TWI673154B - Porous bismuth imide resin film production system, separator film, and porous bismuth imide resin film production method - Google Patents

Porous bismuth imide resin film production system, separator film, and porous bismuth imide resin film production method Download PDF

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TWI673154B
TWI673154B TW104117951A TW104117951A TWI673154B TW I673154 B TWI673154 B TW I673154B TW 104117951 A TW104117951 A TW 104117951A TW 104117951 A TW104117951 A TW 104117951A TW I673154 B TWI673154 B TW I673154B
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film
porous
unfired
resin film
fine particles
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TW201600301A (en
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川村芳次
水木秀行
杉山真也
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日商東京應化工業股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/443Particulate material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D67/00Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
    • B01D67/0002Organic membrane manufacture
    • B01D67/0023Organic membrane manufacture by inducing porosity into non porous precursor membranes
    • B01D67/003Organic membrane manufacture by inducing porosity into non porous precursor membranes by selective elimination of components, e.g. by leaching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D71/00Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/06Organic material
    • B01D71/58Other polymers having nitrogen in the main chain, with or without oxygen or carbon only
    • B01D71/62Polycondensates having nitrogen-containing heterocyclic rings in the main chain
    • B01D71/64Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/24Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/26Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/403Manufacturing processes of separators, membranes or diaphragms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409Separators, membranes or diaphragms characterised by the material
    • H01M50/411Organic material
    • H01M50/414Synthetic resins, e.g. thermoplastics or thermosetting resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Cell Separators (AREA)

Abstract

本發明係提供可提高多孔性之醯亞胺系樹脂膜之製造效率之多孔性之醯亞胺系樹脂膜製造系統、分隔膜(separator)及多孔性之醯亞胺系樹脂膜製造方法。 The present invention provides a porous fluorene-imide-based resin film manufacturing system, a separator, and a method for manufacturing a porous fluorene-imide-based resin film that can improve the production efficiency of a porous fluorene-imide-based resin film.

其係含有:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺之樹脂材料(A1)及微粒子(A2)的塗佈液(第1塗佈液(Q1)及第2塗佈液(Q2)塗佈於搬送基材(S),形成未燒成膜(FA)的塗佈單元(10),在此塗佈單元(10)內,由搬送基材(S)剝離後的前述未燒成膜(FA)進行燒成,形成含有微粒子之燒成膜(FB)的燒成單元(20)及由燒成膜(FB)中除去微粒子(A2)的除去單元(30)。 It is a coating liquid (first coating liquid (Q1)) containing a resin material (A1) and fine particles (A2) containing polyamic acid, polyimide, polyimide, or polyimide And the second coating liquid (Q2) is applied to the transfer substrate (S) to form an unfired coating (FA) coating unit (10), and in this coating unit (10), the transfer substrate (10) S) firing the unfired film (FA) after peeling to form a firing unit (20) of a fired film (FB) containing fine particles and removal of fine particles (A2) from the fired film (FB) Unit (30).

Description

多孔性之醯亞胺系樹脂膜製造系統、分隔膜及多孔性之醯亞胺系樹脂膜製造方法 Porous perylene imine-based resin film manufacturing system, separator film, and porous perylene imine-based resin film manufacturing method

本發明係有關多孔性之醯亞胺系樹脂膜製造系統、分隔膜及多孔性之醯亞胺系樹脂膜製造方法。 The present invention relates to a porous fluorene imine-based resin film manufacturing system, a separation film, and a porous fluorene-imide resin film manufacturing method.

二次電池之一種的鋰離子電池係於被浸漬於電解液之正極與負極之間,配置分隔膜,藉由分隔膜防止正極與負極之間直接電接觸的構造。正極使用鋰過渡金屬氧化物,負極使用例如鋰或碳(石墨)等。充電時,鋰離子由正極通過分隔膜,往負極移動,放電時,鋰離子由負極通過分隔膜,往正極移動。這種分隔膜,近年則使用耐熱性高,且安全性高之多孔性聚醯亞胺膜所構成的分隔膜已為人知(參照例如專利文獻1等)。 A lithium-ion battery, which is a type of secondary battery, has a structure in which a separator is arranged between a positive electrode and a negative electrode which are immersed in an electrolytic solution. The separator prevents direct electrical contact between the positive electrode and the negative electrode. The positive electrode uses a lithium transition metal oxide, and the negative electrode uses, for example, lithium or carbon (graphite). During charging, lithium ions move from the positive electrode through the separator to the negative electrode, and during discharge, lithium ions move from the negative electrode through the separator to the positive electrode. Such a separator has been known in recent years as a separator composed of a porous polyimide film having high heat resistance and high safety (see, for example, Patent Document 1).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2011-111470號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2011-111470

上述多孔性聚醯亞胺膜,例如塗佈形成含有微粒子之聚醯胺酸或聚醯亞胺之未燒成膜,將此未燒成膜進行燒成形成燒成膜,藉由自燒成膜中除去微粒子來形成。以往則不存在將上述3個步驟以一聯線(line)進行的製造系統,因此,多孔性之聚醯亞胺膜之製造效率不太高。故需要製造效率更高的系統。 The porous polyimide film is, for example, applied to form an unfired film of polyamic acid or polyimide containing fine particles, and the unfired film is fired to form a fired film, and self-fired It is formed by removing fine particles from the film. Conventionally, there has not been a manufacturing system in which the above three steps are performed in one line. Therefore, the production efficiency of a porous polyimide film is not high. Therefore, a more efficient system needs to be manufactured.

有鑑於以上的情形,本發明之目的係提供可提高多孔性之醯亞胺系樹脂膜之製造效率的多孔性之醯亞胺系樹脂膜製造系統、分隔膜及多孔性之醯亞胺系樹脂膜製造方法。 In view of the above circumstances, an object of the present invention is to provide a porous ammonium resin film manufacturing system, a separator, and a porous ammonium resin that can improve the production efficiency of a porous ammonium resin film Film manufacturing method.

本發明之第1態樣之多孔性之醯亞胺系樹脂膜製造系統係製造多孔性之醯亞胺系樹脂膜之製造系統,其係含有:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子的液體塗佈於基材,形成未燒成膜的塗佈單元;在塗佈單元內或塗佈單元外,由基材剝離後的未燒成膜進行燒成,形成含有微粒子之燒成膜的燒成單元及由燒成膜中除去微粒子的除去單元。 According to the first aspect of the present invention, a porous amidine resin film production system is a production system for producing a porous amidine resin film, and the system includes: polyamine, polyimide, Polyamide, imine, or liquid of polyamine and fine particles are applied to the substrate to form an unfired coating unit; unfired after peeling from the substrate in or outside the coating unit The film is fired to form a firing unit for a fired film containing fine particles and a removing unit for removing the fine particles from the fired film.

本發明之第2態樣的分隔膜係藉由多孔性之醯亞胺系樹脂膜而形成的分隔膜,多孔性之醯亞胺系樹脂膜係藉由本發明之第1態樣之多孔性之醯亞胺系樹脂膜製 造系統所生成。 The separator film according to the second aspect of the present invention is a separator formed by using a porous sulfonium-based resin film, and the porous resin film according to the first aspect of the pore is based on a porous Made of fluorene imide resin film Build system.

本發明之第3態樣之多孔性之醯亞胺系樹脂 膜製造方法,其係製造多孔性之醯亞胺系樹脂膜的方法,其係含有:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子的液體塗佈於基材後,由基材剝離形成未燒成膜;將未燒成膜進行燒成,形成含有微粒子之燒成膜;及由燒成膜中除去微粒子。 The third aspect of the present invention is a porous osmium resin. A method for producing a film, which is a method for producing a porous sulfonium-based resin film, comprising: coating a liquid containing polyamic acid, polyimide, polyimide, polyimide, or polyimide and fine particles After the cloth is applied to the substrate, the substrate is peeled to form an unfired film; the unfired film is fired to form a fired film containing fine particles; and the fine particles are removed from the fired film.

依據本發明之態樣時,可提高多孔性之醯亞胺系樹脂膜之製造效率。 According to the aspect of the present invention, it is possible to improve the production efficiency of a porous fluorene-imide-based resin film.

SYS、SYS2、SYS3、SYS4、SYS5‧‧‧製造系統(多孔性之醯亞胺系樹脂製造系統) SYS, SYS2, SYS3, SYS4, SYS5 ‧‧‧ manufacturing system (Porous hydrazine resin manufacturing system)

F‧‧‧多孔性樹脂膜(多孔質之醯亞胺系樹脂膜) F‧‧‧Porous Resin Film (Porous Polyimide-based Resin Film)

FA‧‧‧未燒成膜 FA‧‧‧Unfired

FB‧‧‧燒成膜 FB‧‧‧fired film

S‧‧‧搬送基材(基材) S‧‧‧ Conveying substrate (substrate)

Q1‧‧‧第1塗佈液 Q1‧‧‧The first coating liquid

F1‧‧‧第1塗佈膜 F1‧‧‧The first coating film

Q2‧‧‧第2塗佈液 Q2‧‧‧Second coating solution

F2‧‧‧第2塗佈膜 F2‧‧‧The second coating film

A1‧‧‧樹脂材料 A1‧‧‧Resin material

A2‧‧‧微粒子 A2‧‧‧ Particle

R、RS、RF‧‧‧捲筒體 R, RS, RF‧‧‧ roll

10‧‧‧塗佈單元 10‧‧‧ Coating Unit

12‧‧‧第1噴嘴 12‧‧‧The first nozzle

13‧‧‧第2噴嘴 13‧‧‧ Nozzle 2

14‧‧‧乾燥部 14‧‧‧ Drying section

15‧‧‧剝離部 15‧‧‧ stripping department

20‧‧‧燒成單元 20‧‧‧ firing unit

30‧‧‧除去單元 30‧‧‧ Remove unit

32‧‧‧蝕刻部 32‧‧‧Etching Department

40、60、73‧‧‧捲繞部 40, 60, 73‧‧‧ Winding section

72‧‧‧浸漬部 72‧‧‧ Dip

80‧‧‧後處理單元 80‧‧‧ post-processing unit

81‧‧‧靜電防止單元 81‧‧‧static prevention unit

82‧‧‧蝕刻單元 82‧‧‧etching unit

90‧‧‧捲繞裝置 90‧‧‧ Winding device

100‧‧‧分隔膜 100‧‧‧ separator

200‧‧‧鋰離子電池 200‧‧‧lithium-ion battery

[圖1]表示本發明之實施形態之製造系統之一例的圖。 [FIG. 1] A diagram showing an example of a manufacturing system according to an embodiment of the present invention.

[圖2]表示設置於本實施形態之塗佈單元之噴嘴之一例的圖。 [Fig. 2] A diagram showing an example of a nozzle provided in a coating unit of this embodiment.

[圖3]表示本實施形態之捲繞部之一例的斜視圖。 Fig. 3 is a perspective view showing an example of a winding portion according to this embodiment.

[圖4]表示本實施形態之燒成單元之一例的斜視圖。 Fig. 4 is a perspective view showing an example of a firing unit according to this embodiment.

[圖5]表示本實施形態之除去單元之一例的斜視圖。 Fig. 5 is a perspective view showing an example of a removal unit according to this embodiment.

[圖6]表示本實施形態之醯亞胺系樹脂膜之製造過程之一例的圖。 FIG. 6 is a diagram showing an example of a manufacturing process of a fluorene imine-based resin film according to this embodiment.

[圖7]表示變形例之製造系統之一例的圖。 FIG. 7 is a diagram showing an example of a manufacturing system according to a modification.

[圖8]表示變形例之製造系統之一例的圖。 FIG. 8 is a diagram showing an example of a manufacturing system according to a modification.

[圖9]表示變形例之製造系統之一例的圖。 FIG. 9 is a diagram showing an example of a manufacturing system according to a modification.

[圖10]表示變形例之製造系統之一例的圖。 FIG. 10 is a diagram showing an example of a manufacturing system according to a modification.

[圖11]表示變形例之蝕刻單元之一例的圖。 11 is a diagram showing an example of an etching unit according to a modification.

[圖12]表示變形例之捲繞裝置之一例的圖。 [Fig. 12] A diagram showing an example of a winding device according to a modification.

[圖13]表示實施形態之分隔膜之一例的圖。 FIG. 13 is a diagram showing an example of a separation film according to the embodiment.

以下参照圖面說明本發明之實施形態。以下 使用XYZ座標系,說明圖中的方向。此XYZ座標系中,與水平面平行的平面作為XY平面。與此XY平面平行的一方向標記為X方向,與X方向正交之方向標記為Y方向。又,與XY平面垂直的方向標記為Z方向。X方向、Y方向及Z方向之各自在圖中之箭頭方向為+方向,與箭頭方向相反的方向作為-方向來說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. the following Use the XYZ coordinate system to explain the orientation in the figure. In this XYZ coordinate system, a plane parallel to the horizontal plane is taken as the XY plane. A direction parallel to the XY plane is marked as the X direction, and a direction orthogonal to the X direction is marked as the Y direction. A direction perpendicular to the XY plane is referred to as a Z direction. Each of the X direction, the Y direction, and the Z direction in the drawing is a + direction, and a direction opposite to the arrow direction is described as a-direction.

圖1表示製造系統SYS之一例的圖。圖1所 示之製造系統SYS係製造多孔性樹脂膜F(多孔性之醯亞胺系樹脂膜)者。製造系統SYS具備:塗佈特定之塗佈液,形成未燒成膜FA的塗佈單元10、將未燒成膜FA進行燒成形成燒成膜FB的燒成單元20、自燒成膜FB中除去微粒子,形成多孔性樹脂膜F的除去單元30及統合控制上述各單元的控制裝置(無圖示)。 FIG. 1 is a diagram showing an example of a manufacturing system SYS. Figure 1 The manufacturing system SYS shown below is one that manufactures a porous resin film F (a porous imine resin film). The manufacturing system SYS includes a coating unit 10 that applies a specific coating liquid to form an unfired film FA, a firing unit 20 that fires the unfired film FA to form a fired film FB, and a self-fired film FB The removal unit 30 for removing fine particles to form a porous resin film F, and a control device (not shown) that integrally controls the above units.

製造系統SYS例如於上下2階層所構成,塗 佈單元10被配置於2階部分,燒成單元20及除去單元 30被配置於1階部分。配置於相同一階之燒成單元20及除去單元30,例如在Y方向排列配置,但是不限於此,例如也可於X方向或X方向與Y方向之合成方向排列配置。 The manufacturing system SYS is composed of two layers, for example, The cloth unit 10 is arranged in the second-stage part, the firing unit 20 and the removing unit 30 is arranged in the first-order section. The firing units 20 and the removing units 30 arranged at the same stage are arranged in the Y direction, for example, but are not limited thereto. For example, they may be arranged in the X direction or a combined direction of the X direction and the Y direction.

製造系統SYS之階層構造或各階之各單元的 配置等,不限定於上述者,例如塗佈單元10及燒成單元20可配置於2階部分,除去單元30可被置於1階部分。 又,所有的單元也可配置於同一階。此時,各單元可一列配置或可以複數列配置。又,所有的單元也可配置於不同階層。 Hierarchical structure of manufacturing system SYS or each unit of each stage The arrangement and the like are not limited to those described above. For example, the coating unit 10 and the firing unit 20 may be arranged in a second-stage portion, and the removal unit 30 may be arranged in a first-stage portion. In addition, all the units may be arranged at the same stage. At this time, each unit may be arranged in one row or in plural rows. In addition, all units can be arranged in different levels.

製造系統SYS中,未燒成膜FA形成帶狀。 塗佈單元10之+Y側(未燒成膜FA之搬送方向的前方)設置將帶狀之未燒成膜FA捲繞成捲筒狀之捲繞部40。燒成單元20之-Y側(未燒成膜FA之搬送方向的後方)設置將捲筒狀之未燒成膜FA往燒成單元20送出之送出部50。 除去單元30之+Y側(燒成膜FB之搬送方向的前方)設置將多孔性樹脂膜F捲繞成捲筒狀的捲繞部60。 In the manufacturing system SYS, the unfired film FA is formed into a band shape. The + Y side of the coating unit 10 (front of the unfired film FA in the conveying direction) is provided with a winding portion 40 for winding the tape-shaped unfired film FA into a roll shape. The -Y side of the firing unit 20 (behind the conveyance direction of the unfired film FA) is provided with a delivery unit 50 that sends the roll-shaped unfired film FA to the firing unit 20. The + Y side of the removal unit 30 (forward of the conveyance direction of the fired film FB) is provided with a winding portion 60 for winding the porous resin film F into a roll shape.

如此,由送出部50經由燒成單元20及除去 單元30,至捲繞部60為止之區間(1階部分)係藉由所謂的捲對捲(roll-to-roll)方式來處理。因此,此區間係未燒成膜FA、燒成膜FB及多孔性樹脂膜F之各膜以連續狀態被搬送。 In this way, the delivery unit 50 passes through the firing unit 20 and is removed. The section (first-order section) from the unit 30 to the winding unit 60 is processed by a so-called roll-to-roll method. Therefore, each section in this section is conveyed in a continuous state with each of the unfired film FA, the fired film FB, and the porous resin film F.

[塗佈液] [Coating liquid]

在此,說明各單元之前,針對成為多孔性樹脂膜F之原料的塗佈液進行說明。塗佈液包含特定之樹脂材料、微粒子及溶劑。特定之樹脂材料,例如可列舉聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺、或聚醯胺。溶劑可使用可溶解此等之樹脂材料的有機溶劑。 Here, before explaining each unit, the coating liquid used as a raw material of the porous resin film F is demonstrated. The coating liquid contains a specific resin material, fine particles, and a solvent. Specific resin materials include, for example, polyamic acid, polyimide, polyimide, or polyimide. As the solvent, an organic solvent that can dissolve these resin materials can be used.

本實施形態中,塗佈液可使用微粒子之含有 率不同之2種類的塗佈液(第1塗佈液及第2塗佈液)。具體而言,第1塗佈液係以微粒子之含有率高於第2塗佈液來調製。藉此,可擔保未燒成膜FA、燒成膜FB及多孔性樹脂膜F之強度及柔軟性。又,藉由設置微粒子之含有率較低的層,可達成降低多孔性樹脂膜F之製造成本。 In the present embodiment, the coating liquid may contain fine particles. Two types of coating liquids (a first coating liquid and a second coating liquid) having different ratios. Specifically, the first coating liquid is prepared so that the content of fine particles is higher than that of the second coating liquid. This ensures the strength and flexibility of the unfired film FA, the fired film FB, and the porous resin film F. In addition, by providing a layer having a low content rate of fine particles, it is possible to reduce the manufacturing cost of the porous resin film F.

例如第1塗佈液中,以19:81~45:65之體 積比含有樹脂材料與微粒子。又,第2塗佈液中,以20:80~50:50之體積比含有樹脂材料與微粒子。但是以第1塗佈液之微粒子之含有率高於第2塗佈液之微粒子之含有率,來設定體積比。各樹脂材料之體積係使用各樹脂材料之質量乘以其比重所得的值。 For example, in the first coating solution, a body of 19:81 to 45:65 is used. The volume ratio contains a resin material and fine particles. The second coating liquid contains a resin material and fine particles in a volume ratio of 20:80 to 50:50. However, the volume ratio is set such that the content of the fine particles in the first coating liquid is higher than the content of the fine particles in the second coating liquid. The volume of each resin material is a value obtained by multiplying the mass of each resin material by its specific gravity.

上述的情形,將第1塗佈液之體積全體設定 為100時,微粒子之體積為65以上時,粒子為均勻分散,又,微粒子之體積為81以內時,粒子彼此不會凝聚而分散。因此,多孔性樹脂膜F可均勻形成孔。又,微粒子之體積比率在此範圍內時,可確保未燒成膜FA成膜時之剝離性。 In the above case, the entire volume of the first coating liquid is set. When it is 100, when the volume of the fine particles is 65 or more, the particles are uniformly dispersed, and when the volume of the fine particles is less than 81, the particles are not aggregated and dispersed. Therefore, the porous resin film F can form pores uniformly. In addition, when the volume ratio of the fine particles is within this range, peelability during film formation of the unfired film FA can be secured.

第2塗佈液之體積全體設定為100時,微粒 子之體積為50以上時,微粒子單體為均勻分散,又,微粒子之體積為80以內時,微粒子彼此不會凝聚,又,表面也不會產生龜裂等,因此,可安定形成電特性良好的多孔性樹脂膜F。 When the entire volume of the second coating liquid is set to 100, fine particles When the volume of the particles is 50 or more, the fine particles are uniformly dispersed, and when the volume of the particles is less than 80, the particles will not agglomerate with each other, and the surface will not crack, so it can form stable electrical properties. A porous resin film F.

上述2種類的塗佈液係藉由例如將預先分散 有微粒子之溶劑與聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺以任意之比率混合來調製。又,也可在預先分散有微粒子之溶劑中,使聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺進行聚合來調製。例如可在預先分散有微粒子之有機溶劑中,使四羧酸二酐及二胺進行聚合成為聚醯胺酸,或再進行醯亞胺化成為聚醯亞胺來製造。 The two types of coating liquids are dispersed in advance by, for example, The fine particle-containing solvent is prepared by mixing polyamic acid, polyimide, polyimide, or polyimide at an arbitrary ratio. Moreover, it can also be prepared by polymerizing polyamic acid, polyimide, polyimide, or polyimide in a solvent in which fine particles are dispersed in advance. For example, it can be produced by polymerizing tetracarboxylic dianhydride and diamine into a polyfluorinated acid in an organic solvent in which fine particles are dispersed in advance, or by further carrying out imidization to form polyimide.

塗佈液之黏度,最終較佳為300~2500cP,更 佳為400~1500cP之範圍,又更佳為600~1200cP之範圍。 塗佈液之黏度在此範圍內時,可均勻成膜。 The viscosity of the coating liquid is finally preferably 300 ~ 2500cP, more It is preferably in the range of 400 to 1500 cP, and more preferably in the range of 600 to 1200 cP. When the viscosity of the coating liquid is within this range, a uniform film can be formed.

上述塗佈液中,將微粒子與聚醯胺酸或聚醯 亞胺進行乾燥作為未燒成膜FA時,微粒子之材質為後述無機材料時,微粒子/聚醯亞胺之比率成為2~6(質量比),來混合微粒子與聚醯胺酸或聚醯亞胺即可。更佳為3~5(質量比)。微粒子之材質為後述有機材料時,微粒子/聚醯亞胺之比率成為1~3.5(質量比),來混合微粒子與聚醯胺酸或聚醯亞胺即可。更佳為1.2~3(質量比)。又,作為未燒成膜FA時,微粒子/聚醯亞胺之體積比率成為1.5~4.5,來混合微粒子與聚醯胺酸或聚醯亞胺即可。更佳為1.8~3(體積比)。作為未燒成膜FA時,微粒子/聚醯亞胺之 質量比或體積比在下限值以上時,分隔膜可得到適當密度的孔,在上限值以下時,不會產生黏度之增加或膜中之龜裂等之問題,可安定成膜。取代聚醯胺酸或聚醯亞胺,樹脂材料為聚醯胺醯亞胺或聚醯胺時,質量比也與上述同樣。 In the coating solution, fine particles are mixed with polyamic acid or polyfluorene When imine is dried as unfired film FA, when the material of the fine particles is an inorganic material described later, the ratio of fine particles / polyimide becomes 2 to 6 (mass ratio), and the fine particles are mixed with polyamic acid or polyimide Amine is sufficient. More preferably, it is 3 to 5 (mass ratio). When the material of the fine particles is an organic material described later, the ratio of the fine particles / polyimide is 1 to 3.5 (mass ratio), and the fine particles and the polyamic acid or polyimide may be mixed. More preferably, it is 1.2 to 3 (mass ratio). In the case of unfired film FA, the volume ratio of the fine particles / polyimide is 1.5 to 4.5, and the fine particles may be mixed with the polyamic acid or polyimide. More preferably, it is 1.8 to 3 (volume ratio). When used as unfired film FA, fine particles / polyimide When the mass ratio or volume ratio is above the lower limit value, pores of an appropriate density can be obtained for the separation film. When it is below the upper limit value, no increase in viscosity or cracks in the film can be caused, and the film can be formed stably. When the polyamic acid or polyimide is substituted and the resin material is polyimide or polyimide, the mass ratio is also the same as described above.

以下具體說明各樹脂材料。 Each resin material will be specifically described below.

<聚醯胺酸> <Polyamic acid>

本實施形態所用的聚醯胺酸係使任意之四羧酸二酐與二胺聚合所得者,無特別限定皆可使用。四羧酸二酐及二胺之使用量並無特殊限定,相對於四羧酸二酐1莫耳,較佳為使用二胺0.50~1.50莫耳,更佳為使用0.60~1.30莫耳,特佳為使用0.70~1.20莫耳。 The polyamino acid used in this embodiment is obtained by polymerizing any tetracarboxylic dianhydride and diamine, and it can be used without particular limitation. The amount of tetracarboxylic dianhydride and diamine used is not particularly limited. Compared to 1 mol of tetracarboxylic dianhydride, 0.50 to 1.50 mol of diamine is preferred, and 0.60 to 1.30 mol is more preferred. It is best to use 0.70 ~ 1.20 moles.

四羧酸二酐可適宜選擇以往作為聚醯胺酸之 合成原料使用的四羧酸二酐。四羧酸二酐可為芳香族四羧酸二酐、亦可為脂肪族四羧酸二酐,但是由所得之聚醯亞胺樹脂的耐熱性的觀點而言,較佳為使用芳香族四羧酸二酐。四羧酸二酐亦可組合2種以上使用。 Tetracarboxylic dianhydride can be appropriately selected as a polyamine Tetracarboxylic dianhydride used as a synthetic raw material. The tetracarboxylic dianhydride may be an aromatic tetracarboxylic dianhydride or an aliphatic tetracarboxylic dianhydride, but from the viewpoint of the heat resistance of the obtained polyimide resin, it is preferable to use an aromatic tetracarboxylic dianhydride. Carboxylic dianhydride. Tetracarboxylic dianhydride may be used in combination of two or more kinds.

芳香族四羧酸二酐之較佳的具體例,可列舉 苯均四酸二酐、1,1-雙(2,3-二羧基苯基)乙烷二酐、雙(2,3-二羧基苯基)甲烷二酐、雙(3,4-二羧基苯基)甲烷二酐、3,3’,4,4’-聯苯基四羧酸二酐、2,3,3’,4’-聯苯基四羧酸二酐、2,2,6,6-聯苯基四羧酸二酐、2,2-雙(3,4-二羧基苯基)丙烷二酐、2,2-雙(2,3-二羧基苯基)丙烷二酐、2,2-雙(3,4- 二羧基苯基)-1,1,1,3,3,3-六氟丙烷二酐、2,2-雙(2,3-二羧基苯基)-1,1,1,3,3,3-六氟丙烷二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、雙(3,4-二羧基苯基)醚二酐、雙(2,3-二羧基苯基)醚二酐、2,2’,3,3’-二苯甲酮四羧酸二酐、4,4-(p-伸苯基二氧)二鄰苯二甲酸二酐、4,4-(m-伸苯基二氧)二鄰苯二甲酸二酐、1,2,5,6-萘四羧酸二酐、1,4,5,8-萘四羧酸二酐、2,3,6,7-萘四羧酸二酐、1,2,3,4-苯四羧酸二酐、3,4,9,10-苝四羧酸二酐、2,3,6,7-蒽四羧酸二酐、1,2,7,8-菲四羧酸二酐、9,9-雙鄰苯二甲酸酐茀、3,3’,4,4’-二苯基碸四羧酸二酐等。脂肪族四羧酸二酐,可列舉例如乙烯四羧酸二酐、丁烷四羧酸二酐、環戊烷四羧酸二酐、環己烷四羧酸二酐、1,2,4,5-環己烷四羧酸二酐、1,2,3,4-環己烷四羧酸二酐等。此等之中,由價格、獲得容易性等而言,較佳為3,3’,4,4’-聯苯基四羧酸二酐及苯均四酸二酐。 又,此等四羧酸二酐亦可單獨或混合二種以上使用。 Preferred specific examples of the aromatic tetracarboxylic dianhydride include: Pyromellitic dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyl Phenyl) methane dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4'-biphenyltetracarboxylic dianhydride, 2,2,6 , 6-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 2,2-double (3,4- (Dicarboxyphenyl) -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) -1,1,1,3,3, 3-hexafluoropropane dianhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (2,3-di Carboxyphenyl) ether dianhydride, 2,2 ', 3,3'-benzophenonetetracarboxylic dianhydride, 4,4- (p-phenylene dioxy) diphthalic dianhydride, 4 , 4- (m-phenylene dioxy) diphthalic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-fluorenetetracarboxylic dianhydride, 2,3,6 , 7-Anthracenetetracarboxylic dianhydride, 1,2,7,8-phenanthrenetetracarboxylic dianhydride, 9,9-bisphthalic anhydride hydrazone, 3,3 ', 4,4'-diphenyl碸 tetracarboxylic dianhydride and so on. Examples of the aliphatic tetracarboxylic dianhydride include ethylene tetracarboxylic dianhydride, butane tetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, cyclohexane tetracarboxylic dianhydride, 1,2,4, 5-cyclohexanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic dianhydride and the like. Among these, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride are preferred in terms of price and availability. These tetracarboxylic dianhydrides may be used alone or in combination of two or more.

二胺可適宜選擇以往作為聚醯胺酸之合成原 料使用的二胺。二胺可為芳香族二胺、亦可為脂肪族二胺,但是就所得之聚醯亞胺樹脂的耐熱性之觀點而言,較佳為芳香族二胺。此等二胺亦可組合2種以上使用。 Diamine can be used as a suitable synthetic source of polyamines Material used in the diamine. The diamine may be an aromatic diamine or an aliphatic diamine, but in terms of the heat resistance of the obtained polyimide resin, an aromatic diamine is preferred. These diamines may be used in combination of two or more kinds.

芳香族二胺,可列舉鍵結有1個或2~10個左 右之苯基的二胺基化合物。具體而言為苯二胺及其衍生物、二胺基聯苯化合物及其衍生物、二胺基二苯化合物及其衍生物、二胺基三苯化合物及其衍生物、二胺基萘及其衍生物、胺基苯基胺基二氫茚(Indane)及其衍生物、二胺 基四苯化合物及其衍生物、二胺基六苯化合物及其衍生物、cardo型茀二胺衍生物。 Aromatic diamines, including one or two to ten left bonds Diamino compound of right phenyl. Specifically, phenylenediamine and its derivatives, diamino biphenyl compounds and its derivatives, diamino diphenyl compounds and its derivatives, diamino triphenyl compounds and its derivatives, diamino naphthalene and Derivatives thereof, aminophenylaminoindane (Indane) and derivatives thereof, diamines Tetraphenyl compounds and their derivatives, diaminohexabenzene compounds and their derivatives, and cardo-type fluorene diamine derivatives.

苯二胺為m-苯二胺、p-苯二胺等,苯二胺衍 生物為鍵結有甲基、乙基等之烷基的二胺,例如2,4-二胺基甲苯、2,4-三苯二胺等。 Phenylenediamine is m-phenylenediamine, p-phenylenediamine, etc. Organisms are diamines bonded to alkyl groups such as methyl and ethyl, such as 2,4-diaminotoluene and 2,4-triphenyldiamine.

二胺基聯苯化合物係2個胺基苯基以苯基彼 此間鍵結者。例如為4,4’-二胺基聯苯、4,4’-二胺基-2,2’-雙(三氟甲基)聯苯等。 Diamino biphenyl compounds are two amino phenyl groups Bonding here. For example, 4,4'-diaminobiphenyl, 4,4'-diamino-2,2'-bis (trifluoromethyl) biphenyl and the like.

二胺基二苯化合物係2個胺基苯基經由其他 基,而以苯基彼此鍵結者。鍵結為醚鍵、磺醯基鍵、硫醚鍵、以伸烷基或其衍生物基之鍵結、亞胺基鍵、偶氮鍵、氧化膦鍵、醯胺鍵、伸脲基鍵等。伸烷基鍵係碳數為1~6左右者,其衍生物基係伸烷基之1個以上之氫原子被鹵素原子等取代者。 Diamine diphenyl compounds are two aminophenyl via other And phenyl groups are bonded to each other. The bond is an ether bond, a sulfonyl bond, a thioether bond, a bond with an alkylene group or a derivative thereof, an imine bond, an azo bond, a phosphine oxide bond, a fluorenyl bond, a ureido bond, etc. . An alkylene bond has a carbon number of about 1 to 6, and its derivative group is one in which more than one hydrogen atom of an alkylene group is replaced by a halogen atom or the like.

二胺基二苯化合物之例,可列舉3,3’-二胺基 二苯基醚、3,4’-二胺基二苯基醚、4,4’-二胺基二苯基醚、3,3’-二胺基二苯基碸、3,4’-二胺基二苯基碸、4,4’-二胺基二苯基碸、3,3’-二胺基二苯基甲烷、3,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基硫醚、3,3’-二胺基二苯基酮、3,4’-二胺基二苯基酮、2,2-雙(p-胺基苯基)丙烷、2,2’-雙(p-胺基苯基)六氟丙烷、4-甲基-2,4-雙(p-胺基苯基)-1-戊烯、4-甲基-2,4-雙(p-胺基苯基)-2-戊烯、亞胺基二苯胺、4-甲基-2,4-雙(p-胺基苯基)戊烷、雙(p-胺基苯基)氧化膦、4,4’-二胺基偶氮苯、4,4’-二胺基二 苯基脲、4,4’-二胺基二苯基醯胺、1,4-雙(4-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、4,4’-雙(4-胺基苯氧基)聯苯、雙[4-(4-胺基苯氧基)苯基]碸、雙[4-(3-胺基苯氧基)苯基]碸、2,2-雙[4-(4-胺基苯氧基)苯基]丙烷、2,2-雙[4-(4-胺基苯氧基)苯基]六氟丙烷等。 Examples of diaminodiphenyl compounds include 3,3'-diamine Diphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenylphosphonium, 3,4'-di Aminodiphenylphosphonium, 4,4'-diaminodiphenylphosphonium, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4 ' -Diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl ketone, 3,4'-diaminodiphenyl ketone, 2 2,2-bis (p-aminophenyl) propane, 2,2'-bis (p-aminophenyl) hexafluoropropane, 4-methyl-2,4-bis (p-aminophenyl) -1-pentene, 4-methyl-2,4-bis (p-aminophenyl) -2-pentene, iminodiphenylamine, 4-methyl-2,4-bis (p-amine Phenyl) pentane, bis (p-aminophenyl) phosphine oxide, 4,4'-diaminoazobenzene, 4,4'-diaminodi Phenylurea, 4,4'-diaminodiphenylphosphoniumamine, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, 4,4'-bis (4-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] Hydrazone, bis [4- (3-aminophenoxy) phenyl] fluorene, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane and the like.

此等之中,就價格、獲得容易性等而言,較 佳為p-苯二胺、m-苯二胺、2,4-二胺基甲苯及4,4’-二胺基二苯基醚。 Among these, in terms of price, availability, etc., P-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, and 4,4'-diaminodiphenyl ether are preferred.

二胺基三苯化合物係2個胺基苯基與1個伸 苯基均經由其他的基鍵結者,其他的基係選擇與二胺基二苯化合物相同者。二胺基三苯化合物之例,可列舉1,3-雙(m-胺基苯氧基)苯、1,3-雙(p-胺基苯氧基)苯、1,4-雙(p-胺基苯氧基)苯等。 Diamine triphenyl compounds are two amine phenyl and one extension The phenyl groups are all bonded through other groups, and the other groups are the same as those of the diaminodiphenyl compound. Examples of the diamino triphenyl compound include 1,3-bis (m-aminophenoxy) benzene, 1,3-bis (p-aminophenoxy) benzene, and 1,4-bis (p -Aminophenoxy) benzene and the like.

二胺基萘之例,可列舉1,5-二胺基萘及2,6- 二胺基萘。 Examples of diaminonaphthalene include 1,5-diaminonaphthalene and 2,6- Diaminonaphthalene.

胺基苯基胺基二氫茚之例,可列舉5或6-胺 基-1-(p-胺基苯基)-1,3,3-三甲基二氫茚。 Examples of aminophenylaminoindane include 5 or 6-amine -1- (p-aminophenyl) -1,3,3-trimethylindane.

二胺基四苯化合物之例,可列舉4,4’-雙(p-胺 基苯氧基)聯苯、2,2’-雙[p-(p’-胺基苯氧基)苯基]丙烷、2,2’-雙[p-(p’-胺基苯氧基)聯苯基]丙烷、2,2’-雙[p-(m-胺基苯氧基)苯基]二苯甲酮等。 Examples of diaminotetraphenyl compounds include 4,4'-bis (p-amine Phenylphenoxy) biphenyl, 2,2'-bis [p- (p'-aminophenoxy) phenyl] propane, 2,2'-bis [p- (p'-aminophenoxy) ) Biphenyl] propane, 2,2'-bis [p- (m-aminophenoxy) phenyl] benzophenone and the like.

cardo型茀二胺衍生物可列舉9,9-雙苯胺茀 等。 Cardo-type fluorene diamine derivatives include 9,9-bisaniline fluorene Wait.

脂肪族二胺例如碳數為2~15左右者,具體而 言可列舉五亞甲二胺、六亞甲二胺、七亞甲二胺等。 The aliphatic diamine is, for example, one having 2 to 15 carbon atoms, specifically, Examples include pentamethylenediamine, hexamethylenediamine, heptamethylenediamine, and the like.

再者,亦可為此等二胺之氫原子被由鹵素原 子、甲基、甲氧基、氰基、苯基等群中選擇之至少1種的取代基取代的化合物。 Furthermore, the hydrogen atom of these diamines may be replaced by a halogen atom. A compound substituted with at least one kind of substituent selected from the group consisting of a hydrogen atom, a methyl group, a methoxy group, a cyano group, and a phenyl group.

製造本實施形態所用之聚醯胺酸的手段並無 特殊限制,例如可使用於有機溶劑中,使酸、二胺成分反應的方法等習知的手法。 There is no means for producing the polyamic acid used in this embodiment There is a special limitation, for example, a conventional method such as a method for reacting an acid and a diamine component in an organic solvent can be used.

四羧酸二酐與二胺之反應,通常在有機溶劑 中進行。四羧酸二酐與二胺之反應所使用之有機溶劑,只要可溶解四羧酸二酐及二胺,且不與四羧酸二酐及二胺反應者,則無特別限定。有機溶劑可單獨或混合2種以上使用。 The reaction of tetracarboxylic dianhydride with diamine, usually in organic solvents In progress. The organic solvent used for the reaction of tetracarboxylic dianhydride and diamine is not particularly limited as long as it can dissolve tetracarboxylic dianhydride and diamine and does not react with tetracarboxylic dianhydride and diamine. The organic solvents can be used alone or in combination of two or more.

四羧酸二酐與二胺之反應所用的有機溶劑之 例,可列舉N-甲基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二乙基乙醯胺、N,N-二甲基甲醯胺、N,N-二乙基甲醯胺、N-甲基己內醯胺、N,N,N’,N’-四甲基脲等之含氮極性溶劑;β-丙內酯、γ-丁內酯、γ-戊內酯、δ-戊內酯、γ-己內酯、ε-己內酯等之內酯系極性溶劑;二甲基亞碸;乙腈;乳酸乙酯、乳酸丁酯等之脂肪酸酯類;二乙二醇二甲基醚、二乙二醇二乙基醚、二噁烷、四氫呋喃、甲基賽珞蘇乙酸酯、乙基賽珞蘇乙酸酯等之醚類;甲酚類等之酚系溶劑。此等有機溶劑可單獨或混合2種以上使用。有機溶劑之使用量並無特別限定,但較佳為使生成之聚醯胺酸的 含量為5~50質量%。 Organic solvents used in the reaction of tetracarboxylic dianhydride and diamine Examples include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dimethylformamide, N, Nitrogen-containing polar solvents such as N-diethylformamide, N-methylcaprolactam, N, N, N ', N'-tetramethylurea; β-propiolactone, γ-butyrolactone , Γ-valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone and other lactone-based polar solvents; dimethyl sulfene; acetonitrile; fatty acids such as ethyl lactate and butyl lactate Esters; ethers of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dioxane, tetrahydrofuran, methyl cyperidine acetate, ethyl cyperidine acetate; etc. Phenolic solvents such as phenols. These organic solvents can be used alone or in combination of two or more. The amount of the organic solvent used is not particularly limited, but it is preferred that The content is 5 to 50% by mass.

此等有機溶劑之中,就生成之聚醯胺酸的溶 解性而言,較佳為N-甲基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二乙基乙醯胺、N,N-二甲基甲醯胺、N,N-二乙基甲醯胺、N-甲基己內醯胺、N,N,N’,N’-四甲基脲等之含氮極性溶劑。 Among these organic solvents, In terms of solubility, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-diethylacetamide, and N, N-dimethylformamidine are preferred. Nitrogen-containing polar solvents such as amines, N, N-diethylformamide, N-methylcaprolactam, N, N, N ', N'-tetramethylurea and the like.

聚合溫度一般為-10~120℃、較佳為5~30℃。 聚合時間雖依所使用之原料組成而異,通常為3~24Hr(小時)。又,如此條件下所得到之聚醯胺酸之有機溶劑溶液的固有黏度,較佳為1000~10萬cP(百分泊)、又更佳為5000~7萬cP之範圍。 The polymerization temperature is generally -10 to 120 ° C, preferably 5 to 30 ° C. Although the polymerization time varies depending on the composition of the raw materials used, it is usually 3 to 24 Hr (hours). In addition, the inherent viscosity of the organic solvent solution of the polyamic acid obtained under such conditions is preferably in the range of 1,000 to 100,000 cP (percent poise), and more preferably in the range of 5,000 to 70,000 cP.

<聚醯亞胺> <Polyimide>

本實施形態所用之聚醯亞胺,只要可溶解塗佈液所使用之有機溶劑的可溶性聚醯亞胺,則其結構或分子量並無限定,可使用習知者。關於聚醯亞胺,亦可於側鏈具有羧基等之可縮合的官能基或於燒成時會促進交聯反應等之官能基。 The polyimide used in this embodiment is not limited in structure or molecular weight as long as it is a soluble polyimide that can dissolve the organic solvent used in the coating solution, and it can be used by a conventional one. The polyfluorene imine may have a condensable functional group such as a carboxyl group in a side chain, or a functional group that promotes a crosslinking reaction or the like during firing.

為了成為可溶於有機溶劑的聚醯亞胺,可使 用於主鏈導入柔軟之彎曲構造之單體,例如可使用乙二胺、六亞甲二胺、1,4-二胺基環己烷、1,3-二胺基環己烷、4,4’-二胺基二環己基甲烷等之脂肪族二胺;2-甲基-1,4-苯二胺、o-聯甲苯胺、m-聯甲苯胺、3,3’-二甲氧基聯苯胺、4,4’-二胺基苯甲醯苯胺等之芳香族二胺;聚氧乙烯 二胺、聚氧丙烯二胺、聚氧丁烯二胺等之聚氧化烯二胺;聚矽氧烷二胺;2,3,3’,4’-氧二鄰苯二甲酸酐、3,4,3’,4’-氧二鄰苯二甲酸酐、2,2-雙(4-羥基苯基)丙烷二苯甲酸酯-3,3’,4,4’-四羧酸二酐等。又,使用具有提高對有機溶劑之溶解性的官能基之單體,例如可使用2,2’-雙(三氟甲基)-4,4’-二胺基聯苯、2-三氟甲基-1,4-苯二胺等之氟化二胺。 此外,除了提高上述聚醯亞胺之溶解性用的單體外,於不阻礙溶解性之範圍內,可併用與上述聚醯胺酸之欄所記載者相同的單體。 In order to be polyimide soluble in organic solvents, Monomers for introducing a flexible, curved structure into the main chain, for example, ethylenediamine, hexamethylenediamine, 1,4-diaminocyclohexane, 1,3-diaminocyclohexane, 4, Aliphatic diamines such as 4'-diaminodicyclohexylmethane; 2-methyl-1,4-phenylenediamine, o-dimethyltoluidine, m-dimethyltoluidine, 3,3'-dimethoxy Aromatic diamines such as benzidine, 4,4'-diaminobenzidine aniline; polyoxyethylene Diamine, polyoxypropylene diamine, polyoxybutylene diamine, etc .; polyoxyalkylene diamine; polysiloxane diamine; 2, 3, 3 ', 4'-oxydiphthalic anhydride, 3, 4,3 ', 4'-oxydiphthalic anhydride, 2,2-bis (4-hydroxyphenyl) propane dibenzoate-3,3', 4,4'-tetracarboxylic dianhydride Wait. Moreover, a monomer having a functional group that improves the solubility in an organic solvent is used, and for example, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl, 2-trifluoromethyl Fluorinated diamines such as 1,4-phenylenediamine. In addition to the monomers for improving the solubility of the polyimide, as long as the solubility is not inhibited, the same monomers as those described in the column of the polyamidic acid can be used in combination.

本發明所使用之製造可溶解於有機溶劑之聚 醯亞胺的手段,並無特別限定,例如可使用將聚醯胺酸進行化學醯亞胺化或加熱醯亞胺化,使溶解於有機溶劑之方法等之習知手法。這種聚醯亞胺,可列舉脂肪族聚醯亞胺(全脂肪族聚醯亞胺)、芳香族聚醯亞胺等,較佳為芳香族聚醯亞胺。芳香族聚醯亞胺可為將具有如式(1)所示之重複單位的聚醯胺酸藉由熱或化學閉環反應而取得者、或將具有如式(2)所示之重複單位的聚醯亞胺溶解於溶劑者。 式中Ar表示芳基。 Polymers soluble in organic solvents used in the present invention The method of hydrazone is not particularly limited, and for example, a conventional method such as a method of chemically hydrazone of a polyamic acid or heating hydrazone to dissolve it in an organic solvent can be used. Examples of such polyimide include aliphatic polyimide (full aliphatic polyimide), aromatic polyimide, and the like, and aromatic polyimide is preferred. The aromatic polyimide may be obtained by a polyamic acid having a repeating unit represented by the formula (1) by a thermal or chemical ring closure reaction, or an aromatic polyimide having a repeating unit represented by the formula (2) Polyimide is dissolved in a solvent. In the formula, Ar represents an aryl group.

<聚醯胺醯亞胺> <Polyamide and imine>

本實施形態所使用的聚醯胺醯亞胺,只要是可溶解於塗佈液所使用之有機溶劑的可溶性聚醯胺醯亞胺,則不限制其構造或分子量,可使用習知者。關於聚醯胺醯亞胺,其側鏈可具有羧基等的可縮合的官能基或燒成時促進交聯反應等的官能基。 As long as the polyamidoamine imine used in this embodiment is a soluble polyamidoamine imine that is soluble in the organic solvent used in the coating liquid, the structure or molecular weight is not limited, and a known one can be used. The polyamidamine / imine may have a condensable functional group such as a carboxyl group at its side chain, or a functional group that promotes a crosslinking reaction during firing.

本實施形態所使用之聚醯胺醯亞胺,無特別限制地可使用使任意偏苯三甲酸酐與二異氰酸酯反應而得到者、或藉由任意偏苯三甲酸酐的反應性衍生物與二胺之反應得到的前驅物聚合物進行醯亞胺化而得者。 The polyamidoamine imine used in this embodiment can be used without any particular limitation, obtained by reacting any trimellitic anhydride with a diisocyanate, or a reactive derivative of any trimellitic anhydride with a diamine. The precursor polymer obtained by the reaction is obtained by amidation.

上述任意的偏苯三甲酸酐或其反應性衍生物,可列舉例如偏苯三甲酸酐、偏苯三甲酸酐氯化物等的偏苯三甲酸酐鹵素化物、偏苯三甲酸酐酯等。 Examples of the arbitrary trimellitic anhydride or a reactive derivative thereof include trimellitic anhydride halides, trimellitic anhydride esters, and the like, such as trimellitic anhydride, trimellitic anhydride chloride, and the like.

二異氰酸酯可列舉例如間伸苯基二異氰酸 酯、p-伸苯基二異氰酸酯、4,4’-氧基雙(苯基異氰酸酯)、4,4’-二異氰酸酯二苯基甲烷、雙[4-(4-異氰酸酯苯氧基)苯基]碸、2,2’-雙[4-(4-異氰酸酯苯氧基)苯基]丙烷等。 Examples of diisocyanates include m-phenylene diisocyanate Ester, p-phenylene diisocyanate, 4,4'-oxybis (phenyl isocyanate), 4,4'-diisocyanate diphenylmethane, bis [4- (4-isocyanatephenoxy) phenyl ] 碸, 2,2'-bis [4- (4-isocyanatephenoxy) phenyl] propane and the like.

二胺可列舉與在前述聚醯胺酸之說明中所例 示相同者。 Examples of the diamine include those described in the foregoing description of the polyamidic acid. Show the same.

<聚醯胺> <Polyamine>

聚醯胺較佳為由二羧酸與二胺所得之聚醯胺,特佳為芳香族聚醯胺。 Polyamine is preferably a polyamine obtained from a dicarboxylic acid and a diamine, and particularly preferably an aromatic polyamine.

二羧酸可列舉馬來酸、富馬酸、伊康酸、甲 基馬來酸、二甲基馬來酸、苯基馬來酸、氯馬來酸、二氯馬來酸、氟馬來酸、苯二甲酸、間苯二甲酸、對苯二甲酸及聯苯甲酸(Diphenic acid)等。 Examples of the dicarboxylic acid include maleic acid, fumaric acid, itaconic acid, and formic acid. Maleic acid, dimethylmaleic acid, phenylmaleic acid, chloromaleic acid, dichloromaleic acid, fluoromaleic acid, phthalic acid, isophthalic acid, terephthalic acid and biphenyl Formic acid (Diphenic acid) and the like.

二胺可列舉與前述聚醯胺酸之說明例示者同 樣者。 Examples of the diamines are the same as those described above for the polyamidic acid. Kind of person.

<微粒子> <Fine particles>

接著,說明微粒子。微粒子可使用例如真球率高,且粒徑分布指數小者。這種微粒子於液體中之分散性優,成為互不凝集的狀態。微粒子的粒徑(平均直徑),例如可設定為100~2000nm左右。藉由使用如上述微粒子,在其後的步驟去除微粒子,可使所得之多孔性樹脂膜F的孔徑一致。可使施加於藉由多孔性樹脂膜F形成之分隔膜的電場均勻化。 Next, fine particles are described. As the fine particles, for example, those having a high true sphere ratio and a small particle size distribution index can be used. Such fine particles have excellent dispersibility in a liquid and are in a state where they do not aggregate with each other. The particle diameter (average diameter) of the fine particles can be set to, for example, about 100 to 2000 nm. By using the fine particles as described above and removing the fine particles in the subsequent steps, the pore diameter of the obtained porous resin film F can be made uniform. The electric field applied to the partition film formed by the porous resin film F can be made uniform.

微粒子之材質,只要不溶於塗佈液所含之溶 劑,且其後步驟可自多孔性樹脂膜F中去除的材質時,無特別限定,可採用習知者。例如,無機材料可列舉二氧化矽(silica)、氧化鈦、氧化鋁(Al2O3)等之金屬氧化物。有機材料可列舉高分子量烯烴(聚丙烯、聚乙烯等)、聚苯乙烯、環氧樹脂、纖維素、聚乙烯醇、聚乙烯丁醛(polyvinyl butyral)、聚酯、聚甲基丙烯酸甲酯、聚醚等之有機高分子微粒子。微粒子之一例可列舉(單分散)球狀二氧化矽粒子等之矽溶膠、碳酸鈣等。此時,可使多孔性樹脂膜F之孔徑更均勻。 The material of the fine particles is not particularly limited as long as it is insoluble in the solvent contained in the coating solution and can be removed from the porous resin film F in the subsequent steps, and it can be a known one. Examples of the inorganic material include metal oxides such as silica, titanium oxide, and aluminum oxide (Al 2 O 3 ). Examples of the organic material include high molecular weight olefins (polypropylene, polyethylene, etc.), polystyrene, epoxy resin, cellulose, polyvinyl alcohol, polyvinyl butyral, polyester, polymethyl methacrylate, Organic polymer particles such as polyether. Examples of the fine particles include (monodisperse) silica sols such as spherical silica particles, calcium carbonate, and the like. In this case, the pore diameter of the porous resin film F can be made more uniform.

又,第1塗佈液所含有之微粒子與第2塗佈 液所含有之微粒子,在真球率、粒徑、材料等之各方面可相同或彼此相異。第1塗佈液所含有之微粒子,其粒徑分布指數比第2塗佈液所含有之微粒子小或相同較佳。或第1塗佈液所含有之微粒子,其真球率比第2塗佈液所含有之微粒子小或相同較佳。又,第1塗佈液所含有之微粒子,其微粒子之粒徑(平均直徑)比第2塗佈液所含有之微粒子小為佳,特別是第1塗佈液所含有之微粒子為100~1000nm(更佳為100~600nm),第2塗佈液所含有之微粒子為500~2000nm(更佳為700~2000nm)較佳。第1塗佈膜所含有之微粒子之粒徑藉由使用比第2塗佈液所含有之微粒子之粒徑小者,可使多孔性樹脂膜F表面之孔之開口比例高且均勻。又,相較於多孔性樹脂膜F全體為第1塗佈液所含有之微粒子之粒徑的情形,也可提高膜的強度。 The fine particles contained in the first coating liquid and the second coating The fine particles contained in the liquid may be the same or different from each other in terms of sphericity, particle size, and materials. The particle size distribution index of the fine particles contained in the first coating liquid is smaller or the same as that of the fine particles contained in the second coating liquid. Or, the fine particles contained in the first coating liquid have a true sphere ratio smaller than or the same as the fine particles contained in the second coating liquid. The particle size (average diameter) of the fine particles contained in the first coating liquid is preferably smaller than the fine particles contained in the second coating liquid. In particular, the fine particles contained in the first coating liquid are 100 to 1000 nm. (More preferably 100 to 600 nm), and the fine particles contained in the second coating liquid are preferably 500 to 2000 nm (more preferably 700 to 2000 nm). The particle diameter of the fine particles contained in the first coating film is made smaller than that of the fine particles contained in the second coating liquid, so that the opening ratio of the pores on the surface of the porous resin film F can be made high and uniform. Moreover, compared with the case where the whole porous resin film F is the particle diameter of the microparticles | fine-particles contained in a 1st coating liquid, the strength of a film can also be improved.

又,上述塗佈液除了特定之樹脂材料、微粒 子及溶劑外,必要時也可含有脫模劑、分散劑、縮合劑、醯亞胺化劑、界面活性劑等各種的添加劑。 In addition, the coating liquid is not limited to a specific resin material or fine particles. Various additives such as a release agent, a dispersant, a condensing agent, an imidizing agent, and a surfactant may be contained in addition to the solvent and the solvent, if necessary.

[塗佈單元] [Coating unit]

塗佈單元10具有搬送部11、第1噴嘴12、第2噴嘴13、乾燥部14及剝離部15。 The coating unit 10 includes a conveying section 11, a first nozzle 12, a second nozzle 13, a drying section 14, and a peeling section 15.

搬送部11具有搬送基材(基材)S、基材送出滾輪11a、支撐滾輪11b~11d、基材捲繞滾輪11e及搬出滾輪11f。 The transfer unit 11 includes a transfer substrate (base material) S, a substrate delivery roller 11a, support rollers 11b to 11d, a substrate winding roller 11e, and a delivery roller 11f.

搬送基材S係形成帶狀。搬送基材S係由基 材送出滾輪11a送出,具有張力跨接(bridge over)於支撐滾輪11b~11d,且被基材捲繞滾輪11e捲繞。搬送基材S之材質,例如可列舉聚對苯二甲酸乙二酯(PET)等,但是不限於此等,也可為不銹鋼等之金屬材料。 The transport substrate S is formed in a belt shape. Conveying substrate S The material sending roller 11a sends out, has tension bridged over the supporting rollers 11b to 11d, and is wound by the substrate winding roller 11e. Examples of the material of the transport substrate S include polyethylene terephthalate (PET). However, the material is not limited to this and may be a metal material such as stainless steel.

各滾輪11a~11f例如形成圓筒狀,各自與X 方向平行配置。又,各滾輪11a~11f不限於與X方向平行的配置,至少1個為對於X方向,可以傾斜配置。例如,各滾輪11a~11f為與Z方向平行配置,Z方向之高度位置可相同來配置。此時,搬送基材S係對於水平面(XY平面),以直立狀態沿著水平面移動。 Each of the rollers 11a to 11f is formed into a cylindrical shape, for example, The directions are arranged in parallel. In addition, each of the rollers 11a to 11f is not limited to an arrangement parallel to the X direction, and at least one of the rollers 11a to 11f may be arranged obliquely to the X direction. For example, the rollers 11a to 11f are arranged in parallel with the Z direction, and the height positions in the Z direction may be the same. At this time, the conveying substrate S is moved along the horizontal plane in an upright state with respect to the horizontal plane (XY plane).

基材送出滾輪11a係搬送基材S被纏繞的狀 態來配置。支撐滾輪11b係配置於基材送出滾輪11a之+Z側,同時被配置於比基材送出滾輪11a更靠近-Y側。 又,支撐滾輪11c係配置於支撐滾輪11b之+Z側,同時被配置於比支撐滾輪11b更靠近+Y側。藉由此3個滾輪(基材送出滾輪11a、支撐滾輪11b、11c)之配置,搬送基材S係以含有支撐滾輪11b之-Y側端部的面支撐。 The substrate delivery roller 11a is a state in which the substrate S is wound. State to configure. The support roller 11b is arranged on the + Z side of the substrate sending-out roller 11a, and is also arranged closer to the -Y side than the substrate sending-out roller 11a. The support roller 11c is disposed on the + Z side of the support roller 11b, and is disposed closer to the + Y side than the support roller 11b. With the arrangement of the three rollers (the substrate delivery roller 11a, the support rollers 11b, 11c), the conveyance substrate S is supported by a surface including the -Y side end portion of the support roller 11b.

又,支撐滾輪11d係配置於支撐滾輪11c之 +Y側,同時被配置於支撐滾輪11c之-Z側。此時,藉由支撐滾輪11b~11d之3個滾輪之配置,搬送基材S係以含有支撐滾輪11c之+Z側端部的面支撐。 The support roller 11d is disposed on the support roller 11c. The + Y side is simultaneously arranged on the -Z side of the support roller 11c. At this time, by arranging the three rollers of the support rollers 11b to 11d, the conveyance substrate S is supported by a surface including the + Z side end portion of the support roller 11c.

又,支撐滾輪11d可被置於與支撐滾輪11c 之高度位置(Z方向之位置)大致同等高度位置。此時,搬送基材S係由支撐滾輪11c朝向支撐滾輪11d,以與XY平面大致平行的狀態,被送至+Y方向。 In addition, the support roller 11d may be placed in contact with the support roller 11c. The height position (position in the Z direction) is approximately the same height position. At this time, the transport substrate S is moved from the support roller 11c toward the support roller 11d, and is transported to the + Y direction in a state substantially parallel to the XY plane.

基材捲繞滾輪11e係被配置於支撐滾輪11d 之-Z側。由支撐滾輪11d朝向基材捲繞滾輪11e,搬送基材S係被送至-Z方向。搬出滾輪11f係在支撐滾輪11d之+Y側,且被配置於-Z側。搬出滾輪11f係將以乾燥部14形成的未燒成膜FA送至+Y方向。此未燒成膜FA藉由搬出滾輪11f,搬出至塗佈單元10之外部。 The substrate winding roller 11e is arranged on the support roller 11d. -Z side. The support roller 11d is wound toward the base material by the support roller 11e, and the conveyance base material S is sent to the -Z direction. The carry-out roller 11f is located on the + Y side of the support roller 11d and is arranged on the -Z side. The unloading roller 11f sends the unfired film FA formed in the drying section 14 to the + Y direction. This unfired film FA is carried out to the outside of the coating unit 10 by a carrying-out roller 11f.

上述滾輪11a~11f不限於圓筒形,也可形成 錐型之冠部(CROWN)。此時,對於滾輪11a~11f之鬆弛補正有用,搬送基材S或後述之未燒成膜FA可與滾輪11a~11f均等接觸。又,滾輪11a~11f也可形成輻射型之冠部。此時,可有效防止搬送基材S或未燒成膜FA之蛇行。又,滾輪11a~11f也可形成凹(CONCAVE)型之冠部(X 方向之中央部為凹形彎曲的部分)。此時,將張力賦予X方向,可搬送搬送基材S或未燒成膜FA,故可有效防止皺紋之發生。以下滾輪也與上述同樣,可為具有錐型、輻射型、凹型等之冠部的構成。 The rollers 11a to 11f are not limited to a cylindrical shape, and may be formed. CROWN. At this time, it is useful for slack correction of the rollers 11a to 11f, and the conveyance substrate S or the unfired film FA described later can be brought into uniform contact with the rollers 11a to 11f. The rollers 11a to 11f may form a radial crown. In this case, the meandering of the substrate S or the unfired film FA can be effectively prevented. In addition, the rollers 11a to 11f can also form a CONCAVE crown (X The central part of the direction is a concavely curved portion). At this time, by applying tension to the X direction, the substrate S or the unfired film FA can be transported, and thus the occurrence of wrinkles can be effectively prevented. The following rollers may also have a crown, such as a tapered shape, a radial shape, or a concave shape, as described above.

圖2(a)表示第1噴嘴12之一例的斜視圖。如 圖1及圖2(a)所示,第1噴嘴12係於搬送基材S形成第1塗佈液Q1之塗佈膜(以下為第1塗佈膜F1)。第1噴嘴12具有吐出第1塗佈液Q1之吐出口12a。例如以長度方向與搬送基材S之X方向之尺寸大致相同來形成吐出口12a。 FIG. 2 (a) is a perspective view showing an example of the first nozzle 12. Such as As shown in FIG. 1 and FIG. 2 (a), the first nozzle 12 is a coating film (hereinafter, the first coating film F1) that forms the first coating liquid Q1 on the transport substrate S. The first nozzle 12 has a discharge port 12a that discharges the first coating liquid Q1. For example, the discharge port 12a is formed with a dimension substantially the same as the X-direction dimension of the transport substrate S.

第1噴嘴12係配置於吐出位置P1。吐出位置 P1係相對於支撐滾輪11b,在-Y方向上的位置。第1噴嘴12係吐出口12a朝向+Y方向,以傾斜來配置。因此,吐出口12a係朝向搬送基材S之中,以支撐滾輪11b之-Y側端部支撐的部分。第1噴嘴12係對於此搬送基材S,由吐出口12a沿著水平方向吐出第1塗佈液Q1。 The first nozzle 12 is arranged at the discharge position P1. Spit position P1 is a position in the -Y direction with respect to the support roller 11b. The first nozzle 12 is arranged so that the discharge port 12a is inclined in the + Y direction. Therefore, the discharge port 12a is directed toward the portion of the conveyance substrate S and is supported by the end portion on the -Y side of the support roller 11b. The first nozzle 12 discharges the first coating liquid Q1 from the discharge port 12a in the horizontal direction with respect to the conveyed substrate S.

圖2(b)係表示第2噴嘴13之一例的斜視圖。 如圖1及圖2(b)所示,第2噴嘴13係在搬送基材S上,與第1塗佈膜F1重疊形成第2塗佈液Q2之塗佈膜(以下為第2塗佈膜F2)。第2噴嘴13具有吐出第2塗佈液Q2之吐出口13a。例如長度方向與搬送基材S之X方向之尺寸大致相同,以形成吐出口13a。 FIG. 2 (b) is a perspective view showing an example of the second nozzle 13. As shown in FIG. 1 and FIG. 2 (b), the second nozzle 13 is a coating film of the second coating liquid Q2 formed on the conveying substrate S by overlapping with the first coating film F1 (hereinafter referred to as the second coating) Film F2). The second nozzle 13 has a discharge port 13a that discharges the second coating liquid Q2. For example, the dimension of the length direction and the X direction of the conveyance base material S are substantially the same, and the discharge opening 13a is formed.

第2噴嘴13配置於吐出位置P2。吐出位置 P2係相對於支撐滾輪11c為+Z方向上之位置。第2噴嘴 13係吐出口13a朝向-Z方向來配置。因此,吐出口13a係朝向搬送基材S之中,以支撐滾輪11c之+Z側端部支撐的部分。第2噴嘴13係對於此搬送基材S,由吐出口13a沿著重力方向吐出第2塗佈液Q2。 The second nozzle 13 is arranged at the discharge position P2. Spit position P2 is a position in the + Z direction with respect to the support roller 11c. 2nd nozzle The 13-system discharge port 13a is arranged toward the -Z direction. Therefore, the discharge opening 13a is a portion which is supported by the end portion on the + Z side of the support roller 11c toward the conveying substrate S. The second nozzle 13 discharges the second coating liquid Q2 from the discharge port 13a in the direction of gravity with respect to the conveyed substrate S.

又,第1噴嘴12及第2噴嘴13也可為可在 X方向、Y方向及Z方向之中至少一方向移動。又,第1噴嘴12及第2噴嘴13也可設置成可繞著與X方向平行之軸線旋轉。又,第1噴嘴12及第2噴嘴13不吐出塗佈液時,配置於無圖示之待機位置,吐出塗佈液時,可由待機位置分別移動至上述吐出位置P1、P2。又,可設置第1噴嘴12及第2噴嘴13進行預備吐出動作的部分。 The first nozzle 12 and the second nozzle 13 may be Move in at least one of the X direction, the Y direction, and the Z direction. The first nozzle 12 and the second nozzle 13 may be provided so as to be rotatable about an axis parallel to the X direction. When the first nozzle 12 and the second nozzle 13 do not discharge the coating liquid, they are arranged in a standby position (not shown), and when the coating liquid is discharged, they can be moved from the standby position to the above-mentioned discharge positions P1 and P2, respectively. Further, the first nozzle 12 and the second nozzle 13 may be provided with a portion for performing a preliminary discharge operation.

第1噴嘴12及第2噴嘴13各自經由連接配 管(無圖示)等,與塗佈液供給源(無圖示)連接。第1噴嘴12及第2噴嘴13例如在內部設置保持特定量之塗佈液的保持部(無圖示)。此時,第1噴嘴12及第2噴嘴13可具有調整上述保持部所保持之液狀體之溫度的溫調部。 Each of the first nozzle 12 and the second nozzle 13 is connected via a connection. A tube (not shown) and the like are connected to a coating liquid supply source (not shown). The first nozzle 12 and the second nozzle 13 are provided with a holding portion (not shown) for holding a predetermined amount of the coating liquid, for example. At this time, the first nozzle 12 and the second nozzle 13 may have a temperature adjustment section that adjusts the temperature of the liquid body held by the holding section.

由第1噴嘴12或第2噴嘴13吐出之各塗佈 液之吐出量或第1塗佈膜F1或第2塗佈膜F2之膜厚,可藉由各噴嘴、各連接配管(無圖示)、或塗佈液供給源(無圖示)所連接的幫浦(無圖示)之壓力、搬送速度、各噴嘴位置或搬送基材S與噴嘴之距離等來調整。第1塗佈膜F1或第2塗佈膜F2之膜厚,例如分別為0.5μm~500μm。 Each coating discharged from the first nozzle 12 or the second nozzle 13 The discharge amount of the liquid or the thickness of the first coating film F1 or the second coating film F2 can be connected through each nozzle, each connection pipe (not shown), or a coating liquid supply source (not shown). The pressure of the pump (not shown), the conveying speed, the position of each nozzle, or the distance between the conveying substrate S and the nozzle are adjusted. The film thickness of the first coating film F1 or the second coating film F2 is, for example, 0.5 μm to 500 μm, respectively.

如本實施形態,使用2種類之塗佈液(第1塗 佈液Q1及第2塗佈液Q2)時,將藉由第1塗佈液Q1所得 之第1塗佈膜F1的膜厚,例如在0.5μm~10μm之範圍調整,將藉由第2塗佈液Q2所得之第2塗佈膜F2的膜厚,例如在1μm~50μm之範圍調整較佳。 As in this embodiment, two types of coating liquids (the first coating Cloth liquid Q1 and second coating liquid Q2) The film thickness of the first coating film F1 is adjusted, for example, in a range of 0.5 μm to 10 μm, and the film thickness of the second coating film F2 obtained by the second coating solution Q2 is, for example, in a range of 1 μm to 50 μm. Better.

又,第1噴嘴12及第2噴嘴13之間,可配 置使第1塗佈膜F1乾燥用之乾燥部(無圖示)。此乾燥部具備加熱乾燥部為佳。加熱乾燥部使用溫風送風部或紅外線加熱器為佳。加熱溫度例如50℃~150℃、較佳為50℃~100℃之範圍。藉由使第1塗佈膜F1乾燥後,形成第2塗佈膜F2,例如可抑制第2塗佈液所用的微粒子與第1塗佈膜F1之微粒子混合存在。 In addition, between the first nozzle 12 and the second nozzle 13, A drying section (not shown) for drying the first coating film F1 was set. It is preferable that the drying section includes a heating drying section. It is preferable to use a warm air supply section or an infrared heater for the heating and drying section. The heating temperature is, for example, in a range of 50 ° C to 150 ° C, and preferably in a range of 50 ° C to 100 ° C. By drying the first coating film F1 and forming the second coating film F2, for example, it is possible to suppress the fine particles used in the second coating liquid from being mixed with the fine particles of the first coating film F1.

如圖1所示,乾燥部14係在第2噴嘴13之 +Y側,且被配置於支撐滾輪11c與支撐滾輪11d之間。 乾燥部14係使被塗佈於搬送基材S上之2層的塗佈膜(第1塗佈膜F1及第2塗佈膜F2)乾燥,形成未燒成膜FA。 As shown in FIG. 1, the drying section 14 is connected to the second nozzle 13. The + Y side is disposed between the support roller 11c and the support roller 11d. The drying section 14 dries the two coating films (the first coating film F1 and the second coating film F2) applied to the transport substrate S to form an unfired film FA.

乾燥部14具有腔(chamber)14a與加熱部 14b。腔14a收容搬送基材S及加熱部14b。加熱部14b係將形成於搬送基材S上之第1塗佈膜F1及第2塗佈膜F2進行加熱。加熱部14b可使用例如紅外線加熱器等。 加熱部14b係以50℃~100℃程度的溫度,將塗佈膜加熱。 The drying section 14 has a chamber 14a and a heating section 14b. The cavity 14a contains the conveyance substrate S and the heating part 14b. The heating section 14b heats the first coating film F1 and the second coating film F2 formed on the transfer substrate S. As the heating unit 14b, for example, an infrared heater can be used. The heating portion 14b heats the coating film at a temperature of about 50 ° C to 100 ° C.

剝離部15係未燒成膜FA由搬送基材S被剝離的部分。本實施形態中,藉由作業者之手作業剝離未燒成膜FA,但是不限於此,也可使用機械手等自動剝離。由搬送基材S剝離的未燒成膜FA,藉由搬出滾輪11f被 搬出至塗佈單元10之外部,送至捲繞部40。又,未燒成膜FA經剝離後的搬送基材S,藉由基材捲繞滾輪11e捲繞。 The peeling portion 15 is a portion where the unfired film FA is peeled from the transport substrate S. In the present embodiment, the unfired film FA is peeled off by the operator's hand, but it is not limited to this, and it can be peeled off automatically using a robot or the like. The unfired film FA peeled off from the transport substrate S is picked up by the unloading roller 11f. It is carried out to the outside of the coating unit 10 and sent to the winding unit 40. In addition, the transported substrate S after the unfired film FA is peeled off is wound by the substrate winding roller 11e.

[捲繞部(1)] [Winding section (1)]

圖3概略表示塗佈單元10之+Y側之構成的斜視圖。 FIG. 3 is a perspective view schematically showing the configuration of the + Y side of the coating unit 10.

如圖3所示,塗佈單元10之+Y側設置搬出未燒成膜FA之搬出口10b。由搬出口10b搬出的未燒成膜FA,藉由捲繞部40捲繞。 As shown in FIG. 3, the + Y side of the coating unit 10 is provided with a carrying-out port 10b for carrying out the unfired film FA. The unfired film FA carried out from the carrying-out port 10b is wound by the winding part 40.

捲繞部40係於軸承41被安裝軸構件SF的構 成。軸構件SF係將由搬出口10b搬出的未燒成膜FA捲繞形成捲筒體R。軸構件SF係對於軸承41,設置成可拆裝。軸構件SF安裝於軸承41時,可繞著與X方向平行之軸線旋轉來被支撐。捲繞部40具有可使安裝於軸承41之軸構件SF旋轉之無圖示的驅動機構。 The winding portion 40 is a structure of the bearing 41 to which the shaft member SF is mounted. to make. The shaft member SF is a roll R formed by winding the unfired film FA carried out from the carrying-out port 10b. The shaft member SF is detachably provided to the bearing 41. When the shaft member SF is attached to the bearing 41, it is supported by being rotatable about an axis parallel to the X direction. The winding portion 40 includes a driving mechanism (not shown) that can rotate the shaft member SF mounted on the bearing 41.

又,捲繞部40中,未燒成膜FA之中,第1 塗佈膜F1側之面配置於外側,來捲繞未燒成膜FA。例如藉由驅動機構,使軸構件SF繞著圖1之逆時針旋轉,來捲繞未燒成膜FA。形成有捲筒體R的狀態下,軸構件SF自軸承41取下,可將捲筒體R移動至其他之單元。 In the wound portion 40, among the unfired films FA, the first The surface on the coating film F1 side is arranged on the outside, and the unfired film FA is wound. For example, the shaft member SF is rotated counterclockwise in FIG. 1 by a driving mechanism to wind the unfired film FA. In a state where the roll body R is formed, the shaft member SF is removed from the bearing 41, and the roll body R can be moved to another unit.

圖1及圖3中,捲繞部40係離開塗佈單元10 而獨立配置,但是不限於此。例如捲繞部40可配置於塗佈單元10之內部。此時,搬出口10b未配置於塗佈單元10,可由搬出滾輪11f(或由支撐滾輪11d)捲繞未燒成膜 FA,形成捲筒體R。 In FIGS. 1 and 3, the winding unit 40 is separated from the coating unit 10. Independent configuration, but not limited to this. For example, the winding portion 40 may be disposed inside the coating unit 10. At this time, the carrying-out port 10b is not arranged in the coating unit 10, and the unfired film can be wound by the carrying-out roller 11f (or the supporting roller 11d). FA, forming the roll body R.

[送出部] [Submission Department]

圖4係概略表示燒成單元20之-Y側之構成的斜視圖。 FIG. 4 is a perspective view schematically showing the configuration of the -Y side of the firing unit 20.

如圖4所示,燒成單元20之-Y側設置搬入未燒成膜FA之搬入口20a。送出部50係相對於搬入口20a,送出未燒成膜FA。 As shown in FIG. 4, the -Y side of the firing unit 20 is provided with a carrying port 20a for carrying in the unfired film FA. The sending-out part 50 sends out the unfired film FA with respect to the carrying port 20a.

送出部50係軸構件SF可安裝於軸承51的構 成。軸構件SF可與安裝於捲繞部40之軸承41者共同使用。因此,可將自捲繞部40取下之軸構件SF安裝至送出部50之軸承51。藉此,可將捲繞部40形成的捲筒體R配置於送出部50。又,對於軸承51及捲繞部40之軸承41,各自可設定為離地面之高度為相等,也可設定為不同的高度位置。 The delivery unit 50 is a structure in which the shaft member SF can be attached to the bearing 51. to make. The shaft member SF can be used in common with a bearing 41 mounted on the winding portion 40. Therefore, the shaft member SF removed from the winding portion 40 can be attached to the bearing 51 of the sending-out portion 50. Thereby, the roll body R formed by the winding part 40 can be arrange | positioned at the sending-out part 50. In addition, each of the bearing 51 and the bearing 41 of the winding portion 40 may be set to have the same height from the ground, or may be set to different height positions.

軸構件SF被安裝於軸承51時,可繞著與X 方向平行之軸線旋轉而被支撐。送出部50具有使安裝於軸承51之軸構件SF旋轉之無圖示的驅動機構。藉由驅動機構,使軸構件SF於圖1之順時針旋轉,構成捲筒體R之未燒成膜FA朝向搬入口20a被送出。上述捲繞部40中,未燒成膜FA之中,第1塗佈膜F1側之面配置於外側,來捲繞未燒成膜FA,因此未燒成膜FA由捲筒體R被拉出時,第1塗佈膜F1側被配置於上方。 When the shaft member SF is mounted on the bearing 51, An axis parallel to the direction is rotated and supported. The sending-out portion 50 includes a driving mechanism (not shown) that rotates the shaft member SF attached to the bearing 51. By the drive mechanism, the shaft member SF is rotated clockwise in FIG. 1, and the unfired film FA constituting the roll body R is sent out toward the loading port 20 a. In the winding section 40, the unfired film FA has the surface on the side of the first coating film F1 disposed outside to wind the unfired film FA. Therefore, the unfired film FA is pulled by the roll body R. At the time of exit, the first coating film F1 side is arranged above.

[燒成單元] [Baking unit]

燒成單元20在本實施形態中,對於未燒成膜FA進行高溫處理的單元。燒成單元20係將未燒成膜FA進行燒成,形成含有微粒子的燒成膜FB。燒成單元20具有腔21、加熱部22及搬送部23。腔21具有搬入未燒成膜FA之搬入口20a及搬出燒成膜FB之搬出口20b。腔21係收容加熱部22及搬送部23。 The firing unit 20 is a unit that performs high-temperature processing on the unfired film FA in this embodiment. The firing unit 20 fires the unfired film FA to form a fired film FB containing fine particles. The firing unit 20 includes a cavity 21, a heating unit 22, and a transport unit 23. The cavity 21 has a carry-in port 20a for carrying in the unfired film FA and a carry-out port 20b for carrying out the fired film FB. The cavity 21 contains a heating unit 22 and a transport unit 23.

加熱部22係將被搬入腔31內之未燒成膜FA 進行加熱。加熱部22具有於Y方向排列配置之複數的加熱器22a。此加熱器22a例如可使用紅外線加熱器等。加熱部22係由腔21之內部之-Y側端部跨+Y側端部來配置。加熱部22係在Y方向之大致全體,可將未燒成膜FA加熱。加熱部22例如可將未燒成膜FA加熱至120℃~450℃左右。藉由加熱部22之加熱溫度可配合未燒成膜FA之搬送速度或未燒成膜FA之構成成分等適宜調整。 The heating section 22 is an unfired film FA to be carried into the cavity 31 Heat. The heating unit 22 includes a plurality of heaters 22 a arranged in the Y direction. As this heater 22a, for example, an infrared heater or the like can be used. The heating portion 22 is disposed across the + Y-side end portion inside the cavity 21. The heating section 22 is substantially the entire Y direction, and can heat the unfired film FA. The heating unit 22 can heat the unfired film FA to about 120 ° C to 450 ° C, for example. The heating temperature of the heating unit 22 can be appropriately adjusted in accordance with the conveyance speed of the unfired film FA, the constituent components of the unfired film FA, and the like.

搬送部23具有搬送帶23a、驅動滾輪23b、 被動滾輪23c及張力滾輪23d、23e。搬送帶23a係形成無端狀,沿著Y方向配置。搬送帶23a係使用對於未燒成膜FA之燒成溫度具有耐久性的材料所形成。搬送帶23a係在具有張力的狀態下,與XY平面大致平行,跨接於驅動滾輪23b與被動滾輪23c之間。未燒成膜FA及燒成膜FB係被載置於搬送帶23a的狀態下,被搬送至+Y方向。 The transport unit 23 includes a transport belt 23a, a driving roller 23b, The passive roller 23c and the tension rollers 23d and 23e. The conveying belt 23a is endless and is arranged along the Y direction. The transfer belt 23a is formed using a material having durability against the firing temperature of the unfired film FA. The conveying belt 23a is substantially parallel to the XY plane in a state of tension, and bridges between the driving roller 23b and the passive roller 23c. The unfired film FA and the fired film FB are conveyed in the + Y direction while being placed on the conveying belt 23 a.

驅動滾輪23b係被配置於腔21之內部之+Y 側端部。驅動滾輪23b係例如形成圓筒狀,與X方向平行 配置。驅動滾輪23b設置例如馬達等之旋轉驅動裝置。驅動滾輪23b設置成藉由此旋轉驅動裝置,可繞著與X方向平行之軸線旋轉。藉由驅動滾輪23b旋轉,搬送帶23a繞著圖1之順時針旋轉。藉由搬送帶23a旋轉,被載置於搬送帶23a上之未燒成膜FA及燒成膜FB被搬送至+Y方向。 The driving roller 23b is arranged at the + Y inside the cavity 21. Side end. The driving roller 23b is formed in a cylindrical shape, for example, and is parallel to the X direction. Configuration. The driving roller 23b is provided with a rotary driving device such as a motor. The driving roller 23b is provided to rotate around the axis parallel to the X direction by rotating the driving device. By the rotation of the driving roller 23b, the conveying belt 23a rotates clockwise around FIG. As the conveyance belt 23 a rotates, the unfired film FA and the fired film FB placed on the conveyance belt 23 a are conveyed to the + Y direction.

被動滾輪23c係被配置於腔21之內部之-Y側 端部。被動滾輪23c例如形成圓筒狀,與X方向平行配置。被動滾輪23c係形成與驅動滾輪23b相同之直徑,Z方向之位置(高度位置)與驅動滾輪23b大致相等來配置。 被動滾輪23c係設置成可繞與X方向平行之軸線旋轉。被動滾輪23c係追蹤搬送帶23a之旋轉而旋轉。 The passive roller 23c is arranged on the -Y side of the interior of the cavity 21. Ends. The passive roller 23c is formed in a cylindrical shape, for example, and is arranged parallel to the X direction. The passive roller 23c is formed to have the same diameter as the driving roller 23b, and the position (height position) in the Z direction is substantially equal to the driving roller 23b. The passive roller 23c is provided so as to be rotatable about an axis parallel to the X direction. The passive roller 23c rotates following the rotation of the conveyance belt 23a.

張力滾輪23d係配置於被動滾輪23c之+Z側。張力滾輪23d係與X方向平行配置,且設置成可繞X軸旋轉。張力滾輪23d設置為可在Z方向昇降移動。張力滾輪23d在與被動滾輪23c之間,可挾著未燒成膜FA。張力滾輪23d可以挾著未燒成膜FA的狀態旋轉。 The tension roller 23d is arranged on the + Z side of the passive roller 23c. The tension roller 23d is arranged parallel to the X direction and is provided to be rotatable about the X axis. The tension roller 23d is provided to be movable up and down in the Z direction. The tension roller 23d and the passive roller 23c can hold the unfired film FA. The tension roller 23d can be rotated while holding the unfired film FA.

張力滾輪23e係配置於驅動滾輪23b之+Z側。張力滾輪23e係與X方向平行配置,設置成可繞X軸旋轉。張力滾輪23e設置成可在Z方向昇降移動。張力滾輪23e在與驅動滾輪23b之間,可挾著燒成膜FB。張力滾輪23e可挾著燒成膜FB的狀態旋轉。 The tension roller 23e is arranged on the + Z side of the driving roller 23b. The tension roller 23e is arranged parallel to the X direction and is provided so as to be rotatable about the X axis. The tension roller 23e is provided so that it can move up and down in a Z direction. Between the tension roller 23e and the driving roller 23b, the fired film FB can be held. The tension roller 23e can be rotated while holding the fired film FB.

藉由張力滾輪23d、23e各自在被動滾輪23c及驅動滾輪23b之間,各自挾著未燒成膜FA及燒成膜FB 的狀態下,連續之未燒成膜FA及燒成膜FB之中,被挾之2處之間的部分,來自外部之張力受到阻斷。藉此,可防止對於未燒成膜FA及燒成膜FB,施加過剩的負荷。張力滾輪23d、23e可調整避免對配置於腔21內之未燒成膜FA及燒成膜FB施加張力。 The tension rollers 23d and 23e are respectively held between the passive roller 23c and the driving roller 23b, and the unfired film FA and the fired film FB are held respectively. Of the continuous unfired film FA and fired film FB, the tension between the two places is blocked from the outside. This prevents an excessive load from being applied to the unfired film FA and the fired film FB. The tension rollers 23 d and 23 e can be adjusted to avoid applying tension to the unfired film FA and the fired film FB disposed in the cavity 21.

[除去單元] [Remove unit]

除去單元30具有腔31、蝕刻部32、洗凈部33、乾燥部34及搬送部35。腔31具有搬入燒成膜FB之搬入口30a及搬出多孔性樹脂膜F之搬出口30b。腔31係收容蝕刻部32、洗凈部33、乾燥部34及搬送部35。 The removing unit 30 includes a cavity 31, an etching portion 32, a washing portion 33, a drying portion 34, and a transfer portion 35. The cavity 31 has a carrying inlet 30a for carrying in the fired film FB and a carrying outlet 30b for carrying out the porous resin film F. The cavity 31 contains an etching section 32, a cleaning section 33, a drying section 34, and a transfer section 35.

蝕刻部32係對燒成膜FB進行蝕刻,除去燒 成膜FB所含有之微粒子,形成多孔性樹脂膜F。蝕刻部32中,藉由將燒成膜FB浸漬於可溶解或分解微粒子的蝕刻液中,除去微粒子。蝕刻部32設置供給這種蝕刻液的供給部(無圖示)或可儲存蝕刻液的儲存部。 The etching section 32 etches the firing film FB to remove the firing. The fine particles contained in the FB are formed into a porous resin film F. In the etching section 32, the fired film FB is immersed in an etching solution capable of dissolving or decomposing the fine particles to remove the fine particles. The etching section 32 is provided with a supply section (not shown) that supplies such an etching solution or a storage section that can store the etching solution.

洗凈部33係洗淨蝕刻後之多孔性樹脂膜F。 洗凈部33配置於蝕刻部32之+Y側(多孔性樹脂膜F之搬送方向的前方)。洗凈部33具有供給洗凈液的供給部(無圖示)。又,也可具有將洗淨多孔性樹脂膜F後之廢液回收的回收部(無圖示)、進行多孔性樹脂膜F之液體排除之液體排除部(無圖示)等。 The cleaning portion 33 is a porous resin film F after the etching. The cleaning section 33 is disposed on the + Y side of the etching section 32 (front of the porous resin film F in the conveying direction). The cleaning section 33 includes a supply section (not shown) that supplies a cleaning solution. The porous resin film F may include a recovery unit (not shown) for recovering the waste liquid after washing the porous resin film F, and a liquid discharge unit (not shown) for removing liquid from the porous resin film F.

乾燥部34係將洗凈後之多孔性樹脂膜F進行 乾燥。乾燥部34配置於洗凈部33之+Y側(多孔性樹脂膜 F之搬送方向的前方)。乾燥部34設置加熱多孔性樹脂膜F的加熱部等。 The drying section 34 performs washing of the porous resin film F dry. The drying section 34 is disposed on the + Y side of the washing section 33 (a porous resin film F forward of the transport direction). The drying section 34 is provided with a heating section or the like that heats the porous resin film F.

搬送部35跨越蝕刻部32、洗凈部33及乾燥 部34,搬送燒成膜FB及多孔性樹脂膜F。搬送部35具有搬送帶35a、驅動滾輪35b及被動滾輪35c。又,除驅動滾輪35b及被動滾輪35c外,也可於蝕刻部32、洗凈部33、乾燥部34之內部配置支撐搬送帶35a的支撐滾輪。 The transport section 35 straddles the etching section 32, the cleaning section 33, and the drying section. The section 34 conveys the fired film FB and the porous resin film F. The transport unit 35 includes a transport belt 35a, a driving roller 35b, and a passive roller 35c. Further, in addition to the drive roller 35b and the passive roller 35c, a support roller that supports the transport belt 35a may be disposed inside the etching section 32, the cleaning section 33, and the drying section 34.

搬送帶35a係形成無端狀,沿著Y方向配 置。搬送帶35a係使用對於上述蝕刻液具有耐久性的材料所形成。搬送帶35a在具有張力的狀態下,與XY平面大致平行狀態,跨接於驅動滾輪35b與被動滾輪35c之間。 燒成膜FB及多孔性樹脂膜F被載置於搬送帶35a上。 The conveying belt 35a is endless, and is arranged along the Y direction. Home. The conveying belt 35a is formed using a material having durability against the etching solution. The conveying belt 35a is in a state of being substantially parallel to the XY plane under a tension state, and bridges between the driving roller 35b and the passive roller 35c. The fired film FB and the porous resin film F are placed on the transfer belt 35a.

驅動滾輪35b配置於腔31之內部之+Y側端 部。驅動滾輪35b例如形成圓筒狀,且與X方向平行配置。驅動滾輪35b設置例如馬達等之旋轉驅動裝置。驅動滾輪35b係設置成藉由此旋轉驅動裝置,可繞著與X方向平行之軸線旋轉。藉由驅動滾輪35b旋轉,搬送帶35a繞著圖1之順時針旋轉。藉由搬送帶35a旋轉,載置於搬送帶35a上之燒成膜FB及多孔性樹脂膜F被搬送至+Y方向。 The driving roller 35b is arranged at the + Y side end inside the cavity 31 unit. The drive roller 35b is formed in a cylindrical shape, for example, and is arranged parallel to the X direction. The drive roller 35b is provided with a rotary drive device such as a motor. The driving roller 35b is provided to rotate around the axis parallel to the X direction by rotating the driving device. By the rotation of the driving roller 35b, the conveying belt 35a rotates clockwise around FIG. When the conveyance belt 35a is rotated, the fired film FB and the porous resin film F placed on the conveyance belt 35a are conveyed to the + Y direction.

被動滾輪35c配置於腔31之內部之-Y側端 部。被動滾輪35c例如形成圓筒狀,且與X方向平行配置。被動滾輪35c係形成與驅動滾輪35b相同之直徑,Z 方向之位置(高度位置)與驅動滾輪35b大致相等來配置。被動滾輪35c係設置為可繞著與X方向平行之軸線旋轉。被動滾輪35c係追蹤搬送帶35a之旋轉而旋轉。 The passive roller 35c is arranged at the -Y side end of the inside of the cavity 31 unit. The passive roller 35c is formed in a cylindrical shape, for example, and is arranged parallel to the X direction. The passive roller 35c is formed with the same diameter as the driving roller 35b, Z The position in the direction (height position) is arranged substantially equal to the driving roller 35b. The passive roller 35c is provided to be rotatable about an axis parallel to the X direction. The passive roller 35c rotates following the rotation of the conveyance belt 35a.

又,除去單元30不限於藉由蝕刻除去微粒子的情形。例如,微粒子之材質使用比聚醯亞胺更低溫分解的有機材料時,藉由將燒成膜FB加熱,可使微粒子分解。這種有機材料只要是比聚醯亞胺更低溫分解的有機材料時,無特別限定均可使用。例如可列舉由線狀聚合物或習知之解聚合性聚合物所構成之樹脂微粒子。通常的線狀聚合物在熱分解時,聚合物之分子鏈被不規則切斷,解聚合性聚合物係在熱分解時,聚合物分解成單體的聚合物。皆分解成低分子量體或CO2,由燒成膜FB中消失。此時之微粒子之分解溫度,較佳為200~320℃,更佳為230~260℃。分解溫度為200℃以上時,塗佈液使用高沸點溶劑時,也可成膜,燒成單元20中之燒成條件之選擇變寬。又,分解溫度未達320℃時,對於燒成膜FB不會施加熱傷害,可僅使微粒子消失。 The removing unit 30 is not limited to the case of removing fine particles by etching. For example, when the material of the fine particles is an organic material that decomposes at a lower temperature than polyimide, the fine particles can be decomposed by heating the fired film FB. As long as this organic material is an organic material which decomposes at a lower temperature than polyimide, it can be used without particular limitation. Examples thereof include resin fine particles composed of a linear polymer or a conventional depolymerizable polymer. When a normal linear polymer is thermally decomposed, the molecular chain of the polymer is irregularly cut, and a depolymerizable polymer is a polymer that is decomposed into monomers during thermal decomposition. Both decompose into low molecular weight bodies or CO 2 and disappear from the fired film FB. The decomposition temperature of the fine particles at this time is preferably 200 to 320 ° C, and more preferably 230 to 260 ° C. When the decomposition temperature is 200 ° C. or higher, when a high-boiling-point solvent is used as the coating liquid, a film can also be formed, and the selection of the firing conditions in the firing unit 20 becomes wider. When the decomposition temperature is less than 320 ° C, thermal damage is not applied to the fired film FB, and only fine particles can be eliminated.

[捲繞部(2)] [Winding section (2)]

圖5概略表示除去單元30之+Y側之構成的斜視圖。 FIG. 5 is a perspective view schematically showing the configuration of the + Y side of the removal unit 30.

如圖5所示,塗佈單元30之+Y側設置搬出多孔性樹脂膜F之搬出口30b。由搬出口30b搬出的多孔性樹脂膜F,藉由捲繞部60捲繞。 As shown in FIG. 5, the + Y side of the coating unit 30 is provided with the carrying-out port 30b which carries out the porous resin film F. The porous resin film F carried out from the carrying-out port 30b is wound by the winding part 60.

捲繞部60係於軸承61被安裝軸構件SF的構 成。軸構件SF係將由搬出口30b搬出的多孔性樹脂膜F捲繞形成捲筒體RF。軸構件SF係對於軸承61,設置成可拆裝。軸構件SF被安裝於軸承61時,可繞著與X方向平行之軸線旋轉來被支撐。捲繞部60具有可使安裝於軸承61之軸構件SF旋轉之無圖示的驅動機構。藉由驅動機構使軸構件SF旋轉,以捲繞多孔性樹脂膜F。在形成有捲筒體RF的狀態下,軸構件SF由軸承61上取下,可回收捲筒體RF。 The winding portion 60 is connected to the structure of the bearing 61 to which the shaft member SF is mounted. to make. The shaft member SF is a roll RF formed by winding the porous resin film F carried out from the carrying-out port 30b. The shaft member SF is detachably provided to the bearing 61. When the shaft member SF is attached to the bearing 61, it is supported by being rotatable about an axis parallel to the X direction. The winding unit 60 includes a driving mechanism (not shown) that can rotate the shaft member SF mounted on the bearing 61. The shaft member SF is rotated by the driving mechanism to wind the porous resin film F. In a state where the roll body RF is formed, the shaft member SF is removed from the bearing 61, and the roll body RF can be recovered.

[製造方法] [Production method]

其次,說明使用如上述構成的製造系統SYS,製造多孔性樹脂膜F之動作之一例。圖6(a)~(f)表示多孔性樹脂膜F之製造過程之一例的圖。 Next, an example of the operation of manufacturing the porous resin film F using the manufacturing system SYS configured as described above will be described. 6 (a) to (f) are diagrams showing an example of a manufacturing process of the porous resin film F.

首先,塗佈單元10中,形成未燒成膜FA。 塗佈單元10係使基材送出滾輪11a旋轉,送出搬送基材S,將搬送基材S設置於支撐滾輪11b~11d後,以基材捲繞滾輪11e捲繞。然後,由基材送出滾輪11a依序送出搬送基材S,同時以基材捲繞滾輪11e進行捲繞。 First, in the coating unit 10, an unfired film FA is formed. The coating unit 10 rotates the substrate sending-out roller 11a, sends out the transfer substrate S, sets the transfer substrate S on the support rollers 11b to 11d, and winds it with the substrate winding roller 11e. Then, the substrate S is sequentially delivered by the substrate delivery roller 11a, and is wound by the substrate winding roller 11e.

此狀態下,使第1噴嘴12配置於第1位置 P1,使吐出口12a朝向+Y方向。藉此,使吐出口12a朝向搬送基材S之中,藉由支撐滾輪11b支撐的部分。然後,由吐出口12a吐出第1塗佈液Q1。第1塗佈液Q1係由吐出口12a朝向+Y方向被吐出,到達搬送基材S後,隨著搬送基材S之移動,塗佈於搬送基材S上。藉此,如 圖6(a)所示,搬送基材S上形成藉由第1塗佈液Q1所得的第1塗佈膜F1。第1塗佈膜F1中,樹脂材料A1中含有特定之體積比的微粒子A2。 In this state, the first nozzle 12 is arranged at the first position. P1 makes the discharge port 12a face the + Y direction. Thereby, the discharge opening 12a is oriented toward the portion of the conveyance substrate S that is supported by the support roller 11b. Then, the first coating liquid Q1 is discharged from the discharge port 12a. The first coating liquid Q1 is discharged from the discharge port 12a in the + Y direction, and after reaching the transfer substrate S, it is applied to the transfer substrate S as the transfer substrate S moves. Take this as As shown in FIG. 6 (a), the first coating film F1 obtained by the first coating liquid Q1 is formed on the transport substrate S. In the first coating film F1, the resin material A1 contains fine particles A2 in a specific volume ratio.

接著,使第2噴嘴12配置於第2位置P2,使吐出口13a朝向-Z方向。藉此,使吐出口13a朝向搬送基材S之中,藉由支撐滾輪11c支撐的部分。然後,由吐出口13a吐出第2塗佈液Q2。第2塗佈液Q2係由吐出口13a朝向-Z方向被吐出,到達形成於搬送基材S之第1塗佈膜F1上之後,隨著搬送基材S之移動,被塗佈於第1塗佈膜F1上。藉此,如圖6(b)所示,第1塗佈膜F1上形成藉由第2塗佈液所得的第2塗佈膜F2。第2塗佈膜F2中,樹脂材料A1中含有特定之體積比的微粒子A2。微粒子之含有率係設定為第1塗佈膜F1大於第2塗佈膜F2。 Next, the second nozzle 12 is arranged at the second position P2, and the discharge port 13a is oriented in the -Z direction. Thereby, the ejection opening 13a is oriented toward the portion of the conveyance substrate S that is supported by the support roller 11c. Then, the second coating liquid Q2 is discharged from the discharge port 13a. The second coating liquid Q2 is discharged toward the -Z direction from the discharge port 13a, and after reaching the first coating film F1 formed on the conveying substrate S, it is applied to the first coating film S as it moves. On the coating film F1. Thereby, as shown in FIG.6 (b), the 2nd coating film F2 obtained by the 2nd coating liquid is formed on the 1st coating film F1. In the second coating film F2, the resin material A1 contains fine particles A2 in a specific volume ratio. The content of the fine particles is set such that the first coating film F1 is larger than the second coating film F2.

又,吐出口12a、13a朝向在搬送基材S之中,藉由支撐滾輪11b、11c支撐的部分的狀態下,被塗佈第1塗佈液Q1及第2塗佈液Q2,因此,第1塗佈液Q1及第2塗佈液Q2到達搬送基材S時,對搬送基材S產生作用的力被支撐滾輪11b、11c所承受。因此,搬送基材S之撓性或振動等之發生被抑制,搬送基材S上以均勻的厚度安定形成第1塗佈膜F1及第2塗佈膜F2。 In addition, the first and second coating liquids Q1 and Q2 are applied in a state where the discharge ports 12a and 13a face the portions supported by the support rollers 11b and 11c in the conveyance substrate S. Therefore, the first When the 1 coating liquid Q1 and the 2nd coating liquid Q2 reach the conveyance base material S, the force which acts on the conveyance base material S is received by the support rollers 11b and 11c. Therefore, occurrence of flexibility, vibration, and the like of the transport substrate S is suppressed, and the first coating film F1 and the second coating film F2 are formed stably with uniform thickness on the transport substrate S.

接著,搬送基材S移動,而第1塗佈膜F1及第2塗佈膜F2之層合部分被搬入乾燥部14之腔14a內時,乾燥部14中,進行第1塗佈膜F1及第2塗佈膜F2之乾燥。乾燥部14係使用加熱部14b,例如以50℃~ 100℃左右的溫度,將第1塗佈膜F1及第2塗佈膜F2加熱。此溫度範圍時,搬送基材S不會發生應變或變形等,可將第1塗佈膜F1及第2塗佈膜F2加熱。藉由使第1塗佈膜F1及第2塗佈膜F2之層合體乾燥,如圖6(c)所示,形成未燒成膜FA。 Next, when the conveying substrate S moves, and the laminated portion of the first coating film F1 and the second coating film F2 is carried into the cavity 14a of the drying section 14, the first coating film F1 and Drying of the second coating film F2. The drying section 14 uses a heating section 14b, for example, at 50 ° C ~ The first coating film F1 and the second coating film F2 are heated at a temperature of about 100 ° C. In this temperature range, the first base film F1 and the second base film F2 can be heated without strain or deformation of the transported substrate S. By drying the laminated body of the first coating film F1 and the second coating film F2, as shown in FIG. 6 (c), an unfired film FA is formed.

又,本說明書中,層合體係指由前述第1塗佈膜F1及前述第2塗佈膜F2所構成之未燒成膜。形成本發明之多孔性之醯亞胺系樹脂膜時,第1液體及第2液體中,聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺之中,分別使用同種的樹脂時,由形成之前述第1塗佈膜F1及前述第2塗佈膜F2所構成之未燒成膜(或多孔性之醯亞胺系樹脂膜),實質為1層,但是因形成微粒子之含有率不同之未燒成膜(或具有空孔率不同之區域之多孔性之醯亞胺系樹脂膜),故也包含第1液體及第2液體使用同種的樹脂的情形,本說明書中,也稱為層合體。 In the present specification, the laminated system refers to an unfired film composed of the first coating film F1 and the second coating film F2. When forming the porous fluorene-based imide resin film of the present invention, among the first liquid and the second liquid, the same kind is used among polyamic acid, polyfluorene, polyfluorene, or polyfluorene, respectively. In the case of a resin, an unfired film (or a porous fluorene imine-based resin film) composed of the first coating film F1 and the second coating film F2 formed is substantially a single layer. Unfired films with different microparticle content ratios (or porous imine-based resin films with regions with different porosity), so the case of using the same resin in the first liquid and the second liquid is also included. This manual It is also called a laminate.

接著,搬送基材S移動,未燒成膜FA之前端部分到達支撐滾輪11d(剝離部15)時,例如藉由作業者之手作業,將此前端部分由搬送基材S剝離。本實施形態中,搬送基材S之材料使用例如PET,故使第1塗佈膜F1及第2塗佈膜F2乾燥形成未燒成膜FA時,由搬送基材S剝離變得容易,故作業者容易進行剝離。 Next, when the conveyance substrate S moves and the front end portion of the unfired film FA reaches the support roller 11d (the peeling portion 15), the front end portion is peeled from the conveyance substrate S, for example, by the operator's hand. In this embodiment, for example, PET is used as the material of the transport substrate S. Therefore, when the first coating film F1 and the second coating film F2 are dried to form the unfired film FA, peeling from the transport substrate S becomes easy. It is easy for a worker to peel.

將未燒成膜FA之前端部分剝離後,接著,搬送基材S移動,藉由第1噴嘴12形成第1塗佈膜F1。又,接著,藉由第2噴嘴13形成第2塗佈膜F2,以乾燥 部14形成未燒成膜FA。藉此,未燒成膜FA形成帶狀,由乾燥部14搬出至+Y側的未燒成膜FA之長度漸漸變長。作業者在剝離部15,繼續剝離未燒成膜FA。然後,被剝離後之未燒成膜FA之前端到達捲繞部40之軸構件SF的長度時,作業者以手作業將未燒成膜FA設置於搬出滾輪11f,同時,未燒成膜FA之前端部分裝設於軸構件SF。然後,依序形成未燒成膜FA,為了配合剝離,在捲繞部40使軸構件SF旋轉。藉此,被剝離後之未燒成膜FA依序由塗佈單元10搬出,被捲繞部40之軸構件SF捲繞,形成捲筒體R。構成捲筒體R之未燒成膜FA如圖6(d)所示,成為由搬送基材S剝離後的狀態,表面及裏面均露出。 After the front end portion of the unfired film FA is peeled off, the conveyance substrate S is moved to form the first coating film F1 by the first nozzle 12. Then, a second coating film F2 is formed by the second nozzle 13 and dried. The portion 14 forms an unfired film FA. Thereby, the unfired film FA is formed into a band shape, and the length of the unfired film FA carried out from the drying section 14 to the + Y side is gradually increased. The worker continues peeling the unfired film FA in the peeling part 15. Then, when the front end of the peeled unfired film FA reaches the length of the shaft member SF of the winding section 40, the operator sets the unfired film FA on the take-out roller 11f by hand, and at the same time, the unfired film FA The front end portion is attached to the shaft member SF. Then, the unfired film FA is sequentially formed, and the shaft member SF is rotated at the winding portion 40 in order to accommodate peeling. Thereby, the peeled unfired film FA is sequentially carried out from the coating unit 10, and is wound by the shaft member SF of the winding section 40 to form a roll body R. As shown in FIG. 6 (d), the unfired film FA constituting the roll body R is in a state after being peeled from the transport substrate S, and both the surface and the inside are exposed.

剝離未燒成膜FA之前端部分的作業、及剝離 後之前端部分安裝於軸構件SF的作業等,不限於作業者以手作業進行的態樣,例如可使用機械手等自動進行。 又,為了提高未燒成膜FA之剝離性,故也可在搬送基材S之表面形成脫模層。 Work for peeling unfired film FA front end part, and peeling The work of attaching the rear front end portion to the shaft member SF is not limited to a situation in which the operator performs the work by hand, for example, it can be performed automatically using a robot or the like. In addition, in order to improve the releasability of the unfired film FA, a release layer may be formed on the surface of the transport substrate S.

特定長度的未燒成膜FA被捲繞於軸構件SF 後,切斷未燒成膜FA,同時將軸構件SF連捲筒體R一同由軸承41取下。然後,將新的軸構件SF安裝於捲繞部40之軸承41,將未燒成膜FA之切取的端部裝設於此軸構件SF,使旋轉接著形成未燒成膜FA,可製作新的捲筒體R。 An unfired film FA of a specific length is wound around the shaft member SF After that, the unfired film FA is cut, and the shaft member SF and the roll body R are removed from the bearing 41 at the same time. Then, a new shaft member SF is mounted on the bearing 41 of the winding portion 40, and the cut end of the unfired film FA is mounted on the shaft member SF, and the unfired film FA is formed by rotation, and a new The roll body R.

另外,例如作業者將由軸承41連捲筒體R一 同取下的軸構件SF搬送至送出部50,安裝於軸承51。此軸構件SF之搬送動作及安裝動作也可使用機械手或搬送裝置等自動進行。軸構件SF安裝於軸承51後,藉由使軸構件SF旋轉,由捲筒體R依序拉出未燒成膜FA,而未燒成膜FA被搬入燒成單元20之腔21內。又,將未燒成膜FA之前端搬入腔21時,作業者也可以手作業進行,也可使用機械手等自動進行。 In addition, for example, the operator will roll the roller R- The removed shaft member SF is transported to the sending-out portion 50 and is attached to the bearing 51. The movement and installation of the shaft member SF can also be performed automatically using a robot or a transfer device. After the shaft member SF is mounted on the bearing 51, the shaft member SF is rotated to sequentially pull out the unfired film FA from the roll body R, and the unfired film FA is carried into the cavity 21 of the firing unit 20. In addition, when the front end of the unfired film FA is carried into the cavity 21, the operator may perform the operation manually, or may perform the operation automatically using a robot or the like.

被搬入腔21內之未燒成膜FA被載置於搬送帶23a上,遵循搬送帶23a之旋轉,被搬送至+Y方向。又,也可使用張力滾輪23d、23e調整張力。然後,搬送未燒成膜FA,同時使用加熱部22,進行未燒成膜FA之燒成。 The unfired film FA carried into the cavity 21 is placed on the carrying belt 23a, and is rotated to the + Y direction in accordance with the rotation of the carrying belt 23a. The tension can also be adjusted using the tension rollers 23d and 23e. Then, the unfired film FA is conveyed, and the unfired film FA is fired using the heating unit 22 at the same time.

燒成時之溫度係因未燒成膜FA之構造而異,較佳為120℃~375℃左右,又更佳為150℃~350℃。又,微粒子中含有機材料時,必須設定比其熱分解溫度更低之溫度。塗佈液含有聚醯胺酸時,此燒成時,完成醯亞胺化較佳,但是不限於未燒成膜FA為由聚醯亞胺、聚醯胺醯亞胺或聚醯胺所構成,藉由燒成單元20,對於未燒成膜FA進行高溫處理的情形。 The temperature during firing varies depending on the structure of the unfired film FA, and is preferably about 120 ° C to 375 ° C, and more preferably 150 ° C to 350 ° C. When the fine particles contain organic materials, it is necessary to set a temperature lower than the thermal decomposition temperature. When the coating liquid contains polyamic acid, it is better to complete the fluorination at this firing, but the unfired film FA is not limited to polyfluorine, polyfluorene, imine, or polyamine In the case where the unfired film FA is subjected to a high temperature treatment by the firing unit 20.

又,燒成條件,例如塗佈液含有聚醯胺酸及/或聚醯亞胺時,可以3小時使由室溫升溫至375℃後,在375℃下保持20分鐘的方法或可以50℃刻度,階段性由室溫升溫至375℃(各階段保持20分鐘),最後,375℃下保持20分鐘等進行階段性加熱。又,可將未燒成膜FA 之端部固定於SUS製之模型等,防止變形。 The firing conditions include, for example, a method in which the coating solution contains polyamic acid and / or polyimide, the temperature can be raised from room temperature to 375 ° C for 3 hours, and the method can be maintained at 375 ° C for 20 minutes or 50 ° C. Graduation, stepwise heating from room temperature to 375 ° C (20 minutes at each stage), and finally, stepwise heating at 375 ° C for 20 minutes. In addition, unfired film FA can be formed. The end is fixed to a model made of SUS, etc. to prevent deformation.

藉由這種燒成,如圖6(e)所示,形成燒成膜 FB。燒成膜FB係在經醯亞胺化或高溫處理之樹脂層A3之內部含有微粒子A2。燒成膜FB之膜厚,可藉由例如測微器(micrometer)等測量複數處的厚度,求得平均值。較佳的平均膜厚,若使用於分隔膜等時,較佳為3μm~500μm,更佳為5μm~100μm,又更佳為10μm~30μm。 By this firing, as shown in FIG. 6 (e), a firing film is formed. FB. The fired film FB contains fine particles A2 in the inside of the resin layer A3 that has been imidized or high-temperature treated. The film thickness of the fired film FB can be determined by measuring the thickness at a plurality of places, for example, using a micrometer, to obtain an average value. The preferred average film thickness is 3 μm to 500 μm, more preferably 5 μm to 100 μm, and even more preferably 10 μm to 30 μm when used in a separator film or the like.

在燒成單元20所形成的燒成膜FB,由燒成 單元20搬出時,未經捲繞被搬入除去單元30。燒成膜FB之前端部分搬入除去單元30時,作業者可以手作業進行,也可使用機械手等自動進行。 The firing film FB formed in the firing unit 20 is fired by When the unit 20 is carried out, it is carried into the removal unit 30 without being wound. When the front end portion of the fired film FB is carried into the removal unit 30, the operator may perform the operation manually, or may perform the operation automatically using a robot or the like.

被搬入除去單元30之燒成膜FB被載置於搬 送帶35a上,遵循搬送帶35a之旋轉,被搬送至+Y方向。除去單元30係隨著燒成膜FB之搬送,首先,在蝕刻部32中,除去微粒子A2。微粒子A2之材質,使用例如二氧化矽時,蝕刻部32中,燒成膜FB被浸漬於低濃度之氟化氫等之蝕刻液中。藉此,微粒子A2溶解於蝕刻液而被除去,如圖6(f)所示,樹脂層A3之內部形成含有多孔部A4的多孔性樹脂膜F。 The fired film FB carried into the removal unit 30 is placed in the carrying The conveyance belt 35a follows the rotation of the conveyance belt 35a and is conveyed to the + Y direction. The removal unit 30 removes the fine particles A2 in the etching section 32 as the fired film FB is transported. For the material of the fine particles A2, for example, when silicon dioxide is used, the fired film FB in the etching section 32 is immersed in an etching solution such as a low concentration of hydrogen fluoride. Thereby, the fine particles A2 are dissolved in the etching solution and removed, and as shown in FIG. 6 (f), a porous resin film F containing a porous portion A4 is formed inside the resin layer A3.

其後,遵循搬送帶35a之旋轉,多孔性樹脂膜F依序被搬入洗凈部33及乾燥部34中。洗凈部33係藉由洗凈液洗淨多孔性樹脂膜F,然後進行液體排除。又,乾燥部34係液體排除後之多孔性樹脂膜F被加熱,洗凈液被除去。然後,多孔性樹脂膜F自除去單元30被 搬出,藉由捲繞部60之軸構件SF被捲繞。 Thereafter, following the rotation of the conveyance belt 35 a, the porous resin film F is sequentially carried into the washing section 33 and the drying section 34. The washing section 33 is configured to wash the porous resin film F with a washing solution, and then remove the liquid. The porous resin film F after the liquid in the drying section 34 is removed is heated, and the washing liquid is removed. Then, the porous resin film F is removed from the removing unit 30. When unloaded, the shaft member SF is wound by the winding unit 60.

如上述,本實施形態之製造系統SYS係包 含:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺之樹脂材料A1及微粒子A2的塗佈液(第1塗佈液Q1及第2塗佈液Q2)塗佈於搬送基材S,形成未燒成膜FA的塗佈單元10,此塗佈單元10內,將由搬送基材S剝離的未燒成膜FA進行燒成,形成含有微粒子之燒成膜FB的燒成單元20,由燒成膜FB中除去微粒子A2的除去單元30,故可以連串流程進行未燒成膜FA之形成、未燒成膜FA之燒成(燒成膜FB之形成)、及微粒子A2之除去(多孔性樹脂膜F之形成)之3個步驟。藉此,可提高多孔性樹脂膜F之製造效率。 As described above, the manufacturing system SYS of this embodiment is a package Containing: A coating liquid (a first coating liquid Q1 and a second coating liquid Q2) containing a resin material A1 and fine particles A2 containing polyamic acid, polyimide, polyamidine, or polyimide. A coating unit 10 that is applied to the transfer substrate S to form an unfired film FA. In this coating unit 10, the unfired film FA peeled from the transfer substrate S is fired to form a fired film containing fine particles. The firing unit 20 of the FB is a removing unit 30 for removing the fine particles A2 from the fired film FB. Therefore, a series of processes can be performed to form the unfired film FA and the firing of the unfired film FA (the formation of the fired film FB). ), And three steps of removing fine particles A2 (formation of porous resin film F). Thereby, the manufacturing efficiency of the porous resin film F can be improved.

又,塗佈單元(10)係在基材(搬送基材S)上形 成帶狀之未燒成膜(FA),故可適用於捲對捲方式等之製造步驟,可有效率形成多孔性之醯亞胺系樹脂膜(多孔性樹脂膜F)。 The coating unit (10) is formed on a substrate (conveying substrate S). It is a strip-shaped unfired film (FA), so it can be applied to manufacturing steps such as a roll-to-roll method, and can efficiently form a porous sulfonium-imide-based resin film (porous resin film F).

又,除去單元(20)係將藉由燒成單元(10)燒成的燒成膜(FB),未經捲繞依序收納(take in),除去微粒子(A2),故可有效率地進行由燒成至微粒子之除去的步驟。 In addition, the removal unit (20) removes fine particles (A2) by sequentially taking in the fired film (FB) fired by the firing unit (10) without winding in order to remove the fine particles (A2). The steps from firing to removal of fine particles are performed.

又,具備將由基材(搬送基材S)剝離的未燒成膜(FA)進行捲繞,形成捲筒體(R)的捲繞部(40),故可容易在單元間搬送。 In addition, since the unfired film (FA) peeled from the base material (conveying base material S) is wound and a winding portion (40) is formed to form a roll body (R), it can be easily transported between units.

捲筒體(R)為由基材(搬送基材S)剝離之帶狀的未燒成膜(FA)之捲筒體時,燒成單元(10)依序由捲筒體拉出未燒 成膜,進行燒成,故可有效率地形成燒成膜FB。 When the roll body (R) is a roll body of a strip-shaped unfired film (FA) peeled off from the base material (conveying base material S), the firing unit (10) sequentially pulls out the Since the film is formed and fired, the fired film FB can be efficiently formed.

又,液體使用至少微粒子(A2)之含有率互為不同之第1液體(第1塗佈液Q1)及第2液體(第2塗佈液Q2),而塗佈單元(10)藉由將第1液體及第2液體塗佈於基材(搬送基材S),形成至少微粒子之含有率不同,經層合的未燒成膜(FA),故以此未燒成膜為基礎所形成的多孔性之醯亞胺系樹脂膜(多孔性樹脂膜F)作為分隔膜使用時,離子順利移動,同時相較於僅以第1塗佈液Q1形成相同空孔率之多孔性之醯亞胺系樹脂膜時,更能確保作為膜的強度。 In addition, as the liquid, at least the first liquid (the first coating liquid Q1) and the second liquid (the second coating liquid Q2) whose content rates of the fine particles (A2) are different from each other, and the coating unit (10) The first liquid and the second liquid are applied to a substrate (conveying substrate S) to form at least a fine particle content, and a laminated unfired film (FA) is formed based on the unfired film. When used as a separator, the porous imine resin film (porous resin film F) can smoothly move ions, and at the same time, it can form a porous material with the same porosity compared with the first coating liquid Q1. In the case of an amine resin film, the strength as a film can be more ensured.

又,本實施形態之多孔性樹脂膜F之製造方 法係包含:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺之樹脂材料A1及微粒子A2的塗佈液(第1塗佈液Q1及第2塗佈液Q2)塗佈於搬送基材S後,由搬送基材S剝離,形成未燒成膜FA;將未燒成膜FA進行燒成形成含有微粒子A2的燒成膜FB;及由燒成膜FB中除去微粒子A2,故可以連串流程進行未燒成膜FA之形成、未燒成膜FA之燒成(燒成膜FB之形成)、及微粒子A2之除去(多孔性樹脂膜F之形成)之3個步驟。藉此,可提高多孔性樹脂膜F之製造效率。 The manufacturing method of the porous resin film F of this embodiment The law system includes a coating liquid (a first coating liquid Q1 and a second coating liquid) containing a resin material A1 and fine particles A2 containing polyamic acid, polyimide, polyimide, or polyimide Q2) After being coated on the transfer substrate S, it is peeled off from the transfer substrate S to form an unfired film FA; the unfired film FA is fired to form a fired film FB containing fine particles A2; and the fired film FB The fine particles A2 are removed in the process, so the unfired film FA can be formed in a series of processes, the unfired film FA can be fired (the fired film FB is formed), and the fine particles A2 can be removed (the porous resin film F is formed). 3 steps. Thereby, the manufacturing efficiency of the porous resin film F can be improved.

又,未燒成膜(FA)係形成帶狀,故可適用於 捲對捲方式等之製造步驟,可有效率地形成多孔性之醯亞胺系樹脂膜(多孔性樹脂膜F)。 In addition, the unfired film (FA) is formed in a band shape, so it can be applied to Production steps such as a roll-to-roll method can efficiently form a porous fluorene-imide-based resin film (porous resin film F).

另外,藉由將燒成膜(FB)未經捲繞依序收納,由燒成膜中除去微粒子(A2),故可有效地進行由燒成至微粒子之 除去為止的步驟。 In addition, by storing the fired film (FB) in sequence without winding, and removing the fine particles (A2) from the fired film, the firing to the fine particles can be efficiently performed. Steps to remove.

又,將由基材(搬送基材S)剝離的未燒成膜(FA)進行捲繞形成捲筒體(R),故可在單元間容易搬送。 In addition, since the unfired film (FA) peeled from the substrate (transport substrate S) is wound to form a roll (R), it can be easily transported between units.

此外,捲筒體為由基材(搬送基材S)剝離之帶狀之未燒成膜(FA)的捲筒體(R)時,由捲筒體依序拉出未燒成膜,進行燒成,故可有效率形成燒成膜FB。 In addition, when the roll body is a roll-shaped unfired film (FA) stripped from the base material (conveying base material S), the unfired film is sequentially pulled out from the roll body to perform The firing is performed, so that the firing film FB can be formed efficiently.

又,液體使用至少微粒子(A2)之含有率互為不同之第1液體(第1塗佈液Q1)及第2液體(第2塗佈液Q2),將第1液體及第2液體塗佈於基材(搬送基材S),形成至少微粒子(A2)之含有率不同,經層合的未燒成膜(FA),故作為分隔膜使用時,離子順利移動,同時可製造能確保作為膜的強度之多孔性之醯亞胺系樹脂膜(多孔性樹脂膜F)。 As the liquid, at least the first liquid (the first coating liquid Q1) and the second liquid (the second coating liquid Q2) having different contents of the fine particles (A2) were used, and the first liquid and the second liquid were applied. On the substrate (conveying substrate S), at least fine particles (A2) are formed, and the laminated unfired film (FA) is formed. Therefore, when used as a separation film, ions move smoothly and can be manufactured to ensure the The strength of the film is a porous imine resin film (porous resin film F).

[變形例] [Modification]

上述實施形態係舉在塗佈單元10與燒成單元20之間配置有捲繞部40的構成為例來說明,但是不限於此。圖7表示變形例之製造系統SYS2之一部份之例的圖。 The above embodiment is described by taking the configuration in which the winding unit 40 is arranged between the coating unit 10 and the firing unit 20 as an example, but it is not limited thereto. FIG. 7 is a diagram showing an example of a part of a manufacturing system SYS2 according to a modification.

例如圖7所示,可為未設置捲繞部40,由塗 佈單元10搬出之未燒成膜FA被搬入燒成單元20的構成。此時,燒成單元20係將由塗佈單元10被搬出,經由中繼滾輪70而搬送的未燒成膜FA,依序收納進行燒成,形成燒成膜FB。 For example, as shown in FIG. The unfired film FA carried out from the cloth unit 10 is configured to be carried into the firing unit 20. At this time, the firing unit 20 is an unfired film FA which is carried out by the coating unit 10 and conveyed via the relay roller 70, and is sequentially stored and fired to form a fired film FB.

如上述,燒成單元(20)係將由基材(搬送基材 S)剝離之未燒成膜(FA),未捲繞依序收納進行燒成,故可 連續進行由未燒成膜FA之形成至燒成膜FB之形成為止。 As described above, the firing unit (20) S) The peeled unfired film (FA) is unrolled and stored in sequence for firing, so The formation from the unfired film FA to the firing film FB is continuously performed.

又,上述實施形態係舉設置於塗佈單元10之 內部的剝離部15中,將未燒成膜FA由搬送基材S剝離之構成為例來說明,但是不限於此。例如,塗佈單元10中,未燒成膜FA與搬送基材S未剝離,一體捲繞,在塗佈單元10之外部,浸漬於液體中,同時可將未燒成膜FA由搬送基材S剝離。圖8表示變形例之製造系統SYS3之一部份之例的圖。 In addition, the above-mentioned embodiment is provided in the coating unit 10 Although the internal peeling part 15 has demonstrated the structure which peeled the unfired film FA from the conveyance base material S as an example, it is not limited to this. For example, in the coating unit 10, the unfired film FA and the conveyance substrate S are not peeled off, and they are wound integrally. They are immersed in a liquid outside the coating unit 10, and the unfired film FA can be transferred from the conveyance substrate at the same time. S peeled. FIG. 8 is a diagram showing an example of a part of a manufacturing system SYS3 according to a modification.

例如圖8所示,塗佈單元10係具有未燒成膜 FA與搬送基材S未剝離,一體捲繞的捲繞部73。捲繞部73具有軸承16及軸構件SF2。軸承16配置於支撐滾輪11d之-Z側。軸構件SF2係對於軸承16,設置成可拆裝。軸構件SF2安裝於軸承16時,可繞著與X方向平行之軸線可旋轉來支撐。塗佈單元10設置可使安裝於軸承16之軸構件SF2旋轉之無圖示的驅動機構。藉由此驅動機構使軸構件SF2旋轉,未燒成膜FA與搬送基材S一體捲繞,形成捲筒體RS。 For example, as shown in FIG. 8, the coating unit 10 has an unfired film. The FA and the transfer substrate S are not peeled, and the winding portion 73 is integrally wound. The winding portion 73 includes a bearing 16 and a shaft member SF2. The bearing 16 is arranged on the -Z side of the support roller 11d. The shaft member SF2 is detachable from the bearing 16. When the shaft member SF2 is mounted on the bearing 16, it can be rotatably supported around an axis parallel to the X direction. The coating unit 10 is provided with a driving mechanism (not shown) capable of rotating the shaft member SF2 mounted on the bearing 16. By this drive mechanism, the shaft member SF2 is rotated, and the unfired film FA and the conveyance base material S are integrally wound, and the roll body RS is formed.

塗佈單元10之外部設置軸承71。此軸承71 之-Z側設置浸漬部72。浸漬部72具有容器72a、被收容於此容器72a之液體72b及浸漬於此液體72b的滾輪72c。液體72b例如有水等。 A bearing 71 is provided outside the coating unit 10. This bearing 71 A dipping portion 72 is provided on the -Z side. The immersion section 72 includes a container 72a, a liquid 72b stored in the container 72a, and a roller 72c immersed in the liquid 72b. The liquid 72b is, for example, water.

藉由軸構件SF2,未燒成膜FA及搬送基材S 被一體捲繞,形成捲筒體RS時,首先,將軸構件SF2由 軸承16取下。此外,將軸構件SF2裝設於被設置於塗佈單元10之外部的軸承71。 By the shaft member SF2, the unfired film FA and the transport substrate S When it is wound up integrally to form the roll body RS, first, the shaft member SF2 is formed by The bearing 16 is removed. The shaft member SF2 is mounted on a bearing 71 provided outside the coating unit 10.

於軸承71裝設軸構件SF2後,由捲筒體RS 拉出未燒成膜FA與搬送基材S,浸漬於液體72b中。例如將未燒成膜FA與搬送基材S之層合體設置於滾輪72c之下側。此時,將由捲筒體RS拉出之未燒成膜FA與搬送基材S依序浸漬於液體72b中。例如作業者係在未燒成膜FA及搬送基材S被浸漬於液體72b的狀態下,將未燒成膜FA由搬送基材S剝離。 After the shaft member SF2 is installed in the bearing 71, the roll body RS The unfired film FA and the transport substrate S are pulled out, and immersed in the liquid 72b. For example, a laminate of the unfired film FA and the transport substrate S is provided below the roller 72c. At this time, the unfired film FA drawn out from the roll RS and the transport substrate S are sequentially immersed in the liquid 72b. For example, the operator peels the unfired film FA from the transport substrate S in a state where the unfired film FA and the transport substrate S are immersed in the liquid 72b.

如此,具備將含有基材(搬送基材S)之未燒成 膜(FA)捲繞,形成捲筒體(RS)的捲繞部(73),故可在單元間容易搬送。又,捲筒體為含有基材(搬送基材S)之帶狀之未燒成膜(FA)的捲筒體(RS)時,具備由捲筒體拉出基材,浸漬於特定液體(液體72b)中,由此基材剝離未燒成膜之浸漬部(72),故可安定剝離。 In this manner, it is possible to provide unfired materials including a substrate (conveying substrate S). The film (FA) is wound to form a winding portion (73) of the roll body (RS), so that it can be easily transported between units. In addition, when the roll body is a roll body (RS) of a strip-shaped unfired film (FA) containing a base material (conveying base material S), the roll body is provided with the base material being pulled out from the roll body and immersed in a specific liquid ( In the liquid 72b), the unfired immersion part (72) is peeled off from the base material, so that the substrate can be peeled off stably.

又,將未燒成膜FA浸漬於液體72b的態樣, 不限於將未燒成膜FA由搬送基材S剝離的情形。例如可將由搬送基材S剝離之未燒成膜FA浸漬於水等之液體中。圖9表示變形例之製造系統SYS4之一部份之例的圖。 In the state where the unfired film FA is immersed in the liquid 72b, It is not limited to the case where the unfired film FA is peeled from the conveyance base material S. For example, the unfired film FA peeled from the transport substrate S can be immersed in a liquid such as water. FIG. 9 is a diagram showing an example of a part of a manufacturing system SYS4 according to a modification.

如圖9所示,塗佈單元10之+Y側設置第2 浸漬部74。第2浸漬部74具有容器74a、被收容於此容器74a之液體74b、及浸漬於此液體74b之滾輪74c。由塗佈單元10搬出之未燒成膜FA,經由滾輪74c浸漬於液 體74b中。此時,可將未燒成膜FA,例如以10秒~5分鐘、較佳為30秒~40秒左右浸漬於液體74b中。藉此,將未燒成膜FA燒成時,可抑制皺紋形成。 As shown in FIG. 9, the + Y side of the coating unit 10 is provided with a second Visitors 74. The second immersion section 74 includes a container 74a, a liquid 74b stored in the container 74a, and a roller 74c immersed in the liquid 74b. The unfired film FA carried out from the coating unit 10 is immersed in the liquid through the roller 74c. Body 74b. At this time, the unfired film FA may be immersed in the liquid 74b for, for example, about 10 seconds to 5 minutes, preferably about 30 seconds to 40 seconds. This makes it possible to suppress the formation of wrinkles when the unfired film FA is fired.

將由搬送基材S剝離之未燒成膜FA浸漬於水 等之液體時,浸漬後,可藉由捲繞部40捲繞未燒成膜FA,或浸漬後,也可不經由捲繞部40。 The unfired film FA peeled from the transport substrate S is immersed in water In the case of a liquid such as this, the unfired film FA may be wound by the winding portion 40 after immersion, or may not pass through the winding portion 40 after immersion.

又,也可具有將由搬送基材S剝離之未燒成膜FA浸漬於水等之液體後,強制該未燒成膜FA的步驟。強制的手段,可列舉壓製該未燒成膜FA的步驟。藉此,將未燒成膜FA進行乾燥或燒成時,可抑制形成皺紋。 Moreover, you may have the process of forcibly immersing the unfired film FA peeled from the conveyance base material S with liquid, such as water, and forcing it. The compulsory means includes a step of pressing the unfired film FA. Accordingly, when the unfired film FA is dried or fired, the formation of wrinkles can be suppressed.

未燒成膜FA之浸漬後,未經由捲繞部40 時,將經由中繼滾輪搬送的未燒成膜FA依序收納進行燒成,形成燒成膜FB。藉此,燒成單元(20)係將由基材(搬送基材S)剝離之未燒成膜(FA)未捲繞,依序收納進行燒成,故可連續進行由未燒成膜FA之形成至燒成膜FB之形成。前述被搬送之未燒成膜FA被收納進入燒成單元之前,可設置將浸漬時所附著之液體進行乾燥或吸水的步驟。 After impregnation of unfired film FA, the winding section 40 At this time, the unfired film FA conveyed via the relay roller is sequentially stored and fired to form a fired film FB. This allows the firing unit (20) to unwind the unfired film (FA) peeled from the substrate (conveying substrate S), and sequentially store and fire it. Therefore, continuous firing of the unfired film FA can be performed. Formation to the formation of the fired film FB. Before the transferred unfired film FA is stored in the firing unit, a step of drying or absorbing the liquid adhered during the immersion may be provided.

又,除上述實施形態之構成外,也可設置對 於以除去單元30形成之多孔性樹脂膜F,進行後處理之後處理單元。圖10表示變形例之製造系統SYS5之一例的圖。 In addition to the configuration of the above embodiment, a countermeasure may be provided. The porous resin film F formed by the removal unit 30 is subjected to a post-treatment and then the unit is processed. FIG. 10 is a diagram showing an example of a manufacturing system SYS5 according to a modification.

如圖10所示,在除去單元30與捲繞部60之 間配置後處理單元80。此後處理單元80,例如可使用對 於多孔性樹脂膜F,進行除靜電處理之靜電防止單元81。 靜電防止單元81搭載例如静電除去器等之除電裝置。 As shown in FIG. 10, between the removal unit 30 and the winding section 60, 间 Configure a post-processing unit 80. Thereafter, the processing unit 80 may use, for example, In the porous resin film F, an antistatic unit 81 is subjected to antistatic treatment. The static electricity prevention unit 81 is equipped with a static elimination device such as a static eliminator.

如此,具備對於除去微粒子(A2)後之燒成膜 (多孔性樹脂膜F),進行靜電防止處理之靜電防止單元(81),故可由微粒子除去後之多孔性樹脂膜F中除去靜電。 In this way, it is possible to provide a fired film for removing fine particles (A2). (Porous resin film F) is an antistatic unit (81) that performs an antistatic treatment. Therefore, static electricity can be removed from the porous resin film F after fine particles have been removed.

又,後處理單元80例如可使用除去多孔性樹 脂膜F之一部份之蝕刻單元82。圖11(a)概略表示蝕刻單元82之一例的圖。如圖11(a)所示,蝕刻單元82具有收容有處理液82b的收容部82a。處理液82b例如可使用鹼溶液等。將多孔性樹脂膜F以特定時間浸漬於處理液82b,如圖11(b)所示,可除去多孔部A4之內部。此時,可除去多孔部A4之毛邊,同時確保連通性。 The post-processing unit 80 can be used for removing porous trees, for example. An etching unit 82 of a part of the lipid film F. FIG. 11 (a) is a diagram schematically showing an example of the etching unit 82. As shown in FIG. 11 (a), the etching unit 82 includes a storage portion 82a that stores a processing liquid 82b. As the treatment liquid 82b, for example, an alkali solution or the like can be used. The porous resin film F is immersed in the treatment liquid 82b for a predetermined time, and as shown in FIG. 11 (b), the inside of the porous portion A4 can be removed. At this time, the burrs of the porous portion A4 can be removed while ensuring connectivity.

後處理單元80為使用蝕刻單元82時,藉由 蝕刻單元82之後處理之後,可再進行多孔性樹脂膜F之乾燥步驟或後烘烤處理步驟。乾燥步驟或後烘烤處理步驟之溫度可配合多孔性樹脂膜F之樹脂之種類,適宜設定,例如100~300℃。 When the post-processing unit 80 uses the etching unit 82, After the etching unit 82 is processed, the porous resin film F may be dried or post-baked. The temperature of the drying step or the post-baking treatment step can be set according to the type of the resin of the porous resin film F, and is suitably set, for example, 100 to 300 ° C.

後處理單元80使用蝕刻單元82時,前述除 去單元30中之乾燥部34中,進行液體排除,可不進行乾燥或加熱,而將多孔性樹脂膜F搬送至蝕刻單元82中。 此時,乾燥部34中之液體排除時,除去附著於洗凈後之多孔性樹脂膜F的液體。乾燥部34設置吸水滾輪等為佳,藉由將吸水滾輪與多孔性樹脂膜F接觸,搬送多孔性 樹脂膜F,同時可吸收多孔性樹脂膜F所附著的液體。 When the post-processing unit 80 uses the etching unit 82, In the drying unit 34 in the removing unit 30, the liquid is removed, and the porous resin film F can be transferred to the etching unit 82 without drying or heating. At this time, when the liquid in the drying section 34 is removed, the liquid adhered to the washed porous resin film F is removed. The drying section 34 is preferably provided with a water-absorbing roller or the like. The porous portion is conveyed by bringing the water-absorbing roller into contact with the porous resin film F. The resin film F can absorb the liquid to which the porous resin film F is attached.

如此,因含有將微粒子(A2)已被除去之燒成膜(多孔性樹脂膜F)之一部份除去的蝕刻單元(82),故多孔性樹脂膜F所含有之多孔部A4之內面將變得平滑,且可確保連通性。 In this way, since the etching unit (82) which partially removes a part of the fired film (porous resin film F) from which the fine particles (A2) have been removed, the inner surface of the porous portion A4 contained in the porous resin film F is included. Will become smooth and ensure connectivity.

又,上述實施形態中,以捲繞部40、60為使軸構件SF拆裝於軸承41、61的構成為例來說明,但是不限於此,例如可使用圖12所示之捲繞裝置90。以下,以使用捲繞裝置90取代捲繞部40的情形為例來說明。 In the above embodiment, the winding portions 40 and 60 are described as examples of the structure in which the shaft member SF is detached from the bearings 41 and 61, but the invention is not limited to this. For example, the winding device 90 shown in FIG. . Hereinafter, a case where the winding device 90 is used instead of the winding portion 40 will be described as an example.

如圖12所示,捲繞裝置90具有框體91、軸構件SF、軸承92、驅動部93、中繼滾輪94a~94e及滾輪支撐部95。框體91係支撐軸構件SF、軸承92、驅動部93、中繼滾輪94a~94e、滾輪支撐部95之各部。 As shown in FIG. 12, the winding device 90 includes a frame body 91, a shaft member SF, a bearing 92, a driving portion 93, relay rollers 94 a to 94 e, and a roller support portion 95. The frame body 91 supports each of the shaft member SF, the bearing 92, the driving portion 93, the relay rollers 94a to 94e, and the roller support portion 95.

軸構件SF係將由塗佈單元10搬出之未燒成膜FA進行捲繞形成捲筒體R。軸構件SF係對於軸承92,設定為可拆裝。軸構件SF安裝於軸承92時,可繞著與X方向平行之軸線旋轉,被軸承92支撐。形成捲筒體R的狀態下,將軸構件SF由軸承92取下,可將捲筒體R移動至其他的單元或回收。 The shaft member SF is formed by winding an unfired film FA carried out from the coating unit 10 to form a roll body R. The shaft member SF is detachable from the bearing 92. When the shaft member SF is attached to the bearing 92, it can rotate around an axis parallel to the X direction and is supported by the bearing 92. In a state where the roll body R is formed, the shaft member SF is removed from the bearing 92, and the roll body R can be moved to another unit or recovered.

中繼滾輪94a~94e係調整未燒成膜FA之張力,將未燒成膜FA送至軸構件SF。中繼滾輪94a~94e例如形成圓筒狀,各自與X方向平行配置。本實施形態中,未燒成膜FA係以中繼滾輪94a、94b、94c、94d、94e之順序跨越,但是不限於此,也可不使用一部份的中繼滾 輪。又,中繼滾輪94a~94e之中,至少1個可為藉由滾輪支撐部95而移動。例如,滾輪支撐部95可使中繼滾輪94b移動至Z方向或Y方向。又,也可為藉由滾輪支撐部95,使中繼滾輪94b繞著與X軸平行之軸線AX回轉的構成。此時,使中繼滾輪94b移動(回轉)的量(距離)以回饋(feed back)軸承92之捲繞速度,可使未燒成膜FA之張力保持一定。又,也可為在中繼滾輪94b之-Y側,使經由支點軸配置的可移動的重疊(無圖示)移動,變更對中繼滾輪94b之負荷的構成。此時,藉由前述重疊調整施加於中繼滾輪94b之負荷,可調整未燒成膜FA之張力。 The relay rollers 94a to 94e adjust the tension of the unfired film FA and send the unfired film FA to the shaft member SF. The relay rollers 94a to 94e are formed in a cylindrical shape, for example, and are arranged in parallel to the X direction. In this embodiment, the unfired film FA passes in the order of the relay rollers 94a, 94b, 94c, 94d, and 94e, but it is not limited to this, and a part of the relay rollers may not be used wheel. In addition, at least one of the relay rollers 94 a to 94 e can be moved by the roller support portion 95. For example, the roller support portion 95 can move the relay roller 94b to the Z direction or the Y direction. A configuration may also be adopted in which the relay roller 94b is rotated around an axis AX parallel to the X axis by the roller support portion 95. At this time, the amount (distance) of moving (revolving) the relay roller 94b to feed the winding speed of the bearing 92 can keep the tension of the unfired film FA constant. Further, a configuration in which a movable overlap (not shown) arranged via a fulcrum axis is moved on the -Y side of the relay roller 94b, and the load on the relay roller 94b may be changed. At this time, the tension applied to the unfired film FA can be adjusted by the aforementioned overlapping adjustment of the load applied to the relay roller 94b.

中繼滾輪94a~94e不限於與X方向平行之配置,也可為對於X方向傾斜配置。又,中繼滾輪94a~94e不限於圓筒形,也可使用形成有錐型、輻射型、凹型等之冠部(crown)者。 The relay rollers 94a to 94e are not limited to the arrangement parallel to the X direction, but may be arranged obliquely to the X direction. Further, the relay rollers 94a to 94e are not limited to a cylindrical shape, and crowns having a tapered shape, a radial shape, a concave shape, or the like may be used.

又,上述捲繞裝置90也可取代捲繞部60來使用。又,藉由使未燒成膜FA等之膜與捲繞時相反方向,使軸構件SF旋轉,可將未燒成膜FA等之膜送出。因此,例如也可使用捲繞裝置90取代上述送出部50。 The winding device 90 may be used instead of the winding portion 60. In addition, the film of the unfired film FA or the like can be rotated by rotating the shaft member SF in the opposite direction to that at the time of winding, so that the film of the unfired film FA or the like can be sent out. Therefore, for example, the winding unit 90 may be used in place of the above-mentioned delivery unit 50.

[分隔膜] [Separator]

其次,說明實施形態之分隔膜100。圖13表示鋰離子電池200之一例的模式圖,一部份被切開的狀態。如圖13所示,鋰離子電池200具有兼正極端子之金屬殼201及負極端子202。金屬殼201之內部設置正極201a、負極 202a及分隔膜100,浸漬於無圖示之電解液中。分隔膜100係配置於正極201a與負極202a之間,防止正極201a與負極202a之間之電接觸。正極201a可使用鋰過渡金屬氧化物,負極202a可使用例如鋰或碳(石墨)等。 Next, the separation film 100 according to the embodiment will be described. FIG. 13 is a schematic diagram showing an example of the lithium-ion battery 200, and a part of the lithium-ion battery 200 is cut away. As shown in FIG. 13, the lithium-ion battery 200 includes a metal case 201 and a negative terminal 202 that also serve as a positive terminal. Inside the metal case 201 are provided a positive electrode 201a and a negative electrode 202a and the separator 100 are immersed in an electrolytic solution (not shown). The separator 100 is disposed between the positive electrode 201a and the negative electrode 202a, and prevents electrical contact between the positive electrode 201a and the negative electrode 202a. As the positive electrode 201a, a lithium transition metal oxide can be used, and as the negative electrode 202a, lithium, carbon (graphite), or the like can be used.

上述實施形態所記載的多孔性樹脂膜F係作 為此鋰離子電池200之分隔膜100使用。此時,例如將形成有第1塗佈膜F1之面作為鋰離子電池之負極202a側,可提高電池性能。又,圖13係以角型之鋰離子電池200之分隔膜100為例來說明,但是不限於此。上述多孔性樹脂膜F也可使用圓筒型或層合型等之任何形態之鋰離子電池的分隔膜。又,除鋰離子電池之分隔膜外,上述多孔性樹脂膜F可作為燃料電池電解質膜、氣體或液體之分離用膜、低介電率材料使用。 The porous resin film F described in the above embodiment is made of For this purpose, the separator 100 of the lithium ion battery 200 is used. In this case, for example, using the surface on which the first coating film F1 is formed as the negative electrode 202a side of the lithium ion battery can improve battery performance. 13 illustrates the separation film 100 of the angular lithium ion battery 200 as an example, but it is not limited thereto. The porous resin film F may be a separator of a lithium ion battery in any form such as a cylindrical type or a laminated type. In addition to the separator film of a lithium ion battery, the porous resin film F can be used as a fuel cell electrolyte film, a gas or liquid separation film, or a low-dielectric-constant material.

以上針對實施形態說明,但是本發明不限於 上述說明,在不脫離本發明之技術特徵的範圍內,可為各種變更。 The embodiment has been described above, but the present invention is not limited to this. The above description can be modified in various ways without departing from the technical characteristics of the present invention.

例如上述實施形態及變形例係以使用微粒子之含有率不同之2種類的塗佈液,形成未燒成膜FA的情形為例來說明,但是不限於此等,也可為以1種類的塗佈液形成未燒成膜者。此時,也可不使用第1噴嘴12及第2噴嘴13之中任一者,也可省略其中一方的噴嘴。省略其中一方的噴嘴時,較佳為省略第1噴嘴12,而使用第2噴嘴13。 For example, the above-mentioned embodiment and modified example are described using the case where two types of coating liquids having different contents of fine particles are used to form an unfired film FA. However, the invention is not limited to this, and may be a type of coating. The cloth liquid forms unfired film. In this case, either the first nozzle 12 or the second nozzle 13 may not be used, and one of the nozzles may be omitted. When one of the nozzles is omitted, the first nozzle 12 is preferably omitted and the second nozzle 13 is used.

又,上述實施形態及變形例係以燒成單元20 形成燒成膜FB後,未捲繞燒成膜FB,而搬入除去單元 30之構成為例來說明,但是不限於此,也可捲繞燒成膜FB。此時,也可使用上述變形例說明的捲繞裝置90。 It should be noted that the above embodiments and modifications are based on the firing unit 20 After the fired film FB is formed, the fired film FB is not wound, but is moved into a removal unit The structure of 30 is described as an example, but it is not limited to this, and the fired film FB may be wound. In this case, the winding device 90 described in the above modification may be used.

又,上述實施形態及變形例係以塗佈單元 10、燒成單元20、及除去單元30各配置1台之構成為例來說明,但是不限於此者。例如上述單元之至少1個可設置複數台。此時,例如藉由將單位時間內可處理之未燒成膜FA、燒成膜FB或多孔性樹脂膜F之分量(例長度、等)較少的單元配置較多,可提高製造系統SYS全體之製造效率。 It should be noted that the above-mentioned embodiment and modified examples are based on a coating unit. 10. The configuration in which each of the firing unit 20 and the removing unit 30 is arranged is described as an example, but it is not limited to this. For example, at least one of the above units may be provided with a plurality of units. At this time, for example, by increasing the number of units (e.g., length, etc.) of unfired film FA, fired film FB, or porous resin film F that can be processed per unit time, the manufacturing system SYS can be improved. Overall manufacturing efficiency.

此外,上述實施形態及變形例係以塗佈單元 10、燒成單元20、除去單元30、及後處理單元80(靜電防止單元81、蝕刻單元82)之各單元沿著Y方向搬送未燒成膜FA、燒成膜FB或多孔性樹脂膜F之各膜的情形為例來說明,但是不限於此者。例如任一的單元將膜可搬送至X方向、Y方向、Z方向或此等之合成方向,或可在1個單元內適宜變更搬送方向。 In addition, the above-mentioned embodiment and modification are described with the coating unit. 10. Each unit of the firing unit 20, the removing unit 30, and the post-processing unit 80 (the antistatic unit 81, the etching unit 82) transports the unfired film FA, the fired film FB, or the porous resin film F along the Y direction. The case of each film is described as an example, but it is not limited to this. For example, the film can be transported to the X direction, the Y direction, the Z direction, or a composite direction thereof in any unit, or the transport direction can be appropriately changed in one unit.

又,上述實施形態及變形例係以進行塗佈單 元10中之塗佈、燒成單元20中之燒成、除去單元30中之除去之3個步驟的情形為例來說明,但是不限於此者。 例如塗佈膜之材料使用聚醯亞胺、聚醯胺醯亞胺、或聚醯胺時,可不進行燒成。因此,未進行燒成時,例如藉由在燒成單元20與除去單元30之間設置捲繞裝置及送出裝置等,可將以塗佈單元10形成的未燒成膜FA,不經由燒成單元20而搬入除去單元30中。又,未進行燒成時,製造 多孔性之醯亞胺系樹脂膜之製造系統可為包含:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子之液體塗佈於基材,形成未燒成膜的塗佈單元;前述塗佈單元內或前述塗佈單元外,由前述基材剝離後之前述未燒成膜中除去前述微粒子的除去單元的製造系統。未進行燒成時,由除去微粒子之除去單元30中搬出多孔性樹脂膜F後,可進行前述之後烘烤處理步驟。後烘烤處理步驟前,可經由後處理單元80及/或蝕刻單元82。 In addition, the above-mentioned embodiments and modifications are performed by coating The case of the three steps of applying, firing in the element 10, and removing in the removing unit 30 is described as an example, but it is not limited to this. For example, when polyimide, polyimide, or polyimide is used as the material of the coating film, firing may not be performed. Therefore, when firing is not performed, for example, by providing a winding device and a feeding device between the firing unit 20 and the removing unit 30, the unfired film FA formed by the coating unit 10 can be passed through without firing. The unit 20 is carried into a removal unit 30. When firing is not performed, manufacturing The production system of a porous fluorene-based imide resin film may include: coating a substrate with a liquid containing polyamic acid, polyfluorene, polyfluorene, imine, or polyamine and fine particles to form a non-fluorine A coating unit for a fired film; a manufacturing system for a removal unit for removing the fine particles in the unfired film after the substrate is peeled from the substrate, or outside the coating unit. When the firing is not performed, the porous resin film F is removed from the fine particle removing unit 30, and then the aforementioned post-baking treatment step may be performed. Before the post-baking process step, the post-processing unit 80 and / or the etching unit 82 may be used.

又,上述實施形態及變形例係以藉由所謂的 捲對捲方式,形成多孔性樹脂膜F的構成為例來說明,但是不限於此者。例如除去單元30中之處理終了後,多孔性樹脂膜F由除去單元30搬出時,未以捲繞部60捲繞,而以特定的長度切斷,也可將切斷者回收。 It should be noted that the above-mentioned embodiments and modification examples are so-called In the roll-to-roll method, the configuration for forming the porous resin film F is described as an example, but it is not limited to this. For example, after the processing in the removal unit 30 is completed, when the porous resin film F is carried out from the removal unit 30, the porous resin film F is not wound by the winding portion 60, but is cut by a specific length, and the cut person may be recovered.

Claims (21)

一種多孔性之醯亞胺系樹脂膜製造系統,其係製造多孔性之醯亞胺系樹脂膜之製造系統,其係含有:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子的液體塗佈於搬送基材,形成未燒成膜的塗佈單元,在前述塗佈單元內或前述塗佈單元外,由前述搬送基材剝離後的前述未燒成膜進行燒成,形成含有前述微粒子之燒成膜的燒成單元及由前述燒成膜中除去前述微粒子的除去單元。 A porous fluorene imine-based resin film manufacturing system is a system for manufacturing a porous fluorene-imide resin film, which contains: polyimide, polyimide, and polyimide A liquid of amine, polyamine, and fine particles is applied to a conveying substrate to form an unfired coating unit. The unfired material is peeled from the conveying substrate in the coating unit or outside the coating unit. The film is fired to form a firing unit including a fired film containing the fine particles and a removing unit for removing the fine particles from the fired film. 如請求項1之多孔性之醯亞胺系樹脂膜製造系統,其中前述塗佈單元係於前述基材上形成帶狀之前述未燒成膜。 The porous imine-based resin film manufacturing system according to claim 1, wherein the coating unit is a strip-shaped unfired film formed on the substrate. 如請求項1或2之多孔性之醯亞胺系樹脂膜製造系統,其中前述除去單元係將藉由前述燒成單元所燒成之前述燒成膜未予以捲繞,而依序收納,除去前述微粒子。 For example, the porous fluorene-imide-based resin film manufacturing system according to claim 1 or 2, wherein the removal unit is to sequentially store and remove the fired film fired by the fired unit without winding it. The aforementioned fine particles. 如請求項1或2之多孔性之醯亞胺系樹脂膜製造系統,其係具備將由前述基材剝離之前述未燒成膜、或含有前述基材之前述未燒成膜予以捲繞,形成捲筒體的捲繞部。 The porous sulfonimide-based resin film manufacturing system according to claim 1 or 2, which is formed by winding the unfired film peeled from the base material or the unfired film containing the base material to form a roll. The winding part of the roll body. 如請求項4之多孔性之醯亞胺系樹脂膜製造系統,其中前述捲筒體為由前述基材剝離之帶狀之未燒成膜的捲筒體時,前述燒成單元係將前述未燒成膜由前述捲筒體依 序拉出進行燒成。 For example, if the porous imine-based resin film manufacturing system of claim 4 is used, the roll body is a strip-shaped unfired roll body peeled from the substrate, and the firing unit is configured to pass the The fired film is formed by the aforementioned roll body. Sequentially pulled out for firing. 如請求項4之多孔性之醯亞胺系樹脂膜製造系統,其中前述捲筒體為含有前述基材之帶狀之未燒成膜的捲筒體時,具備將前述基材由前述捲筒體拉出,浸漬於特定液體中,將前述未燒成膜由此基材剝離的浸漬部。 The porous imine-based resin film manufacturing system according to claim 4, wherein when the roll body is a roll-shaped unfired roll body containing the base material, the method includes the step of removing the base material from the roll. The body is pulled out, immersed in a specific liquid, and the impregnated portion of the base material is peeled off from the unfired film. 如請求項1或2之多孔性之醯亞胺系樹脂膜製造系統,其中前述燒成單元係將由前述基材剝離之未燒成膜未予以捲繞,而依序收納進行燒成。 For example, the porous fluorene-imide resin film manufacturing system according to claim 1 or 2, wherein the firing unit is an unfired film peeled from the base material without being wound, and is sequentially stored for firing. 如請求項1或2之多孔性之醯亞胺系樹脂膜製造系統,其係含有對於已除去前述微粒子之前述燒成膜,進行靜電防止處理之靜電防止單元。 The porous imidene resin film manufacturing system according to claim 1 or 2, further comprising an antistatic unit that performs antistatic treatment on the fired film from which the fine particles have been removed. 如請求項1或2之多孔性之醯亞胺系樹脂膜製造系統,其係含有將已除去前述微粒子之前述燒成膜之一部分予以除去的蝕刻單元。 The porous fluorene-imide-based resin film manufacturing system according to claim 1 or 2, further comprising an etching unit for removing a part of the fired film from which the fine particles have been removed. 如請求項1或2之多孔性之醯亞胺系樹脂膜製造系統,其中前述液體使用至少微粒子之含有率彼此不同之第1液體及第2液體,前述塗佈單元係藉由將前述第1液體及前述第2液體塗佈於前述基材,形成至少微粒子之含有率不同經層合的前述未燒成膜。 For example, the porous imidene resin film manufacturing system according to claim 1 or 2, wherein the liquid is a first liquid and a second liquid whose content ratios of at least fine particles are different from each other, and the coating unit is configured by applying the first The liquid and the second liquid are applied to the base material to form the unfired film laminated with at least fine particles having different content rates. 一種分隔膜,其係藉由多孔性聚醯亞胺膜而形成的分隔膜,前述多孔性聚醯亞胺膜係藉由如請求項1~10中任一項之多孔性之醯亞胺系樹脂膜製造系統所生成。 A separator film is a separator film formed by a porous polyimide film, and the porous polyimide film is made of a porous imine system according to any one of claims 1 to 10. Produced by a resin film manufacturing system. 一種多孔性之醯亞胺系樹脂膜製造方法,其係製造多孔性之醯亞胺系樹脂膜的方法,其係含有:將含有聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺或聚醯胺及微粒子的液體塗佈於搬送基材後,由前述搬送基材剝離形成未燒成膜,將前述未燒成膜進行燒成,形成含有前述微粒子之燒成膜,及由前述燒成膜中除去前述微粒子。 A method for producing a porous fluorene imine-based resin film, which is a method for producing a porous fluorene-imide resin film, comprising: containing polyamic acid, a polyimide, and a polyimide After the liquid of polyamine and fine particles is applied to the conveying substrate, the unfired film is peeled off from the conveying substrate, and the unfired film is fired to form a fired film containing the fine particles, and The fine particles are removed from the fired film. 如請求項12之多孔性之醯亞胺系樹脂膜製造方法,其中前述未燒成膜係形成帶狀。 The method for producing a porous fluorene imine-based resin film according to claim 12, wherein the unfired film system is formed into a band shape. 如請求項12或13之多孔性之醯亞胺系樹脂膜製造方法,其係將前述燒成膜未予以捲繞,而依序收納,由前述燒成膜中除去前述微粒子。 According to claim 12 or 13, the method for producing a porous sulfonyl imide-based resin film is a method in which the fired film is not wound, but is sequentially stored, and the fine particles are removed from the fired film. 如請求項12或13之多孔性之醯亞胺系樹脂膜製造方法,其係將由前述基材剝離之前述未燒成膜、或含有前述基材之前述未燒成膜予以捲繞形成捲筒體。 The method for producing a porous imine-based resin film according to claim 12 or 13, comprising winding the unfired film peeled from the substrate or the unfired film containing the substrate to form a roll. body. 如請求項15之多孔性之醯亞胺系樹脂膜製造方法,其中前述捲筒體為由前述基材剝離之帶狀之未燒成膜之捲筒體時,由前述捲筒體依序拉出前述未燒成膜進行燒成。 For example, the method for producing a porous imine-based resin film according to claim 15, wherein when the roll is a strip-shaped unfired roll that is peeled from the substrate, the roll is sequentially pulled by the roll. The aforementioned unfired film was fired. 如請求項15之多孔性之醯亞胺系樹脂膜製造方法,其中前述捲筒體為含有前述基材之帶狀之未燒成膜之捲筒體時,將前述基材由前述捲筒體拉出,浸漬於特定液體中,將前述未燒成膜由此基材剝離。 The method for producing a porous imine-based resin film according to claim 15, wherein when the roll body is a roll-shaped unfired roll body containing the base material, the base material is removed from the roll body. It is pulled out, immersed in a specific liquid, and the said unfired film peels off a base material. 如請求項12或13之多孔性之醯亞胺系樹脂膜製 造方法,其係將由前述基材剝離之前述未燒成膜未予以捲繞,依序收納進行燒成。 Made of porous imine resin film as claimed in item 12 or 13 The manufacturing method is that the unfired film peeled from the substrate is unrolled and sequentially stored for firing. 如請求項12或13之多孔性之醯亞胺系樹脂膜製造方法,其係對於已除去前述微粒子之前述燒成膜,進行靜電防止處理。 The method for producing a porous fluorene-imide-based resin film according to claim 12 or 13, wherein the fired film from which the fine particles have been removed is subjected to an antistatic treatment. 如請求項12或13之多孔性之醯亞胺系樹脂膜製造方法,其係將已除去前述微粒子之前述燒成膜之一部分予以除去。 A method for producing a porous fluorene-imide-based resin film according to claim 12 or 13, which comprises removing a part of the fired film from which the fine particles have been removed. 如請求項12或13之多孔性之醯亞胺系樹脂膜製造方法,其中前述液體使用至少微粒子之含有率彼此不同之第1液體及第2液體,藉由將前述第1液體及前述第2液體塗佈於前述基材,形成至少微粒子之含有率不同經層合的前述未燒成膜。 For example, the method for producing a porous fluorene-imide-based resin film according to claim 12 or 13, wherein the first liquid and the second liquid whose content ratios of at least fine particles are different from each other are obtained by combining the first liquid and the second liquid The liquid is applied to the substrate to form the unfired film laminated with at least fine particles having different contents.
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