CN101434009A - Automatic control method of laser device for cutting - Google Patents
Automatic control method of laser device for cutting Download PDFInfo
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- CN101434009A CN101434009A CN 200710188753 CN200710188753A CN101434009A CN 101434009 A CN101434009 A CN 101434009A CN 200710188753 CN200710188753 CN 200710188753 CN 200710188753 A CN200710188753 A CN 200710188753A CN 101434009 A CN101434009 A CN 101434009A
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- workpiece
- laser cutting
- cutting device
- autocontrol method
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Abstract
The invention relates to an automatic control method for a laser cutting machine, which comprises the following steps: a feeding device sends a workpiece into a feeding end; the workpiece is positioned on a sucking disc module; the position of the workpiece is sensed and corrected; the workpiece which moves to and fro is cut by a laser device; when the workpiece moves to and fro once, the laser device performs translation motion for a certain distance, so as to be convenient to cut a plurality of parallel tangent lines on the workpiece; the sucking disc module moves to a discharging end, so as to utilize a discharging device to bear and automatically discharge the workpiece; and the sucking disc module returns back to the feeding end and the feeding device sends the next workpiece into the feeding end. By utilization of the automatic control method, the processing speed can be improved, so as to improve the productivity.
Description
Technical field
The present invention relates to the autocontrol method of a kind of autocontrol method, particularly a kind of laser cutting device.
Background technology
General thin film solar plate is provided with top electrode plated film, semiconductor coated film and bottom electrode plated film above glass substrate, all have many parallel tangent lines on each plated film, the formation of this tangent line utilizes a laser cutting machine that plated film is cut off, and the spacing that staggers separately of the tangent line between every layer of plated film makes and can insulate about it and up and down can intercommunication between the plated film.
Because the triple-layer coating on each thin film solar plate all need be formed with many tangent lines respectively, therefore on making, earlier the top electrode plated film is carried out laser cutting; Then cut the top electrode plated film plating surface of finishing again and formed the semiconductor plated film, and on semiconductor coated film, cut once more; On the semiconductor coated film that has cut, form a bottom electrode plated film afterwards again, and the bottom electrode plated film is cut; Need processing procedure so altogether through at least three plated films and at least three cuttings.
In the process of stressing high efficiency at present, if can provide a kind of possess have automatic feed design to carry out laser cutting to quicken laser cutting device, and possess and self-emptying design is arranged to transport out the autocontrol method of the workpiece of finishing cutting automatically, be purpose of the present invention.
Summary of the invention
In order to address the above problem, one of the object of the invention is that a kind of autocontrol method of laser cutting device is being provided, by the auto-control Design of feeding device and drawing mechanism one-in-and-one-out, improve the automaticity of whole laser cutting device, and then improve production capacity.
One of the object of the invention is that a kind of autocontrol method of laser cutting device is being provided, and wherein adopts the vision module accurately to detect the position of tangent line on workpiece or the workpiece, can revise the location of workpiece rapidly, and improves process velocity.
In order to achieve the above object, one embodiment of the invention provide a kind of autocontrol method of laser cutting device to comprise: drop into workpiece to a feeding device; Feeding device transports the feeding end that workpiece enters a board main body automatically, and feeding end has a sucker module; The location workpiece is in the sucker module; The position of detecting workpiece; Revise the position of workpiece; Start a laser aid, and the sucker module is moved forward and backward, utilize laser aid that workpiece is cut, wherein the sucker module whenever moves forward and backward once, and laser aid is translation one distance then, so that laser cutting goes out a plurality of parallel tangent lines on the workpiece; The sucker module moves to a discharge end of board main body, and discharge end has a drawing mechanism, utilizes drawing mechanism carrying and self-emptying workpiece; And the sucker module returns feeding end, and feeding device transports next workpiece and enters feeding end.。
Another embodiment of the present invention provides a kind of autocontrol method of laser cutting device to comprise: transport a workpiece automatically and enter a board main body; The location workpiece is in the board main body; Revise the position of workpiece; Move around workpiece and utilize a laser aid to cut is to form a plurality of parallel tangent lines on workpiece; And transport workpiece automatically and go out the board main body.
Below illustrate in detail by the specific embodiment conjunction with figs., when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.
Description of drawings]
Fig. 1 a to Fig. 1 j is depicted as the autocontrol method schematic flow sheet of one embodiment of the invention laser cutting device.
Be respectively workpiece and cutting the Workpiece structure schematic diagram finish after of one embodiment of the invention before not cutting shown in Fig. 2 a and Fig. 2 b.
Be respectively workpiece and cutting the Workpiece structure schematic diagram finish after of another embodiment of the present invention before not cutting shown in Fig. 3 a and Fig. 3 b.
Be respectively workpiece and cutting the Workpiece structure schematic diagram finish after of further embodiment of this invention before not cutting shown in Fig. 4 a and Fig. 4 b.
The main element symbol description:
10,10 ' workpiece
12 feeding devices
14 board main bodys
16 feeding ends
17 discharge ends
18 sucker modules
20,20 ' pneumatic cylinder
22 vision modules
221、221’?CCD
24,24 ' servoBcylinder
26 laser aids
261 light path mirror groups
28 drawing mechanisms
30 cut preceding workpiece
32 glass substrates
34 top electrode plated films
341 tangent lines
36 semiconductor coated films
361 tangent lines
38 bottom electrode plated films
381 tangent lines
Workpiece after 40 cuttings are finished
The specific embodiment
See also Fig. 1 a to Fig. 1 j, be the autocontrol method schematic flow sheet of one embodiment of the invention laser cutting device, as shown in Figure 1a, a workpiece 10 is dropped on the feeding device 12; Automatically transport the feeding end 16 that workpiece 10 enters a board main body 14 by feeding device 12, shown in Fig. 1 b, this feeding end 16 is provided with a sucker module 18, and the feeding device 12 that enters feeding end 16 is positioned at sucker module 18 tops; Then, shown in Fig. 1 c, feeding device 12 descends, and workpiece 10 is placed on the sucker module 18; See also Fig. 1 d, and utilize two groups of pneumatic cylinders 20,20 ' and two group of servoBcylinder 24,24 ' with workpiece 10 clampings with coarse positioning on sucker module 18 (in the accompanying drawing with workpiece 10 same positions); Then shown in Fig. 1 e, utilize the position of a vision module 22 detecting workpiece 10, in this embodiment, the vision module is two groups of CCD 221,221 ', so that the position deviation amount of detecting workpiece 10; Afterwards, shown in Fig. 1 f, utilize servoBcylinder 24,24 ' to cooperate, carry out the position deviation correction of workpiece 10 according to departure with pneumatic cylinder 20,20 '; And after correction is finished, start laser aid 26, shown in Fig. 1 g, sucker module 18 is moved forward and backward in laser aid 26 belows together with workpiece 10, with the laser optical path that utilizes laser aid 26 to be launched workpiece 10 is carried out the lines cutting, wherein sucker module 18 whenever moves forward and backward once, and the light path mirror group 261 on the laser aid 26 is turned left or past right translation one distance, so that cut out a plurality of parallel tangent lines on the workpiece 10.
The above-mentioned explanation that continues, when many parallel tangent line cuttings on the workpiece 10 finish after, see also Fig. 1 h, sucker module 18 just carries the discharge end 17 that workpiece 10 moves to board body 14, putting in advance on this discharge end 17 has a drawing mechanism 28; Afterwards, shown in Fig. 1 i, drawing mechanism 28 rises, so that make workpiece 10 break away from sucker module 18, rises with time feeding device 12; At last, shown in Fig. 1 j, by drawing mechanism 28 carrying and self-emptying workpiece 10,18 of sucker modules are back to feeding end 16 by discharge end 17 simultaneously, and feeding device 12 transports next workpiece 10 ' and comes in simultaneously.
Wherein, shown in Fig. 2 a, the workpiece 30 before the above-mentioned cutting can be glass substrate 32 and on the top electrode plated film 34 that forms, and pass through workpiece 40 after laser cutting device cutting is finished promptly shown in Fig. 2 b, top electrode plated film 34 has many parallel tangent lines 341.
Moreover, shown in Fig. 3 a, workpiece 30 before the above-mentioned not cutting can be stacked by glass substrate 32, the top electrode plated film 34 that has cut and full wafer semiconductor coated film 36 and form, and the workpiece 40 after finishing through laser cutting device cutting is promptly shown in Fig. 3 b, semiconductor coated film 36 has many parallel tangent lines 361, and with the tangent line 341 of top electrode plated film 34 spacing that staggers separately.
Person more, shown in Fig. 4 a, workpiece 30 before the above-mentioned not cutting can be stacked by glass substrate 32, the top electrode plated film 34 that has cut, the semiconductor coated film 36 that has cut and full wafer bottom electrode plated film 38 and form, and the workpiece 40 after finishing through laser cutting device cutting is promptly shown in Fig. 4 b, bottom electrode plated film 38 has many parallel tangent lines 381 and runs through semiconductor coated film 36, and with the tangent line 341 of the tangent line 361 of semiconductor coated film 36 and top electrode plated film 34 spacing that staggers separately.
Wherein, utilizing after servoBcylinder carries out drift correction to the position of workpiece, and can utilize the vision module once more the position of workpiece to be detected once more, whether servoBcylinder for confirmation has is adjusted to correct position with the location of workpiece; The design of its light path mirror group of above-mentioned again laser aid mat can be launched the laser optical path in two roads or four roads at every turn, so that cut out two roads or four road tangent lines on the workpiece simultaneously at every turn, to increase the process velocity of cutting, in addition, after a workpiece is finished in every and cutting, laser aid just can return former starting point, when treating that next workpiece is desired to cut, begins translation in regular turn by former starting point.
On the other hand, except above-mentioned for utilize two servoBcylinders cooperate with pneumatic cylinder with the correction workpiece in the position of sucker module, also can utilize the directly position of the whole sucker module of rotation of a rotating mechanism, or utilize a software controlled machine to adjust the cutting angle of laser optical path automatically.
In the present invention, adopt feeding device automatically workpiece to be delivered to feeding end to prepare to carry out the work piece cut processing procedure; The workpiece of directly cutting being finished by the sucker module is delivered to discharge end; The last workpiece that utilizes drawing mechanism to have cut is again exported automatically, and when workpiece carries out the discharging action, simultaneously another workpiece is fed into feeding device.The auto-control Design of this kind feeding device and drawing mechanism one-in-and-one-out will help to improve the automaticity of whole laser cutting device, and then improve production capacity.
In sum, the autocontrol method of laser cutting device of the present invention is on the location of workpiece, adopt the vision module accurately to detect the position of tangent line on workpiece or the workpiece, use and to revise its position rapidly, and the raising process velocity, simultaneously by the increase of laser optical path and allot the one-in-and-one-out design of charging/discharging device,, the present invention have processing precise degree height, process velocity to reach the high advantage of automaticity soon with being possessed.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who has the knack of this skill can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (21)
1. the autocontrol method of a laser cutting device comprises:
Drop into workpiece to a feeding device;
This feeding device transports the feeding end that this workpiece enters a board main body automatically, and this feeding end has a sucker module;
Locate this workpiece in this sucker module;
Detect the position of this workpiece;
Revise the position of this workpiece;
Start a laser aid, and this sucker module is moved forward and backward, utilize this laser aid that this workpiece is cut, wherein this sucker module whenever moves forward and backward once, translation one distance then on this laser aid is so that laser cutting goes out a plurality of parallel tangent lines on this workpiece;
This sucker module moves to a discharge end of this board main body, and this discharge end has a drawing mechanism, utilizes this drawing mechanism carrying and this workpiece of self-emptying; And
This sucker module returns this feeding end, and this feeding device transports next workpiece and enters this feeding end.
2. the autocontrol method of laser cutting device as claimed in claim 1 wherein utilizes at least two vision modules to detect this workpiece.
3. the autocontrol method of laser cutting device as claimed in claim 2, wherein this vision module is CCD.
4. the autocontrol method of laser cutting device as claimed in claim 1 wherein utilizes at least two pneumatic cylinders and at least two servoBcylinders that this workpiece is carried out the clamping location.
5. the autocontrol method of laser cutting device as claimed in claim 4, this workpiece of start correction that wherein utilizes this servoBcylinder is in the position of this sucker module.
6. the autocontrol method of laser cutting device as claimed in claim 1 wherein utilizes the position of this sucker module of rotating mechanism correction.
7. the autocontrol method of laser cutting device as claimed in claim 1, wherein revise the position of this workpiece after, and detect the position of this workpiece once more.
8. the autocontrol method of laser cutting device as claimed in claim 1, wherein this laser aid has at least two road laser optical paths.
9. the autocontrol method of laser cutting device as claimed in claim 1, wherein during this workpiece of discharging, another workpiece is fed into this feeding device.
10. the autocontrol method of laser cutting device as claimed in claim 1, wherein this feeding device enters after this feeding end, and following Shen is to be placed in this workpiece on this sucker module.
11. the autocontrol method of laser cutting device as claimed in claim 1, wherein after this sucker module moved to this discharge end, this drawing mechanism rose to carry this workpiece.
12. the autocontrol method of laser cutting device as claimed in claim 11, wherein, when this drawing mechanism rose, this feeding device rose simultaneously.
13. the autocontrol method of a laser cutting device comprises:
Automatically transport a workpiece and enter a board main body;
Locate this workpiece in this board main body;
Revise the position of this workpiece;
Move around this workpiece and utilize a laser aid to cut is to form a plurality of parallel tangent lines on this workpiece; And
Automatically transport this workpiece and go out this board main body.
14. the autocontrol method of laser cutting device as claimed in claim 13 more comprises the step of position of this workpiece of detecting.
15. the autocontrol method of laser cutting device as claimed in claim 14 wherein utilizes at least two vision modules to detect the position of this workpiece.
16. the autocontrol method of laser cutting device as claimed in claim 15, this vision module is CCD.
17. the autocontrol method of laser cutting device as claimed in claim 13 wherein utilizes at least two pneumatic cylinders and at least two servoBcylinders that this workpiece is carried out the clamping location.
18. the autocontrol method of laser cutting device as claimed in claim 17 wherein utilizes the position of this workpiece of start correction of this servoBcylinder.
19. the autocontrol method of laser cutting device as claimed in claim 13 wherein utilizes the position of this workpiece of rotating mechanism correction.
20. the autocontrol method of laser cutting device as claimed in claim 13, wherein this laser aid has at least two road laser optical paths.
21. the autocontrol method of laser cutting device as claimed in claim 13, wherein when transporting this workpiece automatically and going out this board main body, next workpiece is transported automatically enters this board main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710188753 CN101434009A (en) | 2007-11-14 | 2007-11-14 | Automatic control method of laser device for cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710188753 CN101434009A (en) | 2007-11-14 | 2007-11-14 | Automatic control method of laser device for cutting |
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| Publication Number | Publication Date |
|---|---|
| CN101434009A true CN101434009A (en) | 2009-05-20 |
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| CN 200710188753 Pending CN101434009A (en) | 2007-11-14 | 2007-11-14 | Automatic control method of laser device for cutting |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102145435A (en) * | 2010-02-09 | 2011-08-10 | 绿阳光电股份有限公司 | Laser scribing machine with automatic correction mechanism and automatic correction method thereof |
| CN103962735A (en) * | 2014-05-22 | 2014-08-06 | 江苏金方圆数控机床有限公司 | Plate feeding positioning system for laser cutting flexible production line |
| WO2017036126A1 (en) * | 2015-08-31 | 2017-03-09 | 宝山钢铁股份有限公司 | Method and system for dynamically following laser cutting with magnetic belt |
| CN107520544A (en) * | 2017-10-16 | 2017-12-29 | 河南艾顿机床有限公司 | A kind of laser cutting machine and laser cutting streamline |
| CN110026804A (en) * | 2019-04-04 | 2019-07-19 | 惠科股份有限公司 | A kind of cutting machine, cutting machine and cutting method for substrate |
-
2007
- 2007-11-14 CN CN 200710188753 patent/CN101434009A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102145435A (en) * | 2010-02-09 | 2011-08-10 | 绿阳光电股份有限公司 | Laser scribing machine with automatic correction mechanism and automatic correction method thereof |
| CN103962735A (en) * | 2014-05-22 | 2014-08-06 | 江苏金方圆数控机床有限公司 | Plate feeding positioning system for laser cutting flexible production line |
| WO2017036126A1 (en) * | 2015-08-31 | 2017-03-09 | 宝山钢铁股份有限公司 | Method and system for dynamically following laser cutting with magnetic belt |
| US10759003B2 (en) | 2015-08-31 | 2020-09-01 | Baoshan Iron & Steel Co., Ltd. | Method and system for dynamically following laser cutting with magnetic belt |
| CN107520544A (en) * | 2017-10-16 | 2017-12-29 | 河南艾顿机床有限公司 | A kind of laser cutting machine and laser cutting streamline |
| CN110026804A (en) * | 2019-04-04 | 2019-07-19 | 惠科股份有限公司 | A kind of cutting machine, cutting machine and cutting method for substrate |
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Open date: 20090520 |