JP2016004871A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of suppressing a circuit pattern from being damaged.SOLUTION: An electronic apparatus 1 includes: a base part 3 formed of a resin material; a circuit pattern 5 formed on the base part 3; an LED 6 mounted on the base part 3 so as to be electrically connected to the circuit pattern 5; and a plurality of first projecting parts 4 formed integrally with the base part 3. The base part 3 is formed integrally with the circuit pattern 5, and at least a part of the circuit pattern 5 is located between the first projecting parts 4.

Description

  The present invention relates to an electronic device having a structure that suppresses damage to a circuit pattern.

  Conventionally, an electronic device in which a circuit pattern is formed on a three-dimensional substrate by MID technology has been provided (see, for example, Patent Document 1).

JP 2004-28764 A

  However, in the pyroelectric element shown in FIG. 15 of Patent Document 1, a circuit pattern electrically connected to the chip component and formed on the MID substrate is exposed to the outside. For this reason, when the pyroelectric element is incorporated into an electronic device, the exposed circuit pattern may come into contact with other members such as an electric cable, and the circuit pattern may be damaged. Further, when the pyroelectric element is incorporated into an electronic device and then vibrates in a state where the circuit pattern of the pyroelectric element is in contact with another member such as an electric cable, the circuit pattern may be worn.

  An object of this invention is to provide the electronic device which can suppress damage to a circuit pattern.

An electronic device according to one embodiment of the present invention includes:
A base portion formed of a resin material;
A circuit pattern formed on the base portion;
An electronic component mounted on the base portion so as to be electrically connected to the circuit pattern;
A plurality of first protrusions formed integrally with the base portion,
The base portion and the circuit pattern are integrally formed,
An electronic device in which at least a part of the circuit pattern is located between the first protrusions.

  According to the above configuration, at least a part of the circuit pattern is located between the first protrusions. For this reason, it is prevented by a 1st projection part that a circuit pattern contacts an electric cable. Thus, an electronic device that can suppress damage to the circuit pattern can be provided.

  The first protrusions may be regularly arranged in a lattice shape.

  According to the above configuration, even when an arbitrary circuit pattern is formed on the base portion, damage to the circuit pattern is prevented by any of the first protrusions. As described above, the circuit pattern can be formed without being restricted by the formation position of the first protrusion, so that it is not necessary to change the formation position of the first protrusion in accordance with the design change of the circuit pattern. In this way, it becomes possible to ensure the degree of freedom of circuit pattern design.

  Further, the thickness of the end portion of the base portion may be larger than the basic thickness of the base portion, and the end surface of the end portion may be formed in a round shape.

  According to the above configuration, the base portion is resin-molded so that the thickness at the end portion of the base portion is larger than the basic thickness of the base portion by using a mold with relatively few processing steps. In addition, by making the end surface of the base portion round, damage to the circuit pattern formed on the end surface can be reduced.

  The electronic device may further include a plurality of second protrusions formed integrally with the base portion. Furthermore, the electronic component may include a semiconductor light emitting element, and the semiconductor light emitting element may be disposed between the second protrusions. Furthermore, the height of each of the second protrusions may be greater than the height of the semiconductor light emitting device.

  According to the said structure, it is prevented by the 2nd projection part that an electric cable etc. contact a semiconductor light-emitting device. As described above, an electronic device having a structure for protecting a circuit pattern and a semiconductor light emitting element can be provided.

  In addition, the electronic component is electrically connected to the circuit pattern via a fixed medium, and a concave portion or a convex portion is formed in the vicinity of the electronic component on the base portion, and a part of the circuit pattern However, you may form on the surface of the said recessed part or the said convex part.

  According to the above configuration, the concave portion or the convex portion formed in the base portion prevents the fixing medium from spreading along the circuit pattern, and the reliability of the electrical connection between the electronic component and the circuit pattern is ensured.

  ADVANTAGE OF THE INVENTION According to this invention, it is possible to provide the electronic device which can suppress damage to a circuit pattern.

1 is an overall perspective view showing an electronic device according to an embodiment of the present invention. (A) is the A section enlarged top view of the electronic device shown by FIG. (B) is sectional drawing of the part of the electronic device cut | disconnected along the AA line shown by (a). (A) is the B section enlarged top view of the electronic device shown by FIG. (B) is sectional drawing of the electronic device cut | disconnected along the BB line shown by (a). (C) is sectional drawing of the electronic device cut | disconnected along CC line shown by (a). FIG. 4 is a cross-sectional view of the electronic device shown in FIG. 3B when the reflector 60 is attached to the base portion 3. FIG. 4 is a cross-sectional view of an electronic device cut along line CC shown in FIG. 3A when the concave portions 10a and 10b in FIG. 3 are replaced with convex portions 13a and 13b, respectively. FIG. 2 is an enlarged cross-sectional view of a C part of the electronic device illustrated in FIG. 1. (A) is sectional drawing which shows the metal mold | die for injection molding of the base part shown by FIG. (B) is sectional drawing which shows the metal mold | die of a comparative example. (A) is an expanded sectional view which shows the through-hole of the base part of an electronic device. (B) is sectional drawing which shows the metal mold | die for injection molding of the base part which has the through-hole shown by (a). It is sectional drawing which shows the vehicle lamp provided with the electronic device shown by FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, about the member which has the same reference number as the member already demonstrated in description of this embodiment, the description is abbreviate | omitted for convenience of explanation. Moreover, the dimension of each member shown by this drawing may differ from the actual dimension of each member for convenience of explanation.
Further, in the description of the present embodiment, the X-axis direction, the Y-axis direction, and the Z-axis direction will be referred to as appropriate, but the directions of these axes are relative to those set for the electronic device 1 shown in FIG. Direction. Therefore, when the electronic device 1 shown in FIG. 1 rotates in a predetermined direction, the X-axis direction, the Y-axis direction, and the Z-axis direction also rotate accordingly. The X, Y, and Z axis directions described in this embodiment are directions including ± X, Y, and Z directions. When a specific vector (direction) is indicated, the directions are + X direction, -Y direction, and the like. Make it explicit.

  FIG. 1 is an overall perspective view showing an electronic apparatus 1 according to an embodiment of the present invention. As shown in FIG. 1, the electronic device 1 includes a base portion 3, a circuit pattern 5, and an LED (light emitting diode) 6 as an electronic component.

  The base part 3 is formed of a resin material. Moreover, the base part 3 is formed in the three-dimensional solid shape by the injection molding which used the metal mold | die, for example. As shown in FIG. 1, the base portion 3 is formed in a step shape.

  The circuit pattern 5 is made of a material such as metal plating, for example, and is integrally formed on the base portion 3 by MID (Molded Interconnect Device) technology.

  MID is a molded component in which a circuit pattern is formed on a resin molded product surface with a metal film such as plating. By applying this MID technique, the circuit pattern 5 can be directly formed on the base portion 3 having a three-dimensional solid shape. Various methods exist in this MID technique, and a one-time molding method, a two-time molding method, and the like are known. In addition, the circuit pattern can be formed by an electrolytic plating method or by an electroless plating method.

For example, the following example can be considered as a method of forming a circuit pattern.
First, a base portion 3 having a metal nucleus embedded in the resin surface is prepared. Next, a metal nucleus is exposed from the surface of the base portion 3 irradiated with the laser by performing three-dimensional laser irradiation on the surface of the base portion 3 in accordance with desired circuit pattern data. Then, a circuit pattern is formed on the base part 3 by forming metal plating on the surface of the base part 3 where the metal nucleus is exposed by an electroless plating method.

  The LED 6, which is an electronic component, is disposed on the base portion 3 and is electrically connected to the circuit pattern 5. In FIG. 1, one or two LEDs 6 are mounted on each of the step portions of the base portion 3, and are connected in series via a circuit pattern 5. In addition, although LED6 is used in this embodiment, according to the use of the electronic apparatus 1, light sources, such as a semiconductor laser (LD), may be used, for example.

  Next, a plurality of first protrusions formed integrally with the base portion 3 will be described with reference to FIG. 2A is an enlarged top view of a part A of the electronic device 1 shown in FIG. 1, and FIG. 2B is cut along the line AA shown in FIG. 2A. 1 is a cross-sectional view of an electronic device 1.

As shown in FIG. 2, the plurality of first projecting portions 4 are formed integrally with the base portion 3 and are regularly arranged in a lattice shape. Further, the circuit pattern 5 is formed on the base portion 3 so as to be positioned between the first protrusions 4. In the present embodiment, it is not necessary that all the circuit patterns 5 are arranged between the first protrusions 4. It is sufficient that at least a part of the circuit pattern 5 is disposed between the first protrusions 4. Further, a part of the circuit pattern 5 may be arranged so as to overlap the first protrusion 4.
For convenience of explanation, the first protrusion 4 is not shown in FIG. 1, which is an overall perspective view of the electronic device 1, and the first protrusion 4 is not shown in FIG. 2, which is a partially enlarged top view of the electronic device 1. It is shown.

The first protrusions 4 may be regularly formed in a lattice shape over the entire surface of the base 3, or may be formed only in a specific region of the base 3 where the circuit pattern 5 is formed. The first protrusion 4 is formed integrally with the base 3 by, for example, injection molding using a mold. In addition, as shown in FIG. 2, the first protrusion 4 is formed in a columnar shape, but the shape of the first protrusion 4 is not limited to this, for example, a pyramid shape, a cone shape, an elliptical column shape, It may be formed in a square column shape, a rectangular column shape, or the like, and may have a shape protruding from the surface of the base portion 3.
As shown in FIG. 2, the height of the first protrusion 4 in the Z-axis direction with respect to the surface of the base 3 is larger than the height of the circuit pattern 5.

According to the present embodiment, at least a part of the circuit pattern 5 is located between the first protrusions 4. For this reason, it is prevented by the 1st projection part 4 that the circuit pattern 5 contacts an electric cable.
That is, since the first protrusion 4 comes into contact with the electric cable or the like before the electric cable or the like comes into contact with the circuit pattern 5, the contact between the electric cable or the like and the circuit pattern 5 may damage the surface of the circuit pattern 5. Is prevented.

  On the other hand, when the first protrusion 4 is not provided, the circuit pattern 5 may be damaged due to the electrical cable or the like coming into contact with the circuit pattern 5 when the electronic device 1 is mounted on another device. For example, when the film thickness of the circuit pattern 5 is 5 μm to 10 μm, the surface of the circuit pattern 5 may come into contact with an electric cable or the like, so that the circuit pattern 5 may be worn and disconnected.

Moreover, what is necessary is just to satisfy the following formula | equation (1) as conditions for preventing the contact with the circuit pattern 5, an electric cable, etc., for example. In Equation (1), the height of the first protrusions 4 is H, the pitch of the first protrusions 4 is L, the radius of the cross-sectional circle perpendicular to the longitudinal direction of the electric cable is R, and the circuit pattern 5 The film thickness of is t.
When the radius R of the cross-sectional circle of the electric cable is 2 mm, the height H and the pitch L of the first protrusions 4 can be set as 1.3 mm and 2 mm, for example.

It is also conceivable to prevent contact between the circuit pattern 5 and an electric cable or the like by forming a circuit pattern forming groove in the base portion 3 in advance and then forming the circuit pattern 5 in the groove. Furthermore, it is conceivable to prevent contact between the circuit pattern 5 and an electric cable or the like by forming a circuit pattern 5 between adjacent ribs after forming a plurality of ribs on the base portion 3.
However, any of the structures described above has a problem in that the circuit pattern 5 formation position is restricted by the groove or rib formation position, and thus the design freedom of the circuit pattern 5 cannot be secured.

On the other hand, in this embodiment, after the plurality of first protrusions 4 and the base part 3 are integrally formed by injection molding using a mold, for example, the circuit pattern 5 is formed on the base part 3 by MID technology. Has been. Accordingly, since the plurality of first protrusions 4 are formed on the base part 3 at predetermined intervals in a lattice shape, a desired circuit pattern 5 is formed on the base part 3 without being restricted by the position where the first protrusions 4 are formed. Therefore, it is not necessary to change the formation position of the first protrusion 4 in accordance with the design change of the circuit pattern 5. Thus, in this embodiment, it is possible to ensure the degree of freedom in designing the circuit pattern 5.
Note that the first protrusions 4 do not necessarily have to be arranged in a grid at predetermined intervals if the contact between the electric cable or the like and the circuit pattern 5 can be prevented and the design freedom of the circuit pattern 5 can be secured. .

  Next, the LED 6 mounted on the base 3 will be described with reference to FIGS. 3 and 5. FIG. 3A is an enlarged top view of part B of the electronic device 1 shown in FIG. FIG. 3B is a cross-sectional view of the electronic device 1 cut along the line BB shown in FIG. FIG. 3C is a cross-sectional view of the electronic device 1 cut along the line CC shown in FIG.

  As shown in FIG. 3, a pair of second projecting portions 9 formed integrally with the base portion 3 is disposed around the LED 6, and the LED 6 is disposed between the pair of second projecting portions 9. .

  As shown in FIG. 3, the second protrusion 9 is formed in a cylindrical shape, but the shape of the second protrusion 9 is not limited to this, and for example, a pyramid, a cone, an elliptical column, a square column Alternatively, it may be formed in a rectangular column shape or the like, and may be a shape protruding from the surface of the base portion 3. Moreover, although a pair of 2nd projection part 9 is illustrated, three or more 2nd projection parts may be arrange | positioned around LED6. The second protrusion 9 is formed integrally with the base 3 by, for example, injection molding using a mold.

As shown in FIG. 3B, the height of the second protrusion 9 in the Z-axis direction with respect to the surface of the base 3 is larger than the height of the LED 6. Thereby, when the electric cable or the like approaches the circuit pattern 5 in the −Z direction, the second protrusion 9 prevents the electric cable or the like from contacting the LED 6. For example, when the height of the LED 6 from the surface of the base portion 3 is 1 mm, the height of the second protrusion 9 from the surface of the base portion 3 can be set to 2 mm.
That is, since the second protrusion 9 comes into contact with the electric cable or the like before the electric cable or the like comes into contact with the LED 6, the surface of the LED 6 is prevented from being damaged by the contact between the electric cable or the like and the LED 6.
In this way, it is possible to provide the electronic device 1 that can suppress damage to the circuit pattern 5 and the LED 6.

  For example, when the electronic device 1 of this embodiment is mounted on a vehicular lamp, a reflector 60 may be mounted on the electronic device 1 as shown in FIG. At this time, the reflector 60 is configured to reflect the light emitted from the LED 6 toward the + Z direction, and is disposed on the base portion 3 so as to surround the LED 6. Further, the reflector 60 is provided with a through hole. By inserting the 2nd projection part 9 in the penetration hole of reflector 60, reflector 60 is fixed to base part 3, and the position of reflector 60 to LED6 is determined. Thus, the 2nd projection part 9 functions also as a positioning member for determining the mounting position of the reflector 60 with respect to LED6. By providing the 2nd projection part 9 in the base part 3, since the positioning of the reflector 60 with respect to LED6 can be performed with high precision, the light radiate | emitted from LED6 can be irradiated to a predetermined area | region accurately. An example in which the electronic apparatus 1 according to this embodiment is applied to a vehicle lamp will be described later.

  The LED 6 has electrode pads 16 a and 16 b and is electrically connected to the circuit pattern 5 through the solder 12. In the present embodiment, solder is used as a fixing medium for fixing the LED 6, but a conductive adhesive may be used as the fixing medium instead of the solder. The solder 12 does not need to be disposed between the electrode pads 16 a and 16 b of the LED 6 and the circuit pattern 5, and functions as a fixing medium for fixing the LED 6 to the circuit pattern 5. The solder 12 wets and spreads on the circuit pattern 5 made of metal plating, but does not spread on the base part 3 made of a resin material.

  As shown in FIG. 3, the base portion 3 is formed with recesses 10a and 10b each having a predetermined depth in the vicinity of the LED 6, and part of the circuit pattern 5 is formed on the surface of the recesses 10a and 10b. ing. Here, the “vicinity” of the LED 6 is defined as a position where reliability of electrical connection between the LED 6 as an electronic component and the circuit pattern 5 is ensured by preventing the solder from spreading.

  As shown in FIG. 3 (c), the solder 12 spreading wet along the circuit pattern 5 spreads to a part of the circuit pattern 5 formed in the recesses 10a and 10b. Twelve wetting spreads are prevented. That is, the solder 12 cannot get over the side walls of the recesses 10a and 10b and stays in the recesses 10a and 10b. As described above, the recesses 10a and 10b prevent the solder 12 from spreading out, so that the reliability of the electrical connection between the LED 6 using the solder 12 and the circuit pattern 5 is ensured.

  In the present embodiment, the wetting and spreading of the solder 12 has been described. However, even when a conductive adhesive is used as the fixing medium, the wetting and spreading of the conductive adhesive similarly becomes a problem. Are provided with recesses 10a and 10b, respectively.

  As shown in FIG. 5, wetting and spreading of the solder 12 can also be prevented by providing convex portions 13 a and 13 b instead of the concave portions 10 a and 10 b. FIG. 5 shows an electronic device cut along the line CC shown in FIG. 3A when the concave portions 10a and 10b shown in FIG. 3C are replaced with convex portions 13a and 13b, respectively. FIG.

As shown in FIG. 5, convex portions 13a and 13b having a predetermined height are formed in the base portion 3 at positions corresponding to the positions where the concave portions 10a and 10b are formed, and a part of the circuit pattern 5 is formed. It is formed on the surface of the convex portions 13a and 13b. For this reason, as shown in FIG. 5, when the solder 12 that spreads along the circuit pattern 5 spreads to a part of the circuit pattern 5 formed on the surface of the convex portions 13a and 13b, the convex portions 13a and 13b The progress of the wetting and spreading of the solder 12 is prevented by the side wall, and the solder 12 stays around the convex portions 13a and 13b.
Thus, since the protrusions 13a and 13b prevent the solder 12 from spreading out, the reliability of the electrical connection between the LED 6 using the solder 12 and the circuit pattern 5 is ensured.

  In FIG. 3, the B part of the electronic device 1 of FIG. 1 has been described. However, other LEDs 6 shown in FIG. 1 other than the LED 6 existing in the B part are similarly shown in FIG. 3. It may have a simple structure.

  Next, the edge part of the base part 3 is demonstrated with reference to FIG. FIG. 6 is an enlarged cross-sectional view of a C portion of the electronic device 1 shown in FIG. As shown in FIG. 6, the thickness t1 at the end portion 22 of the base portion 3 is larger than the basic thickness t2 of the base portion 3, and the end surface 20 of the end portion 22 of the base portion 3 is formed in a round shape. Here, the basic thickness t2 of the base portion 3 is defined as the thickness in a region other than the end portion 22 of the base portion 3. For example, when the basic thickness t2 of the base portion 3 is 2 mm, the thickness t1 at the end portion 22 can be set as 3 mm.

In FIG. 6, the circuit pattern 5 is formed so as to extend from the upper surface 27 of the base portion 3 to the lower surface 28 through the end surface 20.
By forming the end surface 20 of the base portion 3 in a round shape, damage to the circuit pattern 5 formed on the end surface 20 can be alleviated as compared to the case where the end surface of the base portion 3 is not round.
That is, when the end surface 20 of the base portion 3 is not formed in a round shape, the angle formed between the end surface 20 and the upper surface 27 of the base portion 3 and the angle formed between the end surface 20 and the lower surface 28 of the base portion 3 are 90 respectively. Degree. Therefore, since the end face 20 has a sharp corner, there is a problem that the circuit pattern 5 formed near the corner is easily damaged. In order to solve such a problem, the end surface 20 of the base portion 3 is formed in a round shape.

  The metal mold | die used for the base part 3 shown by FIG. 6 is demonstrated with reference to FIG. FIG. 7A is a cross-sectional view showing an upper mold 43 and a lower mold 42 for injection molding of the base portion 3 shown in FIG. FIG. 7B is a cross-sectional view showing an upper mold 47 and a lower mold 46 according to a comparative example. In addition, in FIG. 6, shapes other than the edge part 22 of the base part 3 are shown as flat form for convenience.

  As shown in FIG. 7A, the base portion shown in FIG. 6 is obtained by injecting resin into the cavity C1 of the upper mold 43 and the cavity C2 of the lower mold 42, respectively, and solidifying the injected resin. 3 can be formed. On the other hand, as shown in FIG. 7B, the resin is injected into the cavity C3 of the upper mold 47 and the cavity C4 of the lower mold 46, respectively, and then the injected resin is solidified to have a round-shaped end surface. The base part 3 can be formed.

However, the cavity C2 of the lower mold 42 shown in FIG. 7A has a smaller processing area than the cavity C4 shown in FIG. That is, the lower mold 42 can reduce the number of processing steps required for the mold as compared with the lower mold 46.
Thus, when forming the base part 3 which has a round-shaped end surface, it is preferable to use the metal mold | die shown by Fig.7 (a). When the base portion 3 is formed using the mold shown in FIG. 7A, the thickness t1 at the end portion 22 of the base portion 3 is larger than the basic thickness t2 of the base portion 3 as shown in FIG. Become.

  FIG. 8A is an enlarged cross-sectional view showing the through hole h of the base portion 3 of the electronic device 1. FIG. 8B is a cross-sectional view showing an upper mold 56 and a lower mold 52 for injection molding of the base portion 3 having the through hole h shown in FIG. Similarly to the case where the end surface of the base portion 3 is formed in a round shape, in FIG. 8A, the side wall surfaces 37 and 38 that define the through holes h of the base portion 3 are each formed in a round shape. Thus, by making the side wall surfaces 37 and 38 into a round shape, the circuit pattern 5 formed on the boundary portion between the side wall surfaces 37 and 38 of the base portion 3 and the upper surface 27 and the side wall surfaces 37 and 38 of the base portion 3. It is possible to alleviate damage to the circuit pattern 5 formed at the boundary between the lower surface 28 and the lower surface 28.

As shown in FIG. 8B, resin is injected into the cavities C6 and C7 of the upper mold 56 and the cavities C10 and C12 of the lower mold 52, respectively, and the injected resin is solidified to form the through holes h. The base part 3 which has can be formed.
Further, similarly to the lower mold 42 shown in FIG. 7A, since the processing area of the cavities C10 and C12 of the lower mold 52 can be reduced, the through hole h is formed with a mold having a small number of processing steps. The base part 3 which has can be formed.

  Next, an example in which the electronic apparatus 1 shown in FIG. 1 is applied to a vehicle lamp will be described with reference to FIG. FIG. 9 is a cross-sectional view showing a vehicular lamp 100 including the electronic device 1 shown in FIG.

  As shown in FIG. 9, the vehicular lamp 100 includes an electronic device 1, a reflector 60, a translucent cover 50, and a lamp body 40. The translucent cover 50 and the lamp body 40 form a lamp chamber 70 for housing the electronic device 1 and the reflector 60. The light emitted from the LED 6 is reflected by the reflector 60 so as to go in the + Z direction, and the reflected light passes through the translucent cover 50 and is irradiated to the front area of the vehicular lamp 100.

Thus, the electronic device 1 manufactured by the MID technology can be used for a vehicle lamp, and the manufacturing process is simplified as compared with the structure of a conventional vehicle lamp using a flexible printed circuit board or a bus bar circuit. It is possible to provide a lighting fixture.
In addition, although the example which applies the electronic device 1 by this embodiment to a vehicle lamp was shown, it cannot be overemphasized that the electronic device by this embodiment is applicable not only to a vehicle lamp but to various uses.

  Although the embodiment of the present invention has been described above, it goes without saying that the technical scope of the present invention should not be construed in a limited manner by the description of this embodiment. This embodiment is an example, and it is understood by those skilled in the art that various modifications can be made within the scope of the invention described in the claims. The technical scope of the present invention should be determined based on the scope of the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Electronic device 3 Base part 4 Protrusion part 5 Circuit pattern 6 LED (electronic component)
60 Reflector 9 Second protrusion 10a, 10b Recess 13a, 13b Protrusion 16a, 16b Electrode pad 20 End surface 22 End 27 Upper surface 28 Lower surface 37, 38 Side wall surface 40 Lamp body 42 Lower mold 43 Upper mold 46 Lower mold 47 Upper mold 50 Translucent cover 52 Lower mold 56 Upper mold 70 Lamp chamber 100 Vehicle lamps C1 to C4 Cavity C6, C7 Cavity C10, C12 Cavity h Through hole

Claims (5)

A base portion formed of a resin material;
A circuit pattern formed on the base portion;
An electronic component mounted on the base portion so as to be electrically connected to the circuit pattern;
A plurality of first protrusions formed integrally with the base portion,
The base portion and the circuit pattern are integrally formed,
An electronic device in which at least a part of the circuit pattern is located between the first protrusions.   The electronic device according to claim 1, wherein the first protrusions are regularly arranged in a lattice pattern.   3. The electronic device according to claim 1, wherein a thickness at an end portion of the base portion is larger than a basic thickness of the base portion, and an end surface of the end portion is formed in a round shape. The electronic device further includes a plurality of second protrusions formed integrally with the base portion,
The electronic component has a semiconductor light emitting element,
The said semiconductor light-emitting device is arrange | positioned between the said 2nd projection parts, Each height of the said 2nd projection part is larger than the height of the said semiconductor light-emitting device. Electronic devices. The electronic component is electrically connected to the circuit pattern via a fixed medium,
In the base portion, a concave portion or a convex portion is formed in the vicinity of the electronic component,
5. The electronic device according to claim 1, wherein a part of the circuit pattern is formed on a surface of the concave portion or the convex portion.

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