TW201608669A - Collet for picking up semiconductor die - Google Patents

Abstract

Provided is a collet for picking up a semiconductor die, which can be used at a high temperature and can achieve a small-sized tip while having a long lifespan. The collet includes a first body having a hollow formed in a lengthwise direction, a second body coupled to a top end of the first body, a third body coupled to a bottom end of the first body and movable in the lengthwise direction, an elastomer coupled between the second body and the third body, positioned in the hollow and expandable in the lengthwise direction, and a tip coupled to the third body and picking up the semiconductor die.

Description

Chuck for picking up semiconductor chips [Cross-reference to related applications]

The present application claims priority to Korean Patent Application No. 10-2014-0112364, filed on Jan. 27, 2014, to the Korean Patent Office, the entire disclosure of which is hereby incorporated by reference.

Embodiments of the present invention relate to a chuck for picking up a semiconductor chip.

Generally, a semiconductor device is prepared by coating an adhesive material such as solder, silver paste or resin onto the back surface of a semiconductor chip and then bonding the semiconductor chip to a printed circuit board or a lead frame. Here, the semiconductor chip is picked up by the chuck to move to the printed circuit board or lead frame to be bonded, which is commonly referred to as a chip bonding process.

Currently, in the market for semiconductor assembly, in the process of bonding a light emitting diode (LED) and/or a separately packaged chip, it is necessary to use a chuck having a relatively small head end for a relatively small size chip. In addition, there is a need for a collet that has a long life and is capable of operating at high temperatures.

Embodiments of the present invention provide a chuck for picking up a semiconductor chip which can be used at a high temperature and can realize a small-sized head end while having a long life.

The above and other objects of the present invention are described in the following description of the preferred embodiments.

According to an aspect of the invention, there is provided a chuck for picking up a semiconductor chip, the chuck comprising a first body having a cavity formed in a longitudinal direction; a second body connected to a top end portion of the first body; a third body movable to a bottom end portion of the first body and movable in a longitudinal direction; an elastic body coupled between the second body and the third body, positioned in the cavity and expandable and contractable in the longitudinal direction; and connected to the The three bodies pick up the head end of the semiconductor chip.

The elastomer may comprise a polymer, polytetrafluoroethylene, silicone, rubber, polyurethane or thermoplastic elastomer (TPE).

Further, the elastomer is in the shape of a hose having a cavity or a flexible tube having a cavity.

The elastomer may have a groove formed circumferentially along its outer diameter.

Here, the elastomer can be a spring.

The top end portion of the elastic body may be interference fit in the second body, and the bottom end portion of the elastic body may be interference fit in the third body.

The vacuum grease may be disposed between the top end portion of the elastic body and the second body and between the bottom end portion of the elastic body and the third body.

The irregular portion may be formed on the second body and the third body, and the top end portion and the bottom end portion of the elastic body may be connected to the irregular portion.

The second body can be interference fit in the first body.

The vacuum grease may be disposed between the first body and the second body.

The first body and the second body may have irregularities connected to each other.

The vacuum grease may be disposed between the second body and the third body.

Additionally, a vacuum aperture can be formed along the second body, the elastomer, the third body, and the tip end.

The first body, the second body, the third body and the head end may each be made of a ceramic material, a metal or a polymer.

The ceramic material may include alumina, zirconia, tungsten carbide, tantalum carbide, and tantalum nitride.

The metal can be stainless steel or high speed steel.

The polymer may be polyetheretherketone (PEEK) or polyimine (PI).

According to another aspect of the present invention, there is provided a chuck for picking up a semiconductor chip, the chuck comprising a first body having a cavity formed in a longitudinal direction; a head end connected to a cavity of the first body; An adhesive disposed between the cavity and the head end of the first body.

The cavity may include a first cavity connected to the head end and a second cavity having a smaller diameter than the first cavity, and a bottom frame contacting the top end portion of the head end may be formed in the first cavity and the second cavity between.

According to an embodiment of the present invention, a chuck for picking up a semiconductor chip can be used at a high temperature and can realize a small-sized head end while having a long life.

In an exemplary embodiment, since the head end is made of a ceramic material in addition to the first, second and third bodies and the elastic body, a collet can be realized which can be subjected to high temperature due to material and processing characteristics It can be used and can realize a small-sized head end with a long life. Further, since the elastomer is formed of a resilient polymer such as Teflon or silicone or a spring, damage of the semiconductor chip during the chip picking process or the die bonding process can be prevented.

100‧‧‧ chuck

110‧‧‧First Ontology

110a‧‧‧ Irregular Department

111‧‧‧ Cavity

120‧‧‧Second ontology

121‧‧‧vacuum hole

122‧‧‧Brake

122a‧‧‧ Irregular Department

123‧‧‧diffuse

123a‧‧‧ Irregular Department

130‧‧‧ Third ontology

131‧‧‧vacuum hole

132‧‧‧Brake

133‧‧‧diffuse

133a‧‧‧ Irregular Department

134‧‧‧ Groove

135‧‧‧diffuse

140‧‧‧ Elastomers

140a‧‧‧ Groove

140b‧‧‧ Groove

140c‧‧ ́s fold

141‧‧‧ cavity

150‧‧‧ head end

151‧‧‧vacuum hole

160‧‧‧Semiconductor chip

200‧‧‧ chuck

240‧‧‧ Elastomers

300‧‧‧ chuck

310‧‧‧First Ontology

311‧‧‧ cavity

311a‧‧‧First cavity

311b‧‧‧ second cavity

311c‧‧‧ bottom frame

320‧‧‧ head end

321‧‧‧vacuum hole

330‧‧‧Adhesive

The above and other features and advantages of the present invention will become more apparent from the detailed description of the preferred embodiments thereof Cross-sectional view 2A and 2B are partial cross-sectional views showing respective component connection structures for chucks for picking up semiconductor chips according to an embodiment of the present invention; and FIGS. 3A to 3C are diagrams for picking up semiconductor chips according to an embodiment of the present invention; Cross-sectional view of the elastomer of the collet; FIGS. 4A and 4B are cross-sectional views showing an operational state of a collet for picking up a semiconductor chip according to an embodiment of the present invention; FIG. 5 is a view showing another operation according to the present invention. A cross-sectional view of a collet for picking up a semiconductor chip of an embodiment; FIGS. 6A and 6B are cross-sectional views showing an operational state of a collet for picking up a semiconductor chip according to another embodiment of the present invention; and FIG. 7A And 7B are cross-sectional views showing an operational state of a chuck for picking up a semiconductor chip according to still another embodiment of the present invention.

The advantages and features of the present invention, as well as the methods of practicing the invention, may be more readily understood by reference to the detailed description of the preferred embodiments herein. However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments described herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the invention will be In the drawings, the thickness of layers and regions are exaggerated for clarity.

Further, in the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Throughout the drawings, the same reference numerals denote the same elements. The term "and/or" as used herein includes any and all combinations of one or more of the listed listed items.

The terminology used herein is for the purpose of describing the particular embodiments, As used herein, the singular forms " It is to be understood that the term "comprises" and / or "comprising", when used in the specification, the <RTI ID=0.0> </ RTI> </ RTI> </ RTI> <RTIgt; The existence or addition of integers, steps, operations, components, components, and/or groups thereof.

It will be understood that, although the terms first, second, etc. may be used herein to describe different elements, these elements are not limited by these terms. These terms are only used to distinguish one element from another. Thus, for example, a first element, a first component or a first part discussed below may be termed a second element, a second component or a second part without departing from the teachings of the invention.

1 is a cross-sectional view showing a chuck for picking up a semiconductor chip in accordance with an embodiment of the present invention.

As shown in FIG. 1, a collet 100 according to an embodiment of the present invention includes a first body 110, a second body 120, a third body 130, an elastomer 140, and a head end 150.

The first body 110 is in the shape of a hose or tube having a cavity 111 formed in the longitudinal direction. That is, the first body 110 is in the shape of a cylinder having an open or empty space in a vertical (or up and down) direction. The first body 110 is made of one selected from the group consisting of ceramic materials, metals, polymers, and their equivalents, but the present invention does not limit the materials of the first body 110 to those listed herein. More specifically, the first body 110 may be made of a ceramic material having good processability, being capable of being used at a high temperature, and having an extended life, such as alumina, zirconia, tungsten carbide, tantalum carbide or tantalum nitride; A magnetized metal such as stainless steel (for example, SUS303) or high speed steel; or a polymer having high heat resistance such as polyetheretherketone (PEEK) or polyimine (PI). Preferably, the first body 110 is made of metal.

The second body 120 is coupled to the top end portion of the first body 110 in an interference fit, thereby substantially closing the top end portion of the cavity 111 formed in the first body 110. Here, a vacuum grease (not shown) is disposed between the first body 110 and the second body 120, thereby more effectively preventing vacuum leakage. Further, a vacuum hole 121 is formed at a substantially central portion of the second body 120 to allow a vacuum to be applied in the longitudinal direction of the vacuum hole 121. The second body 120 includes a braking portion 122 for restricting the connection depth of the elastic body 140 described later, and a protruding portion 123 connected to the elastic body 140. Here, the braking portion 122 of the second body 120 is coupled to the top end portion of the first body 110. The second body 120 can be made of one selected from the group consisting of ceramic materials, metals, polymers, and their equivalents, although the present invention does not limit the materials of the second body 120 to those listed herein. More specifically, the second body 120 may be made of a ceramic material having good processability, being capable of being used at a high temperature, and having an extended life, such as alumina, zirconia, tungsten carbide, tantalum carbide or tantalum nitride; A magnetized metal such as stainless steel (for example, SUS303) or high speed steel; or a polymer having high heat resistance such as polyetheretherketone (PEEK) or polyimine (PI). Preferably, the second body 120 is made of metal.

The third body 130 is coupled to the bottom end of the first body 110, thereby substantially closing the bottom end of the cavity 111 formed in the first body 110. Here, a vacuum grease (not shown) is disposed between the first body 110 and the third body 130, thereby more effectively preventing vacuum leakage. Further, a vacuum hole 131 is formed at a substantially central portion of the third body 130 to allow a vacuum to be applied in the longitudinal direction of the vacuum hole 131. The third body 130 includes a braking portion 132, a protruding portion 133, and a protruding portion 135 for restricting the connection depth of the elastic body 140 described later, and the protruding portion 133 is coupled to the elastic body 140, and the protruding portion 135 There is a recess 134 that is connected to the head end 150 described later. Here, the protrusion 135 of the third body 130 having the recess 134 is connected to the bottom end of the first body 110. this Additionally, the head end 150 can be attached and secured to the recess 134 using a resilient adhesive. The third body 130 is made of one selected from the group consisting of ceramic materials, metals, polymers, and their equivalents, but the present invention does not limit the materials of the third body 130 to those listed herein. More specifically, the third body 130 may be made of a ceramic material having good processability, being capable of being used at a high temperature, and having an extended life, such as alumina, zirconia, tungsten carbide, tantalum carbide or tantalum nitride; A magnetized metal such as stainless steel (for example, SUS303) or high speed steel; or a polymer having high heat resistance such as polyetheretherketone (PEEK) or polyimine (PI). Preferably, the third body 130 is made of metal.

The elastic body 140 is coupled between the second body 120 and the third body 130 to be positioned in the cavity 111 of the first body 110 and elastically expandable and contractible in the longitudinal direction. In order to provide flexibility or elasticity, the elastomer 140 may further include a cavity 141 formed therein in the longitudinal direction. Therefore, the cavity 141 is connected to the vacuum hole 121 formed in the second body 120 and the vacuum hole 131 formed in the third body 130. The elastomer 140 may be made of one selected from the group consisting of polymers, polytetrafluoroethylene, silicone, rubber, polyurethane, thermoplastic elastomer (TPE), and equivalents thereof, but the present invention does not limit the material of the elastomer 140 to Those listed here. Preferably, the elastomer 140 is made of silicone.

The head end 150 is connected to the third body 130 to pick up the semiconductor chip 160 and perform a die bonding process. Here, since vacuum grease (not shown) is disposed between the third body 130 and the head end 150, vacuum leakage can be more effectively prevented. Further, a vacuum hole 151 is formed at a substantially central portion of the head end 150 to allow a vacuum to be applied in the longitudinal direction of the head end 150. Here, the vacuum hole 151 is connected to the vacuum hole 131 formed in the third body 130. As described above, the head end 150 can be coupled to the recess 134 of the protrusion 135 formed in the third body 130. The head end 150 is made of one selected from the group consisting of ceramic materials, metals, polymers, and their equivalents, but the present invention does not limit the material of the head end 150 to those listed herein. More specifically, the head end 150 can be made of the following materials: Good processing properties, ceramic materials that can be used at high temperatures and have extended life, such as alumina, zirconia, tungsten carbide, tantalum carbide or tantalum nitride; non-magnetized metals such as stainless steel (eg SUS303) or high speed steel; A polymer having high heat resistance such as polyetheretherketone (PEEK) or polyimine (PI). Preferably, the head end 150 is made of a ceramic material.

2A and 2B are partial cross-sectional views showing respective component connection structures for chucks for picking up semiconductor chips according to an embodiment of the present invention.

First, as shown in FIG. 2A, in order to more effectively prevent vacuum leakage, a plurality of irregularities 123a may be formed on the second body 120, particularly on the outer peripheral surface of the protruding portion 123, and a plurality of irregularities 133a may be formed on the third body 130, particularly on the outer peripheral surface of the protrusion 133. Here, the top end portion of the elastic body 140 is connected to the irregular portion 123a of the second body 120, and the bottom end portion of the elastic body 140 is connected to the irregular portion 133a of the third body 130. Therefore, the hermetic sealing force between the second body 120, each of the elastic body 140 and the third body 130 is further increased, thereby effectively preventing vacuum leakage.

Here, the top end portion of the elastic body 140 is interference fit in the second body 120, and the bottom end portion of the elastic body 140 is interference fit in the third body 130. Further, a vacuum grease may be disposed between the top end portion of the elastic body 140 and the second body 120 and between the bottom end portion of the elastic body 140 and the third body 130.

Next, as shown in FIG. 2B, in order to prevent vacuum leakage, irregularities 110a and 122a are formed in the first body 110 and the second body 120, respectively, which are connected to each other. Here, the second body 120 is interference fit in the first body 110, and vacuum grease may be disposed between the first body 110 and the second body 120.

3A and 3B are diagrams for picking up a semiconductor chip according to an embodiment of the present invention. A cross-sectional view of the elastomer 140 of the collet 100.

First, as shown in FIGS. 3A to 3C, the elastic body 140 may be in the shape of a hose or a tube having a cavity 141 formed in the longitudinal direction. That is, as shown in FIGS. 3A and 3B, the elastic body 140 may have a plurality of grooves 140a and 140b (half-moon or triangular shape) formed circumferentially along the outer peripheral surface. Further, as shown in FIG. 3C, the elastic body 140 may have a plurality of pleats 140c formed along the inner and outer peripheral surfaces thereof.

Therefore, due to the material and structural characteristics of the elastomer 140, the elastomer 140 can elastically contract according to the up and down movement of the head end 150. That is, when the head end 150 picks up the semiconductor chip 160, the head end 150 slightly moves in the up and down direction. Here, since the elastic body 140 is elastically compressed, the head end 150 or the semiconductor chip 160 can be prevented from being damaged.

4A and 4B are cross-sectional views showing an operational state of a chuck 100 for picking up a semiconductor chip according to an embodiment of the present invention. Here, the same functional components are denoted by the same reference symbols of the functional components shown in FIG. 1.

As shown in FIG. 4A, the semiconductor chip 160 is placed first, and then the chuck 100 is positioned thereon. Here, the semiconductor chip 160 may be positioned on a tape (not shown), and the chuck 100 may be attached to a die bonder (not shown).

Further, in a state where vacuum is supplied through the vacuum holes 121, 131, and 151 and the cavity 141 provided in the chuck 100, the chuck 100 is lowered toward the semiconductor chip 160, or the semiconductor chip 160 is directed toward the clip by a needle (not shown) The head 100 is raised. These two operations can be performed simultaneously.

As shown in FIG. 4B, as the collet 100 is lowered toward the semiconductor chip 160 and/or the semiconductor chip 160 is raised toward the collet 100, the head end 150, which is a functional component of the collet 100, is slightly raised toward the inside of the first body 110. high. Here, since the elastic body 140 supporting the head end 150 is available The ground is compressed, so an external force exceeding a predetermined threshold is not applied to the head end 150 and the semiconductor chip 160. That is, the semiconductor chip 160 may not be damaged by the head end 150.

Further, once the pickup of the semiconductor chip 160 is completed, the head end 150 is lowered to its original position by the restoring force of the elastic body 140. Since the vacuum is still being supplied, the semiconductor chip 160 is adsorbed in the bottom end portion of the head end 150.

Further, the above operation is repeated after the chuck 100 is moved to a printed circuit board or a lead frame (referred to as a substrate) by means of a die bonder. That is, the collet 100 is lowered to compress the semiconductor chip 160 toward the substrate. Here, the adhesion member may be formed on the substrate in advance, and the semiconductor chip 160 is positioned on the adhesion member. Further, as shown in FIG. 4B, the collet 100 is further moved downward, and then the elastic body 140 is compressed. Therefore, the semiconductor chip 160 is electrically adhered or mechanically adhered to the substrate. Thereafter, the vacuum supplied through the vacuum holes 121, 131, and 151 and the cavity 141 is canceled, and then the chuck 100 is raised. Therefore, the semiconductor chip 160 is released from the head end 150, thereby completing the chip bonding process of the semiconductor chip 160.

Meanwhile, the difference in size between the inner diameter of the first body 110 and the outer diameter of the elastic body 140 is preferably in a range from approximately 0.05 mm to approximately 0.5 mm. That is, if the difference in size is less than 0.05 mm, when the elastic body 140 is compressed, the outer peripheral surface of the elastic body 140 may directly contact the inner peripheral surface of the first body 110, making it difficult for the elastic body 140 to perform the shock absorbing function. If the dimensional difference is greater than 0.5 mm, the elastomer 140 may exceed the compression limit such that the third body 130 may fully enter the cavity 111 of the first body 110, causing the collet to fail or the die bond to fail.

FIG. 5 is a cross-sectional view showing a chuck 200 for picking up a semiconductor chip in accordance with another embodiment of the present invention.

As shown in FIG. 5, in addition to the configuration of the elastic body 240, the collet 200 is basically The collet 100 shown in Figure 1 is identical. That is, in another embodiment of the invention, the elastomer 240 can be replaced by a metal spring. In other words, the top end portion of the spring is coupled to the bottom end portion of the second body 120, that is, the protrusion portion 123, and the bottom end portion of the spring is coupled to the top end portion of the third body 130, that is, the protrusion portion 133.

Here, since the spring cannot prevent the vacuum from leaking, the vacuum may leak to the outside through the gap between the first body 110 and the third body 130. However, since such vacuum leakage occurs as a negligible amount of small amount that does not affect the chip picking or chip bonding process, the chip picking or chip bonding process can be performed normally.

In order to avoid even a small amount of undesired vacuum leakage as described above, the vacuum grease may be further disposed in the gap between the first body 110 and the third body 130. As is well known in the art, because the vacuum grease also has elasticity, the third body 130 can be vertically moved a predetermined distance toward the inside of the first body 110. Therefore, the use of vacuum grease can contribute to the vertical movement of the third body 130 while preventing vacuum leakage.

6A and 6B are cross-sectional views showing an operational state of a chuck 200 for picking up a semiconductor chip according to another embodiment of the present invention.

As shown in FIGS. 6A and 6B, the operations performed in the chip pickup and chip bonding processes are the same as those shown in FIGS. 4A and 4B. However, because the elastomer 240 is replaced by a spring, the collet 200 differs from the collet 100 shown in Figures 4A and 4B only in that the spring is compressed or released. Therefore, a repetitive description of the operation of the collet 200 with the spring as the elastic body 240 is no longer given.

7A and 7B are cross-sectional views showing an operational state of a chuck 300 for picking up a semiconductor chip according to still another embodiment of the present invention.

As shown in FIGS. 7A and 7B, a pick-up semi-guide according to still another embodiment of the present invention is shown. The body chip collet 300 includes a first body 310, a head end 320, and an adhesive 330.

The first body 310 has a cavity 311 formed in the longitudinal direction, and the head end 320 is coupled to the cavity 311. More specifically, the cavity 311 includes a first cavity 311a connected to the head end 320 and a second cavity 311b having a smaller diameter than the first cavity 311a, and a bottom frame 311c contacting the tip end portion of the head end 320. It may be formed between the first cavity 311a and the second cavity 311b. Moreover, the first body 310 can be made of one selected from the group consisting of ceramic materials, metals, polymers, and their equivalents, although the present invention does not limit the materials of the first body 310 to those listed herein. More specifically, the first body 310 may be made of a ceramic material having good processability, being capable of being used at a high temperature, and having an extended life, such as alumina, zirconia, tungsten carbide, tantalum carbide or tantalum nitride; A magnetized metal such as stainless steel (for example, SUS303) or high speed steel; or a polymer having high heat resistance such as polyetheretherketone (PEEK) or polyimine (PI). Preferably, the first body 310 is made of metal.

The head end 320 is coupled to the cavity 311 of the first body 310. That is, the head end 320 may be connected to the first cavity 311a of the first body 310 in an interference fit manner, and the top end portion of the head end 320 and the bottom portion formed between the first cavity 311a and the second cavity 311b The frame 311c is in contact, thereby limiting the depth of connection of the head end 320 to the first body 310. Here, the head end 320 has a vacuum hole 321 formed therein, and the pickup and chip bonding process of the semiconductor chip 160 is performed by the head end 320.

The head end 320 can be made of one selected from the group consisting of ceramic materials, metals, polymers, and their equivalents, although the present invention does not limit the material of the head end 320 to those listed herein. More specifically, the head end 320 may be made of a ceramic material having good processability, being capable of being used at a high temperature, and having an extended life, such as alumina, zirconia, tungsten carbide, tantalum carbide or tantalum nitride; non-magnetized A metal such as stainless steel (for example, SUS303) or high speed steel; or a polymer having high heat resistance such as polyetheretherketone (PEEK) or polyimine (PI). Preferably, the head end 320 is made of metal to make.

The adhesive 330 may be disposed between the cavity 311 and the head end 320 of the first body 310. Specifically, the adhesive 330 may be disposed between the cavity 311 of the first body 310 and the tip end portion of the head end 320. Further, an adhesive 330 may be disposed between the bottom frame 311c and the top end portion of the head end 320. The adhesive 330 may be an epoxy resin adhesive having heat resistance and high strength or an elastic adhesive having flexibility and flexibility. Here, when the adhesive 330 is an elastic adhesive, the pressure applied to the semiconductor chip 160 during chip pickup and die bonding can be absorbed and reduced to a certain extent, thereby effectively preventing the semiconductor chip 160 from being damaged. .

As described above, since the present invention provides the collet 300 which is basically constructed of metal and ceramic material bonding, the head end 320 having a relatively small size while preventing vacuum leakage can be realized, which is relatively small in size due to material and process difficulty. Can not be achieved. Furthermore, the collet 300 according to the present invention can be used at high temperatures and has a long life compared to conventional rubber or plastic substrate chucks.

Although a chuck for picking up a semiconductor chip in accordance with the present invention is specifically shown and described in connection with an exemplary embodiment, it will be apparent to those skilled in the art that the present invention is not limited by the scope of the invention as defined by the following claims. In the case of a range, various changes can be made in form and detail. Therefore, it is intended that the embodiments of the invention be construed as

100‧‧‧ chuck

110‧‧‧First Ontology

111‧‧‧ Cavity

120‧‧‧Second ontology

121‧‧‧vacuum hole

122‧‧‧Brake

123‧‧‧diffuse

130‧‧‧ Third ontology

131‧‧‧vacuum hole

132‧‧‧Brake

133‧‧‧diffuse

134‧‧‧ Groove

135‧‧‧diffuse

140‧‧‧ Elastomers

141‧‧‧ cavity

150‧‧‧ head end

151‧‧‧vacuum hole

Claims (19)

A chuck for picking up a semiconductor chip, the chuck comprising: a first body having a cavity formed in a longitudinal direction; a second body coupled to the first body a third body connected to the bottom end of the first body and movable in the longitudinal direction; an elastic body connected to the second body and the body Between the third bodies, positioned in the cavity and capable of stretching in the longitudinal direction; and a head end, the head end is connected to the third body, and the semiconductor chip is picked up. The collet of claim 1, wherein the elastomer comprises a polymer, polytetrafluoroethylene, silicone, rubber, polyurethane or a thermoplastic elastomer. The collet of claim 1, wherein the elastomer is in the shape of a hose having a cavity or a flexible tube having a cavity. The collet of claim 1, wherein the elastic body has a groove formed circumferentially along an outer diameter thereof. The collet of claim 4, wherein the elastomer is a spring. The collet of claim 1, wherein a top end portion of the elastic body is interference fit in the second body, and a bottom end portion of the elastic body is interference fit in the third body. The collet of claim 1, wherein a vacuum grease is disposed between the top end portion of the elastic body and the second body and between the bottom end portion of the elastic body and the third body. A collet according to claim 1, wherein an irregular portion is formed on the second body and the third body, and a top end portion and a bottom end portion of the elastic body are connected to the irregular portion. The collet of claim 1, wherein the second body is interference fit in the first body. The collet of claim 1, wherein a vacuum grease is disposed between the first body and the second body. The collet of claim 1, wherein the first body and the second body have irregularities connected to each other. The collet of claim 1, wherein a vacuum grease is disposed between the second body and the third body. The collet of claim 1, wherein a vacuum hole is formed along the second body, the elastic body, the third body, and the head end. The collet of claim 1, wherein the first body, the second body, the third body, and the head end are made of a ceramic material, a metal, or a polymer. The collet of claim 14, wherein the ceramic material comprises alumina, zirconia, tungsten carbide, tantalum carbide, and tantalum nitride. The collet of claim 14, wherein the metal is stainless steel or high speed steel. The cartridge of claim 14, wherein the polymer is polyetheretherketone or polyimine. A collet for picking up a semiconductor chip, the collet comprising: a first body having a cavity formed in a longitudinal direction; a head end, the head end being connected to the space of the first body a cavity; and an adhesive disposed between the cavity of the first body and the head end. The collet of claim 18, wherein the cavity comprises a first cavity connected to the head end and a second cavity having a smaller diameter than the first cavity, and the head A bottom frame contacting the top end portion of the end is formed between the first cavity and the second cavity.