TW201535449A - Switching element, switching circuit and alert circuit - Google Patents

Abstract

The invention may accomplish miniaturization without working together with physically mechanical element. The invention includes: an insulation substrate (10); a first electrode (11) and a second electrode (12) formed closely on the insulation substrate (10); a first fusible conductor (13) loaded on the first electrode (11); a high melting point metal element (15) formed on the insulation substrate (10) with the melting point higher than the first fusible conductor (13), and making the first fusible conductor (13) fuse by using the heating produced by the high melting point metal element (15) which flows over current, connecting the first electrode (11) and the second electrode (12) by the fusion conductor, and the first electrode (11) and the second electrode (12) is electrical short.

Description

Switching element, switching circuit, and alarm circuit

The present invention relates to a switch element and a switch circuit, and more particularly to a switch element and a switch circuit that can be miniaturized and easily incorporated into an element that operates by surface mounting.

As a switching element for operating an alarm, an alarm fuse is generally used. As an example of the warning fuse, as shown in FIGS. 16(A) and 16(B), the fuse holder 100 is provided with an alarm circuit 105 for operating the alarm, and is normally phased. a pair of alarm contacts 101, an alarm contact 102 disposed off-earth, a spring 103 that contacts the alarm contact 101 with the alarm contact 102, and a spring 103 that is held away from the alarm contact 102 The fuse 104 is placed at a location where pressure is applied.

The alarm contact 101 and the alarm contact 102 are contacts that operate the alarm circuit 105 by contact, and are formed of an elastic conductive material such as a leaf spring, and are disposed close to each other. The alarm circuit 105 operates, for example, a buzzer or a lamp, and operates an alarm system or the like by driving a thyristor or a relay circuit.

The spring 103 is maintained in a state of being energized to a position away from the alarm contact 102 by the fuse wire 104. Further, the spring 103 recovers elasticity by the fuse of the fuse wire 104, and presses the alarm contact 102 to come into contact with the alarm contact 101.

The fuse wire 104 is held in a state in which the spring 103 is elastically displaced, and if it is energized according to the detection of various sensors, it is blown by self-heating, and the spring 103 is opened.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-76610

In the conventional alarm fuse, a configuration is adopted in which the spring 103 is elastically displaced by the fuse wire 104, and the stress of the spring 103 is loosened by fusing the fuse 104, thereby physically squeezing The alarm contact 102 is pressed, thereby short-circuiting the alarm contact 101 and the alarm contact 102. In such an alarm fuse, since the alarm circuit is operated by the physical interlocking of the mechanical elements, the configuration of the alarm fuse is ensured by the alarm contact 101, the alarm contact 102, or the movable range of the spring 103. It becomes large and is difficult to use in a narrow circuit, and the manufacturing cost is also high.

Further, in order to short-circuit the alarm contact 101 and the alarm contact 102, the fuse 104 must be blown. Therefore, the alarm circuit cannot be operated unless the current exceeding the rated value is continuously supplied and the fuse 104 is blown.

Accordingly, it is an object of the present invention to provide a switching element, a switching circuit, and an alarm circuit using the same, which can realize miniaturization without using physical mechanical elements, and which can quickly operate a circuit.

In order to solve the above problems, the switching element of the present invention includes: an insulating substrate; the first electrode and the second electrode are formed on the insulating substrate in close proximity; and the first soluble conductor is mounted on the first electrode; a high-melting-point metal body formed on the insulating substrate and having a melting point higher than the first meltable conductor; and melting the first meltable conductor by heat generated by energization of the high-melting-point metal body The first electrode and the second electrode are connected via a molten conductor of the first soluble conductor, and the first electrode and the second electrode are electrically short-circuited.

Further, the switch circuit of the present invention includes a switch unit having a first electrode and a second electrode, wherein the first electrode and the second electrode are open to each other and connected to an external circuit, and at least one of the soluble conductors is mounted thereon. The external circuit is operated by short-circuiting the first electrode and the second electrode; and the fuse has a melting point higher than a melting point of the soluble conductor, and is electrically connected to be independent of the switch portion a functional circuit that melts the fusible conductor by heat generated by energization of the fuse with the functional circuit, and short-circuits the first electrode and the second electrode by using a molten conductor of the fusible conductor Thereby the external circuit is operated.

Further, the alarm circuit of the present invention includes an operation circuit, and has a first electrode and a second electrode that are open to each other and have a soluble conductor mounted on at least one of them, and are opened by a switch portion that short-circuits the first electrode and the second electrode. Alarm operation; and control a circuit having a fuse and a functional circuit, the control circuit being electrically independent of the operating circuit, the fuse being higher than the fusible conductor, the functional circuit being connected in series with the fuse to a power source; The fuse is blown with an overcurrent flowing when the functional circuit is abnormal, the meltable conductor is melted by heat generated during the fuse, and the first electrode and the first electrode are made by the molten conductor of the soluble conductor. The 2 electrodes are shorted so that the alarm operates.

According to the present invention, since the mechanical element such as a spring or an alarm contact can be used without physical connection of the mechanical element, the structure can be compactly designed and mounted in the surface of the insulating substrate. In a narrow installation area. Further, according to the present invention, since the switch is turned on by the heat of the high melting point metal body, an abnormal overcurrent can be detected and the circuit can be operated without blocking the fuse. Further, according to the present invention, the insulating substrate can be surface-mounted by reflow mounting or the like, and can be easily attached to a narrow mounting region.

1, 40, 50‧‧‧ switch components

2‧‧‧Switch

10‧‧‧Insert substrate

10a‧‧‧ surface

10b~10e‧‧‧ side edge

10f‧‧‧back

11‧‧‧1st electrode

11a, 12a‧‧‧ external connection terminals

11b, 12b‧‧‧ front end

12‧‧‧2nd electrode

13‧‧‧1st fusible conductor

14‧‧‧2nd fusible conductor

15‧‧‧High melting point metal body

15a‧‧‧External connection terminal

15b‧‧‧Fever Department

16‧‧‧Insulation

Openings 16a, 42a, 52a, 62, 63, 64‧‧

17‧‧‧Connected solder

18‧‧‧ Flux

19‧‧‧Connecting Department

20‧‧‧ Cover member

21‧‧‧ side wall

22‧‧‧ top face

23‧‧‧ Cover electrode

30‧‧‧Alarm circuit

31‧‧‧Alarm

32‧‧‧Functional circuit

33‧‧‧Running circuit

34‧‧‧Control circuit

41, 51‧‧‧1st insulation layer

42. 52‧‧‧2nd insulation layer

60‧‧‧High melting point metal layer

61‧‧‧Low-melting metal layer

100‧‧‧Fuse holder

101, 102‧‧‧ alarm contacts

103‧‧‧ Spring

104‧‧‧Fuse wire

105‧‧‧Alarm circuit

1(A), 1(B), and 1(C) are views showing a state before operation of a switching element to which the present invention is applied, and Fig. 1(A) is a plan view, and Fig. 1(B) is A- A' sectional view, Fig. 1 (C) is a circuit diagram.

2(A), 2(B), and 2(C) are diagrams showing a state before the operation of the switching element in which the second meltable conductor is mounted on the second electrode, and FIG. 2(A) is a plan view. 2(B) is a cross-sectional view of A-A', and FIG. 2(C) is a circuit diagram.

3(A), 3(B), and 3(C) are diagrams showing a state in which the high-melting-point metal body of the switching element generates heat and the first electrode and the second electrode are short-circuited via the molten conductor of the soluble conductor. 3(A) is a plan view, FIG. 3(B) is a cross-sectional view taken along line A-A', and FIG. 3(C) is a circuit diagram.

4(A), 4(B), and 4(C) are diagrams showing a state in which the high-melting-point metal body of the switching element is blown, and FIG. 4(A) is a plan view and FIG. 4(B) is A-A'. The cross-sectional view and FIG. 4(C) are circuit diagrams.

Fig. 5 is a circuit diagram showing an alarm circuit.

6(A), 6(B), and 6(C) are diagrams showing a switching element in which a high-melting-point metal body is connected to a first electrode, and FIG. 6(A) is a plan view and FIG. 6(B) is A. -A' sectional view, Fig. 6 (C) is a circuit diagram.

Fig. 7 is a cross-sectional view showing a switching element in which a cover electrode is formed in a cover member.

8(A) and 8(B) are diagrams showing switching elements in which a high melting point metal body and a first electrode, a second electrode, a first meltable conductor, and a second meltable conductor are superposed on the surface of an insulating substrate. 8(A) is a plan view, and FIG. 8(B) is a cross-sectional view taken along line A-A'.

9(A) and 9(B) show a first electrode, a second electrode, and a first fusible conductor, and a second can be formed on the back surface of the insulating substrate to form a high melting point metal body and formed on the surface of the insulating substrate. FIG. 9(A) is a plan view, and FIG. 9(B) is a cross-sectional view taken along line A-A'.

10(A) and 10(B) are perspective views showing a fusible conductor having a high melting point metal layer and a low melting point metal layer and including a covering structure, and FIG. 10(A) shows The structure in which the high-melting-point metal layer is an inner layer and is covered with a low-melting-point metal layer, and FIG. 10(B) shows a structure in which a low-melting-point metal layer is used as an inner layer and is covered with a high-melting-point metal layer.

11(A) and 11(B) are perspective views showing a fusible conductor including a laminated structure of a high melting point metal layer and a low melting point metal layer, and Fig. 11(A) shows a top two-layer structure, and Fig. 11(B) shows 3-layer structure of inner layer and outer layer.

Figure 12 is a cross-sectional view showing a fusible conductor of a multilayer structure including a high melting point metal layer and a low melting point metal layer.

13(A) and 13(B) are plan views showing a meltable conductor in which a linear opening is formed on the surface of the high-melting-point metal layer and the low-melting-point metal layer is exposed, and FIG. 13(A) is formed along the longitudinal direction. There is an opening, and an opening is formed in the width direction in FIG. 13(B).

FIG. 14 is a plan view showing a fusible conductor in which a circular opening is formed on the surface of the high-melting-point metal layer and the low-melting-point metal layer is exposed.

15 is a plan view showing a fusible conductor in which a circular opening portion is formed in a high-melting-point metal layer and a low-melting-point metal is filled inside.

16(A) and 16(B) are views showing a conventional alarm element, Fig. 16(A) is a cross-sectional view before operation, and Fig. 16(B) is a cross-sectional view after operation.

Hereinafter, the switching element, the switching circuit, and the alarm circuit to which the present invention is applied will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below, and various modifications can be made without departing from the spirit and scope of the invention. Moreover, the drawings are schematic, the ratios of the dimensions, etc. are sometimes present. The situation is different. The specific dimensions and the like should be judged by referring to the following description. Further, of course, the drawings also include portions having different dimensional relationships or ratios from each other.

[switching element]

As shown in FIG. 1(A), FIG. 1(B), and FIG. 1(C), the switching element 1 to which the present invention is applied includes an insulating substrate 10 and a first electrode 11 which is formed close to the insulating substrate 10. The second electrode 12; the first meltable conductor 13 mounted on the first electrode 11; and the high melting point metal body 15 formed on the insulating substrate 10 and having a higher melting point than the first soluble conductor 13. 1(A) is a plan view showing a portion of the switching element 1 excluding the cover member 20. FIG. 1(B) is a cross-sectional view taken along line A-A', and FIG. 1(C) is a circuit diagram.

In the switching element 1, the first electrode 11 and the second electrode 12 are connected to an alarm device 31 including a buzzer or a lamp or an alarm system, and the first soluble conductor 13 is melted by heat generation of the high melting point metal body 15. Thereby, the first electrode 11 and the second electrode 12 are short-circuited by the molten conductor, and a buzzer or a lamp or an alarm system or the like as the alarm 31 is operated.

The insulating substrate 10 is formed into a substantially square shape using, for example, an insulating member such as alumina, glass ceramic, mullite or zirconia. Other materials for a printed wiring board such as a glass epoxy substrate or a phenol substrate may be used for the insulating substrate 10, but it is necessary to pay attention to the temperature at which the first soluble conductor 13 is blown.

[First electrode, second electrode]

The first electrode 11 and the second electrode 12 are disposed close to each other on the surface 10a of the insulating substrate 10, and are opened by separation. Further, the first electrode 11 is mounted on the first electrode 11 The first fusible conductor 13 to be described later. The first electrode 11 and the second electrode 12 constitute a switch 2, and the switch 2 generates heat by energization of the high-melting-point metal body 15, and the molten conductor of the first soluble conductor 13 crosses the first electrode 11 and the second electrode. The electrodes 12 are agglomerated and bonded, and are short-circuited via the molten conductor.

Further, as shown in FIG. 2(A), FIG. 2(B), and FIG. 2(C), in the switching element 1, the second meltable conductor 14 may be mounted on the second electrode 12. In the switching element 1, by providing the first fusible conductor 13 and the second fusible conductor 14, more molten conductors can be condensed across the first electrode 11 and the second electrode 12, and more quickly and reliably. The first electrode 11 and the second electrode 12 are short-circuited. Hereinafter, as shown in FIG. 2(A), FIG. 2(B), and FIG. 2(C), the first meltable conductor 13 is provided on the first electrode 11, and the second electrode 12 is provided on the second electrode 12. The configuration of the switching element 1 of the fusible conductor 14 will be described as an example.

When the first electrode 11 and the second electrode 12 are heated by the high melting point metal body 15, the molten conductors of the first soluble conductor 13 and the second meltable conductor 14 can be easily aggregated.

The first electrode 11 and the external connection terminal 11a of the second electrode 12 and the external connection terminal 12a are provided on the side edge 10b and the side edge 10c of the insulating substrate 10, respectively. The first electrode 11 and the second electrode 12 are connected to the alarm device 31 via the external connection terminal 11a and the external connection terminal 12a, and the power supply path to the alarm device 31 is realized by the operation of the switching element 1.

The first electrode 11 and the second electrode 12 can be formed using a common electrode material such as copper (Cu) or silver (Ag). Further, it is preferable that the first electrode 11 and the second electrode On the surface of the electrode 12, nickel plating/gold plating (Ni/Au plating), nickel plating/palladium plating (Ni/Pd plating), nickel plating/palladium plating/gold plating (Ni/Pd plating) are applied by a known method such as plating treatment. /Au) is the film. Thereby, the switching element 1 can prevent oxidation of the first electrode 11 and the second electrode 12, and can reliably hold the molten conductors of the first soluble conductor 13 and the second meltable conductor 14. Further, when the switching element 1 is reflow-bonded, the connection solder 17 for connecting the first soluble conductor 13 and the second meltable conductor 14 is melted, or the first fusible conductor 13 and the second fusible element are formed. The low melting point metal of the outer layer of the conductor 14 is melted, and the first electrode 11 and the second electrode 12 can be prevented from being eroded (solder erosion).

[High melting point metal body]

The high-melting-point metal body 15 is a member that generates heat when it is energized and has conductivity, and includes, for example, W, Mo, Ru, Cu, Ag, or an alloy containing the same as a main component. The high-melting-point metal body 15 can be formed by mixing the alloy or the composition, the powder of the compound, a resin binder, or the like to form a paste-like substance, and using the screen ( Screen) The paste material is patterned and calcined.

The high melting point metal body 15 is disposed on the front surface 10a of the insulating substrate 10 in parallel with the first electrode 11 and the second electrode 12. When the high-melting-point metal body 15 generates heat by energization, the first meltable conductor 13 and the second meltable conductor 14 mounted on the first electrode 11 and the second electrode 12 can be melted.

Further, the external connection terminal 15a of the high melting point metal body 15 is provided on the side edge 10b and the side edge 10c of the insulating substrate 10. The high melting point metal body 15 is connected to the function circuit 32 of a trigger that operates as the alarm device 31 via the external connection terminal 15a. It is connected and generates heat by an overcurrent generated accompanying an abnormality of the functional circuit 32.

Further, at a position close to the first fusible conductor 11 and the second meltable conductor 12 of the high-melting-point metal body 15, a heat generating portion 15b which is relatively thin and locally generates heat at a high temperature due to current concentration is formed. The heat generating portion 15b is provided at a position close to the first meltable conductor 11 and the second meltable conductor 12, whereby the high melting point metal body 15 can efficiently melt the first meltable conductor 13 and the second meltable conductor 14. Therefore, the first electrode 11 and the second electrode 12 can be quickly short-circuited.

As shown in FIG. 2(A), FIG. 2(B), and FIG. 2(C), when the functional circuit 32 is normally operated, a suitable current within the rated value flows in the high-melting-point metal body 15. Further, when an overcurrent flows due to an abnormality of the functional circuit 32, the high-melting-point metal body 15 generates heat, and as shown in FIG. 3(A), FIG. 3(B), and FIG. 3(C), the first fusible is made. The conductor 13 and the second meltable conductor 14 are melted, and the first electrode 11 and the second electrode 12 are short-circuited via the molten conductor. Thereafter, the high-melting-point metal body 15 also continues to generate heat, whereby, as shown in FIG. 4(A), FIG. 4(B), and FIG. 4(C), it is blown by its own Joule heat. Thereby, the high melting point metal body 15 blocks an overcurrent generated by the abnormality of the functional circuit 32, and stops the heat generation. In other words, the high-melting-point metal body 15 melts the first meltable conductor 13 and the second meltable conductor 14, and functions as a fuse that blocks its own power supply path by self-heating.

Further, the high-melting-point metal body 15 is provided with the heat generating portion 15b which is locally high in temperature, whereby the heat generating portion 15b is blown. In this case, in the high-melting-point metal body 15, since the heat generating portion 15b is formed relatively thin, the arc discharge generated at the time of the fuse can be restricted to a small scale, and the insulating layer 16 to be described later can be coated. And can prevent the molten conductor from scattering.

Further, the high melting point metal body 15 is patterned by printing the conductive paste, and a high melting point metal foil such as a copper foil or a silver foil or a high melting point metal wire such as a copper wire or a silver wire may be used. And formed. Further, when the high melting point metal body 15 is used to form the high melting point metal body 15, the leakage of the molten conductor after the high melting point metal body 15 is blown is less than that of the conductive pattern, and therefore, it is suitable as the insulating substrate 10. A ceramic substrate which is excellent in thermal conductivity and which can rapidly melt the first soluble conductor 13 and the second meltable conductor 14 is used.

[Insulation]

The first electrode 11, the second electrode 12, and the high melting point metal body 15 are covered with the insulating layer 16 on the surface 10a of the insulating substrate 10. The insulating layer 16 is provided to protect the first electrode 11, the second electrode 12, and the high melting point metal body 15 from being insulated, and to suppress arc discharge when the high melting point metal body 15 is blown, and the insulating layer 16 includes, for example, glass. Floor.

As shown in FIG. 1(A), FIG. 1(B), FIG. 1(C), FIG. 2(A), FIG. 2(B), and FIG. 2(C), the insulating layer 16 covers the heat of the high-melting-point metal body 15. The portion 15b is formed in a region other than the front end portion 11b of the first electrode 11 and the second electrode 12 and the tip end portion 12b. In other words, the tip end portion 11b and the tip end portion 12b of the first electrode 11 and the second electrode 12 are exposed from the insulating layer 16, and the first fusible conductor 13 and the second meltable conductor 14 which will be described later can be aggregated and bonded.

Further, in the first electrode 11 and the second electrode 12, an opening 16a is formed in a part of the insulating layer 16. Further, in the first electrode 11 and the second electrode 12, The distal end portion 11b, the distal end portion 12b, and the opening portion 16a are provided with solder 17 for connection, and the first solderable conductor 13 is formed between the distal end portion 11b and the distal end portion 12b and the opening portion 16a by the solder 17 for connection. The second fusible conductor 14 is supported on the insulating layer 16.

Further, an insulating layer 16 containing glass or the like may be formed between the high melting point metal body 15 and the insulating substrate 10. Thereby, the insulation resistance after the high melting point metal body 15 is blocked can be improved.

[1st fusible conductor, 2nd fusible conductor]

The first soluble conductor 13 and the second meltable conductor 14 that are mounted on the first electrode 11 and the second electrode 12 via the insulating layer 16 can be rapidly melted by the heat generation of the high melting point metal body 15 As the metal, for example, a low melting point metal such as solder or a Pb-free solder containing Sn as a main component is suitably used.

Further, the first fusible conductor 13 and the second meltable conductor 14 may contain a low melting point metal and a high melting point metal. As the low-melting-point metal, it is preferable to use solder or a Pb-free solder containing Sn as a main component, and as the high-melting-point metal, silver (Ag), copper (Cu), or an alloy containing the same as a main component is preferably used. Wait. When the switching element 1 is reflowed by containing a high melting point metal and a low melting point metal, even if the reflow temperature exceeds the melting temperature of the low melting point metal to melt the low melting point metal, the low melting point metal can be suppressed from flowing out to the outside, and The shape of the first fusible conductor 13 and the second fusible conductor 14 is maintained. Further, when it is blown, the high-melting-point metal is etched by the melting of the low-melting-point metal (solder erosion), whereby it can be rapidly melted at a temperature lower than the melting point of the high-melting-point metal. Further, the first soluble conductor 13 and the second meltable conductor 14 can be formed by various configurations as described below.

Further, in order to prevent oxidation, improve wettability, and the like, the first fusible conductor 13 and the second meltable conductor 14 are preferably coated with a flux 18.

[switch circuit, alarm circuit]

The above switching element 1 has a circuit configuration as shown in Fig. 2(C). That is, the switching element 1 is configured with a switch 2 in which the first electrode 11 and the second electrode 12 are open at normal times (Fig. 2(C)), and the heat is generated by the high melting point metal body 15 When the first meltable conductor 13 and the second meltable conductor 14 are melted, they are short-circuited via the molten conductor (Fig. 3(B)). Further, the external connection terminals 11a and the external connection terminals 12a of the first electrode 11 and the second electrode 12 constitute two terminals of the switch 2.

Further, the switching element 1 is used, for example, in the alarm circuit 30. FIG. 5 is a view showing an example of a circuit configuration of the alarm circuit 30. The alarm circuit 30 includes an operation circuit 33 that operates the alarm device 31 by using the switch 2 of the switching element 1, and a control circuit 34 having a fuse and a functional circuit that is electrically independent of the operating circuit and that The fuse including the high melting point metal body 15 is connected in series to the power source in a functional circuit, and the melting point of the high melting point metal body 15 is higher than that of the first fusible conductor 13 and the second fusible conductor 14.

As shown in FIG. 5, in the switching element 1, the two external connection terminals 11a and 12a of the switch 2 are connected to an alarm 31 including a buzzer or a lamp or an alarm system. Further, the two external connection terminals 15a of the high melting point metal body 15 in the switching element 1 are connected to the functional circuit 32.

In the switching element 1 having such a configuration, the first soluble conductor 13 and the second meltable conductor 14 are melted by the heat generation of the high-melting-point metal body 15, and the fusion is performed via the fusion. The fuse is short-circuited, and the high-melting-point metal body 15 is formed adjacent to the first electrode 11 and the second electrode 12 constituting the switch 2 that operates the alarm device 31. In other words, the switching element 1 has a configuration in which the high-melting-point metal body 15 is physically and electrically independent of the first electrode 11 and the second electrode 12, and the first fusible conductor 13 is made by the heat of the high-melting-point metal body 15. The second fusible conductor 14 is melted to be short-circuited, and it can be said that it is connected by heat and interlocked.

Therefore, the switching element 1 can be configured not only by using mechanical elements such as springs or alarm contacts, but also by mechanical interlocking of mechanical elements. Therefore, it can be compactly designed in the surface of the insulating substrate 10, and can be mounted on a narrow surface. Installation area. Further, the switching element 1 can reduce the number of parts, the number of manufacturing steps, and can realize cost reduction. Further, in the switching element 1, the insulating substrate 10 can be surface-mounted by reflow mounting or the like, and can be easily attached to a narrow mounting region.

When actually used, in the switching element 1, an overcurrent flows in the high melting point metal body 15 due to the failure of the functional circuit 32. Therefore, as shown in FIG. 3(A), the high-melting-point metal body 15 generates heat, whereby the first meltable conductor 13 and the second meltable conductor 14 are melted. The first meltable conductor 13 and the second meltable conductor 14 have a larger area of the molten conductor than the opening 16a, and are aggregated and bonded to each of the first electrode 11 and the second electrode 12 heated by the high melting point metal body 15. The front end portion 11b and the front end portion 12b are provided. Thereby, in the switching element 1, the first electrode 11 and the second electrode 12 are short-circuited, and the alarm device 31 can be operated. That is, the switch 2 of the switching element 1 is turned on (Fig. 3(C)). In the alarm circuit 30, the alarm circuit 31 is operated by the operation circuit 33 by turning on the switch 2 of the switching element 1.

In the switching element 1, the heat generating portion 15b is formed in the vicinity of the first meltable conductor 13 and the second meltable conductor 14 of the high melting point metal body 15, thereby forming a high-resistance heat generating portion. When 15b is at a high temperature, the first meltable conductor 13 and the second meltable conductor 14 can be efficiently melted, and the first electrode 11 and the second electrode 12 can be quickly short-circuited. Further, in the high-melting-point metal body 15, only the high-resistance heat-generating portion 15b is locally high-temperature, so that the two external connection terminals 15a facing the side edges have a heat-dissipating effect, and can maintain a relatively low temperature in accordance with this. Therefore, the solder for mounting the external connection terminal 15a in the switching element 1 does not melt.

As shown in FIG. 4(A), FIG. 4(B), and FIG. 4(C), after the short circuit between the first electrode 11 and the second electrode 12, the high-melting-point metal body 15 continues to generate heat, and due to its own Joule heat. Block (Figure 4 (A), Figure 4 (B)). Thereby, the switching element 1 blocks the energization of the functional circuit 32, and stops the heat generation (FIG. 4(C)). At this time, in the switching element 1, since the high melting point metal body 15 is covered by the insulating layer 16, the arc discharge can be suppressed, and the explosive scattering of the molten conductor can be suppressed. Further, since the high-melting-point metal body 15 is provided with the fine heat generating portion 15b, the fuse portion can be narrowed, and the amount of the scattered molten conductor can be reduced.

As described above, in the switching element 1, the high-melting-point metal body 15 having a higher melting point than the first fusible conductor 13 and the second meltable conductor 14 generates heat, so that the first fusible conductor 13 and the second fusible conductor 14 are surely The high-melting-point metal body 15 is melted, and the first electrode 11 and the second electrode 12 can be short-circuited. In other words, in the switching element 1, the blocking of the high melting point metal body 15 is not a requirement for the short circuit of the first electrode 11 and the second electrode 12. Therefore, the switching element 1 can be used as an alarm switch, which is to inform the accompanying function electric The abnormality of the road 32 flows with a current exceeding the rated value of the high melting point metal body 15.

Further, the high melting point metal body 15 is blocked by its own Joule heat, whereby the heat generation is automatically stopped. Therefore, the switching element 1 does not need to be provided with a mechanism for limiting the power supply of the functional circuit 32, and the high-melting-point metal body 15 can be stopped from heating with a simple configuration, and the entire device can be downsized.

[Connection of high melting point metal body to first electrode]

Further, as shown in FIG. 6(A), FIG. 6(B), and FIG. 6(C), the switching element 1 may have the first high melting point metal body 15 and the first soluble conductor 13 mounted thereon. A connecting portion 19 to which the electrode 11 is connected. The connection portion 19 may be provided by patterning in the same step as the high melting point metal body 15 or the first electrode 11 by using the same conductive material as the high melting point metal body 15 or the first electrode 11, for example. .

When the high melting point metal body 15 is connected to the first electrode 11, the high melting point metal body 15 of the switching element 1 generates heat by energization, and heat is transferred to the first fusible via the connecting portion 19 and the first electrode 11. The conductor 13 is melted more quickly. Therefore, the connection portion 19 is preferably formed of a metal material such as Ag or Cu which is excellent in thermal conductivity.

[cover member/cover electrode]

In the switching element 1, a cover member 20 that protects the inside is attached to the insulating substrate 10. In the switching element 1, the insulating substrate 10 is covered by the cover member 20 to protect the inside thereof. The cover member 20 includes a side wall 21 constituting a side surface of the switching element 1 and a top surface portion 22 constituting an upper surface of the switching element 1. By connecting the side wall 21 to the insulating substrate 10, the inside of the switching element 1 is closed. Cover. Like the insulating substrate 10, the cover member 20 can be, for example, a thermoplastic or a ceramic. An insulating member such as a porcelain or a glass epoxy substrate is formed.

Further, as shown in FIG. 7, the cover portion electrode 23 may be formed on the inner surface side of the top surface portion 22 of the cover member 20. The cover portion electrode 23 is formed at a position that overlaps between the tip end portions 11b of the first electrode 11 and the second electrode 12 and the tip end portion 12b. When the high-melting-point metal body 15 generates heat and the first meltable conductor 13 and the second meltable conductor 14 are melted, the molten conductor which is aggregated on the first electrode 11 and the second electrode 12 will be melted. By wet contact and diffusion, the allowable amount of the molten conductor can be increased, and the first electrode 11 and the second electrode 12 can be more reliably short-circuited.

[Configuration of High Melting Metal Body: Modification 1]

Further, in the switching element to which the present invention is applied, the high melting point metal body may be overlapped with the first electrode and the second electrode on the surface of the insulating substrate. In the following description, the same components as those of the switching element 1 described above are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIGS. 8(A) and 8(B), in the switching element 40, a high melting point metal body 15 is formed between the opposing side edges 10d and the side edges 10e of the surface 10a of the insulating substrate 10. Further, in the switching element 40, the first electrode 11 and the second electrode 12 are formed on the opposite side edges 10b and side edges 10c of the surface 10a of the insulating substrate 10.

The high melting point metal body 15 is covered by the first insulating layer 41 at a substantially central portion of the insulating substrate 10. Further, an external connection terminal 15a of the high melting point metal body 15 is formed on the side edge 10d and the side edge 10e of the insulating substrate 10, respectively. Further, the high-melting-point metal body 15 is formed with a heat generating portion 15b which is formed to be thinner at both ends than the intermediate portion overlapping the first electrode 11 and the second electrode 12, and generates heat at a high temperature.

The external connection terminal 11a and the external connection terminal 12a of the first electrode 11 and the second electrode 12 are formed on the side edge 10b and the side edge 10c of the insulating substrate 10, respectively. Further, the first electrode 11 and the second electrode 12 are formed so as to straddle the upper surface of the first insulating layer 41 from the side edge 10b and the side edge 10c, and the upper surface of the first insulating layer 41 and the front end portion 11b of each other The front end portion 12b is close to and apart from each other and opens. Further, the first electrode 11 and the second electrode 12 are covered by the second insulating layer 42 except for the distal end portion 11b and the distal end portion 12b.

An opening 42a is formed in a part of the second insulating layer 42. In addition, the first electrode 11 and the second electrode 12 are provided with solder for connection at the distal end portion 11b, the distal end portion 12b, and the opening portion 42a, and the solder for the connection is applied to the distal end portion 11b, the distal end portion 12b, and the opening. The first meltable conductor 13 and the second meltable conductor 14 are supported between the portions 42a on the second insulating layer 42. Thereby, at least a part of the tip end portion 11b of the first electrode 11 and the second electrode 12, the tip end portion 12b, and the first meltable conductor 13 and the second meltable conductor 14 overlap with the heat generating portion 15b of the high melting point metal body 15. Further, the flux 18 is applied to the first fusible conductor 13 and the second meltable conductor 14 in order to prevent oxidation, improve wettability, and the like.

Similarly to the insulating layer 16 of the switching element 1 described above, an insulating material such as glass is preferably used for the first insulating layer 41 and the second insulating layer 42.

According to the switching element 40, the first electrode 11, the second electrode 12, the first meltable conductor 13, and the second meltable conductor 14 are disposed so as to overlap the heat generating portion 15b of the high melting point metal body 15, so that the heat generating portion is used. The heat generation of 15b rapidly melts the first fusible conductor 13 and the second meltable conductor 14, thereby causing the first electrode 11 and the second electrode 12 short circuit. At this time, the switching element 40 continuously laminates the heat generating portion 15b, the first electrode 11, the second electrode 12, and the first meltable conductor 13, and the second through the first insulating layer 41 including the glass and the second insulating layer 42. Since the conductor 14 can be melted, the heat of the heat generating portion 15b can be efficiently conducted.

[Configuration of High Melting Metal Body: Modification 2]

Further, in the switching element of the present invention, the first electrode and the second electrode may be formed on the surface of the insulating substrate, and a high melting point metal body may be formed on the back surface of the insulating substrate, thereby forming the high melting point metal body and the first electrode. The second electrode overlaps. In the following description, the same components as those of the switching element 1 will be denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIGS. 9(A) and 9(B), in the switching element 50, a high-melting-point metal body 15 is formed between the opposing side edges 10d and the side edges 10e of the back surface 10f of the insulating substrate 10. Further, in the switching element 50, the first electrode 11 and the second electrode 12 are formed on the opposite side edges 10b and side edges 10c of the surface 10a of the insulating substrate 10.

The high melting point metal body 15 is covered by the first insulating layer 51 at a substantially central portion of the insulating substrate 10. Further, an external connection terminal 15a of the high melting point metal body 15 is formed on the side edge 10d and the side edge 10e of the insulating substrate 10, respectively. Further, the high-melting-point metal body 15 is formed with a heat generating portion 15b which is formed to be thinner at both ends than the intermediate portion overlapping the first electrode 11 and the second electrode 12, and generates heat at a high temperature.

The first electrode 11 and the external connection terminal 11a of the second electrode 12 and the external connection terminal 12a are formed on the side edge 10b and the side edge 10c of the insulating substrate 10, respectively. Further, the first electrode 11 and the second electrode 12 are formed by the side edge 10b and the side edge 10c. The substantially central portion of the front surface portion 10a of the insulating substrate 10 is opened and separated from each other by the front end portion 11b and the front end portion 12b. Further, the first electrode 11 and the second electrode 12 are covered by the second insulating layer 52 except for the distal end portion 11b and the distal end portion 12b.

An opening 52a is formed in a part of the second insulating layer 52. In addition, the first electrode 11 and the second electrode 12 are provided with solder for connection at the distal end portion 11b, the distal end portion 12b, and the opening portion 52a, and the solder for the connection is applied to the distal end portion 11b and the distal end portion 12b. The first soluble conductor 13 and the second meltable conductor 14 are supported between the openings 52a on the second insulating layer 52. Thereby, at least a part of the tip end portion 11b of the first electrode 11 and the second electrode 12, the tip end portion 12b, and the first meltable conductor 13 and the second meltable conductor 14 overlap with the heat generating portion 15b of the high melting point metal body 15. Further, the flux 18 is applied to the first fusible conductor 13 and the second fusible conductor 14 in order to prevent oxidation, improve wettability, and the like.

Similarly to the insulating layer 16 of the switching element 1, an insulating material such as glass is preferably used for the first insulating layer 51 and the second insulating layer 52.

According to the switching element 50, the first electrode 11, the second electrode 12, the first meltable conductor 13, and the second meltable conductor 14 are disposed so as to overlap the heat generating portion 15b of the high melting point metal body 15, so that heat is generated. The heat generated by the portion 15b rapidly melts the first meltable conductor 13 and the second meltable conductor 14, and the first electrode 11 and the second electrode 12 can be short-circuited. In the switching element 50, the thermal conductivity of the ceramic substrate or the like is excellent as the insulating substrate 10, whereby the high melting point metal body 15 can be formed on the first soluble conductor 13 and the second meltable conductor 14. It is preferred that the same surface is heated to the same extent.

[Modification of Fusible Conductor]

As described above, any or all of the first soluble conductor 13 and the second meltable conductor 14 may contain a low melting point metal and a high melting point metal. The high-melting-point metal layer 60 contains Ag, Cu, or an alloy containing the same as the main component, and the low-melting-point metal layer 61 contains Pb-free solder or the like containing Sn as a main component. At this time, as shown in FIG. 10(A), the first fusible conductor 13 and the second fusible conductor 14 may be made of a fusible conductor in which a high melting point metal layer 60 as an inner layer is provided. And a low melting point metal layer 61 as an outer layer is provided. In this case, the first fusible conductor 13 and the second fusible conductor 14 may have a structure in which the entire surface of the high-melting-point metal layer 60 is covered by the low-melting-point metal layer 61, and may be a pair of opposite sides. Part of the covered structure. The coating structure formed of the high melting point metal layer 60 or the low melting point metal layer 61 can be formed using a known film forming technique such as plating.

Further, as shown in FIG. 10(B), the first fusible conductor 13 and the second fusible conductor 14 may be made of a fusible conductor, and the fusible conductor is provided with a low-melting-point metal layer 61 as an inner layer, and A high melting point metal layer 60 is provided as an outer layer. In this case, the first fusible conductor 13 and the second fusible conductor 14 may have a structure in which the entire surface of the low-melting-point metal layer 61 is covered by the high-melting-point metal layer 60, or may be a pair of opposite sides. Part of the covered structure.

Further, as shown in FIGS. 11(A) and 11(B), the first fusible conductor 13 and the second fusible conductor 14 may have a laminated structure in which a high-melting-point metal layer 60 and a low-melting-point metal layer 61 are laminated.

At this time, as shown in FIG. 11(A), the first fusible conductor 13 and the second fusible element are The conductor 14 is formed in a two-layer structure including a lower layer supported by the first electrode 11 and the second electrode 12 and an upper layer laminated on the lower layer, and may be used as an upper layer of the upper surface layer of the lower high-melting-point metal layer 60. The low melting point metal layer 61 may, conversely, be the upper surface layer of the lower melting point metal layer 61 as the upper layer of the high melting point metal layer 60. Alternatively, as shown in FIG. 11(B), the first fusible conductor 13 and the second fusible conductor 14 may be formed in a three-layer structure including an inner layer and an outer layer laminated on the upper and lower surfaces of the inner layer. The upper and lower surface layer of the high-melting-point metal layer 60 as the inner layer serves as the outer layer of the low-melting-point metal layer 61, and conversely, the upper and lower surface layer of the low-melting-point metal layer 61 as the inner layer serves as the outer layer of the high-melting-point metal layer 60.

Further, as shown in FIG. 12, the first fusible conductor 13 and the second fusible conductor 14 may have a multilayer structure of four or more layers in which the high-melting-point metal layer 60 and the low-melting-point metal layer 61 are alternately laminated. At this time, the first fusible conductor 13 and the second fusible conductor 14 may have a structure in which the entire surface or a portion other than the opposing pair of side faces is covered by the metal layer constituting the outermost layer.

Further, in the first fusible conductor 13 and the second fusible conductor 14, the high-melting-point metal layer 60 may be partially deposited in a stripe shape on the surface of the low-melting-point metal layer 61 constituting the inner layer. 13(A) and 13(B) are plan views of the first soluble conductor 13 and the second meltable conductor 14.

In the first fusible conductor 13 and the second meltable conductor 14 shown in FIG. 13(A), a plurality of linear high-melting-point metal layers 60 are formed on the surface of the low-melting-point metal layer 61 at predetermined intervals in the width direction. In the longitudinal direction, a linear opening 62 is formed in the longitudinal direction, and the low-melting-point metal layer 61 is exposed from the opening 62. The first can In the melted conductor 13 and the second meltable conductor 14, the low-melting-point metal layer 61 is exposed from the opening 62, whereby the contact area between the molten low-melting metal and the high-melting-point metal is increased, and the erosion of the high-melting-point metal layer 60 is further promoted. , which can improve the fuse. The opening portion 62 can be formed by, for example, partially plating a metal constituting the high melting point metal layer 60 on the low melting point metal layer 61.

Further, as shown in FIG. 13(B), the first fusible conductor 13 and the second fusible conductor 14 may have a plurality of linear shapes at a predetermined interval along the longitudinal direction of the surface of the low-melting-point metal layer 61. The high melting point metal layer 60 is formed in the width direction, whereby the linear opening portion 62 is formed in the width direction.

Further, as shown in FIG. 14, in the first fusible conductor 13 and the second fusible conductor 14, a high-melting-point metal layer 60 can be formed on the surface of the low-melting-point metal layer 61, and across the entire surface of the high-melting-point metal layer 60. A circular opening portion 63 is formed, and the low melting point metal layer 61 is exposed from the opening portion 63. The opening portion 63 can be formed by, for example, partially plating a metal constituting the high melting point metal layer 60 on the low melting point metal layer 61.

In the first fusible conductor 13 and the second fusible conductor 14, by exposing the low-melting-point metal layer 61 from the opening 63, the contact area between the molten low-melting-point metal and the high-melting-point metal is increased, and the high-melting-point metal is further promoted. Erosion, which can improve the fuse.

Further, as shown in FIG. 15, in the first fusible conductor 13 and the second fusible conductor 14, a plurality of openings 64 may be formed in the high-melting-point metal layer 60 as an inner layer, and the plating technique is equal to the height. The melting point metal layer 60 forms the low melting point metal layer 61, and It is filled in the opening portion 64. Thereby, in the first fusible conductor 13 and the second meltable conductor 14, the area in which the molten low-melting-point metal contacts the high-melting-point metal is increased, so that the low-melting-point metal can be etched in a shorter time. metal.

Further, it is preferable that the first meltable conductor 13 and the second meltable conductor 14 have a volume of the low-melting-point metal layer 61 larger than a volume of the high-melting-point metal layer 60. In the first fusible conductor 13 and the second fusible conductor 14, the high-melting-point metal body 15 is heated to melt the low-melting-point metal, thereby melting the high-melting-point metal, so that it can be rapidly melted and melted. Therefore, in the first fusible conductor 13 and the second fusible conductor 14, by forming the volume of the low-melting-point metal layer 61 larger than the volume of the high-melting-point metal layer 60, the etching action can be promoted, and the etching can be quickly performed. The first electrode 11 and the second electrode 12 are short-circuited.

1‧‧‧Switching elements

10‧‧‧Insert substrate

10a‧‧‧ surface

10b, 10c‧‧‧ side edge

11‧‧‧1st electrode

11a, 12a‧‧‧ external connection terminals

12‧‧‧2nd electrode

13‧‧‧1st fusible conductor

15‧‧‧High melting point metal body

15a‧‧‧External connection terminal

15b‧‧‧Fever Department

16‧‧‧Insulation

16a‧‧‧ Opening

18‧‧‧ Flux

Claims (32)

A switching element comprising: an insulating substrate; a first electrode and a second electrode are formed on the insulating substrate in close proximity; a first meltable conductor is mounted on the first electrode; and a high melting point metal body is formed in The insulating substrate has a melting point higher than the first meltable conductor; and the first meltable conductor is melted by heat generated by energization of the high melting point metal body, and the first fusible element is melted The molten conductor of the conductor connects the first electrode and the second electrode, and electrically shorts the first electrode and the second electrode. The switching element according to claim 1, wherein the high melting point metal body is melted after the first meltable conductor is melted and the first electrode and the second electrode are short-circuited. The switching element according to claim 2, wherein the high melting point metal body is melted by its own Joule heat. The switching element according to claim 3, wherein the second meltable conductor is mounted on the second electrode. The switching element according to claim 1, wherein the high melting point metal body comprises an electrode pattern laminated on a surface of the insulating substrate. The switching element according to claim 5, wherein the high melting point metal body is a metal mainly composed of silver or copper. Such as the switching element described in claim 5 or 6, wherein In the electrode pattern of the high melting point metal body, a heat generating portion which is relatively thin and which locally generates heat at a high temperature due to current concentration is formed at a position close to the first meltable conductor. The switching element according to claim 1, wherein the high melting point metal body is covered by an insulating layer. The switching element according to claim 5, wherein an insulating layer is formed between the high melting point metal body and the insulating substrate. The switching element according to claim 8 or 9, wherein the insulating layer is mainly composed of glass. The switching element according to any one of claims 1 to 4, wherein the high melting point metal body is a foil or a wire mainly composed of copper or silver. The switching element according to any one of claims 1 to 6, wherein the insulating substrate is a ceramic substrate. The switching element according to any one of the first to sixth aspect, wherein the first electrode and the high melting point of the first soluble conductor are mounted Metal body connection. The switching element according to any one of claims 1 to 8, wherein the first electrode and the second electrode are arranged side by side with the high melting point metal body. The insulating substrates are on the same plane. The switching element according to any one of claims 1 to 8, wherein the first electrode and the second electrode are on one surface of the insulating substrate An insulating layer is laminated on the high melting point metal body. For example, any of items 1 to 6, 8 and 9 of the patent application scope The switching element according to the invention, wherein the first electrode and the second electrode are disposed on one surface of the insulating substrate, and the high melting point metal body is disposed on the other surface of the insulating substrate, and is mounted on at least The first meltable conductor on the first electrode overlaps the high melting point metal body. The switching element according to any one of claims 1 to 8, wherein the first fusible conductor is a solder. The switching element according to claim 1, wherein the first fusible conductor comprises a low melting point metal and a high melting point metal, and the low melting point metal is melted by heat generation of the high melting point metal body, and is melted Etching the high melting point metal. The switching element according to claim 18, wherein the low melting point metal is a solder, and the high melting point metal is an alloy mainly composed of silver, copper, or silver or copper. The switching element according to claim 18, wherein an inner layer of the first fusible conductor is the high melting point metal, and an outer layer is a coating structure of the low melting point metal. The switching element according to claim 18, wherein an inner layer of the first fusible conductor is the low melting point metal, and an outer layer is a coating structure of the high melting point metal. The switching element according to claim 18, wherein the first fusible conductor is a laminated structure in which the low melting point metal and the high melting point metal are laminated. The switching element according to claim 18, wherein the first fusible conductor has a multilayer structure in which four or more layers of the low melting point metal and the high melting point metal are alternately laminated. The switching element according to claim 18, wherein in the first fusible conductor, the high melting point metal formed on a surface of the low melting point metal constituting the inner layer is provided with an opening. The switching element according to claim 18, wherein the first fusible conductor comprises a layer of the high melting point metal having a plurality of openings, and the layer formed on the layer of the high melting point metal a layer of a low melting point metal, and the opening portion is filled with the low melting point metal. The switching element according to any one of claims 18 to 25, wherein, in the first fusible conductor, a volume of the low melting point metal is larger than a volume of the high melting point metal. The switching element according to any one of claims 1 to 6, wherein the first fusible conductor is coated with the help of the first fusible conductor. Flux. The switching element according to any one of the first to sixth aspect, wherein the first electrode and the second electrode are coated on the surface of the first electrode and the second electrode. There are any of nickel/gold plating, nickel plating/palladium plating, nickel plating/palladium/gold plating. The switching element according to any one of the preceding claims, wherein the switching element comprises a cover member, and the cover member is provided in the On the insulating substrate and protecting the inside, In the cover member, a cover electrode is provided at a position overlapping the first electrode and the second electrode. A switching circuit comprising: a switch unit having a first electrode and a second electrode, wherein the first electrode and the second electrode are open to each other and connected to an external circuit, and at least one of the soluble conductors is mounted on the switch The first electrode and the second electrode are short-circuited to operate the external circuit; and the fuse has a melting point higher than a melting point of the soluble conductor, and is connected to a functional circuit electrically formed independently of the switch portion And melting the meltable conductor by heat generated by energizing the fuse with the functional circuit, and short-circuiting the first electrode and the second electrode by the molten conductor of the soluble conductor The external circuit is running. The switching circuit of claim 30, wherein the energization of the fuse is stopped by causing the metal body to be blown by its own Joule heat. An alarm circuit includes an operation circuit, and has a first electrode and a second electrode that are open to each other and have a soluble conductor mounted on at least one of them, and the alarm device is operated by a switch portion that short-circuits the first electrode and the second electrode And a control circuit having a fuse and a functional circuit, the control circuit being electrically independent of the operating circuit, the fuse having a melting point higher than a melting point of the fusible conductor, the functional circuit and The fuse is connected in series to the power source; the fuse is melted with an overcurrent flowing when the functional circuit is abnormal. The fuse is melted by heat generated during the fuse, and the first electrode and the second electrode are short-circuited by the molten conductor of the meltable conductor to operate the alarm.