TW201613141A - Semiconductor light-emitting device - Google Patents

Semiconductor light-emitting device

Info

Publication number
TW201613141A
TW201613141A TW104106378A TW104106378A TW201613141A TW 201613141 A TW201613141 A TW 201613141A TW 104106378 A TW104106378 A TW 104106378A TW 104106378 A TW104106378 A TW 104106378A TW 201613141 A TW201613141 A TW 201613141A
Authority
TW
Taiwan
Prior art keywords
emitting device
semiconductor light
chip
supporting substrate
side section
Prior art date
Application number
TW104106378A
Other languages
English (en)
Inventor
Toshihiro Kuroki
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW201613141A publication Critical patent/TW201613141A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW104106378A 2014-09-16 2015-02-26 Semiconductor light-emitting device TW201613141A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014187916A JP2016062980A (ja) 2014-09-16 2014-09-16 半導体発光装置

Publications (1)

Publication Number Publication Date
TW201613141A true TW201613141A (en) 2016-04-01

Family

ID=55455629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106378A TW201613141A (en) 2014-09-16 2015-02-26 Semiconductor light-emitting device

Country Status (4)

Country Link
US (1) US20160079487A1 (zh)
JP (1) JP2016062980A (zh)
CN (1) CN105990497A (zh)
TW (1) TW201613141A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6652025B2 (ja) * 2016-09-29 2020-02-19 豊田合成株式会社 発光装置及びその製造方法
US10164159B2 (en) 2016-12-20 2018-12-25 Samsung Electronics Co., Ltd. Light-emitting diode package and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100544044C (zh) * 2005-05-31 2009-09-23 三洋电机株式会社 半导体发光元件和半导体发光装置
KR20100030470A (ko) * 2008-09-10 2010-03-18 삼성전자주식회사 다양한 색 온도의 백색광을 제공할 수 있는 발광 장치 및 발광 시스템

Also Published As

Publication number Publication date
JP2016062980A (ja) 2016-04-25
CN105990497A (zh) 2016-10-05
US20160079487A1 (en) 2016-03-17

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