TW201603917A - 藉由加壓燒結以連接組件之方法 - Google Patents

藉由加壓燒結以連接組件之方法 Download PDF

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Publication number
TW201603917A
TW201603917A TW104114192A TW104114192A TW201603917A TW 201603917 A TW201603917 A TW 201603917A TW 104114192 A TW104114192 A TW 104114192A TW 104114192 A TW104114192 A TW 104114192A TW 201603917 A TW201603917 A TW 201603917A
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Taiwan
Prior art keywords
metal
metal oxide
components
sintered
sintering
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TW104114192A
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English (en)
Inventor
麥克 沙佛
渥夫岡 史密特
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賀利氏德國有限責任兩合公司
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Publication of TW201603917A publication Critical patent/TW201603917A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/1003—Use of special medium during sintering, e.g. sintering aid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
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    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
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Abstract

本發明係關於一種連接組件之方法，其中提供各自包含至少一個金屬接觸面之至少兩個組件及在該等組件之間配置的呈具有金屬氧化物表面之金屬固體形式的金屬燒結劑之配置，且該配置經加壓燒結，從而該金屬燒結劑之金屬氧化物表面及該等組件之該等金屬接觸面各自形成接合接觸面，且從而(I)該加壓燒結在含有至少一種可氧化化合物之氛圍中進行及/或(II)該等金屬氧化物表面在形成相應接合接觸面之前具備至少一種可氧化有機化合物。

Description

藉由加壓燒結以連接組件之方法
本發明係關於一種藉由加壓燒結以連接組件之方法，其涉及具有金屬氧化物表面之金屬燒結劑之用途。
下文中提及之金屬氧化物表面或金屬氧化物層各為外部或外向金屬氧化物表面或金屬氧化物層。關於下文中揭示之金屬燒結劑，此尤其亦可涉及一種覆蓋其整個外表面且因此為外向之金屬氧化物表面或金屬氧化物層。
US 2010/0195292 A1揭示具有具備外部氧化銀層之銀電極之電子組件。氧化銀層可藉由燒結電子組件用於直接連接至待與其連接之表面上，從而將氧化銀還原成銀。
US 2008/160183 A1揭示一種燒結連接方法，其中使用可燒結入導電層中且包含有機塗佈金屬粒子及氧化銀粒子之組合物在待連接之表面之間產生燒結連接件。仍可燒結之組合物可以油墨、漿料之塗覆形式或以層狀顆粒形式之燒結預形體存在。
EP 0 579 911 A2揭示一種生產基於銅之漿液澆鑄各向同性複合材料之方法。在此情形下，將混合漿液澆鑄至適合基板上，燃燒，燒結且經由冷軋及回火步驟處理成粗帶。該等複合材料可用於製造電子組件。
藉由塗覆及乾燥而由其產生之金屬燒結漿料或可燒結的燒結物預形體用於附接及電接觸電子組件(諸如半導體晶片)及用於自電子組件 散熱之用途在電子工業中為已知的。相應地，該等金屬燒結漿料及銀預形體描述於例如Journal of ELECTRONIC MATERIALS(DOI：10.1007/s11664-013-2967-3)之2014年1月17日之作者為KIM S.SIOW的在線出版物「Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging？」中。關於金屬燒結漿料之專利文獻之實例包括WO2011/026623A1、EP2425920A1、EP2428293A1及EP2572814A1。通常，該等金屬燒結漿料藉由印刷(例如網版或模板印刷)塗覆至支撐基板上，乾燥(若需要)，與電子組件組態，且隨後經受燒結過程。在不經由液態轉變之情況下，金屬粒子在燒結過程期間藉由擴散連接，同時在基板與電子組件之間形成固體、導電且導熱的金屬連接件。
然而，如本申請人能夠確定，無需或無需直接使用金屬燒結漿料可實現組件之間的附接，同時形成燒結連接件。出人意料地，可使用具有金屬氧化物表面之金屬燒結劑而非金屬燒結漿料。
本發明係關於一種連接組件之方法，其中提供各自包含至少一個金屬接觸面之至少兩個組件及在組件之間配置的呈具有金屬氧化物表面之金屬固體形式之金屬燒結劑的配置，且該配置經加壓燒結，從而金屬燒結劑之金屬氧化物表面及組件之金屬接觸面各自形成接合接觸面，且從而(I)加壓燒結在含有至少一種可氧化化合物之氛圍中進行及/或(II)金屬氧化物表面在形成相應接合接觸面之前具備至少一種可氧化有機化合物。
本文中所使用之措辭「從而金屬燒結劑之金屬氧化物表面及組件之金屬接觸面各自形成接合接觸面」明確意謂包括其中僅金屬燒結劑之金屬氧化物表面之表面部分及組件之金屬接觸面形成接合接觸面之情況。
因此，根據本發明之方法之實施例(I)包含以下步驟： (i)提供各自具有金屬接觸面之至少兩個組件，及呈具有金屬氧化物表面之金屬固體形式之金屬燒結劑；(ii)提供至少兩個組件及配置於其間的金屬燒結劑之配置，同時自金屬燒結劑之各別金屬氧化物表面及相應組件之金屬接觸面形成接合接觸面；及(iii)在含有至少一種可氧化化合物之氛圍中加壓燒結該配置。
相比而言，根據本發明之方法之實施例(II)包含以下步驟：(i)提供各自具有金屬接觸面之至少兩個組件，及呈具有金屬氧化物表面之金屬固體形式之金屬燒結劑；(ii)提供具有至少一種可氧化有機化合物之金屬氧化物表面；(ii)提供至少兩個組件及配置於其間的金屬燒結劑之配置，同時自具備至少一種可氧化有機化合物之金屬燒結劑之相應金屬氧化物表面及相應組件之金屬接觸面形成接合接觸面；及(iv)加壓燒結該配置。
組合實施例(I)與實施例(II)為可行的。
在根據本發明之方法中，至少兩個組件彼此連接。在此情形下，提供各自包含金屬接觸面之至少兩個組件及在該等組件之間配置的呈具有金屬氧化物表面之金屬固體形式之金屬燒結劑之配置，且該配置藉由施加機械壓力及高溫以熟習此項技術者已知之常用方式經燒結。
連接至少兩個組件應理解為意謂將第一組件附接在第二組件上。在本發明之範疇中，「在……上」應理解為簡單地意謂藉助於呈具有金屬氧化物表面之金屬固體形式之金屬燒結劑將第一組件之金屬接觸面連接至第二組件之金屬接觸面，從而組件或包含該等組件之配置之相對位置為不相關的。
在本發明之範疇中，術語組件較佳包含單個部件。較佳地，該等單個部件無法經進一步拆卸。
根據特定實施例，術語組件係指用於電子器件之部件。因此，組件可例如為主動組件(例如，半導體晶片，諸如LED、二極體、IGBT、閘流體、MOSFET、電晶體、IC)；被動組件(例如，DCB、引線框、電阻器、電容器、線圈、電感器、憶阻器、夾片、冷卻體)；壓電陶瓷；及珀爾貼元件(Peltier element)。
待連接之組件可為相同或不同組件。
組件各自具有一個金屬接觸面，從而金屬接觸面之金屬可為純金屬或金屬合金。合金包含例如>50wt.%百分率之相應金屬。
待連接之組件之金屬接觸面之金屬可相同或不同。較佳地，其選自由銀、銅、鈀及該等金屬之合金組成之群。銀及銀合金作為金屬接觸面之金屬為尤佳的。
組件可由金屬組成或其金屬接觸面可以例如金屬化形式存在。此可涉及例如自金屬燒結製備物藉由氣相沈積、化學電鍍(chemical galvanisation)、電鍍或塗覆及後續燒結產生之金屬化。上文所提及之金屬燒結漿料為金屬燒結製備物之實例。
在組件無論如何不由該金屬組成之情況下，金屬接觸面之厚度可為100nm至200μm。
如金屬燒結劑，待連接之一個組件或所有組件之金屬接觸面亦可包含金屬氧化物層。該金屬氧化物層之金屬氧化物可尤其為相應金屬接觸面之金屬的氧化物。
金屬燒結劑為具有金屬氧化物表面，亦即具有各自呈金屬氧化物層形式之總表面或多個離散表面的金屬固體。因此，金屬燒結劑為離散金屬固體，亦即以自由形式及/或以單一獨立部件提供其。具體言之，金屬燒結劑以平坦或層狀金屬部件形狀存在，亦即以包含該等金屬氧化物表面之離散及/或自由金屬層之形式存在。平坦或層狀金屬部件之厚度或層厚度在例如10μm至300μm範圍內。
金屬燒結劑之金屬可為純金屬或金屬合金。合金包含例如>50wt.%百分率之各別金屬。較佳地，金屬燒結劑之金屬選自由銀、銅、鈀及該等金屬之合金組成之群。銀及銀合金作為金屬為尤佳的。
金屬燒結劑同樣可僅為具備由相同或不同金屬製成之外部層(亦即具備外部金屬化)之金屬部件。在此情形下，外部金屬化可例如自金屬燒結製備物藉由氣相沈積、化學電鍍、電鍍或塗覆及後續燒結產生。上文所提及之金屬燒結漿料為可在此情形下使用之金屬燒結製備物之實例。
在一個實施例中，金屬燒結劑為層狀金屬燒結體，亦即呈層形式之燒結金屬結構，換言之無法再經原樣燒結之金屬結構。此類型之燒結金屬結構尤其包含無金屬氧化物，亦即除上文所提及之外部金屬氧化物表面外，其物質中無金屬氧化物。此類型之燒結層狀金屬燒結體不應誤認為上文所提及之仍可燒結之燒結預形體中之一者。呈層狀金屬燒結體形狀之金屬燒結劑可藉由以下產生：將金屬燒結製備物塗覆(例如藉助於網版印刷、模板印刷或噴塗)至具有不能形成燒結連接件之表面的支撐基板上，之後燒結由此塗覆之金屬燒結製備物，同時施加或較佳不施加機械壓力，之後使由此由支撐基板之表面形成之層狀金屬燒結體脫離。若在此生產步驟順序(例如，藉助於常壓氧化)之後無或僅不充足的金屬氧化物層產生於層狀金屬燒結體之表面上，則出於在層狀金屬燒結體之整個外表面或部分外表面上產生或強化金屬氧化物層之目的，可添加下游氧化步驟。如下文所說明之氧化方法可用於此情形。
上文所提及之金屬燒結漿料為可在產生此類型之層狀金屬燒結體中使用之金屬燒結製備物之實例。
用於產生層狀金屬燒結體之具有不能形成燒結連接件之表面的適合支撐基板包括例如氧化鋁陶瓷、鎳箔、聚醯亞胺膜、聚四氟乙烯膜 及聚矽氧膜。在此情形下，不管材料之選擇，選擇具有無孔及充分光滑表面之平面支撐基板對於熟習此項技術者為顯而易見的。
金屬燒結製備物之塗覆，例如網版印刷、模板印刷或噴塗以及燒結程序為熟習此項技術者熟知，且不存在方法相關特殊性，使得無需詳細描述且在此情形下出於例示性目的應參考上文所引用之文獻。同樣，自具有不能形成燒結連接件之表面的支撐基板脫離無難度，因為由此形成之層狀金屬燒結體基本上在燒結過程期間自身脫離。
金屬燒結劑(尤其呈層狀金屬燒結體形式)可以由根據本發明之方法之操作器所需之格式產生，以使得在該操作器之駐地處不產生呈碎片形式之廢料。亦可有利地將金屬燒結劑(尤其呈層狀金屬燒結體形式)製成環狀器皿，且將其遞送至方法之操作器上，例如仍位於支撐基板上或已自支撐基板脫離。環狀器皿可具備易於使用及根據說明書藉由方法之操作器使用之預定斷裂位點，例如穿孔。在環狀器皿之情況下，卷式物品為較佳遞送形式。
在任何情況下，金屬燒結劑包含該等金屬氧化物表面，其可各自與組件之金屬接觸面形成接合接觸面。在此情形下，能夠與組件之金屬接觸面形成接合接觸面之金屬氧化物表面可以離散金屬氧化物表面形式存在，亦即彼此分隔。然而，其同樣僅可以覆蓋金屬燒結劑之部分或全部表面之連續金屬氧化物層形式存在。參考呈平坦或層狀金屬部件形狀之金屬燒結劑，金屬氧化物表面較佳位於其前側及後側，以使得根據本發明之方法中產生之配置具有夾層結構，亦即具有金屬燒結劑配置於組件間的配置之組件隨後位於金屬燒結劑之相對側。
金屬燒結劑之金屬氧化物層或離散金屬氧化物表面之金屬氧化物可尤其為金屬燒結劑之金屬的氧化物或金屬燒結劑之外部金屬化之金屬的氧化物。外部或外向金屬氧化物層牢固連接至位於下方之金屬。該層之厚度可為例如0.02μm至6μm。其可藉由氧化，特定言之藉由 相應金屬與空氣接觸後之氧化形成，或其可藉助於氧化劑或藉由不氧化、尚未氧化、僅少量氧化或大體上氧化之金屬表面之陽極氧化以化學方式產生或強化。如前述句子中所指示，金屬氧化物之預先存在薄層可例如藉助於陽極氧化而產生或強化。舉例而言，未氧化、部分氧化或最初氧化金屬表面可藉由陽極氧化而經氧化，直至形成例如0.03μm至5μm厚之金屬氧化物層。參考銀表面，層厚度為例如0.05μm至1μm之氧化銀層可藉由陽極氧化形成。
陽極氧化可例如藉由在適合的電解質水溶液中浸沒而配置成陽極且待於其表面上氧化之金屬燒結劑來實施。適合的電解質水溶液包括例如碳酸鈉、碳酸氫鈉、氫氧化鉀或氫氧化鈉之5wt.%至10wt.%水溶液。陽極氧化可在5伏至20伏範圍內之直流電壓下進行例如5秒至30秒。
在根據本發明之方法中，組件藉由加壓燒結藉助於在其間配置的呈具有金屬氧化物表面之金屬固體形式之金屬燒結劑彼此連接，亦即組件及位於其間之金屬燒結劑在組件及金屬燒結劑之金屬接觸面之金屬不轉變成液相之情況下藉由加熱及藉由施加機械壓力彼此連接。
在根據本發明之方法之實施例(I)中，加壓燒結在含有至少一種可氧化化合物之氛圍中進行。適合的可氧化化合物之實例包括一氧化碳、氫氣及甲酸。該氛圍可由至少一種可氧化及氣態化合物組成，或其可含有後者與惰性氣體(諸如尤其氮氣及/或氬氣)之組合。較佳地，該氛圍中可氧化化合物之百分率為1vol.%至30vol.%。
在根據本發明之方法之實施例(II)中，在形成接合接觸面之前，金屬燒結劑之金屬氧化物表面及一若至少兩個組件中之至少一者之金屬接觸面包含金屬氧化物層一較佳後者同樣具備至少一種有機化合物，亦即具有一種可氧化有機化合物或兩種或兩種以上可氧化有機化合物之混合物。
可氧化有機化合物較佳包含1至50個，更佳2至24個，甚至更佳6至24個且又更佳8至20個碳原子且具有至少一個官能基。
較佳使用游離脂肪酸、脂肪酸鹽或脂肪酸酯作為可氧化有機化合物。游離脂肪酸、脂肪酸鹽及脂肪酸酯較佳為非分支鏈的。另外，游離脂肪酸、脂肪酸鹽及脂肪酸酯較佳為飽和的。
較佳脂肪酸鹽包括銨鹽、單烷基銨鹽、二烷基銨鹽、三烷基銨鹽、鋁鹽、銅鹽、鋰鹽、鈉鹽及鉀鹽。
烷基酯，特定言之甲酯、乙酯、丙酯及丁酯為較佳酯。
根據一較佳實施例，游離脂肪酸、脂肪酸鹽或脂肪酸酯為具有8至24個，更佳8至18個碳原子之化合物。
較佳可氧化有機化合物包括辛酸(caprylic acid/octanoic acid)、癸酸(capric acid/decanoic acid)、月桂酸(十二烷酸)、肉豆蔻酸(十四烷酸)、棕櫚酸(十六烷酸)、珠光脂酸(十七烷酸)、硬脂酸(十八烷酸)、花生酸(二十酸/二十烷酸)、蘿酸(二十二烷酸)、二十四烷酸(lignoceric acid/tetracosanoic acid)以及相應酯及鹽。
尤佳可氧化有機化合物包括十二烷酸、十八烷酸、硬脂酸鋁、硬脂酸銅、硬脂酸鈉、硬脂酸鉀、棕櫚酸鈉及棕櫚酸鉀。
為提供相應的具有至少一種可氧化有機化合物之金屬氧化物層，可例如在無稀釋之情況下將可氧化有機化合物作為有效物質塗覆於金屬氧化物層之表面上，或可由水性製備物或由有機溶劑中之製備物塗覆，之後例如在15℃至50℃之目標溫度下乾燥10分鐘至60分鐘之乾燥時間段。關於塗覆模式，基本上無限制，例如可將金屬氧化物層浸入至少一種可氧化有機化合物之製備物中，或可將至少一種可氧化有機化合物之製備物噴塗或漆至金屬氧化物層上。水性製備物或基於有機溶劑之製備物可例如為至少一種可氧化有機化合物之1wt.%至20wt.%溶液、分散液或懸浮液。
至少一種可氧化有機化合物之質量與具備或待具備至少一種可氧化有機化合物之金屬氧化物層之表面積的比率為例如每平方公尺金屬氧化物表面0.0005g至10g至少一種可氧化有機化合物。熟習此項技術者將基於金屬氧化物層之厚度選擇此比率，亦即金屬氧化物層之厚度愈高，熟習此項技術者將選擇的至少一種可氧化有機化合物之質量與待具備至少一種可氧化有機化合物之金屬氧化物層之表面積的比率愈高。
對於產生接合接觸面，將組件各自藉由其金屬接觸面置放於具備至少一種可氧化有機化合物之金屬燒結劑之相應金屬氧化物表面上。在此情形下，金屬接觸面或其表面部分與相應金屬氧化物表面之重疊區界定接合接觸面。
最後，使至少兩個組件及位於其間的金屬燒結劑之配置經受加壓燒結過程，該金屬燒結劑包含具備至少一種可氧化有機化合物之金屬氧化物表面。
實際加壓燒結在例如200℃至280℃之目標溫度下進行，且製程壓力在例如1MPa至小於40MPa，較佳5MPa至20MPa之範圍內。燒結時間在例如1分鐘至5分鐘範圍內。
若程序專門遵循根據本發明之方法之實施例(II)，則加壓燒結可在不經受任何特殊限制之氛圍中進行，例外為該氛圍不同於實施例(I)中之主要氛圍。舉例而言，含氧氛圍或無氧氛圍可在實施例(II)中佔優勢。在本發明之範疇中，無氧氛圍應理解為意謂氧含量不超過500ppm，較佳不超過10ppm且甚至更佳不超過1ppm之氛圍，尤其惰性氣體氛圍，例如氮氣及/或氬氣之氛圍。
加壓燒結在適用於加壓燒結之習知設備中進行，其中可設定上文所提及之製程參數。
例示性實施例1
使用模板印刷，以100μm濕層厚度將尺寸為10×10mm2之銀燒結漿料(ASP 043-04P2，來自Heraeus Materials Technology)層塗覆至呈聚四氟乙烯膜形式之支撐基板上，隨後在循環風乾箱中在250℃目標溫度下將其燒結30min。
使用移液管謹慎地使燒結產物自支撐基板脫離，以獲得自由層狀銀燒結體。
將10wt.%碳酸鈉水溶液置放於不鏽鋼容器中，且將不鏽鋼容器連接至10V直流電壓源之陰極。將電壓源之陽極連接至自由層狀銀燒結體，且隨後將後者浸沒於碳酸鈉溶液中持續30秒。
一旦將其取出，用去離子水沖洗由陽極氧化產生之自由層狀銀燒結體之塗黑表面，且隨後乾燥。隨後，將於Exxsol D60中之一滴2wt.%月桂酸溶液均勻分佈地置放於氧化銀表面之前側及後側，且在70℃下在循環空氣加熱箱中乾燥。隨後，在相應DCB基板之金表面與尺寸為10×10mm2之IGBT銀接觸面之間接合由此具備月桂酸之銀燒結體，且在250℃目標溫度及20MPa機械壓力下在燒結加壓中燒結由此產生之夾層配置持續120秒。
例示性實施例2
將10wt.%碳酸鈉水溶液置放於不鏽鋼容器中，且將不鏽鋼容器連接至10V直流電壓源之陰極。將電壓源之陽極連接至來自Sehlenk Metallfolien之長度為3cm、寬度為3mm且厚度為0.1mm之銀帶上，且將後者浸沒於碳酸鈉溶液中持續30秒。
一旦將其取出，用去離子水沖洗由陽極氧化產生之塗黑銀表面，且乾燥銀帶。隨後，將陽極氧化銀帶浸沒於在Exxsol D60中之2wt.%月桂酸溶液中，將其取出後在70℃下在循環風乾箱中乾燥。隨後，在銅引線框之鍍銀接觸面與尺寸為2×2mm2之Si晶片之銀接觸面之間接合由此製備之銀帶，且在250℃目標溫度及20MPa機械壓力下在燒結 加壓中燒結由此產生之夾層配置持續120秒。
燒結之後，藉由測試剪切強度來測定黏結。在此情形下，在20℃下用剪切鏨以0.3mm/s速率剪斷組件。藉助於測力計(由DAGE,Germany製造之DAGE 2000裝置)量測力。表1展示實例1至實例2所獲得之結果。

Claims (18)

  1. 一種連接組件之方法，其中提供各自包含至少一個金屬接觸面之至少兩個組件及在該等組件之間配置的呈具有金屬氧化物表面之金屬固體形式的金屬燒結劑之配置，且該配置經加壓燒結，從而該金屬燒結劑之金屬氧化物表面及該等組件之該等金屬接觸面各自形成接合接觸面，且從而(I)該加壓燒結在含有至少一種可氧化化合物之氛圍中進行，及/或(II)該等金屬氧化物表面在形成相應接合接觸面之前具備至少一種可氧化有機化合物。
  2. 如請求項1之方法，其中該金屬固體為厚度或層厚度在10μm至300μm範圍內之平坦或層狀金屬部件。
  3. 如請求項1或2之方法，其中該金屬燒結劑之金屬選自由銀、銅、鈀及該等金屬之合金組成之群。
  4. 如請求項3之方法，其中該金屬部件為層狀金屬燒結體，其可經由包含以下步驟之方法獲得：(1)將金屬燒結製備物塗覆至具有不能形成燒結連接件之表面的支撐基板上；(2)燒結由此塗覆之該金屬燒結製備物；(3)自該支撐基板之該表面使步驟(2)中形成之該層狀金屬燒結體脫離；及(4)若可適用，則在步驟(3)之後的氧化步驟過程中在該層狀金屬燒結體之全部或部分外表面上產生或強化金屬氧化物層。
  5. 如請求項4之方法，其中具有不能形成燒結連接件之表面的該支撐基板選自由氧化鋁陶瓷、鎳箔、聚醯亞胺膜、聚四氟乙烯膜及聚矽氧膜組成之群。
  6. 如請求項1或2之方法，其中該金屬燒結劑包含前側及後側，金屬氧化物表面位於其中之每一者上。
  7. 如請求項1或2之方法，其中該金屬氧化物為該金屬燒結劑之該金屬之氧化物或該金屬燒結劑之外部金屬化之該金屬的氧化物。
  8. 如請求項1或2之方法，其中該金屬氧化物層或金屬氧化物表面藉由與空氣接觸形成，或藉助於氧化劑或藉由陽極氧化以化學方式產生或強化。
  9. 如請求項1或2之方法，其中該等組件為用於電子器件之部件。
  10. 如請求項1或2之方法，其中待連接之該等組件之該等金屬接觸面之金屬相同或不同，且選自由銀、銅、鈀及該等金屬之合金組成之群。
  11. 如請求項1或2之方法，其中該等至少兩個組件中之至少一者之該金屬接觸面包含金屬氧化物層。
  12. 如請求項11之方法，其中該等至少兩個組件中之至少一者之該金屬氧化物層在形成該接合接觸面之前具備至少一種可氧化有機化合物。
  13. 如請求項12之方法，其中該至少一種可氧化有機化合物包含1至50個碳原子且具有至少一個官能基。
  14. 如請求項12之方法，其中該至少一種可氧化有機化合物之質量與相應金屬氧化物層之表面積之比率為每平方公尺金屬氧化物表面0.0005g至10g。
  15. 如請求項12之方法，其中該至少一種可氧化有機化合物選自游離脂肪酸、脂肪酸鹽及脂肪酸酯。
  16. 如請求項12之方法，其中自水性製備物或自有機溶劑中之製備物將該至少一種可氧化有機化合物塗覆於該金屬氧化物層上。
  17. 如請求項16之方法，其中該製備物為溶液、分散液或懸浮液。
  18. 一種組件之連接件，其根據如請求項1至17中之方法產生。
TW104114192A 2014-07-28 2015-05-04 藉由加壓燒結以連接組件之方法 TW201603917A (zh)

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