TW201532082A - Electronic component - Google Patents

Abstract

This electronic component has a main body and an electrode that is provided on said main body and designed so as to be joined to a substrate via an electrically conductive material. The main body has the following: a connecting section that is designed so as to be connected to a connecting member; an insertion section that can be inserted into a receptacle provided in the substrate; and a contact section that can contact one surface of the substrate.

Description

Electronic parts

The present invention relates to an electronic component that is bonded to a substrate and connected to a connecting member.

A reflow soldering method as disclosed in Patent Document 1 has been known as a method of joining an electronic component to be mounted on a substrate to a substrate.

Advanced technical literature Patent literature

Patent Document 1 Japanese Patent Laid-Open No. Hei 11-233910

However, such an electronic component joined to the substrate by reflow soldering may sometimes wish to connect the electronic component to other connecting members. Here, when soldering by reflow soldering, the entire electronic component moves relative to the substrate due to the surface tension of the solder, and the position of the connection portion of the electronic component to be connected to the connection member also moves relative to the substrate. As described above, when the substrate on which the electronic component is mounted is placed at a predetermined position with respect to the connection member, the position of the connection portion may be shifted from the connection portion of the connection member. In this case, there is a concern that the connection portion of the electronic component cannot be connected to the connection member.

Further, even in the case where the electronic component is bonded to the substrate by another means than the reflow soldering, the position of the connection portion of the electronic component does not move better with respect to the substrate.

An object of the present invention is to provide an electronic component capable of suppressing a position at which a connection portion between an electronic component and a connection member are shifted when a substrate on which an electronic component is mounted is disposed at a predetermined position with respect to the connection member.

One aspect of the foregoing object is to provide an electronic component having a body portion and an electrode disposed on the body portion and configured to bond the conductive material to the substrate. The main body portion has a connection portion that is connected to the connection member, a fitting portion that is engageable with the fitted portion that is provided on the substrate, and a contact portion that is in contact with one side of the substrate .

10‧‧‧Electronic parts

11‧‧‧ Body Department

11a‧‧‧Bottom plate

11b‧‧‧Long side plate

11c‧‧‧Short side panel

12‧‧‧ electrodes

13‧‧‧Connecting Department

13a‧‧‧Extension Settings Department

13b‧‧‧Internal Department

13h‧‧‧through hole

14‧‧‧First protrusion

15‧‧‧second protrusion

16‧‧‧Protruding

16a‧‧‧Outside

19‧‧‧ solder

20‧‧‧Substrate

20h‧‧‧ inserted through hole

21‧‧‧First substrate

Bottom of 211b‧‧

212b‧‧‧inside

21a‧‧‧ recess

21b‧‧‧Gap section

22‧‧‧second substrate

221a‧‧‧ front end

22a‧‧‧ convex

23‧‧‧Connecting Department

30‧‧‧heating components

30a‧‧‧seat

31‧‧‧ bolt

Z‧‧‧ area

L1‧‧‧distance between front end portion 221a and inner bottom portion 211b

L2‧‧‧ Length along the length of each projection 16

L3‧‧‧Distance between a pair of inner portions 212b

Distance between L4‧‧‧ outer sides 16a

Fig. 1 is a top plan view showing a state in which an electronic component according to an embodiment is mounted on a substrate.

Figure 2 is a perspective view of an electronic component.

Figure 3 is a top view of the electronic component.

Figure 4 is a side view of the electronic component.

Fig. 5 is a bottom view showing a state in which an electronic component is positioned with respect to a substrate.

[Formation for implementing the invention]

Hereinafter, an embodiment in which an electronic component is embodied will be described with reference to Figs.

As shown in FIG. 1, the electronic component 10 is mounted on the substrate 20 by soldering as a conductive material 19 and bonding it to the substrate 20 by reflow soldering. Next, the substrate 20 on which the electronic component 10 is mounted is disposed at a position that is determined in advance with respect to the plate-shaped heat dissipating member 30 which is a connecting member different from the substrate 20.

The heat radiating member 30 is made of metal and is made of, for example, aluminum. Inside the heat radiating member 30, a fluid passage (not shown) through which a fluid serving as a cooling medium, for example, water passes, is formed. The heat radiating member 30 transmits heat from the components of the substrate 20 or the like to the heat radiating member 30 to be taken away by the fluid of the fluid passage, thereby dissipating heat.

The electronic component 10 has a body portion 11, a pair of electrodes 12, and a connecting portion 13. The electrode 12 is disposed on the body portion 11 and joined to the substrate 20 by reflow soldering. The connecting portion 13 is provided in the main body portion 11 and is connected to the boss portion 30a of the heat radiating member 30. The connecting portion 13 is coupled to the boss portion 30a by a bolt 31. In the present embodiment, the electronic component 10 is a thermistor for measuring the temperature of the heat radiating member 30 (specifically, the temperature of the fluid passing through the fluid passage).

As shown in FIG. 2, the main body portion 11 has a flat bottom plate portion 11a which is rectangular in plan view, and a pair of long side plate portions 11b which are respectively provided from the two long sides of the bottom plate portion 11a. Each long side plate portion 11b is It is formed in a flat plate shape extending in a direction orthogonal to the bottom plate portion 11a. The two long side plate portions 11b extend parallel to each other. Further, the main body portion 11 has a pair of short side plate portions 11c corresponding to the long side plate portions 11b. The two short side plate portions 11c extend from the edge portions of one end in the longitudinal direction of the corresponding long side plate portion 11b. Each of the short side plate portions 11c has a flat plate shape extending in a direction orthogonal to the corresponding long side plate portion 11b.

Each of the electrodes 12 has a rod shape. Each of the electrodes 12 extends from the edge portion of the bottom plate portion 11a opposite to the short side plate portion 11c along the longitudinal direction of the bottom plate portion 11a. Each of the electrodes 12 is bent from there to extend in a direction in which the long side plate portions 11b are erected. The protruding direction of each of the electrodes 12 is the same direction as the longitudinal direction of the bottom plate portion 11a.

The connecting portion 13 is composed of a flat extending portion 13a and an annular insertion portion 13b. The extended portion 13a is formed integrally with the bottom plate portion 11a. Further, the extended portion 13a linearly extends from the edge portion where the short side plate portion 11c is located in the bottom plate portion 11a. The insertion portion 13b is formed at the front end of the extended portion 13a. A circular hole-shaped through hole 13h through which the bolt 31 can pass is formed in the insertion portion 13b.

As shown in FIG. 3, in the edge portion of the pair of long side plate portions 11b on the side opposite to the bottom plate portion 11a, a flat first protruding portion that protrudes outward from each other is formed adjacent to each of the short side plate portions 11c. 14. Further, in the pair of long side plate portions 11b, the edge portions on the opposite side to the respective short side plate portions 11c are formed with flat second protrusion portions 15 that protrude outward from each other. Each of the first protrusions 14 and each of the second protrusions 15 protrudes in a direction orthogonal to the direction in which the electrodes 12 protrude.

As shown in Fig. 4, an end surface on the opposite side of the bottom plate portion 11a of each of the first projections 14 and an end surface on the opposite side to the bottom plate portion 11a of each of the second projections 15 are imaginary planes H extending in parallel with the bottom plate portion 11a. The upper position is in a plane. On the side opposite to the bottom plate portion 11a of the pair of long side plate portions 11b, a protruding portion 16 is formed between each of the first protruding portions 14 and each of the second protruding portions 15, and the protruding portion 16 is more inclined than the imaginary plane H It protrudes on the opposite side to the bottom plate portion 11a.

As shown in FIG. 5, the substrate 20 has a first substrate 21 and a second substrate 22, and the first substrate 21 is formed with two insertion holes 20h through which the electrodes 12 are respectively inserted, and the second substrate 22 is tied to The surface directions of the first substrates 21 are arranged side by side. The aperture of the insertion hole 20h is set to be larger than the outer diameter of each electrode 12. The first substrate 21 and the second substrate 22 are connected to each other by a part of the opposite outer edge portion by the connecting portion 23. A recess 21a that is recessed from the outer edge portion into a trapezoidal shape is formed on the first substrate 21. Further, the first substrate 21 is formed with a notch portion 21b that is connected to the concave portion 21a and has a substantially square shape in a plan view.

A ladder-shaped convex portion 22a that protrudes toward the concave portion 21a of the first substrate 21 is formed on the second substrate 22. The front end portion 221a of the convex portion 22a and the distance L1 between the inner bottom portion 211b of the notch portion 21b facing the front end portion 221a of the convex portion 22a are along the respective protruding portions 16 (shown by broken lines in Fig. 5). The length L2 in the longitudinal direction is the same. Moreover, the distance L3 between the pair of inner side portions 212b facing each other in the notch portion 21b is the same as the distance L4 between the outer side surfaces 16a of the respective protruding portions 16. Therefore, each of the protruding portions 16 can be fitted between the notch portion 21b and the convex portion 22a. In other words, in the present embodiment, the substrate 20 is provided with a fitting portion. The fitted portion is composed of a notch portion 21b and a convex portion 22a, and each protruding portion 16 is fitted thereto, and each protruding portion 16 is formed with a fitting portion that is fitted to the fitted portion.

Further, each of the first protrusions 14 is in contact with the back surface of the convex portion 22a of the second substrate 22, that is, with the back surface of one surface of the substrate 20. Further, each of the second protrusions 15 is in contact with the back surface on the opposite side of the recess 21a from the inner bottom surface 211b of the cutout portion 21b of the first substrate 21, that is, in contact with the back surface of one surface of the substrate 20. Therefore, each of the first protrusions 14 and each of the second protrusions 15 functions as a contact portion that can come into contact with the back surface of the substrate 20. Therefore, in the present embodiment, the four contact portions that can be in contact with the back surface of the substrate 20 are provided in the main body portion 11.

Each of the first protrusions 14 and each of the second protrusions 15 is disposed with respect to the main body portion 11 so as to include the body portion 11 (shown by a two-dot chain line in FIG. 5) surrounded by all of the protrusions. Part of it. The region Z is a quadrangular region in a plan view, and each of the first projections 14 and the second projections 15 is connected to a substantially central portion of a contact portion of the back surface of the substrate 20 by a straight line, and is linearly connected. Surrounded by.

Next, the action of this embodiment will be described. The step of attaching the electronic component 10 to the substrate 20 and bonding the connecting portion 13 to the boss portion 30a by the bolt 31 will be described here.

First, the electronic component 10 is placed from the back surface of the substrate 20 such that each of the protruding portions 16 is fitted between the notch portion 21b and the convex portion 22a. At this time, each electrode 12 is inserted into the corresponding insertion hole 20h. Next, each protruding portion 16 is fitted between the notch portion 21b and the convex portion 22a, and each protruding An end portion in the vicinity of each of the first protrusions 14 of the portion 16 is in contact with the front end portion 221a of the convex portion 22a. Moreover, the end portion in the vicinity of each of the second protrusions 15 of each of the protruding portions 16 is in contact with the inner bottom portion 211b of the notch portion 21b. Further, each of the protruding portions 16 is fitted between the notch portion 21b and the convex portion 22a, and the outer side surface 16a of each protruding portion 16 is in contact with the inner portion 212b of the notch portion 21b. Thereby, the position of the electronic component 10 in the surface direction of the substrate 20 is defined.

Further, each of the first protrusions 14 is in contact with the back surface of the convex portion 22a of the second substrate 22. Each of the second protrusions 15 is in contact with the back surface of the notch portion 21b of the first substrate 21 on the back side opposite to the recess 21a. Thereby, the position of the electronic component 10 in the thickness direction of the substrate 20 is defined.

An end surface of each of the first protrusions 14 on the side opposite to the bottom plate portion 11a is located on a plane with an end surface of the second protrusion portion 15 opposite to the bottom plate portion 11a. Therefore, the contact positions of the respective first protrusions 14 and the respective second protrusions 15 with respect to the back surface of the substrate 20 are located on a plane. Further, each of the first protrusions 14 and the second protrusions 15 is disposed with respect to the main body portion 11 such that a portion Z surrounded by all of the protrusions includes a portion of the body portion 11. Therefore, when each of the first protrusions 14 and the second protrusions 15 comes into contact with the back surface of the substrate 20, the virtual plane H of the region Z becomes parallel to the back surface of the substrate 20. Therefore, the posture of the electronic component 10 can be prevented from being inclined to the back surface of the substrate 20.

The electronic component 10 is then mounted on the substrate 20 by soldering the electrodes 12 to the substrate 20 by reflow. At this time, since each of the protruding portions 16 is fitted between the notch portion 21b and the convex portion 22a, and since each of the first protruding portions 14 and each of the second protruding portions 15 contacts the back surface of the substrate 20. For this reason, the electronic component 10 is positioned relative to the substrate 20. Therefore, it is possible to suppress the movement of each electrode 12 due to the surface tension of the solder generated by the reflow soldering. As a result, when the substrate 20 on which the electronic component 10 is mounted is placed at a predetermined position with respect to the heat radiating member 30, the position of the connecting portion 13 and the joint portion of the heat radiating member 30, that is, the boss portion 30a can be prevented from being shifted. Further, after the connection portion 23 is cut, after the second substrate 22 is separated from the first substrate 21, the connection portion 13 and the boss portion 30a are joined by the bolt 31.

The above embodiment can obtain the following effects.

(1) The electronic component 10 has a pair of protruding portions 16 that are fitted between the notch portion 21b and the convex portion 22a that are formed in the fitted portion of the substrate 20, and a pair of first protruding portions 14 and one For the second protrusions 15, the protrusions are in contact with the back surface of the substrate 20. Thereby, the pair of protruding portions 16 are fitted between the notch portion 21b and the convex portion 22a, thereby defining the position of the electronic component 10 in the surface direction of the substrate 20. Further, the pair of first protrusions 14 and the pair of second protrusions 15 are in contact with the back surface of the substrate 20 to define the position of the electronic component 10 in the thickness direction of the substrate 20. As a result, when the substrate 20 on which the electronic component 10 is mounted is disposed at a predetermined position with respect to the heat radiating member 30, the position of the connecting portion 13 and the joint portion of the connecting member, that is, the boss portion 30a can be prevented from being shifted.

(2) The contact positions of the pair of first protrusions 14 and the pair of second protrusions 15 with respect to the back surface of the substrate 20 are located on a plane. Each of the first protrusions 14 and each of the second protrusions 15 is disposed with respect to the main body portion 11 so that a portion Z surrounded by all of the protrusions includes a portion of the body portion 11. Thereby, each of the first protrusions 14 and each of the second protrusions When the 15 is in contact with the back surface of the substrate 20, the virtual plane H of the region Z surrounded by all of the projections is parallel to the back surface of the substrate 20. Therefore, the posture of the electronic component 10 can be prevented from being inclined to the back surface of the substrate 20.

(3) For example, when each of the second protrusions 15 protrudes from the main body portion 11 toward the protruding direction of the electrode 12, in order to ensure that each of the electrodes 12 is inserted between the portion of the insertion hole 20h and each of the second protrusions 15 The insulation, how long the insulation distance is, requires that the distance between the portion of each of the electrodes 12 that is inserted through the insertion hole 20h and each of the second protrusions 15 is only separated by the distance. Therefore, how long the insulation distance is, it is necessary to lengthen the length of each electrode 12 from the main body portion 11 to the insertion hole 20h to the distance, resulting in an increase in the overall size of the electronic component 10. Then, the second protrusions 15 provided in the end portion of the main body portion 11 close to the respective electrodes 12 protrude in a direction orthogonal to the direction in which the electrodes 12 protrude. Thereby, the length of each electrode 12 from the main body portion 11 to the insertion hole 20h can be shortened as compared with the case where the respective second protrusions 15 protrude from the main body portion 11 toward the protruding direction of the electrode 12, and the length is used to ensure A sufficient insulation distance between each of the electrodes 12 that is inserted into the insertion hole 20h and each of the second protrusions 15 is obtained. Therefore, it is possible to suppress an increase in the size of the electronic component 10 as a whole.

(4) Each of the electrodes 12 is joined to the substrate 20 by reflow soldering. Thereby, it is possible to prevent the respective electrodes 12 from moving due to the surface tension of the solder 19 generated by the reflow soldering.

(5) Since the position of the connecting portion 13 of the electronic component 10 can be prevented from being shifted from the boss portion 30a of the heat radiating member 30, the operation of joining the connecting portion 13 and the boss portion 30a with the bolt 31 can be automated.

Further, the above embodiment can be modified as follows.

In the embodiment, the first protrusions 14 may be omitted. In this case, the edge portion on the side opposite to the bottom plate portion 11a of the pair of long side plate portions 11b functions as a contact portion that can come into contact with the back surface of the substrate 20 at a portion close to each of the short side plate portions 11c.

In the embodiment, the number of contact portions that can be in contact with the back surface of the substrate 20 is not particularly limited. However, it is preferable to provide three or more of the main body portions 11 .

In the embodiment, each of the first protrusions 14 and the second protrusions 15 may protrude in a direction intersecting the protruding direction of each of the electrodes 12, and the angle of the protruding direction of each of the electrodes 12 is not particularly limited. .

In the embodiment, each of the first protrusions 14 may protrude in a direction in which the extended portion 13a extends from the bottom plate portion 11a.

In the embodiment, each of the second protrusions 15 may protrude from the main body portion 11 in the protruding direction of each of the electrodes 12.

In the embodiment, the connecting portion 13 may be connected to the boss portion 30a by, for example, an adhesive.

In the embodiment, the electronic component 10 may be surface-mounted on the substrate 20 and formed into a wafer type.

In the embodiment, the heat radiating member 30 is applied as a connecting member that is connected to the connecting portion 13, but the connecting member is not particularly limited.

In the embodiment, the region Z may be a curved line connecting the substantially central portions of the contact portions of the first projections 14 and the second projections 15 with respect to the back surface of the substrate 20, and surrounded by the respective curves. Area.

In the embodiment, the region Z may be connected by a straight line or a curved line at the edge of each of the first protrusions 14 and the second protrusions 15 with respect to the back surface of the substrate 20, and may be linear or The area enclosed by each curve.

In the embodiment, when the connecting portion 13 is joined to the boss portion 30a by the bolt 31, the second substrate 22 may not be separated from the first substrate 21. In this case, it is necessary to form a through hole through which the bolt 31 can pass through the second substrate 22.

In the embodiment, each of the electrodes 12 may be joined to the substrate 20 by a soldering method other than reflow.

In the embodiment, each of the electrodes 12 may be bonded to the substrate 20 by, for example, a conductive adhesive as a conductive material.

10‧‧‧Electronic parts

11‧‧‧ Body Department

11a‧‧‧Bottom plate

11b‧‧‧Long side plate

11c‧‧‧Short side panel

12‧‧‧ electrodes

13‧‧‧Connecting Department

13a‧‧‧Department

13b‧‧‧Internal Department

13h‧‧‧through hole

14‧‧‧First protrusion

15‧‧‧second protrusion

16‧‧‧Protruding

16a‧‧‧Outside

20‧‧‧Substrate

20h‧‧‧ inserted through hole

21‧‧‧First substrate

Bottom of 211b‧‧

212b‧‧‧inside

21a‧‧‧ recess

21b‧‧‧Gap section

22‧‧‧second substrate

221a‧‧‧ front end

22a‧‧‧ convex

23‧‧‧Connecting Department

L1‧‧‧distance between front end portion 221a and inner bottom portion 211b

L2‧‧‧ Length along the length of each projection 16

L3‧‧‧Distance between a pair of inner portions 212b

Distance between L4‧‧‧ outer sides 16a

Z‧‧‧ area

Claims (7)

An electronic component comprising: a main body portion; and an electrode provided in the main body portion and configured to bond the conductive material to the substrate, wherein the main body portion has a connecting portion configured to be connected to the connecting member; and a fitting portion It can be fitted to the fitted portion provided on the substrate, and the contact portion can be in contact with one surface of the substrate. The electronic component according to claim 1, wherein the main body portion has two or more additional contact portions in addition to the contact portion, and a contact position of each of the contact portions with respect to the surface of the substrate is located at a position In the plane, each of the contact portions is disposed with respect to the body portion such that a region surrounded by all the contact portions includes at least a portion of the body portion. The electronic component according to claim 1, wherein the electrode system protrudes from the main body portion and is insertable through an insertion hole provided in the substrate, wherein the contact portion is located at an end portion of the main body portion close to the electrode, and the contact portion It protrudes in a direction crossing the protruding direction of the aforementioned electrode. An electronic part of claim 2, wherein The electrode system protrudes from the main body portion and is inserted through an insertion hole provided in the substrate, and at least one of the contact portions is located at an end portion of the main body portion close to the electrode, and the at least one contact portion is It extends in a direction crossing the direction in which the aforementioned electrodes extend. The electronic component of any one of claims 1 to 4, wherein the electrode is bonded to the substrate by reflow soldering. The electronic component according to any one of claims 1 to 4, wherein the connecting member is a heat dissipating member that dissipates heat transferred from the substrate. The electronic component of any one of claims 1 to 4, wherein the electronic component is a thermistor.