TW201612646A - Positive photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device, organic electroluminescent display device and touch panel - Google Patents

Positive photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device, organic electroluminescent display device and touch panel

Info

Publication number
TW201612646A
TW201612646A TW104130710A TW104130710A TW201612646A TW 201612646 A TW201612646 A TW 201612646A TW 104130710 A TW104130710 A TW 104130710A TW 104130710 A TW104130710 A TW 104130710A TW 201612646 A TW201612646 A TW 201612646A
Authority
TW
Taiwan
Prior art keywords
display device
cured film
resin composition
photosensitive resin
positive photosensitive
Prior art date
Application number
TW104130710A
Other languages
Chinese (zh)
Other versions
TWI667543B (en
Inventor
Kenta Yoshida
Ichiro Koyama
Satoru Yamada
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201612646A publication Critical patent/TW201612646A/en
Application granted granted Critical
Publication of TWI667543B publication Critical patent/TWI667543B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Human Computer Interaction (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Provided are: a positive photosensitive resin composition which has excellent sensitivity and curability; a method for producing a cured film; a cured film; a liquid crystal display device; an organic electroluminescent display device; and a touch panel. This positive photosensitive resin composition contains: a resin which contains an acid group and/or an acid group protected by an acid-decomposable group, and which is cyclized and cured by means of a base; a thermal base generator represented by general formula (1); a photoacid generator; and a solvent. In formula (1), R1 represents a hydrogen atom or an n-valent organic group; each of R2-R5 independently represents a hydrogen atom or an alkyl group; and n represents an integer of 1 or more.
TW104130710A 2014-09-17 2015-09-17 Positive photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device, organic electroluminescence display device, and touch panel TWI667543B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-188763 2014-09-17
JP2014188763 2014-09-17

Publications (2)

Publication Number Publication Date
TW201612646A true TW201612646A (en) 2016-04-01
TWI667543B TWI667543B (en) 2019-08-01

Family

ID=55533240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104130710A TWI667543B (en) 2014-09-17 2015-09-17 Positive photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device, organic electroluminescence display device, and touch panel

Country Status (3)

Country Link
JP (1) JP6259109B2 (en)
TW (1) TWI667543B (en)
WO (1) WO2016043203A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI655722B (en) * 2017-11-13 2019-04-01 穩懋半導體股份有限公司 AN IMPROVED PASSIVATION STRUCTURE FOR GaN FIELD EFFECT TRANSISTOR
TWI770283B (en) * 2017-09-26 2022-07-11 日商東麗股份有限公司 Photosensitive resin composition, cured film, element provided with cured film, organic EL display device provided with cured film, manufacturing method of cured film, and manufacturing method of organic EL display device
TWI795512B (en) * 2018-02-27 2023-03-11 日商日亞化學工業股份有限公司 Light emitting element

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019158990A (en) * 2018-03-09 2019-09-19 東レ株式会社 Colored resin composition, color filter substrate, and reflection type liquid crystal display
JP7426375B2 (en) * 2019-03-06 2024-02-01 富士フイルム株式会社 Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and thermal base generator
WO2022085430A1 (en) * 2020-10-23 2022-04-28 東レ株式会社 Display device and method for manufacturing display device
JPWO2023002728A1 (en) * 2021-07-21 2023-01-26
WO2024057730A1 (en) * 2022-09-16 2024-03-21 東レ株式会社 Organic el display device

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JP2003026919A (en) * 2001-07-23 2003-01-29 Hitachi Chemical Dupont Microsystems Ltd Alkaline development type photosensitive resin composition and method for forming pattern
JP4154953B2 (en) * 2002-08-09 2008-09-24 日立化成デュポンマイクロシステムズ株式会社 Positive photosensitive resin composition, pattern manufacturing method using the same, and electronic component
JP5011649B2 (en) * 2005-03-31 2012-08-29 大日本印刷株式会社 Photosensitive resin composition and article
JP2007056196A (en) * 2005-08-26 2007-03-08 Tokyo Institute Of Technology Polyimide precursor composition, method for producing polyimide film and semiconductor device
JP5021337B2 (en) * 2007-02-28 2012-09-05 旭化成イーマテリアルズ株式会社 Resin composition containing thermal base generator
US7838198B2 (en) * 2007-12-13 2010-11-23 International Business Machines Corporation Photoresist compositions and method for multiple exposures with multiple layer resist systems
EP2239301B1 (en) * 2008-01-28 2016-04-27 Toray Industries, Inc. Siloxane resin compositions
CN101963755B (en) * 2009-06-26 2012-12-19 罗门哈斯电子材料有限公司 Self-aligned spacer multiple patterning methods
KR101392539B1 (en) * 2009-11-16 2014-05-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 Polyimide precursor and photosensitive resin composition containing the polyimide precursor
JP5542500B2 (en) * 2010-03-30 2014-07-09 東京応化工業株式会社 Resist pattern forming method and resist composition
JP5621735B2 (en) * 2010-09-03 2014-11-12 信越化学工業株式会社 Pattern forming method and chemically amplified positive resist material
EP2799928B1 (en) * 2011-12-26 2019-05-22 Toray Industries, Inc. Photosensitive resin composition and process for producing semiconductor element
JP5910109B2 (en) * 2012-01-26 2016-04-27 住友ベークライト株式会社 Positive photosensitive resin composition, cured film, protective film, insulating film, semiconductor device, and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770283B (en) * 2017-09-26 2022-07-11 日商東麗股份有限公司 Photosensitive resin composition, cured film, element provided with cured film, organic EL display device provided with cured film, manufacturing method of cured film, and manufacturing method of organic EL display device
TWI655722B (en) * 2017-11-13 2019-04-01 穩懋半導體股份有限公司 AN IMPROVED PASSIVATION STRUCTURE FOR GaN FIELD EFFECT TRANSISTOR
TWI795512B (en) * 2018-02-27 2023-03-11 日商日亞化學工業股份有限公司 Light emitting element
TWI831601B (en) * 2018-02-27 2024-02-01 日商日亞化學工業股份有限公司 Light emitting element

Also Published As

Publication number Publication date
WO2016043203A1 (en) 2016-03-24
TWI667543B (en) 2019-08-01
JPWO2016043203A1 (en) 2017-07-06
JP6259109B2 (en) 2018-01-10

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