TW201535881A - Socket mounting constuction and spring member - Google Patents

Abstract

This invention provides a socket mounting construction which has a substrate, a holder member, a plurality of supporting members extending from a major surface to be inserted in the through holes of the substrate provided in the holder member and a spring member (plate spring 5) fixed onto the plurality of supporting members in such state to urge the holder member carried by the substrate against the substrate, wherein first through holes (through holes 52a-52d) extend in the direction of the thickness of the supporting member are formed in the spring member, and a fixing part for holding and fixing the supporting member is provided, the fixing part forming a part of the side wall of at least one of the plurality of first through holes.

Description

Socket mounting structure and spring member

The present invention relates to a socket mounting structure of a test socket used for an ON state inspection or an operation characteristic inspection of an inspection object such as a semiconductor integrated circuit or a liquid crystal panel, and a spring member used in the socket mounting structure.

In the past, when performing an on-state inspection or an operation characteristic inspection of an inspection target such as a semiconductor integrated circuit or a liquid crystal panel, in order to electrically connect the inspection target to a signal processing device having a circuit board that outputs an inspection signal, the system uses A test socket (hereinafter referred to as a socket) for accommodating a plurality of contact probes. With the progress of the integration and miniaturization of the semiconductor integrated circuit and the liquid crystal panel in recent years, the pitch between the contact probes is narrowed in the socket, so that it can be applied to high integration and fineness. The technology of the inspection object is progressing.

The conventional socket has: a plurality of contact probes; a probe holder for accommodating and holding a plurality of contact probes according to a predetermined pattern; and a periphery of the probe holder for suppressing inspection and a plurality of contact probes Holding structure of the positional deviation of the semiconductor integrated circuit in contact with the needle Pieces. The socket is fixed by screwing the holding member to the circuit board of the signal processing device, and can be electrically connected to the contact probe (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2010-3511

However, in the signal processing device, a plurality of circuit substrates are sometimes provided depending on the type of the semiconductor integrated circuit. In this case, it is necessary to mount the above-mentioned sockets on the signal processing device (on the circuit board) in accordance with the semiconductor integrated circuit to be inspected. The socket is fixed to the substrate by screwing, so the time required for installation and disassembly operations may be quite long. Moreover, the labor required for this work is also quite large, and therefore a technique for easily attaching and detaching the socket and the circuit board is desired.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a socket mounting structure and a spring member which can easily attach and detach a socket and a circuit board.

In order to solve the above problems and achieve the object, the socket mounting structure of the present invention is a socket mounting structure in which a socket is mounted on a substrate, and the socket has a plurality of contact probes that are in contact with the substrate and the contacted body at both ends in the longitudinal direction. Needle; accommodate and maintain the aforementioned complex in accordance with a predetermined pattern a plurality of probe holders for contacting the probe; and a holding member disposed around the probe holder; the socket mounting structure includes: extending from the main surface of the substrate, and respectively inserted in the holding member a plurality of support members for inserting through holes; and a plate-shaped spring member attached to the plurality of support members in a state in which the holding member placed on the substrate is biased toward the substrate side, and the spring member is formed a first through hole that penetrates the plate thickness direction and is inserted into the support member, and has a fixing portion that forms a part of a side wall of at least one of the plurality of first through holes to hold The aforementioned support member is fixed.

Further, in the above-described invention, the spring member has a base portion formed in a substantially strip shape, and both ends of the base portion in the longitudinal direction thereof face the base portion on a plane through which the plate surface passes. The two arm portions that are curved in a substantially vertical direction in the longitudinal direction and that are curved in the center portion are formed in a substantially C-shape when viewed in a direction perpendicular to the plate surface of the base portion, and the first through holes are respectively It is provided in the aforementioned arm.

Further, in the above-described invention, the support member is formed in a columnar shape and has a small diameter portion provided on the distal end side and having a smaller diameter than the other portions, and the first through hole has a diameter larger than that of the support member. a first hole portion having a largest diameter; and a uniform width extending from an end portion of the first hole portion to a side different from a front end side of the arm portion, the width being substantially equal to a diameter of the small diameter portion The hole portion is formed by a slit extending from a side wall of the second hole portion, and is a claw portion for locking the support member.

Further, in the above-described invention, in the socket mounting structure of the present invention, the two arm portions are each provided with a bent portion formed by bending an edge end portion on the side opposite to the side opposite to each other.

Further, in the above-described invention, in the socket mounting structure of the present invention, the holding member is provided with a screw hole through which a screw can be screwed, and the arm portion is provided with a second through hole penetrating in the thickness direction corresponding to the screw hole. In the hole, the holding member and the spring member are coupled by a screw that is inserted into the second through hole and screwed into the screw hole.

Further, in the socket mounting structure of the present invention, in the above aspect of the invention, the holding member has two notch portions which are respectively provided on opposite outer edge sides of the upper surface side, and are formed along the outer edge. a slit for guiding a mounting position of the aforementioned spring member on the aforementioned holding member.

Further, the spring member of the present invention is a plate-shaped spring member used for mounting a socket on a substrate, and the socket has a plurality of contact probes that are in contact with the substrate and the contacted body at both ends in the longitudinal direction; a probe holder for accommodating and holding the plurality of contact probes according to a predetermined pattern; and a holding member provided around the probe holder; the spring member is characterized in that a plurality of first through holes are formed The plate is inserted in the plate thickness direction, and is extended from the main surface of the substrate in a state in which the load is applied to the substrate side with respect to the holding member placed on the substrate, and is inserted into the insertion member provided in the holding member. The plurality of support members of the through hole are inserted and have a fixing portion that forms a side wall of at least one of the plurality of first through holes to hold and fix the support member.

According to the present invention, the effect of easily attaching and detaching the socket with respect to the circuit board is exhibited.

1‧‧‧ socket

2‧‧‧Contact probe (probe)

3‧‧‧ probe holder

4‧‧‧Retaining components

5‧‧‧ leaf spring

21‧‧‧1st plunger

22‧‧‧2nd plunger

23‧‧‧ pipe components

31‧‧‧1st component

32‧‧‧2nd component

33, 34‧‧‧ Keep the hole

33a, 34a, 211a to 211d‧‧‧ Small Trails

33b, 34b‧‧‧The Great Trails Department

40‧‧‧ Main body

41a, 41b‧‧‧ notch

50‧‧‧ base

51a, 51b‧‧‧arms

52a to 52d, 53a, 53b‧‧‧through holes

100‧‧‧Semiconductor integrated circuit

101‧‧‧Connecting electrode

200‧‧‧ circuit substrate

201‧‧‧ electrodes

201a to 201d‧‧‧ axes

401a, 401b‧‧‧ screws

411‧‧‧ embedded hole

412a to 412d‧‧‧ inserted through holes

413a, 413b‧‧‧ screw holes

511a, 511b‧‧‧1st extension

511c, 511d‧‧‧bend

512a, 512b‧‧‧2nd extension

521, 526‧‧‧1st hole

522, 527‧‧‧2nd hole

523, 524‧‧‧ slit

525‧‧‧ claws

Fig. 1 is a perspective view showing a schematic structure of a socket mounting structure according to an embodiment of the present invention.

Fig. 2 is a partial cross-sectional view showing the structure of a main part of a socket according to an embodiment of the present invention.

Fig. 3 is a partial cross-sectional view showing the structure of a main part of a socket in the inspection of the semiconductor integrated circuit according to the embodiment of the present invention.

Fig. 4 is a perspective view showing a structure of a main part of a socket mounting structure according to an embodiment of the present invention.

Fig. 5 is a perspective view showing a structure of a main part of a socket mounting structure according to an embodiment of the present invention.

Fig. 6 is a perspective view showing a structure of a main part of a socket mounting structure according to an embodiment of the present invention.

Fig. 7 is a plan view showing the configuration of a main part of the leaf spring shown in Fig. 6.

Fig. 8 is a perspective view showing the structure of a main part of the socket of the embodiment.

Fig. 9 is a partial cross-sectional view showing the structure of a main part of a socket according to an embodiment of the present invention.

Figure 10 is a view showing the main part of the socket of the embodiment of the present invention. A three-dimensional map.

Figure 11 is a partial cross-sectional view showing the structure of a main part of a socket according to an embodiment of the present invention.

Fig. 12 is a perspective view showing the structure of a main part of a socket according to an embodiment of the present invention.

Figure 13 is a partial cross-sectional view showing the structure of a main part of a socket according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Further, the present invention is not limited by the following embodiments. Further, each of the drawings referred to in the following description schematically shows the shape, size, and positional relationship to the extent that the contents of the present invention can be understood. That is, the present invention is not limited to the shapes, sizes, and positional relationships illustrated in the respective drawings.

Fig. 1 is a perspective view showing a schematic structure of a socket mounting structure according to an embodiment of the present invention. The socket 1 shown in FIG. 1 is a device used for performing electrical characteristic inspection of the semiconductor integrated circuit 100 as an inspection target, and outputs the semiconductor integrated circuit 100 and the inspection signal to the semiconductor integrated circuit 100. The device between the circuit substrates 200 is electrically connected.

The socket 1 has one end side in the longitudinal direction and one electrode (contacted body) of the semiconductor integrated circuit 100 as the contacted body, and the other end side is in contact with the electrode of the circuit board 200. a plurality of contact probes 2 (hereinafter referred to as "probe 2"); a probe holder 3 for accommodating and holding a plurality of probes 2 in accordance with a predetermined pattern; a holding member 4 around the probe holder 3 and for suppressing occurrence of a positional deviation of the semiconductor integrated circuit 100 in contact with the plurality of probes 2 at the time of inspection; and mounting on the upper surface of the holding member 4, and The holding member 4 is pressed toward the circuit board 200 side to fix the holding member 4 and the leaf spring 5 (spring member) of the circuit board 200.

FIG. 2 is a view showing a detailed structure of the probe 2 housed in the probe holder 3. The probe 2 shown in FIG. 2 includes a first plunger 21 that comes into contact with the connection electrode of the semiconductor integrated circuit 100 when the semiconductor integrated circuit 100 is inspected, and an electrode contact with the circuit substrate 200 including the inspection circuit. The second plunger 22; and a pipe member 23 interposed between the first plunger 21 and the second plunger 22 and covering the periphery of the spring member (not shown). The first plunger 21, the second plunger 22, and the tube member 23 constituting the probe 2 have the same axis. When the probe 2 is brought into contact with the semiconductor integrated circuit 100, the spring member in the tube member 23 expands and contracts in the axial direction to relax the impact of the semiconductor integrated circuit 100 on the connection electrode, and the semiconductor integrated circuit 100 and The circuit substrate 200 applies a load. In addition, the first plunger 21 is in contact with, for example, the hemispherical connection electrode 101 (see FIG. 3) in the semiconductor integrated circuit 100, and thus has a plurality of sharp end portions forming a tapered tip shape.

The probe holder 3 is formed of an insulating material such as a resin, a machined ceramic, or a crucible, and has a first member 31 on the upper surface side of the second drawing and a second member 32 on the lower surface side. Adult. In the first member 31 and the second member 32, the same number of holding holes 33 and 34 for accommodating the plurality of probes 2 are respectively formed, and the probe 2 is housed. The holding holes 33 and 34 are formed in such a manner that their axes coincide with each other. The formation positions of the holding holes 33 and 34 are determined in accordance with the wiring pattern of the semiconductor integrated circuit 100.

Both of the holding holes 33 and 34 have a stepped hole shape in which the diameter is different along the through direction. In other words, the holding hole 33 is composed of a small diameter portion 33a having an opening on the upper end surface of the probe holder 3 and a large diameter portion 33b having a larger diameter than the small diameter portion 33a. The diameter of the small diameter portion 33a is slightly larger than the diameter of the first plunger 21. The diameter of the large diameter portion 33b is slightly larger than the diameter of the pipe member 23.

On the other hand, the holding hole 34 is composed of a small diameter portion 34a having an opening at the lower end surface of the probe holder 3 and a large diameter portion 34b having a larger diameter than the small diameter portion 34a. The diameter of the small diameter portion 34a is slightly larger than that of the second plunger 22. The diameter of the large diameter portion 34b is slightly larger than the diameter of the pipe member 23. The shape of these holding holes 33 and 34 is determined depending on the structure of the probe 2 to be accommodated.

The pipe member 23 has a function of preventing the probe 2 from coming off the probe holder 3 by abutting against the boundary wall surface of the small diameter portion 33a of the holding hole 33 and the large diameter portion 33b. Further, the pipe member 23 has a function of preventing the probe 2 from coming off the probe holder 3 by abutting against the boundary wall surface between the small diameter portion 34a and the large diameter portion 34b of the holding hole 34. In addition, the length of the pipe member 23 in the longitudinal direction is such that the first plunger 21 and the second plunger 22 protrude from the probe holder 3, respectively, even in a state in which the large diameter portion 33b and the large diameter portion 34b are in communication with each other. A small length in the axial direction can also be applied.

Figure 3 is a semiconductor assembly using the probe holder 3 A diagram of the state of the circuit 100 at the time of inspection. When the semiconductor integrated circuit 100 is inspected, the spring member inside the tube member 23 is compressed in the longitudinal direction due to the contact load from the semiconductor integrated circuit 100. The first plunger 21 enters the tubular member 23 in association with the compression of the spring member. The inspection signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 at the time of inspection is the connection electrode 101 which reaches the semiconductor integrated circuit 100 from the electrode 201 of the circuit board 200 via the probe 2, respectively. Specifically, the probe 2 reaches the connection electrode 101 of the semiconductor integrated circuit 100 via the second plunger 22 , the spring member inside the tube member 23 , and the first plunger 21 .

Further, since the tip end of the first plunger 21 is formed in a tapered shape, even when an oxide film is formed on the surface of the connection electrode 101, the oxide film can be pierced and the tip end can be directly brought into contact with the connection electrode 101. Further, the tips of the first plunger 21 and the second plunger 22 are appropriately changed depending on the shape of the object to be contacted.

Fig. 4 is a perspective view showing the structure of a main part of the socket mounting structure of the embodiment. Fig. 5 is a perspective view showing the structure of the holding member 4 of the socket mounting structure of the embodiment. The holding member 4 is formed by using a metal such as iron, brass, or stainless steel (SUS), or a main body portion 40 formed by performing an insulating process such as a synthetic resin, a ceramic, or the like. Further, an insertion hole 411 into which the probe holder 3 is fitted is provided in the main body portion 40. Further, the main body portion 40 has notch portions 41a and 41b which are respectively provided on the opposite outer edge sides of the upper surface side, and a slit is formed along the outer edge for guiding the mounting position of the leaf spring 5. Formed in the notch portions 41a, 41b: Inserting holes 412a to 412d through which the shafts 201a to 201d (supporting members, see FIGS. 1 and 4) protruding from the circuit board 200 are respectively inserted; and screws respectively for attaching the leaf spring 5 to the main body portion 40 401a, 401b screw holes 413a, 413b.

The shafts 201a to 201d extend substantially cylindrically from the main surface of the circuit board 200 in the vertical direction. The shafts 201a to 201d have small diameter portions 211a to 211d provided on the front end side and having a smaller diameter than the other portions.

Fig. 6 is a perspective view showing the structure of the leaf spring 5 of the socket mounting structure of the embodiment. Fig. 7 is a plan view showing the configuration of a main portion of the leaf spring 5 shown in Fig. 6. The leaf spring 5 is formed of a metal material having a spring characteristic, for example, stainless steel such as SUS301, and has a base portion 50 formed in a substantially strip shape, and both ends in the longitudinal direction of the base portion 50 are oriented on a plane through which the board surface passes. The arm portions 51a and 51b extending in a strip shape in a direction substantially perpendicular to the longitudinal direction of the base portion 50 are formed in a substantially C-shape when viewed in a direction perpendicular to the plate surface of the base portion 50.

The arm portion 51a has a first extending portion 511a extending from one end portion of the base portion 50, and a second extending portion 512a extending in an arc shape from a front end of the first extending portion 511a. The arm portion 51a is positioned on a plane on which the first extending portion 511a passes through the plate surface of the base portion 50, and is formed in a shape in which the second extending portion 512a is curved in a direction away from the plane.

The arm portion 51b has a first extending portion 511b extending from the other end portion of the base portion 50, and a second extending portion 512b extending in an arc shape from the first extending portion 511b. The arm portion 51b is located on a plane on which the first extension portion 511b passes through the plate surface of the base portion 50, and the second extension portion 512b is formed away from The shape in which the direction of the plane is curved.

Further, the arm portions 51a and 51b are formed with through holes 52a to 52d (first through holes) penetrating in the thickness direction of the insertion holes 412a to 412d, respectively, and are formed with the screw holes 413a and 413b, respectively. Through holes 53a and 53b (second through holes) penetrating in the thickness direction. Here, the through holes 52a and 52b are provided in the second extending portions 512a and 512b, and the through holes 52c and 52d are the first extending portions 511a and 511b provided in the arm portions 51a and 51b. Further, the through holes 53a are provided between the through holes 52a and the through holes 52c, respectively. The through hole 53b is provided between the through hole 52b and the through hole 52d.

The through hole 52a has a first hole portion 521 having a diameter larger than the maximum diameter of the shaft 201a (the largest diameter in the insertion portion), and one side from the end of the first hole portion 521 toward the front end side (the first extension) The portion 511a side) extends and has a second hole portion 522 having a smaller width than the opening diameter of the first hole portion 521. The second hole portion 522 has a claw portion 525 (fixed portion) which is a slit 523 extending from a side portion of the second hole portion 522 and extends from a front end of the second hole portion 522 toward a longitudinal direction. The slit 524 is formed, and a part of the side wall of the second hole portion 522 is formed to lock the small diameter portion 211a of the shaft 201a. The second hole portion 522 is substantially equal in diameter to the small diameter portion 211a and extends in a uniform width. The slit 523 is formed in an L shape that is bent in the width direction of the second hole portion 522 and then bent in the longitudinal direction of the arm portion 51a.

An end portion and a claw portion 525 (projecting portion 525a) on the side different from the side of the second hole portion 522 that is coupled to the first hole portion 521 are formed in the through hole 52a, and the small diameter portion 211a is inserted and held. Holding portion 522a. A circle that is in contact with the outer edge of the holding portion 522a is substantially equal to a circle formed on the outer circumference of the small diameter portion 211a. In other words, the small diameter portion 211a is locked to the protruding portion 525a in a state of being inserted into the holding portion 522a, and is fixed to the through hole 52a.

The claw portion 525 is a gap that can be moved by the slits 523, 524 on a plane parallel to the main surface. Further, a protruding portion 525a that protrudes toward the second hole portion 522 side (width direction) is provided at the front end portion of the claw portion 525. In a state where no load is applied to the claw portion 525, the width W1 (minimum width) formed by the front end of the protruding portion 525a and the wall surface of the second hole portion 522 facing the protruding portion 525a is smaller than the width W2 of the second hole portion 522. . Further, in the present embodiment, the through hole 52b also has the same structure.

The through hole 52c has a first hole portion 526 having a diameter larger than the maximum diameter of the shaft 201a (the largest diameter in the insertion portion); and a width extending from one end of the first hole portion 526 toward the front end side, and the width The second hole portion 527 is smaller than the diameter of the first hole portion 526. The diameter of the second hole portion 527 is substantially equal to the diameter of the small diameter portion 211c, and extends in a uniform width. Moreover, the through hole 52d also has the same configuration.

The through holes 53a and 53b extend in a direction parallel to the direction in which the second hole portion 522 extends. The length of the through holes 53a and 53b extending in the above direction is equal to or longer than the length of one end of the through holes 52a to 52d from the longitudinal direction of the arm portions 51a and 51b to the other end.

The first extension portion 511a is provided with a curved portion 511c which is formed by bending an edge end portion on the opposite side to the side opposite to the second extension portion 512b. The curved portion 511c is oriented toward the first extending portion 511a 2 The side of the curved portion of the extending portion 512a is bent in such a manner that the same side is bent. The same curved portion 511d is also provided in the first extension portion 511b.

The curved portion 511c is an end portion on the side of the second extending portion 512a between the through hole 52c and the through hole 53a and separated from the respective through holes by a predetermined distance. The curved portion 511d is an end portion on the side of the second extending portion 512b on the side between the through hole 52d and the through hole 53b and separated from the respective through holes by a predetermined distance.

Here, the diameters of the insertion holes 412a to 412d and the first hole portion 521 are larger than the maximum diameter of the shafts 201a to 201d. Further, the width of the second hole portion 522 is larger than the diameters of the small diameter portions 211a to 211d and smaller than the maximum diameter of the shafts 201a to 201d. The shafts 201a to 201d are detachably attached to the circuit board 200 by being screwed into the insertion holes 412a to 412d.

Further, the leaf spring 5 is attached to the holding member 4 by disposing the arm portions 51a and 51b on the upper surfaces of the notch portions 41a and 41b. In order to prevent detachment from the holding member 4, the leaf spring 5 is fixed by screws 401a, 401b inserted through the through holes 53a, 53b. The screws 401a and 401b are screwed to the screw holes 413a and 413b in a state in which they are inserted into the through holes 53a and 53b, respectively, and are attached to the circuit board 200 (see FIG. 4).

Next, the step of mounting the holding member 4 on the circuit substrate 200 will be described with reference to Figs. 8 to 13 . Figs. 8, 10, and 12 are perspective views showing a structure of a main part of the socket of the embodiment, and are views showing a step of attaching the holding member 4 to the circuit board 200. Fig. 9, Fig. 11, and Fig. 13 are partial cross-sectional views showing the configuration of a main portion of the socket of the embodiment, and showing the holding member 4 A diagram of a step of mounting on the circuit board 200.

First, in a state in which the arm portions 51a and 51b of the leaf spring 5 are located in the notch portions 41a and 41b, and the insertion holes 412a and 412b of the holding member 4 communicate with the first hole portions 521 of the through holes 52a and 52b, respectively. The holding member 4 is mounted on the circuit substrate 200. At this time, the shafts 201a to 201d are respectively inserted into the insertion holes 412a to 412d and the through holes 52a and 52b (refer to Fig. 8). At this time, for example, the small diameter portion 211a of the shaft 201a is located in the first hole portion 521 of the through hole 52a (see Fig. 9). The leaf spring 5 is formed in a state in which the second extending portions 512a and 512b are in contact with the notch portions 41a and 41b, and are separated from the upper surface of the main body portion 40 in addition to the second extending portions 512a and 512b.

Next, after the second extending portions 512a and 512b are slid along the notch portions 41a and 41b, a load close to the main body portion 40 is applied to the base portion 50 of the leaf spring 5, and the first extending portions 511a and 511b and the main body portion are moved. 40 close or contact (refer to Figure 10). Here, in the state of Fig. 8, the arm portions 51a and 51b are inserted into the through holes 52a and 52b, so that the distal end portions of the second extending portions 512a and 512b are fixed. When the base portion 50 is brought close to the main body portion 40 in this state, for example, when the first extending portion 511a of the arm portion 51a approaches the holding member 4, it is intended to return to the load of the curved shape in the initial state of the arm portion 51b. The second extension portion 512b (curved portion) is in a state of being pressed against the holding member 4. Thereby, the leaf spring 5 is in a state in which the holding member 4 is pressed toward the circuit board 200 side.

When the base portion 50 is brought close to the main body portion 40, the shafts 201c and 201d are respectively inserted into the through holes 52c and 52d. At this time, for example, the shaft 201c The small diameter portion 211c is located in the first hole portion 526 of the through hole 52c.

Further, by the sliding of the arm portions 51a and 51b, for example, the reduced diameter portion 211a located in the first hole portion 521 moves to the second hole portion 522. At this time, after the small-diameter portion 211a comes into contact with the protruding portion 525a of the claw portion 525, the claw portion 525 is moved toward the slit 523 side, and the width of the second hole portion 522 is widened (see FIG. 11). Further, in the through hole 52c, the small diameter portion 211c also moves to the second hole portion 527.

When the arm portions 51a and 51b are further slid, the shafts 201a to 201d abut against the end portions (end portions on the second hole portion side) of the through holes 52a to 54d (see Fig. 12). At this time, as shown in Fig. 13, the small diameter portion 211a is housed in the holding portion 522a. Thereby, the small diameter portion 211a can be prevented from moving toward the first hole portion 521 side and the leaf spring 5 can be fixed. In this state, the leaf spring 5 presses and fixes the holding member 4 to the circuit board 200 side, and thus the holding member 4 is fixed to the circuit board 200.

With the configuration and operation as described above, the leaf spring 5 can be fixed to the circuit substrate 200 by applying a load to the leaf spring 5 and sliding it relative to the holding member 4 placed on the circuit substrate 200, and The holding member 4 is mounted on the circuit substrate 200. Further, the leaf spring 5 fixed to the holding member 4 by the shafts 201a to 201d is pressed by the holding member 4 by the load generated by the bending of the arm portions 51a and 51b, so that the leaf holder 5 can be held. The member 4 is in close contact with the circuit substrate 200.

Further, when the holding member 4 is detached from the circuit board 200, the leaf spring 5 can be detached from the circuit board 20 by sliding it in a direction opposite to the sliding direction at the time of mounting.

Further, the curved portion 511c is bent on the same side as the side in which the first extending portion 511a is curved toward the second extending portion 512a, that is, when the holding member 4 is attached to the circuit board 200. The spring 5 is bent in the opposite direction to which the load direction is applied, so that the strength of the arm portion 51a with respect to the load can be increased. Thereby, the durability when the leaf spring 5 is repeatedly used can be improved.

Further, since the end portion of the curved portion 511c on the second extending portion 512a side is provided between the through hole 52c and the through hole 53a and is separated from the respective through holes by a predetermined distance, the end portion is disposed at the end portion. The strength of the arm portion 51a can be increased in comparison with the case of the through hole 52c or the vicinity of the through hole 53a. Thereby, the durability when the leaf spring 5 is repeatedly used can be improved.

Further, the same effect as the above-described curved portion 511c can be obtained also in the curved portion 511d.

According to the above embodiment, the holding member 4 is attached to the circuit board 200 by applying a load to the leaf spring 5 attached to the holding member 4 and sliding it, thereby locking the holding member 4 to the circuit board 200. It is simply attached and detached with respect to the circuit board 200.

Moreover, according to the above-described embodiment, since the curved portions 511c and 511d are bent in the direction away from the holding member 4 when they are attached to the holding member 4, they can be attached regardless of the size of the holding member 4. Further, by providing the curved portions 511c and 511d, the workability when the user grips the leaf springs 5 (the arm portions 51a and 51b) can be improved as compared with the case where the curved portions 511c and 511d are not provided.

Moreover, as in the past, the holding member and the circuit are fixed by screwing When the substrate is fixed, the torque of the screw must be considered. On the other hand, the socket mounting structure of the present embodiment does not require a screw for fixing the holding member 4 and the circuit board 200, and therefore can be fixed without considering torque.

Further, in the above-described embodiment, since the shafts 201a to 201d can be attached to the conventional screw holes for screw mounting, it is also possible to realize that the substrate is not provided with a dedicated hole.

Further, in the above-described embodiment, the small diameter portions 211a to 211d are provided in the shafts 201a to 201d. However, the shape in which the distal end of the shaft is larger than the width of the second hole portion 522 and the diameter is increased may be employed. .

Further, in the above-described embodiment, the claw portions 525 are provided in the through holes 52a and 52b. However, the claw portions may be provided in the through holes 52c and 52d, or all or any of the through holes 52a to 52d may be provided in the through holes. Claws.

Further, in the above-described embodiment, the fixing portion is formed by the slits 523 and 524 and has the claw portion 525 of the protruding portion 525a. However, as long as the small diameter portion 211a can be held and fixed by the movement of the leaf spring 5, The claw portion (corresponding to the protruding portion 525a) that protrudes from the side wall of the second hole portion 522 may be used.

Further, in the above-described embodiment, the leaf spring 5 is attached to the holding member 4 by the screws 401a and 401b. However, the leaf spring may be attached not to the prior art, and the leaf spring may be placed after the holding member 4 is placed on the circuit board 200. 5 is mounted to the holding member 4, and then by screws 401a, 401b Screw the screw.

In the above-described embodiment, the connection electrode 101 is formed in a hemispherical shape. However, a guide pin formed in a flat shape such as a QFP (Quad Flat Package) may be used.

Further, the probe 2 is not limited to the one composed of the plunger and the tube member as shown in Fig. 2, and may be a probe having no tube member (a probe composed of a plunger and a coil spring) or A wire probe that is deflected into a bow shape to obtain a load.

Further, in the above embodiment, the probe holder and the holding member are formed separately. However, the probe holder may be integrally formed or the probe holder may have the above-described holding member.

[Industrial availability]

As described above, the socket mounting structure and the spring member of the present invention are quite useful in that the socket is simply attached and detached with respect to the circuit board.

5‧‧‧ leaf spring

50‧‧‧ base

51a, 51b‧‧‧arms

52a to 52d, 53a, 53b‧‧‧through holes

511a, 511b‧‧‧1st extension

511c, 511d‧‧‧bend

512a, 512b‧‧‧2nd extension

526‧‧‧1st hole

527‧‧‧2nd hole

Claims (7)

A socket mounting structure is a socket mounting structure for mounting a socket on a substrate, the socket having: a plurality of contact probes respectively contacting the substrate and the contact body at both ends in the longitudinal direction; receiving and holding according to a predetermined pattern a probe holder for the plurality of contact probes; and a holding member provided around the probe holder; the socket mounting structure includes: extending from the main surface of the substrate, and respectively inserted in the holding a plurality of support members of the insertion hole of the member; and a plate-shaped spring member attached to the plurality of support members in a state in which the holding member placed on the substrate is biased toward the substrate side, the spring member a first through hole is formed in the plate thickness direction, and the support member is inserted through the support member, and has a fixing portion that forms a side wall of at least one of the plurality of first through holes A portion to hold and fix the aforementioned support member. The socket mounting structure according to Item 1, wherein the spring member has a base portion formed in a substantially strip shape, and both ends of the base portion in the longitudinal direction thereof face each other on a plane through which the board surface passes. The arm portion of the base portion extends in a direction substantially perpendicular to the longitudinal direction, and the central portion is curved into two arc-shaped arms; and is formed when viewed in a direction perpendicular to a plate surface of the base portion. The first through hole is provided in the arm portion in a substantially C shape. The socket mounting structure according to the second aspect of the invention, wherein the support member is formed in a columnar shape, and has a small diameter portion provided on the distal end side and having a smaller diameter than the other portion, wherein the first through hole has a diameter larger than that a first hole portion having a maximum diameter of the support member; and a uniform width extending from an end portion of the first hole portion to a side different from a front end side of the arm portion, and the width and a diameter of the small diameter portion The second hole portion is substantially equal; the fixing portion is formed by a slit extending from a side wall of the second hole portion, and is a claw portion for locking the support member. The socket mounting structure according to the second or third aspect of the invention, wherein the two arm portions are respectively formed by bending an edge end portion on a side opposite to the side opposite to each other. The bend. The socket mounting structure according to the second aspect of the invention, wherein the holding member is provided with a screw hole through which a screw can be screwed, and the arm portion is provided with a thread penetrating in a thickness direction corresponding to the screw hole. In the 2 through hole, the holding member and the spring member are coupled by a screw that is inserted into the second through hole and screwed into the screw hole. The socket mounting structure according to claim 1, wherein the holding member has two notch portions, and the notch portions are respectively disposed at The opposite outer edge side of the upper surface side, and a slit is formed along the outer edge, and guides the mounting position of the spring member on the aforementioned holding member. A spring member is a plate-shaped spring member used for mounting a socket on a substrate, the socket having: a plurality of contact probes respectively contacting the substrate and the contacted body at both ends in the longitudinal direction; a pattern holder for accommodating and holding the plurality of contact probes; and a holding member disposed around the probe holder; the spring member is characterized in that a plurality of first through holes are formed, which are formed toward the plate thickness The direction penetrates and extends from the main surface of the substrate in a state in which the holding member placed on the substrate is loaded toward the substrate side, and is respectively inserted into the insertion hole provided in the holding member. The plurality of support members are inserted and have a fixing portion that forms a part of a side wall of at least one of the plurality of first through holes to hold and fix the support member.