TW201611936A - Processing equipment - Google Patents

Processing equipment

Info

Publication number
TW201611936A
TW201611936A TW104121135A TW104121135A TW201611936A TW 201611936 A TW201611936 A TW 201611936A TW 104121135 A TW104121135 A TW 104121135A TW 104121135 A TW104121135 A TW 104121135A TW 201611936 A TW201611936 A TW 201611936A
Authority
TW
Taiwan
Prior art keywords
workpiece
sheet material
processing device
processing equipment
bearing surface
Prior art date
Application number
TW104121135A
Other languages
English (en)
Other versions
TWI595956B (zh
Inventor
Jyun-Kai Ciou
Yung-Min Hsieh
Guo-Shing Huang
Chang-Ying Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Publication of TW201611936A publication Critical patent/TW201611936A/zh
Application granted granted Critical
Publication of TWI595956B publication Critical patent/TWI595956B/zh

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
TW104121135A 2014-09-22 2015-06-30 加工設備 TWI595956B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201462053532P 2014-09-22 2014-09-22

Publications (2)

Publication Number Publication Date
TW201611936A true TW201611936A (en) 2016-04-01
TWI595956B TWI595956B (zh) 2017-08-21

Family

ID=56360696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104121135A TWI595956B (zh) 2014-09-22 2015-06-30 加工設備

Country Status (1)

Country Link
TW (1) TWI595956B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI824421B (zh) * 2022-02-24 2023-12-01 雷傑科技股份有限公司 微晶粒加工設備及微晶粒加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69933072T2 (de) * 1998-01-27 2006-12-21 Kitano Co., Ltd., Komatsushima Verfahren und Vorrichtung zum Laminieren plattenförmiger Substrate
JP3837320B2 (ja) * 2001-11-07 2006-10-25 リンテック株式会社 光ディスクの貼合装置
JP4476764B2 (ja) * 2004-03-26 2010-06-09 富士フイルム株式会社 基板接合装置及び方法
TWM330882U (en) * 2007-10-09 2008-04-21 Mirle Automation Corp Laser cutting apparatus
TWM484729U (zh) * 2014-03-10 2014-08-21 Yuxi Technology Co Ltd 螢幕保護貼之結構

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI824421B (zh) * 2022-02-24 2023-12-01 雷傑科技股份有限公司 微晶粒加工設備及微晶粒加工方法

Also Published As

Publication number Publication date
TWI595956B (zh) 2017-08-21

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