TW201605942A - Method and apparatus for manufacturing a resin substrate - Google Patents

Abstract

The present invention discloses a method for producing a resin substrate, characterized by comprising the following steps: a preprocessing step, which is performed to apply a silane-coupling agent onto at least one surface of a support member made of glass; a coating step, which is performed to apply a solution containing polyamide acid or polyimide powder to the treated surface of the support member treated by the preprocessing step; a sintering step: which is performed after the coating step to heat the support member so that a resin substrate composed of polyimide can be formed on the support member; and a peeling step, which is performed to peel the resin substrate off the support member.

Description

Method and device for manufacturing resin substrate

The present invention relates to a method and an apparatus for producing a resin substrate.

The present patent application claims priority based on Japanese Patent Application No. 2014-134398, filed on Jun.

In recent years, there has been a demand for a substrate for an electronic device to replace a glass substrate with a flexible resin substrate. In order to manufacture such a resin substrate, after the resin substrate is formed on the support substrate (support), the support substrate must be peeled off from the resin substrate (see, for example, Patent Document 1).

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese National Patent Publication No. 2012-511173

However, in the prior art, when the self-supporting substrate is peeled off, a laser is used, and thus there is a problem that damage occurs to the resin substrate. Therefore, it is desirable to provide a new technique which is excellent in peelability and which can suppress the occurrence of damage at the time of peeling.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for producing a resin substrate which is excellent in peelability and which can suppress occurrence of damage during peeling, and an apparatus including the resin substrate obtained by the production method.

In order to achieve the above object, a method for producing a resin substrate according to a first aspect of the present invention is characterized by the step of pretreating a decane coupling agent to at least one side of a support made of glass. a coating step of applying a solution containing a polyaminic acid or a polyimide pigment to the support in which the treatment is carried out by the treatment of the aforementioned pretreatment step; and a calcination step: the coating After the step, a resin substrate made of polyimide is formed by heating the support to the support; and a peeling step of peeling the resin substrate from the support.

According to the configuration of the present aspect, since the hydroxyl group on the surface of the support is deuterated by the pretreatment, the polyvalent imine constituting the resin substrate and the covalent bond formed on the surface of the support can be suppressed. Further, since the fluorenyl group derived from the decane coupling agent is formed, the releasability of the resin substrate composed of the polyimide can be improved.

Therefore, it is possible to manufacture a resin substrate having high reliability that is suppressed when the peeling occurs.

Further, in the method for producing a resin substrate, in the peeling step, it is preferable that a slit is formed as a base point at a portion of the interface between the support and the resin substrate.

According to this configuration, the resin substrate can be easily peeled off from the support by functioning as a starting point with the slit.

Further, in the method for producing a resin substrate, in the pretreatment step, it is preferred to selectively treat the decane coupling agent to a predetermined portion of at least one surface of the support.

According to this configuration, a part of the support is treated with a non-decane coupling agent, and a region having high adhesion to the resin substrate is generated. Therefore, since the support body can support the resin substrate satisfactorily, the resin substrate can be favorably held even when it is conveyed in the middle of the step of manufacturing the laminate of the support body and the resin substrate.

Further, in the method for producing a resin substrate, in the pretreatment step, it is preferred that the decane coupling agent is selectively applied to the specified portion by an inkjet method.

The decane coupling material can be selectively and reliably coated by an inkjet method.

Further, in the method for producing a resin substrate, in the pretreatment step, it is preferred to selectively treat the decane coupling agent to the specified portion by a vapor deposition method.

Selectively and reliably selectively treat decane coupling by evaporation material.

A device according to a second aspect of the present invention is characterized by comprising a resin substrate manufactured by the manufacturing method of the first aspect.

According to the device of the present aspect, since the damage at the time of peeling is a resin substrate having high reliability that is suppressed, the device itself is also highly reliable.

According to the present invention, the peeling property is excellent and the occurrence of damage at the time of peeling can be suppressed.

1‧‧‧Support substrate (support)

2‧‧‧Processing film

3‧‧‧Resin substrate

11‧‧‧Resin substrate

3a‧‧‧ incision

1a‧‧‧ surface

3A‧‧‧solution

10‧‧‧Layer

15‧‧‧ cutting blade

16‧‧‧Inkjet nozzle

20‧‧‧Layer

Fig. 1 is a view showing a step of manufacturing a resin substrate.

Fig. 2 is a view showing the chemical reaction generated in the pretreatment step.

[Fig. 3] shows the experimental results of the effect of improving the peeling property of the treated film.

(Fig. 4) (a) and (b) are views showing the positions at which the slits are formed.

[Fig. 5] (a) and (b) are views showing a case where a treatment film is formed to a part of a surface.

[Fig. 6] (a) to (d) are views showing a manufacturing step of the resin substrate continued from Fig. 5;

[Best Practice for Carrying Out the Invention]

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a case where a resin substrate used as a substrate for an electronic device is manufactured will be described as an example. In the drawings used in the following description, in order to facilitate the understanding of the features, the feature portions are enlarged for convenience. However, the size ratios and the like of the respective constituent elements are not limited to the actual ones.

The method for producing a resin substrate according to the present embodiment includes the steps of: pretreating a decane coupling agent onto a support substrate; and applying a step of applying a resin substrate forming material to the support substrate The firing step: heating the support substrate to form the resin substrate onto the support substrate; and the peeling step: peeling the resin substrate from the support substrate.

Fig. 1 is a flow chart showing the manufacture of a resin substrate according to the embodiment.

First, as shown in Fig. 1(a), the treatment is carried out before the treatment of the surface of the support substrate 1 (at least one surface) 1a by the treatment of the decane coupling agent (pretreatment step). In the present embodiment, the support substrate 1 is made of glass.

In the pretreatment, the treatment liquid is applied by coating (including spraying) to the surface 1a of the support substrate (support) 1. The processing time of the pre-processing is preferably set to 1 to 60 seconds. Alternatively, instead of the coating treatment liquid, the treatment of the decane coupling material on the support substrate 1 may be carried out by a vapor deposition method. By the treatment time of the evaporation method, for example, baking at 80 ° C to 120 ° C It is better to carry out 1 to 15 minutes in the box.

In the present embodiment, the treatment liquid used in the pretreatment is a solvent containing a decylating agent and a solvent. Hereinafter, each component will be described in detail.

(alkylating agent)

The decylating agent is not particularly limited, and all conventional sulfonating agents can be used. Specifically, for example, a decylating agent represented by the following formulas (1) to (3) can be used. In the present specification, the alkyl group has a carbon number of 1 to 5, the cycloalkyl group has a carbon number of 5 to 10, the alkoxy group has a carbon number of 1 to 5, and the heterocycloalkyl group has a carbon number of 5 to 10.

(In the formula (1), R ¹ represents a hydrogen atom or a saturated or unsaturated alkyl group, and R ² represents a saturated or unsaturated alkyl group, a saturated or unsaturated cycloalkyl group, or a saturated or unsaturated heterocycloalkyl group. R ¹ and R ² may be bonded to each other to form a saturated or unsaturated heterocycloalkyl group having a nitrogen atom).

(In the formula (2), R ³ represents a hydrogen atom, a methyl group, a trimethylsulfanyl group or a dimethylalkyl group, and R ⁴ and R ⁵ each independently represent a hydrogen atom, an alkyl group or a vinyl group).

(In the formula (3), X represents O, CHR ⁷ , CHOR ⁷ , CR ⁷ R ⁷ or NR ⁸ , and R ⁶ and R ⁷ each independently represent a hydrogen atom, a saturated or unsaturated alkyl group, a saturated or unsaturated ring. An alkyl group, a trialkyl decyl group, a trialkyl decyloxy group, an alkoxy group, a phenyl group, a phenethyl group or an ethyl fluorenyl group, and R 8 is a hydrogen atom, an alkyl group or a trialkyl decyl group.

The decylating agent represented by the above formula (1) is, for example, N,N-dimethylaminotrimethyldecane, N,N-diethylaminotrimethylnonane, t-butylamino group III. Methyl decane, allylamino trimethyl decane, trimethyl decyl decylamine, trimethyl decyl piperidine, trimethyl decyl imidazole, trimethyl decyl morpholine, 3-trimethyl Base alkyl-2-oxazolinone, trimethyldecyl pyrazole, trimethyldecyl pyrrolidine, 2-trimethyldecyl-1,2,3-triazole, 1-trimethyldecane Base-1,2,4-triazole and the like.

In addition, examples of the decylating agent represented by the above formula (2) include hexamethyldiazepine, N-methylhexamethyldioxane, and 1,2-di-N-octyltetramethyl. Dioxane, 1,2-divinyltetramethyldiazepine, eight Methyl diazirane, nonamethyltriazane, ginseng (dimethyl decyl)amine, and the like.

Further, examples of the decylating agent represented by the above formula (3) include trimethyl decyl acetate, trimethyl decyl propionate, trimethyl decyl butyrate, and trimethyl decyloxy group. Alkyl-3-penten-2-one and the like.

The content of the alkylating agent is preferably from 0.1 to 50% by mass, more preferably from 0.5 to 30% by mass, even more preferably from 1.0 to 20% by mass, based on the surface treatment liquid. By setting it as the said range, in addition to ensuring the coating property of a surface treatment liquid, the hydrophobicity of the surface of a pattern can fully be improved.

(solvent)

The solvent is not particularly limited as long as it is a resin which can dissolve the sulfonating agent and has a small amount of damage to the resin pattern to be surface-treated or the pattern to be etched, and a conventionally used solvent can be used.

Specifically, for example, an anthracene such as dimethyl hydrazine; an anthracene such as dimethyl hydrazine, diethyl hydrazine, bis(2-hydroxyethyl) fluorene or tetramethylene hydrazine; N, N; - decylamines such as dimethylformamide, N-methylformamide, N,N-dimethylacetamide, N-methylacetamide, N,N-diethylacetamide N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-propyl-2-pyrrolidone, N-hydroxymethyl-2-pyrrolidone, N-hydroxyethyl Indoleamines such as pyridine-2-pyrrolidone; 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, 1,3-diisopropyl An imidazolinone such as 2-imidazolidinone; a dialkyl ether such as dimethyl ether, diethyl ether, methyl ethyl ether, dipropyl ether, diisopropyl ether or dibutyl ether Class; dimethyl glycol (dimethyl Dialkyl glycol ethers such as glycol), dimethyl diethylene glycol, dimethyl triethylene glycol, methyl ethyl diethylene glycol, diethyl glycol; methyl ethyl ketone a ketone such as cyclohexanone, 2-heptanone or 3-heptanone; a terpene such as p-menthane, diphenylmethane, limonene, terpinene, decane, norbornane or decane. Classes, etc.

By the above pretreatment, as shown in Fig. 1(b), the treatment film 2 derived from the decane coupling material (the decylating agent) on the surface 1a of the support substrate 1 is formed on the entire surface 1a.

Here, the chemical reaction generated between the treatment film 2 and the surface 1a of the support substrate 1 in the pretreatment step will be described. Fig. 2 is a view showing a chemical reaction generated between the treatment film 2 and the surface 1a of the support substrate 1 in the pretreatment step. The following description is given by exemplifying the decylating agent (HMDS (hexamethyldioxane)) represented by the above formula (2).

The support substrate 1 made of glass has an OH group (hydroxy group) present on the surface 1a. Therefore, when pretreatment is carried out by a decane coupling material, HMDS is decomposed and bonded to two hydroxyl groups to generate ammonia (NH ₃ ). Thereby, the OH group (hydroxyl group) in the surface 1a of the support substrate 1 is decanolated, and as shown in Fig. 2, the oxime-containing treatment film 2 derived from the decylating agent is formed on the surface 1a. Therefore, the support substrate 1 is formed on the surface 1a by the treatment film 2 (alkylene group), and the OHK group (hydroxyl group) is not present.

Next, as shown in FIG. 1(c), a solution 3A containing polylysine as a material for forming a resin substrate is applied to the pretreatment. The treatment of the step is performed on the treated surface (that is, the treatment film 2). Hereinafter, the polyamic acid used in the present embodiment will be described.

(polyglycine)

In the present embodiment, the polyamic acid used in the formation of the resin substrate composed of the polyimide is not particularly limited, and it can be used from a polyamic acid which is conventionally known as a precursor of a polyimide resin. Appropriate choice.

For example, polylysine which is composed of a constituent unit represented by the following formula (4) is exemplified.

(In the formula (4), R ⁹ is a tetravalent organic group, R ¹⁰ is a divalent organic group, and n is a repeating number of constituent units represented by the formula (1)).

In the formula (4), R ⁹ is a tetravalent organic group, and R ¹⁰ is a divalent organic group, and the carbon number is preferably 2 to 50, and more preferably 2 to 30. R ¹ and R ² each may be an aliphatic group, an aromatic group, or a combination of the structures. R ⁹ and R ¹⁰ may contain a halogen atom, an oxygen atom, and a sulfur atom in addition to a carbon atom and a hydrogen atom. When R ⁹ and R ¹⁰ are an oxygen atom, a nitrogen atom or a sulfur atom, the oxygen atom, the nitrogen atom or the sulfur atom may be selected from a nitrogen-containing heterocyclic group, -CONH-, -NH-, -N=N. -, -CH=N-, -COO-, -O-, -CO-, -SO-, -SO ₂ -, -S-, and -SS- are contained in R ⁹ and R ¹⁰ It is preferably contained in R ⁹ and R ¹⁰ as a group selected from the group consisting of -O-, -CO-, -SO-, -SO ₂ -, -S-, and -SS-.

By heating the polyamic acid consisting of the structural unit represented by the above formula (4), a polyimine resin composed of the constituent units represented by the following formula (5) can be obtained.

(In the formula (5), R ¹ and R ^{2 have the} same meanings as in the formula (4), and n is the number of repetitions of the constituent units represented by the formula (5)).

Hereinafter, a method for producing a tetracarboxylic dianhydride component, a diamine component, and N,N,N',N'-tetramethylurea, and polyglycine used in the preparation of polylysine will be described. .

(tetracarboxylic dianhydride component)

The tetracarboxylic dianhydride component which is a synthetic raw material of polyamic acid is not particularly limited as long as it can form polyamic acid by reacting with a diamine component. The tetracarboxylic dianhydride component can be appropriately selected from the conventional tetracarboxylic dianhydride used as a synthetic raw material of polyamic acid. The tetracarboxylic dianhydride component may be an aromatic tetracarboxylic dianhydride or an aliphatic tetracarboxylic dianhydride, but the obtained The aromatic tetracarboxylic dianhydride is preferred from the viewpoint of heat resistance of the obtained polyimide resin. The tetracarboxylic dianhydride component may be used in combination of two or more kinds.

Specific examples of suitable aromatic tetracarboxylic dianhydrides include pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, and 2,3,3',4'. -biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 4,4'-oxydiphthalic anhydride, and 3,3',4 , 4'-diphenylfluorene tetracarboxylic dianhydride, and the like. Among these, 3,3', 4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride are preferable in terms of price, availability, and the like.

(diamine component)

The diamine component which is a synthetic raw material of polyamic acid is not particularly limited as long as it can form a polyamic acid by reacting with a tetracarboxylic dianhydride component. The diamine component can be appropriately selected from the conventional diamines used as a synthetic raw material of polyamic acid. The diamine component may be an aromatic diamine or an aliphatic diamine, but in terms of heat resistance of the obtained polyimine resin, an aromatic diamine is preferred. The diamine component may be used in combination of two or more kinds.

Specific examples of suitable aromatic diamines include, for example, p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, 4,4'-diaminobiphenyl, 4,4'- Diamino-2,2'-bis(trifluoromethyl)biphenyl, 3,3'-diaminodiphenyl hydrazine, 4,4'-diaminodiphenyl hydrazine, 4,4'-diamine Diphenyl sulfide, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diamine Diphenyl ether, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy) ) Benzene, 4, 4'- Bis(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]anthracene, bis[4-(3-aminophenoxy)phenyl]anthracene, 2 2-bis[4-(4-aminophenoxy)phenyl]propane, and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane. Among these, p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, and 4,4'-diaminodiphenyl ether are preferable in terms of price, availability, and the like.

(N,N,N',N'-tetramethylurea)

The tetracarboxylic dianhydride component and the diamine component were synthesized using N, N, N', N'-tetramethyl urea as a solvent. N, N, N', N'-tetramethyl urea is used as a solvent to synthesize polylysine, and heating the polyamic acid to form a polyimide resin is easy to obtain tensile elongation and heat resistance. It is an excellent polyimine resin.

(synthesis of polyaminic acid)

The tetracarboxylic dianhydride component and the diamine component described above are reacted using N,N,N',N'-tetramethylurea as a solvent to synthesize polyglycine. When the polyamic acid is synthesized, the amount of the tetracarboxylic dianhydride component and the diamine component used is not particularly limited. However, it is preferably 0.50 to 1.50 moles of the diamine component based on 1 mole of the tetracarboxylic dianhydride component. It is preferably used with 0.60~1.30 m, especially preferably 0.70~1.20 m.

The amount of use of N, N, N', N'-tetramethylurea is not particularly limited as long as it does not inhibit the object of the present invention. Typically, the amount of N, N, N', N'-tetramethylurea used is relative to the tetracarboxylic dianhydride component. The total amount of the diamine component is 100 parts by mass, preferably 100 to 4000 parts by mass, and more preferably 150 to 2000 parts by mass.

Further, in the case of synthesizing polyamic acid, it is preferable to use only N, N, N', N'-tetramethylurea as a solvent. However, a solvent other than N,N,N',N'-tetramethylurea may be used together with N,N,N',N'-tetramethylurea to the extent that the object of the present invention is not hindered. A solvent other than N, N, N', N'-tetramethylurea can be appropriately selected from the solvents conventionally used for the synthesis of polylysine. Suitable examples of the solvent other than N,N,N',N'-tetramethylurea include, for example, N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N. - dimethylacetamide, hexamethylphosphoniumamine, and 1,3-dimethyl-2-imidazolidinone. When a solvent other than N, N, N', N'-tetramethylurea is used together with N, N, N', N'-tetramethylurea, the amount of other solvent used is relative to that used for polyamine The total mass of the solvent for acid synthesis is preferably 20% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less.

The temperature at which the tetracarboxylic dianhydride component and the diamine component are reacted is not particularly limited as long as the reaction proceeds well. Typically, the reaction temperature of the tetracarboxylic dianhydride component and the diamine component is preferably -5 to 150 ° C, more preferably 0 to 120 ° C, and particularly preferably 0 to 70 ° C. Further, although the reaction time of the tetracarboxylic dianhydride component and the diamine component varies depending on the reaction temperature, it is preferably from 1 to 50 hours, preferably from 2 to 40 hours, particularly preferably from 5 to 5 hours. ~30 hours.

A polyaminic acid solution can be obtained by the method described above. Alternatively, a pre-treatment may be carried out using a solution containing a polyimide pigment powder.

Next, as shown in FIG. 1(d), the support substrate 1 coated with the solution 3A is heated and fired, whereby the resin substrate 3 made of polyimide is formed on the support substrate 1 to form a laminate. 10 (burning step).

In the firing step, for example, the support substrate 1 is heated to 120 ° C to 350 ° C, preferably to 150 ° C to 350 ° C. By heating in such a temperature range, thermal deterioration or thermal decomposition of the produced polyimine (resin substrate 3) can be suppressed, and a high-quality product can be manufactured. Further, when the polyglycine is heated at a high temperature, it is preferable to carry out the polyamine at a lower temperature because it consumes a large amount of energy or has a situation in which the treatment equipment is deteriorated over time at a high temperature. Heating. Specifically, the upper limit of the temperature at which the polyamic acid is heated is preferably 250 ° C or lower, more preferably 220 ° C or lower, and particularly preferably 200 ° C or lower.

In the present embodiment, the treatment film 2 is present between the surface 1a of the support substrate 1 and the resin substrate 3. The surface 1a forms a fluorenyl group by treating the film 2, and since the OH group (hydroxy group) is not present, a covalent bond is not formed with the polyimine constituting the resin substrate 3. Further, by forming a decyl group, the adhesion between the polyimide and the treatment film 2 is lowered, and the releasability of the resin substrate 3 is improved.

Fig. 3 is an experimental result showing the effect of improving the peeling property of the treatment film 2. In FIG. 3, the horizontal axis represents the elapsed time (the number of days elapsed) after the resin substrate is formed on the support substrate, and the vertical axis represents the adhesion strength (unit: g) of the polyimide (resin substrate) and the support substrate. In addition, in Fig. 3, for comparison, support which is not treated by a decane coupling agent will be used. The case of the substrate is shown as "untreated"; the case where the support substrate treated by the decane coupling agent is used is indicated as "processed 1" and "processed 2". However, "Processed 1" and "Processed 2" are different from the decane coupling agents used in the treatment.

As shown in Fig. 3, whether it is treated by a decane coupling agent (treated 1, 2) or not (untreated), after the resin substrate is formed on the support substrate, it passes over time. The adhesion strength is reduced. When the number of days passed exceeds 3 days, the adhesion strength does not become too large between the case of treatment with a decane coupling agent or the case where it is not carried out. The reason for this is that the adhesion strength of the polyimide substrate constituting the resin substrate is lowered as time passes, so that the adhesion strength at the interface of the support substrate is lowered.

Usually, peeling of the self-supporting substrate is performed immediately after the formation of the resin substrate. Therefore, in the case where the elapsed time is short, it is important to reduce the adhesion strength.

It can be confirmed from Fig. 3 that in the case of treatment with a decane coupling agent (treated 1, 2), the elapsed time is short, that is, even if the moisture adsorption of the polyimine is not produced, the adhesion can be low. Peel off from the resin substrate.

Next, an electronic device (not shown) for the purpose is laminated on the upper surface of the resin substrate 3. For example, a TFT element is formed on the resin substrate 3, and a display element is laminated or bonded, whereby a display device such as a liquid crystal display, an organic EL display, or an electronic paper can be formed.

After forming an electronic device not shown, as shown in Figure 1(e) Generally, the resin substrate 3 is peeled off from the support substrate 1 (peeling step).

In the present embodiment, in the peeling step, a portion of the interface between the support substrate 1 and the resin substrate 3 is formed as a slit at the base point during peeling. 4(a) and 4(b) are views showing a position at which a slit is formed.

The formation position of the slit 3a is preferably set to the four corners of the support substrate 1 in a plan view, for example, as shown in Fig. 4(a). Further, the position at which the slit 3a is formed may be, for example, as shown in FIG. 4(b), in the plan view, the circumferential length of the outer peripheral portion of the support substrate 1. Further, for the formation of the slit 3a, for example, a rotating disc-shaped cutting blade 15 can be used.

According to the present embodiment, since the treatment film 2 is formed on the surface 1a of the support substrate 1, the adhesion between the polyimide and the treatment film 2 is lowered as described above. Therefore, by using the slit 3a as a starting point, the resin substrate 3 on which the electronic device is formed can be easily peeled off from the support substrate 1. Therefore, the resin substrate 3 is not damaged at the time of peeling, and the substrate 1 can be easily peeled off.

The above is an embodiment of the present invention, and the present invention is not limited to the above, and can be appropriately modified without departing from the scope of the invention. For example, the above embodiment is an example in which the treatment film 2 is formed on the entire surface of the surface 1a of the support substrate 1, but the present invention is not limited thereto.

For example, it is also possible to selectively form a predetermined portion (for example, a central portion other than the outer peripheral portion) of the surface 1a of the support substrate 1. When the treatment film 2 is selectively formed on the surface 1a, an inkjet method or an evaporation method can be used. For example, as shown in Fig. 5(a), the drip material can be used (矽 The alkane coupling agent is selectively dropped from the inkjet nozzle 16 to the surface 1a of the support substrate 1. However, when using the vapor deposition method, it is only necessary to mask the unnecessary portion (outer peripheral portion).

After the treatment film 2 is selectively formed on the surface 1a, as shown in FIG. 6(a), the polyphthalic acid solution is applied onto the surface 1a of the support substrate 1 and fired to form a poly-polymer. A resin layer 13 composed of sulfimine. Therefore, the laminate 20 composed of the support substrate 1 and the resin layer 13 is formed.

Next, an electronic device (not shown) for the application is laminated on the upper surface of the resin layer 13 (including the surface which becomes a region of the resin substrate 11 to be described later). For example, a TFT element is formed on the resin substrate 13, and a display element is laminated or bonded, whereby a display device such as a liquid crystal display, an organic EL display, or an electronic paper can be formed.

However, when the adhesiveness is lowered by the treatment of the film 2 in the entire resin layer 13, when the laminate 20 is moved in the middle, the self-supporting substrate 1 is peeled off due to vibration or punching.

On the other hand, as shown in FIG. 6(a), the resin layer 13 is adhered to the surface 1a of the support substrate 1 only in the outer peripheral edge portion. Therefore, the outer peripheral edge portion of the resin layer 13 can be favorably held by the support substrate 1, and the inner side of the outer peripheral edge portion is lowered in adhesion to the support substrate 1 by the treatment film 2.

Therefore, for example, even if the laminate 20 is moved in the middle, peeling of the self-supporting substrate 1 due to vibration, punching, or the like can be prevented.

Next, as shown in Fig. 6(b), by cutting the blade 15 along The formation region of the treatment film 2 is cut to cut the resin layer 13. Thereafter, as shown in FIGS. 6(c) and 6(d), the resin substrate 11 is taken out from the resin layer 13 along the opening 13a cut by the cutting blade 15. Since the resin substrate 11 is formed on the process film 2, the adhesion to the support substrate 1 is lowered.

Therefore, the resin substrate 11 can be easily peeled off from the treatment film 2 by, for example, lifting the corner portion, and the resin layer 13 remaining on the support substrate 1 is taken out through the opening 13a. According to the above, the resin substrate 11 can be manufactured.

Further, in the above embodiment, the case where the processing film 2 is formed by treating only the surface (surface 1a) of one side of the support substrate 1 with the decane coupling agent is mentioned, but the treatment film 2 may be formed to the other of the support substrate 1. The surface of one side (the back surface opposite to the surface 1a) forms a resin substrate. That is, the resin substrates 3, 11 can be formed to both sides of the support substrate 1.

1‧‧‧Support substrate (support)

1a‧‧‧ surface

2‧‧‧Processing film

3‧‧‧Resin substrate

3A‧‧‧solution

10‧‧‧Layer

Claims (6)

A method for producing a resin substrate, comprising the steps of: treating a decane coupling agent to at least one surface of a support made of glass; and applying a step of: comprising polylysine or poly a solution of the quinone imine powder applied to the support body by the treatment of the foregoing pretreatment step; a firing step: after the coating step, by heating the support body A resin substrate composed of sulfimine is formed on the support; and a peeling step is performed to peel the resin substrate from the support. The method of producing a resin substrate according to claim 1, wherein in the peeling step, a portion of the interface between the support and the resin substrate is formed as a slit at the time of peeling off. The method for producing a resin substrate according to claim 1 or 2, wherein in the pretreatment step, the decane coupling agent is selectively treated to a designated portion of at least one of the surfaces of the support. The method for producing a resin substrate according to claim 3, wherein in the pretreatment step, the decane coupling agent is selectively applied to the specified portion by an inkjet method. The method for producing a resin substrate according to claim 3, wherein in the pretreatment step, the decane coupling agent is selectively treated to the specified portion by a vapor deposition method. A device characterized by comprising a resin base of claim 1 A resin substrate manufactured by a method of manufacturing a board.