TW201607602A - Mist collecting device - Google Patents
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Abstract
Description
本發明是有關於一種霧收集裝置。 The present invention relates to a mist collecting device.
在半導體製程中所使用的切削裝置與磨削裝置,是被設定在被高清淨度的環境氣體(清淨空氣)所充滿的無塵室中。清淨空氣是以精密過濾器將粉塵捕獲而被製造出來的,需要花費成本。又,切削裝置與磨削裝置等之加工裝置,是一邊供給加工水一邊加工晶圓等被加工物。被供給到加工裝置之加工水,通常是被稱為純水之已去除掉不純物之成本較高的水,且會與加工屑一起被廢棄。 The cutting device and the grinding device used in the semiconductor manufacturing process are set in a clean room filled with high-purity ambient gas (clean air). Clean air is produced by capturing dust with a precision filter, which is costly. Further, the processing device such as the cutting device and the grinding device processes a workpiece such as a wafer while supplying the processing water. The processing water supplied to the processing apparatus is usually a high-cost water called pure water which has been removed from the impurities, and is discarded together with the processing chips.
將成本高的純水之大量廢棄作為課題,而用於再利用之加工廢液處理裝置已在開發中(參照例如專利文獻1)。雖然藉由加工廢液處理裝置,可使再利用大部分的加工水之作法變得可行,但是在加工裝置之加工室的環境氣體中,形成霧而飛散的加工水,會和加工室的環境氣體一起被排出,而無法再利用。於是,目前已在開發的有在加工裝置內進行環境氣體中的霧的捕獲之裝置(參照例如專利文獻2)。 A large amount of pure water having a high cost has been discarded as a problem, and a processing waste liquid processing apparatus for recycling has been developed (see, for example, Patent Document 1). Although it is possible to reuse most of the processed water by processing the waste liquid processing apparatus, in the ambient gas of the processing chamber of the processing apparatus, the processing water which forms fog and scatters, and the environment of the processing room The gases are discharged together and cannot be reused. Then, there has been developed a device for capturing mist in an environmental gas in a processing apparatus (see, for example, Patent Document 2).
專利文獻1:日本專利特許第5086123號公報 Patent Document 1: Japanese Patent No. 5086123
專利文獻2:日本專利特開2012-151263號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2012-151263
但是,在加工裝置內進行環境氣體中之霧的捕獲的裝置上,在提升霧的捕獲量之點上還有進一步改善的空間。 However, in the apparatus for capturing the mist in the ambient gas in the processing apparatus, there is room for further improvement in the point of increasing the amount of mist captured.
本發明即是有鑒於上述而作成的發明,其目的在於提供一種可以謀求霧的捕獲量提升之霧收集裝置。 The present invention has been made in view of the above, and an object of the invention is to provide a mist collecting device capable of improving the amount of mist captured.
為了解決上述課題並達成目的,本發明為一種在加工室內一邊對被加工物供給加工水一邊從施行加工之加工裝置吸引加工室的環境氣體,並從所吸引之環境氣體中收集霧的霧收集裝置,特徵在於,其是由下述所構成:連結於加工室之吸引導管;透過吸引導管將加工室之環境氣體吸引並排出的風扇單元;以及連接在吸引導管與風扇單元之間,並將環境氣體中的霧捕獲以去除的霧去除機構。霧去除機構包括:連結風扇單元,且在風扇單元產生之氣流的上流側連結吸引導管的筐體;收容於筐體之霧捕獲部;及透過筐體下端部的流出口將捕獲到之霧所形成的液體進行排水的排水機構。霧捕獲部包括位於氣流上流側之第1除 霧器(demister)、及位於氣流下流側且較第1除霧器細密結構的第2除霧器。在第1除霧器與第2除霧器之間,配置有冷卻所通過之氣流的冷卻機構,且透過風扇單元所排出之清淨空氣會被排出到無塵室內或回到加工室。 In order to solve the above problems and achieve the object, the present invention provides an environment gas that is sucked into a processing chamber from a processing device that performs processing while supplying processing water to a workpiece in a processing chamber, and collects mist from the collected ambient gas. The apparatus is characterized in that it is constituted by: a suction duct connected to the processing chamber; a fan unit that sucks and discharges ambient gas of the processing chamber through the suction duct; and is connected between the suction duct and the fan unit, and The mist in the ambient gas is captured to remove the mist removal mechanism. The mist removing mechanism includes a casing that connects the fan unit and connects the suction duct to the upstream side of the airflow generated by the fan unit, a mist capturing portion that is housed in the casing, and a mist that is captured through the outlet of the lower end of the casing. The formed liquid drains the drainage mechanism. The mist capture section includes the first division on the upstream side of the airflow A demister and a second mist eliminator located on the downstream side of the airflow and having a finer structure than the first demister. A cooling mechanism for cooling the airflow passing therethrough is disposed between the first mist eliminator and the second mist eliminator, and the clean air discharged through the fan unit is discharged into the clean room or returned to the processing chamber.
又,較理想的是,在上述霧收集裝置中,排水機構具備有抵抗筐體內之負壓以將液體吸引而排出的抽氣機(aspirator)、蓄積由抽氣機所排出之液體的蓄水部、及將蓄水部所蓄積之水供給到抽氣機,且使其產生負壓的供給泵。 Further, in the mist collecting device, the drain mechanism is provided with an aspirator that resists the negative pressure in the casing to suck and discharge the liquid, and accumulates the water discharged by the liquid discharged from the air extractor. The portion and the supply pump that supplies the water accumulated in the water storage unit to the air extractor and generates a negative pressure.
又,較理想的是,在上述霧收集裝置中,冷卻機構可透過溫度來控制所排出之清淨空氣的濕度。 Further, preferably, in the mist collecting device, the cooling mechanism can control the humidity of the cleaned air discharged through the temperature.
根據本發明,藉由以冷卻機構冷卻通過第1除霧器後之氣流,可以使通過第1除霧器後之氣流中的飽和水蒸氣量比冷卻前相對地減少,並促使已通過第1除霧器之霧的粒徑變大,而變得易於以網孔比第1除霧器還要細密的第2除霧器捕獲霧。因此,根據本發明,可以謀求霧的捕獲量提升。 According to the present invention, by cooling the airflow passing through the first mist eliminator by the cooling mechanism, the amount of saturated water vapor in the airflow passing through the first mist eliminator can be relatively reduced compared with that before cooling, and the first pass can be made. The particle size of the mist of the mist eliminator becomes large, and it becomes easy to capture the mist with the second mist eliminator whose mesh is finer than the first mist eliminator. Therefore, according to the present invention, it is possible to increase the amount of mist captured.
1‧‧‧霧收集裝置 1‧‧‧Fog collection device
10‧‧‧吸引導管 10‧‧‧Attraction catheter
20‧‧‧風扇單元 20‧‧‧Fan unit
21‧‧‧單元筐體 21‧‧‧unit housing
21a‧‧‧排出口 21a‧‧‧Export
22‧‧‧風扇 22‧‧‧Fan
23‧‧‧空氣過濾器 23‧‧‧Air filter
30‧‧‧霧去除機構 30‧‧‧Fog removal mechanism
31‧‧‧筐體 31‧‧‧Shell
31a‧‧‧吸引口 31a‧‧‧ attracting mouth
31b‧‧‧連結口 31b‧‧‧ link
32‧‧‧霧捕獲部 32‧‧‧Fog capture department
32a‧‧‧第1除霧器 32a‧‧‧1st defogger
32b‧‧‧第2除霧器 32b‧‧‧2nd mist eliminator
33‧‧‧排水機構 33‧‧‧Drainage mechanism
33a‧‧‧傾斜面 33a‧‧‧ sloped surface
33b‧‧‧流出口 33b‧‧‧Export
33c‧‧‧排水管 33c‧‧‧Drainage pipe
33d‧‧‧抽氣機 33d‧‧‧Air pump
33e‧‧‧蓄水部 33e‧‧‧Water Storage Department
33f‧‧‧供給泵 33f‧‧‧Supply pump
34‧‧‧冷卻機構 34‧‧‧Cooling mechanism
40‧‧‧排出導管 40‧‧‧Draining catheter
50‧‧‧控制機構 50‧‧‧Control agency
51‧‧‧清淨空氣溫度檢測部 51‧‧‧Clean air temperature detection department
52‧‧‧清淨空氣濕度檢測部 52‧‧‧Clean air humidity detection department
53‧‧‧清淨空氣溫度調整部 53‧‧‧Clean air temperature adjustment department
54‧‧‧清淨空氣濕度調整部 54‧‧‧Clean air humidity adjustment department
55‧‧‧切換部 55‧‧‧Switching Department
56‧‧‧水位調整部 56‧‧‧Water level adjustment department
100‧‧‧加工裝置 100‧‧‧Processing device
110‧‧‧加工室 110‧‧‧Processing room
120‧‧‧工作夾台 120‧‧‧Working table
130‧‧‧切削機構 130‧‧‧ cutting mechanism
F‧‧‧氣流 F‧‧‧Airflow
L‧‧‧液體 L‧‧‧Liquid
W‧‧‧被加工物 W‧‧‧Processed objects
圖1為顯示實施形態之霧收集裝置的構成例之圖。 Fig. 1 is a view showing a configuration example of a mist collecting device of an embodiment.
針對用於實施本發明之形態(實施形態),參照著 圖式作更詳細之說明。本發明並不因以下的實施形態所記載之內容而受到限制。又,在以下所記載之構成要素中,含有本發明所屬技術領域中具有通常知識者可輕易設想得到的或實質上是相同者。此外,以下所記載之構成均可適當地組合。又,在不脫離本發明的要旨的範圍內,可進行各種構成之省略、置換或變更。 For the embodiment (embodiment) for carrying out the invention, reference is made to The schema is explained in more detail. The present invention is not limited by the contents described in the following embodiments. Further, among the constituent elements described below, those having ordinary knowledge in the technical field to which the present invention pertains can be easily conceived or substantially identical. Further, the configurations described below can be combined as appropriate. Further, various configurations may be omitted, substituted, or changed without departing from the spirit and scope of the invention.
[實施形態] [Embodiment]
圖1為顯示實施形態之霧收集裝置的構成例之圖。再者,在圖1中所顯示的也是與實施形態有關之霧收集裝置的使用例。 Fig. 1 is a view showing a configuration example of a mist collecting device of an embodiment. Further, an example of use of the mist collecting device according to the embodiment is shown in Fig. 1.
圖1所示之霧收集裝置1為收集加工裝置100之加工室110之環境氣體中的霧的裝置。霧收集裝置1是設置於例如半導體製造工廠等之無塵室內。霧收集裝置1,如圖1所示,是包含吸引導管10、風扇單元20、霧去除機構30、排出導管40、及控制機構50而構成。 The mist collecting device 1 shown in Fig. 1 is a device for collecting mist in the ambient gas of the processing chamber 110 of the processing device 100. The mist collecting device 1 is installed in a clean room such as a semiconductor manufacturing factory. As shown in FIG. 1, the mist collecting device 1 includes a suction duct 10, a fan unit 20, a mist removing mechanism 30, a discharge duct 40, and a control unit 50.
在此,加工裝置100是對被加工物W施行切削加工之切削裝置(切割機(dicer))。加工裝置100是與霧收集裝置1同樣地被設置於無塵室內。加工裝置100具備有在加工室110內保持被加工物W之工作夾台120、和切削保持於工作夾台120上之被加工物W之切削機構130。切削機構130可一邊將例如純水等之加工水供給到被加工物W上,一邊對被加工物W施行切削加工。被加工物W並無特別限制,可為例如半導體晶圓或光裝置晶圓、無機材料基板、延性樹脂材料基板等各種加工材料。 Here, the processing apparatus 100 is a cutting apparatus (dicer) that performs a cutting process on the workpiece W. The processing apparatus 100 is installed in a clean room similarly to the mist collection apparatus 1. The processing apparatus 100 includes a work chuck 120 that holds the workpiece W in the processing chamber 110, and a cutting mechanism 130 that cuts and holds the workpiece W on the work chuck 120. The cutting mechanism 130 can perform the cutting process on the workpiece W while supplying the processing water such as pure water to the workpiece W. The workpiece W is not particularly limited, and may be various processing materials such as a semiconductor wafer, an optical device wafer, an inorganic material substrate, and a ductile resin material substrate.
吸引導管10是使加工室110與霧去除機構30連通之空氣導管。吸引導管10的一端部是被連結到加工室110。吸引導管10的另一端部是被連結到霧去除機構30之後述的筐體31。 The suction duct 10 is an air duct that connects the processing chamber 110 with the mist removing mechanism 30. One end of the suction duct 10 is coupled to the processing chamber 110. The other end portion of the suction duct 10 is a housing 31 to be described later, which is coupled to the mist removing mechanism 30.
風扇單元20是透過吸引導管10將加工室110的環境氣體吸引並排出之單元。風扇單元20是以可相對於筐體31裝卸的方式被連結。風扇單元20之單元筐體21的排出口21a,與排出導管40連結,也相對於無塵室形成開放。單元筐體21內配置有風扇22與空氣過濾器23。 The fan unit 20 is a unit that sucks and discharges the ambient gas of the processing chamber 110 through the suction duct 10. The fan unit 20 is coupled to be detachable from the casing 31. The discharge port 21a of the unit casing 21 of the fan unit 20 is connected to the discharge duct 40, and is also opened to the clean room. A fan 22 and an air filter 23 are disposed in the unit casing 21.
風扇22是相對單元筐體21被設置成與排出口21a為相反側。風扇22可由例如多葉片式風扇(sirocco fan)或渦輪風扇(turbofan)等離心風扇、螺槳風扇(propeller fan)等之軸流風扇等所構成。風扇22會形成從與排出口21a為相反側處流向排出口21a側的氣流F。亦即,風扇22會產生從霧去除機構30側朝向風扇單元20側流動的氣流F。又,風扇22會藉由產生氣流F,亦即藉由吸引霧去除機構30之筐體31內的空氣,而將筐體31內的氣壓相對於無塵室內之氣壓形成負壓。 The fan 22 is disposed opposite to the discharge port 21a with respect to the unit casing 21. The fan 22 can be constituted by, for example, a centrifugal fan such as a sirocco fan or a turbofan, an axial fan such as a propeller fan, or the like. The fan 22 forms a gas flow F that flows from the side opposite to the discharge port 21a toward the discharge port 21a side. That is, the fan 22 generates the airflow F flowing from the mist removing mechanism 30 side toward the fan unit 20 side. Further, the fan 22 generates a negative pressure by generating the air flow F, that is, by sucking the air in the casing 31 of the mist removing mechanism 30, and the air pressure in the casing 31 with respect to the air pressure in the clean room.
空氣過濾器23是相對於單元筐體21設置在與風扇22為相反側(亦即排出口21a側)。空氣過濾器23是由例如HEPA過濾器(High Efficiency Particulate Air Filter)或ULPA過濾器(Ultra Low Penetration Air Filter)等所構成。因此,從風扇單元20之排出口21a會排出清淨空氣。亦即,透過風扇單元20排出之清淨空氣會透過導管而被排出到無塵室內, 或透過排出導管40而回到加工室110。 The air filter 23 is provided on the opposite side of the fan 22 (that is, on the side of the discharge port 21a) with respect to the unit casing 21. The air filter 23 is constituted by, for example, a HEPA filter (High Efficiency Particulate Air Filter) or a ULPA filter (Ultra Low Penetration Air Filter). Therefore, the clean air is discharged from the discharge port 21a of the fan unit 20. That is, the clean air discharged through the fan unit 20 is discharged into the clean room through the duct. Or return to the processing chamber 110 through the discharge conduit 40.
霧去除機構30是用於將透過吸引導管10而被吸引之加工室110之環境氣體中的霧予以捕獲而去除之機構。霧去除機構30是連接於吸引導管10與風扇單元20之間。亦即,霧去除機構30會被連接到吸引導管10與風扇單元20,而連通吸引導管10與風扇單元20。霧去除機構30具備有筐體31、霧捕獲部32、排水機構33與冷卻機構34。 The mist removing mechanism 30 is a mechanism for capturing and removing mist in the environmental gas of the processing chamber 110 that has been sucked through the suction duct 10 . The mist removing mechanism 30 is connected between the suction duct 10 and the fan unit 20. That is, the mist removing mechanism 30 is connected to the suction duct 10 and the fan unit 20 to communicate the suction duct 10 and the fan unit 20. The mist removing mechanism 30 includes a casing 31, a mist catching unit 32, a drain mechanism 33, and a cooling mechanism 34.
筐體31是形成為例如箱形,且在其內部之空間內收容有霧捕獲部32以及冷卻機構34。在筐體31中,是將吸引導管10連結在風扇單元20所產生之氣流F的上流側,並將風扇單元20連結在風扇單元20所產生之氣流F的下流側。在本實施形態中,是將吸引導管10連結在形成於筐體31之吸引口31a上,並將風扇單元20連結在與吸引口31a為相反側之形成於筐體31的連結口31b上。再者,在本實施形態中,筐體31中的氣流F的上流側為吸引口31a側,是氣流F的來側。又,在本實施形態中,筐體31中的氣流F的下流側為連結口31b側,是氣流F的前進側。 The casing 31 is formed, for example, in a box shape, and accommodates a mist catching portion 32 and a cooling mechanism 34 in a space inside thereof. In the casing 31, the suction duct 10 is coupled to the upstream side of the airflow F generated by the fan unit 20, and the fan unit 20 is coupled to the downstream side of the airflow F generated by the fan unit 20. In the present embodiment, the suction duct 10 is coupled to the suction port 31a formed in the casing 31, and the fan unit 20 is coupled to the connection port 31b formed in the casing 31 on the side opposite to the suction port 31a. Further, in the present embodiment, the upstream side of the airflow F in the casing 31 is the suction port 31a side and is the side of the airflow F. Further, in the present embodiment, the downstream side of the airflow F in the casing 31 is the side of the connection port 31b, and is the forward side of the airflow F.
霧捕獲部32被收容納於筐體31內。霧捕獲部32具備有第1除霧器32a與第2除霧器32b。第1除霧器32a及第2除霧器32b是例如將不鏽鋼絲編織成針織(medias)狀的金屬網複數片疊合而構成之所謂的金屬絲網除霧器(wire mesh demister)。第1除霧器32a及第2除霧器32b各自藉由例如使霧相對於不鏽鋼絲進行慣性衝撞,或是使不鏽鋼絲對霧直接阻隔的方式,來分離空氣與霧,並生成由霧所形成的液 體L。第1除霧器32a與第2除霧器32b是互相隔著間隔而被配置。第1除霧器32a與第2除霧器32b之間配置有用以冷卻要通過第2除霧器32b之氣流F的冷卻機構34。 The mist catching portion 32 is housed in the casing 31. The mist trap unit 32 includes a first mist eliminator 32a and a second mist eliminator 32b. The first mist eliminator 32a and the second mist eliminator 32b are, for example, so-called wire mesh demisters in which a plurality of metal meshes in which a stainless steel wire is woven into a mediums are superposed. Each of the first mist eliminator 32a and the second mist eliminator 32b separates air and mist by, for example, causing the mist to collide with the stainless steel wire in an inertial manner or directly blocking the stainless steel wire from the mist, and generates a mist. Formed liquid Body L. The first mist eliminator 32a and the second mist eliminator 32b are disposed at intervals from each other. A cooling mechanism 34 for cooling the airflow F to be passed through the second mist eliminator 32b is disposed between the first mist eliminator 32a and the second mist eliminator 32b.
第1除霧器32a是在筐體31中被配置於氣流F的上流側。第1除霧器32a之篩網是例如網孔比第2除霧器32b還粗大之篩網。第2除霧器32b是在筐體31中被配置於氣流F的下流側。第2除霧器32b之篩網是例如網孔比第1除霧器32a還細密的篩網。 The first mist eliminator 32a is disposed on the upstream side of the airflow F in the casing 31. The screen of the first mist eliminator 32a is, for example, a screen having a larger mesh than the second mist eliminator 32b. The second mist eliminator 32b is disposed on the downstream side of the airflow F in the casing 31. The screen of the second mist eliminator 32b is, for example, a screen whose mesh is finer than the first mist eliminator 32a.
排水機構33是透過筐體31下端部的流出口33b,排放以第1除霧器32a與第2除霧器32b所捕獲到之霧所形成的液體L的機構。排水機構33具備有傾斜面33a、流出口33b、排水管33c、抽氣機33d、蓄水部33e、及供給泵33f。 The drain mechanism 33 is a mechanism that passes through the outflow port 33b at the lower end portion of the casing 31, and discharges the liquid L formed by the mist captured by the first mist eliminator 32a and the second mist eliminator 32b. The drain mechanism 33 includes an inclined surface 33a, an outflow port 33b, a drain pipe 33c, an air blower 33d, a water storage portion 33e, and a supply pump 33f.
傾斜面33a是從氣流F的上流側朝下流側,使筐體31內之底面的鉛直方向之位置慢慢降低而形成。 The inclined surface 33a is formed from the upstream side of the airflow F toward the downstream side, and the position of the bottom surface of the casing 31 in the vertical direction is gradually lowered.
流出口33b是在傾斜面33a中形成於氣流F下流側之端部。 The outflow port 33b is an end portion formed on the downstream side of the airflow F in the inclined surface 33a.
排水管33c是從筐體31往鉛直方向下方延伸。排水管33c的一個端部是連結於流出口33b。排水管33c的另一個端部是透過例如橡膠管等而連結於抽氣機33d之吸入口。 The drain pipe 33c extends downward from the casing 31 in the vertical direction. One end of the drain pipe 33c is connected to the outflow port 33b. The other end of the drain pipe 33c is connected to the suction port of the air extractor 33d through, for example, a rubber pipe.
抽氣機33d是抵抗筐體31內之負壓以將液體L吸引而排出的構成。抽氣機33d是一般的抽氣機,其具有:將由供給泵33f所供給之水吐出的文氏噴嘴(Venturi nozzle)、設於文氏噴嘴的前端部周圍的筒部、設於筒部而與筒部內 連通的吸入口、和設於筒部而與文氏噴嘴的前端部連通的擴散器(diffuser)。抽氣機33d會將由文氏噴嘴所吐出之水以及從吸入口吸入之液體L各自排出至蓄水部33e。 The air blower 33d is configured to withstand the negative pressure in the casing 31 to suck and discharge the liquid L. The air extractor 33d is a general air extractor that has a Venturi nozzle that discharges water supplied from the supply pump 33f, a cylindrical portion that is provided around the tip end portion of the Venturi nozzle, and is provided in the tubular portion. Inside the tube A communicating suction port and a diffuser that is provided in the tubular portion and communicates with the front end portion of the Venturi nozzle. The air blower 33d discharges the water discharged from the Venturi nozzle and the liquid L sucked from the suction port to the water storage portion 33e.
蓄水部33e是將藉由抽氣機33d從筐體31內吸引而排出的液體L予以蓄積的構成。在本實施形態中,蓄水部33e所蓄積之水是由以第1除霧器32a與第2除霧器32b所捕獲的霧形成的液體L。又,蓄水部33e所蓄積之水,可藉由例如加工廢液處理裝置,作為加工水再生而被供給到加工裝置100中,其中該加工廢液處理裝置是用以處理在加工裝置100之加工時所供給之加工水的廢液。 The water storage unit 33e is configured to accumulate the liquid L discharged by sucking from the inside of the casing 31 by the air blower 33d. In the present embodiment, the water accumulated in the water storage portion 33e is the liquid L formed by the mist captured by the first mist eliminator 32a and the second mist eliminator 32b. Further, the water accumulated in the water storage unit 33e can be supplied to the processing apparatus 100 as processing water regeneration by, for example, a processing waste liquid processing apparatus for processing the processing apparatus 100. Waste liquid of processing water supplied during processing.
冷卻機構34是在筐體31內,配置於第1除霧器32a與第2除霧器32b之間。冷卻機構34是將通過第1除霧器32a後,要通過第2除霧器32b前的氣流F冷卻。亦即,冷卻機構34是用以冷卻要通過第2除霧器32b的氣流F。再者,在本實施形態中,所謂的冷卻氣流F是指將已通過第1除霧器32a的空氣冷卻。 The cooling mechanism 34 is disposed in the casing 31 between the first demister 32a and the second demister 32b. The cooling mechanism 34 cools the airflow F before passing through the second mist eliminator 32b after passing through the first defogger 32a. That is, the cooling mechanism 34 is for cooling the airflow F to be passed through the second mist eliminator 32b. Further, in the present embodiment, the so-called cooling airflow F means that the air that has passed through the first mist eliminator 32a is cooled.
又,冷卻機構34是例如將圖未示之迷路板(又稱為緩衝板)等交互地配置複數個,而將已通過第1除霧器32a之空氣的流動流路形成為迷路狀。在本實施形態中,冷卻機構34在筐體31內具有圖未示之冷卻管,該冷卻管可供併設於例如半導體製造工廠之冷凝器(chiller)等所冷卻之水流動。再者,較理想的是,將冷卻管構成為可對已通過第1除霧器32a之空氣進行熱交換。 Further, the cooling mechanism 34 is configured such that a plurality of lost plates (also referred to as a buffer plate), which are not shown, are alternately arranged, and the flow path of the air that has passed through the first demister 32a is formed in a lost shape. In the present embodiment, the cooling mechanism 34 has a cooling pipe (not shown) in the casing 31, and the cooling pipe can flow in water cooled by a chiller or the like provided in, for example, a semiconductor manufacturing plant. Further, it is preferable that the cooling pipe is configured to exchange heat with the air that has passed through the first mist eliminator 32a.
又,冷卻機構34是藉由溫度來控制排出至無塵室 內的清淨空氣或返回加工室110之清淨空氣的濕度。亦即,冷卻機構34是藉由控制已通過第1除霧器32a之空氣的溫度,來控制可在第2除霧器32b被捕獲的霧的捕獲量。 Moreover, the cooling mechanism 34 is controlled to discharge to the clean room by temperature. The clean air inside or the humidity of the clean air returning to the processing chamber 110. That is, the cooling mechanism 34 controls the amount of trapping of the mist that can be captured in the second mist eliminator 32b by controlling the temperature of the air that has passed through the first mist eliminator 32a.
排出導管40是使加工室110與風扇單元20連通的空氣導管。排出導管40的一端部會被連結到加工室110。排出導管40的另一端部會被連結到單元筐體21之排出口21a。 The discharge duct 40 is an air duct that connects the processing chamber 110 with the fan unit 20. One end of the discharge duct 40 is coupled to the processing chamber 110. The other end portion of the discharge duct 40 is coupled to the discharge port 21a of the unit casing 21.
控制機構50是控制霧收集裝置1整體之動作的機構。控制機構50是例如具有CPU(Central Processing Unit)、ROM(Read Only Memory)或RAM(Random Access Memory)等之微電腦。在功能概念上,控制機構50是包含清淨空氣溫度檢測部51、清淨空氣濕度檢測部52、清淨空氣溫度調整部53、清淨空氣濕度調整部54、切換部55與水位調整部56而構成。 The control mechanism 50 is a mechanism that controls the overall operation of the mist collecting device 1. The control unit 50 is, for example, a microcomputer having a CPU (Central Processing Unit), a ROM (Read Only Memory), or a RAM (Random Access Memory). In terms of function, the control mechanism 50 includes a clean air temperature detecting unit 51, a clean air humidity detecting unit 52, a clean air temperature adjusting unit 53, a clean air humidity adjusting unit 54, a switching unit 55, and a water level adjusting unit 56.
清淨空氣溫度檢測部51是例如根據設置於風扇單元20之圖未示的溫度感測器所輸出的檢測訊號,來檢測排出到無塵室內之清淨空氣或回到加工室110之清淨空氣的溫度。 The clean air temperature detecting unit 51 detects the temperature of the clean air discharged into the clean room or the clean air returned to the processing chamber 110, for example, based on the detection signal output from the temperature sensor not shown in the figure of the fan unit 20. .
清淨空氣濕度檢測部52是例如根據設置於風扇單元20之圖未示的濕度感測器所輸出的檢測訊號,來檢測排出至無塵室內之清淨空氣或回到加工室110之清淨空氣的相對濕度。 The clean air humidity detecting unit 52 detects the relative air discharged into the clean room or the clean air returned to the processing chamber 110, for example, based on a detection signal output from a humidity sensor not shown in the figure of the fan unit 20. humidity.
清淨空氣溫度調整部53是根據清淨空氣溫度檢測部51所檢測的溫度,將以冷卻機構34冷卻且已通過第2除 霧器32b之空氣,藉由例如設置於風扇單元20之圖未示的加熱機構進行加熱,以使排出至無塵室內之清淨空氣或回到加工室110之清淨空氣的溫度成為預定之溫度。亦即,清淨空氣溫度調整部53是藉由調整由加熱機構所形成之空氣的加熱溫度,以調整清淨空氣之溫度。在此,清淨空氣之預定溫度可為與無塵室內之環境氣體的溫度及加工室110內之環境氣體的溫度相同之溫度,且可為由操作員所設定之任意的溫度。 The clean air temperature adjusting unit 53 is cooled by the cooling mechanism 34 and has passed the second division based on the temperature detected by the clean air temperature detecting unit 51. The air of the mister 32b is heated by, for example, a heating means (not shown) provided in the fan unit 20 so that the temperature of the clean air discharged into the clean room or the clean air returned to the processing chamber 110 becomes a predetermined temperature. That is, the clean air temperature adjusting unit 53 adjusts the temperature of the clean air by adjusting the heating temperature of the air formed by the heating mechanism. Here, the predetermined temperature of the clean air may be the same temperature as the temperature of the ambient gas in the clean room and the temperature of the ambient gas in the processing chamber 110, and may be any temperature set by the operator.
清淨空氣濕度調整部54是根據清淨空氣濕度檢測部52所檢測之相對濕度,將已通過第1除霧器32a的空氣以冷卻機構34冷卻,以使得排出至無塵室內之清淨空氣或回到加工室110之清淨空氣的相對濕度成為預定之相對濕度。亦即,清淨空氣濕度調整部54是藉由調整由冷卻機構34所形成之空氣的冷卻溫度,來調整清淨空氣之相對濕度。在此,清淨空氣之預定的相對濕度可為與無塵室內之環境氣體的相對濕度及加工室110內之環境氣體的相對濕度相同之相對濕度,且可為由操作員所設定之任意的相對濕度。又,較理想的是,濕度感測器是構成為可對已藉由加熱機構加熱而被調整為預定溫度之清淨空氣檢測相對濕度。 The clean air humidity adjusting unit 54 cools the air that has passed through the first defogger 32a by the cooling mechanism 34 in accordance with the relative humidity detected by the clean air humidity detecting unit 52, so that the clean air is discharged to the clean room or returned. The relative humidity of the clean air of the processing chamber 110 becomes a predetermined relative humidity. That is, the clean air humidity adjusting unit 54 adjusts the relative humidity of the clean air by adjusting the cooling temperature of the air formed by the cooling mechanism 34. Here, the predetermined relative humidity of the clean air may be the same relative humidity as the relative humidity of the ambient gas in the clean room and the relative humidity of the ambient gas in the processing chamber 110, and may be any relative relative set by the operator. humidity. Further, preferably, the humidity sensor is configured to detect the relative humidity of the clean air that has been adjusted to a predetermined temperature by heating by the heating means.
再者,清淨空氣之溫度設定與相對濕度設定,是例如,透過圖未示出之顯示、輸入機構而由操作員來設定,其中該顯示、輸入機構具有:可顯示目前之清淨空氣的溫度與相對濕度,以及清淨空氣之溫度與相對濕度的設定值之顯示部(例如分段式顯示器(segment display)等);和可輸 入溫度與相對濕度之設定值的輸入部(例如上、下鍵等)。又,較理想的是,將顯示、輸入機構以對操作員來說操作性與可見性佳之位置設置於筐體31上。 Furthermore, the temperature setting and the relative humidity setting of the clean air are set by an operator, for example, through a display and input mechanism not shown, wherein the display and input mechanism has a temperature indicating that the current clean air is displayed. Relative humidity, and a display portion of the set value of the temperature and relative humidity of the clean air (for example, a segment display, etc.); Input part of the set value of temperature and relative humidity (for example, up and down keys, etc.). Further, it is preferable that the display and input means are provided on the casing 31 at a position where the operability and visibility are excellent for the operator.
切換部55,是藉由例如設於排出口21a之切換閥等,以使透過風扇單元20而排出之清淨空氣排出到無塵室內,或使透過風扇單元20而排出之清淨空氣回到加工室110。亦即,切換部55是藉由切換閥來切換清淨空氣之排出目的地,藉以使清淨空氣排出到無塵室內或回到加工室110。 The switching unit 55 discharges the clean air discharged through the fan unit 20 into the clean room by, for example, a switching valve provided in the discharge port 21a, or returns the clean air discharged through the fan unit 20 to the processing chamber. 110. That is, the switching unit 55 switches the discharge destination of the clean air by switching the valve, so that the clean air is discharged into the clean room or returned to the processing chamber 110.
水位調整部56,是例如根據從設於蓄水部33e之圖未示的水位感測器所輸出的檢測訊號,來控制將加工水等供給至蓄水部33e的供水管的開閉閥的開閉動作,以及將蓄水部33e內之水排放到加工廢液處理裝置等的排水泵的動作。亦即,水位調整部56是藉由將加工水供給到蓄水部33e內、或將蓄水部33e內的水排放,來調整蓄水部33e之水位。在本實施形態中,水位調整部56會將蓄水部33e之水位調整成不會讓水從蓄水部33e溢流出來,且維持不使供給泵33f空轉的水位。 The water level adjusting unit 56 controls the opening and closing of the opening and closing valve of the water supply pipe that supplies the processing water or the like to the water storage unit 33e, for example, based on the detection signal output from the water level sensor (not shown) provided in the water storage unit 33e. The operation and the operation of discharging the water in the water storage unit 33e to the drain pump of the processing waste liquid processing apparatus or the like. In other words, the water level adjusting unit 56 adjusts the water level of the water storage unit 33e by supplying the processing water into the water storage unit 33e or discharging the water in the water storage unit 33e. In the present embodiment, the water level adjusting unit 56 adjusts the water level of the water storage unit 33e so as not to allow water to overflow from the water storage unit 33e, and maintains the water level where the supply pump 33f is not idling.
其次,針對如以上所述地被構成之霧收集裝置1的基本動作進行說明。再者,無塵室內之環境氣體與加工室110內之環境氣體可由操作員事先設定好,以保持在例如溫度為23℃左右,且相對濕度為40%左右到60%左右。又,從霧收集裝置1之排出口21a排出的清淨空氣是與無塵室內之環境氣體與加工室110內的環境氣體同樣地,可由操作員事先設定好,以保持在例如溫度為23℃左右,且相對濕度 為40%左右到60%左右。又,供給到加工裝置100的加工水,與無塵室內之環境氣體與加工室110內的環境氣體同樣地,可由操作員事先設定好,以保持在例如溫度為23℃左右。又,霧收集裝置1至少要在由加工裝置100進行之加工開始前接通電源並進行運轉。 Next, the basic operation of the mist collecting device 1 configured as described above will be described. Further, the ambient gas in the clean room and the ambient gas in the processing chamber 110 can be set in advance by the operator to maintain, for example, a temperature of about 23 ° C and a relative humidity of about 40% to about 60%. Further, the clean air discharged from the discharge port 21a of the mist collecting device 1 is set in advance by the operator in the same manner as the ambient gas in the clean room and the ambient gas in the processing chamber 110, for example, at a temperature of about 23 ° C. And relative humidity It is about 40% to about 60%. Further, the processing water supplied to the processing apparatus 100 can be set in advance by the operator in the same manner as the environmental gas in the clean room, similar to the environmental gas in the processing chamber 110, for example, at a temperature of about 23 °C. Further, the mist collecting device 1 is turned on and operated at least before the processing by the processing device 100 is started.
在加工裝置100還沒有對被加工物W實施加工的狀態(亦即在加工室110內還未產生加工水之霧的狀態)下,霧收集裝置1會一邊透過吸引導管10吸引加工室110的環境氣體,一邊透過排出導管40將清淨空氣送回加工室110,或使其排出到無塵室內。再者,在以控制機構50使清淨空氣排出到無塵室內時,會透過設於加工裝置100之筐體上且使加工室110與無塵室連通之圖未示出的吸氣口,將無塵室內的環境氣體供給到加工室110內。 In a state in which the processing apparatus 100 has not processed the workpiece W (that is, a state in which the mist of the processing water has not occurred in the processing chamber 110), the mist collecting device 1 sucks the processing chamber 110 through the suction duct 10. The ambient gas is sent back to the processing chamber 110 through the discharge duct 40 or discharged into the clean room. Further, when the control unit 50 discharges the clean air into the clean room, the intake port that is provided on the casing of the processing apparatus 100 and that connects the processing chamber 110 to the clean room will not be shown. The ambient gas in the clean room is supplied into the processing chamber 110.
在加工裝置100對被加工物W施行加工的狀態(亦即在加工室110內產生加工水之霧的狀態)下,霧收集裝置1會一邊透過吸引導管10吸引加工室110的環境氣體,一邊透過排出導管40將清淨空氣送回加工室110。在此,在控制機構50中,會調整藉由冷卻機構34形成之空氣(通過第1除霧器32a後的空氣)的冷卻溫度與藉由加熱機構形成之清淨空氣的加熱溫度,以使清淨空氣之溫度與相對濕度保持預定的溫度與預定的相對濕度。 In a state in which the processing apparatus 100 performs processing on the workpiece W (that is, a state in which the mist of the processing water is generated in the processing chamber 110), the mist collecting device 1 sucks the atmosphere of the processing chamber 110 through the suction duct 10 while The clean air is sent back to the processing chamber 110 through the exhaust conduit 40. Here, in the control unit 50, the cooling temperature of the air formed by the cooling mechanism 34 (the air that has passed through the first demister 32a) and the heating temperature of the clean air formed by the heating mechanism are adjusted to make it clean. The temperature and relative humidity of the air are maintained at a predetermined temperature and a predetermined relative humidity.
又,在霧收集裝置1中,是藉由一邊使透過吸引導管10而被吸引之空氣通過第1除霧器32a,一邊以第1除霧器32a捕獲透過吸引導管10而被吸引之空氣中的霧,以使通 過第1除霧器32a後之空氣的相對濕度比通過第1除霧器32a前之空氣相對地降低。又,在霧收集裝置1中,是藉由因應清淨空氣之相對濕度(預定之相對濕度以及所檢測之相對濕度)而利用冷卻機構34使通過第1除霧器32a後之空氣冷卻,而使通過第1除霧器32a後之空氣的相對濕度比冷卻前的空氣相對地上升(亦即使飽和水蒸氣量比冷卻前相對地減少),並使通過第1除霧器32a後之空氣中的霧的粒徑擴大(以空氣中的霧為核心,使空氣中的水蒸氣凝集)。又,在霧收集裝置1中,是使藉由冷卻機構34所冷卻之空氣通過第2除霧器32b,而以第2除霧器32b捕獲藉由冷卻機構34所冷卻之空氣中的霧。亦即,在霧收集裝置1中,是藉由將對通過第1除霧器32a後之空氣的冷卻溫度相對地降低,而使通過第1除霧器32a後之空氣中的霧的捕獲量相對地增加,並藉由將對通過第1除霧器32a後之空氣的冷卻溫度相對地提高,而使通過第1除霧器32a後之空氣中的霧的捕獲量相對地減少。 In the mist collecting device 1, the air sucked through the suction duct 10 passes through the first mist eliminator 32a, and the first mist eliminator 32a catches the air sucked through the suction duct 10 and is sucked. Fog to make pass The relative humidity of the air after passing through the first mist eliminator 32a is relatively lower than the air passing through the first mist eliminator 32a. Further, in the mist collecting device 1, the air passing through the first demister 32a is cooled by the cooling mechanism 34 in response to the relative humidity (predetermined relative humidity and the detected relative humidity) of the clean air. The relative humidity of the air after passing through the first demister 32a is relatively higher than that of the air before cooling (even if the amount of saturated water vapor is relatively reduced before cooling), and is allowed to pass through the air after passing through the first demister 32a. The particle size of the mist is enlarged (the fog in the air is the core, and the water vapor in the air is agglomerated). Further, in the mist collecting device 1, the air cooled by the cooling mechanism 34 passes through the second mist eliminator 32b, and the mist in the air cooled by the cooling mechanism 34 is captured by the second mist eliminator 32b. In other words, in the mist collecting device 1, the amount of mist in the air that has passed through the first demister 32a is relatively reduced by lowering the cooling temperature of the air that has passed through the first demister 32a. When the cooling temperature of the air that has passed through the first mist eliminator 32a is relatively increased, the amount of mist trapped in the air passing through the first mist eliminator 32a is relatively reduced.
又,在霧收集裝置1中,會生成以第1除霧器32a及第2除霧器32b各自捕獲之霧所形成的液體L,並使所生成之液體L從傾斜面33a往流出口33b流下。又,在霧收集裝置1中,會將往流出口33b流下之液體L以抽氣機33d吸引,並排出至蓄水部33e。又,在霧收集裝置1中,因為是將所捕獲到之霧所形成的液體L以抽氣機33d吸引而排出至蓄水部33e,所以可抑制蓄水部33e的水位降低。 Further, in the mist collecting device 1, the liquid L formed by the mist captured by each of the first mist eliminator 32a and the second mist eliminator 32b is generated, and the generated liquid L is caused to flow from the inclined surface 33a to the outflow port 33b. Flow down. Further, in the mist collecting device 1, the liquid L flowing down the outflow port 33b is sucked by the air extractor 33d and discharged to the water storage portion 33e. Further, in the mist collecting device 1, the liquid L formed by the captured mist is sucked by the air extractor 33d and discharged to the water storage portion 33e, so that the water level of the water storage portion 33e can be suppressed from decreasing.
又,在霧收集裝置1中,是一邊因應清淨空氣之 濕度(預定之相對濕度以及所檢測之相對濕度)而利用冷卻機構34將通過第1除霧器32a後之空氣冷卻,一邊因應清淨空氣之溫度(預定之溫度以及所檢測之溫度)而利用加熱機構將通過第2除霧器32b後之空氣加熱,並使已加熱之空氣通過空氣過濾器23,藉此生成預定之溫度以及預定之相對濕度的清淨空氣,並透過排出導管40將預定之溫度以及預定之相對濕度的清淨空氣送回加工室110,或排出到無塵室內。 Moreover, in the mist collecting device 1, it is necessary to clean the air. The humidity (predetermined relative humidity and the detected relative humidity) is cooled by the cooling mechanism 34 to cool the air passing through the first demister 32a, and is heated by the temperature of the clean air (predetermined temperature and detected temperature). The mechanism heats the air after passing through the second mist eliminator 32b, and passes the heated air through the air filter 23, thereby generating clean air of a predetermined temperature and a predetermined relative humidity, and passing the discharge duct 40 to a predetermined temperature. The clean air of the predetermined relative humidity is returned to the processing chamber 110 or discharged into the clean room.
如以上所述,根據實施形態之霧收集裝置1,藉由在使透過吸引導管10而被吸引之加工室110的環境氣體通過第1除霧器32a以捕獲環境氣體中的霧之後,利用冷卻機構34冷卻通過第1除霧器32a後的空氣,可使已通行穿過第1除霧器32a的霧(亦即通過第1除霧器32a後之空氣中的霧)的粒徑比冷卻前相對地擴大。又,根據實施形態之霧收集裝置1,藉由使利用冷卻機構34所冷卻之空氣通過篩孔比第1除霧器32a還要細密的第2除霧器32b,可以利用第2除霧器32b捕獲粒徑相較於冷卻前已相對地擴大之霧(亦即已冷卻之空氣中的霧)。又,根據實施形態之霧收集裝置1,因為是藉由冷卻機構34所冷卻之空氣來冷卻第2除霧器32b,所以也可以抑制利用第2除霧器32b所捕獲之霧所形成的液體L的氣化。亦即,根據實施形態之霧收集裝置1,藉由使含有粒徑已比冷卻前相對地擴大之霧的空氣通過網孔比第1除霧器32a細密的第2除霧器32b,可以促進霧與第2除霧器32b之慣性衝撞與直接阻隔等,而利用第2除霧器32b捕獲霧, 並提升空氣與霧的分離性能。因此,根據實施形態之霧收集裝置1,就能達到所謂的可以謀求霧的捕獲量提升之效果。 As described above, according to the mist collecting device 1 of the embodiment, the ambient gas in the processing chamber 110 sucked through the suction conduit 10 passes through the first mist eliminator 32a to capture the mist in the ambient gas, and then the cooling is performed. The mechanism 34 cools the air that has passed through the first demister 32a, so that the particle size ratio of the mist that has passed through the first demister 32a (that is, the mist in the air after passing through the first demister 32a) can be cooled. The front is relatively enlarged. Further, according to the mist collecting device 1 of the embodiment, the second mist eliminator 32b that is finer than the first demister 32a through the air cooled by the cooling mechanism 34 can be used, and the second defogger can be used. The 32b capture particle size is comparable to the fog that has been relatively enlarged prior to cooling (i.e., the mist in the cooled air). Further, according to the mist collecting device 1 of the embodiment, since the second mist eliminator 32b is cooled by the air cooled by the cooling mechanism 34, the liquid formed by the mist captured by the second mist eliminator 32b can be suppressed. L gasification. In other words, according to the mist collecting device 1 of the embodiment, the air containing the mist having the particle diameter relatively larger than that before the cooling is passed through the second mist eliminator 32b whose mesh is denser than the first mist eliminator 32a. The fog collides with the inertia of the second mist eliminator 32b, directly blocks, and the like, and the mist is captured by the second mist eliminator 32b. And improve the separation performance of air and fog. Therefore, according to the mist collecting device 1 of the embodiment, the so-called effect of improving the amount of trapping of the mist can be achieved.
又,根據實施形態之霧收集裝置1,因為是將從筐體31內吸引的液體L排出至蓄水部33e而蓄積,所以可抑制從外部另行將水供給到蓄水部33e內的情形。又,根據實施形態之霧收集裝置1,將由捕獲到的霧所形成之液體L以抽氣機33d吸引而排到蓄水部33e之時,可將被排出的液體L蓄積於蓄水部33e,以利用已蓄積之液體L將抽氣機33d作為吸引源而使其發揮作用。亦即,根據實施形態之霧收集裝置1,當從筐體31內吸引充分量的液體L時,可以在不從外部另行供給水到蓄水部33e內的情況下,達到可以將抽氣機33d作為吸引源使用的效果。 In the mist collecting device 1 of the embodiment, the liquid L sucked from the casing 31 is discharged to the water storage portion 33e, and it is possible to suppress the supply of water to the water storage portion 33e from the outside. In the mist collecting device 1 of the embodiment, when the liquid L formed by the trapped mist is sucked by the air extractor 33d and discharged to the water storage unit 33e, the discharged liquid L can be stored in the water storage unit 33e. The air extractor 33d functions as a suction source by using the accumulated liquid L. In other words, when the mist collecting device 1 of the embodiment sucks a sufficient amount of the liquid L from the casing 31, the air extracting device can be supplied without separately supplying water from the outside to the water storing portion 33e. 33d is used as a source of attraction.
又,根據實施形態之霧收集裝置1,藉由將以冷卻機構34對通過第1除霧器32a後之空氣所形成的冷卻溫度相對地降低(亦即相對地加大通過第1除霧器32a後之空氣與冷卻後之空氣的溫度差),可以使在第2除霧器32b之霧的捕獲量增加,且藉由將以冷卻機構34對通過第1除霧器32a後之空氣所形成的冷卻溫度相對地提高(亦即相對地縮小通過第1除霧器32a後之空氣與冷卻後之空氣的溫度差),可以使在第2除霧器32b之霧的捕獲量減少。因此,根據實施形態之霧收集裝置1,可以藉由調整由冷卻機構34所形成之空氣的冷卻溫度,以調整霧的捕獲量。 Further, according to the mist collecting device 1 of the embodiment, the cooling temperature formed by the air passing through the first demister 32a by the cooling mechanism 34 is relatively lowered (that is, relatively increased by the first defogger) The difference in temperature between the air after 32a and the air after cooling can increase the amount of trapping of the mist in the second mist eliminator 32b, and the air passing through the first demister 32a by the cooling mechanism 34 The formed cooling temperature is relatively increased (that is, the temperature difference between the air passing through the first mist eliminator 32a and the cooled air is relatively reduced), so that the amount of mist captured in the second mist eliminator 32b can be reduced. Therefore, according to the mist collecting device 1 of the embodiment, the amount of trapping of the mist can be adjusted by adjusting the cooling temperature of the air formed by the cooling mechanism 34.
又,根據實施形態之霧收集裝置1,因為可以調 整霧的捕獲量,所以可以生成任意之相對濕度的清淨空氣。因此,根據實施形態之霧收集裝置1,可以達到將任意之相對濕度的清淨空氣排出到無塵室內,或送回到加工室110之效果。 Moreover, according to the mist collecting device 1 of the embodiment, since it can be adjusted The amount of fog is captured, so it can generate clean air of any relative humidity. Therefore, according to the mist collecting device 1 of the embodiment, it is possible to discharge the clean air of any relative humidity into the clean room or return it to the processing chamber 110.
再者,在上述之實施形態中,雖然霧收集裝置1是將透過風扇單元20而排出之清淨空氣排出到無塵室內,或送回到加工室110,但是並不受限於此,例如也可將清淨空氣分別送回無塵室以及加工室110。 Further, in the above-described embodiment, the mist collecting device 1 discharges the clean air discharged through the fan unit 20 into the clean room or returns it to the processing chamber 110. However, the present invention is not limited thereto. The clean air can be returned to the clean room and the processing chamber 110, respectively.
又,在上述之實施形態中,雖然霧收集裝置1具備有第1除霧器32a及第2除霧器32b之各自疊合複數片金屬網而成的金屬絲網除霧器,但是只要能捕獲空氣中的霧即可,所以也可以是例如具備將金屬網捲繞成渦卷狀的金屬絲網除霧器者。 Further, in the above-described embodiment, the mist collecting device 1 includes a wire mesh defogger in which a plurality of metal meshes are stacked on each of the first defogger 32a and the second defogger 32b. It is only necessary to trap the mist in the air, and therefore, for example, a wire mesh defogger having a metal mesh wound in a spiral shape may be provided.
又,在上述之實施形態中,雖然霧收集裝置1使蓄積於蓄水部33e之水為由霧所形成的液體L,但是只要是可把抽氣機33d作為吸引源來使用的流體即可,所以也可以是例如純水等加工水或以加工廢液處理裝置所再生的加工水等。因此,當在蓄水部33e中沒有蓄積水或液體L的情形等時,可藉由從外部將加工水等蓄積於蓄水部33e,而將抽氣機33d當作吸引源來使用。 Further, in the above-described embodiment, the mist collecting device 1 makes the water stored in the water storage portion 33e a liquid L formed by the mist, but the fluid can be used as the suction source 33d. Therefore, it may be, for example, processed water such as pure water or processed water regenerated by a processing waste liquid processing apparatus. Therefore, when water or liquid L is not accumulated in the water storage unit 33e, the aerated machine 33d can be used as a suction source by accumulating the processing water or the like from the outside in the water storage unit 33e.
又,在上述之實施形態中,雖然霧收集裝置1是藉由將已用冷凝器等冷卻的水流到冷卻管,而利用冷卻機構34將通過第1除霧器32a後的空氣冷卻,但是也可以藉由將已用所謂的蒸氣壓縮式冷凍機冷卻過的氟利昂氣體 (Freon gas)等之冷媒流到冷卻管來冷卻空氣。此時,可以將通過第1除霧器32a後的空氣冷卻到更低的溫度,而可以更加提升霧的捕獲量。 Further, in the above-described embodiment, the mist collecting device 1 cools the air that has passed through the first demister 32a by the cooling mechanism 34 by flowing the water cooled by the condenser or the like to the cooling pipe. By using a Freon gas that has been cooled by a so-called vapor compression refrigerator The refrigerant such as Freon gas flows to the cooling pipe to cool the air. At this time, the air that has passed through the first demister 32a can be cooled to a lower temperature, and the amount of mist captured can be further increased.
又,在上述之實施形態中,雖然霧收集裝置1是在冷卻機構34上將複數片迷路板交互地配置複數片,但是只要可以藉由冷卻機構34來冷卻通過第1除霧器32a後的空氣以生成任意之相對濕度的清淨空氣即可,所以也可以使通過第1除霧器32a後之空氣以螺旋狀的形式流通。亦即,霧收集裝置1只要能冷卻通過第1除霧器32a後的空氣,而生成任意之相對濕度的清淨空氣,則冷卻機構34的構成並無特定限制。 Further, in the above-described embodiment, the mist collecting device 1 has a plurality of pieces of the lost plates alternately arranged on the cooling mechanism 34. However, the cooling unit 34 can cool the first demister 32a. Since the air is required to generate clean air of any relative humidity, the air that has passed through the first demister 32a may be circulated in a spiral shape. In other words, the configuration of the cooling mechanism 34 is not particularly limited as long as the mist collecting device 1 can cool the air that has passed through the first demister 32a to generate clean air having an arbitrary relative humidity.
又,在上述之實施形態中,雖然加工裝置100是對被加工物W施行切削加工之切削裝置(切割機(dicer)),但並不受限於此,也可以是例如以下的各種加工裝置:一邊供給加工水一邊用磨削磨石來磨削被加工物W等的磨削裝置(砂輪機(grinder))、一邊供給加工水一邊用研磨輪來研磨被加工物W等之研磨裝置(拋光機(polisher))、用和高壓高速之加工水一起被噴出之研磨材來切斷被加工物W等之所謂的水刀切割機(water jet saw)等。 Further, in the above-described embodiment, the processing apparatus 100 is a cutting device (dicer) that performs cutting processing on the workpiece W. However, the processing apparatus 100 is not limited thereto, and may be, for example, the following various processing apparatuses. A grinding device (a grinder) that grinds a workpiece W or the like while grinding the grindstone while supplying the processing water, and grinds the workpiece W with a grinding wheel while supplying the processing water ( A polisher, a so-called water jet saw or the like that cuts a workpiece W or the like by using a polishing material that is sprayed together with high-pressure high-speed processing water.
1‧‧‧霧收集裝置 1‧‧‧Fog collection device
10‧‧‧吸引導管 10‧‧‧Attraction catheter
20‧‧‧風扇單元 20‧‧‧Fan unit
21‧‧‧單元筐體 21‧‧‧unit housing
21a‧‧‧排出口 21a‧‧‧Export
22‧‧‧風扇 22‧‧‧Fan
23‧‧‧空氣過濾器 23‧‧‧Air filter
30‧‧‧霧去除機構 30‧‧‧Fog removal mechanism
31‧‧‧筐體 31‧‧‧Shell
31a‧‧‧吸引口 31a‧‧‧ attracting mouth
31b‧‧‧連結口 31b‧‧‧ link
32‧‧‧霧捕獲部 32‧‧‧Fog capture department
32a‧‧‧第1除霧器 32a‧‧‧1st defogger
32b‧‧‧第2除霧器 32b‧‧‧2nd mist eliminator
33‧‧‧排水機構 33‧‧‧Drainage mechanism
33a‧‧‧傾斜面 33a‧‧‧ sloped surface
33b‧‧‧流出口 33b‧‧‧Export
33c‧‧‧排水管 33c‧‧‧Drainage pipe
33d‧‧‧抽氣機 33d‧‧‧Air pump
33e‧‧‧蓄水部 33e‧‧‧Water Storage Department
33f‧‧‧供給泵 33f‧‧‧Supply pump
34‧‧‧冷卻機構 34‧‧‧Cooling mechanism
40‧‧‧排出導管 40‧‧‧Draining catheter
50‧‧‧控制機構 50‧‧‧Control agency
51‧‧‧清淨空氣溫度檢測部 51‧‧‧Clean air temperature detection department
52‧‧‧清淨空氣濕度檢測部 52‧‧‧Clean air humidity detection department
53‧‧‧清淨空氣溫度調整部 53‧‧‧Clean air temperature adjustment department
54‧‧‧清淨空氣濕度調整部 54‧‧‧Clean air humidity adjustment department
55‧‧‧切換部 55‧‧‧Switching Department
56‧‧‧水位調整部 56‧‧‧Water level adjustment department
100‧‧‧加工裝置 100‧‧‧Processing device
110‧‧‧加工室 110‧‧‧Processing room
120‧‧‧工作夾台 120‧‧‧Working table
130‧‧‧切削機構 130‧‧‧ cutting mechanism
F‧‧‧氣流 F‧‧‧Airflow
L‧‧‧液體 L‧‧‧Liquid
W‧‧‧被加工物 W‧‧‧Processed objects
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JP (1) | JP6320244B2 (en) |
KR (1) | KR102311570B1 (en) |
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JP7343325B2 (en) * | 2019-07-26 | 2023-09-12 | 株式会社ディスコ | Waste liquid treatment equipment |
JP6748327B1 (en) * | 2020-05-11 | 2020-08-26 | Dmg森精機株式会社 | Machine Tools |
KR102609233B1 (en) * | 2020-11-25 | 2023-12-04 | 세메스 주식회사 | Apparatus and method for transferring semiconductor package in semiconductor strip sawing and sorting equipment |
CN116079540A (en) * | 2023-01-14 | 2023-05-09 | 无锡市华威石化通用设备有限公司 | Automatic dust-free polishing device for pipeline filter fittings |
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JP2696024B2 (en) * | 1991-11-07 | 1998-01-14 | 三菱電機株式会社 | Wet processing apparatus and control method thereof |
JPH07332810A (en) * | 1994-06-08 | 1995-12-22 | Daikin Ind Ltd | Oil mist separator for refrigerator |
KR200147804Y1 (en) * | 1996-11-05 | 1999-06-15 | 김광영 | Outdoor refrigerator |
DE19948654C1 (en) * | 1999-10-08 | 2001-08-23 | Integral Energietechnik Gmbh | Procedure for climate control of a room |
JP3782314B2 (en) * | 2000-05-16 | 2006-06-07 | 東京エレクトロン株式会社 | Application processing equipment |
JP3504931B2 (en) * | 2001-08-03 | 2004-03-08 | タカギ冷機株式会社 | Waste liquid dehydration equipment |
TWI299280B (en) * | 2005-12-26 | 2008-08-01 | Taiwan Semiconductor Mfg | Apparatus for treating waste gas |
KR20080005108U (en) * | 2007-04-30 | 2008-11-04 | 주식회사 성림피에스 | Air washer Circulation system |
KR20080096931A (en) * | 2007-04-30 | 2008-11-04 | 주식회사 성림피에스 | Air washing method for clean rooms |
CN201186200Y (en) * | 2008-04-23 | 2009-01-28 | 上虞市金科环境设备有限公司 | Oil mist collector |
KR20100042314A (en) * | 2008-10-16 | 2010-04-26 | 전광수 | Wet type air shower apparatus having demister filter |
JP5660903B2 (en) * | 2011-01-19 | 2015-01-28 | 株式会社ディスコ | Processing equipment |
CN102563786B (en) * | 2012-01-12 | 2014-04-23 | 西安交通大学 | Refrigeration and heat pump composite energy system with independently controlled temperature and independently controlled humidity |
CN103894034A (en) * | 2012-12-28 | 2014-07-02 | 承源环境科技企业有限公司 | Low-energy-consumption purification device |
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KR20160025470A (en) | 2016-03-08 |
TWI634937B (en) | 2018-09-11 |
KR102311570B1 (en) | 2021-10-08 |
CN105381661A (en) | 2016-03-09 |
JP6320244B2 (en) | 2018-05-09 |
JP2016047563A (en) | 2016-04-07 |
CN105381661B (en) | 2019-05-31 |
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