TW201610609A - Silver halide solution physical developing solution and method of use - Google Patents

Silver halide solution physical developing solution and method of use Download PDF

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TW201610609A
TW201610609A TW104115926A TW104115926A TW201610609A TW 201610609 A TW201610609 A TW 201610609A TW 104115926 A TW104115926 A TW 104115926A TW 104115926 A TW104115926 A TW 104115926A TW 201610609 A TW201610609 A TW 201610609A
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silver
silver halide
mol
solution
hydrophilic
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TW104115926A
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麥可 菲利浦 楊布勒德
湯瑪斯 愛德華 羅依
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柯達公司
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Priority claimed from US14/281,984 external-priority patent/US9335635B2/en
Priority claimed from US14/281,968 external-priority patent/US9405198B2/en
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Publication of TW201610609A publication Critical patent/TW201610609A/en

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Abstract

A black-and-white developing solution and a silver halide solution physical developing solution are used in sequence to provide electrically-conductive film elements from conductive film element precursors that contain photosensitive silver halide emulsions on one or both supporting sides of a transparent substrate. The two developing solutions have unique combinations of developing agents and other essential components to provide complete development of imagewise exposed silver halide and highly conductive silver metal in desired patterns on a transparent substrate.

Description

鹵化銀溶液之物理顯像溶液及使用方法 Physical imaging solution of silver halide solution and using method thereof

本發明係關於一種使用加工特徵及加工溶液之獨特組合提供導電銀薄膜元件(或導電物品)之方法。該等導電銀薄膜元件可具備預定導電銀圖案且用於不同電子裝置,或其可進一步經加工以提供電鍍在銀上方之其他導電金屬之圖案。該方法可在使用獨特鹵化銀物理顯像溶液成像曝光導電薄膜元件前驅體之後進行。 The present invention is directed to a method of providing a conductive silver film element (or conductive article) using a unique combination of processing features and processing solutions. The conductive silver film elements can be provided with a predetermined conductive silver pattern and used in different electronic devices, or they can be further processed to provide a pattern of other conductive metals plated over the silver. The method can be performed after imagewise exposure of a conductive thin film element precursor using a unique silver halide physical imaging solution.

用於各種通訊、財務、擷取及存檔目的之各種電子裝置、尤其顯示裝置存在快速進展。對於例如觸控螢幕面板、電致變色裝置、發光二極體、場效應電晶體及液晶顯示器之用途,導電薄膜為必需的,且工業中作出相當大努力來改良彼等導電薄膜之性質以及其製造方法。 Various electronic devices, particularly display devices, for various communication, financial, retrieval, and archival purposes have experienced rapid progress. Conductive films are necessary for applications such as touch screen panels, electrochromic devices, light-emitting diodes, field effect transistors, and liquid crystal displays, and considerable efforts are made in the industry to improve the properties of their conductive films and their Production method.

另外,隨著所提及之顯示裝置近年來之開發,其吸引力已借助於觸控螢幕技術而大大增加,由此用手指或觸筆在螢幕表面上之輕觸可產生訊號以導致螢幕視圖變化或導致資訊之接收或發送、電信、與網際網路相互作用及在不斷增加步伐之創新下正開發之許多其他特徵。觸控螢幕技術已在很大程度上藉由在主顯示器上使用透明導電柵格,以便螢幕表面上指示之觸控之位置可藉由適當電路及軟體來偵測,而變得可能。 In addition, with the development of the mentioned display device in recent years, its attraction has been greatly increased by means of touch screen technology, whereby a tap on the surface of the screen with a finger or a stylus can generate a signal to cause a screen view. Many other features that are being developed or are being developed, resulting in the receipt or transmission of information, telecommunications, interaction with the Internet, and innovation at an ever-increasing pace. Touch screen technology has largely become possible by using a transparent conductive grid on the main display so that the position of the touch on the surface of the screen can be detected by appropriate circuitry and software.

當前,大多數觸控螢幕顯示器使用氧化銦錫(ITO)塗層以產生用 以區別多點接觸之電容區域陣列。ITO塗層具有顯著缺點,且正努力以在各種電子裝置中置換其使用。銦為昂貴稀土金屬且在世界上可自極少來源以有限供應獲得。ITO導電性相對低且需要短線路長度來實現充足響應速率。用於大顯示器之觸控螢幕分割成更小片段以將導電線路長度減小至可接受之電阻。ITO為陶瓷材料,不容易彎曲或折曲,且需要在高加工溫度下真空沈積來製備導電層。 Currently, most touch screen displays use indium tin oxide (ITO) coatings for production. To distinguish the array of capacitive regions of multi-point contact. ITO coatings have significant drawbacks and efforts are being made to replace their use in various electronic devices. Indium is an expensive rare earth metal and is available in the world from a limited supply from a limited supply. ITO conductivity is relatively low and requires short line lengths to achieve adequate response rates. The touch screen for large displays is split into smaller segments to reduce the length of the conductive trace to an acceptable resistance. ITO is a ceramic material that is not easily bent or bent and requires vacuum deposition at high processing temperatures to prepare a conductive layer.

銀為導電性比ITO大50至100倍之理想導體。銀用於許多商業應用中且可自眾多來源獲得。高度需要使用銀作為導電性來源來製造導電薄膜元件,但需要長足發展或其他加工操作來獲得最優導電性質。 Silver is an ideal conductor that is 50 to 100 times more conductive than ITO. Silver is used in many commercial applications and is available from a variety of sources. It is highly desirable to use silver as a source of conductivity to fabricate conductive thin film components, but significant development or other processing operations are required to achieve optimal conductive properties.

美國專利申請公開案2011/0308846(Ichiki)描述導電薄膜之製備,其藉由用小於10μm之銀線大小減小導電網路中之鹵化銀圖像形成,該等導電薄膜可用以形成顯示器中之觸控面板。 U.S. Patent Application Publication No. 2011/0308846 (Ichiki) describes the preparation of a conductive film which is formed by reducing the size of a silver halide image in a conductive network by using a silver wire size of less than 10 μm, which can be used to form a display. Touch panel.

另外,美國專利3,464,822(Blake)描述鹵化銀乳液之用途,其用於攝影元件以藉由顯像及顯像之後的一或多個處理浴形成導電銀表面圖像。 In addition, U.S. Patent No. 3,464,822 (Blake) describes the use of a silver halide emulsion for use in photographic elements to form a conductive silver surface image by one or more processing baths after development and development.

美國專利7,829,270(Nakahira)描述感光性鹵化銀材料之用途,其用以形成導電銀金屬圖案。在曝光感光性鹵化銀材料之後,將其使用黑白顯像溶液加工,隨後為定像及物理顯像及無電電鍍操作。 U.S. Patent 7,829,270 (Nakahira) describes the use of a photosensitive silver halide material for forming a conductive silver metal pattern. After exposure to the photosensitive silver halide material, it is processed using a black and white imaging solution followed by fixation and physical imaging and electroless plating operations.

此外,美國專利8,012,676(Yoshiki等人)亦描述類似方法,但進一步包括用以增強所得銀金屬圖像之導電性之操作。 Further, a similar method is described in U.S. Patent No. 8,012,676 (Yoshiki et al.), but further includes the operation to enhance the conductivity of the resulting silver metal image.

因此,已知使用各種加工溶液及條件在透明薄膜上提供導電銀圖案。然而,此外需要提高銀圖案、尤其呈細線路形式之銀圖案之導電性而不增加Dmin。換言之,需要平衡導電銀圖像中提高之銀金屬導電性、增加之透明度及低Dmin。考慮到此等需要,開發本發明。 Accordingly, it is known to provide a conductive silver pattern on a transparent film using a variety of processing solutions and conditions. However, it is furthermore necessary to increase the conductivity of the silver pattern, especially in the form of fine lines, without increasing Dmin . In other words, it is necessary to balance the improved silver metal conductivity, increased transparency, and low Dmin in the conductive silver image. The present invention has been developed in view of such needs.

本發明提供一種鹵化銀溶液之物理顯像溶液,其包含: (a)至少0.01mol/l且至多且包括1mol/l之量之主要顯像劑,其為氫醌或抗壞血酸或任一者之衍生物,及(c)至少0.001mol/l且至多且包括0.1mol/l之量之鹵化銀溶解催化劑,且該鹵化銀溶液之物理顯像溶液實質上不含有(b)催化顯像劑。 The invention provides a physical imaging solution of a silver halide solution, which comprises: (a) a primary imaging agent in an amount of at least 0.01 mol/l and up to and including 1 mol/l, which is hydroquinone or ascorbic acid or a derivative of either, and (c) at least 0.001 mol/l and up to and including The silver halide solution is dissolved in an amount of 0.1 mol/l, and the physical development solution of the silver halide solution contains substantially no (b) catalytic developer.

本發明亦提供一種在導電薄膜元件中之透明基板上提供導電銀圖像之方法,該方法按次序包含:成像曝光包含具有第一支撐側及相對第二支撐側之透明基板之導電薄膜元件前驅體,且該導電薄膜元件前驅體在該第一支撐側上按次序包括包含感光性鹵化銀之第一非彩色親水性感光層、及視情況安置在該第一非彩色親水性感光層上方之第一親水性外塗層,以提供在該第一非彩色親水性感光層中包含第一潛伏銀圖像之成像曝光之前驅體,在pH為至少8且至多且包括13且包含以下之鹵化銀顯像溶液中加工該成像曝光之前驅體至少10秒:(a)至少0.01mol/l且至多且包括1mol/l之量之主要顯像劑,其為氫醌或抗壞血酸或任一者之衍生物,及(b)至少0.001mol/l且至多且包括0.1mol/l之量之催化顯像劑,其為對胺基苯酚或菲尼酮或任一者之衍生物,以在該第一非彩色親水性感光層中提供對應於該第一潛伏銀圖像之第一銀圖像,在至少20℃之溫度下,在根據本文中描述之任何實施例的鹵化銀溶液之物理顯像溶液中加工該成像曝光之前驅體至少30秒,以提供該銀圖像之導電性,其為在僅用第一顯像溶液加工之後的該第一銀圖像之導電性之至少2倍,在定像溶液中加工該成像曝光之前驅體,以移除剩餘銀離子且提供含有該第一銀圖像之導電薄膜元件,處理該導電薄膜元件,以增強該第一銀圖像之導電性,及 視情況洗滌及乾燥該導電薄膜元件。 The present invention also provides a method of providing a conductive silver image on a transparent substrate in a conductive thin film element, the method comprising, in order, imaging exposing a conductive thin film element precursor comprising a transparent substrate having a first support side and a second support side And the conductive film element precursor comprises, in order, on the first support side, a first achromatic hydrophilic photosensitive layer comprising photosensitive silver halide, and optionally disposed above the first achromatic hydrophilic photosensitive layer a first hydrophilic overcoat layer to provide an imagewise exposure precursor comprising a first latent silver image in the first achromatic hydrophilic photosensitive layer, at a pH of at least 8 and up to and including 13 and comprising halogenation Processing the imagewise exposure precursor in the silver imaging solution for at least 10 seconds: (a) at least 0.01 mol/l and up to and including 1 mol/l of the primary imaging agent, which is hydroquinone or ascorbic acid or either a derivative, and (b) a catalytic developer in an amount of at least 0.001 mol/l and up to and including 0.1 mol/l, which is a p-aminophenol or phenidone or a derivative thereof, in the a non-colored hydrophilic layer of light Providing a first silver image corresponding to the first latent silver image, processing the imagewise exposure prior to processing in a physical imaging solution of a silver halide solution according to any of the embodiments described herein at a temperature of at least 20 °C Body for at least 30 seconds to provide conductivity of the silver image, which is at least 2 times greater than the conductivity of the first silver image after processing with only the first imaging solution, processing the image in a fixing solution Exposing the precursor to remove residual silver ions and providing a conductive thin film element containing the first silver image, processing the conductive thin film element to enhance conductivity of the first silver image, and The conductive film member is washed and dried as appropriate.

在本發明之一些實施例中,該方法使用導電薄膜元件前驅體進行,該導電薄膜元件前驅體進一步在該透明基板之該相對第二支撐側上包含第二非彩色親水性感光層、及視情況安置在該第二非彩色親水性感光層上方之第二親水性外塗層,且該方法進一步包含:自該透明基板之該第二相對側成像曝光該導電薄膜元件前驅體,以在該成像曝光之前驅體之該第二非彩色親水性感光層中提供第二潛伏銀圖像,在pH為至少8且至多且包括13且包含以下之相同或不同鹵化銀顯像溶液中加工該成像曝光之前驅體至少10秒:(a)至少0.01mol/l且至多且包括1mol/l之量之主要顯像劑至少10秒,其為氫醌或抗壞血酸或任一者之衍生物,及(b)至少0.001mol/l且至多且包括0.1mol/l之量之催化顯像劑,其為對胺基苯酚或菲尼酮或任一者之衍生物,以在該第二非彩色親水性感光層中提供對應於該第二潛伏銀圖像之第二銀圖像,在至少20℃之溫度下,在本文中描述之任何實施例的相同或不同鹵化銀溶液之物理顯像溶液中加工該成像曝光之前驅體至少30秒,以提供該銀圖像之導電性,其為在僅用第一顯像溶液加工之後的該第二銀圖像之導電性之至少2倍,在定像溶液中加工該成像曝光之前驅體,以移除剩餘銀離子且提供含有該第二銀圖像之導電薄膜元件,處理該導電薄膜元件,以增強該第二銀圖像之導電性,及視情況洗滌及乾燥該導電薄膜元件。 In some embodiments of the invention, the method is performed using a conductive thin film element precursor, the conductive thin film element precursor further comprising a second achromatic hydrophilic photosensitive layer on the opposite second support side of the transparent substrate, and a second hydrophilic overcoat layer disposed over the second achromatic hydrophilic photosensitive layer, and the method further comprising: imaging exposing the conductive thin film element precursor from the second opposite side of the transparent substrate to Providing a second latent silver image in the second achromatic hydrophilic photosensitive layer of the imagewise exposure precursor, processing the image in a silver halide imaging solution having a pH of at least 8 and up to and including 13 and comprising the same or different silver halide imaging solutions Exposing the precursor for at least 10 seconds: (a) at least 0.01 mol/l and up to and including 1 mol/l of the primary imaging agent for at least 10 seconds, which is hydroquinone or ascorbic acid or a derivative of either, and b) a catalytic developer in an amount of at least 0.001 mol/l and up to and including 0.1 mol/l, which is a p-aminophenol or phenidone or a derivative thereof, to be hydrophilic in the second achromatic hydrophilic Provided in the light layer corresponding to the a second silver image of the second latent silver image, at least 30 after processing the imagewise exposure in a physical imaging solution of the same or different silver halide solution of any of the embodiments described herein at a temperature of at least 20 °C Seconds to provide conductivity of the silver image, which is at least 2 times the conductivity of the second silver image after processing with only the first development solution, before processing the imagewise exposure in the fixing solution a body for removing remaining silver ions and providing a conductive thin film element containing the second silver image, treating the conductive thin film element to enhance conductivity of the second silver image, and optionally washing and drying the conductive thin film element .

本發明之方法可用以提供一種本發明之導電薄膜元件,該導電薄膜元件在透明基板之第一支撐側上具有第一銀圖像且視情況在透明基板之相對第二支撐側上具有第二銀圖像。該第一及第二銀圖像為導電 的且可單獨使用或用其他導電金屬電鍍。 The method of the present invention can be used to provide a conductive film element of the present invention having a first silver image on a first support side of a transparent substrate and optionally a second on a second support side of the transparent substrate Silver image. The first and second silver images are electrically conductive It can be used alone or with other conductive metals.

本發明可使用pH為至少8且包含以下之獨特鹵化銀顯像溶液進行:(a)至少0.01mol/l且至多且包括0.15mol/l之量之主要顯像劑,其為氫醌或抗壞血酸或任一者之衍生物,(b)至少0.001mol/l且至多且包括0.025mol/l之量之催化顯像劑,其為對胺基苯酚或菲尼酮或任一者之衍生物,及(c)至少0.25mol/l且至多且包括2.5mol/l之總量之一或多種顯像抑制劑。 The present invention can be carried out using a unique silver halide imaging solution having a pH of at least 8 and comprising: (a) a primary imaging agent in an amount of at least 0.01 mol/l and up to and including 0.15 mol/l, which is hydroquinone or ascorbic acid Or a derivative of either, (b) a catalytic developer in an amount of at least 0.001 mol/l and up to and including 0.025 mol/l, which is a p-aminophenol or phenidone or a derivative thereof And (c) one or more development inhibitors in a total amount of at least 0.25 mol/l and up to and including 2.5 mol/l.

本發明提供含有可配置於細線路或柵格之預定圖案中之高度導電銀金屬圖像的改良之導電薄膜元件之數種優勢。所得導電薄膜元件展現高導電性及高透明度,同時在於定像溶液中加工之後保持(視覺)Dmin儘可能低、例如小於或等於0.3。此等優勢藉由在定像之前使用黑白鹵化銀顯像溶液之獨特組合而實現。 The present invention provides several advantages of an improved conductive film element comprising a highly conductive silver metal image that can be disposed in a predetermined pattern of fine lines or grids. The resulting conductive film member exhibits high conductivity and high transparency while keeping (visual) D min as low as possible, for example, less than or equal to 0.3, after processing in the fixing solution. These advantages are achieved by using a unique combination of black and white silver halide imaging solutions prior to fixation.

以下論述係針對本發明之各種實施例,且在一些實施例對於特定用途可特別合乎需要時,所揭示實施例不應解釋為或以其他方式視為限制本發明之範疇,如下文所要求。另外,熟習此項技術者將理解,以下揭示內容具有比所明確描述更廣泛之應用,且對任何實施例之論述並不打算限制本發明之範疇。 The following discussion is directed to the various embodiments of the present invention, and the disclosed embodiments are not to be construed as limiting or limiting the scope of the invention. In addition, those skilled in the art will understand that the following disclosures are more broadly described, and the description of any embodiments is not intended to limit the scope of the invention.

定義definition

除非另外指示,否則如本文中用以定義用以製備導電薄膜元件前驅體之加工溶液及各種層及調配物之各種組分,單數形式「一個(a/an)」及「該(the)」打算包括該等組分中之一或多者(換言之,包括 複數個指示物)。 Unless otherwise indicated, the singular forms "a" and "the" are used to define the processing solutions and various layers and formulations of the precursors of the conductive film element precursors. Intended to include one or more of these components (in other words, including a plurality of indicators).

在本申請案中未明確定義之各術語應理解為具有熟習此項技術者通常所接受之含義。若術語之建構將使其在其上下文中無意義或基本上無意義,則術語之定義應取自英語或化學辭典。 Terms that are not explicitly defined in this application are to be understood as having the meaning commonly accepted by those skilled in the art. If the construction of terms makes them meaningless or essentially meaningless in their context, the definition of terms should be taken from English or chemical dictionaries.

除非另外明確指示,否則本文中所規定之各種範圍中之數值的使用視為近似值,如同在所述範圍內之最小值及最大值之前面均加有詞語「約」。以此方式,在所述範圍以上及以下之微小變量可用以實質上實現與範圍內之值相同之結果。另外,此等範圍之揭示內容預期為包括最小值與最大值之間的各值之連續範圍。 The use of numerical values in the various ranges specified herein is considered to be an approximation, as the meaning of the minimum and maximum values within the range. In this way, small variables above and below the range can be used to substantially achieve the same results as the values in the range. Further, the disclosure of such ranges is intended to include a continuation of the various values between the minimum and maximum values.

除非另外指示,否則術語「重量%」係指組分或材料以組合物、調配物、溶液之總固體計之量,或為層之乾重之百分比。除非另外指示,否則百分比對於乾燥層或圖案或對於用以製造該層或圖案之調配物或組合物之總固體可為相同的。 Unless otherwise indicated, the term "% by weight" refers to the amount of the component or material, based on the total solids of the composition, formulation, solution, or the percentage of the dry weight of the layer. Unless otherwise indicated, the percentages may be the same for the dry layer or pattern or for the total solids of the formulation or composition used to make the layer or pattern.

除非另外指示,否則術語「mol%」係指溶液或分散液內之具體組分(或相同類別之組分之混合物)之莫耳量。 Unless otherwise indicated, the term "mol%" means the molar amount of a particular component (or mixture of components of the same class) within a solution or dispersion.

「導電薄膜元件前驅體」(或「前驅體」)意在指用於實踐本發明以提供本發明之導電薄膜元件之物品或元件。該等導電薄膜元件前驅體因此包含銀金屬粒子之前驅體,諸如如下文所描述適合地轉化(例如藉由還原)為銀金屬之鹵化銀。關於導電薄膜元件前驅體之許多論述同樣適用於導電薄膜元件,因為當鹵化銀中之銀陽離子轉化為銀金屬粒子時,大多數組分及結構並不改變。因此,除非另外指示,否則對用於導電薄膜元件前驅體之鹵化銀層及親水性外塗層中之基板、親水性黏合劑及膠體以及任何其他附加物之論述亦打算描述所得導電薄膜元件之組分。 The "conductive film element precursor" (or "precursor") is intended to mean an article or element for practicing the invention to provide the electroconductive film element of the invention. The conductive thin film element precursors thus comprise a silver metal particle precursor, such as a silver halide that is suitably converted (e.g., by reduction) to a silver metal as described below. Many of the statements regarding the precursors of conductive thin film elements are equally applicable to conductive thin film elements because most of the components and structures do not change when silver cations in silver halide are converted to silver metal particles. Therefore, unless otherwise indicated, the discussion of the substrate, hydrophilic binder and colloid, and any other addenda in the silver halide layer and the hydrophilic overcoat layer for the conductive film element precursor is also intended to describe the resulting conductive film element. Component.

除非另外指示,否則術語「導電薄膜元件(conductive film element/electrically-conductive film elements)」及「導電物品」打算意 指相同事物。其係指含有包含安置在適合基板之一或兩個支撐側上之導電銀金屬圖像(或其他導電金屬圖像)的親水性層之材料。導電物品或導電薄膜元件之其他組分描述於下文中。 Unless otherwise indicated, the terms "conductive film element/electrically-conductive film elements" and "conductive articles" are intended Refers to the same thing. It refers to a material containing a hydrophilic layer comprising a conductive silver metal image (or other conductive metal image) disposed on one or both of the support sides. Other components of the conductive article or conductive film element are described below.

除非另外指示,否則術語「導電」係指「導電性」,而非導熱性。 Unless otherwise indicated, the term "conducting" means "conductivity" rather than thermal conductivity.

術語「第一」係指基板之一個支撐側上之層,且術語「第二」係指基板之相對(相反)支撐側上之層。基板之各支撐側可同等適用且術語「第一」不必意指一側為支撐物之主要或更佳支撐側。 The term "first" refers to a layer on one of the support sides of the substrate, and the term "second" refers to the layer on the opposite (opposite) support side of the substrate. The support sides of the substrate are equally applicable and the term "first" does not necessarily mean that one side is the primary or better support side of the support.

術語「雙工」及「雙側」在本文中關於在基板之兩個支撐側上均具有所描述之層的導電薄膜元件前驅體及導電薄膜元件而使用。除非本文中另外指示,否則基板之兩個支撐側上之各種層的關係及組成可相同或不同。此外,安置在基板之相對支撐側上之鹵化銀可使用相同或不同加工溶液及條件來進行成像及加工。 The terms "duplex" and "double side" are used herein with respect to conductive thin film element precursors and conductive thin film elements having the layers described on both support sides of the substrate. The relationships and compositions of the various layers on the two support sides of the substrate may be the same or different, unless otherwise indicated herein. In addition, the silver halide disposed on the opposite support side of the substrate can be imaged and processed using the same or different processing solutions and conditions.

ESD係指「當量球徑」且為攝影技術中用以定義粒子(諸如鹵化銀顆粒)之大小之術語。鹵化銀顆粒如以顆粒ESD表示之粒度可容易使用圓盤式離心機儀器測定。 ESD is the term "equivalent spherical diameter" and is a term used in photography to define the size of particles, such as silver halide grains. The particle size of the silver halide grains, as indicated by the particle ESD, can be readily determined using a disc centrifuge instrument.

除非另外指示,否則「黑白」係指形成銀之黑白材料及調配物,而非顯色黑白材料及調配物。 Unless otherwise indicated, "black and white" refers to black and white materials and formulations that form silver, rather than black-and-white materials and formulations.

用途use

導電薄膜元件前驅體可用於實踐本發明以形成在適合基板之一或兩個支撐側上包含導電銀金屬圖案之導電薄膜元件。此等導電薄膜元件可本身用作裝置或其可用作具有多種應用之裝置中之組件,該等應用包括但不限於電子、光學、感覺及診斷用途。該等用途之更多細節提供於下文中。特定言之,希望使用本發明之導電薄膜元件前驅體來提供包含如下線路之高度導電銀金屬圖案(或其他導電金屬圖案),該等線路具有小於50μm或小於15μm或甚至小於10μm且低至1μm之線 解析度(線寬)。 A conductive film element precursor can be used to practice the invention to form a conductive film element comprising a conductive silver metal pattern on one or both of the support sides of a suitable substrate. These electrically conductive film elements may themselves be used as devices or as components in devices having a variety of applications including, but not limited to, electronic, optical, sensory, and diagnostic applications. Further details of such uses are provided below. In particular, it is desirable to use the conductive thin film element precursor of the present invention to provide a highly conductive silver metal pattern (or other conductive metal pattern) having a line having less than 50 μm or less than 15 μm or even less than 10 μm and as low as 1 μm. Line Resolution (line width).

特別適用的為製備在透明基板之第一及相對第二支撐側上包含導電銀圖案之導電薄膜元件。該等電子及光學裝置及組件包括但不限於射頻標籤(RFID)、感測器、觸控螢幕顯示器以及用於顯示器之記憶及背面板。 Particularly suitable is the preparation of a conductive film element comprising a conductive silver pattern on a first and opposite second support side of a transparent substrate. The electronic and optical devices and components include, but are not limited to, radio frequency tags (RFID), sensors, touch screen displays, and memory and back panels for displays.

導電薄膜元件前驅體Conductive film element precursor

適用於實踐本發明之導電薄膜元件前驅體為感光性的,但不含有足以提供彩色攝影圖像之化學物質。因此,此等前驅體視為在曝光及加工之後形成金屬銀圖像之黑白感光性材料,且為「非彩色圖像形成的」。 The precursor of the conductive film element suitable for use in practicing the present invention is photosensitive but does not contain a chemical sufficient to provide a color photographic image. Therefore, these precursors are regarded as black and white photosensitive materials which form a metallic silver image after exposure and processing, and are "formed by achromatic images".

包括透明基板及一或兩個支撐側上之所有隨附層之導電薄膜元件前驅體及所得導電薄膜元件視為透明的,意指藉由整個元件之在電磁波譜之所指示可見區(例如410nm至700nm)上的綜合透射率可為70%或70%以上,或更可能至少85%或甚至90%或90%以上。綜合透射率可使用分光光度計及已知程序測定。 The conductive thin film element precursor including the transparent substrate and all of the accompanying layers on the support side and the resulting conductive thin film element are considered to be transparent, meaning that the entire element is in the visible region indicated by the electromagnetic spectrum (for example, 410 nm) The overall transmittance on the 700 nm) may be 70% or more, or more preferably at least 85% or even 90% or more. The integrated transmittance can be measured using a spectrophotometer and known procedures.

在透明基板之兩個支撐側上具有相同或不同必需層之導電薄膜元件前驅體可稱為「雙工」或「雙側」導電薄膜元件前驅體。 A conductive thin film element precursor having the same or different necessary layers on both support sides of a transparent substrate may be referred to as a "duplex" or "double-sided" conductive thin film element precursor.

導電薄膜元件前驅體可藉由以適合方式在適合透明基板之至少一個支撐或平面側(與非支撐邊緣相對)上提供第一非彩色(換言之,形成銀金屬之黑白)親水性感光層而形成。此第一非彩色親水性感光層包含鹵化銀或鹵化銀混合物,總銀覆蓋率為至少2500mg Ag/m2,或至少3500mg Ag/m2,且在許多實施例中小於5000mg Ag/m2,例如至多且包括4900mg Ag/m2。然而,必要時可使用更高銀覆蓋率。因此,此非彩色親水性感光層具有足夠鹵化銀固有或添加光譜敏化以對所選成像輻照(下文描述)具感光性。在透明基板之相對支撐側上感光層之組成及光譜敏化可相同或不同。 The conductive thin film element precursor can be formed by providing a first achromatic (in other words, a black metal forming black and white) hydrophilic photosensitive layer on at least one of the supporting or planar sides (opposite the unsupported edge) suitable for the transparent substrate in a suitable manner. . The first achromatic hydrophilic photosensitive layer comprises a silver halide or a silver halide mixture having a total silver coverage of at least 2500 mg Ag/m 2 , or at least 3500 mg Ag/m 2 , and in many embodiments less than 5000 mg Ag/m 2 , For example, up to and including 4900 mg Ag/m 2 . However, higher silver coverage can be used if necessary. Thus, this achromatic hydrophilic photosensitive layer has sufficient silver halide intrinsic or added spectral sensitization to be photosensitive to selected imaging radiation (described below). The composition and spectral sensitization of the photosensitive layer on the opposite support sides of the transparent substrate may be the same or different.

一或多種鹵化銀分散於一或多種適合親水性黏合劑或膠體內,如下文亦描述。 One or more silver halides are dispersed in one or more suitable hydrophilic binders or gels, as also described below.

該等導電薄膜元件前驅體因此以一種方式處理(成像曝光)以便將銀陽離子轉化(諸如藉由還原)為銀金屬粒子,且此曝光之前驅體隨後可在下文所描述之適當處理或加工步驟之後轉化為本發明之導電薄膜元件。 The conductive thin film element precursors are thus treated in one manner (imagewise exposure) to convert the silver cations (such as by reduction) to silver metal particles, and the exposure precursor can then be suitably processed or processed as described below. It is then converted into a conductive film element of the invention.

導電薄膜元件前驅體基本上由基板之各支撐側上之一個必需層組成,該必需層為安置在透明基板上之非彩色親水性感光層。此必需層可安置在透明基板之僅一個支撐側上,但在許多雙工實施例中,其安置在透明基板之第一及相對第二支撐側兩者上。下文所描述之親水性外塗層為視情況選用的但在許多實施例中為高度希望的,且該等親水性外塗層直接安置在非彩色親水性感光層上。此等層可安置在透明基板之僅一個支撐側上,或其可以相同順序安置在透明基板之第一支撐及相對第二支撐側兩者上。其他視情況選用之層亦可存在於任一或兩個支撐側上,如下文所描述。 The conductive thin film element precursor consists essentially of a necessary layer on each of the support sides of the substrate, which is an achromatic hydrophilic photosensitive layer disposed on the transparent substrate. This necessary layer can be disposed on only one of the support sides of the transparent substrate, but in many duplex embodiments it is disposed on both the first and opposite second support sides of the transparent substrate. The hydrophilic overcoats described below are optionally selected but are highly desirable in many embodiments, and the hydrophilic overcoats are disposed directly on the achromatic hydrophilic photosensitive layer. The layers may be disposed on only one of the support sides of the transparent substrate, or they may be disposed in the same order on both the first support and the opposite second support side of the transparent substrate. Other layers, optionally selected, may also be present on either or both of the support sides, as described below.

透明基板:Transparent substrate:

透明基板之選擇通常視所得導電薄膜元件之預期效用而定。其可為剛性或可撓性的,且如上文所描述通常為透明的。舉例而言,基板可為透明之可撓性基板,其如上文所描述使用標準分光光度計及程序在電磁波譜之所指示可見區上量測之綜合透射率為至少80%且通常至少95%。 The choice of transparent substrate will generally depend on the intended utility of the resulting conductive film element. It can be rigid or flexible and is generally transparent as described above. For example, the substrate can be a transparent flexible substrate that has a combined transmittance measured on the visible region indicated by the electromagnetic spectrum using a standard spectrophotometer and program as described above, at least 80% and typically at least 95% .

適合透明基板包括但不限於玻璃、玻璃強化環氧樹脂層合物、纖維素三乙酸酯或另一種纖維素酯、丙烯酸酯、聚碳酸酯、經黏著劑塗佈之聚合物基板、聚合物基板(諸如聚酯薄膜)及複合材料。適用作聚合物基板之聚合物包括但不限於聚乙烯、聚酯(諸如聚對苯二甲酸乙二醇酯(PET)及聚萘二甲酸乙二醇酯(PEN))、聚丙烯、聚乙酸乙烯 酯、聚胺基甲酸酯、聚醯胺、聚醯亞胺、聚碸及其混合物。 Suitable transparent substrates include, but are not limited to, glass, glass reinforced epoxy laminate, cellulose triacetate or another cellulose ester, acrylate, polycarbonate, adhesive coated polymer substrate, polymer Substrates (such as polyester film) and composite materials. Polymers suitable for use as polymer substrates include, but are not limited to, polyethylene, polyesters (such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN)), polypropylene, polyacetic acid Ethylene Esters, polyurethanes, polyamines, polyimines, polybenzazoles, and mixtures thereof.

聚合基板亦可包含兩個或兩個以上具有相同或不同聚合組合物之層,以便複合基板(或層壓物)具有相同或不同層折射性質。透明基板可在任一或兩個支撐側上經處理以改良銀鹽乳液或分散液與基板之一或兩個支撐側之黏著性。舉例而言,透明基板可在一或兩個支撐側上塗佈有聚合物黏著劑層,或其可經化學處理或經歷電暈處理。 The polymeric substrate may also comprise two or more layers having the same or different polymeric compositions such that the composite substrate (or laminate) has the same or different layer refractive properties. The transparent substrate can be treated on either or both of the support sides to improve the adhesion of the silver salt emulsion or dispersion to one or both of the support sides of the substrate. For example, the transparent substrate can be coated with a layer of polymeric adhesive on one or both of the support sides, or it can be chemically treated or subjected to corona treatment.

雙向定向之薄片,雖然描述為具有至少一個層,但亦可具備可用以改變雙向定向之薄片之光學或其他性質的額外層。該等層可含有色調、抗靜電或導電材料或滑爽劑。必要時可用多達10個層進行雙軸定向擠壓以實現一些具體所要性質。 Bidirectionally oriented sheets, although described as having at least one layer, may also be provided with additional layers that may be used to alter the optical or other properties of the bidirectionally oriented sheets. The layers may contain a hue, an antistatic or electrically conductive material or a slip agent. If necessary, up to 10 layers can be used for biaxially oriented extrusion to achieve some specific properties.

特別適用於製造可撓性電子裝置或觸控螢幕組件之透明基板為可撓性的,該特徵有助於快速卷軸式塗覆。Estar®聚(對苯二甲酸乙二酯)薄膜及纖維素三乙酸酯薄膜為特別適用於製造用於本發明之可撓性透明基板之材料。 A transparent substrate that is particularly suitable for use in the manufacture of flexible electronic devices or touch screen assemblies is flexible, which facilitates rapid roll coating. Estar ® Poly manufacture of flexible material of the transparent substrate used in the present invention (ethylene terephthalate) film and a cellulose triacetate film is particularly suitable.

透明基板可與已併入至可撓性顯示裝置中之支撐物或薄膜相同,此意指本文中描述之必需層塗覆至顯示裝置內之透明基板材料且根據所要圖案原位成像,且隨後原位加工。 The transparent substrate can be the same as the support or film that has been incorporated into the flexible display device, which means that the necessary layers described herein are applied to the transparent substrate material within the display device and imaged in situ according to the desired pattern, and subsequently In situ processing.

在利用離散透明基板(換言之,透明基板未曾併入至可撓性顯示裝置中)時,在其一或兩個支撐側上提供層(來自調配物)。若不同圖案(或柵格)打算用於各支撐側,則可提供包含濾光染料之基板或視情況選用之介入濾光(或防光暈)層以防止曝光自一側達至另一側。或者,鹵化銀乳液可經不同地敏化以用於透明基板之相對支撐側上之相對非彩色親水性感光層。 When a discrete transparent substrate (in other words, a transparent substrate has not been incorporated into a flexible display device) is utilized, a layer (from a formulation) is provided on one or both of its support sides. If different patterns (or grids) are intended for each support side, a substrate containing a filter dye or optionally an intervening filter (or anti-halation) layer may be provided to prevent exposure from one side to the other. . Alternatively, the silver halide emulsion can be sensitized differently for the relatively achromatic hydrophilic photosensitive layer on the opposite support side of the transparent substrate.

用於導電薄膜元件前驅體中之透明基板可具有至少20μm且至多且包括300μm或典型地至少75μm且至多且包括200μm之厚度。必要時抗氧化劑、增亮劑、抗靜電或導電劑、塑化劑及其他已知添加劑可 以對於熟習此項技術者顯而易見之量併入至透明基板中。 The transparent substrate used in the conductive film element precursor may have a thickness of at least 20 μm and up to and including 300 μm or typically at least 75 μm and up to and including 200 μm. Antioxidants, brighteners, antistatic or conductive agents, plasticizers and other known additives if necessary It is incorporated into a transparent substrate in amounts that are apparent to those skilled in the art.

非彩色親水性感光層:Achromatic hydrophilic light layer:

此等層中之必需鹵化銀包含一或多種鹵化銀之銀陽離子,其可在以成像方式曝光各非彩色親水性感光層後根據所要圖案轉化為銀金屬粒子。潛像隨後可使用已知銀顯像程序及化學物質(下文描述)顯像成銀金屬圖像。鹵化銀(或鹵化銀組合)為感光性的,意指UV至可見光之輻射(例如至少200nm且至多且包括750nm輻射)通常用以將銀陽離子轉化為潛像中之銀金屬粒子。在一些實施例中,鹵化銀與熱敏銀鹽(諸如山崳酸銀)組合存在,且非彩色感光性親水性層可為感光性的且熱敏的(對諸如紅外輻射之成像熱能靈敏)。 The necessary silver halide in such layers comprises one or more silver halide silver cations which can be converted to silver metal particles according to the desired pattern after imagewise exposure of each achromatic hydrophilic photosensitive layer. The latent image can then be imaged into a silver metal image using known silver imaging procedures and chemicals (described below). Silver halide (or silver halide combination) is photosensitive, meaning that UV to visible radiation (eg, at least 200 nm and up to and including 750 nm radiation) is typically used to convert silver cations into silver metal particles in a latent image. In some embodiments, silver halide is present in combination with a thermosensitive silver salt such as silver behenate, and the achromatic photosensitive hydrophilic layer can be photosensitive and heat sensitive (sensitive to imaging heat such as infrared radiation) .

適用感光性鹵化銀可為例如氯化銀、溴化銀、氯溴碘化銀、溴氯碘化銀、氯溴化銀、溴氯化銀或溴碘化銀,其以個別組合物(或乳液)形式製備。各種鹵化物在鹵化銀命名中按鹵化物量降序列出。另外,個別鹵化銀乳液可製備且混合以形成用於基板之相同或不同支撐側上之鹵化銀乳液混合物。一般而言,適用鹵化銀可包含至多且包括100mol%之氯化物,或至多且包括100mol%之溴化物,及至多且包括5mol%碘化物,均以總銀計。 Suitable photosensitive silver halides can be, for example, silver chloride, silver bromide, silver chlorobromide iodide, silver bromide iodide, silver chlorobromide, silver bromochloride or silver iodobromide, which are prepared in the form of individual compositions (or emulsions). The various halides are listed in the silver halide nomenclature as a percentage of halide. Additionally, individual silver halide emulsions can be prepared and mixed to form a silver halide emulsion mixture for the same or different support sides of the substrate. In general, suitable silver halides can comprise up to and including 100 mole percent chloride, or up to and including 100 mole percent bromide, and up to and including 5 mole percent iodide, all based on total silver.

用於各非彩色親水性感光層中之鹵化銀顆粒通常可具有至少30nm且至多且包括300nm、或更可能至少50nm且至多且包括200nm之ESD。 The silver halide grains used in each of the achromatic hydrophilic photosensitive layers may generally have an ESD of at least 30 nm and up to and including 300 nm, or more preferably at least 50 nm and up to and including 200 nm.

各非彩色親水性感光層中之鹵化銀中之總銀覆蓋率可為至少2500mg Ag/m2且典型地至少3500mg Ag/m2且至多任何量但通常小於5000mg Ag/m2、例如至多且包括4900mg Ag/m2。必要時可使用更高銀覆蓋率。 The total silver coverage in the silver halide in each of the achromatic hydrophilic photosensitive layers can be at least 2500 mg Ag/m 2 and typically at least 3500 mg Ag/m 2 and at most any amount but typically less than 5000 mg Ag/m 2 , for example at most Includes 4900 mg Ag/m 2 . Use higher silver coverage if necessary.

各非彩色親水性感光層之乾燥厚度通常可為至少0.5μm且至多且包括12μm,且尤其至少0.5μm且至多且包括7μm。 The dry thickness of each achromatic hydrophilic photosensitive layer can generally be at least 0.5 μm and up to and including 12 μm, and especially at least 0.5 μm and up to and including 7 μm.

最後乾燥非彩色親水性感光層可由一或多個經個別塗佈之非彩色親水性感光性子層組成,該等子層可使用相同或不同鹵化銀乳液調配物塗覆。各子層可由相同或不同鹵化銀、親水性黏合劑或膠體附加物組成。子層可具有相同或不同量之銀含量。 The final dried achromatic hydrophilic photosensitive layer can be comprised of one or more individually coated achromatic hydrophilic photosensitive sub-layers that can be coated with the same or different silver halide emulsion formulations. Each sublayer may be composed of the same or different silver halides, hydrophilic binders or colloidal additions. The sublayers may have the same or different amounts of silver content.

用於第一非彩色親水性感光層中之感光性鹵化銀可與用於相對第二支撐側非彩色親水性感光層中之感光性鹵化銀相同或不同。 The photosensitive silver halide used in the first achromatic hydrophilic photosensitive layer may be the same as or different from the photosensitive silver halide used in the second support side achromatic hydrophilic photosensitive layer.

感光性鹵化銀顆粒(及如下文所描述之與其相關之任何附加物)分散(通常均勻地)於一或多種適合親水性黏合劑或膠體中以形成親水性鹵化銀乳液。該等親水性黏合劑或膠體之實例包括但不限於明膠及明膠衍生物、聚乙烯醇(PVA)、聚(乙烯吡咯啶酮)(PVP)、酪蛋白及其混合物。適合親水性膠體及乙烯聚合物及共聚物亦描述於由Kenneth Mason Publications,Emsworth,Hants,PO10 7DQ,UK公開之Research Disclosure之IX部分項目36544,1994年9月中。 The photosensitive silver halide grains (and any addenda associated therewith as described below) are dispersed (generally uniformly) in one or more suitable hydrophilic binders or colloids to form a hydrophilic silver halide emulsion. Examples of such hydrophilic binders or colloids include, but are not limited to, gelatin and gelatin derivatives, polyvinyl alcohol (PVA), poly(vinylpyrrolidone) (PVP), casein, and mixtures thereof. Suitable hydrophilic colloids and ethylene polymers and copolymers are also described in Research Disclosure , Part IX, Project 36544, published by Kenneth Mason Publications, Emsworth, Hants, PO 10 7DQ, UK, September 1994.

各非彩色親水性感光層中親水性黏合劑或膠體之量可適於所要之具體乾燥厚度以及併入之鹵化銀之量。其亦可適於滿足所要分散性、膨脹及與透明基板之層黏著性。一般而言,一或多種親水性黏合劑或膠體可以乳液調配物或乾燥層中之總固體計以至少10重量%且至多且包括95重量%之量存在。 The amount of hydrophilic binder or colloid in each of the achromatic hydrophilic optical layers can be adapted to the particular dry thickness desired and the amount of silver halide incorporated. It may also be adapted to satisfy the desired dispersibility, expansion, and adhesion to the layer of the transparent substrate. In general, one or more hydrophilic binders or colloids may be present in an amount of at least 10% by weight and up to and including 95% by weight, based on the total solids in the emulsion formulation or dry layer.

一些適用非彩色親水性感光層組合物具有相對高銀離子/低親水性黏合劑(例如,明膠)重量比。舉例而言,銀離子(及最終銀金屬)與親水性黏合劑或膠體(諸如明膠(或其衍生物))之特別適用之重量比可為至少0.1:1,或甚至至少1.5:1且至多且包括10:1。銀離子與親水性黏合劑或膠體之特別適用之重量比可為至少2:1且至多且包括5:1。必要時出於既定目的可使用不同比率。 Some suitable achromatic hydrophilic photosensitive layer compositions have a relatively high silver ion/low hydrophilic binder (e.g., gelatin) weight ratio. For example, a particularly suitable weight ratio of silver ions (and final silver metal) to a hydrophilic binder or colloid such as gelatin (or a derivative thereof) can be at least 0.1:1, or even at least 1.5:1 and at most And includes 10:1. A particularly suitable weight ratio of silver ions to hydrophilic binders or colloids can be at least 2:1 and up to and including 5:1. Different ratios can be used for the intended purpose if necessary.

親水性黏合劑或膠體可與一或多種經設計以硬化具體親水性黏合劑(諸如明膠)之硬化劑組合使用。特別適用於明膠及明膠衍生物之硬 化劑包括但不限於非聚合乙烯基-碸,諸如雙(乙烯基-碸基)甲烷(BVSM)、雙(乙烯基-碸基甲基)醚(BVSME)及1,2-雙(乙烯基-碸基乙醯胺)乙烷(BVSAE)。必要時可使用硬化劑之混合物。硬化劑可以對於熟習此項技術者顯而易見之任何適合量併入至各非彩色親水性感光層中。 The hydrophilic binder or colloid can be used in combination with one or more hardeners designed to harden a particular hydrophilic binder, such as gelatin. Particularly suitable for hard gelatin and gelatin derivatives Agents include, but are not limited to, non-polymeric vinyl-oximes such as bis(vinyl-indenyl)methane (BVSM), bis(vinyl-mercaptomethyl)ether (BVSME), and 1,2-bis(vinyl) - mercaptoacetamide) ethane (BVSAE). A mixture of hardeners may be used if necessary. The hardener can be incorporated into each achromatic hydrophilic photosensitive layer in any suitable amount as would be apparent to those skilled in the art.

一般而言,各非彩色親水性感光層可具有如藉由對元件橫截面進行光學顯微法所測定至少150%之膨脹率。膨脹可藉由在感光性鹵化銀乳液層內或在各種加工溶液(下文描述)內用適當量之硬化劑進行之硬化量來控制。 In general, each achromatic hydrophilic photosensitive layer can have an expansion ratio of at least 150% as determined by optical microscopy of the cross-section of the element. The expansion can be controlled by the amount of hardening carried out in a layer of photosensitive silver halide emulsion or in various processing solutions (described below) with an appropriate amount of hardener.

必要時,可使上文描述之適用鹵化銀對任何適合波長之曝光輻射敏化。可使用有機敏化染料,但可有利的為在不使用可見光敏化染料之情況下使銀鹽對電磁波譜之UV部分敏化以避免在希望具有高透明度之導電物品中有不合需要之染料污點。或者,可在無超出其固有光譜敏感性之光譜敏化之情況下使用鹵化銀。 If appropriate, the applicable silver halide described above can be sensitized to exposure radiation of any suitable wavelength. An organic sensitizing dye can be used, but it can be advantageous to sensitize the silver salt to the UV portion of the electromagnetic spectrum without using a visible light sensitizing dye to avoid undesirable dye stains in conductive articles where high transparency is desired. . Alternatively, silver halide can be used without spectral sensitization beyond its inherent spectral sensitivity.

適用於與鹵化銀一起包括在內之附加物(包括化學及光譜敏化劑、濾光染料、有機溶劑、增稠劑、摻雜劑、乳化劑、界面活性劑、穩定劑、硬化劑及防霧劑)之非限制性實例描述於Research Disclosure項目36544,1994年9月及其中標識之許多公開案中。該等材料在此項技術中為熟知的,且對於熟練之業內人士將不難調配或使用該等組分以用於本文中描述之目的。一些適用銀鹽乳液描述於例如美國專利7,351,523(Grzeskowiak)、5,589,318及5,512,415(兩者均頒予Dale等人)中。 Applicable to addenda included with silver halide (including chemical and spectral sensitizers, filter dyes, organic solvents, thickeners, dopants, emulsifiers, surfactants, stabilizers, hardeners and defenses) Non-limiting examples of aerosols are described in Research Disclosure Project 36544, September 1994 and many of the publications identified therein. Such materials are well known in the art and will be readily adapted or used by those skilled in the art for the purposes described herein. Some suitable silver salt emulsions are described, for example, in U.S. Patent Nos. 7,351,523 (Grzeskowiak), 5,589,318, and 5,512,415 (both to Dale et al.).

含有可還原為銀金屬粒子之鹵化銀顆粒之適用鹵化銀乳液可藉由任何適合顆粒生長方法製備,例如藉由使用經設計以維持生長反應器中之銀離子濃度之反饋系統、使用對硝酸銀及鹽溶液之平衡雙重觀測。已知摻雜劑可自沈澱之起始至結束均勻地引入或可結構化至鹵化 銀顆粒內之區域或條帶中。適用摻雜劑包括但不限於鋨摻雜劑、釕摻雜劑、鐵摻雜劑、銠摻雜劑、銥摻雜劑及氰基釕摻雜劑。鋨與銥摻雜劑之組合,諸如亞硝醯基五氯化鋨與銥摻雜劑之組合為適用的。該等錯合物可按美國專利5,385,817(Bell)中描述之方式可替代地用作顆粒表面改性劑。化學敏化可藉由已知鹵化銀化學敏化方法中之任一者進行,例如使用單獨之或與金錯合物組合之硫代硫酸鹽或另一種不穩定之硫化合物。 Suitable silver halide emulsions containing silver halide grains that can be reduced to silver metal particles can be prepared by any suitable particle growth method, for example by using a feedback system designed to maintain the concentration of silver ions in the growth reactor, using silver nitrate and Double observation of the balance of the salt solution. It is known that dopants can be uniformly introduced from the beginning to the end of the precipitation or can be structured to halogenation. In the area or band within the silver particles. Suitable dopants include, but are not limited to, antimony dopants, antimony dopants, iron dopants, antimony dopants, antimony dopants, and cyanoquinone dopants. Combinations of ruthenium and osmium dopants, such as combinations of nitrosonium ruthenium pentachloride and ruthenium dopants, are suitable. These complexes can alternatively be used as particle surface modifiers in the manner described in U.S. Patent 5,385,817 (Bell). Chemical sensitization can be carried out by any of the known silver halide chemical sensitization methods, for example, using a thiosulfate alone or in combination with a gold complex or another unstable sulfur compound.

適用鹵化銀顆粒可為圓形立方、立方圓形、八面體、圓形八面體、多晶型、片狀或薄片狀乳液顆粒。該等鹵化銀顆粒可為規則非雙晶的、規則雙晶的或不規則雙晶的,具有立方或八面體面。在一個實施例中,鹵化銀顆粒可為圓形立方,邊緣長度小於0.5μm且為至少0.05μm。 Suitable silver halide grains may be circular cubic, cubic circular, octahedral, circular octahedron, polycrystalline, flaked or flaked emulsion particles. The silver halide grains may be regular non-dual, regular twin or irregular twin, having a cubic or octahedral surface. In one embodiment, the silver halide grains may be circular cubes having an edge length of less than 0.5 [mu]m and at least 0.05 [mu]m.

適當時可添加防霧劑及穩定劑以向鹵化銀乳液給出所要靈敏度。可使用之防霧劑包括例如氮雜茚(諸如四氮雜茚)、四唑、苯并三唑、咪唑及苯并咪唑。 Antifogging agents and stabilizers may be added as appropriate to give the desired sensitivity to the silver halide emulsion. Antifogging agents which may be used include, for example, azaindoles such as tetraazaindene, tetrazole, benzotriazole, imidazole and benzimidazole.

必需鹵化銀顆粒及親水性黏合劑或膠體及視情況選用之附加物可使用適合乳液溶劑(包括水及水可混溶之有機溶劑)以鹵化銀乳液形式調配及塗佈。舉例而言,適用於製造鹵化銀乳液或塗層調配物之溶劑可為水;醇,諸如甲醇;酮,諸如丙酮;醯胺,諸如甲醯胺;亞碸,諸如二甲亞碸;酯,諸如乙酸乙酯;醚;液體聚乙烯醇;液體或低分子量聚(乙烯醇);或此等溶劑之組合。一或多種用以製備鹵化銀乳液之溶劑之量可為總調配物重量之至少30重量%且至多且包括50重量%。因此,該等塗層調配物可使用此項技術中已知之攝影乳液製造程序中之任一者製備。 The necessary silver halide grains and hydrophilic binders or colloids and optionally additions may be formulated and coated in the form of a silver halide emulsion using a suitable emulsion solvent (including water and water miscible organic solvents). For example, a solvent suitable for use in the manufacture of a silver halide emulsion or coating formulation can be water; an alcohol such as methanol; a ketone such as acetone; a guanamine such as formamide; an anthracene such as dimethyl hydrazine; Such as ethyl acetate; ether; liquid polyvinyl alcohol; liquid or low molecular weight poly(vinyl alcohol); or a combination of such solvents. The amount of one or more solvents used to prepare the silver halide emulsion may be at least 30% by weight and up to and including 50% by weight of the total formulation. Accordingly, such coating formulations can be prepared using any of the photographic emulsion manufacturing procedures known in the art.

親水性外塗層Hydrophilic outer coating

雖然非彩色親水性感光層可為前驅體中之最外層,但在許多實施 例中,親水性外塗層可在透明基板之任一或兩個支撐側上安置在各非彩色親水性感光層上方。此親水性外塗層可為導電薄膜元件前驅體中之最外層(換言之,在透明基板之任一或兩個支撐側上不存在故意放置在其上方之層)。因此,通常若透明基板之兩個支撐側用以提供導電銀圖案,則親水性外塗層可存在於透明基板之兩個支撐側上。因此,第一親水性外塗層可安置在第一非彩色親水性感光層上方,且第二親水性外塗層可在基板之相對支撐側上安置在第二非彩色第二親水性感光層上方。 Although the achromatic hydrophilic photosensitive layer can be the outermost layer of the precursor, in many implementations In one example, a hydrophilic outer coating can be placed over each of the achromatic hydrophilic photosensitive layers on either or both of the support sides of the transparent substrate. The hydrophilic outer coating layer may be the outermost layer of the conductive film element precursor (in other words, there is no layer intentionally placed thereon on either or both of the support sides of the transparent substrate). Therefore, generally, if the two supporting sides of the transparent substrate are used to provide a conductive silver pattern, the hydrophilic overcoat layer may be present on the two supporting sides of the transparent substrate. Therefore, the first hydrophilic outer coating layer may be disposed above the first achromatic hydrophilic photosensitive layer, and the second hydrophilic outer coating layer may be disposed on the second achromatic second hydrophilic photosensitive layer on the opposite supporting side of the substrate. Above.

在大多數實施例中,各親水性外塗層可直接安置在各非彩色親水性感光層上,意指在透明基板之該等支撐側上不存在介入層。此等親水性外塗層之化學組成及乾燥厚度可相同或不同,但在大多數實施例中,其在透明基板之兩個支撐側上具有基本上相同之化學組成及乾燥厚度。 In most embodiments, each hydrophilic overcoat layer can be disposed directly on each of the achromatic hydrophilic photosensitive layers, meaning that no intervening layers are present on the support sides of the transparent substrate. The chemical composition and dry thickness of the hydrophilic outer coatings may be the same or different, but in most embodiments they have substantially the same chemical composition and dry thickness on both support sides of the transparent substrate.

在一些實施例中,各親水性外塗層(第一或第二或兩者)可包含一或多種相同或不同量之鹵化銀以便在曝光及加工之後提供至少5mg Ag/m2且至多且包括150mg Ag/m2、或至少5mg Ag/m2且至多且包括100mg Ag/m2之量之銀金屬粒子。 In some embodiments, each hydrophilic overcoat (first or second or both) may comprise one or more silver halides of the same or different amounts to provide at least 5 mg Ag/m 2 and at most after exposure and processing. Silver metal particles are included in an amount of 150 mg Ag/m 2 , or at least 5 mg Ag/m 2 and up to and including 100 mg Ag/m 2 .

此鹵化銀可分散(通常均勻地)於各親水性外塗層中之一或多種親水性黏合劑或膠體內,該等親水性黏合劑或膠體包括上文對於非彩色親水性感光層所述之彼等。在許多實施例中,相同親水性黏合劑或膠體可用於導電薄膜元件前驅體之所有層中。然而,不同親水性黏合劑或膠體可用於各種層中且支撐基板之任一或兩個支撐側上。各親水性外塗層中之一或多種親水性黏合劑或膠體之量可相同或不同,且以總親水性外塗層乾重計通常為至少50重量%且至多且包括97重量%。 The silver halide may be dispersed (generally uniformly) in one or more hydrophilic binders or gels in each of the hydrophilic outer coatings, including the hydrophilic coloring layer described above for the achromatic hydrophilic layer They are the same. In many embodiments, the same hydrophilic adhesive or colloid can be used in all layers of the conductive film element precursor. However, different hydrophilic binders or gels can be used in the various layers and on either or both of the support sides of the support substrate. The amount of one or more hydrophilic binders or colloids in each hydrophilic overcoat layer may be the same or different and is typically at least 50% by weight and up to and including 97% by weight, based on the total hydrophilic overcoat dry weight.

親水性外塗層可包括至少5mg/m2且至多且包括100mg/m2之量之一或多種輻射吸收劑,諸如UV輻射吸收劑。適用UV輻射吸收劑可 「經固定」以便其不容易自親水性外塗層中擴散。 The hydrophilic overcoat layer can include one or more radiation absorbers, such as a UV radiation absorber, in an amount of at least 5 mg/m 2 and up to and including 100 mg/m 2 . Suitable UV radiation absorbers can be "fixed" so that they do not readily diffuse from the hydrophilic outer coating.

各親水性外塗層亦可包含一或多種用於親水性黏合劑或膠體(諸如明膠或明膠衍生物)之硬化劑。適用硬化劑在上文描述。 Each hydrophilic overcoat layer may also comprise one or more hardeners for hydrophilic binders or colloids such as gelatin or gelatin derivatives. Suitable hardeners are described above.

亦可能的為,各親水性外塗層中之鹵化銀與上方安置有其之各非彩色親水性感光層中之鹵化銀相同。 It is also possible that the silver halide in each of the hydrophilic outer coatings is the same as the silver halide in each of the achromatic hydrophilic photosensitive layers on which the upper surface is disposed.

此外,各親水性外塗層中之一或多種鹵化銀可具有至少30nm且至多且包括1000nm、或至少30nm且至多且包括300nm之顆粒ESD。 Furthermore, one or more of the silver halides in each hydrophilic overcoat layer can have a particle ESD of at least 30 nm and up to and including 1000 nm, or at least 30 nm and up to and including 300 nm.

在一些實施例中,各親水性外塗層中之一或多種鹵化銀具有大於上方安置有其之非彩色親水性感光層中之鹵化銀的顆粒ESD之顆粒ESD。 In some embodiments, one or more of the silver halides in each hydrophilic overcoat layer has a particle ESD that is greater than the particle ESD of the silver halide in the achromatic hydrophilic photosensitive layer on which it is disposed.

各親水性外塗層之乾燥厚度可為至少100nm且至多且包括800nm,或更特別地至少300nm且至多且包括500nm。在許多實施例中,親水性外塗層中之顆粒ESD與乾燥厚度比可為0.25:1至且包括1.75:1或更可能0.5:1至且包括1.25:1。 Each hydrophilic overcoat layer may have a dry thickness of at least 100 nm and up to and including 800 nm, or more specifically at least 300 nm and up to and including 500 nm. In many embodiments, the particle ESD to dry thickness ratio in the hydrophilic overcoat layer can be from 0.25:1 to and including 1.75:1 or more likely from 0.5:1 to and including 1.25:1.

在各種實施例中,各親水性外塗層中之鹵化銀可包含至多100mol%溴化物或至多100mol%氯化物,及至多且包括3mol%碘化物,均為以總銀含量計之莫耳量。 In various embodiments, the silver halide in each hydrophilic overcoat layer may comprise up to 100 mol% bromide or up to 100 mol% chloride, and up to and including 3 mol% iodide, all in terms of total silver content. .

在其他實施例中,各親水性外塗層中之鹵化銀可包含比上方安置有其之非彩色親水性感光層中的鹵化銀更多之氯化物。此關係在該等「雙工」導電薄膜元件前驅體中之基板之兩個支撐側上可相同或不同。 In other embodiments, the silver halide in each hydrophilic overcoat layer may comprise more chloride than the silver halide in the achromatic hydrophilic photosensitive layer on which it is disposed. This relationship may be the same or different on the two support sides of the substrate in the precursor of the "duplex" conductive film element.

在適用實施例中,各親水性外塗層中之鹵化銀可包含以總銀含量計至少80mol%溴化物,且剩餘部分為氯化物或碘化物,且上方安置有其之非彩色親水性感光層中之鹵化銀可具有至少80mol%溴化物,且剩餘部分為碘化物或氯化物,均以總銀含量計。 In a suitable embodiment, the silver halide in each hydrophilic overcoat layer may comprise at least 80 mol% bromide based on the total silver content, and the remainder being chloride or iodide, and the achromatic hydrophilic light disposed thereon is disposed thereon. The silver halide in the layer may have at least 80 mol% bromide and the remainder being iodide or chloride, all based on the total silver content.

本發明之導電薄膜元件前驅體中亦適用的為,各親水性外塗層中 之鹵化銀與上方安置有其之各非彩色親水性感光層中的鹵化銀在攝影速度方面為匹配的。當如以μJ/m2為單位表示,親水性外塗層中之鹵化銀乳液之曝光靈敏度可為用以提供導電銀圖案之底層非彩色親水性感光層中之鹵化銀乳液的最優靈敏度之至少10%且至多且包括200%時,此得以最佳實現。 It is also applicable in the precursor of the electroconductive thin film element of the present invention that the silver halide in each hydrophilic overcoat layer and the silver halide in each of the achromatic hydrophilic photosensitive layers on which the upper surface layer is disposed are matched in terms of photographic speed. When expressed in units of μJ/m 2 , the exposure sensitivity of the silver halide emulsion in the hydrophilic overcoat layer may be the optimum sensitivity of the silver halide emulsion in the underlying achromatic hydrophilic photosensitive layer for providing a conductive silver pattern. This is best achieved at least 10% and up to and including 200%.

額外層:Additional layer:

在透明基板之一或兩個支撐側上除上文描述之層及組分之外,用於實踐本發明之導電薄膜元件前驅體亦可包括並非必需但可提供一些額外性質或益處之其他層,諸如輻射吸收濾光層、黏著層及攝影技術中已知之其他層。輻射吸收濾光層亦可稱為「防光暈」層,其可定位於透明基板之各支撐側上之必需層之間。舉例而言,各支撐側可具有直接安置在其上且直接安置在非彩色親水性感光層下面之輻射吸收濾光層。 In addition to the layers and components described above on one or both of the support sides of the transparent substrate, the conductive film element precursors used in the practice of the present invention may also include other layers that are not required but may provide some additional properties or benefits. Such as radiation absorbing filter layers, adhesive layers and other layers known in the art of photography. The radiation absorbing filter layer may also be referred to as an "antihalation" layer that can be positioned between the necessary layers on each of the support sides of the transparent substrate. For example, each support side can have a radiation absorbing filter layer disposed directly thereon and disposed directly beneath the achromatic hydrophilic photosensitive layer.

該等輻射吸收濾光層可包括一或多種在電磁波譜之UV、紅色、綠色或藍色區或其任何組合中吸收之濾光染料,且可在透明基板之一或兩個支撐側上定位於基板與非彩色親水性感光層之間。 The radiation absorbing filter layer may comprise one or more filter dyes that are absorbed in the UV, red, green or blue regions of the electromagnetic spectrum, or any combination thereof, and may be positioned on one or both of the support sides of the transparent substrate. Between the substrate and the achromatic hydrophilic photosensitive layer.

舉例而言,導電薄膜元件前驅體可在透明基板之第一支撐側與第一非彩色親水性感光層之間包含UV輻射吸收層。 For example, the conductive thin film element precursor may include a UV radiation absorbing layer between the first support side of the transparent substrate and the first achromatic hydrophilic photosensitive layer.

雙工導電薄膜元件前驅體進一步在透明基板之相對第二支撐側上包含第二非彩色親水性感光層,及安置在第二非彩色親水性感光層上方之第二親水性外塗層。輻射(例如,UV)吸收濾光層可安置在透明基板之相對第二支撐側與第二非彩色親水性感光層之間,該輻射吸收層可與透明基板之第一支撐側上之輻射吸收濾光層相同或不同。 The duplex conductive film element precursor further includes a second achromatic hydrophilic photosensitive layer on the opposite second support side of the transparent substrate, and a second hydrophilic overcoat layer disposed over the second achromatic hydrophilic photosensitive layer. A radiation (eg, UV) absorbing filter layer can be disposed between the opposite second support side of the transparent substrate and the second achromatic hydrophilic photosensitive layer, the radiation absorbing layer being permeable to radiation absorption on the first support side of the transparent substrate The filter layers are the same or different.

在許多雙工實施例中,第二非彩色親水性感光層及第二親水性外塗層分別具有與第一非彩色親水性感光層及第一親水性外塗層相同之組成。 In many duplex embodiments, the second achromatic hydrophilic photosensitive layer and the second hydrophilic outer coating respectively have the same composition as the first achromatic hydrophilic photosensitive layer and the first hydrophilic outer coating.

因此,在一些實施例中,導電薄膜元件前驅體可在透明基板之相對第二支撐側上進一步包含第二非彩色親水性感光層,及視情況安置在第二非彩色親水性感光層上方之第二親水性外塗層。 Therefore, in some embodiments, the conductive thin film element precursor may further include a second achromatic hydrophilic photosensitive layer on the opposite second supporting side of the transparent substrate, and optionally disposed above the second achromatic hydrophilic photosensitive layer. A second hydrophilic outer coating.

舉例而言,第二非彩色親水性感光層及第二親水性外塗層可分別具有與第一非彩色親水性感光層及第一親水性外塗層相同之組成。 For example, the second achromatic hydrophilic photosensitive layer and the second hydrophilic outer coating may have the same composition as the first achromatic hydrophilic photosensitive layer and the first hydrophilic outer coating, respectively.

在其他實施例中,如以μJ/m2為單位表示,第一親水性外塗層中之鹵化銀乳液之曝光靈敏度可為第一非彩色親水性感光層中之鹵化銀乳液之最優靈敏度的至少10%且至多且包括200%,且如以μJ/m2為單位表示,第二親水性外塗層中之鹵化銀乳液之曝光靈敏度可為第二非彩色親水性感光層中之鹵化銀乳液之最優靈敏度的至少10%且至多且包括200%。透明基板之相應側之最優靈敏度可相同或不同。 In other embodiments, the exposure sensitivity of the silver halide emulsion in the first hydrophilic overcoat layer may be the optimal sensitivity of the silver halide emulsion in the first achromatic hydrophilic photosensitive layer, as expressed in μJ/m 2 . At least 10% and up to and including 200%, and as expressed in μJ/m 2 , the exposure sensitivity of the silver halide emulsion in the second hydrophilic outer coating layer may be halogenated in the second achromatic hydrophilic photosensitive layer The optimal sensitivity of the silver emulsion is at least 10% and up to and including 200%. The optimal sensitivity of the respective sides of the transparent substrate can be the same or different.

製備導電薄膜元件前驅體Preparation of conductive film element precursor

各種層使用適當組分及塗層溶劑調配且使用已知塗佈程序塗覆至適合透明基板(如上文所描述)之一或兩個支撐側,該等塗佈程序包括攝影工業中常用之彼等(例如,珠塗、刮塗、簾式塗佈、噴塗及料斗式塗佈)。各層可在單通道程序或同時多層塗佈程序中塗覆至透明基板之各支撐側。 The various layers are formulated with the appropriate components and coating solvent and applied to one or both of the support sides of a suitable transparent substrate (as described above) using known coating procedures, including those commonly used in the photographic industry. Etc. (eg, bead coating, knife coating, curtain coating, spray coating, and hopper coating). The layers can be applied to the respective support sides of the transparent substrate in a single channel process or a simultaneous multilayer coating process.

提供導電薄膜元件Providing conductive film components

提供適用於本發明之方法之導電薄膜元件前驅體,且隨後使其成像曝光以在透明基板之任一或兩個支撐側上在非彩色親水性感光層中提供潛伏銀金屬圖像。成像曝光亦將存在於親水性外塗層中之任何鹵化銀還原為銀金屬顆粒。導電薄膜元件前驅體可即刻用於預期目的,或其可以捲筒或薄片形式儲存以供後來使用。舉例而言,前驅體可在製造期間捲起且儲存以用於卷軸式成像及加工過程,且隨後切成所要大小及形狀。 A conductive thin film element precursor suitable for use in the method of the present invention is provided and subsequently imagewise exposed to provide a latent silver metal image in the achromatic hydrophilic photosensitive layer on either or both of the support sides of the transparent substrate. Imagewise exposure also reduces any silver halide present in the hydrophilic overcoat to silver metal particles. The conductive film element precursor can be used immediately for the intended purpose, or it can be stored in the form of a roll or sheet for later use. For example, the precursor can be rolled up during storage and stored for use in roll-to-roll imaging and processing, and then cut to the desired size and shape.

更通常,各非彩色親水性感光層中之感光性鹵化銀可成像曝光於 來自此項技術中熟知之適合來源之適當光化輻射(UV至可見光輻射),且隨後如下文所描述進行顯像(銀離子還原為銀金屬粒子)。該曝光提供在第一非彩色親水性感光層中包含潛伏銀圖像以及在第二非彩色親水性感光層(若其存在於前驅體中)中包含潛伏銀圖像之成像曝光之前驅體。 More generally, the photosensitive silver halide in each of the achromatic hydrophilic photosensitive layers can be imagewise exposed to Appropriate actinic radiation (UV to visible radiation) from a suitable source well known in the art is used and subsequently developed as described below (silver ion reduction to silver metal particles). The exposure provides an imagewise exposure precursor comprising a latent silver image in the first achromatic hydrophilic photosensitive layer and a latent silver image in the second achromatic hydrophilic photosensitive layer (if present in the precursor).

在一些實施例中,曝光過程受控制以便用於透明基板之一個支撐側上之非彩色親水性感光層的任何曝光輻射不達至透明基板之相對第二支撐側上之任何非彩色親水性感光層。此結果可如例如美國專利申請案2011/0289771(Kuriki)中所描述以不同方式實現。特別適用的為在透明基板之兩側上包括輻射濾光染料層或防光暈層,該層配置於透明基板與各(第一及第二)非彩色親水性感光層之間,且曝光使用在導電薄膜元件前驅體處自透明基板之第一(或第二或兩個)支撐側導引之輻射進行。 In some embodiments, the exposure process is controlled such that any exposure radiation for the achromatic hydrophilic photosensitive layer on one of the support sides of the transparent substrate does not reach any achromatic hydrophilic light on the opposite second support side of the transparent substrate. Floor. This result can be achieved in different ways as described, for example, in U.S. Patent Application Serial No. 2011/0289771 (Kuriki). Particularly suitable for comprising a radiation filter dye layer or an antihalation layer on both sides of the transparent substrate, the layer being disposed between the transparent substrate and each of the (first and second) achromatic hydrophilic photosensitive layers, and used for exposure Radiation is conducted at the precursor of the conductive film element from the first (or second or both) support side of the transparent substrate.

用鹵化銀顯像溶液加工:Processing with silver halide imaging solution:

第一加工處理可使用pH為至少8且至多且包括13或更典型地至少10且至多且包括11之鹵化銀顯像溶液(形成銀金屬之黑白顯像劑)進行。pH可連同下文所描述之化合物一起使用已知鹼性試劑提供。 The first processing may be carried out using a silver halide imaging solution (black and silver imaging agent forming a silver metal) having a pH of at least 8 and up to and including 13 or typically at least 10 and up to and including 11. The pH can be provided using known alkaline agents along with the compounds described below.

此鹵化銀顯像溶液之第一必需組分為一或多種主要顯像劑,諸如氫醌或其衍生物或抗壞血酸或其衍生物。適用之氫醌或衍生物(亦稱為多羥基苯)包括但不限於氫醌、兒茶酚、連苯三酚、甲基氫醌、氯氫醌、氫醌單硫酸酯、1,2-萘二酚及1,4-萘二酚。適用之抗壞血酸及衍生物包括但不限於抗壞血酸、異抗壞血酸及其衍生物、抗壞血酸鈉及異抗壞血酸鈉。 The first essential component of the silver halide imaging solution is one or more primary imaging agents such as hydroquinone or a derivative thereof or ascorbic acid or a derivative thereof. Suitable hydroquinones or derivatives (also known as polyhydroxybenzenes) include, but are not limited to, hydroquinone, catechol, pyrogallol, methylhydroquinone, chlorinated hydroquinone, hydroquinone monosulfate, 1,2- Naphthalenediol and 1,4-naphthalenediol. Suitable ascorbic acids and derivatives include, but are not limited to, ascorbic acid, isoascorbic acid and its derivatives, sodium ascorbate and sodium erythorbate.

一或多種主要顯像劑可以至少0.01mol/l且至多且包括1mol/l、至少0.01mol/l且至多且包括0.15mol/l、或更典型地至少0.075mol/l且至多且包括0.14mol/l之總量存在於鹵化銀顯像溶液中。如上所 述,必要時可使用主要顯像劑之混合物,且在該等實施例中,此等濃度係指主要顯像劑之總量。 The one or more primary imaging agents may be at least 0.01 mol/l and up to and including 1 mol/l, at least 0.01 mol/l and up to and including 0.15 mol/l, or more typically at least 0.075 mol/l and up to and including 0.14 mol The total amount of /l is present in the silver halide imaging solution. As above As noted, a mixture of primary imaging agents can be used as necessary, and in such embodiments, such concentrations refer to the total amount of primary imaging agent.

鹵化銀顯像溶液亦包含一或多種催化顯像劑作為第二必需組分,且該等化合物為對胺基苯酚或其衍生物或菲尼酮(包括菲尼酮之衍生物)。該等催化顯像劑可以至少0.001mol/l且至多且包括0.1mol/l、至少0.001mol/l且至多且包括0.025mol/l、或典型地至少0.001且至多且包括0.002mol/l之總量存在於鹵化銀顯像溶液中。當使用此等化合物之混合物時,濃度係指催化顯像劑之總量。 The silver halide imaging solution also contains one or more catalytic developers as a second essential component, and the compounds are p-aminophenol or a derivative thereof or phenidone (including derivatives of phenidone). The catalytic developers may be at least 0.001 mol/l and up to and including 0.1 mol/l, at least 0.001 mol/l and up to and including 0.025 mol/l, or typically at least 0.001 and at most and including 0.002 mol/l. The amount is present in the silver halide imaging solution. When a mixture of such compounds is used, the concentration refers to the total amount of the catalytic developer.

與為主要銀離子顯像劑(還原劑)之主要顯像劑相比,需要催化顯像劑之存在以便尤其藉由減少或消除顯像誘導時間來增加顯像之動力學。 In contrast to the primary imaging agent which is the primary silver ion imaging agent (reducing agent), it is desirable to catalyze the presence of the imaging agent to increase the kinetics of imaging, especially by reducing or eliminating imaging induction time.

適用之對胺基苯酚包括但不限於對甲基胺基苯酚、對胺基苯酚、間氯對胺基苯酚、間甲基對胺基苯酚及對羥基苯基甘胺酸。適用之菲尼酮及衍生物包括但不限於經取代或未經取代之菲尼酮,諸如4,4-二甲基-3-吡唑啶酮(dimezone)及4-(羥基甲基)-4-甲基-1-苯基-3-吡唑啶酮(HMMP)。 Suitable p-aminophenols include, but are not limited to, p-methylaminophenol, p-aminophenol, m-chloro-p-aminophenol, m-methyl-aminophenol, and p-hydroxyphenylglycine. Suitable phenidone and derivatives include, but are not limited to, substituted or unsubstituted fenidone, such as 4,4-dimethyl-3-pyrazolone and 4-(hydroxymethyl)- 4-methyl-1-phenyl-3-pyrazolidinone (HMMP).

一般而言,一或多種催化顯像劑之濃度可小於一或多種主要顯像劑之濃度。更特定言之,一或多種主要顯像劑之總濃度可為一或多種催化顯像劑之總濃度之至少100倍。 In general, the concentration of one or more catalytic imaging agents can be less than the concentration of one or more primary imaging agents. More specifically, the total concentration of one or more primary imaging agents can be at least 100 times the total concentration of one or more catalytic imaging agents.

在許多實施例中,鹵化銀顯像溶液具有氫醌或其衍生物作為主要顯像劑,及菲尼酮作為催化顯像劑。 In many embodiments, the silver halide imaging solution has hydroquinone or a derivative thereof as a primary imaging agent, and phenidone as a catalytic imaging agent.

鹵化銀顯像溶液之重要視情況選用之組分包括但不限於一或多種鹼金屬亞硫酸鹽;及一或多種顯像抑制劑或限制劑,諸如鹼金屬鹵化物、經取代或未經取代之巰基四唑、一或多種苯并三唑、一或多種芳基或烷基二硫化物及一或多種芳基或烷基硫醇。可使用任何相同或不同類別之化合物之混合物。 Important components of the silver halide imaging solution include, but are not limited to, one or more alkali metal sulfites; and one or more imaging inhibitors or limiting agents, such as alkali metal halides, substituted or unsubstituted A fluorenyltetrazole, one or more benzotriazoles, one or more aryl or alkyl disulfides, and one or more aryl or alkyl thiols. Mixtures of any of the same or different classes of compounds can be used.

舉例而言,適用之鹼金屬亞硫酸鹽包括亞硫酸鈉、亞硫酸鉀及其混合物。鹼金屬亞硫酸鹽可以至少0.1mol/l且至多且包括1mol/l或典型地至少0.4mol/l且至多且包括0.8mol/l之總量存在於鹵化銀顯像溶液中。若使用化合物之混合物,則此濃度係指所有亞硫酸鹽之總量。 For example, suitable alkali metal sulfites include sodium sulfite, potassium sulfite, and mixtures thereof. The alkali metal sulfite may be present in the silver halide imaging solution in a total amount of at least 0.1 mol/l and up to and including 1 mol/l or typically at least 0.4 mol/l and up to and including 0.8 mol/l. If a mixture of compounds is used, this concentration refers to the total amount of all sulfites.

一或多種顯像抑制劑或限制劑,諸如鹼金屬鹵化物、芳基巰基四唑、苯并三唑及芳基或烷基二硫化物或芳基或烷基硫醇中之任一者中之至少一者可以至少0.25mmol/l且至多且包括2.5mmol/l或典型地至少0.5mmol/l且至多且包括1.5mmol/l之總量存在於鹵化銀顯像溶液中。 One or more imaging inhibitors or limiting agents, such as an alkali metal halide, an aryl decyltetrazole, a benzotriazole, and an aryl or alkyl disulfide or an aryl or alkyl thiol At least one of them may be present in the silver halide imaging solution in a total amount of at least 0.25 mmol/l and up to and including 2.5 mmol/l or typically at least 0.5 mmol/l and up to and including 1.5 mmol/l.

適用之鹼金屬鹵化物包括但不限於氯化鈉、溴化鈉、氯化鉀及溴化鉀。 Suitable alkali metal halides include, but are not limited to, sodium chloride, sodium bromide, potassium chloride, and potassium bromide.

適用之經取代或未經取代之芳基巰基四唑包括包括但不限於以下之化合物:1-苯基-5-巰基四唑(PMT)、1-乙基-5-巰基四唑、1-第三丁基-5-巰基四唑及1-吡啶基-5-巰基四唑。 Suitable substituted or unsubstituted arylmercaptotetrazole includes, but is not limited to, the following compounds: 1-phenyl-5-mercaptotetrazole (PMT), 1-ethyl-5-mercaptotetrazole, 1- Third butyl-5-mercaptotetrazole and 1-pyridyl-5-mercaptotetrazole.

適用之苯并三唑包括但不限於經取代及未經取代之苯并三唑化合物,諸如苯并三唑、5-甲基苯并三唑及5,6-二氯苯并三唑。 Suitable benzotriazoles include, but are not limited to, substituted and unsubstituted benzotriazole compounds such as benzotriazole, 5-methylbenzotriazole and 5,6-dichlorobenzotriazole.

適用之芳基或烷基二硫化物包括但不限於5,5'-(二硫基雙(4,1-伸苯基亞胺基))雙(5-側氧基-戊酸)及其二鈉鹽、2,2'-二硫基雙苯甲酸及其二鈉鹽以及5,5'-二硫基雙(戊酸)及其二鈉鹽。 Suitable aryl or alkyl disulfides include, but are not limited to, 5,5'-(dithiobis(4,1-phenylphenylimino))bis(5-oxo-valeric acid) and Disodium salt, 2,2'-dithiobisbenzoic acid and its disodium salt, and 5,5'-dithiobis(pentanoic acid) and its disodium salt.

適用之芳基或烷基硫醇包括但不限於5-巰基-4,1-苯基亞胺基-5-側氧基-戊酸及其鈉鹽以及5-巰基戊酸及其鈉鹽。 Suitable aryl or alkyl thiols include, but are not limited to, 5-mercapto-4,1-phenylimino-5-oxo-pentanoic acid and its sodium salt, and 5-mercaptoic acid and its sodium salt.

可以已知量存在於鹵化銀顯像溶液中之其他附加物包括但不限於金屬螯合劑、防腐劑(除亞硫酸鹽之外)、殺生物劑、抗氧化劑、少量水可混溶之有機溶劑(諸如苯甲醇及二乙二醇)、成核劑、酸、鹼(諸如鹼金屬氫氧化物)及緩衝劑(諸如碳酸鹽、硼砂、磷酸鹽及其他鹼式鹽)。 Other addenda that may be present in known amounts in the silver halide imaging solution include, but are not limited to, metal chelators, preservatives (other than sulfites), biocides, antioxidants, small amounts of water-miscible organic solvents. (such as benzyl alcohol and diethylene glycol), nucleating agents, acids, bases (such as alkali metal hydroxides), and buffers (such as carbonates, borax, phosphates, and other basic salts).

鹵化銀顯像溶液可在工作強度下提供,或以可在使用已知加工設備及程序加工之前或期間適合地稀釋之濃縮形式提供。舉例而言,鹵化銀顯像溶液與所要工作強度濃度相比可濃縮至少5倍。 The silver halide imaging solution can be provided at work strength or in a concentrated form that can be suitably diluted prior to or during processing using known processing equipment and procedures. For example, the silver halide imaging solution can be concentrated at least 5 times compared to the desired working strength concentration.

因此,鹵化銀顯像溶液可用以在適合溫度下、在通常大氣壓力下加工或處理成像曝光之前驅體適合時間,以實現成像曝光之第一(或第二)非彩色親水性感光層中的曝光之銀離子之至少75mol%且典型地至少90mol%以及可存在之各親水性外塗層中的任何銀離子之至少90mol%的顯像。 Therefore, the silver halide imaging solution can be used to process the film at a suitable temperature, under normal atmospheric pressure, or to treat the film for a suitable time before imaging exposure to achieve imagewise exposure in the first (or second) achromatic hydrophilic photosensitive layer. At least 75 mol% of the exposed silver ions and typically at least 90 mol% and at least 90 mol% of any silver ions in each of the hydrophilic overcoat layers that may be present are developed.

舉例而言,使用鹵化銀顯像溶液之加工溫度可在至少15℃且至多且包括60℃或典型地至少35℃且至多且包括45℃之範圍內。適用加工時間可在至少10秒且至多且包括10分鐘但更可能至多且包括1分鐘範圍內。熟練之工作人員可使用習知實驗來找到最優加工條件以在將銀離子還原為潛像中之銀金屬方面實現所要結果。使用水或適合水溶液之洗滌或沖洗處理可在此加工特徵之後且在用鹵化銀溶液之物理顯像溶液加工之前在適合溫度下進行適合時間。 For example, the processing temperature using the silver halide imaging solution can be in the range of at least 15 °C and up to and including 60 °C or typically at least 35 °C and up to and including 45 °C. Suitable processing times can be in the range of at least 10 seconds and up to and including 10 minutes but more likely up to and including 1 minute. Skilled workers can use conventional experiments to find optimal processing conditions to achieve the desired result in reducing silver ions to silver metal in the latent image. Washing or rinsing with water or a suitable aqueous solution can be carried out at a suitable temperature after processing the features and prior to processing with the physical imaging solution of the silver halide solution.

用鹵化銀溶液之物理顯像溶液加工:Processing with a physical imaging solution of a silver halide solution:

在視情況選用之洗滌之後,成像曝光之前驅體隨後通常在獨特鹵化銀溶液之物理顯像溶液中進行加工以提高基板之支撐側中之一或兩側上的銀圖像、例如預定銀金屬圖案之導電性。 After optional cleaning, the imagewise exposure precursor is then typically processed in a physical imaging solution of a unique silver halide solution to enhance the silver image, such as a predetermined silver metal, on one or both sides of the support side of the substrate. The conductivity of the pattern.

鹵化銀溶液之物理顯像溶液通常可具有至少8且至多且包括13或典型地至少8且至多且包括12之pH。pH可連同下文所描述之化合物一起使用已知鹼性試劑提供。 The physical imaging solution of the silver halide solution can generally have a pH of at least 8 and up to and including 13 or typically at least 8 and up to and including 12. The pH can be provided using known alkaline agents along with the compounds described below.

此鹵化銀溶液之物理顯像溶液包含一或多種選自以下中之一或多者之主要顯像劑作為必需組分:氫醌或其衍生物或一或多種抗壞血酸或其衍生物。該等化合物之實例提供於上文。鹵化銀溶液之物理顯像溶液中之主要顯像劑可與上文描述之鹵化銀顯像溶液中之主要顯像劑 相同或不同。 The physical imaging solution of the silver halide solution contains one or more primary imaging agents selected from one or more of the following: anhydroquinone or a derivative thereof or one or more ascorbic acids or derivatives thereof. Examples of such compounds are provided above. The main imaging agent in the physical imaging solution of the silver halide solution can be used as the main imaging agent in the silver halide imaging solution described above Same or different.

鹵化銀溶液之物理顯像溶液中之一或多種主要顯像劑可以至少0.01mol/l且至多且包括1mol/l或典型地至少0.05mol/l且至多且包括0.2mol/l之總量存在。若使用該等化合物之混合物,則此濃度係指主要顯像劑之總量。 One or more primary imaging agents in the physical imaging solution of the silver halide solution may be present in a total amount of at least 0.01 mol/l and up to and including 1 mol/l or typically at least 0.05 mol/l and up to and including 0.2 mol/l. . If a mixture of such compounds is used, this concentration refers to the total amount of the primary imaging agent.

另外,鹵化銀溶液之物理顯像溶液包含至少0.001mol/l且至多且包括0.1mol/l或典型地至少0.005mol/l且至多且包括0.05mol/l之量之一或多種鹵化銀溶解催化劑作為必需組分。當使用該等化合物之混合物時,此等濃度係指鹵化銀溶解催化劑之總量。 In addition, the physical imaging solution of the silver halide solution comprises at least 0.001 mol/l and up to and including 0.1 mol/l or typically at least 0.005 mol/l and up to and including 0.05 mol/l of one or more silver halide dissolution catalysts As an essential component. When a mixture of such compounds is used, these concentrations refer to the total amount of silver halide dissolution catalyst.

適用之鹵化銀溶解催化劑包括但不限於鹼金屬硫氰酸鹽,諸如硫氰酸鈉及硫氰酸鉀;硫醚,諸如3,6-二硫雜-1,8-辛二醇;及雜環硫酮,諸如四氫-4,6-二甲基-1,3,5-三嗪-2(1H)-硫酮及四氫-3-羥基乙基-1,3,5-三嗪-2(1H)-硫酮。此等化合物可容易與銀錯合。 Suitable silver halide dissolution catalysts include, but are not limited to, alkali metal thiocyanates such as sodium thiocyanate and potassium thiocyanate; thioethers such as 3,6-dithia-1,8-octanediol; Cyclothione, such as tetrahydro-4,6-dimethyl-1,3,5-triazine-2(1H)-thione and tetrahydro-3-hydroxyethyl-1,3,5-triazine -2(1H)-thione. These compounds can be easily mismatched with silver.

用於本發明中之鹵化銀溶液之物理顯像溶液實質上不含有催化顯像劑,諸如上文關於鹵化銀顯像溶液描述之彼等(b)化合物。術語「實質上無」意指小於0.001mol/l或甚至小於0.0001mol/l之該等化合物故意併入至溶液中或產生於溶液中。 The physical imaging solution used in the silver halide solution of the present invention is substantially free of catalytic imaging agents such as those described above with respect to silver halide imaging solutions. The term "substantially free" means that less than 0.001 mol/l or even less than 0.0001 mol/l of such compounds are intentionally incorporated into the solution or are produced in solution.

鹵化銀溶液之物理顯像溶液可進一步包含一或多種鹼金屬亞硫酸鹽,包括亞硫酸鈉、亞硫酸鉀及其混合物。當使用亞硫酸鉀或亞硫酸鈉時或特別地當僅使用亞硫酸鉀時,鹼金屬亞硫酸鹽可以至少0.2mol/l且至多且包括3mol/l或典型地至少0.5mol/l且至多且包括1mol/l之總量存在於鹵化銀溶液之物理顯像溶液中。若使用化合物之混合物,則此等濃度係指所有亞硫酸鹽之總量。 The physical imaging solution of the silver halide solution may further comprise one or more alkali metal sulfites, including sodium sulfite, potassium sulfite, and mixtures thereof. When potassium sulfite or sodium sulfite is used or in particular when only potassium sulfite is used, the alkali metal sulfite may be at least 0.2 mol/l and up to and including 3 mol/l or typically at least 0.5 mol/l and up to and including 1 mol The total amount of /l is present in the physical imaging solution of the silver halide solution. If a mixture of compounds is used, then these concentrations refer to the total amount of all sulfites.

鹵化銀溶液之物理顯像溶液可進一步包括一或多種能夠與銀離子錯合之聚胺基聚羧酸鹽,包括但不限於二伸乙基三胺五乙酸五鈉鹽及此項技術中已知之其他類似化合物。當不存在亞硫酸鹽時,該等化合 物可特別適用。該等化合物可以至少0.001mol/l且至多且包括0.03mol/l之量存在。 The physical imaging solution of the silver halide solution may further comprise one or more polyamine polycarboxylates capable of intercalating with silver ions, including but not limited to di-ethyltriamine pentaacetic acid pentasodium salt and Know other similar compounds. When there is no sulfite, the combination The material is particularly suitable. The compounds may be present in an amount of at least 0.001 mol/l and up to and including 0.03 mol/l.

鹵化銀溶液之物理顯像溶液亦可包括一或多種可與銀、鈣、鐵、鎂或可存在之其他金屬離子錯合之金屬離子錯合劑。銀或鈣金屬離子錯合劑以至少0.001mol/l之總量可特別適用。 The physical imaging solution of the silver halide solution may also include one or more metal ion intercalating agents that are miscible with silver, calcium, iron, magnesium or other metal ions that may be present. Silver or calcium metal ion intercalators may be particularly useful in a total amount of at least 0.001 mol/l.

特別適用之鹵化銀溶液之物理顯像溶液包括但不限於氫醌或其衍生物及硫氰酸鈉或硫氰酸鉀,及視情況亞硫酸鹽及鈣或銀金屬離子錯合劑。 Physical imaging solutions of particularly suitable silver halide solutions include, but are not limited to, hydroquinone or a derivative thereof and sodium thiocyanate or potassium thiocyanate, and optionally sulfite and calcium or silver metal ion intercalators.

鹵化銀物理溶液顯像溶液可在工作強度下提供,或以在使用已知加工設備及程序加工之前或期間適合地稀釋之濃縮形式提供。舉例而言,鹵化銀物理顯像溶液與所要工作強度濃度相比可濃縮至少4倍。 The silver halide physical solution imaging solution can be provided at work strength or in a concentrated form that is suitably diluted prior to or during processing using known processing equipment and procedures. For example, a silver halide physical imaging solution can be concentrated at least 4 times compared to the desired working strength concentration.

因此,鹵化銀溶液之物理顯像溶液用以在適合溫度下、在通常大氣壓力下加工或處理成像曝光之前驅體適合時間,以提供所得第一銀圖像之導電性,其為在僅用鹵化銀顯像溶液加工成像曝光之前驅體之後的第一銀圖像(或第二銀圖像)之導電性之至少2倍。 Therefore, the physical imaging solution of the silver halide solution is used to process the film at a suitable temperature, under normal atmospheric pressure, or to treat the film for a suitable time to provide conductivity of the resulting first silver image, which is used only. The silver halide imaging solution is processed to image at least 2 times the conductivity of the first silver image (or second silver image) after exposure to the precursor.

第一銀圖像之導電性量測如下文實例中所描述而獲得。 The conductivity measurement of the first silver image was obtained as described in the examples below.

對於此加工特徵,溫度可在至少20℃且至多且包括60℃範圍內,或典型地為至少35℃且至多且包括45℃。適用之加工時間可在至少30秒且至多且包括6分鐘,但更可能至少2分鐘且至多且包括4分鐘範圍內。熟練之工作人員可使用習知實驗來找到最優加工條件以實現所要導電性結果。使用水或適合水溶液之洗滌或沖洗處理可在此加工特徵之後且在用定像溶液處理之前在適合溫度下進行適合時間。 For this processing feature, the temperature can be at least 20 ° C and up to and including 60 ° C, or typically at least 35 ° C and up to and including 45 ° C. Suitable processing times can be in the range of at least 30 seconds and up to and including 6 minutes, but more preferably at least 2 minutes and up to and including 4 minutes. Skilled workers can use well-known experiments to find optimal processing conditions to achieve desired conductivity results. Washing or rinsing with water or a suitable aqueous solution can be carried out at this temperature after the processing of the features and prior to treatment with the fixing solution.

在許多實施例中,相同鹵化銀顯像溶液、鹵化銀溶液之物理顯像溶液及定像溶液用於在兩側成像曝光之後形成第一及第二銀圖像。 In many embodiments, the same silver halide imaging solution, a physical imaging solution of a silver halide solution, and a fixing solution are used to form the first and second silver images after imagewise exposure on both sides.

定像:Fixing:

在用鹵化銀溶液之物理顯像溶液加工及視情況選用之洗滌之後, 剩餘未顯像之銀離子(任何層中)可藉由用定像溶液處理成像曝光且顯像之前驅體而移除。定像溶液在黑白攝影技術中為熟知的,且含有一或多種錯合鹵化銀以便將其自存在其之層中移除之化合物。硫代硫酸鹽常用於定像溶液中。定像溶液可視情況含有硬化劑,諸如礬或鉻礬。顯像之薄膜可在鹵化銀溶液物理顯像之後即刻在定像溶液中進行加工,或可存在介入停影液或水洗或兩者。定像可在任何適合溫度及時間下進行,諸如至少20℃下持續至少30秒。 After processing with a physical imaging solution of a silver halide solution and optionally washing, The remaining unexposed silver ions (in any layer) can be removed by treating the imagewise exposure with the fixative solution and developing the precursor. Fixing solutions are well known in the art of black and white photography and contain one or more compounds that are misaligned with silver halide in order to remove them from the layers in which they are present. Thiosulfate is commonly used in fixing solutions. The fixing solution may optionally contain a hardener such as hydrazine or chrome. The developed film can be processed in the fixing solution immediately after physical development of the silver halide solution, or there may be an intervening stop solution or water wash or both. Fixing can be carried out at any suitable temperature and time, such as at least 20 ° C for at least 30 seconds.

在定像之後,含有第一銀圖像(及視情況選用之第二銀圖像)之導電物品可在水中洗滌或沖洗,該水可視情況包括界面活性劑或其他物質以減少乾燥後之水斑點形成,該乾燥在下一加工特徵之前為視情況選用的。乾燥可在環境中或藉由例如在對流烘箱中在高於50℃但低於基板之玻璃轉變溫度之溫度下加熱而實現。 After fixation, the conductive article containing the first silver image (and optionally the second silver image) can be washed or rinsed in water, which may include surfactants or other materials to reduce the amount of water after drying. Spot formation, which is optionally used prior to the next processing feature. Drying can be accomplished in the environment or by heating at a temperature above 50 ° C but below the glass transition temperature of the substrate, for example in a convection oven.

定像隨後在各先前非彩色親水性感光層中之第一銀圖像中(通常銀圖案中)留下銀金屬粒子。此定像亦移除各親水性外塗層中之任何未顯像之銀離子。對於本文中描述之雙工導電薄膜元件前驅體,在相對第二支撐側上提供相同效應。 The fixation then leaves silver metal particles in the first silver image (usually in the silver pattern) in each of the previous achromatic hydrophilic photosensitive layers. This fixation also removes any unexposed silver ions in each of the hydrophilic outer coatings. For the duplex conductive film element precursors described herein, the same effect is provided on the opposite second support side.

希望在於定像溶液中加工之後所得導電薄膜元件展現小於或等於0.03之(視覺)DminIt is desirable that the resulting conductive film member after processing in the fixing solution exhibits (visual) Dmin of less than or equal to 0.03.

在定像之後,物品可在水中洗滌或沖洗,該水可視情況包括界面活性劑或其他物質以減少乾燥後之水斑點形成。 After fixation, the article can be washed or rinsed in water, which may optionally include a surfactant or other substance to reduce the formation of water spots after drying.

導電性增強:Enhanced conductivity:

在定像及視情況選用之沖洗之後且在如上文所描述之乾燥之前,包含第一銀圖像(及視情況選用之第二銀圖像)之導電物品可進一步用水洗滌或沖洗且隨後經處理以進一步增強基板之各支撐側上之各銀圖像中的銀金屬(或核)之導電性。多種方式已提出以執行此「導電性增強」過程。舉例而言,美國專利7,985,527(Tokunaga)及8,012,676 (Yoshiki等人)描述使用熱水浴、水蒸氣、還原劑或鹵化物處理。該等處理之細節提供於此等專利中。 The electrically conductive article comprising the first silver image (and optionally the second silver image) may be further washed or rinsed with water after subsequent fixing and optionally rinsing and prior to drying as described above and subsequently The treatment further enhances the conductivity of the silver metal (or core) in each of the silver images on each of the support sides of the substrate. A variety of approaches have been proposed to perform this "conductivity enhancement" process. For example, US Patent 7,985,527 (Tokunaga) and 8,012,676 (Yoshiki et al.) describes the treatment with a hot water bath, water vapor, reducing agent or halide. Details of such processing are provided in these patents.

亦可能藉由與導電性增強劑重複接觸(處理)隨後進行視情況選用之洗滌及乾燥,且重複用於導電性增強之處理與視情況選用之洗滌及乾燥之此循環通常一或多次,來增強各銀圖像中之銀金屬粒子之導電性。適用之導電性增強劑包括但不限於亞硫酸鹽、硼烷化合物、氫醌、對苯二胺及亞磷酸鹽。此處理可在至少30℃且至多且包括90℃之溫度下進行至少0.25分鐘且至多且包括30分鐘。 It is also possible to repeat the contact (treatment) with the conductivity enhancer, followed by washing and drying as appropriate, and repeating the cycle for the conductivity enhancement treatment and optionally the washing and drying, usually one or more times. To enhance the conductivity of the silver metal particles in each silver image. Suitable conductivity enhancers include, but are not limited to, sulfites, borane compounds, hydroquinones, p-phenylenediamines, and phosphites. This treatment can be carried out at a temperature of at least 30 ° C and up to and including 90 ° C for at least 0.25 minutes and up to and including 30 minutes.

額外處理:Additional processing:

前浴溶液亦可用以在上文描述之鹵化銀顯像之前處理曝光之銀鹽。該等前浴溶液可包括一或多種如上文所描述且相同或不同量之顯像抑制劑。有效顯像抑制劑包括但不限於苯并三唑、雜環硫酮及巰基四唑。前浴溫度可在如上文關於鹵化銀顯像步驟所描述之範圍內。前浴時間視濃度及具體抑制劑而定,但其可在至少10秒且至多且包括4分鐘範圍內。 The anterior bath solution can also be used to treat the exposed silver salt prior to the silver halide imaging described above. The pre-bath solutions may include one or more imaging inhibitors as described above and in the same or different amounts. Effective imaging inhibitors include, but are not limited to, benzotriazole, heterocyclic thioketone, and decyltetrazole. The anterior bath temperature can be within the range as described above with respect to the silver halide imaging step. The anterior bath time depends on the concentration and the particular inhibitor, but it can be in the range of at least 10 seconds and up to and including 4 minutes.

在一些實施例中可適用的為在定像之後且在乾燥之前用硬化浴處理導電薄膜元件以改良所得導電薄膜元件之物理耐久性。該等硬化浴可包括一或多種對於熟習此項技術者將顯而易見之適當量之已知硬化劑。 It is applicable in some embodiments to treat the conductive film member with a hardening bath after fixing and before drying to improve the physical durability of the resulting conductive film member. Such hardening baths may include one or more suitable amounts of known hardeners that will be apparent to those skilled in the art.

對導電薄膜元件之額外處理,諸如用穩定浴之處理必要時亦可在任何適合時間及溫度下在最後乾燥之前進行。 Additional treatment of the conductive film elements, such as treatment with a stabilizing bath, can also be carried out, if necessary, at any suitable time and temperature prior to final drying.

本發明之方法可使用一種導電薄膜元件前驅體進行,該導電薄膜元件前驅體在基板之第一及相對第二支撐側兩者上包含適合第一及第二非彩色親水性感光層、及分別安置在第一及第二非彩色親水性感光層上方之第一及第二親水性外塗層,第一及第二親水性外塗層為基板之相應第一支撐及相對第二支撐側上之最外層。 The method of the present invention can be carried out using a conductive thin film element precursor comprising a first and second achromatic hydrophilic photosensitive layer on both the first and second support sides of the substrate, and respectively And first and second hydrophilic outer coatings disposed on the first and second achromatic hydrophilic photosensitive layers, the first and second hydrophilic outer coatings are corresponding first supports and opposite second support sides of the substrate The outermost layer.

在該等方法中,第一及第二非彩色親水性感光層兩者經適當曝光以在第一及第二非彩色親水性感光層中提供相同或不同(通常不同)之含有鹵化銀之潛伏圖案。此等不同曝光之方式可為同時或依序的。在許多實施例中,兩側經同時曝光。 In such methods, both the first and second achromatic hydrophilic photosensitive layers are suitably exposed to provide the same or different (usually different) latent silver halide-containing haze in the first and second achromatic hydrophilic photosensitive layers. pattern. These different exposures can be simultaneous or sequential. In many embodiments, both sides are simultaneously exposed.

兩個相對非彩色親水性感光層中形成之潛伏圖像中之鹵化銀隨後在上文描述之加工處理期間轉化為兩側上之銀金屬粒子。因此,兩個潛伏圖像可同時顯像且定像。 The silver halide in the latent image formed in the two relatively achromatic hydrophilic photosensitive layers is then converted to silver metal particles on both sides during the processing described above. Therefore, two latent images can be simultaneously imaged and fixed.

未轉化之銀離子可自第一及第二非彩色親水性感光層移除,在基板之相對支撐第二側上在對應於第一及第二潛伏圖案之相應第一及第二圖案中留下銀金屬粒子。 The unconverted silver ions are removable from the first and second achromatic hydrophilic photosensitive layers, remaining in the respective first and second patterns corresponding to the first and second latent patterns on the opposite side of the opposite side of the substrate Lower silver metal particles.

在該等過程期間,相同鹵化銀顯像溶液、鹵化銀溶液之物理顯像溶液及定像溶液用於形成第一及第二銀圖像兩者。 During such processes, the same silver halide imaging solution, a physical imaging solution of the silver halide solution, and a fixing solution are used to form both the first and second silver images.

視情況且合意地,元件之兩側上之圖案中的銀金屬粒子可如上文所描述進一步經處理以增強銀金屬導電性。 Optionally and desirably, the silver metal particles in the pattern on both sides of the element can be further processed as described above to enhance silver metal conductivity.

在許多實施例中,所得導電薄膜元件在基板之至少第一支撐側上具有至少一個預定導電銀金屬電極柵(圖案)且合意地在基板之相對第二支撐側上具有導電銀金屬電極柵(圖案),該等電極柵之組成、圖案配置、導電線粗細或柵線形狀(例如,六角形、菱形、八角形、正方形、圓形或不規則)不同。舉例而言,基板之第一支撐側上之導電銀金屬電極柵可具有正方形圖案之導電銀金屬電極柵,且基板之相對支撐第二側上之導電銀金屬電極柵可具有菱形圖案。 In many embodiments, the resulting conductive thin film element has at least one predetermined conductive silver metal electrode grid (pattern) on at least a first support side of the substrate and desirably has a conductive silver metal electrode grid on the opposite second support side of the substrate ( Pattern), the composition of the electrode grid, the pattern configuration, the thickness of the conductive line or the shape of the grid line (for example, hexagonal, rhombic, octagonal, square, circular or irregular). For example, the conductive silver metal electrode grid on the first support side of the substrate may have a square pattern of conductive silver metal electrode grid, and the conductive silver metal electrode grid on the opposite side of the substrate may have a diamond pattern.

使用本發明製備之導電薄膜元件可在形成後使用,或其可進一步經處理例如以將導電金屬(諸如銅、鈀、鉑、鋁、錫或金)無電電鍍至第一(及第二)銀圖像上。相同或不同無電電鍍之導電金屬可提供於基板之相對支撐側上之第一及第二銀圖像上。 The conductive thin film element prepared using the present invention may be used after formation, or it may be further processed, for example, to electrolessly electroplate a conductive metal such as copper, palladium, platinum, aluminum, tin or gold to the first (and second) silver. On the image. Conductive metals of the same or different electroless plating may be provided on the first and second silver images on opposite support sides of the substrate.

銀管理Silver management

在使用容易溶解鹵化銀之顯像劑之方法中存在如下風險,所得可溶銀離子可自感光性鹵化銀乳液中遷移且其可隨後與黑白顯像劑反應以形成金屬銀。金屬銀轉而帶來沈澱或沈積形成之問題,致使顯像劑不合需要。在此等情況下,希望將溶解之銀離子在其在加工罐中積聚且變得還原為金屬銀之前自顯像劑溶液移除。可溶銀離子之移除可藉由多種不同方式實現,包括電解電鍍、化學電鍍至含有活性成核位點(諸如Cary-Lea銀)之基板上(例如如美國專利5,188,662(McGuckin等人)中所描述)、或使用對於銀離子具有高親和力之離子交換樹脂。藉由某些離子交換樹脂(通常稱為螯合樹脂)之移除更適用於更簡單之過程。對於銀離子具有高容量及特異性之多種螯合樹脂可商購自各種來源。 In the method of using an image developer which readily dissolves silver halide, there is a risk that the resulting soluble silver ions can migrate from the photosensitive silver halide emulsion and which can then be reacted with a black-and-white developer to form metallic silver. Metallic silver in turn causes problems with precipitation or deposition, rendering the developer undesirable. In such cases, it is desirable to remove dissolved silver ions from the developer solution before it accumulates in the processing tank and becomes reduced to metallic silver. The removal of soluble silver ions can be accomplished in a number of different ways, including electrolytic plating, electroless plating onto substrates containing active nucleation sites such as Cary-Lea silver (e.g., as in U.S. Patent 5,188,662 (McGuckin et al)). As described, or using an ion exchange resin having a high affinity for silver ions. Removal by certain ion exchange resins (commonly referred to as chelating resins) is more suitable for a simpler process. A wide variety of chelating resins having high capacity and specificity for silver ions are commercially available from a variety of sources.

提供以下實例以說明本發明之實踐且不打算以任何方式進行限制。 The following examples are provided to illustrate the practice of the invention and are not intended to be limiting in any way.

使用塗佈有含有98mol%氯化銀及2mol%碘化銀之非彩色感光性鹵化銀乳液(乳液1)之125μm聚(對苯二甲酸乙二酯)基板製備導電薄膜元件前驅體(標識為元件1及元件2)。乳液顆粒具有立方形態及邊緣長度0.36μm,且將其使用以總明膠之0.5重量%塗佈為如下層2之一部分的BVSM[1,1'-(亞甲基(碸基))雙-乙烷]硬化。 A conductive thin film element precursor (identified as component 1) was prepared using a 125 μm poly(ethylene terephthalate) substrate coated with a non-color photosensitive silver halide emulsion (emulsion 1) containing 98 mol% of silver chloride and 2 mol% of silver iodide And component 2). The emulsion particles have a cubic morphology and an edge length of 0.36 μm, and are coated with BVSM [1,1'-(methylene(fluorenyl))bis-B, which is coated as a part of the following layer 2 with 0.5% by weight of total gelatin. Alkyl] hardened.

第一層(層1)直接提供於基板上用於UV吸收。365nm下之UV吸收增加至1.7光密度單位。層1包括1500mg/m2之明膠及300mg/m2之TINUVIN 328 UV吸收染料。 The first layer (layer 1) is provided directly on the substrate for UV absorption. The UV absorption at 365 nm is increased to 1.7 optical density units. Layer 1 comprises 1500 mg/m 2 of gelatin and 300 mg/m 2 of TINUVIN 328 UV absorbing dye.

包括乳液1之感光性鹵化銀乳液層(層2)提供於層1上方。對於元件1,銀(Ag)與明膠重量比保持恆定在2.33:1下(或在約0.297:1之體積比下)。對於元件2,銀(Ag)與明膠重量比保持恆定在2.45:1下(或在約0.313:1之體積比下)。 A photosensitive silver halide emulsion layer (layer 2) comprising emulsion 1 is provided above layer 1. For element 1, the weight ratio of silver (Ag) to gelatin was kept constant at 2.33:1 (or at a volume ratio of about 0.297:1). For element 2, the silver (Ag) to gelatin weight ratio remains constant at 2.45:1 (or at a volume ratio of about 0.313:1).

元件1及2兩者進一步在層2上方包括親水性外塗層(層3),該層3 包括488mg/m2之明膠、6mg/m2之0.6μm不溶性聚合啞光粒子及習知塗層界面活性劑。 Both elements 1 and 2 further comprise a hydrophilic overcoat layer (layer 3) above layer 2, the layer 3 comprising 488 mg/m 2 of gelatin, 6 mg/m 2 of 0.6 μm insoluble polymeric matte particles and conventional coatings Surfactant.

使元件1之導電薄膜元件前驅體通過鍍鉻之設計遮罩成像曝光,該遮罩具有菱形之柵格圖案,拐角至拐角尺寸為300μm(垂直)×500μm(水平)。遮罩上之柵線為約3μm寬。各通道之寬度為4.8mm。各通道之長度為85mm。用365nm波長下之UV輻射進行曝光。 The conductive thin film element precursor of the element 1 was imagewise exposed by a chrome-plated design having a diamond-shaped grid pattern having a corner-to-corner size of 300 μm (vertical) × 500 μm (horizontal). The gate line on the mask is about 3 μm wide. The width of each channel is 4.8 mm. Each channel has a length of 85 mm. Exposure was carried out with UV radiation at a wavelength of 365 nm.

將成像曝光之鹵化銀薄膜使用以下表I中展示之加工順序加工以將銀陽離子還原為銀金屬且形成導電薄膜元件。導電薄膜元件之評估結果亦如下展示於表I中。 The imagewise exposed silver halide film was processed using the processing sequence shown in Table I below to reduce the silver cations to silver metal and form a conductive film element. The evaluation results of the conductive film elements are also shown in Table I below.

使用位於各導電通道之端部處之接觸墊上的兩點探針量測上文描述之五個相同通道之電阻,且將兩點探針連接至歐姆表。使用X-Rite型號310密度計量測導電薄膜元件之非曝光區中之視覺Dmin。視覺密度為紅色、綠色及藍色密度之加權平均值,經設計以模擬人眼之靈敏度。表I中包括六個試驗之相對電阻及視覺Dmin值以展現本發明之優勢。顯像劑1A與顯像劑2A之組合(發明實例1)提供低電阻及低視覺Dmin兩者。單獨顯像劑1A(比較實例2及3)或單獨顯像劑2A(比較實例4)展現極高電阻。習知黑白顯像劑,顯像劑2B給出低電阻(比較實例 5),但極高視覺Dmin。顯像劑1A與習知黑白顯像劑,顯像劑2B組合使用(比較實例6)亦給出良好電阻,但給出不可接受之視覺DminThe resistance of the five identical channels described above is measured using a two-point probe located on the contact pads at the ends of each conductive channel, and the two-point probe is connected to the ohmmeter. The X-Rite Model 310 density meter was used to measure the visual Dmin in the non-exposed areas of the conductive film elements. The visual density is a weighted average of the red, green, and blue densities and is designed to mimic the sensitivity of the human eye. The relative resistance and visual Dmin values of the six tests are included in Table I to demonstrate the advantages of the present invention. The combination of the developer 1A and the developer 2A (Inventive Example 1) provides both low resistance and low visual Dmin . Separate developer 1A (Comparative Examples 2 and 3) or Separate Developer 2A (Comparative Example 4) exhibited extremely high electrical resistance. Conventional black and white imaging agent, developer 2B gives low resistance (Comparative Example 5), but extremely high visual Dmin . The use of the developer 1A in combination with the conventional black-and-white imaging agent and the developer 2B (Comparative Example 6) also gave good resistance, but gave an unacceptable visual Dmin .

將元件2之導電薄膜元件前驅體如上文所描述曝光,且隨後使用以下表II中展示之加工順序加工。使用兩點探針量測獲得薄層電阻,該等量測在1×1吋(2.54cm×2.54cm)柵格上使用直接接觸該柵格之接觸墊進行,產生以歐姆/平方為單位之電阻。 The conductive thin film element precursor of element 2 was exposed as described above and subsequently processed using the processing sequence shown in Table II below. Sheet resistance was obtained using a two-point probe measurement on a 1 x 1 吋 (2.54 cm x 2.54 cm) grid using contact pads that directly contact the grid, resulting in ohms per square. resistance.

表II中包括四個試驗之薄層電阻值以展現本發明之優勢。本發明之實踐中所用的第一顯像劑與第二顯像劑之組合(發明實例7、8及9)提供與使用包含抗壞血酸及N-甲基-對胺基苯酚之單一習知顯像劑(比較實例10)相比低得多之薄層電阻。 The sheet resistance values of the four tests are included in Table II to demonstrate the advantages of the present invention. The combination of the first imaging agent and the second imaging agent used in the practice of the present invention (Inventive Examples 7, 8, and 9) provides and uses a single conventional imaging agent comprising ascorbic acid and N-methyl-p-aminophenol ( Comparative Example 10) is much lower than the sheet resistance.

用於此等實例中之加工溶液之組成展示於表III至IX中。所有此等加工溶液均為使用去礦化水製備之水溶液。 The compositions of the processing solutions used in these examples are shown in Tables III through IX. All such processing solutions are aqueous solutions prepared using demineralized water.

Claims (23)

一種鹵化銀溶液之物理顯像溶液,其包含:(a)至少0.01mol/l且至多且包括1mol/l之量之主要顯像劑,其為氫醌或抗壞血酸或任一者之衍生物,及(c)至少0.001mol/l且至多且包括0.1mol/l之量之鹵化銀溶解催化劑,且該鹵化銀溶液之物理顯像溶液實質上不含有(b)催化顯像劑。 A physical imaging solution of a silver halide solution comprising: (a) a primary imaging agent in an amount of at least 0.01 mol/l and up to and including 1 mol/l, which is hydroquinone or ascorbic acid or a derivative thereof And (c) a silver halide dissolution catalyst in an amount of at least 0.001 mol/l and up to and including 0.1 mol/l, and the physical development solution of the silver halide solution is substantially free of (b) a catalytic developer. 如請求項1之鹵化銀溶液之物理顯像溶液,其進一步包含至少0.2mol/l且至多且包括3mol/l之量之鹼金屬亞硫酸鹽。 A physical imaging solution of the silver halide solution of claim 1, which further comprises an alkali metal sulfite in an amount of at least 0.2 mol/l and up to and including 3 mol/l. 如請求項1或2之鹵化銀溶液之物理顯像溶液,其進一步包含至少0.5mol/l且至多且包括1mol/l之量之亞硫酸鈉或亞硫酸鉀。 A physical imaging solution of the silver halide solution of claim 1 or 2, which further comprises at least 0.5 mol/l and up to and including 1 mol/l of sodium sulfite or potassium sulfite. 如請求項1或2之鹵化銀溶液之物理顯像溶液,其中該鹵化銀溶解催化劑為至少0.005mol/l且至多且包括0.05mol/l之量之鹼金屬硫氰酸鹽。 A physical development solution of the silver halide solution of claim 1 or 2, wherein the silver halide dissolution catalyst is an alkali metal thiocyanate in an amount of at least 0.005 mol/l and up to and including 0.05 mol/l. 如請求項1或2之鹵化銀之物理顯像溶液,其進一步包含至少0.001mol/l之總量之一或多種金屬離子錯合劑。 A physical imaging solution of silver halide according to claim 1 or 2, which further comprises one or more metal ion intercalating agents in a total amount of at least 0.001 mol/l. 如請求項5之鹵化銀之物理顯像溶液,其進一步包含至少0.001mol/l之總量之鈣或銀金屬離子錯合劑作為金屬離子錯合劑。 A physical imaging solution of silver halide according to claim 5, which further comprises a total amount of calcium or a silver metal ion intercalating agent of at least 0.001 mol/l as a metal ion intercalating agent. 如請求項1或2之鹵化銀之物理顯像溶液,其中該主要顯像劑為氫醌或其衍生物,且該鹵化銀溶解催化劑為硫氰酸鈉或硫氰酸鉀。 A physical development solution of silver halide according to claim 1 or 2, wherein the main developer is hydroquinone or a derivative thereof, and the silver halide dissolution catalyst is sodium thiocyanate or potassium thiocyanate. 如請求項7之鹵化銀之物理顯像溶液,其進一步包含至少0.5mol/l且至多且包括1mol/l之量之亞硫酸鈉或亞硫酸鉀。 A physical imaging solution of silver halide according to claim 7, which further comprises at least 0.5 mol/l and up to and including 1 mol/l of sodium sulfite or potassium sulfite. 如請求項1或2之鹵化銀之物理顯像溶液,其與所要工作強度濃度相比濃縮至少4倍。 A physical imaging solution of silver halide according to claim 1 or 2 which is concentrated at least 4 times more than the concentration of the desired working strength. 一種在導電薄膜元件中之透明基板上提供導電銀圖像之方法,該方法按次序包含:成像曝光包含具有第一支撐側及相對第二支撐側之透明基板之導電薄膜元件前驅體,且該導電薄膜元件前驅體在該第一支撐側上按次序包括包含感光性鹵化銀之第一非彩色親水性感光層、及視情況安置在該第一非彩色親水性感光層上方之第一親水性外塗層,以提供在該第一非彩色親水性感光層中包含第一潛伏銀圖像之成像曝光之前驅體,在pH為至少8且包含以下之鹵化銀顯像溶液中加工該成像曝光之前驅體至少10秒:(a)至少0.01mol/l且至多且包括1mol/l之量之主要顯像劑,其為氫醌或抗壞血酸或任一者之衍生物,及(b)至少0.001mol/l且至多且包括0.1mol/l之量之催化顯像劑,其為對胺基苯酚或菲尼酮或任一者之衍生物,以在該第一非彩色親水性感光層中提供對應於該第一潛伏銀圖像之第一銀圖像,在至少20℃之溫度下,在如請求項1至9中任一項之鹵化銀溶液之物理顯像溶液中加工該成像曝光之前驅體至少30秒,以提供該銀圖像之導電性,其為在僅用該鹵化銀顯像溶液加工之後的該第一銀圖像之導電性之至少2倍,在定像溶液中加工該成像曝光之前驅體,以移除剩餘銀離子且提供含有該第一銀圖像之導電薄膜元件,處理該導電薄膜元件,以增強該第一銀圖像之導電性,及視情況洗滌及乾燥該導電薄膜元件。 A method of providing a conductive silver image on a transparent substrate in a conductive film element, the method comprising, in order, imaging exposing a conductive thin film element precursor including a transparent substrate having a first support side and a second support side, and The conductive thin film element precursor includes, in order, on the first support side, a first achromatic hydrophilic photosensitive layer containing photosensitive silver halide, and optionally a first hydrophilicity disposed above the first achromatic hydrophilic photosensitive layer An overcoat layer to provide an imagewise exposure precursor comprising a first latent silver image in the first achromatic hydrophilic photosensitive layer, the imagewise exposure processed in a silver halide imaging solution having a pH of at least 8 and comprising: The precursor is at least 10 seconds: (a) at least 0.01 mol/l and up to and including 1 mol/l of the primary imaging agent, which is hydroquinone or ascorbic acid or a derivative of either, and (b) at least 0.001 a catalytic developer of mol/l and up to and including 0.1 mol/l, which is a p-aminophenol or phenidone or a derivative thereof, to provide in the first achromatic hydrophilic photosensitive layer Corresponding to the first latent silver map a first silver image, the imagewise exposure precursor is processed in a physical imaging solution of a silver halide solution according to any one of claims 1 to 9 at a temperature of at least 20 ° C for at least 30 seconds to provide the The conductivity of the silver image, which is at least 2 times the conductivity of the first silver image after processing with only the silver halide imaging solution, and processing the image before exposure in the fixing solution to move In addition to the remaining silver ions and providing a conductive thin film element containing the first silver image, the conductive thin film element is processed to enhance the conductivity of the first silver image, and optionally, the conductive thin film element is washed and dried. 如請求項10之方法,其中該導電薄膜元件在於該定像溶液中加工之後展現小於或等於0.03之(視覺)DminThe method of claim 10, wherein the conductive film element exhibits (visual) Dmin less than or equal to 0.03 after processing in the fixing solution. 如請求項10或11之方法,其中處理以增強導電性之循環及視情況選用之洗滌及乾燥循環重複至少一次。 The method of claim 10 or 11, wherein the treating to enhance the cycle of conductivity and optionally the washing and drying cycle is repeated at least once. 如請求項10或11之方法,其中該第一銀圖像提供於預定導電銀圖案中。 The method of claim 10 or 11, wherein the first silver image is provided in a predetermined conductive silver pattern. 如請求項10或11之方法,其中該第一非彩色親水性感光層包含一或多種鹵化銀,以提供小於5000mg Ag/m2之總銀金屬覆蓋率。 The method of claim 10 or 11, wherein the first achromatic hydrophilic photosensitive layer comprises one or more silver halides to provide a total silver metal coverage of less than 5000 mg Ag/m 2 . 如請求項10或11之方法,其中該導電薄膜元件前驅體進一步包含安置在該第一非彩色親水性感光層上方之第一親水性外塗層,該第一親水性外塗層視情況包含一或多種鹵化銀,以提供至少5mg Ag/m2且至多且包括150mg Ag/m2之覆蓋率之銀金屬,且該一或多種鹵化銀各自具有至少30nm且至多且包括300nm之顆粒ESD。 The method of claim 10 or 11, wherein the conductive thin film element precursor further comprises a first hydrophilic outer coating disposed over the first achromatic hydrophilic photosensitive layer, the first hydrophilic outer coating optionally comprising One or more silver halides to provide a silver metal of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 coverage, and the one or more silver halides each have a particle ESD of at least 30 nm and up to and including 300 nm. 如請求項15之方法,其中該第一親水性外塗層進一步包含紫外光吸收劑。 The method of claim 15, wherein the first hydrophilic outer coating further comprises an ultraviolet light absorber. 如請求項10或11之方法,其中該鹵化銀顯像溶液進一步包含至少0.1mol/l且至多且包括1mol/l之量之鹼金屬亞硫酸鹽。 The method of claim 10 or 11, wherein the silver halide imaging solution further comprises an alkali metal sulfite in an amount of at least 0.1 mol/l and up to and including 1 mol/l. 如請求項10或11之方法,其中該鹵化銀顯像溶液進一步包含以下中之一或多者:鹼金屬鹵化物、芳基巰基四唑、苯并三唑、芳基或烷基二硫化物或芳基或烷基硫醇。 The method of claim 10 or 11, wherein the silver halide imaging solution further comprises one or more of the following: an alkali metal halide, an arylsulfonyltetrazole, a benzotriazole, an aryl or an alkyl disulfide. Or aryl or alkyl mercaptan. 如請求項10或11之方法,其中該導電薄膜元件前驅體進一步在該透明基板之該相對第二支撐側上包含第二非彩色親水性感光層、及視情況安置在該第二非彩色親水性感光層上方之第二親水性外塗層,且該方法進一步包含:自該透明基板之該第二相對側成像曝光該導電薄膜元件前驅體,以在該成像曝光之前驅體之該第二非彩色親水性感光層中提供第二潛伏銀圖像,在pH為至少8且包含以下之相同或不同鹵化銀顯像溶液中加工該成像曝光之前驅體至少10秒:(a)至少0.01mol/l且至多且包括1 mol/l之量之主要顯像劑,其為氫醌或抗壞血酸或任一者之衍生物,及(b)至少0.001mol/l且至多且包括0.1mol/l之量之催化顯像劑,其為對胺基苯酚或菲尼酮或任一者之衍生物,以在該第二非彩色親水性感光層中提供對應於該第二潛伏銀圖像之第二銀圖像,在至少20℃之溫度下,在如請求項1至9中任一項之相同或不同鹵化銀溶液之物理顯像溶液中加工該成像曝光之前驅體至少30秒,以提供該銀圖像之導電性,其為在僅用第一顯像溶液加工之後的該第二銀圖像之導電性之至少2倍,在定像溶液中加工該成像曝光之前驅體,以移除剩餘銀離子且提供含有該第二銀圖像之導電薄膜元件,處理該導電薄膜元件,以增強該第二銀圖像之導電性,及視情況洗滌及乾燥該導電薄膜元件。 The method of claim 10 or 11, wherein the conductive thin film element precursor further comprises a second achromatic hydrophilic photosensitive layer on the opposite second support side of the transparent substrate, and optionally disposed in the second achromatic hydrophilic layer a second hydrophilic overcoat layer over the photosensitive layer, and the method further comprising: imaging exposing the conductive thin film element precursor from the second opposite side of the transparent substrate to the second of the precursor prior to the imagewise exposure Providing a second latent silver image in the achromatic hydrophilic photosensitive layer, processing the imagewise exposure for at least 10 seconds in a solution having a pH of at least 8 and comprising the same or different silver halide imaging solutions: (a) at least 0.01 mol /l and up to and including 1 a primary imaging agent in an amount of mol/l which is hydroquinone or ascorbic acid or a derivative thereof, and (b) a catalytic developer in an amount of at least 0.001 mol/l and up to and including 0.1 mol/l, It is a para-aminophenol or phenidone or a derivative thereof to provide a second silver image corresponding to the second latent silver image in the second achromatic hydrophilic photosensitive layer, at least 20 Processing the imagewise exposure precursor for at least 30 seconds in a physical imaging solution of the same or different silver halide solution according to any one of claims 1 to 9 at a temperature of ° C to provide conductivity of the silver image, It is at least 2 times the conductivity of the second silver image after processing with only the first development solution, and the imagewise exposure precursor is processed in the fixing solution to remove the remaining silver ions and provide the inclusion The conductive film element of the second silver image is processed to enhance the conductivity of the second silver image, and optionally wash and dry the conductive film element. 如請求項19之方法,該導電薄膜元件前驅體進一步包含安置在該第二非彩色親水性感光層上方之第二親水性外塗層,該第二親水性外塗層視情況包含一或多種鹵化銀,以提供至少5mg Ag/m2且至多且包括150mg Ag/m2之覆蓋率之銀金屬,且該一或多種鹵化銀各自具有至少30nm且至多且包括300nm之顆粒ESD。 The method of claim 19, the conductive thin film element precursor further comprising a second hydrophilic outer coating disposed over the second achromatic hydrophilic photosensitive layer, the second hydrophilic outer coating optionally comprising one or more Silver halide to provide a silver metal of at least 5 mg Ag/m 2 and up to and including 150 mg Ag/m 2 coverage, and the one or more silver halides each have a particle ESD of at least 30 nm and up to and including 300 nm. 一種藉由如請求項10至20中任一項之方法提供之導電薄膜元件,其在透明基板之至少第一支撐側上具有第一銀圖像。 A conductive film element provided by the method of any one of claims 10 to 20, having a first silver image on at least a first support side of the transparent substrate. 如請求項21之導電薄膜元件,其在透明基板之第一支撐側上具有第一銀圖像且在該透明基板之相對第二支撐側上具有第二銀圖像。 The conductive film element of claim 21 having a first silver image on a first support side of the transparent substrate and a second silver image on a second opposite support side of the transparent substrate. 如請求項21或22之導電薄膜元件,其進一步在該第一銀圖像及視情況該第二銀圖像上包含無電電鍍之導電金屬。 The conductive film element of claim 21 or 22 further comprising an electrolessly plated conductive metal on the first silver image and optionally the second silver image.
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