TW201542694A - High refractive index film forming composition having alkali soluble development and method for forming pattern - Google Patents

High refractive index film forming composition having alkali soluble development and method for forming pattern Download PDF

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TW201542694A
TW201542694A TW104102692A TW104102692A TW201542694A TW 201542694 A TW201542694 A TW 201542694A TW 104102692 A TW104102692 A TW 104102692A TW 104102692 A TW104102692 A TW 104102692A TW 201542694 A TW201542694 A TW 201542694A
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film
mass
varnish
compound
solvent
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Taku Kato
Makoto Nakajima
Junpei Kobayashi
Masaki Nagai
Masayoshi Suzuki
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Nissan Chemical Ind Ltd
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Priority claimed from JP2014012673A external-priority patent/JP2017052812A/en
Priority claimed from JP2014012676A external-priority patent/JP2017052815A/en
Priority claimed from JP2014012674A external-priority patent/JP2017052813A/en
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    • HELECTRICITY
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract

To provide: a film forming composition which is suitable for the production of a film having high refractive index, high transparency, high heat resistance, high light resistance and high hardness; and a pattern forming method. A film forming composition which contains: a silicon compound (A) that is a hydrolysis-condensation product of a hydrolyzable silane containing a hydrolyzable silane (a1) represented by formula (a1) and a hydrolyzable silane (a2) represented by formula (a2) and has a weight average molecular weight of 700-4,000; inorganic particles (B) having an average particle diameter of 1-100 nm and a refractive index of 1.50-2.70; and a solvent (C). The silicon compound (A) is a polymer that is obtained by hydrolyzing and condensing a hydrolyzable silane which contains the hydrolyzable silane (a1) and the hydrolyzable silane (a2) respectively in an amount of 90-50% by mole and in an amount of 10-50% by mole. Si(R1)4 Formula (a1) L-Si(R2)3 Formula (a2) (In the formulae, each of R1 and R2 represents an alkoxy group having 1-20 carbon atoms, an acyloxy group having 2-20 carbon atoms or a halogen group; and L represents a linear, branched or cyclic alkyl group having 3-6 carbon atoms.).

Description

鹼溶解顯影性之高折射率膜形成組成物及圖型形成方法 Alkali-dissolved and developable high-refractive-index film forming composition and pattern forming method

本發明係有關含有聚矽氧烷及無機微粒子之膜形成組成物及圖型形成方法。 The present invention relates to a film-forming composition containing a polyoxyalkylene oxide and inorganic fine particles and a pattern forming method.

發光二極體(LED)可作為各種顯示器之背光光源、信號機、照明、雷射、生物感測器等使用,在民生用途廣為普及。 Light-emitting diodes (LEDs) can be used as backlight sources, signals, illumination, lasers, biosensors, etc. for various displays, and are widely used in people's livelihood.

LED為了達成更長壽命且低消耗電力,因此提升光取出效率的裝置開發成為主流。此等之潮流中,開發可提升光取出效率用的元件構造及材料。 In order to achieve a longer life and lower power consumption, the LED has become a mainstream device for improving light extraction efficiency. In the trend of these, development of component structures and materials for improving light extraction efficiency has been developed.

為了提升光取出效率,有控制光學的折射率的方法,使封裝材料形成高折射率化的檢討報告。 In order to improve the light extraction efficiency, there is a method of controlling the refractive index of the optical material to form a review report of the high refractive index of the encapsulating material.

例如高折射材料形成用組成物,其係含有:選自由氧化鋯、氧化鈦、氧化鋅、氧化鉭、氧化銦、氧化鉿、氧化錫、氧化鈮及此等之複合體所成群之至少1種金 屬氧化物的微粒子;重量平均分子量為1,000至100,000之範圍之含烷氧基之矽氧烷聚合物(b1);重量平均分子量為500至100,000之含羥基之聚矽氧烷(b2);選自由β-二酮、酮酯、二羧酸及其衍生物、羥基羧酸及其衍生物、酮醇、二羥基化合物、羥醛(oxyaldehyde)化合物、及胺化合物及其衍生物所成群之至少1種螯合化劑(參照專利文獻1)、包含含有烷基、芳基、羥基等之有機聚矽氧烷、縮合觸媒、及無機微粒子的光關聯裝置封裝用樹脂組成物(專利文獻2參照)及將可具有碳原子數1~20之烷基、或碳原子數1~8之烴基之具有苯基的三烷氧基矽烷(A)與具有含有反應性環狀醚基之取代基的三烷氧基矽烷(B)進行共水解、共縮合所得之梯形或無規型結構之倍半矽氧烷衍生物、及無機微粒子為主成分的B階段化光元件用封裝樹脂組成物(參照專利文獻3)。 For example, a composition for forming a high refractive material containing at least one selected from the group consisting of zirconia, titania, zinc oxide, cerium oxide, indium oxide, cerium oxide, tin oxide, cerium oxide, and the like. Gold a fine particle of an oxide; an alkoxy-containing alkane polymer (b1) having a weight average molecular weight of 1,000 to 100,000; a hydroxyl group-containing polyoxyalkylene (b2) having a weight average molecular weight of 500 to 100,000; Free β-diketones, ketoesters, dicarboxylic acids and their derivatives, hydroxycarboxylic acids and their derivatives, keto alcohols, dihydroxy compounds, oxyaldehyde compounds, and amine compounds and their derivatives At least one type of chelating agent (refer to Patent Document 1), and a resin composition for optical-related device encapsulation comprising an organic polysiloxane having an alkyl group, an aryl group, a hydroxyl group, or the like, a condensed catalyst, and inorganic fine particles (Patent Literature) 2) and a trialkoxy decane (A) having a phenyl group having an alkyl group having 1 to 20 carbon atoms or a hydrocarbon group having 1 to 8 carbon atoms and having a reactive cyclic ether group A resin composition for a B-stage optical element having a trapezoidal or random structure of a sesquiterpene oxide derivative obtained by co-hydrolysis or co-condensation, and a main component of the inorganic fine particles (Refer to Patent Document 3).

目的之高折射率材料係要求高透明性、高耐熱性、高耐光性、高硬度,但是滿足此等之要求性能全部之充分滿足的材料,目前為止仍無法得到。 The high-refractive-index material of the present invention requires high transparency, high heat resistance, high light resistance, and high hardness, but materials satisfying all of the required properties have not been available so far.

添加無機粒子時,有時膜硬度會降低。聚矽氧烷之膜硬度高,相反地,未展現高折射率。由此等之背景組合無機粒子與聚矽氧烷,形成高折射率材料的方法乃為公知技術已為人知。 When inorganic particles are added, the film hardness may decrease. The film of polyoxyalkylene has a high hardness and, conversely, does not exhibit a high refractive index. The method of combining inorganic particles with polysiloxanes to form a high refractive index material is well known in the art.

LED用之高折射率膜要求鹼顯影性,且製作 10μm以下之圖型時,對於鹼要求溶解顯影性。因此,對高折射率組成物本身賦予感光性,可得到圖型,但是因含有感光劑等,故作為LED元件之構件,難以滿足長期之耐光性與信賴性。 High refractive index film for LED requires alkali developability and is produced In the case of a pattern of 10 μm or less, the developability is required to be dissolved in the alkali. Therefore, the high refractive index composition itself is provided with photosensitivity, and a pattern can be obtained. However, since it contains a photosensitive agent or the like, it is difficult to satisfy long-term light resistance and reliability as a member of the LED element.

含有聚矽氧烷與無機粒子的高折射率組成物,利用在塗佈之感光性材料進行圖型化之檢討仍未為人知,考慮製作LED之製程,形成10μm以下之圖型化(patterning)之檢討仍未為人知。 The high refractive index composition containing a polysiloxane and an inorganic particle is not known by the patterning of the photosensitive material applied, and the process of manufacturing an LED is considered, and patterning of 10 micrometers or less is formed. The review is still unknown.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2006-316264 [Patent Document 1] Japanese Patent Laid-Open No. 2006-316264

[專利文獻2]日本特開2006-328315 [Patent Document 2] Japanese Patent Laid-Open No. 2006-328315

[專利文獻3]日本特開2008-202008 [Patent Document 3] Japan Special Open 2008-202008

[發明概要] [Summary of the Invention]

本發明有鑑於上述情況而完成者,本發明之目的係提供適合可達成高折射率、高透明性、高耐熱性、高耐光性、高硬度之顯示裝置用膜製作之膜形成組成物及使用此組成物之圖型形成方法、及阻劑膜之剝離時防止膜粗糙的方法。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a film forming composition and a film which are suitable for a film for a display device which can achieve high refractive index, high transparency, high heat resistance, high light resistance, and high hardness. A method of forming a pattern of the composition and a method of preventing film roughness when the resist film is peeled off.

本發明之第1觀點為一種膜形成組成物(1),其係含有:含有式(a1)表示之水解性矽烷(a1)與式(a2)表示之水解性矽烷(a2): (式中,R1及R2各自表示碳原子數1~20之烷氧基、碳原子數2~20之醯氧基、或鹵基,L表示碳原子數3~6之直鏈、分支或環狀之烷基)之水解性矽烷之水解縮合物,且重量平均分子量700至4000之矽化合物(A)、具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)、及溶劑(C)。 A first aspect of the present invention is a film-forming composition (1) comprising: a hydrolyzable decane (a1) represented by the formula (a1) and a hydrolyzable decane (a2) represented by the formula (a2): (wherein R 1 and R 2 each represent an alkoxy group having 1 to 20 carbon atoms, a decyloxy group having 2 to 20 carbon atoms, or a halogen group; and L represents a linear chain or a branch having 3 to 6 carbon atoms; Or a hydrolyzed condensate of a hydrolyzable decane of a cyclic alkyl group), and a ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, an inorganic particle having an average particle diameter of from 1 to 100 nm and a refractive index of from 1.50 to 2.70 (B) ), and solvent (C).

第2觀點為第1觀點之膜形成組成物(1),其中矽化合物(A)係水解性矽烷(a1)與水解性矽烷(a2)之比例為水解性矽烷(a1)含有90莫耳%至50莫耳%,水解性矽烷(a2)含有10莫耳%至50莫耳%之水解性矽烷進行水解縮合的聚合物。 The second aspect is the film-forming composition (1) of the first aspect, wherein the ratio of the hydrazine compound (A) to the hydrolyzable decane (a1) to the hydrolyzable decane (a2) is 90 mol% of the hydrolyzable decane (a1). To 50 mol%, the hydrolyzable decane (a2) contains 10 mol% to 50 mol% of hydrolyzable decane to carry out hydrolysis-condensation of the polymer.

第3觀點為第1觀點之膜形成組成物(1),其中矽化合物(A)為將水解性矽烷在非醇溶劑中進行水解縮合 所得者。 The third aspect is the film formation composition (1) of the first aspect, wherein the ruthenium compound (A) is a hydrolysis condensation of a hydrolyzable decane in a non-alcohol solvent. The winner.

第4觀點為第3觀點之膜形成組成物(1),其中非醇溶劑為酮或醚。 The fourth aspect is the film formation composition (1) of the third aspect, wherein the non-alcohol solvent is a ketone or an ether.

第5觀點為第3觀點之膜形成組成物(1),其中非醇溶劑為丙酮或四氫呋喃。 The fifth aspect is the film formation composition (1) of the third aspect, wherein the non-alcohol solvent is acetone or tetrahydrofuran.

第6觀點為第3觀點之膜形成組成物(1),其中溶劑(C)包含上述水解性矽烷之水解與接著縮合時所用之非醇溶劑與除去水解性矽烷之水解所產生之反應物之溶劑取代用的溶劑者。 The sixth aspect is the film-forming composition (1) of the third aspect, wherein the solvent (C) comprises a reaction of the hydrolysis of the hydrolyzable decane and the reaction of the non-alcohol solvent used in the subsequent condensation and the hydrolysis of the hydrolyzable decane. Solvent replacement solvent.

第7觀點為第1觀點之膜形成組成物(1),其中無機粒子(B)為二氧化鋯。 The seventh aspect is the film formation composition (1) of the first aspect, wherein the inorganic particles (B) are zirconium dioxide.

第8觀點為第3觀點之膜形成組成物(2),其中進一步含有選自銨鹽、膦類、鏻鹽、鋶鹽、或螯合化合物的硬化觸媒(D)。 The eighth aspect is the film-forming composition (2) of the third aspect, further comprising a curing catalyst (D) selected from the group consisting of an ammonium salt, a phosphine, a phosphonium salt, a phosphonium salt, or a chelate compound.

第9觀點為第3觀點之膜形成組成物(3),其中進一步含有選自1,2-二酮及/或1,3-二酮的二酮化合物(E)。 The ninth aspect is the film-forming composition (3) of the third aspect, which further contains a diketone compound (E) selected from the group consisting of 1,2-dione and/or 1,3-diketone.

第10觀點為第9觀點之膜形成組成物(3),其中二酮化合物(E)為含有下述式(3)及/或下述式(4): (式中,W表示碳原子或氧原子)表示之骨架的化合物。 The tenth aspect is the film-forming composition (3) of the ninth aspect, wherein the diketone compound (E) contains the following formula (3) and/or the following formula (4): A compound wherein (wherein W represents a carbon atom or an oxygen atom) is a skeleton.

第11觀點為第9觀點之膜形成組成物(3),其中二酮化合物(E)為丁二酮、丙酮酸甲酯、丙酮酸乙酯、或乙醯基丙酮。 The eleventh aspect is the film-forming composition (3) of the ninth aspect, wherein the diketone compound (E) is butanedione, methyl pyruvate, ethyl pyruvate, or acetaminoacetone.

第12觀點為第8觀點之膜形成組成物(4),其中進一步含有水(F)及酸(G)。 The twelfth aspect is the film formation composition (4) of the eighth aspect, which further contains water (F) and acid (G).

第13觀點為第1觀點之膜形成組成物(1)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠(sol)的步驟,混合矽化合物(A)之清漆與無機粒子(B)之溶膠,得到含有矽化合物(A)、無機粒子(B)及溶劑(C)之膜形成組成物的步驟。 A method for producing a film-forming composition (1) according to the first aspect, which comprises the step of: hydrolyzing decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a solvent (c1) The step of performing hydrolysis to obtain a varnish of the ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, and measuring inorganic particles having an average particle diameter of from 1 to 100 nm and a refractive index of from 1.50 to 2.70 by dynamic light scattering method (B) Dispersing in the dispersion medium (c2) to obtain a sol (sol), mixing the varnish of the cerium compound (A) with the sol of the inorganic particles (B) to obtain a cerium compound (A), inorganic particles (B) and a solvent (C) The film forms a step of forming a composition.

第14觀點為第8觀點之膜形成組成物(2)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟, 混合矽化合物(A)之清漆與無機粒子(B)之溶膠與硬化觸媒(D),得到含有矽化合物(A)、無機粒子(B)、硬化觸媒(D)及溶劑(C)之膜形成組成物的步驟。 A method for producing a film-forming composition (2) according to the eighth aspect, which comprises the step of: hydrolyzing decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) The step of performing hydrolysis to obtain a varnish of the ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, and measuring inorganic particles having an average particle diameter of from 1 to 100 nm and a refractive index of from 1.50 to 2.70 by dynamic light scattering method ( B) a step of dispersing in a dispersing medium (c2) to obtain a sol, The varnish of the cerium compound (A) and the sol of the inorganic particles (B) and the curing catalyst (D) are mixed to obtain a cerium compound (A), inorganic particles (B), a curing catalyst (D), and a solvent (C). The step of forming a composition of the film.

第15觀點為第9觀點之膜形成組成物(3)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟,混合矽化合物(A)之清漆、無機粒子(B)之溶膠及二酮化合物(E),得到含有矽化合物(A)、無機粒子(B)、二酮化合物(E)及溶劑(C)之膜形成組成物的步驟。 The fifteenth aspect is the method for producing the film-forming composition (3) according to the ninth aspect, which comprises the step of: hydrolyzing decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) The step of performing hydrolysis to obtain a varnish of the ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, and measuring inorganic particles having an average particle diameter of from 1 to 100 nm and a refractive index of from 1.50 to 2.70 by dynamic light scattering method ( B) a step of dispersing the dispersing medium (c2) to obtain a sol, mixing the varnish of the cerium compound (A), the sol of the inorganic particles (B), and the diketone compound (E) to obtain a cerium compound (A) and inorganic particles (B) a step of forming a composition of a film of a diketone compound (E) and a solvent (C).

第16觀點為第12觀點之膜形成組成物(4)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟, 混合矽化合物(A)之清漆、無機粒子(B)之溶膠、硬化觸媒(D)、水(F)及酸(G),得到含有矽化合物(A)、無機粒子(B)、硬化觸媒(D)、水(F)、酸(G)及溶劑(C)之膜形成組成物的步驟。 The method for producing a film-forming composition (4) according to the twelfth aspect, which comprises the step of: hydrolyzing decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) The step of performing hydrolysis to obtain a varnish of the ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, and measuring inorganic particles having an average particle diameter of from 1 to 100 nm and a refractive index of from 1.50 to 2.70 by dynamic light scattering method ( B) a step of dispersing in a dispersing medium (c2) to obtain a sol, The varnish of the cerium compound (A), the sol of the inorganic particles (B), the curing catalyst (D), water (F) and the acid (G) are mixed to obtain a cerium compound (A), an inorganic particle (B), and a hardening contact. A step of forming a composition of a film of the medium (D), water (F), acid (G), and solvent (C).

第17觀點為一種圖型形成方法,其係將感光性阻劑塗佈於由第1觀點至第12觀點之中任一觀點之膜形成組成物所得之膜上,使乾燥後,對該感光性阻劑膜進行光照射,接著顯影後,剝離該阻劑膜所構成。 The seventeenth aspect is a pattern forming method in which a photosensitive resist is applied onto a film obtained from a film forming composition according to any one of the first aspect to the twelfth aspect, and after drying, the photosensitive film is formed. The resist film is irradiated with light, and after development, the resist film is peeled off.

第18觀點為一種膜,其係將第1觀點至第12觀點之中任一觀點之膜形成組成物被覆於基板上,經加熱所得,在波長633nm下具有1.50至1.90之折射率。 The ninth aspect is a film obtained by coating a film-forming composition of any one of the first to twelfth aspects onto a substrate, and having a refractive index of 1.50 to 1.90 at a wavelength of 633 nm.

第19觀點為第18觀點之膜,其中膜表面之水的接觸角為60°至80°。 The 19th aspect is the film of the 18th aspect, wherein a contact angle of water of the film surface is 60° to 80°.

第20觀點為第18觀點之膜,其係作為光取出膜或保護膜使用。 The twentieth aspect is the film of the 18th aspect, which is used as a light extraction film or a protective film.

第21觀點為一種裝置,其係具有含有第18觀點之膜的電子裝置。 The twenty-first aspect is an apparatus having an electronic device including the film of the eighteenth aspect.

第22觀點為第21觀點之裝置,其中電子裝置為LED。 The 22nd aspect is the apparatus of the 21st aspect, wherein the electronic device is an LED.

LED用之光取出膜及保護膜等之構件要求高折射率且鹼顯影性,有必要製作10μm以下之圖型。製作10μm以下之圖型時,由矽化合物(A)、無機粒子(B) 及溶劑(C)所構成之組成物製作的被膜被要求鹼顯影性。鹼顯影區分為溶解顯影與剝離顯影。溶解顯影係指鹼溶液邊溶解膜,同時形成圖型的顯影,剝離顯影係指鹼溶液使膜不易溶解,使膜產生膨潤及龜裂,同時形成圖型的顯影。在此,欲形成10μm以下之圖型時,必須為可溶解顯影,但是剝離顯影時,其圖型形成困難。剝離顯影則無法將龜裂所發生之尺寸抑制在10μm以下,且無法得到均勻之10μm以下的圖型。 A member such as a light extraction film for LED and a protective film requires a high refractive index and alkali developability, and it is necessary to produce a pattern of 10 μm or less. When the pattern of 10 μm or less is produced, the compound (A) and the inorganic particles (B) are produced. The film produced by the composition of the solvent (C) is required to have alkali developability. Alkali development is distinguished by dissolution development and peel development. The dissolution and development means that the film is dissolved while the alkali solution is dissolved, and the development of the pattern is formed. The peeling and development means that the alkali solution makes the film less soluble, causing the film to swell and crack, and at the same time forming a pattern. Here, when a pattern of 10 μm or less is to be formed, it is necessary to be soluble and developable, but in the case of peel development, the pattern formation is difficult. In the case of peel development, the size of cracks cannot be suppressed to 10 μm or less, and a pattern of 10 μm or less in uniformity cannot be obtained.

本發明之膜形成組成物係含有重量平均分子量 700至4000之矽化合物(A)、具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)及溶劑(C)的膜形成組成物。 The film-forming composition of the present invention contains a weight average molecular weight A film-forming composition of the inorganic compound (B) having an average particle diameter of from 1 to 100 nm and a refractive index of from 1.50 to 2.70 and a solvent (C) in an amount of from 700 to 4,000.

矽化合物(A)為重量平均分子量700至 4000,此外,以特定的比率使水解性矽烷(a1)與極特定種類之水解性矽烷(a2)藉由共聚合而得的水解縮合物,由此水解縮合物與無機粒子(B)所構成之組成物製作的被膜對於鹼溶液,展現溶解顯影性,可得到形成10μm以下之圖型的高折射率的被膜。 矽 compound (A) is a weight average molecular weight of 700 to In addition, a hydrolysis condensate obtained by copolymerizing a hydrolyzable decane (a1) and a highly specific type of hydrolyzable decane (a2) at a specific ratio, thereby hydrolyzing a condensate and an inorganic particle (B) The film produced by the composition exhibits dissolution developability with respect to the alkali solution, and a film having a high refractive index of a pattern of 10 μm or less can be obtained.

又,藉由限定水解性矽烷(a2)之種類,可抑 制本加熱時之環狀之低分子化合物昇華,可防止加熱時或信賴性試驗時之折射率降低及膜密度降低。 Moreover, by limiting the type of hydrolyzable decane (a2), it is possible to suppress The sublimation of the cyclic low molecular compound during the heating process prevents the decrease in the refractive index and the decrease in the film density during heating or the reliability test.

無機粒子(B)藉由動態光散射法之平均粒徑 為1至100nm,可達成過濾性良好,膜形成組成物之高透過率。 Average particle size of inorganic particles (B) by dynamic light scattering From 1 to 100 nm, good filterability and high transmittance of the film-forming composition can be achieved.

又,矽化合物(A)為聚矽氧烷,無機粒子(B)為顯示高折射率之二氧化鋯時,以無機化合物構成的組成物,因此耐光性良好。 Further, the ruthenium compound (A) is a polysiloxane, and the inorganic particles (B) are a composition composed of an inorganic compound when the zirconia having a high refractive index is exhibited, and thus the light resistance is good.

存在於矽化合物(A)與無機粒子(B)之表面的羥基,當施加外部刺激的熱時,開始聚縮合,可形成堅固且高硬度的膜。 The hydroxyl groups present on the surface of the ruthenium compound (A) and the inorganic particles (B) start to condense when heat of external stimuli is applied, and a film having a strong and high hardness can be formed.

由本發明之聚矽氧烷與平均粒徑為1至100nm以下之無機粒子所構成之組成物,對於鹼溶液具有溶解顯影性,因此使用感光性阻劑,可形成10μm以下之圖型化。未經過乾蝕刻等之製程,因此,步驟簡略化,可降低生產成本。 The composition comprising the polysiloxane of the present invention and inorganic particles having an average particle diameter of 1 to 100 nm or less has solubility developability in an alkali solution. Therefore, a photosensitive resist can be used to form a pattern of 10 μm or less. The process is not simplified by dry etching, and therefore, the steps are simplified, and the production cost can be reduced.

又,將使用完全水解型之聚矽氧烷與部分水解型之聚矽氧烷的組成物,進行比較時,有以下的特徵。 Further, when a composition of a completely hydrolyzed polyoxyalkylene and a partially hydrolyzed polyoxyalkylene was used, the following characteristics were obtained.

部分水解型之聚矽氧烷係指將含有羥基等之官能基的醇使用於水解或聚縮合時之溶劑所得之聚合物。部分水解型之聚矽氧烷在進行水解、聚縮合的階段,由溶劑之醇或單體之矽烷烷氧化物(alkoxide)所生成之醇與水解生成的矽烷醇基進行反應,以矽烷烷氧化物的形態殘存。又,溶液狀態之聚合物中之矽烷醇基與矽烷烷氧化物為化學平衡反應,因此,水解及縮合時之溶劑選擇醇時,成為矽烷烷氧化物之殘留比例多的聚矽氧烷。 The partially hydrolyzed polyoxyalkylene refers to a polymer obtained by using an alcohol having a functional group such as a hydroxyl group in a solvent for hydrolysis or polycondensation. In the stage of hydrolysis and polycondensation of the partially hydrolyzed polyoxyalkylene, the alcohol formed from the solvent alcohol or the alkoxide of the monomer is reacted with the hydrolyzed stanol group to oxidize the decane alkane. The form of the object remains. Further, since the stanol group in the polymer in the solution state is chemically balanced with the decane alkoxide, when the solvent is selected as the solvent in the hydrolysis and condensation, it becomes a polysiloxane having a large residual ratio of the decane alkoxide.

另外,完全水解型之聚矽氧烷係指將不含羥基之非醇用於水解及縮合時之溶劑所得之聚合物。完全水解型之聚矽氧烷係水解及聚縮合時之溶劑的非醇溶劑不具有 將聚合物之矽烷醇末端封閉的羥基,因此,所得之聚合物成為矽烷醇之殘留比例多的聚矽氧烷。亦即,完全水解型之聚矽氧烷幾乎不含有機成分的矽烷烷氧化物,故成為幾乎不含在耐光性試驗不利之碳元素的聚合物。 Further, the fully hydrolyzed polyoxyalkylene refers to a polymer obtained by using a solvent containing no hydroxyl group as a solvent for hydrolysis and condensation. The fully hydrolyzed polyoxyalkylene-based solvent and the non-alcoholic solvent of the solvent in the polycondensation do not have The hydroxyl group at the end of the stanol of the polymer is blocked, and therefore, the obtained polymer becomes a polyoxane having a large residual ratio of stanol. That is, since the fully hydrolyzed polyoxyalkylene oxide contains almost no organic component decane alkoxide, it is a polymer which hardly contains carbon which is unfavorable in the light resistance test.

部分水解型之聚矽氧烷殘存許多矽烷烷氧化 物,故與微粒子之矽烷醇反應時,必須一旦經由水解,且必須另外添加添加劑等。添加劑例如有矽烷醇之生成促進劑或矽烷烷氧化物之分解促進劑,但是此等添加劑含有有機基或金屬,使耐光性惡化,故不適合本發明之組成物。 Partially hydrolyzed polyoxyalkylene remains in the oxidation of many decane alkane Therefore, when reacting with the sterol of the fine particles, it is necessary to pass the hydrolysis once, and it is necessary to additionally add an additive or the like. The additive is, for example, a sterol alcohol production promoter or a decane alkoxide decomposition accelerator. However, these additives contain an organic group or a metal to deteriorate light resistance, and thus are not suitable for the composition of the present invention.

與部分水解型之聚矽氧烷比較,完全水解型之 聚矽氧烷在末端殘存矽烷醇較多,故熱硬化後,可得到高信賴性的膜對於鹼溶液,溶解性過高,利用本發明目的之感光性阻劑形成10μm以下之圖型困難,但是藉由添加硬化觸媒(D),旋轉塗佈該被膜後,在使暫時乾燥的階段,提高或控制鹼溶液耐性,在適合實用步驟的條件,可效率良好形成10μm以下之圖型。 Compared with partially hydrolyzed polyoxyalkylene, fully hydrolyzed Since the polyoxyalkylene has a large amount of decyl alcohol remaining at the terminal, it is possible to obtain a highly reliable film after thermal curing, and the solubility in the alkali solution is too high, and it is difficult to form a pattern of 10 μm or less by the photosensitive resist of the object of the present invention. However, by adding the curing catalyst (D), the film is spin-coated, and the alkali solution resistance is improved or controlled at the stage of temporary drying, and a pattern of 10 μm or less can be efficiently formed under conditions suitable for practical steps.

又,由本發明之聚矽氧烷與平均粒徑為1至 100nm以下之無機粒子與氫鍵性膜粗糙防止材(例如二酮化合物)所構成之組成物,使用感光性阻劑可圖型化,進一步再塗佈感光性阻劑時,或阻劑膜之剝離時,不會發生膜粗糙。 Further, the polysiloxane of the present invention has an average particle diameter of 1 to A composition composed of inorganic particles of 100 nm or less and a hydrogen-bonding film roughness preventing material (for example, a diketone compound) can be patterned using a photosensitive resist, and when a photosensitive resist is further applied, or a resist film When peeling off, film roughness does not occur.

又,藉由含有水(F)及酸(G),使反應性 基的羥基安定,在以23℃或5℃為保管溫度之清漆狀態的品質不會產生變化,可長期得到可形成良好之10μm以下 之圖型的被膜。 Moreover, by containing water (F) and acid (G), the reactivity is made. The hydroxy group of the group does not change in the quality of the varnish at a storage temperature of 23 ° C or 5 ° C, and can be formed to a good length of 10 μm or less. The film of the pattern.

又,藉由本發明所得之膜可滿足高折射率、高 透明性、高耐熱性、高耐光性、高硬度之條件全部,且可圖型化,故可適合作為液晶顯示器、電漿顯示器、陰極射線管、有機發光顯示器、電子紙、LED、固體攝像元件、太陽能電池、有機薄膜電晶體等之電子裝置使用。特別是適合作為要求高耐光性之LED用構件使用。 Moreover, the film obtained by the present invention can satisfy high refractive index and high Transparent, high heat resistance, high light resistance, high hardness conditions, and can be patterned, it can be suitable as liquid crystal display, plasma display, cathode ray tube, organic light-emitting display, electronic paper, LED, solid-state imaging element Use in electronic devices such as solar cells and organic thin film transistors. In particular, it is suitable for use as a member for LEDs requiring high light resistance.

[圖1]使用含有聚合物TT73之實施例(1-1)之組成物時之圖型觀察圖。 Fig. 1 is a pattern view showing a composition of Example (1-1) containing a polymer TT73.

[圖2]使用含有聚合物TI73之實施例(1-2)之組成物時之圖型觀察圖。 Fig. 2 is a pattern view showing the use of the composition of Example (1-2) containing the polymer TI73.

[圖3]使用含有聚合物TH73之實施例(1-3)之組成物時之圖型觀察圖。 Fig. 3 is a pattern view showing the use of the composition of Example (1-3) containing the polymer TH73.

[圖4]使用含有聚合物TI73M1之實施例(1-8)之組成物時之圖型觀察圖。 Fig. 4 is a pattern view showing the use of the composition of the example (1-8) containing the polymer TI73M1.

[圖5]使用含有聚合物pTEOS之比較例(1-1)之組成物時之圖型觀察圖。 Fig. 5 is a pattern view showing a composition of Comparative Example (1-1) containing a polymer pTEOS.

[圖6]使用含有聚合物TI73M4之比較例(1-5)之組成物時之圖型觀察圖。 Fig. 6 is a pattern view showing the use of the composition of Comparative Example (1-5) containing the polymer TI73M4.

[圖7]使用含有清漆V(2-1)之實施例(2-10)之組成物時之圖型觀察圖。 Fig. 7 is a pattern view showing a composition of Example (2-10) containing varnish V (2-1).

[圖8]使用含有清漆V(2-2)之實施例(2-11)之組成物時之圖型觀察圖。 Fig. 8 is a pattern view showing a composition of Example (2-11) containing varnish V (2-2).

[圖9]使用含有清漆V(2-3)之實施例(2-12)之組成物時之圖型觀察圖。 Fig. 9 is a pattern view showing a composition of Example (2-12) containing varnish V (2-3).

[圖10]使用含有清漆RV(2-1)之參考例(2-14)之組成物時之圖型觀察圖。 Fig. 10 is a pattern view showing a composition of Reference Example (2-14) containing varnish RV (2-1).

[圖11]使用含有清漆RV(2-2)之參考例(2-15)之組成物時之圖型觀察圖。 Fig. 11 is a pattern view showing a composition of Reference Example (2-15) containing varnish RV (2-2).

[圖12]使用含有清漆RV(2-3)之參考例(2-16)之組成物時之圖型觀察圖。 Fig. 12 is a pattern view showing a composition of Reference Example (2-16) containing varnish RV (2-3).

[圖13]實施例(3-10)且使用清漆V(3-1)時之阻劑膜剝離後之製膜面觀察圖。 Fig. 13 is a view showing a film formation surface after the resist film is peeled off in the case of using the varnish V (3-1) in the embodiment (3-10).

[圖14]參考例(3-14),且使用清漆RV(3-1)時之阻劑膜剝離後之製膜面觀察圖。 Fig. 14 is a view showing a film formation surface after peeling of the resist film when the varnish RV (3-1) is used in Reference Example (3-14).

[圖15]使用含有清漆V(4-1)之實施例(4-1)之組成物時之圖型觀察圖。 Fig. 15 is a pattern view showing a composition of Example (4-1) containing varnish V (4-1).

[圖16]使用含有清漆V(4-2)之實施例(4-2)之組成物時之圖型觀察圖。 Fig. 16 is a pattern view showing a composition of Example (4-2) containing varnish V (4-2).

[圖17]使用含有清漆V(4-3)之實施例(4-3)之組成物時之圖型觀察圖。 Fig. 17 is a pattern view showing a composition of Example (4-3) containing varnish V (4-3).

[圖18]使用含有清漆V(4-10)之實施例(4-10)之組成物時之圖型觀察圖。 Fig. 18 is a pattern view showing the composition of Example (4-10) containing varnish V (4-10).

[圖19]使用含有清漆V(4-14)之實施例(4-14)之組成物時之圖型觀察圖。 Fig. 19 is a pattern view showing a composition of Example (4-14) containing varnish V (4-14).

[圖20]使用含有清漆V(4-15)之實施例(4-15)之組成物時之圖型觀察圖。 Fig. 20 is a pattern view showing the use of the composition of the embodiment (4-15) containing the varnish V (4-15).

[圖21]使用含有清漆V(4-16)之實施例(4-16)之組成物時之圖型觀察圖。 Fig. 21 is a pattern view showing a composition of Examples (4-16) containing varnish V (4-16).

[圖22]使用含有清漆V(4-17)之實施例(4-17)之組成物時之圖型觀察圖。 Fig. 22 is a pattern view showing a composition of Example (4-17) containing varnish V (4-17).

[圖23]參考例(4-1),且使用清漆RV(4-1)之圖型化後之製膜面觀察圖。 Fig. 23 is a view showing a film formation surface of the reference example (4-1) and using the varnish RV (4-1).

[圖24]參考例(4-2),且使用清漆RV(4-2)之圖型化後之製膜面觀察圖。 Fig. 24 is a view showing a film formation surface after the patterning of the varnish RV (4-2) using Reference Example (4-2).

[圖25]參考例(4-3),且使用清漆RV(4-3)之圖型化後之製膜面觀察圖。 Fig. 25 is a view showing a film formation surface after the patterning of the varnish RV (4-3) using Reference Example (4-3).

[實施發明之形態] [Formation of the Invention]

本發明係含有:具有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷之水解縮合物,且重量平均分子量700至4000之矽化合物(A)、具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)、及溶劑(C)的膜形成組成物。式(1)及式(2)中之R1及R2各自表示碳原子數1~20之烷氧基、碳原子數2~20之醯氧基、或鹵基,L表示碳原子數3~6之直鏈、分支或環狀之烷基。 The present invention contains a hydrolyzed condensate of a hydrolyzable decane having a hydrolyzable decane (a1) and a hydrolyzable decane (a2), and a ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, having an average particle diameter of from 1 to 100 nm. The inorganic particle (B) having a refractive index of 1.50 to 2.70 and the film of the solvent (C) form a composition. R 1 and R 2 in the formula (1) and the formula (2) each represent an alkoxy group having 1 to 20 carbon atoms, an anthracene group having 2 to 20 carbon atoms, or a halogen group, and L represents a carbon number of 3 a linear, branched or cyclic alkyl group of ~6.

上述膜形成組成物之固體成分濃度,只要是調 整為可得到目的之膜形成用被膜的膜厚即可,可為0.1~50質量%、1~30質量%、或5~20質量%之濃度範圍。固體成分係由膜形成組成物中除去溶劑後剩餘的比例。 The solid content concentration of the above film-forming composition is as long as it is The film thickness of the film for forming a film which can be obtained is sufficient, and may be in a concentration range of 0.1 to 50% by mass, 1 to 30% by mass, or 5 to 20% by mass. The solid content is the ratio remaining after the solvent is removed from the film-forming composition.

固體成分中之矽化合物(A)與無機粒子(B)之含量,可為50~100質量%、70~100質量%、或70~99質量%。 The content of the ruthenium compound (A) and the inorganic particles (B) in the solid content may be 50 to 100% by mass, 70 to 100% by mass, or 70 to 99% by mass.

以固體成分換算,無機粒子(B)為100質量份時,矽化合物(A)可在0.1~200質量份之範圍內添加,較佳為0.1~100質量份,為了保持膜質,保持保存安定性,更佳為0.1~50質量份。 When the inorganic particles (B) are 100 parts by mass in terms of solid content, the ruthenium compound (A) may be added in an amount of 0.1 to 200 parts by mass, preferably 0.1 to 100 parts by mass, and the storage stability is maintained in order to maintain the film quality. More preferably, it is 0.1 to 50 parts by mass.

本發明用的矽化合物(A)係將以式(a1)表示之水解性矽烷(a1)與以式(a2)表示之水解性矽烷(a2)進行水解、共聚合的水解縮合物。此水解縮合物可含有水解物。 The hydrazine compound (A) used in the present invention is a hydrolysis condensate obtained by hydrolyzing and copolymerizing a hydrolyzable decane (a1) represented by the formula (a1) and a hydrolyzable decane (a2) represented by the formula (a2). This hydrolysis condensate may contain a hydrolyzate.

矽化合物(A)係將水解性矽烷(a1)與水解性矽烷(a2)之比例為水解性矽烷(a1)含有90莫耳%至50莫耳%、80莫耳%至60莫耳%、或70莫耳%,水解性矽烷(a2)含有10莫耳%至50莫耳%、20莫耳%至40莫耳%、或30莫耳%的水解性矽烷進行水解縮合的聚合物。 The hydrazine compound (A) has a ratio of the hydrolyzable decane (a1) to the hydrolyzable decane (a2) of 90% by mole to 50% by mole, and 80% by mole to 60% by mole of the hydrolyzable decane (a1). Or 70 mol%, the hydrolyzable decane (a2) contains 10 mol% to 50 mol%, 20 mol% to 40 mol%, or 30 mol% of a hydrolyzable decane hydrolyzed and condensed.

水解性矽烷(a1)含有95莫耳%以上所製造的矽化合物(A)之鹼溶液之顯影性為剝離顯影,未展現本發明之重要目的之溶解顯影性。又,水解性矽烷(a2)含有55莫耳%以上所製造的矽化合物之疏水性升高,排斥鹼溶液,失去顯影性。 The hydrolyzable decane (a1) contains 95 mol% or more of the alkali solution of the ruthenium compound (A), and the developability is peel development, and the dissolution developability which does not exhibit the important object of the present invention is exhibited. Further, the hydrolyzable decane (a2) containing 55 mol% or more of the ruthenium compound produced has an increased hydrophobicity, repels the alkali solution, and loses developability.

水解物係矽烷單體之水解基產生水解生成矽烷 醇基者。該水解縮合物係水解物中之矽烷醇基彼此產生脫水縮合的水解縮合物,形成聚矽氧烷者,縮合物之末端通常具有矽烷醇基。矽化合物(A)為水解縮合物(聚矽氧烷),但是也可具有其前驅物的水解物。 The hydrolyzate is hydrolyzed by a hydrolyzate of a decane monomer to produce a decane Alcohol based. The hydrolysis condensate is a hydrolyzed condensate in which the stanol groups in the hydrolyzate are dehydrated and condensed to each other to form a polyoxyalkylene, and the terminal of the condensate usually has a stanol group. The hydrazine compound (A) is a hydrolysis condensate (polyoxane), but may also have a hydrolyzate of its precursor.

式(a1)及式(a2)中之R1、R2表示烷氧 基、醯氧基、或鹵基。 R 1 and R 2 in the formula (a1) and the formula (a2) represent an alkoxy group, a decyloxy group or a halogen group.

烷氧基例如碳原子數1~20之具有直鏈、分支 或環狀之烷基部分之烷氧基,例如有甲氧基、乙氧基、n-丙氧基、異丙氧基、n-丁氧基、異丁氧基、sec-丁氧基、t-丁氧基、n-戊氧基、1-甲基-n-丁氧基、2-甲基-n-丁氧基、3-甲基-n-丁氧基、1,1-二甲基-n-丙氧基、1,2-二甲基-n-丙氧基、2,2-二甲基-n-丙氧基、1-乙基-n-丙氧基、n-己氧基、1-甲基-n-戊氧基、2-甲基-n-戊氧基、3-甲基-n-戊氧基、4-甲基-n-戊氧基、1,1-二甲基-n-丁氧基、1,2-二甲基-n-丁氧基、1,3-二甲基-n-丁氧基、2,2-二甲基-n-丁氧基、2,3-二甲基-n-丁氧基、3,3-二甲基-n-丁氧基、1-乙基-n-丁氧基、2-乙基-n-丁氧基、1,1,2-三甲基-n-丙氧基、1,2,2,-三甲基-n-丙氧基、1-乙基-1-甲基-n-丙氧基、及1-乙基-2-甲基-n-丙氧基等。 Alkoxy groups such as carbon atoms 1 to 20 have a straight chain, a branch Or alkoxy groups of a cyclic alkyl moiety, for example, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy, T-butoxy, n-pentyloxy, 1-methyl-n-butoxy, 2-methyl-n-butoxy, 3-methyl-n-butoxy, 1,1-di Methyl-n-propoxy, 1,2-dimethyl-n-propoxy, 2,2-dimethyl-n-propoxy, 1-ethyl-n-propoxy, n- Hexyloxy, 1-methyl-n-pentyloxy, 2-methyl-n-pentyloxy, 3-methyl-n-pentyloxy, 4-methyl-n-pentyloxy, 1, 1-dimethyl-n-butoxy, 1,2-dimethyl-n-butoxy, 1,3-dimethyl-n-butoxy, 2,2-dimethyl-n- Butoxy, 2,3-dimethyl-n-butoxy, 3,3-dimethyl-n-butoxy, 1-ethyl-n-butoxy, 2-ethyl-n- Butoxy, 1,1,2-trimethyl-n-propoxy, 1,2,2,-trimethyl-n-propoxy, 1-ethyl-1-methyl-n-propyl An oxy group, and 1-ethyl-2-methyl-n-propoxy group and the like.

醯氧基例如有碳原子數2~20的醯氧基,例如 甲基羰基氧基、乙基羰基氧基、n-丙基羰基氧基、異丙基羰基氧基、n-丁基羰基氧基、異丁基羰基氧基、sec-丁基羰基氧基、t-丁基羰基氧基、n-戊基羰基氧基、1-甲基-n- 丁基羰基氧基、2-甲基-n-丁基羰基氧基、3-甲基-n-丁基羰基氧基、1,1-二甲基-n-丙基羰基氧基、1,2-二甲基-n-丙基羰基氧基、2,2-二甲基-n-丙基羰基氧基、1-乙基-n-丙基羰基氧基、n-己基羰基氧基、1-甲基-n-戊基羰基氧基、2-甲基-n-戊基羰基氧基、3-甲基-n-戊基羰基氧基、4-甲基-n-戊基羰基氧基、1,1-二甲基-n-丁基羰基氧基、1,2-二甲基-n-丁基羰基氧基、1,3-二甲基-n-丁基羰基氧基、2,2-二甲基-n-丁基羰基氧基、2,3-二甲基-n-丁基羰基氧基、3,3-二甲基-n-丁基羰基氧基、1-乙基-n-丁基羰基氧基、2-乙基-n-丁基羰基氧基、1,1,2-三甲基-n-丙基羰基氧基、1,2,2-三甲基-n-丙基羰基氧基、1-乙基-1-甲基-n-丙基羰基氧基、1-乙基-2-甲基-n-丙基羰基氧基、苯基羰基氧基、及甲苯磺醯基羰基氧基等,但不限於此等。 The decyloxy group has, for example, a decyloxy group having 2 to 20 carbon atoms, for example Methylcarbonyloxy, ethylcarbonyloxy, n-propylcarbonyloxy, isopropylcarbonyloxy, n-butylcarbonyloxy, isobutylcarbonyloxy, sec-butylcarbonyloxy, T-Butylcarbonyloxy, n-pentylcarbonyloxy, 1-methyl-n- Butylcarbonyloxy, 2-methyl-n-butylcarbonyloxy, 3-methyl-n-butylcarbonyloxy, 1,1-dimethyl-n-propylcarbonyloxy, 1, 2-Dimethyl-n-propylcarbonyloxy, 2,2-dimethyl-n-propylcarbonyloxy, 1-ethyl-n-propylcarbonyloxy, n-hexylcarbonyloxy, 1-methyl-n-pentylcarbonyloxy, 2-methyl-n-pentylcarbonyloxy, 3-methyl-n-pentylcarbonyloxy, 4-methyl-n-pentylcarbonyloxy 1,1,1-dimethyl-n-butylcarbonyloxy, 1,2-dimethyl-n-butylcarbonyloxy, 1,3-dimethyl-n-butylcarbonyloxy, 2,2-Dimethyl-n-butylcarbonyloxy, 2,3-dimethyl-n-butylcarbonyloxy, 3,3-dimethyl-n-butylcarbonyloxy, 1- Ethyl-n-butylcarbonyloxy, 2-ethyl-n-butylcarbonyloxy, 1,1,2-trimethyl-n-propylcarbonyloxy, 1,2,2-trimethyl Base-n-propylcarbonyloxy, 1-ethyl-1-methyl-n-propylcarbonyloxy, 1-ethyl-2-methyl-n-propylcarbonyloxy, phenylcarbonyloxy And the like, and toluenesulfonylcarbonyloxy group, etc., but are not limited thereto.

又,作為水解基之鹵基,可舉例如氟、氯、 溴、碘等。 Further, examples of the halogen group as the hydrolyzable group include fluorine and chlorine. Bromine, iodine, etc.

上述水解性矽烷(a1)例如有四甲氧基矽烷、 四乙醯氧基矽烷、四乙氧基矽烷、四n-丙氧基矽烷、四異丙氧基矽烷、四n-丁氧基矽烷、四乙醯氧基矽烷、四氯矽烷等,但只要是4官能(具有4個水解性基)的矽氧烷單體即可,並不限於此等。此等之中,較佳為使用四甲氧基矽烷、四乙氧基矽烷。水解性矽烷可使用市售品。 The hydrolyzable decane (a1) is, for example, tetramethoxy decane, Tetraethoxy decane, tetraethoxy decane, tetra-n-propoxy decane, tetraisopropoxy decane, tetra-n-butoxy decane, tetraethoxy decane, tetrachloro decane, etc., but as long as It is a tetrafunctional (having four hydrolyzable groups) oxosiloxane monomers, and is not limited thereto. Among these, tetramethoxynonane and tetraethoxydecane are preferably used. A commercially available product can be used for the hydrolyzable decane.

水解性矽烷(a2)中之L表示碳原子數3~6 之直鏈、分支或環狀之烷基。例如有n-丙基、異丙基、n-丁基、異丁基、sec-丁基、t-丁基、n-戊基、1-甲基-n-丁 基、2-甲基-n-丁基、3-甲基-n-丁基、1,1-二甲基-n-丙基、1,2-二甲基-n-丙基、2,2-二甲基-n-丙基、1-乙基-n-丙基、n-己基、1-甲基-n-戊基、2-甲基-n-戊基、3-甲基-n-戊基、4-甲基-n-戊基、1,1-二甲基-n-丁基、1,2-二甲基-n-丁基、1,3-二甲基-n-丁基、2,2-二甲基-n-丁基、2,3-二甲基-n-丁基、3,3-二甲基-n-丁基、1-乙基-n-丁基、2-乙基-n-丁基、1,1,2-三甲基-n-丙基、1,2,2-三甲基-n-丙基、1-乙基-1-甲基-n-丙基、及1-乙基-2-甲基-n-丙基、環丙基、環丁基、環戊基、環己基等,但是不限於此等者。 L in the hydrolyzable decane (a2) represents a carbon number of 3 to 6 A linear, branched or cyclic alkyl group. For example, there are n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, t-butyl, n-pentyl, 1-methyl-n-butyl Base, 2-methyl-n-butyl, 3-methyl-n-butyl, 1,1-dimethyl-n-propyl, 1,2-dimethyl-n-propyl, 2, 2-Dimethyl-n-propyl, 1-ethyl-n-propyl, n-hexyl, 1-methyl-n-pentyl, 2-methyl-n-pentyl, 3-methyl- N-pentyl, 4-methyl-n-pentyl, 1,1-dimethyl-n-butyl, 1,2-dimethyl-n-butyl, 1,3-dimethyl-n -butyl, 2,2-dimethyl-n-butyl, 2,3-dimethyl-n-butyl, 3,3-dimethyl-n-butyl, 1-ethyl-n- Butyl, 2-ethyl-n-butyl, 1,1,2-trimethyl-n-propyl, 1,2,2-trimethyl-n-propyl, 1-ethyl-1- Methyl-n-propyl, and 1-ethyl-2-methyl-n-propyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl and the like, but are not limited thereto.

上述水解性矽烷(a2)例如有n-丙基三甲氧 基矽烷、n-丙基三乙氧基矽烷、異丙基三乙氧基矽烷、環丙基三乙氧基矽烷、n-丁基三乙氧基矽烷、sec-丁基三乙氧基矽烷、t-丁基三乙氧基矽烷、異丁基三乙氧基矽烷、環丁基三乙氧基矽烷、n-戊基三乙氧基矽烷、t-戊基三乙氧基矽烷、三乙氧基(戊烷-2-基)矽烷、三乙氧基(戊烷-3-基)矽烷、環戊基三甲氧基矽烷、n-己基三甲氧基矽烷、n-己基三乙氧基矽烷、三乙氧基(己烷-2-基)矽烷、三乙氧基(己烷-3-基)矽烷、三乙氧基(4-甲基戊烷-2-基)矽烷、三乙氧基(2-甲基戊烷-2-基)矽烷、三乙氧基(3-甲基戊烷-3-基)矽烷、環己基三甲氧基矽烷等,但是不限於此等者。 The above hydrolyzable decane (a2) is, for example, n-propyltrimethoxy Baseline, n-propyltriethoxydecane, isopropyltriethoxydecane, cyclopropyltriethoxydecane, n-butyltriethoxydecane, sec-butyltriethoxydecane , t-butyl triethoxy decane, isobutyl triethoxy decane, cyclobutyl triethoxy decane, n-pentyl triethoxy decane, t-pentyl triethoxy decane, three Ethoxy(pentane-2-yl)decane, triethoxy(pentan-3-yl)decane, cyclopentyltrimethoxydecane, n-hexyltrimethoxydecane, n-hexyltriethoxy Decane, triethoxy(hexane-2-yl)decane, triethoxy(hexane-3-yl)decane, triethoxy(4-methylpentan-2-yl)decane, triethyl An oxy (2-methylpentan-2-yl) decane, a triethoxy (3-methylpentan-3-yl) decane, a cyclohexyl trimethoxy decane, etc., but is not limited thereto.

此等之中,較佳可使用n-丙基三甲氧基矽 烷、n-丙基三乙氧基矽烷、異丁基三乙氧基矽烷、n-己基三甲氧基矽烷。水解性矽烷可使用市售品。 Among these, n-propyltrimethoxyfluorene is preferably used. Alkane, n-propyltriethoxydecane, isobutyltriethoxydecane, n-hexyltrimethoxydecane. A commercially available product can be used for the hydrolyzable decane.

將含有式(a1)之水解性矽烷(a1)與式 (a2)之水解性矽烷(a2)的水解性矽烷進行水解縮合, 含有該水解縮合物之共聚物的矽化合物(A)可為重量平均分子量700至4000、或1000至2000之縮合物。此等之分子量係藉由GPC分析之聚苯乙烯換算所得之分子量。重量平均分子量未達700時,聚合物為過低分子量,無法得到均勻的膜。又,重量平均分子量超過4000時,聚合物為過高分子量化,對於鹼溶液,成為剝離顯影。 Hydrolyzing decane (a1) containing formula (a1) The hydrolyzable decane of the hydrolyzable decane (a2) of (a2) is subjected to hydrolysis condensation, The hydrazine compound (A) containing the copolymer of the hydrolysis condensate may be a condensate having a weight average molecular weight of 700 to 4,000 or 1,000 to 2,000. These molecular weights are molecular weights obtained by polystyrene conversion by GPC analysis. When the weight average molecular weight is less than 700, the polymer has an excessively low molecular weight, and a uniform film cannot be obtained. Further, when the weight average molecular weight exceeds 4,000, the polymer is over-polymerized, and the alkali solution is subjected to peel development.

作為水解觸媒的有機酸,可舉例如乙酸、丙 酸、丁酸、戊酸、己酸、庚酸、辛酸、壬酸、癸酸、草酸、馬來酸、甲基丙二酸、己二酸、癸二酸、没食子酸、丁酸、苯六甲酸、花生四烯酸、2-乙基己酸、油酸、硬脂酸、亞麻油酸、次亞麻酸、水楊酸、苯甲酸、p-胺基苯甲酸、p-甲苯磺酸、苯磺酸、單氯乙酸、二氯乙酸、三氯乙酸、三氟乙酸、甲酸、丙二酸、磺酸、苯二甲酸、富馬酸、檸檬酸、酒石酸等。 The organic acid as the hydrolysis catalyst may, for example, be acetic acid or C. Acid, butyric acid, valeric acid, caproic acid, heptanoic acid, caprylic acid, capric acid, capric acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid, sebacic acid, gallic acid, butyric acid, benzene Formic acid, arachidonic acid, 2-ethylhexanoic acid, oleic acid, stearic acid, linoleic acid, linolenic acid, salicylic acid, benzoic acid, p-aminobenzoic acid, p-toluenesulfonic acid, benzene Sulfonic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoroacetic acid, formic acid, malonic acid, sulfonic acid, phthalic acid, fumaric acid, citric acid, tartaric acid, and the like.

作為水解觸媒的無機酸,可舉例如鹽酸、硝 酸、硫酸、氟酸、磷酸等。 The inorganic acid as the hydrolysis catalyst may, for example, be hydrochloric acid or nitrate. Acid, sulfuric acid, hydrofluoric acid, phosphoric acid, and the like.

作為水解觸媒的有機鹼,可舉例如吡啶、吡 咯、哌嗪、吡咯烷、哌啶、甲基吡啶、三甲基胺、三乙基胺、單乙醇胺、二乙醇胺、二甲基單乙醇胺、單甲基二乙醇胺、三乙醇胺、二氮雜雙環辛烷、二氮雜雙環壬烷、二氮雜雙環十一碳烯、四甲基氫氧化銨、1,8-二氮雜雙環[5,4,0]-7-十一烯等。 The organic base as a hydrolysis catalyst may, for example, be pyridine or pyridyl Ol, piperazine, pyrrolidine, piperidine, picoline, trimethylamine, triethylamine, monoethanolamine, diethanolamine, dimethyl monoethanolamine, monomethyldiethanolamine, triethanolamine, diazabicyclo Octane, diazabicyclononane, diazabicycloundecene, tetramethylammonium hydroxide, 1,8-diazabicyclo[5,4,0]-7-undecene, and the like.

無機鹼例如有氨、氫氧化鈉、氫氧化鉀、氫氧 化鋇、氫氧化鈣等。此等觸媒中,較佳為金屬螯合化合物、有機酸、無機酸,此等可使用1種或2種以上同時使用。 Inorganic bases such as ammonia, sodium hydroxide, potassium hydroxide, hydrogen hydroxide Huayu, calcium hydroxide and the like. Among these catalysts, a metal chelate compound, an organic acid, and an inorganic acid are preferable, and these may be used alone or in combination of two or more kinds.

水解觸媒為揮發性之無機酸,例如可適用使用 鹽酸。烷氧基矽烷基、醯氧基矽烷基、鹵素化矽烷基的水解,相對上述水解基之1莫耳,使用0.1~100莫耳、0.1~10莫耳、1~5莫耳、或2~3.5莫耳的水。 The hydrolysis catalyst is a volatile inorganic acid, for example, applicable hydrochloric acid. The hydrolysis of an alkoxyalkyl group, a decyloxyalkyl group or a halogenated decyl group is 0.1 to 100 moles, 0.1 to 10 moles, 1 to 5 moles, or 2 to 1 mole of the above hydrolyzable group. 3.5 moles of water.

進行水解與縮合時的反應溫度通常為由20℃(室溫)至水解使用之溶劑之常壓下之迴流溫度的範圍內進行。又,可在加壓下進行,例如可升溫至液溫200℃左右。 The reaction temperature at the time of hydrolysis and condensation is usually carried out in the range of from 20 ° C (room temperature) to the reflux temperature under normal pressure of the solvent used for the hydrolysis. Further, it can be carried out under pressure, and for example, it can be heated to a liquid temperature of about 200 °C.

得到含水解縮合物(聚矽氧烷)之矽化合物(A)的方法,例如有將水解性矽烷、溶劑、純水及酸觸媒的混合物加熱的方法。具體而言,預先使水解性矽烷溶解於溶劑中,添加鹽酸與純水作成鹽酸水溶液後,將其滴下於水解性矽烷溶液中,進行加熱的方法。此時,鹽酸的量係相對水解性矽烷所具有的全水解性基(全烷氧基)1莫耳,一般為0.0001~0.5莫耳。此方法中之加熱可在液溫50~180℃進行,較佳為避免引起液之蒸發、揮散等,例如在密閉容器中之迴流下進行數十分鐘至十數小時。 A method of obtaining a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), for example, a method of heating a mixture of hydrolyzable decane, a solvent, pure water, and an acid catalyst. Specifically, the hydrolyzable decane is dissolved in a solvent in advance, and hydrochloric acid and pure water are added as a hydrochloric acid aqueous solution, and then the mixture is dropped into a hydrolyzable decane solution to be heated. In this case, the amount of hydrochloric acid is 1 mol to the total hydrolyzable group (per alkoxy group) of the hydrolyzable decane, and is generally 0.0001 to 0.5 mol. The heating in this method can be carried out at a liquid temperature of 50 to 180 ° C, preferably to avoid evaporation or volatilization of the liquid, for example, for several tens of minutes to several tens of hours under reflux in a closed vessel.

水解與縮合所用的溶劑(c1),例如有n-戊烷、異戊烷、n-己烷、異己烷、n-庚烷、異庚烷、2,2,4-三甲基戊烷、n-辛烷、異辛烷、環己烷、甲基環己烷等之脂 肪族烴系溶劑;苯、甲苯、二甲苯、乙基苯、三甲基苯、甲基乙基苯、n-丙基苯、異丙基苯、二乙基苯、異丁基苯、三乙基苯、二異丙基苯、三甲基苯等之芳香族烴系溶劑;丙酮、甲基乙基酮、甲基-n-丙基酮、甲基-n-丁基酮、二乙基酮、甲基異丁基酮、甲基-n-戊基酮、乙基-n-丁基酮、甲基-n-己基酮、二異丁基酮、環己酮、甲基環己酮等之酮系溶劑;乙基醚、異丙基醚、n-丁基醚、n-己基醚、2-乙基己基醚、四氫呋喃、2-甲基四氫呋喃等之醚系、p-二甲苯、o-二甲苯、苯乙烯、乙二醇二甲基醚、丙二醇單甲基醚、乙二醇單甲基醚、丙二醇、丙二醇單乙基醚、乙二醇單乙基醚、乙二醇單異丙基醚、乙二醇單甲基醚乙酸酯、丙二醇單甲基醚乙酸酯、乙二醇單乙基醚乙酸酯、二乙二醇二甲基醚、丙二醇單丁基醚、乙二醇單丁基醚、二乙二醇二乙基醚、二丙二醇單甲基醚、二乙二醇單甲基醚、二丙二醇單乙基醚、二乙二醇單乙基醚、三乙二醇二甲基醚、二乙二醇單乙基醚乙酸酯、二乙二醇、1-辛醇、乙二醇、己二醇、三亞甲基乙二醇、1-甲氧基-2-丁醇、環己醇、二丙酮醇、糠醇、四氫糠基醇、苄基醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、γ-丁基內酯、丙酮、甲基乙基酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基-n-丁基酮、環己酮、乙酸乙酯、乙酸異丙基酮、乙酸n-丙基、乙酸異丁基、乙酸n-丁基、甲醇、乙醇、異丙醇、tert-丁醇、烯丙基醇、n-丙醇、2-甲基-2-丁醇、異丁醇、n-丁醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、 2-乙基己醇、異丙基醚、1,4-二噁烷、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、1,3-二甲基-2-咪唑啉酮、二甲基亞碸、N-環己基-2-吡咯烷酮等。此等之溶劑可使用1種或可組合2種以上使用。 The solvent (c1) used for the hydrolysis and condensation is, for example, n-pentane, isopentane, n-hexane, isohexane, n-heptane, isoheptane, 2,2,4-trimethylpentane, Fat of n-octane, isooctane, cyclohexane, methylcyclohexane, etc. Aromatic hydrocarbon solvent; benzene, toluene, xylene, ethylbenzene, trimethylbenzene, methylethylbenzene, n-propylbenzene, cumene, diethylbenzene, isobutylbenzene, three An aromatic hydrocarbon solvent such as ethylbenzene, diisopropylbenzene or trimethylbenzene; acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-butyl ketone, and diethyl Ketone, methyl isobutyl ketone, methyl-n-amyl ketone, ethyl-n-butyl ketone, methyl-n-hexyl ketone, diisobutyl ketone, cyclohexanone, methylcyclohexane a ketone solvent such as a ketone; an ether system such as ethyl ether, isopropyl ether, n-butyl ether, n-hexyl ether, 2-ethylhexyl ether, tetrahydrofuran or 2-methyltetrahydrofuran, p-xylene , o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol Monoisopropyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol dimethyl ether, propylene glycol monobutyl Ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, dipropylene glycol Methyl ether, diethylene glycol monomethyl ether, dipropylene glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol dimethyl ether, diethylene glycol monoethyl ether acetate, Diethylene glycol, 1-octanol, ethylene glycol, hexanediol, trimethylene glycol, 1-methoxy-2-butanol, cyclohexanol, diacetone alcohol, decyl alcohol, tetrahydroindenyl Alcohol, benzyl alcohol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, γ-butyl lactone, acetone, methyl ethyl ketone, methyl isopropyl Ketone, diethyl ketone, methyl isobutyl ketone, methyl-n-butyl ketone, cyclohexanone, ethyl acetate, isopropyl ketone acetate, n-propyl acetate, isobutyl acetate, acetic acid -butyl, methanol, ethanol, isopropanol, tert-butanol, allyl alcohol, n-propanol, 2-methyl-2-butanol, isobutanol, n-butanol, 2-methyl 1-butanol, 1-pentanol, 2-methyl-1-pentanol, 2-ethylhexanol, isopropyl ether, 1,4-dioxane, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-Dimethyl-2-imidazolidinone, dimethyl hydrazine, N-cyclohexyl-2-pyrrolidone, and the like. These solvents may be used alone or in combination of two or more.

藉由使水解性矽烷在溶劑(c1)中水解,將其 水解物進行縮合反應,可得到水解縮合物(聚矽氧烷),可以溶解於水解溶劑中之聚矽氧烷清漆的形態得到該縮合物。 By hydrolyzing the hydrolyzable decane in the solvent (c1), The hydrolyzate is subjected to a condensation reaction to obtain a hydrolysis condensate (polyoxane), and the condensate can be obtained in the form of a polyoxyalkylene varnish which can be dissolved in a hydrolysis solvent.

含有上述水解縮合物(聚矽氧烷)之矽化合物(A)之清漆之稀釋或取代等所用的溶劑(C)可為與水解性矽烷之水解與縮聚合所用的溶劑(c1)相同或可為另外的溶劑。含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆中的溶劑可為上述溶劑(C)。 The solvent (C) used for the dilution or substitution of the varnish of the hydrazine compound (A) containing the above hydrolysis condensate (polyoxane) may be the same as the solvent (c1) used for the hydrolysis and condensation polymerization of the hydrolyzable decane. For additional solvents. The solvent in the varnish of the hydrazine compound (A) containing a hydrolysis condensate (polyoxyalkylene oxide) may be the above solvent (C).

作為矽化合物(A)之清漆使用時,清漆中之矽化合物(A)的濃度可在0.1~60質量%之範圍內使用。 When used as a varnish of the ruthenium compound (A), the concentration of the ruthenium compound (A) in the varnish can be used in the range of 0.1 to 60% by mass.

本發明之(C)成分為溶劑。溶劑較佳為與得到(A)成分之溶劑同樣的溶劑,但是在不會明顯損及本發明之膜形成用塗佈液之保存安定性時,無特別限定。可使用上述一般的有機溶劑。 The component (C) of the present invention is a solvent. The solvent is preferably the same solvent as the solvent of the component (A), but is not particularly limited as long as the storage stability of the coating liquid for film formation of the present invention is not significantly impaired. The above general organic solvents can be used.

從含有水解縮合物(聚矽氧烷)之矽化合物(A)與平均粒徑為1至100nm之無機粒子(B)之相溶性的觀點,溶劑(C)更佳為丁醇、二丙酮醇、甲基乙基酮、甲基異丁基酮、己二醇、甲基纖維素、乙基纖維素、丁基纖維素、乙基卡必醇、丁基卡必醇、二乙二醇單甲基 醚、丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單甲基醚乙酸酯、丙二醇單丁基醚、環己酮、乙酸甲酯、乙酸乙酯、乳酸乙酯等。 The solvent (C) is more preferably butanol or diacetone from the viewpoint of compatibility of the hydrazine compound (A) containing the hydrolysis condensate (polysiloxane) with the inorganic particles (B) having an average particle diameter of 1 to 100 nm. , methyl ethyl ketone, methyl isobutyl ketone, hexane diol, methyl cellulose, ethyl cellulose, butyl cellulose, ethyl carbitol, butyl carbitol, diethylene glycol methyl Ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monobutyl ether, cyclohexanone, methyl acetate, ethyl acetate, ethyl lactate, and the like.

本發明中,矽化合物(A)可使用將水解性矽 烷在非醇溶劑中進行水解縮合所得者。 In the present invention, the hydrazine compound (A) can be used to hydrolyze hydrazine. The alkane is hydrolyzed and condensed in a non-alcoholic solvent.

含有本發明之水解縮合物(聚矽氧烷)的矽化 合物(A)係將不含羥基之非醇用於水解及聚縮合時之溶劑而得,本說明書中,稱為完全水解型之聚矽氧烷,水解率高的聚矽氧烷。而將含有羥基之醇用於水解或聚縮合時之溶劑所得之聚合物稱為部分水解型之聚矽氧烷來區別。 完全水解型與部分水解型係在聚合物末端之矽烷醇(Si-OH)之存在量不同為較大的差異,完全水解型之聚矽氧烷係Si-OH比部分水解型之聚矽氧烷較多存在。Si-OH之存在量係使用取代成非醇溶劑的清漆,使固體成分量為相同,以1H-NMR定量即可。定量係可將聚矽氧烷之Si-OH之波峰進行積分算出波峰面積之質子數與將內標或溶劑之波峰進行積分算出波峰面積的質子數進行比較來決定。 The hydrazine compound (A) containing the hydrolysis condensate (polysiloxane) of the present invention is obtained by using a non-alcohol containing no hydroxyl group as a solvent for hydrolysis and polycondensation, and is referred to as a fully hydrolyzed type in the present specification. A siloxane, a polyoxyalkylene having a high hydrolysis rate. The polymer obtained by using a hydroxyl group-containing alcohol for the solvent in the case of hydrolysis or polycondensation is referred to as a partially hydrolyzed polysiloxane. The fully hydrolyzed and partially hydrolyzed systems differ greatly in the amount of stanol (Si-OH) present at the end of the polymer, and the fully hydrolyzed polyoxyalkylene-based Si-OH is partially hydrolyzed. More alkane is present. The amount of Si-OH present is determined by using a varnish substituted with a non-alcohol solvent, and the amount of solid components is the same, and it can be quantified by 1 H-NMR. The quantitative system can be obtained by integrating the peaks of the Si-OH of the polyoxyalkylene to calculate the number of protons in the peak area and comparing the number of protons in which the internal standard or the peak of the solvent is integrated to calculate the peak area.

將由內標或溶劑的波峰算出的質子數設為 1.00時,完全水解型的聚矽氧烷之Si-OH之算出的質子數為0.1以上,較佳為0.2以上。另外,部分水解型之聚矽氧烷定義為將由內標或溶劑之波峰算出的質子數設為1.00時,聚矽氧烷之Si-OH之算出的質子數未達0.1。 Set the number of protons calculated from the peak of the internal standard or solvent At 1.00, the calculated number of protons of Si-OH of the fully hydrolyzed polyoxyalkylene is 0.1 or more, preferably 0.2 or more. Further, the partially hydrolyzed polyoxyalkylene is defined such that when the number of protons calculated from the internal standard or the peak of the solvent is 1.00, the number of protons calculated from Si-OH of polyoxyalkylene is less than 0.1.

水解與縮合所用的非醇溶劑(c1),例如有 n-戊烷、異戊烷、n-己烷、異己烷、n-庚烷、異庚烷、 2,2,4-三甲基戊烷、n-辛烷、異辛烷、環己烷、甲基環己烷等之脂肪族烴系溶劑;苯、甲苯、二甲苯、乙基苯、三甲基苯、甲基乙基苯、n-丙基苯、異丙基苯、二乙基苯、異丁基苯、三乙基苯、二異丙基苯、三甲基苯等之芳香族烴系溶劑;丙酮、甲基乙基酮、甲基-n-丙基酮、甲基-n-丁基酮、二乙基酮、甲基異丁基酮、甲基-n-戊基酮、乙基-n-丁基酮、甲基-n-己基酮、二異丁基酮、環己酮、甲基環己酮等之酮系溶劑;乙基醚、異丙基醚、n-丁基醚、n-己基醚、2-乙基己基醚、四氫呋喃、2-甲基四氫呋喃等之醚系溶劑等。此等之溶劑可使用1種或可組合2種以上使用。其中,較佳為使用丙酮等之酮系溶劑、四氫呋喃等之醚系溶劑,特佳為使用丙酮。 a non-alcohol solvent (c1) used for hydrolysis and condensation, for example N-pentane, isopentane, n-hexane, isohexane, n-heptane, isoheptane, An aliphatic hydrocarbon solvent such as 2,2,4-trimethylpentane, n-octane, isooctane, cyclohexane or methylcyclohexane; benzene, toluene, xylene, ethylbenzene, three Aromatic groups such as methylbenzene, methylethylbenzene, n-propylbenzene, cumene, diethylbenzene, isobutylbenzene, triethylbenzene, diisopropylbenzene, trimethylbenzene, etc. Hydrocarbon solvent; acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-butyl ketone, diethyl ketone, methyl isobutyl ketone, methyl-n-amyl ketone a ketone solvent such as ethyl-n-butyl ketone, methyl-n-hexyl ketone, diisobutyl ketone, cyclohexanone or methylcyclohexanone; ethyl ether, isopropyl ether, n- An ether solvent such as butyl ether, n-hexyl ether, 2-ethylhexyl ether, tetrahydrofuran or 2-methyltetrahydrofuran. These solvents may be used alone or in combination of two or more. Among them, a ketone solvent such as acetone or an ether solvent such as tetrahydrofuran is preferably used, and acetone is particularly preferably used.

將水解性矽烷在非醇溶劑(c1)中進行水解, 藉由將其水解物進行縮合反應,可得到水解縮合物(聚矽氧烷),可以溶解於水解溶劑中之聚矽氧烷清漆的形態得到該縮合物。 Hydrolyzing hydrazine in a non-alcohol solvent (c1), By subjecting the hydrolyzate to a condensation reaction, a hydrolysis condensate (polyoxane) can be obtained, and the condensate can be obtained in the form of a polyoxyalkylene varnish which can be dissolved in a hydrolysis solvent.

含有所得之水解縮合物(聚矽氧烷)之矽化合 物(A)的溶劑可取代。具體而言,水解與水解後之縮合時所用的溶劑(合成時溶劑)選擇丙酮時,丙酮中,得到聚矽氧烷後,添加與其合成時之溶劑相同量的取代用溶劑,取代成其他的溶劑時,可以蒸發器(evaporator)等使共沸餾除丙酮。此時,可同時餾除因水解性矽烷之水解產生之反應物(例如甲醇、乙醇)。又,使用揮發性之酸觸媒時,可同時除去。 a hydrazine compound containing the obtained hydrolysis condensate (polyoxane) The solvent of the substance (A) can be substituted. Specifically, when the solvent used in the condensation after the hydrolysis and the hydrolysis (the solvent in the synthesis) is selected from acetone, the polysiloxane is obtained in acetone, and the same amount of the solvent for the substitution as the solvent in the synthesis is added, and replaced with another solvent. In the case of a solvent, acetone may be azeotropically distilled off by an evaporator or the like. At this time, a reactant (for example, methanol or ethanol) produced by hydrolysis of hydrolyzable decane can be simultaneously distilled off. Further, when a volatile acid catalyst is used, it can be simultaneously removed.

此取代用溶劑成為將含有水解縮合物(聚矽氧 烷)之矽化合物(A)形成清漆時的溶劑成分(C)。 This substitution solvent will become a hydrolyzed condensate (polyoxyl) The solvent component (C) when the oxime compound (A) forms a varnish.

溶劑取代時之合成時,溶劑係共沸餾除,因此 沸點比取代用溶劑低為佳。例如水解與水解後之縮合時所用的溶劑,例如有丙酮、四氫呋喃等,取代用溶劑例如有丙二醇單甲基醚乙酸酯等。 When the solvent is substituted, the solvent is azeotropically distilled, so The boiling point is preferably lower than the solvent for substitution. For example, a solvent used for the condensation after hydrolysis and hydrolysis may be, for example, acetone or tetrahydrofuran, and the solvent for substitution may, for example, be propylene glycol monomethyl ether acetate or the like.

含有上述水解縮合物(聚矽氧烷)之矽化合物(A)之清漆之稀釋或取代等所用的溶劑(C)可為與水解性矽烷之水解與縮聚合所用的非醇溶劑相同或可為另外的溶劑。含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆中的溶劑可為上述溶劑(C)。 The solvent (C) used for the dilution or substitution of the varnish of the hydrazine compound (A) containing the above hydrolysis-condensation product (polyoxane) may be the same as or may be the non-alcohol solvent used for the hydrolysis and condensation polymerization of the hydrolyzable decane. Additional solvent. The solvent in the varnish of the hydrazine compound (A) containing a hydrolysis condensate (polyoxyalkylene oxide) may be the above solvent (C).

作為矽化合物(A)之清漆使用時,清漆中之矽化合物(A)的濃度可在0.1~60質量%之範圍內使用。 When used as a varnish of the ruthenium compound (A), the concentration of the ruthenium compound (A) in the varnish can be used in the range of 0.1 to 60% by mass.

此時之溶劑(C)的具體例,例如有甲苯、p-二甲苯、o-二甲苯、苯乙烯、乙二醇二甲基醚、丙二醇單甲基醚、乙二醇單甲基醚、丙二醇、丙二醇單乙基醚、乙二醇單乙基醚、乙二醇單異丙基醚、乙二醇單甲基醚乙酸酯、丙二醇單甲基醚乙酸酯、乙二醇單乙基醚乙酸酯、二乙二醇二甲基醚、丙二醇單丁基醚、乙二醇單丁基醚、二乙二醇二乙基醚、二丙二醇單甲基醚、二乙二醇單甲基醚、二丙二醇單乙基醚、二乙二醇單乙基醚、三乙二醇二甲基醚、二乙二醇單乙基醚乙酸酯、二乙二醇、1-辛醇、乙二醇、己二醇、三亞甲基乙二醇、1-甲氧基-2-丁醇、環己醇、二丙酮醇、糠醇、四氫糠基醇、苄基醇、1,3-丁二 醇、1,4-丁二醇、2,3-丁二醇、γ-丁基內酯、丙酮、甲基乙基酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基-n-丁基酮、環己酮、乙酸乙酯、乙酸異丙基酮、乙酸n-丙基、乙酸異丁基、乙酸n-丁基、甲醇、乙醇、異丙醇、tert-丁醇、烯丙基醇、n-丙醇、2-甲基-2-丁醇、異丁醇、n-丁醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、2-乙基己醇、異丙基醚、1,4-二噁烷、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、1,3-二甲基-2-咪唑啉酮、二甲基亞碸、N-環己基-2-吡咯烷酮等。 Specific examples of the solvent (C) at this time include, for example, toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, Propylene glycol, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, ethylene glycol single ethyl Ethyl acetate, diethylene glycol dimethyl ether, propylene glycol monobutyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, diethylene glycol single Methyl ether, dipropylene glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol dimethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol, 1-octanol , ethylene glycol, hexanediol, trimethylene glycol, 1-methoxy-2-butanol, cyclohexanol, diacetone alcohol, decyl alcohol, tetrahydrofurfuryl alcohol, benzyl alcohol, 1,3 - Ding Er Alcohol, 1,4-butanediol, 2,3-butanediol, γ-butyl lactone, acetone, methyl ethyl ketone, methyl isopropyl ketone, diethyl ketone, methyl isobutyl Ketone, methyl-n-butyl ketone, cyclohexanone, ethyl acetate, isopropyl ketone acetate, n-propyl acetate, isobutyl acetate, n-butyl acetate, methanol, ethanol, isopropanol, Tert-butanol, allyl alcohol, n-propanol, 2-methyl-2-butanol, isobutanol, n-butanol, 2-methyl-1-butanol, 1-pentanol, 2 -methyl-1-pentanol, 2-ethylhexanol, isopropyl ether, 1,4-dioxane, N,N-dimethylformamide, N,N-dimethylacetamide And N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethyl hydrazine, N-cyclohexyl-2-pyrrolidone, and the like.

本發明之(C)成分為溶劑。溶劑較佳為與得 到(A)成分之溶劑同樣的非醇溶劑,但是在不會明顯損及本發明之膜形成用塗佈液之保存安定性時,無特別限定。可使用上述一般的有機溶劑。 The component (C) of the present invention is a solvent. The solvent is preferably The solvent of the component (A) is the same non-alcoholic solvent, but is not particularly limited as long as the storage stability of the coating liquid for film formation of the present invention is not significantly impaired. The above general organic solvents can be used.

從含有水解縮合物(聚矽氧烷)之矽化合物 (A)與平均粒徑為1至100nm之無機粒子(B)之相溶性的觀點,溶劑(C)更佳為丁醇、二丙酮醇、甲基乙基酮、甲基異丁基酮、己二醇、甲基纖維素、乙基纖維素、丁基纖維素、乙基卡必醇、丁基卡必醇、二乙二醇單甲基醚、丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單甲基醚乙酸酯、丙二醇單丁基醚、環己酮、乙酸甲酯、乙酸乙酯、乳酸乙酯等。 From a hydrazine compound containing a hydrolysis condensate (polyoxane) (A) From the viewpoint of compatibility with the inorganic particles (B) having an average particle diameter of from 1 to 100 nm, the solvent (C) is more preferably butanol, diacetone alcohol, methyl ethyl ketone, methyl isobutyl ketone, Hexanediol, methyl cellulose, ethyl cellulose, butyl cellulose, ethyl carbitol, butyl carbitol, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl Ether, propylene glycol monomethyl ether acetate, propylene glycol monobutyl ether, cyclohexanone, methyl acetate, ethyl acetate, ethyl lactate, and the like.

含有本發明之水解性矽烷(a1)與水解性矽烷 (a2)之水解性矽烷之水解縮合物的矽化合物(A)係水解性矽烷(a2)為具有碳原子數3~6之直鏈、分支或環狀 之烷基,且具有3個水解性基的水解性矽烷,以水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%之比例製造縮合物,可使重量平均分子量為700至4000。藉此,由含有矽化合物(A)、無機粒子(B)及溶劑(C)之組成物所得的膜,對於鹼溶液具有溶解顯影性,故使用感光性阻劑可形成10μm以下之圖型化,可同時滿足高折射率、高耐光性、防止感光性阻劑之內部混合。 Containing the hydrolyzable decane (a1) of the present invention and hydrolyzable decane The hydrazine compound (A) which is a hydrolysis condensate of the hydrolyzable decane of (a2) is a hydrolyzable decane (a2) which has a linear chain, a branch or a ring having 3 to 6 carbon atoms. a hydrolyzable decane having an alkyl group and having three hydrolyzable groups, having a hydrolyzable decane (a1) of from 90 mol% to 50 mol%, and a hydrolyzable decane (a2) of from 10 mol% to 50 mol% The ratio of the condensate is such that the weight average molecular weight is from 700 to 4,000. In this way, the film obtained from the composition containing the ruthenium compound (A), the inorganic particles (B), and the solvent (C) has solubility developability with respect to the alkali solution, so that the patterning of 10 μm or less can be formed by using the photosensitive resist. It can simultaneously satisfy high refractive index, high light resistance, and prevent internal mixing of photosensitive resist.

藉由規定矽化合物(A)之重量平均分子量, 規定水解性矽烷(a1)與水解性矽烷(a2)之水解縮合物中的共聚合比率,使用協和界面科學(股)製之全自動接觸角計、商品名Drop Master系列DM700,將純水由尺寸為22G的針製作液滴,以液滴法(θ/2法)算出液體附著於被膜表面之液滴之水的接觸角為60°至80°,對鹼溶液時,成為溶解顯影。 By specifying the weight average molecular weight of the ruthenium compound (A), The copolymerization ratio of the hydrolyzable decane (a1) and the hydrolyzable decane (a2) in the hydrolysis condensate is defined by a fully automatic contact angle meter manufactured by Kyowa Interface Science Co., Ltd., trade name Drop Master series DM700, and pure water is used. The needle having a size of 22 G was used to prepare droplets, and the contact angle of water in which the liquid adhered to the surface of the film was calculated by the droplet method (θ/2 method) was 60° to 80°, and when it was an alkali solution, it was dissolved and developed.

水接觸角係對於鹼溶液之溶解顯影性直接相關 之重要的膜物性,被膜之水接觸角未達60°時,成為剝離顯影,超過80°時,會排斥鹼溶液,變得不會展現顯影性。水接觸角未達60°時,矽烷醇多,親水性比較高,故鹼溶液變得易浸透至膜中。鹼溶液浸透時,被膜內在之矽化合物之矽烷醇直接接觸鹼,在溶解之前開始聚縮合,而進行高分子量化。藉由進行高分子量化,而不會變成溶解顯影而成為剝離顯影。又,水接觸角超過80°時,被膜表面之疏水性升高,而排斥鹼溶液,無法顯影,變得無法形 成圖型。 Water contact angle is directly related to the dissolution and developability of alkali solution The important film properties are such that when the water contact angle of the film is less than 60°, the film is peeled and developed. When it exceeds 80°, the alkali solution is repelled and the developability is not exhibited. When the water contact angle is less than 60°, the stanol is large and the hydrophilicity is relatively high, so that the alkali solution becomes easy to permeate into the film. When the alkali solution is impregnated, the decyl alcohol of the ruthenium compound in the film is directly contacted with the alkali, and polycondensation is started before dissolution to carry out polymerization. By performing high molecular weight measurement, it does not become dissolved and developed to be peeled and developed. Moreover, when the water contact angle exceeds 80°, the hydrophobicity of the surface of the film rises, and the alkali solution is repelled, and development cannot be performed, and it becomes invisible. Formed.

藉由控制重量平均分子量、共聚合比率、與粒 子(B)之混合比、暫時加熱溫度條件,使被膜之水的接觸角成為60°至80°,始能展現對鹼溶液之最佳的溶解顯影性。 By controlling the weight average molecular weight, the copolymerization ratio, and the grain The mixing ratio of the sub- (B) and the temporary heating temperature conditions allow the contact angle of the water of the film to be 60 to 80° to exhibit the optimum dissolution developability to the alkali solution.

本發明所用的無機粒子(B)成分為具有1至 100nm之平均粒徑的無機粒子(B),上述無機粒子(B)之折射率可選擇1.50至2.70、1.50至1.70、1.60至2.00、1.90至2.20、或2.20至2.70之範圍。 The inorganic particle (B) component used in the present invention has 1 to The inorganic particles (B) having an average particle diameter of 100 nm may have a refractive index of 1.50 to 2.70, 1.50 to 1.70, 1.60 to 2.00, 1.90 to 2.20, or 2.20 to 2.70.

與上述聚矽氧烷一同構成本發明之組成物之無機粒子(B)的種類,例如有二氧化鋯等之金屬氧化物。無機粒子可單獨使用二氧化鋯,或組合2種以上使用。 The type of the inorganic particles (B) constituting the composition of the present invention together with the above polyoxyalkylene oxide is, for example, a metal oxide such as zirconium dioxide. As the inorganic particles, zirconium dioxide may be used alone or in combination of two or more.

金屬氧化物之具體例,除二氧化鋯外,例如二氧化鋯中含有SiO2、HfO2之複合氧化物等。複合氧化物係指在粒子之製造階段,使混合2種以上之無機氧化物者。 Specific examples of the metal oxide include, in addition to zirconium dioxide, a composite oxide of SiO 2 or HfO 2 in the zirconium dioxide. The composite oxide refers to a compound in which two or more inorganic oxides are mixed at the production stage of the particles.

此外,此等之化合物可單獨使用或可組合2種以上使用,也可與上述氧化物混合使用。 Further, these compounds may be used singly or in combination of two or more kinds thereof, or may be used in combination with the above oxides.

本發明所用的無機粒子(B)成分可使用藉由動態光散射法之平均粒徑為1至100nm、5至50nm、或1至10nm之無機粒子。上述粒徑也可混合使用平均粒徑不同的粒子。 The inorganic particles (B) used in the present invention may be inorganic particles having an average particle diameter of 1 to 100 nm, 5 to 50 nm, or 1 to 10 nm by dynamic light scattering. Particles having different average particle diameters may be used in combination with the above particle diameter.

又,使用上述無機粒子(B)時,可直接使用粒子或可使用預先將粒子分散於水或有機溶劑的膠體狀態 者(膠體粒子分散於分散媒者。亦即、溶膠)。溶膠中之無機粒子的濃度可在0.1~60質量%之範圍內使用。 Further, when the inorganic particles (B) are used, the particles may be used as they are or a colloidal state in which the particles are dispersed in water or an organic solvent in advance may be used. (The colloidal particles are dispersed in the dispersion medium, that is, the sol). The concentration of the inorganic particles in the sol can be used in the range of 0.1 to 60% by mass.

將無機粒子分散於水性媒體之水溶膠的分散 媒,可使用由水取代成有機溶劑之有機溶劑溶膠。此分散媒(c2)與含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆之稀釋或取代等所用的溶劑(C)合體,作為本發明所用的溶劑(C)。 Dispersion of aqueous sols by dispersing inorganic particles in aqueous media As the medium, an organic solvent sol which is substituted with water to form an organic solvent can be used. This dispersion medium (c2) is combined with a solvent (C) used for dilution or substitution of a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polyoxyalkylene oxide), and is used as a solvent (C) used in the present invention.

因此,分散媒(c2)可使用與上述溶劑(C) 相同者。此外,也可使用將無機粒子(B)以氧化矽、有機矽化合物、有機金屬化合物等處理後的粒子。藉由氧化矽之處理係指含有無機粒子(B)之分散體中,在粒子表面使氧化矽粒子以公知的方法成長者。藉由有機矽化合物、有機金屬化合物之處理係指在含有無機粒子(B)之分散體中,添加此等之化合物,使此等之化合物、或此等之化合物之反應生成物吸附或結合於無機粒子之表面者。 Therefore, the dispersion medium (c2) can be used with the above solvent (C) The same. Further, particles obtained by treating the inorganic particles (B) with cerium oxide, an organic cerium compound, an organometallic compound or the like can also be used. The treatment by cerium oxide means that the cerium oxide particles are grown on the surface of the particles by a known method in the dispersion containing the inorganic particles (B). The treatment of the organic ruthenium compound or the organometallic compound means that the compound containing the inorganic particles (B) is added to the compound, and the reaction product of the compound or the compound is adsorbed or bonded to the reaction product. The surface of inorganic particles.

上述有機矽化合物,例如有矽烷偶合劑或矽 烷,矽烷偶合劑之具體例有乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二(三乙氧基)矽烷、3-環氧丙氧基丙基三乙氧基矽烷、p-苯乙烯基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯 氧基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基甲矽烷基-N-(1,3-二甲基-亞丁基)丙基胺、N-苯基-3-胺基丙基三甲氧基矽烷、3-氯丙基三甲氧基矽烷、3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷、雙(三乙氧基甲矽烷基丙基)四硫化物、3-異氰酸酯丙基三乙氧基矽烷等。 The above organic hydrazine compound, for example, a decane coupling agent or hydrazine Specific examples of the alkane and decane coupling agent are vinyltrichloromethane, vinyltrimethoxydecane, vinyltriethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxynonane, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethylbis(triethoxy)decane, 3-glycidoxypropyltriethoxydecane, p - Styryltrimethoxydecane, 3-methylpropenyloxypropylmethyldimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane, 3-methylpropenyloxyl Propylmethyldiethoxydecane, 3-methylpropenyloxypropyltriethoxydecane, 3-propene oxime Oxypropyltrimethoxydecane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane, N-2-(aminoethyl)-3-aminopropyl Methyltrimethoxydecane, N-2-(aminoethyl)-3-aminopropylmethyltriethoxydecane, 3-aminopropyltrimethoxydecane, 3-aminopropyl Triethoxy decane, 3-triethoxycarbamido-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxydecane, 3-chloropropyltrimethoxydecane, 3-mercaptopropylmethyldimethoxydecane, 3-mercaptopropyltrimethoxydecane, bis(triethoxycarbamidopropyl)tetrasulfide, 3 - Isocyanate propyl triethoxy decane, and the like.

又,矽烷之具體例有甲基三氯矽烷、二甲基二 氯矽烷、三甲基氯矽烷、苯基三氯矽烷、甲基三甲氧基矽烷、二甲基二甲氧基矽烷、苯基三甲氧基矽烷、甲基三乙氧基矽烷、二甲基二乙氧基矽烷、苯基三乙氧基矽烷、n-丙基三甲氧基矽烷、n-丙基三乙氧基矽烷、己基三甲氧基矽烷、己基三乙氧基矽烷、癸基三甲氧基矽烷、三氟丙基三甲氧基矽烷、六甲基二矽氮烷等。 Further, specific examples of decane include methyltrichlorodecane and dimethyldiene. Chlorodecane, trimethylchlorodecane, phenyltrichlorodecane, methyltrimethoxydecane, dimethyldimethoxydecane, phenyltrimethoxydecane, methyltriethoxydecane, dimethyldi Ethoxy decane, phenyl triethoxy decane, n-propyl trimethoxy decane, n-propyl triethoxy decane, hexyl trimethoxy decane, hexyl triethoxy decane, decyl trimethoxy Decane, trifluoropropyltrimethoxydecane, hexamethyldioxane, and the like.

上述有機金屬化合物,可舉例如鈦酸酯系偶合 劑或鋁系偶合劑,鈦酸酯系偶合劑的具體例,可舉例如商品名PLENACT KRTTS,KR46B、KR38B、KR138S、KR238S、KR338X、KR44、KR9SA、KR ET5、KR ET(Ajinomoto Fine-Techno Co.,Inc.(股)製)、鋁系偶合劑的具體例,可舉例如PLENACTAL-M(Ajinomoto Fine-Techno Co.,Inc.(股)製)等。 The above organometallic compound may, for example, be a titanate coupling Specific examples of the agent or the aluminum-based coupling agent and the titanate-based coupling agent include, for example, trade names PLENACT KRTTS, KR46B, KR38B, KR138S, KR238S, KR338X, KR44, KR9SA, KR ET5, KR ET (Ajinomoto Fine-Techno Co Specific examples of the aluminum-based coupling agent include PLENACTAL-M (Ajinomoto Fine-Techno Co., Inc., manufactured by Ajinomoto Fine-Techno Co., Inc.).

此等有機矽化合物、有機金屬化合物的使用量 相對於上述無機粒子(B)100質量份,較佳為2~100質量份。 The amount of these organic cerium compounds and organometallic compounds It is preferably 2 to 100 parts by mass based on 100 parts by mass of the inorganic particles (B).

無機粒子(B)所使用的金屬氧化物膠體粒 子,可藉由習知方法,例如離子交換法、解膠法、水解法、反應法來製造。 Metal oxide colloidal particles used for inorganic particles (B) The product can be produced by a conventional method such as an ion exchange method, a degumming method, a hydrolysis method, or a reaction method.

離子交換法例如有將上述金屬的鹽以離子交換 樹脂處理並除去對離子後生成粒子的方法。 The ion exchange method is, for example, ion exchange of a salt of the above metal A method of treating and removing particles after ion treatment.

解膠法例如有將上述金屬的鹽以酸或鹼進行中 和的方法、或從將上述金屬的烷氧化物進行水解的方法、或將上述金屬的鹼性鹽在加熱下水解所得的沈澱物或凝膠中,除去不必要之電解質的方法或添加分散所需要之離子的方法等。反應法的例,例如有將上述金屬的粉末與酸反應的方法等。 The debonding method is, for example, a case where the salt of the above metal is carried out with an acid or a base. And a method of removing unnecessary electrolytes or adding a dispersion from a method of hydrolyzing an alkoxide of the above metal or a precipitate or gel obtained by hydrolyzing a basic salt of the above metal under heating The method of ion required, etc. Examples of the reaction method include a method of reacting a powder of the above metal with an acid.

調製本發明之(被)膜形成組成物(1)的方 法無特別限定。使(A)成分、(B)成分及(C)成分為均勻混合狀態即可。混合成分(A)至成分(C)時的順序只要可得到均勻清漆則無問題,無特別限定。 Modification of the film of the present invention to form the composition (1) There is no particular limitation on the law. The component (A), the component (B), and the component (C) may be uniformly mixed. The order in which the components (A) to (C) are mixed is not particularly limited as long as a uniform varnish can be obtained.

例如有膜形成組成物(1)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒 (c2)得到溶膠的步驟,混合矽化合物(A)之清漆與無機粒子(B)之溶膠,得到含有矽化合物(A)、無機粒子(B)及溶劑(C)之膜形成組成物的步驟。 For example, there is a method for producing a film-forming composition (1), which comprises hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a solvent (c1) to obtain a weight average. a step of varnishing a compound (A) having a molecular weight of from 700 to 4,000, and dispersing the inorganic particles (B) having an average particle diameter of from 1 to 100 nm and a refractive index of from 1.50 to 2.70 by a dynamic light scattering method in a dispersion medium (c2) a step of obtaining a sol, mixing a varnish of the cerium compound (A) and a sol of the inorganic particles (B) to obtain a film-forming composition containing the cerium compound (A), the inorganic particles (B), and the solvent (C) .

調製本發明之(被)膜形成組成物(2)的方法無特別限定。使(A)成分、(B)成分、(C)成分及(D)成分為均勻混合狀態即可。混合成分(A)至成分(D)時的順序只要可得到均勻清漆則無問題,無特別限定。 The method of preparing the film-forming composition (2) of the present invention is not particularly limited. The component (A), the component (B), the component (C), and the component (D) may be uniformly mixed. The order in which the components (A) to (D) are mixed is not particularly limited as long as a uniform varnish can be obtained.

例如膜形成組成物(2)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟,混合矽化合物(A)之清漆、無機粒子(B)之溶膠及硬化觸媒(D),得到含有矽化合物(A)、無機粒子(B)、硬化觸媒(D)及溶劑(C)之膜形成組成物的步驟。 For example, a method for producing a film-forming composition (2), which comprises hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) to obtain a weight. a step of varnishing the compound (A) having an average molecular weight of 700 to 4,000. The inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70 are dispersed in a dispersion medium by a dynamic light scattering method. C2) a step of obtaining a sol, mixing a varnish of the cerium compound (A), a sol of the inorganic particles (B), and a curing catalyst (D) to obtain a cerium-containing compound (A), an inorganic particle (B), and a curing catalyst (D) And a step of forming a composition of the film of the solvent (C).

調製本發明之(被)膜形成組成物(3)的方法無特別限定。使(A)成分、(B)成分、(C)成分及(E)成分為均勻混合狀態即可。混合成分(A)、成分 (B)、成分(C)及成分(E)時的順序只要可得到均勻清漆則無問題,無特別限定。 The method of preparing the film-forming composition (3) of the present invention is not particularly limited. The component (A), the component (B), the component (C), and the component (E) may be uniformly mixed. Mixed component (A), component The order of (B), the component (C), and the component (E) is not particularly limited as long as a uniform varnish can be obtained.

例如有膜形成組成物(3)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟,混合矽化合物(A)之清漆、無機粒子(B)之溶膠及二酮化合物(E),得到含有矽化合物(A)、無機粒子(B)、二酮化合物(E)及溶劑(C)之膜形成組成物的步驟。 For example, there is a method for producing a film-forming composition (3), which comprises hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) to obtain a step of varnishing the compound (A) having a weight average molecular weight of 700 to 4,000. The inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70 are dispersed in a dispersion medium by a dynamic light scattering method. (c2) a step of obtaining a sol, mixing a varnish of the cerium compound (A), a sol of the inorganic particles (B), and a diketone compound (E) to obtain a cerium compound (A), an inorganic particle (B), and a diketone compound ( The step of forming a composition from the film of E) and solvent (C).

調製本發明之(被)膜形成組成物(3)的方法,無特別限定。只要是(A)成分、(B)成分、(C)成分及(D)成分、(F)成分及(G)成分為均勻混合的狀態即可。混合成分(A)、成分(B)、成分(C)、成分(D)成分、成分(F)、成分(G)時之順序,只要可得到均勻清漆則無問題,無特別限定。 The method of preparing the film-forming composition (3) of the present invention is not particularly limited. The components (A), (B), (C), and (D), (F), and (G) may be uniformly mixed. The order of mixing the component (A), the component (B), the component (C), the component (D) component, the component (F), and the component (G) is not particularly limited as long as a uniform varnish can be obtained.

例如有膜形成組成物(4)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子 量700至4000之矽化合物(A)之清漆的步驟, 藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟, 混合矽化合物(A)之清漆、無機粒子(B)之溶膠、硬化觸媒(D)、水(F)及酸(G),得到含有矽化合物(A)、無機粒子(B)、硬化觸媒(D)、水(F)、酸(G)及溶劑(C)之膜形成組成物的步驟。 For example, there is a method for producing a film-forming composition (4), which comprises hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1). Weight average molecule a step of varnishing the compound (A) in an amount of from 700 to 4,000, The step of dispersing the inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70 in a dispersion medium (c2) to obtain a sol by dynamic light scattering method, The varnish of the cerium compound (A), the sol of the inorganic particles (B), the curing catalyst (D), water (F) and the acid (G) are mixed to obtain a cerium compound (A), an inorganic particle (B), and a hardening contact. A step of forming a composition of a film of the medium (D), water (F), acid (G), and solvent (C).

成分(D)之硬化觸媒,可使用銨鹽、膦類、鏻鹽、鋶鹽、或金屬螯合化合物。 As the hardening catalyst of the component (D), an ammonium salt, a phosphine, a phosphonium salt, a phosphonium salt or a metal chelate compound can be used.

銨鹽例如具有式(5): (式中,p表示2~11、q表示2~3之整數,R11表示烷基、芳基、或彼等之組合,Y-表示陰離子)所示結構;具有以式(6): (式中,R12、R13、R14及R15表示烷基、芳基、或彼等之組合,N表示氮原子,Y-表示陰離子,且R12、R13、R14 及R15各自藉由C-N鍵與氮原子鍵結者)所示之結構的第4級銨鹽; 具有式(7): (式中,R16及R17表示烷基、芳基、或彼等之組合,Y-表示陰離子)之結構之第4級銨鹽、具有式(8): (式中,R18表示烷基、芳基、或彼等之組合,Y-表示陰離子)之結構之第4級銨鹽、具有式(9): (式中,R19及R20表示烷基、芳基、或彼等之組合,Y-表示陰離子)之結構的第4級銨鹽、具有式(10): (式中,p表示2~11、q表示2~3之整數,H表示氫原子,Y-表示陰離子)之結構的第3級銨鹽。 The ammonium salt has, for example, the formula (5): (wherein, p represents 2 to 11, q represents an integer of 2 to 3, R 11 represents an alkyl group, an aryl group, or a combination thereof, and Y - represents an anion); and has a formula (6): (wherein R 12 , R 13 , R 14 and R 15 represent an alkyl group, an aryl group, or a combination thereof, N represents a nitrogen atom, Y - represents an anion, and R 12 , R 13 , R 14 and R 15 a fourth-order ammonium salt of a structure each of which is bonded to a nitrogen atom by a CN bond; having the formula (7): (In the formula, R 16 and R 17 represent an alkyl group, an aryl group, or a combination thereof, and Y - represents an anion), and a fourth-order ammonium salt having the structure: (8): (In the formula, R 18 represents an alkyl group, an aryl group, or a combination thereof, and Y - represents an anion), and a fourth-order ammonium salt having the structure: (9): (In the formula, R 19 and R 20 represent an alkyl group, an aryl group, or a combination thereof, and Y - represents an anion) a fourth-order ammonium salt having the formula (10): (In the formula, p represents a second-order ammonium salt of 2 to 11, q represents an integer of 2 to 3, H represents a hydrogen atom, and Y - represents an anion).

鏻鹽例如以式(11):【化9】R21R22R23R24P+ Y- 式(11)(式中,R21、R22、R23、及R24表示烷基、芳基、或彼等之組合,P表示磷原子,Y-表示陰離子,且R21、R22、R23、及R24各自藉由C-P鍵與磷原子鍵結者)表示之第4級鏻鹽。 The onium salt is, for example, a formula (11): [Chem. 9] R 21 R 22 R 23 R 24 P + Y - Formula (11) (wherein R 21 , R 22 , R 23 , and R 24 represent an alkyl group, an aromatic group a group, or a combination thereof, wherein P represents a phosphorus atom, Y - represents an anion, and R 21 , R 22 , R 23 , and R 24 are each a terminal salt represented by a bond of a phosphorus bond with a phosphorus atom) .

又,鋶鹽例如有以式(12):【化10】R25R26R27S+ Y- 式(12)(式中,R25、R26、及R27表示烷基、芳基、或彼等之組合,S表示硫原子,Y-表示陰離子,且R25、R26、及R27各自藉由C-S鍵與硫原子鍵結者)表示之第3級鋶鹽。 Further, the onium salt is, for example, represented by the formula (12): [Chem. 10] R 25 R 26 R 27 S + Y - (12) (wherein R 25 , R 26 and R 27 represent an alkyl group, an aryl group, or of their combination, S represents a sulfur atom, Y - represents an anion, and R 25, R 26, and R 27 each represents a sulfonium salt of level 3 by CS bonds with a sulfur atom are bonded).

上述式(5)之化合物係由胺所衍生之第4級銨 鹽,p表示2~11,q表示2~3之整數。此第4級銨鹽之R11各自表示碳原子數1~18,較佳為2~10之烷基、芳基或彼等之組合,例如有乙基、丙基、丁基等之直鏈烷基、或苄基、環己基、環己基甲基、二環戊二烯基等。又,陰離子(Y-),可例舉如氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子、或羧酸根(-COO-)、硫酸根(-SO3 -)、醇鹽(alcoholate)(-O-)等之酸基。 The compound of the above formula (5) is a fourth-order ammonium salt derived from an amine, p represents 2 to 11, and q represents an integer of 2 to 3. R 11 of the fourth-order ammonium salt each represents an alkyl group having 1 to 18 carbon atoms, preferably 2 to 10, an aryl group or a combination thereof, and for example, a linear chain such as an ethyl group, a propyl group or a butyl group. An alkyl group, or a benzyl group, a cyclohexyl group, a cyclohexylmethyl group, a dicyclopentadienyl group or the like. Further, the anion (Y - ) may, for example, be a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (- An acid group such as SO 3 - ) or an alcoholate (-O - ).

上述式(6)之化合物為以R12R13R14R15N+Y- 所示的第4級銨鹽。此第4級銨鹽之R12、R13、R14及R15各自為碳原子數1~18之烷基、芳基或彼等之組合,或藉由Si-C鍵與矽原子鍵結的矽烷化合物。陰離子(Y-)例如有氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子、或羧酸根(-COO-)、硫酸根(-SO3 -)、醇鹽(-O-)等之酸基。此第4級銨鹽可以市售品取得,例如有四甲基乙酸銨、四丁基乙酸銨、氯化三乙基苄基銨、溴化三乙基苄基銨、氯化三辛基甲基銨、氯化三丁基苄基銨、氯化三甲基苄基銨等。此等可以銨化合物來添加。 The compound of the above formula (6) is a fourth-order ammonium salt represented by R 12 R 13 R 14 R 15 N + Y - . R 12 , R 13 , R 14 and R 15 of the fourth-order ammonium salt are each an alkyl group having 1 to 18 carbon atoms, an aryl group or a combination thereof, or bonded to a ruthenium atom by a Si-C bond. Decane compound. The anion (Y - ) is, for example, a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (-SO 3 - ). An acid group such as an alkoxide (-O - ). The fourth-grade ammonium salt can be obtained from commercially available products, such as ammonium tetramethylammonium acetate, tetrabutylammonium acetate, triethylbenzylammonium chloride, triethylbenzylammonium bromide, and trioctyl chloride. Alkyl ammonium, tributylbenzylammonium chloride, trimethylbenzylammonium chloride, and the like. These can be added as ammonium compounds.

上述式(7)之化合物為由1-取代咪唑所衍生 之第4級銨鹽,R16及R17為碳原子數1~18,R16及R17之碳原子數的總和為具有7以上為佳。例如R16表示甲基、乙基、丙基、苯基、苄基、藉由Si-C鍵而與矽原子鍵結的矽烷化合物,或此等之組合。R17表示例如苄基、辛基、十八基。陰離子(Y-)例如有氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子、或羧酸根(-COO- )、硫酸根(-SO3 -)、醇鹽(-O-)等之酸基。此化合物可以市售品取得,但是亦可將例如1-甲基咪唑、1-苄基咪唑等之咪唑系化合物,與溴化苄基、溴化甲基等之鹵化烷基或鹵化芳基反應來製造。又,式(7)之化合物也可作為4位與5位經氫化的4,5-二氫咪唑化合物來使用。此等可以環狀銨化合物來添加。 The compound of the above formula (7) is a fourth-order ammonium salt derived from a 1-substituted imidazole, and R 16 and R 17 have a carbon number of 1 to 18, and the sum of the number of carbon atoms of R 16 and R 17 has 7 or more. It is better. For example, R 16 represents a methyl group, an ethyl group, a propyl group, a phenyl group, a benzyl group, a decane compound bonded to a ruthenium atom by a Si-C bond, or a combination thereof. R 17 represents, for example, a benzyl group, an octyl group or an octadecyl group. The anion (Y - ) is, for example, a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (-SO 3 - ). An acid group such as an alkoxide (-O - ). This compound can be obtained as a commercial product, but an imidazole compound such as 1-methylimidazole or 1-benzylimidazole can be reacted with a halogenated alkyl group or a halogenated aryl group such as a benzyl bromide or a methyl bromide. To manufacture. Further, the compound of the formula (7) can also be used as a hydrogenated 4,5-dihydroimidazole compound at the 4-position and the 5-position. These may be added as a cyclic ammonium compound.

上述式(8)之化合物係由吡啶所衍生之第4 級銨鹽,R18各自為碳原子數1~18、較佳為碳原子數4~18之烷基、芳基、或彼等之組合,例如有丁基、辛基、苄基、月桂基。陰離子(Y-)例如有氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子,或羧酸根(-COO-)、硫酸根(-SO3 -)、醇鹽(-O-)等之酸基。此化合物可以市售品取得,但是可將例如吡啶與氯化月桂基、氯化苄基、溴化苄基、溴化甲基、溴化辛基等之鹵化烷基、或鹵化芳基反應來製造。此化合物例如有氯化N-月桂基吡啶鎓、溴化N-苄基吡啶鎓等。 The compound of the above formula (8) is a fourth-order ammonium salt derived from pyridine, and each of R 18 is an alkyl group having 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms, an aryl group, or the like. Combinations include, for example, butyl, octyl, benzyl, lauryl. The anion (Y - ) is, for example, a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (-SO 3 - ). An acid group such as an alkoxide (-O - ). This compound can be obtained from a commercial product, but for example, a pyridine can be reacted with a halogenated alkyl group such as lauryl chloride, benzyl chloride, benzyl bromide, methyl bromide or octyl bromide or a halogenated aryl group. Manufacturing. The compound is, for example, N-laurylpyridinium chloride or N-benzylpyridinium bromide.

上述式(9)之化合物係由甲吡啶等所代表之 取代吡啶所衍生之第4級銨鹽,R19各自為碳原子數1~18、較佳為4~18之烷基、芳基、或彼等之組合,例如有甲基、辛基、月桂基、苄基等。R20各自為碳原子數1~18之烷基、芳基、或彼等之組合,例如由甲吡啶所衍生之第4級銨時,R19為甲基。陰離子(Y-)例如有氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子、或羧酸根(-COO-)、硫酸根(-SO3 -)、醇鹽(-O-)等酸基。 此化合物可以市售品取得,但是可將例如甲吡啶等之取代吡啶與溴化甲基、溴化辛基、氯化月桂基、氯化苄基、溴化苄基等之鹵化烷基、或鹵化芳基產生反應來製造。此化合物例如有N-苄基甲吡啶鎓氯化物、N-苄基甲吡啶鎓溴化物、N-月桂基甲吡啶鎓氯化物等。 The compound of the above formula (9) is a fourth-order ammonium salt derived from a substituted pyridine represented by a pyridyl group or the like, and each of R 19 is an alkyl group having 1 to 18, preferably 4 to 18, an aryl group, Or a combination thereof, for example, a methyl group, an octyl group, a lauryl group, a benzyl group or the like. Each of R 20 is an alkyl group having 1 to 18 carbon atoms, an aryl group, or a combination thereof, and for example, when the fourth-order ammonium is derived from a pyridyl group, R 19 is a methyl group. The anion (Y - ) is, for example, a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (-SO 3 - ). An acid group such as an alkoxide (-O - ). This compound can be obtained as a commercial product, but a substituted alkyl group such as methylpyridine or the like, a halogenated alkyl group such as methyl bromide, octyl bromide, lauryl chloride, benzyl chloride or benzyl bromide, or The halogenated aryl group is reacted to produce. The compound is, for example, N-benzylpyridinium chloride, N-benzylpyridinium bromide, N-laurylpyridinium chloride or the like.

上述式(10)之化合物係由胺所衍生之第3級 銨鹽,p表示2~11、q表示2~3之整數。又,陰離子(Y-)例如有氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子、或羧酸根(-COO-)、硫酸根(-SO3 -)、醇鹽(-O-)等之酸基。可藉由胺與羧酸或酚等之弱酸產生反應來製造。羧酸例如有甲酸或乙酸,使用甲酸時,陰離子(Y-)為(HCOO-);使用乙酸時,陰離子(Y-)為(CH3COO-)。又,使用酚時,陰離子(Y-)為(C6H5O-)。 The compound of the above formula (10) is a third-order ammonium salt derived from an amine, p represents 2 to 11, and q represents an integer of 2 to 3. Further, the anion (Y - ) is, for example, a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (-SO 3 - ), an acid group such as an alkoxide (-O - ). It can be produced by reacting an amine with a weak acid such as a carboxylic acid or a phenol. The carboxylic acid is, for example, formic acid or acetic acid. When formic acid is used, the anion (Y - ) is (HCOO - ); when acetic acid is used, the anion (Y - ) is (CH 3 COO - ). Further, when phenol is used, the anion (Y - ) is (C 6 H 5 O - ).

上述式(11)之化合物係具有R21R22R23R24P+Y- 之結構的第4級鏻鹽。R21、R22、R23、及R24各自為碳原子數1~18之烷基、芳基、或彼等之組合、或藉由Si-C鍵結與矽原子鍵結的矽烷化合物,較佳為R21~R24之4個取代基中,3個為苯基或經取代之苯基,例如有苯基或甲苯基,剩餘1個各自為碳原子數1~18之烷基、芳基、或藉由Si-C鍵結與矽原子鍵結的矽烷化合物。又,陰離子(Y-)例如有氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子、或羧酸根(-COO-)、硫酸根(-SO3 -)、醇鹽(-O-)等之酸基。此化合物可以市售品取得,例如有鹵化 四n-丁基鏻、鹵化四n-丙基鏻等之鹵化四烷基鏻、鹵化三乙基苄基鏻等之鹵化三烷基苄基鏻、鹵化三苯基甲基鏻、鹵化三苯基乙基鏻等之鹵化三苯基單烷基鏻、鹵化三苯基苄基鏻、鹵化四苯基鏻、鹵化三甲苯基單芳基鏻、或鹵化三甲苯基單烷基鏻(鹵原子為氯原子或溴原子)。特佳為鹵化三苯基甲基鏻、鹵化三苯基乙基鏻等之鹵化三苯基單烷基鏻、鹵化三苯基苄基鏻等之鹵化三苯基單芳基鏻、鹵化三甲苯基單苯基鏻等之鹵化三甲苯基單芳基鏻、或鹵化三甲苯基單甲基鏻等之鹵化三甲苯基單烷基鏻(鹵原子為氯原子或溴原子)。 The compound of the above formula (11) is a fourth-order phosphonium salt having a structure of R 21 R 22 R 23 R 24 P + Y - . R 21 , R 22 , R 23 , and R 24 are each an alkyl group having 1 to 18 carbon atoms, an aryl group, or a combination thereof, or a decane compound bonded to a ruthenium atom by Si-C bonding, Preferably, among the four substituents of R 21 to R 24 , three are a phenyl group or a substituted phenyl group, for example, a phenyl group or a tolyl group, and the remaining one is each an alkyl group having 1 to 18 carbon atoms. An aryl group or a decane compound bonded to a ruthenium atom by Si-C bonding. Further, the anion (Y - ) is, for example, a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (-SO 3 - ), an acid group such as an alkoxide (-O - ). The compound is commercially available, and examples thereof include a tetraalkylphosphonium halide such as a tetra-n-butylphosphonium halide or a tetra-n-propylphosphonium halide, and a trialkylbenzylphosphonium halide such as a triethylbenzylphosphonium halide. a triphenylmonoalkylphosphonium halide, a triphenylbenzylphosphonium halide, a tetraphenylphosphonium halide, a tetraphenylphosphonium monoarylphosphonium halide, or the like, or a triphenylmethylphosphonium halide A trimethylphenyl monoalkyl halide (the halogen atom is a chlorine atom or a bromine atom). Particularly preferred are a triphenylmonoarylphosphonium halide such as a triphenylmethylphosphonium halide or a triphenylethylphosphonium halide, a triphenylmonoarylphosphonium halide such as a triphenylbenzylphosphonium halide, or a trimethylhalogen halide. A trimethylphenylmonoarylphosphonium halide such as a monophenylphosphonium group or a trimethylphenylmonoalkylphosphonium halide (a halogen atom is a chlorine atom or a bromine atom).

又,膦類例如有甲基膦、乙基膦、丙基膦、異 丙基膦、異丁基膦、苯基膦等之第一膦、二甲基膦、二乙基膦、二異丙基膦、二異戊基膦、二苯基膦等之第二膦、三甲基膦、三乙基膦、三苯基膦、甲基二苯基膦、二甲基苯基膦等之第三膦。 Further, the phosphines are, for example, methylphosphine, ethylphosphine, propylphosphine or the like. a second phosphine such as a first phosphine such as propylphosphine, isobutylphosphine or phenylphosphine, dimethylphosphine, diethylphosphine, diisopropylphosphine, diisopentylphosphine or diphenylphosphine; A third phosphine such as trimethylphosphine, triethylphosphine, triphenylphosphine, methyldiphenylphosphine or dimethylphenylphosphine.

上述式(12)之化合物係具有R25R26R27S+Y- 之結構的第3級鋶鹽。R25、R26、及R27各自為碳原子數1~18之烷基、芳基、或彼等之組合、或藉由Si-C鍵結與矽原子鍵結的矽烷化合物,較佳為R25~R27之4個取代基中3個為苯基或經取代之苯基,例如有苯基或甲苯基,剩餘1個各自為碳原子數1~18之可被取代之烷基、芳基、或彼等之組合。又,陰離子(Y-)例如有氯離子(Cl-)、溴離子(Br-)、碘離子(I-)等之鹵離子、或羧酸根(-COO-)、硫酸根(-SO3 -)、醇鹽(-O-)等之酸基。此化 合物可以市售品取得,例如有鹵化三n-丁基鋶、鹵化三n-丙基鋶等之鹵化四烷基鏻、鹵化二乙基苄基鋶等之鹵化三烷基苄基鋶、鹵化二苯基甲基鋶、鹵化二苯基乙基鋶等之鹵化二苯基單烷基鋶、鹵化三苯基鋶(鹵原子為氯原子或溴原子)、三n-丁基鋶羧酸酯、三n-丙基鋶羧酸酯等之四烷基鏻羧酸酯、二乙基苄基鋶羧酸酯等之三烷基苄基鋶羧酸酯、二苯基甲基鋶羧酸酯、二苯基乙基鋶羧酸酯等之二苯基單烷基鋶羧酸酯、三苯基鋶羧酸酯、三苯基鋶三氟甲烷磺酸酯等。特佳為鹵化三苯基鋶、三苯基鋶羧酸酯。此等可以鋶化合物來添加。 The compound of the above formula (12) is a third-order phosphonium salt having a structure of R 25 R 26 R 27 S + Y - . R 25 , R 26 and R 27 are each an alkyl group having 1 to 18 carbon atoms, an aryl group, or a combination thereof, or a decane compound bonded to a ruthenium atom by Si-C bonding, preferably 3 of the 4 substituents of R 25 to R 27 are a phenyl group or a substituted phenyl group, for example, a phenyl group or a tolyl group, and the remaining one is an alkyl group which may be substituted with 1 to 18 carbon atoms, An aryl group, or a combination thereof. Further, the anion (Y - ) is, for example, a halide ion such as a chloride ion (Cl - ), a bromide ion (Br - ), an iodide ion (I - ), or a carboxylate (-COO - ) or a sulfate (-SO 3 - ), an acid group such as an alkoxide (-O - ). The compound is commercially available, and examples thereof include a halogenated trialkylsulfonium halide such as a tri-n-butylphosphonium halide or a tri-n-propylphosphonium halide; and a trialkylbenzylphosphonium halide such as a diethylbenzylphosphonium halide; a halogenated diphenylmonoalkylphosphonium halide such as diphenylmethylguanidinium halide or diphenylethylphosphonium halide; a triphenylphosphonium halide (a halogen atom is a chlorine atom or a bromine atom), and a tri-n-butylphosphonium carboxylic acid. a trialkyl hydrazine carboxylic acid ester such as an ester, a tri-n-propyl hydrazine carboxylate or a trialkyl hydrazine carboxylic acid ester such as diethyl benzyl hydrazine carboxylate or a diphenylmethyl hydrazine carboxylic acid. a diphenylmonoalkylphosphonium carboxylate such as an ester or a diphenylethylphosphonium carboxylate; a triphenylsulfonium carboxylate; a triphenylsulfonium trifluoromethanesulfonate; Particularly preferred are triphenylsulfonium halides and triphenylsulfonium carboxylates. These can be added as a compound.

金屬螯合化合物例如有三乙氧基‧單(乙醯基 丙酮)鈦、三-n-丙氧基‧單(乙醯基丙酮)鈦、三異丙氧基‧單(乙醯基丙酮)鈦、三-n-丁氧基‧單(乙醯基丙酮)鈦、三-sec-丁氧基‧單(乙醯基丙酮)鈦、三-t-丁氧基‧單(乙醯基丙酮)鈦、二乙氧基‧雙(乙醯基丙酮)鈦、二-n-丙氧基‧雙(乙醯基丙酮)鈦、二異丙氧基‧雙(乙醯基丙酮)鈦、二-n-丁氧基‧雙(乙醯基丙酮)鈦、二-sec-丁氧基‧雙(乙醯基丙酮)鈦、二-t-丁氧基‧雙(乙醯基丙酮)鈦、單乙氧基‧參(乙醯基丙酮)鈦、單-n-丙氧基‧參(乙醯基丙酮)鈦、單異丙氧基‧參(乙醯基丙酮)鈦、單-n-丁氧基‧參(乙醯基丙酮)鈦、單-sec-丁氧基‧參(乙醯基丙酮)鈦、單-t-丁氧基‧參(乙醯基丙酮)鈦、肆(乙醯基丙酮)鈦、三乙氧基‧單(乙基乙醯乙酸)鈦、三-n-丙氧基‧單(乙基乙醯乙酸)鈦、三異 丙氧基‧單(乙基乙醯乙酸)鈦、三-n-丁氧基‧單(乙基乙醯乙酸)鈦、三-sec-丁氧基‧單(乙基乙醯乙酸)鈦、三-t-丁氧基‧單(乙基乙醯乙酸)鈦、二乙氧基‧雙(乙基乙醯乙酸)鈦、二-n-丙氧基‧雙(乙基乙醯乙酸)鈦、二異丙氧基‧雙(乙基乙醯乙酸)鈦、二-n-丁氧基‧雙(乙基乙醯乙酸)鈦、二-sec-丁氧基‧雙(乙基乙醯乙酸)鈦、二-t-丁氧基‧雙(乙基乙醯乙酸)鈦、單乙氧基‧參(乙基乙醯乙酸)鈦、單-n-丙氧基‧參(乙基乙醯乙酸)鈦、單異丙氧基‧參(乙基乙醯乙酸)鈦、單-n-丁氧基‧參(乙基乙醯乙酸)鈦、單-sec-丁氧基‧參(乙基乙醯乙酸)鈦、單-t-丁氧基‧參(乙基乙醯乙酸)鈦、肆(乙基乙醯乙酸)鈦、單(乙醯基丙酮)參(乙基乙醯乙酸)鈦、雙(乙醯基丙酮)雙(乙基乙醯乙酸)鈦、參(乙醯基丙酮)單(乙基乙醯乙酸)鈦、等之鈦螯合化合物;三乙氧基‧單(乙醯基丙酮)鋯、三-n-丙氧基‧單(乙醯基丙酮)鋯、三異丙氧基‧單(乙醯基丙酮)鋯、三-n-丁氧基‧單(乙醯基丙酮)鋯、三-sec-丁氧基‧單(乙醯基丙酮)鋯、三-t-丁氧基‧單(乙醯基丙酮)鋯、二乙氧基‧雙(乙醯基丙酮)鋯、二-n-丙氧基‧雙(乙醯基丙酮)鋯、二異丙氧基‧雙(乙醯基丙酮)鋯、二-n-丁氧基‧雙(乙醯基丙酮)鋯、二-sec-丁氧基‧雙(乙醯基丙酮)鋯、二-t-丁氧基‧雙(乙醯基丙酮)鋯、單乙氧基‧參(乙醯基丙酮)鋯、單-n-丙氧基‧參(乙醯基丙酮)鋯、單異丙氧基‧參(乙醯基丙酮)鋯、單-n-丁氧 基‧參(乙醯基丙酮)鋯、單-sec-丁氧基‧參(乙醯基丙酮)鋯、單-t-丁氧基‧參(乙醯基丙酮)鋯、肆(乙醯基丙酮)鋯、三乙氧基‧單(乙基乙醯乙酸)鋯、三-n-丙氧基‧單(乙基乙醯乙酸)鋯、三異丙氧基‧單(乙基乙醯乙酸)鋯、三-n-丁氧基‧單(乙基乙醯乙酸)鋯、三-sec-丁氧基‧單(乙基乙醯乙酸)鋯、三-t-丁氧基‧單(乙基乙醯乙酸)鋯、二乙氧基‧雙(乙基乙醯乙酸)鋯、二-n-丙氧基‧雙(乙基乙醯乙酸)鋯、二異丙氧基‧雙(乙基乙醯乙酸)鋯、二-n-丁氧基‧雙(乙基乙醯乙酸)鋯、二-sec-丁氧基‧雙(乙基乙醯乙酸)鋯、二-t-丁氧基‧雙(乙基乙醯乙酸)鋯、單乙氧基‧參(乙基乙醯乙酸)鋯、單-n-丙氧基‧參(乙基乙醯乙酸)鋯、單異丙氧基‧參(乙基乙醯乙酸)鋯、單-n-丁氧基‧參(乙基乙醯乙酸)鋯、單-sec-丁氧基‧參(乙基乙醯乙酸)鋯、單-t-丁氧基‧參(乙基乙醯乙酸)鋯、肆(乙基乙醯乙酸)鋯、單(乙醯基丙酮)參(乙基乙醯乙酸)鋯、雙(乙醯基丙酮)雙(乙基乙醯乙酸)鋯、參(乙醯基丙酮)單(乙基乙醯乙酸)鋯等之鋯螯合化合物;參(乙醯基丙酮)鋁、參(乙基乙醯乙酸)鋁等之鋁螯合化合物;等。 Metal chelating compounds such as triethoxy ‧ mono Acetone) Titanium, tri-n-propoxy ‧ mono(ethinyl acetonide) titanium, triisopropoxy ‧ mono (acetoxyacetone) titanium, tri-n-butoxy ‧ single (acetamidacetone) Titanium, tris-s-butoxy ‧ mono(ethinyl acetonide) titanium, tri-t-butoxy ‧ mono (acetoxyacetone) titanium, diethoxy ‧ bis (ethyl decyl acetonate) titanium , bis-n-propoxy bis(ethinyl acetonate) titanium, diisopropoxy bis bis(acetic acetoxy) titanium, di-n-butoxy bis bis(ethinyl acetonate) titanium, Di-sec-butoxy bis(ethinylacetone) titanium, di-t-butoxy bis bis(acetic acetone) titanium, monoethoxy ‧ cis (acetyl acetonide) titanium, single - N-propoxy ‧ cis (acetonitrile) titanium, monoisopropoxy ‧ cis (acetoxime) titanium, mono-n-butoxy ‧ cis (acetonitrile) titanium, single-sec - Butoxy oxynphthyl (ethinyl acetonide) titanium, mono-t-butoxy ‧ cis (acetoxyacetone) titanium, ruthenium (acetonitrile) titanium, triethoxy ‧ single (ethyl ethyl Indoleacetic acid) titanium, tri-n-propoxy ‧ mono (ethyl acetonitrile) titanium, three different Propoxy ‧ mono (ethyl acetonitrile ) titanium, tri-n-butoxy ‧ mono (ethyl acetonitrile ) titanium, tri-sec-butoxy ‧ mono (ethyl acetonitrile ) titanium, Tri-t-butoxy ‧ mono (ethyl acetonitrile ) titanium, diethoxy bis (ethyl acetonitrile ) titanium, di-n-propoxy bis (ethyl acetonitrile ) titanium , diisopropoxy ‧ bis(ethyl acetoacetate) titanium, di-n-butoxy bis (ethyl acetonitrile) titanium, di-sec-butoxy bis (ethyl acetamidine acetate Titanium, di-t-butoxy bis (ethyl acetoacetate) titanium, monoethoxy ‧ gin (ethyl acetoacetate) titanium, mono-n-propoxy ‧ gin (ethyl acetamidine) Acetic acid) titanium, monoisopropoxy ‧ cis (ethyl acetoacetate) titanium, mono-n-butoxy ‧ cis (ethyl acetoacetate) titanium, mono-sec-butoxy ‧ gin (ethyl Ethylene acetate) titanium, mono-t-butoxy ‧ cis (ethyl acetoacetate) titanium, strontium (ethyl acetoacetate) titanium, mono (acetyl acetonide) ginseng (ethyl acetoacetate) titanium , bis(ethylmercaptoacetone) bis(ethylacetamidineacetic acid) titanium, ginseng (ethionylacetone) mono(ethylacetamidineacetic acid) titanium, titanium chelating compounds, etc.; triethoxy ‧ single (B Mercaptoacetone) zirconium, tri-n-propyl Zirconium mono(acetonitrile)zirconium, triisopropoxy ‧ mono(ethinyl acetonide) zirconium, tri-n-butoxy ‧ mono (acetyl ketone) zirconium, tri-sec-butoxy ‧Single (acetonitrile)zirconium, tris-t-butoxy ‧ mono(ethinyl acetonide) zirconium, diethoxy bis (acetyl acetonide) zirconium, di-n-propoxy ‧ double (Ethyl mercaptoacetate) zirconium, diisopropoxy ‧ bis(ethyl decyl acetonide) zirconium, di-n-butoxy bis bis(ethyl decyl acetonate ) zirconium, di-sec-butoxy ‧ double Ethyl acetonide) zirconium, zirconium di-t-butoxy bis(ethyl decyl acetonate), zirconium monoethoxy phenanthrene (ethinyl acetonide), mono-n-propoxy quinone Zirconium, monoisopropoxy ‧ ginseng (acetonitrile) zirconium, mono-n-butoxy Zirconium (acetyl acetoacetate) zirconium, mono-sec-butoxy ‧ cis (ethinyl acetonide) zirconium, mono-t-butoxy ‧ ginsyl (ethenyl acetonide) zirconium, cerium (ethenyl) Acetone, zirconium, triethoxy, mono(ethylacetamidineacetic acid) zirconium, tri-n-propoxy ‧ mono(ethylacetamidineacetic acid) zirconium, triisopropoxy ‧ mono (ethyl acetoacetic acid Zirconium, tri-n-butoxy ‧ mono (ethyl acetamidine acetic acid) zirconium, tri-sec-butoxy ‧ mono (ethyl acetoacetate) zirconium, tri-t-butoxy ‧ single (B) Ethylene acetoacetate) zirconium, diethoxy bis (ethyl acetonitrile) zirconium, di-n-propoxy bis (ethyl acetonitrile) zirconium, diisopropoxy ‧ bis (ethyl Ethylene acetate) zirconium, di-n-butoxy bis(ethylacetamidineacetic acid) zirconium, di-sec-butoxy bis (ethyl acetonitrile) zirconium, di-t-butoxy ‧ Zirconium bis(ethylacetamidineacetate), zirconium monoethoxy phenate (ethyl acetoacetate), zirconium mono-n-propoxy ‧ cis (ethyl acetoacetate), monoisopropoxy ‧ (Ethylacetamidineacetic acid) zirconium, mono-n-butoxy ‧ cis (ethyl acetoacetate) zirconium, mono-sec-butoxy ‧ ginsyl (ethyl acetoacetate) zirconium, mono-t-butyl Oxygen ginseng (ethyl acetoacetate) zirconium, hafnium (B Ethylene acetate) zirconium, mono(ethylideneacetone) ginseng (ethyl acetoacetate) zirconium, bis(ethyl decyl acetonate) bis(ethyl acetonitrile) zirconium, ginseng (ethyl acetonide) single (B) a zirconium chelate compound such as zirconium acetate; zirconium or the like; an aluminum chelate compound such as aluminum (e, acetonitrile) aluminum or ginseng (ethyl acetoacetate);

硬化觸媒(D)成分之添加量係相對於矽化合 物(A)成分100質量份,為0.01~10質量份、0.01~5質量份、或0.01~3質量份。硬化觸媒(D)展現完全水解型之聚矽氧烷之矽化合物(A)的鹼顯影性,此外,為了控制之目的被添加,添加量少於0.01質量份時,有時膜在鹼 顯影液中,完全溶解,多於10質量份時,硬化過度進行,有時無法形成圖型。 The addition amount of the hardening catalyst (D) component is relative to the bismuth compound 100 parts by mass of the component (A) is 0.01 to 10 parts by mass, 0.01 to 5 parts by mass, or 0.01 to 3 parts by mass. The hardening catalyst (D) exhibits the alkali developability of the ruthenium compound (A) of the fully hydrolyzed polyoxyalkylene, and is added for the purpose of control, and when the amount is less than 0.01 parts by mass, the film may be in the base. When the developer is completely dissolved in the developer, if it is more than 10 parts by mass, the hardening proceeds excessively, and the pattern may not be formed.

本發明之(E)成分係作為氫鍵性膜粗糙防止 材機能的二酮化合物。作為氫鍵性膜粗糙防止材機能的二酮化合物係指存在於矽化合物(A)及無機粒子(B)之羥基與清漆中或暫時乾燥時,形成氫鍵的化合物。形成氫鍵時,可抑制感光性阻劑之再塗佈時及阻劑膜剝離時之膜粗糙。 The component (E) of the present invention is used as a hydrogen bond film roughening prevention A functional diketone compound. The diketone compound which functions as a hydrogen bond film roughening prevention material is a compound which forms a hydrogen bond when it exists in the hydroxy group of the hydrazine compound (A) and inorganic particle (B), and a varnish, or drying. When a hydrogen bond is formed, film roughening at the time of recoating of the photosensitive resist and peeling of the resist film can be suppressed.

二酮化合物(E)例如有1,2-二酮及/或1,3-二 酮。二酮化合物(E)具有式(3)及/或式(4)表示之部分結構。式(3)中,W表示碳原子或氧原子。 The diketone compound (E) is, for example, a 1,2-diketone and/or a 1,3-di ketone. The diketone compound (E) has a partial structure represented by the formula (3) and/or the formula (4). In the formula (3), W represents a carbon atom or an oxygen atom.

作為氫鍵性膜粗糙防止材機能的二酮化合物 (E),從操作性的觀點,較佳為23℃、大氣壓下為液體,具有上述化合物(3)所示之基本骨架的化合物。 Diketone compound as a function of hydrogen bond film roughness preventing material (E) From the viewpoint of workability, a compound having a basic skeleton represented by the above compound (3) is preferably a liquid at 23 ° C under atmospheric pressure.

上述(E)成分之具體例,例如有乙醯基丙 酮、3-乙基-2,4-戊二酮、3-乙基-2,4-戊二酮、二(三甲基乙醯基)甲烷、2,6-二甲基-3,5-庚二酮、6-甲基-2,4-庚二酮、丙酮酸甲酯、丙酮酸乙酯、丁二酮、3,4-己二酮、2,3-戊二酮、2,3-庚二酮、5-甲基-2,3-己二酮等。上述(E)成分為式(3)的情形,具有部分結構O=C-C=O鍵結,式(4)的情形,具有部分結構O=C-C-C=O鍵結即可,無特別限定者。此等之部分結構係藉由存在於矽化合物(A)及無機粒子(B)之羥基與氫鍵,剝離感光性阻劑時,可抑制膜粗糙。 Specific examples of the above component (E), for example, ethyl acetonitrile Ketone, 3-ethyl-2,4-pentanedione, 3-ethyl-2,4-pentanedione, bis(trimethylethenyl)methane, 2,6-dimethyl-3,5 -heptanedione, 6-methyl-2,4-heptanedione, methyl pyruvate, ethyl pyruvate, butanedione, 3,4-hexanedione, 2,3-pentanedione, 2, 3-heptanedione, 5-methyl-2,3-hexanedione, and the like. In the case where the component (E) is in the formula (3), it has a partial structure O=C-C=O bond, and in the case of the formula (4), it may have a partial structure O=C-C-C=O bond, and is not particularly limited. Some of these structures are capable of suppressing film roughness when the photosensitive resin is removed by the hydroxyl group and the hydrogen bond present in the ruthenium compound (A) and the inorganic particles (B).

二酮化合物(E)較佳為例如有丁二酮、丙酮 酸甲酯、丙酮酸乙酯、乙醯基丙酮。 The diketone compound (E) is preferably, for example, diacetyl or acetone. Methyl ester, ethyl pyruvate, acetonitrile.

二酮化合物(E)成分之添加量係相對於矽化 合物(A)成分100質量份,為1~10000質量份、100~5000質量份、或500~2000質量份,較佳為100~5000質量份、更佳為500~2000質量份。 The amount of the diketone compound (E) added is relative to the deuteration 100 parts by mass of the component (A) is from 1 to 10,000 parts by mass, from 100 to 5,000 parts by mass, or from 500 to 2,000 parts by mass, preferably from 100 to 5,000 parts by mass, more preferably from 500 to 2,000 parts by mass.

水(F)成分較佳為離子交換水。使用一般的 自來水時,會將自來水中所含的鈉離子、鉀離子、氯離子等帶入清漆中,使聚矽氧烷之保管安定性惡化,有時會損及均勻的清漆品質。水(F)成分在含有水(F)與溶劑(C)之全溶劑中的比例必須為6質量%至18質量%。 The water (F) component is preferably ion-exchanged water. Use general In the case of tap water, sodium ions, potassium ions, chloride ions, and the like contained in the tap water are brought into the varnish to deteriorate the storage stability of the polyoxyalkylene, which may impair the uniform varnish quality. The proportion of the water (F) component in the total solvent containing water (F) and solvent (C) must be 6 mass% to 18 mass%.

(F)成分之全溶劑中之比例未達6質量% 時,有時會損及保管安定性,超過18質量%時,有時會使塗佈性惡化。水(F)成分之較佳的添加量為全溶劑中之比例為8質量%至16質量%、更佳為10質量%至14質量%。 The proportion of the total solvent of the component (F) is less than 6% by mass In some cases, the storage stability may be impaired, and when it exceeds 18% by mass, the coatability may be deteriorated. The water (F) component is preferably added in an amount of from 8 to 16% by mass, more preferably from 10 to 14% by mass, based on the total solvent.

酸(G)成分係分子內含有1至2個的羧基,可使最終的膜形成組成物(清漆)之pH為3至5的酸。 The acid (G) component contains 1 to 2 carboxyl groups in the molecule, and the final film can be formed into an acid having a pH of 3 to 5 of the composition (varnish).

酸(G)之添加量係將膜形成組成物(清漆)調整為pH3至5之量可添加於膜形成組成物(清漆)中。 The amount of the acid (G) to be added is adjusted to a pH of 3 to 5 by the film-forming composition (varnish), and may be added to the film-forming composition (varnish).

成分(G)之具體例,例如有乙酸、丙酸、丁酸、戊酸、己酸、庚酸、辛酸、壬酸、癸酸、草酸、馬來酸、甲基丙二酸、己二酸、癸二酸、没食子酸、丁酸、苯六甲酸、花生四烯酸、2-乙基己酸、油酸、硬脂酸、亞麻 油酸、次亞麻酸、水楊酸、苯甲酸、p-胺基苯甲酸、p-甲苯磺酸、苯磺酸、單氯乙酸、二氯乙酸、三氯乙酸、三氟乙酸、甲酸、丙二酸、磺酸、苯二甲酸、富馬酸、檸檬酸、酒石酸等。藉由使最終的膜形成組成物(清漆)之pH為3至5,可提高存在於完全水解型之聚矽氧烷之末端的矽烷醇之安定性。最終的清漆之pH為3至5,較佳為pH4附近。藉由使膜形成組成物(清漆)之pH為4,矽烷醇之安定性成為最佳已為人知。從使最終的膜形成組成物(清漆)之pH為4的觀點,成分(G)特佳為甲酸、乙酸、丙酸、草酸、馬來酸。 Specific examples of the component (G) include, for example, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, heptanoic acid, caprylic acid, capric acid, capric acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid. , azelaic acid, gallic acid, butyric acid, mellitic acid, arachidonic acid, 2-ethylhexanoic acid, oleic acid, stearic acid, flax Oleic acid, linolenic acid, salicylic acid, benzoic acid, p-aminobenzoic acid, p-toluenesulfonic acid, benzenesulfonic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoroacetic acid, formic acid, C Diacid, sulfonic acid, phthalic acid, fumaric acid, citric acid, tartaric acid, and the like. By setting the pH of the final film-forming composition (varnish) to 3 to 5, the stability of the stanol present at the end of the fully hydrolyzed polyoxyalkylene can be improved. The final varnish has a pH of from 3 to 5, preferably near pH 4. It is known that the stability of the stanol is optimized by setting the pH of the film-forming composition (varnish) to 4. From the viewpoint of setting the pH of the final film-forming composition (varnish) to 4, the component (G) is particularly preferably formic acid, acetic acid, propionic acid, oxalic acid or maleic acid.

將上述成分(F)與成分(G)添加於清漆 中,可大幅提高5℃至23℃之膜形成組成物(清漆)之保管安定性,可長期提供良好的被膜。 Adding the above component (F) and component (G) to the varnish Among them, the storage stability of the film-forming composition (varnish) of 5 ° C to 23 ° C can be greatly improved, and a good film can be provided for a long period of time.

膜形成組成物之固體成分中,含有矽化合物 (A)、無機粒子(B)、硬化觸媒(D)、二酮化合物(E)、酸(G),但是也可含有上述以外的成分。 a solid component of the film-forming composition containing a ruthenium compound (A), inorganic particles (B), a curing catalyst (D), a diketone compound (E), and an acid (G), but may contain components other than the above.

本發明中,在不損及本發明效果的範圍內,除 成分(A)、成分(B)、成分(C)、成分(D)、成分(E)、成分(F)、成分(G)外,也可含有其他的成分,例如平坦劑、界面活性劑等之成分。 In the present invention, in addition to not impairing the effects of the present invention, In addition to the component (A), the component (B), the component (C), the component (D), the component (E), the component (F), and the component (G), other components such as a flat agent or a surfactant may be contained. Ingredients.

界面活性劑例如有聚氧乙烯月桂醚、聚氧乙烯 硬脂醚、聚氧乙烯十六醚、聚氧乙烯油醚等之聚氧乙烯烷醚類、聚氧乙烯辛基酚醚、聚氧乙烯壬基酚醚等之聚氧乙烯烷基烯丙基醚類、聚氧乙烯‧聚氧丙烯嵌段共聚物類、 山梨醇酐單月桂酸酯、山梨醇酐單棕櫚酸酯、山梨醇酐單硬脂酸酯、山梨醇酐單油酸酯、山梨醇酐三油酸酯、山梨醇酐三硬脂酸酯等之山梨醇酐脂肪酸酯類、聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單棕櫚酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐三油酸酯、聚氧乙烯山梨醇酐三硬脂酸酯等之聚氧乙烯山梨醇酐脂肪酸酯類等之非離子系界面活性劑、商品名Eftop(註冊商標)EF301、EF303、EF352((股)TOHKEM PRODUCTS製)、商品名MegafacF171、F173、F-553、F-554、R-08、R-30、R-30-N(大日本油墨化學工業(股)製)、Fluorad FC430、FC431(住友3M(股)製)、商品名AsahiguardAG710,SurflonS-382、SC101、SC102、SC103、SC104、SC105、SC106(旭硝子(股)製)等之氟系界面活性劑、及有機矽氧烷聚合物KP341(信越化學工業(股)製)、BYK-302、BYK-307、BYK-322、BYK-323、BYK-330、BYK-333、BYK-370、BYK-375、BYK-378(BYK-Chemie Japan(股)製)等。此等之界面活性劑可單獨使用或可組合2種以上使用。使用界面活性劑時,其比例係相對於矽化合物(A)100質量份,為0.0001~5質量份、0.001~1質量份、或0.01~0.5質量份。 Surfactants such as polyoxyethylene lauryl ether, polyoxyethylene Polyoxyethylene alkyl allyl groups such as polyoxyethylene alkyl ethers such as stearyl ether, polyoxyethylene hexadecyl ether, and polyoxyethylene oleyl ether, polyoxyethylene octyl phenol ether, polyoxyethylene nonyl phenol ether, and the like Ethers, polyoxyethylene ‧ polyoxypropylene block copolymers, Sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan tristearate, etc. Sorbitol fatty acid esters, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan oil Nonionic surfactant such as polyoxyethylene sorbitan fatty acid ester such as acid ester or polyoxyethylene sorbitan tristearate, trade name Eftop (registered trademark) EF301, EF303, EF352 ((share) TOHKEM PRODUCTS), trade names Megafac F171, F173, F-553, F-554, R-08, R-30, R-30-N (made by Dainippon Ink Chemical Industry Co., Ltd.), Fluorad FC430, FC431 (Sumitomo a 3M (stock) system, a trade name of Asahiguard AG710, Surflon S-382, SC101, SC102, SC103, SC104, SC105, SC106 (made by Asahi Glass Co., Ltd.), a fluorine-based surfactant, and an organic siloxane polymer KP341 ( Shin-Etsu Chemical Industry Co., Ltd., BYK-302, BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-370, BYK-375, BYK- 378 (BYK-Chemie Japan). These surfactants may be used singly or in combination of two or more. When the surfactant is used, the ratio thereof is 0.0001 to 5 parts by mass, 0.001 to 1 part by mass, or 0.01 to 0.5 part by mass based on 100 parts by mass of the hydrazine compound (A).

混合上述其他的成分、溶劑、平坦劑或界面 活性劑的方法係將無機粒子(B)及溶劑(C)添加於矽化合物(A),同時也可在成分(A)至成分(C)混合後,無特別限定。 Mix the above other ingredients, solvents, flat agents or interfaces In the method of the active agent, the inorganic particles (B) and the solvent (C) are added to the hydrazine compound (A), and the components (A) to (C) are not particularly limited.

<被膜之形成> <Formation of film>

本發明之膜形成組成物藉由塗佈於基材,經熱硬化可得到所期望的被膜。塗佈方法可採用公知或周知的方法。 可採用例如旋轉塗佈法、浸漬法、淋塗法、噴墨法、噴霧法、棒塗法、凹版塗佈法、狹縫塗佈法、輥塗佈法、轉印印刷法、刷毛塗佈法、刀塗佈法、氣刀塗佈法等的方法。 此時使用的基材可舉例如矽、銦錫氧化物(ITO)、銦鋅氧化物(IZO)、聚對苯二甲酸乙二酯(PET)、三乙醯基纖維素(TAC)、聚乙烯(PE)、離子聚合物(IO)、聚醯亞胺(PI)、聚醯胺(PA)、聚氯乙烯(PVC)、聚環烯烴(PCO)、聚偏二氯乙烯(PVDC)、聚乙烯醇(PVA)、聚丙烯(PP)、聚碳酸酯(PC)、聚苯乙烯(PS)、聚丙烯腈(PAN)、乙烯乙酸乙烯酯共聚物(EVA)、乙烯乙烯醇共聚物(EVOH)、乙烯甲基丙烯酸共聚物(EMMA)、聚甲基丙烯酸(PMMA)、尼龍、塑膠、玻璃、藍寶石、石英、金鋼石、陶瓷、鋁鎵砷(AlGaAs)、鎵砷磷(GaAsP)、銦氮化鎵(InGaN)、氮化鎵(GaN)、鋁氮化鎵(AlGaN)、磷化鎵(GaP)、硒化鋅(ZnSe)、鋁銦鎵磷(AlGaInP)、氧化鋅(ZnO)等所構成之基材。 The film-forming composition of the present invention can be applied to a substrate to be thermally cured to obtain a desired film. The coating method can be carried out by a known or well-known method. For example, a spin coating method, a dipping method, a shower coating method, an inkjet method, a spray method, a bar coating method, a gravure coating method, a slit coating method, a roll coating method, a transfer printing method, and a brush coating method can be employed. Methods such as a method, a knife coating method, and an air knife coating method. The substrate used at this time may, for example, be ruthenium, indium tin oxide (ITO), indium zinc oxide (IZO), polyethylene terephthalate (PET), triethylenesulfonyl cellulose (TAC), poly Ethylene (PE), ionic polymer (IO), polyimine (PI), polydecylamine (PA), polyvinyl chloride (PVC), polycycloolefin (PCO), polyvinylidene chloride (PVDC), Polyvinyl alcohol (PVA), polypropylene (PP), polycarbonate (PC), polystyrene (PS), polyacrylonitrile (PAN), ethylene vinyl acetate copolymer (EVA), ethylene vinyl alcohol copolymer ( EVOH), ethylene methacrylic acid copolymer (EMMA), polymethacrylic acid (PMMA), nylon, plastic, glass, sapphire, quartz, diamond, ceramic, aluminum gallium arsenide (AlGaAs), gallium arsenide phosphorus (GaAsP) , InGaN, InGaN, GaN, AlGaN, GaP, Zinc Selenide, AlGaInP, Zinc Oxide ) a substrate formed by the like.

加熱機器無特別限定,例如使用加熱板、烤 箱、冶爐,在適當的氣氛下,即大氣、氮等的惰性氣體、真空中等加熱即可。藉此,可得到具有均勻製膜面的被 膜。 The heating machine is not particularly limited, for example, using a hot plate, grilling The tank and the furnace are heated under an appropriate atmosphere, that is, an inert gas such as the atmosphere or nitrogen, or a vacuum. Thereby, a quilt having a uniform film forming surface can be obtained membrane.

加熱溫度係使溶劑蒸發為目的,無特別限 定,例如可在40~200℃下進行。此等情形時,為了展現更高均勻製膜性,或使在基材上進行反應等目的,可有2階段以上之溫度變化。 Heating temperature is the purpose of evaporating the solvent, no special limit For example, it can be carried out at 40 to 200 ° C. In these cases, in order to exhibit higher uniform film forming properties or to carry out a reaction on a substrate, there may be a temperature change of two or more stages.

加熱溫度及加熱時間選擇適合目的之電子裝 置之製程步驟的條件即可,聚矽氧烷被膜之物性值可選擇適合電子裝置之要求特性的加熱條件。 Heating temperature and heating time select the appropriate electronic equipment The conditions of the process steps may be set, and the physical properties of the polyoxane film may be selected to suit the desired characteristics of the electronic device.

含有本發明之水解縮合物(聚矽氧烷)之矽 化合物(A)、無機粒子(B)、溶劑(C)、成分(D)、成分(E)、成分(F)、成分(G)的膜形成用組成物,較佳為將此等各成分混合(hybrid)化所成之膜形成組成物(清漆)成為均勻分散液者。 含有 containing the hydrolysis condensate (polyoxane) of the present invention The film-forming composition of the compound (A), the inorganic particles (B), the solvent (C), the component (D), the component (E), the component (F), and the component (G) is preferably such a component. The film-forming composition (varnish) formed by the hybridization becomes a uniform dispersion.

在此,混合化係指廣義上混合不同性質的溶 質,以溶液狀態混合,其中不同溶質彼此在化學或物理上可具有或不具有相互作用,只要保持分散性即可。 Here, mixing refers to the mixing of different properties in a broad sense. The mass is mixed in a solution state in which the different solutes may or may not have chemical or physical interaction with each other as long as the dispersibility is maintained.

混合化只要是可得到最終的膜形成組成物 (清漆)之安定性時,其調製方法無特別限定。 Mixing as long as the final film forming composition is available When the stability of (varnish) is used, the preparation method is not particularly limited.

例如方法(1):使含有水解縮合物(聚矽氧 烷)之矽化合物(A)以溶液狀態(清漆)混合於無機粒子(B)的分散液(溶膠)中,方法(2):將含有水解縮合物(聚矽氧烷)之矽化合物(A)在溶液中(清漆中)分散無機粒子(B)等各種方法,但由操作性的觀點,較佳為將含有水解縮合物(聚矽氧烷)之矽化合物(A)以 溶液(清漆)之狀態混合於無機粒子(B)的分散液(溶膠)的方法。 For example, the method (1): containing a hydrolysis condensate (polyoxyl) The alkane compound (A) is mixed in a solution state (varnish) in a dispersion (sol) of the inorganic particles (B), and the method (2): a hydrazine compound containing a hydrolysis condensate (polyoxane) (A) Various methods such as dispersing inorganic particles (B) in a solution (in a varnish), but from the viewpoint of workability, it is preferred to use a hydrazine compound (A) containing a hydrolysis condensate (polyoxane). A method in which the state of the solution (varnish) is mixed with the dispersion (sol) of the inorganic particles (B).

混合化之最終的清漆之安定性只要是不會引 起因分散性之降低造成的析出、1次粒徑或2次粒徑的大幅變化、塗佈性之惡化、著色(白化、變黃)、膜質的惡化即可。 The stability of the final varnish of the mixture is not The precipitation due to the decrease in dispersibility, the large change in the primary particle diameter or the secondary particle diameter, the deterioration in coatability, the coloration (whitening, yellowing), and the deterioration of the film quality may be sufficient.

組成物中之無機粒子的含量在不損及所得之 最終清漆之分散性的範圍即可,且可配合製作之被膜之目的之折射率、透過率、耐熱性來控制。 The content of the inorganic particles in the composition does not impair the obtained The range of the dispersibility of the final varnish can be controlled, and can be controlled in accordance with the refractive index, transmittance, and heat resistance of the intended film.

包含含有本發明之水解縮合物(聚矽氧烷) 之矽化合物(A)、無機粒子(B)及溶劑(C)的膜形成組成物(塗佈液),只要在不會引起因分散性之降低造成的析出、1次粒徑或2次粒徑的大幅變化、塗佈性之惡化、著色(白化、變黃)、膜質的惡化的保管條件時,即無特別限定。例如在23℃(室溫保管)、5℃(冷藏保管)及-20℃(冷凍保管)保管即可,在清漆狀態下,為了防止羥基彼此反應,因此在-20℃(冷凍保管)下保管為佳。 Containing a hydrolysis condensate (polyoxyalkylene) containing the present invention The film-forming composition (coating liquid) of the compound (A), the inorganic particles (B), and the solvent (C) is not precipitated due to a decrease in dispersibility, primary particle size or secondary particle size. The storage conditions of the large-diameter change, the deterioration of the coating property, the coloring (whitening, yellowing), and the deterioration of the film quality are not particularly limited. For example, it can be stored at 23 ° C (stored at room temperature), 5 ° C (storage storage), and -20 ° C (refrigerated storage). In the varnish state, in order to prevent the hydroxyl groups from reacting with each other, it is stored at -20 ° C (freezing storage). It is better.

本發明係將上述膜形成組成物被覆於基板 上,經加熱而得,成為具有在波長633nm下為1.50至1.90、1.50至1.70、或1.70至1.90之折射率與藉由JIS規格K5600所定之鉛筆硬度為H~9H、H~5H、或H~3H之硬度的膜。 The present invention coats the above film forming composition on a substrate The upper surface is heated to have a refractive index of 1.50 to 1.90, 1.50 to 1.70, or 1.70 to 1.90 at a wavelength of 633 nm and a pencil hardness of H~9H, H~5H, or H as determined by JIS specification K5600. A film with a hardness of ~3H.

<被膜之圖型化方法> <Method of patterning the film>

本發明之上述膜形成組成物本身雖無感光性,但對於鹼溶液具有溶解顯影性,因此利用感光性阻劑,可形成10μm以下之圖型化。對上述膜形成組成物不賦予感光性的理由係因為作為感光性材料時所添加之感光劑成為使耐光性惡化的原因。 Although the film-forming composition of the present invention has no photosensitivity, it has solubility developability in an alkali solution. Therefore, a pattern of 10 μm or less can be formed by using a photosensitive resist. The reason why the film forming composition is not provided with photosensitivity is because the photosensitizer added as a photosensitive material causes deterioration of light resistance.

圖型化之方法係經由以下步驟1至步驟9而完成。 The method of patterning is completed by the following steps 1 to 9.

步驟1:將膜形成組成物塗佈於基材 Step 1: Coating the film forming composition on the substrate

步驟2:使基材上的膜進行暫時性乾燥(temporal drying) Step 2: Temporarily drying the film on the substrate

步驟3:於膜形成用組成物上塗佈感光性阻劑 Step 3: Coating a photosensitive resist on the film forming composition

步驟4:使感光性阻劑乾燥 Step 4: Dry the photosensitive resist

步驟5:透過遮罩從感光性阻劑上進行光照射 Step 5: Light irradiation from the photosensitive resist through the mask

步驟6:進行鹼顯影 Step 6: Perform alkali development

步驟7:以純水清洗(rinse) Step 7: Wash with pure water (rinse)

步驟8:剝離阻劑 Step 8: Stripping Resist

步驟9:將圖型化後的膜形成組成物進行正式加熱 Step 9: Formally heat the patterned film forming composition

步驟2為使膜形成組成物暫時性乾燥的步驟,只要是加熱至變得不會溶解於步驟3之感光性阻劑之主溶劑為止則無特別限定,在40℃至200℃、或80℃至150℃、或90℃至120℃下加熱即可,加熱時間係以30秒至300秒、或60秒至120秒、或180秒至240秒加熱即可。 Step 2 is a step of temporarily drying the film-forming composition, and is not particularly limited as long as it is heated until it is dissolved in the main solvent of the photosensitive resist of the step 3, and is 40 to 200 ° C or 80 ° C. The heating may be carried out at 150 ° C or 90 ° C to 120 ° C, and the heating time may be 30 seconds to 300 seconds, or 60 seconds to 120 seconds, or 180 seconds to 240 seconds.

步驟3為塗佈感光性阻劑的步驟,使用市售 一般的正型感光性阻劑或負型感光性阻劑即可。例如正型光阻劑可使用THMR-iP1800(東京應化工業(股)製)、AZ3100、AZ1500(AZ ELECTRONIC MATERIALS公司製)等。 Step 3 is a step of coating a photosensitive resist, and is commercially available. A general positive photosensitive resist or a negative photosensitive resist can be used. For example, THMR-iP1800 (manufactured by Tokyo Ohka Kogyo Co., Ltd.), AZ3100, AZ1500 (manufactured by AZ ELECTRONIC MATERIALS Co., Ltd.), or the like can be used.

步驟5為透過遮罩進行光照射的步驟,使用 一般的曝光機即可。例如可使用對準器(aligner)PLA-600FA(Canon(股)製)、i線步進機NSR-2205i12D((股)Nikon製)等。 Step 5 is a step of irradiating light through the mask, using The general exposure machine can be. For example, an aligner PLA-600FA (manufactured by Canon), an i-line stepper NSR-2205i12D (manufactured by Nikon), or the like can be used.

步驟6為鹼顯影的步驟,鹼顯影液使用一般 的氫氧化四甲基銨(TMAH)水溶液即可。TMAH的濃度為0.1質量%至2.38質量%、0.5質量%至1.0質量%、或1.0質量%至2.0質量%即可,顯影時間為10秒至180秒、20秒至60秒、或90秒至120秒即可。又,鹼顯影液也可為碳酸鈉及氫氧化鈉、氫氧化鉀水溶液等之無機鹼。 Step 6 is a step of alkali development, and the alkali developer is generally used. The aqueous solution of tetramethylammonium hydroxide (TMAH) can be used. The concentration of TMAH may be 0.1% by mass to 2.38% by mass, 0.5% by mass to 1.0% by mass, or 1.0% by mass to 2.0% by mass, and the developing time is 10 seconds to 180 seconds, 20 seconds to 60 seconds, or 90 seconds to 120 seconds. Further, the alkali developing solution may be an inorganic base such as sodium carbonate, sodium hydroxide or potassium hydroxide aqueous solution.

步驟8為剝離阻劑的步驟,一般的阻劑溶劑 即可。例如有丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、丙酮酸乙酯等。 Step 8 is a step of stripping the resist, a general resist solvent Just fine. For example, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, ethyl pyruvate, and the like.

步驟9為將膜形成組成物進行正式加熱的步 驟,在80℃至300℃、或100℃至150℃、或180℃至230℃、或250℃至300℃加熱即可。 Step 9 is a step of subjecting the film forming composition to formal heating. The heating may be carried out at 80 ° C to 300 ° C, or 100 ° C to 150 ° C, or 180 ° C to 230 ° C, or 250 ° C to 300 ° C.

經由如以上之圖型化的方法,即使膜形成組 成物為非感光性材料,因具有鹼顯影性而可進行圖型化。 Through the method of patterning as above, even the film formation group The product is a non-photosensitive material and can be patterned due to alkali developability.

由如此所得之本發明之組成物所構成的膜可 一次滿足高折射率、高透明性、高耐熱性、高耐光性、高硬度,因此可適用於液晶顯示器、電漿顯示器、陰極射線管、有機發光顯示器、電子紙、LED、固體攝像元件、太陽能電池、有機薄膜電晶體等之電子裝置。特別是可適用作為要求高耐光性的LED用構件。 The film composed of the composition of the present invention thus obtained may be It satisfies high refractive index, high transparency, high heat resistance, high light resistance, and high hardness, so it can be applied to liquid crystal displays, plasma displays, cathode ray tubes, organic light-emitting displays, electronic paper, LEDs, solid-state imaging devices, and solar energy. An electronic device such as a battery or an organic thin film transistor. In particular, it can be suitably used as a member for LEDs which requires high light resistance.

更具體而言,可適用作為各種顯示器之背光 光源、信號機、照明、雷射、生物感測器等。 More specifically, it can be applied as a backlight for various displays. Light source, signal, lighting, laser, biosensor, etc.

[實施例] [Examples]

以下,舉實施例及比較例,更具體說明本發明,但本發明不限於下述實施例者。又,實施例使用的各測定裝置如下。 Hereinafter, the present invention will be specifically described by way of Examples and Comparative Examples, but the present invention is not limited to the examples described below. Further, each measuring device used in the examples is as follows.

[GPC] [GPC]

裝置:東曹(股)製HLC-8200 GPC Device: HTC-8200 GPC made by Tosoh Corporation

管柱:Shodex KF-804L+KF-805L Column: Shodex KF-804L+KF-805L

管柱溫度:40℃ Column temperature: 40 ° C

溶劑:四氫呋喃(以下為THF) Solvent: tetrahydrofuran (hereinafter THF)

檢出器:UV(254nm) Detector: UV (254nm)

檢量線:標準聚苯乙烯 Checking line: standard polystyrene

[1H-NMR] [ 1 H-NMR]

裝置:日本電子(股)製ECP300 Device: Japan Electronics Co., Ltd. ECP300

溶劑:重丙酮 Solvent: heavy acetone

[被膜之折射率/橢圓測厚儀] [Refractive index of the film / elliptical thickness gauge]

裝置:J.A.Woollam Japan製多入射角分光橢圓測厚儀VASE Device: J.A. Woollam Japan Multi-incidence Angle Spectroscopic Elliptical Thickness Gauge VASE

在波長450nm下測量。 Measured at a wavelength of 450 nm.

[紫外線可視分光光度計] [UV visible spectrophotometer]

裝置:(股)島津製作所製SHIMADSU UV-3600 Device: (share) Shimadzu SU-3600 made by Shimadzu Corporation

[粒子之折射率] [refractive index of particles]

裝置:J.A.Woollam Japan製多入射角分光橢圓測厚儀VASE。 Device: J.A. Woollam Japan multi-incident angle spectroscopic elliptical thickness gauge VASE.

在波長450nm下測量。 Measured at a wavelength of 450 nm.

將無機粒子(B)使膜厚成為100nm,而以丙二醇單甲基醚稀釋,旋轉塗佈於矽基板,測量在100℃、1分鐘、以加熱板加熱後,200℃、5分鐘、以加熱板加熱後之膜的折射率。 The inorganic particles (B) were made to have a film thickness of 100 nm, diluted with propylene glycol monomethyl ether, and spin-coated on a ruthenium substrate, and measured at 100 ° C for 1 minute, heated by a hot plate, and heated at 200 ° C for 5 minutes. The refractive index of the film after the plate is heated.

[平均粒徑] [The average particle size]

裝置:Beckman Coulter製N5 Device: N5 made by Beckman Coulter

將無機粒子(B)分散液以與分散媒相同溶劑稀釋,測量動態光散射法之粒徑(Unimodal模式、強度平均粒徑)。 The inorganic particle (B) dispersion was diluted with the same solvent as the dispersion medium, and the particle diameter (Unimodal mode, strength average particle diameter) of the dynamic light scattering method was measured.

[旋轉塗佈法] [Rot coating method]

裝置:東京Electron(股)製、clean track、裝置名ACT8 Device: Tokyo Electron system, clean track, device name ACT8

[曝光] [exposure]

裝置:(股)Nikon製、i線步進機、裝置名NSR-2205i12D Device: (share) Nikon system, i line stepper, device name NSR-2205i12D

[水接觸角] [water contact angle]

使用協和界面科學(股)製、全自動接觸角計Drop Master系列、裝置名DM700,將純水由尺寸為22G的針製作液滴,以液滴法(θ/2法)算出液體附著於被膜表面之液滴之水接觸角。 Using the Concord Interface Science (stock) system, the fully automatic contact angle meter Drop Master series, the device name DM700, the pure water was made into a droplet of 22G needle, and the liquid method was attached to the film by the droplet method (θ/2 method). The water contact angle of the droplets on the surface.

[光學顯微鏡] [Optical microscope]

裝置:Nikon公司製、裝置名ECLIPSE E600 POL Device: manufactured by Nikon Corporation, device name ECLIPSE E600 POL

光學顯微鏡係倍率50倍觀察。 The optical microscope was observed at a magnification of 50 times.

[電子顯微鏡] [electron microscope]

裝置:(股)日立高科技公司製、裝置名S-4800 Device: (share) Hitachi High-Tech Company, device name S-4800

[合成例(1-1)] [Synthesis Example (1-1)]

將29.17g之四乙氧基矽烷、116.66g之丙二醇單甲基 醚(簡稱PGME)置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行攪拌,邊將0.01莫耳/L之鹽酸10.09g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,反應溶液中添加116.66g之PGME,減壓餾除反應副產物之乙醇、水、鹽酸,經濃縮得到水解縮合物(聚合物)之PGME溶液。接著,添加PGME,調整成140℃下之固體殘留物換算為14質量%。所得之聚合物為僅以水解性矽烷(a1)成分構成的聚矽氧烷(簡稱pTEOS)之清漆。所得之pTEOS之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1800。 29.17 g of tetraethoxynonane, 116.66 g of propylene glycol monomethyl Ether (PGME for short) was placed in a 300 ml flask, and the mixture was stirred with a magnetic stirrer while dropping 0.019 g of 0.01 mol/L hydrochloric acid into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 116.66 g of PGME was added to the reaction solution, and ethanol, water, and hydrochloric acid of the reaction by-product were distilled off under reduced pressure, and concentrated to obtain a PGME solution of the hydrolyzed condensate (polymer). Next, PGME was added, and the solid residue at 140 ° C was adjusted to 14 mass %. The obtained polymer was a varnish of polyoxyalkylene (pTEOS) composed only of a hydrolyzable decane (a1) component. The weight average molecular weight of the obtained pTEOS by GPC was Mw 1800 in terms of polystyrene.

[合成例(1-2)] [Synthesis Example (1-2)]

將29.17g之四乙氧基矽烷、10.70g之甲基三乙氧基矽烷、159.46g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行攪拌,邊將0.01莫耳/L之鹽酸13.33g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為將70莫耳%之水解性矽烷(a1)與以具有碳原子數為1之甲基與3個水解性基之矽烷單體取代水解性矽烷(a2),並以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TM73)的清漆。所得之TM73之藉由GPC之重量平均分子量係以聚苯乙烯換算為 Mw1155。 29.17 g of tetraethoxy decane, 10.70 g of methyltriethoxy decane, and 159.46 g of PGME were placed in a 300 ml flask, and the solution was stirred with a magnetic stirrer while being 0.01 mol/L. 13.33 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is obtained by dissolving 70 mol% of hydrolyzable decane (a1) and hydrolyzed decane (a2) with a decane monomer having a methyl group having 1 carbon atom and 3 hydrolyzable groups, and 30 mol. The ratio of the % of the ear is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TM73 for short). The weight average molecular weight of the obtained TM73 by GPC is converted into polystyrene. Mw1155.

[合成例(1-3)] [Synthesis Example (1-3)]

將29.17g之四乙氧基矽烷、11.54g之乙基三乙氧基矽烷、162.82g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行攪拌,邊將0.01莫耳/L之鹽酸13.33g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為70莫耳%之水解性矽烷(a1)與以具有碳原子數為2之乙基與3個水解性基之矽烷單體取代水解性矽烷(a2),並以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TE73)之清漆。所得之TE73之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1310。 29.17 g of tetraethoxy decane, 11.54 g of ethyl triethoxy decane, and 162.82 g of PGME were placed in a 300 ml flask, and the solution was stirred with a magnetic stirrer while being 0.01 mol/L. 13.33 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was 70 mol% of hydrolyzable decane (a1) and hydrolyzed decane (a2) was substituted with a decane monomer having an ethyl group having 3 carbon atoms and 3 hydrolyzable groups, and was 30 mol. A ratio of % to a varnish of a hydrolyzed copolymerized polyoxyalkylene (referred to as TE73). The weight average molecular weight of the obtained TE73 by GPC was Mw1310 in terms of polystyrene.

[合成例(1-4)] [Synthesis Example (1-4)]

將29.17g之四乙氧基矽烷、9.86g之丙基三甲氧基矽烷、156.09g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行攪拌,邊將0.01莫耳/L之鹽酸13.33g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為70莫耳%之水解性矽烷 (a1)與作為水解性矽烷(a2)之具有碳原子數為3之丙 基與3個水解性基之矽烷單體,以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TT73)之清漆。所得之TT73之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1041。 29.17 g of tetraethoxydecane, 9.86 g of propyltrimethoxydecane, and 156.09 g of PGME were placed in a 300 ml flask, and the solution was stirred with a magnetic stirrer while 0.01 mol/L hydrochloric acid was added. 13.33 g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The resulting polymer is 70 mol% hydrolyzed decane (a1) and C as a hydrolyzable decane (a2) having a carbon number of 3 A varnish of a polyoxyalkylene (abbreviated as TT73) hydrolyzed at a ratio of 30 mol% to a decane monomer having three hydrolyzable groups. The weight average molecular weight by GPC of the obtained TT73 was Mw1041 in terms of polystyrene.

[合成例(1-5)] [Synthesis Example (1-5)]

將29.17g之四乙氧基矽烷、13.22g之異丁基三乙氧基矽烷、169.56g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行攪拌,邊將0.01莫耳/L之鹽酸13.33g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為70莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基之矽烷單體,以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TI73)之清漆。所得之TI73之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1087。 29.17 g of tetraethoxydecane, 13.22 g of isobutyltriethoxydecane, and 169.56 g of PGME were placed in a 300 ml flask, and the solution was stirred with a magnetic stirrer while being 0.01 mol/L. 13.33 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was 70 mol% of hydrolyzable decane (a1) and decane monomer having hydrolyzable decane (a2) having an isobutyl group having 4 carbon atoms and 3 hydrolyzable groups, at 30 mol. A ratio of % is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TI73 for short). The weight average molecular weight of the obtained TI73 by GPC was Mw 1087 in terms of polystyrene.

[合成例(1-6)] [Synthesis Example (1-6)]

將29.17g之四乙氧基矽烷、12.38g之n-己基三甲氧基矽烷、166.19g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行攪拌,邊將0.01莫耳/L之鹽酸 13.33g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為70莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為6之n-己基與3個水解性基之矽烷單體,以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TH73)之清漆。所得之TH73之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1060。 29.17 g of tetraethoxynonane, 12.38 g of n-hexyltrimethoxydecane, and 166.19 g of PGME were placed in a 300 ml flask, and the solution was stirred with a magnetic stirrer while being 0.01 mol/L. hydrochloric acid 13.33 g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was 70 mol% of hydrolyzable decane (a1) and decane monomer having a hydrolyzable decane (a2) having n-hexyl group having 6 carbon atoms and 3 hydrolyzable groups, at 30 mol. A ratio of % to a varnish of a hydrolyzed copolymerized polyoxyalkylene (referred to as TH73). The weight average molecular weight of the obtained TH73 by GPC was Mw 1060 in terms of polystyrene.

[合成例(1-7)] [Synthesis Example (1-7)]

將29.17g之四乙氧基矽烷、3.43g之異丁基三乙氧基矽烷、130.38g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行攪拌,邊將0.01莫耳/L之鹽酸10.93g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物係將90莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基的矽烷單體,以10莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TI91)之清漆。所得之TI91之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1237。 29.17 g of tetraethoxy decane, 3.43 g of isobutyl triethoxy decane, and 130.38 g of PGME were placed in a 300 ml flask, and the solution was stirred with a magnetic stirrer while being 0.01 mol/L. 10.93 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is obtained by combining 90 mol% of hydrolyzable decane (a1) with a hydrocarbyl decane (a2) having a tetraalkyl group having 4 carbon atoms and 3 hydrolyzable groups of decane monomer. The proportion of the ear % is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TI91 for short). The weight average molecular weight of the obtained TI91 by GPC was Mw1237 in terms of polystyrene.

[合成例(1-8)] [Synthesis Example (1-8)]

29.17g之四乙氧基矽烷、7.71g之異丁基三乙氧基矽烷、147.52g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸11.98g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物係將80莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基的矽烷單體,以20莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TI82)之清漆。所得之TI82之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1235。 29.17 g of tetraethoxy decane, 7.71 g of isobutyl triethoxy decane, and 147.52 g of PGME were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L hydrochloric acid. 11.98 g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is obtained by dissolving 80 mol% of hydrolyzable decane (a1) with a hydrocarbyl decane (a2) having a tetrahydric butyl group having 4 carbon atoms and 3 hydrolyzable decane monomers, 20 mol. The proportion of the ear % is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TI82 for short). The weight average molecular weight of the obtained TI82 by GPC was Mw1235 in terms of polystyrene.

[合成例(1-9)] [Synthesis Example (1-9)]

將20.83g之四乙氧基矽烷、14.69g之異丁基三乙氧基矽烷、140.10g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸10.81g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物係將60莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基之矽烷單體,以40莫耳%之比例進 行水解共聚合的聚矽氧烷(簡稱TI64)之清漆。所得之TI64之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1051。 20.83 g of tetraethoxy decane, 14.69 g of isobutyl triethoxy decane, and 140.10 g of PGME were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 10.81 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is obtained by dissolving 60 mol% of hydrolyzable decane (a1) with a hydrocarbyl decane (a2) having a tetraalkyl group having 4 carbon atoms and 3 hydrolyzable groups of decane monomers, 40 mol. The percentage of the ear A varnish of a hydrolyzed copolymerized polyoxyalkylene (TI64 for short). The weight average molecular weight of the obtained TI64 by GPC was Mw1051 in terms of polystyrene.

[合成例(1-10)] [Synthesis Example (1-10)]

將20.83g之四乙氧基矽烷、22.04g之異丁基三乙氧基矽烷、171.48g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸12.61g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物係將50莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基的矽烷單體,以50莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TI55)之清漆。所得之TI55之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1025。 20.83 g of tetraethoxy decane, 22.04 g of isobutyl triethoxy decane, and 171.48 g of PGME were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 12.61 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is obtained by combining 50 mol% of hydrolyzable decane (a1) with a hydrocarbyl decane (a2) having a tetraalkyl group having 4 carbon atoms and 3 hydrolyzable groups of decane monomer. The proportion of the ear % is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TI55 for short). The weight average molecular weight of the obtained TI55 by GPC was Mw 1025 in terms of polystyrene.

[合成例(1-11)] [Synthesis Example (1-11)]

將16.67g之四乙氧基矽烷、26.45g之異丁基三乙氧基矽烷、172.45g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸12.25g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例 (1-1)同樣操作,調整成為140℃下之固體殘留物換算為 14質量%。所得之聚合物係將40莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基的矽烷單體,以60莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TI46)之清漆。所得之TI46之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1015。 16.67 g of tetraethoxydecane, 26.45 g of isobutyltriethoxydecane, and 172.45 g of PGME were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 12.25 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, with the synthesis example (1-1) In the same operation, the solid residue adjusted to 140 ° C is converted into 14% by mass. The obtained polymer is obtained by dissolving 40 mol% of hydrolyzable decane (a1) and decane monomer having a hydrolyzable decane (a2) having an isobutyl group having 4 carbon atoms and 3 hydrolyzable groups, 60 mol. The ratio of the % of the ear is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TI46 for short). The weight average molecular weight of the obtained TI46 by GPC was Mw 1015 in terms of polystyrene.

[合成例(1-12)] [Synthesis Example (1-12)]

將合成例(1-5)所得之TI73於100℃之油浴中,進行9小時之加熱攪拌,確認以聚苯乙烯換算為Mw2097,得到聚矽氧烷(簡稱TI73M1)之清漆。 The TI73 obtained in the synthesis example (1-5) was heated and stirred in an oil bath of 100 ° C for 9 hours to confirm that it was Mw 2097 in terms of polystyrene, and a varnish of polyoxyalkylene (TI73M1 for short) was obtained.

[合成例(1-13)] [Synthesis Example (1-13)]

將合成例(1-5)所得之TI73於100℃之油浴中進行20小時之加熱攪拌,確認以聚苯乙烯換算為Mw3014,得到聚矽氧烷(簡稱TI73M2)之清漆。 The TI73 obtained in the synthesis example (1-5) was heated and stirred in an oil bath of 100 ° C for 20 hours, and it was confirmed that Mw 3014 was converted into polystyrene to obtain a varnish of polysiloxane (TI73M2 for short).

[合成例(1-14)] [Synthesis Example (1-14)]

將合成例(1-5)所得之TI73於100℃之油浴中進行32小時之加熱攪拌,確認以聚苯乙烯換算為Mw4235,得到聚矽氧烷(簡稱TI73M3)之清漆。 The TI73 obtained in the synthesis example (1-5) was heated and stirred in an oil bath of 100 ° C for 32 hours, and it was confirmed that Mw 4235 was converted into polystyrene (TI73M3) varnish in terms of polystyrene.

[合成例(1-15)] [Synthesis Example (1-15)]

將合成例(1-5)所得之TI73於100℃之油浴中進行62小時之加熱攪拌,確認以聚苯乙烯換算為Mw6357,得到聚矽氧烷(簡稱TI73M4)之清漆。 The TI73 obtained in the synthesis example (1-5) was heated and stirred in an oil bath of 100 ° C for 62 hours, and it was confirmed that Mw 6357 was obtained in terms of polystyrene to obtain a varnish of polyoxyalkylene (TI73M4 for short).

[合成例(1-16)] [Synthesis Example (1-16)]

將10.42g之四乙氧基矽烷、4.72g之異丁基三乙氧基矽烷、136.25g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸4.76g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物係將70莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基的矽烷單體,以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TI73L1)之清漆。所得之TI73L1之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw760。 10.42 g of tetraethoxydecane, 4.72 g of isobutyltriethoxydecane, and 136.25 g of PGME were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 4.76 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is obtained by combining 70 mol% of hydrolyzable decane (a1) with a decane monomer having a hydrolyzable decane (a2) having an isobutyl group having 4 carbon atoms and 3 hydrolyzable groups, to 30 mol. The proportion of the ear % is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TI73L1 for short). The weight average molecular weight of the obtained TI73L1 by GPC was Mw760 in terms of polystyrene.

[合成例(1-17)] [Synthesis Example (1-17)]

將5.21g之四乙氧基矽烷、2.36g之異丁基三乙氧基矽烷、143.82g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸2.38g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例 (1-1)同樣操作,調整成為140℃下之固體殘留物換算為 14質量%。所得之聚合物係將70莫耳%之水解性矽烷(a1)與作為水解性矽烷(a2)之具有碳原子數為4之異丁基與3個水解性基的矽烷單體,以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TI73L2)之清漆。所得之TI73L2之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw652。 5.21 g of tetraethoxy decane, 2.36 g of isobutyl triethoxy decane, and 143.82 g of PGME were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 2.38 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, with the synthesis example (1-1) In the same operation, the solid residue adjusted to 140 ° C is converted into 14% by mass. The obtained polymer is obtained by combining 70 mol% of hydrolyzable decane (a1) with a decane monomer having a hydrolyzable decane (a2) having an isobutyl group having 4 carbon atoms and 3 hydrolyzable groups, to 30 mol. A proportion of the ear % is a varnish of a hydrolyzed copolymerized polyoxyalkylene (TI73L2 for short). The weight average molecular weight of the obtained TI73L2 by GPC was Mw652 in terms of polystyrene.

[合成例(1-18)] [Synthesis Example (1-18)]

將20.83g之四乙氧基矽烷、9.62g之n-辛基三甲氧基矽烷、121.80g之PGME置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為100℃之油浴中,在加熱迴流下,使反應240分鐘。然後,與合成例(1-1)同樣操作,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物係將70莫耳%之水解性矽烷(a1)與取代水解性矽烷(a2),以具有碳原子數為8之n-辛基與3個水解性基的矽烷單體,以30莫耳%之比例進行水解共聚合的聚矽氧烷(簡稱TO73)之清漆。所得之TO73之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw998。 20.83 g of tetraethoxydecane, 9.62 g of n-octyltrimethoxydecane, and 121.80 g of PGME were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 9.52 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 100 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, in the same manner as in the synthesis example (1-1), the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is obtained by using 70 mol% of a hydrolyzable decane (a1) and a substituted hydrolyzable decane (a2) as a decane monomer having an n-octyl group having 8 carbon atoms and 3 hydrolyzable groups. A varnish of a hydrolyzed copolymerized polyoxyalkylene (TO73 for short) at a ratio of 30 mol%. The weight average molecular weight of the obtained TO73 by GPC was Mw998 in terms of polystyrene.

[合成例(2-1)] [Synthesis Example (2-1)]

將20.83g之四乙氧基矽烷、7.04g之n-丙基三甲氧基 矽烷、111.49g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加111.49g之丙二醇單甲基醚乙酸酯(簡稱PGMEA),減壓餾除反應副產物之乙醇、甲醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)的清漆,且完全水解型之聚矽氧烷(簡稱P1)之清漆。所得之P1之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1541。 20.83 g of tetraethoxynonane, 7.04 g of n-propyltrimethoxy 矽 、, 111.49 g of acetone was placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while dropping 9.52 g of 0.01 mol/L hydrochloric acid into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 111.49 g of propylene glycol monomethyl ether acetate (PGMEA) was added to the reaction solution, and ethanol, methanol, water, hydrochloric acid, and acetone of the reaction by-products were distilled off under reduced pressure. The PGMEA solution of the hydrolysis condensate (polymer) was concentrated. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polyoxane), and a varnish of a fully hydrolyzed polyoxyalkylene (P1). The weight average molecular weight of the obtained P1 by GPC was Mw1541 in terms of polystyrene.

P1之PGMEA清漆係添加PGMEA,使140℃中之固體殘留物換算成為6質量%,測量1H-NMR。由1H-NMR之結果,確認歸屬於溶劑之PGMEA之質子之5.1ppm的波峰為1.00時,歸屬於聚矽氧烷之矽烷醇(Si-OH)之6.0ppm附近的波峰為0.32,殘留許多Si-OH。重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 PGMEA varnish of P1 was added with PGMEA, and the solid residue at 140 ° C was converted into 6% by mass, and 1H-NMR was measured. As a result of 1 H-NMR, it was confirmed that the peak of 5.1 ppm of the proton of the PGMEA attributed to the solvent was 1.00, and the peak near 6.0 ppm of the decyl alcohol (Si-OH) attributed to the polyoxyalkylene was 0.32, and many remained. Si-OH. The weight average molecular weight and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-2)] [Synthesis Example (2-2)]

將20.83g之四乙氧基矽烷、9.44g之異丁基三乙氧基矽烷、121.11g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴 中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加121.11g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)的矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P2)之清漆。P2之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxy decane, 9.44 g of isobutyl triethoxy decane, and 121.11 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 9.52 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 121.11 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-product were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polyoxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P2). The weight average molecular weight of P2 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-3)] [Synthesis Example (2-3)]

將20.83g之四乙氧基矽烷、8.84g之n-己基三甲氧基矽烷、118.71g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加118.71g之PGMEA,減壓餾除反應副產物之乙醇、甲醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)的矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P3)之清漆。P3之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxydecane, 8.84 g of n-hexyltrimethoxydecane, and 118.71 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while 0.01 mol/L hydrochloric acid was added. 9.52 g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 118.71 g of PGMEA was added to the reaction solution, and ethanol, methanol, water, hydrochloric acid, acetone of the reaction by-products were distilled off under reduced pressure, and PGMEA of the hydrolysis condensate (polymer) was obtained by concentration. Solution. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P3). The weight average molecular weight of P3 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-4)] [Synthesis Example (2-4)]

將20.83g之四乙氧基矽烷、2.45g之異丁基三乙氧基矽烷、93.13g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸7.80g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加93.13g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下以固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P4)之清漆。P4之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxy decane, 2.45 g of isobutyl triethoxy decane, and 93.13 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 7.80 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 93.13 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-product were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the temperature was adjusted to 14% by mass in terms of solid residue at 140 °C. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P4). The weight average molecular weight of P4 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-5)] [Synthesis Example (2-5)]

將12.50g之四乙氧基矽烷、13.22g之異丁基三乙氧基矽烷、102.89g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸7.56g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加102.89g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到 水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P5)之清漆。P5之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 12.50 g of tetraethoxy decane, 13.22 g of isobutyl triethoxy decane, and 102.89 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 7.56 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 102.89 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-product were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P5). The weight average molecular weight of P5 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-6)] [Synthesis Example (2-6)]

將5.21g之四乙氧基矽烷、2.36g之異丁基三乙氧基矽烷、118.59g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸2.38g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加118.59g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下以固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P6)之清漆。P6之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 5.21 g of tetraethoxydecane, 2.36 g of isobutyltriethoxydecane, and 118.59 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 2.38 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 118.59 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-product were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the temperature was adjusted to 14% by mass in terms of solid residue at 140 °C. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P6). The weight average molecular weight of P6 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-7)] [Synthesis Example (2-7)]

將20.83g之四乙氧基矽烷、83.33g之丙酮置入300ml 之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸7.20g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加83.33g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P7)之清漆。P7之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxy decane and 83.33 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while dropping 7.20 g of 0.01 mol/L hydrochloric acid into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 83.33 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-product were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P7). The weight average molecular weight of P7 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-8)] [Synthesis Example (2-8)]

將10.42g之四乙氧基矽烷、16.53g之異丁基三乙氧基矽烷、107.78g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸7.65g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加107.78g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱 P8)之清漆。P8之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 10.42 g of tetraethoxynonane, 16.53 g of isobutyltriethoxydecane, and 107.78 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 7.65 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 107.78 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-product were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P8). The weight average molecular weight of P8 and the proton number ratio by 1 H-NMR are shown in Table 1.

[合成例(2-9)] [Synthesis Example (2-9)]

將合成例2所得之P2在100℃之油浴中進行22小時之加熱攪拌,確認聚苯乙烯換算為Mw3401,得到聚矽氧烷(簡稱P9)之清漆。P9之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 P2 obtained in Synthesis Example 2 was heated and stirred in an oil bath of 100 ° C for 22 hours, and it was confirmed that polystyrene (P9) varnish was obtained by converting polystyrene into Mw3401. The weight average molecular weight of P9 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-10)] [Synthesis Example (2-10)]

將合成例2所得之P2於100℃之油浴中,進行35小時之加熱攪拌,確認聚苯乙烯換算為Mw4545,得到聚矽氧烷(簡稱P10)之清漆。P10之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 P2 obtained in Synthesis Example 2 was heated and stirred in an oil bath of 100 ° C for 35 hours, and it was confirmed that polystyrene was converted into Mw 4545 to obtain a varnish of polyoxyalkylene oxide (abbreviated as P10). The weight average molecular weight of P10 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-11)] [Synthesis Example (2-11)]

將20.83g之四乙氧基矽烷、7.64g之甲基三乙氧基矽烷、113.90g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加113.90g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調 整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P11)之清漆。 P11之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxynonane, 7.64 g of methyltriethoxydecane, and 113.90 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while 0.01 mol/L of hydrochloric acid was added. 9.52 g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 113.90 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-product were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P11). The weight average molecular weight of P11 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-12)] [Synthesis Example (2-12)]

將20.83g之四乙氧基矽烷、8.24g之乙基三乙氧基矽烷、116.30g之丙酮置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加116.30g之PGMEA,減壓餾除反應副產物之乙醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P12)之清漆。 P12之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxynonane, 8.24 g of ethyltriethoxysilane, and 116.30 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while 0.01 mol/L hydrochloric acid was added. 9.52 g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, and 116.30 g of PGMEA was added to the reaction solution, and ethanol, water, hydrochloric acid, and acetone of the reaction by-products were distilled off under reduced pressure, and the PGMEA solution of the hydrolyzed condensate (polymer) was obtained by concentration. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P12). The weight average molecular weight of P12 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-13)] [Synthesis Example (2-13)]

將20.83g之四乙氧基矽烷、8.24g之n-辛基三甲氧基矽烷、123.47g之丙酮置入300ml之燒瓶中,混合溶液邊 以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加123.47g之PGMEA,減壓餾除反應副產物之乙醇、甲醇、水、鹽酸、丙酮,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)之矽化合物(A)之清漆,且為完全水解型之聚矽氧烷(簡稱P13)之清漆。P13之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxynonane, 8.24 g of n-octyltrimethoxydecane, and 123.47 g of acetone were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while being 0.01 mol/L. 9.52 g of hydrochloric acid was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, 123.47 g of PGMEA was added to the reaction solution, and ethanol, methanol, water, hydrochloric acid, acetone of the reaction by-products were distilled off under reduced pressure, and PGMEA of the hydrolysis condensate (polymer) was obtained by concentration. Solution. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound (A) containing a hydrolysis condensate (polysiloxane), and was a varnish of a fully hydrolyzed polyoxyalkylene (P13). The weight average molecular weight of P13 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[合成例(2-14)] [Synthesis Example (2-14)]

將20.83g之四乙氧基矽烷、7.04g之n-丙基三甲氧基矽烷111.49g之乙醇置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加111.49g之PGMEA,減壓餾除溶劑之乙醇、反應副產物的乙醇、甲醇、水、鹽酸,經濃縮得到水解縮合物(聚合物)之PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)的矽化合物之清漆,且為部分水解型之聚矽氧烷(簡稱P14)之 清漆。所得之P14之藉由GPC之重量平均分子量係以聚苯乙烯換算為Mw1520。 20.83 g of tetraethoxy decane and 7.04 g of n-propyltrimethoxydecane 111.49 g of ethanol were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while 0.01 mol/L hydrochloric acid was added. 9.52 g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, 111.49 g of PGMEA was added to the reaction solution, and ethanol of the solvent, ethanol of the reaction by-product, methanol, water, hydrochloric acid were distilled off under reduced pressure, and the mixture was concentrated to obtain a hydrolyzed condensate (polymer). PGMEA solution. Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer is a varnish of a hydrazine compound containing a hydrolysis condensate (polysiloxane), and is a partially hydrolyzed polyoxy siloxane (referred to as P14). Varnish. The weight average molecular weight of the obtained P14 by GPC was Mw1520 in terms of polystyrene.

P14之PGMEA清漆係添加PGMEA,成為140℃中之固體殘留物換算為6質量%,測量1H-NMR。 The PGMEA varnish of P14 was added with PGMEA, and the solid residue at 140 ° C was converted into 6% by mass, and 1 H-NMR was measured.

1H-NMR的結果,確認歸屬於溶劑之PGMEA之質子之5.1ppm的波峰為1.00時,歸屬於聚矽氧烷之矽烷醇(Si-OH)之6.0ppm附近的波峰為0.06,且Si-O為非常少。 When the peak of 5.1 ppm of the proton of the PGMEA attributed to the solvent was 1.00, the peak near 6.0 ppm of the decyl alcohol (Si-OH) belonging to the polyoxyalkylene was 0.06, and Si was obtained as a result of 1 H-NMR. -O is very small.

[合成例(2-15)] [Synthesis Example (2-15)]

將20.83g之四乙氧基矽烷、9.44g之異丁基三甲氧基矽烷121.11g之乙醇置入300ml之燒瓶中,混合溶液邊以磁攪拌器進行,邊將0.01莫耳/L之鹽酸9.52g滴下至混合溶液中。添加後,將燒瓶移至調整為85℃之油浴中,在加熱迴流下,使反應240分鐘。然後,將反應溶液冷卻至室溫,於反應溶液中添加121.11g之PGMEA,減壓餾除溶劑之乙醇、反應副產物之乙醇、水、鹽酸,經濃縮得到水解縮合物(聚合物)PGMEA溶液。再添加PGMEA,調整成為140℃下之固體殘留物換算為14質量%。所得之聚合物為含有水解縮合物(聚矽氧烷)的矽化合物之清漆,且為部分水解型之聚矽氧烷(簡稱P15)之清漆。 P15之重量平均分子量及藉由1H-NMR之質子數比率如表1所示。 20.83 g of tetraethoxy decane and 9.44 g of isobutyltrimethoxydecane 121.11 g of ethanol were placed in a 300 ml flask, and the solution was mixed with a magnetic stirrer while adding 0.01 mol/L of hydrochloric acid 9.52. g was dropped into the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C, and the reaction was allowed to proceed for 240 minutes under heating under reflux. Then, the reaction solution was cooled to room temperature, 121.11 g of PGMEA was added to the reaction solution, ethanol of the solvent, ethanol of the reaction by-product, water, hydrochloric acid were distilled off under reduced pressure, and the hydrolyzed condensate (polymer) PGMEA solution was obtained by concentration. . Further, PGMEA was added, and the solid residue at 140 ° C was adjusted to be 14% by mass. The obtained polymer was a varnish of a hydrazine compound containing a hydrolysis condensate (polysiloxane), and was a varnish of a partially hydrolyzed polyoxyalkylene (P15). The weight average molecular weight of P15 and the ratio of the number of protons by 1 H-NMR are shown in Table 1.

[製造例1] [Manufacturing Example 1]

二氧化鋯分散液;含有藉由烷氧基矽烷表面處理之二氧化鋯粒子30.5質量%的丙二醇單甲基醚分散液(簡稱B1)(日產化學工業(股)製) Zirconium dioxide dispersion; propylene glycol monomethyl ether dispersion (abbreviated as B1) containing zirconia particles surface-treated with alkoxy decane (manufactured by Nissan Chemical Industries Co., Ltd.)

製造例1所得之無機粒子溶膠之各物性值如表2所示。 The physical property values of the inorganic particle sol obtained in Production Example 1 are shown in Table 2.

<膜形成組成物(1)及被膜之製作> <Production of Film Forming Composition (1) and Film> [實施例(1-1)] [Example (1-1)]

於50mL茄型燒瓶中量秤製造例1所得之6.5000g之B1,接著,添加23.8851g之PGME,添加合成例(1-4)所得之4.9563g之TT73(相對於B1之固體成分,聚矽氧烷之固體成分為35質量%),添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGME稀釋成為1質量%的溶液0.3965g,室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(1-1))。 6.5000 g of B1 obtained in Production Example 1 was weighed in a 50 mL eggplant type flask, followed by addition of 23.8851 g of PGME, and 4.9563 g of TT73 obtained in Synthesis Example (1-4) was added (relative to the solid content of B1, polyfluorene) The solid content of the oxane was 35 mass%), and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd., which is a surfactant, was added to a solution of 0.3965 g diluted to 1% by mass with PGME, and mixed at room temperature until completely uniform. Thus, a varnish (referred to as V(1-1)) having a total mass of the solid component of 7.5% by mass was obtained.

所得之V(1-1)評價圖型化特性。V(1-1)係使用東京Electron(股)製clean track ACT8,旋轉塗佈於以六甲基二矽氮烷(HMDS)處理之8inch的矽基板,使膜厚成為100nm,使用加熱板,以150℃加熱1分鐘。接著,由所得之V(1-1)之被膜之上,旋轉塗佈AZ3100(AZ ELECTRONIC MATERIALS公司製)使膜厚成為 1.5μm,使用加熱板,以100℃加熱1分鐘。然後,使用(股)Nikon製i線步進機NSR-2205i12D,通過光罩,將300mJ/cm2之曝光量進行光照射。光照射後,使用2.38質量%之氫氧化四甲基銨(簡稱TMAH),進行30秒顯影,純水清洗1分鐘後,以空氣使乾燥。接著,將感光性阻劑於PGME中浸漬2分鐘,剝離阻劑,以光學顯微鏡觀察Line:Space為1:1之5μm之處。光學顯微鏡觀察的結果,在Line:Space為1:1之5μm附近的例評價為○,離開Line:Space為1:1之5μm之例或殘留膜的例評價為×。以光學顯微鏡觀察的結果如圖1所示。 The obtained V(1-1) was evaluated for patterning characteristics. V (1-1) was spin-coated on an 8 inch ruthenium substrate treated with hexamethyldioxane (HMDS) using a clean track ACT8 manufactured by Tokyo Electron Co., Ltd. to a film thickness of 100 nm, and a hot plate was used. Heat at 150 ° C for 1 minute. Next, AZ3100 (manufactured by AZ ELECTRONIC MATERIALS Co., Ltd.) was spin-coated on the obtained film of V (1-1) to have a film thickness of 1.5 μm, and heated at 100 ° C for 1 minute using a hot plate. Then, using an i-line stepper NSR-2205i12D manufactured by Nikon, a light exposure amount of 300 mJ/cm 2 was irradiated through a photomask. After the light irradiation, 2.38 mass% of tetramethylammonium hydroxide (TMAH) was used for development for 30 seconds, and the mixture was washed with pure water for 1 minute, and then dried with air. Next, the photosensitive resist was immersed in PGME for 2 minutes, and the resist was peeled off, and the line: Space was observed by an optical microscope to be 5 μm of 1:1. As a result of observation by an optical microscope, an example in the vicinity of Line:Space of 1:1 to 5 μm was evaluated as ○, and an example in which Line:Space was 1:1 to 5 μm or an example of the residual film was evaluated as ×. The results observed with an optical microscope are shown in Fig. 1.

又,Line:Space為1:1之5μm之處,使用電子顯微鏡,由圖型之頂方向,測量Space部分的長度。測量長度的結果,Space部分之寬為5.15μm。Space部分係溶解於鹼顯影液的部分,越接近5μm,顯示可形成更良好的圖型。 Further, when Line:Space is 1:1 to 5 μm, the length of the Space portion is measured from the top direction of the pattern using an electron microscope. As a result of measuring the length, the width of the Space portion was 5.15 μm. The Space portion was dissolved in the portion of the alkali developer, and the closer to 5 μm, the better the pattern was formed.

所得之V(1-1)係評價耐熱折射率。旋轉塗佈於矽基板上,使V(1-1)之膜厚成為100nm,使用加熱板,以150℃加熱1分鐘。加熱後,測量450nm之折射率。接著,使用加熱板,以300℃加熱1小時,測量450nm之折射率後,比較300℃加熱前後之折射率。折射率之比較結果如表3所示。 The obtained V(1-1) was used to evaluate the heat-resistant refractive index. The film was spin-coated on a ruthenium substrate so that the film thickness of V (1-1) was 100 nm, and the mixture was heated at 150 ° C for 1 minute using a hot plate. After heating, the refractive index at 450 nm was measured. Next, using a hot plate, the film was heated at 300 ° C for 1 hour, and the refractive index at 450 nm was measured, and then the refractive index before and after heating at 300 ° C was compared. The results of the comparison of the refractive indices are shown in Table 3.

所得之V(1-1)測量水接觸角。旋轉塗佈於矽基板上,使V(1-1)之膜厚成為100nm,使用加熱板,以150℃加熱1分鐘。接著,以100℃加熱1分鐘。此加熱 板之2階段加熱係再現塗佈感光性阻劑,經乾燥之鹼顯影前之熱經歷的加熱條件。 The resulting V(1-1) measures the water contact angle. The film was spin-coated on a ruthenium substrate so that the film thickness of V (1-1) was 100 nm, and the mixture was heated at 150 ° C for 1 minute using a hot plate. Then, it was heated at 100 ° C for 1 minute. This heating The two-stage heating of the plate reproduces the heating conditions under which the photosensitive resist is applied and the heat before drying by the dried alkali is developed.

所得之被膜使用協和界面科學(股)製全自動接觸角計Drop Master系列DM700,將純水由尺寸為22G的針製作液滴,以液滴法(θ/2法)算出液體附著於被膜表面之液滴之水接觸角。其結果如表3所示。 The obtained film was made by using the Drop Master series DM700 of the fully automatic contact angle meter made by Concord Interface Science Co., Ltd., and the pure water was made into a droplet of 22G needle, and the liquid method was attached to the surface of the film by the droplet method (θ/2 method). The water contact angle of the droplets. The results are shown in Table 3.

[實施例(1-2)] [Embodiment (1-2)]

將實施例(1-1)之TT73取代成合成例(1-5)所得之TI73外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。圖型之光學顯微鏡觀察的結果如圖2所示。 The TT73 of Example (1-1) was replaced with TI73 obtained in Synthesis Example (1-5), and the alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3. The results of the optical microscope observation of the pattern are shown in Fig. 2.

又,Line:Space為1:1之5μm之處,使用電子顯微鏡,由圖型之頂方向,測量Space部分的長度。測量長度的結果,Space部分之寬為5.12μm。 Further, when Line:Space is 1:1 to 5 μm, the length of the Space portion is measured from the top direction of the pattern using an electron microscope. As a result of measuring the length, the width of the Space portion was 5.12 μm.

[實施例(1-3)] [Example (1-3)]

將實施例(1-1)之TT73取代成合成例(1-6)所得之TH73外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。圖型之光學顯微鏡觀察的結果如圖3所示。 The TT73 of Example (1-1) was replaced with TH73 obtained in Synthesis Example (1-6), and the alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3. The results of the optical microscope observation of the pattern are shown in Fig. 3.

又,Line:Space為1:1之5μm之處,使用電子顯微鏡,由圖型之頂方向,測量Space部分的長度。測量長度的結果,Space部分之寬為5.12μm。 Further, when Line:Space is 1:1 to 5 μm, the length of the Space portion is measured from the top direction of the pattern using an electron microscope. As a result of measuring the length, the width of the Space portion was 5.12 μm.

[實施例(1-4)] [Example (1-4)]

將實施例(1-1)之TT73取代成合成例(1-7)所得之TI91外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TI91 obtained in Synthesis Example (1-7), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[實施例(1-5)] [Example (1-5)]

將實施例(1-1)之TT73取代成合成例(1-8)所得之TI82外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TI82 obtained in Synthesis Example (1-8), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[實施例(1-6)] [Example (1-6)]

將實施例(1-1)之TT73取代成合成例(1-9)所得之TI64外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TI64 obtained in Synthesis Example (1-9), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[實施例(1-7)] [Embodiment (1-7)]

將實施例(1-1)之TT73取代成合成例(1-10)所得之TI55外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of the example (1-1) was replaced with the TI55 obtained in the synthesis example (1-10), and the alkali developability, heat resistance, and water contact angle were measured in the same manner as in the example (1-1). The results are shown in Table 3.

[實施例(1-8)] [Embodiment (1-8)]

將實施例(1-1)之TT73取代成合成例(1-12)所得之TI73M1外,與實施例(1-1)同樣操作,測量鹼顯影 性、耐熱性、水接觸角。其結果如表3所示。圖型之光學顯微鏡觀察的結果如圖4所示。 The TT73 of Example (1-1) was replaced with TI73M1 obtained in Synthesis Example (1-12), and alkali development was measured in the same manner as in Example (1-1). Sex, heat resistance, water contact angle. The results are shown in Table 3. The results of the optical microscope observation of the pattern are shown in Fig. 4.

又,Line:Space為1:1之5μm之處,使用電子顯微鏡,由圖型之頂方向,測量Space部分的長度。測量長度的結果,Space部分之寬為5.15μm。 Further, when Line:Space is 1:1 to 5 μm, the length of the Space portion is measured from the top direction of the pattern using an electron microscope. As a result of measuring the length, the width of the Space portion was 5.15 μm.

[實施例(1-9)] [Embodiment (1-9)]

將實施例(1-1)之TT73取代成合成例(1-13)所得之TI73M2外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TI73M2 obtained in Synthesis Example (1-13), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[實施例(1-10)] [Example (1-10)]

將實施例(1-1)之TT73取代成合成例(1-16)所得之TI73L1外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TI73L1 obtained in Synthesis Example (1-16), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[實施例(1-11)] [Embodiment (1-11)]

將實施例(1-1)之TT73取代成合成例(1-11)所得之TI46外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TI46 obtained in Synthesis Example (1-11), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[比較例(1-1)] [Comparative Example (1-1)]

將實施例(1-1)之TT73取代成合成例(1-1)所得之pTEOS外,與實施例(1-1)同樣操作,測量鹼顯影 性、耐熱性、水接觸角。其結果如表3所示。圖型之光學顯微鏡觀察的結果如圖5所示。 The TT73 of Example (1-1) was replaced with the pTEOS obtained in Synthesis Example (1-1), and the alkali development was measured in the same manner as in Example (1-1). Sex, heat resistance, water contact angle. The results are shown in Table 3. The results of the optical microscope observation of the pattern are shown in Fig. 5.

[比較例(1-2)] [Comparative Example (1-2)]

將實施例(1-1)之TT73取代成合成例(1-2)所得之TM73外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TM73 obtained in Synthesis Example (1-2), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[比較例(1-3)] [Comparative Example (1-3)]

將實施例(1-1)之TT73取代成合成例(1-3)所得之TE73外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TE73 obtained in Synthesis Example (1-3), and the alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[比較例(1-4)] [Comparative Example (1-4)]

將實施例(1-1)之TT73取代成合成例(1-14)所得之TI73M3外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TI73M3 obtained in Synthesis Example (1-14), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

[比較例(1-5)] [Comparative Example (1-5)]

將實施例(1-1)之TT73取代成合成例(1-15)所得之TI73M4外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。圖型之光學顯微鏡觀察的結果如圖6所示。 The TT73 of Example (1-1) was replaced with TI73M4 obtained in Synthesis Example (1-15), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3. The results of the optical microscope observation of the pattern are shown in Fig. 6.

[比較例(1-6)] [Comparative Example (1-6)]

將實施例(1-1)之TT73取代成合成例(1-17)所得之TI73L2外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。使用TI73L2,所得之旋轉塗佈膜,可以目視確認的程度,明顯發現放射線狀之塗佈不均,得知製膜性差。 The TT73 of Example (1-1) was replaced with TI73L2 obtained in Synthesis Example (1-17), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). Using TI73L2, the obtained spin coating film was visually confirmed, and the coating unevenness in the form of radiation was clearly observed, and the film forming property was poor.

[比較例(1-7)] [Comparative Example (1-7)]

將實施例(1-1)之TT73取代成合成例(1-18)所得之TO73外,與實施例(1-1)同樣操作,測量鹼顯影性、耐熱性、水接觸角。其結果如表3所示。 The TT73 of Example (1-1) was replaced with TO73 obtained in Synthesis Example (1-18), and alkali developability, heat resistance, and water contact angle were measured in the same manner as in Example (1-1). The results are shown in Table 3.

關於表3之結果,比較實施例(1-1)至實施例(1-11)及比較例(1-1)至比較例(1-7)。 With respect to the results of Table 3, Comparative Examples (1-1) to (1-11) and Comparative Examples (1-1) to Comparative Examples (1-7) were compared.

實施例(1-1)至實施例(1-11)及比較例(1-2)至比較例(1-3)係與比較例(1-4)至比較例(1-5)及比較例(1-7)比較,得知看見10μm以下之5μm的圖型化的鹼顯影性良好。 Examples (1-1) to (1-11) and Comparative Examples (1-2) to (1-3) were compared with Comparative Examples (1-4) to Comparative Examples (1-5). In the comparison of the examples (1-7), it was found that the patterning alkali developability of 5 μm of 10 μm or less was good.

實施例(1-11)係重量平均分子量為700至4000之範圍內,但是構成矽化合物(A)之水解性矽烷(a1)為40莫耳%、水解性矽烷(a2)為60莫耳%所共 聚合的組成,但是水接觸角有若干在較佳的範圍外,但是依用途仍可使用。 Example (1-11) is a weight average molecular weight of 700 to 4000, but the hydrolyzable decane (a1) constituting the hydrazine compound (A) is 40 mol%, and the hydrolyzable decane (a2) is 60 mol%. Total The composition of the polymerization, but some of the water contact angles are outside the preferred range, but can be used depending on the application.

比較例(1-4)及比較例(1-5)係構成矽化合 物(A)之水解性矽烷(a1)為70莫耳%、水解性矽烷(a2)為30莫耳%所共聚合的聚合比例為範圍內的組成,但是重量平均分子量為700至4000之範圍外。 Comparative Examples (1-4) and Comparative Examples (1-5) constitute a bismuth compound The hydrolyzable decane (a1) of the substance (A) is 70 mol%, and the hydrolyzable decane (a2) is a composition in a range in which the polymerization ratio is 30 mol%, but the weight average molecular weight is in the range of 700 to 4,000. outer.

比較例(1-7)係重量平均分子量為700至 4000之範圍內,且構成矽化合物(A)之水解性矽烷(a1)為70莫耳%、水解性矽烷(a2)為30莫耳%所共聚合的聚合比例在範圍內,但是水解性矽烷(a2)之L為碳原子數8之烷基,在碳原子數3~6之直鏈、分支或環狀之烷基之範圍外。 Comparative Example (1-7) has a weight average molecular weight of 700 to In the range of 4000, the polymerization ratio of the hydrolyzable decane (a1) constituting the ruthenium compound (A) is 70 mol%, and the hydrolyzable decane (a2) is 30 mol%, but the hydrolyzable decane is in the range. L in (a2) is an alkyl group having 8 carbon atoms, and is outside the range of a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms.

實施例(1-1)至實施例(1-11)及比較例 (1-1)及比較例(1-4)至(1-5)及比較例(1-7)係與比較例(1-2)及比較例(1-3)進行比較,得知折射率之熱時變化良好。 Example (1-1) to Example (1-11) and Comparative Example (1-1) and Comparative Examples (1-4) to (1-5) and Comparative Example (1-7) were compared with Comparative Example (1-2) and Comparative Example (1-3) to find refraction. The rate of change is good.

比較例(1-2)及比較例(1-3)係水解性矽烷 (a2)之L為碳原子數1及2之烷基,在碳原子數3~6之直鏈、分支或環狀之烷基之範圍外。折射率在熱時降低的現象,在使用L為碳原子數1及2之矽化合物(A)時,聚合物中,成為環狀之低分子化合物在熱時產生昇華,成為空氣層的緣故。空氣之折射率為1.0,故膜中混入空氣層時,膜之折射率會降低已為人知。 Comparative Example (1-2) and Comparative Example (1-3) are hydrolyzable decane L in (a2) is an alkyl group having 1 and 2 carbon atoms, and is outside the range of a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms. When the refractive index is lowered during heat, when L is a compound (A) having 1 and 2 carbon atoms, the low molecular compound which is a ring in the polymer undergoes sublimation upon heat and becomes an air layer. Since the refractive index of air is 1.0, it is known that the refractive index of the film is lowered when the air layer is mixed in the film.

將實施例(1-1)至實施例(1-11)及比較例 (1-1)至比較例(1-7)之水接觸角進行比較。實施例(1-1)至實施例(1-10)係使用協和界面科學(股)製、全自動接觸角計Drop Master系列DM700,將純水由尺寸為22G的針製作液滴,以液滴法(θ/2法)算出液體附著於被膜表面之液滴之水的接觸角為60°至80°,在範圍內。比較例(1-2)、比較例(1-3)、比較例(1-4)及比較例(1-5)之水的接觸角為60°至80°,在範圍內,但是折射率之熱時變化不良,或看見10μm以下之5μm之圖型化之鹼顯影性不良,作為目的之被膜時,性能不足。 Example (1-1) to Example (1-11) and Comparative Example The water contact angles of (1-1) to Comparative Example (1-7) were compared. Examples (1-1) to (1-10) were made by using the Concord Interface Science (system), fully automatic contact angle meter Drop Master series DM700, and the pure water was made into droplets of 22G needles. The drop method (θ/2 method) calculates the contact angle of water in which the liquid adheres to the droplets on the surface of the film is 60° to 80°. The contact angles of water of Comparative Example (1-2), Comparative Example (1-3), Comparative Example (1-4), and Comparative Example (1-5) were 60° to 80°, in the range, but the refractive index When the heat is not changed, or the 5 μm of the patterned alkali of 10 μm or less is poor in developability, the performance is insufficient when it is used as a target film.

本發明中,依據<膜形成組成物(1)及被膜之製作>之表3所示結果,可形成適合於具有高折射率,可達成高透明性、高耐熱性、高耐光性、高硬度之顯示裝置用膜製作之膜形成組成物及圖型形成方法,但是依使用的用途,有需要更高水準之圖型化特性或阻劑膜剝離後之膜粗糙防止特性、熟成特性的用途。例如[1]矽化合物(A)使用將水解性矽烷在非醇溶劑中進行水解縮合而得者,[2]使用硬化觸媒(D),[3]使用二酮化合物(E),[4]使用水(F)及酸(G),依據<膜形成組成物(2)及被膜之製作>、<膜形成組成物(3)及被膜之製作>、<膜形成組成物(4)及被膜之製作>所示結果,可適用於上述用途,如以下所示。 In the present invention, according to the results shown in Table 3 of <Film Forming Composition (1) and Film Preparation>, it is possible to form a high refractive index, high transparency, high heat resistance, high light resistance, and high hardness. In the film forming composition and the pattern forming method of the film for a display device, depending on the use, there is a need for a higher level of patterning property or a film roughness preventing property and a ripening property after the resist film is peeled off. For example, [1] the hydrazine compound (A) is obtained by hydrolyzing and condensing a hydrolyzable decane in a non-alcoholic solvent, [2] using a hardening catalyst (D), [3] using a diketone compound (E), [4] Water (F) and acid (G) are used, and <film formation composition (2) and film production>, <film formation composition (3) and film production>, <film formation composition (4) and The results of the production of the film > can be applied to the above applications, as shown below.

<膜形成組成物(2)及被膜之製作> <Film formation composition (2) and production of film> [實施例(2-1)] [Embodiment (2-1)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加10.9446g之丙二醇單乙基醚(簡稱PGEE),添加合成例(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之苄基三乙基氯化銨(簡稱BTEAC)以PGEE稀釋形成1質量%的溶液0.0915g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,室溫下混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-1))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 10.94446 g of propylene glycol monoethyl ether (PGEE) was added, and 2.2875 g of P1 obtained in Synthesis Example (2-1) was added (relatively In the case of the solid component of B1, the solid content of polyoxymethane is 35% by mass), and benzyl triethylammonium chloride (abbreviated as BTEAC) as a curing catalyst (D) is added to form a 1% by mass solution by dilution with PGEE. 0.0915 g, R-30-N, manufactured by Dainippon Ink Chemical Industry Co., Ltd., as a surfactant, was diluted with PGEE to form a 0.1 mass% solution of 0.1830 g, and mixed at room temperature until completely homogeneous to obtain a total solid content. A varnish having a mass of 7.5% by mass (V(2-1) for short).

[實施例(2-2)] [Embodiment (2-2)]

將實施例(2-1)之P1取代成合成例(2-2)所得之P2外,與實施例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-2))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (2-1) except that P1 of Example (2-1) was replaced by P2 obtained in Synthesis Example (2-2). (2-2)).

[實施例(2-3)] [Embodiment (2-3)]

將實施例(2-1)之P1取代成合成例(2-3)所得之P3外,與實施例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-3))。 In the same manner as in Example (2-1) except that P1 of Example (2-1) was replaced by P3 obtained in Synthesis Example (2-3), a varnish having a total mass of 7.5% by mass of solid content (V for short) was obtained. (2-3)).

[實施例(2-4)] [Example (2-4)]

將實施例(2-1)之P1取代成合成例(2-4)所得之P4外,與實施例(2-1)同樣操作,得到固體成分之總質 量為7.5質量%之清漆(簡稱V(2-4))。 The P1 obtained in the example (2-1) was replaced with the P4 obtained in the synthesis example (2-4), and the total mass of the solid component was obtained in the same manner as in the example (2-1). A varnish having a quantity of 7.5% by mass (V(2-4) for short).

[實施例(2-5)] [Embodiment (2-5)]

將實施例(2-1)之P1取代成合成例(2-5)所得之P5外,與實施例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-5))。 In the same manner as in the example (2-1) except that P1 of the example (2-1) was replaced by the P5 obtained in the synthesis example (2-5), a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as V) was obtained. (2-5)).

[實施例(2-6)] [Embodiment (2-6)]

將實施例(2-1)之P1取代成合成例(2-6)所得之P6外,與實施例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-6))。 In the same manner as in the example (2-1) except that P1 of the example (2-1) was replaced by the P6 obtained in the synthesis example (2-6), a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as V) was obtained. (2-6)).

[實施例(2-7)] [Example (2-7)]

將實施例(2-1)之P1取代成合成例(2-9)所得之P9外,與實施例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-7))。 In the same manner as in the example (2-1) except that P1 of the example (2-1) was replaced by the P9 obtained in the synthesis example (2-9), a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as V) was obtained. (2-7)).

[實施例(2-8)] [Embodiment (2-8)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加9.4379g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液1.8300g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30- N以PGEE稀釋形成1質量%的溶液0.1830g,室溫下混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-8))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 9.4379 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was solid relative to the solid content of B1) The solid content of the siloxane is 35% by mass), and 1.8300 g of a 1% by mass solution of BTEAC as a curing catalyst (D) is added and diluted with PGEE, and a large Japanese ink chemical industry (share) is added as a surfactant. R-30- N was diluted with PGEE to form 0.1830 g of a 1% by mass solution, and mixed at room temperature until it was completely uniform, and a varnish (referred to as V(2-8)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(2-9)] [Embodiment (2-9)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加10.9446g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之苄基三甲基氯化銨(簡稱BTMAC)以PGEE稀釋形成1質量%的溶液0.0915g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,室溫下混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(2-9))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 10.94446 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the siloxane is 35% by mass), and benzyl trimethylammonium chloride (abbreviated as BTMAC) as a curing catalyst (D) is added to dilute PGEE to form a 0.01% by mass solution of 0.019% by weight, and is added as a surfactant. R-30-N manufactured by Nippon Ink Chemical Industry Co., Ltd. was diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and mixed at room temperature until completely uniform, to obtain a varnish having a total mass of 7.5% by mass of solid components ( Referred to as V (2-9)).

[參考例(2-1)] [Reference Example (2-1)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加11.0239g之PGEE,添加合成例(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,室溫下混合直到完全均勻為止,得到未添加硬化觸媒之固體成分之總質量為7.5質量%之清漆(簡稱RV(2-1))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 1,1.0239 g of PGEE was added, and 2.2875 g of P1 obtained in Synthesis Example (2-1) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the decane was 35 mass%), and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd., which is a surfactant, was added and diluted with PGEE to form a 0.1 mass% solution of 0.1830 g, and mixed at room temperature until When it was completely uniform, a varnish (abbreviated as RV (2-1)) having a total mass of the solid component to which no hardening catalyst was added was 7.5% by mass.

[參考例(2-2)] [Reference Example (2-2)]

除了將參考例(2-1)之P1取代成合成例(2-2)所得之P2外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-2))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P2 obtained in Synthesis Example (2-2). RV (2-2)).

[參考例(2-3)] [Reference Example (2-3)]

除了將參考例(2-1)之P1取代成合成例(2-3)所得之P3外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-3))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P3 obtained in Synthesis Example (2-3). RV (2-3)).

[參考例(2-4)] [Reference Example (2-4)]

除了將參考例(2-1)之P1取代成合成例(2-4)所得之P4外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-4))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P4 obtained in Synthesis Example (2-4). RV (2-4)).

[參考例(2-5)] [Reference Example (2-5)]

除了將參考例(2-1)之P1取代成合成例(2-5)所得之P5外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-5))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P5 obtained in Synthesis Example (2-5). RV (2-5)).

[參考例(2-6)] [Reference Example (2-6)]

除了將參考例(2-1)之P1取代成合成例(2-7)所得之P7外,與參考例(2-1)同樣操作,得到固體成分之 總質量為7.5質量%之清漆(簡稱RV2-6))。 A solid component was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P7 obtained in Synthesis Example (2-7). A varnish (referred to as RV2-6) with a total mass of 7.5% by mass.

[參考例(2-7)] [Reference Example (2-7)]

除了將參考例(2-1)之P1取代成合成例(2-8)所得之P8外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-7))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P8 obtained in Synthesis Example (2-8). RV (2-7)).

[參考例(2-8)] [Reference Example (2-8)]

除了將參考例(2-1)之P1取代成合成例(2-10)所得之P10外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-8))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was replaced by P10 obtained in Synthesis Example (2-10). RV (2-8)).

[參考例(2-9)] [Reference Example (2-9)]

除了將參考例(2-1)之P1取代成合成例(2-11)所得之P11外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-9))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was replaced by P11 obtained in Synthesis Example (2-11). RV (2-9)).

[參考例(2-10)] [Reference Example (2-10)]

除了將參考例(2-1)之P1取代成合成例(2-12)所得之P12外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-10))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P12 obtained in Synthesis Example (2-12). RV (2-10)).

[參考例(2-11)] [Reference Example (2-11)]

除了將參考例(2-1)之P1取代成合成例(2-13)所 得之P13外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-11))。 Substituting P1 of Reference Example (2-1) for Synthesis Example (2-13) In the same manner as in Reference Example (2-1), a varnish (abbreviated as RV (2-11)) having a total mass of the solid component of 7.5% by mass was obtained.

[參考例(2-12)] [Reference Example (2-12)]

除了將參考例(2-1)之P1取代成合成例(2-14)所得之P14外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-12))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P14 obtained in Synthesis Example (2-14). RV (2-12)).

[參考例(2-13)] [Reference Example (2-13)]

除了將參考例(2-1)之P1取代成合成例(2-15)所得之P15外,與參考例(2-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(2-13))。 A varnish having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Reference Example (2-1) except that P1 of Reference Example (2-1) was substituted with P15 obtained in Synthesis Example (2-15). RV (2-13)).

<被膜之製作> <production of film> [實施例(2-10)至實施例(2-18)及參考例(2-14)至參考例(2-26)] [Examples (2-10) to (2-18) and Reference Examples (2-14) to Reference Examples (2-26)] [圖型化特性(藉由表3之鹼顯影性試驗經嚴格評價的試驗)] [Characteristic characteristics (tests which have been rigorously evaluated by the alkali developability test of Table 3)]

所得之V(2-1)至V(2-9)及RV(2-1)至RV(2-13)評價圖型化特性。各清漆係使用東京Electron(股)製clean track ACT8,旋轉塗佈於以六甲基二矽氮烷(HMDS)處理之8inch的矽基板,使膜厚成為100nm,使用加熱板,以150℃加熱1分鐘。接著,由所得之被膜之上,旋轉塗佈AZ3100(AZ ELECTRONIC MATERIALS 公司製)使膜厚成為1.5μm,使用加熱板,以100℃加熱1分鐘。然後,使用(股)Nikon製i線步進機NSR-2205i12D,通過光罩,將300mJ/cm2之曝光量進行光照射。光照射後,使用2.38質量%之氫氧化四甲基銨(簡稱TMAH),進行30秒顯影,純水清洗1分鐘後,以空氣使乾燥。接著,將感光性阻劑於PGME中浸漬2分鐘,剝離阻劑,以光學顯微鏡觀察Line:Space為1:1之5μm之處。光學顯微鏡觀察的結果,在Line:Space為1:1之5μm附近的例評價為○,離開Line:Space為1:1之5μm之例或殘留膜的例評價為×。 The obtained V(2-1) to V(2-9) and RV(2-1) to RV(2-13) were evaluated for patterning characteristics. Each varnish was spin-coated on an 8 inch ruthenium substrate treated with hexamethyldioxane (HMDS) to a thickness of 100 nm using a clean track ACT8 manufactured by Tokyo Electron Co., Ltd., and heated at 150 ° C using a hot plate. 1 minute. Next, AZ3100 (manufactured by AZ ELECTRONIC MATERIALS Co., Ltd.) was spin-coated on the obtained film to have a film thickness of 1.5 μm, and heated at 100 ° C for 1 minute using a hot plate. Then, using an i-line stepper NSR-2205i12D manufactured by Nikon, a light exposure amount of 300 mJ/cm 2 was irradiated through a photomask. After the light irradiation, 2.38 mass% of tetramethylammonium hydroxide (TMAH) was used for development for 30 seconds, and the mixture was washed with pure water for 1 minute, and then dried with air. Next, the photosensitive resist was immersed in PGME for 2 minutes, and the resist was peeled off, and the line: Space was observed by an optical microscope to be 5 μm of 1:1. As a result of observation by an optical microscope, an example in the vicinity of Line:Space of 1:1 to 5 μm was evaluated as ○, and an example in which Line:Space was 1:1 to 5 μm or an example of the residual film was evaluated as ×.

V(2-1)至V(2-9)及RV(2-1)至RV(2-13)之結果如表4所示。又,V(2-1)至V(2-3)及RV(2-1)至RV(2-3)之觀察結果如圖7至圖12所示。 The results of V(2-1) to V(2-9) and RV(2-1) to RV(2-13) are shown in Table 4. Further, observation results of V(2-1) to V(2-3) and RV(2-1) to RV(2-3) are shown in FIGS. 7 to 12.

此外,圖7至圖9係在Line:Space為1:1之5μm之處,使用電子顯微鏡,由圖型之頂方向,測量Space部分的長度。測量長度的結果,圖7之Space部分之寬為5.10μm,圖8之Space部分之寬為5.07μm,圖9之Space部分之寬為5.07μm。在此,Space部分係溶解於鹼顯影液的部分,越接近5μm,顯示可形成更良好的圖型。 Further, Fig. 7 to Fig. 9 measure the length of the Space portion from the top direction of the pattern using an electron microscope where Line:Space is 1:1 to 5 μm. As a result of measuring the length, the width of the Space portion of Fig. 7 was 5.10 μm, the width of the Space portion of Fig. 8 was 5.07 μm, and the width of the Space portion of Fig. 9 was 5.07 μm. Here, the Space portion is dissolved in the portion of the alkali developing solution, and the closer to 5 μm, the better the pattern can be formed.

[耐熱折射率] [heat resistant refractive index]

所得之V(2-1)至V(2-9)及RV(2-1)至RV(2-13)評價耐熱折射率。各清漆係旋轉塗佈於矽基板上,使膜厚成為100nm,使用加熱板,以150℃加熱1分鐘。加 熱後,測量450nm之折射率。接著,使用加熱板,以300℃加熱1小時,測量450nm之折射率後,比較300℃加熱前後之折射率。折射率之比較結果如表4所示。 The obtained V(2-1) to V(2-9) and RV(2-1) to RV(2-13) were evaluated for the heat-resistant refractive index. Each varnish was spin-coated on a ruthenium substrate to have a film thickness of 100 nm, and heated at 150 ° C for 1 minute using a hot plate. plus After the heat, the refractive index at 450 nm was measured. Next, using a hot plate, the film was heated at 300 ° C for 1 hour, and the refractive index at 450 nm was measured, and then the refractive index before and after heating at 300 ° C was compared. The results of the comparison of the refractive indices are shown in Table 4.

[水接觸角] [water contact angle]

各清漆係測量水接觸角。旋轉塗佈於矽基板上,使膜厚成為100nm,使用加熱板,以150℃加熱1分鐘,接著,以100℃加熱1分鐘。此加熱板之2階段加熱係再現塗佈感光性阻劑,經乾燥之鹼顯影前之熱經歷的加熱條件。 Each varnish measures the water contact angle. The film was spin-coated on a ruthenium substrate to a thickness of 100 nm, and heated at 150 ° C for 1 minute using a hot plate, followed by heating at 100 ° C for 1 minute. The two-stage heating of the hot plate reproduces the heating conditions under which the photosensitive resist is applied and the heat before drying by the dried alkali is developed.

所得之被膜使用協和界面科學(股)製、全自動接觸角計Drop Master系列DM700,將純水由尺寸為22G的針製作液滴,以液滴法(θ/2法)算出液體附著於被膜表面之液滴之水接觸角。其結果如表4所示。 The obtained film was made by using the Concord Interface Science Co., Ltd., a fully automatic contact angle meter, Drop Master series DM700, and the pure water was made into a droplet of a size of 22 G, and the liquid was attached to the film by the droplet method (θ/2 method). The water contact angle of the droplets on the surface. The results are shown in Table 4.

注)表3之鹼顯影性試驗中,Line:Space為 1:1之部分之寬為5.12~5.15μm,也評價為○,但是表4圖型化特性試驗為要求該等以上之水準的試驗,因此,未達5μm附近者評價為×。 Note) In the alkali developability test of Table 3, Line:Space is The width of the portion of 1:1 is 5.12 to 5.15 μm, which is also evaluated as ○. However, the test for the patterning characteristic of Table 4 is a test requiring the above level. Therefore, it is evaluated as × when it is less than 5 μm.

以V(2-1)至V(2-9)及RV(2-1)至RV (2-13)作為被膜,比較該被膜之圖型化特性時,實施例(2-10)至實施例(2-18)、參考例(2-25)及參考例 (2-26)之圖型化特性良好。 From V(2-1) to V(2-9) and RV(2-1) to RV (2-13) When comparing the patterning characteristics of the film as a film, Examples (2-10) to (2-18), Reference Example (2-25), and Reference Examples (2-26) The patterning characteristics are good.

實施例(2-10)至實施例(2-18)係由本發明 之矽化合物(A)之重量平均分子量在700~4000之範圍內,以構成矽化合物(A)之水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%所共聚合,且水解性矽烷(a2)之L為碳原子數3~6之直鏈、分支或環狀之烷基所構成,具有1至100nm之平均粒徑與1.50至2.70之折射率之無機粒子(B)、硬化觸媒(C)及溶劑(D)所構成之組成物所得的被膜之水的接觸角為60°至80°之範圍內。 Embodiments (2-10) to (2-18) are the inventions The weight average molecular weight of the compound (A) is in the range of from 700 to 4,000, and the hydrolyzable decane (a1) constituting the hydrazine compound (A) is from 90 mol% to 50 mol%, and the hydrolyzable decane (a2) is 10 mol% to 50 mol% of the copolymerization, and the L of the hydrolyzable decane (a2) is a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms, and has an average particle size of 1 to 100 nm. The contact angle of the water of the film obtained by the composition of the inorganic particles (B) having a refractive index of 1.50 to 2.70, the curing catalyst (C) and the solvent (D) is in the range of 60 to 80.

從硬化觸媒之必要性的觀點,實施例(2- 10)至實施例(2-14)與參考例(2-14)至參考例(2-18)進行比較。實施例(2-10)至實施例(2-14)含有作為硬化觸媒之BTEAC,參考例(2-14)至參考例(2-18)不含BTEAC之組成物。藉由含有硬化觸媒,熱時進行硬化,被膜被賦予阻劑溶劑耐性、鹼顯影液及阻劑膜剝離液耐性,可形成10μm以下之圖型。而不含硬化觸媒的參考例(2-14)至參考例(2-18),未被賦予阻劑溶劑耐性、鹼顯影液及阻劑膜剝離液耐性,特別是鹼耐性不足,因此形成圖型之前,所有被膜部分溶解於鹼顯影液中,而無法得到圖型。 From the viewpoint of the necessity of hardening the catalyst, the embodiment (2- 10) Comparison to Example (2-14) and Reference Example (2-14) to Reference Example (2-18). Examples (2-10) to (2-14) contained BTEAC as a curing catalyst, and Reference Examples (2-14) to Reference Examples (2-18) contained a composition of BTEAC. By containing a curing catalyst, it is hardened by heat, and the film is provided with a solvent resistance to a resist, an alkali developer, and a resist film peeling liquid, and a pattern of 10 μm or less can be formed. The reference example (2-14) to the reference example (2-18), which does not contain the hardening catalyst, is not imparted with the solvent resistance of the resist, the alkali developer and the resist film peeling liquid, and particularly the alkali resistance is insufficient, so that it is formed. Before the pattern, all the film portions were dissolved in the alkali developing solution, and the pattern could not be obtained.

由重量平均分子量之觀點,實施例(2- 11)、實施例(2-15)、實施例(2-16)及參考例(2-21)進行比較。聚合物之重量平均分子量係實施例(2- 11)為1500、實施例(2-15)為735、實施例(2-16)為3401、參考例(2-21)為4545。在此,使用重量平均分子量為700~4000之範圍內的聚合物,作為組成物、被膜者之圖型化特性良好。使用參考例(2-21)之重量平均分子量超過4000之聚合物,組成物、作為被膜者之圖型化特性為殘留膜,因為高分子量體之溶解性降低所造成的。 From the viewpoint of weight average molecular weight, examples (2- 11), Example (2-15), Example (2-16), and Reference Example (2-21) were compared. The weight average molecular weight of the polymer is an example (2- 11) is 1500, embodiment (2-15) is 735, embodiment (2-16) is 3401, and reference example (2-21) is 4545. Here, a polymer having a weight average molecular weight of 700 to 4,000 is used, and the patterning property of the composition or the film is good. When the polymer having a weight average molecular weight of more than 4,000 in Reference Example (2-21) was used, the patterning property of the composition and the film as a film was a residual film because the solubility of the high molecular weight body was lowered.

構成矽化合物(A)之水解性矽烷(a1)與水 解性矽烷(a2)之共聚合比率的觀點,實施例(2-11)、實施例(2-13)、實施例(2-14)及參考例(2-20)進行比較。聚合物之共聚合比率係實施例(2-11)為(a1)/(a2)=70莫耳%/30莫耳%、實施例(2-13)為(a1)/(a2)=90莫耳%/10莫耳%、實施例(2-14)為(a1)/(a2)=50莫耳%/50莫耳%、參考例(2-20)為(a1)/(a2)=40莫耳%/60莫耳%。在此,使用構成矽化合物(A)之水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%所共聚合的聚合物,組成物、作為被膜者之圖型化特性良好。使用參考例(2-20)之共聚合比率為(a1)/(a2)=40莫耳%/60莫耳%之聚合物,作為組成物、被膜者之圖型化特性係無法得到圖型的結果,因為疏水性太高,失去對鹼顯影液之溶解性所造成的。 Hydrolyzable decane (a1) constituting hydrazine compound (A) and water From the viewpoints of the copolymerization ratio of the deuterated decane (a2), the examples (2-11), the examples (2-13), the examples (2-14), and the reference examples (2-20) were compared. The copolymerization ratio of the polymer is (a1) / (a2) = 70 mol% / 30 mol%, and the embodiment (2-13) is (a1) / (a2) = 90. Mohr%/10 mol%, Example (2-14) is (a1)/(a2)=50 mol%/50 mol%, and reference example (2-20) is (a1)/(a2) = 40 mole % / 60 mole %. Here, the polymer copolymerized with the hydrolyzable decane (a1) constituting the hydrazine compound (A) is from 90 mol% to 50 mol%, and the hydrolyzable decane (a2) is from 10 mol% to 50 mol%. The composition and the patterning property of the film are good. When the copolymerization ratio of the reference example (2-20) was (a1)/(a2)=40 mol%/60 mol%, the patterning property of the composition or the film was not obtained. As a result, the hydrophobicity is too high, and the solubility in the alkali developer is lost.

構成矽化合物(A)之水解性矽烷(a2)中之 L之碳原子數的觀點,實施例(2-10)至實施例(2-12)及參考例(2-19)、參考例(2-22)至參考例(2-24)進 行比較。水解性矽烷(a2)中之L之碳原子數係實施例(2-10)為3、實施例(2-11)為4、實施例(2-12)為6、參考例(2-19)為0、參考例(2-22)為1、參考例(2-23)為2、參考例(2-24)為8。在此,使用水解性矽烷(a2)之L為碳原子數3~6的聚合物,組成物、作為被膜者之圖型化特性及耐熱折射率良好。參考例(2-19)之碳原子數為0的聚矽氧烷、參考例(2-22)之碳原子數為1的聚合物、參考例(2-23)之碳原子數為2的聚合物係圖型化特性為剝離顯影,無法形成均勻之5μm的圖型。使碳原子數為0~2之聚合物共聚合時,膜進行縮合,無法得到對鹼顯影液之溶解顯影性。 In the hydrolyzable decane (a2) constituting the hydrazine compound (A) From the viewpoints of the number of carbon atoms of L, the examples (2-10) to the examples (2-12) and the reference examples (2-19), the reference examples (2-22) to the reference examples (2-24) Line comparison. The number of carbon atoms of L in the hydrolyzable decane (a2) is 3, the examples (2-11) are 4, the examples (2-12) are 6, and the reference examples (2-19) ) is 0, reference example (2-22) is 1, reference example (2-23) is 2, and reference example (2-24) is 8. Here, L which is a hydrolyzable decane (a2) is a polymer having 3 to 6 carbon atoms, and the composition, the patterning property as a film, and the heat-resistant refractive index are good. Reference Example (2-19) A polyoxyalkylene having a carbon number of 0, a polymer having a carbon number of 1 in Reference Example (2-22), and a carbon number of 2 in Reference Example (2-23) The polymer patterning property was peel development, and a uniform pattern of 5 μm could not be formed. When the polymer having a carbon number of 0 to 2 is copolymerized, the film is condensed, and the solubility developability to the alkali developer cannot be obtained.

參考例(2-24)之碳原子數為8的單體進行 共聚合的聚合物,不溶解於鹼顯影液中,圖型化特性不良。此結果可由鹼顯影時之膜表面之親疏水來說明。鹼顯影液一般為水溶液,例如有稀薄的TMAH水溶液或氫氧化鉀水溶液等。此等顯影液為水溶液,故膜之疏水性高時,不會滲透至膜中而排斥,因此,原本已失去顯影性。 被膜長時間浸漬於鹼顯影液時,也有會溶解的情形,但是考慮製程之生產率時,至少120秒以內結束鹼顯影步驟為佳,故排斥鹼顯影液程度的疏水性,為不佳的膜特性。 The monomer of the reference example (2-24) having a carbon number of 8 is carried out. The copolymerized polymer does not dissolve in the alkali developer and has poor patterning properties. This result can be illustrated by the hydrophilicity of the film surface upon alkali development. The alkali developer is usually an aqueous solution, for example, a thin aqueous solution of TMAH or an aqueous solution of potassium hydroxide. Since these developing solutions are aqueous solutions, when the hydrophobicity of the film is high, they do not permeate into the film and repel. Therefore, the developing property is originally lost. When the film is immersed in the alkali developing solution for a long period of time, it may be dissolved. However, in consideration of the productivity of the process, it is preferable to terminate the alkali developing step at least within 120 seconds, so that the hydrophobicity of the alkali developing solution is repelled, which is a poor film property. .

由此等之結果發現,欲兼顧圖型化特性與耐 熱折射率時,使特定之單體以特定之比率共聚合是很重要,特別是水解性矽烷(a2)中之L之碳原子數中有最佳值。 As a result of this, it was found that it is desirable to take into account the patterning characteristics and resistance. In the case of the thermal refractive index, it is important to copolymerize a specific monomer in a specific ratio, and particularly, among the number of carbon atoms of L in the hydrolyzable decane (a2), there is an optimum value.

關於鹼顯影性,已於上述鹼顯影時之膜表面 之親疏水性極重要,由實施例(2-10)至實施例(2-18)及參考例(2-14)至(2-26)之結果,鹼顯影性之餘裕(MARGIN)廣,且成為溶解顯影性,可形成10μm以下之圖型的膜之參數係水之接觸角為60°至80°之範圍被證明。 Regarding alkali developability, the film surface which has been developed by the above alkali The hydrophobicity is extremely important, and as a result of the examples (2-10) to (2-18) and the reference examples (2-14) to (2-26), the margin of alkali developability (MARGIN) is wide, and It is proved that the parameter of the film which can be formed into a pattern of 10 μm or less in the dissolution developability is a range in which the contact angle of water is from 60° to 80°.

[耐光性試驗] [Light resistance test] [實施例(2-19)至實施例(2-20)及參考例(2-27)至參考例(2-28)] [Examples (2-19) to (2-20) and Reference Examples (2-27) to Reference Examples (2-28)]

所得之V(2-1)至V(2-2)及RV(2-12)至RV(2-13)評價耐光性。 The obtained V(2-1) to V(2-2) and RV(2-12) to RV(2-13) were evaluated for light resistance.

V(2-1)至V(2-2)及RV(2-12)至RV(2-13)係旋轉塗佈於矽基板上,使膜厚成為100nm,使用加熱板,以150℃加熱60分鐘。加熱後,測量膜厚、450nm之折射率、平均透過率。接著,進行耐光性試驗,測量耐光性試驗後之膜的膜厚、折射率、平均透過率。其結果如表5所示。 V(2-1) to V(2-2) and RV(2-12) to RV(2-13) were spin-coated on a ruthenium substrate to have a film thickness of 100 nm, and heated at 150 ° C using a hot plate. 60 minutes. After heating, the film thickness, the refractive index at 450 nm, and the average transmittance were measured. Next, the light resistance test was performed, and the film thickness, refractive index, and average transmittance of the film after the light resistance test were measured. The results are shown in Table 5.

膜厚及450nm之折射率係測量矽基板上之被膜,平均透過率係測量石英基板上之被膜。平均透過率為算出400nm至800nm之平均透過率。 The film thickness and the refractive index of 450 nm measure the film on the ruthenium substrate, and the average transmittance is a film on the quartz substrate. The average transmittance is calculated as an average transmittance of 400 nm to 800 nm.

耐光性試驗中之光照射係以一般財團法人日本Weathering Test Center來進行,以照度為38.7W/m2、曝光波長為320nm至400nm之xenon Arc Lamp為光源。試 驗機使用suga試驗機(股)製SX75-AP型。試驗環境係溫度為42±3℃、相對濕度為50±5%RH。 The light irradiation in the light resistance test was carried out by a general weather corporation Japan Weathering Test Center, and a xenon Arc Lamp having an illuminance of 38.7 W/m 2 and an exposure wavelength of 320 nm to 400 nm was used as a light source. The test machine was made of SX75-AP type using a suga test machine. The test environment has a temperature of 42 ± 3 ° C and a relative humidity of 50 ± 5% RH.

實施例(2-19)至實施例(2-20)及參考例(2-27)至參考例(2-28)之耐光性進行比較。實施例(2-19)至實施例(2-20)及參考例(2-27)至參考例(2-28)各自耐熱折射率及圖型化特性良好,但是參考例(2-27)至參考例(2-28)在耐光性試驗後之膜厚降低,折射率增大、平均透過率降低。而實施例(2-19)至實施例(2-20)在耐光性試驗後之膜厚、折射率、平均透過率未變化。 The light resistance of the examples (2-19) to (2-20) and the reference examples (2-27) to the reference examples (2-28) were compared. The heat-resistant refractive index and patterning characteristics of Examples (2-19) to (2-20) and Reference Examples (2-27) to Reference (2-28) were good, but Reference Example (2-27) In Reference Example (2-28), the film thickness after the light resistance test was lowered, the refractive index was increased, and the average transmittance was lowered. On the other hand, in Example (2-19) to Example (2-20), the film thickness, the refractive index, and the average transmittance after the light resistance test were not changed.

耐光性試驗之結果,僅是V(2-1)至V(2-2)之聚合物為完全水解型,RV(2-12)至RV(2-13)之聚合物為部分水解型之不同,單體之共聚合比率相同,重量平均分子量也為同程度之聚合物,因此,因聚合物之聚合方法之差異,產生明顯的差異。亦即,可知完全水解型之聚合物的耐光性試驗良好。完全水解型之聚合物,在加 熱步驟,膜之熱硬化反應結束,而部分水解型之聚合物在加熱步驟,熱硬化反應未完全結束,有烷氧基殘留,可能在耐光性試驗中進行反應所造成的。 As a result of the light resistance test, only the polymers of V(2-1) to V(2-2) are completely hydrolyzed, and the polymers of RV(2-12) to RV(2-13) are partially hydrolyzed. Differently, the copolymerization ratio of the monomers is the same, and the weight average molecular weight is also the same degree of the polymer, and therefore, a significant difference occurs due to the difference in the polymerization method of the polymer. That is, it was found that the polymer of the fully hydrolyzed type had a good light resistance test. Fully hydrolyzed polymer, in addition In the thermal step, the thermosetting reaction of the film is completed, and the partially hydrolyzed polymer is in the heating step, the thermosetting reaction is not completely completed, and the alkoxy group remains, which may be caused by the reaction in the light resistance test.

綜合以上的結果,為了兼顧作為LED用材料 所要求之耐熱折射率、圖型化特性、耐光性全部時,可藉由滿足以下要件來達成,亦即,由本發明之矽化合物(A)之重量平均分子量為700至4000之範圍內,構成矽化合物(A)之水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%進行共聚合,且水解性矽烷(a2)之L為碳原子數3~6之直鏈、分支或環狀之烷基所構成,具有1至100nm之平均粒徑與1.50至2.70之折射率之無機粒子(B)、硬化觸媒(D)及溶劑(C)所構成之組成物所得之被膜之水的接觸角為60°至80°之範圍內。 In summary, the above results are used as materials for LEDs. When all of the required heat-resistant refractive index, patterning property, and light resistance are satisfied, it can be achieved by satisfying the following requirements, that is, the weight average molecular weight of the ruthenium compound (A) of the present invention is in the range of 700 to 4,000. The hydrolyzable decane (a1) of the hydrazine compound (A) is from 90 mol% to 50 mol%, and the hydrolyzable decane (a2) is copolymerized from 10 mol% to 50 mol%, and the hydrolyzable decane (a2) L is a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms, and has inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70, and a hardening catalyst (D). And the contact angle of the water of the film obtained by the composition of the solvent (C) is in the range of 60 to 80.

<膜形成組成物(3)及被膜之製作> <Production of Film Forming Composition (3) and Film> [實施例(3-1)] [Example (3-1)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加7.9724g之丙二醇單乙基醚(簡稱PGEE),添加合成例(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為氫鍵性膜粗糙防止材之二酮化合物(E)丙酮酸乙酯(簡稱PE)3.0515g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGME稀釋成 為1質量%的溶液0.1830g,室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-1))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 7.9724 g of propylene glycol monoethyl ether (PGEE) was added, and 2.2875 g of P1 obtained in Synthesis Example (2-1) was added (relatively In the case of the solid component of B1, the solid content of the polyoxyalkylene oxide is 35% by mass), and 3.0515 g of a diketone compound (E) ethyl pyruvate (abbreviated as PE) as a hydrogen bond film roughness preventing material is added, and the interface is added as an interface. R-30-N made by the Japanese ink chemical industry (shares) of the active agent is diluted with PGME 0.1830 g of a 1 mass% solution was mixed at room temperature until it was completely uniform, and a varnish (referred to as V(3-1)) having a total mass of the solid component of 7.5% by mass was obtained.

所得之V(3-1)係評價折射率。旋轉塗佈於矽基板上,使V(3-1)之膜厚成為100nm,使用加熱板,以150℃加熱1分鐘。接著,使用加熱板以300℃加熱1小時,測量450nm之折射率的結果為1.613。 The obtained V(3-1) was used to evaluate the refractive index. The film was spin-coated on a ruthenium substrate so that the film thickness of V(3-1) was 100 nm, and the mixture was heated at 150 ° C for 1 minute using a hot plate. Next, heating was performed at 300 ° C for 1 hour using a hot plate, and the refractive index at 450 nm was measured and found to be 1.613.

[實施例(3-2)] [Embodiment (3-2)]

將實施例(3-1)之P1取代成合成例(2-2)所得之P2外,與實施例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-2))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (3-1) except that P1 of Example (3-1) was replaced by P2 obtained in Synthesis Example (2-2). (3-2)).

所得之V(3-2)係與實施例(3-1)同樣測量折射率的結果為1.610。 The obtained V(3-2) was measured in the same manner as in the example (3-1), and the result was 1.610.

[實施例(3-3)] [Embodiment (3-3)]

將實施例(3-1)之P1取代成合成例(2-3)所得之P3外,與實施例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-3))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (3-1) except that P1 of Example (3-1) was replaced by P3 obtained in Synthesis Example (2-3). (3-3)).

所得之V(3-3)係與實施例(3-1)同樣測量折射率的結果為1.603。 The obtained V(3-3) was measured in the same manner as in the example (3-1), and the result was 1.603.

[實施例(3-4)] [Embodiment (3-4)]

將實施例(3-1)之P1取代成合成例(2-4)所得之 P4外,與實施例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-4))。 Substituting P1 of the embodiment (3-1) for the synthesis example (2-4) In the same manner as in Example (3-1) except for P4, a varnish (abbreviated as V(3-4)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(3-5)] [Embodiment (3-5)]

將實施例(3-1)之P1取代成合成例(2-5)所得之P5外,與實施例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-5))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (3-1) except that P1 of Example (3-1) was replaced by P5 obtained in Synthesis Example (2-5). (3-5)).

[實施例(3-6)] [Embodiment (3-6)]

將實施例(3-1)之P1取代成合成例(2-6)所得之P6外,與實施例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-6))。 The P1 obtained in the example (3-1) was replaced with the P6 obtained in the synthesis example (2-6), and the same procedure as in the example (3-1) was carried out to obtain a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as V). (3-6)).

[實施例(3-7)] [Embodiment (3-7)]

將實施例(3-1)之P1取代成合成例(2-8)所得之P8外,與實施例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-7))。 The P1 obtained in the example (3-1) was replaced with the P8 obtained in the synthesis example (2-8), and the same procedure as in the example (3-1) was carried out to obtain a varnish having a total mass of 7.5% by mass of the solid component (abbreviated as V). (3-7)).

[實施例(3-8)] [Embodiment (3-8)]

將實施例(3-1)之PE取代成丙酮酸甲酯(簡稱PM)外,與實施例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(3-8))。 A varnish having a total mass of 7.5% by mass of a solid component (V(3) was obtained in the same manner as in Example (3-1) except that the PE of Example (3-1) was substituted with methyl pyruvate (abbreviated as PM). -8)).

[實施例(3-9)] [Embodiment (3-9)]

將實施例(3-1)之PE取代成乙醯基丙酮(簡稱ACA)外,與實施例(3-1)同樣操作,得到固體成分的總質量為7.5質量%之清漆(簡稱V(3-9))。 A varnish having a total mass of a solid component of 7.5% by mass (abbreviated as V (3) was obtained in the same manner as in Example (3-1) except that the PE of Example (3-1) was replaced with ethyl acetoacetone (ACA for short). -9)).

[參考例(3-1)] [Reference Example (3-1)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加11.0239g之PGEE,添加合成例(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,室溫下混合直到完全均勻為止,得到未添加氫鍵性膜粗糙防止材之二酮化合物(E)之固體成分的總質量為7.5質量%之清漆(簡稱RV(3-1))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 1,1.0239 g of PGEE was added, and 2.2875 g of P1 obtained in Synthesis Example (2-1) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the decane was 35 mass%), and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd., which is a surfactant, was added and diluted with PGEE to form a 0.1 mass% solution of 0.1830 g, and mixed at room temperature until A varnish (abbreviated as RV (3-1)) having a total mass of the solid content of the diketone compound (E) to which the hydrogen bond film roughness preventing material was not added was obtained.

[參考例(3-2)] [Reference Example (3-2)]

將參考例(3-1)之P1取代成合成例(2-2)所得之P2外,與參考例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(3-2))。 The P1 obtained in the reference example (3-1) was replaced with the P2 obtained in the synthesis example (2-2), and the same procedure as in the reference example (3-1) was carried out to obtain a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV). (3-2)).

[參考例(3-3)] [Reference Example (3-3)]

將參考例(3-1)之P1取代成合成例(2-3)所得之P3外,與參考例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(3-3))。 The P1 obtained in the reference example (3-1) was replaced with the P3 obtained in the synthesis example (2-3), and the same procedure as in the reference example (3-1) was carried out to obtain a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV). (3-3)).

[參考例(3-4)] [Reference Example (3-4)]

將參考例(3-1)之P1取代成合成例(2-4)所得之P4外,與參考例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(3-4))。 The P1 obtained in the reference example (3-1) was replaced with the P4 obtained in the synthesis example (2-4), and the same procedure as in the reference example (3-1) was carried out to obtain a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV). (3-4)).

[參考例(3-5)] [Reference Example (3-5)]

將參考例(3-1)之P1取代成合成例(2-5)所得之P5外,與參考例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(3-5))。 The P1 obtained in the reference example (3-1) was replaced with the P5 obtained in the synthesis example (2-5), and the same procedure as in the reference example (3-1) was carried out to obtain a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV). (3-5)).

[參考例(3-6)] [Reference Example (3-6)]

將參考例(3-1)之P1取代成合成例(2-7)所得之P7外,與參考例(3-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(3-6))。 The P1 obtained in the reference example (3-1) was replaced with the P7 obtained in the synthesis example (2-7), and the same procedure as in the reference example (3-1) was carried out to obtain a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV). (3-6)).

<被膜之製作> <production of film> [實施例(3-10)至實施例(3-18)及參考例(3-7)至參考例(3-12)] [Examples (3-10) to Examples (3-18) and Reference Examples (3-7) to Reference Examples (3-12)] [鹼溶解性與阻劑膜剝離後之膜粗糙特性] [Alkaline solubility and film roughness characteristics after peeling of the resist film]

所得之V(3-1)至V(3-9)及RV(3-1)至RV(3-6)評價鹼溶解性。各清漆係使用東京Electron(股)製clean track ACT8,旋轉塗佈於以六甲基二矽氮烷(HMDS)處理之8inch的矽基板,使膜厚成為100nm, 使用加熱板,以150℃加熱1分鐘。接著,由所得之被膜之上,旋轉塗佈AZ3100(AZ ELECTRONIC MATERIALS公司製)使膜厚成為1.5μm,使用加熱板,以100℃加熱1分鐘。然後,使用(股)Nikon製i線步進機NSR-2205i12D,通過光罩,將300mJ/cm2之曝光量進行光照射。光照射後,使用2.38質量%之氫氧化四甲基銨(簡稱TMAH),進行30秒顯影,純水清洗1分鐘後,以空氣使乾燥。此時,對於鹼顯影液,成為溶解顯影之例評價為○,剝離顯影或未溶解的例評價為×,如表6所示。 The obtained alkali solubility was evaluated from V(3-1) to V(3-9) and RV(3-1) to RV(3-6). Each varnish was spin-coated on an 8 inch ruthenium substrate treated with hexamethyldioxane (HMDS) to a thickness of 100 nm using a clean track ACT8 manufactured by Tokyo Electron Co., Ltd., and heated at 150 ° C using a hot plate. 1 minute. Next, AZ3100 (manufactured by AZ ELECTRONIC MATERIALS Co., Ltd.) was spin-coated on the obtained film to have a film thickness of 1.5 μm, and heated at 100 ° C for 1 minute using a hot plate. Then, using an i-line stepper NSR-2205i12D manufactured by Nikon, a light exposure amount of 300 mJ/cm 2 was irradiated through a photomask. After the light irradiation, 2.38 mass% of tetramethylammonium hydroxide (TMAH) was used for development for 30 seconds, and the mixture was washed with pure water for 1 minute, and then dried with air. In this case, the case where the alkali developing solution was dissolved and developed was evaluated as ○, and the example of peeling development or undissolved was evaluated as ×, as shown in Table 6.

接著,將感光性阻劑於PGME中浸漬2分鐘,剝離阻劑,以光學顯微鏡觀察無圖型之處(感光性阻劑被層合,剝離後之處)。光學顯微鏡觀察的結果,未發生膜粗糙的例評價為○,發生膜粗糙的例評價為×,V(3-1)至V(3-9)及RV(3-1)至RV(3-6)之結果如表6所示。又,V(3-1)至RV(3-1)之觀察結果如圖13至圖14所示。 Next, the photosensitive resist was immersed in PGME for 2 minutes, and the resist was peeled off, and the pattern was not observed by an optical microscope (where the photosensitive resist was laminated and peeled off). As a result of observation by an optical microscope, the case where no film roughness did not occur was evaluated as ○, and the case where film roughness occurred was evaluated as ×, V(3-1) to V(3-9) and RV(3-1) to RV(3- The results of 6) are shown in Table 6. Further, the observation results of V(3-1) to RV(3-1) are shown in Figs. 13 to 14.

將V(3-1)至V(3-9)及RV(3-1)至RV(3-6)作為被膜,將該被膜之鹼溶解性進行比較時,實施例(3-10)至實施例(3-18)及參考例(3-7)至參考例(3-11)之鹼溶解性良好。而參考例(3-12)之水解性矽烷(a2)中之L的碳原子數為0的例係對於鹼顯影液,產生剝離,無法得到目的之溶解顯影性。 When V(3-1) to V(3-9) and RV(3-1) to RV(3-6) are used as a film, and the alkali solubility of the film is compared, Example (3-10) is The alkali solubility of the examples (3-18) and the reference examples (3-7) to the reference examples (3-11) was good. On the other hand, in the hydrolyzable decane (a2) of the reference example (3-12), the number of carbon atoms of L was 0, and the alkali developer was peeled off, and the desired solution developability could not be obtained.

將V(3-1)至V(3-9)及RV(3-1)至RV(3-6)作為被膜,將該被膜之阻劑膜剝離後之膜粗糙特性進行比較時,實施例(3-10)至實施例(3-18)未發生阻劑膜剝離後之膜粗糙,而參考例(3-7)至參考例(3- 12)發生膜粗糙。此等之差異係氫鍵性膜粗糙防止劑之二酮化合物(E)之有無的差異而已。 When V(3-1) to V(3-9) and RV(3-1) to RV(3-6) are used as a film, the film roughness characteristics after the film of the film is peeled off are compared, and Examples (3-10) to Example (3-18), film roughness after peeling of the resist film did not occur, and Reference Example (3-7) to Reference Example (3- 12) Film roughness occurs. These differences are differences in the presence or absence of the diketone compound (E) of the hydrogen bond film roughness preventive agent.

由表6的結果,發現欲兼顧鹼溶解性與阻劑 膜剝離後之膜粗糙特性時,使特定之單體以特定之比率共聚合為很重要,特別是水解性矽烷(a2)中之L之碳原子數有最佳值。 From the results of Table 6, it was found that both alkali solubility and resist were desired. In the film roughening property after film peeling, it is important to copolymerize a specific monomer at a specific ratio, and in particular, the number of carbon atoms of L in the hydrolyzable decane (a2) has an optimum value.

綜合以上結果時,欲兼具作為LED用材料所 要求之鹼溶解性與阻劑膜剝離後之膜粗糙特性時,可藉由滿足以下要件來達成,亦即,由本發明之矽化合物(A)之重量平均分子量為700~4000之範圍內,較佳為構成矽化合物(A)之水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%進行共聚合,且水解性矽烷(a2)之L為碳原子數3~6之直鏈、分支或環狀之烷基所構成,具有1至100nm之平均粒徑與1.50至2.70之折射率之無機粒子(B)、氫鍵性膜粗糙防止劑(E)及溶劑(C)所構成之組成物的要件。 When combining the above results, it is intended to be used as a material for LEDs. The required alkali solubility and the film roughness characteristic after the release of the resist film can be achieved by satisfying the following requirements, that is, the weight average molecular weight of the ruthenium compound (A) of the present invention is in the range of 700 to 4000. Preferably, the hydrolyzable decane (a1) constituting the hydrazine compound (A) is from 90 mol% to 50 mol%, and the hydrolyzable decane (a2) is from 10 mol% to 50 mol% for copolymerization, and hydrolyzable decane (a2) L is a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms, and has inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70, and hydrogen bonding. The constituents of the composition composed of the film roughness preventing agent (E) and the solvent (C).

<膜形成組成物(4)及被膜之製作> <Production of Film Forming Composition (4) and Film> [實施例(4-1)] [Example (4-1)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加8.3058g之丙二醇單乙基醚(簡稱PGEE),添加合成例(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之苄基三乙基氯化銨(簡 稱BTEAC)以PGEE稀釋形成1質量%的溶液0.0915g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8458g(全溶劑中之比例為12質量%),室溫下混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-1))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 8.3058 g of propylene glycol monoethyl ether (PGEE) was added, and 2.2875 g of P1 obtained in Synthesis Example (2-1) was added (relatively In the case of the solid component of B1, the solid content of polyoxymethane is 35% by mass), and benzyltriethylammonium chloride as a hardening catalyst (D) is added (simple BTEAC) was diluted with PGEE to form 0.019 g of a 1% by mass solution, and acetic acid was added to dilute with PGEE to form a 0.9% by mass solution of 1% by mass, and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd. as a surfactant was added. 0.1830 g of a 1% by mass solution was diluted with PGEE, and 1.8458 g of ion-exchanged water (12% by mass in the total solvent) was added thereto, and mixed at room temperature until completely uniform, and the total mass of the solid component was 7.5% by mass. Varnish (referred to as V (4-1)).

所得之V(4-1)評價折射率。旋轉塗佈於矽基板上,使V(4-1)之膜厚成為100nm,使加熱板以150℃加熱1分鐘。接著,使用加熱板以300℃加熱1小時,測量450nm之折射率的結果為1.616。 The obtained V(4-1) was used to evaluate the refractive index. The film was spin-coated on a ruthenium substrate so that the film thickness of V(4-1) was 100 nm, and the hot plate was heated at 150 ° C for 1 minute. Next, the film was heated at 300 ° C for 1 hour using a hot plate, and the refractive index at 450 nm was measured and found to be 1.616.

[實施例(4-2)] [Embodiment (4-2)]

將實施例(4-1)之P1取代成合成例(2-2)所得之P2外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-2))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was substituted with P2 obtained in Synthesis Example (2-2). (4-2)).

所得之V(4-2)係與實施例(4-1)同樣測量折射率的結果為1.612。 The obtained V(4-2) was measured in the same manner as in the example (4-1), and the result was 1.612.

[實施例(4-3)] [Embodiment (4-3)]

將實施例(4-1)之P1取代成合成例(2-3)所得之P3外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-3))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced by P3 obtained in Synthesis Example (2-3). (4-3)).

所得之V(4-3)係與實施例(4-1)同樣測量折射率 的結果為1.608。 The obtained V(4-3) was measured in the same manner as in the example (4-1). The result is 1.608.

[實施例(4-4)] [Example (4-4)]

將實施例(4-1)之P1取代成合成例(2-4)所得之P4外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-4))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced by P4 obtained in Synthesis Example (2-4). (4-4)).

[實施例(4-5)] [Embodiment (4-5)]

將實施例(4-1)之P1取代成合成例(2-5)所得之P5外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-5))。 The P1 obtained in the example (4-1) was replaced with the P5 obtained in the synthesis example (2-5), and the same procedure as in the example (4-1) was carried out to obtain a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as V). (4-5)).

[實施例(4-6)] [Example (4-6)]

將實施例(4-1)之P1取代成合成例(2-6)所得之P6外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-6))。 A varnish having a total mass of 7.5% by mass of a solid component (V for short) was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced with P6 obtained in Synthesis Example (2-6). (4-6)).

[實施例(4-7)] [Embodiment (4-7)]

將實施例(4-1)之P1取代成合成例(2-9)所得之P9外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-7))。 In the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced with P9 obtained in Synthesis Example (2-9), a varnish having a total mass of 7.5% by mass of solid content (V for short) was obtained. (4-7)).

[實施例(4-8)] [Embodiment (4-8)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之 B1,接著,添加7.9832g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.4575g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8512g(全溶劑中之比例為12質量%),室溫下混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-8))。 3.000 g of the scale obtained in Production Example 1 in a 20 mL eggplant type flask B1, Next, 7.9832 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (the solid content of polysiloxane was 35 mass% with respect to the solid content of B1), and it was added as a hardening contact. The BTEAC of the medium (D) was diluted with PGEE to form a solution of 0.475 g of a 1% by mass solution, and 0.960 g of a solution of 1% by mass was added by diluting acetic acid with PGEE, and R-made by Dainippon Ink Chemical Industry Co., Ltd. as a surfactant was added. 30-N was diluted with PGEE to form 0.1830 g of a 1% by mass solution, and 1.8512 g of ion-exchanged water (12% by mass in the total solvent) was added, and mixed at room temperature until completely homogeneous, and the total mass of the solid component was obtained. 7.5% by mass of varnish (referred to as V(4-8)).

[實施例(4-9)] [Embodiment (4-9)]

除了將實施例(4-1)之BTEAC變更為苄基三甲基氯化銨(簡稱BTMAC)外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-9))。 A varnish having a total mass of 7.5% by mass of a solid component was obtained in the same manner as in Example (4-1) except that the BTEAC of Example (4-1) was changed to benzyltrimethylammonium chloride (abbreviated as BTMAC). (referred to as V (4-9)).

[實施例(4-10)] [Embodiment (4-10)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加8.2252g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作 為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8471g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-10))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 8.2252 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the siloxane is 35% by mass), and 0.1830 g of a solution of 1% by mass of BTEAC as a curing catalyst (D) is added by dilution with PGEE, and 0.9150 g of a solution of 1% by mass is added by diluting acetic acid with PGEE. R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd., which is a surfactant, was diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and then added 1.8471 g of ion-exchanged water (the ratio of the total solvent was 12% by mass) The mixture was mixed at room temperature until it was completely uniform, and a varnish (referred to as V(4-10)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(4-11)] [Embodiment (4-11)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加8.8409g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.2314g(全溶劑中之比例為8質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-11))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 8.8409 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the siloxane is 35% by mass), and the amount of the BTEAC as the curing catalyst (D) is 0.1830 g, which is diluted with PGEE to form a 1% by mass solution, and the acetic acid is added to the PGEE to form a 0.9% by mass solution of 1% by mass. R-30-N manufactured by Nippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and 1.2314 g of ion-exchanged water is added (the ratio of the total solvent is 8% by mass). The mixture was mixed at room temperature until it was completely homogeneous, and a varnish (referred to as V(4-11)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(4-12)] [Embodiment (4-12)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加7.6095g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之 BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水2.4628g(全溶劑中之比例為16質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-12))。 3.0000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 7.6095 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the siloxane is 35% by mass), and is added as a hardening catalyst (D). BTEAC was diluted with PGEE to form 0.1830 g of a 1% by mass solution, and acetic acid was added to dilute with PGEE to form a 0.9% by mass solution of 1% by mass, and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd. as a surfactant was added to PGEE. 0.1830 g of a solution of 1% by mass was diluted, and 2.4628 g of ion-exchanged water was added (the ratio of the total solvent was 16% by mass), and the mixture was mixed at room temperature until it was completely uniform, and a varnish having a total mass of 7.5% by mass of the solid component was obtained ( Referred to as V (4-12)).

[實施例(4-13)] [Embodiment (4-13)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加6.6121g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加乙酸以PGEE稀釋形成1質量%的溶液2.7450g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8742g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-13))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 6.6121 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the decane was 35 mass%), and the BTEAC as a curing catalyst (D) was added to dilute PGEE to form a solution of 0.1830 g of a 1 mass% solution, and the acetic acid was added to dilute PGEE to form a solution of 2.7450 g of a 1 mass% solution. R-30-N manufactured by Nippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and 1.8742 g of ion-exchanged water is added (the ratio of the total solvent is 12% by mass). The mixture was mixed at room temperature until it was completely uniform, and a varnish (referred to as V(4-13)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(4-14)] [Embodiment (4-14)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加7.4186g之PGEE,添加合成例(2-2)所 得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加甲酸以PGEE稀釋形成1質量%的溶液1.8300g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8607g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-14))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 7.4186 g of PGEE was added, and Synthesis Example (2-2) was added. 2.2875 g of P2 (solid content of polyoxymethane was 35 mass% with respect to the solid content of B1), and BTAAC as a hardening catalyst (D) was added and diluted with PGEE to form a solution of 0.1830 g of a 1 mass% solution. Addition of formic acid to a solution of 1.300 g of a 1% by mass solution diluted with PGEE, and addition of R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd. as a surfactant, diluted with PGEE to form a solution of 0.18% by mass of 1 mass%, and then added with ions 1.8607 g of water (12% by mass in the total solvent) was exchanged, and it was mixed at room temperature until it was completely uniform, and a varnish (referred to as V(4-14)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(4-15)] [Embodiment (4-15)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加4.9990g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加丙酸以PGEE稀釋形成1質量%的溶液4.5750g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.9013g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-15))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 4.9990 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the siloxane is 35% by mass), and the amount of the BTEAC as the curing catalyst (D) is 0.1830 g, which is diluted with PGEE to form a 1% by mass solution, and the propionic acid is added and diluted with PGEE to form a 4.5% by mass solution of 4.5% by weight. As a surfactant, R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd. was diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and 1.9013 g of ion-exchanged water was added (the ratio of the total solvent was 12% by mass). The mixture was mixed at room temperature until it was completely homogeneous, and a varnish (referred to as V(4-15)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(4-16)] [Embodiment (4-16)]

將實施例(4-10)之乙酸取代成草酸外,與實施例(4-10)同樣操作,得到得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-16))。 The acetal (abbreviated as V(4-16)) having a total mass of the solid component of 7.5% by mass was obtained in the same manner as in Example (4-10) except that the acetic acid of Example (4-10) was replaced with oxalic acid.

[實施例(4-17)] [Embodiment (4-17)]

將實施例(4-10)之乙酸取代成馬來酸外,與實施例(4-10)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-17))。 The acetic acid of Example (4-10) was replaced with maleic acid, and the same procedure as in Example (4-10) was carried out to obtain a varnish (referred to as V(4-17)) having a total mass of the solid component of 7.5% by mass.

[實施例(4-18)] [Embodiment (4-18)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加5.2295g之PGEE、3.0763g之丙酮酸乙酯(簡稱PE。二酮化合物),添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.0915g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8458g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-18))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 5.2295 g of PGEE and 3.0763 g of ethyl pyruvate (abbreviated as PE. diketone compound) were added, and Synthesis Example (2-2) was added. The obtained 2.2875 g of P2 (solid content of polyoxymethane was 35 mass% with respect to the solid content of B1), and BREAAC as a hardening catalyst (D) was added and diluted with PGEE to form a 0.01 mass% solution of 0.015 g. The addition of acetic acid was diluted with PGEE to form 0.9150 g of a 1% by mass solution, and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd. as a surfactant was added to dilute with PGEE to form a solution of 0.18% by mass of 1 mass%, and then add ions. 1.8458 g of water (12% by mass in the total solvent) was exchanged, and it was mixed at room temperature until it was completely uniform, and a varnish (referred to as V(4-18)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(4-19)] [Embodiment (4-19)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加5.1466g之PGEE、3.0785g之PE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8471g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-19))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 5.1466 g of PGEE and 3.0785 g of PE were added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (relative to B1). In the case of a solid component, the solid content of polyoxymethane is 35% by mass), and B830AC as a curing catalyst (D) is added to dilute PGEE to form a solution of 0.1830 g of a 1% by mass solution, and acetic acid is added to dilute with PGEE to form a 1% by mass solution. 0.9150 g, R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a 1 mass% solution of 0.1830 g, and then ion-exchanged water is added to 1.8471 g (the ratio in the total solvent is 12% by mass), mixed at room temperature until completely uniform, and a varnish (referred to as V(4-19)) having a total mass of the solid component of 7.5% by mass was obtained.

[實施例(4-20)] [Embodiment (4-20)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加2.8637g之PGEE、3.1237g之PE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.1830g,添加乙酸以PGEE稀釋形成1質量%的溶液2.7450g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水2.4990g(全溶劑中之比例為16質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱V(4-20))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 2.8637 g of PGEE and 3.1237 g of PE were added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (relative to B1). In the case of a solid component, the solid content of polyoxymethane is 35% by mass), and B830AC as a curing catalyst (D) is added to dilute PGEE to form a solution of 0.1830 g of a 1% by mass solution, and acetic acid is added to dilute with PGEE to form a 1% by mass solution. 2.7450g, R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a 1 mass% solution of 0.1830 g, and then ion-exchanged water is added to 2.990 g (the ratio of the total solvent is 16% by mass), mixed at room temperature until completely uniform, and a varnish (referred to as V(4-20)) having a total mass of the solid component of 7.5% by mass was obtained.

[參考例(4-1)] [Reference Example (4-1)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加8.3865g之PGEE,添加(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8444g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到未添加實施例(4-1)之硬化觸媒(D)的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-1))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 8.3865 g of PGEE was added, and 2.2875 g of P1 obtained in (2-1) was added (Polyoxime relative to the solid content of B1) The solid content of the alkane was 35% by mass), and 0.9150 g of a solution of 1% by mass was added by diluting acetic acid with PGEE, and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd. as a surfactant was added to form a dilution with PGEE. 0.1830 g of a mass % solution, and 1.8444 g of ion-exchanged water (12% by mass in the total solvent) were added, and the mixture was mixed at room temperature until it was completely uniform, and a hardening catalyst (D) without the addition of the example (4-1) was obtained. Example: A varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV (4-1)).

[參考例(4-2)] [Reference Example (4-2)]

將參考例(4-1)之P1取代成合成例(2-2)所得之P2外,與參考例(4-1)同樣操作,得到未添加實施例(4-2)之硬化觸媒的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-2))。 The P1 obtained in the reference example (4-1) was replaced with the P2 obtained in the synthesis example (2-2), and the same procedure as in the reference example (4-1) was carried out to obtain a hardening catalyst to which the compound (4-2) was not added. Example: a varnish having a total mass of a solid component of 7.5% by mass (abbreviated as RV (4-2)).

[參考例(4-3)] [Reference Example (4-3)]

將參考例(4-1)之P1取代成合成例(2-3)所得之P3外,與參考例(4-1)同樣操作,得到未添加實施例(4-3)之硬化觸媒的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-3))。 The P1 obtained in Reference Example (4-1) was replaced with P3 obtained in Synthesis Example (2-3), and the same procedure as in Reference Example (4-1) was carried out to obtain a hardening catalyst to which Example (4-3) was not added. Example: a varnish having a total mass of a solid component of 7.5% by mass (abbreviated as RV (4-3)).

[參考例(4-4)] [Reference Example (4-4)]

將參考例(4-1)之P1取代成合成例(2-4)所得之P4外,與參考例(4-1)同樣操作,得到未添加實施例(4-4)之硬化觸媒的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-4))。 The P1 of Reference Example (4-1) was replaced with P4 obtained in Synthesis Example (2-4), and the same procedure as Reference Example (4-1) was carried out to obtain a hardening catalyst to which Example (4-4) was not added. Example: a varnish having a total mass of a solid component of 7.5% by mass (abbreviated as RV (4-4)).

[參考例(4-5)] [Reference Example (4-5)]

將參考例(4-1)之P1取代成合成例(2-5)所得之P5外,與參考例(4-1)同樣操作,得到未添加實施例(4-5)之硬化觸媒的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-5))。 The P1 of Reference Example (4-1) was replaced with P5 obtained in Synthesis Example (2-5), and the same procedure as Reference Example (4-1) was carried out to obtain a hardening catalyst to which Example (4-5) was not added. Example: a varnish having a total mass of a solid component of 7.5% by mass (abbreviated as RV (4-5)).

[參考例(4-6)] [Reference Example (4-6)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加10.1516g之PGEE,添加合成例(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之苄基三乙基氯化銨(簡稱BTEAC)以PGEE稀釋形成1質量%的溶液0.0915g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,室溫混合直到完全均勻為止,得到未添加實施例(4-1)之離子交換水的例:固體成分之總質量為 7.5質量%之清漆(簡稱RV(4-6))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 10.1516 g of PGEE was added, and 2.2875 g of P1 obtained in Synthesis Example (2-1) was added (when it was solid relative to the solid content of B1) The solid content of the decane was 35 mass%), and benzyl triethylammonium chloride (BTEAC) as a hardening catalyst (D) was added to dilute with PGEE to form a 0.01% by mass solution of 0.01% by mass, and acetic acid was added to dilute with PGEE. 0.9150 g of a 1% by mass solution was formed, and R-30-N manufactured by Dainippon Ink Chemical Industry Co., Ltd. as a surfactant was added to dilute with PGEE to form a 0.1 mass% solution of 0.1830 g, and mixed at room temperature until completely homogeneous. An example in which ion-exchanged water of Example (4-1) was not added was obtained: the total mass of the solid component was 7.5% by mass of varnish (referred to as RV (4-6)).

[參考例(4-7)] [Reference Example (4-7)]

將參考例(4-6)之P1取代成合成例(2-2)所得之P2外,與參考例(4-6)同樣操作,得到未添加實施例(4-2)之離子交換水的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-7))。 The P1 of Reference Example (4-6) was replaced with P2 obtained in Synthesis Example (2-2), and the same procedure as Reference Example (4-6) was carried out to obtain ion-exchanged water to which Example (4-2) was not added. Example: a varnish having a total mass of a solid component of 7.5% by mass (abbreviated as RV (4-7)).

[參考例(4-8)] [Reference Example (4-8)]

將參考例(4-6)之P1取代成合成例(2-3)所得之P3外,與參考例(4-6)同樣操作,得到未添加實施例(4-3)之離子交換水的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-8))。 The P1 of Reference Example (4-6) was replaced with P3 obtained in Synthesis Example (2-3), and the same procedure as Reference Example (4-6) was carried out to obtain ion-exchanged water to which Example (4-3) was not added. Example: a varnish having a total mass of a solid component of 7.5% by mass (abbreviated as RV (4-8)).

[參考例(4-9)] [Reference Example (4-9)]

將參考例(4-6)之P1取代成合成例(2-4)所得之P4外,與參考例(4-6)同樣操作,得到未添加實施例(4-4)之離子交換水的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-9))。 The P1 of Reference Example (4-6) was replaced with P4 obtained in Synthesis Example (2-4), and the same procedure as Reference Example (4-6) was carried out to obtain ion-exchanged water to which Example (4-4) was not added. Example: a varnish having a total mass of a solid component of 7.5% by mass (abbreviated as RV (4-9)).

[參考例(4-10)] [Reference Example (4-10)]

將參考例(4-6)之P1取代成合成例(2-5)所得之P5外,與參考例(4-6)同樣操作,得到未添加實施例(4-5)之離子交換水的例:固體成分之總質量為7.5質量 %之清漆(簡稱RV(4-10))。 The P1 of Reference Example (4-6) was replaced with P5 obtained in Synthesis Example (2-5), and the same procedure as Reference Example (4-6) was carried out to obtain ion-exchanged water to which Example (4-5) was not added. Example: The total mass of solid components is 7.5 mass % varnish (referred to as RV (4-10)).

[參考例(4-11)] [Reference Example (4-11)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加9.1124g之PGEE,添加合成例(2-1)所得之2.2875g之P1(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.0915g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8322g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到未添加實施例(4-1)之酸的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-11))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 9.1124 g of PGEE was added, and 2.2875 g of P1 obtained in Synthesis Example (2-1) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the oxime is 35 mass%), and BREAAC as a curing catalyst (D) is added to a mixture of 0.0915 g of a solution of 1% by mass diluted with PGEE, and a large Japanese ink chemical industry (share) is added as a surfactant. R-30-N was diluted with PGEE to form 0.1830 g of a 1% by mass solution, and 1.8322 g of ion-exchanged water (12% by mass in the total solvent) was added, and mixed at room temperature until completely uniform, and an unadded example was obtained. 4-1) Examples of the acid: a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV (4-11)).

[參考例(4-12)] [Reference Example (4-12)]

將參考例(4-11)之P1取代成合成例(2-2)所得之P2外,與參考例(4-11)同樣操作,得到未添加實施例(4-2)之酸的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-12))。 In the same manner as in Reference Example (4-11), except that P1 of Reference Example (4-11) was replaced with P2 obtained in Synthesis Example (2-2), an example in which the acid of Example (4-2) was not added was obtained: A varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV (4-12)).

[參考例(4-13)] [Reference Example (4-13)]

將參考例(4-11)之P1取代成合成例(2-3)所得之P3外,與參考例(4-11)同樣操作,得到未添加實施例 (4-3)之酸的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-13))。 The P1 of Reference Example (4-11) was replaced with P3 obtained in Synthesis Example (2-3), and the same operation as Reference Example (4-11) was carried out to obtain an unadded Example. (4-3) Example of the acid: a varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV (4-13)).

[參考例(4-14)] [Reference Example (4-14)]

將參考例(4-11)之P1取代成合成例(2-4)所得之P4外,與參考例(4-11)同樣操作,得到未添加實施例(4-4)之酸的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-14))。 In the same manner as in Reference Example (4-11), except that P1 of Reference Example (4-11) was substituted with P4 obtained in Synthesis Example (2-4), an example in which the acid of Example (4-4) was not added was obtained: A varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV (4-14)).

[參考例(4-15)] [Reference Example (4-15)]

將參考例(4-11)之P1取代成合成例(2-5)所得之P5外,與參考例(4-11)同樣操作,得到未添加實施例(4-5)之酸的例:固體成分之總質量為7.5質量%之清漆(簡稱RV(4-15))。 The P1 of Reference Example (4-11) was replaced with P5 obtained in Synthesis Example (2-5), and the same procedure as Reference Example (4-11) was carried out to obtain an example in which the acid of Example (4-5) was not added: A varnish having a total mass of the solid component of 7.5% by mass (abbreviated as RV (4-15)).

[參考例(4-16)] [Reference Example (4-16)]

將實施例(4-1)之P1取代成合成例(2-7)所得之P7外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-16))。 In the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced by P7 obtained in Synthesis Example (2-7), a varnish having a total mass of 7.5% by mass of solid content (abbreviated as RV) was obtained. (4-16)).

[參考例(4-17)] [Reference Example (4-17)]

將實施例(4-1)之P1取代成合成例(2-8)所得之P8外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-17))。 A varnish (referred to as RV for a total mass of 7.5% by mass) of a solid component was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was substituted with P8 obtained in Synthesis Example (2-8). (4-17)).

[參考例(4-18)] [Reference Example (4-18)]

將實施例(4-1)之P1取代成合成例(2-10)所得之P10外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-18))。 A varnish (referred to as RV for a total mass of 7.5% by mass) of a solid component was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced by P10 obtained in Synthesis Example (2-10). (4-18)).

[參考例(4-19)] [Reference Example (4-19)]

將實施例(4-1)之P1取代成合成例(2-11)所得之P11外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-19))。 In the same manner as in Example (4-1), P1 of Example (4-1) was replaced with P11 obtained in Synthesis Example (2-11), and a varnish having a total mass of 7.5% by mass of solid content (abbreviated as RV) was obtained. (4-19)).

[參考例(4-20)] [Reference Example (4-20)]

將實施例(4-1)之P1取代成合成例(2-12)所得之P12外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-20))。 A varnish (referred to as RV for a total mass of 7.5% by mass) of a solid component was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced by P12 obtained in Synthesis Example (2-12). (4-20)).

[參考例(4-21)] [Reference Example (4-21)]

將實施例(4-1)之P1取代成合成例(2-13)所得之P13外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-21))。 A varnish (referred to as RV for a total mass of 7.5% by mass) of a solid component was obtained in the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced by P13 obtained in Synthesis Example (2-13). (4-21)).

[參考例(4-22)] [Reference Example (4-22)]

將實施例(4-1)之P1取代成合成例(2-14)所得之P14外,與實施例(4-1)同樣操作,得到固體成分之總質 量為7.5質量%之清漆(簡稱RV(4-22))。 The P1 obtained in the example (4-1) was substituted with the P14 obtained in the synthesis example (2-14), and the same procedure as in the example (4-1) was carried out to obtain the total mass of the solid component. A varnish of 7.5 mass% (referred to as RV (4-22)).

[參考例(4-23)] [Reference Example (4-23)]

將實施例(4-1)之P1取代成合成例(2-15)所得之P15外,與實施例(4-1)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-23))。 In the same manner as in Example (4-1) except that P1 of Example (4-1) was replaced with P15 obtained in Synthesis Example (2-15), a varnish having a total mass of 7.5% by mass of solid content (abbreviated as RV) was obtained. (4-23)).

[參考例(4-24)] [Reference Example (4-24)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加6.6927g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.0915g,添加硝酸以PGEE稀釋形成1質量%的溶液2.7450g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8729g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-24))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 6.6927 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the decane was 35% by mass), and 0.0915 g of a solution of 1% by mass of BTEAC as a curing catalyst (D) was added and diluted with PGEE, and 2.7450 g of a solution of 1% by mass was added by diluting with PGEE. R-30-N manufactured by Nippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and 1.8729 g of ion-exchanged water is added (the ratio of the total solvent is 12% by mass). The mixture was mixed at room temperature until it was completely homogeneous, and a varnish (abbreviated as RV (4-24)) having a total mass of the solid component of 7.5% by mass was obtained.

[參考例(4-25)] [Reference Example (4-25)]

將參考例(4-24)之硝酸取代成硫酸外,與參考例(4-24)同樣操作,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-25))。 The nitric acid of Reference Example (4-24) was replaced with sulfuric acid, and a varnish (abbreviated as RV (4-25)) having a total mass of 7.5% by mass of a solid component was obtained in the same manner as in Reference Example (4-24).

[參考例(4-26)] [Reference Example (4-26)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加9.1043g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.0915g,添加乙酸以PGEE稀釋形成1質量%的溶液0.0092g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水1.8324g(全溶劑中之比例為12質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-26))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 9.1043 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the oxane was 35% by mass), and 0.0915 g of a 1% by mass solution of BTEAC as a curing catalyst (D) was added and diluted with PGEE, and acetic acid was added to dilute PGEE to form a solution of 1% by mass of 0.0092 g, which was added as R-30-N manufactured by Nippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and 1.8324 g of ion-exchanged water is added (the ratio of the total solvent is 12% by mass). The mixture was mixed at room temperature until it was completely homogeneous, and a varnish (abbreviated as RV (4-26)) having a total mass of the solid component of 7.5% by mass was obtained.

[參考例(4-27)] [Reference Example (4-27)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加9.5363g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.0915g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水0.6153g(全溶劑中之比例為4質量%),室溫混 合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-27))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 9.5363 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the siloxane is 35% by mass), and 0.0915 g of a solution of 1% by mass of BTEAC as a curing catalyst (D) is added by dilution with PGEE, and 0.9150 g of a solution of 1% by mass is added by diluting acetic acid with PGEE, and added as R-30-N manufactured by Nippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and 0.6153 g of ion-exchanged water is added (the ratio of the total solvent is 4% by mass). Room temperature mixing The varnish (abbreviated as RV (4-27)) having a total mass of the solid component of 7.5% by mass was obtained until the mixture was completely uniform.

[參考例(4-28)] [Reference Example (4-28)]

於20mL茄型燒瓶中量秤製造例1所得之3.0000g之B1,接著,添加7.0753g之PGEE,添加合成例(2-2)所得之2.2875g之P2(相對於B1之固體成分時,聚矽氧烷之固體成分為35質量%),添加作為硬化觸媒(D)之BTEAC以PGEE稀釋形成1質量%的溶液0.0915g,添加乙酸以PGEE稀釋形成1質量%的溶液0.9150g,添加作為界面活性劑之大日本油墨化學工業(股)製之R-30-N以PGEE稀釋形成1質量%的溶液0.1830g,再添加離子交換水3.0763g(全溶劑中之比例為20質量%),室溫混合直到完全均勻為止,得到固體成分之總質量為7.5質量%之清漆(簡稱RV(4-28))。 3.000 g of B1 obtained in Production Example 1 was weighed in a 20 mL eggplant type flask, and then 7.0753 g of PGEE was added, and 2.2875 g of P2 obtained in Synthesis Example (2-2) was added (when it was compared with the solid content of B1, it was gathered. The solid content of the siloxane is 35% by mass), and 0.0915 g of a solution of 1% by mass of BTEAC as a curing catalyst (D) is added by dilution with PGEE, and 0.9150 g of a solution of 1% by mass is added by diluting acetic acid with PGEE, and added as R-30-N manufactured by Nippon Ink Chemical Industry Co., Ltd., which is a surfactant, is diluted with PGEE to form a solution of 0.1830 g of a 1% by mass solution, and 3.0763 g of ion-exchanged water is added (the ratio of the total solvent is 20% by mass). The mixture was mixed at room temperature until it was completely uniform, and a varnish (abbreviated as RV (4-28)) having a total mass of the solid component of 7.5% by mass was obtained.

實施例(4-1)至實施例(4-20)及參考例(4-1)至參考例(4-28)所得之V(4-1)至V(4-20)及RV(4-1)至RV(4-28)之組成如表7至表10所示。又,各清漆係使用數位pH計,測量pH,其結果如表7所示。 V(4-1) to V(4-20) and RV(4) obtained in Examples (4-1) to (4-20) and Reference Examples (4-1) to Reference Examples (4-28) The composition of -1) to RV (4-28) is shown in Tables 7 to 10. Further, each varnish was measured for pH using a digital pH meter, and the results are shown in Table 7.

表7至表10表示本發明之參數之重量平均分子量、構成矽化合物(A)之水解性矽烷(a1)與水解性矽烷(a2)之共聚合比率、水解性矽烷(a2)中之L之碳原子數、硬化觸媒添加之有無及其種類、酸添加之有無及 其種類、水添加之有無及水在全溶劑中所佔有的比例(重量%)。 Table 7 to Table 10 show the weight average molecular weight of the parameter of the present invention, the copolymerization ratio of the hydrolyzable decane (a1) constituting the hydrazine compound (A) and the hydrolyzable decane (a2), and the L in the hydrolyzable decane (a2). The number of carbon atoms, the presence or absence of the addition of the hardening catalyst, the presence or absence of acid addition, and The type, the presence or absence of water addition, and the proportion (% by weight) of water in the total solvent.

表7至表10中,酸之種類係乙酸以G1表 示,甲酸以G2表示,丙酸以G3表示,草酸以G4表示,馬來酸以G5表示,硝酸以G6表示,硫酸以G7表示。 In Tables 7 to 10, the acid type is acetic acid with G1 It is indicated that formic acid is represented by G2, propionic acid is represented by G3, oxalic acid is represented by G4, maleic acid is represented by G5, nitric acid is represented by G6, and sulfuric acid is represented by G7.

<清漆之保存安定性試驗>[熟成試驗] <Preservation stability test of varnish> [cooking test]

實施例(4-1)至實施例(4-20)及參考例(4-1)至參考例(4-28)所得之V(4-1)至V(4-20)及RV(4-1)至RV(4-28)之清漆在調製後,在溫度為40℃、相對濕度為50%之烤箱之中進行熟成試驗。熟成試驗之時間為336小時。 V(4-1) to V(4-20) and RV(4) obtained in Examples (4-1) to (4-20) and Reference Examples (4-1) to Reference Examples (4-28) -1) After the varnish of RV (4-28) was prepared, the aging test was carried out in an oven having a temperature of 40 ° C and a relative humidity of 50%. The ripening test time was 336 hours.

熟成試驗之前後,各清漆製作被膜,確認塗膜表面有否產生異物。各清漆係使用東京Electron(股)製clean track ACT8,旋轉塗佈於8inch之矽基板,使膜厚成為100nm,使用加熱板,以150℃進行1分鐘燒成。 Before the aging test, the varnish was made into a film to confirm whether or not foreign matter was generated on the surface of the film. Each of the varnishes was spin-coated on an 8-inch ruthenium substrate using a clean track ACT8 manufactured by Tokyo Electron Co., Ltd. to a thickness of 100 nm, and fired at 150 ° C for 1 minute using a hot plate.

被膜使用光學顯微鏡,觀察塗膜表面,未產生異物,得到均勻的膜之例評價為○,產生異物,保存安定性試驗有不良情形的例評價為×,如表11至表12所示。 The film was observed with an optical microscope, and no foreign matter was observed on the surface of the coating film. A uniform film was obtained as an example. ○, a foreign matter was generated, and an example in which the storage stability test was defective was evaluated as ×, as shown in Tables 11 to 12.

<被膜之製作> <production of film> [圖型化特性] [graphical characteristics]

所得之V(4-1)至V(4-20)及RV(4-1)至RV(4-28)評價圖型化特性。各清漆係使用東京Electron(股)製clean track ACT8,旋轉塗佈於以六甲基二矽氮烷(HMDS)處理之8inch的矽基板,使膜厚成為100nm,使用加熱板,以150℃進行1分鐘燒成。接著,由所得之被膜之上,旋轉塗佈AZ3100(AZ ELECTRONIC MATERIALS公司製)使膜厚成為1.5μm,使用加熱板,以100℃進行1分鐘燒成。然後,使用(股)Nikon製i 線步進機NSR-2205i12D,將300mJ/cm2之曝光量通過光罩進行光照射。光照射後,使用2.38質量%之氫氧化四甲基銨(簡稱TMAH),進行30秒顯影,純水清洗1分鐘後,以空氣使乾燥。接著,將感光性阻劑於PGME中浸漬2分鐘,剝離阻劑,以光學顯微鏡觀察Line:Space為1:1之5μm之處。光學顯微鏡觀察的結果,在Line:Space為1:1之5μm附近的例評價為○,離開Line:Space為1:1之5μm之例或殘留膜的例評價為×,V(4-1)至V(4-20)及RV(4-1)至RV(4-28)之結果如表11至表12所示。又,V(4-1)至V(4-3)、V(4-10)、V(4-14)至V(4-17)及RV(4-1)至RV(4-3)之觀察結果如圖15至圖25所示。 The obtained V(4-1) to V(4-20) and RV(4-1) to RV(4-28) were evaluated for patterning characteristics. Each of the varnishes was spin-coated on an 8 inch ruthenium substrate treated with hexamethyldioxane (HMDS) to a thickness of 100 nm using a clean track ACT8 manufactured by Tokyo Electron Co., Ltd., and was heated at 150 ° C using a hot plate. Fired in 1 minute. Then, AZ3100 (manufactured by AZ ELECTRONIC MATERIALS Co., Ltd.) was spin-coated on the obtained film to have a film thickness of 1.5 μm, and baked at 100 ° C for 1 minute using a hot plate. Then, using an i-line stepper NSR-2205i12D made of Nikon, a dose of 300 mJ/cm 2 was irradiated with light through a reticle. After the light irradiation, 2.38 mass% of tetramethylammonium hydroxide (TMAH) was used for development for 30 seconds, and the mixture was washed with pure water for 1 minute, and then dried with air. Next, the photosensitive resist was immersed in PGME for 2 minutes, and the resist was peeled off, and the line: Space was observed by an optical microscope to be 5 μm of 1:1. As a result of observation by an optical microscope, an example in which the Line:Space is 1:1 to 5 μm is evaluated as ○, and an example in which Line:Space is 1:1 to 5 μm or an example of the residual film is evaluated as ×, V (4-1) The results up to V(4-20) and RV(4-1) to RV(4-28) are shown in Tables 11 to 12. Also, V(4-1) to V(4-3), V(4-10), V(4-14) to V(4-17), and RV(4-1) to RV(4-3) The observation results are shown in Figs. 15 to 25 .

此外,圖15至圖22係在Line:Space為1:1之5μm之處,使用電子顯微鏡,由圖型之頂方向,測量Space部分的長度。測量長度的結果,圖15之Space部分之寬為5.04μm、圖16之Space部分之寬為5.02μm、圖17之Space部分之寬為5.02μm、圖18之Space部分之寬為5.01μm、圖19之Space部分之寬為5.01μm、圖20之Space部分之寬為5.01μm、圖21之Space部分之寬為5.01μm、圖22之Space部分之寬為5.01μm。在此,Space部分係溶解於鹼顯影液的部分,越接近5μm,顯示可形成更良好的圖型。 Further, Fig. 15 to Fig. 22 measure the length of the Space portion from the top direction of the pattern using an electron microscope where Line:Space is 1:1 to 5 μm. As a result of measuring the length, the width of the Space portion of FIG. 15 is 5.04 μm, the width of the Space portion of FIG. 16 is 5.02 μm, the width of the Space portion of FIG. 17 is 5.02 μm, and the width of the Space portion of FIG. 18 is 5.01 μm. The width of the Space portion of 19 is 5.01 μm, the width of the Space portion of Fig. 20 is 5.01 μm, the width of the Space portion of Fig. 21 is 5.01 μm, and the width of the Space portion of Fig. 22 is 5.01 μm. Here, the Space portion is dissolved in the portion of the alkali developing solution, and the closer to 5 μm, the better the pattern can be formed.

[水接觸角] [water contact angle]

所得之V(4-1)至V(4-20)及RV(4-1)至RV(4-28)測量水接觸角。旋轉塗佈於矽基板上,使膜厚成為100nm,使用加熱板,以150℃進行1分鐘燒成,接著,以100℃進行1分鐘燒成。此加熱板中之2階段燒成係再現塗佈感光性阻劑,經乾燥之鹼顯影前之熱經歷的燒成條件。 The obtained water contact angles were measured from V(4-1) to V(4-20) and RV(4-1) to RV(4-28). The film was spin-coated on a ruthenium substrate to a thickness of 100 nm, and fired at 150 ° C for 1 minute using a hot plate, followed by firing at 100 ° C for 1 minute. The two-stage firing in the hot plate reproduces the firing conditions under which the photosensitive resist is applied and the heat before drying by the dried alkali is developed.

所得之被膜使用協和界面科學(股)製全自動接觸角計Drop Master系列DM700,將純水由尺寸為22G的針製作液滴,以液滴法(θ/2法)算出液體附著於被膜表面之液滴之水接觸角。其結果如表11至表12所示。 The obtained film was made by using the Drop Master series DM700 of the fully automatic contact angle meter made by Concord Interface Science Co., Ltd., and the pure water was made into a droplet of 22G needle, and the liquid method was attached to the surface of the film by the droplet method (θ/2 method). The water contact angle of the droplets. The results are shown in Tables 11 to 12.

將表7至表12中,V(4-1)至V(4-20)及 RV(4-1)及RV(4-28)之熟成前後之清漆之異物及其被膜之圖型化特性進行比較。 In Tables 7 to 12, V(4-1) to V(4-20) and The foreign matter of the varnish before and after the ripening of RV (4-1) and RV (4-28) and the patterning characteristics of the film were compared.

V(4-1)至V(4-20)之清漆係重量平均分子 量為700~4000之範圍內,構成矽化合物(A)之水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%所共聚合,且水解性矽烷(a2)之L為碳原子數3~6之直鏈、分支或環狀之烷基所構成,具有1至100nm之平均粒徑與1.50至2.70之折射率之無機粒子(B)、硬化觸媒(D)、水(F)、酸(G)及溶劑(C)所構成之清漆,其中水(F)在全溶劑中之比例為6重量%至18重量%,清漆之pH控制在3至5,熟成前後之清漆中未產生異物,所得之被膜上也未發現異物。 Varnished weight average molecules of V(4-1) to V(4-20) The hydrolyzable decane (a1) constituting the hydrazine compound (A) is from 90 mol% to 50 mol%, and the hydrolyzable decane (a2) is from 10 mol% to 50 mol% in the range of from 700 to 4,000. Copolymerization, and the L of the hydrolyzable decane (a2) is a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms, and has an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70. a varnish composed of particles (B), a curing catalyst (D), water (F), an acid (G), and a solvent (C), wherein the ratio of water (F) in the total solvent is from 6% by weight to 18% by weight. The pH of the varnish was controlled to 3 to 5, and no foreign matter was generated in the varnish before and after the aging, and no foreign matter was found on the obtained film.

參考例(4-1)至參考例(4-5)係不含硬化觸 媒(D)的例,但是評價圖型化特性時,被膜過度溶解於鹼顯影液中,無法得到圖型。由此結果得知,硬化觸媒(D)為必須成分。 Reference Example (4-1) to Reference Example (4-5) are free from hardening touch In the case of the medium (D), when the patterning property was evaluated, the film was excessively dissolved in the alkali developing solution, and the pattern could not be obtained. From this result, it was found that the hardening catalyst (D) was an essential component.

參考例(4-6)至參考例(4-10)係不含水 (F)的例,但是評價圖型化特性時,被膜未溶解於鹼顯影液中,無法得到圖型。水(F)係使矽化合物(A)之矽烷醇在清漆中展現,提高熱時之硬化性,使安定化及適度地展現酸(G)之氫離子濃度所必須的成分。 Reference example (4-6) to reference example (4-10) are not containing water In the example of (F), when the patterning property was evaluated, the film was not dissolved in the alkali developing solution, and the pattern could not be obtained. Water (F) is a component which is required to exhibit the sclerosing property of the hydrazine compound (A) in the varnish, to improve the hardenability at the time of heat, and to stabilize and moderately exhibit the hydrogen ion concentration of the acid (G).

參考例(4-11)至參考例(4-15)係不含酸 (G)的例,但是熟成後發生產生異物的不良情形。此乃是清漆之pH為6.8,與其矽烷醇安定化,卻更促進矽烷 醇縮合,清漆中產生異物。此結果可知酸(G)為必須成分。 Reference Example (4-11) to Reference Example (4-15) are acid free In the case of (G), there is a problem that foreign matter is generated after the ripening. This is the varnish pH of 6.8, which is more stable with stanol but promotes decane. Alcohol condensation, foreign matter is produced in the varnish. This result shows that the acid (G) is an essential component.

參考例(4-16)、參考例(4-19)及參考例(4-20)係水解性矽烷(a2)之L為碳原子數0~2之烷基的例,但是評價圖型化特性時,被膜對於鹼顯影液為剝離顯影,無法得到圖型。此乃是縮合過度進行,對於鹼顯影液,未展現溶解顯影性的緣故。又,參考例(4-21)係水解性矽烷(a2)之L為碳原子數8之烷基的例,但是評價圖型化特性時,被膜未溶解於鹼顯影液中,無法得到圖型。由此等之結果得知,水解性矽烷(a2)之L為碳原子數3~6之直鏈、分支或環狀之烷基所構成者為必須的。此外,藉由水解性矽烷(a2)之L為碳原子數3~6之直鏈、分支或環狀之烷基所構成,因此所得之被膜之水接觸角為60°至80°之範圍內。為了對於鹼顯影液得到溶解顯影性時,很明顯地,被膜之親疏水性非常重要,由矽化合物之結構發現最佳的親疏水性。 Reference Example (4-16), Reference Example (4-19), and Reference Example (4-20) are examples in which L of the hydrolyzable decane (a2) is an alkyl group having 0 to 2 carbon atoms, but evaluation patterning In the case of the characteristics, the film was peeled and developed for the alkali developing solution, and the pattern could not be obtained. This is because the condensation is excessively carried out, and the alkali developing solution does not exhibit dissolution developability. In addition, the reference example (4-21) is an example in which L of the hydrolyzable decane (a2) is an alkyl group having 8 carbon atoms. However, when the patterning property is evaluated, the film is not dissolved in the alkali developer, and the pattern cannot be obtained. . As a result of the above, it is known that L of the hydrolyzable decane (a2) is a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms. Further, since the L of the hydrolyzable decane (a2) is a linear, branched or cyclic alkyl group having 3 to 6 carbon atoms, the water contact angle of the obtained film is in the range of 60 to 80 . In order to obtain dissolution developability for an alkali developer, it is apparent that the hydrophilicity of the film is very important, and the optimum hydrophobicity is found from the structure of the ruthenium compound.

參考例(4-17)係非使用構成矽化合物(A)之水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%所共聚合的聚合物,而是使用水解性矽烷(a1)為40莫耳%、水解性矽烷(a2)為60莫耳%所共聚合之聚合物的例,但是評價圖型化特性時,被膜未溶解於鹼顯影液中,無法得到圖型。由此結果得知,水解性矽烷(a1)及水解性矽烷(a2)之共聚合比率很重要,而實施例(4-5)係使用水解性矽烷(a1) 為50莫耳%、水解性矽烷(a2)為50莫耳%所共聚合的聚合物的例,未發現鹼溶解性,因此得知水解性矽烷(a1)及水解性矽烷(a2)之共聚合比率有最佳值。 Reference Example (4-17) is a non-hydrolyzable decane (a1) constituting the hydrazine compound (A) of 90 mol% to 50 mol%, and a hydrolyzable decane (a2) of 10 mol% to 50 mol%. The polymer to be copolymerized is an example of a polymer obtained by copolymerizing a hydrolyzable decane (a1) of 40 mol% and a hydrolyzable decane (a2) of 60 mol%, but when evaluating the patterning property, The film was not dissolved in the alkali developer, and the pattern could not be obtained. From this result, it was found that the copolymerization ratio of the hydrolyzable decane (a1) and the hydrolyzable decane (a2) was important, and the example (4-5) used the hydrolyzable decane (a1). An example of a polymer copolymerized by 50 mol% and hydrolyzable decane (a2) of 50 mol%, no alkali solubility was found, and thus a total of hydrolyzable decane (a1) and hydrolyzable decane (a2) were known. The polymerization ratio has the best value.

參考例(4-18)係使用重量平均分子量為 4545之聚合物的例,但是評價圖型化特性時,被膜對於鹼顯影液,為剝離顯影,無法得到圖型。由此結果得知,矽化合物(A)之重量平均分子量太高時,成為剝離顯影,重量平均分子量有最佳值。 Reference Example (4-18) uses a weight average molecular weight of In the case of the polymer of 4545, when the patterning property was evaluated, the film was peeled and developed for the alkali developer, and the pattern could not be obtained. From the results, it was found that when the weight average molecular weight of the ruthenium compound (A) is too high, it is peeled and developed, and the weight average molecular weight has an optimum value.

參考例(4-22)及參考例(4-23)均為使用部 分水解型之矽化合物(A)的例。雙方在圖型化特性、熟成前後均未發生異物,為良好的結果。耐光性試驗之結果如後述。 Reference example (4-22) and reference example (4-23) are both used An example of the hydrazine compound (A) which is hydrolyzed. Both of them showed no foreign matter in the patterning characteristics and before and after ripening, which was a good result. The results of the light resistance test are described later.

參考例(4-24)及參考例(4-25)係將酸的種 類變更為強酸,清漆之pH設定為1.2的例。參考例(4-24)及參考例(4-25)之清漆在熟成後,產生不溶於溶劑(C)的凝膠。由此結果得知,清漆之pH有最佳值。 Reference examples (4-24) and reference examples (4-25) are acid species The type was changed to a strong acid, and the pH of the varnish was set to 1.2. The varnish of Reference Example (4-24) and Reference Example (4-25) produced a gel insoluble in solvent (C) after aging. From this result, it was found that the pH of the varnish had the optimum value.

參考例(4-26)係使乙酸之添加量降低,添 加0.01phr,使清漆之pH為5.6的例。參考例(4-26)在熟成後,產生異物。由此結果得知,清漆之pH有最佳值。 Reference example (4-26) reduces the amount of acetic acid added, An example of adding 0.01 phr to make the pH of the varnish 5.6. Reference Example (4-26) After the ripening, foreign matter was generated. From this result, it was found that the pH of the varnish had the optimum value.

參考例(4-27)及參考例(4-28)係將水 (F)之添加量設定為4%及20%的例。參考例(4-27)在熟成後產生異物,參考例(4-28)係將清漆塗佈於基板時,產生條痕(striation),無法得到均勻的被膜。由此 結果可知,水(F)之添加量有最佳值。 Reference example (4-27) and reference example (4-28) are water The addition amount of (F) was set to 4% and 20%. In Reference Example (4-27), foreign matter was generated after the aging, and in Reference Example (4-28), when the varnish was applied to the substrate, streaks were generated, and a uniform film could not be obtained. thus As a result, it was found that the amount of water (F) added had the optimum value.

[耐光性試驗] [Light resistance test] [實施例(4-21)至實施例(4-22)及參考例(4-29)至參考例(4-30)] [Examples (4-21) to Examples (4-22) and Reference Examples (4-29) to Reference Examples (4-30)]

所得之V(4-1)至V(4-2)及RV(4-22)至RV(4-23)評價耐光性。 The obtained V(4-1) to V(4-2) and RV(4-22) to RV(4-23) were evaluated for light resistance.

V(4-1)至V(4-2)及RV(4-22)至RV(4-23)係旋轉塗佈於矽基板上,使膜厚成為100nm,使用加熱板,以150℃進行60分鐘燒成。燒成後,測量膜厚、450nm之折射率、平均透過率。接著,進行耐光性試驗,測量耐光性試驗後之膜之膜厚、折射率、平均透過率。其結果如表13所示。 V(4-1) to V(4-2) and RV(4-22) to RV(4-23) were spin-coated on a ruthenium substrate to have a film thickness of 100 nm, and were heated at 150 ° C using a hot plate. Fired in 60 minutes. After the firing, the film thickness, the refractive index at 450 nm, and the average transmittance were measured. Next, the light resistance test was performed, and the film thickness, refractive index, and average transmittance of the film after the light resistance test were measured. The results are shown in Table 13.

膜厚及450nm之折射率係測量矽基板上之被膜,而平均透過率係測量石英基板上之被膜。平均透過率係算出400nm至800nm之平均透過率。 The film thickness and the refractive index of 450 nm measure the film on the ruthenium substrate, and the average transmittance is a film on the quartz substrate. The average transmittance is an average transmittance of 400 nm to 800 nm.

耐光性試驗中之光照射係以一般財團法人日本Weathering Test Center來進行,以照度為38.7W/m2、曝光波長為320nm至400nm之xenon Arc Lamp為光源。試驗機使用suga試驗機(股)製SX75-AP型。試驗環境係溫度為42±3℃、相對濕度為50±5%RH。 The light irradiation in the light resistance test was carried out by a general weather corporation Japan Weathering Test Center, and a xenon Arc Lamp having an illuminance of 38.7 W/m 2 and an exposure wavelength of 320 nm to 400 nm was used as a light source. The test machine was made of SX75-AP type using a suga test machine. The test environment has a temperature of 42 ± 3 ° C and a relative humidity of 50 ± 5% RH.

將實施例(4-21)至實施例(4-22)及參考例(4-29)至參考例(4-30)之耐光性進行比較。實施例(4-21)至實施例(4-22)及參考例(4-29)至參考例(4-30)係在圖型化特性及熟成後,未產生異物且良好,但是參考例(4-29)至參考例(4-30)在耐光性試驗後之膜厚降低,折射率增大,平均透過率降低。而實施例(4-21)至實施例(4-22)之耐光性試驗後之膜厚、折射率、平均透過率未變化。 The light resistances of Examples (4-21) to (4-22) and Reference Examples (4-29) to Reference Examples (4-30) were compared. In the examples (4-21) to (4-22) and the reference examples (4-29) to (4-30), after the patterning property and the ripening, no foreign matter was generated and it was good, but the reference example was used. (4-29) to Reference Example (4-30), the film thickness after the light resistance test was lowered, the refractive index was increased, and the average transmittance was lowered. The film thickness, refractive index, and average transmittance of the examples (4-21) to (4-22) after the light resistance test were not changed.

耐光性試驗之結果,V(4-1)至V(4-2)之聚合物為完全水解型,RV(4-22)至RV(4-23)之聚合物為部分水解型僅此不同而已,單體之共聚合比率相同,重量平均分子量也為相同程度的聚合物,因此,因聚合物之聚合方法之不同,也會顯示有明顯差異。亦即,得知完全水解型之聚合物在耐光性試驗為良好。完全水解型之聚合物在燒成步驟,膜之熱硬化反應結束,而部分水解型之聚合物在燒成步驟,熱硬化反應未完全結束,因有烷氧基殘留,耐光性試驗中進行反應所造成的。 As a result of the light resistance test, the polymers of V(4-1) to V(4-2) are completely hydrolyzed, and the polymers of RV(4-22) to RV(4-23) are partially hydrolyzed. However, since the copolymerization ratio of the monomers is the same and the weight average molecular weight is also the same degree of the polymer, there is a significant difference depending on the polymerization method of the polymer. That is, it was found that the fully hydrolyzed polymer was excellent in the light resistance test. The fully hydrolyzed polymer is subjected to a calcination step, the thermal hardening reaction of the film is completed, and the partially hydrolyzed polymer is not completely finished in the calcination step, and the reaction is carried out in the light resistance test due to the residual alkoxy group. Caused by it.

綜合以上結果,欲兼顧作為LED用材料所要求之高折射率、耐熱折射率、高度圖型化特性、耐光性、充分之熟成後之清漆安定性全部時,可藉由含有使本發明之水解性矽烷在非醇溶劑中進行水解縮合而得之重量平均分子量700至4000之矽化合物(A)、具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)、硬化觸媒(D)、水(F)、酸(G)及溶劑(C)的膜形成組成物來達成。 In summary, when the high refractive index, the heat-resistant refractive index, the high-patterning property, the light resistance, and the varnish stability after the ripening are required as the materials for the LED, the hydrolysis of the present invention can be contained. The hydrazine is subjected to hydrolytic condensation in a non-alcohol solvent to obtain a ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, an inorganic particle (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70, and a hardening contact. The film forming composition of the medium (D), water (F), acid (G), and solvent (C) is achieved.

[產業上之可利用性] [Industrial availability]

本發明之膜形成組成物係藉由使用矽化合物(A)之重量平均分子量為700至4000之範圍,構成之水解性矽烷(a1)為90莫耳%至50莫耳%,水解性矽烷(a2)為10莫耳%至50莫耳%所共聚合的範圍,水解性矽烷(a2)之L為碳原子數3~6之直鏈、分支或環狀之烷基之範圍,水接觸角為60°至80°之範圍之非常有特徵的組成,可作為LED用之被膜使用之10μm以下之圖型化的鹼顯影性良好,不經由乾式製程等之步驟,可得到折射率之熱時變化良好的永久膜。 The film-forming composition of the present invention has a hydrolyzable decane (a1) of 90 mol% to 50 mol% by using a weight average molecular weight of the ruthenium compound (A) of from 700 to 4,000, and hydrolyzable decane ( A2) is a range of copolymerization of 10 mol% to 50 mol%, L of the hydrolyzable decane (a2) is a range of linear, branched or cyclic alkyl groups having 3 to 6 carbon atoms, water contact angle It is a very characteristic composition in the range of 60° to 80°, and can be used as a coating film for LEDs. The patterning property of 10 μm or less is good, and the heat of refractive index can be obtained without a step such as a dry process. A well-changing permanent film.

藉由本發明所得之膜可一次滿足高折射率、高透明性、高耐熱性、高耐光性、10μm以下之圖型化特性,因此,可適合作為液晶顯示器、電漿顯示器、陰極射線管、有機發光顯示器、電子紙、LED、固體攝像元件、太陽能電池、有機薄膜電晶體等之電子裝置使用。特別是適合作為要求高耐光性之LED用構件使用。 The film obtained by the present invention can satisfy the high refractive index, high transparency, high heat resistance, high light resistance, and patterning characteristics of 10 μm or less at a time, and thus can be suitably used as a liquid crystal display, a plasma display, a cathode ray tube, and an organic It is used in electronic devices such as light-emitting displays, electronic papers, LEDs, solid-state imaging devices, solar cells, and organic thin film transistors. In particular, it is suitable for use as a member for LEDs requiring high light resistance.

Claims (22)

一種膜形成組成物(1),其係含有:含有式(a1)表示之水解性矽烷(a1)與式(a2)表示之水解性矽烷(a2):【化1】Si(R 1 ) 4 式(a1) L-Si(R 2 ) 3 式(a2)(式中,R1及R2各自表示碳原子數1~20之烷氧基、碳原子數2~20之醯氧基或鹵基,L表示碳原子數3~6之直鏈、分支或環狀之烷基)之水解性矽烷之水解縮合物,且重量平均分子量700至4000之矽化合物(A)、具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)及溶劑(C)。 A film-forming composition (1) comprising: a hydrolyzable decane (a1) represented by the formula (a1) and a hydrolyzable decane (a2) represented by the formula (a2): [Chem. 1] Si(R 1 ) 4 Formula (a1) L-Si(R 2 ) 3 Formula (a2) (wherein R 1 and R 2 each represent an alkoxy group having 1 to 20 carbon atoms, a decyloxy group having 2 to 20 carbon atoms or a halogen a hydrolytic condensate of a hydrolyzable decane having a weight average molecular weight of from 700 to 4,000, having a weight average molecular weight of from 700 to 4,000, having a molecular weight of from 700 to 4,000, having a molecular weight of from 700 to 4,000, and having from 1 to 100 nm Inorganic particles (B) and a solvent (C) having an average particle diameter of 1.50 to 2.70. 請求項1之膜形成組成物(1),其中矽化合物(A)係水解性矽烷(a1)與水解性矽烷(a2)之比例為水解性矽烷(a1)含有90莫耳%至50莫耳%,水解性矽烷(a2)含有10莫耳%至50莫耳%之水解性矽烷進行水解縮合的聚合物。 The film forming composition (1) of claim 1, wherein the ratio of the hydrazine compound (A) to the hydrolyzable decane (a1) to the hydrolyzable decane (a2) is 90 mol% to 50 mol% of the hydrolyzable decane (a1). %, hydrolyzable decane (a2) contains 10 mol% to 50 mol% of hydrolyzable decane for hydrolysis condensation. 請求項1之膜形成組成物(1),其中矽化合物(A)為將水解性矽烷在非醇溶劑中進行水解縮合所得者。 The film formation composition (1) of claim 1, wherein the hydrazine compound (A) is obtained by hydrolyzing and condensing a hydrolyzable decane in a non-alcohol solvent. 請求項3之膜形成組成物(1),其中非醇溶劑為酮 或醚。 The film of claim 3 forms a composition (1) in which the non-alcohol solvent is a ketone Or ether. 請求項3之膜形成組成物(1),其中非醇溶劑為丙酮或四氫呋喃。 The film of claim 3 forms a composition (1) in which the non-alcohol solvent is acetone or tetrahydrofuran. 請求項3之膜形成組成物(1),其中溶劑(C)包含上述水解性矽烷之水解與接著縮合時所用之非醇溶劑與除去水解性矽烷之水解所產生之反應物之溶劑取代用的溶劑者。 The film forming composition (1) of claim 3, wherein the solvent (C) comprises a solvent for the hydrolysis of the hydrolyzable decane and a solvent for the reaction of the non-alcoholic solvent used for the subsequent hydrolysis, and a solvent for removing the hydrolysis of the hydrolyzed decane. Solvent. 請求項1之膜形成組成物(1),其中無機粒子(B)為二氧化鋯。 The film of claim 1 is a composition (1) in which the inorganic particles (B) are zirconium dioxide. 請求項3之膜形成組成物(2),其中進一步含有選自銨鹽、膦類、鏻鹽、鋶鹽、或螯合化合物的硬化觸媒(D)。 The film of claim 3 is a composition (2) further comprising a hardening catalyst (D) selected from the group consisting of an ammonium salt, a phosphine, a phosphonium salt, a phosphonium salt, or a chelate compound. 請求項3之膜形成組成物(3),其中進一步含有選自1,2-二酮及/或1,3-二酮的二酮化合物(E)。 The film of claim 3 is a composition (3) further containing a diketone compound (E) selected from the group consisting of 1,2-dione and/or 1,3-diketone. 請求項9之膜形成組成物(3),其中二酮化合物(E)為含有下述式(3)及/或下述式(4): (式中,W表示碳原子或氧原子)表示之骨架的化合物。 The film forming composition (3) of claim 9, wherein the diketone compound (E) contains the following formula (3) and/or the following formula (4): A compound wherein (wherein W represents a carbon atom or an oxygen atom) is a skeleton. 請求項9之膜形成組成物(3),其中二酮化合物(E)為丁二酮、丙酮酸甲酯、丙酮酸乙酯或乙醯基丙酮。 The film of claim 9 is a composition (3) wherein the diketone compound (E) is butanedione, methyl pyruvate, ethyl pyruvate or ethyl acetonactone. 請求項8之膜形成組成物(4),其中進一步含有水(F)及酸(G)。 The film of claim 8 forms a composition (4) further comprising water (F) and acid (G). 一種請求項1之膜形成組成物(1)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟,混合矽化合物(A)之清漆與無機粒子(B)之溶膠,得到含有矽化合物(A)、無機粒子(B)及溶劑(C)之膜形成組成物的步驟。 A method for producing a film-forming composition (1) according to claim 1, which comprises the step of hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a solvent (c1), A step of obtaining a varnish of the compound (A) having a weight average molecular weight of 700 to 4,000, and dispersing the inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70 by dispersion by a dynamic light scattering method The medium (c2) is obtained by a step of obtaining a sol, and mixing the varnish of the cerium compound (A) with the sol of the inorganic particles (B) to obtain a film-forming composition containing the cerium compound (A), the inorganic particles (B), and the solvent (C). step. 一種請求項8之膜形成組成物(2)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟,混合矽化合物(A)之清漆與無機粒子(B)之溶膠與硬化觸媒(D),得到含有矽化合物(A)、無機粒子(B)、硬化觸媒(D)及溶劑(C)之膜形成組成物的步 驟。 A process for producing a film-forming composition (2) according to claim 8, which comprises the step of: hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) Hydrolysis to obtain a varnish of the ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, and dispersion of inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70 as measured by dynamic light scattering method In the step of obtaining a sol in the dispersion medium (c2), the varnish of the cerium compound (A) and the sol of the inorganic particles (B) and the curing catalyst (D) are mixed to obtain a cerium-containing compound (A), inorganic particles (B), and hardening. Step of forming a composition of the catalyst (D) and the solvent (C) Step. 一種請求項9之膜形成組成物(3)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟,混合矽化合物(A)之清漆、無機粒子(B)之溶膠及二酮化合物(E),得到含有矽化合物(A)、無機粒子(B)、二酮化合物(E)及溶劑(C)之膜形成組成物的步驟。 A process for producing a film-forming composition (3) according to claim 9, which comprises the step of: hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) Hydrolysis to obtain a varnish of the ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, and dispersion of inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70 as measured by dynamic light scattering method The step of obtaining a sol in the dispersion medium (c2), mixing the varnish of the cerium compound (A), the sol of the inorganic particles (B), and the diketone compound (E) to obtain a cerium compound (A), inorganic particles (B), and The step of forming a composition of the film of the ketone compound (E) and the solvent (C). 一種請求項12之膜形成組成物(4)之製造方法,其係含有以下步驟:將含有水解性矽烷(a1)與水解性矽烷(a2)之水解性矽烷在非醇溶劑(c1)中進行水解,得到重量平均分子量700至4000之矽化合物(A)之清漆的步驟,藉由動態光散射法之測量具有1至100nm之平均粒徑與1.50至2.70之折射率的無機粒子(B)分散於分散媒(c2)得到溶膠的步驟,混合矽化合物(A)之清漆、無機粒子(B)之溶膠、硬化觸媒(D)、水(F)及酸(G),得到含有矽化合物(A)、無機粒子(B)、硬化觸媒(D)、水(F)、酸 (G)及溶劑(C)之膜形成組成物的步驟。 A process for producing a film-forming composition (4) of claim 12, which comprises the step of: hydrolyzing a hydrolyzable decane containing a hydrolyzable decane (a1) and a hydrolyzable decane (a2) in a non-alcohol solvent (c1) Hydrolysis to obtain a varnish of the ruthenium compound (A) having a weight average molecular weight of 700 to 4,000, and dispersion of inorganic particles (B) having an average particle diameter of 1 to 100 nm and a refractive index of 1.50 to 2.70 as measured by dynamic light scattering method In the step of obtaining a sol in the dispersion medium (c2), the varnish of the cerium compound (A), the sol of the inorganic particles (B), the curing catalyst (D), water (F) and the acid (G) are mixed to obtain a cerium-containing compound ( A), inorganic particles (B), hardening catalyst (D), water (F), acid The step of forming a composition of the film of (G) and solvent (C). 一種圖型形成方法,其係將感光性阻劑塗佈於由請求項1至請求項12之中任一項之膜形成組成物所得之膜上,使乾燥後,對該感光性阻劑膜進行光照射,接著顯影後,剝離該阻劑膜所構成。 A pattern forming method for applying a photosensitive resist to a film obtained by forming a composition of any one of Claim 1 to Claim 12, and drying the photosensitive resist film After light irradiation, followed by development, the resist film was peeled off. 一種膜,其係將請求項1至請求項12之中任一項之膜形成組成物被覆於基板上,經加熱所得,在波長633nm下具有1.50至1.90之折射率。 A film obtained by coating a film-forming composition of any one of Claims 1 to 12 with a refractive index of 1.50 to 1.90 at a wavelength of 633 nm. 如請求項18之膜,其中膜表面之水的接觸角為60°至80°。 The film of claim 18, wherein the contact angle of the water of the film surface is from 60° to 80°. 如請求項18之膜,其係作為光取出膜、或保護膜使用。 The film of claim 18 is used as a light extraction film or a protective film. 一種裝置,其係具有含有請求項18之膜的電子裝置。 A device having an electronic device containing the film of claim 18. 如請求項21之裝置,其中電子裝置為LED。 The device of claim 21, wherein the electronic device is an LED.
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