TW201534553A - Electronic functional component and method for producing an electronic functional component - Google Patents

Electronic functional component and method for producing an electronic functional component Download PDF

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Publication number
TW201534553A
TW201534553A TW104101760A TW104101760A TW201534553A TW 201534553 A TW201534553 A TW 201534553A TW 104101760 A TW104101760 A TW 104101760A TW 104101760 A TW104101760 A TW 104101760A TW 201534553 A TW201534553 A TW 201534553A
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TW
Taiwan
Prior art keywords
component
electronic
functional
functional layer
electronic component
Prior art date
Application number
TW104101760A
Other languages
Chinese (zh)
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TWI706910B (en
Inventor
安德亞斯 庫格勒
魯本 法爾
克里斯提娜 貝爾蕭
烏爾立希 沙夫
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羅伯特博斯奇股份有限公司
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Publication of TW201534553A publication Critical patent/TW201534553A/en
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Publication of TWI706910B publication Critical patent/TWI706910B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/46—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0019—Protection against thermal alteration or destruction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Abstract

The invention relates to an electronic functional component and to a production method for an electronic functional component. The electronic functional component comprises an electronic component, which is embedded into the functional component by means of a three-dimensional printing process. By means of the three-dimensional printing process, individual adaptation with regard to the shape and mechanical properties of the functional component can be performed in addition to the enclosing of the electronic component. Furthermore, the electrical connections of the electronic component are led to the surface of the functional component in a suitable form.

Description

電子功能構件與製造電子功能構件的方法 Electronic functional component and method of manufacturing electronic functional component

本發明係有關一種電子功能構件及其製造方法。 The present invention relates to an electronic functional component and a method of manufacturing the same.

已知有為防止受損或受到污染而嵌入塑膠的電子元件及電路組。此類構件一般以常用的噴塗法、射出成型法或模製法製成。 Electronic components and circuit sets that are embedded in plastic to prevent damage or contamination are known. Such components are typically made by conventional spray coating, injection molding or molding processes.

此外，最近亦已知有用來製造立體構件的立體(3D)印刷法。其中立體印刷機係以立體資料模型為基礎透過逐步添加或塗覆材料來產生物體。 Further, a stereoscopic (3D) printing method for manufacturing a three-dimensional member has recently been known. The three-dimensional printing machine generates objects by gradually adding or coating materials based on a stereoscopic data model.

德國專利申請DE 10 2011 078 757 A1揭露一種在立體印刷機上印刷立體元件的方法。為此需將用於待印刷構件的模型資料及品質屬性以及關於欲使用之立體印刷機所需滿足的要求的證書保存在可攜式儲存介質中。若儲存介質及立體印刷機的證書相符，便將模型資料傳輸給印刷機並由立體印刷機製作出期望的立體元件。 German Patent Application DE 10 2011 078 757 A1 discloses a method of printing a three-dimensional component on a three-dimensional printing press. For this purpose, the model data and quality attributes for the component to be printed and the certificate required for the required three-dimensional printing press to be used are stored in the portable storage medium. If the storage medium and the certificate of the three-dimensional printing press match, the model data is transmitted to the printing press and the desired three-dimensional element is produced by the three-dimensional printing mechanism.

本發明第一方面提出一種電子功能構件，包括基本元件，該基本元件包括電絕緣承載層；電子構件，該電子構件設於該基本元件上且包括電接頭；及功能層，該功能層在立體印刷程序中被套印於該基本元件 上且包括連接元件，該連接元件設計用於在該電子構件的電接頭與該功能層的外表面間形成電連接。 A first aspect of the invention provides an electronic functional component comprising a basic component comprising an electrically insulating carrier layer; an electronic component disposed on the basic component and comprising an electrical connector; and a functional layer, the functional layer being stereoscopic The printing process is overprinted in the basic component And including a connecting element designed to form an electrical connection between the electrical connector of the electronic component and the outer surface of the functional layer.

本發明另一方面提出一種製造電子功能構件的方法，包括以下步驟：提供包含電絕緣承載層的基本元件；將包含電接頭的電子構件設置到該基本元件上；在該基本元件上立體印刷功能層以及在該套印功能層內設置用於在該電子構件的電接頭與該功能層的外表面間形成電連接的連接元件。 Another aspect of the invention provides a method of manufacturing an electronic functional component, comprising the steps of: providing a basic component comprising an electrically insulating carrier layer; positioning an electronic component comprising an electrical connector onto the basic component; and performing a three-dimensional printing function on the basic component A layer and a connecting element for forming an electrical connection between the electrical connector of the electronic component and the outer surface of the functional layer are disposed within the layer.

本發明的基本理念係藉由立體印刷程序將電子構件整合於功能構件。藉由將電子構件整合於以立體印刷法製成的元件並且用導電通路對該元件的內部及表面進行結構化，可實現MID構件(MID=Molded Interconnect Device，模塑互連器件)樣式的全新結構形式。藉由將電子元件與以立體印刷法製成的元件連接，可將機械功能及電氣功能集中實現在一個功能構件中。其中，立體印刷程序在需要形成複雜的立體結構時亦能實現特別靈活的製程。 The basic idea of the invention is to integrate electronic components into functional components by means of a three-dimensional printing process. By integrating the electronic component into the component made by the embossing method and structuring the inside and the surface of the component with the conductive path, a new MID component (MID=Molded Interconnect Device) style can be realized. structure type. By connecting the electronic component to the component made by the embossing method, the mechanical function and the electrical function can be collectively realized in one functional component. Among them, the three-dimensional printing program can also achieve a particularly flexible process when it is required to form a complicated three-dimensional structure.

立體印刷程序無需使用諸如射出成型模等昂貴工具，故而能以低成本製造出單個構件或者進行件數較少的小批量製造。 The three-dimensional printing process does not require the use of an expensive tool such as an injection molding die, so that a single component can be manufactured at a low cost or a small-volume manufacturing with a small number of pieces can be performed.

此外，立體印刷法還能為功能構件內部的導電通路實現複雜佈線。具體而言，藉此亦能實現傳統技術無法實現或極難實現的線路交叉及類似佈線。 In addition, the embossing method can also implement complex wiring for the conductive paths inside the functional components. In particular, it is also possible to achieve line crossing and similar wiring that is not possible or extremely difficult to implement by conventional techniques.

此外還能為電子功能構件有效裝配關鍵構件，例如接頭間距極小的積體電路或微電機械系統等等。如此便能以極佳的程序穩定性及更低的生產成本製造電子功能構件。 In addition, it is possible to efficiently assemble key components for electronic functional components, such as integrated circuits or microelectromechanical systems with extremely small joint spacing. This makes it possible to manufacture electronic functional components with excellent program stability and lower production costs.

該功能構件的基本元件可包括電絕緣承載層。特定言之，亦可藉由立體印刷法已製成該基本元件。在此情況下，基本元件可透過該立體印刷程序而已明確具有相應的幾何形狀，該幾何形狀與該功能構件所應具有的結構形式相適配。藉此方式亦可使該功能構件的基本元件獲得一定功能。如此，該基本元件自身亦用作該功能構件的功能層。 The basic elements of the functional component may comprise an electrically insulating carrier layer. In particular, the basic element can also be made by a three-dimensional printing method. In this case, the basic element can be clearly adapted to have a corresponding geometry through the three-dimensional printing process, the geometry being adapted to the structural form that the functional component should have. In this way, the basic components of the functional component can also be given a certain function. As such, the basic element itself also serves as a functional layer of the functional component.

根據實施例，該電子功能構件進一步包括接觸元件，該接觸元件設於該功能層的外表面上且與該電子構件的電接頭及該功能層的外表面間的電連接電性相連。藉由在電子功能構件的外表面設置該接觸元件，電子功能構件可與外部接頭實現電接觸。如此便可以特別簡單的方式實現電子功能構件的可靠接觸。 According to an embodiment, the electronic functional component further comprises a contact element disposed on an outer surface of the functional layer and electrically connected to an electrical connection between the electrical connector of the electronic component and an outer surface of the functional layer. By providing the contact element on the outer surface of the electronic functional component, the electronic functional component can make electrical contact with the external connector. In this way, a reliable contact of the electronic functional component can be achieved in a particularly simple manner.

根據實施例，該基本元件包括與該電子構件的電接頭電性相連的導電結構。透過該導電結構，在電子功能構件內部便已能接觸電子構件的電接頭。藉此亦能接觸接頭間距極小的構件。該導電結構能提供足夠大的連接面來實現進一步接觸。具體來說，該導電結構能擴展該電構件較窄的接頭間距，從而與連接元件實現電接觸。 According to an embodiment, the base element comprises a conductive structure electrically connected to an electrical contact of the electronic component. Through the conductive structure, the electrical connector of the electronic component can be contacted inside the electronic functional component. This also makes it possible to access components with a very small joint spacing. The electrically conductive structure provides a sufficiently large attachment surface for further contact. In particular, the electrically conductive structure can extend the narrower joint spacing of the electrical component to provide electrical contact with the connecting component.

根據實施例，該功能層包括設於該電子構件與該功能層的外表面間的透明塑膠及/或導光體。該透明塑膠及/或導光體在電構件與功能層外表面間形成完整的光學連接。透過該透明塑膠及導光體可在電子構件與周圍環境間形成光學連接。藉此可由電子構件向周圍環境發送光信號及/或由周圍環境向電子構件及電子功能構件內部輸送光信號。該導光體及透明塑膠分別可被相關光譜穿透。該相關光譜具體亦可包括紫外線與紅外線。 According to an embodiment, the functional layer comprises a transparent plastic and/or light guide disposed between the electronic component and an outer surface of the functional layer. The transparent plastic and/or light guide body forms a complete optical connection between the electrical component and the outer surface of the functional layer. An optical connection between the electronic component and the surrounding environment can be achieved through the transparent plastic and the light guide. Thereby, the optical component can be transmitted to the surrounding environment by the electronic component and/or the optical signal can be transmitted from the surrounding environment to the electronic component and the electronic functional component. The light guide and the transparent plastic can be respectively penetrated by the relevant spectrum. The correlation spectrum may specifically include ultraviolet rays and infrared rays.

根據實施例，該功能層具有設於該電子構件與該功能層的外 表面間的通道結構。該通道結構可為連通功能層外表面與電子構件的空腔。此通道結構中具體可通氣體及/或流體。透過該通道結構，電子構件得以接觸到來自於周圍環境的物質並在此期間偵測一或數個環境參數。 According to an embodiment, the functional layer has an outer layer disposed outside the electronic component and the functional layer The channel structure between the surfaces. The channel structure may be a cavity that connects the outer surface of the functional layer with the electronic component. In this channel structure, gas and/or fluid can be specifically passed. Through the channel structure, the electronic component is exposed to substances from the surrounding environment and detects one or several environmental parameters during this period.

根據實施例，該電子構件包括感測器。透過該感測器可偵測一或數個環境參數並提供與偵測到的參數相對應的電信號。藉此例如可偵測環境溫度、氣體或液體壓力、氣體濃度、亮度或類似參數。 According to an embodiment, the electronic component comprises a sensor. The sensor can detect one or several environmental parameters and provide an electrical signal corresponding to the detected parameter. Thereby, for example, ambient temperature, gas or liquid pressure, gas concentration, brightness or the like can be detected.

根據實施例，該電子構件包括微電機械系統(MEMS)。微電機械系統係將電子元件與機械元件集於一身的構件。本發明藉由立體印刷法及與之相適的電接觸而實現的構造，一方面能防止微電機械系統受到環境因素影響，同時亦能對功能構件進行適當的結構化以實現微電機械系統與周圍環境的機械相互作用。 According to an embodiment, the electronic component comprises a microelectromechanical system (MEMS). A microelectromechanical system is a component that combines electronic components and mechanical components. The invention realizes the structure realized by the steric printing method and the appropriate electrical contact therewith, on the one hand, the micro electro mechanical system can be prevented from being affected by environmental factors, and the functional component can be appropriately structured to realize the micro electro mechanical system. Mechanical interaction with the surrounding environment.

根據實施例，該功能層內整合有導熱性及/或剛度高於該功能層的其他元件。該其他元件例如可為金屬薄膜或金屬板。藉由整合散熱體或類似元件形式的元件，能使電子構件得到特別有效的散熱。此外，該元件的增強剛度還能進一步穩定功能構件並防止其機械過載。 According to an embodiment, other elements having thermal conductivity and/or stiffness higher than the functional layer are integrated in the functional layer. The other element can be, for example, a metal film or a metal plate. By integrating components in the form of heat sinks or similar components, electronic components can be particularly efficiently dissipated. In addition, the increased stiffness of the element further stabilizes the functional components and prevents their mechanical overload.

根據該製造電子功能構件的方法的實施例，該在該功能層內設置連接元件的步驟包括以下步驟：在該功能層的外表面與該電子構件的電接頭間設置孔口；以及用導電材料充填該設置成的孔口。藉此可在電子構件與功能層外表面間形成未在立體印刷程序中形成的電連接。 According to an embodiment of the method of manufacturing an electronic functional component, the step of providing a connecting member in the functional layer includes the steps of: providing an aperture between an outer surface of the functional layer and an electrical connector of the electronic component; and using a conductive material Fill the set orifice. Thereby, an electrical connection that is not formed in the three-dimensional printing process can be formed between the electronic component and the outer surface of the functional layer.

以下參照所附圖式說明本發明的其他優點及實施方式。 Further advantages and embodiments of the invention are described below with reference to the drawings.

2‧‧‧電子功能構件 2‧‧‧Electronic functional components

10‧‧‧基本元件 10‧‧‧Basic components

10a‧‧‧頂面 10a‧‧‧ top surface

11‧‧‧基體 11‧‧‧ base

12‧‧‧電絕緣薄膜 12‧‧‧Electrical insulating film

20‧‧‧電子構件 20‧‧‧Electronic components

21‧‧‧電接頭/連接元件 21‧‧‧Electrical connectors/connecting components

22‧‧‧導電結構 22‧‧‧Electrical structure

30‧‧‧功能層 30‧‧‧ functional layer

30a‧‧‧外表面 30a‧‧‧Outer surface

31‧‧‧連接元件/電連接 31‧‧‧Connecting components/electrical connections

32‧‧‧接觸元件 32‧‧‧Contact elements

35‧‧‧光學連接 35‧‧‧ Optical connection

36‧‧‧通道結構 36‧‧‧Channel structure

37‧‧‧其他元件/穩定元件/穩定板 37‧‧‧Other components/stabilizing components/stability plates

38‧‧‧其他元件/冷卻元件 38‧‧‧Other components/cooling components

100‧‧‧方法 100‧‧‧ method

110‧‧‧步驟 110‧‧‧Steps

120‧‧‧步驟 120‧‧‧Steps

130‧‧‧步驟 130‧‧‧Steps

140‧‧‧步驟 140‧‧‧Steps

圖1為根據實施例的電子功能構件示意圖；圖2為根據另一實施例的電子功能構件示意圖；圖3為根據又一實施例的電子功能構件示意圖；及圖4為根據實施例的電子功能構件的製造方法流程圖。 1 is a schematic diagram of an electronic functional component according to an embodiment; FIG. 2 is a schematic diagram of an electronic functional component according to another embodiment; FIG. 3 is a schematic diagram of an electronic functional component according to still another embodiment; and FIG. 4 is an electronic function according to an embodiment. Flow chart of the manufacturing method of the component.

圖1為根據第一實施例的電子功能構件示意圖。其中該電子功能構件包括基本元件10、具有電接頭21的電子構件20及功能層30。功能層30內設用於在電子構件20的接頭21與功能層外表面30a間建立電連接的連接元件31。其中外表面30a不僅限於圖1所示的頂面，而是還包括側面及底面上視情況而自由可及的區域，只要功能層30亦延伸至此區域。 Fig. 1 is a schematic view of an electronic functional component according to a first embodiment. The electronic functional component includes a basic component 10, an electronic component 20 having an electrical connector 21, and a functional layer 30. A connecting member 31 for establishing an electrical connection between the joint 21 of the electronic component 20 and the outer surface 30a of the functional layer is provided in the functional layer 30. The outer surface 30a is not limited to the top surface shown in FIG. 1, but also includes an area that is freely accessible on the side and the bottom surface as long as the functional layer 30 extends to this area.

基本元件10為一電絕緣承載層。其中例如可藉由立體印刷法已製成基本元件10。藉此可使基本元件10精準符合預期要求，尤其與後續待整合的電子構件20精準匹配。舉例而言，如此便已可在基本元件10中設置凸起、凹坑或空腔。 The base element 10 is an electrically insulating carrier layer. The base element 10 can be produced, for example, by embossing. In this way, the basic component 10 can be precisely matched to the intended requirements, in particular precisely matched to the subsequent electronic components 20 to be integrated. For example, it is thus possible to provide protrusions, dimples or cavities in the base element 10.

在基本元件10後續用以設置電子構件20的頂面10a上進一步設有導電結構22。該等導電結構22例如可在立體印刷基本元件10期間便已被整合於基本元件10。為此可在用電絕緣材料印刷基本元件10的同時進一步印刷導電結構22。作為替代方案，亦可採用任意一種其他方法來在基本元件10上設置導電結構。例如可藉由沈積法、冷氣噴塗、噴射塗覆法、導電物質二維印刷或導電結構的替代性設置方法來製造該等導電結構。其中，基本元件10上的導電結構22與電子構件10的接頭21相匹配，從而可在電子構件20的接頭21與導電結構22間實現電接觸。 A conductive structure 22 is further provided on the top surface 10a of the basic component 10 for subsequently arranging the electronic component 20. The electrically conductive structures 22 can be integrated into the base element 10, for example, during the embossing of the base element 10. For this purpose, the electrically conductive structure 22 can be further printed while the basic element 10 is printed with an electrically insulating material. Alternatively, any other method may be employed to provide the conductive structure on the base member 10. The electrically conductive structures can be fabricated, for example, by deposition methods, cold air spraying, spray coating methods, two-dimensional printing of conductive materials, or alternative methods of electrically conductive structures. The conductive structure 22 on the base member 10 is matched with the joint 21 of the electronic component 10 so that electrical contact can be made between the joint 21 of the electronic component 20 and the conductive structure 22.

而後將電子構件20設置到設有導電結構22的基本元件10上並視情況將電子構件20固定。在此過程中，電子構件20的電接頭21與導電結構22間亦形成電連接。該電接觸例如可透過導電膠合或其他電接觸方法而實現。 The electronic component 20 is then placed onto the base component 10 provided with the electrically conductive structure 22 and the electronic component 20 is secured as appropriate. In this process, the electrical connection 21 of the electronic component 20 and the conductive structure 22 also form an electrical connection. The electrical contact can be achieved, for example, by conductive bonding or other electrical contact methods.

將電子構件20設置到基本元件10上並在電子構件20的接頭21與導電結構22間建立電連接後，在立體印刷程序中對此結構進行套印，從而在設有電子構件20的基本元件10上形成功能層30。透過該立體印刷程序形成該電子功能構件最終應具有的幾何形狀。藉由在印刷程序中對功能層30進行適當的結構化與成形處理，還可同時形成功能層30的機械功能。此機械功能例如可包括與該功能構件的期望用途相適的預定外部幾何形狀。視情況亦可形成可動或撓性機械元件。 After the electronic component 20 is placed on the base component 10 and an electrical connection is established between the connector 21 of the electronic component 20 and the conductive structure 22, the structure is overprinted in a three-dimensional printing process so that the basic component 10 is provided with the electronic component 20 The functional layer 30 is formed thereon. The geometry that the electronic functional component should ultimately have is formed by the three-dimensional printing process. The mechanical function of the functional layer 30 can also be formed simultaneously by appropriate structuring and shaping of the functional layer 30 in the printing process. This mechanical function may, for example, include a predetermined outer geometry that is compatible with the intended use of the functional component. Movable or flexible mechanical components can also be formed as appropriate.

在立體印刷功能層30期間，亦可在功能層30中形成由導電結構22的預定位置延伸至功能層30的外表面30a的孔口。可在接下來的後續製程中用導電材料如金屬或其他導電物質充填此等孔口。藉此方式在導電結構22與功能層30的外表面30a間形成連接元件31。由此可透過該連接元件31在外表面30a與電子構件20特別是電子構件20的電接頭21間建立電連接。 During the embossed functional layer 30, an aperture extending from a predetermined location of the electrically conductive structure 22 to the outer surface 30a of the functional layer 30 may also be formed in the functional layer 30. These openings can be filled with a conductive material such as a metal or other conductive material in a subsequent subsequent process. In this way, a connecting element 31 is formed between the electrically conductive structure 22 and the outer surface 30a of the functional layer 30. An electrical connection can thus be made between the outer surface 30a and the electrical component 21 of the electronic component 20, in particular the electronic component 20, via the connecting element 31.

若在立體印刷期間未在導電結構22與功能層外表面30a間為功能層30形成孔口，作為替代方案則亦可於後續製程中在功能層30內設置此孔口。例如可藉由雷射鑽孔法或類似方法在功能層30內設置此孔口。此情況下亦可在設置孔口後用導電物質充填之，以便能在導電結構22與功能層外表面30a間形成電連接。 If the functional layer 30 is not formed between the conductive structure 22 and the functional layer outer surface 30a during embossing, the aperture may be provided in the functional layer 30 in a subsequent process. This aperture can be provided, for example, in the functional layer 30 by a laser drilling method or the like. In this case, it is also possible to fill the opening after the opening, so that an electrical connection can be made between the conductive structure 22 and the outer surface 30a of the functional layer.

根據另一替代方案，還可在立體印刷期間便已將其他導電通路整合於功能層30。該等其他導電通路同樣可在導電結構22與功能層30的外表面30a間實現電連接。此外亦可在功能層30內部設置導電通路。立體印刷程序的較高靈活度允許形成複雜的立體導電通路，其亦能在導電結構22的單個點之間建立連接。 According to another alternative, other conductive pathways may also be integrated into the functional layer 30 during embossing. These other conductive paths can also provide electrical connection between the conductive structure 22 and the outer surface 30a of the functional layer 30. In addition, a conductive path may be provided inside the functional layer 30. The higher flexibility of the three-dimensional printing process allows for the formation of complex, three-dimensional conductive paths that also establish a connection between individual points of the conductive structure 22.

在功能層30的外表面30a上進一步設有與連接元件31電性相連的接觸元件32。該等接觸元件32提供足夠大的電接觸面以形成該功能構件的電接頭。其中可藉由任意一種方法設置接觸元件32。例如可藉由雷射直接成型(LDS)及接下來的電鍍來設置接觸元件32。亦可採用噴射塗覆法、電漿塗覆法或類似方法。亦可在立體印刷期間便已設置接觸元件32。 Contact elements 32 electrically connected to the connecting element 31 are further provided on the outer surface 30a of the functional layer 30. The contact elements 32 provide a sufficiently large electrical contact surface to form the electrical contacts of the functional component. The contact element 32 can be provided by any method. Contact element 32 can be provided, for example, by laser direct structuring (LDS) and subsequent plating. A spray coating method, a plasma coating method or the like can also be employed. Contact element 32 can also be provided during embossing.

電子構件20可為任意一種電子構件。電子構件20例如可為積體電路(IC)。針對接頭間距極小的構件，可透過導電結構22及/或連接元件31擴展此較窄的接頭間距，藉此可在功能層外表面30a上提供接頭間距足夠大的接觸元件32以接觸該電子功能構件。 The electronic component 20 can be any type of electronic component. The electronic component 20 can be, for example, an integrated circuit (IC). For a member having a very small joint pitch, the narrow joint pitch can be expanded through the conductive structure 22 and/or the connecting member 31, whereby the contact member 32 having a sufficiently large joint pitch can be provided on the outer surface 30a of the functional layer to contact the electronic function. member.

此外，亦可採用例如微電機械系統(MEMS)作為電子構件20，微電機械系統除電子功能外還提供機械功能。基本元件10及功能層30能有效防止此等微電機械系統受到外部影響。與此同時，可在立體印刷功能層30期間以適當方式使功能層30與微電機械系統的機械功能相匹配。 In addition, for example, a micro electro mechanical system (MEMS) can be employed as the electronic component 20, which provides mechanical functions in addition to electronic functions. The basic component 10 and the functional layer 30 are effective to prevent such microelectromechanical systems from being externally affected. At the same time, the functional layer 30 can be matched to the mechanical function of the microelectromechanical system in a suitable manner during the embossed printing functional layer 30.

圖2為另一實施例的示意圖。此圖所示的電子功能構件2的構造與圖1所示的構造大體一致。為清楚起見，此圖中未示出電連接31及接觸元件32。 Figure 2 is a schematic illustration of another embodiment. The configuration of the electronic functional component 2 shown in this figure is substantially identical to the configuration shown in FIG. For the sake of clarity, the electrical connections 31 and the contact elements 32 are not shown in this figure.

本實施例中的電子功能構件在功能層30中包括設於電構件 20與功能層30的外表面30a間的光學連接35。此光學連接35例如可為導光體或透明塑膠。該導光體或透明塑膠可在立體印刷期間便已被設置在功能層30中。例如可在電子構件20上安裝導光體，隨後在立體印刷功能層30期間用印刷材料將該導光體嵌入功能層30。作為替代方案，亦可在電子構件20上直接印刷透明塑膠。其中，該導光體或透明塑膠較佳與需要在電子構件20與周圍環境之間交換的光的波長相適配。電子構件20例如可為發光構件如發光二極體或類似構件。作為替代方案，電子構件20亦可為從周圍環境接收光並加以評估的構件。例如亮度感測器或攝影機元件。該設於功能層外表面30a與構件20間的光學連接亦可構造為以適當方式將來自於周圍環境的光聚焦於電子構件20或使發射光發生散射的光學透鏡或透鏡狀結構。 The electronic functional component in this embodiment includes the electrical component in the functional layer 30. An optical connection 35 between the 20 and the outer surface 30a of the functional layer 30. This optical connection 35 can be, for example, a light guide or a transparent plastic. The light guide or transparent plastic can be placed in the functional layer 30 during embossing. For example, a light guide can be mounted on the electronic component 20, and then the light guide can be embedded in the functional layer 30 with a printed material during the embossed functional layer 30. Alternatively, the transparent plastic can be printed directly on the electronic component 20. Preferably, the light guide or transparent plastic is adapted to the wavelength of light that needs to be exchanged between the electronic component 20 and the surrounding environment. The electronic component 20 can be, for example, a light emitting member such as a light emitting diode or the like. Alternatively, electronic component 20 can also be a component that receives light from the surrounding environment and evaluates it. For example, a brightness sensor or a camera component. The optical connection between the outer surface 30a of the functional layer and the member 20 can also be configured to focus light from the surrounding environment on the electronic component 20 or an optical lens or lenticular structure that scatters the emitted light in a suitable manner.

作為補充或替代方案，功能層30亦可具有通道結構36。此通道結構36可為電子構件20與功能層外表面30a之間的一孔口。透過該通道結構36例如可向電子構件20輸送氣體或流體或者導引其從電子構件20旁邊流過。由此，電子構件20亦能接觸到來自於該電子功能構件之周圍環境的物質。舉例而言，藉此可利用該電子功能構件偵測氣體壓力，分析從旁流過的氣體或流體中是否存在一或數種預定物質，或者測定物質濃度或其他環境參數，例如溫度或類似參數。必要時亦可在印刷功能層30期間在功能層30內嵌入分析氣體或流體所需要的助劑，例如有機物質或類似物質。 Additionally or alternatively, the functional layer 30 can also have a channel structure 36. This channel structure 36 can be an aperture between the electronic component 20 and the functional layer outer surface 30a. Through the channel structure 36, for example, a gas or fluid can be delivered to the electronic component 20 or guided to flow past the electronic component 20. Thereby, the electronic component 20 can also contact the substance from the surrounding environment of the electronic functional component. For example, the electronic functional component can be utilized to detect gas pressure, analyze whether one or several predetermined substances are present in the bypassed gas or fluid, or determine the concentration of the substance or other environmental parameters, such as temperature or the like. . If necessary, it is also possible to embed an auxiliary agent, such as an organic substance or the like, which is required for the analysis of the gas or the fluid in the functional layer 30 during the printing of the functional layer 30.

此外亦可藉由電子構件20透過合適的微電機械系統使該氣體或流體在通道結構36中發生運動以形成流動。 Alternatively, the gas or fluid may be moved in the channel structure 36 by the electronic component 20 through a suitable microelectromechanical system to form a flow.

為此所需的通道結構36可在立體印刷功能層30期間便已形 成。此外，通道結構36亦可完全或至少部分藉由合適的後續方法如雷射鑽孔或類似方法而形成。 The channel structure 36 required for this purpose can be shaped during the embossed printing functional layer 30. to make. In addition, the channel structure 36 can also be formed entirely or at least in part by suitable subsequent methods such as laser drilling or the like.

作為補充或替代方案，功能層30還可具有任意其他元件37、38。例如可將剛度高於功能層30的穩定元件37整合於功能層30。此元件例如可為由金屬或硬質塑膠構成的板體。透過該整合於功能層30的穩定板37可提高功能層30及整個電子功能構件的穩定性。藉此可防止敏感的電構件20受損。 Additionally or alternatively, the functional layer 30 can also have any other elements 37,38. For example, a stabilizing element 37 having a higher stiffness than the functional layer 30 can be integrated into the functional layer 30. This element can be, for example, a plate made of metal or hard plastic. The stability of the functional layer 30 and the entire electronic functional component can be improved by the stabilizing plate 37 integrated in the functional layer 30. Thereby, the sensitive electrical component 20 can be prevented from being damaged.

作為替代方案，該其他元件亦可為導熱性高於功能層30的冷卻元件38。其例如可為金屬薄膜、散熱體或類似元件。透過導熱性更高的冷卻元件38可對該電子功能構件特別是電子構件20進行有效散熱。 Alternatively, the other element may also be a cooling element 38 having a higher thermal conductivity than the functional layer 30. It can be, for example, a metal film, a heat sink or the like. The electronic functional component, in particular the electronic component 20, can be effectively dissipated through the more thermally conductive cooling element 38.

圖3示出電子功能構件20的另一替代實施方式。該電子功能構件與前述電子功能構件大體一致。本實施方式中的基本元件10由電絕緣薄膜12形成。與前述實施例相似，在該電絕緣薄膜12上同樣設有用以與電子構件20的連接元件21形成電連接的導電結構22。其中例如可藉由覆晶安裝技術將電子構件設於薄膜12上並與導電結構22連接。其中，薄膜12上用以連接電子構件20的連接元件21的接觸面上較佳塗佈有貴金屬，以便能形成有效電連接。其中亦可採用替代方法來將電子構件20設於電絕緣薄膜12上並與導電結構22實現接觸。 FIG. 3 shows another alternative embodiment of the electronic functional component 20. The electronic functional component substantially conforms to the aforementioned electronic functional component. The basic element 10 in the present embodiment is formed of an electrically insulating film 12. Similar to the foregoing embodiment, the electrically insulating film 12 is also provided with a conductive structure 22 for making electrical connection with the connecting member 21 of the electronic component 20. For example, the electronic component can be disposed on the film 12 and connected to the conductive structure 22 by flip chip mounting technology. The contact surface of the connecting member 21 of the film 12 for connecting the electronic component 20 is preferably coated with a precious metal so as to form an effective electrical connection. An alternative method may also be employed to provide the electronic component 20 on the electrically insulating film 12 and to make contact with the electrically conductive structure 22.

為了保護上述結構，可進一步在此結構上覆蓋圖中未示出的保護膜。而後可將以上述方式製備好的薄膜12連同電子構件20一起設置到預先製備好的基體11上。較佳用合適的壓印工具將薄膜12壓印於基體11上。基體11例如可為在立體印刷程序中製成的基體11。基體11的製造方 法可類似於前文聯繫圖1所說明之基本元件10的製造方法，其中在此情況下，基體11不必具有導電結構。在圖3所示的實施例中，導電結構22已設於薄膜12上。 In order to protect the above structure, a protective film not shown in the drawing may be further covered on this structure. The film 12 prepared in the above manner can then be placed together with the electronic component 20 onto the previously prepared substrate 11. The film 12 is preferably embossed onto the substrate 11 by a suitable embossing tool. The base 11 can be, for example, a base 11 made in a three-dimensional printing process. Manufacturer of base 11 The method can be similar to the method of manufacturing the basic element 10 described above in connection with Fig. 1, in which case the substrate 11 does not have to have a conductive structure. In the embodiment shown in FIG. 3, the electrically conductive structure 22 has been disposed on the film 12.

將薄膜12連同電子構件20一起設於基體11上後，繼續以類似於前述實施例的方式構建功能層30及連接元件31。 After the film 12 is placed on the substrate 11 together with the electronic component 20, the functional layer 30 and the connecting member 31 are continued to be constructed in a manner similar to the foregoing embodiment.

除前述實施例中所描述的用以將電子構件20設於基本元件10或基體11上的平坦表面10a、11a外，亦可採用任意形狀的表面，例如弧形、彎曲或結構化表面。藉此能進一步最佳化成形與空間需求方面的靈活度。此外具體在為基本元件10或功能層30使用延性材料或可塑性變形的材料之情況下，還能實現該電子功能構件進一步的後續變形。 In addition to the flat surfaces 10a, 11a used to provide the electronic component 20 to the base component 10 or the substrate 11 as described in the previous embodiments, any shape of surface, such as a curved, curved or structured surface, may be employed. This further optimizes the flexibility in terms of form and space requirements. Furthermore, in the case of using a ductile material or a plastically deformable material for the basic element 10 or the functional layer 30, further subsequent deformation of the electronic functional component can also be achieved.

圖4為根據本發明實施例的電子功能構件之製造方法100的流程圖。 4 is a flow chart of a method 100 of fabricating an electronic functional component in accordance with an embodiment of the present invention.

在步驟110中提供包含電絕緣承載層的基本元件10。而後在基本元件10上設置與電子構件20的接頭21相匹配的導電結構22。在接下來的步驟120中將包含電接頭21的電子構件20設置到基本元件10上。隨後在步驟130中以立體印刷法在基本元件10上套印功能層30。步驟140係在套印功能層30內設置用於在電子構件20的接頭21與功能層30的外表面30a間形成電連接的連接元件31。其中亦可間接透過基本元件10上的導電結構22來形成電子構件20的接頭21間的連接。 A basic element 10 comprising an electrically insulating carrier layer is provided in step 110. A conductive structure 22 matching the joint 21 of the electronic component 20 is then disposed on the base member 10. The electronic component 20 including the electrical connector 21 is placed onto the base component 10 in the next step 120. The functional layer 30 is then overprinted on the base element 10 in a embossing process in step 130. Step 140 provides a connection element 31 for forming an electrical connection between the joint 21 of the electronic component 20 and the outer surface 30a of the functional layer 30 within the overprint functional layer 30. The connection between the joints 21 of the electronic component 20 can also be formed indirectly through the electrically conductive structure 22 on the base element 10.

根據實施方式，可在步驟130中的立體印刷期間便已設置用於在基本元件10上的導電結構22與功能層30的外表面30a間形成連接的孔口。此情況下可藉由用導電物質充填空腔來形成連接元件31。 According to an embodiment, an aperture for forming a connection between the electrically conductive structure 22 on the base element 10 and the outer surface 30a of the functional layer 30 may be provided during the embossing in step 130. In this case, the connecting member 31 can be formed by filling the cavity with a conductive substance.

若在立體印刷期間無法或僅能部分形成此等空腔，則亦可藉由合適的用以形成孔口的其他步驟來實現此等空腔。此點例如可透過雷射鑽孔程序或類似程序而實現。此情況下亦在形成孔口後用導電物質充填之。 If such cavities cannot be formed or only partially formed during embossing, such cavities can also be achieved by other suitable steps for forming the apertures. This can be achieved, for example, by a laser drilling program or the like. In this case, the pores are also filled with a conductive material.

最後可在另一步驟中在功能層外表面30a上安裝接觸元件32，該等接觸元件與連接元件31電性相連且提供足夠大的接觸面以形成該電子功能構件的電接頭。 Finally, in a further step, contact elements 32 can be mounted on the functional layer outer surface 30a, which are electrically connected to the connecting element 31 and provide a sufficiently large contact surface to form the electrical connections of the electronic functional component.

綜上所述，本發明係有關一種電子功能構件及一種電子功能構件的製造方法。該電子功能構件包括藉由立體印刷程序嵌入該功能構件的電子構件。該立體印刷程序除了能包覆該電子構件外，亦能在成形及機械特性方面對該功能構件進行個別調整。此外還以適當方式將該電子構件的電接頭導引至該功能構件的表面。 In summary, the present invention relates to an electronic functional component and a method of manufacturing the electronic functional component. The electronic functional component includes an electronic component embedded in the functional component by a three-dimensional printing program. In addition to being able to cover the electronic component, the three-dimensional printing process can also individually adjust the functional component in terms of forming and mechanical properties. The electrical connector of the electronic component is also guided to the surface of the functional component in a suitable manner.

10‧‧‧基本元件 10‧‧‧Basic components

10a‧‧‧頂面 10a‧‧‧ top surface

20‧‧‧電子構件 20‧‧‧Electronic components

21‧‧‧電接頭/連接元件 21‧‧‧Electrical connectors/connecting components

22‧‧‧導電結構 22‧‧‧Electrical structure

30‧‧‧功能層 30‧‧‧ functional layer

30a‧‧‧外表面 30a‧‧‧Outer surface

31‧‧‧連接元件/電連接 31‧‧‧Connecting components/electrical connections

32‧‧‧接觸元件 32‧‧‧Contact elements

Claims (10)

一種電子功能構件，包括：基本元件(10)，該基本元件包括電絕緣承載層；電子構件(20)，該電子構件設於該基本元件(10)上且包括電接頭(21)；及功能層(30)，該功能層在立體印刷程序中被套印於該基本元件(10)上且包括連接元件(31)，該連接元件設計用於在該電子構件(20)的電接頭(21)與該功能層(30)的外表面(20a)間形成電連接。 An electronic functional component comprising: a basic component (10) comprising an electrically insulating carrier layer; an electronic component (20) disposed on the basic component (10) and including an electrical connector (21); a layer (30) which is overprinted on the base element (10) in a three-dimensional printing process and comprises a connecting element (31) designed for electrical connection (21) at the electronic component (20) An electrical connection is formed with the outer surface (20a) of the functional layer (30). 如申請專利範圍第1項之電子功能構件，且其包括接觸元件(32)，該接觸元件設於該功能層(30)的外表面(30a)上且與該電子構件(20)的電接頭(21)及該功能層(30)的外表面(30a)間的電連接(31)電性相連。 An electronic functional component according to claim 1, and comprising a contact element (32) disposed on an outer surface (30a) of the functional layer (30) and electrically connected to the electronic component (20) (21) and the electrical connection (31) between the outer surface (30a) of the functional layer (30) are electrically connected. 如申請專利範圍第1或2項之電子功能構件，其中該基本元件(10)包括與該電子構件(20)的電接頭(21)電性相連的導電結構(22)。 The electronic functional component of claim 1 or 2, wherein the basic component (10) comprises a conductive structure (22) electrically connected to the electrical connector (21) of the electronic component (20). 如申請專利範圍第1至3項中任一項之電子功能構件，其中該功能層(30)包括設於該電子構件(20)與該功能層(30)的外表面(30a)間的透明塑膠及/或導光體。 The electronic functional component of any one of claims 1 to 3, wherein the functional layer (30) comprises a transparent layer disposed between the electronic component (20) and an outer surface (30a) of the functional layer (30). Plastic and / or light guide. 如申請專利範圍第1至4項中任一項之電子功能構件，其中該功能層(30)具有設於該電子構件(20)與該功能層(30)的外表面(30a)間的通道結構(36)。 The electronic functional component of any one of claims 1 to 4, wherein the functional layer (30) has a passage between the electronic component (20) and an outer surface (30a) of the functional layer (30). Structure (36). 如申請專利範圍第1至5項中任一項之電子功能構件，且其包括其他元件(37,38)，該其他元件整合於該功能層(30)且具有高於該功能層 的導熱性及/或剛度。 An electronic functional component according to any one of claims 1 to 5, and comprising other components (37, 38) integrated in the functional layer (30) and having a higher functional layer Thermal conductivity and / or stiffness. 如申請專利範圍第1至6項中任一項之電子功能構件，其中該電子構件(20)包括微電機械系統(MEMS)。 The electronic functional component of any one of claims 1 to 6, wherein the electronic component (20) comprises a microelectromechanical system (MEMS). 如申請專利範圍第1至7項中任一項之電子功能構件，其中該電子構件(20)包括感測器。 The electronic functional component of any one of claims 1 to 7, wherein the electronic component (20) comprises a sensor. 一種製造電子功能構件特別是如前述申請專利範圍中任一項之電子功能構件的方法(100)，包括以下步驟：提供(110)包含電絕緣承載層的基本元件(100)；將包含電接頭(21)的電子構件(20)設置(120)到該基本元件(10)上；在該電絕緣基本元件(10)上立體印刷(130)功能層(30)；以及在該套印功能層(30)內設置(140)用於在該電子構件(20)的電接頭(21)與該功能層(30)的外表面(30a)間形成電連接的連接元件(31)。 A method (100) for manufacturing an electronic functional component, in particular an electronic functional component according to any of the preceding claims, comprising the steps of: providing (110) a basic component (100) comprising an electrically insulating carrier layer; An electronic component (20) of (21) is disposed (120) onto the base component (10); embossed (130) a functional layer (30) on the electrically insulating base component (10); and in the overprint functional layer ( 30) An internal arrangement (140) for connecting elements (31) for electrical connection between the electrical connector (21) of the electronic component (20) and the outer surface (30a) of the functional layer (30). 如申請專利範圍第9項之方法(100)，其中設置(140)該連接元件(31)的步驟包括以下步驟：在該功能層(30)的外表面(30a)與該基本元件(10)間設置孔口；以及用導電材料充填該設置成的孔口。 The method (100) of claim 9, wherein the step of disposing (140) the connecting element (31) comprises the steps of: an outer surface (30a) of the functional layer (30) and the basic element (10) An aperture is provided therebetween; and the disposed aperture is filled with a conductive material.
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