TWI683335B - Temperature short-circuit element, temperature switching element - Google Patents

Abstract

The present invention provides a temperature short-circuit element that can operate in a temperature environment above the melting point of a fusible conductor without a heating element.

Temperature short-circuit element, including a first electrode 11, a second electrode 12 provided adjacent to the first electrode 11, and a fusion between the first and second electrodes 11, 12 to fuse the first and second electrodes 11 12. The first meltable conductor 13 short-circuited, the first meltable conductor 13 melts in a temperature environment above the melting point of the first meltable conductor 13 to short-circuit the first and second electrodes 11, 12.

Description

Temperature short-circuit element, temperature switching element

The present invention relates to a temperature short-circuit element that melts a fusible conductor by a temperature environment and physically and electrically short-circuits open terminals, and a terminal that physically and electrically short-circuits open terminals and connects the connected state Temperature switching element that is physically and electrically interrupted.

Most of the rechargeable secondary batteries used repeatedly are processed into battery packs and provided to users. Especially for lithium ion secondary batteries with high weight energy density, in order to ensure the safety of users and electronic equipment, in general, several protection circuits such as overcharge protection and overdischarge protection are built into the battery pack. The function of blocking the output of the battery pack in a given occasion.

Among such protection elements, there is one that uses an FET switch built in a battery pack to turn ON/OFF the output, thereby performing overcharge protection or overdischarge protection actions of the battery pack. However, even if the FET switch is short-circuited for some reason, or a surge current is applied, a large current flows instantly, or the output voltage is abnormally reduced due to the life of the battery (battery cell), or the opposite output is abnormally large. , Or the battery voltage difference is too large, the battery pack or electronic equipment must be protected from accidents such as fire. Therefore, in order to safely interrupt the output of the battery under all such predictable abnormal conditions, a protection element composed of a fuse element having a function of interrupting the current path with an external signal is used.

As a protective element for the protection circuit of lithium ion secondary batteries, etc., such as patents Document 1 describes that there is a fusible conductor connected between the first electrode, the heating element pull-out electrode, and the second electrode on the current path to form a part of the current path. The fusible conductor on the current path is formed by Overheating self-heating, or energizing the heating element inside the protection element, causing it to heat and fuse. In such a protective element, the molten liquid fusible conductor is concentrated on the conductor layer connected to the heating element, thereby separating the first and second electrodes to block the current path.

Advanced technical literature

[Patent Document 1] JP 2010-003665

[Patent Literature 2] JP 2004-185960

[Patent Literature 3] JP 2012-003878

In recent years, HEVs (Hybrid Electric Vehicles) and EVs (Electric Vehicles) that use batteries and motors have rapidly spread. As the power source of HEV and EV, lithium ion secondary batteries are increasingly used in consideration of energy density and output characteristics. For automotive applications, high voltage and high current are necessary. Therefore, despite the development of special batteries that can withstand high voltages and large currents, considering the manufacturing cost, most of the cases still use universal batteries in series or parallel, and use universal batteries to ensure the required voltage and current.

Here, in a car moving at high speed, etc., the sudden reduction in driving force or the sudden stop may be very dangerous, so it is required to be able to cope with battery management in an emergency. For example, when an abnormality of the battery system occurs during driving, it is also possible to supply the driving force for moving to a repair plant or a safe place, or the driving force for warning lights and air conditioners. .

However, in the case of a battery pack in which a plurality of batteries are connected in series as in Patent Document 1, only when the protection element is provided on the charge and discharge path, when an abnormality occurs in a part of the battery and the protection element is actuated, the charge and discharge path of the entire battery pack Being blocked, it is no longer possible to supply electricity.

In view of this, it is proposed to exclude only the abnormal battery in the battery pack composed of a plurality of batteries, and effectively use the normal battery to form a short circuit element that only bypasses the bypass path of the abnormal battery.

FIG. 40 shows a configuration example of the short-circuit element, and FIG. 41 shows a circuit diagram of a battery circuit to which the short-circuit element is applied. This short-circuit element 100, as shown in FIG. 40 and FIG. 41, has first and second short-circuit electrodes 102 and 103 that are open in normal time in parallel with the battery 101 on the charge and discharge path, and the first and first short-circuit electrodes are melted 2 Two fusible conductors 104a, 104b short-circuited between the short-circuit electrodes 102, 103, and a heating element 105 that is connected in series with the fusible conductor 104a to melt the fusible conductors 104a, 104b.

In the short-circuit element 100, a heating element 105 and an external connection electrode 111 connected to one end of the heating element 105 are formed on an insulating substrate 110 such as a ceramic substrate. In addition, in the short-circuit element 100, an insulating layer 112 of glass or the like is formed on the heating element 105, and a heating element electrode 113 connected to the other end of the heating element 105, the first and second short-circuit electrodes 102, 103, and the first 1. The second short-circuit electrodes 102 and 103 support the first and second support electrodes 114 and 115 of the fusible conductors 104a and 104b together.

The first support electrode 114 is connected to the heating element electrode 113 exposed on the insulating layer 112 and is adjacent to the first short-circuit electrode 102. The first support electrode 114 supports both sides of one soluble conductor 104a together with the first short-circuit electrode 102. Similarly, the second support electrode 115 is adjacent to the second short-circuit electrode 103 and supports both sides of the other soluble conductor 104b together with the second short-circuit electrode 103.

The short-circuit element 100 constitutes a power supply path from the external connection electrode 111 to the first short-circuit electrode 102 via the heating element 105, the heating element electrode 113, and the fusible conductor 104a.

The heat generating body 105 self-heats by current flowing through this power supply path, and the heat (Joule heat) melts the fusible conductors 104a and 104b. As shown in FIG. 41, the heating element 105 is connected to a current control element 106 such as an FET through an external connection electrode 111. The current control element 106 controls the power supply to the heating element 105 when the battery 101 is normal, and allows current to flow to the heating element 105 through the charge and discharge path when abnormal.

In the battery circuit using the short-circuit element 100, when an abnormal voltage or the like is detected in the battery 101, the protection element 107 interrupts the battery 101 from the charging and discharging path, and the current control element 106 is actuated to cause current to flow to the heating element 105. Accordingly, the heat of the heating element 105 melts the fusible conductors 104a and 104b. The fusible conductors 104 a and 104 b melt toward the first and second short-circuit electrodes 102 and 103 of a relatively large area and melt, and the molten conductor aggregates and bonds between the two short-circuit electrodes 102 and 103. Therefore, the short-circuit electrodes 102 and 103 are short-circuited by the molten conductors of the fusible conductors 104a and 104b, and accordingly, a current path that bypasses the battery 101 can be formed.

Also, in the short-circuit element 100, the fusible conductor 104a moves to the first short-circuit electrode 102 side and melts, opening the first support electrode 114 and the first short-circuit electrode 102, thereby blocking the power supply path to the heating element 105 Therefore, the heating of the heating element 105 stops.

In order to operate such a short-circuit element, it is necessary to provide a fusible conductor and a heat-generating body as a heat source for melting the fusible conductor inside the element, and connect the short-circuit element to an energizing path to the heat-generating body. In addition, a control element for controlling the energization of the heating element must be provided on the energizing path, and the heating element must be energized when the predetermined operating conditions are met when the battery has an abnormal voltage.

Here, if the fusible conductor can be melted by the heat from the heat source outside the element, it is not necessary to dispose the heating element in the short-circuit element, miniaturization and simplification of the manufacturing process can be achieved, and there is no need to The current control components for power-on control are also applicable to a wide range of application software. Furthermore, it is also possible to avoid accidents such as the failure of the current control element that controls the energization of the heating element and the heating element being unable to generate heat.

Therefore, an object of the present invention is to provide a temperature short-circuit element and a temperature switching element that can be operated in a temperature environment above the melting point of a fusible conductor even without a heating element.

To solve the above-mentioned problems, the temperature short-circuit element of the present invention includes a first electrode, a second electrode provided adjacent to the first electrode, and condensing between the first and second electrodes by melting to cause the first 1. The first meltable conductor with the second electrode short-circuited, the first meltable conductor melts in a temperature environment above the melting point of the first meltable conductor.

Further, the temperature switching element of the present invention includes a first electrode, a second electrode provided adjacent to the first electrode, and condenses between the first and second electrodes by melting to cause the first and second electrodes The short-circuited first meltable conductor, the third electrode and the fourth electrode, and the third meltable conductor connected across the third and fourth electrodes and interrupting the third and fourth electrodes by melting, in In the temperature environment above the melting point of the first and third meltable conductors, the first and third meltable conductors melt.

According to the present invention, the fusible conductor can be melted due to the temperature environment above the melting point, the molten conductor condenses around the first electrode, and is also connected to the second electrode adjacent to the first electrode It can short-circuit between the first and second electrodes. Furthermore, according to the present invention, the fusible conductor can be melted due to the temperature environment above the melting point to block the third and fourth electrodes.

1‧‧‧Temperature short-circuit element

2‧‧‧switch

10‧‧‧Insulated substrate

11‧‧‧1st electrode

11a‧‧‧External connection terminal

12‧‧‧ 2nd electrode

12a‧‧‧External connection terminal

13‧‧‧The first soluble conductor

13a‧‧‧fused conductor

14‧‧‧Heat conduction component

15‧‧‧heat source

17‧‧‧The first insulating layer

18‧‧‧joining material

21‧‧‧The second soluble conductor

24‧‧‧flux

25‧‧‧ Covering member

25a‧‧‧Side wall

25b‧‧‧Top

28‧‧‧External circuit

30‧‧‧Temperature short-circuit element

31‧‧‧The first support electrode

40‧‧‧Temperature short-circuit element

42‧‧‧Fixed member

43‧‧‧Second support electrode

50‧‧‧Temperature short-circuit element

51‧‧‧The second insulating layer

52‧‧‧Opening

60‧‧‧Temperature short-circuit element

61‧‧‧Opening

70‧‧‧Temperature short-circuit element

71‧‧‧ Cover electrode

80‧‧‧temperature switching element

81‧‧‧The third fusible conductor

82‧‧‧Heat conduction component

83‧‧‧3rd electrode

83a‧‧‧External connection terminal

84‧‧‧ 4th electrode

84a‧‧‧External connection terminal

85‧‧‧External circuit

87‧‧‧temperature switching element

90‧‧‧temperature switching element

91‧‧‧High melting point metal layer

92‧‧‧Low melting point metal layer

93‧‧‧Opening

94‧‧‧Opening

95‧‧‧Opening

97‧‧‧temperature switching element

W ₁ ‧‧‧ Interval between the first and second electrodes 11, 12

W ₂ ‧‧‧Width of the first electrode 11

Fig. 1 is a diagram showing the configuration of a temperature short-circuit element to which the present invention is applied, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 2 is a diagram showing a temperature short-circuit element in which the first soluble conductor melts, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 3 is a diagram showing the configuration of a temperature short-circuit element to which the present invention is applied, (A) is a top view, (B) is a cross-sectional view taken along line A-A', and (C) is an external perspective view of a temperature short-circuit element having a heat conducting member.

4 is a diagram showing an example of the circuit configuration of a temperature short-circuit element.

5 is a diagram showing an example of a circuit configuration in which the switch of the temperature short-circuit element is in an ON state.

Fig. 6 is a diagram showing the configuration of a temperature short-circuit element provided with a second fusible conductor, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 7 is a diagram showing a temperature short-circuit element in which the first soluble conductor and the second soluble conductor melt, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 8 is a diagram showing the structure of a surface-mounted temperature short-circuit element, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 9 is a diagram showing the structure of a surface-mounted temperature short-circuit element in which a first soluble conductor is melted, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 10 is a diagram showing the configuration of a temperature short-circuit element provided with a first support electrode, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 11 is a view showing a state where the first meltable conductor provided with the temperature short-circuit element of the first support electrode is melted, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 12 is a diagram showing the configuration of a temperature short-circuit element having first and second fusible conductors, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 13 is a diagram showing the configuration of a temperature short-circuit element in which the first and second meltable conductors are melted, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

FIG. 14 is a cross-sectional view showing a configuration including first and second fusible conductors and a second support electrode supporting the first and second fusible conductors, (A) shows before fusing, and (B) shows after fusing.

15 is a cross-sectional view showing the structure of a temperature short-circuit element supporting a first meltable conductor with a second insulating layer, (A) shows before the melt of the first meltable conductor, (B) shows after the melt of the first meltable conductor .

16 is a diagram showing the structure of the temperature short-circuit element supporting the first meltable conductor with the first and second insulating layers, (A) is a plan view, (B) is a cross-sectional view taken along line AA', and (C) is B -B' line profile.

FIG. 17 is a plan view showing the temperature short-circuit element shown in FIG. 16 after removing the covering member and the first soluble conductor.

FIG. 18 is a diagram showing a state in which the first fusible conductor is melted in the temperature short-circuit element shown in FIG. 16, (A) is a plan view, (B) is a cross-sectional view taken along line AA', and (C) is B- B'line profile.

Fig. 19 is a diagram showing a temperature short-circuit element provided with a cover electrode, (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is a cross-sectional view taken along line B-B'.

FIG. 20 is a diagram showing a state in which the first fusible conductor is melted in the temperature short-circuit element shown in FIG. 19, (A) is a plan view, (B) is a cross-sectional view taken along line AA', and (C) is B- B'line profile.

Fig. 21 is a diagram showing the configuration of a temperature switching element to which the present invention is applied, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 22 is a diagram showing a temperature switching element in which the first and third meltable conductors are melted, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

23 is a diagram showing an example of the circuit configuration of the temperature switching element, (A) shows the melting of the first and second meltable conductors, and (B) shows the melting of the first and second meltable conductors.

24 is a diagram showing an example of a circuit configuration of a temperature switching element connected to an external circuit.

Fig. 25 is a diagram showing the configuration of a surface-mounting temperature switching element, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 26 is a diagram showing the configuration of a surface-mounting temperature switching element in which the first and third meltable conductors are melted, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

FIG. 27 is a diagram showing the structure of a temperature switching element in which the first soluble conductor is supported by the first and second insulating layers, (A) is a plan view, (B) is a cross-sectional view taken along line AA′, and (C) is B -B' line profile.

Fig. 28 is a diagram showing the configuration of a temperature switching element having first to third fusible conductors, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

Fig. 29 is a view showing a state in which the first and third meltable conductors are melted in the temperature switching element shown in Fig. 28, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

FIG. 30 is a plan view showing a temperature switching element that changes the thermal conductivity of the first and second electrodes and the third electrode.

Fig. 31 is a diagram showing a temperature switching element provided with a cover electrode, (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is a cross-sectional view taken along line B-B'.

FIG. 32 is a diagram showing a state in which the first and third meltable conductors are melted in the temperature short-circuit element shown in FIG. 31, (A) is a plan view, (B) is a cross-sectional view taken along line AA', (C) It is a BB' cross-sectional view.

FIG. 33 is a diagram showing a configuration example of a fusible conductor in which a low-melting-point metal layer is covered with a high-melting-point metal layer, (A) is a strip shape, and (B) is a perspective view of a linear fusible conductor.

34 is a diagram showing a configuration example of a fusible conductor of a low-melting-point metal layer and a high-melting-point metal laminated layer, (A) is a perspective view of a fusible conductor having a two-layer structure and (B) a three-layer structure.

FIG. 35 is a perspective view showing the manufacturing process of the fusible conductor of the laminated structure.

FIG. 36 is a cross-sectional view of a fusible conductor manufactured by a multi-layer structure in which a low-melting-point metal layer and a high-melting-point metal layer are overlaid with 4 or more layers.

Fig. 37 is a diagram showing a fusible conductor provided with a strip-shaped opening, (A) a plan view showing a fusible conductor provided with an opening in the longitudinal direction, (B) a fusible conductor provided with an opening in the width direction Top view of the conductor.

Fig. 38 is a plan view showing a soluble conductor provided with a circular opening.

Fig. 39 is a top view of a high melting point metal layer with a circular opening filled with a low melting point metal in the inner layer.

FIG. 40 is a plan view showing a short-circuit element of a reference example.

41 is a circuit diagram showing a battery pack incorporating the short-circuit element of the reference example.

Hereinafter, the temperature short-circuit element and the temperature switching element to which the present invention is applied will be described in detail with reference to the drawings. In addition, the present invention is not limited to the following embodiments, and of course various modifications can be made without departing from the scope of the present invention. In addition, the drawing is displayed in a schematic way, The ratio of each size may differ from the actual product. Specific dimensions, etc. should be judged with reference to the following description. In addition, of course, it is possible that the dimensional relationship and ratio of the drawings are different from each other.

〔Temperature short-circuit element 1〕

The temperature short-circuit element 1 to which the present invention is applied, as shown in FIGS. 1(A) and (B), includes a first electrode 11, a second electrode 12 disposed adjacent to the first electrode 11, and condensed on the first by melting 1. A first soluble conductor 13 between the second electrodes 11 and 12 so as to short-circuit the first and second electrodes 11 and 12. In addition, as shown in FIGS. 2(A) and (B), the temperature short-circuit element 1 can be used in a temperature environment above the melting point of the first fusible conductor 13 without a heating element inside the element. The molten conductor 13 melts and condenses around the first electrode 11 by the molten conductor 13a, and also contacts the second electrode 12 disposed adjacent to the first electrode 11, thereby short-circuiting the first and second electrodes 11, 12.

〔Temperature environment〕

The temperature short-circuit element 1 melts the first soluble conductor 13 by heat transferred from an external heat source. Temperature environment refers to the temperature environment made by the external heat source of the temperature short-circuit element 1 that can melt the first fusible conductor 13, for example, the hot air generated by the abnormal heating of the element located near the temperature short-circuit element 1 is transmitted to the temperature short circuit The element 1 is made accordingly. In addition, the temperature environment above the melting point of the first fusible conductor 13 may be caused by the heat generated by the electronic product using the temperature short-circuit element 1 igniting or surrounding fire being transferred to the temperature short-circuit element 1. In addition, the temperature environment above the melting point of the first fusible conductor 13 is not limited to emergencies such as accidents or disasters, but can also be used as an irreversible normal method for turning on the switch, which is generated by an external heat source. The heat is transferred to the inside of the temperature short-circuit element 1.

〔Heat conduction member〕

In addition, the temperature environment in which the first fusible conductor 13 is melted is short-circuited inside the device 1 by temperature The air or the component inside the component is made by the heat conducting member 14 that transfers the heat outside the component. The heat-conducting member 14 is a material that transfers heat from a heat source outside the temperature short-circuit element 1. For example, a casing or an insulating substrate other than the temperature short-circuit element 1 described later, the first and second electrodes 11, 12, and other structural members can be used. The first soluble conductor 13 is heated by being connected directly or indirectly to the first soluble conductor 13. The heat conductive member 14 may be formed of, for example, an electrode pattern, a wire, or a heat pipe connected to the first electrode 11, and indirectly transfer heat from the heat source 15 to the first soluble conductor 13 through the first electrode 11 to melt it.

In addition, as shown in FIG. 3, in the case of using a conductive member such as a heat pipe, as shown in FIG. 3, at least the surface is preferably covered with an insulating material 16 in order to seek insulation from the surroundings.

[The first and second electrodes]

The first and second electrodes 11, 12 are formed on the same plane, for example, on an insulating substrate such as alumina by printing or firing a high-melting-point metal paste. In addition, the first and second electrodes 11 and 12 may be formed by using mechanical parts such as wires or plates made of high-melting-point metals by supporting them at predetermined positions.

The first and second electrodes 11 and 12 are arranged in close proximity and open, and by the action of the temperature short-circuit element 1, as shown in FIGS. 2(A) and (B), the molten conductor 13a of the first fusible conductor 13 described later condenses, The combination constitutes the switch 2 short-circuited through the molten conductor 13a. The first and second electrodes 11, 12 are provided with external connection terminals 11a, 12a at one ends, respectively. The first and second electrodes 11 and 12 are connected to external circuits such as a power circuit or a digital signal circuit connected by the operation of the temperature short-circuit element 1 through these external connection terminals 11a and 12a. The temperature short-circuit element 1 is short-circuited by the first and second electrodes 11 and 12 through the molten conductor 13a, and becomes a current path of the external circuit or a power supply path to the functional circuit.

[First insulating layer]

The second electrode 12 is provided with a first insulating layer 17 at least in part. In addition, the second electrode 12 overlaps the first soluble conductor 13 supported by the first electrode 11 and supports the first soluble conductor 13 with the first insulating layer 17. The temperature short-circuit element 1 is supported by the first insulating layer 17 through the first fusible conductor 13 connected to the first electrode 11, thereby opening the first and second electrodes 11 and 12 (FIG. 1 ).

For the first insulating layer 17, various materials having insulating properties can be used, and for example, it is composed of a glass layer. In the temperature short-circuit element 1, when the first fusible conductor 13 is melted, the molten conductor 13a contacts the area of the second electrode 12 excluding the first insulating layer 17, and short-circuits the first and second electrodes 11, 12. At this time, the first insulating layer 17 can control the condensation position of the molten conductor 13a on the second electrode 12 to the first electrode 12 side, and more quickly and surely condense the molten conductor 13a to the first and second electrodes 11, 12 rooms.

[First soluble conductor]

For the first fusible conductor 13, any metal that can be quickly melted due to the temperature environment of the temperature short-circuit element 1 can be used. For example, Sn or SnBi-based solder and SnIn-based solder, or other lead-free solders mainly composed of Sn, are suitable. Of low melting point metals.

In addition, the first soluble conductor 13 may contain a low melting point metal and a high melting point metal. As the low-melting-point metal, solders such as the above Sn or lead-free solders containing Sn as a main component are preferable, and as the high-melting-point metal, Ag, Cu, or alloys containing these as a main component are preferably used. By containing a high melting point metal and a low melting point metal, when the temperature short-circuit element 1 is constructed by reflow soldering, even if the reflow temperature exceeds the melting temperature of the low melting point metal to melt the low melting point metal, the outflow of the low melting point metal to the outside can be suppressed To maintain the shape of the first soluble conductor 13. In addition, during short circuit, high melting point metals can also be eroded by melting low melting point metals, and the melting point of high melting point metals can be lowered to It melts quickly. In addition, as will be described later, the first fusible conductor 13 may be formed by various configurations.

The first soluble conductor 13 is formed in a substantially rectangular plate shape, and is connected to the first electrode 11 through a bonding material 18 such as solder for connection. In addition, the first soluble conductor 13 protrudes from the second electrode 12 side and overlaps the second electrode 12, and is separated from the second electrode 12 by being supported by the first insulating layer 17. According to this, the temperature short-circuit element 1 maintains the open state of the first and second electrodes 11 and 12 before the operation. The first fusible conductor 13 is melted by the heat from an external heat source becoming a temperature environment above the melting point, and the molten conductor 13a condenses around the first electrode 11 and is also adjacent to the second electrode 12 disposed adjacent to the first electrode 11 The contact short-circuits the first and second electrodes 11 and 12.

For example, the first fusible conductor 13 starts to melt in a temperature environment of about 140°C by using a SnBi-based solder alloy. In addition, the first soluble conductor 13 starts to melt in a temperature environment of about 120°C by using a SnIn-based solder alloy.

In addition, the first fusible conductor 13 is coated with a flux 24 (see FIG. 8 and the like) in order to prevent oxidation and improve wettability.

In addition, the first soluble conductor 13 does not necessarily need to be supported by the first electrode 11. For example, the first soluble conductor 13 may support one end on the first insulating layer 17 and support the other end with a fixing member (not shown) provided on a support member or an insulating substrate. At this time, the first fusible conductor 13 is supported at a position overlapping with the first and second electrodes 11, 12 and the molten conductor 13a condenses between the first and second electrodes 11, 12 (see FIG. 15).

[Circuit configuration and application]

The temperature short-circuit element 1 has a circuit configuration as shown in FIG. 4. That is, the temperature short-circuit element 1 is in the state before the operation, that is, the first electrode 11 and the second electrode 12 are close to each other and separated to be insulated. 1 The fusible conductor 13 melts to form a short-circuited switch 2. The first and second electrodes 11 and 12 are assembled between various external circuits 28A and 28B such as a power circuit or a signal circuit by being connected in series on a current path of a circuit board or the like that houses the temperature short-circuit element 1.

The external circuits 28A and 28B are blocked by the opening between the first and second electrodes 11 and 12 before the operation of the temperature short-circuit element 1, and the physical and irreversible short circuit is caused by the short circuit of the first and second electrodes 11 and 12 The circuit may be, for example, in the case of abnormal heat generation of an electronic device equipped with the temperature short-circuit element 1, or in an emergency such as a fire, start of a cooling device or a sprinkler, start of a standby circuit, an alarm Various functional circuits such as the operation of the abnormal notification system and the construction of the bypass current path. Alternatively, the external circuits 28A, 28B can also be used to construct hacking or cracking bypassing the communication signal path of the data server in the network communication machine, or to activate general components or software ( activation).

When the temperature short-circuit element 1 becomes heat environment above the melting point of the first fusible conductor 13 due to abnormal heat generation or fire due to element failure or heat transfer from the external heat source 15, as shown in FIGS. 2(A) and (B) As shown, the first fusible conductor 13 is heated and melted, and the first and second electrodes 11, 12 that were originally insulated, are short-circuited through the molten conductor 13a. According to this, as shown in FIG. 5, in the temperature short-circuit element 1, the switch 2 is turned on, and the external circuits 28A and 28B are connected.

[Second fusible conductor]

In addition, as shown in FIG. 6, the temperature short-circuit element 1 may be connected to the second fusible conductor 21 at the second electrode 12, and the heat conducting member 14 may be continuous with the first and second electrodes 11 and 12 and pass through the second electrode 2 The second soluble conductor 21 is melted.

The second soluble conductor 21 may also be provided on the second electrode 12, as shown in FIG. 7, at the temperature short-circuit element 1, by melting each of the first soluble conductor 13 and the second soluble conductor 21 The conductors 13a and 21a increase the amount of molten conductor condensed between the first and second electrodes 11, 12 to reliably short-circuit them. The second soluble conductor 21 can be formed using the same material as the first soluble conductor 13 and can be melted in the same temperature environment in which the first soluble conductor 13 melts. In addition, as will be described later, the second fusible conductor 21 may be formed in various configurations. In addition, the second soluble conductor 21 is similar to the first soluble conductor 13 and is joined to the second electrode 12 by a joining material 18 for joining solder or the like.

In addition, the second fusible conductor 21 is provided so as to protrude from the second electrode 12 toward the first electrode 11 side, and is preferably separated from the first electrode 11 while protruding to a position overlapping with it. In addition, the second soluble conductor 21 can be supported to overlap with the first soluble conductor 13 so that the molten conductor 21a of the second soluble conductor 21 and the molten conductor 13a of the first soluble conductor 13 are easily condensed, and there are It contributes to the short circuit between the first and second electrodes 11, 12.

The second electrode 12 to which the second fusible conductor 21 is joined is transferred to the heat of the external heat source 15 through the heat conduction member 14 similarly to the first electrode 11. According to this, the second electrode 12 can quickly melt the second soluble conductor 21.

〔Surface configuration type〕

In addition, the temperature short-circuit element to which the present invention is applied is formed to be surface-mountable on an external circuit board. As shown in FIGS. 8(A) and (B), the temperature short-circuit element 1 formed for surface mounting has the first and second electrodes 11 and 12 laminated on the surface 10 a of the insulating substrate 10. The first soluble conductor 13 is supported on the first electrode 11 by a bonding material 18 that connects solder or the like, overlaps the second electrode 12, and is supported on the first insulating layer 17 formed on the second electrode 12. According to this, in the temperature short-circuit element 1, the first and second electrodes 11, 12 are opened. 8(A) is a plan view of the surface mounting type temperature short-circuit element 1, and FIG. 8(B) is a cross-sectional view taken along line A-A' of FIG. 8(A).

The insulating substrate 10 uses, for example, alumina, glass ceramics, mullite, The insulating member such as zirconia is formed in a substantially square shape. In addition, the insulating substrate 10 can also use materials for printed wiring substrates such as glass epoxy substrates and phenol substrates, but it is necessary to pay attention to the temperature at which the first fusible conductor 13 melts.

In addition, the insulating substrate 10 is preferably an insulating material having good thermal conductivity such as a ceramic substrate, or a metal substrate whose surface is made of an insulating material. Accordingly, the insulating substrate 10 has the function of transferring the heat of the external heat source 15 to the heat conducting member 14 of the first soluble conductor 13. The heat of the external heat source 15 is directly transmitted to the first electrode 11 through the insulating substrate 10 and the first soluble conductor 13 through the bonding material 18, and is indirectly transmitted to the first soluble conductor 13 as heat radiation in the temperature short-circuit element 1. According to this, it is possible to create a temperature environment at or above the melting point of the first fusible conductor 13 in the temperature short-circuit element 1 to melt the first fusible conductor 13.

The first and second electrodes 11 and 12 are conductor patterns formed on the surface 10 a of the insulating substrate 10. In addition, the first and second electrodes 11 and 12 are connected to external connection terminals (not shown) formed on the back surface 10 b of the insulating substrate 10. The temperature short-circuit element 1 is assembled into various external circuits such as a power circuit through these external connection terminals.

On the first and second electrodes 11, 12, a first insulating layer 17 is provided with an insulating material such as glass, and the first soluble conductor 13 formed in a plate shape is carried across the first and second electrodes 11, 12 between. The first and second electrodes 11 and 12 are separated from the first soluble conductor 13 by supporting the first soluble conductor 13 with the first insulating layer 17. In addition, the first electrode 11 is provided with a bonding material 18 for bonding solder or the like, and the first soluble conductor 13 is connected through the bonding material 18.

In addition, the first insulating layer 17 is formed outside the opposed portions of the first and second electrodes 11, 12 provided adjacent to each other to prevent the outflow of the bonding material 18 and the molten conductor 13a and control the condensation position of the molten conductor 13a at the first 1. The second electrode 11,12. Accordingly, the first insulating layer 17 The molten conductor 13a is prevented from flowing out to the side of the external connection terminal to avoid affecting the connection state with the external circuit branch, and the first and second electrodes 11, 12 can also be short-circuited reliably.

The first and second electrodes 11 and 12 can be formed by patterning a high-melting-point metal paste such as Ag on the surface 10a of the insulating substrate 10 by screen printing technology and then firing. In addition, by forming the first and second electrodes 11 and 12 using a material having good thermal conductivity such as Ag, it can have the function of transferring the heat of the external heat source 15 to the heat conductive member 14 of the first soluble conductor 13.

In addition, the first fusible conductor 13 is coated with flux 24 to prevent oxidation, improve wettability, and the like. In addition, in the temperature short-circuit element 1, the surface 10 a of the insulating substrate 10 is covered with a covering member 25.

The temperature short-circuit element 1 heats the first fusible conductor 13 through the insulating substrate 10 and the heat conduction members such as the first and second electrodes 11, 12 as shown in FIGS. 9(A) and (B) when the external heat source generates heat It melts, and the molten conductor 13a condenses between the first and second electrodes 11, 12 to short-circuit them. At this time, in the temperature short-circuit element 1, the first soluble conductor 13 is supported to overlap with the second electrode 12, so that the molten conductor 13a contacts the second electrode 12 by the surface tension or gravity of the molten conductor 13a, and It is possible to surely short-circuit the first and second electrodes 11 and 12.

In addition, as shown in FIG. 8, the temperature short-circuit element 1 can extend the first soluble conductor 13 to the side opposite to the first electrode 11 and the second electrode 12 and the side opposite to the second electrode 12 and the first electrode 11. According to this, in the temperature short-circuit element 1, the amount of the molten conductor 13a condensed between the first and second electrodes 11, 12 can be increased, and the short circuit can be reliably short-circuited.

Furthermore, in the temperature short-circuit element 1 described above, it is preferable that the first fusible conductor 13 formed in a plate shape has an area larger than the connection area with the first electrode 11. According to this, the first fusible conductor 13 can ensure a sufficient amount of molten conductor required to short-circuit the first and second electrodes 11 and 12.

〔Temperature short-circuit element 30〕

In addition, the temperature short-circuit element to which the present invention is applied may be provided with a support electrode for supporting the end of the first soluble conductor 13 supported by the first electrode 11. In the following description, the same components as those of the above-mentioned temperature short-circuit element 1 are given the same symbols and detailed descriptions are omitted.

The temperature short-circuit element 30 shown in FIG. 10 has the first and second electrodes 11 and 12 formed on the surface 10 a of the insulating substrate 10 similar to the temperature short-circuit element 1 described above, and is supported on the first electrode 11 through the bonding material 18. The first fusible conductor 13. Further, the first soluble conductor 13 is supported by the first insulating layer 17 provided on the first and second electrodes 11, 12 and is separated from the first and second electrodes 11, 12. According to this, the first and first electrodes Two electrodes 11 and 12 are open.

In the temperature short-circuit element 30, both ends of the first fusible conductor 13 protrude outward from the first and second electrodes 11, 12, and both ends are supported by the first support provided on the surface 10a of the insulating substrate 10 Electrode 31. The first support electrode 31 is the same as the first and second electrodes 11, 12, and can be formed by firing or the like after forming a pattern on the surface 10a of the insulating substrate 10 using a high-melting metal paste such as Ag using screen printing technology. It is better to form the first and second electrodes 11, 12 in the same process.

In addition, the first support electrode 31 is provided with a bonding material 18 for bonding solder or the like, thereby fixing both end portions of the first soluble conductor 13. Since the temperature short-circuit element 30 has the size that the first meltable conductor 13 protrudes outward from the first and second electrodes 11, 12, it is possible to obtain a sufficiently molten conductor that short-circuits between the first and second electrodes 11, 12. 13a. In addition, by fixing both ends of the first soluble conductor 13 to the first support electrode 31, the first soluble conductor 13 can be stably supported even in a temperature environment such as during reflow assembly. Furthermore, the first fusible conductor 13 is coated with flux 24 to prevent oxidation, improve wettability, and the like.

In the temperature short-circuit element 30, by melting the first soluble conductor 13 in a temperature environment above the melting point of the first soluble conductor 13, as shown in FIG. 11, the molten conductor 13a condenses on the first and second electrodes 11, 12 on. According to this, the fusion conductor 13a condenses between the first and second electrodes 11, 12 and short-circuits the first and second electrodes 11, 12.

Also, at this time, by forming the first insulating layer 17 on the first and second electrodes 11, 12, in addition to preventing the outflow of the bonding material 18 and the molten conductor 13a, the condensation position of the molten conductor 13a can stay at the first 1. Between the second electrodes 11, 12, the first and second electrodes 11, 12 are surely short-circuited.

Moreover, the first soluble conductor 13 formed in a plate shape has an area larger than the connection area with the first and second electrodes 11 and 12, respectively. According to this, the first fusible conductor 13 can secure a sufficient amount of molten conductor required to short-circuit the first and second electrodes 11 and 12.

〔Temperature short-circuit element 40〕

Moreover, applying the temperature short-circuit element of the present invention, the first soluble conductor 13 may be supported on the first electrode 11 and the second soluble conductor 21 may be supported on the second electrode 12. In the following description, the same configuration as the above-mentioned temperature short-circuit elements 1 and 30 is given the same symbol and detailed description is omitted.

In the temperature short-circuit element 40 shown in FIG. 12, the first and second electrodes 11 and 12 are formed on the surface 10 a of the insulating substrate 10, the first soluble conductor 13 is supported on the first electrode 11, and the second electrode 12 is The second soluble conductor 21 is supported. In the temperature short-circuit element 40, the first and second electrodes 11, 12 independently support the soluble conductor, so that the second soluble conductor 13, 21 is opened before melting.

A first insulating layer 17 is formed on the first and second electrodes 11 and 12, respectively, and a bonding material 18 is provided to support the first and second fusible conductors 13 and 21 while being separated. 2nd The fusible conductor 21 and the first fusible conductor 13 are made of the same material and have the same configuration, and the first and second fusible conductors 13 and 21 are melted under substantially the same temperature environment. In addition, fluxes 24 are applied to the first and second fusible conductors 13 and 21 to prevent oxidation and improve wettability.

〔Fixed member〕

In addition, at the temperature short-circuit element 40, one end of the first fusible conductor 13 supported by the first electrode 11 may be fixed to the insulating substrate 10 by a fixing member 42, and similarly, it will be supported by the second electrode 12. One end of the second fusible conductor 21 is fixed to the insulating substrate 10 with a fixing member 42. The first and second fusible conductors 13, 21 are provided by the bonding material 18 provided on the first and second electrodes 11, 12 and the fixing member 42 fixed on the surface 10a provided on the insulating substrate 10, even When the temperature short-circuit elements 40 are heated during reflow soldering, etc., they will not move toward each other. Therefore, the temperature short-circuit element 40 can prevent an initial short circuit when the first and second fusible conductors 13 and 21 move in the approaching direction and come into contact during the reflow soldering process and before the original operation.

For the fixing member 42 to which the first and second fusible conductors 13 and 21 are fixed, the same material as the bonding material 18 such as solder can be used.

The temperature short-circuit element 40 is melted by the first and second meltable conductors 13, 21 in a temperature environment above the melting point of the first and second meltable conductors 13, 21, as shown in FIG. 13, the melted conductor 13a condenses in On the first electrode 11, the molten conductor 21 a condenses on the second electrode 12. According to this, the molten conductors 13a and 21a condense between the first electrode 11 and the second electrode 12 to short-circuit the first and second electrodes 11 and 12.

Also, at this time, the first insulating layer 17 may be formed on the first and second electrodes 11 and 12 to prevent the outflow of the bonding material 18 and the molten conductors 13a and 21a and the condensation positions of the molten conductors 13a and 21a stay at the first and second Between the second electrodes 11, 12, the first and second electrodes 11, 12 are surely shortened road.

Furthermore, it is preferable that the first and second soluble conductors 13 and 21 formed in a plate shape have a larger area than the connection area with the first and second electrodes 11 and 12, respectively. In this way, the first and second fusible conductors 13 and 21 can secure a sufficient amount of molten conductor to short-circuit the first and second electrodes 11 and 12.

In addition, as shown in FIG. 14, the temperature short-circuit element 40 may be provided with a second support electrode 43 that supports the ends of the first and second fusible conductors 13 and 21. The second support electrode 43 is the same as the first and second electrodes 11, 12, and a high-melting-point metal paste such as Ag can be patterned on the surface 10a of the insulating substrate 10 using screen printing technology and formed by firing, etc. It is preferable to form the first and second electrodes 11 and 12 in the same process.

In addition, the second support electrode 43 is provided with a bonding material 18 for bonding solder or the like, whereby the ends of the first and second soluble conductors 13 and 21 are fixed. The temperature short-circuit element 40 has a size that protrudes outward from the first and second electrodes 11, 12 because the first and second fusible conductors 13, 21 can obtain a short circuit between the first and second electrodes 11, 12. Fully melted conductors 13a, 21a. In addition, by fixing both ends of the first and second soluble conductors 13 and 21 to the second support electrode 43, the first support can be stably supported even in a temperature environment such as during reflow soldering 、第2 meltable conductors 13,21.

〔Temperature short-circuit element 50〕

Furthermore, in the temperature short-circuit element to which the present invention is applied, the first soluble conductor 13 may not be supported by the first electrode 11. In the following description, the same configuration as the above-mentioned temperature short-circuit elements 1, 30, and 40 is given the same symbol and detailed description is omitted.

The temperature short-circuit element 50 shown in FIG. 15(A) has an insulating substrate 10, a The first and second electrodes 11, 12 formed on the surface 10a of the insulating substrate 10, and the second insulating layer 51 formed on the surface 10a of the insulating substrate 10 that is thicker than the first and second electrodes 11, 12 are formed across the first 1. The first soluble conductor 13 supported on the second insulating layer 51 and the covering member 25 covering the surface 10 a of the insulating substrate 10 so as to support the second electrodes 11 and 12.

The second insulating layer 51 is composed of, for example, a glass layer, and is formed on the surface 10a of the insulating substrate 10 except for the side wall 25a of the cover member 25, the first and second electrodes 11, 12 and the first and second electrodes 11 12 The area outside the gap that is electrically open. Accordingly, the second insulating layer 51 forms the openings 52 exposed on the surfaces of the first and second electrodes 11 and 12 and the opposite side edges. In addition, the second insulating layer 51 is formed to be thicker than the thickness of the first and second electrodes 11 and 12, and the first soluble conductor 13 is mounted on the upper surface.

The first fusible conductor 13 is mounted on the second insulating layer 51 so as to straddle the first and second electrodes 11 and 12 visible from the opening 52 of the second insulating layer 51. The first fusible conductor 13 is supported by the second insulating layer 51 on a wide range on both sides except the central portion overlapping the opening 52.

In addition, the covering member 25 is formed using an insulating material such as engineering plastic, and has a side wall 25 a mounted on the surface 10 a of the insulating substrate 10 and a top surface 25 b covering the surface 10 a of the insulating substrate 10. The covering member 25 covers the periphery of the second insulating layer 51 and the first soluble conductor 13 with the side wall 25a.

In such a temperature short-circuit element 50, when the first soluble conductor 13 is melted in a temperature environment above the melting point of the first soluble conductor 13, as shown in FIG. 15(B), the moving position of the molten conductor 13a is controlled at The first and second electrodes 11 and 12 can be seen from the opening 52 provided in the second insulating layer 51. That is, the temperature short-circuit element 50 melts the first soluble conductor 13 The conductor 13a does not have the wettable second insulating layer 51 and the covering member 25 to enclose the first fusible conductor 13, so the molten conductor 13a will condense on the only wettable first and second electrodes 11, 12 .

According to this, in the temperature short-circuit element 50, the molten conductor 13a condenses across the first and second electrodes 11, 12 and reliably short-circuits the first and second electrodes 11, 12.

〔Temperature short-circuit element 60〕

Furthermore, the temperature short-circuit element to which the present invention is applied may also be formed for surface mounting and expand the support area of the first and second electrodes 11, 12 to the first soluble conductor 13 to prevent the first soluble conductor 13 from Deformation and prevent initial short circuit. In the following description, the same components as those of the above-mentioned temperature short-circuit elements 1, 30, 40, and 0 are given the same symbols and detailed descriptions are omitted.

As shown in FIGS. 16 and 17, this temperature short-circuit element 60 includes an insulating substrate 10, first and second electrodes 11 and 12 formed on the surface 10 a of the insulating substrate 10, and first and second electrodes 11 and 12 The first insulating layer 17 is formed so as to expose the respective front end portions 11b and 12b facing the first and second electrodes 11, 12 on the surface 10a of the insulating substrate 10 compared to the first and second electrodes 11, The 12-thick second insulating layer 51 and the first fusible conductor 13 mounted on the first and second insulating layers 17 and 51. 16 (A) is a plan view shown after removing the cover member 25 of the temperature short-circuit element 60, the same figure (B) is a cross-sectional view taken along line AA' shown in the same figure (A), the same figure (C ) Is a cross-sectional view taken along line BB' shown in (A). In addition, FIG. 17 is a plan view shown after removing the covering member 25 of the temperature short-circuit element 60 and the first soluble conductor 13.

The first and second electrodes 11 and 12 in the temperature short-circuit element 60 are formed over a wide range of the longitudinal direction of the insulating substrate 10 formed in a rectangular shape, and are formed from both edges in the width direction of the insulating substrate 10 to the central portion , Facing each other at a predetermined interval. In addition, the first and second electrodes 11, 12, The first insulating layer 17 is deposited on the slightly central portion, and is exposed toward the front end portions 11b and 12b.

In the temperature short-circuit element 60, by forming the short-circuit length of the first and second electrodes 11, 12 to be longer, in addition to improving the reliability of the short circuit, it can also reduce the short-circuit after the short circuit of the first and second electrodes 11, 12 The resistance is in response to the high rated current.

The second insulating layer 51 is formed at the gap between the first and second electrodes 11 and 12 at the opposite side edges of the first and second electrodes 11 and 12. In addition, the second insulating layer 51 is formed to be thicker than the thickness of the first and second electrodes 11 and 12 and continuous with the first insulating layer 17 formed on the first and second electrodes 11 and 12. According to this, a substantially rectangular opening 61 is formed in the first and second insulating layers 17 and 51 to expose the opposing front end portions 11 b and 12 b of the first and second electrodes 11 and 12.

The first soluble conductor 13 is fixed to the first electrode 11 through a bonding material 18 such as solder for bonding. In addition, the first soluble conductor 13 is supported on the first insulating layer 17 and the second insulating layer 51 provided on the first and second electrodes 11 and 12 so as to cover the opening 61. That is, the temperature short-circuit element 60 has a wide range of first and second electrodes 11 and 12 laminated on the insulating substrate 10, and in addition to the respective front end portions 11b and 12b of the first and second electrodes 11, 12 are The first and second insulating layers 17, 51 surround. According to this, the first fusible conductor 13 is supported by the first and second insulating layers 17 and 51 over the entire circumference, preventing deflection in the longitudinal direction and the width direction.

Therefore, according to the temperature short-circuit element 60, it is possible to reliably prevent the first soluble conductor 13 from being bent during reflow soldering and the like, and to prevent the first and second electrodes 11, 12 caused by the deformation of the first soluble conductor 13 Initial short circuit between short circuits.

In addition, the first fusible conductor 13 may replace the first electrode 11 or be in addition to the first electrode 11 and be fixed to the first insulating layer 17 and/or the second insulating layer 51 through the bonding material 18. By fixing the first fusible conductor 13 at multiple locations, even at reflow soldering temperatures Under the environment, it is also possible to prevent positional deviations, etc., and maintain it stably.

In such a temperature short-circuit element 60, when the first meltable conductor 13 is melted in a temperature environment above the melting point of the first meltable conductor 13, as shown in FIG. 18, the moving position of the melted conductor 13a is controlled to be set from On the front end portions 11b and 12b of the first and second electrodes 11, 12 seen through the opening 61 of the first and second insulating layers 17, 51. That is, the temperature short-circuit element 60 is supported by the first and second insulating layers 17, 51 that do not have wettability to the molten conductor 13a of the first fusible conductor 13, so the molten conductor 13a condenses in On the wet first and second electrodes 11,12.

According to this, in the temperature short-circuit element 60, the molten conductor 13a condenses between the first and second electrodes 11, 12 and reliably short-circuits the first and second electrodes 11, 12.

〔Temperature short-circuit element 70〕

In addition, the temperature short-circuit element to which the present invention is applied can be formed for surface mounting, and the second electrode 12 can be connected to the cover electrode provided on the cover member. In the following description, the same components as those of the above-mentioned temperature short-circuit elements 1, 30, 40, 50, and 60 are given the same symbols and detailed descriptions are omitted.

As shown in FIG. 19, this temperature short-circuit element 70 is provided with a covering member 25 covering the surface of the insulating substrate 10, and the second electrode 12 is formed so as to face the top surface 25b of the covering member 25 and the first electrode 11 Part electrode 71 is connected. 19(A) is a plan view shown after removing the covering member 25 of the temperature short-circuit element 70 before the melting of the first soluble conductor 13, and the same figure (B) is A- shown in the same figure (A). A'line cross-sectional view, the same figure (C) is a BB' line cross-sectional view shown in the same figure (A). 20 is a plan view after removing the covering member 25 of the temperature short-circuit element 70 after the melting of the first soluble conductor 13, the same figure (B) is A shown in the same figure (A) -A' line cross-sectional view, the same figure (C) is a B-B' line cross-sectional view shown in the same figure (A).

The cover member 25 has a side wall 25a connected to the outer edge of the surface 10a of the insulating substrate 10 and a top surface 25b, and can be formed using various engineering plastics or the same material as the insulating substrate 10. The cover member 25 has a cover electrode 71 formed from one side edge portion 25a to the top surface 25b of the cover member 25.

The cover electrode 71 is mounted on the insulating substrate 10 via the cover member 25 and connected to the second electrode 12 formed on the surface 10 a of the insulating substrate 10. The first and second electrodes 11 and 12 are opened by being separated from each other. In addition, the first and second electrodes 11 and 12 are connected to the external connection terminals 11 a and 12 a formed on the back surface 10 b of the insulating substrate 10. The temperature short-circuit element 70 is assembled into various external circuits such as a power circuit through the external connection terminals 11a and 12a.

In addition, the cover electrode 71 faces the first electrode 11 formed on the surface 10 a of the insulating substrate 10, and the first soluble conductor 13 is arranged between the first electrode 11 and the first electrode 11. The first soluble conductor 13 is fixed to the first electrode 11 through the bonding material 18. In addition, the first fusible conductor 13 may be provided on the insulating substrate 10 by supporting the first supporting electrode 31 and the fixing member 42 and the second insulating layer 51.

In such a temperature short-circuit element 70, when the first soluble conductor 13 is melted in a temperature environment above the melting point of the first soluble conductor 13, as shown in FIG. 20, the molten conductor 13a condenses on the first electrode 11, and It is also condensed on the cover electrode 71 where the top surface 25b and the first electrode 11 are opposed to each other. According to this, the temperature short-circuit element 70 can short-circuit the first and second electrodes 11 and 12 through the molten conductor 13 a and the cover electrode 71.

〔Temperature switching element〕

Next, the temperature switching element to which the present invention is applied will be explained. Also, the description of the temperature switching element In the above, the same components as those of the above-mentioned temperature short-circuit elements 1, 30, 40, 50, 60, and 70 are given the same symbols and detailed descriptions are omitted.

〔Temperature switching element 80〕

The temperature switching element 80 to which the present invention is applied, as shown in FIGS. 21(A) and (B), includes a first electrode 11, a second electrode 12 disposed adjacent to the first electrode 11, and condenses on the first by melting , The first soluble conductor 13, the third electrode 83, and the fourth electrode 84 between the second electrodes 11, 12 to short-circuit the first and second electrodes 11, 12, and the third and fourth electrodes 83, 84. The third soluble conductor 81 between the third and fourth electrodes 83, 84 is blocked by melting.

In addition, the temperature switching element 80, as shown in FIGS. 22(A) and (B), does not include a heating element inside the element, but is placed in a temperature environment above the melting point of the first and third fusible conductors 13, 81. 1. The third soluble conductor 13, 81 melts. According to this, in the temperature switching element 80, the molten conductor 13a condenses around the first electrode 11 to contact the second electrode 12 disposed adjacent to the first electrode 11, so that the first and second electrodes 11, 12 There is a short circuit and the third fusible conductor 81 is fused to block the third and fourth electrodes 83 and 84.

〔Temperature environment〕

The temperature switching element 80 is the same as the temperature short-circuit element 1 described above, and the first and third fusible conductors 13 and 81 are melted by the heat transferred from the external heat source 15. The so-called temperature environment refers to the temperature environment in which the first and third fusible conductors 13 and 81 are melted by the external heat source 15 of the temperature switching element 80 as described above. The radiant heat generated by the abnormal heating of the element is transferred to the interior of the temperature switching element 80. In addition, the temperature environment above the melting point of the first and third fusible conductors 13, 81 may also be caused by the ignition of the electronic product used by the temperature switching element 80 or the heat generated by the surrounding fire transferred to the interior of the temperature switching element 80 By. In addition, the temperature environment above the melting point of the first and third fusible conductors 13, 81 is not limited to emergency situations such as accidents or disasters, but can also be used as a general method of use for irreversible changeover switches. The heat generated by the external heat source is transferred to the inside of the temperature switching element 80.

〔Heat conduction member〕

In addition, the temperature environment in which the first and third fusible conductors 13 and 81 are melted is made by the air inside the temperature switching element 80 or the component inside the element serving as a heat conduction member 82 that transfers heat outside the element. The heat-conducting member 82 is used to transfer the heat of the heat source outside the temperature switching element 80. For example, a casing or an insulating substrate other than the temperature switching element 80 described later, the first to fourth electrodes 11, 12, 83, 84, and other structures can be used. The member is directly or indirectly connected to the first and third fusible conductors 13, 81 to heat the first and third fusible conductors 13, 81 accordingly. The heat-conducting member 82 may be formed of, for example, an electrode pattern, a wire, or a heat pipe connected to the first electrode 11 or the third and fourth electrodes 83 and 84, and has an indirect transmission of heat from the heat source 15 through the first electrode 11 to the first The first heat conduction member 82A of the first soluble conductor 13 and the second heat conduction member 82B that directly transfers heat from the heat source 15 to the third soluble conductor 81.

In addition, when the heat conductive member 82 is the same as the heat conductive member 14 shown in FIG. 3, when a conductive member such as a heat pipe is used, at least the surface is preferably covered with an insulating material in order to seek insulation from the surroundings.

[1st~4th electrode]

The first and second electrodes 11 and 12 are the same as the temperature short-circuit element 1 described above. The third and fourth electrodes 83, 84 are similar to the first and second electrodes 11, 12, and are formed on the same plane by printing, firing, etc. of a high melting point metal paste on an insulating substrate such as alumina on. In addition, the third and fourth electrodes 83, 84 may also use wire rods or plate members made of refractory metals, etc. It is formed by being supported at a predetermined position.

The third and fourth electrodes 83 and 84 are opened by being arranged at predetermined intervals, and are usually electrically connected through the third fusible conductor 81. For the connection of the third and fourth electrodes 83 and 84 and the third fusible conductor 81, the bonding material 18 such as the above-mentioned connection solder can be used. The third and fourth electrodes 83 and 84 are actuated by the temperature switching element 80, and as shown in FIGS. 22(A) and (B), the third fusible conductor 81 is fused to block conduction. The third and fourth electrodes 83 and 84 are provided with external connection terminals 83a and 84a at one ends, respectively. The third and fourth electrodes 83 and 84 are connected to external circuits such as a power circuit or a digital signal circuit that are blocked by the operation of the temperature switching element 80 through these external connection terminals 83a and 84a. Since the temperature switching element 80 is blocked between the third and fourth electrodes 83 and 84, the current path of the external circuit or the functional circuit can be blocked.

[The third soluble conductor]

The third fusible conductor 81 is the same as the first fusible conductor 13, and any metal that rapidly melts due to the temperature environment of the temperature switching element 80 can be used. For example, Sn or SnBi-based solder or SnIn-based solder is very suitable, and Other low melting point metals such as lead-free solders with Sn as the main component.

In addition, the third fusible conductor 81 may contain a low melting point metal and a high melting point metal. For the low-melting-point metal and the high-melting-point metal, the same ones as those used for the first soluble conductor 13 described above can be used.

In addition, the third fusible conductor 81 is coated with flux 24 to prevent oxidation, improve wettability, and the like.

[Circuit configuration and application]

The temperature switching element 80 has a circuit configuration as shown in FIGS. 23(A) and (B). That is, in the state before the operation, the temperature switching element 80 is configured as a switch 2 in which the first electrode 11 and the second electrode 12 are in close proximity and separated and insulated, and the first fusible conductor 13 is melted and short-circuited. Also, Yu Wen The degree switching element 80 is connected between the third and fourth electrodes 83, 84 through the third fusible conductor 81, and is blocked by the melting of the third fusible conductor 81.

As shown in FIG. 24, the first and second electrodes 11, 12 are assembled in various external circuits 28A, such as a power supply circuit or a signal circuit, by being serially connected to the current path of the circuit board on which the temperature switching element 80 is constructed. Room 28B. Similarly, the third and fourth electrodes 83, 84 are also connected in series between various external circuits 85A, 85B such as a power circuit or a signal circuit by connecting in series on the current path of the circuit board on which the temperature switching element 80 is constructed .

The external circuits 28A and 28B are blocked by the opening between the first and second electrodes 11 and 12 before the temperature switching element 80 is actuated. The short circuit of the first and second electrodes 11 and 12 physically The irreversible short-circuit circuit may be, for example, in the case of abnormal heat generation of the electronic device in which the temperature switching element 80 is assembled, or in an emergency state such as a fire, start the cooling device and sprinkler equipment, etc., start the standby circuit , Alarms and other abnormal notification system operation, bypass current path construction and other functional circuits. Alternatively, the external circuits 28A, 28B may also be a network communication machine that bypasses the data server's communication signal path for hacking or code breaking, or activates general components or software.

In addition, the external circuits 85A and 85B are connected between the third and fourth electrodes 83 and 84 through the third fusible conductor 81 before the temperature switching element 80 is actuated. The third and fourth electrodes 83 and 84 The 84-interrupted, physical and irreversible interrupted circuit can be applied to any kind of electrical circuits such as battery packs and power circuits of electronic equipment, signal circuits, and Internet lines in network communication equipment.

The temperature switching element 80 reaches the melting point of the first and third fusible conductors 13, 81 due to heat from the external heat source 15 such as abnormal heat or fire accompanying element failure In the temperature environment, as shown in FIGS. 22(A) and (B), the first and third fusible conductors 13, 81 are heated and melted. According to this, in the temperature switching element 80, the molten conductor 13a condenses around the first electrode 11 and also contacts the adjacent second electrode 11, and the originally insulated first and second electrodes 11, 12 pass through the molten conductor 13a and Short circuit and connect external circuits 28A and 28B. In addition, in the temperature switching element 80, the third fusible conductor 81 is fused to block the conduction between the third and fourth electrodes 83, 84, and to block the external circuits 85A, 85B.

In addition, in the temperature switching element 80, the second fusible conductor 21 may be connected to the second electrode 12 in the same manner as the temperature short-circuit element 1, and the heat conducting member 82A may be continuous with the first and second electrodes 11, 12 and pass through the second The electrode 12 melts the second soluble conductor 21.

[Melting order]

In addition, in the temperature switching element 80, the short circuit between the external circuits 28A, 28B and the external circuit 85A, 85B can also be specified by specifying the melting order of the first soluble conductor 13 and the third soluble conductor 81. The order of occlusion.

That is, in the temperature switching element 80, the first fusible conductor 13 may be melted before the third fusible conductor 81, so that after the external circuits 28A and 28B are short-circuited, the external circuits 85A and 85B are blocked. According to this, for example, after starting between the external circuits 28A and 28B composed of the emergency power supply circuit or the standby circuit, the external circuit 85A and 85B composed of the general power supply circuit or the functional circuit can be blocked.

In addition, in the temperature switching element 80, the third soluble conductor 81 may be melted before the first soluble conductor 13 so as to short-circuit the external circuits 28A and 28B after blocking the external circuits 85A and 85B. According to this, for example, the external circuits 28A and 28B composed of the alarm system circuit can be activated after the space between the external circuits 85A and 85B composed of the power supply circuit is blocked.

The melting order of the first soluble conductor 13 and the third soluble conductor 81 can be specified by setting a melting point difference between the first soluble conductor 13 and the third soluble conductor 81. For example, when the first soluble conductor 13 is formed of SnIn-based solder and the third soluble conductor 81 is formed of SnBi-based solder, the melting point of the indium-tin alloy is 120°C and the melting point of the tin-bismuth alloy is 138°C, so the first The melting point of the soluble conductor 13 is lower than that of the third soluble conductor 81, and it can be melted first.

In addition, the melting order of the first soluble conductor 13 and the third soluble conductor 81 can also be specified by changing the cross-sectional area of the first soluble conductor 13 and the third soluble conductor 81. Since the cross-sectional area of the fusible conductor is too difficult to melt, it is only necessary to make the cross-sectional area of the molten conductor to be melted first and the cross-sectional area of the molten conductor to be melted later to be larger.

In addition, the melting order of the first soluble conductor 13 and the third soluble conductor 81 can also be specified by changing the path length or thickness of the heat conductive member 82 to cause a difference in thermal conductivity.

〔Surface configuration type〕

Moreover, the temperature switching element of the present invention can be applied to surface mounting on an external circuit board. As shown in FIGS. 25(A) and (B), the temperature switching element 80 formed as a surface structure has first to fourth electrodes 11, 12, 83, and 84 laminated on the surface 10a of the insulating substrate 10. The first soluble conductor 13 is supported on the first electrode 11 by a bonding material 18 for connecting solder or the like, overlaps the second electrode 12, and is supported by the first insulating layer 17 formed on the second electrode 12. According to this, in the temperature switching element 80, the first and second electrodes 11, 12 are opened. The third fusible conductor 81 is connected across the third and fourth electrodes 83 and 84 via the bonding material 18. FIG. 25(A) is a plan view of the surface mounting type temperature switching element 80, and FIG. 25(B) is a cross-sectional view taken along line A-A' in the same diagram (A).

For the insulating substrate 10, the same member as the insulating substrate 10 of the above-mentioned temperature short-circuit element 1 can be used, with an insulating material having excellent thermal conductivity such as a ceramic substrate, or an insulating material on the surface The use of a material-coated metal substrate has the function of a heat-conducting member 82 that transfers the heat of the external heat source 15 to the first and third fusible conductors 13, 81. The heat of the external heat source 15 is transmitted through the insulating substrate 10 to the first, third, and fourth electrodes 11, 83, 84, and directly through the bonding material 18 to the first and third fusible conductors 13, 81, and serves as a temperature switching element The radiant heat in 80 is indirectly transmitted to the first and third fusible conductors 13, 81. According to this, in the temperature switching element 80, that is, a temperature environment above the melting point of the first and third fusible conductors 13, 81 is created, so that the first and third fusible conductors 13, 81 can be melted.

The first to fourth electrodes 11, 12, 83, and 84 are conductor patterns formed on the surface 10a of the insulating substrate 10. In addition, the first to fourth electrodes 11, 12, 83, and 84 are connected to external connection terminals (not shown) formed on the back surface 10 b of the insulating substrate 10. The temperature switching element 80 is assembled in various external circuits such as a power supply circuit or a standby circuit through these external connection terminals.

The first to fourth electrodes 11, 12, 83, and 84 can be formed by patterning high-melting-point metal pastes such as Ag on the surface 10a of the insulating substrate 10 using screen printing technology, and then by firing or the like. In addition, the first to fourth electrodes 11, 12, 83, and 84 can be formed by using a material having excellent thermal conductivity, such as Ag, to have a heat conduction member that transfers the heat of the external heat source 15 to the first soluble conductor 13 82 features.

The first meltable conductor 13 formed in a plate shape with a first insulating layer 17 provided with an insulating material such as glass on the first and second electrodes 11 and 12 is carried across the first and second electrodes 11 and 12. The first and second electrodes 11 and 12 are separated from the first soluble conductor 13 by supporting the first soluble conductor 13 with the first insulating layer 17. In addition, a bonding material 18 for bonding solder or the like is provided on the first electrode 11, and the first soluble conductor 13 is connected through the bonding material 18.

In addition, on the third and fourth electrodes 83 and 84, a first insulating layer 17 is provided with an insulating material such as glass near the connection portion with the third fusible conductor 81.

The first insulating layer 17 is formed between the third and fourth electrodes 83 and 84 and each external connection terminal to prevent the outflow of the bonding material 18 and the molten conductor 81a. According to this, the first insulating layer 17 can prevent the molten conductor 81a from flowing out to each external connection terminal side, which affects the connection state with the external circuit.

In addition, the first and third fusible conductors 13 and 81 are coated with flux 24 to prevent oxidation and improve wettability. In addition, in the temperature switching element 80, the surface 10a of the insulating substrate 10 is covered with a covering member 25.

When the external heat source generates heat, as shown in FIGS. 26(A) and (B), the temperature switching element 80 passes through the insulating substrate 10 and the heat conduction members such as the first to fourth electrodes 11, 12, 83, 84, etc. 3. The third fusible conductors 13, 81 are heated and melted. In the temperature switching element 80, the molten conductor 13a condenses between the first and second electrodes 11, 12 to short-circuit the first and second electrodes 11, 12, and the third fusible conductor 81 melts. The third and fourth electrodes 83 and 84 are blocked.

Also, in the temperature switching element 80, as shown in FIG. 25, the first soluble conductor 13 may be extended to the opposite of the first electrode 11 and the second electrode 12, and the second electrode 12 and the first electrode 11 The opposite side. According to this, the temperature switching element 80 can increase the amount of the molten conductor 13a condensed between the first and second electrodes 11, 12 to reliably short-circuit it.

Furthermore, in the temperature switching element 80, it is preferable that the first fusible conductor 13 formed in a plate shape has a larger area than the connection area with the first electrode 11. In this way, the first soluble conductor 13 can secure a sufficient amount of molten conductor to short-circuit the first and second electrodes 11 and 12.

In addition, the temperature switching element 80 may be provided with the first support electrode 31 that supports the end of the first fusible conductor 13 supported by the first electrode 11 similarly to the temperature short-circuit element 30 described above.

[Temperature switching element 87]

Moreover, the temperature switching element to which the present invention is applied can be formed for surface mounting, and the support area of the first and second electrodes 11, 12 to the first soluble conductor 13 can be increased to prevent the first soluble conductor 13 from Deformation and prevent initial short circuit. In the following description, the same components as those of the above-mentioned temperature short-circuit elements 1, 30, 40, 50, 60, 70 and temperature switching element 80 are given the same symbols and detailed descriptions are omitted.

As shown in FIG. 27, this temperature switching element 87 includes an insulating substrate 10, first to fourth electrodes 11, 12, 83, 84 formed on the surface 10a of the insulating substrate 10, and first and second electrodes 11, 12 A first insulating layer 17 is formed on the surface 10a of the insulating substrate 10 to be stacked on the surface 10a of the insulating substrate 10 so as to expose the respective front end portions 11b and 12b of the first and second electrodes 11, 12. The 12-thick second insulating layer 51, the first soluble conductor 13 mounted on the first and second insulating layers 17, 51, and the third soluble conductor 81 connected between the third and fourth electrodes 83, 84 . Further, FIG. 27(A) is a plan view shown after removing the cover member 25 of the temperature switching element 87, and the same figure (B) is a cross-sectional view taken along line AA′ shown in the same figure (A), and the same figure (C ) Is a BB' cross-sectional view shown in the same figure (A).

The first and second electrodes 11 and 12 in the temperature switching element 87 are similar to the temperature short-circuit element 60 and are formed over a wide range in the longitudinal direction of the insulating substrate 10 formed in a rectangular shape and from both sides in the width direction of the insulating substrate 10 The edge is formed to the central portion, facing each other at a predetermined interval, and the first insulating layer 17 at the slightly central portion from the laminated layer is exposed to the front end portions 11b and 12b.

In addition, the first and second insulating layers 17, 51 in the temperature switching element 87 are formed in the same manner as the temperature short-circuit element 60, and each of the front end portions 11b, 12b facing the first and second electrodes 11, 12 is formed The slightly rectangular opening 61 is exposed.

The first fusible conductor 13 is mounted on the first and second insulating layers 17, 51 so as to cover the opening 61, and is fixed to the first electrode 11 through a bonding material 18 such as solder for bonding. Accordingly, the first fusible conductor 13 is supported by the first and second insulating layers 17 and 51 over the entire circumference to prevent deflection in the longitudinal direction and the width direction.

Therefore, according to the temperature switching element 87, it is possible to reliably prevent the first soluble conductor 13 from being bent during reflow soldering, and to prevent the first and second electrodes 11, which are caused by the deformation of the first soluble conductor 13, The initial short circuit between 12 short circuits.

In addition, the first fusible conductor 13 may replace the first electrode 11 or be fixed to the first insulating layer 17 and/or the second insulating layer 51 through the bonding material 18 in addition to the first electrode 11. The first fusible conductor 13 is fixed at a plurality of locations, and it is possible to prevent the positional deviation and the like from being stably maintained even in a temperature environment such as during reflow soldering.

Such a temperature switching element 87, when the first and third meltable conductors 13, 81 melt in a temperature environment above the melting point of the first and third meltable conductors 13, 81, the melted conductor 13a condenses in the opening Between the front end portions 11b and 12b of the first and second electrodes 11, 12 seen by the portion 61. According to this, in the temperature switching element 87, the molten conductor 13a condenses between the first and second electrodes 11, 12 and reliably short-circuits the first and second electrodes 11, 12. In addition, in the temperature switching element 87, the third and fourth electrodes 83 and 84 are blocked due to the melting of the third fusible conductor 81.

〔Temperature switching element 90〕

Furthermore, applying the temperature switching element of the present invention, the first soluble conductor 13 can be supported on the first electrode 11 and the second soluble conductor 21 can be supported on the second electrode 12. In the following description, the same configurations as the above-mentioned temperature short-circuit elements 1, 40, 50, 60, 70, and temperature switching element 80 are given the same symbols and detailed descriptions are omitted.

The temperature switching element 90 shown in FIG. 28 is similar to the temperature short-circuit element 40 described above. The first and second electrodes 11 and 12 are formed on the insulating substrate 10, and the first soluble conductor 13 is supported on the first electrode 11. The second soluble conductor 21 is supported on the second electrode 12. In the temperature switching element 90, the meltable conductors are independently supported by the first and second electrodes 11, 12 respectively, and are opened before the melting of the first and second meltable conductors 13, 21. The first to third fusible conductors 13, 21, and 81 have the same material and the same configuration, and melt in substantially the same temperature environment. In addition, the first to third fusible conductors 13, 21, and 81 are coated with a flux 24 to prevent oxidation and improve wettability.

In addition, the temperature switching element 90, like the above-mentioned temperature short-circuit element 40, can fix one end of the first fusible conductor 13 supported by the first electrode 11 to the insulating substrate 10 with a fixing member 42. One end of the second soluble conductor 21 supported by the two electrodes 12 is fixed to the insulating substrate 10 with a fixing member 42. In addition, the temperature switching element 90 may be provided with the second support electrode 43 on the insulating substrate 10 similar to the temperature short-circuit element 40 described above, and support the end portions of the first and second fusible conductors 13 and 21 through the bonding material 18.

The temperature switching element 90 melts the first to third meltable conductors 13, 21, 81 in a temperature environment above the melting point of the first to third meltable conductors 13, 21, 81. According to this, as shown in FIG. 29, in the temperature switching element 90, the molten conductor 13 a condenses on the first electrode 11, and the molten conductor 21 a condenses on the second electrode 12. According to this, the molten conductors 13a and 21a condense between the first and second electrodes 11, 12 and short-circuit between the first and second electrodes 11, 12. In addition, the third fusible conductor 81 melts, blocking the third and fourth electrodes 83, 84.

Moreover, it is preferable that the first and second soluble conductors 13 and 21 formed in a plate shape have a larger area than the connection area with the first and second electrodes 11 and 12, respectively. Accordingly, the first and second fusible conductors 13 and 21 can ensure a sufficient molten conductor that short-circuits the first and second electrodes 11 and 12 The amount.

〔Heat conduction path〕

In addition, the temperature switching element 90 is similar to the temperature switching element 80, and the short circuit between the external circuits 28A and 28B and the external circuit can be specified by specifying the melting order of the first soluble conductor 13 and the third soluble conductor 81. The sequence of interruption between circuits 85A and 85B. The melting order of the first soluble conductor 13 and the third soluble conductor 81 can be specified by providing a melting point difference between the first soluble conductor 13 and the third soluble conductor 81 or changing the cross-sectional area.

In addition, in the temperature switching element 90, the heat conduction path from the first electrode 11 to the first fusible conductor 13 functioning as the heat conduction member 82 and the third electrode 83 to third functioning as the heat conduction member 82 can also be changed The thermal conductivity of the heat conduction path of the fusible conductor 81 changes the melting order of the first fusible conductor 13 and the third fusible conductor 81.

That is, as shown in FIG. 30, in the temperature switching element 90, the first and second electrodes 11, 12 function as a heat conduction member that transfers heat from an external heat source to the first soluble conductor 13, and the third electrode 83 It functions as a heat conduction member that transfers heat from an external heat source to the third soluble conductor 81. At this time, for example, in the temperature switching element 90, the heat conduction paths P1 and P2 from the external heat source of the first and second electrodes 11, 12 are formed to be thin and long, and the heat conduction path P3 from the external heat source of the third electrode 83 is formed Formed thick and short.

Accordingly, the thermal conductivity of the heat conduction paths P1, P2 that transfer heat to the first soluble conductor 13 is relatively lower than the heat conduction path P3 that transfers heat to the third soluble conductor 81. According to this, in the temperature switching element 90, when the heat from the external heat source 15 becomes a temperature environment above the melting point of the first and third soluble conductors 13, 81, the heat will be transferred to the first soluble conductor 13 first. The third fusible conductor 81. Therefore, the temperature switching element 90 can first melt the third fusible conductor 81 to interrupt the external circuit After 85A and 85B, the first soluble conductor 13 is melted again to short-circuit the external circuits 28A and 28B.

In addition, in the temperature switching element 90, the first and second electrodes 11, 12 and the third electrode 83 may be formed of materials having different thermal conductivity, thereby changing the heat conduction paths P1, P2 and Thermal conductivity of thermal conduction path P3.

[Temperature switching element 97]

In addition, the temperature switching element to which the present invention is applied can be formed for surface mounting, and connect the second electrode 12 to the cover electrode provided on the cover member. In the following description, the same configurations as those of the above-mentioned temperature short-circuit elements 1, 30, 40, 50, 60, 70, and temperature switching elements 80, 90 are given the same symbols and detailed descriptions are omitted.

As shown in FIG. 31, the temperature switching element 97 has first to fourth electrodes 11, 12, 83, and 84 stacked on the surface 10a of the insulating substrate 10. The third fusible conductor 81 is connected across the third by the bonding material 18 , On the fourth electrodes 83, 84. In addition, the temperature switching element 97 is provided with a cover member 25 covering the surface of the insulating substrate 10, and the second electrode 12 is connected to the cover electrode 71 formed on the top surface 25b of the cover member 25 opposite to the first electrode 11 Thing. Further, FIG. 31(A) is a plan view showing the cover member 25 of the temperature switching element 97 before the melting of the first soluble conductor 13, and FIG. (B) is A- shown in FIG. (A). A'line cross-sectional view, the same figure (C) is a BB' line cross-sectional view shown in the same figure (A). 32 is a plan view of the cover member 25 of the temperature switching element 97 after the melting of the first soluble conductor 13 is removed, and the same figure (B) is the line AA' shown in the same figure (A) The cross-sectional view and the same drawing (C) are the BB' cross-sectional views shown in the same drawing (A).

In the cover member 25, a cover electrode 71 is formed from one side edge portion 25a to the top surface 25b of the cover member 25, which is mounted on the insulating substrate 10, and the cover electrode 71 is connected to the first 2electrode 12. In addition, the first and second electrodes 11 and 12 are separated from each other to be opened. In addition, the first and second electrodes 11 and 12 are connected to the external connection terminals 11 a and 12 a formed on the back surface 10 b of the insulating substrate 10. The temperature switching element 97 is assembled into various external circuits such as a power circuit through the external connection terminals 11a and 12a.

In addition, the cover electrode 71 faces the first electrode 11 formed on the insulating substrate 10, and the first soluble conductor 13 is arranged between the first electrode 11 and the first electrode 11. The first soluble conductor 13 is fixed to the first electrode 11 through the bonding material 18. In addition, the first soluble conductor 13 may be supported by the fixing member 42 or the first support electrode 31 and the second insulating layer 51 provided on the insulating substrate 10.

Such a temperature switching element 97, when the first and third meltable conductors 13, 81 are melted in a temperature environment above the melting point of the first and third meltable conductors 13, 81, as shown in FIG. 32, the melted conductor 13a condenses The first electrode 11 is also condensed on the cover electrode 71 where the top surface 25b and the first electrode 11 are opposed to each other. According to this, the temperature switching element 97 can short-circuit the first and second electrodes 11 and 12 through the molten conductor 13 a and the cover electrode 71. In addition, in the temperature switching element 97, the third fusible conductor 81 is fused, and the third and fourth electrodes 83 and 84 are blocked.

[Other components]

Furthermore, in each of the above-mentioned temperature short-circuit elements 1, 30, 40, 50, 60, 70 and temperature switching elements 80, 90, 97, a plate-shaped first fusible conductor 13 is formed to have An area of more than twice the connection area is preferred. In this way, the first fusible conductor 13 can secure a sufficient amount of the molten conductor 13a required to short-circuit the first electrode 11 and the second electrode 12 or the cover electrode 71, and support the end portion on the fixing member In the case of 42 or the first support electrode 31, it can be quickly fused.

In addition, in each of the above-mentioned temperature short-circuit elements 1, 30, 40, 50, 60, 70 and temperature switching elements 80, 90, 97, the first fusible conductor 13 may be formed of a wire, in this case, the first fusible conductor 13 preferably has a length that is at least twice the length of the connection with the first electrode 11. In this way, the first fusible conductor 13 can secure a sufficient amount of the molten conductor 13a required to short-circuit the first electrode 11 and the second electrode 12 or the cover electrode 71, and support the end portion on the fixing member In the case of 42 or the first support electrode 31, it can be quickly fused.

Further, in the above-mentioned temperature short-circuit elements 1, 30, 40, 50, 60, 70 and temperature switching elements 80, 90, 97, the interval between the first and second electrodes 11, 12 is such that The width of the first electrode 11 on the extension line of the electrode interval is preferably equal to or less than the width. For example, as shown in FIG. 1, in the temperature short-circuit element 1, the interval W ₁ between the first and second electrodes 11, 12 is preferably equal to or less than the width W ₂ of the first electrode 11 on the extension line of the interval between the first and second electrodes . In this way, the first and second electrodes 11 and 12 are arranged closer to each other, and when the molten conductor 13a of the first fusible conductor 13 condenses around the first electrode 11, it can also more reliably contact the first The two electrodes 12 condense the molten conductor 13a between the first and second electrodes 11, 12.

In addition, the first to fourth electrodes 11, 12, 83, 84, the first and second support electrodes 31 of the temperature short-circuit elements 1, 30, 40, 50, 60, 70 and the temperature switching elements 80, 90, 97 , 43 and the cover electrode 71 can be formed using common electrode materials such as Cu and Ag, and the surface is coated with Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating by known methods such as plating treatment It is better to wait for the coating. In this way, each temperature short-circuit element 1, 30, 40, 50, 60, 70 and temperature switching element 80, 90, 97 can prevent the first to fourth electrodes 11, 12, 83, 84, the first support electrode 31 and The oxidation of the cover electrode 71 reliably holds the first to third soluble conductors 13, 21, and 81. In addition, for temperature short-circuit elements 1, 30, 40, 50, 60, 70 and temperature switching elements 80, 90, 97 During reflow soldering, the bonding material 18 for connecting the first to third soluble conductors 13, 21, 81 or the like, or the outer layer of the first to third soluble conductors 13, 21, 81 is formed The low-melting-point metal melts to prevent the first to fourth electrodes 11, 12, 83, 84, the first and second support electrodes 31, 43, and the cover electrode 71 from being eroded (solder erosion).

[Composition of fusible conductor]

As described above, the first to third fusible conductors 13, 21, and 81 may contain low melting point metals and high melting point metals. In addition, in the following description, unless otherwise required, the first to third fusible conductors 13, 21, 81 are collectively referred to as "fusible conductors 13, 21, 81." As the low-melting-point metal, solders such as lead-free solder using Sn as a main component are preferable, and as the high-melting-point metal, Ag, Cu, or alloys having these main components are preferably used. At this time, as shown in FIGS. 33(A) and (B), the fusible conductors 13, 21, and 81 may be formed by providing a low-melting-point metal layer 92 as an inner layer and a high-melting-point metal layer 91 as an outer layer. In this case, the fusible conductors 13, 21, and 81 may be a structure in which the entire low-melting-point metal layer 92 is covered by the high-melting-point metal layer 91, or may be a structure except for a pair of opposing side surfaces.

The coating structure in which the low-melting-point metal layer 92 is covered with the high-melting-point metal layer 91 can be formed using a known film-forming technique such as plating. Among them, the electroplating method in which linear or strip-shaped low-melting-point metal materials can be continuously applied with high-melting-point metal plating is particularly advantageous in terms of operating efficiency and manufacturing cost.

In addition, the fusible conductors 13, 21, and 81 may be a fusible conductor provided with a low-melting-point metal layer 92 as an outer layer and a high-melting-point metal layer 91 as an inner layer. In this case, the fusible conductors 13, 21, and 81 may be a structure in which the entire high-melting-point metal layer 91 is covered by the low-melting-point metal layer 92, or may be a structure in which the opposite side surfaces are covered.

Furthermore, as shown in FIG. 34, the fusible conductors 13, 21, and 81 may have a laminated structure in which a high-melting-point metal layer 91 and a low-melting-point metal layer 92 are laminated.

In this case, the fusible conductors 13, 21, 81 may be formed as shown in FIG. 34(A) by being connected to the first to fourth electrodes 11, 12, 83, 84 or the first and second support electrodes 31 , 43 and other lower layers, and the two-layer structure composed of the upper layer deposited on the lower layer, the area layer above the high melting point metal layer 91 as the lower layer can be used as the upper layer low melting point metal layer 92, on the contrary, it can also be used as The area layer above the lower low-melting-point metal layer 92 serves as the upper high-melting-point metal layer 91. Alternatively, the fusible conductors 13, 21, and 81 may also be formed as a three-layer structure composed of an inner layer and a laminated layer above and below the inner layer as shown in FIG. 34(B). The upper and lower area layers of the high melting point metal layer 91 serve as the outer low melting point metal layer 92. Conversely, the upper and lower area layers of the high melting point metal layer 91 as the inner layer may also serve as the outer high melting point metal layer 91.

The laminated structure of the high-melting-point metal layer 91 and the low-melting-point metal layer 92 can be formed by a sheet-shaped low-melting-point metal material and a sheet-shaped high-melting-point metal material. For example, the build-up structure of the high-melting-point metal layer 91 above and below the low-melting-point metal layer 92 serving as the inner layer, as shown in FIG. 35, can be achieved by solder foil constituting the sheet-shaped low-melting-point metal layer 92. Above and below 92a, an Ag foil 91a that constitutes a sheet-shaped refractory metal layer 91 is laminated and formed by hot pressing or hot rolling at a predetermined temperature and pressure. The fusible conductors 13, 21, 81 composed of the laminated structure of the high-melting-point metal layer 91 and the low-melting-point metal layer 92 are the interfaces between the low-melting-point metal material and the high-melting-point metal material by stamping or rolling at a predetermined temperature and pressure Its alloying and integration. In addition, the fusible conductors 13, 21, 81 have a high-melting-point metal layer 91 deposited on the entire surface of the low-melting-point metal layer 92 with a slightly uniform thickness.

In addition, the laminated structure of the high melting point metal layer 91 and the low melting point metal layer 92 Alternatively, the metal material constituting the high-melting-point metal layer 91 may be laminated on the upper and lower surfaces of the solder foil 92a constituting the sheet-shaped low-melting-point metal layer 92 by a known thin film forming process such as evaporation or sputtering.

Further, as shown in FIG. 36, the fusible conductors 13, 21, and 81 have a multilayer structure in which four or more layers of a high melting point metal layer 91 and a low melting point metal layer 92 are alternately laminated. In this case, the fusible conductors 13, 21, and 81 may have a structure in which the metal layer constituting the outermost layer is covered on the entire surface, or except for a pair of opposing side surfaces.

In addition, the fusible conductors 13, 21, and 81 may be partially laminated on the surface of the low-melting-point metal layer 92 constituting the inner layer in a stripe shape. Fig. 37 is a plan view of the fusible conductors 13, 21, and 81.

In the soluble conductors 13, 21, and 81 shown in FIG. 37(A), a plurality of linear high-melting-point metal layers 91 are formed on the surface of the low-melting-point metal layer 92 at predetermined intervals in the width direction and in the long-side direction. The linear opening 93 is formed along the longitudinal direction, and the low-melting-point metal layer 92 is exposed from the opening 93. In the fusible conductors 13, 21, and 81, since the low-melting-point metal layer 92 is exposed from the opening 93, the contact area between the molten low-melting-point metal and the high-melting-point metal is increased, which can further promote the etching effect of the high-melting-point metal layer 91 to improve the fusing Sex. The opening 93 can be formed, for example, by plating a portion of the low-melting-point metal layer 92 to which the metal constituting the high-melting-point metal layer 91 is applied.

Moreover, as shown in FIG. 37(B), the fusible conductors 13, 21, and 81 can also be placed on the surface of the low-melting-point metal layer 92 at predetermined intervals in the long-side direction, and the linear high-melting-point metal layer 91 is placed across the width. A plurality of directions are formed, and a linear opening 93 is formed along the width direction.

In addition, as shown in FIG. 38, the fusible conductors 13, 21, and 81 can also form a high-melting-point metal layer 91 on the surface of the low-melting-point metal layer 92, and be formed on the entire surface of the high-melting-point metal layer 91 The circular opening 94 exposes the low-melting-point metal layer 92 from the opening 94. The opening 94 can be formed, for example, by applying a partial plating of the metal constituting the high-melting-point metal layer 91 to the low-melting-point metal layer 92.

The fusible conductors 13, 21, and 81 are exposed from the opening 94 through the low melting point metal layer 92, which can increase the contact area between the molten low melting point metal and the high melting point metal, and further promote the etching effect of the high melting point metal to improve the fuseability .

Further, as shown in FIG. 39, the fusible conductors 13, 21, and 81 may be formed with a plurality of openings 95 in the high-melting-point metal layer 91 as the inner layer, and the high-melting-point metal layer 91 may be formed using a plating technique or the like. The low-melting-point metal layer 92 is filled in the opening 95. In this way, the area of the fusible conductors 13, 21, and 81 that the molten low-melting-point metal contacts the high-melting-point metal is large, so that the high-melting-point metal can be eroded by the low-melting-point metal in a shorter time.

In addition, it is preferable that the fusible conductors 13, 21, and 81 have the volume of the low-melting-point metal layer 92 formed as the volume of the higher-melting-point metal layer 91 be larger. The fusible conductors 13, 21, 81 are heated in a temperature environment above the melting point, and the high melting point metal is eroded by the melting of the low melting point metal, so that it can be quickly melted and melted. Therefore, in the fusible conductors 13, 21, 81, the volume of the low-melting-point metal layer 92 is formed to be larger than that of the higher-melting-point metal layer 91, which can promote this ablation effect, and quickly make the first and second electrodes 11, 12 short circuits.

In addition, the fusible conductors 13, 21, and 81 may be provided with an oxidation prevention film such as a CuO film or an Au film on the surface in order to prevent deterioration of the fusing characteristics due to oxidation.

1‧‧‧Temperature short-circuit element

2‧‧‧switch

11‧‧‧1st electrode

11a‧‧‧External connection terminal

12‧‧‧ 2nd electrode

12a‧‧‧External connection terminal

13‧‧‧The first soluble conductor

14‧‧‧Heat conduction component

15‧‧‧heat source

17‧‧‧The first insulating layer

18‧‧‧joining material

24‧‧‧flux

W ₁ ‧‧‧ Interval between the first and second electrodes 11, 12

W ₂ ‧‧‧Width of the first electrode 11

Claims (68)

A temperature short-circuit element comprising: a first electrode; a second electrode provided adjacent to the first electrode; and a first fusible conductor, which is condensed between the first and second electrodes by melting to cause the first 1. The second electrode is short-circuited; and a first insulating layer is provided on at least a part of the second electrode; by the first fusible conductor overlapping the second electrode and supported by the first insulating layer, the first 2. The second electrode is open; in a temperature environment above the melting point of the first soluble conductor, the first soluble conductor melts. A temperature short-circuit element comprising: a first electrode; a second electrode provided adjacent to the first electrode; and a first fusible conductor, which is condensed between the first and second electrodes by melting to cause the first 1. The second electrode is short-circuited; and has an insulating substrate; the first and second electrodes are conductor patterns formed on the insulating substrate; and the insulating substrate is provided with a second thickness thicker than the first and second electrodes An insulating layer; by the first soluble conductor overlapping the first and second electrodes and being supported by the second insulating layer, the first and second electrodes are open; above the melting point of the first soluble conductor In the temperature environment, the first fusible conductor melts. If the temperature short-circuit element of patent application item 1 or 2 has the conduction from the heat source The thermally conductive member; the thermally conductive member is continuous with the first electrode or the first fusible conductor. For example, the temperature short-circuit element of the patent application item 3, wherein at least the surface of the heat conducting member is an insulating material. For example, in the temperature short-circuit element of claim 1 or 2, the first fusible conductor is supported by the first electrode. For example, the temperature short-circuit element of the first patent application includes an insulating substrate; the first and second electrodes are conductor patterns formed on the insulating substrate. For example, the temperature short-circuit element of claim 6, wherein a second insulating layer having a thickness thicker than the first and second electrodes is provided on the insulating substrate; by the first fusible conductor and the first and second The second electrode overlaps and is supported by the second insulating layer, and the first and second electrodes are open. For example, the temperature short-circuit element according to item 2 of the patent application, wherein the first insulating layer is laminated on the first and second electrodes, and is provided with openings exposing the front ends of the first and second electrodes facing each other; The first fusible conductive system is mounted on the first and second insulating layers so as to cover the opening. For example, the temperature short-circuit element according to item 1 or 2 of the patent application is provided with a first supporting electrode supporting the first fusible conductor. For example, the temperature short-circuit element of claim 1 or 2 has a covering member covering at least the first fusible conductor. A temperature short-circuit element as claimed in item 10 of the patent application, wherein the top surface of the covering member is internally provided to overlap the first electrode and the first fusible conductor and is connected to the second electrode The cover electrode is continued; in a temperature environment above the melting point of the first soluble conductor, the first soluble conductor melts, and the first and second electrodes are short-circuited through the cover electrode. According to the temperature short-circuit element of claim 2 or 6, the insulating substrate, the first electrode, or the outer casing are heat-conducting members that transfer heat from a heat source to the first fusible conductor. For example, the temperature short-circuit element of the patent application item 2 or 6, wherein the insulating substrate is a ceramic substrate or a metal substrate with an insulating coating on the surface. For example, the temperature short-circuit element of the second or sixth patent application includes a second fusible conductor connected to the second electrode. For example, in the temperature short-circuit element of claim 5, the first fusible conductor has a larger area than the connection area with the first electrode. A temperature short-circuit element as claimed in item 2 of the patent application, wherein the first fusible conductor, a portion other than the connection portion with the first electrode is connected to at least the insulating substrate or the second insulating layer by a fixing member Either is fixed. For example, the temperature short-circuit element of the patent application item 14, wherein the second fusible conductor has a larger area than the connection area with the second electrode. For example, the temperature short-circuit element of the patent application item 14 is provided with a second support electrode supporting the first and second fusible conductors. A temperature short-circuit element as claimed in item 14 of the patent application, wherein the second fusible conductor is fixed to at least the insulating substrate by a fixing member at a portion other than the connection portion with the second electrode. For example, the temperature short-circuit component of the patent application item 1 or 2, in which the first meltable At least a part of the conductor is coated with flux. For example, the temperature short-circuit element of the patent application scope item 1 or 2, wherein the first fusible conductor has a low melting point metal and a high melting point metal. For example, in the temperature short-circuit element of claim 21, in the first fusible conductive system, a laminate of the low melting point metal and the high melting point metal. For example, in the temperature short-circuit element of claim 21, the surface of the low-melting-point metal of the first fusible conduction system is coated with the high-melting-point metal. For example, the temperature short-circuit element of claim 21, wherein the low-melting-point metal-based solder, the high-melting-point metal-based Ag, Cu, or an alloy mainly composed of Ag or Cu. For example, the temperature short-circuit element of patent application item 24, wherein the low melting point metal is Sn or an alloy mainly composed of Sn. For example, the temperature short-circuit element of claim 24, wherein the low-melting-point metal is SnBi-based or SnIn-based low-melting-point alloy. For example, the temperature short-circuit element of claim 21, wherein the volume of the low melting point metal is larger than that of the high melting point metal. A temperature short-circuit element as claimed in item 21 of the patent application, wherein the high melting point metal is formed by plating on the surface of the low melting point metal. As for the temperature short-circuit element of claim 21, the high melting point metal is formed by bonding a metal foil to the surface of the low melting point metal. For example, the temperature short-circuit element of claim 21, wherein the high melting point metal is formed by performing a thin film forming process on the surface of the low melting point metal. For example, the temperature short-circuit element of patent application scope item 21, in which the high melting point metal An oxidation prevention film is further formed on the surface. For example, the temperature short-circuit element of claim 21, wherein the low melting point metal and the high melting point metal are alternately stacked in multiple layers. A temperature short-circuit element as claimed in item 21 of the patent application range, in which the periphery of the low-melting-point metal except for the opposite end faces is covered with the high-melting-point metal. A temperature switching element comprising: a first electrode; a second electrode provided adjacent to the first electrode: a first fusible conductor, which is condensed between the first and second electrodes by melting to cause the first electrode , The second electrode is short-circuited; the third electrode and the fourth electrode; and the third fusible conductor is connected across the third and fourth electrodes, and the third and fourth electrodes are interrupted by melting; At least a part of the 2 electrodes is provided with a first insulating layer; by the first fusible conductor overlapping with the second electrode and supported by the first insulating layer, the first and second electrodes are open; in the first 1. In a temperature environment above the melting point of the third meltable conductor, the first and third meltable conductors melt. A temperature switching element comprising: a first electrode; a second electrode provided adjacent to the first electrode: a first fusible conductor, which is condensed between the first and second electrodes by melting to cause the first electrode , Section Short circuit of 2 electrodes; 3rd electrode and 4th electrode; 3rd fusible conductor connected across the 3rd and 4th electrodes, blocking the 3rd and 4th electrodes by melting; and an insulating substrate; and the first The first to fourth electrodes are conductor patterns formed on the insulating substrate; a second insulating layer with a thickness thicker than the first and second electrodes is provided on the insulating substrate; by the first fusible conductor and the first 1. The second electrode overlaps and is supported by the second insulating layer, the first and second electrodes are open; in a temperature environment above the melting point of the first and third fusible conductors, the first and third electrodes The fusible conductor melts. For example, the temperature switching element of claim 34 or 35 includes a heat conduction member that conducts heat from a heat source; the heat conduction member, the first electrode or the first fusible conductor, and the third electrode or the first 3 The fusible conductor is continuous. For example, the temperature switching element of the 36th range of the patent application, wherein at least the surface of the heat conducting member is an insulating material. A temperature switching element according to claim 34 or 35, wherein the first fusible conductor is supported by the first electrode. For example, the temperature short-circuit element of patent application item 34 has an insulating substrate; the first to fourth electrodes are conductor patterns formed on the insulating substrate. For example, the temperature switching element of patent application scope item 39, in which the insulating substrate A second insulating layer thicker than the first and second electrodes is provided; by the first fusible conductor overlapping the first and second electrodes and supported by the second insulating layer, the first and first 2 The electrode is open. For example, in the temperature switching element of claim 35, the first insulating layer is laminated on the first and second electrodes, and an opening is provided to expose the front end portions of the first and second electrodes facing each other; The first fusible conductive system is mounted on the first and second insulating layers so as to cover the opening. For example, the temperature switching element of claim 34 or 35 is provided with a first support electrode that supports the first fusible conductor. For example, the temperature switching element of claim 34 or 35 has a covering member covering at least the first fusible conductor. A temperature switching element as claimed in item 43 of the patent application, wherein the top surface of the cover member is provided with a cover electrode which overlaps the first electrode and the first fusible conductor and is continuous with the second electrode ; In a temperature environment above the melting point of the first fusible conductor, the first fusible conductor melts, and the first and second electrodes are short-circuited through the covering electrode. For example, the temperature switching element of claim 35 or 39, wherein the insulating substrate, the first electrode, the third electrode, or the outer casing are for transferring heat from a heat source to the first soluble conductor and/ Or the thermally conductive member of the third fusible conductor. For example, the temperature switching element of patent application item 35 or 39, wherein the insulating substrate is a ceramic substrate or a metal substrate with an insulating coating on the surface. For example, if the temperature switching element of the patent application item 35 or 39, it has the The second fusible conductor of the electrode. For example, in the temperature switching element of claim 38, the first fusible conductor has a larger area than the connection area with the first electrode. A temperature switching element as claimed in item 35 of the patent scope, wherein the first fusible conductor, a portion other than the connection portion with the first electrode is fixed by the fixing member, and at least the insulating substrate or the second insulating layer Either is fixed. For example, in the temperature switching element of claim 47, the second fusible conductor has a larger area than the connection area with the second electrode. For example, the temperature switching element of the 47th range of the patent application is provided with a second supporting electrode supporting the first and second fusible conductors. The temperature switching element according to any one of claims 47, wherein the second fusible conductor is fixed to at least the insulating substrate by a fixing member at a portion other than the connection portion with the second electrode. For example, in the temperature switching element of claim 34 or 35, at least a part of the first soluble conductor and the third soluble conductor are coated with flux. For example, the temperature switching element of claim 34 or 35, wherein the first fusible conductor and the third fusible conductor have a low melting point metal and a high melting point metal. For example, in the temperature switching element of the patent application scope item 54, the first soluble conductor and the third soluble conductor are laminates of the low melting point metal and the high melting point metal. For example, in the temperature switching element according to claim 54 of the patent application range, the first and third meltable conductors are coated structures in which the surface of the low-melting-point metal is coated with the high-melting-point metal. For example, the temperature switching element of claim 54 of the patent application, wherein the low-melting-point metal-based solder, the high-melting-point metal-based Ag, Cu, or an alloy mainly composed of Ag or Cu. For example, the temperature switching element of the 57th range of the patent application, in which the low melting point metal is Sn or an alloy mainly composed of Sn. For example, the temperature switching element of the 57th range of the patent application, wherein the low-melting-point metal is SnBi-based or SnIn-based low-melting-point alloy. For example, the temperature switching element of the 54th patent application, wherein the volume of the low melting point metal is larger than that of the high melting point metal. A temperature switching element as claimed in item 54 of the patent application, wherein the high melting point metal is formed by plating on the surface of the low melting point metal. For example, in the temperature switching element of patent application range 54, the high melting point metal is formed by bonding a metal foil to the surface of the low melting point metal. For example, in the temperature switching element according to claim 54, the high melting point metal is formed by performing a thin film forming process on the surface of the low melting point metal. For example, in the temperature switching element of patent application scope item 54, an oxidation prevention film is further formed on the surface of the high melting point metal. For example, the temperature switching element of the patent application item 54, wherein the low melting point metal and the high melting point metal are alternately stacked in multiple layers. For example, in the temperature switching element according to claim 54 of the patent application range, the periphery of the low-melting-point metal except for the two opposite end faces is covered with the high-melting-point metal. For example, the temperature switching element of claim 34 or 35, in which one of the first fusible conductor and the third fusible conductor has a lower melting point than the other, and the fusible conductor on the other side After melting, the fusible conductor on the other side melts. A temperature switching element according to claim 34 or 35, wherein the heat conduction path from the first electrode functioning as a heat conduction member to the first fusible conductor, and the third function functioning as a heat conduction member The heat conduction path from the electrode to the third fusible conductor, one of which has a higher thermal conductivity than the other, after the one of the fusible conductors connected to the heat conduction path of the one is melted, the other is connected to the heat conduction path of the other The fusible conductor melts.

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