TW201608194A - Calcination jig and method for producing the same - Google Patents

Abstract

An objective of this invention is to provide a calcination jig having a substrate part with high thermal-shock resistance and improving the adhesion between the substrate part and a film part and suppressing the film form separating from the substrate part. To attain this objective, one of an embodiment of calcination jig (1) of this invention includes a substrate part (21), two layers or more of film parts (22), and a boundary part (23). The substrate part (21) includes a setting surface (21a) for setting calcined article(30), and at least includes silicon. The two layers or more of film parts (22) cover the setting surface (21a) of the substrate part (21), and include an oxide ceramic. The boundary part (23) is formed between the substrate part (21) and the film part (22) and includes a composite oxide containing silicon.

Description

Method for manufacturing firing aid and firing aid

The embodiment disclosed in the present invention relates to a method of manufacturing a baking aid and a baking aid.

Conventionally, for example, in the step of manufacturing a ceramic substrate on which an electronic component such as a capacitor is mounted, a step of firing the substrate is included. In the firing step, the substrate to be fired is placed in a firing aid and fired in a furnace (see, for example, Patent Documents 1 to 3).

The above-mentioned baking aid is configured to include a base material portion such as ruthenium carbide or the like which is excellent in mechanical properties when subjected to a thermal shock, and a base material for suppressing firing when the mounting surface on which the object to be fired is placed In the reaction with the fired material, the film portion having a low reactivity of the fired material covers the mounting surface of the base material portion.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-234817

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-76940

[Patent Document 3] Japanese Patent Laid-Open No. 10-7469

However, when the baking aid is configured as described above, the base portion and the film portion are directly in contact with each other because the components have different linear expansion coefficients. Therefore, in the above-described firing preparation of the fired product, a difference in thermal expansion occurs between the base material portion and the film portion of the firing aid, and the adhesion may be lowered, and the film portion may be peeled off from the base portion.

In particular, in recent years, as a result of the extremely miniaturization of parts in electronic parts such as capacitors, in the firing preparation, the fired electronic parts and the firing aids are put into the furnace at a very high temperature from the normal temperature in a short time. Then, it is taken out of the furnace to complete the rapid firing process of firing, and gradually becomes the mainstream. In response to this, it is required that the firing aid does not cause cracking of the base portion or peeling of the film portion from the base portion even when exposed to a severe thermal shock.

In view of the above, an object of the present invention is to provide a base material portion having high thermal shock resistance and to improve the adhesion between the base portion and the film portion, thereby suppressing the film portion to the base. A method of manufacturing a firing aid for stripping of a material portion and a firing aid.

A firing aid according to an aspect of the embodiment includes a base portion, a film portion of two or more layers, and a boundary portion. The base material portion has a mounting surface on which the object to be fired is placed, and contains at least ruthenium. The film portion of two or more layers covers the mounting surface of the base material portion and contains an oxide-based ceramic. The boundary portion is formed between the base material portion and the film portion and contains a composite oxide containing ruthenium.

According to one aspect of the embodiment, the base material portion having high thermal shock resistance is provided in the firing aid, and the adhesion between the base portion and the film portion is improved, and the film portion can be suppressed from being applied to the base portion. Stripped.

1‧‧‧Burning aids

10‧‧‧Base

11‧‧‧ Flat section

12‧‧‧Support

20‧‧‧Travel board

21‧‧‧Parts

21a‧‧‧(Material part) mounting surface

22‧‧‧Mouth Department

22a‧‧‧1st film

22b‧‧‧2nd film

23‧‧‧Borders Department

30‧‧‧Furned goods

Fig. 1 is a schematic perspective view showing a firing aid of the embodiment.

Fig. 2 is a schematic plan view of the carrier plate and the object to be fired shown in Fig. 1.

Fig. 3 is a schematic cross-sectional view taken along line III-III of Fig. 2.

Fig. 4 is a partially enlarged cross-sectional view showing the vicinity of the boundary portion of the carrier plate shown in Fig. 3.

Fig. 5 is a flow chart showing the processing procedure for manufacturing the firing aid.

Hereinafter, embodiments of the firing aid and the method of manufacturing the firing aid disclosed in the present invention will be described in detail with reference to the accompanying drawings. Further, the present invention is not limited to the embodiments shown below.

Fig. 1 is a schematic perspective view showing a firing aid of the embodiment. In addition, in the following, in order to facilitate the description, the X-axis direction, the Y-axis direction, and the Z-axis direction orthogonal to each other are defined, and the three-dimensional orthogonal coordinates in which the positive direction of the Z-axis is vertically upward are shown in the drawing. system. Such as This orthogonal coordinate system is sometimes also shown in other drawings used in the description below.

As shown in Fig. 1, the firing aid 1 includes a base 10 and a passenger board 20. Then, the object 30 to be fired is placed on the carrier board 20 of the baking aid 1 .

The object to be fired 30 is, for example, a ceramic substrate, and is an electronic circuit board on which various electronic components such as a capacitor or a piezoelectric element are mounted. That is, the above-described firing aid 1 is a firing aid for an electronic circuit board. In addition, the shape and the number of the to-be-fired object 30 shown in FIG. 1 are only the illustration and are not limited by this.

The firing aid 1 is placed in a kiln not shown in the figure in a state where the workpiece 30 is placed on the carrier board 20. Then, a relatively high-temperature gas is supplied to the kiln to raise the temperature in the kiln, and the fired product 30 is fired.

The base 10 described above includes the flat plate portion 11 and the support portion 12. The flat plate portion 11 has a shape in which the carrier plate 20 can be carried thereon, and is specifically, for example, a substantially flat plate shape and a substantially rectangular shape in a plan view.

The support portion 12 has a plurality of (for example, four, one of which is not visible in the first drawing), and is formed at an appropriate position on the lower surface side of the flat plate portion 11. Specifically, the support portion 12 is formed so as to protrude from the four corner portions of the lower surface of the flat plate portion 11 in the negative direction of the Z-axis, and supports the flat plate portion 11.

The flat plate portion 11 and the support portion 12 configured as described above are refractory and integrally formed. Specifically, a pulverized or clay-like refractory The mold is introduced into a mold (not shown) and pressurized, that is, so-called extrusion molding, whereby the base 10 in which the flat plate portion 11 and the support portion 12 are integrally formed is completed. The refractory system is, for example, alumina, mullite, zirconia or the like, which can withstand relatively high temperatures (for example, 1500 ° C or higher) and has a gas permeable property.

Further, the base 10 is not limited to the shape shown in FIG. That is, the base 10 may be, for example, a crucible or a rack, etc., in other words, as long as it is a shape that can carry the carrier board 20. In addition, the base 10 and the passenger board 20 need not be different individuals, and may be configured in an integrated manner.

Fig. 2 is a schematic plan view of the carrier plate and the object to be fired shown in Fig. 1, and Fig. 3 is a schematic cross-sectional view taken along line III-III of Fig. 2.

As shown in FIGS. 2 and 3, the carrier board 20 includes a base portion 21 (not visible in FIG. 2), a film portion 22 covering the base portion 21, and a base portion 21 and a film portion. The boundary portion 23 formed between 22 (not visible in Fig. 2).

Further, as shown in FIG. 3, in the base material portion 21, the object 30 to be fired is placed on the upper surface 21a in the Z-axis direction. Hereinafter, in the base material portion 21, the upper surface 21a on which the object 30 to be fired is placed is referred to as a "mounting surface". In addition, in the third drawing, the film portion 22, the boundary portion 23, and the like are enlarged and shown in the Z-axis direction for the sake of easy understanding.

Further, the base portion 21 and the film portion 22 described above have different linear expansion coefficients as described later. Therefore, when the above-described baked product 30 is fired, a considerable difference in thermal expansion occurs between the base portion 21 and the film portion 22, and the adhesion between the base portion 21 and the film portion 22 may be lowered. The portion 22 is peeled off from the base portion 21 .

Therefore, in the baking aid 1 of the present embodiment, even when the difference in thermal expansion between the base portion 21 and the film portion 22 occurs, the adhesion between the base portion 21 and the film portion 22 can be improved. Peeling of the substrate portion 21 by the suppression film portion 22 is achieved. Hereinafter, the firing aid 1 will be described in detail.

The base material portion 21 is formed in a substantially rectangular shape in plan view and has a relatively thin plate shape in the Z-axis direction. As described above, by making the base material portion 21 into a thin plate shape, the base material portion 21 can be made lighter even by the baking aid 1 itself.

Further, the base material portion 21 is a ceramic base material formed to contain at least niobium. In detail, the base portion 21 is formed to include tantalum carbide and tantalum nitride. Further, in the above, the base material portion 21 is made of tantalum carbide and tantalum nitride, but may be composed of any of tantalum carbide and tantalum nitride. In short, it is a material containing niobium. can.

Here, a process of forming the base material portion 21 will be described. For example, in the case where the base material portion 21 contains niobium carbide, the powdery niobium carbide is used in the case where the base material portion 21 contains tantalum nitride, and the metal niobium is blended with alumina or the like and introduced into the former. Further, when the base material portion 21 contains tantalum nitride, a raw material such as tantalum nitride may be simultaneously introduced into the former in addition to the metal tantalum or in place of the metal crucible. Then, a thin plate-shaped molded article is produced by a former.

Then, the above-mentioned molded product is fired in a kiln not shown in the drawing by heating under a nitrogen atmosphere of an inert gas. Further, the metal lanthanide is subjected to a sintering reaction with nitrogen gas to become tantalum nitride.

In this manner, the base portion 21 is formed to include at least ruthenium. Further, the base material portion 21 may be formed of a composite material of tantalum carbide and tantalum nitride. Further, the linear expansion coefficient (thermal expansion coefficient) of the base material portion 21 is, for example, 4.5 × 10 ^-6 /K.

Before the description of the base portion 21 is continued, the film portion 22 is provided with the first film 22a and the second film 22b. The first film 22a is formed to cover the entire surface of the mounting surface 21a of the base material portion 21.

Further, in the above description, the first film 22a is formed so as to cover the entire surface of the mounting surface 21a of the base portion 21, but the series is not limited thereto. In other words, for example, in the mounting surface 21a of the base portion 21, the first film 22a may only partially cover the region on which the object 30 is placed.

The second film 22b is a surface on the positive side in the Z-axis direction of the first film 22a, in other words, the first film 22a is laminated on the surface opposite to the surface on the side of the base portion 21, and contains reactivity with respect to the object 30 to be fired. Low ceramics. In this manner, the film portion 22 has a layer structure having two layers of the first film 22a and the second film 22b.

Among the two-layered film portion 22, the first film 22a facing the layer on the side of the base material portion 21 is formed to contain an oxide and contains ceramics. In other words, the first film 22a and the second film 22b of the film portion 22 each contain an oxide-based ceramic. Specifically, for example, the first film 22a is configured to contain one or more of alumina, cerium oxide, and mullite.

In addition, the linear expansion coefficient of the ceramic constituting the first film 22a is in the range of 0.5 to 2 times the linear expansion coefficient of the base portion 21, and specifically, the linear expansion coefficient of the first film 22a is 2.25 × 10 ^{-6 .} To 9.0×10 ^-6 /K. Moreover, it is preferable that the linear expansion coefficient of the first film 22a is, for example, a value slightly higher than the linear expansion coefficient of the base portion 21, and is equal to or slightly lower than the linear expansion coefficient (described later) of the second film 22b. As described above, the linear expansion coefficients of the base portion 21 and the first film 22a are different from each other. Further, other configurations of the first film 22a and the second film 22b will be described later.

As described above, when the base material portion 21 including the ruthenium is covered by the first film 22a of the film portion 22 including the oxide-based ceramic, the ruthenium is oxidized on the mounting surface 21a of the base material portion 21 to be oxidized to the first film 22a. Oxide reaction. Thereby, the boundary portion 23 containing the composite oxide is formed between the base portion 21 and the first film 22a (see FIG. 3). The composite oxide of the boundary portion 23 is, for example, a composite oxide (Al-Si-O) containing aluminum and ruthenium.

By the boundary portion 23 described above, the bonding between the base portion 21 and the first film 22a of the film portion 22 is made firm, and the adhesion between the base portion 21 and the film portion 22 can be improved. Thereby, peeling of the film part 22 to the base material part 21 can be suppressed.

Fig. 4 is a partially enlarged cross-sectional view showing the vicinity of the boundary portion 23 of the carrier plate shown in Fig. 3. The boundary portion 23 is formed between the base portion 21 and the first film 22a of the film portion 22, and the adhesion between the base portion 21 and the first film 22a of the film portion 22 is improved. The EDS (Energy Dispersive X-ray Spectroscopy) image can also be understood.

Further, as described above, since the linear expansion coefficients of the base portion 21 and the film portion 22 are different from each other, the baked product 30 has a difference in thermal expansion at the time of firing. However, even when the base portion 21 and the film portion 22 are inferior in thermal expansion, the film portion 22 can be suppressed from the viewpoint of improving the adhesion between the base portion 21 and the film portion 22 by the boundary portion 23 described above. Peeling of the base portion 21.

In addition, as described above, by setting the first film 22a to a material having a coefficient of linear expansion between the base portion 21 and the second film 22b, thermal stress can be alleviated, and the film portion 22 can be suppressed from being applied to the base portion 21. Stripped.

In terms of a more preferable composition of the substrate portion 21, the cerium carbide is preferably contained in an amount of 45 to 75% by mass, more preferably 60 to 70% by mass, and the cerium nitride is preferably contained in an amount of 20 to 50% by mass. Jia is 30 to 40% by mass. Further, the alumina in the base material portion 21 is preferably contained in an amount of from 1 to 10% by mass, more preferably from 3 to 7% by mass.

By setting the ratio of niobium carbide to tantalum nitride in the base portion 21 as described above, the reaction between the tantalum of the base portion 21 and the oxide of the film portion 22 can be further promoted, and therefore, the efficiency can be improved. A boundary portion 23 is formed.

Further, in the base material portion 21, before the film portion 22 is formed, it is preferable that the mounting surface 21a is roughened by sandblasting in advance. In detail, the surface roughness Ra of the mounting surface 21a in the base portion 21 is preferably 4 to 20 μm , more preferably 5 to 15 μm , still more preferably 5 by the above-described roughening. Up to 8 μ m. Here, the surface grain roughness Ra refers to a value measured by "arithmetic average grain roughness Ra" described in JIS B0601:2013.

Thereby, the contact area with the film portion 22 is increased on the mounting surface of the base portion 21, and the adhesion between the base portion 21 and the film portion 22 can be further improved by the anchoring effect.

Further, as the base portion 21, a porous ceramic substrate containing relatively many pores is used. Specifically, for example, the porosity of the base portion 21 is preferably from 4 to 38%, more preferably from 5 to 35%, still more preferably from 8 to 15%.

In this manner, when the base material portion 21 is porous and the porosity is set to the above value, for example, unevenness is easily formed on the mounting surface 21a at the time of sandblasting, and therefore the surface of the base material portion 21 can be efficiently performed. Roughening.

In addition, the base portion 21 is porous and has the above-described porosity, so that a relatively large number of irregularities are formed on the mounting surface 21a of the base portion 21 at the time of sandblasting. Thereby, the contact area between the base material portion 21 and the film portion 22 can be further increased, and the adhesion between the base material portion 21 and the film portion 22 can be further improved by the anchoring effect described above.

Further, in Fig. 3, the thickness of the first film 22a in the Z-axis direction is preferably 40 to 210 μm , more preferably 50 to 180 μm , still more preferably 80 to 120 μm . By setting the thickness of the first film 22a to the above value, for example, it is easy to cause the reaction between the ruthenium of the base portion 21 and the oxide of the film portion 22, and it is possible to suppress occurrence of cracks or the like in the film.

Further, the thickness of the second film 22b in the Z-axis direction is preferably 40 to 320 μm , more preferably 50 to 300 μm , still more preferably 80 to 180 μm . By setting the thickness of the second film 22b to the above value, it is possible to suppress, for example, cracks or the like from occurring in the film.

As described above, the thickness of the film portion 22 including the first film 22a and the second film 22b is preferably in the range of 80 to 530 μm , more preferably in the range of 100 to 480 μm , and more preferably It lies in the range of 210 to 300 μm . As a result, as described above, the reaction between the ruthenium of the base portion 21 and the oxide of the film portion 22 is likely to occur, and generation of cracks or the like in the film can be suppressed.

Further, the porosity of the first film 22a and the second film 22b is preferably It is in the range of 15 to 35%, more preferably in the range of 20 to 30%. Thereby, in the first film 22a and the second film 22b, both the adhesion to the base portion 21 and the strength of the film portion 22 itself can be secured, and the baked product can be efficiently smothered during firing. The heat from the base portion 21 and the boundary portion 23 is transmitted.

In addition, the second film 22b of the layer of the two-layer film portion 22 facing the layer on the side of the base portion 21 is formed to contain an oxide such as zirconia. The zirconia is difficult to react with the object 30 to be fired during firing, that is, it has a so-called incompatibility. Thereby, the second film 22b of the film portion 22 can be prevented from reacting with the object 30 to be fired during firing.

Further, in the above, the second film 22b is made of zirconia, but is not limited thereto. In other words, the second film 22b may be a ceramic having poor reactivity, and may contain, for example, titanium oxide.

Moreover, the linear expansion coefficient of the second film 22b is in the range of 1.0 to 2.5 times the linear expansion coefficient of the first film 22a. Specifically, the coefficient of linear expansion of the second film 22b is 2.25 × 10 ^-6 to 22.5 × 10 ^-6 /K, and the coefficient of linear expansion of the first film 22a (2.25 × 10 ^-6 to 9.0 × 10 ^-6 / K) The same degree, or higher value.

In the base material portion 21, the first film 22a, and the second film 22b, the respective linear expansion coefficients can be increased in the order of the base portion 21, the first film 22a, and the second film 22b. In other words, the base portion 21, the first film 22a, and the second film 22b can be arranged such that the linear expansion coefficient is stepwise. When the arrangement is performed in this manner, even if the temperature changes during the firing of the object 30, the difference in thermal expansion between the parts becomes small. Further, peeling of the first film 22a from the base portion 21 or peeling of the second film 22b from the first film 22a can be effectively suppressed.

Next, a process for manufacturing the above-described firing aid 1 (correct carrier plate 20) will be described. Fig. 5 is a flow chart showing the processing procedure for manufacturing the firing aid 1.

First, the base material portion 21 containing at least ruthenium is formed by the above-described reaction sintering (step S1). Next, the mounting surface 21a of the base material portion 21 formed in the step S1 is subjected to sandblasting to roughen the surface (step S2).

Further, in the above, the surface of the base material portion 21 is roughened by sand blasting, but is not limited thereto. In other words, the mounting surface 21a of the base material portion 21 may be polished by a grinding machine such as a belt sand mill, a disc mill or a straight shank mill, or a sandpaper or the like to roughen the surface.

Then, the mounting surface 21a of the base material portion 21 is covered with the film portion 22, and the boundary portion 23 is formed between the base portion 21 and the film portion 22 (step S3). Specifically, for example, the first film 22a is formed by the spraying method on the mounting surface 21a of the base portion 21, and then the second film 22b is formed by the spraying method on the first film 22a.

The above-described spraying method may be a gas plasma spraying, but is not limited thereto, and for example, water plasma spraying or the like may be used. Further, the carrier gas system uses Ar and N ₂ . Further, in order to increase the porosity of the molten film formed here, coarse particles having an average particle diameter of 160 to 300 μm ² are used, and the distance between the spray gun and the shelf is set to about 100 to 300 mm to form a spray. membrane.

Thereby, the boundary portion 23 is formed between the base portion 21 and the first film 22a, and the firing aid 1 (correctly the carrier plate 20) as shown in Fig. 3 is completed. In this manner, the film portion 22 is a spray film formed by a spray method, and in detail, for example, a spray material heated by plasma spray, for example, alumina or zirconia is sprayed. Film formation.

As described above, the film portion 22 can be easily formed on the base material portion 21 by using a spray method. Further, in the above, the film portion 22 is formed by a melt method, but is not limited thereto, and for example, CVD (chemical vapor deposition) or PVD (physical vapor deposition; physical) may be used. Other film forming methods such as vapor deposition).

(Example)

Next, an embodiment in which the baking aid 1 is manufactured in the above-described processing order will be described with reference to Table 1.

(Example 1)

As shown in Table 1, the chemical composition of the base material portion 21 in Example 1 was 75% by mass of niobium carbide, 21% by mass of tantalum nitride, and 4% by mass of alumina. Moreover, the porosity of the base material portion 21 was 35%, and the surface roughness Ra was 4 μm . In the first film 22a, the thickness was set to 100 μm and the porosity was 25%. In the second film 22b, the thickness was 150 μm and the porosity was 25%.

The above-described firing aid 1 is subjected to the following thermal shock test and thermal cycle test to verify the thermal shock resistance of the baking aid 1 and the number of thermal cycle tests until the film portion 22 peels off the base portion 21 The presence or absence of the reaction between the film portion 22 and the object 30 to be fired. The results of the verification are shown in Table 1.

Specifically, in the thermal shock test, the firing aid 1 is first placed in a furnace set at a predetermined temperature to be rapidly heated. In this state, it was kept for 1 hour, and it was taken out of the furnace and rapidly cooled. In the thermal shock resistance of Table 1, the temperature at which the material is cracked (broken) is indicated by the above conditions, and in the case where the material is cracked at a relatively high temperature of 600 ° C or higher, the crack is set to ◎, and the temperature is 500 ° C or higher. When the crack was not generated at 600 ° C, it was set to ○, and when it was less than 500 ° C, the crack was set to ×, and it was evaluated in a three-stage manner. Further, the thermal shock test temperature was started from 300 ° C, and the temperature was raised by 50 ° C each time until the test was continued until the damage was observed. Moreover, in the above-described three-stage evaluation, ◎ and ○ were regarded as evaluations satisfying the criteria of the baking aid.

In the thermal cycle test, first, set to 100 × 85mm On the square-sized baking aid 1 , a compact of 70 × 40 × 3 mm barium titanate powder was allowed to stand, and the temperature was raised to 1300 ° C in a reducing atmosphere. More specifically, the ambient temperature was raised to 1300 ° C over 5 hours, and the state was maintained for 1 hour. Next, the ambient temperature was lowered to a temperature before the temperature rise for 10 hours.

One of the above-described series of steps of temperature rise, temperature maintenance, and temperature reduction was set to one cycle, and the above cycle was repeated. Then, the number of times until the film portion 22 is peeled off from the base portion 21 and the presence or absence of the reaction between the film portion 22 and the object 30 to be fired are confirmed. Further, the granules to which the fired material 30 is adhered to the passenger board 20 are judged to be "reactive". Further, the heat cycle test was repeated, and when the film portion 22 was not peeled off more than 15 times, it was indicated as "15 ↑" in the column from the time when the film portion was peeled off in Table 1.

(Example 2)

In Example 2, the chemical composition of the base material portion 21 was 67% by mass of niobium carbide, 29% by mass of tantalum nitride, and 4% by mass of alumina. Moreover, the porosity of the base material portion 21 was 12%, and the surface roughness Ra was 20 μm . In the first film 22a, the thickness is 120 μm and the porosity is 25%. In the second film 22b, the thickness is 180 μm and the porosity is 25%. The thermal shock resistance of the baking aid 1 obtained in Example 2 and Examples 3 to 13 to be described later, the number of times until peeling of the film portion, and the presence or absence of the reaction between the film portion 22 and the object 30 to be fired are shown. In Table 1.

(Example 3)

In the third embodiment, the chemical composition of the base portion 21 is 54% by mass of lanthanum carbide, 40% by mass of lanthanum nitride, and 6% by mass of alumina. Moreover, the porosity of the base material portion 21 was 9%, and the surface roughness Ra was set to 6 μm . In the first film 22a, the thickness is 50 μm and the porosity is 15%. In the second film 22b, the thickness is 50 μm and the porosity is 25%.

(Example 4)

In the fourth embodiment, the chemical composition of the base portion 21 is 50% by mass of lanthanum carbide and 50% by mass of lanthanum nitride, and alumina is not contained. Moreover, the porosity of the base material portion 21 was 6%, and the surface roughness Ra was set to 8 μm . In the first film 22a, the thickness is 180 μm and the porosity is 35. In the second film 22b, the thickness is 320 μm and the porosity is 25%.

(Example 5)

In Example 5, the chemical composition of the base material portion 21 was 69% by mass of niobium carbide, 30% by mass of tantalum nitride, and 1% by mass of alumina. Moreover, the porosity of the base material portion 21 was 8%, and the surface roughness Ra was set to 8 μm . In the first film 22a and the second film 22b, the porosity of the second film 22b is set to 30%, and the other thickness or the porosity of the first film 22a is the same as that of the first embodiment.

(Example 6)

In Example 6, the chemical composition of the base material portion 21 was 59% by mass of lanthanum carbide, 32% by mass of lanthanum nitride, and 9% by mass of alumina. Moreover, the porosity of the base material portion 21 was 11%, and the surface roughness Ra was set to 8 μm . In addition, in the first film 22a and the second film 22b, the thickness of the first film 22a is set to 55%, and the other porosity and the thickness of the second film 22b are the same as those in the first embodiment.

(Example 7)

In the seventh embodiment, the chemical composition of the base portion 21 is 63% by mass of lanthanum carbide, 31% by mass of lanthanum nitride, and 6% by mass of alumina. Moreover, the porosity of the base material portion 21 was 9%, and the surface roughness Ra was set to 7 μm . The thickness and porosity of the first film 22a and the second film 22b are the same as those in the first embodiment.

(Example 8)

In Example 8, the chemical composition of the base material portion 21 was set to 66% by mass of lanthanum carbide, 30% by mass of lanthanum nitride, and 4% by mass of alumina. Moreover, the porosity of the base material portion 21 was 12%, and the surface roughness Ra was set to 6 μm . Further, in the first film 22a and the second film 22b, the thickness of the first film 22a is 165 μm , and the thickness of the second film 22b is 220 μm , and the porosity is the same as in the first embodiment.

(Example 9)

In the ninth embodiment, the chemical composition of the base material portion 21 is 70% by mass of tantalum carbide and 30% by mass of tantalum nitride, and alumina is not contained. Further, the porosity of the base portion 21 was 12%, and the surface roughness Ra was 2 μm . In addition, in the first film 22a and the second film 22b, the porosity of the first film 22a is set to 15%, and the other thickness and the porosity of the second film 22b are the same as those in the first embodiment.

(Embodiment 10)

In Example 10, the chemical composition of the base material portion 21 was 83% by mass of lanthanum carbide, 15% by mass of lanthanum nitride, and 2% by mass of alumina. Moreover, the porosity of the base material portion 21 was 38%, and the surface roughness Ra was set to 6 μm . Further, in the first film 22a, the thickness was 55 μm and the porosity was 10%, and in the second film 22b, the thickness was 40 μm and the porosity was 25%.

(Example 11)

In the eleventh embodiment, the chemical composition of the base portion 21 is set to 45 mass% of niobium carbide and 55 mass% of niobium nitride, and alumina is not contained. Moreover, the porosity of the base material portion 21 was 4%, and the surface roughness Ra was set to 6 μm . In the first film 22a, the thickness is 150 μm and the porosity is 25%. In the second film 22b, the thickness is 270 μm and the porosity is 10%.

(Embodiment 12)

In Example 12, the chemical composition of the base material portion 21 was 71% by mass of niobium carbide and 29% by mass of niobium nitride, and no alumina was contained. Moreover, the porosity of the base material portion 21 was 6%, and the surface roughness Ra was set to 6 μm . Further, in the first film 22a and the second film 22b, the thickness of the first film 22a is 40 μm , and the thickness of the second film 22b is 55 μm , and the porosity is the same as in the first embodiment.

(Example 13)

In Example 13, the chemical composition of the base material portion 21 was 57% by mass of lanthanum carbide, 30% by mass of lanthanum nitride, and 13% by mass of alumina. Moreover, the porosity of the base material portion 21 was set to 15%, and the surface roughness Ra was set to 14 μm . Further, in the first film 22a and the second film 22b, the thickness of the first film 22a is 210 μm , and the thickness of the second film 22b is 300 μm , and the porosity is the same as in the first embodiment.

(Example 14)

In Example 14, the chemical composition of the base material portion 21 was set to 100% by mass of niobium carbide, and no tantalum nitride and aluminum oxide were contained. Moreover, the porosity of the base material portion 21 was 31%, and the surface roughness Ra was set to 5 μm . The thickness and the porosity of the first film 22a and the second film 22b are the same as those in the first embodiment.

(Example 15)

In Example 15, the chemical composition of the base material portion 21 was set to 100% by mass of tantalum nitride, and ruthenium carbide and alumina were not contained. Moreover, the porosity of the base material portion 21 was 4%, and the surface roughness Ra was set to 6 μm . In addition, in the first film 22a and the second film 22b, the porosity of the second film 22b is set to 10%, and the other thickness and the porosity of the first film 22a are the same as those in the first embodiment.

As shown in Table 1, in the firing aids of Examples 1 to 15, the thermal shock resistance was relatively high, and the number of times until the film portion 22 was peeled off was also relatively large. Further, the reaction between the film portion 22 and the object 30 to be fired was not observed.

(Comparative Example 1)

On the other hand, in Comparative Example 1, the chemical composition of the base portion 21 was set to 100% by mass of alumina, and ruthenium was not contained, specifically, ruthenium carbide and tantalum nitride were not contained. Moreover, the porosity of the base material portion 21 was 12%, and the surface roughness Ra was 29 μm . The thickness and porosity of the first film 22a and the second film 22b are the same as those in the first embodiment. In the baking aid 1 obtained in Comparative Example 1, as shown in Table 1, the thermal shock resistance was lowered, and the number of times until peeling occurred was also reduced.

(Comparative Example 2)

In Comparative Example 2, the chemical composition of the base material portion 21 was set to 64% by mass of lanthanum carbide, 30% by mass of lanthanum nitride, and 6% by mass of alumina. Further, the porosity of the base portion 21 was 12%, and the surface roughness Ra was 2 μm . Further, the film portion 22 does not have the second film 22b, and only the first film 22a. Further, the thickness of the first film 22a was set to 90 μm , and the porosity was set to 10%. In the baking aid 1 obtained in Comparative Example 2, since the second film 22b is not provided, the reaction between the film portion 22 and the object 30 to be fired is observed.

(Comparative Example 3)

In Comparative Example 3, the chemical composition of the base material portion 21 was 59% by mass of lanthanum carbide, 32% by mass of lanthanum nitride, and 9% by mass of alumina. Further, the porosity of the base portion 21 was 12%, and the surface roughness Ra was 2 μm . Further, the film portion 22 does not include the first film 22a, and only the second film 22b. Further, the thickness of the second film 22b was set to 150 μm , and the porosity was set to 25%. In the firing aid 1 obtained in Comparative Example 3, since the first film 22a is not provided, peeling occurs immediately between the film portion 22 and the base portion 21.

As described above, the baking aid 1 of the present embodiment includes the base portion 21, the film portion 22 of two or more layers, and the boundary portion 23. The base material portion 21 has a mounting surface 21a on which the object 30 to be placed is placed, and contains at least ruthenium. The film portion 22 of two or more layers covers the mounting surface 21a of the base material portion 21 and contains an oxide-based ceramic. The boundary portion 23 is formed between the base portion 21 and the film portion 22 and contains a composite oxide containing ruthenium.

In this way, the base material 21 having high thermal shock resistance is provided in the baking aid 1 , and the adhesion between the base portion 21 and the film portion 22 can be improved, and the film portion 22 can be suppressed from being applied to the base portion 21 . Stripped.

In the above, the film portion 22 is formed of two layers of the first film 22a of the underground layer and the second film 22b of the surface layer. However, the film portion 22 is not limited thereto, and may be three or more layers.

Moreover, in the above, the base portion 21 is formed by reaction sintering, but the present invention is not limited thereto, and may be formed by another sintering method such as normal pressure sintering or pressure sintering.

Further, in the first drawing, one firing aid 1 is shown, but the present invention is not limited thereto, and a plurality of firing aids 1 may be stacked, and a plurality of firing aids 1 placed in a plurality of stages may be placed. The fired product 30 is fired once.

As described above, the present embodiment provides a method for producing a firing aid and a firing aid which have higher thermal shock resistance than conventional products and which are completely free from reaction with the fired electronic components.

Further effects and modifications are readily available to those skilled in the art of the present invention. Therefore, the invention in its broader aspects is not intended to Therefore, various modifications may be made without departing from the spirit and scope of the inventions of the inventions.

1‧‧‧Burning aids

20‧‧‧Travel board

21‧‧‧Parts

21a‧‧‧(Material part) mounting surface

22‧‧‧Mouth Department

22a‧‧‧1st film

22b‧‧‧2nd film

23‧‧‧Borders Department

30‧‧‧Furned goods

Claims (10)

A baking aid includes: a substrate having a mounting surface on which the object to be fired is placed, and at least a base portion; the mounting surface covering the base portion and the oxide ceramic layer The film portion described above; and a boundary portion formed between the base material portion and the film portion and containing a composite oxide containing ruthenium. The baking aid according to claim 1, wherein the base material portion has a porosity of 5 to 35%. The firing aid according to the first or second aspect of the invention, wherein the film portion is a linear expansion coefficient of a ceramic constituting a layer facing the side surface of the base portion of the film portion of two or more layers. It is in the range of 0.5 to 2 times the linear expansion coefficient of the base material portion. The baking aid according to the first or second aspect of the invention, wherein the base material portion contains at least one of tantalum carbide and tantalum nitride. In the above-mentioned film portion of the two or more layers, the layer other than the layer on the side of the base material portion contains zirconia. In the above-mentioned film portion of the two or more layers, the layer facing the base material portion contains alumina, cerium oxide, and molybdenum, in the firing aid according to the first or second aspect of the invention. More than one type of stone. The firing aid according to the first or second aspect of the invention, wherein the composite oxide of the boundary portion further contains aluminum. The baking aid according to claim 4, wherein the base material portion contains 45 to 75 mass% of the niobium carbide and 20 to 50 mass% of the niobium nitride. The firing aid according to the first or second aspect of the invention, wherein the thickness of the film portion is within a range of 80 to 530 μm. A method for producing a baking aid includes the steps of: forming a substrate having a mounting surface on which a workpiece is placed and containing at least a crucible; and mounting the surface of the substrate portion The film portion covering two or more layers of the oxide-based ceramic covers a step of forming a boundary portion containing a composite oxide containing ruthenium between the base material portion and the film portion.