CN105916802B - Electronic functional component and method for producing an electronic functional component - Google Patents

Electronic functional component and method for producing an electronic functional component Download PDF

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Publication number
CN105916802B
CN105916802B CN201580005294.XA CN201580005294A CN105916802B CN 105916802 B CN105916802 B CN 105916802B CN 201580005294 A CN201580005294 A CN 201580005294A CN 105916802 B CN105916802 B CN 105916802B
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electronic
functional layer
component
functional
electronic component
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CN105916802A (en
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U.沙夫
K.贝绍尔
R.瓦尔
A.库格勒
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/46—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
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    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
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    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
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    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Ceramic Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Electroluminescent Light Sources (AREA)
  • Micromachines (AREA)

Abstract

The invention relates to an electronic functional component and to a production method for an electronic functional component. The electronic functional component comprises an electronic component (20) which is embedded in the functional component by means of a three-dimensional printing process. By means of the three-dimensional printing process, it is also possible here to carry out separate adaptations with regard to the shaping and the mechanical properties of the functional component in addition to the surrounding of the electronic component. Furthermore, the electrical terminals (21) of the electronic component are guided in a suitable manner onto the surface (30 a) of the functional component.

Description

Electronic functional component and method for producing an electronic functional component
Technical Field
The present invention relates to an electronic functional component and a method for manufacturing the same.
Background
Electronic components and circuit groups embedded in plastic in order to prevent damage or contamination are known. Such parts are typically manufactured using common spray, injection or molding processes.
Further, a so-called three-dimensional (3D) printing method is also known recently for manufacturing three-dimensional devices. In this case, the 3D printer produces the object by continuously adding or applying material on the basis of the three-dimensional data model.
German patent application DE 102011078757 a1 discloses a method for printing three-dimensional components based on A3D printer. For this purpose, model data and quality attributes of the component to be printed and a certificate concerning the requirements of the 3D printer to be used are stored in a portable storage medium. In the case of a consistent certificate of the storage medium and the 3D printer, the model data is transmitted to the printer and the desired three-dimensional component is produced by the 3D printer.
Disclosure of Invention
The invention in a first aspect implements an electronic functional component having: a base element comprising an electrically insulating carrier layer; an electronic component arranged on the base element and including an electrical terminal; and a functional layer which is printed on the base element during the three-dimensional printing process and comprises a connecting element which is designed to provide an electrical connection between an electrical terminal of the electronic component and an outer side of the functional layer.
The invention according to a further aspect provides a method for producing an electronic functional component, having the following steps: providing a base element with an electrically insulating carrier layer; arranging an electronic component having electrical terminals on a base element; the method comprises the steps of three-dimensionally printing a functional layer on a base element and introducing a connecting element into the printed functional layer, the connecting element providing an electrical connection between an electrical terminal of the electronic component and an outer side of the functional layer.
Advantages of the invention
The invention is based on the idea of integrating electronic components in functional components by means of a three-dimensional printing process. By integrating electronic components into three-dimensionally printed components and structuring the components with conductor tracks in the interior and on the surface, it is therefore possible to achieve a completely new design in the form of MID components (Molded Interconnect devices) of the type of injection-Molded circuit carriers. By connecting the electronic component to the three-dimensional printing component, both mechanical and electrical functions can be realized in the functional component. In this case, the three-dimensional printing process also enables a particularly flexible production process for complex three-dimensional structures.
Since no expensive tools, such as injection molds, are required for the three-dimensional printing process, individual components or small batches with a low number of parts can also be produced cost-effectively.
Furthermore, the three-dimensional printing method also allows complex routing of the electrical conductor tracks within the functional component. In particular, it is thus also possible to implement wire crossings and the like which were hitherto impossible or only very expensive in the conventional art.
Furthermore, the assembly of electronic functional parts with critical parts, such as integrated circuits or microelectromechanical systems with very small terminal pitches, can also be realized very well. This allows the electronic functional components to be manufactured with good process stability and with less production costs.
The base element of the functional part can comprise an electrically insulating carrier layer. In particular, the base element can also already be produced in a three-dimensional printing method. In this case, the base element can already have a corresponding geometry in a targeted manner by the three-dimensional printing process, which geometry is also matched to the design of the functional component to be realized. In this way, the base element of the functional component can also be equipped with a function. The base element itself therefore also serves as a functional layer for the functional component.
According to one embodiment, the electronic functional component further comprises a contact element which is arranged on the outside of the functional layer and which is electrically connected with an electrical connection between an electrical terminal of the electronic device and the outside of the functional layer. By such contact elements on the outer side of the electronic functional component, the electronic functional component may provide electrical contacts for external terminals. A particularly simple and safe contacting of the electronic functional components can thus be achieved.
According to one embodiment, the base element comprises an electrically conductive structure, which is electrically connected with an electrical terminal of the electronic component. By means of such an electrically conductive structure, the electrical terminals of the electronic component can already be contacted in the interior of the electronic functional component. It is thus also possible to achieve contacting of components with a very small terminal pitch. The electrically conductive structure can in this case be realized to provide a sufficiently large connection area for the further contact. In particular, the narrow terminal spacings of the electrical component can be extended by the electrically conductive structure in order to make electrical contact with the connecting elements.
According to one embodiment, the functional layer comprises a transparent plastic and/or a light guide, which is arranged between the electronic device and the outside of the functional layer. The transparent plastic and/or the optical waveguide in this case provide a complete optical connection between the electrical component and the outside of the functional layer. An optical connection between the electronic component and the surroundings can be realized by such a transparent plastic or optical waveguide. On the one hand, it is therefore possible to output optical signals from the electronic component into the surroundings and/or also to transmit optical signals from the surroundings to the electronic components inside the electronic functional component. The light guide or the transparent plastic is transparent to the relevant spectrum. This may also include, in particular, ultraviolet and infrared light.
According to one embodiment, the functional layer has a channel structure which is arranged between the electronic device and the outer side of the functional layer. Such a channel structure may be a cavity connecting the outside of the functional layer with the electronic device. The channel structure can be flowed through by a gas and/or a fluid. By means of such a channel structure, the electronic component can be brought into contact with a substance in the surroundings and one or more environmental parameters can be detected there.
According to one embodiment, the electronic component comprises a sensor. One or more environmental parameters can be detected by such a sensor and an electrical signal corresponding to the detected parameter is provided. Thus, for example, the ambient temperature, the pressure of the gas or liquid, the gas concentration, the brightness or the like can be detected.
According to one embodiment, the electronic component comprises a microelectromechanical system (MEMS). Such MEMS are devices that combine electronic and mechanical components with each other. By means of the three-dimensional printing method and the configuration of the electrical contacts suitable for this, it is possible, on the one hand, to protect the MEMS against damage due to environmental influences or the like and, at the same time, to achieve a suitable structuring of the functional components which effect the mechanical interaction of the MEMS with the surroundings.
According to one embodiment, a further element is integrated into the functional layer, which further element has an increased thermal conductivity and/or an increased rigidity compared to the functional layer. Such further elements may be, for example, metal films or metal plates. In this case, a particularly effective cooling of the electronic component can be achieved by integrating the component in the form of a heat sink. Furthermore, the increased rigidity of such a component achieves additional stability of the functional component and protection against mechanical loads.
According to one embodiment, in a method for producing an electronic functional component, the step for introducing a connecting element into the functional layer comprises a step for introducing an opening between the outside of the functional layer and an electrical terminal of the electronic component and a step for filling the introduced opening with an electrically conductive material. Thereby, an electrical connection between the electronic component and the outside of the functional layer can be provided as long as no other has been done during the three-dimensional printing process.
Drawings
Further advantages and embodiments of the invention emerge from the following description with reference to the drawings.
Here:
FIG. 1 shows a schematic diagram of an electronic functional component according to one embodiment;
FIG. 2 shows a schematic view of an electronic functional component according to another embodiment;
FIG. 3 shows a schematic view of an electronic functional component according to yet another embodiment; and
fig. 4 shows a schematic illustration of a flow chart of a method for manufacturing an electronic functional component according to an embodiment.
Detailed Description
FIG. 1 shows a schematic diagram of an electronic functional component according to one embodiment. The electronic functional component here comprises a base element 10, an electronic component 20 with electrical connections 21 and a functional layer 30. Connecting elements 31 providing an electrical connection between the terminals 21 of the electronic component 20 and the outer side 30a of the functional layer are introduced into the functional layer 30. The outer side 30a is not limited to the upper side shown in fig. 1, but rather also includes the lateral surfaces and, if appropriate, also the freely accessible region on the bottom side, as long as the functional layer 30 also extends over this region.
The base element 10 is an electrically insulating carrier layer. The base element 10 can already be produced here, for example, by means of a 3D printing method. In this way, the base element 10 can already be adapted precisely to the desired requirements and in particular also to the electronic components 20 to be integrated in other processes. It is thus already possible, for example, to provide elevations, recesses or cavities in the base element 10.
On the upper side 10a of the base element 10, on which the electronic component 20 is to be applied subsequently, a conductive structure 22 is furthermore provided. The electrically conductive structures 22 can be integrated into the base element 10, for example, already during the three-dimensional printing process of the base element 10. In parallel to the printing of the basic body 10 with electrically insulating material, the electrically conductive structures 22 can additionally be printed. Alternatively, any other method for applying the electrically conductive structure to the base element 10 is also possible. For example, the conductive structure may be manufactured by a deposition process, cold gas spraying, spray coating methods, two-dimensional printing of conductive substances, or alternative methods for applying the conductive structure. The electrically conductive structures 22 on the base body 10 are adapted to the terminals 21 of the electronic component 10 in this case, so that an electrical contact between the terminals 21 of the electronic component 20 and the electrically conductive structures 22 is possible.
Subsequently, the electronic component 20 is applied to the base element 10 with the electrically conductive structure 22 and, if necessary, the electronic component 20 is fixed. Here, too, an electrical connection between the electrical terminals 21 of the electronic component 20 and the electrically conductive structure 22 is realized. The electrical contacting can be realized, for example, by means of conductive adhesive or other methods for electrical contacting.
After the electronic component 20 has been applied to the base element 10 and the electrical connection between the terminals 21 of the electronic component 20 and the electrically conductive structures 22 has been established, the construction is overprinted in a three-dimensional printing process and thus the functional layer 30 is formed over the base element 10 with the electronic component 20. By means of this three-dimensional printing process, the final geometry of the electronic functional component is formed. At the same time, the mechanical function of the functional layer 30 can also be designed by suitable structuring and shaping of the functional layer 30 during the printing process. The mechanical function may include, for example, a predetermined external geometry that is compatible with the intended application of the functional component. If necessary, movable or flexible mechanical components can also be constructed.
During the three-dimensional printing process of the functional layer 30, openings can also be formed in the functional layer 30, which extend from predetermined positions of the electrically conductive structure 22 to the outer side 30a of the functional layer 30. The openings may then be filled with a conductive material, such as a metal or other conductive substance, in a further manufacturing process. In this way, the connection element 31 is formed between the conductive structure 22 and the outer side 30a of the functional layer 30. By means of the connecting element 31, an electrical connection between the outer side 30a and the electronic component 20, in particular the electrical terminals 21 of the electronic component 20, can thus be achieved.
If no openings are formed between the electrically conductive structure 22 and the outer side 30a of the functional layer during the three-dimensional printing process of the functional layer 30, such openings can alternatively also be introduced into the functional layer 30 in a subsequent process. Such openings can be introduced into the functional layer 30, for example, by means of laser drilling or the like. In this case, these introduced openings can also be subsequently filled with a conductive substance in order to achieve an electrical connection between the conductive structure 22 and the outer side 30a of the functional layer.
Furthermore, in other alternatives it is possible to already integrate further conductive tracks into the functional layer 30 during the three-dimensional printing process. These further conductive tracks can also make electrical contact between the conductive structure 22 and the outer side 30a of the functional layer 30. In addition, other electrical conductor tracks can also be implemented within the functional layer 30. Due to the great flexibility of the three-dimensional printing process, complex, three-dimensional conductor track guidance is possible, which also enables connections between the individual points of the conductive structure 22.
On the outer side 30a of the functional layer 30, a contact element 32 is furthermore arranged, which is electrically connected to the connecting element 31. By means of the contact elements 32, sufficiently large electrical contact surfaces are provided, which enable electrical connection of the functional component. The contact element 32 can be applied here by any method. For example, the contact elements 32 may be applied by means of Laser Direct Structuring (LDS) and subsequent electroplating. Also possible are spray coating methods, plasma coating methods or the like. The contact elements 32 may also have been introduced during the three-dimensional printing process.
The electronic component 20 may be any electronic component here. The electronic component 20 is, for example, an Integrated Circuit (IC). In the case of devices with a small terminal pitch, the narrow terminal pitch can be expanded by the conductive structures 22 and/or the connecting elements 31, so that contact elements 32 with a sufficiently large terminal pitch can be provided on the outer side 30a of the functional layer in order to contact the electronic functional component.
Furthermore, for example, a micro-electromechanical system (MEMS) which provides a mechanical function in addition to an electronic function can also be used as the electronic component 20. The MEMS is sufficiently protected from external influences by the base element 10 and the functional layer 30. At the same time, it is also possible during the three-dimensional printing process of the functional layer 30 to adapt the functional layer 30 in a suitable manner to the mechanical function of the MEMS.
In this respect, fig. 2 shows a schematic illustration of a further exemplary embodiment. The configuration of the electronic functional component 2 in this figure corresponds substantially to the configuration in fig. 1. For better illustration, the electrical connections 31 and the contact elements 32 are not shown in this figure.
The electronic functional component in this embodiment comprises an optical connection 35 between the electrical component 20 and the outer side 30a of the functional layer 30 in the functional layer 30. The optical connection 35 may be, for example, a light guide or a transparent plastic. The light guide or transparent plastic can already be introduced into the functional layer 30 during the three-dimensional printing process. For example, the optical waveguide can be applied to the electronic component 20 and subsequently embedded in the functional layer 30 together with the printing material during a three-dimensional printing process of the functional layer 30. Alternatively, the transparent plastic may also be printed directly onto the electronic component 20. The light guide or the transparent plastic is preferably matched to the wavelength of the light that is to be exchanged between the electronic component 20 and the surroundings. For example, the electronic component 20 may be a light-emitting component, such as a light-emitting diode or the like. Alternatively, the electronic component 20 may also be a component that receives light from the surrounding environment and analyzes the light. For example, a brightness sensor or a camera element. The optical connection between the outer side 30a of the functional layer and the component 20 can also be designed as an optical lens or a lens-like structure which focuses light from the surroundings in a suitable manner onto the electronic component 20 or scatters the emitted light.
Additionally or alternatively, the functional layer 30 may also have a channel structure 36. The channel structure 36 may be an opening between the electronic component 20 and the outer side 30a of the functional layer. Through such a channel structure 36, for example, gases or fluids can be supplied to the electronic component 20 or past the electronic component 20. The electronic component 20 can thus also be in contact with substances in the surroundings of the electronic functional component. For example, it is thus possible to detect the gas pressure by means of an electronic functional unit, to analyze the gas or fluid flowing past it with respect to one or more predetermined substances, to determine the substance concentration, or to determine other environmental parameters, such as temperature, or the like. If required, auxiliary substances, for example organic substances or the like, which are necessary for the analysis of gases or fluids, can also be embedded in the functional layer 30 during the printing of the functional layer 30.
Furthermore, it is also possible to put the gas or fluid in the channel structure 36 into motion and thus to generate a flow by means of the electronic component 20 by means of a suitable MEMS.
The channel structure 36 required for this purpose can already be formed during the three-dimensional printing process of the functional layer 30. Furthermore, it is also possible to form the channel structure 36 completely or at least partially also by means of a suitable subsequent method, such as laser drilling or the like.
In addition or alternatively, the functional layer 30 can also have any other elements 37, 38. For example, a stabilizing element 37 can be integrated into the functional layer 30, which has an increased rigidity compared to the functional layer 30. The device may be a plate made of metal or hard plastic, for example. By such a stabilization plate 37 integrated into the functional layer 30, the stability of the functional layer 30 and thus of the entire electronic functional component can be increased. Sensitive electronic components 20 can thus be protected from damage.
Alternatively, the other element can also be a cooling element 38 with increased thermal conductivity compared to the functional layer 30. For example, a metal film, a cooling body or the like can be used here. By means of the cooling element 38 having an increased thermal conductivity, an efficient cooling of the electronic functional components and in particular of the electronic components 20 can be achieved.
Fig. 3 shows a further alternative embodiment of the electronic functional component 20. The electronic functional components here substantially correspond to the electronic functional components described above. The base element 10 in this embodiment is formed here by an electrically insulating film 12. Here, on the electrically insulating film 12, similarly to the previous exemplary embodiment, an electrically conductive structure 22 is applied, which provides an electrical connection to the terminal elements 21 of the electronic component 20. The electronic components can be applied to the film 12 and connected to the conductive structures 22, for example, by means of flip-chip mounting technology. The contact surfaces of the film 12 for connection to the terminal elements 21 of the electronic component 20 are preferably coated with a noble metal in order to achieve a sufficiently good electrical connection. Alternative methods for applying the electronic components 20 to the electrically insulating film 12 and for contacting the electronic components 20 with the electrically conductive structures 22 are likewise possible here.
In order to protect the previously described structure, the latter can additionally be covered with a protective film, not shown. The film 12 with the electronic components 20 thus prepared can then be applied to the previously prepared base body 11. The film 12 is preferably printed onto the base body 11 here using a suitable embossing tool. The base body 11 can be a base body 11 produced in a three-dimensional printing process, for example. The base body 11 can be produced here analogously to the base element 10 described in connection with fig. 1, wherein in this case the base body 11 must be free of electrically conductive structures at all. The electrically conductive structure 22 has been applied to the film 12 in the embodiment according to fig. 3.
After the application of the film 12 with the electronic component 20 on the base body 11, a further structuring of the functional layer 30 and the connection element 31 is subsequently carried out analogously to the previously described embodiments.
In addition to the flat surfaces 10a, 11a shown in the previous exemplary embodiments for applying the electronic component 20 to the base element 10 or the base body 11, any shaped, for example arched, curved or structured surface is also possible. The flexibility and space requirements in the shaping can thus be further optimized. In particular, in the case of stretchable or plastically deformable materials for the base element 10 or the functional layer 30, further subsequent deformation of the electronic functional component can also be achieved.
Fig. 4 shows a schematic representation of a flow chart of a method 100 for manufacturing an electronic functional component on which an embodiment of the invention is based.
In step 110, a base element 10 with an electrically insulating carrier layer is provided. The base element 10 is then provided with electrically conductive structures 22 which are adapted to the terminals 21 of the electronic component 20. In step 120, an electronic component 20 with electrical terminals 21 is then arranged on the base element 10. Subsequently, in a step 130, the functional layer 30 is printed onto the base element 10 in a three-dimensional printing method. In step 140, connecting elements 31 providing an electrical connection between the terminals 21 of the electronic device 20 and the outer side 30a of the functional layer 30 are introduced into the printed functional layer 30. The connection between the terminals 21 of the electronic component 20 can also be achieved here indirectly via the electrically conductive structures 22 on the base element 10.
In one embodiment, openings can already be provided during the three-dimensional printing in step 103, which openings provide a connection between the electrically conductive structures 22 on the base element 10 and the outer side 30a of the functional layer 30. In this case, the connection element 31 may be constructed by filling the cavity with a conductive substance.
If the formation of such cavities is not possible or only partly possible during three-dimensional printing, these cavities can also be realized by means of suitable further steps for forming openings. This may be achieved, for example, by a laser drilling process or the like. In this case, the structured openings are then also filled with a conductive substance.
Finally, in a further step, a contact element 32 can be applied to the outer side 30a of the functional layer, which contact element is electrically connected to the connection element 31 and provides a sufficiently large contact surface for an electrical connection of the electronic functional component.
In summary, the invention relates to an electronic functional component and to a production method for an electronic functional component. The electronic functional component includes an electronic component that is embedded in the functional component by means of a three-dimensional printing process. In this case, it is also possible to adapt separately, by means of the three-dimensional printing process, in addition to the surrounding of the electronic components, with regard to the shaping and mechanical properties of the functional components. Furthermore, the electrical terminals of the electronic component are guided in a suitable manner onto the surface of the functional component.

Claims (10)

1. An electronic functional component having:
a base element (10) comprising an electrically insulating carrier layer;
an electronic component (20) arranged on the base element (10) and comprising an electrical terminal (21); and
a functional layer (30) which is printed on the base element (10) during the three-dimensional printing process and into which connecting elements (31) are introduced which are designed to provide an electrical connection between electrical terminals (21) of the electronic component (20) and a side face (30 a) of the functional layer (30),
wherein the electronic component (20) comprises a sensor.
2. Electronic functional component according to claim 1, having contact elements (32) which are arranged on the outer side (30 a) of the functional layer (30) and which are electrically connected to electrical connections (31) between electrical connections (21) of the electronic component (20) and the outer side (30 a) of the functional layer (30).
3. Electronic functional component according to claim 1 or 2, wherein the base element (10) comprises an electrically conductive structure (22) which is electrically connected with an electrical terminal (21) of the electronic component (20).
4. Electronic functional component according to claim 1 or 2, wherein the functional layer (30) comprises a transparent plastic and/or optical waveguide which is arranged between the electronic component (20) and the outer side (30 a) of the functional layer (30).
5. The electronic functional component according to claim 1 or 2, wherein the functional layer (30) has a channel structure (36) which is arranged between the electronic component (20) and the outer side (30 a) of the functional layer (30).
6. Electronic functional component according to claim 1 or 2, having a further element (37, 38) which is integrated into the functional layer (30) and has an increased thermal conductivity and/or an increased rigidity compared to the functional layer.
7. Electronic functional part according to claim 1 or 2, wherein the electronic component (20) comprises a micro-electromechanical system, MEMS.
8. Method (100) for producing an electronic functional component, comprising the following steps:
providing (110) a base element (10) with an electrically insulating carrier layer;
arranging (120) an electronic component (20) having electrical terminals (21) on a base element (10);
-three-dimensionally printing (130) a functional layer (30) onto an electrically insulating base element (10); and is
Introducing (140) connecting elements (31) into the printed functional layer (30), said connecting elements providing an electrical connection between the electrical terminals (21) of the electronic component (20) and the side (30 a) of the functional layer (30).
9. The method (100) according to claim 8, wherein the introduction (140) of the connection element (31) comprises the steps of:
introducing an opening between the outer side (30 a) of the functional layer (30) and the base element (10); and is
The introduced opening is filled with a conductive material.
10. The method (100) according to claim 8, wherein the method is used for manufacturing an electronic functional component according to one of claims 1 to 7.
CN201580005294.XA 2014-01-22 2015-01-08 Electronic functional component and method for producing an electronic functional component Active CN105916802B (en)

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9818665B2 (en) 2014-02-28 2017-11-14 Infineon Technologies Ag Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
DE102016002052A1 (en) 2015-12-18 2017-06-22 Liebherr-Components Biberach Gmbh Control cabinet and method for its production
WO2018077675A1 (en) * 2016-10-24 2018-05-03 Philips Lighting Holding B.V. 3d printing method and product
DE102016224870A1 (en) 2016-12-13 2018-06-14 Robert Bosch Gmbh A method of making a patterned pattern on a metal-coated substrate and device
DE102017000744A1 (en) 2017-01-27 2018-08-02 Friedrich-Alexander-Universität Erlangen-Nürnberg Method for producing an electronic or electrical system and system produced by the method
KR102356699B1 (en) * 2017-04-28 2022-01-27 한국전자통신연구원 Manufacturing method of sensor using 3d printing and 3d printer thereof
EP3468312B1 (en) * 2017-10-06 2023-11-29 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Method of manufacturing a component carrier having a three dimensionally printed wiring structure
EP3468311B1 (en) * 2017-10-06 2023-08-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Metal body formed on a component carrier by additive manufacturing
US12030238B2 (en) * 2017-12-31 2024-07-09 Stratasys Ltd. 3D printing to obtain a predefined surface quality
EP3932151A4 (en) * 2019-03-29 2022-04-06 Nano-Dimension Technologies, Ltd. Additively manufactured electronic (ame) circuits having side-mounted components
DE102019217127A1 (en) * 2019-11-06 2021-05-06 Robert Bosch Gmbh Method for producing a functional component package
TWI754526B (en) * 2021-01-25 2022-02-01 蘇政緯 Manufacturing method of circuit board that can shield electromagnetic interference

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102415227A (en) * 2009-04-30 2012-04-11 株式会社村田制作所 Ceramic multilayer substrate producing method
CN103327741A (en) * 2013-07-04 2013-09-25 江俊逢 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011078757A1 (en) 2011-07-06 2013-01-10 Siemens Aktiengesellschaft Method for printing of three-dimensional components on three-dimensional printers, involves providing computer-aided design-model and quality attributes from component designer for component to be printed
SE536670C2 (en) * 2011-08-26 2014-05-13 Digital Metal Ab Layer-based manufacture of free-form micro-components of multimaterial
US10748867B2 (en) * 2012-01-04 2020-08-18 Board Of Regents, The University Of Texas System Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102415227A (en) * 2009-04-30 2012-04-11 株式会社村田制作所 Ceramic multilayer substrate producing method
CN103327741A (en) * 2013-07-04 2013-09-25 江俊逢 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof

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