TW201600563A - Imide resin film production system and imide resin film production method - Google Patents

Imide resin film production system and imide resin film production method Download PDF

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TW201600563A
TW201600563A TW104117955A TW104117955A TW201600563A TW 201600563 A TW201600563 A TW 201600563A TW 104117955 A TW104117955 A TW 104117955A TW 104117955 A TW104117955 A TW 104117955A TW 201600563 A TW201600563 A TW 201600563A
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film
unit
resin film
roller
liquid
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TW104117955A
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TWI701292B (en
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Yoshitsugu Kawamura
Hideyuki Mizuki
Shinya Sugiyama
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Tokyo Ohka Kogyo Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/24Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/26Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/403Manufacturing processes of separators, membranes or diaphragms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/411Organic material
    • H01M50/414Synthetic resins, e.g. thermoplastics or thermosetting resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • H01M50/491Porosity
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Cell Separators (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

The present invention efficiently produces a high-quality imide resin film with outstanding porosity. This imide resin film production system comprises: a film-forming unit (70) which fires an unfired film (FA) containing polyamic acid, polyimide, polyamide-imide, or polyamide resin material (A1) and microparticles (A2), and removes the microparticles (A2) from the fired film (FB) to form a porous resin film (F); and a chemical etching unit (40) which dissolves part of the porous resin film (F).

Description

醯亞胺系樹脂膜製造系統及醯亞胺系樹脂膜製造方法 Bismuth amide resin film production system and yttrium amide resin film production method

本發明係有關醯亞胺系樹脂膜製造系統及醯亞胺系樹脂膜製造方法。 The present invention relates to a ruthenium-based resin film production system and a method for producing a ruthenium-based resin film.

二次電池之一種的鋰離子電池係於被浸漬於電解液之正極與負極之間,配置分隔膜,形成藉由分隔膜防止正極與負極之間直接電接觸的構造。正極使用鋰過渡金屬氧化物,負極使用例如鋰或碳(石墨)等。充電時,鋰離子由正極通過分隔膜,往負極移動,放電時,鋰離子由負極通過分隔膜,往正極移動。這種分隔膜,近年則使用耐熱性高,且安全性高之多孔性聚醯亞胺膜所構成的分隔膜已為人知(例如參照專利文獻1等)。 A lithium ion battery of one type of secondary battery is provided between a positive electrode and a negative electrode which are immersed in an electrolytic solution, and a separator film is disposed to prevent direct electrical contact between the positive electrode and the negative electrode by a separator. A lithium transition metal oxide is used for the positive electrode, and for example, lithium or carbon (graphite) or the like is used for the negative electrode. During charging, lithium ions pass through the separator from the positive electrode and move toward the negative electrode. When discharging, lithium ions pass through the separator from the negative electrode and move toward the positive electrode. In the separator film, a separator film composed of a porous polyimide film having high heat resistance and high safety has been known in recent years (see, for example, Patent Document 1).

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕日本特開2011-111470號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-111470

〔發明概要〕 [Summary of the Invention]

但是以往之多孔性的聚醯亞胺膜,在多孔部之開孔率仍不足,有時會妨礙鋰離子之移動。因此,多孔性之聚醯亞胺膜作為分隔膜使用時,有電池之內部電阻變高的問題。又,不限於聚醯亞胺膜,而醯亞胺系樹脂膜也要求開孔率優異之高品質的多孔性膜。 However, in the conventional porous polyimide film, the opening ratio in the porous portion is still insufficient, which may hinder the movement of lithium ions. Therefore, when a porous polyimide film is used as a separator, there is a problem that the internal resistance of the battery becomes high. Further, the polyimide film is not limited to a polyimide film, and a high-quality porous film having an excellent open cell ratio is also required.

有鑑於以上的情形,本發明之目的係提供可有效率地製造開孔率優異之高品質的醯亞胺系樹脂膜的醯亞胺系樹脂膜製造系統及醯亞胺系樹脂膜製造方法。 In view of the above, an object of the present invention is to provide a ruthenium-based resin film production system and a method for producing a ruthenium-based resin film which can efficiently produce a high-quality quinone-based resin film having an excellent open cell ratio.

本發明之第1態樣之醯亞胺系樹脂膜製造系統,其係製造多孔性之醯亞胺系樹脂膜的製造系統,具備:由含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺、及微粒子之膜中,除去微粒子,形成多孔性之醯亞胺系樹脂膜的膜形成單元;及將醯亞胺系樹脂膜之一部分溶解的化學蝕刻單元。 A system for producing a bismuth imine resin film according to a first aspect of the present invention, which is a system for producing a porous bismuth amide resin film, comprising: a polyamid acid, a polyimine, and a polyamine A film forming unit that removes fine particles to form a porous bismuth imide resin film, and a chemical etching unit that partially dissolves the quinone imide resin film in the film of ruthenium, polyamine, and fine particles.

本發明之第2態樣之醯亞胺系樹脂膜製造方法,其係製造多孔性之醯亞胺系樹脂膜之製造方法,包含:由含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺、及微粒子之膜中,除去微粒子,形成多孔性之醯亞胺系樹脂膜者;及進行將醯亞胺系樹脂膜之一部分溶解之化學蝕刻處理。 A method for producing a ruthenium-based resin film according to a second aspect of the present invention, which is a method for producing a porous bismuth amide-based resin film, comprising: comprising polyamidamine, polyimine, and polyamine In the film of ruthenium, polyamine, and fine particles, the fine particles are removed to form a porous bismuth imide resin film; and a chemical etching treatment for partially dissolving one of the quinoneimide resin films is performed.

依據本發明之態樣時,可有效率地製造開孔率優異之高品質的醯亞胺系樹脂膜。 According to the aspect of the invention, it is possible to efficiently produce a high-quality quinone imide resin film having an excellent open cell ratio.

SYS、SYS2‧‧‧製造系統 SYS, SYS2‧‧‧ Manufacturing System

F‧‧‧多孔性樹脂膜(醯亞胺系樹脂膜) F‧‧‧Porous resin film (醯iamine resin film)

FA‧‧‧未燒成膜 FA‧‧‧Unfired film

FB‧‧‧燒成膜 FB‧‧‧Boiled film

S‧‧‧搬送基材(基材) S‧‧‧Transporting substrate (substrate)

Q1‧‧‧第1塗佈液(液體) Q1‧‧‧1st coating liquid (liquid)

Q2‧‧‧第2塗佈液(液體) Q2‧‧‧Second coating liquid (liquid)

EQ‧‧‧蝕刻液 EQ‧‧‧etching solution

A1‧‧‧樹脂材料 A1‧‧‧Resin materials

A2‧‧‧微粒子 A2‧‧‧Microparticles

A4‧‧‧多孔部 A4‧‧‧Porous Department

10‧‧‧塗佈單元 10‧‧‧ Coating unit

20‧‧‧燒成單元 20‧‧‧burning unit

30、230‧‧‧除去單元 30, 230‧‧‧ removal unit

40、240‧‧‧化學蝕刻單元 40, 240‧‧‧ chemical etching unit

42‧‧‧搬送部 42‧‧‧Transportation Department

43‧‧‧化學蝕刻部 43‧‧‧Chemical Etching Department

47‧‧‧儲存部 47‧‧‧ Storage Department

70‧‧‧膜形成單元 70‧‧‧film forming unit

100‧‧‧分隔膜 100‧‧‧Separate film

200‧‧‧鋰離子電池 200‧‧‧Lithium-ion battery

〔圖1〕表示本發明之實施形態之製造系統之一例的圖。 Fig. 1 is a view showing an example of a manufacturing system according to an embodiment of the present invention.

〔圖2〕表示本實施形態之膜形成單元之一例的圖。 Fig. 2 is a view showing an example of a film forming unit of the embodiment.

〔圖3〕表示設置於本實施形態之塗佈單元之噴嘴之一例的圖。 Fig. 3 is a view showing an example of a nozzle provided in the coating unit of the embodiment.

〔圖4〕表示本實施形態之捲繞部之一例的斜視圖。 Fig. 4 is a perspective view showing an example of a winding portion of the embodiment.

〔圖5〕表示本實施形態之燒成單元之一例的斜視圖。 Fig. 5 is a perspective view showing an example of the firing unit of the embodiment.

〔圖6〕表示本實施形態之化學蝕刻單元之一例的斜視圖。 Fig. 6 is a perspective view showing an example of a chemical etching unit of the embodiment.

〔圖7〕以模式表示本實施形態之化學蝕刻單元之一例的圖。 Fig. 7 is a view showing an example of a chemical etching unit of the present embodiment in a mode.

〔圖8〕表示本實施形態之捲繞部之一例的斜視圖。 Fig. 8 is a perspective view showing an example of a winding portion of the embodiment.

〔圖9〕表示本實施形態之醯亞胺系樹脂膜之製造過程之一例的圖。 Fig. 9 is a view showing an example of a manufacturing process of the quinone-based resin film of the present embodiment.

〔圖10〕表示變形例之製造系統之一例的圖。 Fig. 10 is a view showing an example of a manufacturing system of a modification.

〔圖11〕表示變形例之捲繞裝置之一例的圖。 Fig. 11 is a view showing an example of a winding device according to a modification.

〔圖12〕表示實施形態之分隔膜之一例的圖。 Fig. 12 is a view showing an example of a separator film of the embodiment.

〔實施發明之形態〕 [Formation of the Invention]

以下參照圖面說明本發明之實施形態。以下使用XYZ座標系,說明圖中的方向。此XYZ座標系中,與水平面平行的平面作為XY平面。與此XY平面平行的一方向標記為X方向,與X方向正交之方向標記為Y方向。又,與XY平面垂直的方向標記為Z方向。X方向、Y方向及Z方向之各自在圖中之箭頭方向為+方向,與箭頭方向相反的方向為-方向者來說明。 Embodiments of the present invention will be described below with reference to the drawings. The following uses the XYZ coordinate system to illustrate the direction in the figure. In this XYZ coordinate system, a plane parallel to the horizontal plane serves as an XY plane. One direction parallel to the XY plane is marked in the X direction, and the direction orthogonal to the X direction is marked in the Y direction. Further, the direction perpendicular to the XY plane is marked as the Z direction. The direction of the arrow in the X direction, the Y direction, and the Z direction in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction.

圖1表示製造系統SYS之一例的圖。圖1所示之製造系統SYS係製造多孔性樹脂膜F(多孔性之醯亞胺系樹脂膜)者。製造系統SYS具備:塗佈特定之塗佈液,形成未燒成膜FA的塗佈單元10、將未燒成膜FA進行燒成形成燒成膜FB的燒成單元20、自燒成膜FB中除去微粒子,形成多孔性樹脂膜F的除去單元30、除去多孔性樹脂膜F之一部分的化學蝕刻單元40及統合控制上述各單元的控制裝置(無圖示)。又,塗佈單元10、燒成單元20及除去單元30係構成形成多孔性樹脂膜F之膜形成單元70。 Fig. 1 is a view showing an example of a manufacturing system SYS. The manufacturing system SYS shown in FIG. 1 is a porous resin film F (porous yttrium-based resin film). The manufacturing system SYS includes a coating unit 10 that applies a specific coating liquid to form an unfired film FA, and a firing unit 20 that fires the unfired film FA to form a fired film FB, and a self-fired film FB. The removal unit 30 for removing the fine particles, the chemical etching unit 40 for removing the porous resin film F, and the control device (not shown) for controlling the respective units described above are integrated. Further, the coating unit 10, the firing unit 20, and the removing unit 30 constitute a film forming unit 70 that forms the porous resin film F.

製造系統SYS例如於上下2階層所構成,塗佈單元10被配置於2階部分,燒成單元20、除去單元30及化學蝕刻單元40被配置於1階部分。配置於相同一階之燒成單元20、除去單元30及化學蝕刻單元40,例如在 Y方向排列配置,但是不限於此,例如也可於X方向或X方向與Y方向之合成方向排列配置。 The manufacturing system SYS is configured, for example, in the upper and lower layers, the coating unit 10 is disposed in the second-order portion, and the firing unit 20, the removing unit 30, and the chemical etching unit 40 are disposed in the first-order portion. The firing unit 20, the removing unit 30, and the chemical etching unit 40 disposed in the same first step, for example, Although they are arranged in the Y direction, they are not limited thereto. For example, they may be arranged in the X direction or in the combined direction of the X direction and the Y direction.

製造系統SYS之階層構造或各階之各單元的配置等,不限定於上述者,例如塗佈單元10及燒成單元20可配置於2階部分,除去單元30及化學蝕刻單元40可被置於1階部分。又,所有的單元也可配置於同一階。此時,各單元可一列配置或可以複數列配置。又,所有的單元也可配置於不同階層。 The hierarchical structure of the manufacturing system SYS or the arrangement of each unit of each step is not limited to the above. For example, the coating unit 10 and the firing unit 20 may be disposed in the second-order portion, and the removing unit 30 and the chemical etching unit 40 may be placed. 1st order part. Also, all units can be configured in the same order. At this time, each unit can be configured in one column or in multiple columns. Also, all units can be configured at different levels.

製造系統SYS中,未燒成膜FA形成帶狀。塗佈單元10之+Y側(未燒成膜FA之搬送方向的前方)設置將帶狀之未燒成膜FA捲繞成捲筒狀之捲繞部50。燒成單元20之-Y側(未燒成膜FA之搬送方向的後方)設置將捲筒狀之未燒成膜FA往燒成單元20送出之送出部60。化學蝕刻單元40之+Y側(多孔性樹脂膜F之搬送方向的前方)設置將多孔性樹脂膜F捲繞成捲筒狀的捲繞部80。 In the manufacturing system SYS, the unfired film FA is formed into a strip shape. The +Y side of the coating unit 10 (the front side in the conveyance direction of the unfired film FA) is provided with the winding portion 50 in which the strip-shaped unfired film FA is wound into a roll shape. The -Y side of the firing unit 20 (the rear side in the conveyance direction of the unfired film FA) is provided with the delivery part 60 which sent the roll-form unfired film FA to the baking unit 20. The +Y side of the chemical etching unit 40 (in front of the transport direction of the porous resin film F) is provided with a wound portion 80 in which the porous resin film F is wound into a roll shape.

如此,由送出部60經由燒成單元20、除去單元30及化學蝕刻單元40,至捲繞部80為止之區間(1階部分),係藉由所謂的捲對捲(roll-to-roll)方式來處理。因此,此區間係未燒成膜FA、燒成膜FB及多孔性樹脂膜F之各膜以連續狀態被搬送。 In this way, the section (first-order part) from the delivery unit 60 to the winding unit 80 via the firing unit 20, the removal unit 30, and the chemical etching unit 40 is by a so-called roll-to-roll. Way to handle. Therefore, in this section, each film of the unfired film FA, the fired film FB, and the porous resin film F is conveyed in a continuous state.

〔塗佈液〕 [coating liquid]

在此,說明各單元之前,針對成為多孔性樹脂膜F之 原料的塗佈液進行說明。塗佈液包含特定之樹脂材料、微粒子及溶劑。特定之樹脂材料,例如可列舉聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺、或聚醯胺。溶劑可使用可溶解此等之樹脂材料的有機溶劑。 Here, before the respective units are described, the porous resin film F is formed. The coating liquid of the raw material will be described. The coating liquid contains specific resin materials, fine particles, and a solvent. Specific resin materials include, for example, polyaminic acid, polyimine, polyamidimide, or polyamine. As the solvent, an organic solvent which can dissolve the resin materials can be used.

本實施形態中,塗佈液可使用微粒子之含有率不同之2種類的塗佈液(第1塗佈液及第2塗佈液)。具體而言,第1塗佈液係以微粒子之含有率高於第2塗佈液來調製。藉此,可擔保未燒成膜FA、燒成膜FB及多孔性樹脂膜F之強度及柔軟性。又,藉由設置微粒子之含有率較低的層,可達成降低多孔性樹脂膜F之製造成本。 In the present embodiment, two types of coating liquids (first coating liquid and second coating liquid) having different microparticle content ratios can be used as the coating liquid. Specifically, the first coating liquid is prepared such that the content ratio of the fine particles is higher than that of the second coating liquid. Thereby, the strength and flexibility of the unfired film FA, the fired film FB, and the porous resin film F can be secured. Moreover, by providing a layer having a low content of fine particles, it is possible to reduce the manufacturing cost of the porous resin film F.

例如,第1塗佈液中,以19:81~45:65之體積比含有樹脂材料與微粒子。又,第2塗佈液中,以20:80~50:50之體積比含有樹脂材料與微粒子。但是以第1塗佈液之微粒子之含有率高於第2塗佈液之微粒子之含有率,來設定體積比。各樹脂材料之體積係使用各樹脂材料之質量乘以其比重所得的值。 For example, in the first coating liquid, a resin material and fine particles are contained in a volume ratio of 19:81 to 45:65. Further, in the second coating liquid, a resin material and fine particles are contained in a volume ratio of 20:80 to 50:50. However, the volume ratio is set such that the content ratio of the fine particles in the first coating liquid is higher than the content ratio of the fine particles in the second coating liquid. The volume of each resin material is a value obtained by multiplying the mass of each resin material by its specific gravity.

上述的情形,將第1塗佈液之體積全體設定為100時,微粒子之體積為65以上時,粒子為均勻分散,又,微粒子之體積為81以內時,粒子彼此不會凝聚而分散。因此,多孔性樹脂膜F可均勻形成孔。又,微粒子之體積比率在此範圍內時,可確保未燒成膜FA成膜時之剝離性。 In the above case, when the volume of the first coating liquid is set to 100, the particles are uniformly dispersed when the volume of the fine particles is 65 or more, and when the volume of the fine particles is 81 or less, the particles are not aggregated and dispersed. Therefore, the porous resin film F can uniformly form pores. Further, when the volume ratio of the fine particles is within this range, the peeling property at the time of film formation of the unfired film FA can be ensured.

將第2塗佈液之體積全體設定為100時,微粒子之體積為50以上時,微粒子單體為均勻分散,又, 微粒子之體積為80以內時,微粒子彼此不會凝聚,又,表面也不會產生龜裂等,因此,可安定形成電特性良好的多孔性樹脂膜F。 When the entire volume of the second coating liquid is set to 100, when the volume of the fine particles is 50 or more, the fine particles are uniformly dispersed, and When the volume of the fine particles is within 80, the fine particles do not aggregate with each other, and cracks or the like are not formed on the surface. Therefore, the porous resin film F having good electrical properties can be stably formed.

上述2種類的塗佈液係例如藉由將預先分散有微粒子之溶劑與聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺以任意之比率混合來調製。又,也可在預先分散有微粒子之溶劑中,使聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺進行聚合來調製。例如可藉由在預先分散有微粒子之有機溶劑中,使四羧酸二酐及二胺進行聚合成為聚醯胺酸,或再進行醯亞胺化成為聚醯亞胺來製造。 The above two types of coating liquids are prepared, for example, by mixing a solvent in which fine particles are dispersed in advance with polyamine, polyimine, polyamidimide or polyamine at an arbitrary ratio. Further, it may be prepared by polymerizing polylysine, polyimine, polyamidimide or polyamine in a solvent in which fine particles are dispersed in advance. For example, it can be produced by polymerizing a tetracarboxylic dianhydride and a diamine into a polyphthalic acid in an organic solvent in which fine particles are dispersed in advance, or by further hydrazating to a polyimine.

塗佈液之黏度,最終較佳為300~2000cP,更佳為400~1500cP之範圍,又更佳為600~1200cP之範圍。塗佈液之黏度在此範圍內時,可均勻成膜。 The viscosity of the coating liquid is preferably from 300 to 2000 cP, more preferably from 400 to 1500 cP, and even more preferably from 600 to 1200 cP. When the viscosity of the coating liquid is within this range, the film can be uniformly formed.

上述塗佈液中,將微粒子與聚醯胺酸或聚醯亞胺進行乾燥作為未燒成膜FA時,微粒子之材質為後述無機材料時,以微粒子/聚醯亞胺之比率成為2~6(質量比),來混合微粒子與聚醯胺酸或聚醯亞胺即可。更佳為3~5(質量比)。微粒子之材質為後述有機材料時,以微粒子/聚醯亞胺之比率成為1~3.5(質量比),來混合微粒子與聚醯胺酸或聚醯亞胺即可。更佳為1.2~3(質量比)。又,作為未燒成膜FA時,以微粒子/聚醯亞胺之體積比率成為1.5~4.5,來混合微粒子與聚醯胺酸或聚醯亞胺即可。更佳為1.8~3(體積比)。作為未燒成膜FA時,微粒子/聚醯亞胺之質量比或體積比在下限值以上 時,分隔膜可得到適當密度的孔,在上限值以下時,不會產生黏度之增加或膜中之龜裂等之問題,可安定成膜。取代聚醯胺酸或聚醯亞胺,樹脂材料為聚醯胺醯亞胺或聚醯胺時,質量比也與上述同樣。 In the coating liquid, when the fine particles are dried with polyacrylic acid or polyimine as the unfired film FA, when the material of the fine particles is an inorganic material to be described later, the ratio of the fine particles/polyimine is 2 to 6 (mass ratio), it is sufficient to mix the fine particles with polyamic acid or polyimine. More preferably 3 to 5 (mass ratio). When the material of the microparticles is an organic material to be described later, the ratio of the fine particles to the polyimide may be 1 to 3.5 (mass ratio), and the fine particles may be mixed with polyacrylic acid or polyimine. More preferably 1.2 to 3 (mass ratio). In addition, when the FA is not fired, the volume ratio of the fine particles/polyimine is 1.5 to 4.5, and the fine particles may be mixed with polyamic acid or polyimine. More preferably, it is 1.8 to 3 (volume ratio). When the FA is not fired, the mass ratio or volume ratio of the fine particles/polyimine is above the lower limit value. In the case of the separator, a pore having an appropriate density can be obtained. When it is at most the upper limit value, there is no problem such as an increase in viscosity or cracking in the film, and the film formation can be stabilized. When the polyacetamide or the polyimine is substituted, and the resin material is polyamidamine or polyamine, the mass ratio is also the same as described above.

以下具體說明各樹脂材料。 Each resin material will be specifically described below.

<聚醯胺酸> <polylysine>

本實施形態所用的聚醯胺酸係使任意之四羧酸二酐與二胺聚合所得者,無特別限定皆可使用。四羧酸二酐及二胺之使用量並無特殊限定,相對於四羧酸二酐1莫耳,較佳為使用二胺0.50~1.50莫耳,更佳為使用0.60~1.30莫耳,特佳為使用0.70~1.20莫耳。 The polyamic acid used in the present embodiment is not particularly limited as long as it is obtained by polymerizing any of the tetracarboxylic dianhydride and the diamine. The amount of the tetracarboxylic dianhydride and the diamine to be used is not particularly limited, and is preferably from 0.50 to 1.50 moles, more preferably from 0.60 to 1.30 moles, per mole of the tetracarboxylic dianhydride. Jia uses 0.70~1.20 moules.

四羧酸二酐可適宜選擇自以往作為聚醯胺酸之合成原料使用的四羧酸二酐。四羧酸二酐可為芳香族四羧酸二酐、亦可為脂肪族四羧酸二酐,但是由所得之聚醯亞胺樹脂的耐熱性的觀點而言,較佳為使用芳香族四羧酸二酐。四羧酸二酐亦可組合2種以上使用。 The tetracarboxylic dianhydride can be suitably selected from tetracarboxylic dianhydride which has been conventionally used as a synthetic raw material of polyamic acid. The tetracarboxylic dianhydride may be an aromatic tetracarboxylic dianhydride or an aliphatic tetracarboxylic dianhydride, but from the viewpoint of heat resistance of the obtained polyamidene resin, aromatic four is preferably used. Carboxylic dianhydride. The tetracarboxylic dianhydride may be used in combination of two or more kinds.

芳香族四羧酸二酐之較佳的具體例,可列舉苯均四酸二酐、1,1-雙(2,3-二羧基苯基)乙烷二酐、雙(2,3-二羧基苯基)甲烷二酐、雙(3,4-二羧基苯基)甲烷二酐、3,3’,4,4’-聯苯基四羧酸二酐、2,3,3’,4’-聯苯基四羧酸二酐、2,2,6,6-聯苯基四羧酸二酐、2,2-雙(3,4-二羧基苯基)丙烷二酐、2,2-雙(2,3-二羧基苯基)丙烷二酐、2,2-雙(3,4-二羧基苯基)-1,1,1,3,3,3-六氟丙烷二酐、2,2-雙(2,3-二羧基苯基)-1,1,1,3,3,3-六氟丙烷二 酐、3,3’,4,4’-二苯甲酮四羧酸二酐、雙(3,4-二羧基苯基)醚二酐、雙(2,3-二羧基苯基)醚二酐、2,2’,3,3’-二苯甲酮四羧酸二酐、4,4-(p-伸苯基二氧)二鄰苯二甲酸二酐、4,4-(m-伸苯基二氧)二鄰苯二甲酸二酐、1,2,5,6-萘四羧酸二酐、1,4,5,8-萘四羧酸二酐、2,3,6,7-萘四羧酸二酐、1,2,3,4-苯四羧酸二酐、3,4,9,10-苝四羧酸二酐、2,3,6,7-蒽四羧酸二酐、1,2,7,8-菲四羧酸二酐、9,9-雙鄰苯二甲酸酐茀、3,3’,4,4’-二苯基碸四羧酸二酐等。脂肪族四羧酸二酐,可列舉例如乙烯四羧酸二酐、丁烷四羧酸二酐、環戊烷四羧酸二酐、環己烷四羧酸二酐、1,2,4,5-環己烷四羧酸二酐、1,2,3,4-環己烷四羧酸二酐等。此等之中,由價格、獲得容易性等而言,較佳為3,3’,4,4’-聯苯基四羧酸二酐及苯均四酸二酐。又,此等四羧酸二酐亦可單獨或混合二種以上使用。 Preferred specific examples of the aromatic tetracarboxylic dianhydride include pyromellitic dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, and bis(2,3-di). Carboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4 '-biphenyltetracarboxylic dianhydride, 2,2,6,6-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2 - bis(2,3-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane II Anhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, bis(2,3-dicarboxyphenyl)ether Anhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 4,4-(p-phenylenedioxy)diphthalic dianhydride, 4,4-(m- Phenyldioxy)diphthalic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6, 7-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-decanetetracarboxylic dianhydride, 2,3,6,7-decanetetracarboxylic acid Acid dianhydride, 1,2,7,8-phenanthrenetetracarboxylic dianhydride, 9,9-diphthalic anhydride oxime, 3,3',4,4'-diphenylphosphonium tetracarboxylic dianhydride Wait. Examples of the aliphatic tetracarboxylic dianhydride include ethylene tetracarboxylic dianhydride, butane tetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, cyclohexane tetracarboxylic dianhydride, 1, 2, 4, 5-cyclohexanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic dianhydride, and the like. Among these, 3,3',4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride are preferable in terms of price, availability, and the like. Further, these tetracarboxylic dianhydrides may be used singly or in combination of two or more.

二胺可適宜選擇自以往作為聚醯胺酸之合成原料使用的二胺。二胺可為芳香族二胺、亦可為脂肪族二胺,但是就所得之聚醯亞胺樹脂的耐熱性之觀點而言,較佳為芳香族二胺。此等二胺亦可組合2種以上使用。 The diamine can be suitably selected from the conventional diamine used as a synthetic raw material of polylysine. The diamine may be an aromatic diamine or an aliphatic diamine, but from the viewpoint of heat resistance of the obtained polyimine resin, an aromatic diamine is preferred. These diamines can also be used in combination of 2 or more types.

芳香族二胺,可列舉鍵結有1個或2~10個左右之苯基的二胺基化合物。具體而言為苯二胺及其衍生物、二胺基聯苯化合物及其衍生物、二胺基二苯化合物及其衍生物、二胺基三苯化合物及其衍生物、二胺基萘及其衍生物、胺基苯基胺基二氫茚(Indane)及其衍生物、二胺基四苯化合物及其衍生物、二胺基六苯化合物及其衍生 物、cardo型茀二胺衍生物。 The aromatic diamine may, for example, be a diamine compound having one or two to ten phenyl groups bonded thereto. Specifically, it is phenylenediamine and its derivatives, diaminobiphenyl compounds and derivatives thereof, diaminodiphenyl compounds and derivatives thereof, diaminotriphenyl compounds and derivatives thereof, diaminonaphthalenes and Its derivatives, aminophenylaminoindoline (Indane) and its derivatives, diaminotetraphenyl compounds and their derivatives, diamine hexabenzene compounds and their derivatives , cardo type quinone diamine derivative.

苯二胺為m-苯二胺、p-苯二胺等,苯二胺衍生物為鍵結有甲基、乙基等之烷基的二胺,例如2,4-二胺基甲苯、2,4-三苯二胺等。 The phenylenediamine is m-phenylenediamine, p-phenylenediamine or the like, and the phenylenediamine derivative is a diamine to which an alkyl group such as a methyl group or an ethyl group is bonded, for example, 2,4-diaminotoluene, 2 , 4-triphenyldiamine, and the like.

二胺基聯苯化合物係2個胺基苯基以苯基彼此間鍵結者。例如為4,4’-二胺基聯苯、4,4’-二胺基-2,2’-雙(三氟甲基)聯苯等。 The diaminobiphenyl compound is a group in which two aminophenyl groups are bonded to each other with a phenyl group. For example, it is 4,4'-diaminobiphenyl, 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl or the like.

二胺基二苯化合物係2個胺基苯基經由其他基,而以苯基彼此間鍵結者。鍵結為醚鍵、磺醯基鍵、硫醚鍵、以伸烷基或其衍生物基之鍵結、亞胺基鍵、偶氮鍵、氧化膦鍵、醯胺鍵、伸脲基鍵等。伸烷基鍵係碳數為1~6左右者,其衍生物基係伸烷基之1個以上之氫原子被鹵素原子等取代者。 The diaminodiphenyl compound is a group in which two aminophenyl groups are bonded to each other via a phenyl group. The bond is an ether bond, a sulfonyl bond, a thioether bond, a bond of an alkyl group or a derivative thereof, an imine bond, an azo bond, a phosphine oxide bond, a guanamine bond, a ureido bond, or the like. . When the alkyl group has a carbon number of about 1 to 6, the hydrogen atom of one or more of the alkyl groups of the derivative group is substituted by a halogen atom or the like.

二胺基二苯化合物之例,可列舉3,3’-二胺基二苯基醚、3,4’-二胺基二苯基醚、4,4’-二胺基二苯基醚、3,3’-二胺基二苯基碸、3,4’-二胺基二苯基碸、4,4’-二胺基二苯基碸、3,3’-二胺基二苯基甲烷、3,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基硫醚、3,3’-二胺基二苯基酮、3,4’-二胺基二苯基酮、2,2-雙(p-胺基苯基)丙烷、2,2’-雙(p-胺基苯基)六氟丙烷、4-甲基-2,4-雙(p-胺基苯基)-1-戊烯、4-甲基-2,4-雙(p-胺基苯基)-2-戊烯、亞胺基二苯胺、4-甲基-2,4-雙(p-胺基苯基)戊烷、雙(p-胺基苯基)氧化膦、4,4’-二胺基偶氮苯、4,4’-二胺基二苯基脲、4,4’-二胺基二苯基醯胺、1,4- 雙(4-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、4,4’-雙(4-胺基苯氧基)聯苯、雙〔4-(4-胺基苯氧基)苯基〕碸、雙〔4-(3-胺基苯氧基)苯基〕碸、2,2-雙〔4-(4-胺基苯氧基)苯基〕丙烷、2,2-雙〔4-(4-胺基苯氧基)苯基〕六氟丙烷等。 Examples of the diaminodiphenyl compound include 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, and 4,4'-diaminodiphenyl ether. 3,3'-diaminodiphenylanthracene, 3,4'-diaminodiphenylanthracene, 4,4'-diaminodiphenylanthracene, 3,3'-diaminodiphenyl Methane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide, 3,3'-diamine Diphenyl ketone, 3,4'-diaminodiphenyl ketone, 2,2-bis(p-aminophenyl)propane, 2,2'-bis(p-aminophenyl)hexafluoropropane , 4-methyl-2,4-bis(p-aminophenyl)-1-pentene, 4-methyl-2,4-bis(p-aminophenyl)-2-pentene, sub Aminodiphenylamine, 4-methyl-2,4-bis(p-aminophenyl)pentane, bis(p-aminophenyl)phosphine oxide, 4,4'-diaminoazobenzene, 4,4'-diaminodiphenylurea, 4,4'-diaminodiphenylguanamine, 1,4- Bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 4,4'-double (4-Aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]anthracene, bis[4-(3-aminophenoxy)phenyl]anthracene, 2, 2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, and the like.

此等之中,就價格、獲得容易性等而言,較佳為p-苯二胺、m-苯二胺、2,4-二胺基甲苯及4,4’-二胺基二苯基醚。 Among these, p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, and 4,4'-diaminodiphenyl are preferable in terms of price, availability, and the like. ether.

二胺基三苯化合物係2個胺基苯基與1個伸苯基均經由其他的基鍵結者,其他的基係選擇與二胺基二苯化合物相同者。二胺基三苯化合物之例,可列舉1,3-雙(m-胺基苯氧基)苯、1,3-雙(p-胺基苯氧基)苯、1,4-雙(p-胺基苯氧基)苯等。 The diaminotriphenyl compound is one in which two aminophenyl groups and one phenylene group are bonded via another group, and the other groups are selected to be the same as the diaminobiphenyl compound. Examples of the diaminotriphenyl compound include 1,3-bis(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy)benzene, and 1,4-bis(p). -Aminophenoxy)benzene and the like.

二胺基萘之例,可列舉1,5-二胺基萘及2,6-二胺基萘。 Examples of the diaminonaphthalenes include 1,5-diaminonaphthalene and 2,6-diaminonaphthalene.

胺基苯基胺基二氫茚之例,可列舉5或6-胺基-1-(p-胺基苯基)-1,3,3-三甲基二氫茚。 Examples of the aminophenylaminoindoline are 5 or 6-amino-1-(p-aminophenyl)-1,3,3-trimethylindoline.

二胺基四苯化合物之例,可列舉4,4’-雙(p-胺基苯氧基)聯苯、2,2’-雙〔p-(p’-胺基苯氧基)苯基〕丙烷、2,2’-雙〔p-(p’-胺基苯氧基)聯苯基〕丙烷、2,2’-雙〔p-(m-胺基苯氧基)苯基〕二苯甲酮等。 Examples of the diaminotetraphenyl compound include 4,4'-bis(p-aminophenoxy)biphenyl and 2,2'-bis[p-(p'-aminophenoxy)phenyl. Propane, 2,2'-bis[p-(p'-aminophenoxy)biphenyl]propane, 2,2'-bis[p-(m-aminophenoxy)phenyl] Benzophenone and the like.

cardo型茀二胺衍生物可列舉9,9-雙苯胺茀等。 The cardo type quinone diamine derivative may, for example, be 9,9-bisaniline oxime or the like.

脂肪族二胺例如可為碳數為2~15左右者,具 體而言可列舉五亞甲二胺、六亞甲二胺、七亞甲二胺等。 The aliphatic diamine may be, for example, a carbon number of 2 to 15 or so. Examples of the body include pentaethylenediamine, hexamethylenediamine, and heptylenediamine.

再者,亦可為此等二胺之氫原子被由鹵素原子、甲基、甲氧基、氰基、苯基等群中選擇之至少1種的取代基取代的化合物。 Further, a compound in which a hydrogen atom of the diamine is substituted with at least one substituent selected from the group consisting of a halogen atom, a methyl group, a methoxy group, a cyano group, and a phenyl group may also be used.

本實施形態所用之製造聚醯胺酸的手段並無特殊限制,例如可使用於有機溶劑中,使酸、二胺成分反應的方法等習知的手法。 The means for producing the polyamic acid used in the present embodiment is not particularly limited, and for example, a conventional method such as a method of allowing an acid or a diamine component to be used in an organic solvent can be used.

四羧酸二酐與二胺之反應,通常在有機溶劑中進行。四羧酸二酐與二胺之反應所使用之有機溶劑,只要可溶解四羧酸二酐及二胺,且不與四羧酸二酐及二胺反應者,則無特別限定。有機溶劑可單獨或混合2種以上使用。 The reaction of the tetracarboxylic dianhydride with the diamine is usually carried out in an organic solvent. The organic solvent used for the reaction between the tetracarboxylic dianhydride and the diamine is not particularly limited as long as it can dissolve the tetracarboxylic dianhydride and the diamine and does not react with the tetracarboxylic dianhydride or the diamine. The organic solvent may be used singly or in combination of two or more.

四羧酸二酐與二胺之反應所用的有機溶劑之例,可列舉N-甲基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二乙基乙醯胺、N,N-二甲基甲醯胺、N,N-二乙基甲醯胺、N-甲基己內醯胺、N,N,N’,N’-四甲基脲等之含氮極性溶劑;β-丙內酯、γ-丁內酯、γ-戊內酯、δ-戊內酯、γ-己內酯、ε-己內酯等之內酯系極性溶劑;二甲基亞碸;乙腈;乳酸乙酯、乳酸丁酯等之脂肪酸酯類;二乙二醇二甲基醚、二乙二醇二乙基醚、二噁烷、四氫呋喃、甲基賽珞蘇乙酸酯、乙基賽珞蘇乙酸酯等之醚類;甲酚類等之酚系溶劑。此等有機溶劑可單獨或混合2種以上使用。有機溶劑之使用量並無特別限定,但較佳為使生成之聚醯胺酸的含量為5~50質量%。 Examples of the organic solvent used for the reaction of the tetracarboxylic dianhydride and the diamine include N-methyl-2-pyrrolidone, N,N-dimethylacetamide, and N,N-diethylacetamidine. Amine, N,N-dimethylformamide, N,N-diethylformamide, N-methylcaprolactam, N,N,N',N'-tetramethylurea, etc. Nitrogen polar solvent; lactone-based polar solvent such as β-propiolactone, γ-butyrolactone, γ-valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone; dimethyl Acetone; acetonitrile; fatty acid esters such as ethyl lactate and butyl lactate; diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dioxane, tetrahydrofuran, methyl cyproterone acetate An ether such as ethyl acetaminophen; a phenolic solvent such as cresol. These organic solvents may be used alone or in combination of two or more. The amount of the organic solvent used is not particularly limited, but it is preferably such that the content of the produced polyamine is 5 to 50% by mass.

此等有機溶劑之中,就生成之聚醯胺酸的溶解性而言,較佳為N-甲基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二乙基乙醯胺、N,N-二甲基甲醯胺、N,N-二乙基甲醯胺、N-甲基己內醯胺、N,N,N’,N’-四甲基脲等之含氮極性溶劑。 Among these organic solvents, N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-di are preferable in terms of solubility of the produced polylysine. Ethyl acetamide, N,N-dimethylformamide, N,N-diethylformamide, N-methylcaprolactam, N,N,N',N'-tetramethyl A nitrogen-containing polar solvent such as urea.

聚合溫度一般為-10~120℃、較佳為5~30℃。聚合時間雖依所使用之原料組成而異,通常為3~24Hr(小時)。又,如此條件下所得到之聚醯胺酸之有機溶劑溶液的固有黏度,較佳為1000~10萬cP(百分泊)、又更佳為5000~7萬cP之範圍。 The polymerization temperature is usually -10 to 120 ° C, preferably 5 to 30 ° C. The polymerization time varies depending on the composition of the raw materials used, and is usually from 3 to 24 hours (hours). Further, the organic solvent solution of the polyamic acid obtained under such conditions preferably has an intrinsic viscosity of from 1,000 to 100,000 cP (percentage of poise) and more preferably from 5,000 to 70,000 cp.

<聚醯亞胺> <polyimine]

本實施形態所用之聚醯亞胺,只要可溶解塗佈液所使用之有機溶劑的可溶性聚醯亞胺,則其結構或分子量並無限定,可使用習知者。關於聚醯亞胺,亦可於側鏈具有羧基等之可縮合的官能基或於燒成時會促進交聯反應等之官能基。 The polyimine used in the present embodiment is not limited as long as it can dissolve the soluble polyimine of the organic solvent used in the coating liquid, and a conventional one can be used. The polyimine may have a condensable functional group such as a carboxyl group in the side chain or a functional group which promotes a crosslinking reaction or the like at the time of firing.

為了成為可溶於有機溶劑的聚醯亞胺,可使用於主鏈導入柔軟之彎曲構造用之單體,例如可使用乙二胺、六亞甲二胺、1,4-二胺基環己烷、1,3-二胺基環己烷、4,4’-二胺基二環己基甲烷等之脂肪族二胺;2-甲基-1,4-苯二胺、o-聯甲苯胺、m-聯甲苯胺、3,3’-二甲氧基聯苯胺、4,4’-二胺基苯甲醯苯胺等之芳香族二胺;聚氧乙烯二胺、聚氧丙烯二胺、聚氧丁烯二胺等之聚氧化烯二胺; 聚矽氧烷二胺;2,3,3’,4’-氧二鄰苯二甲酸酐、3,4,3’,4’-氧二鄰苯二甲酸酐、2,2-雙(4-羥基苯基)丙烷二苯甲酸酯-3,3’,4,4’-四羧酸二酐等。又,亦可使用具有提高對有機溶劑之溶解性的官能基之單體,例如可使用2,2’-雙(三氟甲基)-4,4’-二胺基聯苯、2-三氟甲基-1,4-苯二胺等之氟化二胺。此外,除了提高上述聚醯亞胺之溶解性用的單體外,於不阻礙溶解性之範圍內,可併用與上述聚醯胺酸之欄所記載者相同的單體。 In order to be a polyimine soluble in an organic solvent, a monomer for introducing a main chain into a soft curved structure can be used, for example, ethylenediamine, hexamethylenediamine, or 1,4-diaminocyclohexane can be used. An aliphatic diamine such as an alkane, a 1,3-diaminocyclohexane or a 4,4'-diaminodicyclohexylmethane; 2-methyl-1,4-phenylenediamine, o-tolidine An aromatic diamine such as m-tolidine, 3,3'-dimethoxybenzidine or 4,4'-diaminobenzimidamide; polyoxyethylene diamine, polyoxypropylene diamine, a polyoxyalkylene diamine such as polyoxybutylene diamine; Polyoxyalkylene diamine; 2,3,3',4'-oxydiphthalic anhydride, 3,4,3',4'-oxydiphthalic anhydride, 2,2-double (4 -Hydroxyphenyl)propane dibenzoate-3,3',4,4'-tetracarboxylic dianhydride or the like. Further, a monomer having a functional group for improving solubility in an organic solvent can also be used, and for example, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 2-three can be used. A fluorinated diamine such as fluoromethyl-1,4-phenylenediamine. Further, in addition to the monomer for improving the solubility of the above polyimine, the same monomer as described in the above column of polyamic acid may be used in combination insofar as the solubility is not inhibited.

本發明所用之製造可溶解於有機溶劑之聚醯亞胺的手段,並無特別限定,例如可使用將聚醯胺酸進行化學醯亞胺化或加熱醯亞胺化,使溶解於有機溶劑之方法等之習知手法。這種聚醯亞胺,可列舉脂肪族聚醯亞胺(全脂肪族聚醯亞胺)、芳香族聚醯亞胺等,較佳為芳香族聚醯亞胺。芳香族聚醯亞胺可為將具有如式(1)所示之重複單位的聚醯胺酸藉由熱或化學閉環反應而取得者、或將具有如式(2)所示之重複單位的聚醯亞胺溶解於溶劑者。式中Ar表示芳基。 The means for producing the polyimine which can be dissolved in the organic solvent used in the present invention is not particularly limited, and for example, polyacrylic acid can be chemically imidized or heated by imidization to dissolve in an organic solvent. Methods such as methods. Examples of the polyimine are aliphatic polyimine (all aliphatic polyimine), aromatic polyimine, and the like, and aromatic polyimine is preferred. The aromatic polyimine may be obtained by a thermal or chemical ring closure reaction of a polylysine having a repeating unit represented by the formula (1), or may have a repeating unit as shown in the formula (2). Polyimine dissolved in solvent. Wherein Ar represents an aryl group.

<聚醯胺醯亞胺> <polyamidoquinone imine>

本實施形態所使用的聚醯胺醯亞胺,只要是可溶解於塗佈液所使用之有機溶劑的可溶性聚醯胺醯亞胺,則不限制其構造或分子量,可使用習知者。關於聚醯胺醯亞胺,亦可於側鏈具有羧基等的可縮合的官能基或燒成時促進交聯反應等的官能基。 The polyamidoximine used in the present embodiment is not limited to its structure or molecular weight as long as it is a soluble polyamidoquinone which can be dissolved in an organic solvent used in the coating liquid, and a conventional one can be used. The polyamidoximine may have a condensable functional group such as a carboxyl group in the side chain or a functional group which promotes a crosslinking reaction or the like at the time of firing.

本實施形態所使用之聚醯胺醯亞胺,無特別限制地可使用使任意偏苯三甲酸酐與二異氰酸酯反應而得到者、或將藉由任意偏苯三甲酸酐的反應性衍生物與二胺之反應得到的前驅物聚合物進行醯亞胺化而得者。 The polyamidoximine used in the present embodiment can be obtained by reacting any trimellitic anhydride with a diisocyanate, or by using a reactive derivative of any trimellitic anhydride and a diamine, without particular limitation. The precursor polymer obtained by the reaction is obtained by ruthenium imidization.

上述任意的偏苯三甲酸酐或其反應性衍生物,可列舉例如偏苯三甲酸酐、偏苯三甲酸酐氯化物等的偏苯三甲酸酐鹵素化物、偏苯三甲酸酐酯等。 Examples of the above-mentioned trimellitic anhydride or a reactive derivative thereof include trimellitic anhydride halides such as trimellitic anhydride and trimellitic anhydride chloride, and trimellitic anhydride.

二異氰酸酯可列舉例如間伸苯基二異氰酸酯、p-伸苯基二異氰酸酯、4,4’-氧基雙(苯基異氰酸酯)、4,4’-二異氰酸酯二苯基甲烷、雙〔4-(4-異氰酸酯苯氧基)苯基〕碸、2,2’-雙〔4-(4-異氰酸酯苯氧基)苯基〕丙烷等。 Examples of the diisocyanate include meta-phenylene diisocyanate, p-phenylene diisocyanate, 4,4'-oxybis(phenyl isocyanate), 4,4'-diisocyanate diphenylmethane, and bis[4- (4-Isocyanate phenoxy)phenyl]anthracene, 2,2'-bis[4-(4-isocyanatephenoxy)phenyl]propane, and the like.

二胺可列舉與在前述聚醯胺酸之說明中所例示者相同者。 The diamine may be the same as those exemplified in the description of the above polyamic acid.

<聚醯胺> <polyamide>

聚醯胺較佳為由二羧酸與二胺所得之聚醯胺,特佳為芳香族聚醯胺。 The polyamine is preferably a polyamine obtained from a dicarboxylic acid and a diamine, and particularly preferably an aromatic polyamine.

二羧酸可列舉馬來酸、富馬酸、伊康酸、甲基馬來酸、二甲基馬來酸、苯基馬來酸、氯馬來酸、二氯馬來酸、氟馬來酸、苯二甲酸、間苯二甲酸、對苯二甲酸及聯苯甲酸(Diphenic acid)等。 Examples of the dicarboxylic acid include maleic acid, fumaric acid, itaconic acid, methyl maleic acid, dimethyl maleic acid, phenyl maleic acid, chloromaleic acid, dichloromaleic acid, and fluoromalay. Acid, phthalic acid, isophthalic acid, terephthalic acid, and diphenic acid.

二胺可列舉與在前述聚醯胺酸之說明中所例示者同樣者。 The diamine may be the same as those exemplified in the description of the polyamic acid.

<微粒子> <microparticle>

接著,說明微粒子。微粒子可使用例如真球率高,且粒徑分布指數小者。這種微粒子於液體中之分散性優,成為互不凝集的狀態。微粒子的粒徑(平均直徑),例如可設定為100~2000nm左右。藉由使用如上述微粒子,在其後的步驟去除微粒子,可使所得之多孔性樹脂膜F的孔徑一致。可使施加於藉由多孔性樹脂膜F形成之分隔膜的電場均勻化。 Next, the fine particles will be described. The microparticles can be used, for example, in which the true spherical ratio is high and the particle size distribution index is small. Such fine particles are excellent in dispersibility in a liquid, and are in a state in which they do not aggregate. The particle diameter (average diameter) of the fine particles can be set, for example, to about 100 to 2000 nm. By using the fine particles as described above and removing the fine particles in the subsequent steps, the pore diameter of the obtained porous resin film F can be made uniform. The electric field applied to the separator film formed by the porous resin film F can be made uniform.

微粒子之材質,只要不溶於塗佈液所含之溶劑,且在其後步驟可自多孔性樹脂膜F中去除的材質時,無特別限定,可採用習知者。例如,無機材料可列舉二氧 化矽(silica)、氧化鈦、氧化鋁(Al2O3)等之金屬氧化物。有機材料可列舉高分子量烯烴(聚丙烯、聚乙烯等)、聚苯乙烯、環氧樹脂、纖維素、聚乙烯醇、聚乙烯丁醛(polyvinyl butyral)、聚酯、聚甲基丙烯酸甲酯、聚醚等之有機高分子微粒子。微粒子之一例可列舉(單分散)球狀二氧化矽粒子等之矽溶膠、碳酸鈣等。此時,可使多孔性樹脂膜F之孔徑更均勻。 The material of the fine particles is not particularly limited as long as it is insoluble in the solvent contained in the coating liquid and can be removed from the porous resin film F in the subsequent step, and a conventional one can be used. For example, examples of the inorganic material include metal oxides such as silica, titanium oxide, and aluminum oxide (Al 2 O 3 ). Examples of the organic material include high molecular weight olefins (polypropylene, polyethylene, etc.), polystyrene, epoxy resin, cellulose, polyvinyl alcohol, polyvinyl butyral, polyester, polymethyl methacrylate, Organic polymer microparticles such as polyether. Examples of the fine particles include a ruthenium sol such as (monodisperse) spherical cerium oxide particles, calcium carbonate, and the like. At this time, the pore diameter of the porous resin film F can be made more uniform.

又,第1塗佈液所含有之微粒子與第2塗佈液所含有之微粒子,在真球率、粒徑、材料等之各方面可相同或彼此相異。第1塗佈液所含有之微粒子,其粒徑分布指數比第2塗佈液所含有之微粒子小或相同較佳。或第1塗佈液所含有之微粒子,其真球率比第2塗佈液所含有之微粒子小或相同較佳。又,第1塗佈液所含有之微粒子,其微粒子之粒徑(平均直徑)比第2塗佈液所含有之微粒子小為佳,特別是第1塗佈液所含有之微粒子為100~1000nm(更佳為100~600nm),第2塗佈液所含有之微粒子為500~2000nm(更佳為700~2000nm)較佳。第1塗佈膜所含有之微粒子之粒徑藉由使用比第2塗佈液所含有之微粒子之粒徑小者,可使多孔性樹脂膜F表面之孔之開口比例高且均勻。又,相較於多孔性樹脂膜F全體作為第1塗佈液所含有之微粒子之粒徑的情形,可更提高膜的強度。 Further, the fine particles contained in the first coating liquid and the fine particles contained in the second coating liquid may be the same or different from each other in terms of true spherical ratio, particle diameter, material, and the like. The fine particles contained in the first coating liquid preferably have a smaller particle size distribution index than the fine particles contained in the second coating liquid. The fine particles contained in the first coating liquid preferably have a lower true spherical ratio than the fine particles contained in the second coating liquid. Further, the fine particles contained in the first coating liquid have a smaller particle diameter (average diameter) than the fine particles contained in the second coating liquid, and particularly, the fine particles contained in the first coating liquid are 100 to 1000 nm. (more preferably, it is 100 to 600 nm), and the fine particles contained in the second coating liquid are preferably 500 to 2000 nm (more preferably 700 to 2000 nm). When the particle diameter of the fine particles contained in the first coating film is smaller than the particle diameter of the fine particles contained in the second coating liquid, the opening ratio of the pores on the surface of the porous resin film F can be made high and uniform. Moreover, the strength of the film can be further improved as compared with the case where the entire porous resin film F is used as the particle diameter of the fine particles contained in the first coating liquid.

又,上述塗佈液除了特定之樹脂材料、微粒子及溶劑外,必要時也可含有脫模劑、分散劑、縮合劑、 醯亞胺化劑、界面活性劑等各種的添加劑。 Further, the coating liquid may contain a releasing agent, a dispersing agent, a condensing agent, and the like, in addition to a specific resin material, fine particles, and a solvent. Various additives such as ruthenium iodide and surfactant.

〔塗佈單元〕 [coating unit]

塗佈單元10具有搬送部11、第1噴嘴12、第2噴嘴13、乾燥部14及剝離部15。 The coating unit 10 includes a conveying unit 11 , a first nozzle 12 , a second nozzle 13 , a drying unit 14 , and a peeling unit 15 .

搬送部11具有搬送基材(基材)S、基材送出滾輪11a、支撐滾輪11b~11d、基材捲繞滾輪11e及搬出滾輪11f。 The conveyance unit 11 has a conveyance base material (base material) S, a base material delivery roller 11a, support rollers 11b to 11d, a base material winding roller 11e, and a carry-out roller 11f.

搬送基材S係形成帶狀。搬送基材S係由基材送出滾輪11a送出,具有張力地跨掛於支撐滾輪11b~11d,藉由基材捲繞滾輪11e捲繞。搬送基材S之材質,例如可列舉聚對苯二甲酸乙二酯(PET)等,但是不限於此等,也可為不銹鋼等之金屬材料。 The transport substrate S is formed into a strip shape. The conveyance base material S is sent out by the base material delivery roller 11a, and is stretched across the support rollers 11b to 11d with tension, and is wound by the base material winding roller 11e. The material of the substrate S to be transported is, for example, polyethylene terephthalate (PET), but is not limited thereto, and may be a metal material such as stainless steel.

各滾輪11a~11f例如形成圓筒狀,各自與X方向平行配置。又,各滾輪11a~11f不限於與X方向平行的配置,至少1個為對於X方向,可以傾斜配置。例如,各滾輪11a~11f可以成為與Z方向平行配置,Z方向之高度位置可相同來配置。此時,搬送基材S係對於水平面(XY平面),以直立狀態沿著水平面移動。 Each of the rollers 11a to 11f is formed, for example, in a cylindrical shape, and is disposed in parallel with the X direction. Further, each of the rollers 11a to 11f is not limited to the arrangement parallel to the X direction, and at least one of them may be disposed obliquely with respect to the X direction. For example, each of the rollers 11a to 11f may be arranged in parallel with the Z direction, and the height positions in the Z direction may be the same. At this time, the conveyance base material S moves along the horizontal plane in an upright state with respect to a horizontal plane (XY plane).

基材送出滾輪11a係以纏繞有搬送基材S的狀態來配置。支撐滾輪11b係配置於基材送出滾輪11a之+Z側,同時被配置於比基材送出滾輪11a更靠近-Y側。又,支撐滾輪11c係配置於支撐滾輪11b之+Z側,同時被配置於比支撐滾輪11b更靠近+Y側。藉由此3個滾輪 (基材送出滾輪11a、支撐滾輪11b、11c)之配置,搬送基材S係以含有支撐滾輪11b之-Y側端部的面支撐。 The substrate feeding roller 11a is disposed in a state in which the conveying substrate S is wound. The support roller 11b is disposed on the +Z side of the substrate feed roller 11a, and is disposed closer to the -Y side than the substrate feed roller 11a. Further, the support roller 11c is disposed on the +Z side of the support roller 11b, and is disposed closer to the +Y side than the support roller 11b. With this 3 wheels The arrangement of the substrate feeding roller 11a and the supporting rollers 11b and 11c is such that the conveying substrate S is supported by a surface including the end portion on the -Y side of the supporting roller 11b.

又,支撐滾輪11d係配置於支撐滾輪11c之+Y側,同時被配置於支撐滾輪11c之-Z側。此時,藉由支撐滾輪11b~11d之3個滾輪之配置,搬送基材S係以含有支撐滾輪11c之+Z側端部的面支撐。 Further, the support roller 11d is disposed on the +Y side of the support roller 11c, and is disposed on the -Z side of the support roller 11c. At this time, the conveyance base material S is supported by the surface including the +Z side end portion of the support roller 11c by the arrangement of the three rollers supporting the rollers 11b to 11d.

又,支撐滾輪11d可被置於與支撐滾輪11c之高度位置(Z方向之位置)大致同等高度位置。此時,搬送基材S係由支撐滾輪11c朝向支撐滾輪11d,以與XY平面大致平行的狀態,被送至+Y方向。 Further, the support roller 11d can be placed at substantially the same height position as the height position (position in the Z direction) of the support roller 11c. At this time, the conveyance base material S is fed to the support roller 11d by the support roller 11c, and is sent to the +Y direction in a state substantially parallel to the XY plane.

基材捲繞滾輪11e係被配置於支撐滾輪11d之-Z側。由支撐滾輪11d朝向基材捲繞滾輪11e,搬送基材S係被送至-Z方向。搬出滾輪11f係被配置於支撐滾輪11d之+Y側,且-Z側。搬出滾輪11f係將以乾燥部14形成的未燒成膜FA送至+Y方向。此未燒成膜FA藉由搬出滾輪11f,搬出至塗佈單元10之外部。 The substrate winding roller 11e is disposed on the -Z side of the support roller 11d. The support roller S is wound toward the substrate by the roller 11e, and the conveyance substrate S is sent to the -Z direction. The carry-out roller 11f is disposed on the +Y side of the support roller 11d and on the -Z side. The unloading roller 11f is sent to the +Y direction by the unfired film FA formed by the drying section 14. This unfired film FA is carried out to the outside of the coating unit 10 by carrying out the roller 11f.

上述滾輪11a~11f不限於圓筒形,也可形成錐型之冠部(CROWN)。此時,對於滾輪11a~11f之撓曲補正有用,搬送基材S或後述之未燒成膜FA可與滾輪11a~11f均等接觸。又,滾輪11a~11f也可形成輻射型之冠部。此時,可有效防止搬送基材S或未燒成膜FA之蛇行。又,滾輪11a~11f也可形成凹(CONCAVE)型之冠部(X方向之中央部為凹形彎曲的部分)。此時,可將張力賦予X方向,且同時將搬送基材S或未燒成膜FA進行 搬送,故可有效防止皺紋之發生。對於以下的滾輪,也可與上述同樣,為具有錐型、輻射型、凹型等之冠部的構成。 The rollers 11a to 11f are not limited to a cylindrical shape, and a tapered crown portion (CROWN) may be formed. At this time, it is useful for the deflection correction of the rollers 11a to 11f, and the conveyance substrate S or the unfired film FA described later can be brought into uniform contact with the rollers 11a to 11f. Further, the rollers 11a to 11f can also form a crown portion of a radiation type. At this time, it is possible to effectively prevent the meandering of the substrate S or the unfired film FA. Further, the rollers 11a to 11f may be formed in a crown portion of a CONCAVE type (a portion in which the central portion in the X direction is concavely curved). At this time, the tension can be imparted to the X direction, and at the same time, the substrate S or the unfired film FA is carried out. It can be effectively transported to prevent wrinkles. The following roller may have a configuration of a crown portion such as a tapered shape, a radiation type, or a concave shape, similarly to the above.

圖2(a)表示第1噴嘴12之一例的斜視圖。如圖1及圖2(a)所示,第1噴嘴12係於搬送基材S形成第1塗佈液Q1之塗佈膜(以下為第1塗佈膜F1)。第1噴嘴12具有吐出第1塗佈液Q1之吐出口12a。例如以長度方向與搬送基材S之X方向之尺寸大致相同來形成吐出口12a。 Fig. 2(a) is a perspective view showing an example of the first nozzle 12. As shown in FIG. 1 and FIG. 2( a ), the first nozzle 12 is a coating film (hereinafter referred to as a first coating film F1 ) that forms the first coating liquid Q1 on the conveying substrate S. The first nozzle 12 has a discharge port 12a for discharging the first coating liquid Q1. For example, the discharge port 12a is formed in the longitudinal direction substantially the same as the dimension of the transport substrate S in the X direction.

第1噴嘴12係配置於吐出位置P1。吐出位置P1係在相對於支撐滾輪11b為-Y方向上的位置。第1噴嘴12係吐出口12a朝向+Y方向,以傾斜來配置。因此,吐出口12a係朝向搬送基材S之中,以支撐滾輪11b之-Y側端部支撐的部分。第1噴嘴12係對於此搬送基材S,由吐出口12a沿著水平方向吐出第1塗佈液Q1。 The first nozzle 12 is disposed at the discharge position P1. The discharge position P1 is a position in the -Y direction with respect to the support roller 11b. The first nozzle 12 is disposed such that the discharge port 12a faces the +Y direction and is inclined. Therefore, the discharge port 12a faces the conveyance base material S, and supports the portion supported by the -Y side end portion of the roller 11b. In the first nozzle 12, the first coating liquid Q1 is discharged from the discharge port 12a in the horizontal direction with respect to the conveyance substrate S.

圖2(b)係表示第2噴嘴13之一例的斜視圖。如圖1及圖2(b)所示,第2噴嘴13係在搬送基材S上,與第1塗佈膜F1重疊形成第2塗佈液Q2之塗佈膜(以下為第2塗佈膜F2)。第2噴嘴13具有吐出第2塗佈液Q2之吐出口13a。例如以長度方向與搬送基材S之X方向之尺寸大致相同來形成吐出口13a。 Fig. 2(b) is a perspective view showing an example of the second nozzle 13. As shown in FIG. 1 and FIG. 2(b), the second nozzle 13 is formed on the transport substrate S, and a coating film of the second coating liquid Q2 is formed on the first coating film F1 (hereinafter, the second coating is applied). Film F2). The second nozzle 13 has a discharge port 13a for discharging the second coating liquid Q2. For example, the discharge port 13a is formed in the longitudinal direction substantially the same as the dimension of the transport substrate S in the X direction.

第2噴嘴13配置於吐出位置P2。吐出位置P2係在相對於支撐滾輪11c為+Z方向上之位置。第2噴嘴13係吐出口13a朝向-Z方向來配置。因此,吐出口 13a係朝向搬送基材S之中,以支撐滾輪11c之+Z側端部支撐的部分。第2噴嘴13係對於此搬送基材S,由吐出口13a沿著重力方向吐出第2塗佈液Q2。 The second nozzle 13 is disposed at the discharge position P2. The discharge position P2 is at a position in the +Z direction with respect to the support roller 11c. The second nozzle 13 is disposed such that the discharge port 13a faces the -Z direction. Therefore, spitting The 13a is directed toward the conveyance base material S to support the portion supported by the +Z side end portion of the roller 11c. In the second nozzle 13 , the second coating liquid Q2 is discharged from the discharge port 13 a in the direction of gravity with respect to the conveyance substrate S.

又,第1噴嘴12及第2噴嘴13也可為可往X方向、Y方向及Z方向之中至少一方向移動。又,第1噴嘴12及第2噴嘴13也可設置成可繞著與X方向平行之軸線旋轉。又,第1噴嘴12及第2噴嘴13不吐出塗佈液時,配置於無圖示之待機位置,吐出塗佈液時,可由待機位置分別移動至上述吐出位置P1、P2。又,可設置第1噴嘴12及第2噴嘴13進行預備吐出動作的部分。 Further, the first nozzle 12 and the second nozzle 13 may be movable in at least one of the X direction, the Y direction, and the Z direction. Further, the first nozzle 12 and the second nozzle 13 may be provided to be rotatable about an axis parallel to the X direction. When the first nozzle 12 and the second nozzle 13 do not discharge the coating liquid, they are placed at a standby position (not shown), and when the coating liquid is discharged, the standby position can be moved to the discharge positions P1 and P2, respectively. Further, a portion where the first nozzle 12 and the second nozzle 13 perform a preliminary discharge operation can be provided.

第1噴嘴12及第2噴嘴13各自經由連接配管(無圖示)等,與塗佈液供給源(無圖示)連接。第1噴嘴12及第2噴嘴13例如在內部設置保持特定量之塗佈液的保持部(無圖示)。此時,第1噴嘴12及第2噴嘴13可具有調整上述保持部所保持之液狀體之溫度的溫度調節部。 Each of the first nozzle 12 and the second nozzle 13 is connected to a coating liquid supply source (not shown) via a connection pipe (not shown) or the like. For example, the first nozzle 12 and the second nozzle 13 are provided with a holding portion (not shown) that holds a specific amount of the coating liquid. At this time, the first nozzle 12 and the second nozzle 13 may have a temperature adjustment unit that adjusts the temperature of the liquid body held by the holding unit.

由第1噴嘴12或第2噴嘴13吐出之各塗佈液之吐出量或第1塗佈膜F1或第2塗佈膜F2之膜厚,可藉由各噴嘴、各連接配管(無圖示)、或塗佈液供給源(無圖示)所連接的幫浦(無圖示)之壓力、搬送速度、各噴嘴位置或搬送基材S與噴嘴之距離等來調整。第1塗佈膜F1或第2塗佈膜F2之膜厚,例如分別為0.5μm~500μm。 The discharge amount of each coating liquid discharged from the first nozzle 12 or the second nozzle 13 or the thickness of the first coating film F1 or the second coating film F2 can be set by each nozzle and each connecting pipe (not shown). The pressure of the pump (not shown) connected to the coating liquid supply source (not shown), the conveyance speed, the position of each nozzle, the distance between the conveyance substrate S and the nozzle, and the like are adjusted. The film thickness of the first coating film F1 or the second coating film F2 is, for example, 0.5 μm to 500 μm.

如本實施形態,使用2種類之塗佈液(第1 塗佈液Q1及第2塗佈液Q2)時,將藉由第1塗佈液Q1所得之第1塗佈膜F1的膜厚,例如在0.5μm~10μm之範圍調整,將藉由第2塗佈液Q2所得之第2塗佈膜F2的膜厚,例如在1μm~50μm之範圍調整較佳。 As in the present embodiment, two types of coating liquids are used (first In the case of the coating liquid Q1 and the second coating liquid Q2), the film thickness of the first coating film F1 obtained by the first coating liquid Q1 is adjusted, for example, in the range of 0.5 μm to 10 μm, and the second coating layer is used. The film thickness of the second coating film F2 obtained by the coating liquid Q2 is preferably adjusted in the range of, for example, 1 μm to 50 μm.

又,第1噴嘴12及第2噴嘴13之間,可配置使第1塗佈膜F1乾燥用之乾燥部(無圖示)。此乾燥部具備加熱乾燥部為佳。加熱乾燥部使用溫風送風部或紅外線加熱器為佳。加熱溫度例如50℃~150℃、較佳為50℃~100℃之範圍。藉由使第1塗佈膜F1乾燥後,形成第2塗佈膜F2,可抑制第1塗佈膜F1之帶狀痕跡(stripe trace)之發生。 Further, between the first nozzle 12 and the second nozzle 13, a drying portion (not shown) for drying the first coating film F1 can be disposed. It is preferable that the drying section has a heating and drying section. It is preferable to use a warm air blowing unit or an infrared heater in the heating and drying unit. The heating temperature is, for example, in the range of 50 ° C to 150 ° C, preferably 50 ° C to 100 ° C. By drying the first coating film F1 and forming the second coating film F2, the occurrence of a stripe trace of the first coating film F1 can be suppressed.

如圖1所示,乾燥部14係在第2噴嘴13之+Y側,且被配置於支撐滾輪11c與支撐滾輪11d之間。乾燥部14係使被塗佈於搬送基材S上之2層的塗佈膜(第1塗佈膜F1及第2塗佈膜F2)乾燥,形成未燒成膜FA。 As shown in FIG. 1, the drying unit 14 is disposed on the +Y side of the second nozzle 13, and is disposed between the support roller 11c and the support roller 11d. The drying unit 14 dries the two coating films (the first coating film F1 and the second coating film F2) applied to the conveying substrate S to form an unfired film FA.

乾燥部14具有腔(chamber)14a與加熱部14b。腔14a收容搬送基材S及加熱部14b。加熱部14b係將形成於搬送基材S上之第1塗佈膜F1及第2塗佈膜F2進行加熱。加熱部14b可使用例如紅外線加熱器等。加熱部14b係以50℃~100℃左右的溫度,將塗佈膜加熱。 The drying unit 14 has a chamber 14a and a heating portion 14b. The chamber 14a accommodates the transport substrate S and the heating unit 14b. The heating unit 14b heats the first coating film F1 and the second coating film F2 formed on the conveying substrate S. For example, an infrared heater or the like can be used for the heating portion 14b. The heating portion 14b heats the coating film at a temperature of about 50 ° C to 100 ° C.

剝離部15係未燒成膜FA由搬送基材S被剝離的部分。本實施形態中,藉由作業者之手作業剝離未燒 成膜FA,但是不限於此,也可使用機械手等自動剝離。由搬送基材S被剝離的未燒成膜FA,藉由搬出滾輪11f被搬出至塗佈單元10之外部,送至捲繞部50。又,未燒成膜FA經剝離後的搬送基材S,藉由基材捲繞滾輪11e捲繞。 The peeling portion 15 is a portion where the unfired film FA is peeled off by the conveyance substrate S. In this embodiment, the operator does not burn by the hand of the operator. The FA is formed, but is not limited thereto, and may be automatically peeled off using a robot or the like. The unfired film FA which has been peeled off by the conveyance substrate S is carried out to the outside of the coating unit 10 by the carry-out roller 11f, and is sent to the winding unit 50. Moreover, the conveyed base material S after peeling of the unfired film FA is wound by the base material winding roller 11e.

〔捲繞部(1)〕 [Winding section (1)]

圖3概略表示塗佈單元10之+Y側之構成的斜視圖。 Fig. 3 is a schematic perspective view showing the configuration of the +Y side of the coating unit 10.

如圖3所示,塗佈單元10之+Y側設置搬出未燒成膜FA之搬出口10b。由搬出口10b搬出的未燒成膜FA,藉由捲繞部50捲繞。 As shown in FIG. 3, the +Y side of the coating unit 10 is provided with a carry-out port 10b for carrying out the unfired film FA. The unfired film FA carried out by the carry-out port 10b is wound by the winding portion 50.

捲繞部50係於軸承51被安裝軸構件SF的構成。軸構件SF係將由搬出口10b搬出的未燒成膜FA捲繞形成捲筒體R。軸構件SF係對於軸承51,設置成可拆裝。軸構件SF安裝於軸承51時,可繞著與X方向平行之軸線旋轉來被支撐。捲繞部50具有可使安裝於軸承51之軸構件SF旋轉之無圖示的驅動機構。 The winding portion 50 is configured such that the bearing 51 is attached to the shaft member SF. The shaft member SF winds the unfired film FA carried out by the carry-out port 10b to form the roll body R. The shaft member SF is provided to be detachable with respect to the bearing 51. When the shaft member SF is attached to the bearing 51, it can be supported by being rotated about an axis parallel to the X direction. The winding portion 50 has a drive mechanism (not shown) that can rotate the shaft member SF attached to the bearing 51.

又,捲繞部50中,以未燒成膜FA之中,第1塗佈膜F1側之面配置於外側,來捲繞未燒成膜FA。例如藉由驅動機構,使軸構件SF繞著圖1之逆時針旋轉,來捲繞未燒成膜FA。藉由在形成有捲筒體R的狀態下,將軸構件SF自軸承51取下,可將捲筒體R移動至其他之單元。 In the unwound film FA, the surface of the unfired film FA is disposed on the outer side of the first coating film F1 side, and the unfired film FA is wound. For example, the shaft member SF is rotated counterclockwise about FIG. 1 by a drive mechanism to wind the unfired film FA. By removing the shaft member SF from the bearing 51 in a state in which the roll body R is formed, the roll body R can be moved to another unit.

圖1及圖3中,捲繞部50係離開塗佈單元10 而獨立配置,但是不限於此。例如捲繞部50可配置於塗佈單元10之內部。此時,搬出口10b未配置於塗佈單元10,可由搬出滾輪11f(或由支撐滾輪11d)捲繞未燒成膜FA,形成捲筒體R。 In FIGS. 1 and 3, the winding portion 50 is separated from the coating unit 10 Independent configuration, but not limited to this. For example, the winding portion 50 may be disposed inside the coating unit 10. At this time, the unloading port 10 is not disposed in the coating unit 10, and the unfired film FA can be wound by the unloading roller 11f (or the supporting roller 11d) to form the roll body R.

〔送出部〕 [sending department]

圖4係概略表示燒成單元20之-Y側之構成的斜視圖。 FIG. 4 is a perspective view schematically showing a configuration of the -Y side of the firing unit 20.

如圖4所示,燒成單元20之-Y側設置搬入未燒成膜FA之搬入口20a。送出部60係相對於搬入口20a,送出未燒成膜FA。 As shown in FIG. 4, the inlet side 20a in which the unfired film FA is carried in the -Y side of the baking unit 20 is provided. The delivery unit 60 sends the unfired film FA to the carry-in port 20a.

送出部60係軸構件SF可安裝於軸承61的構成。軸構件SF可與安裝於捲繞部50之軸承51者共同使用。因此,可將自捲繞部50取下之軸構件SF安裝至送出部60之軸承61。藉此,可將捲繞部50形成的捲筒體R配置於送出部60。又,對於軸承61及捲繞部50之軸承51,各自可設定為離地面之高度為相等,也可設定為不同的高度位置。 The delivery portion 60 is a structure in which the shaft member SF can be attached to the bearing 61. The shaft member SF can be used together with the bearing 51 attached to the winding portion 50. Therefore, the shaft member SF taken out from the winding portion 50 can be attached to the bearing 61 of the delivery portion 60. Thereby, the roll body R formed by the winding part 50 can be arrange|positioned in the delivery part 60. Further, the bearings 51 of the bearing 61 and the winding portion 50 may be set to have the same height from the ground or may be set to different height positions.

軸構件SF被安裝於軸承61時,可繞著與X方向平行之軸線旋轉而被支撐。送出部60具有使安裝於軸承61之軸構件SF旋轉之無圖示的驅動機構。藉由驅動機構,使軸構件SF於圖1之順時針旋轉,構成捲筒體R之未燒成膜FA朝向搬入口20a被送出。上述捲繞部50中,以未燒成膜FA之中,第1塗佈膜F1側之面配置於 外側,來捲繞未燒成膜FA,因此未燒成膜FA由捲筒體R被拉出時,第1塗佈膜F1側被配置於上方。 When the shaft member SF is attached to the bearing 61, it can be supported by being rotated about an axis parallel to the X direction. The delivery unit 60 has a drive mechanism (not shown) that rotates the shaft member SF attached to the bearing 61. The shaft member SF is rotated clockwise in FIG. 1 by the drive mechanism, and the unfired film FA constituting the roll body R is sent toward the transfer port 20a. In the wound portion 50, the uncoated film FA is disposed on the surface of the first coating film F1 side. When the unfired film FA is wound on the outside, when the unfired film FA is pulled out by the roll body R, the first coat film F1 side is placed above.

〔燒成單元〕 [burning unit]

燒成單元20在本實施形態中,係對於未燒成膜FA進行高溫處理的單元。燒成單元20係將未燒成膜FA進行燒成,形成含有微粒子的燒成膜FB。燒成單元20具有腔21、加熱部22及搬送部23。腔21具有搬入未燒成膜FA之搬入口20a及搬出燒成膜FB之搬出口20b。腔21係收容加熱部22及搬送部23。 In the present embodiment, the firing unit 20 is a unit that performs high-temperature treatment on the unfired film FA. In the firing unit 20, the unfired film FA is fired to form a fired film FB containing fine particles. The firing unit 20 has a cavity 21, a heating unit 22, and a conveying unit 23. The chamber 21 has a transfer inlet 20a into which the unfired film FA is carried, and a transfer port 20b into which the fired film FB is carried out. The cavity 21 houses the heating unit 22 and the conveying unit 23.

加熱部22係將被搬入腔31內之未燒成膜FA進行加熱。加熱部22具有於Y方向排列配置之複數的加熱器22a。此加熱器22a例如可使用紅外線加熱器等。加熱部22係由腔21之內部之-Y側端部跨+Y側端部來配置。加熱部22係在Y方向之大致全體,可將未燒成膜FA加熱。加熱部22例如可將未燒成膜FA加熱至120℃~450℃左右。藉由加熱部22之加熱溫度可配合未燒成膜FA之搬送速度或未燒成膜FA之構成成分等適宜調整。 The heating unit 22 heats the unfired film FA carried into the cavity 31. The heating unit 22 has a plurality of heaters 22a arranged in the Y direction. As the heater 22a, for example, an infrared heater or the like can be used. The heating portion 22 is disposed so that the end portion on the -Y side of the inside of the cavity 21 crosses the +Y side end portion. The heating unit 22 is substantially the entire Y direction, and the unfired film FA can be heated. The heating unit 22 can heat the unfired film FA to, for example, about 120 to 450 ° C. The heating temperature of the heating unit 22 can be appropriately adjusted in accordance with the conveying speed of the unfired film FA or the constituent components of the unfired film FA.

搬送部23具有搬送帶23a、驅動滾輪23b、被動滾輪23c及張力滾輪23d、23e。搬送帶23a係形成無端狀,沿著Y方向配置。搬送帶23a係使用對於未燒成膜FA之燒成溫度具有耐久性的材料所形成。搬送帶23a係在具有張力的狀態下,與XY平面大致平行,跨接於驅動滾輪23b與被動滾輪23c之間。未燒成膜FA及燒成膜FB 係在被載置於搬送帶23a的狀態下,被搬送至+Y方向。 The conveyance unit 23 has a conveyance belt 23a, a drive roller 23b, a passive roller 23c, and tension rollers 23d and 23e. The conveyor belt 23a is formed in an endless shape and arranged along the Y direction. The conveyor belt 23a is formed using a material having durability against the firing temperature of the unfired film FA. The conveyor belt 23a is substantially parallel to the XY plane in a state of being tensioned, and is bridged between the drive roller 23b and the driven roller 23c. Unfired film FA and fired film FB It is conveyed to the +Y direction while being placed on the conveyor belt 23a.

驅動滾輪23b係被配置於腔21之內部之+Y側端部。驅動滾輪23b係例如形成圓筒狀,與X方向平行配置。驅動滾輪23b設置例如馬達等之旋轉驅動裝置。驅動滾輪23b設置成藉由此旋轉驅動裝置,可繞著與X方向平行之軸線旋轉。藉由驅動滾輪23b旋轉,搬送帶23a繞著圖1之順時針旋轉。藉由搬送帶23a旋轉,被載置於搬送帶23a上之未燒成膜FA及燒成膜FB被搬送至+Y方向。 The drive roller 23b is disposed at the +Y side end of the inside of the cavity 21. The drive roller 23b is formed, for example, in a cylindrical shape, and is disposed in parallel with the X direction. The drive roller 23b is provided with a rotary drive such as a motor. The drive roller 23b is arranged to be rotatable about an axis parallel to the X direction by means of the rotary drive. By the rotation of the drive roller 23b, the conveyor belt 23a rotates clockwise around FIG. By the rotation of the conveyor belt 23a, the unfired film FA and the fired film FB placed on the conveyor belt 23a are conveyed to the +Y direction.

被動滾輪23c係被配置於腔21之內部之-Y側端部。被動滾輪23c例如形成圓筒狀,與X方向平行配置。被動滾輪23c係形成與驅動滾輪23b相同之直徑,Z方向之位置(高度位置)與驅動滾輪23b大致相等來配置。被動滾輪23c係設置為可繞與X方向平行之軸線旋轉。被動滾輪23c係追蹤搬送帶23a之旋轉而旋轉。 The passive roller 23c is disposed at the -Y side end of the inside of the cavity 21. The driven roller 23c is formed, for example, in a cylindrical shape, and is disposed in parallel with the X direction. The driven roller 23c has the same diameter as the driving roller 23b, and the position (height position) in the Z direction is substantially equal to the driving roller 23b. The passive roller 23c is arranged to be rotatable about an axis parallel to the X direction. The passive roller 23c rotates by tracking the rotation of the conveyance belt 23a.

張力(tension)滾輪23d係配置於被動滾輪23c之+Z側。張力滾輪23d係與X方向平行配置,設置為可繞X軸旋轉。張力滾輪23d設置為可在Z方向昇降移動。張力滾輪23d在與被動滾輪23c之間,可挾著未燒成膜FA。張力滾輪23d可在挾著未燒成膜FA的狀態旋轉。 The tension roller 23d is disposed on the +Z side of the driven roller 23c. The tension roller 23d is disposed in parallel with the X direction and is provided to be rotatable about the X axis. The tension roller 23d is provided to be movable up and down in the Z direction. The tension roller 23d is placed between the passive roller 23c and the unfired film FA. The tension roller 23d is rotatable in a state in which the unfired film FA is next to it.

張力滾輪23e係配置於驅動滾輪23b之+Z側。張力滾輪23e係與X方向平行配置,設置成可繞X軸旋轉。張力滾輪23e設置成可在Z方向昇降移動。張力 滾輪23e在與被動滾輪23b之間,可挾著燒成膜FB。張力滾輪23e可在挾著未燒成膜FB的狀態旋轉。 The tension roller 23e is disposed on the +Z side of the drive roller 23b. The tension roller 23e is disposed in parallel with the X direction and is provided to be rotatable about the X axis. The tension roller 23e is provided to be movable up and down in the Z direction. tension The roller 23e is placed between the passive roller 23b and the fired film FB. The tension roller 23e is rotatable in a state in which the unfired film FB is next to it.

張力滾輪23d、23e各自在被動滾輪23c及驅動滾輪23b之間,挾著各未燒成膜FA及燒成膜FB的狀態下,連續之未燒成膜FA及燒成膜FB之中,被挾之2處之間的部分,阻斷來自外部之張力。藉此,可防止對於未燒成膜FA及燒成膜FB,施加過剩的負荷。張力滾輪23d、23e可調整避免對配置於腔21內之未燒成膜FA及燒成膜FB施加張力。 Each of the tension rollers 23d and 23e is between the passive roller 23c and the drive roller 23b, and is in the state of the unfired film FA and the fired film FB, and the unfired film FA and the fired film FB are continuously The part between the two places, blocking the tension from the outside. Thereby, it is possible to prevent an excessive load from being applied to the unfired film FA and the fired film FB. The tension rollers 23d and 23e can be adjusted to prevent tension from being applied to the unfired film FA and the fired film FB disposed in the cavity 21.

〔除去單元〕 [removal unit]

除去單元30具有腔31、蝕刻部32、洗淨部33、液體排除部34及搬送部35。腔31具有搬入燒成膜FB之搬入口30a及搬出多孔性樹脂膜F之搬出口30b。腔31係收容蝕刻部32、洗淨部33、液體排除部34及搬送部35。 The removing unit 30 has a cavity 31, an etching unit 32, a cleaning unit 33, a liquid removing unit 34, and a conveying unit 35. The chamber 31 has a transfer inlet 30a into which the fired film FB is carried, and a transfer port 30b through which the porous resin film F is carried out. The cavity 31 houses the etching unit 32, the cleaning unit 33, the liquid removing unit 34, and the conveying unit 35.

蝕刻部32係對燒成膜FB進行蝕刻,除去燒成膜FB所含有之微粒子,形成多孔性樹脂膜F。蝕刻部32中,藉由將燒成膜FB浸漬於可溶解或分解微粒子的蝕刻液中,除去微粒子。蝕刻部32設置供給這種蝕刻液的供給部(無圖示)或可儲存蝕刻液的儲存部。蝕刻部32與洗淨部33,其內部所含有的液體不同,故由蝕刻部32搬出之前面位置,可設置後述的吸水滾輪。吸水滾輪係配置於相對於多孔性樹脂膜F為+Z側及-Z側之至少一方, 較佳為配置於兩方。 The etched portion 32 etches the fired film FB to remove the fine particles contained in the fired film FB to form the porous resin film F. In the etching portion 32, the sintered film FB is immersed in an etching liquid capable of dissolving or decomposing the fine particles to remove the fine particles. The etching unit 32 is provided with a supply unit (not shown) that supplies such an etching liquid or a storage unit that can store the etching liquid. Since the etching unit 32 and the cleaning unit 33 have different liquids contained therein, the etching unit 32 can carry out the front surface position, and a water absorbing roller to be described later can be provided. The water absorbing roller is disposed on at least one of the +Z side and the -Z side with respect to the porous resin film F. It is preferably arranged on both sides.

洗淨部33係洗淨蝕刻後之多孔性樹脂膜F。洗淨部33配置於蝕刻部32之+Y側(多孔性樹脂膜F之搬送方向的前方)。洗淨部33具有供給洗淨液的供給部(無圖示)。又,也可具有將洗淨多孔性樹脂膜F後之廢液回收的回收部(無圖示)等。 The cleaning unit 33 is a porous resin film F after the etching. The cleaning portion 33 is disposed on the +Y side of the etching portion 32 (before the conveyance direction of the porous resin film F). The cleaning unit 33 has a supply unit (not shown) that supplies the cleaning liquid. In addition, a recovery unit (not shown) that collects the waste liquid after washing the porous resin film F may be provided.

液體排除部34係將附著於洗淨後之多孔性樹脂膜F的液體除去。可進行預備乾燥等。液體排除部34配置於洗淨部33之+Y側(多孔性樹脂膜F之搬送方向的前方)。液體排除部34設置吸水滾輪等。藉由使吸水滾輪與多孔性樹脂膜F接觸,搬送多孔性樹脂膜F,同時可吸收附著於多孔性樹脂膜F之液體。吸水滾輪對搬送方向之配置,只要是由液體排除部34搬出的前面時,即無特別限制。又,吸水滾輪係配置於相對於多孔性樹脂膜F為+Z側及-Z側之至少一方,較佳為配置於兩方。 The liquid removing portion 34 removes the liquid adhering to the washed porous resin film F. Pre-drying, etc. can be performed. The liquid draining portion 34 is disposed on the +Y side of the cleaning portion 33 (before the transport direction of the porous resin film F). The liquid discharge portion 34 is provided with a water suction roller or the like. By bringing the water absorbing roller into contact with the porous resin film F, the porous resin film F is conveyed, and the liquid adhering to the porous resin film F can be absorbed. The arrangement of the water suction roller in the conveyance direction is not particularly limited as long as it is carried out by the liquid discharge unit 34. In addition, the water absorbing roller is disposed on at least one of the +Z side and the -Z side with respect to the porous resin film F, and is preferably disposed on both sides.

搬送部35跨越蝕刻部32、洗淨部33及液體排除部34,搬送燒成膜FB及多孔性樹脂膜F。搬送部35具有搬送帶35a、驅動滾輪35b及被動滾輪35c。又,除驅動滾輪35b及被動滾輪35c外,也可於蝕刻部32、洗淨部33、液體排除部34之內部配置支撐搬送帶35a的支撐滾輪。 The conveyance unit 35 carries the fired film FB and the porous resin film F across the etching unit 32, the cleaning unit 33, and the liquid discharge unit 34. The conveyance unit 35 has a conveyance belt 35a, a drive roller 35b, and a passive roller 35c. Further, in addition to the drive roller 35b and the passive roller 35c, a support roller that supports the conveyance belt 35a may be disposed inside the etching portion 32, the cleaning portion 33, and the liquid discharge portion 34.

搬送帶35a係形成無端狀,沿著Y方向配置。搬送帶35a係使用對於上述蝕刻液具有耐久性的材料所形成。搬送帶35a在具有張力的狀態下,與XY平面大 致平行地,跨接於驅動滾輪35b與被動滾輪35c之間。燒成膜FB及多孔性樹脂膜F被載置於搬送帶35a上。 The conveyor belt 35a is formed in an endless shape and arranged along the Y direction. The conveyor belt 35a is formed using a material having durability to the above etching liquid. The conveyor belt 35a has a tension and is larger than the XY plane. In parallel, it is bridged between the drive roller 35b and the passive roller 35c. The fired film FB and the porous resin film F are placed on the conveyor belt 35a.

驅動滾輪35b配置於腔31之內部之+Y側端部。驅動滾輪35b例如形成圓筒狀,且與X方向平行配置。驅動滾輪35b設置例如馬達等之旋轉驅動裝置。驅動滾輪35b係設置成藉由此旋轉驅動裝置,可繞著與X方向平行之軸線旋轉。藉由驅動滾輪35b旋轉,搬送帶35a繞著圖1之順時針旋轉。藉由搬送帶35a旋轉,載置於搬送帶35a上之燒成膜FB及多孔性樹脂膜F被搬送至+Y方向。 The drive roller 35b is disposed at the +Y side end of the inside of the cavity 31. The drive roller 35b is formed, for example, in a cylindrical shape, and is disposed in parallel with the X direction. The drive roller 35b is provided with a rotary drive such as a motor. The drive roller 35b is arranged to be rotatable about an axis parallel to the X direction by means of the rotary drive. By the rotation of the drive roller 35b, the conveyor belt 35a rotates clockwise around FIG. By the rotation of the conveyance belt 35a, the fired film FB and the porous resin film F placed on the conveyance belt 35a are conveyed to the +Y direction.

被動滾輪35c配置於腔31之內部之-Y側端部。被動滾輪35c例如形成圓筒狀,且與X方向平行配置。被動滾輪35c係形成與驅動滾輪35b相同之直徑,Z方向之位置(高度位置)與驅動滾輪35b大致相等來配置。被動滾輪35c係設置為可繞著與X方向平行之軸線旋轉。被動滾輪35c係追蹤搬送帶35a之旋轉而旋轉。 The passive roller 35c is disposed at the -Y side end of the inside of the cavity 31. The passive roller 35c is formed, for example, in a cylindrical shape and arranged in parallel with the X direction. The driven roller 35c has the same diameter as the driving roller 35b, and the position (height position) in the Z direction is substantially equal to the driving roller 35b. The passive roller 35c is arranged to be rotatable about an axis parallel to the X direction. The passive roller 35c rotates while tracking the rotation of the conveyor belt 35a.

又,除去單元30不限於藉由蝕刻除去微粒子的情形。例如,微粒子之材質使用比聚醯亞胺更低溫分解的有機材料時,藉由將燒成膜FB加熱,可使微粒子分解。這種有機材料只要是比聚醯亞胺更低溫分解的有機材料時,無特別限定均可使用。例如可列舉由線狀聚合物或習知之解聚合性聚合物所構成之樹脂微粒子。通常的線狀聚合物在熱分解時,聚合物之分子鏈被不規則切斷,解聚合性聚合物係在熱分解時,聚合物分解成單體的聚合物。 兩者皆藉由分解成低分子量體或CO2,由燒成膜FB中消失。此時之微粒子之分解溫度,較佳為200~320℃,更佳為230~260℃。分解溫度為200℃以上時,塗佈液使用高沸點溶劑時,也可成膜,燒成單元20中之燒成條件之選擇範圍變寬。又,分解溫度未達320℃時,對於燒成膜FB不會施加熱傷害,可僅使微粒子消失。 Further, the removing unit 30 is not limited to the case where the fine particles are removed by etching. For example, when the material of the fine particles is an organic material which decomposes at a lower temperature than the polyimide, the fine particles are decomposed by heating the fired film FB. The organic material is not particularly limited as long as it is an organic material which decomposes at a lower temperature than the polyimide. For example, resin fine particles composed of a linear polymer or a conventional depolymerizable polymer may be mentioned. When a linear polymer is thermally decomposed, the molecular chain of the polymer is irregularly cut, and the depolymerizable polymer is decomposed into a monomeric polymer upon thermal decomposition. Both of them are eliminated from the fired film FB by decomposition into a low molecular weight body or CO 2 . The decomposition temperature of the fine particles at this time is preferably 200 to 320 ° C, more preferably 230 to 260 ° C. When the decomposition temperature is 200° C. or higher, when the coating liquid is a high boiling point solvent, film formation can be performed, and the selection range of the firing conditions in the firing unit 20 is widened. Further, when the decomposition temperature is less than 320 ° C, no thermal damage is applied to the fired film FB, and only the fine particles can be eliminated.

〔化學蝕刻單元〕 [Chemical etching unit]

化學蝕刻單元40係配置於除去單元30之+Y側。圖6表示化學蝕刻單元40及捲繞部80之一例的圖。如圖6所示,化學蝕刻單元40具有腔41、搬送部42、化學蝕刻部43、洗淨部44、液體排除部45及加熱部46。腔41具有搬入多孔性樹脂膜F之搬入口40a及搬出多孔性樹脂膜F的搬出口40b。腔41係收容搬送部42、化學蝕刻部43、洗淨部44及液體排除部45。 The chemical etching unit 40 is disposed on the +Y side of the removing unit 30. FIG. 6 is a view showing an example of the chemical etching unit 40 and the winding unit 80. As shown in FIG. 6, the chemical etching unit 40 has a cavity 41, a conveying portion 42, a chemical etching portion 43, a cleaning portion 44, a liquid removing portion 45, and a heating portion 46. The cavity 41 has a transfer inlet 40a into which the porous resin film F is carried, and a transfer port 40b through which the porous resin film F is carried out. The chamber 41 houses the transport unit 42, the chemical etching unit 43, the cleaning unit 44, and the liquid drain unit 45.

搬送部42係跨越化學蝕刻部43、洗淨部44及液體排除部45,將多孔性樹脂膜F搬送至+Y方向。搬送部42具有搬送帶42a、驅動滾輪42b及被動滾輪42c~42e。又,除了驅動滾輪42b及被動滾輪42c~42e之外,在化學蝕刻部43、洗淨部44、液體排除部45之內部也可配置支撐搬送帶42a的支撐滾輪。 The conveyance unit 42 conveys the porous resin film F to the +Y direction across the chemical etching unit 43, the cleaning unit 44, and the liquid removal unit 45. The conveyance unit 42 has a conveyance belt 42a, a drive roller 42b, and passive rollers 42c to 42e. Further, in addition to the drive roller 42b and the passive rollers 42c to 42e, a support roller that supports the conveyance belt 42a may be disposed inside the chemical etching portion 43, the cleaning portion 44, and the liquid discharge portion 45.

搬送帶42a係形成無端狀,沿著Y方向配置。搬送帶42a係使用對於後述之蝕刻液(EQ)具有耐久性的材料所形成。搬送帶42a例如全面形成網目 (mesh)狀,蝕刻液可通過搬送帶42a。搬送帶42a係在與XY平面大致平行,且具有張力的狀態,跨接於驅動滾輪42b與被動滾輪42c之間。多孔性樹脂膜F係被載置於搬送帶42a來搬送。 The conveyor belt 42a is formed in an endless shape and arranged along the Y direction. The conveyor belt 42a is formed using a material having durability against an etching liquid (EQ) to be described later. The conveyor belt 42a, for example, completely forms a mesh In the form of a mesh, the etching liquid can pass through the conveying belt 42a. The conveyor belt 42a is substantially parallel to the XY plane and has a tension state, and is bridged between the drive roller 42b and the driven roller 42c. The porous resin film F is placed on the conveyance belt 42a and conveyed.

驅動滾輪42b係配置於腔41之內部之+Y側端部。驅動滾輪42b例如形成圓筒狀,且與X方向平行配置。驅動滾輪42b設置例如馬達等之旋轉驅動裝置。驅動滾輪42b係設置成藉由此旋轉驅動裝置,可繞著與X方向平行之軸線旋轉。藉由驅動滾輪42b旋轉,搬送帶42a係成為如圖6之繞著順時針旋轉。藉由搬送帶42a旋轉,載置於搬送帶42a上之多孔性樹脂膜F被搬送至+Y方向。 The drive roller 42b is disposed at the +Y side end of the inside of the cavity 41. The drive roller 42b is formed, for example, in a cylindrical shape and arranged in parallel with the X direction. The drive roller 42b is provided with a rotary drive such as a motor. The drive roller 42b is arranged to be rotatable about an axis parallel to the X direction by means of the rotary drive. By rotating the drive roller 42b, the conveyor belt 42a rotates clockwise as shown in FIG. The porous resin film F placed on the conveyor belt 42a is conveyed to the +Y direction by the rotation of the conveyor belt 42a.

被動滾輪42c配置於腔41之內部之-Y側端部。被動滾輪42d及42e各自被配置於被動滾輪42c及驅動滾輪42b之-Z側。被動滾輪42c~42e例如形成圓筒狀,且與X方向平行配置。被動滾輪42c係形成與驅動滾輪42b相同之直徑,Z方向之位置(高度位置)與驅動滾輪42b大致相等來配置。被動滾輪42d係形成與被動滾輪42e相同之直徑,Z方向之位置(高度位置)與被動滾輪42e大致相等來配置。被動滾輪42c~42e係設置為可繞與X方向平行之軸線旋轉。被動滾輪42c~42e係追蹤搬送帶42a之旋轉而旋轉。 The passive roller 42c is disposed at the -Y side end of the inside of the cavity 41. The passive rollers 42d and 42e are disposed on the -Z side of the driven roller 42c and the driving roller 42b, respectively. The passive rollers 42c to 42e are formed, for example, in a cylindrical shape and arranged in parallel with the X direction. The driven roller 42c has the same diameter as the driving roller 42b, and the position (height position) in the Z direction is substantially equal to the driving roller 42b. The passive roller 42d has the same diameter as the passive roller 42e, and the position (height position) in the Z direction is substantially equal to the passive roller 42e. The passive rollers 42c to 42e are arranged to be rotatable about an axis parallel to the X direction. The passive rollers 42c to 42e rotate by tracking the rotation of the conveyor belt 42a.

化學蝕刻部43係對於多孔性樹脂膜F,進行化學蝕刻,使多孔性樹脂膜F之一部分溶解。圖7係以模式表示化學蝕刻部43之一例的圖。如圖7所示,化學蝕 刻部43具有上側噴嘴43a、下側噴嘴43b及滾輪43c。 The chemical etching unit 43 chemically etches the porous resin film F to partially dissolve the porous resin film F. FIG. 7 is a view showing an example of the chemical etching portion 43 in a mode. As shown in Figure 7, chemical etching The engraved portion 43 has an upper nozzle 43a, a lower nozzle 43b, and a roller 43c.

上側噴嘴43a係配置於搬送帶42a之+Z側。上側噴嘴43a例如在Y方向複數排列配置。各上側噴嘴43a係在X方向具有複數的吐出口43d。各吐出口43d朝向-Z側。由各吐出口43d,噴霧狀之蝕刻液EQ被吐出至-Z方向。各上側噴嘴43a與蝕刻液EQ之供給源(無圖示)連接。 The upper nozzle 43a is disposed on the +Z side of the conveyor belt 42a. The upper nozzles 43a are arranged in plural numbers, for example, in the Y direction. Each of the upper nozzles 43a has a plurality of discharge ports 43d in the X direction. Each of the discharge ports 43d faces the -Z side. The sprayed etching liquid EQ is discharged to the -Z direction by the respective discharge ports 43d. Each of the upper nozzles 43a is connected to a supply source (not shown) of the etching liquid EQ.

下側噴嘴43b係配置於搬送帶42a之-Z側。下側噴嘴43b例如在Y方向複數排列配置。圖7表示上側噴嘴43a及下側噴嘴43b在Y方向交互排列的狀態,但是不限於此配置。各下側噴嘴43b係在X方向具有複數之吐出口43e。由各吐出口43e,噴霧狀之蝕刻液EQ被吐出至+Z方向。各下側噴嘴43b與蝕刻液EQ之供給源(無圖示)連接。 The lower nozzle 43b is disposed on the -Z side of the conveyor belt 42a. The lower nozzles 43b are arranged in plural numbers, for example, in the Y direction. FIG. 7 shows a state in which the upper nozzle 43a and the lower nozzle 43b are alternately arranged in the Y direction, but the configuration is not limited thereto. Each of the lower nozzles 43b has a plurality of discharge ports 43e in the X direction. The sprayed etching liquid EQ is discharged to the +Z direction from each of the discharge ports 43e. Each of the lower nozzles 43b is connected to a supply source (not shown) of the etching liquid EQ.

滾輪43c例如在化學蝕刻部43之+Y側端部及-Y側端部,分別配置各1個。滾輪43c係在與搬送帶42a之間,可挾持多孔性樹脂膜F。滾輪43c可伴隨搬送帶42a之旋轉而旋轉。 The roller 43c is disposed, for example, at each of the +Y side end portion and the -Y side end portion of the chemical etching portion 43. The roller 43c is interposed between the conveyor belt 42a and the porous resin film F. The roller 43c is rotatable in accordance with the rotation of the conveyor belt 42a.

化學蝕刻部43可具有回收蝕刻液EQ之廢液的回收部(無圖示)等。又,化學蝕刻部43也可具有將內部排氣之排氣部(無圖示)等。 The chemical etching unit 43 may have a recovery unit (not shown) or the like that collects the waste liquid of the etching liquid EQ. Further, the chemical etching unit 43 may have an exhaust unit (not shown) that exhausts the inside.

化學蝕刻部43中,2個滾輪43c同時接觸多孔性樹脂膜F時,由上側噴嘴43a吐出蝕刻液EQ時,蝕刻液EQ變得容易在Y方向滯留於2個滾輪43c之間的區 間。由上側噴嘴43a繼續吐出蝕刻液EQ,藉此在此區間形成儲存蝕刻液EQ的儲存部47。又,由下側噴嘴43b被噴出的蝕刻液EQ,通過搬送帶42a之網狀物,到達多孔性樹脂膜F之-Z側的面。到達多孔性樹脂膜F之-Z側的蝕刻液EQ係使多孔性樹脂膜F突起往+Z方向。此時,突起的多孔性樹脂膜F與搬送帶42a之間,配置有由下側噴嘴43b被噴出的蝕刻液EQ。因此,多孔性樹脂膜F係在表觀上浮起的狀態下,浸漬於儲存部47所儲存的蝕刻液EQ中,且在此狀態下進行化學蝕刻處理。如此,搬送部42係使多孔性樹脂膜F浸漬於儲存部47內之蝕刻液EQ中。 In the chemical etching portion 43, when the two rollers 43c are in contact with the porous resin film F, when the etching liquid EQ is discharged from the upper nozzle 43a, the etching liquid EQ is likely to remain in the Y direction between the two rollers 43c. between. The etching liquid EQ is continuously discharged from the upper nozzle 43a, whereby the storage portion 47 storing the etching liquid EQ is formed in this section. Moreover, the etching liquid EQ discharged from the lower nozzle 43b passes through the mesh of the conveyance belt 42a, and reaches the surface on the -Z side of the porous resin film F. The etching liquid EQ that has reached the -Z side of the porous resin film F causes the porous resin film F to protrude in the +Z direction. At this time, the etching liquid EQ discharged from the lower nozzle 43b is disposed between the protruding porous resin film F and the conveyance belt 42a. Therefore, the porous resin film F is immersed in the etching liquid EQ stored in the storage portion 47 in a state of apparently floating, and is subjected to a chemical etching treatment in this state. In this manner, the conveying unit 42 immerses the porous resin film F in the etching liquid EQ in the storage unit 47.

又,蝕刻液EQ例如可使用無機鹼溶液或有機鹼溶液等。無機鹼溶液例如可列舉含有水合肼(hydrazine hydrate)與乙二胺之肼溶液、氫氧化鉀、氫氧化鈉、碳酸鈉、矽酸鈉、偏矽酸鈉等之鹼金屬氫氧化物之溶液、氨溶液、以氫氧化鹼與肼與1,3-二甲基-2-咪唑啉酮為主成分的蝕刻液等。有機鹼溶液例如有乙胺、n-丙胺等之第一級胺類;二乙胺、二-n-丁胺等之第二級胺類;三乙胺、甲基二乙胺等之第三級胺類;二甲基乙醇胺、三乙醇胺等之醇胺類;氫氧化四甲基銨、氫氧化四乙基銨等之第四級銨鹽;吡咯、哌啶等之環狀胺類等之鹼性溶液。又,上述各溶液的溶劑可適宜選擇純水、醇類。又,也可使用添加有適當量之界面活性劑者。鹼濃度例如為0.01~20質量%。 Further, as the etching solution EQ, for example, an inorganic alkali solution or an organic alkali solution can be used. The inorganic alkali solution may, for example, be a solution containing an alkali metal hydroxide such as hydrazine hydrate and ethylenediamine, potassium hydroxide, sodium hydroxide, sodium carbonate, sodium citrate or sodium metasilicate. An ammonia solution, an etching solution containing hydrazine hydroxide, hydrazine and 1,3-dimethyl-2-imidazolidinone as main components. The organic alkali solution is, for example, a first-grade amine such as ethylamine or n-propylamine; a second-order amine such as diethylamine or di-n-butylamine; and a third amine such as triethylamine or methyldiethylamine. Alkamines; alkanolamines such as dimethylethanolamine and triethanolamine; fourth-order ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; cyclic amines such as pyrrole and piperidine; Alkaline solution. Further, as the solvent of each of the above solutions, pure water or an alcohol can be appropriately selected. Further, a surfactant to which an appropriate amount of a surfactant is added may also be used. The alkali concentration is, for example, 0.01 to 20% by mass.

又,化學蝕刻部43之另外的態樣,也可為具 有上側噴嘴43a、滾輪43c及床構件(無圖示)的構成。此態樣時,上側噴嘴43a與滾輪43c之各部的構成係與上述實施形態同樣,故省略說明。此態樣之化學蝕刻部43之床構件係設置於搬送帶42a之網狀物之-Z側,沿著XY平面而形成。此床構件係與搬送帶42a對向配置。床構件可與搬送帶42a接觸,也可不接觸。床構件接觸搬送帶42a被配置時,2個滾輪43c之間的區間,形成可儲存蝕刻液EQ之上述儲存部47。又,床構件未接觸搬送帶42a被配置時,也可形成上述儲存部47。此時,例如為以2個滾輪43c之下部與床構件挾著搬送帶42a之網狀物的狀態,搬送帶42a與2個滾輪43c及床構件接觸。因此,2個滾輪43c之間的區間成為可儲存蝕刻液EQ,形成儲存部47。藉由這種床構件,對於Y方向,2個滾輪43c之間的區間變得更容易形成蝕刻液EQ之儲存部47。因此,成為容易維持多孔性樹脂膜F浸漬於被儲存於儲存部47之蝕刻液EQ的狀態。床構件之材料係與搬送帶42a同樣,配合蝕刻液EQ之種類或濃度,適宜選擇具有耐久性的材料即可,例如使用氯乙烯等來形成。又,床構件可在Z方向設置被貫通之複數的孔。藉此,由蝕刻液EQ之供給源通過床構件的孔,可將蝕刻液EQ供給至儲存部47。設置床構件的孔時,也可不設置上側噴嘴43a。 Moreover, the other aspect of the chemical etching unit 43 may also be There are a configuration of the upper nozzle 43a, the roller 43c, and the bed member (not shown). In this aspect, the configuration of each of the upper nozzle 43a and the roller 43c is the same as that of the above embodiment, and thus the description thereof will be omitted. The bed member of the chemical etching portion 43 of this aspect is formed on the -Z side of the mesh of the conveyor belt 42a, and is formed along the XY plane. This bed member is disposed opposite to the conveyor belt 42a. The bed member may or may not be in contact with the conveyor belt 42a. When the bed member contact conveyance belt 42a is disposed, the storage portion 47 in which the etching liquid EQ can be stored is formed in the interval between the two rollers 43c. Further, when the bed member is not in contact with the conveyance belt 42a, the storage portion 47 may be formed. At this time, for example, the conveyance belt 42a is in contact with the two rollers 43c and the bed member in a state in which the lower portion of the two rollers 43c and the bed member are next to the mesh of the conveyance belt 42a. Therefore, the interval between the two rollers 43c is such that the etching liquid EQ can be stored to form the storage portion 47. With such a bed member, in the Y direction, the interval between the two rollers 43c becomes easier to form the storage portion 47 of the etching liquid EQ. Therefore, it is easy to maintain the state in which the porous resin film F is immersed in the etching liquid EQ stored in the storage portion 47. Similarly to the conveyor belt 42a, the material of the bed member may be selected from materials having a durability, such as vinyl chloride or the like, in accordance with the type or concentration of the etching liquid EQ. Further, the bed member may be provided with a plurality of holes that are penetrated in the Z direction. Thereby, the etching liquid EQ can be supplied to the storage portion 47 through the hole of the bed member from the supply source of the etching liquid EQ. When the hole of the bed member is provided, the upper nozzle 43a may not be provided.

接著,如圖6所示,洗淨部44係洗淨化學蝕刻後之多孔性樹脂膜F。洗淨部44係配置於化學蝕刻部43之+Y側(多孔性樹脂膜F之搬送方向的前方)。洗淨 部44具有供給洗淨液的供給部(無圖示)。又,也可具有回收洗淨多孔性樹脂膜F後之廢液的回收部(無圖示)等。化學蝕刻部43與洗淨部44,其內部所含有的液體不同,故在由化學蝕刻部43搬出之前面位置也可設置前述吸水滾輪。吸水滾輪被配置於相對於多孔性樹脂膜F為+Z側及-Z側之至少一方,較佳為配置於兩方。 Next, as shown in FIG. 6, the cleaning part 44 washes the porous resin film F after the purification etching. The cleaning unit 44 is disposed on the +Y side of the chemical etching unit 43 (before the conveyance direction of the porous resin film F). Wash The portion 44 has a supply unit (not shown) that supplies the cleaning liquid. In addition, a recovery unit (not shown) or the like for recovering the waste liquid after washing the porous resin film F may be provided. Since the chemical etching unit 43 and the cleaning unit 44 have different liquids contained therein, the water absorbing roller can be provided at the position before the chemical etching unit 43 is carried out. The water absorbing roller is disposed on at least one of the +Z side and the -Z side with respect to the porous resin film F, and is preferably disposed on both sides.

液體排除部45係將附著於洗淨後之多孔性樹脂膜F的液體除去。可進行預備乾燥。液體排除部45配置於洗淨部44之+Y側(多孔性樹脂膜F之搬送方向的前方)。液體排除部45設置吸水滾輪等。藉由使吸水滾輪與多孔性樹脂膜F接觸,搬送多孔性樹脂膜F,同時可吸收附著於多孔性樹脂膜F之液體。吸水滾輪對搬送方向之配置,只要是由液體排除部45搬出的前面時,即無特別限制。 The liquid removal unit 45 removes the liquid adhering to the washed porous resin film F. Pre-drying is possible. The liquid draining portion 45 is disposed on the +Y side of the cleaning portion 44 (before the transport direction of the porous resin film F). The liquid discharge portion 45 is provided with a water suction roller or the like. By bringing the water absorbing roller into contact with the porous resin film F, the porous resin film F is conveyed, and the liquid adhering to the porous resin film F can be absorbed. The arrangement of the water suction roller in the conveyance direction is not particularly limited as long as it is carried out by the liquid discharge unit 45.

加熱部46係配置於腔41之+Y側(多孔性樹脂膜F之搬送方向的前方)。加熱部46係將藉由液體排除部45進行液體排除後之多孔性樹脂膜F以100℃~300℃左右加熱,進行乾燥步驟或後烘烤處理步驟。加熱部46設置將多孔性樹脂膜F加熱的加熱部等。加熱部46之+Y側設置搬出多孔性樹脂膜F之搬出口46b。 The heating unit 46 is disposed on the +Y side of the chamber 41 (before the conveyance direction of the porous resin film F). The heating unit 46 heats the porous resin film F after the liquid is removed by the liquid removing unit 45 at a temperature of about 100° C. to 300° C. to perform a drying step or a post-baking treatment step. The heating unit 46 is provided with a heating unit or the like that heats the porous resin film F. The +Y side of the heating unit 46 is provided with a discharge port 46b for carrying out the porous resin film F.

〔捲繞部(2)〕 [Winding section (2)]

圖8係概略表示化學蝕刻單元40之+Y側之構成的斜視圖。 FIG. 8 is a perspective view schematically showing a configuration of the +Y side of the chemical etching unit 40.

如圖8所示,化學蝕刻單元40之+Y側設置搬出多孔性樹脂膜F之搬出口46b。由搬出口46b搬出的多孔性樹脂膜F係以捲繞部80捲繞。 As shown in FIG. 8, the +Y side of the chemical etching unit 40 is provided with a carry-out port 46b for carrying out the porous resin film F. The porous resin film F carried out from the carry-out port 46b is wound around the winding portion 80.

捲繞部80係於軸承81被安裝軸構件SF的構成。軸構件SF係將由搬出口40b搬出的多孔性樹脂膜F捲繞形成捲筒體RF。軸構件SF係對於軸承81,設置成可拆裝。軸構件SF安裝於軸承81時,可繞著與X方向平行之軸線旋轉來被支撐。捲繞部80具有可使安裝於軸承81之軸構件SF旋轉之無圖示的驅動機構。藉由驅動機構使軸構件SF旋轉,以捲繞多孔性樹脂膜F。在形成有捲筒體RF的狀態下,將軸構件SF由軸承81取下,可回收捲筒體RF。 The winding portion 80 is configured such that the bearing 81 is attached to the shaft member SF. The shaft member SF winds the porous resin film F carried out from the delivery port 40b to form a roll body RF. The shaft member SF is provided to be detachable with respect to the bearing 81. When the shaft member SF is attached to the bearing 81, it can be supported by being rotated about an axis parallel to the X direction. The winding portion 80 has a drive mechanism (not shown) that can rotate the shaft member SF attached to the bearing 81. The shaft member SF is rotated by a drive mechanism to wind the porous resin film F. In a state in which the reel body RF is formed, the shaft member SF is removed by the bearing 81, and the reel body RF can be recovered.

〔製造方法〕 〔Production method〕

其次,說明使用如上述構成之製造系統SYS,製造多孔性樹脂膜F之動作之一例。圖9(a)~(f)表示多孔性樹脂膜F之製造過程之一例的圖。 Next, an example of an operation of manufacturing the porous resin film F using the manufacturing system SYS having the above configuration will be described. (a) to (f) of FIG. 9 are views showing an example of a manufacturing process of the porous resin film F.

首先,塗佈單元10中,形成未燒成膜FA。在塗佈單元10係使基材送出滾輪11a旋轉,送出搬送基材S,將搬送基材S掛置於支撐滾輪11b~11d後,以基材捲取滾輪11e捲繞。然後,由基材送出滾輪11a,依序送出搬送基材S,同時以基材捲取滾輪11e進行捲繞。 First, in the coating unit 10, an unfired film FA is formed. In the coating unit 10, the substrate feeding roller 11a is rotated, the conveying substrate S is fed out, and the conveying substrate S is placed on the supporting rollers 11b to 11d, and then wound by the substrate winding roller 11e. Then, the roller 11a is fed from the substrate, and the conveyance substrate S is sequentially fed, and the substrate winding roller 11e is wound.

此狀態下,第1噴嘴12係配置於吐出位置P1,吐出口12a朝向+Y方向。藉此,吐出口12a係朝向 搬送基材S之中,以支撐滾輪11b支撐的部分。然後,由吐出口12a吐出第1塗佈液Q1。第1塗佈液Q1係由吐出口12a朝向+Y方向吐出,到達搬送基材S後,伴隨搬送基材S之移動,被塗佈於搬送基材S上。藉此,在搬送基材S上形成藉由第1塗佈液Q1所得之第1塗佈膜F1。 In this state, the first nozzle 12 is disposed at the discharge position P1, and the discharge port 12a is oriented in the +Y direction. Thereby, the discharge port 12a is oriented Among the conveyance base materials S, the portion supported by the support roller 11b. Then, the first coating liquid Q1 is discharged from the discharge port 12a. The first coating liquid Q1 is discharged from the discharge port 12a in the +Y direction, and reaches the conveyance base material S, and is applied to the conveyance base material S in association with the movement of the conveyance substrate S. Thereby, the first coating film F1 obtained by the first coating liquid Q1 is formed on the conveyance substrate S.

接著,第2噴嘴13係配置於吐出位置P2,吐出口13a朝向-Z方向。藉此,吐出口13a係朝向搬送基材S之中,以支撐滾輪11c支撐的部分。然後,由吐出口13a吐出第2塗佈液Q2。第2塗佈液Q2係由吐出口13a朝向-Z方向吐出,到達形成於搬送基材S之第1塗佈膜F1上後,伴隨搬送基材S之移動,被塗佈於第1塗佈膜F1上。藉此,如圖9(a)所示,在第1塗佈膜F1上形成藉由第2塗佈液所得之第2塗佈膜F2。又,第1塗佈膜F1及第2塗佈膜F2中,微粒子A2以彼此以不同的體積比包含於樹脂材料A1內。又,微粒子之含有率設定為第1塗佈膜F1大於第2塗佈膜F2。 Next, the second nozzle 13 is disposed at the discharge position P2, and the discharge port 13a faces the -Z direction. Thereby, the discharge port 13a is directed toward the conveyance base material S, and supports the portion supported by the roller 11c. Then, the second coating liquid Q2 is discharged from the discharge port 13a. The second coating liquid Q2 is discharged from the discharge port 13a in the -Z direction, reaches the first coating film F1 formed on the conveyance substrate S, and is applied to the first coating in association with the movement of the conveyance substrate S. On film F1. Thereby, as shown in FIG. 9(a), the second coating film F2 obtained from the second coating liquid is formed on the first coating film F1. Further, in the first coating film F1 and the second coating film F2, the fine particles A2 are contained in the resin material A1 at a different volume ratio from each other. Further, the content ratio of the fine particles is set such that the first coating film F1 is larger than the second coating film F2.

又,在吐出口12a、13a朝向搬送基材S之中,藉由支撐滾輪11b、11c支撐的部分的狀態下,被塗佈第1塗佈液Q1及第2塗佈液Q2,因此,第1塗佈液Q1及第2塗佈液Q2到達搬送基材S時,對搬送基材S產生作用的力被支撐滾輪11b、11c所接受。因此,搬送基材S之撓曲或振動等之發生被抑制,搬送基材S上以均勻的厚度安定形成第1塗佈膜F1及第2塗佈膜F2。 In the state in which the discharge rollers 11a and 13a are supported by the support rollers 11b and 11c, the first coating liquid Q1 and the second coating liquid Q2 are applied to the conveyance base material S, so that the first coating liquid Q1 and the second coating liquid Q2 are applied. When the coating liquid Q1 and the second coating liquid Q2 reach the conveying substrate S, the force acting on the conveying substrate S is received by the supporting rollers 11b and 11c. Therefore, the occurrence of deflection, vibration, and the like of the conveyance substrate S is suppressed, and the first coating film F1 and the second coating film F2 are formed in a uniform thickness on the conveyance substrate S.

接著,搬送基材S移動,而第1塗佈膜F1及 第2塗佈膜F2之層合部分被搬入乾燥部14之腔14a內時,在乾燥部14中,進行第1塗佈膜F1及第2塗佈膜F2之乾燥。乾燥部14係使用加熱部14b,以例如50℃~100℃左右的溫度,將第1塗佈膜F1及第2塗佈膜F2加熱。此溫度範圍時,搬送基材S不會發生應變或變形等,可將第1塗佈膜F1及第2塗佈膜F2加熱。藉由使第1塗佈膜F1及第2塗佈膜F2之層合體乾燥,如圖9(b)所示,形成未燒成膜FA。 Next, the transfer substrate S moves, and the first coating film F1 and When the laminated portion of the second coating film F2 is carried into the cavity 14a of the drying unit 14, the drying of the first coating film F1 and the second coating film F2 is performed in the drying unit 14. The drying unit 14 heats the first coating film F1 and the second coating film F2 at a temperature of, for example, about 50° C. to 100° C., using the heating unit 14 b. In this temperature range, the conveyance substrate S does not undergo strain or deformation, and the first coating film F1 and the second coating film F2 can be heated. By drying the laminate of the first coating film F1 and the second coating film F2, as shown in FIG. 9(b), the unfired film FA is formed.

本說明書中,層合體係指由前述第1塗佈膜F1及前述第2塗佈膜F2所構成之未燒成膜。形成本發明之多孔性之醯亞胺系樹脂膜時,第1液體及第2液體中,聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺之中,使用各自同種的樹脂時,由形成之前述第1塗佈膜F1及前述第2塗佈膜F2所構成之未燒成膜(或多孔性之醯亞胺系樹脂膜)實質成為1層,但是形成微粒子之含有率不同之未燒成膜(或具有空孔率不同之區域之多孔性之醯亞胺系樹脂膜),故也包含第1液體及第2液體使用同種樹脂的情形,在本說明書中稱為層合體。 In the present specification, the lamination system refers to an unfired film composed of the first coating film F1 and the second coating film F2. When the porous bismuth imide resin film of the present invention is formed, among the first liquid and the second liquid, the same species is used for polyamine, polyimine, polyamidimide or polyamine. In the case of the resin, the unfired film (or the porous yttrium-based resin film) composed of the first coating film F1 and the second coating film F2 formed is substantially one layer, but forms fine particles. In the case of an unfired film (or a bismuth imino resin film having a porosity in a region having a different porosity), the same liquid is used in the first liquid and the second liquid, and is referred to in the present specification. It is a laminate.

接著,搬送基材S移動,未燒成膜FA之前端部分到達支撐滾輪11d(剝離部15)時,例如藉由作業者之手作業,將此前端部分由搬送基材S剝離。本實施形態中,搬送基材S之材料例如使用PET,故使第1塗佈膜F1及第2塗佈膜F2乾燥形成未燒成膜FA時,由搬送基材S剝離變得容易,故作業者可容易進行剝離。 Then, the conveyance substrate S moves, and when the end portion of the unfired film FA reaches the support roller 11d (peeling portion 15), the tip end portion is peeled off from the conveyance substrate S by, for example, an operator's hand. In the present embodiment, the material for transporting the substrate S is, for example, PET. When the first coating film F1 and the second coating film F2 are dried to form the unfired film FA, the separation of the substrate S is facilitated. The operator can easily peel off.

將未燒成膜FA之前端部分剝離後,接著,搬送基材S移動,藉由第1噴嘴12形成第1塗佈膜F1。又,接著,藉由第2噴嘴13形成第2塗佈膜F2,以乾燥部14形成未燒成膜FA。藉此,未燒成膜FA形成帶狀,由乾燥部14搬出至+Y側的未燒成膜FA之長度漸漸變長。作業者在剝離部15,繼續剝離未燒成膜FA。然後,被剝離後之未燒成膜FA之前端到達捲繞部50之軸構件SF的長度時,作業者以手作業將未燒成膜FA掛置於搬出滾輪11f,同時,未燒成膜FA之前端部分裝設於軸構件SF。然後,為了配合依序形成未燒成膜FA,且其陸續被剝離,在捲繞部50使軸構件SF旋轉。藉此,被剝離後之未燒成膜FA依序由塗佈單元10搬出,被捲繞部50之軸構件SF捲繞,形成捲筒體R。構成捲筒體R之未燒成膜FA如圖9(c)所示,成為由搬送基材S剝離後的狀態,表面及裏面均露出。 After the front end portion of the unfired film FA is peeled off, the conveyance substrate S moves, and the first coating film F1 is formed by the first nozzle 12 . Then, the second coating film F2 is formed by the second nozzle 13, and the unfired film FA is formed in the drying portion 14. Thereby, the unfired film FA is formed into a strip shape, and the length of the unfired film FA carried out by the drying section 14 to the +Y side gradually becomes longer. The operator continues to peel off the unfired film FA at the peeling portion 15. Then, when the front end of the unfired film FA which has been peeled off reaches the length of the shaft member SF of the winding portion 50, the operator hangs the unfired film FA on the carry-out roller 11f by hand, and at the same time, the unfired film The front end portion of the FA is mounted on the shaft member SF. Then, in order to form the unfired film FA in order to be sequentially peeled off, the shaft member SF is rotated in the winding portion 50. Thereby, the unfired film FA which has been peeled off is sequentially carried out by the coating unit 10, and is wound by the shaft member SF of the winding portion 50 to form the roll body R. As shown in Fig. 9(c), the unfired film FA constituting the roll body R is in a state of being peeled off by the transfer substrate S, and both the surface and the inside are exposed.

剝離未燒成膜FA之前端部分的作業、及剝離後之前端部分安裝於軸構件SF的作業等,不限於作業者以手作業進行的態樣,例如可使用機械手等自動進行。又,為了提高未燒成膜FA之剝離性,故也可在搬送基材S之表面形成脫模層。 The work of peeling off the front end portion of the unfired film FA and the work of attaching the front end portion to the shaft member SF after peeling are not limited to the case where the operator performs the work by hand, and can be automatically performed, for example, using a robot or the like. Further, in order to improve the releasability of the unfired film FA, a release layer may be formed on the surface of the conveyance substrate S.

特定長度的未燒成膜FA被捲繞於軸構件SF後,切斷未燒成膜FA,同時將軸構件SF連捲筒體R一同由軸承51取下。然後,將新的軸構件SF安裝於捲繞部50之軸承51,將未燒成膜FA之切斷端部裝設於此軸構 件SF,使旋轉且接著形成未燒成膜FA,可製作新的捲筒體R。 After the unfired film FA of a specific length is wound around the shaft member SF, the unfired film FA is cut, and the shaft member SF is continuously removed from the roll body R by the bearing 51. Then, the new shaft member SF is attached to the bearing 51 of the winding portion 50, and the cut end portion of the unfired film FA is attached to the shaft structure. The SF is rotated to form an unfired film FA, and a new roll body R can be produced.

另外,例如作業者將由軸承51連捲筒體R一同取下的軸構件SF搬送至送出部60,安裝於軸承61。此軸構件SF之搬送動作及安裝動作也可使用機械手或搬送裝置等自動進行。軸構件SF安裝於軸承61後,藉由使軸構件SF旋轉,由捲筒體R依序拉出未燒成膜FA,而未燒成膜FA被搬入燒成單元20之腔21內。又,將未燒成膜FA之前端搬入腔21時,作業者也可以手作業,也可使用機械手等自動進行。 Further, for example, the operator transports the shaft member SF that has been removed by the bearing 51 continuous rolling cylinder R to the delivery portion 60, and is attached to the bearing 61. The conveying operation and the mounting operation of the shaft member SF can also be automatically performed using a robot or a conveying device. After the shaft member SF is attached to the bearing 61, the unfired film FA is sequentially pulled out from the roll body R by rotating the shaft member SF, and the unfired film FA is carried into the cavity 21 of the firing unit 20. Further, when the front end of the unfired film FA is carried into the chamber 21, the operator can also work by hand or automatically using a robot or the like.

被搬入腔21內之未燒成膜FA被載置於搬送帶23a上,遵循搬送帶23a之旋轉,被搬送至+Y方向。又,也可使用張力滾輪23d、23e調整張力。然後,搬送未燒成膜FA,同時使用加熱部22,進行未燒成膜FA之燒成。 The unfired film FA carried into the cavity 21 is placed on the conveyor belt 23a, and is conveyed to the +Y direction in accordance with the rotation of the conveyor belt 23a. Further, the tension can be adjusted using the tension rollers 23d and 23e. Then, the unfired film FA is transferred, and the heating portion 22 is used to perform baking of the unfired film FA.

燒成時之溫度係因未燒成膜FA之構造而異,較佳為120℃~375℃左右,又更佳為150℃~350℃。又,微粒子中含有機材料時,必須設定成比其熱分解溫度更低之溫度。塗佈液含有聚醯胺酸時,此燒成時,完成醯亞胺化較佳,但是未燒成膜FA為由聚醯亞胺、聚醯胺醯亞胺或聚醯胺所構成,藉由燒成單元20,對於未燒成膜FA進行高溫處理的情形不在此限。 The temperature at the time of firing varies depending on the structure of the unfired film FA, and is preferably from about 120 ° C to about 375 ° C, more preferably from 150 ° C to 350 ° C. Further, when the organic material is contained in the fine particles, it is necessary to set a temperature lower than the thermal decomposition temperature. When the coating liquid contains polylysine, it is preferable to carry out the ruthenium imidation at the time of baking, but the unfired film FA is composed of polyimine, polyamidimide or polyamine. The case where the unfired film FA is subjected to high temperature treatment by the firing unit 20 is not limited thereto.

又,燒成條件,例如塗佈液含有聚醯胺酸及/或聚醯亞胺時,可以3小時使由室溫升溫至375℃後,在 375℃下保持20分鐘的方法或可以50℃刻度,階段性由室溫升溫至375℃(各階段保持20分鐘),最後,在375℃下保持20分鐘等進行階段性加熱。又,可將未燒成膜FA之端部固定於SUS製之模型等,防止變形。 Further, when the baking conditions include polyamic acid and/or polyimide, the temperature can be raised from room temperature to 375 ° C for 3 hours. The method of holding at 375 ° C for 20 minutes or 50 ° C scale, the temperature is raised from room temperature to 375 ° C (each stage is maintained for 20 minutes), and finally, the stage heating is carried out by holding at 375 ° C for 20 minutes or the like. Further, the end portion of the unfired film FA can be fixed to a model made of SUS or the like to prevent deformation.

藉由這種燒成,如圖9(d)所示,形成燒成膜FB。燒成膜FB係在經醯亞胺化或高溫處理之樹脂層A3的內部含有微粒子A2。燒成膜FB之膜厚,可藉由以例如測微器(micrometer)等測量複數處的厚度,求得平均值而得到。較佳的平均膜厚,若使用於分隔膜等時,較佳為3μm~500μm,更佳為5μm~100μm,又更佳為10μm~30μm。 By this baking, as shown in FIG. 9(d), the fired film FB is formed. The fired film FB contains fine particles A2 inside the resin layer A3 which is subjected to hydrazine imidization or high temperature treatment. The film thickness of the fired film FB can be obtained by measuring the thickness at a plurality of points, for example, by a micrometer or the like, and obtaining an average value. The preferred average film thickness is preferably from 3 μm to 500 μm, more preferably from 5 μm to 100 μm, still more preferably from 10 μm to 30 μm, when used in a separator film or the like.

在燒成單元20所形成的燒成膜FB,由燒成單元20搬出時,不經捲繞而被搬入除去單元30。燒成膜FB之前端部分搬入除去單元30時,作業者可以手作業進行,也可使用機械手等自動進行。 When the fired film FB formed by the firing unit 20 is carried out by the firing unit 20, it is carried into the removing unit 30 without being wound. When the front end portion of the fired film FB is carried into the removal unit 30, the operator can perform the work by hand or automatically using a robot or the like.

被搬入除去單元30之燒成膜FB被載置於搬送帶35a上,遵循搬送帶35a之旋轉,被搬送至+Y方向。除去單元30係隨著燒成膜FB之搬送,首先,在蝕刻部32中,除去微粒子A2。微粒子A2之材質,使用例如二氧化矽時,蝕刻部32中,燒成膜FB被浸漬於低濃度之氟化氫等之蝕刻液中。藉此,微粒子A2溶解於蝕刻液而被除去,如圖9(e)所示,形成在樹脂層A3之內部含有多孔部A4的多孔性樹脂膜F。 The fired film FB of the loading and unloading unit 30 is placed on the conveyance belt 35a, and is conveyed to the +Y direction in accordance with the rotation of the conveyance belt 35a. The removal unit 30 is transported along with the fired film FB. First, the fine particles A2 are removed in the etching unit 32. When the material of the fine particles A2 is, for example, cerium oxide, in the etching portion 32, the fired film FB is immersed in an etching liquid such as hydrogen fluoride having a low concentration. Thereby, the fine particles A2 are dissolved in the etching liquid and removed, and as shown in FIG. 9(e), the porous resin film F containing the porous portion A4 inside the resin layer A3 is formed.

其後,遵循搬送帶35a之旋轉,多孔性樹脂 膜F依序被搬入洗淨部33及液體排除部34中。洗淨部33係藉由洗淨液洗淨多孔性樹脂膜F。又,液體排除部34係進行多孔性樹脂膜F之液體排除,除去洗淨液。然後,多孔性樹脂膜F由除去單元30被搬出,被搬入化學蝕刻單元40中。 Thereafter, following the rotation of the conveyor belt 35a, the porous resin The film F is sequentially carried into the cleaning unit 33 and the liquid removing unit 34. The cleaning unit 33 cleans the porous resin film F by the cleaning liquid. Moreover, the liquid discharge part 34 removes the liquid of the porous resin film F, and removes a washing liquid. Then, the porous resin film F is carried out by the removing unit 30 and carried into the chemical etching unit 40.

被搬入化學蝕刻單元40之多孔性樹脂膜F係被載置於搬送帶42a上,遵循搬送帶42a之旋轉,被搬送至+Y方向。化學蝕刻單元40係隨著多孔性樹脂膜F之搬送,首先在化學蝕刻部43中,對於多孔部A4之內部進行化學蝕刻處理。化學蝕刻部43係多孔性樹脂膜F被浸漬於蝕刻液EQ之儲存部47,如圖9(f)所示,多孔部A4之內部被除去。此時,多孔部A4之毛邊被除去,同時確保連通性。 The porous resin film F carried into the chemical etching unit 40 is placed on the conveyor belt 42a, and is conveyed to the +Y direction in accordance with the rotation of the conveyor belt 42a. The chemical etching unit 40 carries out the chemical etching treatment on the inside of the porous portion A4 in the chemical etching portion 43 as the porous resin film F is transported. The chemical etching portion 43 is a porous resin film F immersed in the storage portion 47 of the etching liquid EQ, and as shown in FIG. 9(f), the inside of the porous portion A4 is removed. At this time, the burrs of the porous portion A4 are removed while ensuring connectivity.

其後,遵循搬送帶42a之旋轉,多孔性樹脂膜F依序被搬入洗淨部44及液體排除部45中。洗淨部44係藉由洗淨液洗淨多孔性樹脂膜F,液體排除部45係進行液體排除。又,液體排除部45係進行多孔性樹脂膜F之液體排除。然後,加熱部46中,液體排除後之多孔性樹脂膜F被加熱至100℃~300℃左右,除去洗淨液。多孔性樹脂膜F由化學蝕刻單元40被搬出,藉由捲繞部80之軸構件SF捲繞。 Thereafter, the porous resin film F is sequentially carried into the cleaning portion 44 and the liquid discharge portion 45 in accordance with the rotation of the conveyor belt 42a. The cleaning unit 44 cleans the porous resin film F by the cleaning liquid, and the liquid removing unit 45 removes the liquid. Further, the liquid removing portion 45 performs liquid removal of the porous resin film F. Then, in the heating unit 46, the porous resin film F after the liquid is removed is heated to about 100 to 300 ° C to remove the cleaning liquid. The porous resin film F is carried out by the chemical etching unit 40 and wound by the shaft member SF of the winding portion 80.

如以上,本實施形態之製造系統SYS係具備:由將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺之樹脂材料A1及微粒子A2的未燒成膜FA,進行燒成 所得之燒成膜FB中,除去微粒子A2,形成多孔性樹脂膜F的膜形成單元70及將多孔性樹脂膜F之一部分溶解的化學蝕刻單元40,故可以一連串流程進行未燒成膜FA之形成、未燒成膜FA之燒成(燒成膜FB之形成)、及微粒子A2之除去(多孔性樹脂膜F之形成)之3個步驟。藉此,可有效率製造多孔性樹脂膜F。又,藉由化學蝕刻單元40除去多孔部A4之內部,故可提高多孔部A4之開孔率,可確保多孔部A4之連通性。這種多孔性樹脂膜F作為鋰離子電池等之分隔膜使用時,離子順利移動,故可提高電池之電特性。因此,可得到開孔率優異之高品質的多孔性樹脂膜F。 As described above, the manufacturing system SYS of the present embodiment includes the unfired film FA including the resin material A1 and the fine particles A2 containing polyglycine, polyimine, polyamidamine or polyamine. Burning In the obtained fired film FB, the fine particle A2 is removed, the film forming unit 70 which forms the porous resin film F, and the chemical etching unit 40 which partially dissolves the porous resin film F are formed, so that the unfired film FA can be carried out in a series of processes. Three steps of formation of the unfired film FA (formation of the fired film FB) and removal of the fine particles A2 (formation of the porous resin film F) are carried out. Thereby, the porous resin film F can be efficiently produced. Further, since the inside of the porous portion A4 is removed by the chemical etching unit 40, the opening ratio of the porous portion A4 can be increased, and the connectivity of the porous portion A4 can be ensured. When such a porous resin film F is used as a separator film of a lithium ion battery or the like, ions are smoothly moved, so that electrical characteristics of the battery can be improved. Therefore, a high-quality porous resin film F having an excellent opening ratio can be obtained.

又,化學蝕刻單元(40)具備:儲存蝕刻液(EQ)之儲存部(47)及將醯亞胺系樹脂膜(多孔性樹脂膜F)浸漬於儲存部內之蝕刻液的膜搬送部(搬送部42),故對於醯亞胺系樹脂膜,可有效率地進行化學蝕刻處理。 In addition, the chemical etching unit (40) includes a storage unit (47) for storing an etching solution (EQ), and a film conveying unit for immersing the yttrium imide resin film (porous resin film F) in the storage portion (transporting) Since the portion 42) is used, the chemical etching treatment can be efficiently performed on the quinone imine resin film.

又,醯亞胺系樹脂膜(多孔性樹脂膜F)為形成帶狀,化學蝕刻單元(49)將由膜形成單元(70)送出之醯亞胺系樹脂膜(多孔性樹脂膜F)依序收納,故可適用於捲對捲(roll-to-roll)方式等之製造步驟,因此,可有效率地形成醯亞胺系樹脂膜(多孔性樹脂膜F)。 Further, the quinone imine resin film (porous resin film F) is formed into a strip shape, and the chemical etching unit (49) sequentially transports the quinone imine resin film (porous resin film F) sent from the film forming unit (70). Since it can be applied to a manufacturing process such as a roll-to-roll method, the quinone-imide resin film (porous resin film F) can be efficiently formed.

又,具備將由化學蝕刻單元(40)排出之帶狀的醯亞胺系樹脂膜(多孔性樹脂膜F)進行捲繞的捲繞部(80),故可將進行化學蝕刻處理後之醯亞胺系樹脂膜捲 繞,而有效率地回收。 In addition, the winding portion (80) for winding a strip-shaped yttrium-based resin film (porous resin film F) discharged from the chemical etching unit (40) is provided, so that it can be subjected to chemical etching treatment. Amine resin film roll Wrap around and recycle efficiently.

又,本實施形態之多孔性樹脂膜F的製造方法係包含:由含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子(A2)的膜(燒成膜FB)中,除去微粒子,形成多孔性之醯亞胺系樹脂膜(多孔性樹脂膜F)者;及進行將醯亞胺系樹脂膜之一部分溶解之化學蝕刻處理者,故可以一連串流程進行未燒成膜FA之形成、未燒成膜FA之燒成(燒成膜FB之形成)、及微粒子A2之除去(多孔性樹脂膜F之形成)之3個步驟。藉此,可提高多孔性樹脂膜F之製造效率。又,藉由化學蝕刻單元40除去多孔部A4之內部,故可提高多孔部A4之開孔率,可確保多孔部A4之連通性。 Moreover, the method for producing the porous resin film F of the present embodiment includes a film containing a polyaminic acid, a polyimine, a polyamidimide or a polyamide and a fine particle (A2) (a fired film). In FB), the porous bismuth imide resin film (porous resin film F) is removed, and the chemical etching process for partially dissolving one of the quinone imide resin films is performed, so that the process can be carried out in a series of processes. The formation of the fired film FA, the firing of the unfired film FA (formation of the fired film FB), and the removal of the fine particles A2 (formation of the porous resin film F) are three steps. Thereby, the manufacturing efficiency of the porous resin film F can be improved. Further, since the inside of the porous portion A4 is removed by the chemical etching unit 40, the opening ratio of the porous portion A4 can be increased, and the connectivity of the porous portion A4 can be ensured.

〔變形例〕 [Modification]

上述實施形態係除去單元30與化學蝕刻單元40以分別的單元形態,離開於Y方向排列設置的構成為例來說明,但是不限於此。圖10表示變形例之製造系統SYS2之一部分之例的圖。如圖10所示,製造系統SYS2係除去單元230與化學蝕刻單元240在Y方向連接的構成。 In the above-described embodiment, the configuration in which the removing unit 30 and the chemical etching unit 40 are arranged in a separate unit form and arranged in the Y direction is described as an example, but the present invention is not limited thereto. Fig. 10 is a view showing an example of a part of a manufacturing system SYS2 of a modification. As shown in FIG. 10, the manufacturing system SYS2 is configured such that the removing unit 230 and the chemical etching unit 240 are connected in the Y direction.

除去單元230具有蝕刻部32、洗淨部33及液體排除部34。蝕刻部32、洗淨部33及液體排除部34係於Y方向排列配置。蝕刻部32、洗淨部33及液體排除部34之各部的構成係與上述實施形態同樣,故省略說明。 The removing unit 230 has an etching portion 32, a cleaning portion 33, and a liquid removing portion 34. The etching unit 32, the cleaning unit 33, and the liquid removal unit 34 are arranged side by side in the Y direction. The configuration of each of the etching portion 32, the cleaning portion 33, and the liquid discharge portion 34 is the same as that of the above-described embodiment, and thus the description thereof is omitted.

化學蝕刻單元240具有化學蝕刻部43、洗淨 部44及液體排除部45。化學蝕刻部43、洗淨部44及液體排除部45係於Y方向排列配置。又,化學蝕刻部43、洗淨部44及液體排除部45之各部的構成係與上述實施形態同樣,故省略說明。 The chemical etching unit 240 has a chemical etching portion 43 and is cleaned. The portion 44 and the liquid removing portion 45. The chemical etching unit 43, the cleaning unit 44, and the liquid removing unit 45 are arranged side by side in the Y direction. The configuration of each of the chemical etching unit 43, the cleaning unit 44, and the liquid removing unit 45 is the same as that of the above embodiment, and thus the description thereof is omitted.

除去單元230及化學蝕刻單元240具有共同之腔241及共同之搬送部242。腔241係收容除去單元230之各構成(蝕刻部32、洗淨部33及液體排除部34)及化學蝕刻單元240之各構成(化學蝕刻部43、洗淨部44及液體排除部45)。腔241具有搬入燒成膜FB之搬入口241a及搬出多孔性樹脂膜F之搬出口241b。 The removal unit 230 and the chemical etching unit 240 have a common cavity 241 and a common transfer portion 242. The cavity 241 houses the respective configurations (the etching portion 32, the cleaning portion 33, and the liquid removing portion 34) of the removing unit 230 and the chemical etching unit 240 (the chemical etching portion 43, the cleaning portion 44, and the liquid removing portion 45). The cavity 241 has a transfer inlet 241a into which the fired film FB is carried, and a transfer port 241b through which the porous resin film F is carried out.

搬送部242係跨接除去單元230與化學蝕刻單元240,將燒成膜FB及多孔性樹脂膜F搬送至+Y方向。搬送部242具有搬送帶242a、驅動滾輪242b及被動滾輪242c~42e。又,除了驅動滾輪242b及被動滾輪242c~242e之外,也可在除去單元230或化學蝕刻單元240之內部設置支撐搬送帶242a之支撐滾輪。 The conveyance unit 242 bridges the removal unit 230 and the chemical etching unit 240, and conveys the fired film FB and the porous resin film F to the +Y direction. The conveyance unit 242 has a conveyance belt 242a, a drive roller 242b, and passive rollers 242c to 42e. Further, in addition to the driving roller 242b and the passive rollers 242c to 242e, a supporting roller that supports the conveying belt 242a may be provided inside the removing unit 230 or the chemical etching unit 240.

搬送帶242a係形成無端狀,沿著Y方向配置。搬送帶242a係使用對於蝕刻部32所用之蝕刻液及化學蝕刻部43所用之化學蝕刻液之各自具有耐久性的材料而形成。搬送帶242a例如形成網狀。搬送帶242a係在具有張力的狀態,與XY平面大致平行,跨接於驅動滾輪242b與被動滾輪242c~242e之間。多孔性樹脂膜F係載置於搬送帶242a被搬送。 The conveyor belt 242a is formed in an endless shape and arranged along the Y direction. The conveyor belt 242a is formed using a material having durability for each of the etching liquid used in the etching portion 32 and the chemical etching liquid used in the chemical etching portion 43. The conveyor belt 242a is formed, for example, in a mesh shape. The conveyance belt 242a is in a state of being tensioned, and is substantially parallel to the XY plane, and is bridged between the drive roller 242b and the passive rollers 242c to 242e. The porous resin film F is placed on the conveyance belt 242a and conveyed.

又,搬送帶242a可跨接除去單元230與化學 蝕刻單元240而連續,但是可配合各單元所用的蝕刻液及化學蝕刻液,或配合各單元之搬送距離,亦適宜分割而形成。 Also, the conveyor belt 242a can bridge the removal unit 230 and chemistry Although the etching unit 240 is continuous, it can be formed by mixing the etching liquid and the chemical etching liquid used for each unit, or the conveyance distance of each unit.

驅動滾輪242b係配置於腔241之內部之+Y側端部。驅動滾輪242b設置成可繞著與X方向平行的軸線旋轉。藉由驅動滾輪242b旋轉,而搬送帶242a係成為如圖10之繞著順時針旋轉。藉由搬送帶242a旋轉,而載置於搬送帶242a上之多孔性樹脂膜F被搬送至+Y方向。 The drive roller 242b is disposed at the +Y side end of the inside of the cavity 241. The drive roller 242b is arranged to be rotatable about an axis parallel to the X direction. By rotating the drive roller 242b, the conveyor belt 242a is rotated clockwise as shown in FIG. The porous resin film F placed on the conveyance belt 242a is conveyed to the +Y direction by the rotation of the conveyance belt 242a.

被動滾輪242c係配置於腔241之內部之-Y側端部。被動滾輪242d及242e係各自配置於被動滾輪242c及驅動滾輪242b之-Z側。被動滾輪242c~242e設置成可繞著與X方向平行的軸線旋轉。被動滾輪242c~242e係追蹤搬送帶42a之旋轉而旋轉。 The passive roller 242c is disposed at the -Y side end of the interior of the cavity 241. The passive rollers 242d and 242e are respectively disposed on the -Z side of the driven roller 242c and the driving roller 242b. The passive rollers 242c-242e are arranged to rotate about an axis parallel to the X direction. The passive rollers 242c to 242e rotate by tracking the rotation of the conveyor belt 42a.

如此,膜形成單元(70)包含:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺、及微粒子之液體(第1塗佈液Q1、第2塗佈液Q2)塗佈於基材(搬送基材S),形成未燒成膜(FA)的塗佈單元(10);在塗佈單元內或塗佈單元外,將由基材剝離後的未燒成膜進行燒成,形成含有微粒子之燒成膜(FB)的燒成單元(20);及由燒成膜中除去微粒子形成多孔性之醯亞胺系樹脂膜(多孔性樹脂膜F)的除去單元(30),而化學蝕刻單元(40)與除去單元連接,故可對於醯亞胺系樹脂膜,有效率地進行化學蝕刻。 In this manner, the film forming unit (70) includes a liquid containing a poly-proline, a polyimine, a polyamidamine or a polyamide, and fine particles (the first coating liquid Q1, the second coating liquid) Q2) coating unit (10) coated on a substrate (transporting substrate S) to form an unfired film (FA); unfired after being peeled off from the substrate in the coating unit or outside the coating unit The film is fired to form a firing unit (20) containing a sintered film (FB) of fine particles; and the yttrium imide resin film (porous resin film F) is formed by removing fine particles from the fired film to form a porous yttrium-based resin film (porous resin film F). Since the unit (30) and the chemical etching unit (40) are connected to the removing unit, chemical etching can be efficiently performed on the quinone-based resin film.

又,藉由上述搬送部242,多孔性樹脂膜F係 藉由1個搬送帶242a被搬送從除去單元230至化學蝕刻單元240。因此,在除去單元230與化學蝕刻單元240之間,多孔性樹脂膜F不必進行交付承接。藉此,對於多孔性樹脂膜F,可極力壓抑外力產生作用。 Moreover, the porous resin film F is the transport unit 242 The transfer unit 230 is transported from the removal unit 230 to the chemical etching unit 240 by one transfer belt 242a. Therefore, between the removal unit 230 and the chemical etching unit 240, the porous resin film F does not have to be delivered. Thereby, the porous resin film F can suppress the external force generating action as much as possible.

又,上述實施形態係以捲繞部50、80為將軸構件SF拆裝於軸承51、81之構成為例來說明,但不限於此,也可使用例如圖12所示之捲繞裝置90。以下舉使用捲繞裝置90取代捲繞部50的情形為例來說明。 Further, in the above embodiment, the winding portions 50 and 80 are exemplified as a configuration in which the shaft member SF is detached from the bearings 51 and 81. However, the present invention is not limited thereto, and for example, the winding device 90 shown in Fig. 12 may be used. . Hereinafter, a case where the winding device 90 is used instead of the winding portion 50 will be described as an example.

如圖11所示,捲繞裝置90具有框體91、軸構件SF、軸承92、驅動部93、中繼滾輪94a~94e及滾輪支撐部95。框體91係支撐軸構件SF、軸承92、驅動部93、中繼滾輪94a~94e、滾輪支撐部95之各部。 As shown in FIG. 11, the winding device 90 has a frame body 91, a shaft member SF, a bearing 92, a drive unit 93, relay rollers 94a to 94e, and a roller support portion 95. The frame 91 supports each of the shaft member SF, the bearing 92, the drive unit 93, the relay rollers 94a to 94e, and the roller support portion 95.

軸構件SF係捲繞由塗佈單元10搬出之未燒成膜FA,形成捲筒體R。軸構件SF係對於軸承92,設置成可拆裝。軸構件SF係被裝設於軸承92時,可繞著與X方向平行的軸線旋轉地被軸承92支撐。在形成有捲筒體R的狀態下,將軸構件SF由軸承92取下,可將捲筒體R移動至其他的單元或回收。 The shaft member SF winds the unfired film FA carried out by the coating unit 10 to form a roll body R. The shaft member SF is detachably attached to the bearing 92. When the shaft member SF is attached to the bearing 92, it can be supported by the bearing 92 so as to be rotatable about an axis parallel to the X direction. In a state in which the roll body R is formed, the shaft member SF is removed by the bearing 92, and the roll body R can be moved to another unit or recovered.

中繼滾輪94a~94e係調整未燒成膜FA之張力,同時將未燒成膜FA送至軸構件SF。中繼滾輪94a~94e例如形成圓筒狀,各自與X方向平行配置。本實施形態中,未燒成膜FA係依中繼滾輪94a、94b、94c、94d、94e之順序跨接,但不限於此,也可不使用一部分的中繼滾輪。又,也可為中繼滾輪94a~94e之中,至少1 個可藉由滾輪支撐部95移動。例如也可為滾輪支撐部95使中繼滾輪94b往Z方向或Y方向移動。又,也可為藉由滾輪支撐部95,使中繼滾輪94b繞著與X軸平行之軸線AX回轉的構成。此時,藉由使中繼滾輪94b移動(回轉)的量(距離)回饋(feed back)於軸承92之捲繞速度,可使未燒成膜FA之張力保持一定。又,也可為在中繼滾輪94b之-Y側,使經由支點軸配置的可移動的重疊(無圖示)移動,變更對中繼滾輪94b之負荷的構成。此時,藉由前述重疊調整施加於中繼滾輪94b之負荷,可調整未燒成膜FA之張力。 The relay rollers 94a to 94e adjust the tension of the unfired film FA, and simultaneously send the unfired film FA to the shaft member SF. The relay rollers 94a to 94e are formed, for example, in a cylindrical shape, and are arranged in parallel with the X direction. In the present embodiment, the unfired film FA is bridged in the order of the relay rollers 94a, 94b, 94c, 94d, and 94e. However, the present invention is not limited thereto, and a part of the relay rollers may not be used. Moreover, at least one of the relay rollers 94a to 94e may be used. The pieces can be moved by the roller support portion 95. For example, the roller support portion 95 may move the relay roller 94b in the Z direction or the Y direction. Further, the relay roller 94b may be configured to be rotated around the axis AX parallel to the X-axis by the roller support portion 95. At this time, the tension of the unfired film FA can be kept constant by feeding back (rotation) the amount (distance) of the relay roller 94b to the winding speed of the bearing 92. Further, a configuration in which the movable overlap (not shown) disposed via the fulcrum shaft is moved on the -Y side of the relay roller 94b, and the load on the relay roller 94b is changed. At this time, the tension applied to the relay roller 94b by the overlap adjustment can adjust the tension of the unfired film FA.

中繼滾輪94a~94e不限於與X方向平行之配置,也可為對於X方向傾斜配置。又,中繼滾輪R21~R25不限於圓筒形,也可使用形成有錐型、輻射型、凹型等之冠部(crown)者。 The relay rollers 94a to 94e are not limited to being arranged in parallel with the X direction, and may be arranged obliquely in the X direction. Further, the relay rollers R21 to R25 are not limited to a cylindrical shape, and a crown formed of a tapered shape, a radiation type, a concave type or the like may be used.

又,上述捲繞裝置90也可取代捲繞部80來使用。又,藉由朝與使未燒成膜FA等之膜捲繞時相反方向,使軸構件SF旋轉,可將未燒成膜FA等之膜送出。因此,例如也可使用捲繞裝置90取代上述送出部60。 Further, the winding device 90 may be used instead of the winding portion 80. In addition, by rotating the shaft member SF in a direction opposite to the case where the film of the unfired film FA or the like is wound, the film of the unfired film FA or the like can be sent out. Therefore, for example, the winding device 90 may be used instead of the above-described delivery portion 60.

〔分隔膜〕 [separator film]

其次,說明實施形態之分隔膜100。圖12表示鋰離子電池200之一例的模式圖,一部分被切開的狀態。如圖12所示,鋰離子電池200具有兼正極端子之金屬殼201及負極端子202。金屬殼201之內部設置正極201a、負極 202a及分隔膜100,浸漬於無圖示之電解液中。分隔膜100係配置於正極201a與負極202a之間,防止正極201a與負極202a之間之電接觸。正極201a可使用鋰過渡金屬氧化物,負極202a可使用例如鋰或碳(石墨)等。 Next, the separator film 100 of the embodiment will be described. Fig. 12 is a schematic view showing an example of a lithium ion battery 200, in a state in which a part is cut. As shown in FIG. 12, the lithium ion battery 200 has a metal case 201 and a negative electrode terminal 202 which are also positive electrode terminals. The inside of the metal shell 201 is provided with a positive electrode 201a and a negative electrode. 202a and the separator film 100 are immersed in an electrolyte solution (not shown). The separator 100 is disposed between the positive electrode 201a and the negative electrode 202a to prevent electrical contact between the positive electrode 201a and the negative electrode 202a. A lithium transition metal oxide can be used for the positive electrode 201a, and lithium, carbon (graphite) or the like can be used for the negative electrode 202a.

上述實施形態所記載的多孔性樹脂膜F係作為此鋰離子電池200之分隔膜100使用。此時,例如將形成有第1塗佈膜F1之面作為鋰離子電池之負極202a側,可提高電池性能。又,圖12係以方型之鋰離子電池200之分隔膜100為例來說明,但是不限於此。上述多孔性樹脂膜F也可使用作為圓筒型或層合型等之任何形態之鋰離子電池的分隔膜。又,除鋰離子電池之分隔膜外,上述多孔性樹脂膜F可作為燃料電池電解質膜、氣體或液體之分離用膜、低介電率材料使用。 The porous resin film F described in the above embodiment is used as the separator film 100 of the lithium ion battery 200. At this time, for example, the surface on which the first coating film F1 is formed is used as the negative electrode 202a side of the lithium ion battery, and battery performance can be improved. Further, FIG. 12 is an example in which the separator film 100 of the prismatic lithium ion battery 200 is taken as an example, but is not limited thereto. As the porous resin film F, a separator film of a lithium ion battery of any form such as a cylindrical type or a laminate type can be used. Further, the porous resin film F can be used as a fuel cell electrolyte membrane, a gas or liquid separation membrane, or a low dielectric material, in addition to the separator film of the lithium ion battery.

以上針對實施形態說明,但是本發明不限於上述說明,在不脫離本發明之技術特徵的範圍內,可為各種變更。 The present invention has been described above with respect to the embodiments, but the present invention is not limited to the above description, and various modifications can be made without departing from the spirit and scope of the invention.

例如上述實施形態及變形例中,除去多孔性樹脂膜F之一部分時,以僅進行化學蝕刻法的情形為例來說明,但是不限於此。例如也可藉由組合化學蝕刻法與物理除去方法的方法,除去多孔性樹脂膜F之一部分。物理的方法例如可使用藉由電漿(氧、氬等)、電暈放電等之乾蝕刻、將研磨劑(例如、氧化鋁(硬度9)等)分散於液體中,藉由將此於芳香族聚醯亞胺薄膜之表面,以30m/s~100m/s之速度進行照射,處理聚醯亞胺薄膜表面的方法等。此等 之手法可適用於在除去單元30中,由燒成膜FB中除去微粒子之前及微粒子之除去後之任一情形。又,僅可適用於在除去微粒子後進行的情形之物理的方法,可採用壓黏於將對象表面以液體潤濕後之紙板(pasteboard)薄膜(例如PET薄膜等之聚酯薄膜)後,未經乾燥或乾燥後,將多孔性樹脂膜F由紙板薄膜拉剝離的方法。因液體之表面張力或靜電附著力,在僅多孔性樹脂膜F之表面層,殘留於紙板薄膜上的狀態下,多孔性樹脂膜F由紙板薄膜上被拉剝離。 For example, in the above-described embodiment and the modification, when one portion of the porous resin film F is removed, the case where only the chemical etching method is performed will be described as an example, but the invention is not limited thereto. For example, a part of the porous resin film F may be removed by a combination of a chemical etching method and a physical removal method. The physical method can be, for example, dry etching using a plasma (oxygen, argon, or the like), corona discharge, or the like, and dispersing an abrasive (for example, alumina (hardness 9) or the like) in a liquid, thereby imparting aroma to the liquid. The surface of the polyimide film is irradiated at a speed of 30 m/s to 100 m/s to treat the surface of the polyimide film. Such The method can be applied to any of the removal unit 30 before the removal of the fine particles from the fired film FB and after the removal of the fine particles. Further, the physical method which can be applied only to the case after the removal of the fine particles can be carried out by press-bonding a pasteboard film (for example, a polyester film such as a PET film) which is wetted with a liquid on the surface of the object. After drying or drying, the porous resin film F is peeled off from the paperboard film. The porous resin film F is pulled and peeled off from the cardboard film in a state where only the surface layer of the porous resin film F remains on the cardboard film due to the surface tension of the liquid or the electrostatic adhesion.

例如,在上述實施形態及變形例係以使用微粒子之含有率不同之2種類的塗佈液,形成未燒成膜FA的情形為例來說明,但不限於此,可為以1種類的塗佈液形成未燒成膜者。此時,可不使用第1噴嘴12及第2噴嘴13之中任一者,也可省略其中之一的噴嘴。省略其中之一的噴嘴時,省略第1噴嘴12而使用第2噴嘴13為佳。 For example, in the above-described embodiments and modifications, the case where the unfired film FA is formed by using two types of coating liquids having different contents of fine particles is described as an example. However, the present invention is not limited thereto, and may be applied in one type. The cloth liquid forms an unfired film. In this case, one of the first nozzle 12 and the second nozzle 13 may not be used, and one of the nozzles may be omitted. When one of the nozzles is omitted, the first nozzle 12 is omitted and the second nozzle 13 is preferably used.

又,上述實施形態及變形例係以塗佈單元10、燒成單元20、除去單元30及化學蝕刻單元40各配置1台的構成為例來說明,但是不限於此。例如上述單元之至少1個可設置複數台。此時,例如每單位時間內可處理之未燒成膜FA、燒成膜FB或多孔性樹脂膜F之份量(例如長度等)較少的單元可多配置,可提高製造系統SYS全體之製造效率。 Further, in the above-described embodiments and modifications, the configuration in which the coating unit 10, the firing unit 20, the removing unit 30, and the chemical etching unit 40 are disposed one by one is described as an example, but the invention is not limited thereto. For example, at least one of the above units may be provided with a plurality of units. In this case, for example, a unit having a small amount (for example, length) of the unfired film FA, the fired film FB, or the porous resin film F which can be processed per unit time can be disposed, and the manufacturing system SYS can be manufactured as a whole. effectiveness.

又,上述實施形態及變形例係以塗佈單元 10、燒成單元20、除去單元30、及化學蝕刻單元40之各單元,將未燒成膜FA、燒成膜FB或多孔性樹脂膜F之各膜沿著Y方向搬送的情形為例來說明,但不限於此。例如任一的單元可將膜搬送至X方向、Y方向、Z方向或此等之合成方向,或也可在1個單元內適宜變更搬送方向。 Further, the above embodiments and modifications are coating units 10. Each of the firing unit 20, the removing unit 30, and the chemical etching unit 40 is an example in which each of the unfired film FA, the fired film FB, or the porous resin film F is transported in the Y direction. Description, but not limited to this. For example, any of the units may transport the film to the X direction, the Y direction, the Z direction, or the like, or the transfer direction may be appropriately changed in one unit.

又,除上述實施形態之構成外,也可設置對於在化學蝕刻單元40,一部分被除去之多孔性樹脂膜F,進行後處理的後處理單元。此後處理單元例如對於多孔性樹脂膜F,進行除靜電處理之帶靜電防止單元等。帶靜電防止單元被搭載有例如靜電除去器等之除電裝置。 Further, in addition to the configuration of the above embodiment, a post-processing unit that performs post-treatment on the partially removed porous resin film F in the chemical etching unit 40 may be provided. After that, the processing unit performs a static electricity prevention unit or the like for removing the static electricity, for example, the porous resin film F. The static electricity prevention unit is mounted with a static elimination device such as an electrostatic discharge device.

又,上述實施形態及變形例係以進行塗佈單元10之塗佈、燒成單元20之燒成、除去單元30之除去之3個步驟的情形為例來說明,但是不限於此者。例如塗佈膜之材料使用聚醯亞胺、聚醯胺醯亞胺、或聚醯胺時,可不進行燒成。因此,未進行燒成時,例如藉由在燒成單元20與除去單元30之間設置捲繞裝置及送出裝置等,可將以塗佈單元10形成的未燒成膜FA,不經由燒成單元20而搬入除去單元30中。又,未進行燒成時,製造多孔性之醯亞胺系樹脂膜之製造系統可為包含:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子之液體塗佈於基材,形成未燒成膜的塗佈單元;前述塗佈單元內或前述塗佈單元外,由前述基材剝離後之前述未燒成膜中除去前述微粒子的除去單元的製造系統。又,未進行燒成時,由除去微粒子之除去單元30,將多孔性樹脂膜F搬 出後,也可進行前述後烘烤處理步驟。又,後烘烤處理步驟前,也可經由化學蝕刻單元40。此時,後烘烤處理步驟可藉由加熱部46進行。 Further, the above-described embodiments and modifications are described by taking three steps of applying the coating unit 10, firing the firing unit 20, and removing the removing unit 30 as an example, but are not limited thereto. For example, when the material of the coating film is polyimine, polyamidimide or polyamine, the firing may not be performed. Therefore, when the firing is not performed, for example, by providing a winding device, a feeding device, and the like between the firing unit 20 and the removing unit 30, the unfired film FA formed by the coating unit 10 can be prevented from firing. The unit 20 is carried into the removal unit 30. Further, in the case where the firing is not performed, the production system for producing the porous bismuth imide resin film may include: containing polylysine, polyimine, polyamidimide or polyamine and fine particles. a coating unit in which a liquid is applied to a substrate to form an unfired film; and a removal unit in which the fine particles are removed from the unfired film after the substrate is peeled off from the substrate or in the coating unit system. When the firing is not performed, the porous resin film F is removed by the removing unit 30 for removing fine particles. After the release, the aforementioned post-baking treatment step can also be performed. Also, the chemical etching unit 40 may be passed before the post-baking treatment step. At this time, the post-baking treatment step can be performed by the heating portion 46.

又,上述實施形態及變形例係以所謂的捲對捲方式形成多孔性樹脂膜F的構成為例來說明,但不限於此。例如化學蝕刻單元40中之處理結束後,多孔性樹脂膜F由化學蝕刻單元40被搬出時,可不需以捲繞部80捲繞,可以特定長度切斷,經切斷者也可回收。 Further, in the above-described embodiments and modifications, the configuration in which the porous resin film F is formed by the so-called roll-to-roll method is described as an example, but the invention is not limited thereto. For example, when the porous resin film F is carried out by the chemical etching unit 40 after the completion of the treatment in the chemical etching unit 40, it is not necessary to be wound by the winding portion 80, and it can be cut at a specific length, and can be recovered by the cut.

SYS‧‧‧製造系統 SYS‧‧‧ Manufacturing System

F‧‧‧多孔性樹脂膜(醯亞胺系樹脂膜) F‧‧‧Porous resin film (醯iamine resin film)

FA‧‧‧未燒成膜 FA‧‧‧Unfired film

FB‧‧‧燒成膜 FB‧‧‧Boiled film

10‧‧‧塗佈單元 10‧‧‧ Coating unit

20‧‧‧燒成單元 20‧‧‧burning unit

30‧‧‧除去單元 30‧‧‧Removal unit

40‧‧‧化學蝕刻單元 40‧‧‧Chemical etching unit

50‧‧‧捲繞部 50‧‧‧Winding Department

60‧‧‧送出部 60‧‧‧Send out

70‧‧‧膜形成單元 70‧‧‧film forming unit

80‧‧‧捲繞部 80‧‧‧Winding Department

Claims (6)

一種醯亞胺系樹脂膜製造系統,其係製造多孔性之醯亞胺系樹脂膜的製造系統,具備:由含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺、及微粒子之膜中,除去前述微粒子,形成前述多孔性之醯亞胺系樹脂膜的膜形成單元;及將前述醯亞胺系樹脂膜之一部分溶解的化學蝕刻單元。 A system for producing a quinone imine resin film, which is a system for producing a porous bismuth imide resin film, comprising: a polyamido acid, a polyamidiamine, a polyamidimide or a polyamine And a film forming unit that forms the porous bismuth imide resin film and a chemical etching unit that partially dissolves the quinone imide resin film in the film of the fine particles. 如申請專利範圍第1項之醯亞胺系樹脂膜製造系統,其中前述化學蝕刻單元具備:儲存蝕刻液之儲存部、將前述醯亞胺系樹脂膜浸漬於前述儲存部內之蝕刻液的膜搬送部。 The imine-based resin film production system according to the first aspect of the invention, wherein the chemical etching unit includes: a storage portion for storing the etching liquid; and a film transfer of the etching liquid in which the quinone-based resin film is immersed in the storage portion unit. 如申請專利範圍第1或2項之醯亞胺系樹脂膜製造系統,其中前述醯亞胺系樹脂膜係形成帶狀,前述化學蝕刻單元係將由前述膜形成單元送出之前述醯亞胺系樹脂膜依序收納。 The imine-based resin film production system according to claim 1 or 2, wherein the quinone imine resin film is formed into a strip shape, and the chemical etching unit is the quinone imide resin sent from the film forming unit. The film is stored in order. 如申請專利範圍第1~3項中任一項之醯亞胺系樹脂膜製造系統,其係具備將由前述化學蝕刻單元排出之前述帶狀之醯亞胺系樹脂膜進行捲繞之捲繞部。 The yttrium-imide-based resin film production system according to any one of the first to third aspects of the present invention, further comprising a winding portion that winds the strip-shaped bismuth imide resin film discharged by the chemical etching unit . 如申請專利範圍第1~4項中任一項之醯亞胺系樹脂膜製造系統,其中前述膜形成單元包含:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子的液體塗佈於基材,形成未燒成膜的塗佈單元;在前述塗佈單元內或前述塗佈單元外,將由前述基材剝離後的前述未燒成膜 進行燒成,形成含有前述微粒子之燒成膜的燒成單元;及由前述燒成膜中除去前述微粒子,形成多孔性之前述醯亞胺系樹脂膜的除去單元;前述化學蝕刻單元與前述除去單元連接。 The quinone imine resin film manufacturing system according to any one of claims 1 to 4, wherein the film forming unit comprises: polyglycine, polyimine, polyamidimide or poly a coating unit in which a liquid of guanamine and fine particles is applied to a substrate to form an unfired film; and the unfired film after peeling off the substrate in the coating unit or outside the coating unit a firing unit that forms a fired film containing the fine particles, and a removal unit that removes the fine particles from the fired film to form a porous bismuth imide resin film; the chemical etching unit and the removal Unit connection. 一種醯亞胺系樹脂膜製造方法,其係製造多孔性之醯亞胺系樹脂膜之製造方法,包含:由含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺、及微粒子之膜中,除去前述微粒子,形成前述多孔性之醯亞胺系樹脂膜,將前述醯亞胺系樹脂膜之一部分溶解進行化學蝕刻處理。 A method for producing a quinone imine resin film, which is a method for producing a porous bismuth imide resin film, comprising: comprising a polyaminic acid, a polyimine, a polyamidimide or a polyamine In the film of the fine particles, the microparticles are removed to form the porous quinone imine resin film, and one of the quinoneimide resin films is partially dissolved and chemically etched.
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