TW201605701A - Substrate packaging structure and substrate packaging group - Google Patents

Abstract

A substrate packaging structure including a carrying tray, a wedging portion, a substrate and a protecting film is provided. The carrying tray has a carrying surface and a base. An outer side of the carrying surface is connected to an inner side of the base, and the inner side of the base has a plurality of propping surfaces. The wedging portion is located on the carrying surface and being adjacent to one of the propping surface. The substrate is located on the carrying surface, and sides of the substrate prop the propping surfaces. A protecting film sticks on the substrate, and the protecting film covers the substrate and has a positioning portion extending toward the outside of the substrate, and the wedging portion wedges the positioning portion. A substrate packaging group is also provided.

Description

Substrate packaging structure and substrate packaging structure group

The present invention relates to a substrate packaging structure and a substrate packaging structure group, and more particularly to a substrate packaging structure and a substrate packaging structure group capable of preventing damage of a substrate due to collision.

With the development of technology, display panels have been widely used in various electronic products such as tablets, smart phones or flat-panel TVs. Specifically, the display panel is mainly composed of non-collision-resistant components such as glass and a flexible printed circuit (PCB), so the display panel manufacturer needs to package and fix the display panel when transporting or storing the display panel. Collision is prevented in the substrate carrier tray, thereby avoiding damage of the display panel due to collision or vibration.

1 is a top plan view of a prior art panel and substrate carrier tray. Specifically, referring to FIG. 1, the substrate package structure 50 can be used to fix the panel 60 by the inner edge 52 of the base, but at the same time, the flexible printed circuit board 62 on one side of the panel 60 also contacts the inside of the base. Edge 52. During the shipping process, the flexible printed circuit board 62 will be The panel 60 is forced to move within the inner edge 52 of the seat, thereby damaging the flexible printed circuit board 62.

Embodiments of the present invention provide a substrate packaging structure that can avoid collision of the substrate with the substrate packaging structure when the substrate is carried.

An embodiment of the present invention provides a substrate packaging structure group, which can fix at least two substrates on at least two substrate packaging structures, in addition to avoiding collision of the substrate with the substrate packaging structure, and avoiding the substrate from being separated from the substrate. Packaging structure.

Embodiments of the present invention provide a substrate packaging structure including a carrier tray, a latching portion, a substrate, and a protective film. The carrier tray has a bearing surface and a seat body. The outer edge of the bearing surface is connected to the inner edge of the seat body, and the inner edge of the seat body has a plurality of abutting surfaces. The substrate is disposed on the bearing surface. The side edges of the substrate abut against these abutting faces. The protective film is attached to the substrate and has a positioning portion extending outside the substrate. The engaging portion is engaged with the positioning portion.

In an embodiment of the invention, the bearing surface further has at least one groove, and the substrate covers the groove.

In an embodiment of the invention, the positioning portion has at least one opening, and the engaging portion is a protrusion and passes through the opening.

In an embodiment of the invention, the top end of the stud has an enlarged portion, and the edge of the opening has at least one slit.

In an embodiment of the invention, the substrate is further connected to a circuit board, the circuit board and the positioning portion are located on opposite sides of the substrate, and the circuit board has a distance from the inner edge of the same side seat.

In an embodiment of the invention, the substrate is further connected to a circuit board, the circuit board and the positioning portion are located on the same side of the substrate, and the positioning portion extends beyond the circuit board.

In an embodiment of the present invention, the positioning portion has an opening, and the engaging portion is detachable from the bearing surface. The engaging portion includes a fixing portion and a insertion post, and the insertion post is inserted into the opening, and the fixing portion is at one end. The post is connected, and the other end of the fixing portion is inserted into the seat.

In an embodiment of the invention, the fixing portion is spanned across the positioning portion.

In an embodiment of the invention, a buffer portion is disposed on the insertion post, and when the insertion post is inserted into the opening, the buffer portion is located on the opening to press the protective film or the insertion post is inserted into the opening.

In an embodiment of the invention, the engaging portion carries the positioning portion, the engaging portion matches the contour of the positioning portion, and the contour of the engaging portion and the positioning portion is retracted toward the substrate direction.

In an embodiment of the invention, the protective film completely covers the substrate.

Embodiments of the present invention provide a substrate packaging structure group including at least two substrate packaging structures. The substrate packaging structures are stacked on each other, and each substrate packaging structure comprises a structure of the substrate packaging structure, wherein each substrate packaging structure includes a bottom surface opposite to the bearing surface, the bottom surface has a bottom pillar extending vertically downward, and the bottom pillar It is set within the projection range of the engaging portion.

In an embodiment of the invention, the bottom pillar position of the substrate packaging structure On the positioning portion of another substrate packaging structure.

In an embodiment of the invention, the height of the bottom pillar is not greater than the height difference between the top of the seat and the bearing surface.

Based on the above, in the substrate packaging structure and the substrate packaging structure group provided by the embodiments of the present invention, the collision between the substrate and the inner edge of the seat can be reduced by the engagement between the engaging portion and the positioning portion of the protective film. . In the substrate packaging structure group provided by the embodiment of the present invention, the plurality of substrate packaging structures can prevent the substrate from being detached from the substrate packaging structure when stacked by the bottom column extending vertically downward.

The above described features and advantages of the invention will be apparent from the following description.

A‧‧‧ area

I1I1', I2I2', I3I3'‧‧‧ hatching

50, 100A, 100B, 100C, 100D‧‧‧ substrate packaging structure

52‧‧‧bearing depression

110‧‧‧Loading tray

60, 130‧‧‧ substrate

62‧‧‧Flexible printed circuit boards

112‧‧‧ bearing surface

114‧‧‧ Groove

120‧‧‧ body

121‧‧‧ inner edge

122‧‧‧The top surface

132‧‧‧Protective film

134A, 134B, 134C, 134D‧‧‧ Positioning Department

136A‧‧‧ opening

137A‧‧‧ slit

138A, 138C, 138D‧‧‧ boards

140A, 140B, 140C‧‧‧ Engagement Department

142‧‧‧Expanded

142C‧‧‧ buffer

144C‧‧‧Fixed Department

146C‧‧‧Plunting column

150‧‧‧ bottom

152‧‧‧ bottom column

1 is a top plan view of a prior art substrate and substrate package structure.

2A is a partial perspective view of a plurality of substrate package structures of the first embodiment of the present invention.

2B is a plan view of a plurality of substrate package structures of the first embodiment of the present invention.

Figure 2C is a partial plan view of area A in Figure 2B.

2D is a plan view of the substrate of the first embodiment of the present invention.

Fig. 2E is a cross-sectional view showing a substrate package structure group in the first embodiment of the present invention.

Fig. 2F is a partial cross-sectional view showing the substrate package structure group in the first embodiment of the present invention.

2G is a top plan view of a substrate in another embodiment of the present invention.

2H is a top plan view of a substrate in another embodiment of the present invention.

Figure 2I is a partial cross-sectional view showing the substrate package structure in the first embodiment of the present invention.

Fig. 3A is a plan view of a substrate of a second embodiment of the present invention.

Fig. 3B is a plan view showing a substrate package structure of a second embodiment of the present invention.

Figure 3C is a partial cross-sectional view showing a substrate package structure group of a third embodiment of the present invention.

4 is a plan view showing a panel and a substrate packaging structure of a fourth embodiment of the present invention.

Fig. 5A is a plan view showing a panel and a substrate package structure according to a fifth embodiment of the present invention.

Fig. 5B is a cross-sectional view taken along line I3I3' of Fig. 5A.

Fig. 5C is a perspective view of the engaging portion in the fifth embodiment of the present invention.

2A is a partial perspective view of a plurality of substrate package structures of the first embodiment of the present invention. 2B is a plan view of a plurality of substrate package structures of the first embodiment of the present invention. Figure 2C is a partial plan view of area A in Figure 2B. 2D is a plan view of the substrate of the first embodiment of the present invention. It should be particularly noted that, in FIG. 2A and FIG. 2B, a plurality of identical substrate packaging structures connected to each other are illustrated. Therefore, in the following description, the substrate packaging structure 100A refers to the same interconnections. One of the substrate packaging structures. 2A and 2B omits the substrate or only a substrate, so as to clearly illustrate the substrate packaging structure of the first embodiment of the present invention. Referring to FIG. 2A to FIG. 2D , in the first embodiment of the present invention, the substrate package structure 100A includes a carrier disk 110 , an engaging portion 140A , a substrate 130 , and a protective film 132 . In this embodiment, the carrier 110 has a bearing surface 112 and a body 120, and the substrate 130 is disposed on the bearing surface 112.

In detail, referring to FIG. 2B, FIG. 2C and FIG. 2D, in the first embodiment of the present invention, the protective film 132 is attached to the substrate 130, and the protective film 132 covers the substrate 130 and has a position extending beyond the substrate 130. Part 134A. In this embodiment, the outer edge of the bearing surface 112 is connected to the inner edge 121 of the base 120. The inner edge 121 of the base 120 has a plurality of abutting surfaces 122. The side edges of the substrate 130 abut against the abutting surfaces 122. . In this embodiment, the engaging portion 140A is disposed on the bearing surface 112 and adjacent to one of the abutting surfaces 122, and the engaging portion 140A is engaged with the positioning portion 134A. The substrate 130 in the present embodiment can be received in the direction parallel to the surface of the substrate 130 when the substrate 130 is placed on the bearing surface 112 by the positioning portion 134A of the protective film 132 attached thereto and the engaging portion 140A. By limitation, the contact between the substrate 130 and the inner edge 121 of the base 120 can be reduced, thereby reducing damage to the substrate 130 caused by moving, storing or colliding with the substrate package structure 100A.

Further, referring to FIG. 2C and FIG. 2D, in the first embodiment of the present invention, the substrate 130 is further connected to a circuit board 138A, the circuit board 138A and the positioning portion 134A are located on opposite sides, and the circuit board 138A and the same side There is a distance between the inner edges 121 of the seat body 120. On the other hand, in the present embodiment, the protective film 132 completely covers the base. The board 130 is, but not limited to, the one. In other embodiments, the protective film 132 may partially cover the substrate 130. Therefore, since the positioning portion 134A of the protective film 132 can be engaged with the engaging portion 140A, the circuit board 138A to which the substrate 130 is connected does not collide with the inner edge 121 of the base 120 and cause damage when the substrate packaging structure 100A is moved. Thereby, the protective effect on the substrate 130 is enhanced.

Fig. 2E is a cross-sectional view showing a substrate package structure group in the first embodiment of the present invention. Fig. 2F is a partial cross-sectional view showing the substrate package structure group in the first embodiment of the present invention. It should be noted that the sectional view of Fig. 2E may correspond to the section line I1I1' of Fig. 2B, and the partial sectional view of Fig. 2F may correspond to the section line I2I2' of Fig. 2B. Referring to FIG. 2E and FIG. 2F, in the embodiment, the substrate packaging structure group includes a plurality of the above-mentioned substrate packaging structures 100A, and the substrate packaging structures 100A are partially connected to each other, and the portions are stacked on each other, so that the substrate can be restricted. Between two substrate packaging structures stacked on each other.

Specifically, referring to FIG. 2B and FIG. 2F, in the embodiment, the bearing surface 112 has a recess 114 for enhancing the strength of the substrate packaging structure. In this embodiment, the substrate 130 may be a liquid crystal display panel, the recess 114 is a visible area corresponding to the liquid crystal display panel, and the substrate 130 is covered on the recess 114 to prevent the visible area from directly contacting the bearing surface 112, but is implemented in other parts. The example is not limited to this. The protective film 132 is attached to the surface of the substrate 130 facing away from the substrate packaging structure.

2G is a top plan view of a substrate in another embodiment of the present invention. 2H is a top plan view of a substrate in another embodiment of the present invention. Figure 2I is a partial cross-sectional view showing the substrate package structure in the first embodiment of the present invention. Specifically, please refer to FIG. 2B and FIG. 2D and FIG. 2E, in the first embodiment of the present invention, the positioning portion 134A has an opening 136A, and the engaging portion 140A is a protrusion 140A and passes through the opening 136A, but is not limited thereto. Referring to FIG. 2G and FIG. 2I, in other embodiments, the stud 140A has an enlarged portion 142, and the edge of the opening 136A has a slit 137A (four in this case), so that the enlarged portion 142 of the stud 140A can be made. After passing through, and the opening 136A is engaged with the stud 140A, it is not detached by vibration or collision. In detail, the protrusion 140A and the opening 136A of the above-described embodiment of the present invention substantially match the size of the engaging portion 140A, so that the opening 136A is not easily loosened when being engaged. In other embodiments, referring to FIG. 2H, the edge of the opening 136A may have eight slits 137A.

For example, in the above embodiment of the present invention, the substrate 130 is a liquid crystal display panel, and the substrate packaging structure 100A is a container for packaging the liquid crystal display module for transportation after the liquid crystal display module is completed. However, in other partial embodiments, the substrate 130 may be a circuit board, and the invention is not limited thereto.

In detail, referring to FIG. 2C and FIG. 2D, in the first embodiment of the present invention, the circuit board 138A is, for example, a flexible printed circuit board, and the substrate package structure 100A is, for example, polyethylene terephthalate. (Polyethylene Terephthalate, PET) is formed, but is not limited thereto. In other embodiments, the substrate packaging structure 100A may be suitably made of a foamed material (for example, Expanded Polyethylene (EPE) or Polystyrene (PS) (ie, styrofoam). It is formed as a material of a panel substrate packaging structure.

It should be noted that the following embodiments follow the component numbers and parts of the foregoing embodiments, wherein the same reference numerals are used to denote the same or similar elements. And the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

Fig. 3A is a plan view of a substrate of a second embodiment of the present invention. Fig. 3B is a plan view showing a substrate package structure of a second embodiment of the present invention. Referring to FIGS. 3A and 3B, in the second embodiment of the present invention, the substrate package structure 100B and the protective film 132 are substantially the same as the substrate package structure 100A and the protective film 132 in the first embodiment of the present invention described above. The difference is that the engaging portion 140B of the second embodiment of the present invention carries the positioning portion 134B, the engaging portion 140B matches the contour of the positioning portion 134B, and the contour of the engaging portion 140B and the positioning portion 134B faces the substrate 130. Retraction. More specifically, in the present embodiment, the width of the engaging portion 140B and the positioning portion 134B at the edge of the substrate 130 connected to the positioning portion 134B is smaller than the portion of the substrate 130 that is closer to the substrate 130 than the portion away from the substrate 130. More specifically, the engaging portion 140B and the positioning portion 134B of the present embodiment are each a T-shape and match each other. Therefore, in this embodiment, the contours of the engaging portion 140B and the positioning portion 134B are matched and engaged with each other, and because the contours of the engaging portion 140B and the positioning portion 134B are retracted toward the substrate 130, the engaging portion 140B and the positioning are caused. When the portion 134B is engaged, the substrate 130 cannot move toward the inner edge 121 of the base body facing the circuit board 138A, thereby preventing the circuit board 138A from colliding with the inner edge 121 of the surrounding body and being damaged, thereby providing high safety.

Figure 3C is a partial cross-sectional view showing a substrate package structure group of a third embodiment of the present invention. Specifically, referring to FIG. 3B and FIG. 3C, the substrate packaging structure group of the third embodiment of the present invention includes a plurality of substrate packaging structures similar to the substrate packaging structure 100B of the second embodiment described above, and the substrate packaging structures 100B between each other Stacking. Each of the substrate packaging structures 100B includes a bottom surface 150 opposite to the bearing surface 112. The bottom surface 150 has a bottom pillar 152 extending vertically downward, and the bottom pillar is disposed within the projection range of the engaging portion 140B. Therefore, when the substrate package structures 100B are stacked, in addition to being engaged with each other by the engaging portions 140B and the positioning portions 134B, the substrate 130 can be restricted in the direction perpendicular to the bottom surface 150 by the bottom pillars 152. Bit.

Further, referring to FIG. 3C, in the third embodiment of the present invention, the bottom pillar 152 of the substrate packaging structure 100B is located above the positioning portion 134B of the other substrate packaging structure 100B, and the height of the bottom pillar 152 is not greater than the seat. The height of the top of the body 120 is different from the height of the carrying surface 112. Therefore, when at least two of the substrate packaging structures 100B are stacked, the bottom pillars 152 of one of the substrate packaging structures 100B are not protruded and are difficult to overlap each other. .

4 is a plan view showing a substrate and a substrate package structure of a fourth embodiment of the present invention. Referring to FIG. 4, in the fourth embodiment of the present invention, the substrate package structure 100C and the protective film 132 are substantially the same as the substrate package structure 100A and the protective film 132 in the first embodiment of the present invention, except that the difference is that The circuit board 138C to which the substrate is connected is located not only on one side with respect to the positioning portion 134C but also on the other side. The circuit board 138C is spaced from the inner edge 121 of the base. Referring to FIG. 4, the positioning portion 134C has a plurality of openings 136A, and the engaging portion 140A is a boss, and the engaging portion 140A passes through the opening 136A, but is not limited thereto. Referring to FIG. 4, in the present embodiment, the substrate carried by the substrate package structure 100C is, for example, a liquid crystal display panel, but is not limited thereto.

Referring to FIG. 4, in other embodiments, the engaging portion 140A may also be, for example, a spigot, the engaging portion 140A passes through the opening 136A, and the engaging portion 140A is detachably assembled. The other portions of the substrate package structure 100C are mounted, that is, the engaging portions 140A can be directly inserted into the substrate package structure 100C through the openings 136A, and at this time, the substrate package structure 100C can be made of, for example, polystyrene. Therefore, the substrate package structure 100C of FIG. 4 can be fixed by the engagement of the protrusion and the insertion portion of the positioning post 134C and the positioning portion 134C, wherein the circuit board 138C is not in contact with the inner edge 121 of the base body, It is possible to avoid damage to the circuit board 138C due to a collision.

Fig. 5A is a plan view showing a panel and a substrate package structure according to a fifth embodiment of the present invention. Fig. 5B is a cross-sectional view taken along line I3I3' of Fig. 5A. Referring to FIG. 5A and FIG. 5B, in the fifth embodiment of the present invention, the substrate package structure 100D and the protective film 132 are substantially the same as the substrate package structure 100C and the protective film 132 in the fourth embodiment of the present invention. The substrate is further connected to the circuit board 138D on the side where the positioning portion 134D is located, the positioning portion 134D extends beyond the circuit board 138D, and the engaging portion 140C engages the positioning portion 134D to extend beyond the circuit board 138D. Share. In other words, in the other embodiments described above, the positioning portion extends to the outer side of the circuit board without covering the circuit board, and the positioning portion 134D of the present embodiment covers the circuit board 138D and extends outside the circuit board 138D.

Fig. 5C is a perspective view of the engaging portion in the fifth embodiment of the present invention. Specifically, referring to FIG. 5A to FIG. 5C , in the embodiment, the positioning portion 134D has a plurality of openings 136A, the engaging portion 140C is detachable from the bearing surface 112, and the engaging portion 140C includes a fixing portion 144C and Insert 146C. The insertion post 146C is inserted into the opening 136A, one end of the fixing portion 144C is connected to the insertion post 146C, and the other end of the fixing portion 144C is inserted into the base 120. The fixing portion 144C of the embodiment is inserted into the end of the base 120 and has a T shape. The seat portion 120 has a corresponding T-shaped slot, and one end of the fixing portion 144C having a T-shaped cross section is inserted, and the engaging portion 140C is fitted to the base 120. The fixing portion 144C is partially disposed on the positioning portion 134D, and a buffer portion 142C is disposed on the insertion post 146C. In the embodiment, the buffer portion 142C and the insertion post are inserted into the opening 136A. In detail, the plunger 146C and the fixing portion 144C of the present embodiment are plastic members having a high hardness, and the buffer portion 142C is formed of a material having elasticity (for example, plastic or rubber), thereby protecting the substrate 130 from collision. The rupture allows the engagement portion 140C and the opening 136A to be more stable when engaged, but the present invention is not limited thereto. In other embodiments, the insertion post 146C and the buffer portion 142C may be formed of a material having elasticity, wherein the cross-sectional size of the post 146C may be more consistent with the opening 136A, and the buffer portion 142C disposed on the post 146C may Located outside the opening 136A, that is, the buffer portion 142C presses the portion of the positioning portion 134D of the protective film 132 when the insertion post 146C passes through the opening 136A to reinforce the protective film or is located above the partial positioning portion 134D to limit the protection. Movement of the membrane 132.

More specifically, referring to FIG. 5A, in a fifth embodiment of the present invention, the panel is connected, for example, to a plurality of circuit boards 138D, and each of the circuit boards 138D is connected to the four sides of the panel. In this embodiment, the positioning portions 134D are engaged by the plurality of engaging portions 140C (here, the four engaging portions 140C are taken as an example), and the circuit boards 138D are not in contact with the inner edge 121 of the base 120. Therefore, it is possible to avoid damage to the above board due to collision.

In summary, in the substrate packaging structure and the substrate packaging structure group provided by the embodiments of the present invention, the card between the positioning portion of the engaging portion and the protective film When the protective film is attached to a substrate, the substrate can be fixed on the substrate packaging structure, and the circuit board or the connection port connected to the substrate can be kept away from the inner edge of the base. Therefore, it is possible to reduce the collision between the board and the inner edge of the seat.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100A‧‧‧Substrate packaging structure

110‧‧‧Loading tray

121‧‧‧ inner edge

122‧‧‧The top surface

132‧‧‧Protective film

134A‧‧‧ Positioning Department

136A‧‧‧ opening

138A‧‧‧ boards

140A‧‧‧Clock Department

Claims (14)

A substrate packaging structure comprising: a carrier tray having a bearing surface and a body, wherein an outer edge of the bearing surface is connected to an inner edge of the base body, and an inner edge of the base body has a plurality of abutting surfaces; a clamping portion disposed on the bearing surface adjacent to one of the abutting surfaces; a substrate disposed on the bearing surface, a side edge of the substrate abutting the abutting surfaces; and a protective film attached to the On the substrate, the protective film covers the substrate and has a positioning portion extending outside the substrate, and the engaging portion is engaged with the positioning portion. The substrate packaging structure of claim 1, wherein the bearing surface further has at least one groove, and the substrate covers the groove. The substrate packaging structure of claim 1, wherein the positioning portion has at least one opening, and the engaging portion is a protrusion and passes through the opening. The substrate packaging structure of claim 3, wherein the top end of the stud has an enlarged portion, and the opening edge has at least one slit. The substrate packaging structure of claim 1, wherein the substrate is further connected to a circuit board, the circuit board and the positioning portion are located on opposite sides of the substrate, and the circuit board and the same side of the base body There is a distance between the inner edges. The substrate packaging structure of claim 1, wherein the substrate is further connected to a circuit board, the circuit board and the positioning portion are located on the same side of the substrate, and the positioning portion extends beyond the circuit board. The substrate packaging structure of claim 1, wherein the positioning portion has an opening, the engaging portion is detachable from the bearing surface, and the engaging portion comprises a fixing portion. And a plug, the plug is inserted into the opening, one end of the fixing portion is connected to the plug, and the other end of the fixing portion is inserted into the seat. The substrate packaging structure of claim 7, wherein the fixing portion is straddle the positioning portion. The substrate packaging structure of claim 7, wherein a buffer portion is disposed on the plug, and when the plug is inserted into the opening, the buffer portion is located on the opening to press the protective film or The insertion post is inserted into the opening. The substrate packaging structure of claim 1, wherein the engaging portion carries the positioning portion, the engaging portion matches the contour of the positioning portion, and the engaging portion and the positioning portion are contoured The substrate is retracted in the direction. The substrate packaging structure of claim 1, wherein the protective film completely covers the substrate. A substrate packaging structure set comprising at least two substrate packaging structures, the substrate packaging structures being stacked on each other, each of the substrate packaging structures comprising the structure according to claim 10, wherein each of the substrate packaging structures comprises The bottom surface of the bearing surface is opposite to the bottom surface, and the bottom surface has a bottom pillar extending vertically downward, and the bottom pillar is disposed in a projection range of the engaging portion. The substrate packaging structure set of claim 12, wherein the bottom pillar of the substrate packaging structure is located above the positioning portion of the other substrate packaging structure. The substrate packaging structure set according to claim 12, wherein the height of the bottom pillar is not greater than a height difference between a top portion of the base body and the bearing surface.