CN102745420B - Buffering packing box - Google Patents
Buffering packing box Download PDFInfo
- Publication number
- CN102745420B CN102745420B CN201210208156.XA CN201210208156A CN102745420B CN 102745420 B CN102745420 B CN 102745420B CN 201210208156 A CN201210208156 A CN 201210208156A CN 102745420 B CN102745420 B CN 102745420B
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- China
- Prior art keywords
- lid
- accommodation space
- damper element
- packaging box
- buffering packaging
- Prior art date
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- 230000003139 buffering effect Effects 0.000 title claims description 26
- 238000012856 packing Methods 0.000 title abstract description 4
- 230000004308 accommodation Effects 0.000 claims description 26
- 230000000712 assembly Effects 0.000 claims description 23
- 238000000429 assembly Methods 0.000 claims description 23
- 238000004806 packaging method and process Methods 0.000 claims description 22
- 238000005452 bending Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Packaging Frangible Articles (AREA)
- Buffer Packaging (AREA)
Abstract
The invention relates to a buffer packing box, comprising: the cover body, the box body and the buffer piece; one side of the box body is connected with the cover body, the box body comprises a plurality of side plates, a bottom plate and a positioning part, the side plates are connected with the bottom plate to form a containing space, the containing space is covered by the cover body to contain the electronic module, and the positioning part is positioned on the bottom plate or one of the side plates and protrudes towards the containing space; one end of the buffer piece is connected to the outer wall surface of one of the side plates and is bent towards the accommodating space to abut against the positioning part. The invention uses the buffer piece to receive the pushing force of the circuit board assembly and forms an elastic buffer effect, thereby effectively protecting the stability of the circuit board assembly of the electronic module in the transportation process.
Description
Technical field
The present invention is about a kind of packing box, particularly a kind of buffering packaging box that possesses buffer action.
Background technology
Towards frivolous, in the field of liquid crystal of narrow limit and Rimless, the size of glass substrate is along with scientific and technological development and evolution and increasing, thickness is also more and more thinner simultaneously, and the transmission flat cable distance between circuit substrate and the circuit substrate of glass substrate one side is that more convergent is short, and edge between circuit substrate distance and glass substrate is also to stress to dwindle spacing, be with, when the general packing container using is received this Liquid Crystal Display, all cannot recycle traditional approach uses, for example the convex cylinder of breasting circuit substrate uses, therefore, how solving transmission projection cannot provide under all fixing problem of buffering and Support Position, avoid in transportation simultaneously, when the circuit substrate of Liquid Crystal Display or transmission flat cable are subject to the situations such as gravity extruding, cause the problems such as extruded position damage, be for relevant affiliated technical field personnel institute must solution problem.
Summary of the invention
In view of this, the present invention proposes a kind of buffering packaging box, comprises: lid, box body and damper element; Wherein, box body one side is connected in lid, and box body comprises multiple side plates, base plate and location division, and multiple side plates are connected with base plate and form accommodation space, cover accommodation space and receive electronics module via lid, position point is given prominence on base plate or one of them side plate and to accommodation space; Damper element one end is connected in the outside wall surface of one of them side plate, is resisted against location division towards accommodation space bending.Wherein, this damper element comprises a junction, a body and a kink.Connecting portion is connected in the outside wall surface of one of them this side plate; Body is connected in this connecting portion; Kink one end is connected in this body, and the other end is towards this body bending; Damper element is in the time of bending, and the other end of kink bends towards body, again by body and kink one accommodation space inner bending in the same way, makes this body be resisted against this location division afterwards, and this kink supports this circuit board assemblies; Or this body is resisted against this circuit board assemblies, this kink supports this location division.
Beneficial effect of the present invention is; buffering packaging box is foldable is the electronics module towards frivolous, narrow limit and Rimless; and damper element is set in buffering packaging box; support on the circuit board assemblies of electronics module; in the middle of the processes such as transportation or movement; accept the pushing force of circuit board assemblies with damper element, and form elastomeric buffering effect, the stability of the circuit board assemblies of effectively protecting electronics module in transportation.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the schematic appearance of the first embodiment of the present invention;
Fig. 2 is the schematic top plan view of the first embodiment of the present invention;
Fig. 3 is the local schematic top plan view () of the first embodiment of the present invention;
Fig. 4 is the local schematic top plan view (two) of the first embodiment of the present invention;
Fig. 5 is the local appearance schematic diagram (three) of the first embodiment of the present invention;
Fig. 6 is the schematic top plan view that the present invention installs electronics module;
Fig. 7 is the partial enlarged drawing of Fig. 6 A-A part;
Fig. 8 is the partial schematic diagram () of Fig. 6 B part;
Fig. 9 is the partial schematic diagram (two) of Fig. 6 B part;
Figure 10 is the local schematic top plan view () of the second embodiment of the present invention;
Figure 11 is the local schematic top plan view (two) of the second embodiment of the present invention;
Figure 12 is the local schematic top plan view (three) of the second embodiment of the present invention;
Figure 13 is the local appearance schematic diagram of the third embodiment of the present invention;
Figure 14 is the local schematic top plan view of the third embodiment of the present invention;
Figure 15 is the local appearance schematic diagram of the fourth embodiment of the present invention.
Wherein, Reference numeral
1.......... buffering packaging box
3.......... lid
31.......... joint portion
32.......... support division
5.......... box body
51.......... side plate
511......... withstanding part
512......... the first withstanding part
513......... the second withstanding part
52.......... base plate
521......... positioning groove
522......... support portion
53.......... location division
54.......... accommodation space
55.......... fixed part
7.......... damper element
71.......... connecting portion
711......... the first side
712......... the second side
72.......... body
73.......... kink
74.......... top
75.......... elastic portion
76.......... elasticity support arm
9.......... electronics module
91.......... circuit board assemblies
The specific embodiment
Below in conjunction with the drawings and specific embodiments, technical solution of the present invention being described in detail, further to understand object of the present invention, scheme and effect, but is not the restriction as claims protection domain of the present invention.
Fig. 1, Fig. 2 and Fig. 3 are the first embodiment of the present invention.Fig. 1 is schematic appearance, and Fig. 2 is schematic top plan view, and Fig. 3 is local schematic top plan view (one).
As shown in Figures 1 and 2, in example of the present invention, buffering packaging box 1 comprises: lid 3, box body 5 and damper element 7, receive electronics module 9 with buffering packaging box 1, at this, electronics module 9 can be for example Liquid Crystal Display, LCD TV, or there is half-blank or other electronic product that integrated circuit and winding displacement are joined cloth in product, but not as limit.
One side of box body 5 is connected in a side of lid 3, at this to provide pivot joint mode to use, and box body 5 comprises multiple side plates 51, base plate 52 and location division 53, allow box body 5 be formed with accommodation space 54 by side plate 51 with base plate 52, accommodation space 54 is interior for putting electronics module 9, and cover accommodation space 54 and fixing storage electronics module 9 via lid 3, location division 53 is to be positioned on side plate 51, be described with the wall on side plate 51 in this location division 53, but not as limit, location division 53 can form in addition on any one side plate 51 or on base plate 52, and location division 53 is preferably to accommodation space 54 outstanding (as shown in Figure 5).In the present embodiment, lid 3, box body 5 and damper element 7 are integral type members, but not as limit, wherein, lid 3, box body 5 and damper element 7 also can be respectively individual member separately, in detail after described in.At this, the material of lid 3, box body 5 and damper element 7 is preferably selected polyethylene terephthalate (Polyethylene Terephthalate, be called for short PET), but not as limit, material can be high density polyethylene (HDPE) (High Density Polyethylene, be called for short HDPE) or polyvinylchloride (Polyvinylchloride, be called for short PVC) etc., preferably present with transparent form at this lid 3, box body 5 and damper element 7, but not as limit, for example mode translucent or that fill out any color of tool presents.
Refer to Fig. 6, Fig. 7, Fig. 8 and Fig. 9, for introducing the use state of buffering packaging box 1 and electronics module 9, above-mentioned electronics module 9 comprises circuit board assemblies 91, in the time that electronics module 9 is accommodated in the accommodation space 54 of buffering packaging box 1, circuit board assemblies 91 can support on the body 72 of damper element 7, when in the process of transportation, body 72 is subject to the pushing force of circuit board assemblies 91, can form elastomeric towards kink 73 beats, be able to the pushing force of buffer circuit board component 91 and other position (as panel or framework), and, telltale is more frivolous at present, each non-display part is all towards frivolous, the design of narrow limit and Rimless, make the transmission flat cable distance between circuit card and circuit card more and more nearer, and the edge between circuit card distance and panel is more and more in convergence situation, be conducive to guarantee in transportation its safety by buffering packaging box 1 of the present invention, and, utilize the structure design of damper element 7, can cushion and adjust any position supports, further in the safety that is used for fixing and protects electronics module 9 in transportation, also the telltale of applicable more narrow limit and Rimless uses.
In addition, as shown in Fig. 1, Fig. 6 and Fig. 7, lid 3 comprises joint portion 31, and box body 5 comprises fixed part 55, and wherein, fixed part 55 is embedded in joint portion 31 and with close-fitting combination location lid 3 and box body 5.In addition, lid 3 comprises support division 32, is to cover on the connecting portion 71 that accommodation space 54 supports damper element 7 in lid 3 at the support division 32 of this embodiment, and, box body 5 more comprises positioning groove 521, is to be positioned at base plate 52 at this positioning groove 521, but positioning groove 521 also can be on side plate 51 position.The damper element 7 of the present embodiment is embedded in positioning groove 521 and is positioned on base plate 52, and box body 5 more comprises multiple support portions 522, be positioned at base plate 52, be supported in the electronics module 9 in accommodation space 54, support portion 522 is concavo-convex staggered structures (as shown in Figure 1) with base plate 52 simultaneously, there is the function of buffer protection electronics module 9, and box body 5 more comprises multiple withstanding parts 511, be positioned on one of them side plate 51, can hold the electronics module 9 that is positioned at accommodation space 54, comprise the first withstanding part 512 and the second withstanding part 513 at this withstanding part 511, the first withstanding part 512 is positioned on the side plate 51 that connects lid 3, the second withstanding part 513 is positioned on the side plate 51 of two sides.
Refer to shown in Figure 10, Figure 11 and Figure 12, for the second embodiment of the present invention, the present embodiment and the first embodiment maximum differential are: the body 72 of the damper element 7 of the present embodiment is to be connected in the second side 712 of connecting portion 71, and connecting portion 71 is to be connected on the side plate 51 that is different from the first embodiment, form different overbending directions, also can damper element 7 is positioned on location division 53 and support circuit board assemblies 91.
Refer to shown in Figure 13 and Figure 14, for the third embodiment of the present invention, the present embodiment and the first embodiment maximum differential are: the damper element 7 of the present embodiment is to adopt separate design with box body 5, and, damper element 7 comprises outstanding elastic portion 75, is positioned on location division 53 and supports circuit board assemblies 91, when elastic portion 75 is subject to pushing of circuit board assemblies 91 with this elastic portion 75, for being shifted towards the inner space of elastic portion 75 and possessing the effect of bounce-back, provide the effect of buffer circuit board component 91.
Refer to shown in Figure 15, for the fourth embodiment of the present invention, the present embodiment is with the first embodiment maximum differential: the damper element 7 of the present embodiment separates with box body 5, and damper element 7 is by extending the structure that bends out elasticity support arm 76 on body 72, be positioned on location division 53 and support circuit board assemblies 91 with this elasticity support arm 76, when elasticity support arm 76 is subject to pushing of circuit board assemblies 91, for being shifted towards the inner space of elasticity support arm 76 and possessing the effect of bounce-back, provide the effect of buffer circuit board component 91.
7 of the damper elements of above-mentioned the 3rd embodiment and the 4th embodiment are during as individual member, the available material of damper element 7 can be different from box body 5, the material of damper element 7 can be chosen as ABS resin or high density expanded polypropylene (Expanded Polypropylene is called for short EPP).
The present invention is by damper element is set in buffering packaging box; support on the circuit board assemblies of electronics module; in the middle of the processes such as transportation or movement; accept the pushing force of circuit board assemblies with damper element; and form elastomeric buffering effect, the stability of the circuit board assemblies of effectively protecting electronics module in transportation.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (9)
1. a buffering packaging box, in order to receive an electronics module, this electronics module has the circuit board assemblies exposing, and it is characterized in that, and this buffering packaging box comprises:
One lid;
One box body, one side is connected in this lid, comprise multiple side plates, a base plate and a location division, those side plates are connected and form an accommodation space with this base plate, cover this accommodation space and receive this electronics module via this lid, this position point is given prominence on this base plate or one of them this side plate and to this accommodation space; And
One damper element, one end is connected in the outside wall surface of one of them this side plate, is resisted against this location division towards this accommodation space bending;
Wherein, this damper element comprises:
A junction, is connected in the outside wall surface of one of them this side plate;
One body, is connected in this connecting portion; And
One kink, one end is connected in this body, and the other end is towards this body bending;
Damper element is in the time of bending, and the other end of kink bends towards body, again by body and kink one accommodation space inner bending in the same way, makes this body be resisted against this location division afterwards, and this kink supports this circuit board assemblies; Or this body is resisted against this circuit board assemblies, this kink supports this location division.
2. buffering packaging box as claimed in claim 1, is characterized in that, this lid comprises a joint portion, and this box body comprises a fixed part, is combined with this fixed part close-fitting and locates this lid and this box body in this joint portion.
3. buffering packaging box as claimed in claim 1, is characterized in that, this lid comprises a support division, supports this damper element in the time that this lid covers this accommodation space.
4. buffering packaging box as claimed in claim 1, is characterized in that, this box body more comprises a positioning groove, is positioned at this base plate, and this damper element is embedded in this positioning groove and is positioned on this base plate.
5. buffering packaging box as claimed in claim 1, is characterized in that, this box body more comprises multiple support portions, is positioned at this base plate, supports this electronics module that is positioned at this accommodation space.
6. buffering packaging box as claimed in claim 1, is characterized in that, this box body more comprises multiple withstanding parts, is positioned on one of them this side plate, holds this electronics module that is positioned at this accommodation space.
7. buffering packaging box as claimed in claim 1, is characterized in that, this damper element extends institute by one of them this side plate and forms.
8. buffering packaging box as claimed in claim 1, is characterized in that, this connecting portion comprises one first side and one second side that are connected, and this body is connected in this first side or this second side.
9. buffering packaging box as claimed in claim 1, is characterized in that, this damper element more comprises a top, supports this lid in the time that this lid covers this accommodation space.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101113311A TWI432367B (en) | 2012-04-13 | 2012-04-13 | Cushion package structure |
TW101113311 | 2012-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102745420A CN102745420A (en) | 2012-10-24 |
CN102745420B true CN102745420B (en) | 2014-05-21 |
Family
ID=47026013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210208156.XA Active CN102745420B (en) | 2012-04-13 | 2012-06-19 | Buffering packing box |
Country Status (2)
Country | Link |
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CN (1) | CN102745420B (en) |
TW (1) | TWI432367B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108922388A (en) * | 2018-06-11 | 2018-11-30 | 芜湖华特电子科技有限公司 | A kind of industrial display convenient for storage |
CN112978041A (en) * | 2021-01-29 | 2021-06-18 | 厦门三德信科技股份有限公司 | Packing carton of POL and OCA integration product |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI303618B (en) * | 2006-08-10 | 2008-12-01 | Gudeng Prec Industral Co Ltd | Metal photomask box |
US8474618B2 (en) * | 2007-04-30 | 2013-07-02 | Menasha Corporation | Single glass sheet package with suction cups |
JP5227827B2 (en) * | 2009-02-16 | 2013-07-03 | 積水化成品工業株式会社 | Glass substrate container |
CN101717014B (en) * | 2009-12-23 | 2012-04-18 | 友达光电股份有限公司 | Packing box structure |
CN201694533U (en) * | 2010-03-23 | 2011-01-05 | 鸿富锦精密工业(深圳)有限公司 | Packaging box and plate for producing same |
CN101920816B (en) * | 2010-08-24 | 2012-04-18 | 友达光电股份有限公司 | Packing buffer unit |
TWI406797B (en) * | 2010-12-28 | 2013-09-01 | Au Optronics Corp | Packing system for plate-shaped materials and holding tray thereof |
-
2012
- 2012-04-13 TW TW101113311A patent/TWI432367B/en active
- 2012-06-19 CN CN201210208156.XA patent/CN102745420B/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201341278A (en) | 2013-10-16 |
TWI432367B (en) | 2014-04-01 |
CN102745420A (en) | 2012-10-24 |
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