TW201613427A - Flexible circuit substrate and electronic equipment - Google Patents

Flexible circuit substrate and electronic equipment

Info

Publication number
TW201613427A
TW201613427A TW104132073A TW104132073A TW201613427A TW 201613427 A TW201613427 A TW 201613427A TW 104132073 A TW104132073 A TW 104132073A TW 104132073 A TW104132073 A TW 104132073A TW 201613427 A TW201613427 A TW 201613427A
Authority
TW
Taiwan
Prior art keywords
microns
layer
thickness
insulation layer
flexible circuit
Prior art date
Application number
TW104132073A
Other languages
Chinese (zh)
Other versions
TWI660649B (en
Inventor
Hiroki Matsui
Makoto Ohno
Sakurako Shigematsu
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014199550A external-priority patent/JP6461540B2/en
Priority claimed from JP2015022855A external-priority patent/JP6436809B2/en
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW201613427A publication Critical patent/TW201613427A/en
Application granted granted Critical
Publication of TWI660649B publication Critical patent/TWI660649B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Abstract

Provided are a flexible circuit substrate and an electronic equipment capable of preventing breakage or crack of wiring circuit and have excellent bending resistance. The flexible circuit substrate comprises: a polyimide insulation layer; a circuit wiring layer arranged at least one side of the polyimide insulation layer; and a cover layer stacked on the circuit wiring layer, wherein the thickness of the polyimide insulation layer is 10-14 microns or 23-27 microns; the thickness of copper wiring constituting the circuit wiring layer is 10-14 microns, and the volume fraction of copper wiring is above 85%; when the thickness of the polyimide insulation layer is 10-14 microns, the equivalent bending strength during bending when the cover layer is configured as the inner side is 0.03-0.04 Nm2; when the thickness of the polyimide insulation layer is 23-27 microns, the equivalent bending strength during bending when the cover layer is configured as the inner side is 0.07-0.10 Nm2.
TW104132073A 2014-09-30 2015-09-30 Flexible circuit board and electronic equipment TWI660649B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-199550 2014-09-30
JP2014199550A JP6461540B2 (en) 2014-09-30 2014-09-30 Flexible circuit board, method of using the same, and electronic device
JP2015-022855 2015-02-09
JP2015022855A JP6436809B2 (en) 2015-02-09 2015-02-09 Flexible circuit board and electronic device

Publications (2)

Publication Number Publication Date
TW201613427A true TW201613427A (en) 2016-04-01
TWI660649B TWI660649B (en) 2019-05-21

Family

ID=55610002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132073A TWI660649B (en) 2014-09-30 2015-09-30 Flexible circuit board and electronic equipment

Country Status (3)

Country Link
KR (1) KR102404294B1 (en)
CN (1) CN105472880B (en)
TW (1) TWI660649B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107328536B (en) * 2017-08-16 2023-07-25 拓旷(上海)光电科技有限公司 Test machine
JP7270579B2 (en) * 2019-06-19 2023-05-10 金居開發股▲分▼有限公司 Micro-roughened electrodeposited copper foil and copper-clad laminate
CN113597144A (en) * 2021-07-28 2021-11-02 恒赫鼎富(苏州)电子有限公司 Multilayer FPC circuit board manufacturing process

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4443977B2 (en) * 2004-03-30 2010-03-31 新日鐵化学株式会社 Flexible copper clad laminate and manufacturing method thereof
JP2007208087A (en) 2006-02-03 2007-08-16 Kaneka Corp High turnable flexible printed wiring board
CN101960283B (en) * 2008-03-04 2014-02-19 新日铁住金化学株式会社 Method of predicting bend lifetime of laminated body, prediction device of bend lifetime of laminated body
JP2010280191A (en) 2009-06-08 2010-12-16 Hitachi Cable Ltd Copper foil for heat treatment, manufacturing method thereof and flexible printed wiring board
JP5689277B2 (en) * 2009-10-22 2015-03-25 新日鉄住金化学株式会社 Flexible circuit board and multilayer circuit board
KR101690491B1 (en) * 2009-12-25 2016-12-28 신닛테츠 수미킨 가가쿠 가부시키가이샤 Flexible circuit board and structure of bend section of flexible circuit board
TWI599277B (en) * 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 Flexible copper-clad laminate

Also Published As

Publication number Publication date
TWI660649B (en) 2019-05-21
CN105472880A (en) 2016-04-06
KR102404294B1 (en) 2022-05-31
KR20160038827A (en) 2016-04-07
CN105472880B (en) 2019-07-02

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