improved. Sex.

The contact angle of the (meth)acrylic modified siloxane oligomer to water is a value obtained by measuring using a contact angle measuring device (for example, "DropMaster 500"). More specifically, the contact angle can be obtained by: (meth)acrylic modified methoxy olefin oligomer and polymerization initiator (LUCIRIN TPO) (relative to (meth)acrylic modified oxime The alkane oligomer was mixed at 1% by mass and irradiated with an exposure amount of 4000 mJ/cm ² to obtain a cured product. With respect to the obtained cured product, the liquid amount of pure water was set to 1 μL, and the contact angle was measured from the shape of water droplets after dropping for 500 msec. Further, the value after the dropping of 500 msec was measured five times, and three values other than the maximum value and the minimum value among the five measurement results were averaged.

The (meth)acryl-based modified methoxy olefin oligomer may have a (meth) acrylonitrile group and an alkoxy group. Thereby, the compatibility with the component (A) can be further improved, and the transparency is further improved.

The content of the (meth)acrylic modified alkoxysilane oligomer is preferably from 1 to 99 parts by mass, and preferably from 5 to 95 parts by mass, per 100 parts by mass of the component (B). When the content is within these ranges, the compatibility with the component (A) can be further improved, and the transparency is further improved.

The content of the (meth)acrylic modified alkoxysilane oligomer may be 3 to 45 parts by mass, 5 to 42 parts by mass, or 10 to 40 parts by mass based on 100 parts by mass of the component (A). When the content is 3 parts by mass or more, the transparency tends to be further improved. When the content is 45 parts by mass or less, it is possible to further suppress the occurrence of initial cracking.

The component (B) can contain a polymerizable compound other than the above (meth)acrylic modified siloxane oligomer. Examples of such a polymerizable compound include a decane compound and a (meth)acrylic compound (excluding a compound corresponding to a decane compound). Among them, a decane compound is preferred from the viewpoint of being more excellent in compatibility with the component (A).

A decane compound can be used as the polymerizable compound other than the (meth)acrylic modified alkoxysilane oligomer. The resin composition contains a decane compound, that is, it is possible to further improve the adhesion between the cured product obtained by curing the resin composition and the surface to be adhered.

The decane compound may, for example, be a compound having an epoxy group, an imidazolium compound, a decane compound having a (meth) acrylonitrile group, a decane compound having a ureido group, a decane compound having a vinyl group, or a urea propyl triethoxy group. Decane, decanediol compound, stanol compound, decane triol compound, 1,4-bis(trihydroxydecyl)benzene, 1,4-bis(alkyldihydroxydecyl)benzene, 1,4-double ( Dialkyl hydroxy fluorenyl) benzene and the like. As the decane compound having an epoxy group, for example, a compound represented by the following formula (3) can be used.

In the formula (3), R ⁷ represents a divalent group, and R ⁸ represents a monovalent group; and a plurality of R ⁸ in the same molecule may be the same or different from each other.

In the general formula (3), R ⁷ is preferably a linear alkyl group represented by -(CH ₂ ) _n - (n = 1 to 10) from the viewpoint of further improving the adhesion to the substrate. . From the viewpoint of further improving sensitivity and resolution, R ^{8 is} preferably an alkoxy group or an alkoxyalkyl group. Among them, R ^{8 is particularly} preferable as an alkoxy group from the viewpoint of being inexpensive and easily available, and further improving the adhesion to the substrate. The alkoxy group may, for example, be a methoxy group or an ethoxy group. Examples of the decane compound having an alkoxy group include glycidoxypropyl trialkoxy decane (3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, etc.). ).

The decane compound having a (meth) acrylonitrile group may, for example, be (meth) propylene decyloxytrialkoxy decane (3-(methyl) propylene decyloxytrimethoxy decane).

The decane compound may be used alone or in combination of two or more.

The content of the aforementioned decane compound is preferably less than 40 parts by mass based on 100 parts by mass of the component (A). When the content is less than 40 parts by mass, it is possible to further suppress the occurrence of initial cracking. Among them, 0.1 to 35 parts by mass, preferably 0.3 to 30 parts by mass, more preferably 0.5 to 25 parts by mass. When the content is within the above range, the adhesion to the substrate and the hardness of the cured product can be further improved while suppressing white turbidity.

A (meth)acrylic compound can be used as the polymerizable compound other than the (meth)acrylic modified hafnoxy compound and the above decane compound. The above-mentioned (meth)acrylic compound can be used alone or in combination of two or more.

A (meth)acrylic compound is a polyfunctional (meth)acrylic compound. The resin composition contains the above-mentioned polyfunctional (meth)acrylic compound, that is, the hardness of the cured product can be further enhanced. The "polyfunctional (meth)acrylic compound" is not particularly limited as long as it has two or more (meth)acrylonitrile groups. For example, a (meth)acrylic compound having an alicyclic skeleton, a (meth)acrylic compound having an aliphatic skeleton, a (meth)acrylic compound having a functional group, and the like can be given. In the (meth)acrylic compound having a functional group, the "functional group" may, for example, be a hydroxyl group, a carboxyl group or an amine group.

The (meth)acrylic compound having an alicyclic skeleton may, for example, be cyclohexane-1,4-dimethanol di(meth)acrylate or cyclohexane-1,3-dimethanol di(methyl). Acrylate, tricyclodecane dihydroxymethyl (meth)acrylate (for example, "KAYARAD R-684 (Japan Chemical Co., Ltd.)"), tricyclodecane dimethanol di(meth)acrylate (for example) "A-DCP (Xinzhongcun Chemical Industry Co., Ltd.)"), neopentyl glycol di(meth)acrylate, (poly)ethylene oxide modified neopentyl glycol di(meth)acrylate, hydroxyl Trimethylacetic acid neopentyl glycol di(meth)acrylate and the like.

From the viewpoint of further increasing the transmittance of the cured product, among the (meth)acrylic compounds having an alicyclic skeleton, the di(meth)acrylate and tricyclodecane are derived from dioxanediol. Preferably, at least one selected from the group consisting of dimethanol di(meth)acrylate is preferred from dioxanediol diacrylate or tricyclodecane dimethanol diacrylate.

Examples of the (meth)acrylic compound having an aliphatic skeleton include isostearyl (meth)acrylate, lauryl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and (methyl). Isodecyl acrylate, stearyl (meth) acrylate, 1,6-hexanediol (meth) acrylate, decanediol di(meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like. Among them, at least one selected from the group consisting of isostearyl (meth)acrylate and lauryl (meth)acrylate is preferred from the viewpoint of further increasing the transmittance of the cured product. Further, from the viewpoint of further increasing the hardness of the cured product, it is preferred to select at least one selected from the group consisting of decanediol di(meth)acrylate and dipentaerythritol hexa(meth)acrylate. It is preferable to use at least one selected from the group consisting of decanediol diacrylate and dipentaerythritol hexaacrylate, and dipentaerythritol hexaacrylate is more preferable.

The (meth)acrylic compound having a functional group may, for example, be 2-hydroxyethyl bis(meth)acrylate, 2-hydroxypropyl bis(meth)acrylate, or 2-hydroxybutyl bis(meth)acrylate. And 2-hydroxy-3-phenoxypropyl bis(meth)acrylate, diethylaminoethyl bis(meth)acrylate, dimethylaminomethyl bis(meth)acrylate, and the like.

The content of the polyfunctional (meth)acrylic compound is preferably less than 10 parts by mass based on 100 parts by mass of the component (A). Among them, it is preferably 1 to 9 parts by mass, more preferably 2 to 8 parts by mass, and particularly preferably 3 to 7 parts by mass. When the content is within the above range, the heat resistance can be easily suppressed from being lowered, and the hardness of the cured product can be increased, and foaming can be further suppressed.

The content of the component (B) is preferably from 1 to 49 parts by mass based on 100 parts by mass of the component (A). When the content is within this range, the transparency can be further improved, and the hardness after hardening can be improved. Among them, it is preferably 5 to 45 parts by mass, more preferably 10 to 40 parts by mass. When the content is in the above range, the handleability can be further improved when the film is formed, and the fluidity of the uncured resin composition is excellent, and the light-emitting element or the light-receiving element (for example, the light-emitting element or the light-receiving element provided on the substrate can be easily formed). The upper part of the component is sealed. Further, it is possible to easily prevent foaming, turbidity, coloring, and cracking of the cured product.

((C) component: polymerization initiator)

The polymerization initiator can be formulated with: (C1) photopolymerization initiator (hereinafter referred to as "(C1) component") and/or (C2) thermal polymerization initiator (hereinafter referred to as "(C2) )ingredient"). The term "mixing" can also be referred to as "containing" in the resin composition. Therefore, it can be designed not only as a thermosetting system but also as a photocuring system. For example, an exposure step is used. It is known that the primary hardening of the oxygen-containing material takes about 30 minutes, and the secondary hardening takes 4 hours. The long-known conventional oxygen-absorbing material and the resin composition of this embodiment can shorten the hardening time. However, when it is desired to harden in a short time, it is preferable to use only the (C1) component.

The component (C) may be a radical polymerization initiator. For example, the (C1) component may be a photoradical polymerization initiator. The photoradical polymerization initiator is not particularly limited as long as free radicals are generated by irradiation. The (C2) component may be a thermal radical polymerization initiator. The thermal radical polymerization initiator is not particularly limited as long as it generates free radicals by heating.

The (C1) component may, for example, be a fluorenylphosphine oxide, an oxime ester, an aromatic ketone, an anthracene, a benzoin ether compound, a benzoin derivative, or a 2,4,5-triarylimidazole dimer. , acridine derivatives, coumarin derivatives, N-phenylglycine, N-phenylglycine derivatives, and the like. The component (C1) can be synthesized by a conventional method, and a commercially available product can also be obtained.

Among these, from the viewpoint of improving photocurability, high sensitivity, and transparency of a cured product (cured film or the like), the (C1) component is derived from fluorenylphosphine oxide and oxime ester. At least one selected from the group consisting of classes is preferred. From the viewpoint of improving storage stability, the component (C1) is preferably at least one selected from the group consisting of fluorenylphosphine oxide and aromatic ketone. The component (C1) can be used alone or in combination of two or more.

[醯-based phosphine oxide]

The fluorenylphosphine oxide may, for example, be bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide (for example, "IRGACURE-819 (manufactured by BASF)"), 2,4,6-trimethyl Benzobenzyldiphenylphosphine oxide (for example, "LUCIRIN TPO (manufactured by BASF Corporation)").

[肟 esters]

Examples of the oxime esters include 1,2-octanedione-1-[4-(phenylthio)phenyl-2-(O-benzamide)] (for example, "IRGACURE-OXE01 (BASF)" ), 1-[9-ethyl-6-(2-methylbenzamide) Mercapto)-9H-carbazol-3-yl]ethanone-1-(O-acetamidine) (eg "IRGACURE-OXE02 (BASF)"), 1-phenyl-1,2-propanedione -2-[O-(ethoxycarbonyl) oxime] (for example, "Quantacure-PDO") (Nippon Chemical Co., Ltd.).

[aromatic ketone]

The aromatic ketone may, for example, be benzophenone, N, N, N', N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N,N',N'-tetraethyl-4,4'-diaminobenzophenone, 4-(dimethylamino)-4'-methoxybenzophenone, 2,2-di Methoxy-1,2-diphenylethan-1-one (eg "IRGACURE-651 (BASF)"), 2-benzyl-2-yldimethylamino-1-(4-(N- Morpholinyl)phenyl)butan-1-one (eg "IRGACURE-369 (BASF)"), 2-methyl-1-[4-(methylthio)phenyl]-2-(N-? Polinyl)propan-1-one (for example, "IRGACURE-907 (BASF)"), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropenyl)benzyl] Phenyl}-2-methylpropan-1-one (for example, "IRGACURE-127 (BASF)").

The content of the (C1) component is preferably 0.1 to 30 parts by mass, more preferably 0.1 to 20 parts by mass, more preferably 0.2 to 20 parts by mass, and more preferably 0.3 to 10 parts by mass per 100 parts by mass of the component (A). Very good, with 0.5 to 5 parts by mass. When the content is within the above range, foaming, turbidity, coloration, and cracking of the cured product can be easily prevented.

The component (C2) may, for example, be a dilauroyl peroxide (for example, "PEROYL L (Nippon Oil Co., Ltd.)"), peroxy-2- 1,1,3,3-trimethylbutyl ethylhexanoate (for example, "PEROCTA O (Nippon Oil Co., Ltd.)"), benzamidine peroxide (for example, "NYPER BW (Nippon Oil Co., Ltd.) ))), 1,1-di(tri-hexylperoxy)cyclohexane (eg "PERHEXA HC"), t-butyl cumyl peroxide (eg "PERBUTYL C"), 4,4-di(tertiary butylperoxy)-n-butyl valerate (eg "PERHEXA V (Nippon Oil Co., Ltd.)"), Peroxides (such as "PERCUMYL D (Nippon Oil Co., Ltd.)") and other peroxides. Among them, the resin composition may contain dicumyl peroxide from the viewpoint of further improving transparency. The component (C2) can be used alone or in combination of two or more.

The content of the (C2) component is preferably 0.1 to 30 parts by mass, more preferably 0.1 to 20 parts by mass, more preferably 0.2 to 20 parts by mass, and more preferably 0.3 to 10 parts by mass per 100 parts by mass of the component (A). Very good, with 0.5 to 5 parts by mass. When the content is within the above range, foaming, turbidity, coloration, and cracking of the cured product can be easily prevented.

((D) component: phosphor)

The resin composition of the present embodiment may further contain a phosphor. The component (D) is not particularly limited, and examples thereof include a yellow phosphor, a green phosphor, and a red phosphor. Commercially available yellow phosphors include, for example, QMK58/F-U1 (PhosphorTech). The component (D) can be used alone or in combination of two or more.

The phosphor can use a compound that converts blue light into white light. The phosphor can use a red phosphor in combination with a green phosphor or a yellow phosphor. Thereby, blue light can be converted into white light. In addition, the hardness of the cured product can be further increased.

From the viewpoint that the phosphor is not easily deposited, the content of the component (D) is preferably less than 70 parts by mass based on 100 parts by mass of the component (A). Further, it is preferably 1 to 65 parts by mass, more preferably 5 to 60 parts by mass, even more preferably 10 to 55 parts by mass, whereby the dispersibility is more excellent.

((E) component: antioxidant)

The resin composition of the present embodiment may further contain an antioxidant. Thereby, it is possible to prevent oxidation of the component (A), the component (B), and the component (C) remaining in the cured product after the curing reaction. As a result, it is easy to prevent the hardened material from being colored, and it is possible to obtain more excellent visible light transmittance.

The component (E) is not particularly limited, and examples thereof include a phenol-based antioxidant, a phosphorus-based antioxidant, a sulfur-based antioxidant, a thioether-based antioxidant, a thiol-based antioxidant, a vitamin-based antioxidant, and a lactone-based antioxidant. An amine antioxidant or the like. In particular, the resin composition contains at least one selected from the group consisting of a phenolic antioxidant, a thioether antioxidant, and a thiol antioxidant, that is, heat resistance can be further improved. Among them, from the viewpoint of suppressing silver vulcanization, a phenolic antioxidant is preferred.

Examples of the phenolic antioxidant include the following commercially available products: Irganox 1010, Irganox 1076, Irganox 1330, Irganox 3114, Irganox 3125 (above, BASF Corporation) Trademark (meaning registered trademark, the same below); ADK STAB AO-20, ADK STAB AO-50, ADK STAB AO-60, ADK STAB AO-80, ADK STAB AO-30, ADK STAB AO-40 ( The above are trademarks of ADEKA Co., Ltd.); BHT (trademark of Takeda Pharmaceutical Co., Ltd.); Cyanox 1790 (trademark of Cyanamid); Sumilizer GP, Sumilizer GM, Sumilizer GS, Sumilizer GA-80 (above Sumitomo Chemical Co., Ltd.) Ltd. trademark) and so on. Among them, the resin composition may contain AO-80 from the viewpoint of further improving heat resistance.

Examples of the thioether-based antioxidant include the following commercially available products: ADK STAB AO-412S, ADK STAB AO-503 (the above is a trademark of ADEKA Co., Ltd.), and the like.

Examples of the thiol-based antioxidant include the following commercially available products: Karenz MT NR-1, Karenz MT PE-1 (the above is a trademark of Showa Denko Co., Ltd.), and the like; ADK STAB PE-1 (trademark of ADEKA Co., Ltd.) Wait.

The component (E) can be used alone or in combination of two or more.

The content of the component (E) is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 15 parts by mass, even more preferably 0.5 to 10 parts by mass, per 100 parts by mass of the component (A). When the content is within the above range, coloring of the resin at a high temperature can be easily suppressed.

((F) component: light stabilizer or UV absorber)

The resin composition of the present embodiment may further contain: (F1) component: light stabilizer; or (F2) component: ultraviolet absorber. Thereby, it is possible to prevent photodegradation of the component (A), the component (B), the component (C), and the component (E) (when the component (E) is used) remaining in the cured product after the curing reaction. As a result, it is easy to prevent the hardened material from being colored, and it is possible to obtain more excellent visible light transmittance. From the viewpoint of easily suppressing deterioration of heat resistance, among the (F1) component and the (F2) component, the resin composition preferably contains the component (F1).

The component (F1) is not particularly limited, and a hindered amine light stabilizer can be preferably used. Specific examples of the hindered amine-based light stabilizers include, for example, ADK STAB LA-77, ADK STAB LA-57, ADK STAB LA-52, ADK STAB LA-62, ADK STAB LA-67, ADK STAB LA-68, ADK STAB LA-63, ADK STAB LA-94, ADK STAB LA-94, ADK STAB LA-81, ADK STAB LA-82 and ADK STAB LA-87 (above ADEKA Co., Ltd.); Tinuvin 123, Tinuvin 144, Tinuvin 440 and Tinuvin 662, Chimassorb 2020, Chimassorb 119, Chimassorb 944 (above BASF); Hostavin N30 (Hoechst); Cyasorb UV-3346, Cyasorb UV-3526 (above Cytec); Uval 299 (GLC); And Sanducor Pr-31 (Clariant) and the like. The (F1) component can be used alone or in combination of two or more.

The component (F2) is not particularly limited, and at least one selected from the group consisting of a benzotriazole-based ultraviolet absorber and a hydroxyphenyltriazine-based ultraviolet absorber can be used. The (F2) component can be used alone or in combination of two or more.

The content of each of the (F1) component and the (F2) component is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 15 parts by mass, even more preferably 0.5 to 10 parts by mass, per 100 parts by mass of the component (A). When the content is within the above range, it is possible to easily suppress coloring of the resin at a high temperature.

(other ingredients)

From the viewpoint of further improving the workability when applied to a substrate, a support, or the like, a solvent or a solvent may be added to the resin composition to prepare a solution or a dispersion of the resin composition as a coating liquid. The solvent to be used is not particularly limited and may be derived from a polar solvent (N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, propylene glycol monomethyl At least one selected from the group consisting of ether ether acetate, etc., dipropylene glycol monomethyl ether, and γ-butyrolactone. In the solution (coating liquid) of the resin composition, the content of the resin composition is preferably from 20 to 85% by mass, and preferably from 30 to 80% by mass, based on the total mass of the coating liquid. Further, in the coating liquid, the content of the solvent is preferably 15 to 80% by mass, and preferably 20 to 70% by mass based on the total mass of the coating liquid.

<Resin film>

The resin composition of the present embodiment is preferably a resin film formed into a film shape. Thereby, due to the unhardened state at room temperature It is a plastic solid or semi-solid, so it is easy to handle. When manufacturing an LED module, it is not necessary to block the resin of the bank parts, and the number of steps can be simplified. Further, it is possible to perform a large-area collective seal to seal a plurality of light-emitting elements and light-receiving elements at a time.

The resin film of the present embodiment includes a support and a resin composition layer, and the resin composition layer is disposed on the support, and the resin composition layer contains the resin composition of the embodiment. In other words, the resin film of the present embodiment includes a support and a resin composition layer, and the resin composition layer is formed on the support using the resin composition. In the resin film of the present embodiment, a protective layer may be further provided on the surface of the resin composition layer opposite to the support.

As the support, for example, an organic film (polymer film) such as a polyethylene terephthalate film can be used. As the protective layer, for example, an organic film such as a polyethylene terephthalate film, a polyethylene film, or a polypropylene film can be used. The resin composition layer can be used alone by peeling off the support from the resin composition layer as long as the resin composition layer has self-supporting properties.

The resin film can be formed by, for example, applying a resin composition to a support. Further, it may be formed by dissolving or dispersing a resin composition in a solvent to prepare a coating liquid, and applying a coating liquid to a support to form a coating film, and then removing the solvent from the coating film. The method of using a coating liquid is a method of forming a coating film by applying a coating liquid containing a resin composition and a solvent to a support, and then using a hot plate, an oven, etc., for example, 60-150 degreeC. The coating film was dried by heating for 1 minute to 1 hour, and a resin composition layer was formed on the support.

The resin film is preferably formed by a method in which the thickness of the resin composition layer is made uniform. The thickness of the resin composition layer, the support, and the protective layer can be appropriately set to a desired thickness depending on the application. For example, the thickness of the resin composition layer is preferably from 1 to 500 μm. The thickness of the support is preferably from 10 to 3000 μm. The thickness of the protective layer is preferably 10 to 200 μm.

When a resin film is used for sealing a light-emitting element (light-receiving element or light-emitting element (LED element, etc.)) having irregularities, the resin composition is obtained from the viewpoint of achieving a favorable unevenness and a flat surface. The thickness of the layer is preferably from 10 to 500 μm, more preferably from 20 to 450 μm, even more preferably from 30 to 400 μm.

In the resin film, the light transmittance of the cured product of the resin composition (resin composition layer) is preferably 80% or more with a wavelength of 450 nm of the resin composition layer having a thickness of 400 μm, and is preferably 85% or more. Good, more than 90% better, more than 95%.

The resin composition of the present embodiment has excellent visible light transmittance when the film is thick, and has little heat resistance after high-temperature and long-term heat history, and has excellent heat resistance. Therefore, the resin composition or the resin film of the present embodiment is suitably used as a sealing member for a light-emitting element (such as an LED element) which is intended to be used in a high-temperature environment for a long time in a high-temperature environment. In other words, it is sealed by using the resin composition or the resin film of the present embodiment. The electronic component can be used as a component of the following devices: illumination for a camera used in a mobile phone or the like; an LED display or the like.

The cured resin of the present embodiment includes a cured product of the resin composition of the present embodiment or a cured product of the resin composition (the resin composition layer) of the resin film of the present embodiment. The resin cured product of the present embodiment is obtained by curing the resin composition of the present embodiment or the resin composition layer of the resin film of the present embodiment. The cured resin of the present embodiment can be preferably used for electronic parts.

<Electronic parts and manufacturing method>

The electronic component according to the embodiment includes an optical element (for example, an optical semiconductor element) and a sealing member, and the optical element is one of a light-emitting element and a light-receiving element (for example, the optical semiconductor element is one of a semiconductor light-emitting element and a semiconductor light-receiving element) The sealing member is for sealing the optical element, and the sealing member includes the resin composition of the embodiment, the resin composition of the resin film of the embodiment, or the cured resin of the embodiment. The electronic component of the present embodiment is obtained by the method of manufacturing an electronic component of the present embodiment, and has a structure obtained by the method of manufacturing an electronic component of the embodiment. The electronic component of the present embodiment may be an electronic component obtained by sealing the upper portion of the light-emitting element or the light-receiving element using the resin composition or the resin film of the present embodiment. Therefore, it can be used as the following: an acrylic resin-based sealing material (a sealing material containing no (meth)acrylic modified alkoxysilane oligomer) which has been developed so far, and transparency and heat resistance. It is more excellent and has better gas barrier properties. The light emitting element and the light receiving element may be disposed on the substrate.

A method of manufacturing the electronic component of the embodiment will be described. The method for producing an electronic component according to the present embodiment includes the steps of sealing the light-emitting element or the light-receiving element by using the resin composition of the embodiment or the resin composition of the resin film of the embodiment; The step of hardening the aforementioned resin composition. In the sealing step, for example, the upper portion of the light-emitting element or the light-receiving element is sealed. The light emitting element and the light receiving element may be disposed on the substrate.

Fig. 1 is a flow chart showing an embodiment of a manufacturing process of an LED package using the resin film of the embodiment. The method shown in Fig. 1 is mainly composed of a method in which the element member 18 obtained by applying an adhesive, a die bond and a wire bond is subjected to the following steps: (a) sticking a resin film a step of (b) a step of hardening the resin composition; and (c) a step of peeling off the support. As another method, the manufacturing step of the LED package may be constituted by the steps of forming a resin composition layer on the element member 18 using a liquid resin composition; and the step of hardening the resin composition layer .

First, as shown in Fig. 1 (a), first, a build-up film (resin film) 6 having a support 2 and a resin composition layer (film-like curable resin composition) 4, which is composed of a resin, is prepared. The object layer 4 is formed on the support body 2. The phosphor 8 is dispersed in the resin composition layer 4. The laminated film 6 may further have a protective film, which is thin The film protects the surface of the resin composition layer 4 by covering the surface of the resin composition layer 4 opposite to the support 2 .

First, as shown in Fig. 1(a), the surface of the optical element 14 side of the element member 18 is adhered to the resin composition layer so that the optical element 14 is positioned inside the outer edge 4a of the resin composition layer 4. 4, the element member 18 has: a substrate 10; an adhesive 12 applied to the substrate 10; an optical element (optical semiconductor element or the like) 14 disposed on the substrate 10 via an adhesive 12; Line 16 connects the substrate 10 to the optical element 14. The resin composition layer 4 does not necessarily need to be adhered to the entire surface of the surface 18a of the element member 18 (including the surface of the optical element 14 and the surface of the substrate 10), but the resin may be adhered in such a manner as to fill the optical element 14. Composition layer 4.

In the step of pasting the resin composition layer 4, specifically, the resin composition is used in a state of being formed into a small piece in accordance with the range to be coated (for example, the surface of the optical element 14 or the entire surface of the element member 18). Layer 4. For example, when the laminated film 6 has a protective layer, it is cut into a desired size of each protective layer to form the laminated film 6 into small pieces. After the protective layer of the laminated film 6 formed into a small piece is peeled off, it is placed in contact with the surface to be coated and brought into close contact with each other, and if necessary, the laminated film 6 is pressed, heated, or the like to form a resin. The composition layer is adhered to the surface to be covered.

The method of pressing the laminated film 6 on the element member 18 or heating it while pressing it is a device such as a film adhesive, usually at room temperature to 300 ° C and 10 MPa or less (usually 0.01). ~10 MPa) is carried out by pressurization. The press-bonding is preferably carried out by pressurization of preferably 5 MPa or less (e.g., 0.1 to 5 MPa), more preferably 0.5 to 5 MPa. The preferred pressing temperature is 60 to 150 °C.

Then, as shown in Fig. 1(b), the resin composition layer 4 adhered to the element member 18 is irradiated (active light) from the side of the support 2, and the resin composition layer 4 is cured to form a sealing member 4d. The sealing member 4d contains a cured product of the resin composition layer 4 and seals the optical element 14. By reducing the adhesion of the surface of the resin composition layer 4 and improving the hardness by the illumination, the optical element 14 can be protected from external factors such as heat, light, dust, moisture, etc., and the crosslinking density is increased. It can improve the gas barrier properties against moisture in the air, sulfur-containing gases, and the like.

The type of light to be irradiated is not particularly limited. Illumination can be performed using, for example, a light source generally used in the art. The active light is, for example, at least one selected from the group consisting of ultraviolet light, visible light, electron beam, and X-ray. Among these, ultraviolet light or visible light is particularly preferred. Exposure, for example, 1 ~ 10,000mJ / cm ^2, to 1,000 ~ 8,000mJ / cm ² preferably, to 1,000 ~ 4,000mJ / cm ² is preferred. The amount of exposure can be appropriately adjusted in consideration of a preferable balance of the surface of the film-like curable resin composition, such as the viscosity, hardness, and gas barrier properties.

The curing of the resin composition layer 4 may be carried out by thermal curing, or by photohardening and thermal hardening.

After the resin composition layer 4 is cured to seal the optical element 14, the support 2 is peeled off from the sealing member 4d as shown in Fig. 1(c). The peeling of the support 2 can also be performed before the resin composition layer 4 is cured. Since the resin composition layer 4 contains a (meth)acrylic modified siloxane compound, it is preferable to peel the support 2 after curing the resin composition layer 4 in order to prevent the polymerization from being inhibited by oxygen.

As shown in FIG. 1(c), the electronic component 20 of the present embodiment includes an element member 18 having a substrate 10 and an adhesive 12 applied to the substrate 10, and a sealing member 4d. The optical element 14 is disposed on the substrate 10 via an adhesive 12 which is in contact with the surface 18a of the element member 18 on the optical element 14 side and seals the optical element 14. The sealing member 4d has, on the side of the optical element 14 of the element member 18, a main surface 4b which is opposed to the substrate 10 at a position farther from the substrate 10 than the optical element 14, and a wall surface 4c formed on the main surface 4b is exposed between the surface of the substrate 10 on the side of the optical element 14 and exposed to the outside. The sealing member 4d contains a cured product of a resin composition containing: (A) component: (meth)acrylic polymer; (B) component: polymerizable compound; and, (C) component: polymerization initiation Agent.

After the support is peeled off, heat can be heated by heat in order to improve the adhesion to the surface to be adhered. The heating device is not particularly limited, and a heating plate, an oven, or the like can be used. The heating temperature is preferably 100 to 180 ° C and preferably 120 to 150 ° C in consideration of the influence of other members. The heating time is preferably 10 to 60 minutes. Here, the material to be adhered For example, an insulating resin such as polyphthalamide (PPA), an unsaturated polyester resin, or an epoxy resin; a metal such as silver, copper, or gold;

[Examples]

The present invention will be more specifically described below based on examples and comparative examples, but the present invention is not limited by the following examples.

{Examples 1 to 36 and Comparative Examples 1 to 7}

(A) component, (B) component, (C) component and other components of the content (unit: parts by mass) shown in Tables 1 to 5, and N,N-dimethylacetamide 100 mass as a solvent The mixture was mixed to obtain a solution of the resin compositions of the respective examples and comparative examples. The numbers in the table are the parts by mass indicating the solid content of each component. The details of each component in the table are as follows.

<(A) component>

The component (A) is synthesized by the following method.

(A1)

300 g of tricyclo [5.2.1.0 ^2,6 ]癸-8-ester ("FA-513A (Hitachi Kasei Co., Ltd.)"), 350 g of butyl acrylate (BA), and 300 g of butyl methacrylate (BMA) 50 g of glycidyl methacrylate (GMA) and 50 g of 2-ethylhexyl methacrylate (2EHMA) were mixed to obtain a monomer mixture. Further, 5 g of lauryl peroxide and 1 g of n-octyl mercaptan (chain transfer agent) were dissolved in the obtained monomer mixture to obtain a mixed liquid (a1).

Into a 5 L autoclave equipped with a stirrer and a cooler, 0.04 g of polyvinyl alcohol as a suspending agent and 2000 g of ion-exchanged water were added and stirred. Then, the mixed liquid (a1) was added while stirring, and polymerization was carried out at 60 ° C for 5 hours in a nitrogen atmosphere at a stirring speed of 250 min ^-1 , and then polymerization was carried out at 90 ° C for 2 hours to obtain resin particles ( The polymerization rate was 99% by mass method. The resin particles are washed with water, dehydrated, and dried to obtain (A1). The obtained (A1) had a weight average molecular weight of 250,000.

(A2)

FA-513A 300g, BA 350g, BMA 300g, GMA 50g, 2EHMA 50g were mixed to obtain a monomer mixture. Further, 5 g of lauryl peroxide and 0.45 g of n-octyl mercaptan (chain transfer agent) were dissolved in the obtained monomer mixture to obtain a mixed liquid (a2).

(A2) was obtained under the same conditions as in the synthesis of (A1) except that the mixed liquid (a2) was used instead of the mixed liquid (a1). The obtained (A2) had a weight average molecular weight of 500,000.

(A3)

FA-513A 250g, BA 300g, BMA 250g, GMA 200g, 2EHMA 50g were mixed to obtain a monomer mixture. Further, 5 g of lauryl peroxide and 0.45 g of n-octyl mercaptan (chain transfer agent) were dissolved in the obtained monomer mixture to obtain a mixed liquid (a3).

(A3) was obtained under the same conditions as the synthesis of (A1) except that the mixed liquid (a3) was used instead of the mixed liquid (a1). The obtained (A3) had a weight average molecular weight of 511,000.

(A4)

300 g of tricyclo [5.2.1.0 ^2,6 ] 癸-8-ester ("FA-513M (Hitachi Chemical Co., Ltd.))), BMA 650 g, GMA 50 g, and 2EHMA 50 g were mixed to obtain a monomer mixture. . Further, 5 g of lauryl peroxide and 1 g of n-octyl mercaptan (chain transfer agent) were dissolved in the obtained monomer mixture to obtain a mixed liquid (a4).

(A4) was obtained under the same conditions as the synthesis of (A1) except that the mixed liquid (a4) was used instead of the mixed liquid (a1). The obtained (A4) had a weight average molecular weight of 208,000.

(A5)

FA-513M 300g, BMA 650g, GMA 50g, 2EHMA 50g were mixed to obtain a monomer mixture. Further, 5 g of lauryl peroxide and 0.45 g of n-octyl mercaptan (chain transfer agent) were dissolved in the obtained monomer mixture to obtain a mixed liquid (a5).

(A5) was obtained under the same conditions as the synthesis of (A1) except that the mixed liquid (a5) was used instead of the mixed liquid (a1). The obtained (A5) had a weight average molecular weight of 462,000.

(A6)

FA-513M 250 g, BMA 550 g, GMA 200 g, 2EHMA 50 g were mixed to obtain a monomer mixture. Further, 5 g of lauryl peroxide and 0.45 g of n-octyl mercaptan (chain transfer agent) were dissolved in the obtained monomer mixture to obtain a mixed liquid (a6).

(A6) was obtained under the same conditions as the synthesis of (A1) except that the mixed liquid (a6) was used instead of the mixed liquid (a1). The obtained (A6) had a weight average molecular weight of 443,000.

In the synthesis of (A2) to (A6), the polymerization ratio of the resin particles was 99% by mass method.

The weight average molecular weight was determined by a GPC method using tetrahydrofuran as a solution. The details of the GPC method are as follows.

‧Device name: HLC-8220GPC (product name, TOSOH Co., Ltd.)

‧Tube: Gelpack R-420, R-430, R-440 (product name, Hitachi Chemical Co., Ltd.)

‧Detector: RI detector

‧column temperature: 40 ° C

‧Solution: tetrahydrofuran

‧ Flow rate: 1mL / minute

‧Standard material: polystyrene

<(B) component>

((Meth)acrylic modified metaxane compound)

B1: Methacrylic acid modified methoxy olefin oligomer ("MAC-SQ HTK-01 (East Asia Synthetic Co., Ltd.)", contact angle with water: 80°)

B2: Methacrylic acid modified methoxy olefin oligomer ("MAC-SQ HTK-S07 (East Asia Synthetic Co., Ltd.)", contact angle with water: 81 °)

B3: Methacrylic acid modified methoxy olefin oligomer ("MAC-SQ HTK-07 (East Asia Synthetic Co., Ltd.)", contact angle with water: 90°)

B4: Methacrylic acid modified methoxy olefin oligomer ("MAC-SQ HTK-10 (East Asia Synthetic Co., Ltd.)", contact angle with water: 77°)

B5: Methacrylic acid modified methoxy olefin oligomer ("MAC-SQ HTK-08 (East Asia Synthetic Co., Ltd.)", contact angle with water: 86°)

B6: Acrylic modified methoxy olefin oligomer ("AC-SQ HTK-01 (East Asia Synthetic Co., Ltd.)", contact angle with water: 80 °)

The weight average molecular weight of B1 to B6 is 3,000 to 6,000. The number of (meth)acrylonitrile groups of B1 to B6 is 10 to 3,000. B1 to B5 have a structure represented by the above formula (1) (R: a group represented by the formula (1a); a group having a methacryl group). B6 has a structure represented by the above formula (1) (R: a group represented by the formula (1a); a group having an acrylonitrile group). B1 to B6 have a hydrogen atom and/or an alkyl group bonded to an oxygen atom in the formula (1). In B1 to B6, the total number of alkoxy groups and merid groups bonded to a ruthenium atom in the (meth)acrylic modified siloxane oxide oligomer is, in terms of the average number of ruthenium atoms per one, 2 or less.

In order to determine the contact angle of the (meth)acrylic modified siloxane oligomer to water, a cured product was obtained. More specifically, the contact angle can be obtained by: (meth)acrylic modified methoxy olefin oligomer and polymerization initiator (LUCIRIN TPO) (relative to (meth)acrylic modified oxime The alkane oligomer was mixed at 1% by mass and irradiated with an exposure amount of 4000 mJ/cm ² to obtain a cured product. With respect to the obtained cured product, the liquid amount of pure water was set to 1 μL, and the contact angle was measured from the shape of water droplets after dropping for 500 msec. Further, the value after the dropping of 500 msec was measured five times, and three values other than the maximum value and the minimum value among the five measurement results were averaged. The contact angle is measured using a contact angle measuring device (for example, "DropMaster 500 (Concord Interface Scientific Co., Ltd.)").

((M) component other than (meth)acrylic modified alkoxysilane oligomer)

B7: 3-glycidoxypropyltrimethoxydecane ("KBM-403 (Shin-Etsu Chemical Co., Ltd.)")

B8: 3-methacryloxypropyltrimethoxydecane ("KBM-503 (Shin-Etsu Chemical Co., Ltd.)")

B9: decanediol diacrylate ("FA-129AS (Hitachi Chemical Co., Ltd.)")

B10: Tricyclodecane dimethanol diacrylate ("A-DCP (Xin Nakamura Chemical Industry Co., Ltd.)")

B11: Dipentaerythritol hexaacrylate ("DPHA (SARTOMER Co., Ltd.)")

B12: Isostearyl methacrylate ("S-1800A (Xin Nakamura Chemical Industry Co., Ltd.)")

B13: Methacrylic acid modified oxirane oligomer ("X-22-164A (Shin-Etsu Chemical Co., Ltd.)", functional group equivalent: 860 g/mol)

B14: Methacrylic acid modified oxirane oligomer ("X-22-164B (Shin-Etsu Chemical Co., Ltd.)", functional group equivalent: 1630 g/mol)

B15: Methacrylic acid modified oxirane oligomer ("X-22-164C (Shin-Etsu Chemical Co., Ltd.)", functional group equivalent: 2370g/mol)

B16: methacrylic modified oxygen oligomer ("X-22-164E (Shin-Etsu Chemical Co., Ltd.)", functional group equivalent: 3900g/mol)

<(C1) component: photoradical polymerization initiator>

C1A: 2,4,6-trimethylbenzimidyldiphenylphosphine oxide ("LUCIRIN TPO (BASF)")

C1B: 2-methyl-1-[4-(methylthio)phenyl]-2-(N-morpholinyl)propan-1-one ("IRGACURE-907 (BASF)")

C1C: 2,2-dimethoxy-1,2-diphenylethan-1-one ("-IRGACURE-651 (BASF)")

<(C2) component: thermal radical polymerization initiator>

C2A: dicumyl peroxide (for example, "PERCUMYL D (Japan Oil Co., Ltd.)")

<(E) component>

E1: ADK STAB AO-80 (trademark of ADEKA Co., Ltd.)

E2: ADK STAB AO-412S (trademark of ADEKA Co., Ltd.)

E3: ADK STAB PE-1 (trademark of ADEKA Co., Ltd.)

<(F1) component>

F1A: bis(1-undecyloxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate ("LA-81 (ADEKA Co., Ltd.)")

<Production of Resin Film>

A solution of the resin compositions of the examples and the comparative examples was applied onto polyethylene terephthalate (support, thickness: 50 μm) by using an applicator so that the thickness became uniform. The coated solution was heated by using a dryer at 120 ° C for 10 minutes to obtain a resin film having a support and a resin composition layer formed on the support. The thickness of the resin composition layer of the obtained resin film was 200 μm. The resin film layer was further laminated by using a laminator, and the thickness of the resin composition layer was set to a predetermined thickness (400 μm). Then, a protective layer is adhered to the resin film.

<Measurement of initial penetration rate>

After the protective layer of the resin film having a thickness of 400 μm of the resin composition layer was peeled off, the resin film was laminated on the glass substrate in a direction in which the support was located on the opposite side of the glass substrate. The laminate is a laminate machine. When a resin film containing a photopolymerization initiator is used, a resin film laminated on a glass substrate is irradiated with an exposure amount of 4000 mJ/cm ² using a high-precision parallel exposure machine (manufactured by MIKASA Co., Ltd.) (within 20 seconds) And a test substrate with a cured resin was obtained. When a resin film containing a thermal polymerization initiator was used, the temperature was raised from room temperature to 150 ° C at 5 ° C / min in a nitrogen atmosphere, and then heated at 150 ° C for 1 hour to obtain a test substrate with a cured resin. When a resin film containing both a photopolymerization initiator and a thermal polymerization initiator is used, the above exposure machine is used to illuminate at an exposure amount of 4000 mJ/cm ² , and then heated at 150 ° C for 15 minutes in a nitrogen atmosphere to obtain an attached film. A test substrate having a cured resin. Then, the transmittance of the test substrate was measured by using an ultraviolet visible light spectrophotometer "U-3310 Spectrophotometer (Hitachi High-Technologies Co., Ltd.)" to measure the transmittance of light having a wavelength of 450 nm. The transmittance of the glass monomer was used as a control group. The measurement results were evaluated on the basis of the following criteria. The results are shown in Tables 1 to 5.

AAA: The initial transmittance of light at 450 nm is 99.5% or more.

AA: The initial transmittance of light at 450 nm is 99% or more and less than 99.5%.

A: The initial transmittance of light at 450 nm is 98% or more and less than 99%.

B: The initial transmittance of light at 450 nm is 97% or more and less than 98%.

C: The initial transmittance of light at 450 nm is less than 97%.

<Measurement of initial cracks>

It was confirmed with the naked eye whether or not cracks were present in the resin cured product of the test substrate with the cured resin produced in the measurement of the initial penetration rate. The measurement results were evaluated on the basis of the following criteria. The results are shown in Tables 1 to 5.

A: Unable to confirm crack

B: Can confirm the crack

<Measurement of heat resistance>

The test substrate with the cured resin produced in the measurement of the initial transmittance was allowed to stand in an oven at 200 ° C for 72 hours. After standing to cool to room temperature, the transmittance of light having a wavelength of 450 nm was measured using an ultraviolet visible light spectrophotometer "U-3310 Spectrophotometer (Hitachi High-Technologies Co., Ltd.)". The transmittance of the glass monomer was used as a control group. The measurement results were evaluated on the basis of the following criteria. The results are shown in Tables 1 to 5.

AAA: The transmittance of light at 450 nm is 95% or more

AA: The initial transmittance of light at 450 nm is 90% or more and less than 95%.

A: The initial transmittance of light at 450 nm is 80% or more and less than 90%.

B: The initial transmittance of light of 450 nm is 70% or more and less than 80%.

C: The initial transmittance of light at 450 nm is less than 70%.

{Example 37 and Comparative Example 8}

<Measurement of initial cracks>

A resin film was produced by using the respective components (content: parts by mass) shown in Table 6 by the same method as the above method. D1 of component (D) is QMK58/F-U1 (PhosphorTech). The initial crack was measured by the same method as the above method. The results are shown in Table 6.

<Evaluation of heat resistance by measuring change in brightness>

The LED package described later is sealed using the aforementioned resin film. Then, the LED package was soldered to a substrate (SHIIMA Electronics Co., Ltd.) to obtain a substrate for measuring luminance change. The obtained substrate for measuring the brightness change is connected to a constant current power supply device ("PMC70-1A (Kusui Electronics Co., Ltd.)"), and then placed in a constant temperature and humidity chamber set at a temperature of 85 ° C and a relative humidity of 85% ( "ESPEC HUMIDITY CABINET LHT-112 (ESPEC Co., Ltd.)"). A constant current power supply unit was used to cause a current of 125 mA to flow into the LED package, and the lamp was continuously lit for 1000 hours. The brightness of the lamp was continuously lit for about 1000 hours, and it was measured using an instantaneous multi-photometry system ("MCPD-3000 (Otsuka Electronics Co., Ltd.)"). The luminance of the light emitted after the measurement was measured as the relative luminance when the luminance of the light before the lamp was turned on was set to 100 (reference), and the change in luminance was confirmed. The measurement results were evaluated on the basis of the following criteria. The results are shown in Table 6.

A: The brightness after 1000 hours is more than 80%

C: The brightness after 1000 hours is less than 80%

The structure of the LED package is as shown in Fig. 2. As shown in Fig. 2, in the above-mentioned LED package (also referred to as "high-brightness blue LED package") 30, a lead frame ("TOP LED OP-4 (ENOMOTO)") 31 is used, and plating is performed. Silver reflective material 32, bonded crystal material ("CT-220HS (KYOCERA Chemical) Co., Ltd.)") 33, LED component (C470MB290) (CREE company)) 34, gold wire ("SR-25 (Tanzhonggui Metal Industry Co., Ltd.)") 35, and reflector (polyphthalamide) 36) These are generally available components. Further, the hardening conditions of the die-bonding material were set at 150 ° C for 90 minutes, and the wire bonding was performed semi-automatically. In addition, the LED package was used to illuminate the lamp and use a solid microscope to amplify up to 20 times to check the state of the gold wire, thereby confirming that there is no problem.

The resin composition of the examples contains a (meth)acrylic polymer; a polymerizable compound containing a (meth)acrylic modified alkoxysilane oligomer; and a polymerization initiator. The resin composition of such an embodiment can be hardened in a shorter time than the conventional epoxy resin. In other words, it takes about 30 minutes for the primary curing of the conventional epoxy resin and 4 hours for the secondary hardening, and the resin composition of the embodiment can be within about 30 minutes with respect to the conventional silicone resin having a long curing time like this. Since light hardening is performed, it can be seen that the hardening time can be shortened. Due to Since the radical polymerization reaction is carried out by radical polymerization using a radical polymerization initiator, it is presumed that the curing is easy in a short time. Further, according to the embodiment using the component (C2), even if the resin composition contains a thermal polymerization initiator, the curing time is about 2 hours, and it is understood that the curing time can be shortened.

Further, in the examples, the resin composition can be cured in a short time, and the cured product of the resin composition does not become cloudy. Therefore, the initial composition of the resin composition of the examples was high, and it was found that excellent transparency was exhibited. Further, in the examples, the coloring was suppressed even after 72 hours at 200 ° C, and it was found that the resin composition of the examples had excellent heat resistance.

[Industrial availability]

The resin composition of the present invention is less prone to cracking even if it is hardened in a short period of time, and is excellent in transparency even when exposed to high temperatures. Therefore, the resin composition of the present invention is suitably used as a sealing member such as a light-emitting element (such as an LED element) which is intended to be small-sized and high-density and to be used for a long period of time in a high-temperature environment.

Claims (10)

A resin composition comprising: (A) component: (meth)acrylic polymer; (B) component: a polymerizable compound; and (C) component: a polymerization initiator; and the component (B) A (meth)acrylic modified methoxy olefin oligomer is included. The resin composition according to claim 1, wherein the component (A) has a weight average molecular weight of from 100,000 to 800,000. The resin composition according to claim 1 or 2, wherein the (meth)acrylic modified alkoxysilane oligomer has a contact angle with respect to water of from 60 to 100. The resin composition according to any one of claims 1 to 3, wherein the (meth)acrylic modified alkoxysilane oligomer has a (meth)acrylonyl group and an alkoxy group. The resin composition according to any one of claims 1 to 4, further comprising a phosphor. A resin film comprising a support and a resin composition layer, the resin composition layer being disposed on the support; and the resin composition layer comprising the resin composition according to any one of claims 1 to 5 . A cured resin comprising the contents of claims 1 to 5 A cured product of the resin composition according to any one of the above, or a cured product of the resin composition of the resin film according to claim 6. An electronic component comprising: a light element and a sealing member, wherein the light element is one of a light emitting element and a light receiving element, the sealing member is for sealing the light element; and the sealing member comprises: claim 1 to 5 The resin composition according to any one of the preceding claims, wherein the resin composition according to claim 6 or the resin cured product according to claim 7. A method of producing an electronic component, comprising the steps of: using the resin composition according to any one of claims 1 to 5, or the resin composition of the resin film according to claim 6, to emit light a step of sealing the element or the light-receiving element; and a step of hardening the resin composition. An electronic component having the structure obtained by the method of manufacturing an electronic component according to claim 9.