TW201607110A - Electrochemical cell and method for manufacturing same - Google Patents
Electrochemical cell and method for manufacturing same Download PDFInfo
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- TW201607110A TW201607110A TW104106673A TW104106673A TW201607110A TW 201607110 A TW201607110 A TW 201607110A TW 104106673 A TW104106673 A TW 104106673A TW 104106673 A TW104106673 A TW 104106673A TW 201607110 A TW201607110 A TW 201607110A
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- resin composition
- curable resin
- electrolyte
- electrochemical cell
- substrate
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- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 36
- 239000011342 resin composition Substances 0.000 claims abstract description 207
- 239000003792 electrolyte Substances 0.000 claims abstract description 112
- 238000007789 sealing Methods 0.000 claims abstract description 110
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 238000002347 injection Methods 0.000 claims abstract description 11
- 239000007924 injection Substances 0.000 claims abstract description 11
- -1 acrylate compound Chemical class 0.000 claims description 71
- 239000008151 electrolyte solution Substances 0.000 claims description 41
- 150000001875 compounds Chemical class 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000004593 Epoxy Substances 0.000 claims description 31
- 239000005062 Polybutadiene Substances 0.000 claims description 31
- 229920002857 polybutadiene Polymers 0.000 claims description 31
- 229920001195 polyisoprene Polymers 0.000 claims description 31
- 229920001083 polybutene Polymers 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 16
- 239000000565 sealant Substances 0.000 claims description 13
- 125000003118 aryl group Chemical group 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 9
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 claims 1
- 229920000582 polyisocyanurate Polymers 0.000 claims 1
- 239000011495 polyisocyanurate Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 4
- 239000007822 coupling agent Substances 0.000 description 24
- 238000011156 evaluation Methods 0.000 description 15
- 239000002253 acid Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 239000000654 additive Substances 0.000 description 12
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 12
- 239000011521 glass Substances 0.000 description 9
- 239000011256 inorganic filler Substances 0.000 description 8
- 229910003475 inorganic filler Inorganic materials 0.000 description 8
- 230000014759 maintenance of location Effects 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000012766 organic filler Substances 0.000 description 7
- 239000005056 polyisocyanate Substances 0.000 description 7
- 229920001228 polyisocyanate Polymers 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 239000002265 redox agent Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- 229910052623 talc Inorganic materials 0.000 description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000012952 cationic photoinitiator Substances 0.000 description 4
- 229910000420 cerium oxide Inorganic materials 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 239000011630 iodine Substances 0.000 description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 4
- 150000004714 phosphonium salts Chemical class 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 150000002497 iodine compounds Chemical class 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- YSHMQTRICHYLGF-UHFFFAOYSA-N 4-tert-butylpyridine Chemical compound CC(C)(C)C1=CC=NC=C1 YSHMQTRICHYLGF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 150000005676 cyclic carbonates Chemical class 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012775 heat-sealing material Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000003495 polar organic solvent Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 1
- ZQRKUBCVPHGWSF-UHFFFAOYSA-N (2,4,6-trimethylphenyl)methylhydrazine Chemical compound CC1=CC(C)=C(CNN)C(C)=C1 ZQRKUBCVPHGWSF-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- AGGJWJFEEKIYOF-UHFFFAOYSA-N 1,1,1-triethoxydecane Chemical compound CCCCCCCCCC(OCC)(OCC)OCC AGGJWJFEEKIYOF-UHFFFAOYSA-N 0.000 description 1
- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical compound CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- LOLANUHFGPZTLQ-UHFFFAOYSA-N 1-ethoxydecane Chemical compound CCCCCCCCCCOCC LOLANUHFGPZTLQ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- YNICHAOCDICNOT-UHFFFAOYSA-N 2,2-dimethoxyundecane Chemical compound CCCCCCCCCC(C)(OC)OC YNICHAOCDICNOT-UHFFFAOYSA-N 0.000 description 1
- LJWZDTGRJUXOCE-UHFFFAOYSA-N 2-(2-ethylhexyl)oxetane Chemical compound CCCCC(CC)CC1CCO1 LJWZDTGRJUXOCE-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 1
- SAFFSEYSJOXUCD-UHFFFAOYSA-N 2-[[(2,6-dimethoxyphenyl)methyl-(2,4,4-trimethylpentyl)phosphoryl]methyl]-1,3-dimethoxybenzene Chemical compound COC1=CC=CC(OC)=C1CP(=O)(CC(C)CC(C)(C)C)CC1=C(OC)C=CC=C1OC SAFFSEYSJOXUCD-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QKPVEISEHYYHRH-UHFFFAOYSA-N 2-methoxyacetonitrile Chemical compound COCC#N QKPVEISEHYYHRH-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
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- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- 125000004811 3-methylpropylene group Chemical group [H]C([H])([H])C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- DFYGYTNMHPUJBY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane-1-thiol Chemical compound SCCCC(C(OC)(OC)OC)CCCCCCCC DFYGYTNMHPUJBY-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
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- RQRUDUAXTMDTMI-UHFFFAOYSA-N C(C)C(C(C(OC)(OC)OC)(CCCN)CC)CCCCCCC Chemical compound C(C)C(C(C(OC)(OC)OC)(CCCN)CC)CCCCCCC RQRUDUAXTMDTMI-UHFFFAOYSA-N 0.000 description 1
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- QHJSCTNRFWNYID-UHFFFAOYSA-N CCC=COCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound CCC=COCCCC(C(OC)(OC)OC)CCCCCCCC QHJSCTNRFWNYID-UHFFFAOYSA-N 0.000 description 1
- PYKRRFPSMQECDC-UHFFFAOYSA-N CCC=COCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound CCC=COCCCC(C(OCC)(OCC)OCC)CCCCCCCC PYKRRFPSMQECDC-UHFFFAOYSA-N 0.000 description 1
- VXGHFEAWNFYQKJ-UHFFFAOYSA-N COCCC(C(=O)O)CC(=O)O.CC(=C)C Chemical compound COCCC(C(=O)O)CC(=O)O.CC(=C)C VXGHFEAWNFYQKJ-UHFFFAOYSA-N 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 206010019468 Hemiplegia Diseases 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- UNVWJAYEKZVDDL-UHFFFAOYSA-N N(C(=O)N)CCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound N(C(=O)N)CCCC(C(OC)(OC)OC)CCCCCCCC UNVWJAYEKZVDDL-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
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- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
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- KJNMFTZWJLGHIS-UHFFFAOYSA-N SCCCC(C(OC)(OC)C)CCCCCCCC Chemical compound SCCCC(C(OC)(OC)C)CCCCCCCC KJNMFTZWJLGHIS-UHFFFAOYSA-N 0.000 description 1
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- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- VSMKVYMEPNUODT-UHFFFAOYSA-N benzenecarboximidamide;benzoic acid Chemical compound NC(=[NH2+])C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 VSMKVYMEPNUODT-UHFFFAOYSA-N 0.000 description 1
- RRFQCEWDBIZSDW-UHFFFAOYSA-N benzenediazonium fluoro(dioxido)borane Chemical compound [O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1.N#[N+]C1=CC=CC=C1 RRFQCEWDBIZSDW-UHFFFAOYSA-N 0.000 description 1
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- 239000003054 catalyst Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
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- 229910052878 cordierite Inorganic materials 0.000 description 1
- HQFQTTNMBUPQAY-UHFFFAOYSA-N cyclobutylhydrazine Chemical compound NNC1CCC1 HQFQTTNMBUPQAY-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ZTOMUSMDRMJOTH-UHFFFAOYSA-N glutaronitrile Chemical compound N#CCCCC#N ZTOMUSMDRMJOTH-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 150000004693 imidazolium salts Chemical group 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- PANJMBIFGCKWBY-UHFFFAOYSA-N iron tricyanide Chemical compound N#C[Fe](C#N)C#N PANJMBIFGCKWBY-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
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- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- WKGDNXBDNLZSKC-UHFFFAOYSA-N oxido(phenyl)phosphanium Chemical compound O=[PH2]c1ccccc1 WKGDNXBDNLZSKC-UHFFFAOYSA-N 0.000 description 1
- 125000003544 oxime group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- FOWDZVNRQHPXDO-UHFFFAOYSA-N propyl hydrogen carbonate Chemical compound CCCOC(O)=O FOWDZVNRQHPXDO-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
- H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Sealing Material Composition (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
本發明係關於電化學電池及其製造方法。 The present invention relates to electrochemical cells and methods of making the same.
如色素敏化太陽電池之電解液被密封的電化學電池中,作為密封電解液之密封材料,自以往即使用熱熔型之熱封材料。熱熔型之熱封材料,因為係固體材料,係有基板表面之微細階差未被填平的情況,又,耐熱性或耐濕性不必然充分,因電解液之洩漏等,係有無法長期間發揮充分的電解液密封性能的情況。進一步地,必須有電解液注入口,因此電解液注入口之密封亦為必要。 In an electrochemical cell in which the electrolyte of the dye-sensitized solar cell is sealed, as a sealing material for the sealing electrolyte, a hot-melt type heat sealing material has been used from the past. The hot-melt type heat sealing material is a solid material, and the fine step of the surface of the substrate is not filled, and the heat resistance or the moisture resistance is not necessarily sufficient, and the leakage of the electrolyte may not be possible. A sufficient electrolyte sealing performance is exhibited for a long period of time. Further, it is necessary to have an electrolyte injection port, and therefore it is necessary to seal the electrolyte injection port.
另一方面,已知有於電化學電池之電解液密封使用液狀密封劑的技術(例如參照日本特開2010-180258號公報)。又,已知有藉由減壓下貼合之方法,在不設置電解液注入口之下製造電化學電池之技術(例如參照日本特開2007-220608號公報)。 On the other hand, a technique of using a liquid sealant for electrolytic solution sealing of an electrochemical cell is known (for example, refer to Japanese Laid-Open Patent Publication No. 2010-180258). Further, a technique of manufacturing an electrochemical cell without providing an electrolyte injection port by a method of bonding under reduced pressure is known (for example, refer to Japanese Laid-Open Patent Publication No. 2007-220608).
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2010-180258號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-180258
[專利文獻2]日本特開2007-220608號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-220608
使用以往的液狀密封劑,藉由減壓下貼合之方法來製造電化學電池時,因未硬化狀態之液狀密封劑與電解液接觸,而會有於密封部產生不良狀況的情況。又,係有無法充分得到對密封部之基材的接著性的情況。 When an electrochemical cell is produced by a method of bonding under reduced pressure using a conventional liquid sealant, a liquid sealant in an unhardened state may be in contact with the electrolyte solution, which may cause a problem in the seal portion. Further, there is a case where the adhesion to the base material of the sealing portion cannot be sufficiently obtained.
本發明係有鑑於上述課題而為者,其目的在於提供電解液被密封而成之電化學電池、且電解液密封性能優良的電化學電池及其製造方法。 The present invention has been made in view of the above problems, and an object thereof is to provide an electrochemical cell in which an electrolytic solution is sealed, and an electrochemical cell having excellent electrolyte sealing performance and a method for producing the same.
用以解決前述課題之具體的手段係如以下所述,本發明包含以下的態樣。 Specific means for solving the above problems are as follows. The present invention includes the following aspects.
<1>一種電化學電池,其係具有:不具有電解液注入口之2枚基材、配置於2枚基材之間的電解液層、與配置於2枚基材之間,包圍並密封電解液層之第一密封部,且第一密封部,為溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物之硬化物。 <1> An electrochemical cell comprising: two substrates having no electrolyte injection port; an electrolyte layer disposed between two substrates; and being disposed between two substrates, surrounding and sealed The first sealing portion of the electrolyte layer, and the first sealing portion is a cured product of a photocurable first curable resin composition having a solubility parameter and an electrolyte solution of 4 or more.
<2>如<1>之電化學電池,其係進一步具有配置為包圍第一密封部,且為第二硬化性樹脂組成物之硬化物的第 二密封部。 <2> The electrochemical cell according to <1>, further comprising a cured product which is disposed so as to surround the first sealing portion and is a second curable resin composition Two sealing parts.
<3>如<1>或<2>之電化學電池,其中第二硬化性樹脂組成物,為含有具有芳香環基之環氧化合物的陽離子硬化性環氧樹脂組成物。 <3> The electrochemical cell according to <1> or <2>, wherein the second curable resin composition is a cationically curable epoxy resin composition containing an epoxy compound having an aromatic ring group.
<4>如<1>~<3>中任一項之電化學電池,其中第一硬化性樹脂組成物,包含具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架之(甲基)丙烯酸酯化合物。 <4> The electrochemical cell according to any one of <1> to <3> wherein the first curable resin composition comprises from the group consisting of polybutene, polybutadiene, polyisoprene, hydrogenation. A (meth) acrylate compound having a skeleton of at least one of a group of polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene.
<5>如<1>~<4>中任一項之電化學電池,其係色素敏化太陽電池、防眩鏡或顯示體。 <5> The electrochemical cell according to any one of <1> to <4> which is a dye-sensitized solar cell, an anti-glare mirror or a display body.
<6>一種電化學電池之製造方法,其係具有密封於第一基材與第二基材之間的電解液層之電化學電池之製造方法,該方法包含:於第一基材上,將溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物供給為框狀,形成第一硬化性樹脂組成物層之步驟;對形成於第一基材上之框內供給電解液,形成電解液層,且於電解液層、第一硬化性樹脂組成物層上層合第二基材,得到層合體之步驟;使第一硬化性樹脂組成物層光硬化而形成第一密封部之步驟;將第二硬化性樹脂組成物供給為包圍第一密封部,形成第二硬化性樹脂組成物層之步驟;與使第二硬化性樹脂組成物層硬化而形成第二密封部之步驟。 <6> A method for producing an electrochemical cell, comprising: a method for producing an electrochemical cell having an electrolyte layer sealed between a first substrate and a second substrate, the method comprising: on the first substrate, a step of forming a first curable resin composition layer by forming a first curable resin composition having a photocuring property and a first curable resin composition having a photohardenability difference of 4 or more; and forming a frame on the first substrate The electrolyte solution is supplied to form an electrolyte layer, and the second substrate is laminated on the electrolyte layer and the first curable resin composition layer to obtain a laminate; and the first curable resin composition layer is photocured to form a step of supplying a second curable resin composition to surround the first sealing portion to form a second curable resin composition layer; and curing the second curable resin composition layer to form a second The step of sealing.
<7>一種電化學電池之製造方法,其係具有密封於 第一基材與第二基材之間的電解液層之電化學電池之製造方法,該方法包含:於第一基材上,將溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物供給為框狀,形成第一硬化性樹脂組成物層之步驟;將溶解度參數與第一硬化性樹脂組成物差距2以上之第二硬化性樹脂組成物,以接觸並包圍框狀之第一硬化性樹脂組成物層的方式供給於第一基材上,形成第二硬化性樹脂組成物層之步驟;於形成於第一基材上之框內供給電解液,形成電解液層,且於電解液層以及第一及第二硬化性樹脂組成物層上層合第二基材而得到層合體之步驟;與使第一硬化性樹脂組成物層及第二硬化性樹脂組成物層硬化而形成第一密封部及第二密封部之步驟。 <7> A method for producing an electrochemical cell, which has a seal A method for producing an electrochemical cell of an electrolyte layer between a first substrate and a second substrate, the method comprising: having a solubility parameter of 4 or more on the first substrate, and having photohardenability The first curable resin composition is supplied in a frame shape to form a first curable resin composition layer, and the second curable resin composition having a solubility parameter different from the first curable resin composition by 2 or more is contacted. a step of forming a second curable resin composition layer on the first substrate so as to surround the frame-shaped first curable resin composition layer; and supplying an electrolyte solution in a frame formed on the first substrate to form a step of laminating a second substrate on the electrolyte layer and the first and second curable resin composition layers to obtain a laminate; and the first curable resin composition layer and the second curable resin The step of hardening the composition layer to form the first sealing portion and the second sealing portion.
<8>一種電化學電池用之電解液密封劑組,其係含有:含有具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架之(甲基)丙烯酸酯化合物的第一硬化性樹脂組成物、與含有具有芳香環基之環氧化合物的陽離子硬化性環氧樹脂組成物即第二硬化性樹脂組成物。 <8> An electrolyte sealant group for an electrochemical cell, comprising: having a selected from the group consisting of polybutene, polybutadiene, polyisoprene, hydrogenated polybutene, hydrogenated polybutadiene, and a first curable resin composition of a (meth) acrylate compound having a skeleton of at least one resin in a group of hydrogenated polyisoprene, and a cationic hardenable epoxy containing an epoxy compound having an aromatic ring group The resin composition is a second curable resin composition.
依照本發明,可提供密封電解液而成的電化學電池,且電解液密封性能優良的電化學電池及其製造方法。 According to the present invention, an electrochemical cell in which an electrolyte solution is sealed and an electrolyte battery excellent in electrolyte sealing performance and a method for producing the same can be provided.
1‧‧‧基材 1‧‧‧Substrate
1’‧‧‧基材 1'‧‧‧Substrate
2‧‧‧第一硬化性樹脂組成物層 2‧‧‧First hardened resin composition layer
3‧‧‧電解液層 3‧‧‧ electrolyte layer
4‧‧‧第二硬化性樹脂組成物層 4‧‧‧Second hardening resin composition layer
[圖1A]顯示電化學電池之製造方法的一實施形態之一步驟的概略斜視圖。 Fig. 1A is a schematic perspective view showing a step of an embodiment of a method of manufacturing an electrochemical cell.
[圖1B]顯示電化學電池之製造方法的一實施形態之一步驟的概略斜視圖。 Fig. 1B is a schematic perspective view showing a step of an embodiment of a method of manufacturing an electrochemical cell.
[圖1C]顯示電化學電池之製造方法的一實施形態之一步驟的概略斜視圖。 Fig. 1C is a schematic perspective view showing a step of an embodiment of a method of manufacturing an electrochemical cell.
[圖1D]電化學電池之概略截面圖。 [Fig. 1D] A schematic cross-sectional view of an electrochemical cell.
[圖2A]顯示電化學電池之製造方法的其他實施形態之一步驟的概略斜視圖。 Fig. 2A is a schematic perspective view showing a step of another embodiment of a method of manufacturing an electrochemical cell.
[圖2B]顯示電化學電池之製造方法的其他實施形態之一步驟的概略斜視圖。 Fig. 2B is a schematic perspective view showing a step of another embodiment of the method for producing an electrochemical cell.
[圖2C]電化學電池之概略截面圖。 [Fig. 2C] A schematic cross-sectional view of an electrochemical cell.
本說明書中「步驟」之用語,不僅為獨立的步驟,即使與其他步驟無法明確區別的情況,只要會達成該步驟所期望的目的,則包含於本用語中。又,使用「~」所示之數值範圍,表示分別包含「~」前後所記載之數值作為最小值及最大值的範圍。進一步地,組成物中之各成分的含量,當組成物中存在有複數種相當於各成分之物質時,若無特別指明,係意指組成物中存在之該複數種物質的合計量。 The term "step" in this specification is not only an independent step, but even if it is not clearly distinguishable from other steps, it is included in the term as long as the desired purpose of the step is achieved. Further, the numerical range indicated by "~" indicates a range including the numerical values described before and after "~" as the minimum value and the maximum value. Further, when the content of each component in the composition is a plurality of substances corresponding to the respective components in the composition, unless otherwise specified, it means the total amount of the plurality of substances present in the composition.
又,(甲基)丙烯醯基,意指丙烯醯基及甲基丙烯醯基之至少一方、(甲基)丙烯酸酯化合物,意指丙烯酸酯化合物及甲基丙烯酸酯化合物之至少一方。 Further, the (meth) acrylonitrile group means at least one of an acryloyl group and a methacryl oxime group, and a (meth) acrylate compound means at least one of an acrylate compound and a methacrylate compound.
<電化學電池> <Electrochemical battery>
本發明之電化學電池,具有不具有電解液注入口之2枚基材、配置於2枚基材之間的電解液層、與配置於2枚基材之間,包圍並密封電解液層之第一密封部,且第一密封部,為溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物之硬化物。 The electrochemical cell of the present invention has two substrates which do not have an electrolyte injection port, an electrolyte layer which is disposed between the two substrates, and is disposed between the two substrates to surround and seal the electrolyte layer. The first sealing portion is a cured product of the first curable resin composition having a photohardenability and a difference in solubility parameter from the electrolyte solution of 4 or more.
形成第一密封部之第一硬化性樹脂組成物之溶解度參數,藉由相較於密封於電化學電池中的電解液之溶解度參數為差距4以上,電解液密封性能優良,例如可長期充分地密封電解液,抑制電解液之洩漏等。第一硬化性樹脂組成物與電解液之溶解度參數差未達4時,第一硬化性樹脂組成物與電解液會相溶,難以達成充分的電解液密封性能。 The solubility parameter of the first curable resin composition forming the first sealing portion is excellent in sealing performance of the electrolyte by a solubility difference of 4 or more compared to the electrolyte sealed in the electrochemical cell, for example, it can be sufficiently long-term Seal the electrolyte to prevent leakage of the electrolyte. When the difference in solubility parameter between the first curable resin composition and the electrolytic solution is less than 4, the first curable resin composition is compatible with the electrolytic solution, and it is difficult to achieve sufficient electrolyte sealing performance.
第一硬化性樹脂組成物與電解液之溶解度參數之差係4以上,較佳為4~7、更佳為4~5。又,第一硬化性樹脂組成物之溶解度參數亦佳為小於電解液之溶解度參數。 The difference between the solubility parameter of the first curable resin composition and the electrolytic solution is 4 or more, preferably 4 to 7, more preferably 4 to 5. Further, the solubility parameter of the first curable resin composition is preferably less than the solubility parameter of the electrolyte.
此處溶解度參數(以下亦稱為「SP值」),係指以分子凝聚能之平方根表示之值,其係通常使用作為表示化合物之極性的尺度者。本說明書中之第一硬化性樹脂 組成物及電解液等之溶解度參數,係分別基於Polym.Eng.Sci.,14[2],147-154(1974)記載之Fedors法來算出。 Here, the solubility parameter (hereinafter also referred to as "SP value") means a value expressed by the square root of the molecular aggregation energy, and is generally used as a scale indicating the polarity of the compound. The first curable resin in this specification The solubility parameters of the composition, the electrolytic solution, and the like are calculated based on the Fedors method described in Polym. Eng. Sci., 14 [2], 147-154 (1974), respectively.
又,電化學電池,較佳為第二密封部包圍並密封第一密封部,該第二密封部係具有與第一硬化性樹脂組成物不同構成(較佳為SP值不同的構成)之第二硬化性樹脂組成物的硬化物。亦即,電化學電池較佳為配置於2枚基材之間的電解液層,係以第一硬化性樹脂組成物之硬化物即第一密封部、與包圍並密封第一密封部之第二硬化性樹脂組成物之硬化物即第二密封部來進行2重密封。電化學電池藉由構成為將電解液2重密封,電解液密封性能會更加提高。 Further, in the electrochemical cell, it is preferable that the second sealing portion surrounds and seals the first sealing portion, and the second sealing portion has a configuration different from the first curable resin composition (preferably, a configuration having a different SP value) A cured product of a second curable resin composition. That is, the electrochemical cell is preferably an electrolyte layer disposed between two substrates, and is a first sealing portion which is a cured product of the first curable resin composition, and a first sealing portion that surrounds and seals the first sealing portion. The second sealing portion, which is a cured product of the second curable resin composition, is double-sealed. By configuring the electrochemical cell to reseal the electrolyte 2, the electrolyte sealing performance is further improved.
[第一硬化性樹脂組成物] [First Curable Resin Composition]
電化學電池之電解液層,係以2枚基材、與第一硬化性樹脂組成物之硬化物即第一密封部來密封。 The electrolyte layer of the electrochemical cell is sealed by two base materials and a first sealing portion which is a cured product of the first curable resin composition.
第一硬化性樹脂組成物,只要為具有光硬化性,且與電解液之SP值的差為4以上,則其構成並無特殊限制。第一硬化性樹脂組成物例如包含(甲基)丙烯酸酯化合物、與光起始劑,可依需要含有其他添加劑。 The first curable resin composition is not particularly limited as long as it has photocurability and the difference in SP value from the electrolytic solution is 4 or more. The first curable resin composition contains, for example, a (meth) acrylate compound and a photoinitiator, and may contain other additives as needed.
第一硬化性樹脂組成物之SP值,較佳為6~9、更佳為8~9。第一硬化性樹脂組成物包含(甲基)丙烯酸酯化合物時,第一硬化性樹脂組成物之SP值,可作為(甲基)丙烯酸酯化合物之SP值而算出。 The SP value of the first curable resin composition is preferably 6 to 9, more preferably 8 to 9. When the first curable resin composition contains a (meth) acrylate compound, the SP value of the first curable resin composition can be calculated as the SP value of the (meth) acrylate compound.
(甲基)丙烯酸酯化合物 (meth) acrylate compound
(甲基)丙烯酸酯化合物,只要係具有至少1個(甲基)丙烯醯基,且可使第一硬化性樹脂組成物之SP值成為所期望之值的聚合性化合物,則並無特殊限制。其中(甲基)丙烯酸酯化合物,就由Fedors法算出之SP值的觀點而言,尤以具有凝聚能密度與莫耳分子體積分別為小的來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架較佳;更佳為具有來自選自由氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架。 The (meth) acrylate compound is not particularly limited as long as it has at least one (meth) acrylonitrile group and the SP value of the first curable resin composition can be a desired value. . The (meth) acrylate compound, in terms of the SP value calculated by the Fedors method, particularly having a small cohesive energy density and a molar molecular volume, respectively, is selected from the group consisting of polybutene, polybutadiene, and poly Preferably, at least one resin of the group consisting of isoprene, hydrogenated polybutene, hydrogenated polybutadiene and hydrogenated polyisoprene has a skeleton; more preferably has a hydrogenated polybutadiene and hydrogenated from A skeleton of at least one resin in a group of polyisoprene.
(甲基)丙烯酸酯化合物,具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架時,作為聚丁二烯,可列舉1,4-聚丁二烯、1,2-聚丁二烯、1,4-丁二烯與1,2-丁二烯之共聚物等。作為聚異戊二烯,可列舉1,4-聚異戊二烯、1,2-聚異戊二烯、1,4-異戊二烯與1,2-異戊二烯之共聚物等。又,此等之氫化體即氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯,分別意指於聚合物中所含的不飽和鍵之至少一部分加成氫而還原為飽和鍵的聚合物。 a (meth) acrylate compound having at least one selected from the group consisting of polybutene, polybutadiene, polyisoprene, hydrogenated polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene In the case of the skeleton of one type of resin, examples of the polybutadiene include copolymerization of 1,4-polybutadiene, 1,2-polybutadiene, 1,4-butadiene and 1,2-butadiene. Things and so on. Examples of the polyisoprene include 1,4-polyisoprene, 1,2-polyisoprene, a copolymer of 1,4-isoprene and 1,2-isoprene, and the like. . Further, such hydrogenated bodies, that is, hydrogenated polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene, respectively, mean that at least a part of the unsaturated bonds contained in the polymer are hydrogenated to be reduced to a saturated bond. Polymer.
聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯之數平均分子量,分別以1000~10000之範圍內較佳、更佳為2000~4000之範圍 內。 The number average molecular weights of polybutene, polybutadiene, polyisoprene, hydrogenated polybutene, hydrogenated polybutadiene and hydrogenated polyisoprene are preferably in the range of 1000 to 10,000, respectively. For the range of 2000~4000 Inside.
(甲基)丙烯酸酯化合物,就以Fedors法算出之SP值的觀點而言,亦佳係具有凝聚能密度與莫耳分子體積分別為小的來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架之胺基甲酸酯改質(甲基)丙烯酸酯化合物;更佳係具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架,且具有2個以上之(甲基)丙烯醯基的胺基甲酸酯改質(甲基)丙烯酸酯化合物;又更佳為具有來自選自由氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架,且具有2個以上之(甲基)丙烯醯基的胺基甲酸酯改質(甲基)丙烯酸酯化合物。 The (meth) acrylate compound is preferably selected from the group consisting of polybutene, polybutadiene, and poly, from the viewpoint of the SP value calculated by the Fedors method, and having a small cohesive energy density and a molar molecular volume, respectively. a urethane-modified (meth) acrylate compound of a skeleton of at least one resin in the group consisting of isoprene, hydrogenated polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene; Preferably, the skeleton has a skeleton derived from at least one resin selected from the group consisting of polybutene, polybutadiene, polyisoprene, hydrogenated polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene. And a urethane-modified (meth) acrylate compound having 2 or more (meth) acryloyl fluorenyl groups; more preferably having a olefin selected from the group consisting of hydrogenated polybutadiene and hydrogenated polyisoprene A urethane-modified (meth) acrylate compound having a skeleton of at least one type of resin and having two or more (meth) acrylonitrile groups.
具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂(以下亦稱為「特定樹脂」)的骨架之胺基甲酸酯改質(甲基)丙烯酸酯化合物,例如可由分子內具有至少1個(較佳為2個以上)之羥基的特定樹脂、分子內具有2個以上之異氰酸基的聚異氰酸酯化合物、與分子內具有可與異氰酸基反應之官能基及(甲基)丙烯醯基的(甲基)丙烯酸化合物來製造。具體而言,可藉由使具有羥基之特定樹脂與聚異氰酸酯化合物反應後,使殘留之異氰酸基與(甲基)丙烯酸化合物反應來製造。 Having at least one resin selected from the group consisting of polybutene, polybutadiene, polyisoprene, hydrogenated polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene (hereinafter also referred to as The urethane-modified (meth) acrylate compound of the skeleton of the "specific resin" may have, for example, a specific resin having at least one (preferably two or more) hydroxyl groups in the molecule, and two molecules in the molecule. The polyisocyanate compound of the above isocyanate group is produced by a (meth)acrylic compound having a functional group capable of reacting with an isocyanate group and a (meth)acryl fluorenyl group in the molecule. Specifically, it can be produced by reacting a specific resin having a hydroxyl group with a polyisocyanate compound, and then reacting a residual isocyanate group with a (meth)acrylic compound.
聚異氰酸酯化合物之具體例子,可舉例2,4- 甲伸苯基二異氰酸酯、2,6-甲伸苯基二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯、2,4’-二苯基甲烷二異氰酸酯、2,2’-二苯基甲烷二異氰酸酯、聚伸苯基聚亞甲基聚異氰酸酯(polyphenylene polymethylene polyisocyanate)、1,5-伸萘基二異氰酸酯、1,4-伸萘基二異氰酸酯、p-伸苯基二異氰酸酯、m-伸苯基二異氰酸酯、o-二甲伸苯基二異氰酸酯、m-二甲伸苯基二異氰酸酯等之芳香族聚異氰酸酯化合物;四亞甲基二異氰酸酯、六亞甲基二異氰酸酯、2-甲基-1,5-戊烷二異氰酸酯等之脂肪族聚異氰酸酯化合物;1-甲基環己烷-2,4-二異氰酸酯、異佛酮二異氰酸酯、二環己基甲烷-4,4’-二異氰酸酯等之脂環族聚異氰酸酯化合物等,但不限定為此等。又,此等可1種單獨、亦可組合2種以上使用。 Specific examples of the polyisocyanate compound can be exemplified by 2, 4- Methyl phenyl diisocyanate, 2,6-methylphenyl diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 2,2'-diphenyl Methane diisocyanate, polyphenylene polymethylene polyisocyanate, 1,5-naphthyl diisocyanate, 1,4-naphthyl diisocyanate, p-phenylene diisocyanate, m- An aromatic polyisocyanate compound such as phenyl diisocyanate, o-dimethylphenyl diisocyanate or m-dimethylphenyl diisocyanate; tetramethylene diisocyanate, hexamethylene diisocyanate, 2-methyl An aliphatic polyisocyanate compound such as benzyl-1,5-pentane diisocyanate; 1-methylcyclohexane-2,4-diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-di An alicyclic polyisocyanate compound such as an isocyanate, etc., but is not limited thereto. Further, these may be used alone or in combination of two or more.
第一硬化性樹脂組成物,亦可含有具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架之(甲基)丙烯酸酯化合物、胺基甲酸酯改質(甲基)丙烯酸酯化合物以外的其他(甲基)丙烯酸酯化合物。其他(甲基)丙烯酸酯化合物之具體例子,可列舉丙烯酸二環戊酯、丙烯酸二環戊烯酯、丙烯酸二環戊烯氧基伸乙酯、二羥甲基二環戊烷二丙烯酸酯、丙烯酸異莰酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基乙 基六氫鄰苯二甲酸、鄰苯二甲酸2-(甲基)丙烯醯氧基乙基-2-羥基丙酯、甘油二(甲基)丙烯酸酯、2-(甲基)丙烯醯氧基乙基酸式磷酸酯等,但不限定於此等。又,此等可1種單獨、亦可組合2種以上使用。 The first curable resin composition may also contain a group selected from the group consisting of polybutene, polybutadiene, polyisoprene, hydrogenated polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene. A (meth) acrylate compound having a skeleton of at least one type of resin and a (meth) acrylate compound other than the urethane-modified (meth) acrylate compound. Specific examples of the other (meth) acrylate compound include dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, dimethylol dicyclopentane diacrylate, and acrylic acid. Isodecyl ester, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, (A) Acrylic acid, 2-(methyl) propylene methoxyethyl succinic acid, 2-(methyl) propylene oxy ethoxylate Hexahydrophthalic acid, 2-(meth)acryloyloxyethyl-2-hydroxypropyl phthalate, glycerol di(meth) acrylate, 2-(methyl) propylene decyloxy Ethyl acid phosphate or the like, but is not limited thereto. Further, these may be used alone or in combination of two or more.
胺基甲酸酯改質(甲基)丙烯酸酯化合物,亦可使用市售品。市售品可列舉UA-1(氫化聚異戊二烯胺基甲酸酯丙烯酸酯、Light Chemical公司製)、TE-2000(聚丁二烯胺基甲酸酯甲基丙烯酸酯、日本曹達公司製)等。 A urethane-modified (meth) acrylate compound can also be used as a commercial item. Commercially available products include UA-1 (hydrogenated polyisoprene urethane acrylate, manufactured by Light Chemical Co., Ltd.), TE-2000 (polybutadienyl methacrylate methacrylate, and Japan Soda Corporation). System) and so on.
第一硬化性樹脂組成物可單獨含有1種(甲基)丙烯酸酯化合物、亦可組合含有2種以上。組合含有時,具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架的(甲基)丙烯酸酯化合物(較佳為胺基甲酸酯改質(甲基)丙烯酸酯化合物)之比率,於(甲基)丙烯酸酯化合物總量中,較佳為50質量%以上、更佳為75質量%以上。 The first curable resin composition may contain one type of (meth) acrylate compound alone or two or more types in combination. When combined, having at least one resin selected from the group consisting of polybutene, polybutadiene, polyisoprene, hydrogenated polybutene, hydrogenated polybutadiene, and hydrogenated polyisoprene The ratio of the (meth) acrylate compound (preferably the urethane-modified (meth) acrylate compound) of the skeleton is preferably 50% by mass or more based on the total amount of the (meth) acrylate compound. More preferably, it is 75 mass% or more.
光起始劑 Photoinitiator
第一硬化性樹脂組成物,較佳為含有至少1種光起始劑。光起始劑已知有藉由可見光線、紫外線、X射線、電子線等之能量線而產生自由基物種之自由基系光起始劑;產生布忍斯特酸或路易士酸等之陽離子物種的陽離子系光起始劑等。藉由所產生之自由基物種,(甲基)丙烯酸酯化合物會聚合,硬化性樹脂組成物會硬化。又,藉由所產生之陽離子物種,含有環氧化合物之陽離子硬化性環氧樹脂 組成物會硬化。 The first curable resin composition preferably contains at least one photoinitiator. A photoinitiator is known as a radical photoinitiator which generates a radical species by energy rays such as visible light, ultraviolet rays, X-rays, electron beams, etc.; and a cationic species such as Brucenic acid or Lewis acid. a cationic photoinitiator or the like. The (meth) acrylate compound is polymerized by the radical species generated, and the curable resin composition is hardened. Further, a cationically curable epoxy resin containing an epoxy compound by the cationic species produced The composition will harden.
自由基系光起始劑之具體例子,可列舉二苯甲酮、4-苯基二苯甲酮、苄醯基安息香酸、雙二乙基胺基二苯甲酮等之二苯甲酮系光起始劑;2,2-二乙氧基苯乙酮等之苯乙酮系光起始劑;二苯乙二酮、苯偶姻、苯偶姻異丙基醚等之苯偶姻系光起始劑;苄基二甲基縮酮等之烷基苯酮系光起始劑;噻噸酮等之噻噸酮系光起始劑;1-羥基環己基苯基酮、1-(4-異丙基苯基)2-羥基-2-甲基丙烷-1-酮、1-(4-(2-羥基乙氧基)-苯基)-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、寡[2-羥基-2-甲基-1-{-4(1-甲基乙烯基)苯基}丙酮]等之羥基烷基苯酮系光起始劑;2,4,6-三甲基苄醯基二苯基膦氧化物、雙(2,4,6-三甲基苄醯基)-苯基膦氧化物、雙(2,6-二甲氧基苄醯基)-2,4,4-三甲基-戊基膦氧化物等之醯基膦氧化物系光起始劑;樟腦醌、2-甲基-1-(4-(甲硫基)苯基)-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮-1等之酮系光起始劑等,此等之中尤以寡[2-羥基-2-甲基-1-{4-(1-甲基乙烯基)苯基}丙酮]等之羥基烷基苯酮系光起始劑較佳,但不限定於此。 Specific examples of the radical photoinitiator include benzophenones such as benzophenone, 4-phenylbenzophenone, benzamidine benzoic acid, and bisdiethylaminobenzophenone. Photoinitiator; acetophenone photoinitiator such as 2,2-diethoxyacetophenone; benzoin system such as diphenylethylenedione, benzoin, benzoin isopropyl ether Photoinitiator; alkyl benzophenone photoinitiator such as benzyl dimethyl ketal; thioxanthone photoinitiator such as thioxanthone; 1-hydroxycyclohexyl phenyl ketone, 1-( 4-isopropylphenyl) 2-hydroxy-2-methylpropan-1-one, 1-(4-(2-hydroxyethoxy)-phenyl)-2-hydroxy-2-methyl-1 -propan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, oligo[2-hydroxy-2-methyl-1-{-4(1-methylvinyl) a hydroxyalkylphenone photoinitiator such as phenyl}acetone]; 2,4,6-trimethylbenzylidenediphenylphosphine oxide, bis(2,4,6-trimethylbenzylhydrazine) Light-based phosphine oxide based on phenylphosphine oxide, bis(2,6-dimethoxybenzyl)-2,4,4-trimethyl-pentylphosphine oxide Agent; camphorquinone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinylpropan-1-one, 2-benzyl-2 a ketone-based photoinitiator such as dimethylamino-1-(4-morpholinophenyl)-1-butanone-1, etc., among which oligo [2-hydroxy-2-methyl The hydroxyalkylphenone-based photoinitiator such as -1-{4-(1-methylvinyl)phenyl}acetone] is preferably, but not limited thereto.
陽離子系光起始劑之具體例子,可列舉重氮鎓鹽、鋶鹽、錪鹽等。重氮鎓鹽可列舉苯重氮鎓六氟銻酸鹽、苯重氮鎓六氟磷酸鹽、苯重氮鎓六氟硼酸鹽等。鋶鹽可列舉,三苯基鋶 六氟磷酸鹽、三苯基鋶 六氟銻酸鹽、三苯基鋶 肆(五氟苯基)硼酸鹽、4,4’-雙〔二苯基二 氫硫基〕二苯基硫醚 雙六氟磷酸鹽、4,4’-雙〔二(β-羥基乙氧基)苯基二氫硫基〕二苯基硫醚 雙六氟銻酸鹽、4,4’-雙〔二(β-羥基乙氧基)苯基二氫硫基〕二苯基硫醚 雙六氟磷酸鹽、7-〔二(p-甲苯甲醯基)二氫硫基〕-2-異丙基噻噸酮 六氟銻酸鹽、7-〔二(p-甲苯甲醯基)二氫硫基〕-2-異丙基噻噸酮 肆(五氟苯基)硼酸鹽、4-苯基羰基-4’-二苯基二氫硫基-二苯基硫醚 六氟磷酸鹽、4-(p-tert-丁基苯基羰基)-4’-二苯基二氫硫基-二苯基硫醚六氟銻酸鹽、4-(p-tert-丁基苯基羰基)-4’-二(p-甲苯甲醯基)二氫硫基-二苯基硫醚 肆(五氟苯基)硼酸鹽等。錪鹽可列舉二苯基錪 肆(五氟苯基)硼酸鹽、二苯基錪六氟磷酸鹽、二苯基錪 六氟銻酸鹽、二(4-壬基苯基)錪 六氟磷酸鹽等。惟,陽離子系光起始劑不限定於此等。 Specific examples of the cationic photoinitiator include a diazonium salt, a phosphonium salt, a phosphonium salt and the like. Examples of the diazonium salt include benzenediazonium hexafluoroantimonate, benzenediazonium hexafluorophosphate, and benzenediazonium hexafluoroborate. Examples of the onium salt include triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium (pentafluorophenyl)borate, and 4,4'-bis[diphenyldiene. Hydrogenthio]diphenyl sulfide dihexafluorophosphate, 4,4'-bis[bis(β-hydroxyethoxy)phenyldihydrothio]diphenyl sulfide dihexafluoroantimonate, 4,4'-bis[bis(β-hydroxyethoxy)phenyldihydrothio]diphenyl sulfide dihexafluorophosphate, 7-[bis(p-tolylmethyl)dihydrothio -2- isopropyl thioxanthone hexafluoroantimonate, 7-[bis(p-tolylmethyl)dihydrothio]-2-isopropylthioxanthone oxime (pentafluorophenyl)boronic acid Salt, 4-phenylcarbonyl-4'-diphenyldihydrothio-diphenyl sulfide hexafluorophosphate, 4-(p-tert-butylphenylcarbonyl)-4'-diphenyl Hydrogenthio-diphenyl sulfide hexafluoroantimonate, 4-(p-tert-butylphenylcarbonyl)-4'-di(p-tolylmethyl)dihydrothio-diphenyl sulfide Ether quinone (pentafluorophenyl) borate or the like. Examples of the onium salt include diphenylphosphonium (pentafluorophenyl)borate, diphenylphosphonium hexafluorophosphate, diphenylphosphonium hexafluoroantimonate, and bis(4-mercaptophenyl)phosphonium hexafluorophosphate. Salt and so on. However, the cationic photoinitiator is not limited thereto.
第一硬化性樹脂組成物中之光起始劑含量並無特殊限制,可依光起始劑之種類等適當選擇。例如光起始劑之含量,相對於(甲基)丙烯酸酯化合物100質量份而言,可為0.1~10質量份、較佳為0.5~6質量份。 The content of the photoinitiator in the first curable resin composition is not particularly limited, and may be appropriately selected depending on the kind of the photoinitiator or the like. For example, the content of the photoinitiator may be 0.1 to 10 parts by mass, preferably 0.5 to 6 parts by mass, per 100 parts by mass of the (meth) acrylate compound.
第一硬化性樹脂組成物,可含有單獨1種光起始劑、亦可組合含有2種以上。 The first curable resin composition may contain one type of photoinitiator alone or two or more types in combination.
其他添加劑 Other additives
第一硬化性樹脂組成物,在不損及本發明之特性之範圍內,可含有偶合劑;聚合禁止劑;顏料、染料等之著色劑;金屬粉、碳酸鈣、滑石、二氧化矽、非晶質二氧化 矽、氧化鋁、氫氧化鋁等之無機填充劑;難燃劑;有機填充劑;可塑劑;抗氧化劑;消泡劑;調平劑;流變性控制劑等之添加劑。藉由此等添加劑,可得到硬化樹脂強度/接著強度/作業性/保存性等優良的硬化性樹脂組成物及其硬化物。 The first curable resin composition may contain a coupling agent, a polymerization inhibiting agent, a coloring agent for pigments, dyes, and the like; metal powder, calcium carbonate, talc, cerium oxide, and non-degradable, without impairing the characteristics of the present invention. Crystalline oxidation Inorganic fillers such as barium, alumina, aluminum hydroxide; flame retardants; organic fillers; plasticizers; antioxidants; defoamers; leveling agents; rheology control agents and the like. By such an additive, a curable resin composition excellent in cured resin strength, adhesion strength, workability, storage stability, and the like, and a cured product thereof can be obtained.
偶合劑 Coupler
偶合劑可列舉2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷等之具有環氧基之矽烷偶合劑;p-苯乙烯基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷等之具有乙烯性不飽和鍵之矽烷偶合劑;N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基亞丁基)丙基胺、N-苯基-3-胺基丙基三乙氧基矽烷、N-(乙烯基苄基)-2-胺基乙基-3-胺基丙基三甲氧基矽烷之鹽酸鹽等之具有胺基之矽烷偶合劑;3-脲基丙基三甲氧基矽烷、3-氯丙基三甲氧基矽烷、3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷、雙(三乙氧基矽烷基丙基)四硫醚、3-異氰酸酯丙基三乙氧基矽烷等。 The coupling agent may, for example, be 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldi a decane coupling agent having an epoxy group such as ethoxy decane or 3-glycidoxypropyltriethoxy decane; p-styryl trimethoxy decane, 3-methyl propylene methoxy propyl group Methyldimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane, 3-methylpropenyloxypropyltriethoxydecane, 3-propenyloxypropyltrimethoxy a decane coupling agent having an ethylenically unsaturated bond such as decane; N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane, N-2-(aminoethyl)- 3-aminopropyltrimethoxydecane, N-2-(aminoethyl)-3-aminopropyltriethoxydecane, 3-aminopropyltrimethoxydecane, 3-triethoxy Base alkyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltriethoxydecane, N-(vinylbenzyl)-2-amine a decane coupling agent having an amine group such as a hydrochloride of ethyl ethyl-3-aminopropyltrimethoxydecane; 3-ureidopropyltrimethoxydecane, 3- Propyltrimethoxydecane, 3-mercaptopropylmethyldimethoxydecane, 3-mercaptopropyltrimethoxydecane, bis(triethoxydecylpropyl)tetrasulfide, 3-isocyanatepropyl Triethoxy decane and the like.
此等之中,就接著性之觀點而言,尤以具有(甲基)丙烯醯基、乙烯基等之乙烯性不飽和鍵之矽烷偶合劑較佳。 Among these, a decane coupling agent having an ethylenically unsaturated bond such as a (meth) acrylonitrile group or a vinyl group is preferred from the viewpoint of adhesion.
第一硬化性樹脂組成物含有偶合劑時,相對於(甲基)丙烯酸酯化合物100質量份而言,其含量可為0.1~10質量份、較佳為0.5~5質量份。 When the first curable resin composition contains a coupling agent, the content thereof may be 0.1 to 10 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the (meth) acrylate compound.
偶合劑可1種單獨,亦可組合2種以上使用。第一硬化性樹脂組成物含有2種以上之偶合劑時,該等之含有比率並無特殊限制,係依目的等來適當選擇。第一硬化性樹脂組成物包含2種偶合劑時,其含有比可為4:1~1:4、較佳為2:1~1:2。 The coupling agent may be used alone or in combination of two or more. When the first curable resin composition contains two or more kinds of coupling agents, the content ratio of these is not particularly limited, and is appropriately selected depending on the purpose and the like. When the first curable resin composition contains two kinds of coupling agents, the content ratio thereof may be 4:1 to 1:4, preferably 2:1 to 1:2.
[第二硬化性樹脂組成物] [Second hardening resin composition]
電化學電池中,較佳為接觸電解液層而將之密封的第一密封部,被第二硬化性樹脂組成物之硬化物即第二密封部進一步密封。第二硬化性樹脂組成物,只要係至少包含硬化性樹脂,且具有與第一硬化性樹脂組成物不同的構成者,則無特殊限制,可依目的等適當選擇其構成。 In the electrochemical cell, it is preferable that the first sealing portion that is sealed by contacting the electrolyte layer is further sealed by the second sealing portion which is a cured product of the second curable resin composition. The second curable resin composition is not particularly limited as long as it contains at least a curable resin and has a composition different from that of the first curable resin composition, and can be appropriately selected depending on the purpose.
第二硬化性樹脂組成物,例如可為與第一硬化性樹脂組成物之SP值不同之構成,更佳為SP值差距1以上之構成、又更佳為差距2以上之構成。又,第二硬化性樹脂組成物之SP值,較佳為大於第一硬化性樹脂組成物之SP值。藉由使第二硬化性樹脂組成物之SP值大於第一硬化性樹脂組成物之SP值,係有更提高對基材之接著性、更提高電解液密封性能之傾向。 The second curable resin composition may have a configuration different from the SP value of the first curable resin composition, and more preferably has a configuration in which the SP value differs by at least 1 and more preferably has a difference of 2 or more. Further, the SP value of the second curable resin composition is preferably larger than the SP value of the first curable resin composition. When the SP value of the second curable resin composition is larger than the SP value of the first curable resin composition, the adhesion to the substrate is further improved, and the electrolyte sealing performance is further improved.
第二硬化性樹脂組成物之SP值,例如可為10以上、較佳為11以上。上限值並無特殊限制,例如為15。 The SP value of the second curable resin composition may be, for example, 10 or more, preferably 11 or more. The upper limit is not particularly limited and is, for example, 15.
再者,第二硬化性樹脂組成物之SP值,可作為主成分之硬化性樹脂(較佳為環氧化合物)之SP值來算出。 Further, the SP value of the second curable resin composition can be calculated as the SP value of the curable resin (preferably, an epoxy compound) as a main component.
第二硬化性樹脂組成物,可為熱硬化性、亦可為光硬化性。 The second curable resin composition may be thermosetting or photocurable.
又,第二硬化性樹脂組成物,較佳為包含環氧化合物或氧雜環丁烷化合物之至少1種作為硬化性樹脂;更佳為包含環氧化合物;又更佳為包含具有芳香環之環氧化合物;特佳為包含具有芳香環之環氧化合物的陽離子硬化性環氧樹脂組成物。 Further, the second curable resin composition preferably contains at least one of an epoxy compound or an oxetane compound as a curable resin, more preferably an epoxy compound, and more preferably an aromatic ring. An epoxy compound; particularly preferably a cationically curable epoxy resin composition comprising an epoxy compound having an aromatic ring.
包含具有芳香環之環氧化合物的陽離子硬化性環氧樹脂組成物,例如包含具有芳香環之環氧化合物、與酸產生劑,且依需要包含無機填充劑、偶合劑等之其他添加劑所構成。 The cationically curable epoxy resin composition containing an epoxy compound having an aromatic ring is composed of, for example, an epoxy compound having an aromatic ring, an acid generator, and other additives such as an inorganic filler and a coupling agent as needed.
硬化性樹脂 Curable resin
第二硬化性樹脂組成物,較佳為包含環氧化合物或氧雜環丁烷化合物之至少1種作為硬化性樹脂。環氧化合物,例如可單獨使用重量平均分子量400萬以下之雙酚A型環氧化合物、雙酚F型環氧化合物、酚醛清漆型環氧化合物、多環芳香族環氧化合物、該等之改質環氧化合物、脂環式環氧化合物等之1種且為液狀之化合物;亦可合併 使用2種以上。又,可於此等之環氧化合物中溶解常溫為固體或高黏性之環氧化合物來使用。固體之環氧化合物,可列舉例如N655、HP-4700、EXA-4710、HP-4770、HP-7200(DIC公司製)、EHPE3150(Daicel公司製)等。高黏性之環氧化合物,可列舉例如黏度10,000mPa.s以上之環氧化合物。高黏性之環氧化合物,可列舉例如HP-4032D、N740(DIC公司製)、jER152(三菱化學公司製)等。 The second curable resin composition preferably contains at least one of an epoxy compound and an oxetane compound as a curable resin. As the epoxy compound, for example, a bisphenol A type epoxy compound having a weight average molecular weight of 4 million or less, a bisphenol F type epoxy compound, a novolac type epoxy compound, a polycyclic aromatic epoxy compound, or the like can be used alone. One of a liquid epoxy compound, an alicyclic epoxy compound, etc., which is a liquid compound; Use two or more types. Further, an epoxy compound having a solid temperature or a high viscosity at room temperature can be used in the epoxy compound. Examples of the solid epoxy compound include N655, HP-4700, EXA-4710, HP-4770, HP-7200 (manufactured by DIC Corporation), and EHPE3150 (manufactured by Daicel Co., Ltd.). Highly viscous epoxy compounds, for example, a viscosity of 10,000 mPa. An epoxy compound above s. Examples of the highly viscous epoxy compound include HP-4032D, N740 (manufactured by DIC Corporation), and jER152 (manufactured by Mitsubishi Chemical Corporation).
氧雜環丁烷化合物,可列舉3-乙基-3-羥基甲基氧雜環丁烷(OXA)、1,4-雙〔{(3-乙基-3-氧雜環丁烷基)甲氧基}甲基〕苯(XDO)、3-乙基-3-(苯氧基甲基)氧雜環丁烷(OXT-211(POX))、2-乙基己基氧雜環丁烷(OXT-212(EHOX))、二甲伸苯基雙氧雜環丁烷(OXT-121(XDO))、雙(3-乙基-3-氧雜環丁烷基甲基)醚(OXT-221(DOX))、3-乙基-〔(3-三乙氧基矽烷基丙氧基)甲基〕氧雜環丁烷、氧雜環丁烷基倍半矽氧烷、酚酚醛清漆氧雜環丁烷等。再者,括弧內係表示東亞合成公司的型號。 Examples of the oxetane compound include 3-ethyl-3-hydroxymethyloxetane (OXA) and 1,4-bis[{(3-ethyl-3-oxetanyl)). Methoxy]methyl]benzene (XDO), 3-ethyl-3-(phenoxymethyl)oxetane (OXT-211(POX)), 2-ethylhexyloxetane (OXT-212 (EHOX)), Dimethyl phenyl dioxetane (OXT-121 (XDO)), bis(3-ethyl-3-oxetanylmethyl) ether (OXT) -221(DOX)), 3-ethyl-[(3-triethoxydecylpropoxy)methyl]oxetane, oxetane sesquioxane, phenol novolac Oxetane and the like. Furthermore, the brackets indicate the model of the East Asian Synthetic Company.
環氧化合物及氧雜環丁烷化合物,可1種單獨使用、或組合2種以上使用。 The epoxy compound and the oxetane compound may be used alone or in combination of two or more.
第二硬化性樹脂組成物中之硬化性樹脂的含量,可依目的等而適當選擇。例如硬化性樹脂之含量,於第二硬化性樹脂組成物之總質量中,較佳為30質量%以上、更佳為50質量%以上。 The content of the curable resin in the second curable resin composition can be appropriately selected depending on the purpose and the like. For example, the content of the curable resin is preferably 30% by mass or more, and more preferably 50% by mass or more based on the total mass of the second curable resin composition.
酸產生劑 Acid generator
酸產生劑可為光酸產生劑、亦可為熱酸產生劑。光酸產生劑可列舉前述之光起始劑中的陽離子系光起始劑。又,熱酸產生劑,可列舉鋶鹽或錪鹽、4級銨鹽等之鎓鹽系之熱酸產生劑。 The acid generator may be a photoacid generator or a thermal acid generator. The photoacid generator may, for example, be a cationic photoinitiator in the above photoinitiator. Further, examples of the thermal acid generator include a cerium salt-based thermal acid generator such as a phosphonium salt or a phosphonium salt or a quaternary ammonium salt.
第二硬化性樹脂組成物中之酸產生劑含量並無特殊限制,可依酸產生劑之種類等而適當選擇。例如酸產生劑之含量,相對於硬化性樹脂100質量份而言,可為0.1~10質量份、較佳為1~5質量份。 The content of the acid generator in the second curable resin composition is not particularly limited, and may be appropriately selected depending on the type of the acid generator or the like. For example, the content of the acid generator may be 0.1 to 10 parts by mass, preferably 1 to 5 parts by mass, per 100 parts by mass of the curable resin.
第二硬化性樹脂組成物,可包含單獨1種酸產生劑、亦可組合包含2種以上。 The second curable resin composition may contain one type of acid generator alone or two or more types in combination.
其他添加劑 Other additives
第二硬化性樹脂組成物,在不損及本發明之特性的範圍內,亦可包含偶合劑;顏料、染料等之著色劑;無機填充劑;難燃劑;有機填充劑;聚合禁止劑;可塑劑;抗氧化劑;消泡劑;調平劑;流變性控制劑等之添加劑。藉由此等之添加劑,可得到樹脂強度/接著強度/作業性/保存性等優良的第二硬化性樹脂組成物及其硬化物。 The second curable resin composition may further contain a coupling agent, a coloring agent such as a pigment or a dye, an inorganic filler, a flame retardant, an organic filler, and a polymerization inhibiting agent, within a range not impairing the characteristics of the present invention; Additives such as plasticizers; antioxidants; defoamers; leveling agents; rheology control agents. By the additive such as this, a second curable resin composition excellent in resin strength, adhesion strength, workability, preservability, and the like, and a cured product thereof can be obtained.
填充劑 Filler
第二硬化性樹脂組成物,由電解液密封性能之觀點而言,較佳為包含無機填充劑或有機填充劑之至少1種。 The second curable resin composition preferably contains at least one of an inorganic filler or an organic filler from the viewpoint of electrolyte sealing performance.
無機填充劑可列舉金屬粉、碳酸鈣、滑石、二氧化矽、非晶質二氧化矽、氧化鋁、氫氧化鋁、菫青石、偏矽 酸鎂、原矽酸鎂等。此等之中尤較佳可使用滑石、二氧化矽等。有機填充劑可列舉聚乙烯或聚丙烯等之聚烯烴類;脂環族飽和烴樹脂、聚苯乙烯、苯乙烯丁二烯橡膠(SBR)、聚醯胺、聚酯、聚胺基甲酸酯、聚(甲基)丙烯酸酯聚合物、聚氯乙烯(PVC)、聚乙酸乙烯酯、聚環氧化物、聚縮醛、丙烯腈-丁二烯-苯乙烯共聚物(ABS)或該等之共聚物、聚苯醚、聚偏二氯乙烯或此等之聚合物之混合物等。無機填充劑或有機填充劑可1種單獨、亦可組合2種以上使用。 Examples of the inorganic filler include metal powder, calcium carbonate, talc, cerium oxide, amorphous cerium oxide, aluminum oxide, aluminum hydroxide, cordierite, and hemiplegia. Magnesium acid, magnesium orthosilicate. Among these, talc, cerium oxide, or the like is particularly preferably used. Examples of the organic filler include polyolefins such as polyethylene or polypropylene; alicyclic saturated hydrocarbon resins, polystyrene, styrene butadiene rubber (SBR), polyamine, polyester, and polyurethane. , poly(meth)acrylate polymer, polyvinyl chloride (PVC), polyvinyl acetate, polyepoxide, polyacetal, acrylonitrile-butadiene-styrene copolymer (ABS) or the like Copolymer, polyphenylene ether, polyvinylidene chloride or a mixture of such polymers, and the like. The inorganic filler or the organic filler may be used singly or in combination of two or more.
第二硬化性樹脂組成物包含無機填充劑或有機填充劑時,其含量並無特殊限制,可依目的等來適當選擇。例如無機填充劑或有機填充劑之含量,相對於環氧化合物100質量份而言,可為1~100質量份、較佳為30~50質量份。 When the second curable resin composition contains an inorganic filler or an organic filler, the content thereof is not particularly limited, and may be appropriately selected depending on the purpose and the like. For example, the content of the inorganic filler or the organic filler may be 1 to 100 parts by mass, preferably 30 to 50 parts by mass, per 100 parts by mass of the epoxy compound.
偶合劑 Coupler
第二硬化性樹脂組成物,較佳為包含偶合劑之至少1種。第二硬化性樹脂組成物中之偶合劑,可列舉與前述之偶合劑相同者,其中尤以具有環氧基之偶合劑較佳。 The second curable resin composition preferably contains at least one of a coupling agent. The coupling agent in the second curable resin composition may be the same as the above-mentioned coupling agent, and among them, a coupling agent having an epoxy group is particularly preferable.
第二硬化性樹脂組成物包含偶合劑時,其含量並無特殊限制,可依目的等來適當選擇。例如偶合劑之含量,相對於環氧化合物100質量份而言,可為0.1~10質量份、較佳為0.5~5質量份。 When the second curable resin composition contains a coupling agent, the content thereof is not particularly limited, and may be appropriately selected depending on the purpose and the like. For example, the content of the coupling agent may be 0.1 to 10 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the epoxy compound.
[電解液] [electrolyte]
電化學電池中之電解液層係含有電解液,且被第一密封部密封。電解液之構成並無特殊限制,可依電化學電池之目的等適當選擇其構成。例如,電化學電池為色素敏化太陽電池、防眩鏡、顯示體時,電解液例如係包含有機溶劑、氧化還原劑、與依需要之含有的添加劑而構成。 The electrolyte layer in the electrochemical cell contains an electrolyte and is sealed by the first sealing portion. The composition of the electrolytic solution is not particularly limited, and the constitution can be appropriately selected depending on the purpose of the electrochemical battery or the like. For example, when the electrochemical cell is a dye-sensitized solar cell, an anti-glare mirror, or a display, the electrolytic solution is composed of, for example, an organic solvent, a redox agent, and an additive contained as needed.
電解液之SP值,與形成第一密封部之第一硬化性樹脂組成物之SP值係差距4以上,較佳為差距4~7。又,電解液之SP值較佳為大於第一硬化性樹脂組成物之SP值。電解液之SP值例如較佳為12以上、更佳為12~15。 The SP value of the electrolytic solution is different from the SP value of the first curable resin composition forming the first sealing portion by 4 or more, and preferably 4 to 7. Further, the SP value of the electrolytic solution is preferably larger than the SP value of the first curable resin composition. The SP value of the electrolytic solution is, for example, preferably 12 or more, more preferably 12 to 15.
再者,電解液之SP值,可作為主成分即有機溶劑之SP值而算出。 Further, the SP value of the electrolytic solution can be calculated as the SP value of the organic solvent which is the main component.
有機溶劑 Organic solvents
電解液中所含的有機溶劑,較佳為高極性有機溶劑,可由作為電化學反應中之反應媒介而公知之高極性有機溶劑中適當選擇來使用。有機溶劑具體而言可列舉碳酸伸乙酯、碳酸伸丙酯、碳酸伸丁酯等之環狀碳酸酯類;碳酸二甲酯、碳酸二乙酯、碳酸甲基乙酯等之非環狀碳酸酯類;二噁烷、四氫呋喃、2-甲基四氫呋喃、乙二醇二烷基醚、丙二醇二烷基醚、聚乙二醇單烷基醚、聚乙二醇二烷基醚等之醚類;乙腈、戊二腈、甲氧基乙腈、丙腈、苄腈等之腈類;二甲基亞碸、環丁碸等之亞碸類;甲醇、乙醇等之 醇類;烷二醇單烷基醚類;γ-丁內酯等之內酯類;二甲基甲醯胺、二甲基乙醯胺、N-甲基吡咯啶酮等之醯胺類;3-甲基-2-噁唑啉酮等之雜環類等。 The organic solvent contained in the electrolytic solution is preferably a highly polar organic solvent, and can be suitably selected from highly polar organic solvents known as a reaction medium in an electrochemical reaction. Specific examples of the organic solvent include cyclic carbonates such as ethyl carbonate, propyl carbonate, and butyl carbonate; and non-cyclic carbonates such as dimethyl carbonate, diethyl carbonate, and methyl ethyl carbonate. Esters; ethers of dioxane, tetrahydrofuran, 2-methyltetrahydrofuran, ethylene glycol dialkyl ether, propylene glycol dialkyl ether, polyethylene glycol monoalkyl ether, polyethylene glycol dialkyl ether, etc. a nitrile such as acetonitrile, glutaronitrile, methoxyacetonitrile, propionitrile or benzonitrile; a hydrazine such as dimethyl hydrazine or cyclobutyl hydrazine; methanol, ethanol, etc. Alcohols; alkanediol monoalkyl ethers; lactones such as γ-butyrolactone; guanamines such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone; a heterocyclic group such as 3-methyl-2-oxazolinone or the like.
有機溶劑可1種單獨、亦可組合2種以上使用。 The organic solvent may be used singly or in combination of two or more.
氧化還原劑 Redox agent
電化學電池所用之氧化還原劑,較佳為碘與金屬碘化合物。金屬碘化合物之例子,可列舉碘化鋰、碘化鈉、碘化鉀、碘化銫等。又,與碘組合之氧化還原劑不僅為金屬碘化合物,亦可列舉四級吡啶鎓鹽或四級咪唑鎓鹽之碘化物鹽。進一步地,胺類或硫醇類等之雜化合物亦可使用作為氧化還原助劑,亦可添加亞鐵氰酸鹽、鐵氰酸鹽、二茂鐵、二茂鐵鎓離子鹽等之氧化還原系觸媒。 The redox agent used in the electrochemical cell is preferably an iodine and a metal iodine compound. Examples of the metal iodine compound include lithium iodide, sodium iodide, potassium iodide, and cesium iodide. Further, the redox agent combined with iodine is not only a metal iodine compound, but also an iodide salt of a quaternary pyridinium salt or a quaternary imidazolium salt. Further, a hetero compound such as an amine or a thiol may be used as a redox auxiliary, and a redox group, a ferric cyanide, a ferrocene, a ferrocenium ion salt or the like may be added for oxidation reduction. Catalyst.
此等之氧化還原劑及氧化還原助劑之組合,特佳為碘與碘化物鹽之系統。 A combination of such a redox agent and a redox auxiliary agent is particularly preferably a system of iodine and iodide salts.
氧化還原劑於電解液中之濃度,例如係0.01~2mol/L、較佳為0.01~0.05mol/L之範圍。 The concentration of the redox agent in the electrolytic solution is, for example, in the range of 0.01 to 2 mol/L, preferably 0.01 to 0.05 mol/L.
添加劑 additive
添加劑之種類及含量,係依電化學電池之目的等,由公知之添加劑中適當選擇。添加劑具體而言,可列舉防止逆向電流,提高開放起電壓之4-tert-丁基吡啶等。 The type and content of the additive are appropriately selected from known additives depending on the purpose of the electrochemical cell or the like. Specific examples of the additive include 4-tert-butylpyridine which prevents the reverse current and increases the open voltage.
[基材] [substrate]
電化學電池具有不具有電解液注入口之2枚基材。此處「不具有電解液注入口」不僅意指未形成有於基材開口之電解液注入口即貫通孔,亦意指未形成有將一時形成之貫通孔閉塞而閉口之貫通孔。 The electrochemical cell has two substrates that do not have an electrolyte injection port. Here, "there is no electrolyte injection port" means not only a through hole which is not formed in the electrolyte injection port of the substrate opening, but also a through hole in which the through hole formed at the time is closed and closed.
基材之材質及大小等,係依電化學電池之目的等而適當選擇。 The material and size of the substrate are appropriately selected depending on the purpose of the electrochemical cell or the like.
基材之材質具體而言,可列舉玻璃等之無機材質之基材;聚碳酸酯(PC)樹脂、聚乙烯萘(PEN)樹脂、聚萘二甲酸乙二酯(PET)樹脂等之有機材質之基材。基材之與電解液層接觸之面(以下亦稱為「基材面」),亦可依需要設置光透過性之導電層等。導電層可列舉由氧化銦與氧化錫所構成之化合物(ITO)、進而可列舉於氧化錫中摻雜有氟之(FTO)等。於基材之與接觸電解液層之面相反側之面,例如電化學電池為色素敏化太陽電池時,可依需要設置吸附色素之氧化鈦層等之半導體層等。 Specific examples of the material of the substrate include a substrate made of an inorganic material such as glass, and an organic material such as polycarbonate (PC) resin, polyethylene naphthalene (PEN) resin, or polyethylene naphthalate (PET) resin. The substrate. A surface of the substrate that is in contact with the electrolyte layer (hereinafter also referred to as "substrate surface") may be provided with a light-transmitting conductive layer or the like as needed. The conductive layer may, for example, be a compound (ITO) composed of indium oxide and tin oxide, or may be exemplified by fluorine (FTO) doped with tin oxide. In the case where the electrochemical cell is a dye-sensitized solar cell, for example, when the electrochemical cell is a dye-sensitized solar cell, a semiconductor layer or the like which adsorbs a titanium oxide layer of a dye or the like may be provided.
基材之厚度並無特殊限制,可依目的等來適當選擇。基材之厚度例如可為0.5mm~2.0mm。 The thickness of the substrate is not particularly limited and may be appropriately selected depending on the purpose and the like. The thickness of the substrate may be, for example, 0.5 mm to 2.0 mm.
電化學電池中,係於2枚基材之間配置電解液層。電解液層之厚度並無特殊限制,可依電化學電池之目的等來適當選擇。電解液層之厚度例如可為30μm~100μm。 In an electrochemical cell, an electrolyte layer is disposed between two substrates. The thickness of the electrolyte layer is not particularly limited and may be appropriately selected depending on the purpose of the electrochemical cell or the like. The thickness of the electrolyte layer may be, for example, 30 μm to 100 μm.
電解液層,係配置於2枚基材之間,而被包圍電解液層之第一密封部密封。亦即,電解液層係被密封於形成為框狀之第一密封部之框內。形成為框狀之第一密封部之框 的寬度大小並無特殊限制。第一密封部之寬度例如可為0.3mm~2.0mm、較佳為0.5mm~1.0mm。 The electrolyte layer is disposed between the two substrates, and is sealed by the first sealing portion surrounding the electrolyte layer. That is, the electrolyte layer is sealed in a frame formed in a frame-shaped first sealing portion. a frame formed into a frame-shaped first sealing portion There is no special limit to the width of the width. The width of the first sealing portion may be, for example, 0.3 mm to 2.0 mm, preferably 0.5 mm to 1.0 mm.
第一密封部,係具有光硬化性之第一硬化性樹脂組成物之硬化物。第一硬化性樹脂組成物之硬化條件,只要可得到硬化物,則並無特殊限制。第一硬化性樹脂組成物之硬化,例如能夠以供給2000~12000mJ/cm2之光能的硬化條件來進行,較佳為供給3000~6000mJ/cm2之光能的硬化條件。 The first sealing portion is a cured product of a photocurable first curable resin composition. The curing conditions of the first curable resin composition are not particularly limited as long as a cured product can be obtained. The curing of the first curable resin composition can be carried out, for example, under a curing condition of supplying light energy of 2,000 to 12,000 mJ/cm 2 , and is preferably a curing condition of light energy of 3,000 to 6,000 mJ/cm 2 .
電化學電池之較佳態樣中,第一密封部,係被第二硬化性樹脂組成物之硬化物即第二密封部包圍而密封。亦即,配置於2枚基材之間的電解液層,係以第一密封部及第二密封部被2重密封。藉由此構成,可達成更優良的電解液密封性能。 In a preferred embodiment of the electrochemical cell, the first sealing portion is sealed by being surrounded by the second sealing portion which is a cured product of the second curable resin composition. That is, the electrolyte layer disposed between the two substrates is double-sealed by the first sealing portion and the second sealing portion. By this configuration, a more excellent electrolyte sealing performance can be achieved.
第二密封部只要包圍第一密封部來配置即可,可接觸於第一密封部之外周,而配置於2枚基材間、可接觸於第一密封部及與基材之基材面直交的面(以下亦稱為「基材端部面」)來配置、亦可接觸於第一密封部之外周,而配置於2枚基材間與基材端部面之兩方。 The second sealing portion may be disposed so as to surround the first sealing portion, and is disposed in contact with the outer periphery of the first sealing portion, and is disposed between the two substrates, is in contact with the first sealing portion, and is orthogonal to the substrate surface of the substrate. The surface (hereinafter also referred to as "substrate end surface") is disposed so as to be in contact with the outer periphery of the first sealing portion, and is disposed between the two substrates and the end surface of the substrate.
第二密封部配置於2枚基材之間時,包圍第一密封部之第二密封部的平行於基材面之方向的厚度,亦即第二密封部之寬度,並無特殊限制,可依目的等來適當選擇。第二密封部之寬度例如可為0.3mm~2.0mm、較佳為0.5mm~1.0mm。 When the second sealing portion is disposed between the two base materials, the thickness of the second sealing portion surrounding the first sealing portion in a direction parallel to the surface of the substrate, that is, the width of the second sealing portion is not particularly limited. Choose according to the purpose and so on. The width of the second sealing portion may be, for example, 0.3 mm to 2.0 mm, preferably 0.5 mm to 1.0 mm.
又,第二密封部接觸於基材端部面而配置時,第二密 封部之基材面方向的厚度並無特殊限制,可依目的及基材厚度等來適當選擇。例如基材厚度為1.0mm時,第二密封部之厚度可為0.5mm~2.0mm、較佳為1.0mm~2.0mm。 Further, when the second sealing portion is placed in contact with the end surface of the base material, the second dense portion The thickness of the base surface of the sealing portion is not particularly limited, and may be appropriately selected depending on the purpose, the thickness of the substrate, and the like. For example, when the thickness of the substrate is 1.0 mm, the thickness of the second sealing portion may be 0.5 mm to 2.0 mm, preferably 1.0 mm to 2.0 mm.
電化學電池之用途並無特殊限定,可列舉例如色素敏化太陽電池、防眩鏡、顯示體、電容器、電池組(battery)等。其中尤以色素敏化太陽電池、防眩鏡或顯示體較佳。 The use of the electrochemical cell is not particularly limited, and examples thereof include a dye-sensitized solar cell, an anti-glare mirror, a display, a capacitor, and a battery. Among them, a pigment-sensitized solar cell, an anti-glare mirror or a display body is preferable.
<電化學電池之製造方法> <Method of Manufacturing Electrochemical Cell>
電化學電池之製造方法之第一態樣,係具有密封於第一基材與第二基材之間的電解液層之電化學電池之製造方法,其包含:於第一基材上,將溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物供給為框狀,形成第一硬化性樹脂組成物層之步驟(以下亦稱為「步驟A」)、對形成於第一基材上之框內供給電解液,形成電解液層,且於電解液層及第一硬化性樹脂組成物層上層合第二基材而得到層合體之步驟(以下亦稱為「步驟B」)、使第一硬化性樹脂組成物層光硬化而形成第一密封部之步驟(以下亦稱為「步驟C」)、將第二硬化性樹脂組成物供給為包圍第一密封部,形成第二硬化性樹脂組成物層之步驟(以下亦稱為「步驟D」)、與使第二硬化性樹脂組成物層硬化而形成第二密封部之步驟(以下亦稱為「步驟E」)。電化學電池之製造方法亦可依需要包含其他步驟。 The first aspect of the method for manufacturing an electrochemical cell is a method for manufacturing an electrochemical cell having an electrolyte layer sealed between a first substrate and a second substrate, comprising: on the first substrate, The solubility parameter is different from the electrolyte solution by 4 or more, and the photocurable first curable resin composition is supplied in a frame shape, and the first curable resin composition layer is formed (hereinafter also referred to as "step A"). a step of supplying an electrolytic solution in a frame formed on a first substrate to form an electrolyte layer, and laminating a second substrate on the electrolyte layer and the first curable resin composition layer to obtain a laminate (hereinafter also referred to as a laminate) "Step B"), a step of forming a first sealing portion by photocuring the first curable resin composition layer (hereinafter also referred to as "Step C"), and supplying the second curable resin composition to surround the first sealing a step of forming a second curable resin composition layer (hereinafter also referred to as "step D") and a step of curing the second curable resin composition layer to form a second sealing portion (hereinafter also referred to as "step E"). The method of manufacturing the electrochemical cell may also include other steps as needed.
[步驟A] [Step A]
步驟A中,係於第一基材上,將溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物供給為框狀,形成第一硬化性樹脂組成物層。第一基材及第一硬化性樹脂組成物之詳細係如前所述。 In the step A, the first curable resin composition layer is formed by supplying a first curable resin composition having a photocuring property to a frame shape with a solubility parameter of 4 or more. The details of the first substrate and the first curable resin composition are as described above.
將第一硬化性樹脂組成物供給為框狀之方法並無特殊限制,可由通常所用之方法中適當選擇。供給方法可列舉例如注加(dispensing)法、網版印刷法等。 The method of supplying the first curable resin composition into a frame shape is not particularly limited, and can be appropriately selected from the methods generally used. Examples of the supply method include a dispensing method, a screen printing method, and the like.
第一硬化性樹脂組成物層之供給量並無特殊限制,可依目的等來適當選擇。第一硬化性樹脂組成物層之垂直於基板面之方向的厚度例如可為30μm~100μm、較佳為40μm~60μm。又,第一硬化性樹脂組成物層之平行於基板面之方向的厚度例如可為0.3mm~2.0mm、較佳為0.5mm~1.0mm。 The supply amount of the first curable resin composition layer is not particularly limited, and may be appropriately selected depending on the purpose and the like. The thickness of the first curable resin composition layer in the direction perpendicular to the substrate surface may be, for example, 30 μm to 100 μm, or preferably 40 μm to 60 μm. Further, the thickness of the first curable resin composition layer in the direction parallel to the substrate surface may be, for example, 0.3 mm to 2.0 mm, preferably 0.5 mm to 1.0 mm.
[步驟B] [Step B]
步驟B中,係於形成於第一基材上之框內供給電解液,形成電解液層,且於電解液層及第一硬化性樹脂組成物層上層合第二基材而得到層合體。電解液之供給方法,可列舉注加法等。又,電解液之供給量並無特殊限制,可依由第一硬化性樹脂組成物層所形成之框的大小來適當選擇。再者,步驟B所用之電解液的詳細係如前述。 In the step B, the electrolytic solution is supplied into the frame formed on the first substrate to form an electrolyte layer, and the second substrate is laminated on the electrolyte layer and the first curable resin composition layer to obtain a laminate. The method of supplying the electrolytic solution may, for example, be an addition method or the like. Further, the supply amount of the electrolytic solution is not particularly limited, and can be appropriately selected depending on the size of the frame formed by the first curable resin composition layer. Further, the details of the electrolytic solution used in the step B are as described above.
於電解液層及第一硬化性樹脂組成物層上層 合第二基材之方法並無特殊限制。可為於常壓下層合之方法、亦可為於減壓下層合之方法。層合之方法較佳為於減壓下層合之方法。於減壓下層合時,其壓力例如可為200hPa以下、較佳為150hPa以下、更佳為80~120hPa。 On the electrolyte layer and the upper layer of the first curable resin composition layer The method of combining the second substrate is not particularly limited. It may be a method of laminating under normal pressure or a method of laminating under reduced pressure. The lamination method is preferably a method of laminating under reduced pressure. When laminating under reduced pressure, the pressure may be, for example, 200 hPa or less, preferably 150 hPa or less, more preferably 80 to 120 hPa.
[步驟C] [Step C]
步驟C中,係將第一硬化性樹脂組成物層予以光硬化而形成第一密封部。第一硬化性樹脂組成物層之光硬化,可藉由對步驟B中得到之層合體進行光照射來進行。光照射之能量之量並無特殊限制,只要依第一硬化性樹脂組成物層來適當選擇即可。光照射的能量之量例如可為2000~12000mJ/cm2、較佳為3000~6000mJ/cm2。 In the step C, the first curable resin composition layer is photocured to form a first sealing portion. The photohardening of the first curable resin composition layer can be carried out by irradiating the laminate obtained in the step B with light. The amount of energy of light irradiation is not particularly limited, and may be appropriately selected depending on the first curable resin composition layer. The amount of energy of light irradiation may be, for example, 2,000 to 12,000 mJ/cm 2 , preferably 3,000 to 6,000 mJ/cm 2 .
[步驟D] [Step D]
步驟D中,係將第二硬化性樹脂組成物供給為包圍第一密封部,形成第二硬化性樹脂組成物層。步驟D所用之第二硬化性樹脂組成物之詳細係如前所述。 In the step D, the second curable resin composition is supplied so as to surround the first sealing portion to form a second curable resin composition layer. The details of the second curable resin composition used in the step D are as described above.
將第二硬化性樹脂組成物供給為包圍第一密封部之方法並無特殊限制,可由通常使用之方法中適當選擇。供給方法可列舉例如注加法等。第二硬化性樹脂組成物較佳係供給為接觸並包圍第一密封部。 The method of supplying the second curable resin composition so as to surround the first sealing portion is not particularly limited, and may be appropriately selected from the methods generally used. The supply method may, for example, be an addition method or the like. The second curable resin composition is preferably supplied to contact and surround the first sealing portion.
第二硬化性樹脂組成物只要係供給為包圍第一密封部即可,能夠以與第一密封部接觸的方式供給於2枚基材之間、能夠以與第一密封部及基材端部面接觸的方式供給、 亦能夠以與第一密封部接觸的方式供給於2枚基材間與基材端部面之兩方。 The second curable resin composition may be supplied to surround the first sealing portion, and may be supplied between the two substrates so as to be in contact with the first sealing portion, and may be provided with the first sealing portion and the substrate end portion. Surface contact, supply It can also be supplied between the two base materials and the end surface of the base material in contact with the first seal portion.
第二硬化性樹脂組成物層之供給量並無特殊限制,可依目的等來適當選擇。第二硬化性樹脂組成物供給於2枚基材之間時,包圍第一密封部之第二硬化性樹脂組成物層之平行於基材面之方向的厚度,亦即第二硬化性樹脂組成物層之寬度,並無特殊限制,可依目的等來適當選擇。第二硬化性樹脂組成物層之寬度例如可為0.3mm~2.0mm、較佳為0.5mm~1.0mm。 The supply amount of the second curable resin composition layer is not particularly limited, and may be appropriately selected depending on the purpose and the like. When the second curable resin composition is supplied between the two base materials, the thickness of the second curable resin composition layer surrounding the first seal portion in the direction parallel to the substrate surface, that is, the second curable resin composition The width of the layer is not particularly limited and may be appropriately selected depending on the purpose and the like. The width of the second curable resin composition layer may be, for example, 0.3 mm to 2.0 mm, preferably 0.5 mm to 1.0 mm.
又,第二硬化性樹脂組成物以接觸於基材端部面之方式供給時,第二硬化性樹脂組成物層之基材面方向之厚度並無特殊限制,可依目的及基材厚度等來適當選擇。例如基材厚度為1.0mm時,第二硬化性樹脂組成物層之厚度可為0.5mm~2.0mm、較佳為1.0mm~2.0mm。 Further, when the second curable resin composition is supplied in contact with the end surface of the substrate, the thickness of the second curable resin composition layer in the direction of the substrate surface is not particularly limited, and may be depending on the purpose and the thickness of the substrate. Come to the appropriate choice. For example, when the thickness of the substrate is 1.0 mm, the thickness of the second curable resin composition layer may be from 0.5 mm to 2.0 mm, preferably from 1.0 mm to 2.0 mm.
[步驟E] [Step E]
步驟E中,將第二硬化性樹脂組成物層硬化而形成第二密封部。將第二硬化性樹脂組成物層硬化之方法,係依第二硬化性樹脂組成物之構成來適當選擇。第二硬化性樹脂組成物為光硬化性時,可藉由對第二硬化性樹脂組成物層照射光,而形成第二密封部。光照射之能量之量,並無特殊限制,只要依第二硬化性樹脂組成物層來適當選擇即可。光照射之能量之量,例如可為4000~18000mJ/cm2、較佳為5000~8000mJ/cm2。進一步地較佳為賦予熱,若為 60~80℃則為60~90分鐘、若為120℃則為5~10分鐘較佳。 In the step E, the second curable resin composition layer is cured to form a second sealing portion. The method of hardening the second curable resin composition layer is appropriately selected depending on the constitution of the second curable resin composition. When the second curable resin composition is photocurable, the second curable resin composition layer can be irradiated with light to form a second sealing portion. The amount of energy of light irradiation is not particularly limited, and may be appropriately selected depending on the second curable resin composition layer. The amount of energy of light irradiation may be, for example, 4,000 to 18,000 mJ/cm 2 , preferably 5,000 to 8,000 mJ/cm 2 . Further, it is preferable to impart heat, and it is 60 to 90 minutes for 60 to 80 ° C, and 5 to 10 minutes for 120 ° C.
又,第二硬化性樹脂組成物為熱硬化性時,可藉由對第二硬化性樹脂組成物層賦予熱,來形成第二密封部。熱之能量之量並無特殊限制,只要依照第二硬化性樹脂組成物層來適當選擇即可。熱之賦予,例如可為60~120℃、5~180分鐘,較佳為80~100℃、60~120分鐘。 Further, when the second curable resin composition is thermosetting, the second sealing portion can be formed by applying heat to the second curable resin composition layer. The amount of heat energy is not particularly limited, and may be appropriately selected in accordance with the second curable resin composition layer. The heat can be, for example, 60 to 120 ° C, 5 to 180 minutes, preferably 80 to 100 ° C, and 60 to 120 minutes.
電化學電池之製造方法之第二態樣,係具有密封於第一基材與第二基材之間的電解液層之電化學電池之製造方法,其包含:於第一基材上,將溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物供給為框狀,形成第一硬化性樹脂組成物層之步驟(以下亦稱為「步驟a」)、將溶解度參數與第一硬化性樹脂組成物差距2以上之第二硬化性樹脂組成物,以接觸並包圍框狀之第一硬化性樹脂組成物層的外周之方式供給於第一基材上,形成第二硬化性樹脂組成物層之步驟(以下亦稱為「步驟b」)、於形成於第一基材上之框內供給電解液,形成電解液層,且於電解液層、第一及第二硬化性樹脂組成物層上層合第二基材而得到層合體之步驟(以下亦稱為「步驟c」)、與使第一硬化性樹脂組成物層及第二硬化性樹脂組成物層硬化而形成第一密封部及第二密封部之步驟(以下亦稱為「步驟d」)。電化學電池之製造方法亦可依需要包含其他步驟。 The second aspect of the method for manufacturing an electrochemical cell is a method for manufacturing an electrochemical cell having an electrolyte layer sealed between a first substrate and a second substrate, comprising: on the first substrate, a step in which the first curable resin composition having photocurability is supplied in a frame shape, and the first curable resin composition layer is formed (hereinafter also referred to as "step a"), The second curable resin composition having a difference in solubility parameter from the first curable resin composition of 2 or more is supplied to the first substrate so as to contact and surround the outer periphery of the frame-shaped first curable resin composition layer. a step of the second curable resin composition layer (hereinafter also referred to as "step b"), supplying an electrolyte solution in a frame formed on the first substrate to form an electrolyte layer, and in the electrolyte layer, first and a step of laminating a second base material on the second curable resin composition layer to obtain a laminate (hereinafter also referred to as "step c"), and a first curable resin composition layer and a second curable resin composition layer Hardening to form the first seal and the first Step sealing portion of (hereinafter also referred to as "step d"). The method of manufacturing the electrochemical cell may also include other steps as needed.
[步驟a] [Step a]
步驟a中,係於第一基材上,將溶解度參數與電解液差距4以上,且具有光硬化性之第一硬化性樹脂組成物供給為框狀,而形成第一硬化性樹脂組成物層。步驟a之詳細,係與製造方法之第一態樣中的步驟A相同。 In the step a, the first curable resin composition layer is formed by disposing a solubility parameter between the solubility parameter and the electrolyte solution of 4 or more, and the photocurable first curable resin composition is supplied in a frame shape. . The details of step a are the same as step A in the first aspect of the manufacturing method.
[步驟b] [Step b]
步驟b中,係將溶解度參數與第一硬化性樹脂組成物差距2以上之第二硬化性樹脂組成物,以接觸並包圍形成為框狀之第一硬化性樹脂組成物層外周的方式供給,形成第二硬化性樹脂組成物層。步驟b之詳細,係與製造方法之第一態樣中,步驟D之將第二硬化性樹脂組成物供給於2枚基材之間的情況相同。 In the step b, the second curable resin composition having a difference between the solubility parameter and the first curable resin composition of 2 or more is supplied so as to contact and surround the outer periphery of the first curable resin composition layer formed in a frame shape. A second curable resin composition layer is formed. The details of the step b are the same as those in the first aspect of the production method in the case where the second curable resin composition is supplied between the two substrates in the step D.
[步驟c] [Step c]
步驟c中,係於形成於第一基材上之框內供給電解液,形成電解液層,且於電解液層及第一硬化性樹脂組成物層上層合第二基材而得到層合體。步驟c之詳細,係與製造方法之第一態樣中的步驟B相同。 In the step c, the electrolytic solution is supplied into the frame formed on the first substrate to form an electrolyte layer, and the second substrate is laminated on the electrolyte layer and the first curable resin composition layer to obtain a laminate. The details of step c are the same as step B in the first aspect of the manufacturing method.
步驟d中,係將第一硬化性樹脂組成物層及第二硬化性樹脂組成物層硬化,而形成第一密封部及第二密封部。步驟d之詳細,係與製造方法之第一態樣中之步驟C及步驟E相同。 In the step d, the first curable resin composition layer and the second curable resin composition layer are cured to form a first sealing portion and a second sealing portion. The details of step d are the same as those of step C and step E in the first aspect of the manufacturing method.
一邊參照圖1A~圖1D,說明電化學電池之製 造方法之一例。圖1A中,係於基材1上,將第一硬化性樹脂組成物供給為框狀,形成第一硬化性樹脂組成物層2,於所形成之框內供給電解液,形成電解液層3。圖1B中,係於第一硬化性樹脂組成物層2及電解液層3上層合基材1’,得到層合體。接著藉由光硬化處理而形成第一密封部。圖1C中係將第二硬化性樹脂組成物以接觸於第一密封部與基材端面部的方式供給,而形成第二硬化性樹脂組成物層4。接著,將第二硬化性樹脂組成物層4予以硬化處理,形成第二密封部,得到電化學電池。圖1D記載電化學電池之a-b間的截面圖。圖1D中,於2枚基材1及1’之間配置電解液層3,將包圍並密封電解液層3之第一密封部2配置於基材1及1’之間,將第二密封部4配置為接觸於第一密封部2及基材端部面並包圍此等。 Referring to FIG. 1A to FIG. 1D, the system of electrochemical cells will be described. An example of a method of making. In FIG. 1A, the first curable resin composition is supplied in a frame shape on the substrate 1, and the first curable resin composition layer 2 is formed, and an electrolytic solution is supplied into the formed frame to form an electrolyte layer 3. . In Fig. 1B, the substrate 1' is laminated on the first curable resin composition layer 2 and the electrolyte layer 3 to obtain a laminate. The first sealing portion is then formed by photohardening treatment. In FIG. 1C, the second curable resin composition is supplied in contact with the first sealing portion and the end surface portion of the substrate to form the second curable resin composition layer 4. Next, the second curable resin composition layer 4 is hardened to form a second sealing portion, thereby obtaining an electrochemical cell. Figure 1D illustrates a cross-sectional view of a-b of an electrochemical cell. In FIG. 1D, the electrolyte layer 3 is disposed between the two substrates 1 and 1', and the first sealing portion 2 surrounding and sealing the electrolyte layer 3 is disposed between the substrates 1 and 1', and the second sealing is performed. The portion 4 is disposed in contact with the first sealing portion 2 and the end surface of the substrate and surrounds the portion.
又,一邊參照圖2A~圖2C,說明電化學電池之製造方法之其他例子。圖2A中,於基材1上將第一硬化性樹脂組成物供給為框狀,形成第一硬化性樹脂組成物層2,接著將第二硬化性樹脂組成物以與第一硬化性樹脂組成物層2之外周接觸的方式供給,形成第二硬化性樹脂組成物層4後,對所形成之框內供給電解液,形成電解液層3。圖2B中,係於第一硬化性樹脂組成物層2、第二硬化性樹脂組成物層4及電解液層3上,層合基材1’得到層合體。接著藉由光硬化處理,形成第一及第二密封部,而得到電化學電池。圖2C記載電化學電池之c-d間之截面圖。圖2C中,於2枚基材1及1’之間配置電解液層3, 將包圍並密封電解液層3之第一密封部2配置於基材1及1’之間,將第二密封部4配置為接觸第一密封部2並將之包圍。 Further, another example of the method of manufacturing the electrochemical battery will be described with reference to FIGS. 2A to 2C. In FIG. 2A, the first curable resin composition is supplied in a frame shape on the substrate 1, and the first curable resin composition layer 2 is formed, and then the second curable resin composition is composed of the first curable resin. The material layer 2 is supplied in the outer peripheral contact manner, and after the second curable resin composition layer 4 is formed, an electrolytic solution is supplied into the formed frame to form the electrolytic solution layer 3. In Fig. 2B, the first curable resin composition layer 2, the second curable resin composition layer 4, and the electrolyte layer 3 are laminated on the substrate 1' to obtain a laminate. Then, the first and second sealing portions are formed by photohardening treatment to obtain an electrochemical cell. Figure 2C depicts a cross-sectional view of c-d between electrochemical cells. In Fig. 2C, the electrolyte layer 3 is disposed between the two substrates 1 and 1'. The first sealing portion 2 that surrounds and seals the electrolyte layer 3 is disposed between the substrates 1 and 1', and the second sealing portion 4 is disposed to be in contact with the first sealing portion 2 and surrounded.
電化學電池之製造方法,適合於不需要電解液之注入口的貼合方法,因此可簡化製造步驟。又,以本發明之電化學電池之製造方法所製造之電化學電池,可持續長期間維持充分的電解液密封性能。 The method for producing an electrochemical cell is suitable for a bonding method that does not require an injection port of an electrolytic solution, so that the manufacturing steps can be simplified. Further, the electrochemical cell produced by the method for producing an electrochemical cell of the present invention can maintain sufficient electrolyte sealing performance for a long period of time.
<電解液密封劑組> <Electrolyte sealant group>
電解液密封劑組係電化學電池形成用,其包含第一硬化性樹脂組成物與第二硬化性樹脂組成物,該第一硬化性樹脂組成物含有具有來自選自由聚丁烯、聚丁二烯、聚異戊二烯、氫化聚丁烯、氫化聚丁二烯及氫化聚異戊二烯所成群組之至少1種樹脂的骨架之(甲基)丙烯酸酯化合物、該第二硬化性樹脂組成物即含有具有芳香環基之環氧化合物的陽離子硬化性環氧樹脂組成物。 The electrolyte sealant group is used for forming an electrochemical cell, comprising a first curable resin composition and a second curable resin composition, the first curable resin composition having a selected from the group consisting of polybutene and polybutadiene a (meth) acrylate compound of a skeleton of at least one resin in the group of a olefin, a polyisoprene, a hydrogenated polybutene, a hydrogenated polybutadiene, and a hydrogenated polyisoprene, the second sclerosing property The resin composition is a cationically curable epoxy resin composition containing an epoxy compound having an aromatic ring group.
藉由使用電解液密封劑組來密封電化學電池之電解液,可持續長期間維持充分的電解液密封性能。 Sealing the electrolyte of the electrochemical cell by using an electrolyte sealant group maintains sufficient electrolyte sealing performance for a long period of time.
電解液密封劑組中之第一硬化性樹脂組成物及第二硬化性樹脂組成物的詳細係如前述,較佳之態樣亦相同。電解液密封劑組亦可依需要進一步含有其他構成要素。其他構成要素可列舉例如記載有使用電解液密封劑組來密封電化學電池之電解液的方法、較佳為電化學電池之製造方法之操作說明書等。 The details of the first curable resin composition and the second curable resin composition in the electrolyte sealant group are as described above, and the preferred aspects are also the same. The electrolyte sealant group may further contain other constituent elements as needed. Other components include, for example, a method of sealing an electrolytic solution of an electrochemical cell using an electrolyte sealant group, an operation manual of a method for producing an electrochemical cell, and the like.
電解液密封劑組例如可適合使用於電化學電池之製造方法。亦即,本發明之一態樣,電解液密封材組在製造電化學電池中之使用。 The electrolyte sealant group can be suitably used, for example, in a method of manufacturing an electrochemical cell. That is, in one aspect of the invention, the use of an electrolyte sealant set in the manufacture of an electrochemical cell.
[實施例] [Examples]
以下藉由實施例來具體說明本發明,但本發明不受此等之實施例限定。 The invention is illustrated by the following examples, but the invention is not limited by the examples.
(配製例1) (Preparation Example 1)
第一硬化性樹脂組成物之配製 Preparation of the first curable resin composition
將氫化聚異戊二烯胺基甲酸酯丙烯酸酯(UA-1、LA cut品、Light Chemical公司製)100質量份、光起始劑(KIP150、Lamberti公司製)3質量份、偶合劑(含有丙烯酸基之矽烷偶合劑、KBM503、信越化學工業公司製)1質量份、與偶合劑(乙烯基矽烷偶合劑、KBM1003、信越化學工業公司製)1質量份予以混合,配製第一硬化性樹脂組成物。 100 parts by mass of hydrogenated polyisoprene urethane acrylate (UA-1, LA cut, manufactured by Light Chemical Co., Ltd.), 3 parts by mass of a photoinitiator (KIP150, manufactured by Lamberti Co., Ltd.), and a coupling agent ( 1 part by mass of an acryl-based decane coupling agent, KBM 503, manufactured by Shin-Etsu Chemical Co., Ltd., and 1 part by mass of a coupling agent (vinyl decane coupling agent, KBM1003, manufactured by Shin-Etsu Chemical Co., Ltd.) to prepare a first curable resin Composition.
第一硬化性樹脂組成物之溶解度參數為8.7。 The solubility parameter of the first curable resin composition was 8.7.
(配製例2) (Preparation Example 2)
第二硬化性樹脂組成物之配製 Preparation of second curable resin composition
將雙酚A型環氧樹脂(850S、DIC公司製)100質量份、滑石(P-2、日本滑石公司製)50質量份、光酸產生劑(SP-172、ADEKA公司製)1.5質量份、與偶合劑(環氧基矽 烷偶合劑、KBM403、信越化學工業公司製)1.5質量份予以混合,配製陽離子硬化性環氧樹脂組成物即第二硬化性樹脂組成物。 100 parts by mass of bisphenol A type epoxy resin (850S, manufactured by DIC Corporation), 50 parts by mass of talc (P-2, manufactured by Nippon Talc Co., Ltd.), and 1.5 parts by mass of photoacid generator (SP-172, manufactured by ADEKA Co., Ltd.) And coupling agent 1.5 parts by mass of an alkane coupling agent, KBM403, and Shin-Etsu Chemical Co., Ltd.) were mixed to prepare a second curable resin composition which is a cationically curable epoxy resin composition.
第二硬化性樹脂組成物之溶解度參數為10.9。 The solubility parameter of the second curable resin composition was 10.9.
(配製例3) (Preparation Example 3)
電解液之配製 Preparation of electrolyte
於碳酸伸丙酯(PC、溶解度參數13)中,以碘化鉀之濃度成為0.5mol/L、碘之濃度成為0.05mol/L、4-tert-丁基吡啶之濃度成為0.5mol/L的方式,溶解各成分,配製電解液。 In the case of propylene carbonate (PC, solubility parameter 13), the concentration of potassium iodide is 0.5 mol/L, the concentration of iodine is 0.05 mol/L, and the concentration of 4-tert-butylpyridine is 0.5 mol/L. The components were dissolved to prepare an electrolyte.
(實施例1) (Example 1)
準備塗覆有FTO(Fluorine-doped tin oxide)透明導電性膜之玻璃板(20mm×24mm、厚度1.0mm)2枚,作為基材。於所準備之玻璃板之FTO膜上,塗佈第一硬化性樹脂組成物3.5±0.5mg,使2枚基材貼合時,成為寬1mm之框狀。於框內注入電解液8~9mg後,疊合另一枚玻璃板,使FTO膜互呈對向,以減壓度100hPa之條件貼合,將電解液臨時密封。 Two glass plates (20 mm × 24 mm, thickness: 1.0 mm) coated with a FTO (Fluorine-doped tin oxide) transparent conductive film were prepared as a substrate. On the FTO film of the prepared glass plate, 3.5 ± 0.5 mg of the first curable resin composition was applied, and when two substrates were bonded together, a frame shape of 1 mm in width was obtained. After injecting 8 to 9 mg of the electrolyte into the frame, the other glass plate was laminated to make the FTO films face each other, and the pressure was 100 hPa to temporarily seal the electrolyte.
使用點型UV照射機(濱松Photonics公司製)作為光源,以成為6000mJ/cm2之光能量的方式進行光照射,使第一硬化性樹脂組成物硬化,藉以將電解液密封於2枚玻璃基材之間電解液,得到評估用電化學電池。 A spot type UV irradiator (manufactured by Hamamatsu Photonics Co., Ltd.) was used as a light source, and light irradiation was performed so as to become light energy of 6000 mJ/cm 2 to cure the first curable resin composition, thereby sealing the electrolyte solution to two glass bases. The electrolyte between the materials was obtained for evaluation of the electrochemical cell.
[評估] [assessment]
(外觀觀察) (appearance observation)
以金屬顯微鏡觀察所得評估用電化學電池之電解液與密封部的界面(密封時)後,密封時不相溶,為良好的密封狀態。 When the interface between the electrolytic solution of the electrochemical cell for evaluation and the sealing portion (at the time of sealing) was observed with a metal microscope, it was incompatible at the time of sealing, and was in a good sealed state.
(電解液維持率) (electrolyte retention rate)
將所得到之評估用電化學電池放置於85℃之恆溫槽中,測定72小時後及240小時後之質量,以置入恆溫槽之前為100%,算出電解液維持率(%)。又,電解液維持率係遵照下述評估基準評估。結果示於表1。 The obtained electrochemical cell for evaluation was placed in a thermostat at 85 ° C, and the mass after 72 hours and 240 hours was measured, and the electrolyte retention rate (%) was calculated to be 100% before being placed in the constant temperature bath. Further, the electrolyte retention rate was evaluated in accordance with the following evaluation criteria. The results are shown in Table 1.
評估基準 Evaluation basis
A:優良。 A: Excellent.
B:實用上之容許範圍內。 B: Within the practical limits.
C:實用上之容許範圍外。 C: It is practically outside the allowable range.
D:無法測定。 D: Unable to measure.
(實施例2) (Example 2)
準備塗覆有FTO(Fluorine-doped tin oxide)透明導電性膜之玻璃板(20mm×24mm、厚度1.0mm)2枚,作為基材。於所準備之玻璃板之FTO膜上,塗佈第一硬化性樹脂組成物1.7±0.2mg,使2枚基材貼合時,成為寬0.5mm之框狀。接著,以包圍第一硬化性樹脂組成物的方式,供給第 二硬化性樹脂組成物2.0±0.2mg,使2枚基材貼合時,成為寬0.5mm之框狀。於框內注入電解液8~9mg後,疊合另一枚玻璃板,使FTO膜互呈對向,以減壓度100hPa之條件貼合,將電解液臨時密封。 Two glass plates (20 mm × 24 mm, thickness: 1.0 mm) coated with a FTO (Fluorine-doped tin oxide) transparent conductive film were prepared as a substrate. The first curable resin composition was applied with 1.7±0.2 mg on the FTO film of the prepared glass plate, and when two substrates were bonded together, a frame shape of 0.5 mm in width was obtained. Next, the first part is supplied so as to surround the first curable resin composition. The second curable resin composition was 2.0 ± 0.2 mg, and when two substrates were bonded together, it was framed to have a width of 0.5 mm. After injecting 8 to 9 mg of the electrolyte into the frame, the other glass plate was laminated to make the FTO films face each other, and the pressure was 100 hPa to temporarily seal the electrolyte.
使用點型UV照射機(濱松Photonics公司製)作為光源,以成為6000mJ/cm2之光能量的方式進行光照射,使第一硬化性樹脂組成物硬化,藉以將電解液密封於2枚玻璃基材之間,得到評估用電化學電池。 A spot type UV irradiator (manufactured by Hamamatsu Photonics Co., Ltd.) was used as a light source, and light irradiation was performed so as to become light energy of 6000 mJ/cm 2 to cure the first curable resin composition, thereby sealing the electrolyte solution to two glass bases. Between the materials, an electrochemical cell was evaluated.
外觀觀察之結果,所得到之評估用電化學電池在密封時不相溶,為良好的密封狀態。又,電解液維持率(%)示於表1。 As a result of the appearance observation, the obtained electrochemical cell for evaluation was incompatible at the time of sealing, and was in a good sealed state. Further, the electrolyte retention rate (%) is shown in Table 1.
(實施例3) (Example 3)
除了於實施例2中,於硬化性樹脂組成物之光硬化後,進一步進行80℃、60分鐘之熱處理以外係同樣地得到評估用電化學電池,同樣地進行評估。 In the same manner as in Example 2, after the photocuring of the curable resin composition, the electrochemical cell for evaluation was obtained in the same manner as the heat treatment at 80 ° C for 60 minutes, and the evaluation was carried out in the same manner.
外觀觀察之結果,所得到之評估用電化學電池在密封時不相溶,為良好的密封狀態。又,電解液維持率(%)示於表1。 As a result of the appearance observation, the obtained electrochemical cell for evaluation was incompatible at the time of sealing, and was in a good sealed state. Further, the electrolyte retention rate (%) is shown in Table 1.
(比較例1) (Comparative Example 1)
除了於實施例1中,使用第二硬化性樹脂組成物以取代第一硬化性樹脂組成物以外,係同樣地得到評估用電化學電池,同樣地進行評估。 An electrochemical cell for evaluation was obtained in the same manner as in Example 1 except that the second curable resin composition was used instead of the first curable resin composition, and the evaluation was performed in the same manner.
外觀觀察之結果,所得到之評估用電化學電池在密封時有相溶,密封狀態不良。又,因密封狀態不良,故無法測定電解液維持率。 As a result of the appearance observation, the obtained electrochemical cell for evaluation was compatible at the time of sealing, and the sealing state was poor. Further, since the sealing state was poor, the electrolyte retention rate could not be measured.
(比較例2) (Comparative Example 2)
除了於比較例1中,於第二硬化性樹脂組成物之光硬化後,進一步進行80℃、1小時之熱處理以外,係同樣地得到評估用電化學電池,同樣地進行評估。 In addition, in Comparative Example 1, after the photocuring of the second curable resin composition, the electrochemical cell for evaluation was further obtained in the same manner as the heat treatment at 80 ° C for 1 hour, and the evaluation was performed in the same manner.
外觀觀察之結果,所得到之評估用電化學電池在密封時有相溶,密封狀態不良。又,因密封狀態不良,故無法測定電解液維持率。 As a result of the appearance observation, the obtained electrochemical cell for evaluation was compatible at the time of sealing, and the sealing state was poor. Further, since the sealing state was poor, the electrolyte retention rate could not be measured.
由表1可知,本發明之電化學電池顯示密封狀態良好的外觀,且顯示優良的電解液維持率。 As is apparent from Table 1, the electrochemical cell of the present invention exhibits a good appearance in a sealed state and exhibits an excellent electrolyte retention rate.
日本國專利申請案第2014-041505號(申請日:2014年3月4日)的揭示內容整體,係作為參照而援用入本說明書。 The disclosure of Japanese Patent Application No. 2014-041505 (filed on March 4, 2014) is incorporated herein by reference.
本說明書記載之全部文獻、專利申請案、及技術規 格,係與具體且各別記載參照各自之文獻、專利申請案、及技術規格並援用的情況為相同程度地,參照並援用入本說明書。 All documents, patent applications, and technical specifications described in this manual The descriptions refer to and apply to the specification, with reference to the respective documents, patent applications, and technical specifications.
1‧‧‧基材 1‧‧‧Substrate
1’‧‧‧基材 1'‧‧‧Substrate
2‧‧‧第一硬化性樹脂組成物層 2‧‧‧First hardened resin composition layer
3‧‧‧電解液層 3‧‧‧ electrolyte layer
4‧‧‧第二硬化性樹脂組成物層 4‧‧‧Second hardening resin composition layer
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