CN116995182B - Diode packaging structure capable of improving heat dissipation effect - Google Patents
Diode packaging structure capable of improving heat dissipation effect Download PDFInfo
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- CN116995182B CN116995182B CN202311222454.9A CN202311222454A CN116995182B CN 116995182 B CN116995182 B CN 116995182B CN 202311222454 A CN202311222454 A CN 202311222454A CN 116995182 B CN116995182 B CN 116995182B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 47
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 230000000694 effects Effects 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000001816 cooling Methods 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 5
- 230000008859 change Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a diode packaging structure capable of improving heat dissipation effect, which relates to the technical field of diodes and comprises a substrate, wherein a fixed seat is arranged in a large-diameter hole, a heat dissipation base is arranged at the top of the fixed seat, and a light-emitting diode is adhered to the top of an electrode seat through heat conduction gel; the top of the substrate is provided with a packaging component; a limiting component is arranged in the arc-shaped groove; a lead plate transversely penetrates through the upper part of one side of the fixing seat, and a plurality of pins are fixedly arranged at the opposite joint positions of the front end and the rear end of the lower substrate and the upper substrate; according to the application, through the matching of the substrate, the packaging member and the heat dissipation base, the light-emitting diode arranged on the electrode base is conveniently and rapidly cooled, and the air in the substrate can be effectively circulated and replaced with the external air; the LED lamp is convenient to disassemble and assemble the radiating base and the LED, the convenience and the high efficiency of part maintenance and replacement are improved when the LED lamp is used, and the cost of maintenance and replacement of the patch type diode is saved.
Description
Technical Field
The present application relates to the field of diode technologies, and in particular, to a diode packaging structure capable of improving a heat dissipation effect.
Background
As a semiconductor element for forming a desired carrier wave (electrons or holes) injected by a P-N junction structure and radiating light energy by recombination therebetween, a light emitting diode has been developed which is small and has a long life compared to a conventional light source, and has high luminous efficiency because electric energy is directly converted into light energy, and various structures of light emitting diode packages mounted on such devices and which are convenient to use have been developed for application to such display devices, lighting devices, and the like; in particular, the amount of heat generated by the light emitting diode chip is considerably high in response to the high luminous efficiency, and therefore, a heat dissipating unit that can dissipate the heat of the chip to the outside is required to be provided in the light emitting diode package;
if the light emitting diode package is not provided with an appropriate heat dissipating unit, the temperature of the light emitting diode chip becomes too high, so that the chip itself or the package is heated, which eventually results in a decrease in light emitting efficiency and a reduction in the lifetime of the chip; heat energy is accumulated due to circuit power loss, particularly when the LED is placed in a sealed environment, the accumulated heat causes rapid temperature rise, the degradation of the LED is accelerated, and the brightness is attenuated and the service life is shortened; the heat cannot be discharged, so that the temperature of the whole structure is increased, and the service life of the light-emitting diode packaging structure is easily shortened or even damaged; therefore, the above problems need to be solved and optimized.
Disclosure of Invention
The application aims to solve the defects in the prior art and provides a diode packaging structure capable of improving the heat dissipation effect.
In order to achieve the above purpose, the present application adopts the following technical scheme: the diode packaging structure comprises a substrate, wherein the substrate is formed by bonding a lower substrate and an upper substrate through heat conduction gel, a large-diameter hole is formed in the bottom surface of the lower substrate, and a small-diameter hole is formed in the bottom surface of the upper substrate; a fixing seat is arranged in the large-diameter hole, a heat dissipation base is arranged at the top of the fixing seat, and the top of the heat dissipation base extends out of the small-diameter hole and is conical truncated; the top surface of the heat dissipation base is provided with a mounting groove, the middle part of the inner bottom surface of the mounting groove is vertically provided with a through hole, an electrode seat is arranged in the through hole, and the top of the electrode seat is adhered with a light-emitting diode through heat-conducting gel; a packaging component is arranged on the top of the substrate; arc grooves are formed in two sides of the bottom surface of the lower substrate; a limiting assembly for positioning the fixing seat is arranged in the arc-shaped groove; the upper part of one side of the fixed seat is transversely penetrated with a lead plate, and the bottom end of the electrode seat is fixedly and electrically connected with the lead plate; and a plurality of pins electrically connected with the lead plate are fixedly arranged at the front-rear end butt joint positions of the lower substrate and the upper substrate.
Preferably, the two side surfaces of the substrate are provided with connection flat openings communicated with the large-diameter holes, water cooling boxes matched with the packaging components are plugged in the connection flat openings, and the inner ends of the water cooling boxes are fixedly connected with the side walls of the lead plates.
Preferably, the packaging member comprises a packaging shell, a light-transmitting sealing plate and a light-transmitting convex lens, wherein the packaging shell is vertically and fixedly covered on the outer side of the heat dissipation base, the light-transmitting sealing plate is installed at the top opening of the packaging shell, the light-transmitting convex lens is rotationally connected to the top of the mounting groove, an annular groove is formed in the top end surface of the packaging shell, a water-cooling coil is arranged in the annular groove, the top end of the water-cooling coil is fixedly communicated with one water-cooling box, and the bottom end of the water-cooling coil is fixedly communicated with the other water-cooling box; the bottom surface of the upper base plate is provided with a pipeline groove for laying a water-cooling coil pipeline.
Preferably, the limiting assembly comprises a positioning shaft fixedly arranged in the middle of the arc-shaped groove, a limiting plate rotatably sleeved on the upper part of the positioning shaft and a heat dissipation screen fixedly sleeved on the lower part of the positioning shaft, limiting arc grooves matched with the limiting plate are formed in two sides of the bottom surface of the fixing seat, and the arc grooves and the limiting arc grooves can form a complete circular groove; the limiting plate is of a circular plate-shaped structure with a notch; the clamping strip groove is transversely formed in the bottom surface of the limiting end of the limiting plate, the locating pin block is horizontally arranged in the clamping strip groove in a sliding mode, and the locating groove is formed in the inner end wall of the limiting arc groove in a transversely matched mode.
Preferably, a groove is formed in the bottom of the outer end of the positioning pin block, a threaded hole is vertically formed in the groove, a limit screw is arranged in the threaded hole, and thread grooves matched with the limit screw are formed in two ends of the inner bottom surface of the clamping strip groove; the cross sections of the clamping strip grooves and the positioning pin blocks are T-shaped cross sections.
Preferably, one end of the limiting plate is provided with an arc notch which is the same as the limiting arc groove; the outer end of the arc-shaped groove is provided with a sector-shaped opening communicated with the flat connection opening; a layer of dust screen is arranged inside the fan-shaped opening.
Preferably, a plurality of outwards scattering heat dissipation pore canals are formed in the inner wall of the outer side of the arc-shaped groove at equal intervals, and ventilation plugs are arranged in the heat dissipation pore canals.
Preferably, a plurality of mutually communicated heat conducting strip grooves are formed in the inner wall of the connecting flat port at equal intervals, and the heat conducting strip grooves are communicated with the fan-shaped port.
Compared with the prior art, the application has the beneficial effects that: according to the application, the substrate, the packaging member and the heat dissipation base are matched, so that the light-emitting diode arranged on the electrode base can be conveniently and rapidly cooled, and the light scattering range and the prompting effect of the light-emitting diode during operation can be improved through the arrangement of the light-transmitting sealing plate and the light-transmitting convex mirror; meanwhile, the air in the substrate can be effectively circulated and replaced with the outside air; and be convenient for carry out dismouting operation to radiating base and emitting diode, improve the convenience and the high efficiency that carry out spare part maintenance and change when this device is used, save the expense of carrying out maintenance and change to SMD diode.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of the present application;
FIG. 2 is a schematic view of a structure of a heat dissipating mesh plate on the bottom of a substrate;
FIG. 3 is a schematic diagram of the structure of the heat dissipating screen of the present application after removal;
FIG. 4 is a schematic view of the structure of the removable light-transmitting seal plate of the present application;
FIG. 5 is a schematic view of a bottom partial structure of the present application;
FIG. 6 is a schematic perspective view of a leadframe and heat sink base according to the present application;
FIG. 7 is a cross-sectional view of a top structure of a substrate of the present application;
fig. 8 is a schematic view of the package cover removing structure of the present application.
Number in the figure: 1. a substrate; 2. a fixing seat; 3. a heat dissipation base; 4. an electrode base; 5. a package housing; 6. a light-transmitting sealing plate; 7. a light emitting diode; 8. a lead plate; 9. pins; 10. a water cooling box; 11. a light-transmitting convex mirror; 12. a water-cooling coil pipe; 13. positioning a shaft; 14. a limiting plate; 15. a heat dissipation screen; 16. a dust screen; 17. a heat dissipation duct; 18. positioning pin blocks; 19. a limit screw; 20. a positioning groove; 21. a vent plug.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments.
Examples: referring to fig. 1 to 8, a diode package structure capable of improving heat dissipation effect includes a substrate 1, wherein the substrate 1 is formed by bonding a lower substrate and an upper substrate through heat conduction gel, a large-diameter hole is formed in the bottom surface of the lower substrate, and a small-diameter hole is formed in the bottom surface of the upper substrate; a fixing seat 2 is arranged in the large-diameter hole, a heat dissipation base 3 is arranged at the top of the fixing seat 2 on the outer ring of the top surface of the fixing seat 2, and the top of the heat dissipation base 3 extends out of the small-diameter hole and is conical truncated; the top surface of the heat dissipation base 3 is provided with a mounting groove, the middle part of the bottom surface in the mounting groove is vertically provided with a through hole, an electrode seat 4 is arranged in the through hole, and the top of the electrode seat 4 is adhered with a light-emitting diode 7 through heat conducting gel; the top of the substrate 1 is provided with a packaging member; arc grooves are formed on two sides of the bottom surface of the lower substrate; a limiting component for positioning the fixed seat 2 is arranged in the arc-shaped groove; a lead plate 8 transversely penetrates through the upper part of one side of the fixed seat 2, and the bottom end of the electrode seat 4 is fixedly and electrically connected with the lead plate 8; a plurality of pins 9 electrically connected with the lead plate 8 are fixedly arranged at the opposite joint of the front end and the rear end of the lower substrate and the upper substrate; through the cooperation of base plate 1 and encapsulation component and heat dissipation base 3, be convenient for carry out the quick heat dissipation operation of water-cooling to the emitting diode 7 of installing on electrode holder 4 to through the setting of printing opacity shrouding 6 and printing opacity convex mirror 11, can improve the astigmatic scope and the suggestion effect of emitting diode 7 when the operation.
In the application, two side surfaces of a base plate 1 are provided with connection flat openings communicated with large-diameter holes, the inside of each connection flat opening is plugged with a water cooling box 10 matched with a packaging component, and the inner end of each water cooling box 10 is fixedly connected with the side wall of a lead plate 8; the packaging component comprises a packaging shell 5, a light-transmitting sealing plate 6 and a light-transmitting convex lens 11, wherein the packaging shell 5 is vertically and fixedly covered on the outer side of the heat dissipation base 3, the light-transmitting sealing plate 6 is arranged at the top opening of the packaging shell 5, the light-transmitting convex lens 11 is screwed and connected to the top of the mounting groove, an annular groove is formed in the top end surface of the packaging shell 5, a water-cooling coil 12 is arranged in the annular groove, the top end of the water-cooling coil 12 is fixedly communicated with one water-cooling box 10, and the bottom end of the water-cooling coil 12 is fixedly communicated with the other water-cooling box 10; the bottom surface of the upper base plate is provided with a pipeline groove for laying a water-cooling coil 12 pipeline; by providing the package member, the air inside the substrate 1 can be effectively circulated and replaced with the outside air, and the efficiency of heat dissipation of the light emitting diode 7 can be improved.
In the application, the limiting component comprises a positioning shaft 13 fixedly arranged in the middle of an arc groove, a limiting plate 14 rotatably sleeved on the upper part of the positioning shaft 13 and a heat dissipation screen 15 fixedly sleeved on the lower part of the positioning shaft 13, wherein limiting arc grooves matched with the limiting plate 14 are formed on two sides of the bottom surface of the fixed seat 2, and the arc grooves and the limiting arc grooves can form a complete circular groove; the limiting plate 14 is of a circular plate-shaped structure with a notch; a clamping strip groove is transversely formed in the bottom surface of the limiting end of the limiting plate 14, a positioning pin block 18 is horizontally arranged in the clamping strip groove in a sliding mode, and a positioning groove 20 is formed in the inner end wall of the limiting arc groove in a transversely matched mode; the bottom of the outer end of the positioning pin block 18 is provided with a groove, the inside of the groove is vertically provided with a threaded hole, the inside of the threaded hole is provided with a limit screw 19, and both ends of the inner bottom surface of the clamping strip groove are provided with thread grooves matched with the limit screw 19; the cross sections of the clamping strip grooves and the positioning pin blocks 18 are T-shaped; through spacing subassembly's setting, be convenient for carry out dismouting operation to radiating base 3 and fixing base 2, improve the convenience and the high efficiency that this device was carried out spare part maintenance and was changed when using, save the expense of maintaining the change to the SMD diode.
In the application, one end of the limiting plate 14 is provided with an arc notch which is the same as the limiting arc groove; the outer end of the arc-shaped groove is provided with a fan-shaped opening communicated with the flat connection opening; a layer of dust screen 16 is arranged inside the fan-shaped opening; a plurality of outwards scattering heat dissipation pore canals 17 are equidistantly arranged on the inner wall of the outer side of the arc-shaped groove, and ventilation plugs 21 are arranged in the heat dissipation pore canals 17; a plurality of mutually communicated heat conducting strip grooves are formed in the inner wall of the connecting flat port at equal intervals, and the heat conducting strip grooves are communicated with the fan-shaped port; the circulation effect of the air inside the substrate 1 is improved, and the cooling liquid inside the water cooling box 10 can be cooled.
Working principle: in this embodiment, the present application further provides a method for using a diode package structure capable of improving a heat dissipation effect, including the following steps:
firstly, a heat dissipation base 3 with a fixed seat 2 and a lead plate 8 is arranged on a base plate 1, the heat dissipation base 3 penetrates out of a small-diameter hole of the base plate 1, meanwhile, a water cooling box 10 fixedly connected with two ends of the lead plate 8 is clamped inside a connecting flat port, two ends of a water cooling coil 12 inside a packaging shell 5 are fixedly communicated with the two water cooling boxes 10 respectively, a lower base plate with a limiting assembly is sleeved on the fixed seat 2, the lower base plate and the upper base plate are fixed through heat conduction gel sealing adhesion, and heat conduction gel is smeared in a gap connecting the flat port and the outer end of the water cooling box 10 for sealing;
secondly, the plate body with the locating pin block 18 is rotated into a limit arc groove of the fixed seat 2 by rotating the limiting plate 14, the locating pin block 18 is pushed to be horizontally inserted into a locating groove 20 of the fixed seat 2, and a limit screw 19 is screwed into a thread groove at the outer end of the clamping strip groove, so that the locating pin block 18 inserted into the locating groove 20 is limited and locked, and the fixed seat 2 can be pressed into a large-diameter hole of the lower substrate under the action of the limiting plate 14 and the locating pin block 18, the top of the fixed seat 2 is tightly abutted against the bottom surface of the upper substrate, and the stability of the fixed seat 2 after installation is improved;
thirdly, the light-emitting diode 7 is arranged at the top of the electrode base 4 through a heat-conducting gel adhesive, the light-emitting diode 7 is electrically connected with the electrode base 4, the light-transmitting convex mirror 11 is sealed and screwed in a notch at the top of the heat dissipation base 3, and the light-transmitting sealing plate 6 is sealed and screwed on the top of the packaging shell 5;
when the substrate 1 provided with the light emitting diode 7 is arranged on the circuit board, the substrate is electrically connected with the circuit board through the pin 9, the light emitting diode 7 can work normally after the electrode holder 4 is electrified, the temperature in the packaging shell 5 can be timely reduced through the water cooling coil 12 and the water cooling box 10 in the limiting component for the heat generated during the work of the light emitting diode 7, the temperature transferred on the electrode holder 4 can be timely exported through the arrangement of the heat dissipation base 3, and the heat can be transferred to the water cooling box 10 through the lead plate 8, so that the cooling effect on the light emitting diode 7 during the operation is improved;
when the water body in the water cooling box 10 needs to dissipate heat, the arc-shaped grooves are matched with the fan-shaped openings and the heat conducting strip grooves, so that heat entering the connecting flat openings can be volatilized through the heat dissipation pore canal 17 on the arc-shaped grooves, and the heat dissipation efficiency of the heat dissipation base 3 and the light emitting diode 7 and the internal circulation effect of air are improved; greatly improves the heat dissipation performance and the service life of the diode packaging structure.
The foregoing is only a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, who is within the scope of the present application, should make equivalent substitutions or modifications according to the technical scheme of the present application and the inventive concept thereof, and should be covered by the scope of the present application.
Claims (3)
1. Diode packaging structure capable of improving heat dissipation effect, comprising a substrate (1), and being characterized in that: the substrate (1) is formed by bonding a lower substrate and an upper substrate through heat conduction gel, wherein a large-diameter hole is formed in the bottom surface of the lower substrate, and a small-diameter hole is formed in the bottom surface of the upper substrate; a fixing seat (2) is arranged in the large-diameter hole, a heat dissipation base (3) is arranged at the top of the fixing seat (2), and the top of the heat dissipation base (3) extends out of the small-diameter hole and is in a conical truncated shape; the top surface of the heat dissipation base (3) is provided with a mounting groove, the middle part of the bottom surface in the mounting groove is vertically provided with a through hole, an electrode seat (4) is arranged in the through hole, and a light emitting diode (7) is adhered to the top of the electrode seat (4) through heat conduction gel; a packaging component is arranged on the top of the substrate (1);
arc grooves are formed in two sides of the bottom surface of the lower substrate; a limiting component for positioning the fixing seat (2) is arranged in the arc-shaped groove; a lead plate (8) is transversely penetrated at the upper part of one side of the fixed seat (2), and the bottom end of the electrode seat (4) is fixedly and electrically connected with the lead plate (8); the front and rear end butt joints of the lower substrate and the upper substrate are fixedly provided with a plurality of pins (9) electrically connected with the lead plate (8);
the two side surfaces of the base plate (1) are provided with connection flat openings communicated with the large-diameter holes, water cooling boxes (10) matched with the packaging components are plugged in the connection flat openings, and the inner ends of the water cooling boxes (10) are fixedly connected with the side walls of the lead plates (8);
the packaging component comprises a packaging shell (5) vertically and fixedly covered on the outer side of the radiating base (3), a light-transmitting sealing plate (6) arranged at the top opening of the packaging shell (5) and a light-transmitting convex mirror (11) screwed and connected to the top of the mounting groove, an annular groove is formed in the top end surface of the packaging shell (5), a water-cooling coil pipe (12) is arranged in the annular groove, the top end of the water-cooling coil pipe (12) is fixedly communicated with one water-cooling box (10), and the bottom end of the water-cooling coil pipe (12) is fixedly communicated with the other water-cooling box (10); the bottom surface of the upper base plate is provided with a pipeline groove for laying a water-cooling coil pipe (12) pipeline;
the limiting assembly comprises a positioning shaft (13) fixedly arranged in the middle of the arc-shaped groove, a limiting plate (14) rotatably sleeved on the upper part of the positioning shaft (13) and a heat dissipation screen plate (15) fixedly sleeved on the lower part of the positioning shaft (13), limiting arc grooves matched with the limiting plate (14) are formed in two sides of the bottom surface of the fixing seat (2), and the arc grooves and the limiting arc grooves can form a complete circular groove; the limiting plate (14) is of a circular plate-shaped structure with a notch; a clamping strip groove is transversely formed in the bottom surface of the limiting end of the limiting plate (14), a positioning pin block (18) is horizontally arranged in the clamping strip groove in a sliding mode, and a positioning groove (20) is formed in the inner end wall of the limiting arc groove in a transverse matching mode with the positioning pin block (18);
the bottom of the outer end of the locating pin block (18) is provided with a groove, a threaded hole is vertically formed in the groove, a limit screw (19) is arranged in the threaded hole, and threaded grooves matched with the limit screw (19) are formed in two ends of the inner bottom surface of the clamping strip groove; the cross sections of the clamping strip grooves and the positioning pin blocks (18) are T-shaped;
a plurality of outwards scattering heat dissipation pore channels (17) are formed in the inner wall of the outer side of the arc-shaped groove at equal intervals, and ventilation plugs (21) are arranged in the heat dissipation pore channels (17).
2. The diode packaging structure capable of improving heat dissipation effect according to claim 1, wherein: one end of the limiting plate (14) is provided with an arc notch which is the same as the limiting arc groove; the outer end of the arc-shaped groove is provided with a sector-shaped opening communicated with the flat connection opening; a layer of dustproof net (16) is arranged inside the fan-shaped opening.
3. The diode packaging structure capable of improving heat dissipation effect according to claim 2, wherein: the inner wall equidistance of connecting flat mouth has offered a plurality of heat conduction strip grooves of intercommunication each other, heat conduction strip groove and fan-shaped mouth intercommunication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311222454.9A CN116995182B (en) | 2023-09-21 | 2023-09-21 | Diode packaging structure capable of improving heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311222454.9A CN116995182B (en) | 2023-09-21 | 2023-09-21 | Diode packaging structure capable of improving heat dissipation effect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116995182A CN116995182A (en) | 2023-11-03 |
| CN116995182B true CN116995182B (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311222454.9A Active CN116995182B (en) | 2023-09-21 | 2023-09-21 | Diode packaging structure capable of improving heat dissipation effect |
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| Country | Link |
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| CN (1) | CN116995182B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208489190U (en) * | 2018-07-13 | 2019-02-12 | 深圳市丰颜光电有限公司 | A kind of encapsulating structure of light emitting diode |
| CN111336461A (en) * | 2018-12-18 | 2020-06-26 | 陈律希 | Novel strong heat dissipation automobile lighting device |
| CN112393184A (en) * | 2019-08-19 | 2021-02-23 | 天祥电气集团有限公司 | Wisdom street lamp that radiating effect is good |
| CN218568876U (en) * | 2022-08-01 | 2023-03-03 | 东莞市伊伯光电科技有限公司 | Packaging structure of heat dissipation type surface-mounted light-emitting diode |
-
2023
- 2023-09-21 CN CN202311222454.9A patent/CN116995182B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208489190U (en) * | 2018-07-13 | 2019-02-12 | 深圳市丰颜光电有限公司 | A kind of encapsulating structure of light emitting diode |
| CN111336461A (en) * | 2018-12-18 | 2020-06-26 | 陈律希 | Novel strong heat dissipation automobile lighting device |
| CN112393184A (en) * | 2019-08-19 | 2021-02-23 | 天祥电气集团有限公司 | Wisdom street lamp that radiating effect is good |
| CN218568876U (en) * | 2022-08-01 | 2023-03-03 | 东莞市伊伯光电科技有限公司 | Packaging structure of heat dissipation type surface-mounted light-emitting diode |
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| Publication number | Publication date |
|---|---|
| CN116995182A (en) | 2023-11-03 |
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