CN104386359A - Substrate packaging structure and substrate packaging structure set - Google Patents
Substrate packaging structure and substrate packaging structure set Download PDFInfo
- Publication number
- CN104386359A CN104386359A CN201410596360.2A CN201410596360A CN104386359A CN 104386359 A CN104386359 A CN 104386359A CN 201410596360 A CN201410596360 A CN 201410596360A CN 104386359 A CN104386359 A CN 104386359A
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- Prior art keywords
- substrate
- packaging structure
- substrate packaging
- location division
- engagement section
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- 239000000758 substrate Substances 0.000 title claims abstract description 200
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 112
- 230000001681 protective effect Effects 0.000 claims abstract description 32
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 35
- 239000004793 Polystyrene Substances 0.000 description 4
- 230000012447 hatching Effects 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 240000001439 Opuntia Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920006328 Styrofoam Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000008261 styrofoam Substances 0.000 description 1
Abstract
A substrate packaging structure comprises a bearing plate, a clamping part, a substrate and a protective film. The bearing plate is provided with a bearing surface and a seat body. The outer edge of the bearing surface is connected with the inner edge of the seat body, and the inner edge of the seat body is provided with a plurality of abutting surfaces. The clamping part is arranged on the bearing surface and is adjacent to one of the abutting surfaces. The substrate is arranged on the bearing surface, and the side edge of the substrate is abutted against the abutting surfaces. The protective film is attached to the substrate, covers the substrate and is provided with a positioning part extending out of the substrate, and the clamping part is clamped with the positioning part. A substrate package structure set is also provided.
Description
Technical field
The invention relates to a kind of substrate packaging structure and substrate packaging structure group, and relate to especially a kind of can prevent substrate from damaging because of collision substrate packaging structure and substrate packaging structure group.
Background technology
Along with development in science and technology, display panel today society is used in various electronic product widely as among tablet PC, intelligent mobile phone or flat-surface television.Specifically, display panel is mainly made up of the assembly of the not impact resistant such as glass, bendable printed circuit board (PCB) (Flexible Printed Circuit), therefore display panel maker is in transport or need display panel pack when depositing display panel and be fixed in board bearing plate and prevent collision, avoids display panel because of collision or the damage that causes of vibration by this.
Fig. 1 is the panel of prior art and the birds-eye view of board bearing plate.Specifically, please refer to Fig. 1, substrate packaging structure 50 can fix panel 60 by the inner edge 52 of pedestal, but the bendable printed circuit board (PCB) 62 of the side of panel 60 also can touch the inner edge 52 of pedestal simultaneously.In the process of transporting, bendable printed circuit board (PCB) 62 can because mobile and oppressed in the inner edge 52 of pedestal of panel 60, and then make bendable printed circuit board (PCB) 62 impaired.
Summary of the invention
Embodiments of the invention provide a kind of substrate packaging structure, can avoid the collision of described substrate and substrate packaging structure during its bearing substrate.
Embodiments of the invention provide a kind of substrate packaging structure group, at least two substrates can be fixed at least two substrate packaging structures by it, and described substrate can also be avoided except can avoiding the collision of described substrate and substrate packaging structure to depart from substrate packaging structure.
Embodiments of the invention provide a kind of substrate packaging structure, and it comprises a carrier, an engagement section, a substrate and a protective film.Carrier has a carrying surface and pedestal.The outer rim of carrying surface connects the inner edge of pedestal, and the inner edge of pedestal has multiple support surface.Substrate is arranged at carrying surface.The lateral margin of substrate is resisted against these support surfaces.Protective film is attached on substrate, has a location division of extending outside substrate.Engagement section engages with location division.
In one embodiment of the invention, above-mentioned carrying surface has more at least one groove, and substrate is covered on groove.
In one embodiment of the invention, above-mentioned location division has at least one perforate, and engagement section is a projection and passes perforate.
In one embodiment of the invention, above-mentioned projection top has the portion of expanding, and verge of opening has at least one slot.
In one embodiment of the invention, above-mentioned substrate more connects a circuit card, circuit card and the relative both sides of position point in substrate, and the interior intermarginal of the pedestal of circuit card and homonymy has a distance.
In one embodiment of the invention, above-mentioned substrate more connects a circuit card, and circuit card and position point are in the same side of substrate, and location division more extends to outside circuit card.
In one embodiment of the invention, above-mentioned location division has a perforate, and engagement section is detachably in carrying surface, and engagement section comprises a fixed part and an inserting column, and inserting column plugs perforate, and one end of fixed part is connected with inserting column, and the other end of fixed part inserts pedestal.
In one embodiment of the invention, above-mentioned fixed part part is located at location division.
In one embodiment of the invention, above-mentioned inserting column is arranged a buffer part, and when inserting column plugs perforate, buffer locations in perforate to suppress protective film or to be inserted in perforate with inserting column.
In one embodiment of the invention, above-mentioned carrying location division, engagement section, the profile of engagement section and location division matches, and the profile of engagement section and location division inside contracts toward orientation substrate.
In one embodiment of the invention, the complete covered substrate of above-mentioned protective film.
Embodiments of the invention provide a kind of substrate packaging structure group, and it comprises at least two substrates packaging structure.These substrate packaging structures storehouse each other, each substrate packaging structure comprises the structure as above-mentioned substrate packaging structure, wherein each substrate packaging structure comprises a bottom surface relative with carrying surface, and bottom surface has a down vertically extending foundation, and foundation is arranged in the drop shadow spread of engagement section.
In one embodiment of the invention, the foundation of an above-mentioned substrate packaging structure is positioned on the location division of another substrate packaging structure.
In one embodiment of the invention, the height of above-mentioned foundation is not more than the top of pedestal and the diff-H of carrying surface.
Based on above-mentioned, in the substrate packaging structure provided at embodiments of the invention and substrate packaging structure group, by engagement section and protective film location division between engaging, the collision between substrate and pedestal inner edge can be reduced.And in the substrate packaging structure group provided at embodiments of the invention, make multiple substrate packaging structure can prevent substrate from departing from substrate packaging structure when storehouse by down vertically extending foundation.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate institute's accompanying drawings to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the substrate of prior art and the birds-eye view of substrate packaging structure;
Fig. 2 A is the partial perspective view of multiple substrate packaging structures of the first embodiment of the present invention;
Fig. 2 B is the birds-eye view of multiple substrate packaging structures of the first embodiment of the present invention;
Fig. 2 C is the partial top view according to region A in Fig. 2 B;
Fig. 2 D is the birds-eye view of the substrate of the first embodiment of the present invention;
Fig. 2 E is the section-drawing of the substrate packaging structure group in the first embodiment of the present invention;
Fig. 2 F is the part sectional view of the substrate packaging structure group in the first embodiment of the present invention;
Fig. 2 G is the birds-eye view of substrate in other embodiments of the invention;
Fig. 2 H is the birds-eye view of substrate in other embodiments of the invention;
Fig. 2 I is the part sectional view of the substrate packaging structure in the first embodiment of the present invention;
Fig. 3 A is the birds-eye view of the substrate of the second embodiment of the present invention;
Fig. 3 B is the birds-eye view of the substrate packaging structure of the second embodiment of the present invention;
Fig. 3 C is the part sectional view of the substrate packaging structure group of the third embodiment of the present invention;
Fig. 4 is the panel of the fourth embodiment of the present invention and the birds-eye view of a substrate packaging structure;
Fig. 5 A is the panel of the fifth embodiment of the present invention and the birds-eye view of a substrate packaging structure;
Fig. 5 B is the section-drawing along Fig. 5 A section line I3I3 ';
Fig. 5 C is the block diagram of engagement section in the fifth embodiment of the present invention.
A: region
I1I1 ', I2I2 ', I3I3 ': hatching
50,100A, 100B, 100C, 100D: substrate packaging structure
52: carrying depression
110: carrier
60,130: substrate
62: bendable printed circuit board (PCB)
112: carrying surface
114: groove
120: pedestal
121: inner edge
122: support surface
132: protective film
134A, 134B, 134C, 134D: location division
136A: perforate
137A: slot
138A, 138C, 138D: circuit card
140A, 140B, 140C: engagement section
142: expand portion
142C: buffer part
144C: fixed part
146C: inserting column
150: bottom surface
152: foundation
Detailed description of the invention
Fig. 2 A is the partial perspective view of multiple substrate packaging structures of the first embodiment of the present invention.Fig. 2 B is the birds-eye view of multiple substrate packaging structures of the first embodiment of the present invention.Fig. 2 C is the partial top view according to region A in Fig. 2 B.Fig. 2 D is the birds-eye view of the substrate of the first embodiment of the present invention.It should be noted that, what illustrate in Fig. 2 A and Fig. 2 B is the multiple identical substrate packaging structure be connected to each other, and therefore described substrate packaging structure 100A refers to one of them of these identical substrate packaging structures be connected to each other in the description which follows.Fig. 2 A and Fig. 2 B omits and depicts substrate or only illustrate a substrate, uses the substrate packaging structure clearly demonstrating the first embodiment of the present invention.Please refer to Fig. 2 A to Fig. 2 D, in the first embodiment of the present invention, substrate packaging structure 100A comprises carrier 110, engagement section 140A, substrate 130 and protective film 132.In the present embodiment, carrier 110 has carrying surface 112 and a pedestal 120, and substrate 130 is arranged at carrying surface 112.
Specifically, please refer to Fig. 2 B, Fig. 2 C and Fig. 2 D, in the first embodiment of the present invention, protective film 132 is attached on substrate 130, and protective film 132 covered substrate 130 there is the location division 134A extended outside substrate 130.In the present embodiment, the outer rim of carrying surface 112 is connected to the inner edge 121 of pedestal 120, and the inner edge 121 of pedestal 120 has multiple support surface 122, and the lateral margin of substrate 130 is resisted against these support surfaces 122.In the present embodiment, engagement section 140A is arranged at carrying surface 112 and a contiguous wherein support surface 122, and engagement section 140A engages with location division 134A.Owing to being restricted on the direction being parallel to substrate 130 surface when the substrate 130 in the present embodiment can engage make substrate 130 be arranged at carrying surface 112 with engagement section 140A by the location division 134A of the protective film 132 attached on it; therefore can reduce the contact of substrate 130 and the inner edge 121 of pedestal 120, so reduce because of movement, storage or bumped substrate packaging structure 100A time the damage to substrate 130 that causes.
Furthermore, please refer to Fig. 2 C and Fig. 2 D, in the first embodiment of the present invention, substrate 130 more connects a circuit card 138A, circuit card 138A is positioned at relative both sides with location division 134A, and has a distance between the inner edge 121 of the pedestal 120 of circuit card 138A and homonymy.On the other hand, protective film 132 covered substrate 130 completely in the present embodiment, but be not limited thereto.In other embodiments, protective film 132 can part covered substrate 130.Therefore; because the location division 134A of protective film 132 can engage with engagement section 140A; therefore when moving substrate packaging structure 100A, the circuit card 138A that substrate 130 connects can not collide with the inner edge 121 of pedestal 120 and cause damage, and then strengthens the protected effect to substrate 130.
Fig. 2 E is the section-drawing of the substrate packaging structure group in the first embodiment of the present invention.Fig. 2 F is the part sectional view of the substrate packaging structure group in the first embodiment of the present invention.It should be noted that, the section drawing of Fig. 2 E can correspond to the hatching I1I1 ' of Fig. 2 B, and the partial section of Fig. 2 F can correspond to the hatching I2I2 ' of Fig. 2 B.Please refer to Fig. 2 E and Fig. 2 F, in the present embodiment, substrate packaging structure group comprises multiple above-mentioned substrate packaging structure 100A, and these substrate packaging structures 100A part is connected to each other, part storehouse each other, uses and substrate can be limited between two substrate packaging structures of mutual storehouse.
Specifically, please refer to Fig. 2 B and Fig. 2 F, in the present embodiment, carrying surface 112 has groove 114, is used for strengthening the intensity of substrate packaging structure.In the present embodiment, substrate 130 can be display panels, and the corresponding display panels place of groove 114 is visible area, and substrate 130 covers on groove 114, visible area can be avoided directly to contact carrying surface 112, be so not limited thereto in other parts embodiment.Wherein protective film 132 is attached on the surface of substrate 130 substrate packaging structure dorsad.
Fig. 2 G is the birds-eye view of substrate in other embodiments of the invention.Fig. 2 H is the birds-eye view of substrate in other embodiments of the invention.Fig. 2 I is the part sectional view of the substrate packaging structure in the first embodiment of the present invention.Specifically, please refer to Fig. 2 B, Fig. 2 D and Fig. 2 E, in the first embodiment of the present invention, location division 134A has perforate 136A, and engagement section 140A is a projection 140A and passes perforate 136A, but is not limited thereto.Please refer to Fig. 2 G and Fig. 2 I, in other embodiments, projection 140A has the portion of expanding 142, and perforate 136A edge has slot 137A (here for four), therefore the portion of expanding 142 of projection 140A can be made to pass, and more can not depart from because vibrating or collide after perforate 136A is engaged with projection 140A.Specifically, projection 140A and the perforate 136A size of the above embodiment of the present invention can roughly be engaged portion 140A, and then make easily to get loose because perforate 136A is excessive during engaging.In other embodiments, please refer to Fig. 2 H, perforate 136A edge more can have eight slot 137A.
For example, in the above embodiment of the present invention, substrate 130 is display panels, and substrate packaging structure 100A is used for packing LCD MODULE so that a kind of container of transport after the LCD MODULE that completes.But in other parts embodiment, substrate 130 can be circuit card, the present invention is not limited thereto.
Specifically, please refer to Fig. 2 C and Fig. 2 D, in the first embodiment of the present invention, circuit card 138A is such as bendable printed circuit board (PCB), and substrate packaging structure 100A is such as by polyethylene terephthalate (Polyethylene Terephthalate, PET) formed, but be not limited thereto.In other embodiments, substrate packaging structure 100A can be more (be such as polyethylene foamed (ExpandedPolyethylene by foaming material, EPE)) or the material be suitable for as the substrate packaging structure of a panel such as polystyrene (Polystyrene, PS) (namely Styrofoam) formed.
Should be noted that at this, following embodiment continues to use reference numerals and the partial content of previous embodiment, wherein adopts identical label to represent identical or approximate assembly, and eliminates the explanation of constructed content.Explanation about clipped can with reference to previous embodiment, and it is no longer repeated for following embodiment.
Fig. 3 A is the birds-eye view of the substrate of the second embodiment of the present invention.Fig. 3 B is the birds-eye view of the substrate packaging structure of the second embodiment of the present invention.Please refer to Fig. 3 A and Fig. 3 B, in the second embodiment of the present invention, substrate packaging structure 100B and protective film 132 roughly the same with the substrate packaging structure 100A in first embodiment of the invention described above and protective film 132.Difference is, the engagement section 140B of second embodiment of the invention carries location division 134B, and the profile of engagement section 140B and location division 134B matches, and the profile of engagement section 140B and location division 134B inside contracts toward substrate 130 direction.More particularly, engagement section 140B is also less than the part away from substrate 130 in the part close to substrate 130 at the width at the edge being parallel to the substrate 130 that location division 134B is connected with location division 134B in the present embodiment.More particularly, the engagement section 140B of the present embodiment and location division 134B is respectively a T font, and mates each other.Therefore, to match each other with location division 134B profile by engagement section 140B in the present embodiment and engage, and because the profile of engagement section 140B and location division 134B inside contracts toward substrate 130 direction, when engagement section 140B is engaged with location division 134B substrate 130 cannot toward circuit card 138A faced by the inner edge 121 of pedestal move, and then the inner edge 121 of the pedestal of circuit card 138A and surrounding can be avoided to collide and damage, there is higher safety.
Fig. 3 C is the part sectional view of the substrate packaging structure group of the third embodiment of the present invention.Specifically, please refer to Fig. 3 B and Fig. 3 C, the substrate packaging structure group of the third embodiment of the present invention comprises multiple substrate packaging structure, and it is similar to the substrate packaging structure 100B of above-mentioned second embodiment, and these substrate packaging structures 100B storehouse each other.Each substrate packaging structure 100B comprises a bottom surface 150 relative with carrying surface 112, and bottom surface 150 has a down vertically extending foundation 152, and foundation is arranged in the drop shadow spread of engagement section 140B.Therefore, when these substrate packaging structures of storehouse 100B, except can engaging mutually with location division 134B by engagement section 140B, substrate 130 can also be subject on the direction perpendicular to bottom surface 150 by foundation 152 spacing.
Furthermore, please refer to Fig. 3 C, in the third embodiment of the present invention, the foundation 152 of substrate packaging structure 100B is positioned on the location division 134B of another substrate packaging structure 100B, and the height of foundation 152 is not more than the top of pedestal 120 and the diff-H of carrying surface 112, therefore, at least two substrates packaging structure 100B phase in substrate packaging structure group repeatedly time, can not be difficult to stacked mutually because the foundation 152 of a wherein substrate packaging structure 100B protrudes.
Fig. 4 is the substrate of the fourth embodiment of the present invention and the birds-eye view of a substrate packaging structure.Please refer to Fig. 4; in the fourth embodiment of the present invention; substrate packaging structure 100C and protective film 132 roughly the same with the substrate packaging structure 100A in first embodiment of the invention described above and protective film 132; difference is; the circuit card 138C that substrate connects not only is positioned at the side relative to location division 134C, is more positioned at other both sides.The inner edge 121 of circuit card 138C and pedestal keeps the distance.Please refer to Fig. 4, location division 134C has multiple perforate 136A, and engagement section 140A is projection, and engagement section 140A is through perforate 136A, but is not limited thereto.Please refer to Fig. 4, in the present embodiment, the substrate that substrate packaging structure 100C carries is such as display panels, but is not limited thereto.
Please refer to Fig. 4, in other embodiments, engagement section 140A can be also such as pin, engagement section 140A is through perforate 136A, and engagement section 140A is removably assembled to the other parts of substrate packaging structure 100C, that is engagement section 140A can directly insert in substrate packaging structure 100C through perforate 136A, and now substrate packaging structure 100C such as can make by polystyrene.Therefore, the substrate packaging structure 100C of Fig. 4 can make panel fix by projection and the engaging of location division 134C or the engaging of pin and location division 134C, wherein because circuit card 138C does not have to contact with the inner edge 121 of pedestal, can avoid damaging circuit card 138C because of collision.
Fig. 5 A is the panel of the fifth embodiment of the present invention and the birds-eye view of a substrate packaging structure.Fig. 5 B is the section-drawing along Fig. 5 A section line I3I3 '.Please refer to Fig. 5 A and Fig. 5 B; in the fifth embodiment of the present invention; substrate packaging structure 100D and protective film 132 roughly the same with the substrate packaging structure 100C in the 4th embodiment of the invention described above and protective film 132; difference is; substrate is also connected to circuit card 138D in the side be positioned at location division 134D; location division 134D more extends to outside circuit card 138D, and engagement section 140C engaging location division 134D extends the part outside circuit card 138D.In other words, in other embodiment above-mentioned, location division extends to the outside of circuit card and not covering board, and the location division 134D of the present embodiment is covering board 138D and extends to outside circuit card 138D.
Fig. 5 C is the block diagram of engagement section in the fifth embodiment of the present invention.Specifically, please refer to Fig. 5 A to Fig. 5 C, in the present embodiment, location division 134D has multiple perforate 136A, and engagement section 140C is detachably in carrying surface 112, and engagement section 140C comprises a fixed part 144C and inserting column 146C.Inserting column 146C plugs perforate 136A, one end of fixed part 144C is connected with inserting column 146C, the other end of fixed part 144C inserts pedestal 120, the one end of inserting pedestal 120 at the fixed part 144C of the present embodiment has T font cross section, and pedestal 120 has corresponding T font slot has T font cross section one end insertion for fixed part 144C, and then make engagement section 140C chimeric with pedestal 120.Fixed part 144C part is located at location division 134D, and inserting column 146C arranges a buffer part 142C, and buffer part 142C and this inserting column are inserted in perforate 136A in the present embodiment.Specifically; the Plastic Parts that hardness is higher at the inserting column 146C of the present embodiment and fixed part 144C; and buffer part 142C is formed by having elastomeric material (being such as plastics, rubber); use protective substrate 130 collision free and break; enable between engagement section 140C with perforate 136A more firm when engaging simultaneously, but the present invention is not limited thereto.In other embodiments; inserting column 146C and buffer part 142C is formed by having elastomeric material; wherein the cross-sectional sizes of inserting column 146C more can be coincide with perforate 136A; and the buffer part 142C be arranged on inserting column 146C can be positioned at outside perforate 136A; namely buffer part 142C can suppress the part location division 134D of protective film 132 to strengthen fixing protective film at inserting column 146C through during perforate 136A, or is positioned at the movement limiting protective film 132 above the 134D of part location division.
More particularly, please refer to Fig. 5 A, in the fifth embodiment of the present invention, panel is such as connected to multiple circuit card 138D, and these circuit cards 138D is connected with four sides of panel separately.In the present embodiment, location division 134D is engaged by multiple engagement section 140C (here for four engagement section 140C), these circuit cards 138D can not contact with the inner edge 121 of pedestal 120, therefore can avoid damaging foregoing circuit plate because of collision.
In sum; in the substrate packaging structure provided at embodiments of the invention and substrate packaging structure group; by engagement section and protective film location division between engaging; when protective film is attached at a substrate; substrate can be fixed on substrate packaging structure, and the circuit card be simultaneously connected with substrate or connectivity port can keep the distance with the inner edge of pedestal.Therefore, the collision between circuit card and the inner edge of pedestal can be reduced.
Although the present invention discloses as above with embodiment; so itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on the accompanying claims person of defining.
Claims (14)
1. a substrate packaging structure, comprises:
One carrier, have a carrying surface and a pedestal, wherein the outer rim of this carrying surface is connected to the inner edge of this pedestal, and the inner edge of this pedestal has multiple support surface;
One engagement section, is arranged at this carrying surface and contiguous wherein this support surface;
One substrate, is arranged at this carrying surface, and the lateral margin of this substrate is resisted against those support surfaces; And
One protective film, is attached on this substrate, and this protective film covers this substrate and has a location division of extending outside this substrate, and this engagement section also engages with this location division.
2. substrate packaging structure as claimed in claim 1, it is characterized in that, this carrying surface has more at least one groove, and this substrate is covered on this groove.
3. substrate packaging structure as claimed in claim 1, it is characterized in that, this location division has at least one perforate, and this engagement section is a projection and passes this perforate.
4. substrate packaging structure as claimed in claim 3, it is characterized in that, this projection top has the portion of expanding, and this verge of opening has at least one slot.
5. substrate packaging structure as claimed in claim 1, it is characterized in that, this substrate more connects a circuit card, this circuit card and the relative both sides of this position point in this substrate, and intermarginally within this pedestal of this circuit card and homonymy has a distance.
6. substrate packaging structure as claimed in claim 1, it is characterized in that, this substrate more connects a circuit card, and this circuit card and this position point are in the same side of this substrate, and this location division more extends to outside this circuit card.
7. the substrate packaging structure as described in claim 1, it is characterized in that, this location division has a perforate, this engagement section is detachably in this carrying surface, this engagement section comprises a fixed part and an inserting column, this inserting column plugs this perforate, and one end of this fixed part is connected with this inserting column, and the other end of this fixed part inserts this pedestal.
8. substrate packaging structure as claimed in claim 7, it is characterized in that, this fixed part part is located at this location division.
9. substrate packaging structure as claimed in claim 7, is characterized in that, this inserting column is arranged a buffer part, and when this inserting column plugs this perforate, this buffer locations in this perforate to suppress this protective film or to be inserted in this perforate with this inserting column.
10. substrate packaging structure as claimed in claim 1, it is characterized in that, this engagement section carries this location division, and the profile of this engagement section and this location division matches, and the profile of this engagement section and this location division inside contracts toward this orientation substrate.
11. substrate packaging structures as described in claim 1, it is characterized in that, this protective film covers this substrate completely.
12. 1 kinds of substrate packaging structure groups, it is characterized in that, comprise at least two substrates packaging structure, those substrate packaging structures storehouse each other, respectively this substrate packaging structure comprises structure as claimed in claim 10, wherein respectively this substrate packaging structure comprises a bottom surface relative with this carrying surface, and this bottom surface has a down vertically extending foundation, and this foundation is arranged in the drop shadow spread of this engagement section.
13. substrate packaging structure groups as claimed in claim 12, is characterized in that, this foundation of this substrate packaging structure is positioned on this location division of this another substrate packaging structure.
14. substrate packaging structure groups as claimed in claim 12, is characterized in that, the height of this foundation is not more than the top of this pedestal and the diff-H of this carrying surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103127633 | 2014-08-12 | ||
| TW103127633A TWI534055B (en) | 2014-08-12 | 2014-08-12 | Substrate packaging structure and substrate packaging group |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104386359A true CN104386359A (en) | 2015-03-04 |
| CN104386359B CN104386359B (en) | 2017-04-12 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410596360.2A Active CN104386359B (en) | 2014-08-12 | 2014-10-30 | Substrate packaging structure and substrate packaging structure set |
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| Country | Link |
|---|---|
| CN (1) | CN104386359B (en) |
| TW (1) | TWI534055B (en) |
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| CN106315024A (en) * | 2016-08-29 | 2017-01-11 | 武汉华星光电技术有限公司 | Tray for small-size liquid crystal display panels and packaging box assembly |
| CN106494770A (en) * | 2016-10-18 | 2017-03-15 | 武汉华星光电技术有限公司 | Face glass protection device |
| CN106742537A (en) * | 2017-03-08 | 2017-05-31 | 武汉华星光电技术有限公司 | A kind of pallet for holding liquid crystal display panel |
| CN106829135A (en) * | 2017-03-07 | 2017-06-13 | 武汉华星光电技术有限公司 | Liquid crystal display panel conveying tray |
| CN106882454A (en) * | 2017-03-14 | 2017-06-23 | 武汉华星光电技术有限公司 | Liquid crystal display panel conveying tray |
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| CN1217279A (en) * | 1997-11-14 | 1999-05-26 | 夏普公司 | Package support |
| CN1693944A (en) * | 2004-04-30 | 2005-11-09 | Lg.菲利浦Lcd株式会社 | Structure for fixing printed circuit board and method of fixing thereof |
| JP2006240724A (en) * | 2005-03-07 | 2006-09-14 | Sekisui Plastics Co Ltd | Parts packing tray and method for manufacturing it |
| TW200900334A (en) * | 2007-06-29 | 2009-01-01 | Au Optronics Corp | Package structure liquid crystal display panel module having fastened pieces |
| CN101070110A (en) * | 2007-07-09 | 2007-11-14 | 友达光电股份有限公司 | Liquidcrystal panel package structure with positioning pieces |
| JP2011148510A (en) * | 2010-01-19 | 2011-08-04 | Toshiba Logistics Corp | Storage tray |
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| CN106829135A (en) * | 2017-03-07 | 2017-06-13 | 武汉华星光电技术有限公司 | Liquid crystal display panel conveying tray |
| CN106742537A (en) * | 2017-03-08 | 2017-05-31 | 武汉华星光电技术有限公司 | A kind of pallet for holding liquid crystal display panel |
| CN106882454A (en) * | 2017-03-14 | 2017-06-23 | 武汉华星光电技术有限公司 | Liquid crystal display panel conveying tray |
| CN106882454B (en) * | 2017-03-14 | 2019-10-25 | 武汉华星光电技术有限公司 | Liquid crystal display panel conveying tray |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201605701A (en) | 2016-02-16 |
| TWI534055B (en) | 2016-05-21 |
| CN104386359B (en) | 2017-04-12 |
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