M330882 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種雷射切割裝置，特別是一種用於切割薄膜 太陽能板(thin film solar cell)内各層基板的雷射切割裝置。 【先前技術】 ， 一般薄膜太陽能板係在玻璃基板上方設置有上電極鍍膜、半 > 導體鍍膜及下電極鍍膜，每一鍍膜上皆具有複數條平行之切線， 此切線的形成係利用一雷射切割機將鍍膜切斷，且每層鍍膜之間 的切線各自錯開一間距，使其左右可絕緣而上下鍍膜之間又可以 互通。 在利用雷射切割機進行鍍膜切割的過程中，為使不同層之鍍 膜間以雷射切割之切線相互平行，必須精確調整玻璃基板在切割 平台上的擺放位置，因此習知會在每一鍍膜上先打上至少二組十 字記號，藉以使玻璃基板在切割平台上可精確定位。然而此種打 十字的工序將會增加切割製程的加工時間，進而減少產能。 【新型内容】 為了解決上述問題，本創作目的之一係提供一種雷射切割裝 置，利用光學偵測裝置直接計算線條偏差量以利進行基板的定位 修正，此將可省略習知需於基板上打十字才可將基板準確定位的 工序，因而具有簡化製程且提高加工速度之優點。 本創作目的之一係提供一種雷射切割裝置，係採用入料裝置 將基板自動輸送至入料端進行切割製程，且利用出料裝置將切割 5 M330882 疋成之基板自動輸出，此人料裝置與出料裝置—進 動化 設計將有助於提高雷射切割裝置的自動化程度，進而提高產能。M330882 VIII. New Description: [New Technical Field] This creation is related to a laser cutting device, in particular a laser cutting device for cutting various layers of substrates in a thin film solar cell. [Prior Art], a general thin film solar panel is provided with an upper electrode coating, a semi-conductor coating and a lower electrode coating on the glass substrate, each of which has a plurality of parallel tangent lines, and the tangent is formed by using a ray The cutting machine cuts the coating, and the tangent lines between the coatings of each layer are shifted by a distance, so that the left and right sides can be insulated and the upper and lower coatings can communicate with each other. In the process of coating and cutting with a laser cutting machine, in order to make the tangent lines of the laser cutting between the coatings of different layers parallel to each other, it is necessary to precisely adjust the position of the glass substrate on the cutting platform, so that it is known in each coating. At least two sets of cross marks are marked first to enable precise positioning of the glass substrate on the cutting platform. However, this cross-cutting process will increase the processing time of the cutting process and thus reduce the throughput. [New content] In order to solve the above problems, one of the purposes of the present invention is to provide a laser cutting device that directly calculates the amount of line deviation by using an optical detecting device to facilitate positioning correction of the substrate, which may omit the conventional need for the substrate. The process of accurately positioning the substrate by the cross has the advantages of simplifying the process and increasing the processing speed. One of the purposes of the present invention is to provide a laser cutting device which automatically feeds a substrate to a feeding end for a cutting process by using a feeding device, and automatically outputs a substrate which is cut into 5 M330882 by a discharging device, the human material device With the discharge device - the precession design will help to increase the automation of the laser cutting device, thereby increasing productivity.
•為了達到上述目的，本創作—實施例之雷射切割裝置，包 ί料體^上設置構以吸盤模〆 u 土板至吸盤模組上方’且下沈基板於吸盤模組上；-定位 裝置設置於人料裝置上，以定位基板的位置；_雷射裝置跨紗機台主 體’且吸盤模組於雷射裝置下方前後移動，以侧雷射裝置對吸盤模組上 之基板進行線條蝴；—光學細裝置設置於人料裝置之—側，侧線條 線段的偏差值；以及—修正裝置，其根據偏差值，修正該基板的 本創作另一實施例之雷射切割裝置，係利用一雷射 板進行線條爛，其特徵在於：雷射切割裝置包括_ 〗、’t~基 偵測線條之至少二線段的偏差值。 、’、，攻置，以 【實施方式】 圖所示為本創作一實施例雷射切割裝置之結 ±L· UA rU . ........ 、θ傅不意 第 圖，於本實施例中，-雷射切割裝置i包括_機台主體7 料裝f 2G、—定位裝置27、—雷射裝置3G、-光學_裝—入 以及一修正襞置35 (第1圖未示出）。 、置33 機台主體10之結構請參閱第2圖，機台主體10上彀 驅動、，，口構&括線性馬達模組12、線性滑執14及設置於、、典 兩端之緩衝幻6;—吸盤模組18設置於滑執14上且 =14 12驅動而於滑執14前後移動。 \、建楔紐In order to achieve the above object, the laser cutting device of the present invention-embodiment is provided with a suction cup mold 土u soil plate to the top of the suction cup module and the sinking substrate is on the suction cup module; The device is disposed on the human material device to locate the position of the substrate; the laser device crosses the main body of the yarn table and the suction cup module moves back and forth under the laser device, and the side laser device performs lines on the substrate on the suction cup module The optical thin device is disposed on the side of the human material device, the deviation value of the side line segment; and the correction device corrects the laser cutting device according to another embodiment of the present invention according to the deviation value, which is utilized A laser plate is smeared in a line, and the laser cutting device includes a deviation value of at least two line segments of the _ 〗 and 't~ base detection lines. , ',, attack, to [Embodiment] The figure shows the knot of the laser cutting device of the embodiment of the creation of ±L· UA rU . . . , θ Fu unintentional picture, in this In the embodiment, the - laser cutting device i comprises a machine main body 7 material loading f 2G, a positioning device 27, a laser device 3G, an optical_loading-in and a correction device 35 (not shown in Figure 1) Out). Please refer to Fig. 2 for the structure of the main body 10 of the machine. The machine body 10 is driven by the cymbal drive, and the port structure & includes the linear motor module 12, the linear slide 14 and the buffers disposed at the ends of the machine. Fantasy 6; The suction cup module 18 is disposed on the slide 14 and is driven by 14 14 to move back and forth in the slide 14 . \,Build a wedge
U 入料裝置20之結構請參閱第3圖及第4圖，包括〜 體22及一升降裝置24連接傳輸本體22。升降裝置24 剧本 本體22運送_基板26至機台主體1()的人料端，即吸^模^輪 6 M330882 上方，如第1圖所示，且利用升降裝置24控制傳輸本體22之升 降，使所運送之基板（未示於第1圖）下沈至吸盤模組18上。 定位裝置27設置於入料裝置20上，請同時參閱第1圖、第 3圖及第4圖，於本實施例中，定位裝置27為二組氣壓缸28、28’ 設於傳輸本體22 —側的前後端，藉以當基板下沈至吸盤模組18 後，將基板初步定位於吸盤模組18上。 接續上述說明，如第1圖所示，雷射裝置30跨設於機台主 體10，使吸盤模組18於雷射裝置30之光路鏡組32的下方前後 移動，以利用光路鏡組32所產生之雷射光路對吸盤模組18上的 基板進行線條切割。 光學偵測裝置33，於此實施例中為使用二CCD模組34、 34’，請參閱第3圖，設置於傳輸本體22 —側，藉以偵測所切割 線條之其中二段的偏差值，以判斷所切割之線條是否與初始所設 定之基線對應。 修正裝置35，請參閱第3圖及第4圖，於此實施例中，係 為二組伺服缸36、36’設置於入料裝置20之非設有氣壓缸28、28’ 的另一側，其位置係與二氣壓缸28、28’對應匹配，以利用伺服缸 36、36’根據CCD模組34、34’所偵測之偏差值精確調整基板於吸 盤模組18上的擺放位置，以利進行後續的線條切割動作。 其中，請再次參閱第2圖及第3圖，於吸盤模組18的二側 邊分別形成有複數個凹陷部38，其係與入料裝置20之傳輸本體 22的複數滾輪40(示於第3圖）位置相對應，以便當傳輸本體22 下沈時提供滾輪40容置空間。又於吸盤模組18的週邊間隔設置 有複數真空吸附孔42，藉以輔助將基板吸附於吸盤模組18上。 另一方面，於吸盤模組18上並形成有複數個集塵吸孔44，藉以 收集雷射光路切割基板時所產生之粉塵；又吸盤模組18上設置 有複數個支撐凸點46，以便使基板與吸盤模組18間維持一極小 7 M330882 之間距，可避免基板直接與吸盤模組18接觸所產生之吸附不均 且基板破損之情形，同時支撐凸點46亦提供大尺寸基板切割時 一輔助支撐的功能。 接續上述說明，請參閱第1圖，雷射裝置30係包含有一滑 執結構48，藉以驅動光路鏡組32左右位移，每當吸盤模組18 吸附基板且前後位移以利用雷射光路畫出一組條線條後，光路鏡 組32便平移一距離，以利用雷射光路晝出另一組平行之線條， 於本實施例中，光路鏡組32每次可產生二道或四道雷射光路， • 以便每次同時於基板上晝出二線條或四線條，具有增加加工速度 ► 之優點。 另一方面，如第1圖所示，本創作雷射切割裝置1更包括一 出料裝置50位於機台主體10之出料端，當基板完成切割製程 後，吸盤模組18係將基板運送至出料端，且使出料裝置50上升， 以便承載基板並將基板運送到下一道製程，同時，吸盤模組18 亦返回至入料端，以利下一台入料裝置20將基板運送至吸盤模 組18且開始進行雷射切割製程。 又上述之修正裝置除了為利用二伺服缸修正基板於吸盤模 _ 組的位置之外，修正裝置亦可為一旋轉機構以直接旋轉整個吸盤 • 模組的位置，抑或為一軟體控制裝置自動調整雷射光路的切割角 度。 在本創作中，利用CCD直接計算線條偏差量的設計，將可 省略習知需於基板上打十字才可將基板準確定位的工序，因而具 有簡化製程且提高加工速度之優點；同時，由於本創作係採用入 料裝置將基板自動輸送至入料端進行切割製程，且利用出料裝置 將切割完成之基板自動輸出，此入料裝置與出料裝置一進一出的 設計將有助於提高雷射切割裝置的自動化程度，進而提高產能。 8 M330882 綜合上述，本創作雷射切割裝置具備有自動進出料功能，且 在不經打十字的工序下可直接藉由CCD進行線偏差偵測，以便 可迅速驅使修正裝置對基板的位置進行修正；另一方面，由於吸 盤模組上複數個支撐凸點的設計，可避免基板直接與吸盤接觸所 產生之吸附不均且基板破損之情形，同時支撐凸點亦提供大尺寸 基板切割時一輔助支撐的功能。 以上所述之實施例僅係為說明本創作之技術思想及特點，其 目的在使熟習此項技藝之人士能夠瞭解本創作之内容並據以實 施，當不能以之限定本創作之專利範圍，即大凡依本創作所揭示 之精神所作之均等變化或修飾，仍應涵蓋在本創作之專利範圍 内0 【圖式簡單說明】 第1圖所示為本創作一實施例雷射切割裝置之結構示意圖 第2圖所示為本創作一實施例雷射切割裝置之局部示意圖。 第3圖所示為本創作一實施例雷射切割裝置之另一局部示意圖。 第4圖所示為第3圖之俯視圖。 【主要元件符號說明】 1 雷射切割裝置 10 機台主體 12 馬達模組 14 滑執 16 緩衝缸 9 M330882Referring to Figures 3 and 4, the structure of the U feeding device 20 includes a body 22 and a lifting device 24 connected to the transfer body 22. Lifting device 24 The script body 22 carries the _substrate 26 to the human end of the machine main body 1 (), that is, above the suction mold wheel 6 M330882, as shown in Fig. 1, and controls the lifting and lowering of the transport body 22 by the lifting device 24. The substrate to be transported (not shown in FIG. 1) is sunk to the suction cup module 18. The positioning device 27 is disposed on the feeding device 20, please refer to FIG. 1 , FIG. 3 and FIG. 4 at the same time. In the embodiment, the positioning device 27 is provided with two sets of pneumatic cylinders 28 , 28 ′ on the transmission body 22 . The front and rear ends of the side are used to initially position the substrate on the chuck module 18 after the substrate has sunk to the chuck module 18. Following the above description, as shown in FIG. 1, the laser device 30 is spanned across the machine main body 10, and the suction cup module 18 is moved back and forth under the optical path lens group 32 of the laser device 30 to utilize the optical path lens group 32. The resulting laser beam path cuts the substrate on the chuck module 18. The optical detecting device 33, in this embodiment, uses two CCD modules 34, 34', please refer to FIG. 3, and is disposed on the side of the transport body 22 to detect the deviation values of the two segments of the cut line. It is determined whether the cut line corresponds to the initially set baseline. For the correction device 35, please refer to FIG. 3 and FIG. 4. In this embodiment, the two sets of servo cylinders 36, 36' are disposed on the other side of the feeding device 20 which is not provided with the pneumatic cylinders 28, 28'. The position is matched with the two pneumatic cylinders 28, 28' to accurately adjust the position of the substrate on the suction cup module 18 by using the servo cylinders 36, 36' according to the deviation values detected by the CCD modules 34, 34'. In order to facilitate the subsequent line cutting action. Referring to FIG. 2 and FIG. 3 again, a plurality of recessed portions 38 are formed on the two sides of the suction cup module 18, and are connected to the plurality of rollers 40 of the transfer body 22 of the feeding device 20 (shown in the first 3) The position corresponds to provide a space for the wheel 40 to be accommodated when the transport body 22 sinks. Further, a plurality of vacuum suction holes 42 are provided at intervals around the suction cup module 18 to assist in adsorbing the substrate to the chuck module 18. On the other hand, a plurality of dust collecting holes 44 are formed on the suction cup module 18 to collect the dust generated when the laser light path cuts the substrate; and the plurality of supporting bumps 46 are disposed on the suction cup module 18 so as to Maintaining a minimum distance of 7 M330882 between the substrate and the chuck module 18 can avoid uneven adsorption and damage of the substrate when the substrate is directly in contact with the chuck module 18, and the support bump 46 also provides a large-sized substrate for cutting. An auxiliary support function. Following the above description, referring to FIG. 1 , the laser device 30 includes a sliding structure 48 for driving the optical path lens group 32 to be displaced to the left and right. Each time the suction cup module 18 adsorbs the substrate and is displaced back and forth to draw a laser light path. After the lines are grouped, the optical path mirror group 32 is translated by a distance to take another series of parallel lines by using the laser beam path. In this embodiment, the optical path lens group 32 can generate two or four laser light paths at a time. , • In order to draw two or four lines on the substrate at the same time, it has the advantage of increasing the processing speed ►. On the other hand, as shown in FIG. 1, the laser cutting apparatus 1 of the present invention further includes a discharging device 50 located at the discharge end of the main body 10 of the machine. After the substrate completes the cutting process, the suction cup module 18 transports the substrate. Up to the discharge end, and the discharge device 50 is raised to carry the substrate and transport the substrate to the next process, and at the same time, the suction cup module 18 is also returned to the feed end, so that the next feeding device 20 transports the substrate Go to the suction cup module 18 and start the laser cutting process. In addition to the above-mentioned correction device, in addition to correcting the position of the substrate in the suction mold group by using two servo cylinders, the correction device can also be a rotation mechanism for directly rotating the position of the entire suction cup and module, or automatically adjusting for a software control device. The cutting angle of the laser light path. In the present creation, the design of directly calculating the line deviation amount by using the CCD can omit the conventional process of accurately positioning the substrate by making a cross on the substrate, thereby having the advantages of simplifying the process and increasing the processing speed; The authoring system uses the feeding device to automatically transport the substrate to the feeding end for the cutting process, and the cutting device is automatically outputted by the discharging device. The design of the feeding device and the discharging device will help to improve the mine. The degree of automation of the cutting device increases the productivity. 8 M330882 In summary, the laser cutting device of the present invention has an automatic feeding and discharging function, and can directly detect the line deviation by the CCD without the cross process, so that the correction device can quickly drive the position of the substrate to be corrected. On the other hand, due to the design of a plurality of supporting bumps on the suction cup module, the uneven adsorption caused by the direct contact between the substrate and the suction cup can be avoided, and the substrate is damaged. At the same time, the supporting bumps also provide an auxiliary for cutting large-sized substrates. Support function. The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent change or modification made by the spirit of the creation of this creation should still be covered by the scope of the patent of the creation. [Simplified illustration of the drawing] Fig. 1 shows the structure of a laser cutting device according to an embodiment of the present invention. FIG. 2 is a partial schematic view showing a laser cutting apparatus according to an embodiment of the present invention. Fig. 3 is a partial schematic view showing the laser cutting device of an embodiment of the present invention. Figure 4 is a plan view of Figure 3. [Main component symbol description] 1 Laser cutting device 10 Machine main body 12 Motor module 14 Slipper 16 Buffer cylinder 9 M330882
18 吸盤模組 20 入料裝置 22 傳輸本體 24 升降裝置 26 基板 27 定位裝置 28、28， 氣壓缸 30 雷射裝置 32 光路鏡組 33 光學偵測裝置 34、34， CCD模組 35 修正裝置 36、36， 伺服缸 38 凹陷部 40 滾輪 42 真空吸附孔 44 集塵吸孔 46 支撐凸點 48 滑執結構 50 出料裝置 1018 Suction cup module 20 Feeding device 22 Transfer body 24 Lifting device 26 Substrate 27 Positioning device 28, 28, Pneumatic cylinder 30 Laser device 32 Optical path lens group 33 Optical detection device 34, 34, CCD module 35 Correction device 36, 36, Servo cylinder 38 Depression 40 Roller 42 Vacuum suction hole 44 Dust suction hole 46 Supporting bump 48 Sliding structure 50 Discharging device 10