TW201623356A - Epoxy resin and hardener for epoxy resin - Google Patents
Epoxy resin and hardener for epoxy resin Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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Abstract
Description
本發明係關於一種環氧樹脂及環氧樹脂硬化劑。 The present invention relates to an epoxy resin and an epoxy resin hardener.
環氧樹脂硬化物通常係藉由將環氧樹脂與環氧樹脂硬化劑進行調配並使其硬化而製造,例如於半導體密封材等電子零件或例如塗料、黏著劑等各種工業領域中受到廣泛使用。 The epoxy resin cured product is usually produced by blending and hardening an epoxy resin and an epoxy resin hardener, and is widely used in various industrial fields such as electronic components such as semiconductor sealing materials or coating materials and adhesives. .
近年來,作為包含此種環氧樹脂及環氧樹脂硬化劑之環氧樹脂組成物,正研究:自抑制環境破壞之觀點出發,使用適應於碳中和之源自植物之原料。具體而言,提出有一種包含環氧樹脂及木質酚作為主成分之環氧樹脂組成物,又,作為環氧樹脂,亦提出使用環氧化木質酚(參照專利文獻1)。 In recent years, as an epoxy resin composition containing such an epoxy resin and an epoxy resin curing agent, it has been studied to use a plant-derived raw material suitable for carbon neutralization from the viewpoint of suppressing environmental damage. Specifically, an epoxy resin composition containing an epoxy resin and lignophenol as a main component has been proposed, and an epoxidized lignan is also proposed as an epoxy resin (see Patent Document 1).
又,作為環氧樹脂,除上述以外,亦提出有使表氯醇與自藉由鹼蒸解法而獲得之紙漿廢液中回收之禾本科植物木質素進行反應而獲得之環氧樹脂,又,亦提出使用上述禾本科植物木質素作為環氧樹脂硬化劑(參照專利文獻2)。 Further, as the epoxy resin, in addition to the above, an epoxy resin obtained by reacting epichlorohydrin with a gramineous plant lignin recovered from a pulp waste liquid obtained by an alkali distillation method is also proposed, and It is also proposed to use the above-mentioned gramineous plant lignin as an epoxy resin hardener (refer to Patent Document 2).
又,作為環氧樹脂,進而提出有使表氯醇與使自藉由鹼蒸解法而獲得之紙漿廢液中回收之禾本科植物木質素與酚類於酸觸媒下進行反應而成之木質素酚樹脂進行反應而獲得之環氧樹脂,又,亦提出使用上述木質素酚樹脂作為環氧樹脂硬化劑(參照專利文獻3)。 Further, as the epoxy resin, there is proposed a wood obtained by reacting epichlorohydrin with a phenolic lignin recovered from a pulp waste liquid obtained by an alkali distillation method and a phenol under an acid catalyst. The epoxy resin obtained by the reaction of the phenol resin is also used, and the above-mentioned lignin phenol resin is also proposed as an epoxy resin hardener (see Patent Document 3).
專利文獻1:日本專利特開2009-292884號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-292884
專利文獻2:日本專利特開2011-144340號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2011-144340
專利文獻3:日本專利特開2011-99083號公報 Patent Document 3: Japanese Patent Laid-Open No. 2011-99083
然而,專利文獻1記載之環氧樹脂組成物由於作為原料成分之木質酚之分子量相對較大,故而存在流動性相對較低、操作性較差之不良情況。 However, in the epoxy resin composition described in Patent Document 1, since the molecular weight of the lignan as a raw material component is relatively large, there is a problem that the fluidity is relatively low and the workability is poor.
又,於使用專利文獻2及專利文獻3記載之環氧樹脂及環氧樹脂硬化劑之情形時,存在所獲得之環氧樹脂硬化物之耐熱性不充分之情況。 In the case of using the epoxy resin and the epoxy resin curing agent described in Patent Document 2 and Patent Document 3, the heat resistance of the obtained cured epoxy resin may be insufficient.
因此,本發明之目的在於提供一種能夠獲得操作性及耐熱性優異之環氧樹脂硬化物之環氧樹脂及環氧樹脂硬化劑。 Therefore, an object of the present invention is to provide an epoxy resin and an epoxy resin hardener which are capable of obtaining an epoxy resin cured product excellent in workability and heat resistance.
本發明之環氧樹脂之特徵在於:其係藉由至少使經羧酸改質之木質素與表氯醇進行反應而獲得。 The epoxy resin of the present invention is characterized in that it is obtained by reacting at least a carboxylic acid-modified lignin with epichlorohydrin.
又,本發明之環氧樹脂較佳為上述經羧酸改質之上述木質素經酚改質。 Further, in the epoxy resin of the present invention, it is preferred that the lignin modified with the above carboxylic acid is phenol-modified.
又,本發明之環氧樹脂較佳為上述羧經羧酸改質之上述木質素藉由有機溶劑而萃取。 Further, in the epoxy resin of the present invention, it is preferred that the lignin in which the carboxy group is modified with a carboxylic acid is extracted by an organic solvent.
又,本發明之環氧樹脂硬化劑之特徵在於:其包含經 羧酸改質之木質素。 Further, the epoxy resin hardener of the present invention is characterized in that it contains A carboxylic acid modified lignin.
又,本發明之環氧樹脂硬化劑較佳為上述經羧酸改質之上述木質素經酚改質。 Further, in the epoxy resin hardener of the present invention, it is preferred that the lignin modified with the above carboxylic acid is phenol-modified.
又,本發明之環氧樹脂硬化劑較佳為上述經羧酸改質之上述木質素藉由有機溶劑而萃取。 Further, in the epoxy resin hardener of the present invention, it is preferred that the lignin modified with the above carboxylic acid is extracted by an organic solvent.
本發明之環氧樹脂及環氧樹脂硬化劑由於係使用經羧酸改質之木質素而獲得,故而操作性優異,又,能夠謀求環氧樹脂硬化物之耐熱性之提昇。 Since the epoxy resin and the epoxy resin hardener of the present invention are obtained by using carboxylic acid-modified lignin, the handleability is excellent, and the heat resistance of the cured epoxy resin can be improved.
1.環氧樹脂 Epoxy resin
本發明之環氧樹脂可藉由使經羧酸改質之木質素(以下,有時稱為羧酸改質木質素)與表氯醇進行反應而獲得。 The epoxy resin of the present invention can be obtained by reacting a carboxylic acid-modified lignin (hereinafter sometimes referred to as a carboxylic acid-modified lignin) with epichlorohydrin.
於羧酸改質木質素中,作為羧酸,例如可列舉具有1個羧基之羧酸(以下,有時稱為單官能羧酸),具體而言,例如可列舉飽和脂肪族單官能羧酸、不飽和脂肪族單官能羧酸、芳香族單官能羧酸等。 In the carboxylic acid-modified lignin, for example, a carboxylic acid having one carboxyl group (hereinafter sometimes referred to as a monofunctional carboxylic acid) may be mentioned as the carboxylic acid, and specific examples thereof include a saturated aliphatic monofunctional carboxylic acid. An unsaturated aliphatic monofunctional carboxylic acid, an aromatic monofunctional carboxylic acid or the like.
作為飽和脂肪族單官能羧酸,例如可列舉乙酸、丙酸、丁酸、月桂酸等。 Examples of the saturated aliphatic monofunctional carboxylic acid include acetic acid, propionic acid, butyric acid, lauric acid, and the like.
作為不飽和脂肪族單官能羧酸,例如可列舉丙烯酸、甲基丙烯酸、亞麻油酸等。 Examples of the unsaturated aliphatic monofunctional carboxylic acid include acrylic acid, methacrylic acid, and linoleic acid.
作為芳香族單官能羧酸,例如可列舉苯甲酸、2-苯氧基苯甲酸、4-甲基苯甲酸等。 Examples of the aromatic monofunctional carboxylic acid include benzoic acid, 2-phenoxybenzoic acid, and 4-methylbenzoic acid.
該等羧酸可單獨使用或將2種以上併用。 These carboxylic acids may be used singly or in combination of two or more.
作為羧酸,較佳為可列舉飽和脂肪族單官能羧酸,更佳為乙酸。若使用上述羧酸,則可簡便地獲得羧酸改質木質素,又,所獲得之羧酸改質木質素如下文所述,由於對有機溶劑之溶解性相對較高,又,熔融溫度為相對低溫(100~200℃左右),故而操作性亦優異。 The carboxylic acid is preferably a saturated aliphatic monofunctional carboxylic acid, more preferably acetic acid. When the above carboxylic acid is used, the carboxylic acid-modified lignin can be easily obtained, and the obtained carboxylic acid-modified lignin is as follows, since the solubility in the organic solvent is relatively high, and the melting temperature is Relatively low temperature (about 100 to 200 ° C), so the operability is also excellent.
木質素係由愈創木基木質素(guaiacyl lignin)(G型)、紫丁香基木質素(syringyl lignin)(S型)、對羥基苯基木質素(H型)等基本骨架所組成之高分子酚性化合物,包含於植物整體中。作為將此種天然木質素工業地萃取出者,例如已知有於利用蘇打法、亞硫酸法、精製法等利用植物原料製造紙漿時所排出之廢液(黑液)中所含之蘇打木質素、亞硫酸酯木質素、精製木質素等。 The lignin is composed of guaiacyl lignin (G type), syringyl lignin (S type), p-hydroxyphenyl lignin (H type) and other basic skeletons. A molecular phenolic compound is included in the whole plant. As a natural extract of such natural lignin, for example, it is known that it is contained in a waste liquid (black liquor) discharged from a plant material by a soda method, a sulfurous acid method, a purification method, or the like. Quality, sulfite lignin, refined lignin, etc.
作為木質素,具體而言,可列舉源自木本系植物之木質素、及源自草本系植物之木質素。 Specific examples of the lignin include lignin derived from woody plants and lignin derived from herbaceous plants.
作為源自木本系植物之木質素,例如可列舉針葉樹(例如,柳杉等)所含之針葉樹系木質素,例如闊葉樹所含之闊葉樹系木質素等。此種源自木本系植物之木質素不包含以H型為基本骨架之木質素,例如,針葉樹系木質素係以G型為基本骨架,闊葉樹系木質素係以G型及S型為基本骨架。 Examples of the lignin derived from the woody plant include coniferous lignin contained in a conifer (for example, cedar), for example, a broad-leaved tree lignin contained in a broad-leaved tree. The lignin derived from the woody plant does not contain the lignin with the H-type as the basic skeleton. For example, the coniferous lignin is based on the G-type, and the broad-leaved lignin is based on the G-type and the S-type. skeleton.
作為源自草本系植物之木質素,例如可列舉禾本科植物(麥稈、稻稈、玉米、竹子等)所含之禾本系木質素等。此種源自草本系植物之木質素係以H型、G型及S型之全部為基本骨架。 Examples of the lignin derived from the herbaceous plant include grass lignin or the like contained in gramineous plants (wheat straw, rice straw, corn, bamboo, etc.). The lignin derived from the herbaceous plant is based on all of the H-form, the G-form, and the S-form.
該等木質素可單獨使用,亦可將2種以上併用。 These lignin may be used singly or in combination of two or more.
作為木質素,較佳為可列舉源自草本系植物之木質素,更佳為源自由玉米飼用莖葉(corn stover)(玉米之芯、莖、葉等)獲得之草本系植物之木質素。 As the lignin, preferred is lignin derived from a herbaceous plant, and more preferably a lignin derived from a herbaceous plant obtained from a corn stover (corn core, stem, leaf, etc.). .
又,作為木質素,就反應性之觀點而言,可列舉較佳為以9質量%以上、更佳為14質量%以上之比例含有H型之基本骨架。 In addition, as the lignin, a basic skeleton containing an H-form is preferably contained in a ratio of 9% by mass or more, and more preferably 14% by mass or more, from the viewpoint of reactivity.
羧酸改質木質素之製造方法並無特別限制,可依據公知之方法。 The method for producing the carboxylic acid-modified lignin is not particularly limited and can be carried out according to a known method.
具體而言,例如可藉由對成為木質素之原料之植物材料(例如,針葉樹、闊葉樹、禾本科植物等)使用羧酸(較佳為乙酸)進行蒸解,以紙漿廢液之形式獲得羧酸改質木質素。 Specifically, for example, a carboxylic acid can be obtained in the form of a pulp waste liquid by using a carboxylic acid (preferably acetic acid) for the plant material (for example, conifer, broadleaf, grass, etc.) which is a raw material of lignin. Modified lignin.
作為蒸解方法,並無特別限制,例如將成為木質素之原料之植物材料與羧酸及無機酸(例如,鹽酸、硫酸等)混合,使其進行反應。 The method of the distillation is not particularly limited. For example, a plant material which is a raw material of lignin is mixed with a carboxylic acid and an inorganic acid (for example, hydrochloric acid, sulfuric acid, etc.) to carry out a reaction.
關於羧酸之調配比例,相對於成為木質素之原料之植物材料100質量份,羧酸(100%換算)例如為500質量份以上,較佳為900質量份以上,例如為30000質量份以下,較佳為15000質量份以下。 The carboxylic acid (100% conversion) is, for example, 500 parts by mass or more, preferably 900 parts by mass or more, for example, 30,000 parts by mass or less, based on 100 parts by mass of the plant material which is a raw material of lignin. It is preferably 15,000 parts by mass or less.
又,關於無機酸之調配比例,相對於成為木質素之原料之植物材料100質量份,無機酸(100%換算)例如為0.01質量份以上,較佳為0.05質量份以上,例如為10質量份以下,較佳為5質量份以下。 In addition, the inorganic acid (100% conversion) is, for example, 0.01 parts by mass or more, preferably 0.05 parts by mass or more, for example, 10 parts by mass, based on 100 parts by mass of the plant material which is a raw material of lignin. Hereinafter, it is preferably 5 parts by mass or less.
又,作為反應條件,反應溫度例如為30℃以上,較 佳為50℃以上,例如為400℃以下,較佳為250℃以下。又,反應時間例如為0.5小時以上,較佳為1小時以上,例如為20小時以下,較佳為10小時以下。 Further, as a reaction condition, the reaction temperature is, for example, 30 ° C or more. It is preferably 50 ° C or more, for example, 400 ° C or less, preferably 250 ° C or less. Further, the reaction time is, for example, 0.5 hours or longer, preferably 1 hour or longer, for example, 20 hours or shorter, preferably 10 hours or shorter.
藉由此種蒸解,可獲得紙漿,並且以紙漿廢液之形式獲得羧酸改質木質素。 By this evaporation, pulp is obtained, and carboxylic acid-modified lignin is obtained in the form of a pulp waste liquid.
繼而,該方法中,利用過濾等公知之分離方法將紙漿分離,並回收濾液(紙漿廢液),視需要將未反應之羧酸例如藉由使用旋轉蒸發器、減壓蒸餾等之公知之方法進行去除(蒸餾去除)。其後,添加大大過量之水使羧酸改質木質素沈澱並進行過濾,藉此以固形份之形式回收羧酸改質木質素。 Then, in this method, the pulp is separated by a known separation method such as filtration, and the filtrate (pulp waste liquid) is recovered, and if necessary, an unreacted carboxylic acid is used, for example, by a known method using a rotary evaporator, vacuum distillation, or the like. Removal (distillation removal). Thereafter, a large excess of water is added to precipitate and filter the carboxylic acid-modified lignin, thereby recovering the carboxylic acid-modified lignin as a solid.
又,獲得羧酸改質木質素之方法並不限定於上述,例如,亦可藉由使未經羧酸改質之木質素(以下,未改質木質素)與羧酸進行反應而獲得羧酸改質木質素。 Further, the method for obtaining the carboxylic acid-modified lignin is not limited to the above, and for example, a carboxy group can be obtained by reacting lignin (hereinafter, unmodified lignin) which has not been modified with a carboxylic acid with a carboxylic acid. Acid modified lignin.
此種方法中,作為未改質木質素,較佳為可列舉粉末狀之未改質木質素。 In such a method, as the unmodified lignin, a powdery unmodified lignin is preferable.
粉末狀之未改質木質素之平均粒徑例如為0.1μm以上,較佳為5μm以上,例如為1000μm以下,較佳為500μm以下。 The average particle diameter of the powdery unmodified lignin is, for example, 0.1 μm or more, preferably 5 μm or more, for example, 1000 μm or less, or preferably 500 μm or less.
只要平均粒徑為上述範圍,則能夠抑制未改質木質素之凝集,從而使未改質木質素對羧酸良好地分散。 When the average particle diameter is in the above range, aggregation of unmodified lignin can be suppressed, and unmodified lignin can be favorably dispersed with respect to the carboxylic acid.
再者,粉末狀之未改質木質素可藉由對塊狀之未改質木質素利用公知之方法進行乾燥及粉碎而獲得,又,亦可使用市售品。 Further, the powdery unmodified lignin can be obtained by drying and pulverizing the block-shaped unmodified lignin by a known method, and a commercially available product can also be used.
作為使未改質木質素與羧酸進行反應之方法,例如將未改質木質素與羧酸及無機酸(例如,鹽酸、硫酸等)進行混合,使 其反應。 As a method of reacting unmodified lignin with a carboxylic acid, for example, unmodified lignin is mixed with a carboxylic acid and a mineral acid (for example, hydrochloric acid, sulfuric acid, etc.) so that Its reaction.
關於羧酸之調配比例,相對於未改質木質素100質量份,羧酸(100%換算)例如為300質量份以上,較佳為500質量份以上,例如為15000質量份以下,較佳為10000質量份以下。 The carboxylic acid (100% conversion) is, for example, 300 parts by mass or more, preferably 500 parts by mass or more, for example, 15,000 parts by mass or less, preferably 100 parts by mass or less, based on 100 parts by mass of the unmodified lignin. 10,000 parts by mass or less.
又,關於無機酸之調配比例,相對於未改質木質素100質量份,無機酸(100%換算)例如為0.01質量份以上,較佳為0.05質量份以上,例如為10質量份以下,較佳為5質量份以下。 In addition, the inorganic acid (100% conversion) is, for example, 0.01 parts by mass or more, preferably 0.05 parts by mass or more, for example, 10 parts by mass or less, based on 100 parts by mass of the unmodified lignin. It is preferably 5 parts by mass or less.
又,作為反應條件,反應溫度例如為30℃以上,較佳為50℃以上,例如為400℃以下,較佳為250℃以下。又,反應時間例如為0.5小時以上,較佳為1小時以上,例如為20小時以下,較佳為10小時以下。 Further, as the reaction conditions, the reaction temperature is, for example, 30 ° C or higher, preferably 50 ° C or higher, for example, 400 ° C or lower, preferably 250 ° C or lower. Further, the reaction time is, for example, 0.5 hours or longer, preferably 1 hour or longer, for example, 20 hours or shorter, preferably 10 hours or shorter.
此種羧酸改質木質素之操作性優異。 Such a carboxylic acid-modified lignin is excellent in handleability.
即,未經羧酸改質之木質素由於對有機溶劑之溶解性相對較低,又,不會熔融,故而根據用途,存在操作性較差之情況。 That is, lignin which has not been modified with a carboxylic acid has a relatively low solubility in an organic solvent and does not melt, and therefore has poor handleability depending on the use.
另一方面,如上所述,經羧酸改質之木質素由於對極性有機溶劑(例如,丙酮、甲醇、苯酚、四氫呋喃、乙腈、N-甲基吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、六甲基膦醯基醯胺等)之溶解性相對較高,且熔融溫度為相對低溫(100~200℃左右),故而操作性優異。 On the other hand, as described above, the carboxylic acid-modified lignin is due to a polar organic solvent (for example, acetone, methanol, phenol, tetrahydrofuran, acetonitrile, N-methylpyrrolidone, N,N-dimethylmethyl). The solubility of decylamine, N,N-dimethylacetamide, dimethyl hydrazine, hexamethylphosphonium decylamine, etc. is relatively high, and the melting temperature is relatively low temperature (about 100 to 200 ° C) Therefore, the operability is excellent.
又,羧酸改質木質素較佳為藉由有機溶劑自藉由上述方法而獲得之產物(粗產物)中萃取。 Further, the carboxylic acid-modified lignin is preferably extracted from the product (crude product) obtained by the above method by an organic solvent.
作為有機溶劑,可列舉上述極性有機溶劑,較佳為可列舉丙酮。 The organic solvent may, for example, be the above-mentioned polar organic solvent, and acetone is preferred.
藉由利用有機溶劑萃取羧酸改質木質素,能夠將羧酸 改質木質素進行精製,從而能夠謀求環氧樹脂硬化物(後述)之耐熱性之提昇。 The carboxylic acid can be obtained by extracting the carboxylic acid modified lignin with an organic solvent. By modifying the modified lignin, it is possible to improve the heat resistance of the cured epoxy resin (described later).
再者,作為萃取方法,並無特別限制,可採用公知之方法。 Further, the extraction method is not particularly limited, and a known method can be employed.
羧酸改質木質素之萃取率例如為50質量%以上,較佳為60質量%以上,更佳為70質量%以上,例如為90質量%以下,較佳為80質量%以下。 The extraction ratio of the carboxylic acid-modified lignin is, for example, 50% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, and for example, 90% by mass or less, preferably 80% by mass or less.
又,羧酸改質木質素較佳為經酚改質。 Further, the carboxylic acid-modified lignin is preferably phenol-modified.
若要將羧酸改質木質素進行酚改質,例如使羧酸改質木質素(未經酚改質之羧酸改質木質素)與酚類於酸觸媒下進行反應。 To phenol-modified carboxylic acid-modified lignin, for example, a carboxylic acid-modified lignin (a phenol-modified carboxylic acid-modified lignin) is reacted with a phenol under an acid catalyst.
作為酚類,例如可列舉:苯酚、甲酚(鄰甲酚、間甲酚、對甲酚等)、間苯二酚等。 Examples of the phenols include phenol, cresol (o-cresol, m-cresol, p-cresol, etc.), resorcin, and the like.
該等酚類可單獨使用或將2種以上併用。 These phenols may be used alone or in combination of two or more.
作為酚類,就性能提昇之觀點而言,較佳為可列舉甲酚,更佳為可列舉對甲酚。 The phenol is preferably cresol from the viewpoint of performance improvement, and more preferably p-cresol.
關於酚類之調配比例,相對於未經酚改質之羧酸改質木質素100質量份,例如為100質量份以上,較佳為300質量份以上,例如為5000質量份以下,較佳為3000質量份以下。 The blending ratio of the phenols is, for example, 100 parts by mass or more, preferably 300 parts by mass or more, for example, 5,000 parts by mass or less, preferably 100 parts by mass or less, based on 100 parts by mass of the phenol-modified lignin modified phenol. 3000 parts by mass or less.
作為酸觸媒,並無特別限制,可列舉公知之酸觸媒,具體而言,例如可列舉硫酸、硝酸、鹽酸等無機之強酸。 The acid catalyst is not particularly limited, and examples thereof include a known acid catalyst. Specific examples thereof include inorganic strong acids such as sulfuric acid, nitric acid, and hydrochloric acid.
該等酸觸媒可單獨使用或將2種以上併用。 These acid catalysts may be used alone or in combination of two or more.
作為酸觸媒,就低成本性及性能提昇之觀點而言,較佳為可列舉硫酸。 As the acid catalyst, sulfuric acid is preferred from the viewpoint of low cost and performance improvement.
關於酸觸媒之調配比例,相對於未經酚改質之羧酸改質木質素100質量份,例如為1質量份以上,較佳為5質量份以上,例如為20質量份以下,較佳為15質量份以下。 The blending ratio of the acid catalyst is, for example, 1 part by mass or more, preferably 5 parts by mass or more, for example, 20 parts by mass or less, preferably 100 parts by mass or less, based on 100 parts by mass of the carboxylic acid-modified lignin which has not been modified with phenol. It is 15 parts by mass or less.
又,於羧酸改質木質素與酚類之反應中,能夠併用甲醛。 Further, in the reaction between the carboxylic acid-modified lignin and the phenol, formaldehyde can be used in combination.
於使用甲醛之情形時,甲醛與羧酸改質木質素及酚類會進行共聚,甲醛因進行脫水縮合會成為亞甲基,於經酚改質之羧酸改質木質素(羧酸改質木質素-酚樹脂)中,經由亞甲基鍵結酚基。 In the case of using formaldehyde, formaldehyde and carboxylic acid modified lignin and phenols will be copolymerized, formaldehyde will be methylene group due to dehydration condensation, and phenol modified carboxylic acid modified lignin (carboxylic acid modification) In the lignin-phenol resin, a phenol group is bonded via a methylene group.
於使用甲醛之情形時,其調配比例相對於酚類1莫耳為2莫耳以下,較佳為1莫耳以下。 In the case of using formaldehyde, the compounding ratio is 2 mol or less, preferably 1 mol or less, relative to the phenolic 1 molar.
又,於羧酸改質木質素與酚類之反應中,可視需要加入溶劑。作為溶劑,例如可列舉N-甲基吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、六甲基膦醯基醯胺等,較佳為N,N-二甲基甲醯胺。 Further, in the reaction of the carboxylic acid-modified lignin with the phenol, a solvent may be added as needed. Examples of the solvent include N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethylammonium, and hexamethylphosphonium decylamine. And, preferably, N,N-dimethylformamide.
於使用溶劑之情形時,其調配量相對於羧酸改質木質素100質量份,例如為25質量份以上,較佳為40質量份以上,例如為100質量份以下,較佳為60質量份以下。 When the solvent is used, the amount thereof is, for example, 25 parts by mass or more, preferably 40 parts by mass or more, for example, 100 parts by mass or less, preferably 60 parts by mass, based on 100 parts by mass of the carboxylic acid-modified lignin. the following.
而且,若要使羧酸改質木質素與酚類進而視需要與甲醛進行反應,例如只要將各成分以上述比例進行調配並加熱即可。 Further, in order to react the carboxylic acid-modified lignin with the phenol and, if necessary, with formaldehyde, for example, the components may be blended and heated in the above ratio.
作為反應條件,反應溫度例如為100℃以上,較佳為110℃以上,例如為200℃以下,較佳為150℃以下。又,反應時間例如為30分鐘以上,例如為3小時以下。 The reaction temperature is, for example, 100 ° C or higher, preferably 110 ° C or higher, and for example 200 ° C or lower, preferably 150 ° C or lower. Further, the reaction time is, for example, 30 minutes or longer, for example, 3 hours or shorter.
藉由如此般使羧酸改質木質素與酚類進行反應,能夠獲得經酚改質之羧酸改質木質素(羧酸改質木質素之酚改質體、羧 酸改質木質素-酚樹脂)。 By reacting a carboxylic acid-modified lignin with a phenol in this manner, a phenol-modified carboxylic acid-modified lignin (a phenolic modified substance of a carboxylic acid-modified lignin, a carboxy group) can be obtained. Acid modified lignin-phenol resin).
又,反應結束後,可視需要添加鹼將酸觸媒進行中和。 Further, after the completion of the reaction, the acid catalyst may be neutralized by adding a base as needed.
又,亦可視需要藉由過濾、蒸餾等公知之方法去除及回收未反應成分(未反應之酚類等)。再者,於進行蒸餾之情形時之蒸餾條件並無特別限制,溫度條件例如為150℃以上,又,壓力條件例如為60mmHg以下。再者,所回收之未反應成分(未反應之酚類等)能夠直接利用於下一生產中。 Further, unreacted components (unreacted phenols, etc.) may be removed and recovered by a known method such as filtration or distillation as needed. Further, the distillation conditions in the case of performing distillation are not particularly limited, and the temperature conditions are, for example, 150 ° C or higher, and the pressure conditions are, for example, 60 mmHg or less. Further, the unreacted components (unreacted phenols, etc.) recovered can be directly used in the next production.
又,於以溶液之形式獲得經酚改質之羧酸改質木質素之情形(例如,添加鹼水溶液之情形等)時,可藉由將該溶液滴加於己烷等有機溶劑中,以沈澱之形式回收經酚改質之羧酸改質木質素。 Further, when a phenol-modified carboxylic acid-modified lignin is obtained as a solution (for example, in the case of adding an aqueous alkali solution, etc.), the solution may be added dropwise to an organic solvent such as hexane to The phenol-modified carboxylic acid modified lignin is recovered in the form of a precipitate.
進而,亦可藉由使以沈澱之形式回收之經酚改質之羧酸改質木質素溶解於有機溶劑等中,再次以沈澱之形式進行回收,而將經酚改質之羧酸改質木質素進行精製。 Further, the phenol-modified carboxylic acid-modified lignin recovered in the form of a precipitate may be dissolved in an organic solvent or the like, and recovered again in the form of a precipitate, thereby modifying the phenol-modified carboxylic acid. The lignin is refined.
又,亦可視需要將經酚改質之羧酸改質木質素(羧酸改質木質素-酚樹脂)進行洗淨。作為洗淨方法,並無特別限制,例如於經酚改質之羧酸改質木質素(羧酸改質木質素-酚樹脂)中添加水並進行攪拌即可。藉由此種洗淨,能夠將雜質或因上述中和而產生之鹽等去除。 Further, the phenol-modified carboxylic acid-modified lignin (carboxylic acid-modified lignin-phenol resin) may be washed as needed. The washing method is not particularly limited. For example, water may be added to the phenol-modified carboxylic acid-modified lignin (carboxylic acid-modified lignin-phenol resin) and stirred. By such washing, impurities or salts generated by the above neutralization can be removed.
藉由使用此種經酚改質之羧酸改質木質素(羧酸改質木質素之酚改質體),能夠謀求環氧樹脂硬化物(後述)之耐熱性之提昇。 By using such a phenol-modified carboxylic acid-modified lignin (phenolic modified body of a carboxylic acid-modified lignin), heat resistance of an epoxy resin cured product (described later) can be improved.
而且,於羧酸改質木質素(包含經酚改質之羧酸改質木質素(以下相同))與表氯醇之反應中,例如於羧酸改質木質素中調 配表氯醇,並使其於公知之鹼觸媒下進行反應。 Moreover, in the reaction of carboxylic acid-modified lignin (including phenol-modified carboxylic acid-modified lignin (the same applies hereinafter)) with epichlorohydrin, for example, in carboxylic acid-modified lignin The epichlorohydrin is combined and allowed to react under a known base catalyst.
關於羧酸改質木質素與表氯醇之調配比例,相對於羧酸改質木質素100質量份,表氯醇為過量,具體而言,例如為150質量份以上,較佳為250質量份以上,例如為2000質量份以下,較佳為1000質量份以下。 The blending ratio of the carboxylic acid-modified lignin to the epichlorohydrin is in excess of 100 parts by mass of the carboxylic acid-modified lignin, and specifically, for example, 150 parts by mass or more, preferably 250 parts by mass. The above is, for example, 2,000 parts by mass or less, preferably 1,000 parts by mass or less.
作為反應條件,反應溫度例如為80℃以上,較佳為90℃以上,例如為120℃以下,較佳為110℃以下。又,反應時間例如為2小時以上,較佳為2.5小時以上,例如為4小時以下,較佳為3.5小時以下。 The reaction temperature is, for example, 80 ° C or higher, preferably 90 ° C or higher, for example, 120 ° C or lower, preferably 110 ° C or lower. Further, the reaction time is, for example, 2 hours or longer, preferably 2.5 hours or longer, for example, 4 hours or shorter, preferably 3.5 hours or shorter.
藉此,使縮水甘油醚基鍵結於羧酸改質木質素,從而可獲得環氧樹脂。 Thereby, the glycidyl ether group is bonded to the carboxylic acid-modified lignin, whereby an epoxy resin can be obtained.
又,除上述方式以外,例如亦可藉由如下2個階段反應使羧酸改質木質素與表氯醇鍵結而獲得環氧樹脂:首先,於公知之相間轉移觸媒(例如,四甲基銨(TBAC)等四級銨鹽等)之存在下,以上述比例使表氯醇加成於羧酸改質木質素,其後,滴加鹼溶液(氫氧化鈉水溶液等)使其閉環。 Further, in addition to the above, for example, the carboxylic acid-modified lignin may be bonded to epichlorohydrin by the following two stages of reaction to obtain an epoxy resin: first, a transfer catalyst is known between the phases (for example, four In the presence of a quaternary ammonium salt such as quaternary ammonium (TBAC), epichlorohydrin is added to the carboxylic acid-modified lignin in the above ratio, and then an alkali solution (such as an aqueous sodium hydroxide solution) is added thereto to make a closed loop. .
於此種情形時,第1階段之反應(使表氯醇加成於羧酸改質木質素之反應)之反應溫度例如為60℃以上,較佳為75℃以上,例如為90℃以下,較佳為85℃以下。又,反應時間例如為6小時以上,較佳為7小時以上,例如為10小時以下,較佳為9小時以下。 In this case, the reaction temperature of the first-stage reaction (reaction of epichlorohydrin to the carboxylic acid-modified lignin) is, for example, 60 ° C or higher, preferably 75 ° C or higher, for example, 90 ° C or lower. It is preferably 85 ° C or less. Further, the reaction time is, for example, 6 hours or longer, preferably 7 hours or longer, for example, 10 hours or shorter, preferably 9 hours or shorter.
又,第2階段之反應(閉環反應)之反應溫度例如為20℃以上,較佳為35℃以上,例如為50℃以下,較佳為45℃以下。又,反應時間例如為10小時以上,較佳為14小時以上,例如為20 小時以下,較佳為16小時以下。 Further, the reaction temperature of the second-stage reaction (closed-loop reaction) is, for example, 20 ° C or higher, preferably 35 ° C or higher, for example, 50 ° C or lower, preferably 45 ° C or lower. Further, the reaction time is, for example, 10 hours or longer, preferably 14 hours or longer, for example, 20 Below the hour, it is preferably 16 hours or less.
於以此方式而獲得之環氧樹脂中,羧酸改質木質素與表氯醇之鍵結比率通常為相對於羧酸改質木質素100質量份,表氯醇為20~35質量份。 In the epoxy resin obtained in this manner, the bonding ratio of the carboxylic acid-modified lignin to epichlorohydrin is usually 100 parts by mass relative to the carboxylic acid-modified lignin, and the epichlorohydrin is 20 to 35 parts by mass.
又,關於以此方式而獲得之環氧樹脂中之羧酸改質木質素之含量,相對於環氧樹脂之總量100質量份,例如為70質量份以上,較佳為75質量份以上,例如為85質量份以下。 In addition, the content of the carboxylic acid-modified lignin in the epoxy resin obtained in this manner is, for example, 70 parts by mass or more, preferably 75 parts by mass or more, based on 100 parts by mass of the total amount of the epoxy resin. For example, it is 85 parts by mass or less.
而且,此種環氧樹脂由於係使用經羧酸改質之木質素而獲得,故而操作性優異,又,能夠謀求環氧樹脂硬化物(後述)之耐熱性之提昇。進而,此種環氧樹脂由於係使用經羧酸改質之木質素而獲得,故而適應於碳中和,從而能夠減輕環境負荷。 In addition, since such an epoxy resin is obtained by using a carboxylic acid-modified lignin, it is excellent in workability, and the heat resistance of the cured epoxy resin (described later) can be improved. Further, since such an epoxy resin is obtained by using a carboxylic acid-modified lignin, it is suitable for carbon neutralization, and the environmental load can be reduced.
2.環氧樹脂硬化劑 2. Epoxy resin hardener
本發明之環氧樹脂硬化劑包含羧酸改質木質素。 The epoxy resin hardener of the present invention comprises a carboxylic acid modified lignin.
作為羧酸改質木質素,可列舉上述羧酸改質木質素。 Examples of the carboxylic acid-modified lignin include the above-mentioned carboxylic acid-modified lignin.
又,羧酸改質木質素較佳為利用有機溶劑萃取而使用。 Further, the carboxylic acid-modified lignin is preferably used by extraction with an organic solvent.
藉由利用有機溶劑萃取羧酸改質木質素,能夠將羧酸改質木質素進行精製,從而能夠謀求環氧樹脂硬化物(後述)之耐熱性之提昇。 By extracting the carboxylic acid-modified lignin with an organic solvent, the carboxylic acid-modified lignin can be purified, and the heat resistance of the cured epoxy resin (described later) can be improved.
又,羧酸改質木質素較佳為經酚改質而使用。 Further, the carboxylic acid-modified lignin is preferably used by phenol modification.
若羧酸改質木質素經酚改質,則能夠進一步謀求環氧樹脂硬化物(後述)之耐熱性之提昇。 When the carboxylic acid-modified lignin is phenol-modified, the heat resistance of the cured epoxy resin (described later) can be further improved.
而且,此種環氧樹脂硬化劑由於係使用經羧酸改質之木質素而獲得,故而操作性優異,又,能夠謀求環氧樹脂硬化物(後 述)之耐熱性之提昇。進而,此種環氧樹脂硬化劑由於係使用經羧酸改質之木質素而獲得,故而適應於碳中和,從而能夠減輕環境負荷。 Further, since such an epoxy resin hardener is obtained by using a carboxylic acid-modified lignin, it is excellent in workability and can be cured of an epoxy resin (post Said) the improvement of heat resistance. Further, since such an epoxy resin hardener is obtained by using a carboxylic acid-modified lignin, it is suitable for carbon neutralization, and the environmental load can be reduced.
3.環氧樹脂組成物 3. Epoxy resin composition
環氧樹脂組成物含有由環氧樹脂所組成之主劑、及環氧樹脂硬化劑。 The epoxy resin composition contains a main component composed of an epoxy resin and an epoxy resin hardener.
作為環氧樹脂,可列舉上述本發明之環氧樹脂,又,作為環氧樹脂硬化劑,可列舉上述本發明之環氧樹脂硬化劑。 Examples of the epoxy resin include the epoxy resin of the present invention described above, and examples of the epoxy resin curing agent include the epoxy resin curing agent of the present invention.
又,於使用上述本發明之環氧樹脂作為環氧樹脂之情形時,作為環氧樹脂硬化劑,例如可使用脂肪族胺類、芳香族胺類、多酚化合物、酚醛清漆樹脂、酸酐等公知之環氧樹脂硬化劑。 Further, when the epoxy resin of the present invention is used as the epoxy resin, as the epoxy resin curing agent, for example, an aliphatic amine, an aromatic amine, a polyphenol compound, a novolac resin, an acid anhydride, or the like can be used. Epoxy resin hardener.
又,於使用上述本發明之環氧樹脂硬化劑作為環氧樹脂硬化劑之情形時,作為環氧樹脂,例如可使用雙酚型環氧樹脂、酚醛清漆型環氧樹脂等公知之環氧樹脂。 Further, when the epoxy resin curing agent of the present invention is used as the epoxy resin curing agent, as the epoxy resin, for example, a known epoxy resin such as a bisphenol epoxy resin or a novolac epoxy resin can be used. .
又,作為環氧樹脂,可將上述本發明之環氧樹脂與公知之環氧樹脂以適當之比例併用,又,作為環氧樹脂硬化劑,亦可將上述本發明之環氧樹脂硬化劑與公知之環氧樹脂硬化劑以適當之比例併用。 Further, as the epoxy resin, the epoxy resin of the present invention and the known epoxy resin may be used in an appropriate ratio, and as the epoxy resin curing agent, the above-mentioned epoxy resin hardener of the present invention may be Known epoxy resin hardeners are used in combination in an appropriate ratio.
較佳為使用上述本發明之環氧樹脂作為環氧樹脂,又,使用上述本發明之環氧樹脂硬化劑作為環氧樹脂硬化劑。 It is preferable to use the epoxy resin of the present invention as an epoxy resin, and to use the above-mentioned epoxy resin hardener of the present invention as an epoxy resin hardener.
主劑(環氧樹脂)與環氧樹脂硬化劑之調配係將該等例如以環氧樹脂硬化劑之胺當量及/或酚性羥基當量與主劑之環氧當量成為大致等量±20%當量之方式進行調配。 The formulation of the main agent (epoxy resin) and the epoxy resin hardener is such that the amine equivalent and/or the phenolic hydroxyl equivalent of the epoxy resin hardener and the epoxy equivalent of the main agent are substantially equal to ± 20%. Alternately formulated.
又,作為調配方法,並無特別限制,例如使主劑(環 氧樹脂)與環氧樹脂硬化劑溶解於共同之溶劑(例如,四氫呋喃、丙酮、甲基乙基酮、甲醇、乙腈等)中,並視需要添加硬化促進劑(後述),其後使溶劑揮發。 Further, as a method of blending, there is no particular limitation, for example, a main agent (ring The epoxy resin and the epoxy resin hardener are dissolved in a common solvent (for example, tetrahydrofuran, acetone, methyl ethyl ketone, methanol, acetonitrile, etc.), and if necessary, a hardening accelerator (described later) is added, and then the solvent is volatilized. .
再者,於主劑(環氧樹脂)及環氧樹脂硬化劑相對於溶劑進行溶解時,可視需要進行加熱。加熱溫度例如為40℃以上,較佳為50℃以上,例如為70℃以下,較佳為60℃以下。 Further, when the main component (epoxy resin) and the epoxy resin hardener are dissolved in a solvent, heating may be performed as needed. The heating temperature is, for example, 40 ° C or higher, preferably 50 ° C or higher, for example, 70 ° C or lower, preferably 60 ° C or lower.
又,於環氧樹脂組成物中,能夠於適當之時機添加硬化促進劑。 Further, in the epoxy resin composition, a curing accelerator can be added at an appropriate timing.
作為硬化促進劑,例如可列舉2-乙基-4-甲基咪唑及其衍生物、1-氰乙基-2-乙基-4-甲基咪唑及其衍生物,進而可列舉二甲苄胺等三級胺、三苯基膦(TPP)之衍生物(KALIBOR鹽等)、及公知之硬化促進劑。 Examples of the curing accelerator include 2-ethyl-4-methylimidazole and derivatives thereof, 1-cyanoethyl-2-ethyl-4-methylimidazole, and derivatives thereof, and further examples thereof include dimethylbenzyl chloride. A tertiary amine such as an amine, a derivative of triphenylphosphine (TPP) (KALIBOR salt, etc.), and a known hardening accelerator.
於調配硬化促進劑之情形時,其調配比例相對於環氧樹脂及環氧樹脂硬化劑之總量100質量份,例如為0.1質量份以上,較佳為0.2質量份以上,例如為3質量份以下,較佳為2質量份以下。 In the case of blending the hardening accelerator, the blending ratio is, for example, 0.1 part by mass or more, preferably 0.2 part by mass or more, for example, 3 parts by mass, based on 100 parts by mass of the total amount of the epoxy resin and the epoxy resin hardener. Hereinafter, it is preferably 2 parts by mass or less.
而且,此種環氧樹脂組成物由於在環氧樹脂及/或環氧樹脂硬化劑中使用有經羧酸改質之木質素,故而操作性優異,又,能夠謀求環氧樹脂硬化物之耐熱性之提昇。 Further, since such an epoxy resin composition uses carboxylic acid-modified lignin in an epoxy resin and/or an epoxy resin curing agent, it is excellent in handleability, and heat resistance of an epoxy resin cured product can be obtained. Sexual improvement.
4.環氧樹脂硬化物 4. Epoxy resin cured
環氧樹脂硬化物可藉由使環氧樹脂組成物硬化而獲得。 The epoxy resin cured product can be obtained by hardening the epoxy resin composition.
作為使環氧樹脂組成物硬化之方法,例如可列舉將環氧樹脂組成物注入公知之模具並進行加熱之方法、或進行真空熱壓成形之方法等。 Examples of the method for curing the epoxy resin composition include a method of injecting an epoxy resin composition into a known mold and heating it, or a method of performing vacuum hot press forming.
於加熱中,可對環氧樹脂以一個階段進行加熱,又,亦可以兩個階段以上之多個階段進行加熱。較佳為對環氧樹脂以兩個階段進行加熱。 In the heating, the epoxy resin may be heated in one stage, or may be heated in multiple stages of two or more stages. It is preferred to heat the epoxy resin in two stages.
於此種情形時,作為加熱條件,第一階段之加熱溫度例如為140℃以上,較佳為145℃以上,例如為160℃以下,較佳為155℃以下。又,第一階段之加熱時間例如為1.5小時以上,較佳為2小時以上,例如為3小時以下,較佳為2.5小時以下。 In this case, the heating temperature in the first stage is, for example, 140 ° C or higher, preferably 145 ° C or higher, for example, 160 ° C or lower, preferably 155 ° C or lower. Further, the heating time in the first stage is, for example, 1.5 hours or longer, preferably 2 hours or longer, for example, 3 hours or shorter, preferably 2.5 hours or shorter.
又,第二階段之加熱溫度例如為170℃以上,較佳為175℃以上,例如為190℃以下,較佳為185℃以下。又,第二階段之加熱時間例如為2.5小時以上,較佳為3小時以上,例如為4小時以下,較佳為3.5小時以下。 Further, the heating temperature in the second stage is, for example, 170 ° C or higher, preferably 175 ° C or higher, for example, 190 ° C or lower, preferably 185 ° C or lower. Further, the heating time in the second stage is, for example, 2.5 hours or longer, preferably 3 hours or longer, for example, 4 hours or shorter, preferably 3.5 hours or shorter.
藉此,可獲得耐熱性優異之環氧樹脂硬化物。 Thereby, an epoxy resin cured product excellent in heat resistance can be obtained.
又,此種環氧樹脂硬化物由於機械物性及電性亦優異,進而係使用經羧酸改質之木質素而獲得,故而適應於碳中和,從而能夠減輕環境負荷。 Moreover, since the cured epoxy resin is excellent in mechanical properties and electrical properties, and is obtained by using carboxylic acid-modified lignin, it is suitable for carbon neutralization, and the environmental load can be reduced.
因此,此種環氧樹脂硬化物作為黏著劑、成形材料、構造材料、半導體密封材、電子材料等,於各種工業領域中受到廣泛使用。 Therefore, such an epoxy resin cured product is widely used in various industrial fields as an adhesive, a molding material, a structural material, a semiconductor sealing material, an electronic material, and the like.
尤其是較佳地用於要求適應碳中和或耐熱性之電氣製品領域、汽車領域等中。 In particular, it is preferably used in the field of electrical products, automobiles, and the like which are required to be suitable for carbon neutralization or heat resistance.
繼而,基於實施例及比較例對本發明進行說明,但本發明並不受下述實施例所限定。又,於以下說明中,只要未特別言及,則「份」及「%」表示質量基準。再者,以下所示之實施例之 數值可代替於實施形態中記載之對應之數值(即,上限值或下限值)。 Hereinafter, the present invention will be described based on examples and comparative examples, but the present invention is not limited by the following examples. In the following description, "parts" and "%" indicate quality standards unless otherwise stated. Furthermore, the embodiments shown below The numerical value can be substituted for the corresponding numerical value (that is, the upper limit value or the lower limit value) described in the embodiment.
將玉米飼用莖葉100質量份與95質量%之乙酸1000質量份及硫酸3質量份進行混合,並使其於回流下反應4小時。反應後進行過濾將紙漿去除,並回收紙漿廢液。繼而,使用旋轉蒸發器將紙漿廢液中之乙酸去除,濃縮至體積成為1/10,其後,添加該濃縮液之10倍量(質量基準)之水,並進行過濾,藉此以固形份之形式獲得乙酸改質木質素。 100 parts by mass of corn forage stems and leaves were mixed with 95 parts by mass of acetic acid 1000 parts by mass and 3 parts by mass of sulfuric acid, and allowed to react under reflux for 4 hours. After the reaction, filtration is carried out to remove the pulp, and the pulp waste liquid is recovered. Then, the acetic acid in the pulp waste liquid was removed using a rotary evaporator, and concentrated to a volume of 1/10. Thereafter, 10 times (mass basis) of the concentrated liquid was added and filtered to thereby obtain a solid portion. The form of acetic acid modified lignin is obtained.
藉由與製造例1相同之方法,以固形份之形式獲得乙酸改質木質素。 Acetic acid modified lignin was obtained in the form of a solid portion by the same method as in Production Example 1.
繼而,於安裝有攪拌機、溫度計及冷卻管之300mL之三口可分離式燒瓶中加入乙酸改質木質素100質量份、對甲酚1000質量份、及98%硫酸11質量份,一面攪拌一面升溫,使其於130℃下反應2.5小時。藉此,乙酸木質素與酚及硫酸進行混合,於20分以內液化。 Then, 100 parts by mass of acetic acid-modified lignin, 1000 parts by mass of p-cresol, and 11 parts by mass of 98% sulfuric acid were placed in a 300 mL three-neck separable flask equipped with a stirrer, a thermometer, and a cooling tube, and the mixture was heated while stirring. It was allowed to react at 130 ° C for 2.5 hours. Thereby, the lignin acetate was mixed with phenol and sulfuric acid, and liquefied within 20 minutes.
繼而,冷卻至溫度變為100℃以下,並添加20%氫氧化鈉水溶液45.3質量份,藉此進行中和。繼而,藉由過濾將不溶部分去除,其後,將所獲得之溶液(濾液)滴加至其20倍體積量之己烷中,獲得沈澱。 Then, the mixture was cooled to a temperature of 100 ° C or lower, and 45.3 parts by mass of a 20% aqueous sodium hydroxide solution was added to carry out neutralization. Then, the insoluble portion was removed by filtration, and thereafter, the obtained solution (filtrate) was added dropwise to its 20-volume amount of hexane to obtain a precipitate.
繼而,將所獲得之沈澱藉由抽吸過濾進行回收,並使 其溶解於所需最小限度(約100質量份)之四氫呋喃(THF)中。繼而,將所獲得之溶液滴加於四氫呋喃之20倍體積量之己烷,再次獲得沈澱。 Then, the obtained precipitate is recovered by suction filtration, and It is dissolved in the minimum required (about 100 parts by mass) in tetrahydrofuran (THF). Then, the obtained solution was added dropwise to 20 volumes of hexane of tetrahydrofuran, and a precipitate was again obtained.
繼而,重複一次上述過濾、對四氫呋喃之溶解及己烷之滴加之操作,並將所獲得之沈澱藉由抽吸過濾進行回收。 Then, the above filtration, the dissolution of tetrahydrofuran, and the dropwise addition of hexane were repeated, and the obtained precipitate was recovered by suction filtration.
其後,使所獲得之沈澱於60℃、40mmHg之條件下乾燥15小時,藉此獲得乙酸木質素之酚改質體。 Thereafter, the obtained precipitate was dried under conditions of 60 ° C and 40 mmHg for 15 hours, whereby a phenol modified body of acetic acid lignin was obtained.
藉由與製造例1相同之方法,以固形份之形式獲得乙酸改質木質素。 Acetic acid modified lignin was obtained in the form of a solid portion by the same method as in Production Example 1.
繼而,使所獲得之乙酸改質木質素溶解於有機溶劑(丙酮)中,將不溶物藉由過濾進行去除。其後,使乙酸改質木質素之有機溶劑溶液乾燥,藉此獲得乙酸改質木質素(藉由有機溶劑而得之萃取物)。 Then, the obtained acetic acid-modified lignin was dissolved in an organic solvent (acetone), and the insoluble matter was removed by filtration. Thereafter, the organic solvent solution of the acetic acid-modified lignin is dried, whereby acetic acid-modified lignin (extracted product obtained by an organic solvent) is obtained.
使用製造例3所獲得之乙酸改質木質素(藉由有機溶劑而得之萃取物),除此以外,與製造例2同樣地使乙酸改質木質素進行酚改質。藉此,獲得乙酸木質素(藉由有機溶劑而得之萃取物)之酚改質體。 The acetic acid-modified lignin was subjected to phenol modification in the same manner as in Production Example 2 except that the acetic acid-modified lignin obtained in Production Example 3 (the extract obtained from the organic solvent) was used. Thereby, a phenolic modified body of acetic acid lignin (extracted product obtained by an organic solvent) is obtained.
對麥稈之鹼蒸解紙漿廢液(黑液)進行中和,其後進行過濾,藉 此以固形份之形式獲得未改質木質素。 Neutralize the wheat straw alkali-digested pulp waste liquid (black liquor), and then filter and borrow This obtains unmodified lignin in the form of a solid.
對麥稈之鹼蒸解紙漿廢液(黑液)進行中和,其後進行過濾,藉此以固形份之形式獲得未改質木質素。 The wheat straw alkali-digested pulp waste liquid (black liquor) is neutralized, and then filtered to obtain unmodified lignin in the form of a solid fraction.
使用該未改質木質素,與製造例2同樣地使未改質木質素進行酚改質。藉此,獲得未改質木質素(未經羧酸改質之木質素)之酚改質體。 Using this unmodified lignin, the unmodified lignin was subjected to phenol modification in the same manner as in Production Example 2. Thereby, a phenol modified body of unmodified lignin (lignin modified without carboxylic acid) was obtained.
藉由與比較製造例1相同之方法,以固形份之形式獲得未改質木質素。 Unmodified lignin was obtained in the form of a solid portion by the same method as Comparative Production Example 1.
繼而,使所獲得之未改質木質素溶解於有機溶劑(甲醇)中,並將不溶物藉由過濾進行去除。其後,使未改質木質素之有機溶劑溶液乾燥,藉此獲得未改質木質素(藉由有機溶劑而得之萃取物)。 Then, the obtained unmodified lignin was dissolved in an organic solvent (methanol), and the insoluble matter was removed by filtration. Thereafter, the organic solvent solution of the unmodified lignin is dried, whereby unmodified lignin (extract obtained by an organic solvent) is obtained.
使用比較製造例3所獲得之未改質木質素(藉由有機溶劑而得之萃取物),除此以外,與製造例2同樣地使未改質木質素進行酚改質。藉此,獲得未改質木質素(藉由有機溶劑而得之萃取物)之酚改質體。 The unmodified lignin was subjected to phenol modification in the same manner as in Production Example 2 except that the unmodified lignin obtained in Comparative Example 3 (the extract obtained by the organic solvent) was used. Thereby, a phenol modified body of unmodified lignin (an extract obtained by an organic solvent) is obtained.
於安裝有攪拌馬達、溫度計、滴加漏斗及回流冷卻管之1L之四口燒瓶中加入製造例3所獲得之乙酸改質木質素(藉由有機溶劑而得之萃取物)224質量份、過量之表氯醇1850質量份、作為相間轉移觸媒之氯化四甲基銨27.4質量份,並加入水0.9質量份,使其於氮氣流下於80℃下反應8小時。 245 parts by mass of an acetic acid-modified lignin (extracted product obtained from an organic solvent) obtained in Production Example 3 was placed in a 1-liter four-necked flask equipped with a stirring motor, a thermometer, a dropping funnel, and a reflux cooling tube. 1850 parts by mass of epichlorohydrin and 27.4 parts by mass of tetramethylammonium chloride as an interphase transfer catalyst were added, and 0.9 parts by mass of water was added thereto, and the mixture was reacted at 80 ° C for 8 hours under a nitrogen stream.
繼而,於40℃下滴加20質量%氫氧化鈉水溶液50g,並攪拌15小時。其後,冷卻至室溫,滴加20質量%乙酸水溶液使其中和。 Then, 50 g of a 20% by mass aqueous sodium hydroxide solution was added dropwise at 40 ° C, and stirred for 15 hours. Thereafter, the mixture was cooled to room temperature, and a 20% by mass aqueous acetic acid solution was added dropwise to neutralize it.
繼而,將所獲得之溶液轉移至分液漏斗,藉由100mL之離子交換水進行5次洗淨,其後加入無水硫酸鎂將水分去除。 Then, the obtained solution was transferred to a separatory funnel, washed 5 times with 100 mL of ion-exchanged water, and then anhydrous magnesium sulfate was added to remove water.
繼而,藉由過濾去除硫酸鎂,並將所獲得之溶液(濾液)滴加至其溶液之20倍體積量之己烷/二乙醚混合溶劑(混合比7/3(體積比))中,使沈澱生成。 Then, magnesium sulfate was removed by filtration, and the obtained solution (filtrate) was added dropwise to a 20-fold volume of a hexane/diethyl ether mixed solvent (mixing ratio of 7/3 (volume ratio)) of the solution. Precipitation is formed.
其後,將所獲得之沈澱藉由抽吸過濾進行回收,並使其於60℃且40mmHg之條件下乾燥15小時,藉此獲得環氧樹脂。 Thereafter, the obtained precipitate was recovered by suction filtration, and dried at 60 ° C and 40 mmHg for 15 hours, whereby an epoxy resin was obtained.
所獲得之環氧樹脂之環氧當量(EEW)為280。 The epoxy equivalent (EEW) of the obtained epoxy resin was 280.
再者,環氧當量(EEW)係藉由以下方法進行測定。 Further, the epoxy equivalent (EEW) was measured by the following method.
即,使所獲得之環氧樹脂(環氧化木質素)溶解於氘氯仿中,添加作為基準物質之1,1',2,2'-四氯乙烷(TCE),其後,測定1H-NMR光譜,並根據各波峰之積分強度比藉由下述式算出環氧當量(以下相同)。 That is, the obtained epoxy resin (epoxidized lignin) was dissolved in chloroform, and 1,1',2,2'-tetrachloroethane (TCE) as a reference substance was added, and then 1 H was measured. The NMR spectrum was calculated from the integrated intensity ratio of each peak by the following formula (the same applies hereinafter).
ITCE:1,1',2,2'-四氯乙烷(TCE)之積分強度 I TCE : integral strength of 1,1',2,2'-tetrachloroethane (TCE)
Iepoxy:環氧基之積分強度 I epoxy : integral strength of epoxy groups
Wepoxy resin:環氧樹脂(環氧化木質素)之質量 W epoxy resin : the quality of epoxy resin (epoxidized lignin)
WTCE:1,1',2,2'-四氯乙烷(TCE)之質量 W TCE : Quality of 1,1',2,2'-tetrachloroethane (TCE)
MTCE:1,1',2,2'-四氯乙烷(TCE)之分子量 M TCE : molecular weight of 1,1',2,2'-tetrachloroethane (TCE)
使用比較製造例3所獲得之未改質木質素(藉由有機溶劑而得之萃取物),除此以外,以與實施例1相同之方式獲得環氧樹脂。所獲得之環氧樹脂之環氧當量為290。 An epoxy resin was obtained in the same manner as in Example 1 except that the unmodified lignin obtained in Comparative Production Example 3 (the extract obtained by the organic solvent) was used. The epoxy resin obtained had an epoxy equivalent of 290.
為了研究各環氧樹脂之性能,將環氧樹脂與環氧樹脂硬化劑進行調配,並使其硬化。再者,作為環氧樹脂硬化劑,使用市售之酚醛清漆樹脂(Phenolite TD-2131,DIC公司製造)。 In order to study the properties of each epoxy resin, the epoxy resin and the epoxy resin hardener were formulated and hardened. Further, as the epoxy resin curing agent, a commercially available novolak resin (Phenolite TD-2131, manufactured by DIC Corporation) was used.
更具體而言,首先,以環氧樹脂之環氧當量與環氧樹脂硬化劑之胺當量及/或酚性羥基當量成為大致等量之方式準備環氧樹脂及環氧樹脂硬化劑,並使該等溶解於四氫呋喃中,繼而,以相對於環氧樹脂與環氧樹脂硬化劑之總量100質量份成為0.5質量份之方式添加硬化促進劑(1-氰乙基-2-乙基-4-甲基咪唑),藉此獲得清漆。繼而,將所獲得之清漆澆鑄於薄膜上,並使其於60℃下乾燥2小時,將四氫呋喃去除,藉此獲得環氧樹脂組成物。 More specifically, first, an epoxy resin and an epoxy resin hardener are prepared such that the epoxy equivalent of the epoxy resin and the amine equivalent of the epoxy resin hardener and/or the phenolic hydroxyl equivalent are substantially equal. These are dissolved in tetrahydrofuran, and then a hardening accelerator (1-cyanoethyl-2-ethyl-4) is added in an amount of 0.5 parts by mass based on 100 parts by mass of the total amount of the epoxy resin and the epoxy resin hardener. -Methylimidazole), whereby a varnish is obtained. Then, the obtained varnish was cast on a film, and dried at 60 ° C for 2 hours, and tetrahydrofuran was removed, whereby an epoxy resin composition was obtained.
其後,填充於Teflon(註冊商標)之模具,於真空壓製中於150℃下加熱2小時,繼而於180℃下加熱3小時,藉此使其硬化。再者,環氧樹脂組成物係於加熱時進行熔融並表現出流動性 之後進行硬化。 Thereafter, the mold was filled in Teflon (registered trademark), and heated at 150 ° C for 2 hours in vacuum pressing, followed by heating at 180 ° C for 3 hours, thereby hardening it. Furthermore, the epoxy resin composition melts upon heating and exhibits fluidity. Then harden.
針對所獲得之環氧樹脂硬化物,利用以下之方法進行評價。將其結果示於表1。 The obtained epoxy resin cured product was evaluated by the following method. The results are shown in Table 1.
(1)玻璃轉移溫度 (1) Glass transition temperature
利用動態黏彈性分析(DVA)進行測定。作為測定裝置,使用SII Nano Technologies公司製造之DMS-6100。試片之大小設為10mm×40mm×2mm。測定模式為三點彎曲模式,測定條件設為空氣條件下、溫度範圍-100℃~300℃、升溫速度5℃/min、頻率1Hz。將藉此而獲得之tanδ曲線之α緩和波峰溫度設為玻璃轉移溫度(Tg)。 The measurement was carried out using dynamic viscoelastic analysis (DVA). As the measuring device, DMS-6100 manufactured by SII Nano Technologies Co., Ltd. was used. The size of the test piece was set to 10 mm × 40 mm × 2 mm. The measurement mode is a three-point bending mode, and the measurement conditions are set to air conditions, a temperature range of -100 ° C to 300 ° C, a temperature increase rate of 5 ° C / min, and a frequency of 1 Hz. The α relaxation peak temperature of the tan δ curve obtained thereby was set as the glass transition temperature (Tg).
將於製造例2中獲得之乙酸木質素之酚改質體設為環氧樹脂硬化劑。 The phenolic modified body of the acetic acid lignin obtained in Production Example 2 was set as an epoxy resin hardener.
將於製造例4中獲得之乙酸改質木質素(藉由有機溶劑而得之萃取物)之酚改質體設為環氧樹脂硬化劑。 The phenol-modified body of the acetic acid-modified lignin (the extract obtained by the organic solvent) obtained in Production Example 4 was used as an epoxy resin hardener.
將於比較製造例2中獲得之未改質木質素之酚改質體設為環氧樹脂硬化劑。 The phenol modified body of the unmodified lignin obtained in Comparative Production Example 2 was set as an epoxy resin hardener.
將於比較製造例4中獲得之未改質木質素(藉由有機溶劑而得之萃取物)之酚改質體設為環氧樹脂硬化劑。 The phenol-modified body of the unmodified lignin (the extract obtained by the organic solvent) obtained in Comparative Production Example 4 was set as an epoxy resin hardener.
為了研究各環氧樹脂硬化劑之性能,將環氧樹脂與環氧樹脂硬化劑進行調配,並使其硬化。再者,作為環氧樹脂,使用市售之雙酚A型環氧樹脂(商品名JER 828,三菱化學公司製造)。 In order to study the properties of each epoxy resin hardener, the epoxy resin and the epoxy resin hardener were formulated and hardened. Further, as the epoxy resin, a commercially available bisphenol A type epoxy resin (trade name JER 828, manufactured by Mitsubishi Chemical Corporation) was used.
更具體而言,首先,以環氧樹脂之環氧當量與環氧樹脂硬化劑之胺當量及/或酚性羥基當量成為大致等量之方式準備環氧樹脂及環氧樹脂硬化劑,並使該等溶解於四氫呋喃中,繼而,以相對於環氧樹脂與環氧樹脂硬化劑之總量100質量份成為0.5質量份之方式添加硬化促進劑(1-氰乙基-2-乙基-4-甲基咪唑),藉此獲得清漆。繼而,將所獲得之清漆澆鑄於薄膜上,並使其於60℃下乾燥2小時,將四氫呋喃去除,藉此獲得環氧樹脂組成物。 More specifically, first, an epoxy resin and an epoxy resin hardener are prepared such that the epoxy equivalent of the epoxy resin and the amine equivalent of the epoxy resin hardener and/or the phenolic hydroxyl equivalent are substantially equal. These are dissolved in tetrahydrofuran, and then a hardening accelerator (1-cyanoethyl-2-ethyl-4) is added in an amount of 0.5 parts by mass based on 100 parts by mass of the total amount of the epoxy resin and the epoxy resin hardener. -Methylimidazole), whereby a varnish is obtained. Then, the obtained varnish was cast on a film, and dried at 60 ° C for 2 hours, and tetrahydrofuran was removed, whereby an epoxy resin composition was obtained.
其後,填充於Teflon(註冊商標)之模具,於真空壓製中於150℃下加熱2小時,繼而,於180℃下加熱3小時,藉此使 其硬化。再者,環氧樹脂組成物係於加熱時進行熔融並表現出流動性後進行硬化。 Thereafter, the mold was filled in Teflon (registered trademark), heated at 150 ° C for 2 hours in vacuum pressing, and then heated at 180 ° C for 3 hours, thereby It hardens. Further, the epoxy resin composition is cured by being melted upon heating and exhibiting fluidity.
針對所獲得之環氧樹脂硬化物,利用與上述相同之方法進行評價。將其結果示於表2。 The obtained epoxy resin cured product was evaluated by the same method as described above. The results are shown in Table 2.
如參照上述評價1及評價2,得以確認:根據使用經乙酸改質之木質素而獲得之環氧樹脂及環氧樹脂硬化劑,由於可獲得流動性相對較高之環氧樹脂組成物,故而環氧樹脂組成物及其硬化物之操作性優異。 With reference to the above evaluation 1 and evaluation 2, it was confirmed that an epoxy resin and an epoxy resin hardener obtained by using acetic acid-modified lignin can obtain an epoxy resin composition having a relatively high fluidity, and thus The epoxy resin composition and the cured product thereof are excellent in handleability.
又,如參照上述評價1及評價2,得以確認:根據使用經乙酸改質之木質素而獲得之環氧樹脂及環氧樹脂硬化劑,可獲得玻璃轉移溫度相對較高且耐熱性優異之環氧樹脂硬化物。 Further, as described above with reference to the evaluations 1 and 2, it was confirmed that an epoxy resin and an epoxy resin curing agent obtained by using acetic acid-modified lignin can obtain a ring having a relatively high glass transition temperature and excellent heat resistance. Oxygen cured product.
針對環氧樹脂硬化物之耐熱性,利用以下方法進一步進行評價。作為樣品,使用利用實施例1及比較例1之環氧樹脂而獲得之環氧樹脂硬化物。將其結果示於表3。 The heat resistance of the cured epoxy resin was further evaluated by the following method. As the sample, an epoxy resin cured product obtained by using the epoxy resins of Example 1 and Comparative Example 1 was used. The results are shown in Table 3.
(2)5%重量減少溫度、10%重量減少溫度(耐熱分解性) (2) 5% weight reduction temperature, 10% weight reduction temperature (heat decomposition resistance)
利用熱重量分析(TGA)進行測定。作為測定裝置,使用島津製作所製造之TGA-50。更具體而言,將利用金銼刀製成粉末狀之試樣以重量成為3~4mg之方式稱取至鉑槽中,於溫度範圍:室溫~800℃、升溫速度10℃/min、氮氣氣流(20mL/min)下之條件下進行測定。以40℃下之重量為基準,將重量減少5%時之溫度設為5%重量減少溫度(Td5)、將減少10%時之溫度設為10%重量減少溫度(Td10)。 The measurement was carried out by thermogravimetric analysis (TGA). As the measuring device, TGA-50 manufactured by Shimadzu Corporation was used. More specifically, a powder sample obtained by using a gold trowel is weighed into a platinum tank in a weight of 3 to 4 mg at a temperature ranging from room temperature to 800 ° C, a temperature rising rate of 10 ° C/min, and a nitrogen gas flow. The measurement was carried out under the conditions of (20 mL/min). Based on the weight at 40 ° C, the temperature at which the weight was reduced by 5% was set to 5% by weight (T d5 ), and the temperature at which 10% was decreased was set to 10% by weight (T d10 ).
如參照上述評價3,得以確認:根據使用經乙酸改質之木質素而獲得之環氧樹脂,可獲得5%重量減少溫度及10%重量減少溫度相對較高且耐熱性優異之環氧樹脂硬化物。 As can be seen from the above evaluation 3, it was confirmed that an epoxy resin obtained by using acetic acid-modified lignin can obtain an epoxy resin hardening having a 5% weight loss temperature and a 10% weight reduction temperature and excellent heat resistance. Things.
再者,上述發明係作為本發明之例示之實施形態而提供,其只不過為例示,並非限定性地解釋。對於該技術領域之熟悉本技藝者而言明確之本發明之變化例包含於後述申請專利範圍中。 Furthermore, the invention described above is provided as an exemplified embodiment of the invention, which is merely illustrative and not limiting. Variations of the invention that are apparent to those skilled in the art are intended to be included within the scope of the appended claims.
使用本發明之環氧樹脂及環氧樹脂硬化劑而獲得之環氧樹脂硬化物於半導體密封材等電子零件或例如塗料、黏著劑等各種工業領域中得以廣泛使用。 The epoxy resin cured product obtained by using the epoxy resin and the epoxy resin hardener of the present invention is widely used in various industrial fields such as electronic components such as semiconductor sealing materials or coating materials and adhesives.
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