TW201616300A - Touch panel with fingerprint identification function - Google Patents

Abstract

A touch panel with fingerprint identification function includes a glass substrate, a fingerprint identification device, a packaging layer, an optical adhesive layer and a sealing layer. The glass substrate has a visible section, a non-visible section and a first plane face. The non-visible section is formed with a recess having a bottom side. The fingerprint identification device is disposed in the recess, having a substrate having a first side. A silicon substrate is disposed on the first side and electrically connected to the substrate via a wire. Multiple fingerprint identification chips are disposed on one side of the silicon substrate. The packaging layer encloses the wire, the substrate and an exposed section of the silicon substrate. The optical adhesive layer is disposed between the fingerprint identification device and the bottom side of the recess. The sealing layer seals the fingerprint identification device in the recess of the glass substrate.

Description

Touch panel with fingerprint recognition function

A touch panel with a fingerprint recognition function, in particular, a touch panel with a fingerprint recognition function integrating the fingerprint identification device and the touch panel.

With the rapid development of multimedia technology, more and more portable electronic devices such as mobile phones, personal digital assistants (PDAs), digital cameras, personal notebooks or tablets have become a must-have tool in people's lives. However, these portable electronic devices are highly personal. Therefore, once these portable electronic devices are lost or stolen, the information stored therein, such as phone books, photos, materials, etc., may be used by others, causing unnecessary losses.

Therefore, such products need to be matched with certain identity authentication and permission management to ensure the privacy of users. The main method of identity authentication currently used is password protection, and the user needs to input the correct password to the portable electronic device before entering the control page of the portable electronic device. However, password protection is less secure because passwords are more likely to be compromised or compromised. And if the user forgets the password, it is also very troublesome. Therefore, there is a portable electronic device that uses fingerprint identification for identity authentication. Since each person's fingerprints are different, the unique characteristics of the fingerprints make the security of identity authentication using fingerprint recognition much improved. Moreover, the method of using identity authentication using fingerprint identification is relatively convenient, so that the user can save the cumbersome memory and password entry.

The current fingerprint identification system is widely used in handheld devices or mobile devices. The most common fingerprint identification device is designed independently on one side of a notebook computer keyboard or on the back side or the bottom side of a handheld mobile device. It is integrated on the touch screen of the handheld mobile device to reduce the volume of the handheld mobile device, and the conventional fingerprint identification chip package module mainly comprises a substrate, a wafer and a mold body. The wafer is disposed on the substrate and electrically connected to the substrate, and the mold body covers the surface of the substrate and the wafer.

Generally, when a finger touches a sensing area of a wafer, since the outer surface of the wafer is covered with a multilayer film, the overall thickness of the chip package module is high, and the chip package module has low sensitivity.

The conventional slip fingerprint identification system has directionality, and the recognition time is too long and must be set independently, which is very poor in structural integration or ease of use.

Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a touch panel with a fingerprint recognition function integrating the fingerprint identification device and the touch panel.

In order to achieve the above object, the present invention provides a touch panel having a fingerprint recognition function, comprising: a glass substrate, a fingerprint identification device, an encapsulation layer, an optical adhesive layer, and a sealing layer;

The glass substrate has a visible area and a non-visible area, and a first plane and a second plane. The non-visible area defines at least one groove portion, and the groove portion has a bottom side; the fingerprint identification device is The fingerprinting device has a substrate, the substrate has a first side, the first side is provided with a substrate, and the substrate is electrically connected to the substrate through at least one wire. a plurality of fingerprint identification wafers are disposed on the other side of the substrate opposite to the substrate; the package layer covers the first side of the conductive line and the substrate, and the side of the side of the substrate is exposed; the optical adhesive layer is disposed on the fingerprint Between the device and the bottom side of the groove portion; the sealing layer encloses the fingerprint identification device in the groove portion of the glass substrate.

By integrating the fingerprint recognition device on the touch panel, not only the manufacturing cost can be saved, but also the touch sensitivity and accuracy can be improved.

1‧‧‧ glass substrate

11‧‧‧visible area

111‧‧‧First electrode layer

112‧‧‧Insulation

113‧‧‧Line layer

114‧‧‧Second electrode layer

12‧‧‧Invisible area

121‧‧‧Slots

1211‧‧‧ bottom side

13‧‧‧ first plane

14‧‧‧ second plane

2‧‧‧Finger identification device

21‧‧‧Substrate

211‧‧‧ first side

22‧‧‧矽 substrate

23‧‧‧Wire

24‧‧‧Fingerprinting chip

241‧‧‧Sensor area

242‧‧‧ top surface

3‧‧‧Encapsulation layer

4‧‧‧Optical adhesive layer

5‧‧‧Closed layer

6‧‧‧shading layer

7‧‧‧Outer ring

1 is an exploded perspective view of a first embodiment of a touch panel having a fingerprint recognition function according to the present invention;

2 is an exploded view of the non-visible area of the first embodiment of the touch panel with the fingerprint recognition function of the present invention;

Figure 3 is a cross-sectional view showing the combination of the non-visible area of the first embodiment of the touch panel having the fingerprint recognition function of the present invention;

Figure 4 is a cross-sectional view showing the combination of the second embodiment of the touch panel having the fingerprint recognition function of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to the first, second, and third figures, which are perspective exploded views of the first embodiment of the touch panel with fingerprint identification function of the present invention, and an anatomical view and a combined cross-sectional view of the non-visible area. As shown in the figure, the present invention is shown. The touch panel with fingerprint identification function comprises: a glass substrate 1, a fingerprint identification device 2, an encapsulation layer 3, an optical adhesive layer 4, and a sealing layer 5;

The glass substrate 1 has a visible area 11 and a non-visible area 12, and a first plane 13 and a second plane 14. The non-visible area 12 of the second plane 14 defines at least one slot 121. The portion 121 has a bottom side 1211.

The visible area 11 has a first electrode layer 111 and an insulating layer 112, a trace layer 113 and a second electrode layer 114. The first and second electrode layers 111 and 114 and the trace layer 113 are electrically connected. connection.

The fingerprint identification device 2 is disposed in the groove portion 121. The fingerprint identification device 2 has a substrate 21. The substrate 21 has a first side 211. The first side 211 is provided with a cymbal substrate 22. The substrate 22 and the substrate 21 are electrically connected to each other through at least one wire 23. The other side of the substrate 22 opposite to the substrate 21 is provided with a plurality of fingerprint identification chips 24 having a sensing area 241 and a The top surface 242, wherein the sensing area 241 is formed on the top surface 242.

The encapsulation layer 3 covers the lead wire 23 and the first side 211 of the substrate 21 and the side of the ruthenium substrate 22 exposed.

The optical adhesive layer 4 is disposed between the fingerprint identification device 2 and the bottom side 1211 of the groove portion 121. The sealing layer 5 encloses the fingerprint recognition device 2 in the groove portion 121 of the glass substrate 1.

The fingerprint identification wafer 24 and the germanium substrate 22 of the present invention are electrically connected to the substrate 21 through wire 23 through wire bonding. However, the fingerprint identification chip 24 and the germanium substrate 22 may be electrically connected to the substrate 21 in other manners, for example, a flip chip or other packaging method is electrically connected to the circuit of the substrate 21, and the present invention is not The arrangement of the fingerprint recognition wafer 24 and the ruthenium substrate 22 is limited.

The groove portion 121 further has a shielding layer 6 disposed between the groove portion 121 and the optical adhesive layer 4 on the side of the sealing layer 3 opposite to the groove portion 121.

The shielding layer 6 covers only the area of the encapsulation layer 3 where the fingerprint recognition wafer 24 is not disposed, and the shielding layer 6 is only shielded from the upper area of the wiring 23 in the encapsulation layer 3. The distance between the first plane 13 and the bottom side 1211 of the groove portion 121 is between 0.1 mm and 0.3 mm.

The material of the shielding layer 6 may be a silicone or epoxy material or an acrylic resin material. The masking layer 6 is overlaid on the encapsulation layer 3 by a spray and does not cover the fingerprint recognition wafer 24.

The sealing layer 5 is selected from any of epoxy resin or acrylic resin or silicone rubber.

Referring to FIG. 4, it is a sectional view of a combination of the second embodiment of the touch panel having the fingerprint identification function of the present invention. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment. Therefore, the difference between the present embodiment and the first embodiment is that the fingerprint recognition device 2 and the slot portion 121 further have an outer ring body 7 disposed on the periphery of the fingerprint recognition device 2, And the outer ring body 7 is any one of a metal ring or a printed metal conductor.

Because the sensitivity of the fingerprint recognition device 2 is improved, it is generally known that the fingerprint recognition device 2 must have a finger closer to the fingerprint recognition chip 24 to make the recognition rate higher, and an electrostatic discharge may occur when a human finger or other object contacts the fingerprint recognition chip 24. The ESD is further susceptible to damage to the fingerprint recognition chip 24, and the fingerprint identification device 2 in this embodiment may further include an outer ring body 7, the outer ring, in order to reduce the damage caused by the electrostatic discharge on the fingerprint recognition chip 24. The body 7 is a metal ring or a printed metal conductor, and the material of the metal ring is a metal material or an alloy material such as a nickel-iron alloy, a copper alloy or the like.

The outer ring body 7 can transmit static electricity from a finger or other object, so that the outer ring body 7 can provide the electrostatic discharge protection of the fingerprint identification device 2.

1‧‧‧ glass substrate

11‧‧‧visible area

111‧‧‧First electrode layer

112‧‧‧Insulation

113‧‧‧Line layer

114‧‧‧Second electrode layer

12‧‧‧Invisible area

121‧‧‧Slots

1211‧‧‧ bottom side

13‧‧‧ first plane

14‧‧‧ second plane

2‧‧‧Finger identification device

21‧‧‧Substrate

211‧‧‧ first side

22‧‧‧矽 substrate

23‧‧‧Wire

24‧‧‧Fingerprinting chip

241‧‧‧Sensor area

242‧‧‧ top surface

3‧‧‧Encapsulation layer

4‧‧‧Optical adhesive layer

5‧‧‧Closed layer

6‧‧‧shading layer

Claims (8)

[Item 1] A touch panel having a fingerprint recognition function includes: a glass substrate having a visible area and a non-visible area; and a first plane and a second plane, wherein the non-visible area defines at least one groove portion, The groove portion has a bottom side; a fingerprint identification device is disposed in the groove portion, the fingerprint identification device has a substrate, the substrate has a first side, and the first side is provided with a 矽 substrate, the 矽 substrate and The substrate is electrically connected to the substrate by a plurality of wires, and the substrate is provided with a plurality of fingerprint identification wafers on the other side of the substrate; and an encapsulation layer covers the wires and the first side of the substrate and the side of the substrate An exposed layer; an optical adhesive layer disposed between the fingerprint identification device and the bottom side of the groove portion; and a sealing layer enclosing the fingerprint identification device in the groove portion of the glass substrate. [Item 2] The touch panel with fingerprint identification function according to claim 1, wherein the fingerprint identification chip has a sensing area and a top surface, wherein the sensing area is formed on the top surface. [Item 3] The touch panel of the fingerprint identification function of claim 1, wherein the groove portion further has a shielding layer, and the shielding layer is disposed on a side of the encapsulation layer opposite to the groove portion. [Item 4] The touch panel with the fingerprint recognition function described in claim 1 further has an outer ring body disposed on the periphery of the fingerprint identification device. [Item 5] The touch panel with fingerprint identification function according to claim 4, wherein the outer ring system is any one of a metal ring or a printed metal conductor. [Item 6] The touch panel with fingerprint identification function as claimed in claim 1, wherein the sealing layer is any one of epoxy resin or acrylic resin or silicone rubber. [Item 7] The touch panel with the fingerprint recognition function of claim 1, wherein the distance between the first plane and the bottom side of the groove portion is 0.1 mm to 0.3 mm. [Item 8] The touch panel of the fingerprint identification function of claim 1, wherein the visible area has a touch electrode layer, an insulating layer and a trace layer, and the first and second electrode layers The wiring layer is electrically connected.