CN105575727A

CN105575727A - Temperature short circuit element and temperature switch element

Info

Publication number: CN105575727A
Application number: CN201510469841.1A
Authority: CN
Inventors: 米田吉弘
Original assignee: Dexerials Corp
Current assignee: Dexerials Corp
Priority date: 2014-08-04
Filing date: 2015-08-04
Publication date: 2016-05-11
Anticipated expiration: 2035-08-04
Also published as: HK1222039A1; TW201612938A; KR20160016718A; CN105575727B; JP6411123B2; JP2016035882A; KR102476501B1; TWI683335B

Abstract

The invention provides a temperature short circuit element and a temperature switch element. Provided is a temperature short circuit element which can be operated in a temperature atmosphere of more than melting point of a fusible conductor, without having a heating element. A temperature short circuit element comprises a first electrode (11), a second electrode (12) adjacent to the first electrode (11), and a first fusible conductor (13) which is molten to condense between the first and second electrodes (11,12) and short-circuits the first and second electrodes (11,12). The first and second electrodes (11,12) are short-circuited by melting the first fusible conductor (13) under the temperature atmosphere of more than melting point.

Description

Temperature short-circuit component, temperature switching device

Technical field

The present invention relates to and according to temperature atmosphere, fusible conductor melted and make physics between the terminal of open state and the temperature short-circuit component of electrical short, and make physics between the terminal of open state and electrical short and by physics between the terminal of connection status and the temperature switching device electrically blocked.

Background technology

Through the most of secondary cell that can recycle that charges, be processed to battery pack and be supplied to user.Particularly in the lithium rechargeable battery that gravimetric energy density is high; in order to ensure the safety of user and electronic equipment; generally in a lot of protective circuits of the built-in additives for overcharge protection of battery pack, over etc., there is the function of the output blocking battery pack when set.

In this protection component, have and utilize the FET switch being built in battery pack to carry out the conduction and cut-off (ON/OFF) exported, thus carry out the additives for overcharge protection of battery pack or the element of over action.But; output voltage is abnormal when because of some reason, FET switch is shorted destruction, when being applied in lightning surge etc. and flowing through instantaneous big current or because of the life-span of battery unit when reducing or export excessive abnormal voltage or battery unit on the contrary voltage deviation becomes large separately; battery pack, electronic equipment all must be protected, and to avoid accident on fire etc.Therefore, in order to also block the output of battery unit in any abnormality can supposed so safely, use by having the protection component formed by the fuse element of the function of the signal cutout current path from outside.

As the protection component of the protective circuit towards lithium rechargeable battery etc.; as recorded at patent documentation 1; current path connects fusible conductor throughout between the 1st electrode, heater extraction electrode, the 2nd electrode; thus form a part for current path; make the fusible conductor on this current path utilize overcurrent carry out spontaneous heating and fuse, or by be located at protection component inside heater energising, making it to generate heat fuses.In such protection component, being connected on the conductor layer of heater by making the liquid fusible conductor of fusing concentrate on, making to be separated and cut-off current path between the 1st, the 2nd electrode.

Prior art document

Patent documentation

Patent documentation 1: Japanese Unexamined Patent Publication 2010-003665 publication

Patent documentation 2: Japanese Unexamined Patent Publication 2004-185960 publication

Patent documentation 3: Japanese Unexamined Patent Publication 2012-003878 publication.

Summary of the invention

The problem that invention will solve

In addition, in recent years, use the HEV(hybrid electric vehicle of battery and motor: HybridElectricVehicle), EV(electric automobile: ElectricVehicle) popularized rapidly.As the power source of HEV, EV, for energy density and output characteristic many uses lithium rechargeable battery.Such as, in mobile applications, need high voltage, big current.Therefore, develop the special cell that can bear high voltage, big current, but in most cases, connect multiple battery unit by series, parallel because of the problem in manufacturing cost, thus use GU Generic Unit to guarantee required electric current and voltage.

At this, in the automobile in high-speed mobile etc., actuating force sharply declines, anxious stopping adventurous situation on the contrary, seeks battery management when supposing very.Such as, when there is the exception of battery system under steam, can supply the actuating force for moving to actuating force till repairing factory or harbor or hazard warning light, idle call, be desirable concerning avoidance is dangerous.

But; in the battery pack that multiple battery cells in series as described in Patent Document 1 connect; as only arranged protection component on discharge and recharge path; if occur abnormal in a part for battery unit thus make protection component work; then can block the discharge and recharge path of battery pack entirety, again can not supply electric power.

Therefore, in order to only get rid of the battery unit of the exception in the battery pack that is made up of multiple unit, and effectively applying flexibly normal battery unit, proposing the short-circuit component that can be formed and only the battery unit of exception be carried out to the bypass path of bypass.

A structure example of short-circuit component shown in Figure 40, is suitable for the circuit diagram of the battery circuit of short-circuit component shown in Figure 41.This short-circuit component 100, as shown in Figure 40 and Figure 41, has: be connected in parallel with battery unit 101 on discharge and recharge path, and when normal, be in the 1st, the 2nd open short-circuiting electrode 102,103; Two fusible conductors 104a, 104b of 102,103 short circuits of the 1st, the 2nd short-circuiting electrode are made by melting; And be connected in series and the heater 105 that fusible conductor 104a, 104b are melted with fusible conductor 104a.

The external connecting electrode 111 that short-circuit component 100 is formed with heater 105 and is connected with one end of heater 105 on the insulated substrate 110 of ceramic substrate etc.In addition, short-circuit component 100 across the insulating barrier 112 of glass etc. be formed on heater 105 connect with the other end of heater 105 heater electrode 113, the 1st, the 2nd short-circuiting electrode 102,103 and support the 1st, the 2nd support electrode 114,115 of fusible conductor 104a, 104b together with the 1st, the 2nd short-circuiting electrode 102,103.

1st support electrode 114 is connected with the heater electrode 113 exposed on insulating barrier 112, in addition, adjoins with the 1st short-circuiting electrode 102.1st support electrode 114 supports the both sides of a fusible conductor 104a together with the 1st short-circuiting electrode 102.Similarly, the 2nd support electrode 115 and the 2nd short-circuiting electrode 103 adjoin, and support the both sides of another fusible conductor 104b together with the 2nd short-circuiting electrode 103.

In short-circuit component 100, form from external connecting electrode 111 via heater 105, heater electrode 113, fusible conductor 104a and arrive the 1st short-circuiting electrode 102, supply path to heater 105.

Heater 105 flows through and spontaneous heating via this supply path because of electric current, and fusible conductor 104a, 104b utilize this heat (Joule heat) to melt.As shown in figure 41, heater 105 is connected with the current controling element 106 of FET etc. via external connecting electrode 111.Current controling element 106 controls like this, that is, when the normal limit of battery unit 101 is to the power supply of heater 105, make electric current flow into heater 105 via charge-discharge circuit footpath when exception.

Use the battery circuit of short-circuit component 100, if abnormal voltage etc. to be detected in battery unit 101, then block this battery unit 101 by protection component 107 from discharge and recharge path, and current controling element 106 is worked, make electric current flow into heater 105.Thus, fusible conductor 104a, 104b fusing because of the heat of heater 105.Fusible conductor 104a, 104b bias is to relatively large-area 1st, the 2nd short-circuiting electrode 102,103 rear flank fusing, and fusing conductor condenses, combines throughout between two short-circuiting electrodes 102,103.Therefore, short-circuiting electrode 102,103 is by the fusing conductor short circuit of fusible conductor 104a, 104b, thereby, it is possible to the current path of bypass is carried out in formation to battery unit 101.

In addition, in short-circuit component 100, because fusible conductor 104a moves to the 1st short-circuiting electrode 102 side and melts and open between the 1st support electrode 114 and the 1st short-circuiting electrode 102, block the supply path to heater 105 thus, therefore stop the heating of heater 105.

In order to make such short-circuit component work, needing to arrange fusible conductor at element internal and become the heater of the thermal source that fusible conductor is melted, and short-circuit component being connected on the electrical path to heater.In addition, need to arrange on electrical path the control element controlled the energising of heater, when battery unit is in abnormal voltage etc., when meeting set condition of work, heater is energized.

At this, if heat from the thermal source of element-external can be utilized to melt fusible conductor, then without the need to arranging heater in short-circuit component, the simplification of miniaturization, manufacturing process can be sought, also need the current controling element carrying out controlling the energising of heater in addition, what can be suitable for is widely used.And, can also avoid generating heat this situation because controlling the heater to the fault of the current controling element of the energising of heater.

Therefore, the object of the invention is to provide and does not possess heater and the temperature short-circuit component worked in the temperature atmosphere enabled more than the fusing point of fusible conductor and temperature switching device.

For solving the scheme of problem

In order to solve above-mentioned problem, temperature short-circuit component involved in the present invention possesses: the 1st electrode; 2nd electrode, with above-mentioned 1st electrode adjacent arrange; And the 1st fusible conductor, condensed throughout between above-mentioned 1st, the 2nd electrode by fusing and make above-mentioned 1st, the 2nd electric pole short circuit, melting in the temperature atmosphere of above-mentioned 1st fusible conductor more than the fusing point of above-mentioned 1st fusible conductor.

In addition, temperature switching device involved in the present invention possesses: the 1st electrode; 2nd electrode, with above-mentioned 1st electrode adjacent arrange; 1st fusible conductor, is condensed by fusing and makes above-mentioned 1st, the 2nd electric pole short circuit throughout between above-mentioned 1st, the 2nd electrode; 3rd electrode and the 4th electrode; And the 3rd fusible conductor, connect across above-mentioned 3rd, the 4th electrode, and block by melting between above-mentioned 3rd, the 4th electrode, melt in the temperature atmosphere of above-mentioned 1st, the 3rd fusible conductor more than the fusing point of above-mentioned 1st, the 3rd fusible conductor.

Invention effect

According to the present invention, fusible conductor melts because of temperature atmosphere more than fusing point, fusing conductor by condense surrounding in the 1st electrode and also with adjacent 1st electrode and the 2nd electrode contact that configures, the 1st, the 2nd inter-electrode short-circuit can be made.In addition, according to the present invention, fusible conductor melts because of temperature atmosphere more than fusing point, can make to block between the 3rd, the 4th electrode.

Accompanying drawing explanation

Fig. 1 is the figure that the structure being suitable for temperature short-circuit component of the present invention is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Fig. 2 is the figure of the temperature short-circuit component after the 1st fusible conductor fusing is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Fig. 3 is the figure that the structure being suitable for temperature short-circuit component of the present invention is shown, (A) is plane graph, and (B) is A-A ' sectional view, and (C) is the stereoscopic figure of the temperature short-circuit component possessing heat transfer component.

Fig. 4 is the figure of the circuit structure example that temperature short-circuit component is shown.

Fig. 5 illustrates that the switch of temperature short-circuit component represents the figure of the circuit structure example of conducting state.

Fig. 6 is the figure of the structure that the temperature short-circuit component possessing the 2nd fusible conductor is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Fig. 7 is the figure of the temperature short-circuit component after the 1st fusible conductor and the fusing of the 2nd fusible conductor are shown, (A) is plane graph, and (B) is A-A ' sectional view.

Fig. 8 is the figure of the structure of the temperature short-circuit component that surface installing type is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Fig. 9 is the figure of structure of the temperature short-circuit component of surface installing type after the 1st fusible conductor fusing is shown, and (A) is plane graph, and (B) is A-A ' sectional view.

Figure 10 is the figure of the structure that the temperature short-circuit component possessing the 1st support electrode is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 11 is the figure of state after the 1st fusible conductor fusing that the temperature short-circuit component possessing the 1st support electrode is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 12 is the figure of the structure that the temperature short-circuit component possessing the 1st, the 2nd fusible conductor is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 13 is the figure of structure of the temperature short-circuit component after the 1st, the 2nd fusible conductor fusing is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 14 is the sectional view of the structure that the 2nd support electrode possessing the 1st, the 2nd fusible conductor and support the 1st, the 2nd fusible conductor is shown, before (A) illustrates fusing, after (B) illustrates fusing.

Figure 15 is the sectional view of the structure that the temperature short-circuit component utilizing the 2nd insulation layer supports the 1st fusible conductor is shown, before (A) illustrates the fusing of the 1st fusible conductor, after (B) illustrates the fusing of the 1st fusible conductor.

Figure 16 is the figure of the structure that the temperature short-circuit component utilizing the 1st, the 2nd insulation layer supports the 1st fusible conductor is shown, (A) is plane graph, and (B) is A-A ' sectional view, and (C) is B-B ' sectional view.

Figure 17 is removing cover and the 1st fusible conductor and the plane graph of the temperature short-circuit component shown in Figure 16 is shown.

Figure 18 is the figure of the state illustrated in the temperature short-circuit component shown in Figure 16 after the 1st fusible conductor fusing, and (A) is plane graph, and (B) is A-A ' sectional view, and (C) is B-B ' sectional view.

Figure 19 is the figure that the temperature short-circuit component possessing cap electrode is shown, (A) is plane graph, and (B) is A-A ' sectional view, and (C) is B-B ' sectional view.

Figure 20 is the figure of the state illustrated in the temperature short-circuit component shown in Figure 19 after the 1st fusible conductor fusing, and (A) is plane graph, and (B) is A-A ' sectional view, and (C) is B-B ' sectional view.

Figure 21 is the figure that the structure being suitable for temperature switching device of the present invention is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 22 is the figure of the temperature switching device after the 1st, the 3rd fusible conductor fusing is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 23 is the figure of the circuit structure example that temperature switching device is shown, before (A) illustrates the fusing of the 1st, the 2nd fusible conductor, after (B) illustrates the fusing of the 1st, the 2nd fusible conductor.

Figure 24 is the figure of the circuit structure example that the temperature switching device be connected with external circuit is shown.

Figure 25 is the figure of the structure of the temperature switching device that surface installing type is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 26 is the figure of structure of the temperature switching device of surface installing type after the 1st, the 3rd fusible conductor fusing is shown, and (A) is plane graph, and (B) is A-A ' sectional view.

Figure 27 illustrates the figure utilizing the 1st, the 2nd insulating barrier to support the structure of the temperature switching device of the 1st fusible conductor, and (A) is plane graph, and (B) is A-A ' sectional view, and (C) is B-B ' sectional view.

Figure 28 is the figure of the structure that the temperature switching device possessing the 1st ~ 3rd fusible conductor is shown, (A) is plane graph, and (B) is A-A ' sectional view.

Figure 29 is the figure of the state illustrated in the temperature switching device shown in Figure 28 after the 1st, the 3rd fusible conductor fusing, and (A) is plane graph, and (B) is A-A ' sectional view.

Figure 30 is the plane graph of the temperature switching device of the pyroconductivity that the heat conduction path of change the 1st, the 2nd electrode and the heat conduction path of the 3rd electrode are shown.

Figure 31 is the figure that the temperature switching device possessing cap electrode is shown, (A) is plane graph, and (B) is A-A ' sectional view, and (C) is B-B ' sectional view.

Figure 32 is the figure of the state illustrated in the temperature short-circuit component shown in Figure 31 after the 1st, the 3rd fusible conductor fusing, and (A) is plane graph, and (B) is A-A ' sectional view, and (C) is B-B ' sectional view.

Figure 33 illustrates that low-melting-point metal layer is covered in the figure of the structure example of the fusible conductor of high melting point metal layer, (A) be long ruler-like is shown, (B) be the stereogram of the fusible conductor that wire is shown.

Figure 34 is the figure of the structure example of the fusible conductor that stacked low-melting-point metal layer and high melting point metal layer are shown, (A) be 2 Rotating fields are shown, (B) be the stereogram of the fusible conductor that 3-tier architecture is shown.

Figure 35 is the stereogram of the manufacturing process of the fusible conductor that stepped construction is shown.

Figure 36 is the sectional view that the fusible conductor that the sandwich construction of more than 4 layers manufactures with low-melting-point metal layer and high melting point metal layer repetition is shown.

Figure 37 is the figure of the fusible conductor that the peristome being provided with striated is shown, (A) is the plane graph that the fusible conductor that peristome is arranged along its length is shown, (B) is the plane graph that the fusible conductor that peristome broad ways is arranged is shown.

Figure 38 is the plane graph that the fusible conductor being provided with circular peristome is shown.

Figure 39 illustrates the plane graph being provided with the fusible conductor of the peristome of the circle of filling low-melting-point metal at the high melting point metal layer of internal layer.

Figure 40 is the plane graph of the short-circuit component illustrated involved by reference example.

Figure 41 is the circuit diagram of the battery pack of the short-circuit component loaded involved by reference example.

Embodiment

Below, with reference to accompanying drawing, applicable temperature short-circuit component of the present invention and temperature switching device are described in detail.In addition, the present invention is not only defined in following execution mode, obviously can carry out various change without departing from the gist of the present invention.In addition, accompanying drawing is schematic, and the ratio etc. of each size has the situation being different from reality.Concrete sizes etc. should judge with reference to the following description.In addition, be to be understood that accompanying drawing also comprises the relation of size each other or the different part of ratio each other.

[temperature short-circuit component 1]

Be suitable for temperature short-circuit component 1 of the present invention as shown in Fig. 1 (A) (B), possess: the 1st electrode 11; The 2nd electrode 12 arranged adjacently with the 1st electrode 11; And to be condensed throughout between the 1st, the 2nd electrode 11,12 by fusing and to make the 1st fusible conductor 13 of the 1st, the 2nd electrode 11,12 short circuit.And, temperature short-circuit component 1 is as shown in Fig. 2 (A) (B), without the need to possessing heater at element internal, and make to melt in the temperature atmosphere of the 1st fusible conductor 13 more than the fusing point of the 1st fusible conductor 13, fusing conductor 13a agglomerates to the 1st electrode 11 around, thus also with to adjacent the 2nd electrode 12 configured of the 1st electrode 11 contact, make 11,12 short circuits of the 1st, the 2nd electrode.

[temperature atmosphere]

Temperature short-circuit component 1 utilizes the heat come from the thermal source transmission of outside that the 1st fusible conductor 13 is melted.Temperature atmosphere refers to the temperature environment that the 1st fusible conductor 13 of being made by the thermal source of the outside of temperature short-circuit component 1 melts, and the waste heat such as produced because of the device abnormal heating be located near temperature short-circuit component 1 is delivered to the inside of temperature short-circuit component 1 and makes.In addition, the heat trnasfer that the temperature atmosphere more than fusing point of the 1st fusible conductor 13 also can be caused by the on fire of the electronic products of serviceability temperature short-circuit component 1 or fire around to temperature short-circuit component 1 inside and make.And then, the temperature atmosphere more than fusing point of the 1st fusible conductor 13 also can be made like this, namely, as the emergency not only when accident, disaster etc., and irreversibly for making the common occupation mode of switch conduction, the heat trnasfer that formed by the thermal source of outside is made to the inside of temperature short-circuit component 1.

[heat transfer component]

In addition, make the temperature atmosphere that the 1st fusible conductor 13 melts, play function by the air of temperature short-circuit component 1 inside or the structure member of element internal as the heat transfer component 14 of the heat of transmitting element outside and make.Heat transfer component 14 transmits the heat of the thermal source of temperature short-circuit component 1 outside, such as can use the shell body of temperature short-circuit component 1 described later or insulated substrate, the 1st, the 2nd electrode 11,12, other component parts, directly, be indirectly connected with the 1st fusible conductor 13 and heat the 1st fusible conductor 13.Heat transfer component 14 can be formed with electrode pattern, wire material or the heat pipe etc. be such as connected with the 1st electrode 11, makes the heat of self-heat power 15 to be indirectly delivered to the 1st fusible conductor 13 via the 1st electrode 11, and makes it fusing.

In addition, as shown in Figure 3, heat transfer component 14 is when using the parts of conductivity of heat pipe etc., and in order to seek the insulation with surrounding, preferably at least surface is covered by insulating material 16.

[the 1st, the 2nd electrode]

By carrying out the printing of refractory metal cream/burn till on the insulated substrate of such as aluminium oxide etc., form the 1st, the 2nd electrode 11,12 at grade.In addition, the 1st, the 2nd electrode 11,12 uses the mechanism part of the wire material, plate material etc. be made up of refractory metal, is formed also can by being supported on commitment positions etc.

1st, the 2nd electrode 11,12 is by open near configuration, is worked, as shown in Fig. 2 (A) (B), the fusing conductor 13a forming the 1st fusible conductor 13 described later condenses, combines and via the switch 2 of this fusing conductor 13a short circuit by temperature short-circuit component 1.1st, the 2nd electrode 11,12 is at one end provided with external connection terminals 11a, 12a respectively.1st, the 2nd electrode 11,12 is via these external connection terminals 11a, 12a and Yin Wendu short-circuit component 1 action and the external circuit of power circuit, digital signal circuit etc. that connects connects.Temperature short-circuit component 1 is because the 1st, the 2nd electrode 11,12 is via fusing conductor 13a short circuit and become the current path of this external circuit or the supply path to functional circuit.

[the 1st insulating barrier]

2nd electrode 12 is at least provided with the 1st insulating barrier 17 in a part.In addition, the 2nd electrode 12 is overlapping the 1st fusible conductor 13 supported by the 1st electrode 11 not only, and supports the 1st fusible conductor 13 by the 1st insulating barrier 17.In temperature short-circuit component 1, open (Fig. 1) because the 1st fusible conductor 13 be connected with the 1st electrode 11 is supported by the 1st insulating barrier 17 between the 1st, the 2nd electrode 11,12.

1st insulating barrier 17 can use the various materials with insulating properties, such as, be made up of glassy layer.And temperature short-circuit component 1 is when the 1st fusible conductor 13 melts, and fusing conductor 13a contacts with the region except the 1st insulating barrier 17 of the 2nd electrode 12, thus the 1st, the 2nd electrode 11,12 short circuit.Now, the coagulation position of the fusing conductor 13a on the 2nd electrode 12 can be controlled to the 1st electrode 12 side by the 1st insulating barrier 17, can more quickly and reliably make fusing conductor 13a condense between the 1st, the 2nd electrode 11,12.

[the 1st fusible conductor]

1st fusible conductor 13 can arbitrary metal that temperature atmosphere be utilized to melt rapidly of serviceability temperature short-circuit component 1, such as, preferably can use Sn or SnBi class scolding tin or SnIn class scolding tin, other take Sn as the low-melting-point metal of the Pb-free solder of principal component etc.

In addition, the 1st fusible conductor 13 also can contain low-melting-point metal and refractory metal.As low-melting-point metal, preferably use above-mentioned Sn or take Sn as the scolding tin of Pb-free solder etc. of principal component, as refractory metal, the alloy etc. preferably using Ag, Cu or be principal component with these.By containing refractory metal and low-melting-point metal, when refluxing installation temperature short-circuit component 1, even if reflux temperature exceedes the fusion temperature of low-melting-point metal and low-melting-point metal melts, low-melting-point metal also can be suppressed the outflow of outside, and the shape of the 1st fusible conductor 13 can be maintained.In addition, when short circuit, also corrode (erosion scolding tin) refractory metal because of low-melting-point metal fusing, thus rapid fusing can be made it under the temperature below the fusing point of refractory metal.In addition, the 1st fusible conductor 13, as illustrated by rear, can be formed by various structure.

1st fusible conductor 13 is shown greatly rectangular plate-like and is formed, and the 1st electrode 11 connects with the grafting material 18 of scolding tin etc. via connection.In addition, the 1st fusible conductor 13 is outstanding and overlapping with the 2nd electrode 12 to the 2nd electrode 12 side, is supported and be separated with the 2nd electrode 12 by the 1st above-mentioned insulating barrier 17.Thus, temperature short-circuit component 1 is maintained the open state of the 1st, the 2nd electrode 11,12 before work.And, 1st fusible conductor 13 melts because utilizing the heat from the thermal source of outside to become the temperature atmosphere of more than fusing point, fusing conductor 13a condenses in the 1st electrode 11 around, and with the 2nd electrode 12 that is that configure contacts the 1st electrode 11 is adjacent, makes 11,12 short circuits of the 1st, the 2nd electrode.

Such as, the 1st fusible conductor 13 uses the soldering alloy of SnBi class, thus under the temperature atmosphere of about 140 DEG C, start fusing.In addition, the 1st fusible conductor 13 uses the soldering alloy of SnIn class, thus under the temperature atmosphere of about 120 DEG C, start fusing.

In addition, the 1st fusible conductor 13, in order to anti-oxidation, raising wetability etc., is coated with solder flux 24(with reference to Fig. 8 etc.).

In addition, the 1st fusible conductor 13 also can necessarily not supported by the 1st electrode 11.Such as, the 1st fusible conductor 13 also can make one end be supported by the 1st above-mentioned insulating barrier 17, and the fixed part utilizing not shown support component or be located at insulated substrate etc. is to support the other end.Now, the 1st fusible conductor 13 is supported on and the 1st, the 2nd electrode 11,12 overlapping positions, and fusing conductor 13a condenses between the 1st, the 2nd electrode 11,12 (with reference to Figure 15).

[circuit structure/application]

Temperature short-circuit component 1 has the circuit structure shown in Fig. 4.That is, temperature short-circuit component 1 forms switch 2, with under the state before action, makes the 1st electrode 11 close with the 2nd electrode 12 and insulate because being separated, because the 1st fusible conductor 13 melts and short circuit.1st, the 2nd electrode 11,12 is connected in series on the current path of the circuit substrate installing temperature short-circuit component 1 etc., thus loads the various between external circuit 28A, 28B of power circuit, signal circuit etc.

External circuit 28A, 28B are before temperature short-circuit component 1 works, utilize open between the 1st, the 2nd electrode 11,12 and block, the circuit of physical property, irreversibly short circuit because of the short circuit of the 1st, the 2nd electrode 11,12, can illustrating such as when loading the device generation abnormal heating of electronic equipment of temperature short-circuit component 1 or in the emergency of fire etc., carrying out the various functional circuits of the work of abnormal reporting chain, the structure in by-pass current path etc. of startup, siren etc. of the startup of cooling device, sprinkler etc., stand-by circuit.Or external circuit 28A, 28B also can be for the hacker in network communication equipment, the by-passing signal path cracking the roundabout data server of system constructing, or carry out the activation of common device, software.

In temperature short-circuit component 1, if be passed the heat of the thermal source 15 from outside with the abnormal heating, fire etc. of the fault of device, become the temperature atmosphere of more than the fusing point of the 1st fusible conductor 13, then as shown in Fig. 2 (A) (B), 1st fusible conductor 13 is heated, is melted, and the 1st, the 2nd electrode 11,12 of insulation is via fusing conductor 13a short circuit.Thus, as shown in Figure 5, in temperature short-circuit component 1, switch 2 conducting, external circuit 28A, 28B connect.

[the 2nd fusible conductor]

In addition, as shown in Figure 6, temperature short-circuit component 1 also can connect the 2nd fusible conductor 21 to the 2nd electrode 12, and makes heat transfer component 14 and the 1st, the 2nd electrode 11,12 continuous, via the 2nd electrode 2, the 2nd fusible conductor 21 is melted.

By also arranging the 2nd fusible conductor 21 at the 2nd electrode 12, as shown in Figure 7, temperature short-circuit component 1 can increase the amount of the fusing conductor of cohesion throughout between the 1st, the 2nd electrode 11,12 by each fusing conductor 13a, 21a of the 1st fusible conductor 13 and the 2nd fusible conductor 21, make it reliably short circuit.2nd fusible conductor 21 uses the material identical with the 1st fusible conductor 13 to be formed, thus in the temperature atmosphere of the 1st fusible conductor 13 fusing, can make it similarly to melt.In addition, the 2nd fusible conductor 21 also as will be explained later, can be formed by various structure.In addition, the 2nd fusible conductor 21 utilizes the grafting material 18 engaging scolding tin etc. to join the 2nd electrode 12 in the same manner as the 1st fusible conductor 13.

In addition, the 2nd fusible conductor 21 is preferably arranged from the 2nd electrode 12 highlightedly to the 1st electrode 11 side, is separated and is projected into overlapping position with the 1st electrode 11.In addition, be easy to condense by the fusing conductor 13a of the fusing conductor 21a and the 1st fusible conductor 13 that support the 2nd fusible conductor the 21,2nd fusible conductor 21 in also overlapping with the 1st fusible conductor 13 mode, the short circuit between the 1st, the 2nd electrode 11,12 can be contributed to.

The 2nd electrode 12 being bonded to the 2nd fusible conductor 21 is same with the 1st electrode 11, transmits the heat of outside thermal source 15 via heat transfer component 14.Thus, the 2nd electrode 12 can make the 2nd fusible conductor 21 melt rapidly.

[surface installing type]

In addition, be suitable for temperature short-circuit component of the present invention, can be formed as being surface mounted to external circuit substrate.With the temperature short-circuit component 1 that surface mount applications is formed, as shown in Fig. 8 (A) (B), be laminated with the 1st, the 2nd electrode 11,12 at the surperficial 10a of insulated substrate 10.1st fusible conductor 13 is supported on the 1st electrode 11 by the grafting material 18 connecting scolding tin etc., and overlapping with the 2nd electrode 12, and the 1st insulating barrier 17 be formed on the 2nd electrode 12 supports.Thus, temperature short-circuit component 1 is formed with the 1st, the 2nd electrode 11,12.In addition, Fig. 8 (A) is the plane graph of the temperature short-circuit component 1 of surface installing type, and Fig. 8 (B) is the A-A ' sectional view with figure (A).

Insulated substrate 10 uses the parts with insulating properties of such as aluminium oxide, glass ceramics, mullite, zirconia etc. to be formed with cardinal principle square shape.Insulated substrate 10 also can use the material for printed circuit board of glass epoxy substrate, benzenesulfonate substrate etc. in addition, but needs to pay attention to temperature when the 1st fusible conductor 13 fuses.

In addition, insulated substrate 10 preferably uses the metal substrate that the insulating material of the heat conductivity excellence of ceramic substrate etc. or surface are applied by insulating material.Thus, insulated substrate 10 plays function as the heat transfer component 14 of the heat transmitting outside thermal source 15 to the 1st fusible conductor 13.The heat of outside thermal source 15 is delivered to the 1st electrode 11 via insulated substrate 10, and is directly delivered to the 1st fusible conductor 13 via grafting material 18, and is indirectly delivered to the 1st fusible conductor 13 as the waste heat in temperature short-circuit component 1.Thus, temperature short-circuit component 1 can make the temperature atmosphere of more than the fusing point of the 1st fusible conductor 13, thus the 1st fusible conductor 13 is melted.

1st, the 2nd electrode 11,12 is formed in the conductive pattern of the surperficial 10a of insulated substrate 10.In addition, the 1st, the 2nd electrode 11,12 is connected with the external connection terminals (not shown) of the back side 10b being formed in insulated substrate 10.Temperature short-circuit component 1 loads the various external circuits of power circuit etc. via these external connection terminals.

On the 1st, the 2nd electrode 11,12, the insulating material of glass etc. is utilized to be provided with the 1st insulating barrier 17, and with the 1st fusible conductor 13 of tabular formation across being equipped between the 1st, the 2nd electrode 11,12.1st, the 2nd electrode 11,12 supports the 1st fusible conductor 13 at the 1st insulating barrier 17, thus is separated with the 1st fusible conductor 13.In addition, the 1st electrode 11 is provided with the grafting material 18 engaging scolding tin etc., is connected with the 1st fusible conductor 13 via grafting material 18.

In addition, 1st insulating barrier 17 removes an opposed part for adjacent the 1st, the 2nd electrode 11,12 arranged and is formed, not only prevent the outflow of grafting material 18, fusing conductor 13a, and the coagulation position of fusing conductor 13a is dropped between the 1st, the 2nd electrode 11,12.Thus, the 1st insulating barrier 17 can prevent fusing conductor 13a from externally flowing out thus situation about having an impact to the connection status with external circuit splicing ear side, and can make reliably short circuit between the 1st, the 2nd electrode 11,12.

1st, the 2nd electrode 11,12 can form the refractory metal cream of Ag etc. by utilizing screen printing technique pattern on the surperficial 10a of insulated substrate 10, and to burn till etc. and to be formed.In addition, the 1st, the 2nd electrode 11,12 is formed by using the material of the heat conductivity excellence of Ag etc., can play function as the heat transfer component 14 of the heat transmitting outside thermal source 15 to the 1st fusible conductor 13.

In addition, the 1st fusible conductor 13 is coated with solder flux 24 in order to anti-oxidation, raising wetability etc.In addition, in temperature short-circuit component 1, cover 25 covers on the surperficial 10a of insulated substrate 10.

Temperature short-circuit component 1 is at the thermal source adstante febre of outside, as shown in Fig. 9 (A) (B), via insulated substrate 10, the 1st, heat transfer component heat fused the 1st fusible conductor 13 of the 2nd electrode 11,12 etc., fusing conductor 13a is condensed between the 1st, the 2nd electrode 11,12 and makes it short circuit.Now, temperature short-circuit component 1 passes through to make the 1st fusible conductor 13 mode overlapping with the 2nd electrode 12 support, thus utilize the surface tension of fusing conductor 13a or gravity to make fusing conductor 13a touch the 2nd electrode 12, reliably short circuit between the 1st, the 2nd electrode 11,12 can be made.

In addition, as shown in Figure 8, temperature short-circuit component 1 also can make the 1st fusible conductor 13 to the 1st electrode 11 with the extending with the 1st electrode 11 opposition side of the 2nd electrode 12 opposition side and the 2nd electrode 12.Thus, temperature short-circuit component 1 increases the amount of the fusing conductor 13a condensed between the 1st, the 2nd electrode 11,12, can make it reliably short circuit.

In addition, in above-mentioned temperature short-circuit component 1, the 1st fusible conductor 13 preferably formed with tabular has than the area large with the connection area of the 1st electrode 11.Thus, the 1st fusible conductor 13 can guarantee the amount of the fusing conductor making 11,12 short circuits of the 1st, the 2nd electrode fully.

[temperature short-circuit component 30]

In addition, the support electrode that temperature short-circuit component of the present invention also can arrange the end of the 1st fusible conductor 13 that support is supported by the 1st electrode 11 is suitable for.In addition, in the following description, identical label marked for the structure that the temperature short-circuit component 1 with above-mentioned is identical and omit that it is detailed.

Temperature short-circuit component 30 shown in Figure 10 is same with above-mentioned temperature short-circuit component 1, the surperficial 10a of insulated substrate 10 is formed the 1st, the 2nd electrode 11,12, the 1st electrode 11 is supported with the 1st fusible conductor 13 across grafting material 18.In addition, the 1st insulating barrier 17 that the 1st fusible conductor 13 is arranged on the 1st, the 2nd electrode 11,12 supports, thus is separated with the 1st, the 2nd electrode 11,12, open between the 1st, the 2nd electrode 11,12 thus.

In addition, in temperature short-circuit component 30, the two ends of the 1st fusible conductor 13 are given prominence to laterally from the 1st, the 2nd electrode 11,12, and the 1st support electrode 31 that both ends are arranged on the surperficial 10a of insulated substrate 10 supports.1st support electrode 31 and the 1st, the 2nd electrode 11,12 same, the refractory metal cream of Ag etc. can be formed by utilizing screen printing technique pattern on the surperficial 10a of insulated substrate 10, and to burn till etc. and to be formed, preferably to be formed with the 1st, the 2nd electrode 11,12 identical operations.

In addition, the 1st support electrode 31 is provided with the grafting material 18 engaging scolding tin etc., and the both ends of the 1st fusible conductor 13 are affixed thus.Temperature short-circuit component 30 possesses the size that the 1st fusible conductor 13 is given prominence to laterally from the 1st, the 2nd electrode 11,12, thus can make the sufficient fusing conductor 13a of the 1st, the 2nd electrode 11,12 short circuits.In addition, by the both ends at affixed 1st fusible conductor 13 of the 1st support electrode 31, reflux install time etc. temperature environment under, also stably can support the 1st fusible conductor 13.In addition, the 1st fusible conductor 13 is coated with solder flux 24 in order to anti-oxidation, raising wetability etc.

In temperature short-circuit component 30, melt in the temperature atmosphere of the 1st fusible conductor 13 more than the fusing point of the 1st fusible conductor 13, thus as shown in figure 11, fusing conductor 13a condenses on the 1st, the 2nd electrode 11,12.Thus, fusing conductor 13a condenses throughout between the 1st, the 2nd electrode 11,12, thus is shorted between the 1st, the 2nd electrode 11,12.

In addition, now by forming the 1st insulating barrier 17 at the 1st, the 2nd electrode 11,12, prevent the outflow of grafting material 18, fusing conductor 13a, and the coagulation position of fusing conductor 13a is dropped between the 1st, the 2nd electrode 11,12, the 1st, the 2nd electrode 11,12 reliably short circuit can be made.

In addition, the 1st fusible conductor 13 being formed as tabular has the area larger than the connection area of each and the 1st, the 2nd electrode 11,12.Thus, the 1st fusible conductor 13 can guarantee the amount of the fusing conductor making abundant short circuit between the 1st, the 2nd electrode 11,12.

[temperature short-circuit component 40]

In addition, be suitable for temperature short-circuit component of the present invention and also can support the 1st fusible conductor 13 at the 1st electrode 11, and make the 2nd fusible conductor 21 be supported on the 2nd electrode 12.In addition, in the following description, for marking identical label with above-mentioned temperature short-circuit component 1,30 identical structures and omitting that it is detailed.

Temperature short-circuit component 40 shown in Figure 12 is formed with the 1st, the 2nd electrode 11,12 on the surperficial 10a of insulated substrate 10, and the 1st electrode 11 is supported with the 1st fusible conductor 13, and the 2nd electrode 12 is supported with the 2nd fusible conductor 21.In temperature short-circuit component 40, the 1st, the 2nd electrode 11,12 separately supports fusible conductor, thus open before the fusing of the 1st, the 2nd fusible conductor 13,21.

1st, the 2nd electrode 11,12 is formed with the 1st insulating barrier 17 respectively, and is provided with grafting material 18, the 1st, the 2nd fusible conductor 13,21 is separated and is supported.2nd fusible conductor 21 has the material identical with the 1st fusible conductor 13, identical structure, and the 1st, the 2nd fusible conductor 13,21 melts in roughly the same temperature atmosphere.In addition, the 1st, the 2nd fusible conductor 13,21 is coated with solder flux 24 in order to anti-oxidation, raising wetability etc.

[fixed part]

In addition, the one end of the 1st fusible conductor 13 supported by the 1st electrode 11 also can be fixed in insulated substrate 10 by fixed part 42 by temperature short-circuit component 40, similarly, by fixed part 42, the one end of the 2nd fusible conductor 21 supported by the 2nd electrode 12 is fixed in insulated substrate 10.1st, the 2nd fusible conductor 13,21 is fixed in the grafting material 18 being located at the 1st, the 2nd electrode 11,12 and the fixed part 42 be located on the surperficial 10a of insulated substrate 10 respectively, thus when reflux install temperature short-circuit component 40 time etc. heating, also can not move to direction close to each other.Therefore, temperature short-circuit component 40 can reflux install time etc., before original work, prevent the 1st, the 2nd fusible conductor 13,21 from moving to close direction thus the incipient short that can contact.

The fixed part 42 of affixed 1st, the 2nd fusible conductor 13,21, can use the material identical with grafting material 18 engaging scolding tin etc.

In the temperature atmosphere of temperature short-circuit component 40 more than the fusing point of the 1st, the 2nd fusible conductor 13,21, the 1st, the 2nd fusible conductor 13,21 melts, thus as shown in figure 13, fusing conductor 13a to condense on the 1st electrode 11 and melts conductor 21a and condenses on the 2nd electrode 12.Thus, fusing conductor 13a, 21a condense throughout between the 1st, the 2nd electrode 11,12, thus are shorted between the 1st, the 2nd electrode 11,12.

In addition, now by forming the 1st insulating barrier 17 at the 1st, the 2nd electrode 11,12, prevent the outflow of grafting material 18, fusing conductor 13a, 21a, and the coagulation position of fusing conductor 13a, 21a is dropped between the 1st, the 2nd electrode 11,12, the 1st, the 2nd electrode 11,12 reliably short circuit can be made.

In addition, be formed as the 1st of tabular the, the 2nd fusible conductor 13,21 and preferably there is the area larger than the connection area of each and the 1st, the 2nd electrode 11,12.Thus, the 1st, the 2nd fusible conductor 13,21 can guarantee the amount of the fusing conductor fully making 11,12 short circuits of the 1st, the 2nd electrode.

In addition, as shown in figure 14, temperature short-circuit component 40 also can arrange the 2nd support electrode 43 of the end of support the 1st, the 2nd fusible conductor 13,21.2nd support electrode 43 and the 1st, the 2nd electrode 11,12 same, the refractory metal cream of Ag etc. can be formed by utilizing screen printing technique pattern on the surperficial 10a of insulated substrate 10, and to burn till etc. and to be formed, preferably to be formed with the 1st, the 2nd electrode 11,12 identical operations.

In addition, the 2nd support electrode 43 is provided with the grafting material 18 engaging scolding tin etc., the end of affixed 1st, the 2nd fusible conductor 13,21 thus.In temperature short-circuit component 40, the 1st, the 2nd fusible conductor 13,21 possesses the size of giving prominence to laterally from the 1st, the 2nd electrode 11,12, thus can obtain sufficient fusing conductor 13a, 21a of making 11,12 short circuits of the 1st, the 2nd electrode.In addition, by the both ends of the 1st, the 2nd fusible conductor 13,21 are fixed in the 2nd support electrode 43, reflux install time etc. temperature environment under, also stably can support the 1st, the 2nd fusible conductor 13,21.

[temperature short-circuit component 50]

In addition, being suitable for temperature short-circuit component of the present invention also can make the 1st fusible conductor 13 do not supported by the 1st electrode 11.In addition, in the following description, for above-mentioned temperature short-circuit component 1,30,40 identical structures mark identical label and omit that it is detailed.

Temperature short-circuit component 50 shown in Figure 15 (A) has: insulated substrate 10; Be formed in the 1st of the surperficial 10a of insulated substrate 10 the, the 2nd electrode 11,12; On the surperficial 10a being formed in insulated substrate 10 and than the 1st, the 2nd electrode 11,12 thick the 2nd insulating barriers 51; With the 1st fusible conductor 13 supported by the 2nd insulating barrier 51 across the mode on the 1st, the 2nd electrode 11,12; And the cover 25 covered on the surperficial 10a of insulated substrate 10.

2nd insulating barrier 51 is such as made up of glassy layer, in the surperficial 10a of insulated substrate 10, be formed in the sidewall 25a of cover 25, the 1st, the 2nd electrode 11,12 and establish the region of the clearance portion of putting except separating the 1st, the 2nd electrode 11,12 by cable.2nd insulating barrier 51 is formed and exposes the surface of the 1st, the 2nd electrode 11,12 and the peristome 52 of opposite lateral edges thus.In addition, the 2nd insulating barrier 51 is formed as than the 1st, the thickness of the 2nd electrode 11,12 is thick, and is equipped with the 1st fusible conductor 13 at upper surface.

1st fusible conductor 13 is equipped on the 2nd insulating barrier 51 in the mode of the top of the 1st, the 2nd electrode 11,12 faced from peristome 52 across the 2nd insulating barrier 51.1st fusible conductor 13 is supported the both sides except the central portion overlapping with peristome 52 widely by the 2nd insulating barrier 51.

In addition, cover 25 uses the insulating material of engineering plastics etc. to be formed, and has the sidewall 25a be equipped on the surperficial 10a of the insulated substrate 10 and end face 25b covered on the surperficial 10a of insulated substrate 10.Cover 25 covers the 2nd insulating barrier 51 and the 1st fusible conductor 13 around by sidewall 25a.

In such temperature short-circuit component 50, if melt in the temperature atmosphere of the 1st fusible conductor 13 more than the fusing point of the 1st fusible conductor 13, then as shown in Figure 15 (B), the shift position of fusing conductor 13a is controlled in from the 1st, the 2nd electrode 11,12 that the peristome 52 being located at the 2nd insulating barrier 51 faces.Namely, in temperature short-circuit component 50, the surrounding of the 1st fusible conductor 13 is inaccessible because of not possessing the 2nd insulating barrier 51 of the wetability of the fusing conductor 13a for the 1st fusible conductor 13 and cover 25, and therefore fusing conductor 13a condenses on the 1st, the 2nd electrode 11,12 uniquely possessing wetability.

Thus, in temperature short-circuit component 50, fusing conductor 13a condenses throughout between the 1st, the 2nd electrode 11,12, thus makes reliably short circuit between the 1st, the 2nd electrode 11,12.

[temperature short-circuit component 60]

In addition, being suitable for temperature short-circuit component of the present invention can be also surface mount applications and being formed, and expands the Area of bearing of the 1st fusible conductor 13 carried out with the 1st, the 2nd electrode 11,12, prevents the distortion of the 1st fusible conductor 13 and prevents incipient short.In addition, in the following description, for above-mentioned temperature short-circuit component 1,30,40,50 identical structures mark identical label and omit that it is detailed.

As shown in Figure 16, Figure 17, this temperature short-circuit component 60 possesses: insulated substrate 10; Be formed in the 1st of the surperficial 10a of insulated substrate 10 the, the 2nd electrode 11,12; 1st, the 2nd electrode 11,12 make opposed each leading section 11b, 12b of the 1st, the 2nd electrode 11,12 expose and the 1st stacked insulating barrier 17; The surperficial 10a forming insulated substrate 10 is upper and compare the 1st, the 2nd electrode 11,12 thick the 2nd insulating barriers 51; And the 1st fusible conductor 13 be equipped on the 1st, the 2nd insulating barrier 17,51.In addition, Figure 16 (A) is the cover 25 of removing temperature short-circuit component 60 and the plane graph that illustrates, and being with the A-A ' sectional view of figure shown in (A) with figure (B), is with the B-B ' sectional view of figure shown in (A) with figure (C).In addition, Figure 17 is the cover 25 of removing temperature short-circuit component 60 and the 1st fusible conductor 13 and the plane graph that illustrates.

In temperature short-circuit component 60 the 1st, the 2nd electrode 11,12 are extensively formed throughout with the length direction of the insulated substrate 10 of rectangular-shaped formation, and are formed into central portion from the both sides of the edge of the Width of insulated substrate 10, and separate predetermined distance and opposed.In addition, the 1st, the 2nd electrode 11,12 is laminated with the 1st insulating barrier 17 in substantially central portion, and opposite leading section 11b, 12b expose.

Temperature short-circuit component 60 can improve the reliability of short circuit by form the short circuit length of the 1st, the 2nd electrode 11,12 longlyer, and the short-circuit resistance reduced after the 1st, the 2nd electrode 11,12 short circuit and corresponding high rated current.

2nd insulating barrier 51 is formed in the clearance portion of the 1st, the 2nd electrode 11,12 in the two ends of the opposite lateral edges of the 1st, the 2nd electrode 11,12.Other 2nd insulating barrier 51 with than the 1st, the thickness of the 2nd electrode 11,12 thick formed, continuous with the 1st insulating barrier 17 be formed on the 1st, the 2nd electrode 11,12.Thus, the 1st, the 2nd insulating barrier 17,51 is formed with the peristome 61 of the substantially rectangular shape that opposite each leading section 11b, 12b of the 1st, the 2nd electrode 11,12 are exposed.

1st fusible conductor 13 is fixed in the 1st electrode 11 via the grafting material 18 of joint scolding tin etc.In addition, the 1st fusible conductor 13 be supported in the mode covering peristome 61 be located at the 1st, the 2nd electrode 11,12 the 1st insulating barrier 17 and the 2nd insulating barrier 51 on.That is, in temperature short-circuit component 60, the 1st, the 2nd electrode 11,12 is on the insulating substrate 10 stacked widely, and except each leading section 11b, 12b of these the 1st, the 2nd electrodes 11,12 by the 1st, the 2nd insulating barrier 17,51 around.Thus, the 1st fusible conductor 13 is rebuild and is around supported by the 1st, the 2nd insulating barrier 17,51, prevents the flexure of length direction and Width.

Therefore, according to temperature short-circuit component 60, can reflux install time etc. in reliably prevent the 1st fusible conductor 13 from bending, and can to prevent because the 1st fusible conductor 13 is out of shape and the incipient short of the 1st, the 2nd electrode 11,12 short circuits.

In addition, the 1st fusible conductor 13 also can replace the 1st electrode 11 or be also fixed in the 1st insulating barrier 17 and/or the 2nd insulating barrier 51 via grafting material 18 except the 1st electrode 11.By by affixed for the 1st fusible conductor 13 many places, reflux install time etc. temperature environment under, also prevent dislocation etc., can stably keep.

In such temperature short-circuit component 60, if melt in the temperature atmosphere of the 1st fusible conductor 13 more than the fusing point of the 1st fusible conductor 13, then as shown in figure 18, the shift position of melting conductor 13a is controlled in each leading section 11b, the 12b of the 1st, the 2nd electrode 11,12 faced from the peristome 61 being located at the 1st, the 2nd insulating barrier 17,51.That is, temperature short-circuit component 60 is supported by the 1st, the 2nd insulating barrier 17,51 that the fusing conductor 13a for the 1st fusible conductor 13 does not possess wetability, and therefore fusing conductor 13a condenses upon and uniquely possesses on the 1st, the 2nd electrode 11,12 of wetability.

Thus, in temperature short-circuit component 60, fusing conductor 13a condenses throughout between the 1st, the 2nd electrode 11,12, thus makes reliably short circuit between the 1st, the 2nd electrode 11,12.

[temperature short-circuit component 70]

In addition, being suitable for temperature short-circuit component of the present invention also can be surface mount applications and being formed, and with the cap Electrode connection of the 2nd electrode 12 is set at cover.In addition, in the following description, for above-mentioned temperature short-circuit component 1,30,40,50,60 identical structures mark identical label and omit that it is detailed.

As shown in figure 19, this temperature short-circuit component 70 possess cover the 25,2nd electrode 12 on the surface covering insulated substrate 10 with the end face 25b of cover 25 opposed with the 1st electrode 11 the cap electrode 71 that formed connect.In addition, Figure 19 (A) is the cover 25 of temperature short-circuit component 70 before the fusing of removing the 1st fusible conductor 13 and the plane graph that illustrates, and being with the A-A ' sectional view of figure shown in (A) with figure (B), is with the B-B ' sectional view of figure shown in (A) with figure (C).In addition, Figure 20 is the cover 25 of temperature short-circuit component 70 after the fusing of removing the 1st fusible conductor 13 and the plane graph that illustrates, and being with the A-A ' sectional view of figure shown in (A) with figure (B), is with the B-B ' sectional view of figure shown in (A) with figure (C).

Cover 25 has the sidewall 25a and end face 25b that are connected with the outer edge of the surperficial 10a of insulated substrate 10, and various engineering plastics or the material same with insulated substrate 10 can be used to be formed.Cover 25 is formed with cap electrode 71 from a lateral edge portion 25a of cover 25 to end face 25b.

By carrying cover 25 at insulated substrate 10, cap electrode 71 is connected with the 2nd electrode 12 of the surperficial 10a being formed in insulated substrate 10.1st, the 2nd electrode 11,12 disconnected from each other and open.In addition, the 1st, the 2nd electrode 11,12 is connected with external connection terminals 11a, 12a of the back side 10b being formed in insulated substrate 10.Temperature short-circuit component 70 loads the various external circuits of power circuit etc. via this external connection terminals 11a, 12a.

In addition, cap electrode 71 is opposed with the 1st electrode 11 on the surperficial 10a being formed in insulated substrate 10, and is configured with the 1st fusible conductor 13 between the 1st electrode 11.1st fusible conductor 13 is fixed on the 1st electrode 11 via grafting material 18.In addition, also at insulated substrate 10, the 1st above-mentioned support electrode 31 or fixed part 42, the 2nd insulating barrier 51 can be set, also to support the 1st fusible conductor 13 by these.

In such temperature short-circuit component 70, if melt in the temperature atmosphere of the 1st fusible conductor 13 more than the fusing point of the 1st fusible conductor 13, then as shown in figure 20, fusing conductor 13a condenses on the 1st electrode 11, and condenses on end face 25b and the 1st electrode 11 cap electrode 71 arranged opposite.Thus, temperature short-circuit component 70 can make the 1st, the 2nd electrode 11,12 short circuit via fusing conductor 13a and cap electrode 71.

[temperature switching device]

Then, applicable temperature switching device of the present invention is described.In addition, in the explanation of temperature switching device, for above-mentioned temperature short-circuit component 1,30,40,50,60,70 identical structures mark identical label and omit that it is detailed.

[temperature switching device 80]

Be suitable for temperature switching device 80 of the present invention, as shown in Figure 21 (A) (B), possess: the 1st electrode 11; The 2nd electrode 12 arranged adjacently with the 1st electrode 11; Condense throughout between the 1st, the 2nd electrode 11,12 by fusing thus make the 1st fusible conductor 13 of the 1st, the 2nd electrode 11,12 short circuit; 3rd electrode 83 and the 4th electrode 84; And connect across the 3rd, the 4th electrode 83,84, the 3rd fusible conductor 81 between the 3rd, the 4th electrode 83,84 is blocked by melting.

And as shown in Figure 22 (A) (B), temperature switching device 80 without the need to possessing heater at element internal, and melts in the temperature atmosphere of the 1st, the 3rd fusible conductor 13,81 more than the fusing point of the 1st, the 3rd fusible conductor 13,81.Thus in temperature switching device 80, fusing conductor 13a condenses in the 1st electrode 11 around, thus also contacts with adjacent the 2nd electrode 12 configured of the 1st electrode 11, thus makes 11,12 short circuits of the 1st, the 2nd electrode, and the 3rd fusible conductor 81 fuses, block between the 3rd, the 4th electrode 83,84.

[temperature atmosphere]

Temperature switching device 80 is same with above-mentioned temperature short-circuit component 1, utilizes the heat transmitted from the thermal source 15 of outside that the 1st, the 3rd fusible conductor 13,81 is melted.Temperature atmosphere refers to as mentioned above and the temperature environment that the 1st, the 3rd fusible conductor 13,81 of being made by the thermal source 15 of the outside of temperature switching device 80 melts such as is located at the device abnormal heating near temperature switching device 80 and the waste heat that produces is delivered to the inside of temperature switching device 80 and makes.In addition, the temperature atmosphere more than fusing point of the 1st, the 3rd fusible conductor 13,81, also can because of the electronic products of serviceability temperature switching device 80 is on fire or fire around and the heat trnasfer that produces to temperature switching device 80 inside and make.And then, the temperature atmosphere more than fusing point of 1st, the 3rd fusible conductor 13,81, emergency not only when accident, disaster etc., and as the common occupation mode of irreversibly diverter switch, the heat trnasfer that the thermal source because of outside produces also can to the inside and making of temperature switching device 80.

[heat transfer component]

In addition, make the temperature atmosphere that the 1st, the 3rd fusible conductor 13,81 melts, play function by the structure member of the air or element internal that make temperature switching device 80 inside as the heat transfer component 82 of the heat of transmitting element outside and make.Heat transfer component 82 transmits the heat of the thermal source of temperature switching device 80 outside, shell body or insulated substrate, the 1st ~ 4th electrode 11,12,83,84 and other the component parts of such as temperature switching device 80 described later can be used, by directly, being indirectly connected with the 1st, the 3rd fusible conductor 13,81, heating the 1st, the 3rd fusible conductor 13,81.Heat transfer component 82 can by formation such as the electrode pattern, wire material or the heat pipes that are such as connected with the 1st electrode 11 or the 3rd, the 4th electrode 83,84, the heat with self-heat power 15 in the future via the 1st electrode 11 be indirectly delivered to the 1st fusible conductor 13 the 1st heat transfer component 82A and future self-heat power 15 heat be directly delivered to the 2nd heat transfer component 82B of the 3rd fusible conductor 81.

In addition, heat transfer component 82 is same with the heat transfer component 14 shown in Fig. 3, when using the parts of conductivity of heat pipe etc., in order to seek the insulation with surrounding, preferably with insulating material at least covering surfaces.

[the 1st ~ 4th electrode]

1st, the 2nd electrode 11,12 is same with above-mentioned temperature short-circuit component 1.3rd, the 4th electrode 83,84 also with the 1st, the 2nd electrode 11,12 same, such as formed at grade by printing of refractory metal cream/burn till etc. on the insulated substrate of aluminium oxide etc.In addition, the 3rd, the 4th electrode 83,84 also can use the mechanism part of the wire material, plate material etc. be made up of refractory metal, by being formed in commitment positions support etc.

3rd, the 4th electrode 83,84 separates predetermined distance and arranges, thus is opened, and is electrically connected all the time via the 3rd fusible conductor 81.3rd, the connection of the 4th electrode the 83,84 and the 3rd fusible conductor 81, can use the grafting material 18 of above-mentioned connection scolding tin etc.And as shown in Figure 22 (A) (B), Yin Wendu switching device 80 works and the 3rd fusible conductor 81 fuses, thus the conducting of the 3rd, the 4th electrode 83,84 is truncated.3rd, the 4th electrode 83,84 is at one end provided with external connection terminals 83a, 84a separately.3rd, the 4th electrode 83,84 connects via the external circuit of these external connection terminals 83a, 84a and Yin Wendu switching device 80 action and the power circuit that blocks or digital signal circuit etc.Because blocking between the 3rd, the 4th electrode 83,84, temperature switching device 80 can block current path or the functional circuit of this external circuit.

[the 3rd fusible conductor]

3rd fusible conductor 81 is same with the 1st fusible conductor 13, the temperature atmosphere of Yin Wendu switching device 80 can be used and any one metal melted rapidly, preferably can use such as Sn or SnBi class scolding tin, SnIn class scolding tin, other take Sn as the low-melting-point metal of the Pb-free solder of principal component etc.

In addition, the 3rd fusible conductor 81 also can contain low-melting-point metal and refractory metal.Low-melting-point metal and refractory metal can use the material same with the material used at above-mentioned 1st fusible conductor 13.

In addition, the 3rd fusible conductor 81 is coated with solder flux 24 in order to anti-oxidation, raising wetability etc.

[circuit structure/application]

Temperature switching device 80 has the circuit structure shown in Figure 23 (A) (B).That is, temperature switching device 80 forms switch 2, with under the state before action, the 1st electrode 11 and the 2nd electrode 12 close to and be separated and insulate, because the 1st fusible conductor 13 melts and short circuit.In addition, temperature switching device 80 connects between the 3rd, the 4th electrode 83,84 via the 3rd fusible conductor 81, blocks because the 3rd fusible conductor 81 melts.

As shown in figure 24, the 1st, the 2nd electrode 11,12 is connected in series on the current path of the circuit substrate installing temperature switching device 80, thus loads the various between external circuit 28A, 28B of power circuit, signal circuit etc.Similarly, the 3rd, the 4th electrode 83,84 is also connected in series on the current path of the circuit substrate installing temperature switching device 80, thus loads the various between external circuit 85A, 85B of power circuit, signal circuit etc.

External circuit 28A, 28B are before temperature switching device 80 works, block because of open between the 1st, the 2nd electrode 11,12, the circuit of physical property, irreversibly short circuit because of the short circuit of the 1st, the 2nd electrode 11,12, can illustrating such as when loading the device generation abnormal heating of electronic equipment of temperature switching device 80 or in the emergency of fire etc., carrying out the various functional circuits of the work of abnormal reporting chain, the structure in by-pass current path etc. of startup, siren etc. of the startup of cooling device, sprinkler etc., stand-by circuit.Or external circuit 28A, 28B also can carry out the activation of the structure in the by-passing signal path making data server roundabout for the hacker in network communication equipment, the system of cracking or common device, software.

In addition, external circuit 85A, 85B are before temperature switching device 80 works, connect because connecting between the 3rd, the 4th electrode 83,84 via the 3rd fusible conductor 81, because of blocking and physical property, the circuit that irreversibly blocks between the 3rd, the 4th electrode 83,84, all circuit such as the internet circuit in the power circuit of such as battery pack or electronic equipment, signal circuit, network communication equipment can be applicable to.

In temperature switching device 80, if transmit the heat of the abnormal heating, fire etc. of the adjoint fault from device, outside thermal source 15, thus become the temperature atmosphere of more than the fusing point of the 1st, the 3rd fusible conductor 13,81, then as shown in Figure 22 (A) (B), the 1st, the 3rd fusible conductor 13,81 is heated, is melted.Thus, in temperature switching device 80, fusing conductor 13a condenses in the 1st electrode 11 around, and contacts with the 2nd electrode 11 of adjacent configuration, and the 1st, the 2nd electrode 11,12 of insulation, via fusing conductor 13a short circuit, connects external circuit 28A, 28B.In addition, temperature switching device 80 blocks the conducting between the 3rd, the 4th electrode 83,84 because the 3rd fusible conductor 81 fuses, and blocks external circuit 85A, 85B.

In addition, in temperature switching device 80, same with temperature short-circuit component 1, also can connect the 2nd fusible conductor 21 to the 2nd electrode 12, and make heat transfer component 82A and the 1st, the 2nd electrode 11,12 continuous, via the 2nd electrode 2, the 2nd fusible conductor 21 be melted.

[fusing order]

In addition, temperature switching device 80 also can pass through the fusing order of restriction the 1st fusible conductor 13 and the 3rd fusible conductor 81, the short circuit between restriction external circuit 28A, 28B and the order of blocking between external circuit 85A, 85B.

That is, in temperature switching device 80, by making the 1st fusible conductor 13 melt prior to the 3rd fusible conductor 81, can, after making external circuit 28A, 28B short circuit, make to block between external circuit 85A, 85B.Thus, such as be made up of Emergency Power circuit or stand-by circuit between external circuit 28A, 28B start after, can block be made up of common power circuit or functional circuit between external circuit 85A, 85B.

In addition, in temperature switching device 80, by making the 3rd fusible conductor 81 melt prior to the 1st fusible conductor 13, after making to block between external circuit 85A, 85B, external circuit 28A, 28B short circuit can be made.Thus, such as make to be made up of power circuit block between external circuit 85A, 85B after, external circuit 28A, 28B of being made up of warning system circuit can be made to start.

The fusing order of the 1st fusible conductor 13 like this and the 3rd fusible conductor 81, can limit by arranging fusing point difference at the 1st fusible conductor 13 and the 3rd fusible conductor 81.Such as, the 1st fusible conductor 13 is being formed with SnIn class scolding tin, when forming the 3rd fusible conductor 81 with SnBi class scolding tin, the fusing point of indium stannum alloy is 120 DEG C, the fusing point of sn-bi alloy is 138 DEG C, and therefore the fusing point of the 1st fusible conductor 13 is lower than the 3rd fusible conductor 81, can prior to fusing.

In addition, the fusing order of the 1st fusible conductor 13 and the 3rd fusible conductor 81, the sectional area also by changing the 1st fusible conductor 13 and the 3rd fusible conductor 81 limits.Thicker just the becoming of fusible conductor sectional area is more difficult to fusing, reduces the sectional area of the fusing conductor first melted, the sectional area of the fusing conductor that increase is melted below.

In addition, the fusing order of the 1st fusible conductor 13 and the 3rd fusible conductor 81, also can be arranged difference to heat conductivity, thus be limited by the path of change heat transfer component 82, fineness degree.

[surface installing type]

In addition, be suitable for temperature switching device of the present invention can be formed as being surface mounted in external circuit substrate.With the temperature switching device 80 that surface mount applications is formed, as shown in Figure 25 (A) (B), be laminated with the 1st ~ 4th electrode 11,12,83,84 at the surperficial 10a of insulated substrate 10.1st fusible conductor 13 is supported on the 1st electrode 11 by the grafting material 18 connecting scolding tin etc., and overlapping with the 2nd electrode 12, and the 1st insulating barrier 17 be formed on the 2nd electrode 12 supports.Thus, temperature switching device 80 is open the 1st, the 2nd electrode 11,12.3rd fusible conductor 81 utilizes grafting material 18 to connect across on the 3rd, the 4th electrode 83,84.In addition, Figure 25 (A) is the plane graph of the temperature switching device 80 of surface installing type, and Figure 25 (B) is the A-A ' sectional view with figure (A).

Insulated substrate 10 can use the parts same with the insulated substrate 10 of above-mentioned temperature short-circuit component 1, by the metal substrate that the insulating material or surface that use the heat conductivity excellence of ceramic substrate etc. are applied by insulating material, the heat transfer component 82 as the heat transmitting outside thermal source 15 to the 1st, the 3rd fusible conductor 13,81 plays function.The heat of outside thermal source 15 is delivered to the 1st, the 3rd, the 4th electrode 11,83,84 via insulated substrate 10, and be directly delivered to the 1st, the 3rd fusible conductor 13,81 via grafting material 18, and as the waste heat indirect transfer in temperature switching device 80 to the 1st, the 3rd fusible conductor 13,81.Thus, temperature switching device 80 can make the temperature atmosphere of more than the fusing point of the 1st, the 3rd fusible conductor 13,81, thus the 1st, the 3rd fusible conductor 13,81 is melted.

1st ~ 4th electrode 11,12,83,84 is formed in the conductive pattern of the surperficial 10a of insulated substrate 10.In addition, the 1st ~ 4th electrode 11,12,83,84 is connected with the external connection terminals (not shown) of the back side 10b being formed in insulated substrate 10.Temperature switching device 80 loads the various external circuits of power circuit, stand-by circuit etc. via these external connection terminals.

1st ~ 4th electrode 11,12,83,84 can form the refractory metal cream of Ag etc. by utilizing screen printing technique pattern on the surperficial 10a of insulated substrate 10 and burn till etc. and formed.In addition, the 1st ~ 4th electrode 11,12,83,84 is formed by using the material of the heat conductivity excellence of Ag etc., can play function as the heat transfer component 82 of the heat transmitting outside thermal source 15 to the 1st fusible conductor 13.

On the 1st, the 2nd electrode 11,12, the insulating material of glass etc. is utilized to be provided with the 1st insulating barrier 17, and across being equipped with the 1st fusible conductor 13 formed with tabular between the 1st, the 2nd electrode 11,12.1st, the 2nd electrode 11,12 the 1st insulating barrier 17 supports the 1st fusible conductor 13, thus is separated with the 1st fusible conductor 13.In addition, the 1st electrode 11 is provided with the grafting material 18 engaging scolding tin etc., is connected with the 1st fusible conductor 13 via grafting material 18.

In addition, on the 3rd, the 4th electrode 83,84, near the connecting portion of the 3rd fusible conductor 81, the insulating material of glass etc. is utilized to be provided with the 1st insulating barrier 17.

1st insulating barrier 17 is formed between the 3rd, the 4th electrode 83,84 and each external connection terminals, prevents the outflow of grafting material 18, fusing conductor 81a.Thus, the 1st insulating barrier 17 prevents fusing conductor 81a from flowing out, to the situation that the connection status with external circuit has an impact to each external connection terminals side.

In addition, the 1st, the 3rd fusible conductor 13,81 is coated with solder flux 24 in order to anti-oxidation, raising wetability etc.In addition, in temperature switching device 80, cover 25 covers on the surperficial 10a of insulated substrate 10.

Temperature switching device 80 at the thermal source adstante febre of outside, as shown in Figure 26 (A) (B), via heat transfer component heat fused the 1st, the 3rd fusible conductor 13,81 of insulated substrate 10, the 1st ~ 4th electrode 11,12,83,84 etc.And, in temperature switching device 80, because fusing conductor 13a condenses the 1st, the 2nd electrode 11,12 short circuits between the 1st, the 2nd electrode 11,12, in addition, block between the 3rd, the 4th electrode 83,84 because the 3rd fusible conductor 81 fuses.

In addition, as shown in figure 25, temperature switching device 80 also can make the 1st fusible conductor 13 extending with the 2nd electrode 12 opposition side to the 1st electrode 11, and extending with the 1st electrode 11 opposition side to the 2nd electrode 12.Thus, temperature switching device 80 can increase the amount of the fusing conductor 13a condensed between the 1st, the 2nd electrode 11,12, thus makes it reliably short circuit.

In addition, in temperature switching device 80, the 1st fusible conductor 13 preferably formed with tabular has than the area large with the connection area of the 1st electrode 11.Thus, the 1st fusible conductor 13 can guarantee the amount of the fusing conductor making 11,12 short circuits of the 1st, the 2nd electrode fully.

In addition, temperature switching device 80 is same with said temperature short-circuit component 30, also can arrange the end supporting and be supported on the 1st fusible conductor 13 of the 1st electrode 11.

[temperature switching device 87]

In addition, be suitable for temperature switching device of the present invention, can be also surface mount applications and being formed, and expand the Area of bearing of the 1st fusible conductor 13 formed by the 1st, the 2nd electrode 11,12, to prevent the distortion of the 1st fusible conductor 13 and to prevent incipient short.In addition, in the following description, identical label marked for the structure identical with above-mentioned temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80 and omit that it is detailed.

As shown in figure 27, this temperature switching device 87 possesses: insulated substrate 10; Be formed in the 1st ~ 4th electrode 11,12,83,84 of the surperficial 10a of insulated substrate 10; 1st, the 2nd electrode 11,12 exposes opposed each leading section 11b, 12b of the 1st, the 2nd electrode 11,12 and the 1st stacked insulating barrier 17; Than being formed in the 1st on the surperficial 10a of insulated substrate 10, the 2nd electrode 11,12 thick the 2nd insulating barriers 51; Be equipped on the 1st fusible conductor 13 on the 1st, the 2nd insulating barrier 17,51; And the 3rd fusible conductor 81 be connected between the 3rd, the 4th electrode 83,84.In addition, Figure 27 (A) is the cover 25 of removing temperature switching device 87 and the plane graph that illustrates, and being with the A-A ' sectional view of figure shown in (A) with figure (B), is with the B-B ' sectional view of figure shown in (A) with figure (C).

In temperature switching device 87 the 1st, the 2nd electrode 11,12 are same with temperature short-circuit component 60, extensively formed throughout with the length direction of the insulated substrate 10 of rectangular-shaped formation, and be formed into central portion from the both sides of the edge of the Width of insulated substrate 10, separate predetermined distance and opposed, expose opposite leading section 11b, 12b from the 1st insulating barrier 17 being layered in substantially central portion.

In addition, in temperature switching device 87, the 1st, the 2nd insulating barrier 17,51 is formed in the same manner as temperature short-circuit component 60, is formed with the peristome 61 of the substantially rectangular shape that opposite each leading section 11b, 12b of the 1st, the 2nd electrode 11,12 are exposed.

1st fusible conductor 13 is equipped on the 1st, the 2nd insulating barrier 17,51 in the mode covering peristome 61, and is fixed in the 1st electrode 11 via the grafting material 18 of joint scolding tin etc.Thus, the whole surrounding of the 1st fusible conductor 13 is supported by the 1st, the 2nd insulating barrier 17,51, prevents the flexure of length direction and Width.

Therefore, according to temperature switching device 87, reflux install time etc. in can reliably prevent the 1st fusible conductor 13 from bending, and the incipient short of short circuit because of the distortion of the 1st fusible conductor 13 to be prevented between the 1st, the 2nd electrode 11,12.

In such temperature switching device 87, if 1st, melt in the temperature atmosphere of the 3rd fusible conductor 13,81 more than the fusing point of the 1st, the 3rd fusible conductor 13,81, then melt conductor 13a and condense between leading section 11b, 12b throughout the face from peristome 61 the 1st, the 2nd each of electrode 11,12.Thus, in temperature switching device 87, fusing conductor 13a condenses, by reliably short circuit between the 1st, the 2nd electrode 11,12 throughout between the 1st, the 2nd electrode 11,12.In addition, in temperature switching device 87, be truncated between the 3rd, the 4th electrode 83,84 because the 3rd fusible conductor 81 fuses.

[temperature switching device 90]

In addition, be suitable for temperature switching device of the present invention, also can support the 1st fusible conductor 13 at the 1st electrode 11, and support the 2nd fusible conductor 21 at the 2nd electrode 12.In addition, in the following description, identical label marked for the structure identical with above-mentioned temperature short-circuit component 1,40,50,60,70 and temperature switching device 80 and omit that it is detailed.

Temperature switching device 90 shown in Figure 28 is same with above-mentioned temperature short-circuit component 40, is formed with the 1st, the 2nd electrode 11,12 on the insulating substrate 10, the 1st electrode 11 is supported with the 1st fusible conductor 13, the 2nd electrode 12 is supported with the 2nd fusible conductor 21.Temperature switching device 90 separately supports fusible conductor because of the 1st, the 2nd electrode 11,12, so open before the fusing of the 1st, the 2nd fusible conductor 13,21.1st ~ 3rd fusible conductor 13,21,81 has identical material, identical structure, melts in roughly the same temperature atmosphere.In addition, solder flux 24 is coated with in order to anti-oxidation, raising wetability etc. at the 1st ~ 3rd fusible conductor 13,21,81.

In addition, temperature switching device 90 is same with above-mentioned temperature short-circuit component 40, also can by fixed part 42 in the affixed one end being supported on the 1st fusible conductor 13 of the 1st electrode 11 of insulated substrate 10, similarly, by fixed part 42 in the affixed one end being supported on the 2nd fusible conductor 21 of the 2nd electrode 12 of insulated substrate 10.In addition, temperature switching device 90 is same with above-mentioned temperature short-circuit component 40, also can arrange the 2nd support electrode 43 at insulated substrate 10, supports the end of the 1st, the 2nd fusible conductor 13,21 via grafting material 18.

Temperature switching device 90 makes to melt in the temperature atmosphere of the 1st ~ 3rd fusible conductor 13,21,81 more than the fusing point of the 1st ~ 3rd fusible conductor 13,21,81.Thus, as shown in figure 29, in temperature switching device 90, fusing conductor 13a to condense on the 1st electrode 11 and melts conductor 21a and condenses on the 2nd electrode 12.Thus, fusing conductor 13a, 21a condense throughout between the 1st, the 2nd electrode 11,12, thus 11,12 short circuits of the 1st, the 2nd electrode.In addition, the 3rd fusible conductor 81 fuses, and is truncated between the 3rd, the 4th electrode 83,84.

In addition, the 1st, the 2nd fusible conductor 13,21 formed with tabular, preferably has the area large with the connection area of respective 1st, the 2nd electrode 11,12.Thus, the 1st, the 2nd fusible conductor 13,21 can guarantee the amount of the fusing conductor making 11,12 short circuits of the 1st, the 2nd electrode fully.

[heat conduction path]

In addition, temperature switching device 90 described above is same with temperature switching device 80, also the fusing order of restriction the 1st fusible conductor 13 and the 3rd fusible conductor 81 be can pass through, the short circuit between external circuit 28A, 28B and the order of blocking between external circuit 85A, 85B limited.1st fusible conductor 13 and the 3rd fusible conductor 81 fusing order, can by the fusing point arranging the 1st fusible conductor 13 and the 3rd fusible conductor 81 poor or change sectional area limit.

In addition, temperature switching device 90 also by the pyroconductivity of the heat conduction path till the 3rd fusible conductor 81 that changes the 3rd electrode 83 playing the heat conduction path till the 1st fusible conductor 13 of the 1st electrode 11 of function as heat transfer component 82 and play function as heat transfer component 82, can limit the fusing order of the 1st fusible conductor 13 and the 3rd fusible conductor 81.

Namely, as shown in figure 30, in temperature switching device 90, the 1st, the 2nd electrode 11,12 plays function as the heat transfer component transmitting the heat of the thermal source from outside to the 1st fusible conductor 13, and the 3rd electrode 83 plays function as the heat transfer component transmitting the heat of the thermal source from outside to the 3rd fusible conductor 81.Now, such as, in temperature switching device 90, heat-transfer path P1, P2 of the thermal source from outside of the 1st, the 2nd electrode 11,12 are formed as thin and long, and the heat-transfer path P3 of the thermal source from outside of the 3rd electrode 83 is formed as thick and short.

Thus, the pyroconductivity of heat-transfer path P1, P2 of heat is transmitted to the 1st fusible conductor 13 relatively lower than the heat-transfer path P3 transmitting heat to the 3rd fusible conductor 81.Thus, temperature switching device 90 the thermal source 15 from outside heat and become the temperature atmosphere of more than the fusing point of the 1st, the 3rd fusible conductor 13,81 time, first conduct heat to the 3rd fusible conductor 81 than the 1st fusible conductor 13.Therefore, temperature switching device 90 can make the 3rd fusible conductor 81 first melt thus block between external circuit 85A, 85B, then, makes the 1st fusible conductor 13 melt and make short circuit between external circuit 28A, 28B.

In addition, temperature switching device 90 also can by forming the 1st, the 2nd electrode the 11,12 and the 3rd electrode 83 with the different materials of pyroconductivity, changes the pyroconductivity of heat-transfer path P1, P2 from the thermal source of outside and heat-transfer path P3.

[temperature switching device 97]

In addition, being suitable for temperature switching device of the present invention also can be surface mount applications and being formed, and with the 2nd electrode 12 is located at the cap Electrode connection of cover.In addition, in the following description, for marking identical label with above-mentioned temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80,90 identical structures and omitting that it is detailed.

As shown in figure 31, this temperature switching device 97 is laminated with the 1st ~ 4th electrode the 11,12,83,84, the 3rd fusible conductor 81 at the surperficial 10a of insulated substrate 10 and is connected across on the 3rd, the 4th electrode 83,84 by grafting material 18.In addition, temperature switching device 97 possess cover the 25,2nd electrode 12 on the surface covering insulated substrate 10 with the end face 25b of cover 25 opposed with the 1st electrode 11 the cap electrode 71 that formed connect.In addition, Figure 31 (A) is the cover 25 of temperature switching device 97 before the fusing of removing the 1st fusible conductor 13 and the plane graph that illustrates, and being with the A-A ' sectional view of figure shown in (A) with figure (B), is with the B-B ' sectional view of figure shown in (A) with figure (C).In addition, Figure 32 is the cover 25 of temperature switching device 97 after the fusing of removing the 1st fusible conductor 13 and the plane graph that illustrates, and being with the A-A ' sectional view of figure shown in (A) with figure (B), is with the B-B ' sectional view of figure shown in (A) with figure (C).

Cover 25 is formed with cap electrode 71 from a lateral edge portion 25a of cover 25 to end face 25b, and by being equipped on insulated substrate 10, cap electrode 71 is connected with the 2nd electrode 12.In addition, the 1st, the 2nd electrode 11,12 disconnected from each other and open.In addition, the 1st, the 2nd electrode 11,12 is connected with external connection terminals 11a, 12a of the back side 10b being formed in insulated substrate 10.Temperature switching device 97 loads the various external circuits of power circuit etc. via this external connection terminals 11a, 12a.

In addition, cap electrode 71 is opposed with the 1st electrode 11 formed on the insulating substrate 10, and is configured with the 1st fusible conductor 13 between the 1st electrode 11.1st fusible conductor 13 is fixed on the 1st electrode 11 via grafting material 18.In addition, the 1st fusible conductor 13 also can arrange above-mentioned fixed part 42 or the 1st support electrode 31, the 2nd insulating barrier 51 at insulated substrate 10, and is supported by these.

In such temperature switching device 97, if 1st, melt in the temperature atmosphere of the 3rd fusible conductor 13,81 more than the fusing point of the 1st, the 3rd fusible conductor 13,81, then as shown in figure 32, fusing conductor 13a condenses on the 1st electrode 11, and also condenses on end face 25b and the 1st electrode 11 cap electrode 71 arranged opposite.Thus, temperature switching device 97 can make the 1st, the 2nd electrode 11,12 short circuit via fusing conductor 13a and cap electrode 71.In addition, in temperature switching device 97, the 3rd fusible conductor 81 fuses, thus is truncated between the 3rd, the 4th electrode 83,84.

[other structure]

In addition, in above-mentioned each temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80,90,97, the 1st fusible conductor 13 formed with tabular is preferably made to have the area with more than 2 times of the connection area of the 1st electrode 11.Thus, the 1st fusible conductor 13 not only guarantees to make fully the amount of the fusing conductor 13a of short circuit between the 1st electrode 11 and the 2nd electrode 12 or cap electrode 71, and when end being supported in fixed part 42 or the 1st support electrode 31, also can quick-break.

In addition, in above-mentioned each temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80,90,97, with wire material formed the 1st fusible conductor 13 also can, in this case, preferably make the 1st fusible conductor 13 have the length with more than 2 times of the connecting length of the 1st electrode 11.Thus, the 1st fusible conductor 13 not only guarantees to make fully the amount of the fusing conductor 13a of short circuit between the 1st electrode 11 and the 2nd electrode 12 or cap electrode 71, and when end being supported in fixed part 42 or the 1st support electrode 31, also can quick-break.

And then, in above-mentioned each temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80,90,97, below the width preferably making the 1st electrode 11 on the extended line being spaced apart the 1st, the 2nd electrode gap of the 1st, the 2nd electrode 11,12.Such as, as shown in Figure 1, in temperature short-circuit component 1, the interval W of the 1st, the 2nd electrode 11,12 is preferably made ₁be the 1st, the 2nd electrode gap extended line on the width W of the 1st electrode 11 ₂below.Thus, 1st, the 2nd electrode 11,12 can be configured in more close position, when the fusing conductor 13a of the 1st fusible conductor 13 condenses the surrounding in the 1st electrode 11, more reliably also can contact with the 2nd electrode 12, fusing conductor 13a is condensed throughout between the 1st, the 2nd electrode 11,12.

In addition, the general electrode material of Cu, Ag etc. can be used to be formed at the 1st ~ 4th electrode the 11,12,83,84, the 1st, the 2nd support electrode 31,43 of above-mentioned each temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80,90,97 and cap electrode 71, preferably utilize the known method of coating process etc. to apply the overlay film of Ni/Au coating, Ni/Pd coating, Ni/Pd/Au coating etc. from the teeth outwards.Thus, each temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80,90,97 can prevent the oxidation of the 1st ~ 4th electrode the 11,12,83,84, the 1st support electrode 31 and cap electrode 71, and reliably can keep the 1st ~ 3rd fusible conductor 13,21,81.In addition, when temperature short-circuit component 1,30,40,50,60,70 and temperature switching device 80,90,97 being refluxed installation, by connecting the grafting material 18 of the connection scolding tin of the 1st ~ 3rd fusible conductor 13,21,81 etc. or forming the fusing of outer field low-melting-point metal of the 1st ~ 3rd fusible conductor 13,21,81, the 1st ~ 4th electrode the 11,12,83,84, the 1st, the 2nd support electrode 31,43 and cap electrode 71 can be prevented by corrode (erosion scolding tin).

[structure of fusible conductor]

As mentioned above, the 1st ~ 3rd fusible conductor 13,21,81 also can contain low-melting-point metal and refractory metal.In addition, in the following description, except needing the situation of special difference, the 1st ~ 3rd fusible conductor 13,21,81 is referred to as " fusible conductor 13,21,81 ".As low-melting-point metal, preferably use take Sn as the scolding tin of the Pb-free solder of principal component etc., as refractory metal, and the alloy etc. preferably using Ag, Cu or be principal component with these.Now, fusible conductor 13,21,81, as shown in Figure 33 (A) (B), also can be used as internal layer to arrange low-melting-point metal layer 92, arrange the fusible conductor of high melting point metal layer 91 as skin.In this case, fusible conductor 13,21,81 both can be whole the structure covered by high melting point metal layer 91 of low-melting-point metal layer 92, also can be structure capped except a pair opposite side.

The covered structure formed by high melting point metal layer 91 of low-melting-point metal layer 92, can use the known film technique of coating etc. to be formed.Wherein, can implement the electrolysis plating of high-melting metal coating continuously to the low melting point metal material of wire or long ruler-like, be favourable on operating efficiency, in manufacturing cost.

In addition, fusible conductor 13,21,81 also can be used as skin to be provided with low-melting-point metal layer 92, be provided with the fusible conductor of high melting point metal layer 91 as internal layer.In this case, fusible conductor 13,21,81 both for making whole the structure covered by low-melting-point metal layer 92 of high melting point metal layer 91, can also can be structure capped except opposite a pair side.

In addition, as shown in figure 34, fusible conductor 13,21,81 also can be high melting point metal layer 91 and the stacked stepped construction of low-melting-point metal layer 92.

In this case, fusible conductor 13,21,81 is as shown in Figure 34 (A), both can be and formed with 2 Rotating fields be made up of the lower floor be connected with the 1st ~ 4th electrode the 11,12,83,84 or the 1st, the 2nd support electrode 31,43 etc. and upper strata stacked in lower floor, build up the low-melting-point metal layer 92 into upper strata at the upper surface layer of the high melting point metal layer 91 becoming lower floor, also can build up the high melting point metal layer 91 into upper strata at the upper surface layer of the low-melting-point metal layer 92 becoming lower floor on the contrary.Or, fusible conductor 13,21,81 is as shown in Figure 34 (B), both can be formed as by internal layer with at the 3-tier architecture that the skin that the upper and lower surface of internal layer is stacked is formed, also can become outer field low-melting-point metal layer 92 the upper and lower surface of the high melting point metal layer 91 becoming internal layer is stacked, become outer field high melting point metal layer 91 and also can the upper and lower surface of the low-melting-point metal layer 92 becoming internal layer is stacked on the contrary.

The laminate structure of high melting point metal layer 91 and low-melting-point metal layer 92, can be formed by the high melting point metal materials of the low melting point metal material of laying sheets and sheet.Such as, in the stacked stepped construction becoming outer field high melting point metal layer 91 of the upper and lower surface of the low-melting-point metal layer 92 becoming internal layer, as shown in figure 35, can in the upper and lower surface of the solder foil 92a of the low-melting-point metal layer 92 of formation sheet, the Ag paper tinsel 91a of the high melting point metal layer 91 of stacked formation sheet, carries out hot pressing or hot rolling and is formed under determined temperature, pressure.In the fusible conductor 13,21,81 be made up of the laminate structure of high melting point metal layer 91 and low-melting-point metal layer 92, the interface of low melting point metal material and high melting point metal materials by punching press under determined temperature, pressure or rolling by alloying, integration.In addition, this fusible conductor 13,21,81 is laminated with high melting point metal layer 91 throughout whole of low-melting-point metal layer 92 with roughly uniform thickness.

Other, the laminate structure of high melting point metal layer 91 and low-melting-point metal layer 92, also can, by the upper and lower surface of the solder foil 92a of the low-melting-point metal layer 92 in formation sheet, the known film formation process of evaporation, sputtering etc. be utilized to carry out the metal material of stacked formation high melting point metal layer 91 and formed.

In addition, fusible conductor 13,21,81 as shown in figure 36, also can be high melting point metal layer 91 and the alternately laminated sandwich construction of more than 4 layers of low-melting-point metal layer 92.In this case, fusible conductor 13,21,81 also can be to utilize and forms outermost metal level to the structure covering whole or carry out covering except a pair opposite side.

In addition, fusible conductor 13,21,81 also can on the surface of the low-melting-point metal layer 92 of formation internal layer with striated stacked high melting point metal layer 91 partly.Figure 37 is the plane graph of fusible conductor 13,21,81.

Fusible conductor 13,21,81 shown in Figure 37 (A) forms the high melting point metal layer 91 of multiple wire along its length with predetermined distance by the surperficial broad ways at low-melting-point metal layer 92, alongst form the peristome 93 of wire, expose low-melting-point metal layer 92 from this peristome 93.Fusible conductor 13,21,81 exposes from peristome 93 by making low-melting-point metal layer 92, increases the low-melting-point metal of fusing and the contact area of refractory metal, promotes the corrosion function of high melting point metal layer 91 further and can improve fusing.Peristome 93 can be formed by such as implementing the coating of the metal forming high melting point metal layer 91 to low-melting-point metal layer 92 local.

In addition, fusible conductor 13,21,81 is as shown in Figure 37 (B), also can form the high melting point metal layer 91 of multiple wire on the surface of low-melting-point metal layer 92 along its length with predetermined distance along Width, thus form the peristome 93 of wire along Width.

In addition, fusible conductor 13,21,81 as shown in figure 38, also can form high melting point metal layer 91 on the surface of low-melting-point metal layer 92, and circular peristome 94 is formed throughout whole of high melting point metal layer 91, expose low-melting-point metal layer 92 from this peristome 94.Peristome 94 can be formed by such as implementing the coating of the metal forming high melting point metal layer 91 in low-melting-point metal layer 92 local.

Fusible conductor 13,21,81, by exposing low-melting-point metal layer 92 from peristome 94, increases the contact area with the low-melting-point metal melted and refractory metal, promotes the corrosion function of refractory metal further and can improve fusing.

In addition, fusible conductor 13,21,81 as shown in figure 39, also can form multiple peristome 95 at the high melting point metal layer 91 becoming internal layer, utilizes coating technology etc. to come at this high melting point metal layer 91 film forming low-melting-point metal layer 92, is filled in peristome 95.Thus, the area that the low-melting-point metal that fusible conductor 13,21,81 increases fusing connects with refractory metal, therefore, it is possible to low-melting-point metal can corrode refractory metal in shorter time.

In addition, fusible conductor 13,21,81 is preferably formed to the volume making the volume of low-melting-point metal layer 92 more than high melting point metal layer 91.Fusible conductor 13,21,81 is heated because of temperature atmosphere more than fusing point, and the corrode refractory metal because of low-melting-point metal fusing, can melt rapidly thus, fuse.Therefore, fusible conductor 13,21,81, by being formed as the volume making the volume of low-melting-point metal layer 92 more than high melting point metal layer 91, promotes this corrosion, can make rapid short circuit between the 1st, the 2nd electrode 11,12.

In addition, the variation of the operating chacteristics that fusible conductor 13,21,81 causes in order to anti-oxidation, also can arrange the oxygen-proof film of CuO film, Au film etc. on surface.

Label declaration

1 temperature short-circuit component; 10 insulated substrates; 11 the 1st electrodes; 11a external connection terminals; 12 the 2nd electrodes; 12a external connection terminals; 13 the 1st fusible conductors; 13a melts conductor; 14 heat transfer components; 15 thermals source; 17 the 1st insulating barriers; 18 grafting materials; 21 the 2nd fusible conductors; 24 solder flux; 25 covers; 25a sidewall; 25b end face; 28 external circuits; 30 temperature short-circuit components; 31 the 1st support electrodes; 40 temperature short-circuit components; 42 fixed parts; 43 the 2nd support electrodes; 50 temperature short-circuit components; 51 the 2nd insulating barriers; 52 peristomes; 60 temperature short-circuit components; 61 peristomes; 70 temperature short-circuit components; 71 cap electrodes; 80 temperature switching devices; 81 the 3rd fusible conductors; 82 heat transfer components; 83 the 3rd electrodes; 83a external connection terminals; 84 the 4th electrodes; 84a external connection terminals; 85 external circuits; 87 temperature switching devices; 90 temperature switching devices; 91 high melting point metal layers; 92 low-melting-point metal layers; 93 peristomes; 94 peristomes; 95 peristomes; 97 temperature switching devices.

Claims

1. a temperature short-circuit component, wherein possesses:

1st electrode;

2nd electrode, with described 1st electrode adjacent arrange; And

1st fusible conductor, by melting thus condensing throughout between described 1st, the 2nd electrode, makes described 1st, the 2nd electric pole short circuit,

Melt in the temperature atmosphere of described 1st fusible conductor more than the fusing point of described 1st fusible conductor.

2. temperature short-circuit component as claimed in claim 1, wherein,

Possess the heat transfer component of the heat transmitting self-heat power,

Described heat transfer component and described 1st electrode or described 1st fusible conductor continuous.

3. temperature short-circuit component as claimed in claim 2, wherein, described heat transfer component at least surface is insulating material.

4. the temperature short-circuit component as described in any one of claims 1 to 3, wherein, described 1st fusible conductor is supported on described 1st electrode.

5. the temperature short-circuit component as described in any one of Claims 1 to 4, wherein,

The 1st insulating barrier is provided with at least partially at described 2nd electrode,

Described 1st fusible conductor is overlapping with described 2nd electrode and by described 1st insulation layer supports, thus described 1st, the 2nd electrode is open.

6. the temperature short-circuit component as described in any one of claims 1 to 3, wherein,

There is insulated substrate,

Described 1st, the 2nd electrode is formed in the conductive pattern on described insulated substrate.

7. temperature short-circuit component as claimed in claim 5, wherein,

There is insulated substrate,

8. temperature short-circuit component as claimed in claim 6, wherein,

On described insulated substrate, be provided with 2nd insulating barrier also higher than the thickness of described 1st, the 2nd electrode,

Described 1st fusible conductor is overlapping with described 1st, the 2nd electrode and by described 2nd insulation layer supports, thus described 1st, the 2nd electrode is open.

9. temperature short-circuit component as claimed in claim 7, wherein,

Described 1st insulating barrier is layered on described 1st, the 2nd electrode, and by being provided with 2nd insulating barrier also higher than the thickness of described 1st, the 2nd electrode on described insulated substrate, is provided with the opening that opposed each leading section that is described 1st, 2 electrodes is exposed,

Described 1st fusible conductor is equipped on described 1st, the 2nd insulating barrier in the mode covering described opening.

10. the temperature short-circuit component as described in any one of claims 1 to 3, wherein, is provided with the 1st support electrode supporting described 1st fusible conductor.

11. temperature short-circuit components as claimed in claim 7, wherein, are provided with the 1st support electrode supporting described 1st fusible conductor.

12. temperature short-circuit components as described in any one of claims 1 to 3, wherein, have the cover at least covering described 1st fusible conductor.

13. temperature short-circuit components as claimed in claim 12, wherein,

The end face of described cover be provided with in inside overlapping with described 1st electrode and described 1st fusible conductor and with described 2nd electrode continuous print cap electrode,

Melt in the temperature atmosphere of described 1st fusible conductor more than the fusing point of described 1st fusible conductor, described 1st, the 2nd electrode is via described cap electric pole short circuit.

14. temperature short-circuit components as claimed in claim 6, wherein, described insulated substrate, described 1st electrode or shell body become the heat transfer component carrying out the heat of self-heat power to described 1st fusible conductor transmission.

15. temperature short-circuit components as claimed in claim 6, wherein, described insulated substrate is that ceramic substrate or surface are by the metal substrate covered that insulate.

16. temperature short-circuit components as described in any one of claims 1 to 3, wherein, possess the 2nd fusible conductor with described 2nd Electrode connection.

17. temperature short-circuit components as claimed in claim 6, wherein, possess the 2nd fusible conductor with described 2nd Electrode connection.

18. temperature short-circuit components as described in any one of claims 1 to 3, wherein, described 1st fusible conductor has than the area large with the connection area of described 1st electrode.

19. temperature short-circuit components as claimed in claim 6, wherein, described 1st fusible conductor by fixed part make with the connecting portion of described 1st electrode beyond position at least affixed with described insulated substrate.

20. temperature short-circuit components as claimed in claim 16, wherein, described 2nd fusible conductor has than the area large with the connection area of described 2nd electrode.

21. temperature short-circuit components as claimed in claim 16, wherein, are provided with the 2nd support electrode supporting described 1st, the 2nd fusible conductor.

22. temperature short-circuit components as claimed in claim 16, wherein, described 2nd fusible conductor by fixed part make with the connecting portion of described 2nd electrode beyond position at least affixed with described insulated substrate.

23. temperature short-circuit components as described in any one of claims 1 to 3, wherein, are coated with solder flux at least partially at described 1st fusible conductor.

24. temperature short-circuit components as described in any one of claims 1 to 3, wherein, described 1st fusible conductor has low-melting-point metal and refractory metal.

25. temperature short-circuit components as claimed in claim 24, wherein, described 1st fusible conductor is the duplexer of described low-melting-point metal and described refractory metal.

26. temperature short-circuit components as claimed in claim 24, wherein, described 1st fusible conductor is the covered structure that the surface of described low-melting-point metal is covered by described refractory metal.

27. temperature short-circuit components as claimed in claim 24, wherein, described low-melting-point metal is scolding tin, and described refractory metal is Ag, Cu or the alloy that is principal component with Ag or Cu.

28. temperature short-circuit components as claimed in claim 27, wherein, described low-melting-point metal is Sn or take Sn as the alloy of principal component.

29. temperature short-circuit components as claimed in claim 27, wherein, described low-melting-point metal is the low-melting alloy of SnBi class or SnIn class.

30. temperature short-circuit components as claimed in claim 24, wherein, described low-melting-point metal volume is more than described refractory metal.

31. temperature short-circuit components as claimed in claim 24, wherein, described refractory metal is formed by the overlay coating to described low-melting-point metal.

32. temperature short-circuit components as claimed in claim 24, wherein, described refractory metal is formed by the surface mount metal forming to described low-melting-point metal.

33. temperature short-circuit components as claimed in claim 24, wherein, described refractory metal is formed in the surface of described low-melting-point metal by film formation process.

34. temperature short-circuit components as claimed in claim 24, wherein, are formed with oxygen-proof film further on the surface of described refractory metal.

35. temperature short-circuit components as claimed in claim 24, wherein, described low-melting-point metal and described refractory metal alternately laminated multi-layer.

36. temperature short-circuit components as claimed in claim 24, wherein, the peripheral part except 2 opposed end faces of described low-melting-point metal is covered by described refractory metal.

37. 1 kinds of temperature switching devices, wherein possess:

1st electrode;

2nd electrode, with described 1st electrode adjacent arrange;

1st fusible conductor, by melting thus condensing throughout between described 1st, the 2nd electrode, thus makes described 1st, the 2nd electric pole short circuit;

3rd electrode and the 4th electrode; And

3rd fusible conductor, connects across described 3rd, the 4th electrode, blocks between described 3rd, the 4th electrode by melting,

Melt in the temperature atmosphere of described 1st, the 3rd fusible conductor more than the fusing point of described 1st, the 3rd fusible conductor.

38. temperature switching devices as claimed in claim 37, wherein,

Possess the heat transfer component of the heat transmitting self-heat power,

Described heat transfer component and described 1st electrode or described 1st fusible conductor and described 3rd electrode or described 3rd fusible conductor continuous.

39. temperature switching devices as claimed in claim 38, wherein, described heat transfer component at least surface is insulating material.

40. temperature switching devices as described in any one of claim 37 ~ 39, wherein, described 1st fusible conductor is supported on described 1st electrode.

41. temperature switching devices as described in any one of claim 37 ~ 39, wherein,

Described 1st fusible conductor is overlapping with described 2nd electrode and be supported on described 1st insulating barrier, thus described 1st, the 2nd electrode is open.

42. temperature short-circuit components as described in any one of claim 37 ~ 39, wherein,

There is insulated substrate,

Described 1st ~ 4th electrode is formed in the conductive pattern on described insulated substrate.

43. temperature short-circuit components as claimed in claim 41, wherein,

There is insulated substrate,

44. temperature switching devices as claimed in claim 42, wherein,

Described insulated substrate is provided with 2nd insulating barrier also higher than the thickness of described 1st, the 2nd electrode,

Described 1st fusible conductor is overlapping with described 1st, the 2nd electrode and be supported on described 2nd insulating barrier, thus described 1st, the 2nd electrode is open.

45. temperature switching devices as claimed in claim 43, wherein,

Described 1st fusible conductor is equipped on described 1st, the 2nd insulating barrier in the mode of the described opening covering described 1st insulating barrier.

46. temperature switching devices as described in any one of claim 37 ~ 39, wherein, are provided with the 1st support electrode supporting described 1st fusible conductor.

47. temperature switching devices as claimed in claim 43, wherein, are provided with the 1st support electrode supporting described 1st fusible conductor.

48. temperature switching devices as described in any one of claim 37 ~ 39, wherein, have the cover at least covering described 1st fusible conductor.

49. temperature switching devices as claimed in claim 48, wherein,

50. temperature switching devices as claimed in claim 42, wherein, described insulated substrate, described 1st electrode, described 3rd electrode or shell body become the heat transfer component carrying out the heat of self-heat power to described 1st fusible conductor and/or the 3rd fusible conductor transmission.

51. temperature switching devices as claimed in claim 42, wherein, described insulated substrate is that ceramic substrate or surface are by the metal substrate covered that insulate.

52. temperature switching devices as described in any one of claim 37 ~ 39, wherein, possess the 2nd fusible conductor with described 2nd Electrode connection.

53. temperature switching devices as claimed in claim 42, wherein, possess the 2nd fusible conductor with described 2nd Electrode connection.

54. temperature switching devices as described in any one of claim 37 ~ 39, wherein, described 1st fusible conductor has than the area large with the connection area of described 1st electrode.

55. temperature switching devices as claimed in claim 42, wherein, described 1st fusible conductor by fixed part make with the connecting portion of described 1st electrode beyond position at least affixed with described insulated substrate.

56. temperature switching devices as claimed in claim 52, wherein, described 2nd fusible conductor has than the area large with the connection area of described 2nd electrode.

57. temperature switching devices as claimed in claim 52, wherein, are provided with the 2nd support electrode supporting described 1st, the 2nd fusible conductor.

58. temperature switching devices as claimed in claim 52, wherein, described 2nd fusible conductor by fixed part make with the connecting portion of described 2nd electrode beyond position at least affixed with described insulated substrate.

59. temperature switching devices as described in any one of claim 37 ~ 39, wherein, are coated with solder flux at least partially at described 1st fusible conductor and described 3rd fusible conductor.

60. temperature switching devices as described in any one of claim 37 ~ 39, wherein, described 1st fusible conductor and described 3rd fusible conductor have low-melting-point metal and refractory metal.

61. temperature switching devices as claimed in claim 60, wherein, described 1st fusible conductor and described 3rd fusible conductor are the duplexers of described low-melting-point metal and described refractory metal.

62. temperature switching devices as claimed in claim 60, wherein, described 1st fusible conductor and described 3rd fusible conductor are the covered structures that the surface of described low-melting-point metal is covered by described refractory metal.

63. temperature switching devices as claimed in claim 60, wherein, described low-melting-point metal is scolding tin, and described refractory metal is Ag, Cu or the alloy that is principal component with Ag or Cu.

64. temperature switching devices as described in claim 63, wherein, described low-melting-point metal is Sn or take Sn as the alloy of principal component.

65. temperature switching devices as described in claim 63, wherein, described low-melting-point metal is the low-melting alloy of SnBi class or SnIn class.

66. temperature switching devices as claimed in claim 60, wherein, described low-melting-point metal volume is more than described refractory metal.

67. temperature switching devices as claimed in claim 60, wherein, described refractory metal is formed by the overlay coating to described low-melting-point metal.

68. temperature switching devices as claimed in claim 60, wherein, described refractory metal is formed by the surface mount metal forming to described low-melting-point metal.

69. temperature switching devices as claimed in claim 60, wherein, described refractory metal utilizes film formation process to be formed in the surface of described low-melting-point metal.

70. temperature switching devices as claimed in claim 60, wherein, are formed with oxygen-proof film further on the surface of described refractory metal.

71. temperature switching devices as claimed in claim 60, wherein, described low-melting-point metal and described refractory metal alternately laminated multi-layer.

72. temperature short-circuit components as claimed in claim 60, wherein, the peripheral part except 2 opposed end faces of described low-melting-point metal is covered by described refractory metal.

73. temperature switching devices as described in any one of claim 37 ~ 39, wherein, any one fusing point of described 1st fusible conductor and described 3rd fusible conductor is lower than another, and after this fusible conductor fusing, another fusible conductor melts.

74. temperature switching devices as described in any one of claim 37 ~ 39, wherein, heat conduction path to described 1st fusible conductor of described 1st electrode as heat transfer component performance function and the heat conduction path to described 3rd fusible conductor of described 3rd electrode as heat transfer component performance function, the pyroconductivity of any one is higher than another, after the fusible conductor be connected with this heat conduction path melts, another fusible conductor be connected with another heat conduction path melts.