TW201540123A - Light irradiation device - Google Patents

Abstract

The present invention is to provide a light irradiation device comprising a seal housing covering the light irradiation device entirely to prevent condensation inside. The light irradiation device of the present invention comprises: a substrate; a light module having a light emitting element mounted on a surface of the substrate and emitting light to an irradiation target; a radiator disposed against a back surface of the substrate and having a channel for a refrigerant to flow in the interior thereof; a seal housing configured to seal the light module and the radiator; a humidity control member attached to the radiator for adjusting humidity inside of the seal housing.

Description

Light irradiation device

The present invention relates to a light irradiation device having a light source in a sealed casing and irradiating light to an object to be irradiated.

Conventionally, an ultraviolet curable ink which is cured by irradiation with ultraviolet light is used as an ink for single-chip lithography. Further, an ultraviolet curable resin is used as a sealant for a flat panel display (FPD) such as a liquid crystal panel or an organic EL (Electro Luminescence) panel. For hardening such an ultraviolet curable ink or an ultraviolet curable resin, generally, an ultraviolet light irradiation device that irradiates ultraviolet light, particularly a one-piece lithographic printing or FPD, is used because it is necessary to irradiate a wide rectangular irradiation region with high irradiation intensity. Since ultraviolet rays are used, a light irradiation device in which a plurality of light-emitting elements are arranged side by side on a substrate and arranged to face the irradiation region is used.

In such a light irradiation device using a large number of light-emitting elements, the temperature rises due to heat generation of the light-emitting elements, and the luminous efficiency of the light-emitting elements is significantly lowered. Therefore, a heat dissipating means such as a heat sink is provided in close contact with the substrate, and a refrigerant such as cooling water flows through a flow path formed inside the heat sink, thereby forcibly dissipating heat generated by the light emitting element. (for example, Patent Document 1).

[Patent Document] Japanese Patent Laid-Open Publication No. 2008-288456

According to the light irradiation device of Patent Document 1, since the heat radiation means (heat dissipation means) absorbs heat of the light-emitting element (LED wafer) from the substrate to dissipate heat, the light-emitting element can be effectively cooled. In the light-emitting device of Patent Document 1, the heat-dissipating means is configured to include "the light-emitting element and the substrate are exposed to the outside". However, when the light-emitting element is exposed to the outside, it is contaminated with moisture, mist, dust, or the like due to the use environment, and the irradiation intensity is lowered, and in the worst case, the light-emitting element is short-circuited.

In order to solve this problem, although a configuration in which the entire light irradiation device is covered by the sealed casing is considered, according to such a configuration, the heat dissipation means causes the air in the sealed casing to be cooled, thereby causing a temperature difference between the inside and the outside of the sealed casing. Further, dew condensation occurs inside the sealed casing, and the emission window that emits light is turbid. Further, if dew condensation occurs inside the sealed casing so that the humidity inside the sealed casing rises, the moisture absorption of the metal (for example, copper) constituting the circuit pattern on the substrate is accelerated, and the occurrence of ion migration is accelerated, and thus, the circuit pattern is obtained. The problem that it becomes easy to short-circuit between (that is, between the anode and the cathode of the light-emitting element) is also a concern.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a light-irradiating device which covers a whole structure of a light-irradiating device with a sealed casing and which does not generate condensation inside.

In order to achieve the above object, a light irradiation device according to the present invention includes: a substrate; a light source module having a light-emitting element mounted on a surface of the substrate and emitting light to an object to be irradiated; and a heat sink disposed in abutting manner The utility model is disposed on the back surface of the substrate and has a flow path for allowing the refrigerant to flow therein; a sealing case which is arranged to seal the light source module and the heat sink; and a humidity adjusting member disposed on the heat sink to adjust the sealing case Humidity in the body.

According to this configuration, since the humidity inside the sealed casing is appropriately adjusted by the humidity adjusting member, it is possible to surely prevent condensation from occurring inside the sealed casing.

Further, the humidity control member desirably adsorbs moisture in the air when the humidity in the sealed casing exceeds a predetermined value, and releases the adsorbed moisture into the air when the temperature is equal to or lower than a predetermined value. Further, in this case, it is desirable that the humidity adjusting member contains porous ceria.

In addition, the humidity conditioning member is desirably a sheet member. Also, in this case, the humidity adjusting member may be disposed to surround the heat sink.

Further, the refrigerant is desirably water, or ethylene glycol, propylene glycol, or a mixture of such compounds and water.

In addition, it has a plurality of light source modules, and it is desirable that the light source modules are arranged in at least one row in a predetermined direction.

Further, in the light-emitting element, it is desirable to emit light having a wavelength acting on the ultraviolet curable resin.

As described above, according to the present invention, it is possible to realize a light irradiation device which adopts a configuration in which the entire light irradiation device is covered with a sealed casing, and condensation does not occur inside.

1‧‧‧Lighting device

100‧‧‧Light irradiation unit

110‧‧‧Light source module

115‧‧‧Ceramic substrate

120‧‧‧LED dies

125‧‧‧electrode plate

131, 132‧‧‧ terminal block

131a‧‧‧Terminal top

132a‧‧‧Bottom of terminal block

135, 136‧‧‧ electrode terminals

135a, 136a‧‧‧ anode terminal

135b, 136b‧‧‧ cathode terminal

150‧‧‧heatsink

150a‧‧‧ radiator front

150b‧‧‧Radiator back

160‧‧‧flow path

170‧‧‧ supply port

175‧‧‧Export

200‧‧‧ Sealed housing

210‧‧‧ housing body

210a‧‧‧ openings

220‧‧‧ Window Department

300‧‧‧Hygrostat

A-A‧‧‧ line

Fig. 1 is a front view of a light irradiation device according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a light irradiation device according to an embodiment of the present invention, taken along line A-A of Fig. 1.

Fig. 3 is an enlarged front view of a light irradiation unit mounted on a light irradiation device according to an embodiment of the present invention.

Fig. 4 is a rear view and a plan view of a light irradiation unit mounted on a light irradiation device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same or corresponding portions in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

Fig. 1 is a front view of a light irradiation device 1 according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing the light irradiation device 1 according to the embodiment of the present invention taken along the line A-A of Fig. 1. The light irradiation device 1 of the present embodiment is mounted on an ultraviolet curing ink which is used as a sealant for FPD (Flat Panel Display) and the like. The resin-cured light source device is disposed so as to face the irradiation target not shown in the drawing, and emits linear ultraviolet light to a predetermined region of the irradiation target.

As shown in FIGS. 1 and 2, the light irradiation device 1 is composed of a light-emitting unit 100 that emits ultraviolet light in a line shape and a sealed casing 200 that houses the light-irradiating unit 100. Hereinafter, in the present specification, the long side (line length) direction from which the linear ultraviolet light is emitted from the light irradiation device 1 is defined as the X-axis direction, and the short-side direction (that is, the vertical direction of the first figure) is defined as the Y-axis direction. The direction, the direction perpendicular to the X-axis and the Y-axis is defined as the Z-axis direction for explanation.

As shown in Fig. 2, the sealed casing 200 is composed of an aluminum casing main body portion 210 having an opening 210a on the front surface thereof, and a glass window portion 220 fitted in the opening 210a, and sealingly accommodating the light irradiation unit 100. .

As shown in FIG. 1, the light irradiation unit 100 includes 32 light source modules 110, a pair of terminal blocks 131 and 132, a heat sink 150, a humidity control sheet 300, and the like. Each of the light source modules 110 is a rectangular unit that emits ultraviolet light. In the present embodiment, the following configuration is adopted: a configuration in which 16 (X-axis directions) × 2 columns (Y-axis direction) are densely arranged. On the heat sink 150, linear ultraviolet light parallel to the X-axis direction is emitted from the light irradiation device 1.

3 and 4 are views for explaining the light irradiation unit 100 of the present embodiment. Fig. 3 is an enlarged front elevational view of the light irradiation unit 100, which magnifies the light source module 110 of two x 2 columns. 4(a) is a rear view of the light irradiation unit 100, and FIG. 4(b) is a plan view of the light irradiation unit 100. Moreover, in FIGS. 3 and 4, the sealed casing 200 is omitted for convenience of explanation.

The heat sink 150 is used to fix the light source modules 110, and is used to make the light source modules 110 The member that generates heat by heat generation is formed of a metal such as copper having a high thermal conductivity. As shown in FIGS. 2 and 4, the heat sink 150 is a square columnar member extending in the X-axis direction, and the front surface 150a (Fig. 3) of the heat sink 150 serves as a mounting surface of the light source module 110. Further, as shown in Fig. 2, the terminal blocks 131 and 132 are attached to the top surface and the bottom surface of the heat sink 150 by a plurality of fixing screws (not shown).

As shown in Fig. 2, the heat sink 150 of the present embodiment is a so-called water-cooled heat sink having a flow path 160 through which a refrigerant can flow, and is provided on the back surface 150b side of the heat sink 150. A supply port 170 for supplying a refrigerant and a discharge port 175 for discharging the refrigerant are provided. Further, although the details are described in the following paragraph, the humidity adjusting sheet 300 is attached to the back surface 150b of the heat sink 150. Further, as the refrigerant, water or an antifreeze solution (for example, ethylene glycol, propylene glycol, or a mixture of the compounds and water) may be used, and the antifreeze may be added with a preservative such as sodium molybdate hydrate or carbon mixed water. s material.

As shown in FIG. 3, the terminal block 131 is a resin plate-shaped member that supports a plurality of pair of electrode terminals 135 including an anode terminal 135a and a cathode terminal 135b along the X-axis direction. The pair of electrode terminals 135 (that is, the anode terminal 135a and the cathode terminal 135b) are terminals for supplying electric power to the respective light source modules 110 and connected to the electrode plates 125 of the respective light source modules 110. In the present embodiment, in order to supply electric power to the 16 light source modules 110 disposed on the terminal block 131 side (that is, the top surface side of the heat sink 150), 16 anode terminals 135a are alternately disposed along the X-axis direction. 16 cathode terminals 135b. Further, although the details are described later, the humidity control sheet 300 is attached to the top surface 131a of the terminal block 131.

Similarly to the terminal block 131, the terminal block 132 is a resin-made plate-shaped member, and supports a plurality of pair of electrode terminals 136 including the anode terminal 136a and the cathode terminal 136b along the X-axis direction. The pair of electrode terminals 136 (that is, the anode terminal 136a and the cathode terminal 136b) are terminals that are connected to the electrode plates 125 of the respective light source modules 110 in order to supply electric power to the respective light source modules 110. In the present embodiment, in order to supply electric power to the 16 light source modules 110 disposed on the terminal block 132 side (that is, the bottom surface side of the heat sink 150), 16 anode terminals 136a are alternately disposed along the X-axis direction. 16 cathode terminals 136b. Further, the details are described in the following paragraph, on the bottom surface of the terminal block 132. On the 132a, a humidity control sheet 300 is attached.

As shown in FIG. 3, each light source module 110 includes a rectangular ceramic substrate 115 formed of aluminum nitride having high thermal conductivity, and a plurality of LEDs 120 in the ceramic substrate 115. The bonding method is arranged in a square lattice shape; a pair of rectangular electrode plates 125 are respectively soldered or the like (for example, a conductive adhesive (silver glue), a brazing material, a fusion fusion, a diffusion bonding, etc.), respectively, and a ceramic substrate The anode pattern (not shown) formed on 115 is electrically connected to the cathode pattern (not shown).

The electrode plate 125 is a plate-like member formed of copper or a copper alloy such as brass, phosphor bronze or beryllium copper, and has high electrical conductivity and flexibility. As described above, the tip end portion of the electrode plate 125 is electrically connected to the anode pattern or the cathode pattern by soldering or the like in the vicinity of the end portion of the surface of the ceramic substrate 115; the base end portion is protruded outside the ceramic substrate 115. The manner is pulled out and electrically connected to the anode terminal 135a (or 136a) or the cathode terminal 135b (or 136b).

Each of the light source modules 110 is arranged in the X-axis direction, and 11 LED dies 120 are arranged in the Y-axis direction, and are arranged in a square lattice on the surface of the ceramic substrate 115, and the optical axis direction thereof and the ceramic substrate 115. The direction perpendicular to the surface (that is, the Z-axis direction) is uniform. The anode terminal (not shown) and the cathode terminal (not shown) of each of the LED dies 120 are electrically connected to the anode pattern and the cathode pattern, respectively, by bonding wires not shown. Then, if a driving current (ie, an anode current) is supplied to the electrode plate 125 connected to the anode pattern, the driving current flows through all the LED dies 120 mounted on the respective light source modules 110, and is emitted from the respective LED dies 120. The amount of light corresponds to the ultraviolet light of the drive current. Further, each of the LED dies 120 of the present embodiment has substantially the same electrical characteristics, and the irradiation intensity distribution of the ultraviolet light emitted from each of the LED dies 120 is substantially equal. The drive current flowing through each of the LED dies 120 passes through the cathode pattern, and the return current (i.e., the cathode current) flows back from the electrode plate 125 connected to the cathode pattern.

When the driving current flows through all the LED dies 120 mounted on the respective light source modules 110 and the ultraviolet light is emitted from each of the LED dies 120, the temperature of the LED dies 120 rises due to heat generation, and the luminous efficiency is significantly improved. Reduced problems. Therefore, in this embodiment, the heat sink is 150 is disposed in close contact with each of the light source modules 110 to forcibly dissipate heat generated by the LED dies 120.

However, in the present embodiment, as shown in FIGS. 1 and 2, since the light irradiation unit 100 is covered by the sealed casing 200 in a sealed manner, a temperature difference occurs between the inside and the outside of the sealed casing 200. Next, if a temperature difference occurs between the inside and the outside of the sealed casing 200, dew condensation occurs inside the sealed casing 200, and the window portion 220 from which the ultraviolet light is emitted becomes turbid. Then, in order to solve this problem, the light irradiation device 1 of the present embodiment includes the humidity control sheet 300 inside the sealed casing 200.

The humidity-conditioning sheet 300 is a sheet-like member containing a porous mesoporous silica, for example, a product name "Mesopure®" (registered trademark) manufactured by Nippon Kasei Co., Ltd. The porous cerium oxide is made of silica as a material, has regular and uniform pores (mesoporous pores), and has a highly hygroscopic substance, and a humidity-conditioning sheet 300 containing porous cerium oxide, It is a property that adsorbs water vapor when the humidity exceeds a predetermined value, and releases water vapor when it is below a predetermined value (that is, hysteresis characteristics). Therefore, if it is disposed in the sealed casing 200, the humidity in the sealed casing 200 can be appropriately adjusted. Further, in the light irradiation device 1 of the present embodiment, since the temperature of the surface of the heat sink 150 is the lowest in the sealed casing 200, the heat sink 150 is most likely to be dew condensation, and the humidity regulating sheet 300 is attached to the heat sink 150. The back 150b (Fig. 4(a)). Further, from the viewpoint of humidity adjustment, the area of the humidity-conditioning sheet 300 is as wide as possible. Therefore, in the present embodiment, the humidity regulating sheet 300 is attached to the bottom surface 132a of the top surfaces 131a and 132 of the terminal block 131 disposed adjacent to the heat sink 150 so as to surround the heat sink 150.

As described above, since the light irradiation device 1 of the present embodiment includes the humidity control sheet 300 inside the sealed casing 200, the light irradiation unit 100 (that is, the light source module 110 and the heat sink) is used even in the sealed casing 200. 150) The configuration of the cover can also appropriately adjust the humidity inside the sealed casing 200. Therefore, the light source modules 110 can be surely cooled on the one hand, and condensation on the inside of the sealed casing 200 can be prevented on the one hand. Further, since the humidity inside the sealed casing 200 is controlled, the pattern on the ceramic substrate 115 does not accelerate ion migration.

Although the present embodiment has been described above, the present invention is not limited to the above-described constituents, and various modifications can be made within the scope of the technical idea of the present invention.

For example, in the present embodiment, the humidity control sheet 300 is disposed so as to surround the heat sink 150. However, the present invention is not limited thereto. To increase the area of the humidity control sheet 300, for example, it may be appropriately disposed in the seal. The inner surface of the housing 200.

Further, the humidity-conditioning sheet 300 of the present embodiment is a sheet-like member containing porous cerium oxide, but other adsorbing-type moisture absorbing agents may be used. The adsorbing type moisture absorbent used for the humidity-conditioning sheet 300 preferably contains at least one telluride, and examples thereof include cerium oxide, zeolite, porous glass, apatite, diatomaceous earth, kaolinite, and sepiolite. , stone, imogolite, activated clay, cerium oxide-alumina composite oxide, cerium oxide-titanium dioxide composite oxide, cerium oxide-zirconia, cerium oxide-magnesium oxide, cerium oxide-oxidation A composite metal oxide such as ruthenium, ruthenium dioxide, ruthenium oxide, ruthenium dioxide or ruthenium oxide.

In the present embodiment, the product name "Mesopure®" (registered trademark) manufactured by Nippon Kasei Co., Ltd. is used as an example of the humidity control sheet 300, but a similar product having hysteresis characteristics can also be applied.

In addition, all the points in the embodiments disclosed herein are illustrative and should not be construed as limiting the scope of the present invention. The scope of the present invention is not limited to the above description, but is also included in the scope of the patent application. All changes within the meaning and scope of the scope and scope of the patent application.

1‧‧‧Lighting device

100‧‧‧Light irradiation unit

110‧‧‧Light source module

131, 132‧‧‧ terminal block

131a‧‧‧Terminal top

132a‧‧‧Bottom of terminal block

150‧‧‧heatsink

150a‧‧‧ radiator front

150b‧‧‧Radiator back

160‧‧‧flow path

170‧‧‧ supply port

175‧‧‧Export

200‧‧‧ Sealed housing

210‧‧‧ housing body

210a‧‧‧ openings

220‧‧‧ Window Department

300‧‧‧Hygrostat

Claims (8)

A light-irradiating device comprising: a light source module having a substrate and a light-emitting element mounted on the surface of the substrate, and emitting light to the illumination target; and a heat sink for abutting against the back surface of the substrate Providing and internally having a flow path through which the refrigerant can flow; a sealed casing disposed in a manner to seal the light source module from the heat sink; and a humidity control member disposed on the heat sink to Adjust the humidity inside the sealed housing. The light-irradiating device according to claim 1, wherein the humidity-conditioning member adsorbs moisture in the air when the humidity in the sealed casing exceeds a predetermined value; and when the humidity is below a predetermined value, the adsorption is performed. The moisture is released into the air. The light irradiation device of claim 2, wherein the humidity adjustment member comprises porous cerium oxide. The light-irradiating device according to any one of claims 1 to 3, wherein the humidity-conditioning member is a sheet-like member. The light irradiation device of claim 4, wherein the humidity adjustment member is disposed to surround the heat sink. The light irradiation device according to any one of claims 1 to 5, wherein the refrigerant is water, or ethylene glycol, propylene glycol, or a mixture of the compounds and water. The light-irradiating device according to any one of claims 1 to 6, further comprising: a plurality of light source modules; wherein the light source modules are arranged in at least one row in a predetermined direction. The light-irradiating device according to any one of claims 1 to 7, wherein the light-emitting element emits light having a wavelength acting on the ultraviolet curable resin.