TW201531359A - A hybrid micro electrical discharge machining and precise grinding machine table - Google Patents

Abstract

A synchronized hybrid micro electrical discharge machining (micro-EDM) and grinding machine table is provided, which may perform micro electrical discharge machining and precise grinding processes for a work-piece synchronously. On the same machine, a co-deposition electrical plating tank is provided, which may plate none-conductive hard abrasive grains onto a micro-tool, which is used to perform the micro-EDM with metal substrate and precise grinding with abrasive grains simultaneously, with length of abrasive grains, exposed out of the tool's outer surface, larger than or equal to the discharge arc, such that the melting layer and a recasting layer of the work's surface by micro-EDM processing can be removed from the surface thereof by the grinding effect of the abrasive grains on the tool's surface during the micro-EDM processes. Besides, the machine table is also provided with a tool blade's dressing/(electrical discharge grinding) device thereon for dressing the micro-tool to accomplish an integrated process from the preparation of the micro-tool's shape, electrical co-deposition with abrasive grains, to the synchronized hybrid micro-EDM and precise micro-grinding.

Description

Compound micro-discharge grinding machine

The present invention relates to a composite processing machine, and more particularly to a device capable of simultaneous precision grinding during micro-discharge machining.

Electrical Discharge Machining (EDM), which is one of the non-traditional processing types, uses the method of converting electrical energy into thermal energy to melt the surface of the workpiece with high temperature, which can be used for processing hard or difficult materials. In the process, the discharge electrode is not directly in contact with the workpiece, so the machining part does not generate machining stress during the machining process, so the electric discharge machining can be used for the processing of the precision mold. However, in the process of electrical discharge machining, the workpiece will form discharge pits and micro-cracks on the surface under the impact of the discharge spark, and form defects such as re-casting layer on the surface after cooling, so that the surface roughness quality of the workpiece is difficult to achieve fineness. Manufacturing requirements. The general practice is to apply a secondary polishing process to the surface of the workpiece after the electrical discharge machining to improve the surface of the workpiece after the electrical discharge machining. However, after the electric discharge machining of the micropores, the secondary treatment of the polishing is performed again, which tends to cause an error in the positioning accuracy, and it is often difficult to control the amount of polishing removal.

In this regard, Taiwan's TWI351330 patent case (patent name: a polishing effect of the discharge machining fluid) exposes the use of modified discharge machining fluid, adding abrasive particles and polymer powder to the discharge machining fluid, but this will lead to electrical discharge machining The cost of the liquid increases, and the electric discharge machining fluid flows away from the grinding surface with the abrasive grains and the polymer powder. If the abrasive grains and the polymer powder are not continuously replenished, the grinding effect is not as expected.

Therefore, how to perform the grinding processing of the workpiece simultaneously in the electric discharge machining without the need to reform the electric discharge machining fluid is a matter of close interest to those skilled in the art.

In view of the above problems of the prior art, the main object of the present invention is to provide a composite micro-discharge grinding machine that can simultaneously perform micro-discharge grinding processing on workpieces on the same machine to improve processing efficiency and improve processing. The surface quality of the piece and the processing of the small geometric feature size of the workpiece.

Another object of the present invention is to provide a composite micro-discharge grinding machine for setting a plating tank containing non-conductive hard abrasive grains, and a cutter grinding device capable of trimming the cutter to prepare a micro-tool with exposed abrasive grains. , by means of the prepared tool, synchronous grinding is achieved simultaneously in the micro-discharge machining of the workpiece.

To achieve the above and other objects, the present invention provides a composite micro-discharge grinding machine system comprising an organic table body, a tool grinding device, a plating tank, and a processing station. The machine body has a high speed shaft, a low speed shaft, a moving carrier and a power feeding device. The tool grinding device is arranged on the moving carrier of the machine body, and is moved to the tool driven by the high-speed rotating shaft. The tool grinding device is provided with a wire electrode, and can receive a current of 0.05 amp or more provided by the power feeding device to the adjacent tool. Perform micro-discharge grinding. The electroplating bath is doped with a non-conductive hard abrasive plating solution. The electroplating bath is disposed on the moving carrier, and is moved to the tool driven by the low-speed rotating shaft, so that the tool is immersed in the plating solution and plated on the outer surface of the tool. For a plurality of abrasive particles, the exposed length of the abrasive particles needs to be greater than or equal to the arc length at which the tool discharges the workpiece. The processing table is arranged for placing the machining piece and is disposed on the moving carrier, and is moved to the tool driven by the high speed rotating shaft, so that the machining part of the processing table is close to the tool, and the tool can receive a minimum of 0.05 amps for the feeding device. The current is passed to the tool for micro-discharge machining of the workpiece, and the micro-discharge machining of the workpiece is precisely ground by the abrasive particles exposed on the surface of the tool.

In an embodiment of the invention, the machine body further has a control module, a gap sensor, and a position sensor. Wherein, the gap sensor senses the gap between the tool and the processing part by the measurement of the voltage, and the control module commands the moving carrier to move, thereby adjusting the distance between the tool and the workpiece; position sensing The device senses the position of the mobile carrier for the control module to adjust the movement of the mobile carrier; the control module also controls the discharge current, the no-load voltage, the discharge capacitance value, and the pulse time of the power supplied by the power supply device to the tool Or rest time.

The tool grinding device is responsible for trimming the rotating rod-shaped tool into a micro-tool by wire discharge grinding. Preferably, the tool grinding device may further have a guiding wheel for ejector wire electrodes, and the wire guiding wire electrode performs electric discharge grinding on the tool to prepare a tool of a desired shape and size.

Preferably, for a tool for repairing discharge energy of a micro-scale feature shape having a tool radius of 1 mm or less, the particle size of the abrasive grains doped by the plating solution is between 5 and 13 μm. Preferably, the abrasive grains doped by the plating solution have a particle size of between 9 and 13 μm, are deposited on the outer surface of the tool by composite plating bath deposition, and have sufficient chip discharge formed between adjacent abrasive grains. Space, in the process of electrical discharge machining and grinding, reduce the chance of concentrated secondary discharge machining due to poor slagging, and thus make the discharge grinding process easy to stabilize.

An anode ring, a cover, and a stirrer may be disposed inside the plating tank. The cover system is located below the anode ring and placed on the bottom surface of the plating tank to define a moving range for the abrasive grains of the plating solution in the plating bath, and the end side of the cover body near the bottom surface of the plating tank is formed with a port for circulating as a plating solution. Entering the flow path of the cover body, the agitator is driven to rotate, and the plating solution inside the cover body is stirred, and the abrasive grains at various positions in the plating solution are gathered upward in the direction of the anode ring, so that the outer surface of the tool can be plated with a grinding machine. grain. In addition, the tool feeding device includes a power supply carbon brush and an elastic member in addition to the power source, and the elastic member provides elastic force to the feeding carbon brush, and the power feeding carbon brush is electrically contacted with the low-speed tool or the tool holder for timely timing. Ground power to low speed tools or tool holders. For high-speed tools or tool holders, the power supply unit can be powered by a contactless induction power supply.

Compared with the prior art, the composite micro-discharge grinding machine of the present invention provides a plating tank for plating exposed abrasive grains on the outer surface of the cutter, and a processing table for arranging the workpiece. The tool performs micro-discharge machining on the workpiece, and simultaneously grinds the workpiece by the abrasive grains exposed on the outer surface of the cutter, so as to save the workpiece from being subjected to micro-discharge processing, and then to perform the second grinding. The treatment can greatly save the processing pass, directly grind the surface of the discharge workpiece with the micro-scale feature shape, and improve the processing efficiency.

In addition, the composite micro-discharge grinding machine of the present invention is integrated into a single machine and the same machining spindle from the preparation of the tool to the processing and grinding of the workpiece, thereby ensuring the reproducibility of the tool positioning and the micro-machining. Precision.

The other aspects of the present invention will be readily understood by those skilled in the art from this disclosure. The invention may also be embodied or applied by other different embodiments. The details of the present invention can be variously modified and changed without departing from the spirit and scope of the invention. In particular, the relative relationship and relative positions of the various elements in the drawings are for illustrative purposes only and are not representative of actual implementation of the invention.

With the development of the technology industry towards miniaturization and precision, with the use of precision bed sets and high-speed spindles, various micro-machinings have emerged, and the dimensional accuracy of their requirements has also increased. Although conventional machining with high-speed spindles can also be micro-machined, there are still too many limited conditions. Non-contact processing is most representative of electric discharge machining, especially micro-discharge machining is applied to micro-hole machining such as processing fuel nozzles, special-shaped spinning nozzles or printer inkjet heads, and is also widely used in electronics, aerospace, machinery, and biomedical applications. Engineering and other manufacturing areas.

The electric discharge machining can adjust the electrical parameters of the discharge to achieve precise control of the removal of the material, so that the machining precision reaches the demand of precision machining, and there is no actual contact between the electrodes, so the processed parts are not affected by the cutting force during the electric discharge machining. Stress generation, which is an important feature for microfabrication technology, is widely used to make micropores with high aspect ratios. However, micro-discharge machining will produce re-casting layers, micro-cracks and discharge pits on the surface of the workpiece after processing, and the micro-electrodes are prone to secondary discharge due to chip removal during processing, resulting in poor micro-hole entrance and exit and electrode wear. The situation. These factors not only cause the roughness of the surface of the workpiece to be poor, the dimensional accuracy and shape accuracy of the workpiece are poor, and the microcracks and the discharge pit are also likely to cause fatigue damage of the workpiece, which shortens the service life of the workpiece, so the workpiece is fine. The surface after electrical discharge machining usually requires further post-treatment to meet the needs of the actual application.

The recast layer and the discharge pit generated on the surface of the machined part after the electric discharge machining generally need to be subjected to the second pass grinding treatment, but the grinding again after the micro discharge is easy to cause an error in the positioning accuracy, so if the discharge can be performed simultaneously With grinding, the high temperature instantaneously melts part of the surface material of the workpiece. Before the molten material is not completely hardened, it is the best timing to remove the surface of the workpiece and re-cast the layer and the discharge pit. At this time, if the surface of the tool is used, The non-conductive hard abrasive grains are used to grind the workpiece, so that the positioning problem of the moving workpiece or the replacement tool can be eliminated, and all processing procedures for the workpiece can be completed on the same machine.

The invention integrates the micro-discharge and micro-grinding processing of the workpiece into the same machine and synchronizes with one process, and simultaneously removes the processed part on the micro-discharge machining by the non-conductive hard abrasive on the tool at the same time of the micro-discharge machining. The molten layer and the recast layer are produced at the time, so that the rough quality of the surface of the workpiece satisfies the requirements of fine manufacturing. The tool of the present invention can be used with a microelectrode cutter between 0.1 mm and 3 mm. The selected microelectrode tool can be electroplated with non-conductive hard abrasive particles using a metal substrate comprising nickel and/or cobalt.

The composite micro-discharge grinding machine of the invention is a numerical control system, which can adopt an air-floating platform and is driven by a linear motor, so that the movement precision of the machine can reach 0.1 μm, and can provide a minimum of 0.05 with a capacitive power supply mechanism. The amperage current is given to the tool so that the tool can micro-discharge energy to refine the surface of the micro-sized workpiece. In an embodiment of the present invention, the equipment specifications and the electrical discharge machining parameter specifications of the micro-discharge grinding machine are respectively arranged in Tables 1 and 2 below:

Table 1. Processing machine equipment specifications Project specifications Main functions Die-Sinker EDM process Micro-EDM process stroke X/Y/Z250×250×150 mm drive and guide linear motor drive (Linear Motor Drive) Air Bearing Guide machining accuracy and roughness (SR) < ± 1.5 μm ; SR < Ra 0.1μm

Table 2, EDM parameters Specifications Discharge parameters Setting range Pulse width (Pon Duration, Ton , μs) 0.5 ~ 1800μs rest (Pulse off time, Toff , μs) 0.5 ~ 1800μs current (Peak Current, Ip , A) 0.05 ~ 63A voltage (Open Voltage, Vo , V) 70V, 100V, 140V, 180V, 280V gap (Gap Voltage, Vg , V) 15 ~ 130V polarity (Polarity, P) +, - Capacitance (C) 0 ~ 9 (0: no start; 1 ~ 9: start)

Referring to FIGS. 1 to 2, the composite micro-discharge grinding machine of the present invention is, for example, a CNC micro-discharge machine having a machine body 11, a tool grinding device 12, a plating tank 13, and a processing table 14. The machine body 11 has a high speed rotating shaft 111, a low speed rotating shaft 112, a moving carrier 114 and a power feeding device 115. The power feeding device 115 electrically contacts the tool 2 or the clamping member 113 of the tool 2 to provide a current of at least 0.05 amps to the tool 2, so that the tool 2 can perform micro-discharge machining on the workpiece 3, and simultaneously by means of the tool 2 The abrasive grains 21 exposed on the outer surface are subjected to grinding processing of the workpiece 3.

As shown in FIG. 2, the power feeding device 115 of the present invention includes a power feeding carbon brush 1151 and an elastic member 1152. The elastic member 1152 provides an elastic force to the power feeding carbon brush 1151, so that the power feeding carbon brush 1151 maintains the microtool 2 or the tool holder 113. Electrical contact, in order to supply power to the tool 2 for micro-discharge machining and grinding. In addition, when the tool 2 is in a high-speed rotation state (the high-speed state refers to, for example, a rotational speed of 20,000 rpm or more), the power feeding device can also use the contactless induction power supply to the tool 2 or the tool 2 clamping member 113. Power is supplied to increase the life of the power supply unit.

Referring to FIG. 7 , the machine body 11 further includes a control module 116 , a gap sensor 117 , and a position sensor 118 . The gap sensor 117 senses the gap between the tool 2 and the processing part of the workpiece 3 by measuring the voltage, and the control module 116 commands the moving carrier 114 to move, thereby adjusting the tool 2 and the processing part of the workpiece. the distance. The position sensor 118 senses the position of the mobile carrier 114 for the control module 116 to adjust the movement of the mobile carrier 114. The control module 116 also controls the discharge current, no load voltage, discharge capacitance, pulse time, and rest time of the power supplied by the power supply device 115 to the tool 2.

The high-speed rotating shaft 111 can be driven by an electric motor and adopts a ceramic bearing. The rotating speed of the high-speed rotating shaft 111 is higher than 500 rpm, the highest rotational speed value is even 80,000 rpm, and an air inlet can be arranged in the high-speed rotating shaft 111 to The temperature inside the rotating shaft is maintained by the intake air to maintain the optimum speed. The high speed spindle 111 can be used with the controller to reduce the speed to 500 rpm to actuate the tool 2 so that the tool 2 can be microdischarged in the tool grinding device 12. When the composite micro-discharge grinding process is performed, the rotational speed value of the high-speed rotary shaft 111 is preferably 20,000 rpm or more with a tool diameter of 0.3 mm.

The low speed shaft 112 actuates the cutter 2 or the cutter 2 clamping member 113 by the transmission belt 119, so that the cutter 2 is rotated at a low speed in the plating tank 13 for electroplating, and the outer surface of the cutter 2 is plated with a non-conductive hard material. Abrasive grain. The preferred rotational speed value of the low speed shaft 112 is between 1 rpm and 25 rpm when the tool is subjected to an abrasive plating process. The abrasive grains are hard abrasive grains having a particle diameter of 5 to 13 μm, and preferably, for example, diamond abrasive grains, tantalum carbide or cubic boron nitride abrasive grains of 9 to 11 μm are used. After the plating process for the tool is completed, for example, the removal of the drive belt 119 can be performed to release the actuation of the tool 2 or the tool 2 clamp 113 by the low speed shaft 112.

The processing table 14 is disposed on the moving carrier 114 for arranging the workpiece 3, and by moving the carrier 114, the workpiece 3 is moved to approach the tool 2 that is rotated by the high-speed shaft 111, so that the tool 2 is paired with the workpiece. 3 performing micro-discharge machining, and simultaneously grinding the micro-discharge machining portion of the workpiece 3 by the abrasive grains exposed on the outer surface of the cutter 2 to remove the re-cast layer and discharge generated by the micro-discharge machining on the surface of the workpiece 3 Pit or surface metamorphic layer.

Referring to Fig. 5, the tool grinding device 12 is attached to the moving carrier 114 of the machine body 11, and is movable below the tool 2 that is driven to rotate by the high speed rotating shaft 111 to perform a discharge grinding process on the tool 2. The tool grinding device 12 is provided with a wire electrode 121, and can receive the current supplied from the power feeding device 115 to perform micro-wire discharge grinding on the approaching tool 2, so that the shape and size of the trimmed tool 2 conform to the execution of the composite micro-discharge grinding process. Requirements. The tool grinding device 12 can also be provided with a guide wheel 122 that moves the guide wire electrode 121 toward the position of the tool 2 to complete the line discharge grinding trimming of the tool 2.

In an embodiment of the invention, the trimming parameters of the tool by the tool grinding device are listed in the following table:

Table 4, discharge grinding parameters Specifications rough trimming capacitor fine trimming discharge current 0.1~0.5A0.05A pulse time 1μs4μs rest time 0.5μs4μs pole voltage 35V30V spindle speed 500 rpm tool polarity ++ machining fluid discharge processing oil

Regarding the plating tank 13, please refer to FIG. 3 and FIG. 6, the plating tank 13 is disposed on the moving carrier 114, and can be moved to the lower side of the cutter 2 by moving the carrier 114. The cutter 2 can be immersed in the plating tank 13 for plating. Processing program. The inside of the bath of the plating tank 13 accommodates the plating solution 131 doped with the non-conductive hard abrasive grains 1311, and has a heating mechanism to heat the plating solution 131. Further, the plating tank 13 is provided with an anode ring 132 corresponding to the immersed position of the cutter 2 to act on the cutter 2 having the polarity of the cathode, and the abrasive grains 1311 in the plating solution 131 are plated with the cutter 2. The abrasive grains 1311 doped with the plating solution 131 are, for example, diamond abrasive grains, cerium carbide abrasive grains or cubic boron nitride abrasive grains, but are not limited thereto. The particle size of the abrasive particles 1311 is between 5 and 13 μm, preferably between 9 and 11 μm.

Further, a cover body 133 and an agitator 134 may be disposed inside the plating tank 13. The cover 133 may be disposed directly under the anode ring 132 and placed on the bottom surface of the plating tank 13 to define a flow range for the abrasive grains 1311 of the plating solution 131 in the plating tank 13. A port 1331 is formed on the end side of the cover body 133 near the inner bottom surface of the plating tank 13 to circulate into the flow path of the cover body 133 as the plating solution 131. As shown in the figure, the cover body 133 is funnel-shaped, but not limited thereto, the cover body 133 can be formed into various shapes. The agitator 134 can be driven to rotate by force, and the plating solution 131 inside the cover body 133 is agitated, so that the abrasive grains 1311 in the plating solution 131 are not sucked by gravity, and the abrasive grains 1311 in the plating solution 131 are allowed to be lifted. The particles are gathered upward in the direction of the anode ring 132, and the outer surface of the cutter 2 is dispersedly coated with the abrasive grains 1311 in cooperation with the rotation of the cutter 2. Preferably, the agitator 134 can be a magnet agitator, and an agitation mechanism such as a blade can be additionally disposed inside the electroplating tank 13. When the agitation mechanism is actuated, the plating solution 131 inside the plating tank 13 is caused to flow.

When the cutter 2 is immersed in the plating solution 131 of the plating bath 13, the outer surface of the cutter 2 is gradually formed by deposition plating to form a metal substrate containing nickel and/or cobalt to plate the abrasive grains 1311. At this moment, the holding member 113 is Actuation by the low speed shaft 112 causes the cutter 2 to rotate at a low speed so that the abrasive grains 1311 can be smoothly plated with the cutter 2.

In the embodiment of the present invention, the plating plating composite plating parameters for the tool having a tool diameter of 0.3 mm to 0.4 mm are exemplified in the following table:

Table 3, electroplating parameters of electroplating bath plating parameters -1 electroplating parameters -2 electroplating parameters -3 electroplating solution nickel sulfamate, nickel sulfamate, nickel sulfamate, nickel cobalt, current density 5~7 ASD7 ASD7~9 ASD abrasive diamond abrasive diamond Abrasive diamond abrasive grain diameter 5～7 μm7～9 μm9～11 μm abrasive grain addition amount 10g/l10~30 g/l10~30 g/l plating time 10~20 (min)5~7 (min)5 ~7 (min) nickel ring diameter 10 mm5 mm5 mm electrode speed 15 rpm 15 rpm 15 rpm

Referring to FIG. 4 together, the outer surface of the cutter 2 is exposed with a plurality of abrasive grains 21, and the exposed length H1 of the abrasive grains 21 is greater than or equal to the length H2 of the arc machining arc of the workpiece 2 to the workpiece 3 to make the abrasive grains. 21 can smoothly contact the workpiece 3 to remove the molten layer and the recast layer 31 which are produced after the electrical discharge machining of the workpiece 3.

In one embodiment, the ratio of the distribution area of the outer surface of the cutter 2 to the total area of the cutter 2 may be less than 33%, so that an effective chip evacuation space is formed between the adjacent abrasive grains 1311 to provide a sufficient area of the metal substrate on the surface. Used as micro-discharge processing. In this way, the electric discharge machining of the workpiece 3 by the cutter 2 can be smoothly performed, and the discharge slag generated during the micro-discharge machining and the abrasive dust generated during the polishing can be ensured to be discharged from the stable self-processing member 3. A concentrated secondary discharge phenomenon occurs. Preferably, the abrasive particles on the outer surface of the tool exhibit an area distribution of about 10% to 33% in the EDS component test, and optimally, the area distribution is about 15% to 25%, so that the microdischarge grinding process is optimal. .

In summary, the present invention mainly provides a composite micro-discharge grinding machine table, and a micro-discharge grinding processing table is arranged on the machine table to perform synchronous micro-discharge grinding processing on the workpiece, so that the processing position has a straight contour shape. And fine, high-quality machined surface to meet the needs of the industry in the field of high-quality micro-holes and grooves. A tool grinding device and a composite plating tank are also provided on the same machine to make micro-tools suitable for the shape, size and surface abrasive grains required for micro-discharge grinding.

The above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be as defined in the scope of the invention.

11‧‧‧ machine body
111‧‧‧High speed shaft
112‧‧‧Low speed shaft
113‧‧‧Clamping parts
114‧‧‧Mobile carrier
115‧‧‧Power supply
1151‧‧‧Power brush
1152‧‧‧Flexible parts
116‧‧‧Control Module
117‧‧‧Gap Sensor
118‧‧‧ position sensor
119‧‧‧Drive belt
12‧‧‧Tool grinding device
121‧‧‧ wire electrode
122‧‧‧Guidance wheel
13‧‧‧ plating bath
131‧‧‧ plating solution
1311‧‧‧ abrasive grain
132‧‧‧Anode ring
133‧‧‧ Cover
1331‧‧‧The bottom of the cover is notched
134‧‧‧Agitator
14‧‧‧Processing table
2‧‧‧Tools
21‧‧‧ abrasive grain
3‧‧‧Processing parts
31‧‧‧Recast layer

Fig. 1 is a schematic view showing the components of a composite micro-discharge grinding machine of the present invention. Fig. 2 is an enlarged schematic view showing a part of the main shaft of the composite micro-discharge grinding machine shown in Fig. 1. Fig. 3 is a schematic view showing the operation of the plating tank of the composite micro-discharge grinding machine of the present invention. Fig. 4 is a schematic view showing the principle of synchronous micro-discharge grinding processing of the composite micro-discharge grinding machine of the present invention. Fig. 5 is a schematic view showing the operation of the composite microdischarge grinding machine of the present invention for performing tool line discharge grinding. Fig. 6 is a schematic view showing the electroplating abrasive grains of the composite micro-discharge grinding machine of the present invention. Fig. 7 is a system architecture diagram of an embodiment of a composite micro-discharge grinding machine of the present invention.

11‧‧‧ machine body

111‧‧‧High speed shaft

112‧‧‧Low speed shaft

113‧‧‧Tool chuck

114‧‧‧Mobile carrier

115‧‧‧Power supply

12‧‧‧Tool grinding device

121‧‧‧ wire electrode

122‧‧‧Guidance wheel

13‧‧‧ plating bath

14‧‧‧Processing table

2‧‧‧Tools

3‧‧‧Processing parts

Claims (10)

A composite micro-discharge grinding machine includes: a machine body having a high-speed shaft, a low-speed shaft, a moving carrier and a power feeding device; a tool grinding device disposed on the moving carrier of the machine body, and the The high-speed shaft drives the rotating tool movement, and the tool grinding device has a wire electrode that can receive the current supplied by the power feeding device to perform wire discharge grinding on the adjacent tool; the plating tank is doped with non-conductive hard abrasive grains. a plating solution, the plating tank is disposed on the moving carrier, and is moved to a tool driven to rotate by the low speed rotating shaft, so that the tool is immersed in the plating solution, and a plurality of abrasive grains are plated on the outer surface of the tool The exposed length of the abrasive particles needs to be greater than or equal to the arc length of the tool for electrical discharge machining of the workpiece; and the processing table for positioning the workpiece and being disposed on the moving carrier, and rotating to be driven by the high speed rotating shaft The movement of the tool causes the workpiece of the processing table to be close to the tool, at which time the tool can receive the current supplied by the power feeding device, and the tool can be used to machine the workpiece The micro-discharge machining is performed, and the micro-discharge machining portion of the workpiece is ground in synchronization by the abrasive grains exposed on the outer surface of the cutter. The composite micro-discharge grinding machine according to claim 1, wherein the machine body further has a control module, a gap sensor and a position sensor; the gap sensor is controlled by a voltage Measuring and sensing a gap between the tool and the processing part of the workpiece, and the control module is configured to command the moving carrier to move, thereby adjusting a distance between the tool and the workpiece; the position sensor is sensing Positioning the mobile carrier for the control module to adjust the movement of the mobile carrier; the control module also controls a discharge current, a no-load voltage, a discharge capacitance value of the power supplied by the power supply device to the tool, Pulse time and rest time. The composite micro-discharge grinding machine according to claim 2, wherein the plating solution is doped with hard abrasive grains having a particle diameter of 5 to 13 μm, including diamond abrasive grains, or A cerium carbide or cubic boron nitride abrasive grain; the plating solution comprises a nickel sulfamate and/or cobalt solution, or a nickel sulfate and/or cobalt solution. The composite micro-discharge grinding machine according to claim 1, wherein the plating tank is provided with an anode ring, a cover body and a stirrer; the cover system is located under the anode ring to plate the plating bath. The abrasive grains of the liquid define a moving range, and the end side of the cover body near the bottom surface of the plating tank is formed with a port as a flow path of the plating solution into the cover body, and the stirrer can be driven to rotate by rotation, and the stirrer is stirred. The plating solution inside the cover body is allowed to accumulate abrasive grains at various positions in the plating solution upward in the direction of the anode ring. The composite micro-discharge grinding machine according to claim 1, wherein the power feeding device comprises a feeding carbon brush and an elastic member, wherein the elastic member provides an elastic force to the feeding carbon brush, and the feeding carbon brush is provided. Maintain electrical contact with low speed tools or tool holders. The composite micro-discharge grinding machine according to claim 1, wherein the power feeding device supplies the high-speed tool or the tool holder by a contactless induction power supply. The composite micro-discharge grinding machine according to the first aspect of the invention, wherein the high-speed shaft has a rotational speed value of more than 500 rpm. The composite micro-discharge grinding machine according to claim 1, wherein the low-speed shaft drives the tool to rotate by a drive belt; the low-speed shaft has a rotational speed value of between 1 rpm and 25 rpm. The composite micro-discharge grinding machine according to claim 1, wherein the tool grinding device further has a guiding wheel that guides the wire electrode to move in the direction of the tool to perform electric discharge grinding on the tool. A tool for applying the composite micro-discharge grinding machine according to claim 1, wherein the abrasive grains are distributed on the outer surface of the tool, and the distributed area accounts for less than 33% of the total surface area of the tool, and the phase is made. An effective chip evacuation space is formed between the adjacent abrasive grains, and a metal substrate of a sufficient area is provided on the outer surface for micro-discharge processing purposes.