TW201527474A - Cured product of curable polyorganosiloxane composition, adhered body using the curable polyorganosiloxane composition, method for producing the adhered body using the curable polyorganosiloxane composition, and use thereof - Google Patents

Cured product of curable polyorganosiloxane composition, adhered body using the curable polyorganosiloxane composition, method for producing the adhered body using the curable polyorganosiloxane composition, and use thereof Download PDF

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TW201527474A
TW201527474A TW103134735A TW103134735A TW201527474A TW 201527474 A TW201527474 A TW 201527474A TW 103134735 A TW103134735 A TW 103134735A TW 103134735 A TW103134735 A TW 103134735A TW 201527474 A TW201527474 A TW 201527474A
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Koji Okawa
Kazuhisa Ono
Shigeki Matsushita
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Momentive Performance Mat Jp
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00Presence of polysiloxane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a cured product of curable polyorganosiloxane composition, comprising: (A) an alkenyl-containing polyorganosiloxane comprising 2 or more alkenyl groups in a molecule; (B) an alkenyl-containing polyorganohydrogensiloxane comprising 2 or more hydrogen atoms bonded to silicon atoms in a molecule; and (C) a platinum-based catalyst; the ratio of the number HB of hydrogen atoms bonded to silicon atoms of (B) with respect to the number ViA of alkenyl groups in (A) is 0.5 to 100, and in view of platinum atom, (C) is 0.5 to 1,000ppm, wherein the composition before curing comprises two or more portions selected from the group consisting of a portion containing (B), a portion containing (B) and (A), a portion containing (C), and a portion containing (C) and (A).

Description

硬化性聚有機矽氧烷組成物的硬化物、使用硬化性聚有機矽氧烷組成物的接著體、使用硬化性聚有機矽氧烷組成物之接著體的製造方法,以及其用途 A cured product of a curable polyorganosiloxane composition, a binder using a curable polyorganosiloxane composition, a method for producing a binder using a curable polyorganosiloxane composition, and a use thereof

本發明係關於硬化性聚有機矽氧烷組成物之硬化物、使用硬化性聚有機矽氧烷組成物之接著體、以及使用硬化性聚有機矽氧烷組成物之接著體的製造方法。 The present invention relates to a cured product of a curable polyorganosiloxane composition, a binder using a curable polyorganosiloxane composition, and a method for producing a binder using a curable polyorganosiloxane composition.

在具備液晶模組等顯示部品之行動電話等的顯示裝置中,為提升顯示裝置之保護或設計性的目的,於顯示裝置之前面設置有玻璃製或樹脂製之螢幕。但因於螢幕及顯示裝置之間存在空氣層,故有因外光之反射而很難看到顯示畫面之問題。因此,進行使空氣層以符合螢幕之折射率的透明接著劑等貼合。此處所使用之接著劑一般係使用紫外線硬化型,塗布於進行貼合之對向構件單側, 貼合構件彼此之後,以紫外線使之硬化。 In a display device such as a mobile phone including a display unit such as a liquid crystal module, a glass or resin screen is provided on the front surface of the display device for the purpose of improving the protection or design of the display device. However, due to the presence of an air layer between the screen and the display device, it is difficult to see the display due to reflection of external light. Therefore, the air layer is bonded to a transparent adhesive or the like which conforms to the refractive index of the screen. The adhesive used here is generally applied to the one side of the facing member to be bonded, using an ultraviolet curing type. After the members are attached to each other, they are hardened by ultraviolet rays.

近年,因設計之多樣性等而在使用紫外線很難穿透之塑膠樹脂作為螢幕素材、或設有使螢幕周邊部著色之框緣印刷的例子等,使紫外線無法穿透而難以硬化之情形增加。相對於此,於專利文獻1中揭示一種硬化性組成物,其係含有:於1分子中平均至少具有一個水解性矽基之化合物、及於1分子中平均至少具有一個聚合性之碳碳雙鍵之化合物。於專利文獻1所記載之組成物係可藉光而迅速硬化,且對於光照射不到之部分亦與大氣中之濕氣反應而硬化之硬化性組成物。又,於專利文獻2中揭示一種加熱硬化之2成分系加成反應型矽氧凝膠。 In recent years, the use of plastic resins that are difficult to penetrate by ultraviolet rays as a screen material or an example of printing a frame edge that colors the peripheral portion of the screen due to the diversity of design, etc., has made it impossible to penetrate the ultraviolet rays and harden the hardening. . In contrast, Patent Document 1 discloses a curable composition containing a compound having an average of at least one hydrolyzable mercapto group in one molecule and an average carbon carbon double having at least one polymerizable property in one molecule. The compound of the bond. The composition described in Patent Document 1 is a curable composition which is rapidly hardened by light and which is hardened by reaction with moisture in the atmosphere, which is not irradiated with light. Further, Patent Document 2 discloses a two-component addition reaction type silicone gel which is heat-hardened.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2010-248347號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-248347

[專利文獻2]日本特開2004-272059號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-272059

於專利文獻1所揭示之組成物,有於塗布裝置內產生硬化而產生塗布裝置堵塞之問題,或與濕氣之反應時間長,貼合後之硬化反應非常慢之問題。 The composition disclosed in Patent Document 1 has a problem that the coating device is hardened to cause clogging of the coating device, or the reaction time with moisture is long, and the curing reaction after bonding is very slow.

於專利文獻2所揭示之熱硬化型組成物,置於顯示裝置與保護板之間進行熱硬化之際,有硬化時間長、保護板偏離之問題。為防止保護板之偏移,亦考慮以 高溫短時間使其硬化的方法,但因貼合之構件的耐熱性,有無法為了硬化而賦予充分熱的問題。 When the thermosetting composition disclosed in Patent Document 2 is thermally hardened between the display device and the protective sheet, there is a problem that the curing time is long and the protective sheet is deviated. In order to prevent the offset of the protection board, it is also considered A method of hardening a high temperature for a short period of time, but there is a problem that sufficient heat cannot be provided for hardening due to the heat resistance of the member to be bonded.

如上述,對於硬化反應中不須使用放射線或加熱裝置等特別的裝置,可以貼合紫外線不穿透之構件或缺乏耐熱性之構件,且不受濕氣等外部環境的影響而可進行硬化反應;適用於使接著劑之各成分分別塗布於擬使貼合的基材後使基材彼此貼合,在接著劑成分彼此接觸時才開始硬化反應之接著方法;可賦予具有優異透明性之硬化物的新穎硬化性聚有機矽氧烷組成物的期待持續升高。 As described above, in the hardening reaction, it is not necessary to use a special device such as a radiation or a heating device, and it is possible to adhere to a member which does not penetrate the ultraviolet ray or a member which lacks heat resistance, and can be subjected to a hardening reaction without being affected by an external environment such as moisture. It is suitable for applying a method in which each component of the adhesive is applied to a substrate to be bonded, and then bonding the substrates to each other, and a curing reaction is started when the adhesive components are in contact with each other; and hardening with excellent transparency can be imparted; The expectation of the novel curable polyorganosiloxane composition of the material continues to increase.

本發明之目的在提供一種可使用速硬化性優異的硬化性聚有機矽氧烷組成物製得之具有優異透明性的硬化物。 An object of the present invention is to provide a cured product which is excellent in transparency and which can be obtained by using a curable polyorganosiloxane composition having excellent fast-curing property.

本發明及其適宜的態樣可舉例如下。 The invention and its suitable aspects can be exemplified as follows.

[1]一種硬化性聚有機矽氧烷組成物之硬化物,係含有:(A)於分子中含有2個以上烯基的含烯基聚有機矽氧烷;(B)於分子中具有2個以上鍵結於矽原子之氫原子的聚有機氫矽氧烷;及(C)鉑系觸媒;相對於(A)之烯基的個數ViA,鍵結於(B)之矽原子的氫原子之個數HB之比為0.5至100,就鉑系金屬原子而言,(C)為0.5至1,000ppm;其中,硬化前之組成物含包含選自由 含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上之部分。 [1] A cured product of a curable polyorganosiloxane composition comprising: (A) an alkenyl group-containing polyorganosiloxane having two or more alkenyl groups in a molecule; (B) having 2 in a molecule or more hydrogen atom bonded to a silicon atom of the silicon polyorganohydrogen siloxane; and (C) a platinum-based catalyst; with respect to the number of (a) an alkenyl group of Vi a, bonded to (B) the silicon atoms The ratio of the number of hydrogen atoms H B is from 0.5 to 100, and in the case of a platinum group metal atom, (C) is from 0.5 to 1,000 ppm; wherein the composition before hardening contains a portion selected from the group consisting of (B) Two or more of the group consisting of (B) and (A), the part containing (C), and the part containing (C) and (A).

[2]如第[1]項之硬化性聚有機矽氧烷組成物之硬化物,其中,硬化前之組成物為包含有選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的2層以上之積層體。 [2] The cured product of the hardenable polyorganosiloxane composition of [1], wherein the composition before hardening comprises a layer selected from the group consisting of (B), containing (B) and (A) The layer, the layer containing (C), and the layered body of two or more layers including the layers of (C) and (A).

[3]如第[1]或[2]項之硬化物,其中,硬化前之組成物為包含有選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的3層以上之積層體。 [3] The cured product according to [1] or [2], wherein the composition before hardening comprises a layer selected from the group consisting of (B), and the layer containing (B) and (A), containing (C) The layer of the layer and the layered body of three or more layers including the layers of the layers (C) and (A).

[4]如第[1]至[3]項中任一項之硬化物,其中,硬化前之組成物為含有(B)及(A)之層與含有(C)之層交互積層之積層體。 [4] The cured product according to any one of [1] to [3] wherein the composition before hardening is a laminate of a layer containing (B) and (A) and an interlayer containing (C). body.

[5]如第[1]至[4]項中任一項之硬化物,其中, 硬化前之組成物為於兩端具有含有(C)之層的積層體。 [5] The hardened material according to any one of [1] to [4] wherein The composition before hardening is a laminate having a layer containing (C) at both ends.

[6]如第[1]至[4]項中任一項之硬化物,其中,硬化前之組成物為於兩端具有含有(B)及(A)之層的積層體。 [6] The cured product according to any one of [1] to [4] wherein the composition before hardening is a laminate having layers including (B) and (A) at both ends.

[7]一種附硬化物之基材,其中,於1個基材上具有如申請專利範圍第[1]至[6]項中任一項之硬化物。 [7] A substrate to which a cured product is provided, wherein the cured product of any one of the above [1] to [6] is applied to one substrate.

[8]一種含有二個基材之接著體,係含有透過如第[1]至[6]項中任一項之硬化物接著二個基材。 [8] A binder comprising two substrates, comprising a cured product according to any one of [1] to [6], followed by two substrates.

[9]一種含有二個基材之接著體的製造方法,該接著體其係使用了硬化性聚有機矽氧烷組成物,且該硬化性聚有機矽氧烷組成物包含有(A)於分子中含有2個以上烯基的含烯基聚有機矽氧烷;(B)於分子中具有2個以上鍵結於矽原子之氫原子的聚有機氫矽氧烷;及(C)鉑系觸媒;相對於(A)之烯基的個數ViA,鍵結於(B)之矽原子的氫原子之個數HB之比為0.5至100,就鉑系金屬原子而言,(C)為0.5至1,000ppm;其中,該製造方法包含步驟1A:於一方基材的被接著面,形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上之部分,而形成硬化前之硬化性聚有機矽氧烷組成物的步驟;及 步驟2A:積層另一方基材,透過硬化性聚有機矽氧烷組成物,使基材彼此貼合之步驟。 [9] A method for producing a binder comprising two substrates, wherein the binder is a curable polyorganosiloxane composition, and the curable polyorganosiloxane composition comprises (A) An alkenyl group-containing polyorganosiloxane having two or more alkenyl groups in the molecule; (B) a polyorganohydroquinone having two or more hydrogen atoms bonded to a deuterium atom in the molecule; and (C) a platinum system catalyst; ratio of number of hydrogen atoms with respect to the number of (a) an alkenyl group of Vi a, bonded to (B) the silicon atoms H B of 0.5 to 100, based on the platinum metal atoms, the ( C) is 0.5 to 1,000 ppm; wherein the production method comprises the step 1A of forming a portion selected from the group containing (B), containing (B) and (A), and containing (C) on the surface to be bonded of one of the substrates. And a part of the group consisting of (C) and (A), and a step of forming a hardened polyorganosiloxane composition before curing; and Step 2A: laminating another A substrate is passed through a curable polyorganosiloxane composition to bond the substrates to each other.

[10]如第[9]項之製造方法,其中,步驟1A係步驟1A-1:係於一方基材的被接著面,積層選自含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的2層以上,而形成硬化性聚有機矽氧烷組成物之積層體的步驟。 [10] The method according to the item [9], wherein the step 1A is the step 1A-1: the layer is attached to the surface of the substrate, and the layer is selected from the layer containing (B) and contains (B) and (A). The step of forming a layered body of a curable polyorganosiloxane composition, the layer containing the layer (C), and the layer containing the layer consisting of (C) and (A) are two or more layers.

[11]如第[9]項之製造方法,其中,步驟1A係步驟1A-2:係於一方基材的被接著面,依序積層含有(C)之層、含有(B)及(A)之層、含有(C)之層的3層,而形成硬化性聚有機矽氧烷組成物之積層體的步驟。 [11] The method according to the item [9], wherein the step 1A is the step 1A-2: the layer of the layer (C) is contained in the layer to be bonded to the substrate, and the layer (B) and (A) are contained. And a layer comprising the layer of the (C) layer to form a layered body of the curable polyorganosiloxane composition.

[12]如第[9]項之製造方法,其中,步驟1A係步驟1A-3:係於一方基材的被接著面,依序積層含有(B)及(A)之層、含有(C)之層、以及含有(B)及(A)之層的3層,而形成硬化性聚有機矽氧烷組成物之積層體的步驟。 [12] The method according to the item [9], wherein the step 1A is the step 1A-3: the layer of the substrate (B) and (A) is contained in a layered surface of one of the substrates, and the layer is contained (C). And a layer comprising the layers of (B) and (A) to form a laminate of the curable polyorganosiloxane composition.

[13]一種含有二個基材之接著體的製造方法,該接著體係使用了硬化性聚有機矽氧烷組成物,且該硬化性聚有機矽氧烷組成物包含有(A)於分子中含有2個以上烯基的含烯基聚有機矽氧烷;(B)於分子中具有2個以上鍵結於矽原子之氫原子的聚有機氫矽氧烷;及(C)鉑系觸媒;相對於(A)之烯基的個數ViA,鍵結於(B)之矽原子的氫 原子個數HB之比為0.5至100,就鉑系金屬原子而言,(C)為0.5至1,000ppm;其中,該製造方法包含步驟1B:於一方基材的被接著面,形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上之部分的步驟;步驟2B:於另一方基材的被接著面,形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的1個以上之部分的步驟;以及步驟3B:透過步驟1B所得之2個以上部分及步驟2B所得之1個以上部分,使步驟1B及步驟2B所得之基材彼此貼合的步驟;步驟1B所得之部分及步驟2B所得之部分的合併部分之組成為硬化性聚有機矽氧烷組成物之組成。 [13] A method for producing a binder comprising two substrates, wherein the binder system uses a curable polyorganosiloxane composition, and the curable polyorganosiloxane composition comprises (A) in a molecule An alkenyl group-containing polyorganosiloxane containing two or more alkenyl groups; (B) a polyorganohydroquinone having two or more hydrogen atoms bonded to a halogen atom in the molecule; and (C) a platinum-based catalyst ; with respect to (a) the number of alkenyl groups Vi a, H B than the number of the hydrogen atoms bonded to (B) of silicon atoms is from 0.5 to 100, based on the metal atom of platinum, (C) is 0.5 to 1,000 ppm; wherein the manufacturing method comprises the step 1B of forming a portion selected from the group containing (B), the portion containing (B) and (A), and the portion containing (C) on the succeeding surface of one of the substrates. And a step of containing two or more of the groups consisting of (C) and (A); and step 2B: forming a portion selected from the group containing (B) on the succeeding surface of the other substrate a step of (B) and (A), a part containing (C), and a part of the group consisting of (C) and (A); and Step 3B: passing through Step 1B 2 or more parts and 1 or more parts obtained in the step 2B, the step of bonding the substrates obtained in the steps 1B and 2B to each other; the portion obtained in the step 1B and the combined portion of the portion obtained in the step 2B are hardening polymerization The composition of the organic oxane composition.

[14]如第[13]項之製造方法,其中,步驟1B係步驟1B-1:於一方基材的被接著面,形成選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的2個以上之層,而形成積層體的步驟;步驟2B係步驟2B-1:於另一方基材的被接著面,形成選自含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的1個以上之層,而形成積層體的步驟。 [14] The method according to [13], wherein the step 1B is the step 1B-1: forming a layer selected from the group consisting of (B), containing (B) and (A) a layer, a layer containing (C), and a layer containing two or more layers of the layers (C) and (A) to form a layered body; and Step 2B is a step 2B-1: The surface of the base material of one of the substrates is formed of a layer containing (B), a layer containing (B) and (A), a layer containing (C), and a layer containing (C) and (A). A step of forming a layered body by forming one or more layers in the group.

[15]如第[13]或[14]項之製造方法,其中,步驟1B係步驟 1B-2:於一方基材的被接著面,積層含有(C)之層,然後積層含有(B)及(A)之層,而得到積層體的步驟;步驟2B係步驟2B-2:於另一方基材的被接著面,積層含有(C)之層,而得到積層體的步驟。 [15] The manufacturing method of item [13] or [14], wherein the step 1B is a step 1B-2: a step of laminating the layer containing the layer (C) on the surface to be bonded to the substrate of one of the substrates, and then layering the layer containing (B) and (A) to obtain a layered body; and step 2B is a step 2B-2: The step of forming the layered body is carried out by laminating the layer containing the layer (C) on the surface of the other substrate.

[16]如第[13]或[14]項之製造方法,其中,步驟1B係步驟1B-3:於一方基材的被接著面,積層含有(B)及(A)之層,然後積層含有(C)之層,而得到積層體的步驟;步驟2B係步驟2B-3:於另一方基材的被接著面,積層含有(B)及(A)之層,而得到積層體的步驟。 [16] The manufacturing method according to [13] or [14], wherein the step 1B is the step 1B-3: the layer of the (B) and (A) layers is laminated on the surface to be joined of one of the substrates, and then laminated a step of obtaining a layered body by the layer containing (C); and a step of obtaining a layered body by the step 2B-3 of the other substrate, and layering the layers containing (B) and (A) to obtain a layered body .

[17]如第[9]至[16]項中任一項之製造方法,其中,一方之基材為具有圖像顯示裝置之圖像顯示部的基部,另一方之基材為圖像顯示裝置之透光性的保護部,接著體為圖像顯示裝置。 The manufacturing method of any one of [9] to [16], wherein one of the base materials is a base portion having an image display portion of the image display device, and the other substrate is an image display. The light-transmitting protective portion of the device is an image display device.

若依本發明,可提供使用速硬化性優異的硬化性聚有機矽氧烷組成物製得之具有優異透明性之硬化物。 According to the present invention, it is possible to provide a cured product having excellent transparency which is obtained by using a curable polyorganosiloxane composition having excellent quick-cure property.

<硬化性聚有機矽氧烷組成物> <Sclerosing polyorganosiloxane composition>

說明有關硬化性聚有機矽氧烷組成物(以下,僅稱為「組成物」。)所含有之各成分。 The components contained in the curable polyorganosiloxane composition (hereinafter, simply referred to as "composition") will be described.

(A)含有烯基之聚有機矽氧烷係於組成物中 成為基質聚合物之成分。藉由調配(A),硬化時可藉交聯反應確保安定之3次元構造、可控制硬化收縮、並可確保良好的辨識性。(A)若係於一分子中平均具有2個以上鍵結於矽原子之烯基,可藉由與(B)之Si-H鍵結的加成反應形成網狀構造者即可,無特別限定。代表性者係於分子中至少平均具有2個以通式(I):(Ra)n1(Rb)n2SiO(4-n1-n2)/2 (I)(式中、Rq係C2-C6烯基(例如乙烯基、烯丙基、3-丁烯基、5-己烯基);Rb係C1-C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基)或苯基;n1係1或2;n2係0至2之整數,但,n1+n2係1至3)表示之含有烯基之矽氧烷單元的含烯基聚有機矽氧烷。鍵結於(A)中之矽原子的烯基數較佳係於一分子中平均2至100個,以2至50個為更佳。 (A) The polyorganosiloxane containing an alkenyl group is a component of the matrix polymer in the composition. By compounding (A), it is possible to ensure a stable 3-dimensional structure, control hardening shrinkage, and ensure good visibility by crosslinking reaction during hardening. (A) if it has an average of two or more alkenyl groups bonded to a ruthenium atom in one molecule, it can be formed by a addition reaction with the Si-H bond of (B) to form a network structure. limited. The representative is at least two in the molecule having the general formula (I): (R a ) n1 (R b ) n2 SiO (4-n1-n2)/2 (I) (wherein, R q system C 2- C 6 alkenyl (eg vinyl, allyl, 3-butenyl, 5-hexenyl); R b is C 1 -C 6 alkyl (eg methyl, ethyl, propyl, butyl) a group, a pentyl group, a hexyl group or a phenyl group; n1 is 1 or 2; n2 is an integer of 0 to 2, but n1+n2 is a group 1 to 3) an alkenyl group-containing poly(alkylene group) containing an alkenyl group. Organic oxirane. The number of alkenyl groups bonded to the ruthenium atom in (A) is preferably from 2 to 100 in an average of from 2 to 50, more preferably from 2 to 50.

(A)之矽氧烷骨架可為直鏈狀亦可為分支狀。由容易控制合成及平均聚合度之觀點,(A)係以直鏈狀者為較佳。又,亦可使用此等之混合物。 The azide skeleton of (A) may be linear or branched. From the viewpoint of easy control of synthesis and average degree of polymerization, (A) is preferably a linear one. Also, a mixture of these may be used.

Ra由容易合成、無損硬化前之流動性或硬化物之耐熱性之觀點,以乙烯基為較佳。Ra係亦可存在於(A)之聚有機矽氧烷分子鏈的末端或中間之任一者,亦可存在於其兩者,但為對於硬化後之組成物賦予優異的機械性 質,以至少存在於其兩末端為較佳。 R a is preferably a vinyl group from the viewpoint of easy synthesis, fluidity before hardening, or heat resistance of a cured product. R a may be present at either the end or the middle of the polyorganosiloxane chain of (A), or both, but imparts excellent mechanical properties to the cured composition. It is preferred to exist at least at both ends thereof.

Rb由容易合成、流動性或硬化後之機械強度等均衡性優異之觀點,以甲基為尤佳。 R b is preferably a methyl group from the viewpoint of excellent balance of ease of synthesis, fluidity, or mechanical strength after hardening.

n1由容易合成之觀點,以1為較佳。 N1 is preferably from the viewpoint of easy synthesis.

(A)從作業性之觀點,23℃之黏度以1至100,000cP為較佳,以1至50,000cP為更佳,以1至15,000cP為尤佳。為成為此等黏度範圍,以調整(A)之重量平均分子量為較佳。又,為成為此等黏度範圍,以併用黏度高之(A)與黏度低之(A)為更佳。本說明書中,黏度係使用旋轉黏度計在23℃中測定之值。 (A) From the viewpoint of workability, the viscosity at 23 ° C is preferably from 1 to 100,000 cP, more preferably from 1 to 50,000 cP, and particularly preferably from 1 to 15,000 cP. In order to achieve such a viscosity range, it is preferred to adjust the weight average molecular weight of (A). Further, in order to achieve such a viscosity range, it is more preferable to use (A) having a high viscosity and (A) having a low viscosity. In the present specification, the viscosity is a value measured at 23 ° C using a rotational viscometer.

因而,就(A)而言,較佳係以式(Ia): (式中,Ra係獨立為C2至C6烯基(例如乙烯基、烯丙基、3-丁烯基、5-己烯基,較佳係乙烯基),Rb係獨立為C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基)或苯基,m1較佳係使(A)在23℃之黏度為1至100,000cP(較佳係1至50,000cP、更佳係1至15,000cP)之數)所示之含有烯基的直鏈狀聚有機矽氧烷。 Thus, in the case of (A), it is preferred to use the formula (Ia): (wherein R a is independently a C 2 to C 6 alkenyl group (e.g., vinyl, allyl, 3-butenyl, 5-hexenyl, preferably vinyl), and R b is independently C 1 to C 6 alkyl (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl, preferably methyl) or phenyl, m1 preferably such that (A) has a viscosity of 1 at 23 ° C An alkenyl group-containing linear polyorganosiloxane having a number of 100,000 cP (preferably 1 to 50,000 cP, more preferably 1 to 15,000 cP).

此外,(A)更佳係兩末端被二甲基乙烯基矽 氧烷單元封閉,中間單元為由二甲基矽氧烷單元所構成之聚甲基乙烯基矽氧烷,且23℃之黏度為1至100,000cP(較佳係5至50,000cP,更佳係10至15,000cP)之含有烯基的直鏈狀聚有機矽氧烷。 In addition, (A) is better at both ends of the dimethyl vinyl fluorene The oxane unit is closed, and the intermediate unit is a polymethyl vinyl siloxane having a dimethyl methoxy olefin unit, and has a viscosity at 23 ° C of 1 to 100,000 cP (preferably 5 to 50,000 cP, more preferably 10 to 15,000 cP) of an alkenyl group-containing linear polyorganosiloxane.

(B)聚有機氫矽氧烷分子中所含有之氫矽基,係藉由與(A)之Ra之間進行加成反應,而發揮作為(A)之交聯劑功能者。為使硬化物網狀化,只要於一分子中平均具有2個以上之鍵結於參與該加成反應之矽原子的氫原子即可,無特別限定。如此之聚有機氫矽氧烷之代表例係於分子中具有2個以上之以通式(II):(Rc)n3(Rd)n4SiO(4-n3-n4)/2 (II)(式中、Rc係氫原子,Rd係C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基)或苯基;n3係1或2;n4係0至2之整數,但n3+n4係1至3)所示之單元。 (B) The hydroquinone group contained in the polyorganohydrohalosiloxane molecule is subjected to an addition reaction with R a of (A) to exhibit a function as a crosslinking agent of (A). In order to reticulate the hardened material, it is not particularly limited as long as it has an average of two or more hydrogen atoms bonded to the ruthenium atom participating in the addition reaction in one molecule. A representative example of such a polyorganohydroquinone is one or more compounds having a formula (II): (R c ) n3 (R d ) n4 SiO (4-n3-n4)/2 (II) (wherein R c is a hydrogen atom, R d is a C 1 to C 6 alkyl group (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl, preferably methyl) or phenyl; n3 Is 1 or 2; n4 is an integer from 0 to 2, but n3+n4 is a unit shown by 1 to 3).

Rd雖亦包含較佳者,但可例示與前述(A)中之Rb同樣者。又,由容易合成之觀點,n3係以1為較佳。 Although R d is also preferable, the same as R b in the above (A) can be exemplified. Further, from the viewpoint of easy synthesis, n3 is preferably 1.

(B)中之矽氧烷骨架可為直鏈狀、分支狀或環狀之任一者,以直鏈狀或環狀為較佳。又,亦可使用此等之混合物。 The azide skeleton in (B) may be any of a linear chain, a branched chain or a cyclic chain, and is preferably a linear chain or a cyclic chain. Also, a mixture of these may be used.

(B)較佳係23℃之黏度為1至10,000cP,以 1至1,000cP為更佳,以1至200cP為最佳,以1至50cP為尤佳。 (B) preferably having a viscosity of from 1 to 10,000 cP at 23 ° C to 1 to 1,000 cP is more preferable, preferably 1 to 200 cP, and particularly preferably 1 to 50 cP.

(B)為環狀時,可舉例如由(B1)Re 2HSiO1/2單 元(式中,Re係氫原子或C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基))及SiO4/2單元所構成,於一分子中具有2個以上之鍵結於矽原子之氫原子的環狀聚有機氫矽氧烷。 When (B) is a cyclic group, for example, a (B1)R e 2 HSiO 1/2 unit (wherein a R e hydrogen atom or a C 1 to C 6 alkyl group (for example, a methyl group, an ethyl group, a propyl group) may be mentioned. a butyl group, a pentyl group, a hexyl group, preferably a methyl group) and a SiO 4/2 unit, having two or more cyclic polyorganohydrogen oximes bonded to a hydrogen atom of a ruthenium atom in one molecule. alkyl.

(B1)係由Re 2HSiO1/2單元及SiO4/2單元所構 成,於一分子中具有2個以上之鍵結於矽原子之氫原子的環狀聚有機氫矽氧烷。(B1)中之氫原子係一分子中以3至100個為較佳,以3至50個為更佳。作為C1至C6烷基之Re,從容易合成等之觀點,以甲基為較佳。 (B1) is a cyclic polyorganohydroquinone which is composed of R e 2 HSiO 1/2 unit and SiO 4/2 unit and has two or more hydrogen atoms bonded to a hydrogen atom of a halogen atom in one molecule. The hydrogen atom in (B1) is preferably from 3 to 100, more preferably from 3 to 50, per molecule. As the R e of the C 1 to C 6 alkyl group, a methyl group is preferred from the viewpoint of easy synthesis and the like.

(B1)之Re 2HSiO1/2單元與SiO4/2單元之比 率,相對於SiO4/2單元1莫耳,以Re 2HSiO1/2單元1.5至2.2莫耳為較佳,以1.8至2.1莫耳為更佳。典型上係如[Re 2HSiO1/2]8[SiO4/2]4或[Re 2HSiO1/2]10[SiO4/2]5,3至5個SiO4/2單元形成環狀矽氧烷骨架,2個Re 2HSiO1/2單元鍵結於各SiO4/2單元者為較佳,尤佳係2個(CH3)2HSiO1/2單元鍵結於各SiO4/2單元。 (B1) the ratio of R e 2 HSiO 1/2 unit and 4/2 units of SiO, SiO 4/2 units with respect to 1 mole, to R e 2 HSiO 1/2 unit is preferably 1.5 to 2.2 mole, It is better to use 1.8 to 2.1 moles. Typically, it is formed as [R e 2 HSiO 1/2 ] 8 [SiO 4/2 ] 4 or [R e 2 HSiO 1/2 ] 10 [SiO 4/2 ] 5 , 3 to 5 SiO 4/2 units a cyclic azide skeleton, preferably two R e 2 HSiO 1/2 units bonded to each SiO 4/2 unit, and particularly preferably two (CH 3 ) 2 HSiO 1/2 units bonded to each SiO 4/2 unit.

(B1)之黏度係以1至100cP較佳,以1至 50cP更佳。 The viscosity of (B1) is preferably from 1 to 100 cP, and is from 1 to 50cP is better.

(B)為直鏈狀時,兩末端分別獨立被R3SiO1/2 單元封閉,且中間單元由R2SiO2/2單元構成(式中,R係氫 原子、C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基)或苯基,但,R之中,至少2個係氫原子),23℃之黏度為1至10,000cP(較佳係1至5,000cP,更佳係1至1,000cP)之直鏈狀聚有機氫矽氧烷。鍵結於矽原子之氫原子係可存在於末端,亦可存在於中間單元。 When (B) is linear, both ends are independently blocked by R 3 SiO 1/2 units, and the intermediate unit is composed of R 2 SiO 2/2 units (wherein R-based hydrogen atoms, C 1 to C 6 alkanes) a group (for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, preferably a methyl group) or a phenyl group, but at least two of R are hydrogen atoms), and the viscosity at 23 ° C is 1 A linear polyorganohydrooxane of 10,000 cP (preferably 1 to 5,000 cP, more preferably 1 to 1,000 cP). The hydrogen atom bonded to the deuterium atom may be present at the end or may be present in the intermediate unit.

可舉例如(B2)以式(III): (式中,Rc係氫原子,Rd係獨立為C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基、較佳係甲基)或苯基,m2係使(B2)之23℃之黏度以1至10,000cP(較佳係1至5,000cP,更佳係1至1,000cP)之數)所示之直鏈狀聚有機氫矽氧烷;(B3)兩末端被Rd 3SiO1/2單元封閉,中間單元由RcRdSiO2/2單元及Rd 2SiO2/2單元(式中,RC係氫原子,Rd係獨立之C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基)或苯基)所構成,且使23℃之黏度為1至10,000cP(較佳係1至5,000cP,更佳係1至1,000cP)之直鏈狀聚有機氫矽氧烷;及 (B4)兩末端被RCRd 2SiO1/2單元封閉,中間單元由RcRdSiO2/2單元及Rd 2SiO2/2單元(式中,Rc係氫原子,Rd係獨立之C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基)或苯基)所構成,且使23℃之黏度為1至10,000cP(較佳係1至5,000cP,更佳係1至1,000cP)之數)之直鏈狀聚有機氫矽氧烷。 For example, (B2) is given by formula (III): (wherein R c is a hydrogen atom, and R d is independently a C 1 to C 6 alkyl group (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl, preferably methyl) or phenyl , m2 is a linear polyorganohydrooxane of (B2) having a viscosity of 23 ° C of 1 to 10,000 cP (preferably 1 to 5,000 cP, more preferably 1 to 1,000 cP); (B3) Both ends are blocked by R d 3 SiO 1/2 unit, and the intermediate unit is composed of R c R d SiO 2/2 unit and R d 2 SiO 2/2 unit (wherein, R C hydrogen atom, R d system) Independently composed of a C 1 to C 6 alkyl group (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl, preferably methyl) or phenyl), and having a viscosity of 1 to 2 at 23 ° C a linear polyorganohydroquinone having 10,000 cP (preferably 1 to 5,000 cP, more preferably 1 to 1,000 cP); and (B4) both ends are blocked by R C R d 2 SiO 1/2 unit, The unit consists of R c R d SiO 2/2 units and R d 2 SiO 2/2 units (wherein R c is a hydrogen atom, and R d is independently a C 1 to C 6 alkyl group (eg, methyl, ethyl, a propyl group, a butyl group, a pentyl group, a hexyl group, preferably a methyl group or a phenyl group, and having a viscosity of from 1 to 10,000 cP at 23 ° C (preferably from 1 to 5,000 cP, more preferably from 1 to 1) , Linear polyorganohydroquinone of 000cP).

(B2)係以式(III)所示之直鏈狀聚有機氫矽氧烷。 (B2) is a linear polyorganohydrooxane represented by the formula (III).

(B2)中之Rd,從容易合成且機械強度及硬化前之流動性等特性均衡優異之觀點,以甲基為較佳。 R d in (B2) is preferably a methyl group from the viewpoint of easy synthesis and excellent balance of properties such as mechanical strength and fluidity before curing.

(B2)較佳係兩末端被二甲基氫矽氧烷單元封閉,且中間單元由二甲基矽氧烷單元所構成之聚甲基氫矽氧烷。 (B2) is preferably a polymethylhydroquinone which is blocked at both ends by a dimethylhydroquinone unit and whose intermediate unit is composed of a dimethyloxane unit.

(B2)之黏度係1至10,000cP,以1至5,000cP更佳,以1至1,000cP又更佳。 The viscosity of (B2) is from 1 to 10,000 cP, more preferably from 1 to 5,000 cP, still more preferably from 1 to 1,000 cP.

(B3)係兩末端被Rd 3SiO1/2單元封閉,中間單元由RcRdSiO2/2單元及Rd 2SiO2/2單元所構成之聚有機氫矽氧烷。(B3)中之Rc係於一分子中以2至5,000個為較佳,以3至5,000個為更佳,以20至1,000個又更佳。(B3)中之Rd,從容易合成且機械強度及硬化前之流動性等特性均衡優異之觀點,以甲基為較佳。 (B3) is a polyorganohydrohalooxane in which both ends are blocked by R d 3 SiO 1/2 units, and the intermediate unit is composed of R c R d SiO 2/2 units and R d 2 SiO 2/2 units. The R c in (B3) is preferably 2 to 5,000 in one molecule, more preferably 3 to 5,000, still more preferably 20 to 1,000. R d in (B3) is preferably a methyl group from the viewpoint of easy synthesis and excellent balance of properties such as mechanical strength and fluidity before curing.

(B3)係RcRdSiO2/2單元與Rd 2SiO2/2單元之比率,相對於Rd 2SiO2/2單元1莫耳,RcRdSiO2/2單元以0.1至2.0莫耳較佳,以0.5至1.5莫耳為更佳。因而,(B3)係兩 末端被三甲基矽氧烷單元封閉,中間單元由二甲基矽氧烷單元及甲基氫矽氧烷單元所構成,且相對於二甲基矽氧烷單元1莫耳,甲基氫矽氧烷單元為0.1至2.0莫耳之聚甲基氫矽氧烷較佳。 (B3) is a ratio of R c R d SiO 2/2 unit to R d 2 SiO 2/2 unit, relative to R d 2 SiO 2/2 unit 1 mol, R c R d SiO 2/2 unit is 0.1 It is preferably from 2.0 to 1.5 moles, more preferably from 0.5 to 1.5 moles. Thus, both ends of (B3) are blocked by a trimethyloxane unit, and the intermediate unit is composed of a dimethyloxane unit and a methylhydroquinone unit, and is relative to the dimethyloxane unit 1 The molar, methylhydroquinone unit is preferably 0.1 to 2.0 moles of polymethylhydroquinone.

(B3)之黏度係1至10,000cP,以1至5,000cP為更佳,以1至1,000cP為最佳。 The viscosity of (B3) is 1 to 10,000 cP, more preferably 1 to 5,000 cP, and most preferably 1 to 1,000 cP.

(B4)係兩末端被RcRd 2SiO1/2單元封閉,中間單元由RcRdSiO2/2單元及Rd 2SiO2/2單元所構成之聚有機氫矽氧烷。(B4)中之RC係一分子中以2至5,000個為較佳,更佳係3至5,000個,又更佳係3至1,000個。(B4)中之Rd,從容易合成且機械的強度及硬化前之流動性等特性均衡優異之點,以甲基為較佳。 (B4) is a polyorganohydrohydroxane in which both ends are blocked by R c R d 2 SiO 1/2 units, and the intermediate unit is composed of R c R d SiO 2/2 units and R d 2 SiO 2/2 units. The R C system in (B4) is preferably 2 to 5,000, more preferably 3 to 5,000, still more preferably 3 to 1,000. The R d in (B4) is preferably a methyl group from the viewpoint that it is easy to synthesize and has excellent balance between mechanical strength and fluidity before hardening.

(B4)係RcRdSiO2/2單元及Rd 2SiO2/2單元之比率,相對於Rd 2SiO2/2單元1莫耳,以RcRdSiO2/2單元為0.1至2.0莫耳較佳,以0.5至1.5莫耳又更佳。因而,(B4)係兩末端被二甲基氫矽氧烷單元封閉,中間單元由二甲基矽氧烷單元及甲基氫矽氧烷單元所構成,且相對於二甲基矽氧烷單元1莫耳,以甲基氫矽氧烷單元為0.1至2.0莫耳之聚甲基氫矽氧烷較佳。 (B4) is a ratio of R c R d SiO 2/2 unit and R d 2 SiO 2/2 unit, relative to R d 2 SiO 2/2 unit 1 mol, and R c R d SiO 2/2 unit is 0.1 to 2.0 moles is preferred, and 0.5 to 1.5 moles is more preferred. Thus, both ends of (B4) are blocked by a dimethylhydroquinone unit, and the intermediate unit is composed of a dimethyloxane unit and a methylhydroquinone unit, and is relative to the dimethyloxane unit. The 1 molar is preferably a polymethylhydroquinone having a methylhydroquinone unit of 0.1 to 2.0 moles.

(B4)之黏度係1至10,000cP,以1至5,000cP更佳,以1至1,000cP又更佳。 The viscosity of (B4) is 1 to 10,000 cP, more preferably 1 to 5,000 cP, still more preferably 1 to 1,000 cP.

(B)係可為分支狀聚有機氫矽氧烷,可舉例如由R2HSiO1/2單元(式中,R係表示氫原子、C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基) 或苯基)及SiO4/2單元所構成,且一分子中具有3個以上之鍵結於矽原子之氫原子的聚烷基氫矽氧烷。又,由R3SiO1/2單元、R2SiO單元及RSiO3/2單元(式中,R係表示氫原子、C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基,較佳係甲基)或苯基)所構成,一分子中具有2個以上之鍵結於矽原子之氫原子的聚烷基氫矽氧烷。分支狀聚有機氫矽氧烷在23℃之黏度係1至10,000cP,以1至5,000cP為更佳,以1至1,000cP又更佳。 (B) may be a branched polyorganohydroquinone, and may, for example, be an R 2 HSiO 1/2 unit (wherein R represents a hydrogen atom, a C 1 to C 6 alkyl group (for example, a methyl group, an ethyl group). a propyl, butyl, pentyl, hexyl group, preferably a methyl group or a phenyl group) and a SiO 4/2 unit, and having more than three hydrogen atoms bonded to a halogen atom in one molecule Alkyl hydroquinone. Further, it is composed of R 3 SiO 1/2 unit, R 2 SiO unit and RSiO 3/2 unit (wherein R represents a hydrogen atom, a C 1 to C 6 alkyl group (for example, methyl group, ethyl group, propyl group, butyl group). A group consisting of a benzyl group, a pentyl group, a hexyl group, preferably a methyl group or a phenyl group, and a polyalkylhydroquinone having two or more hydrogen atoms bonded to a halogen atom in one molecule. The branched polyorganohydrohalosiloxane has a viscosity of from 1 to 10,000 cP at 23 ° C, more preferably from 1 to 5,000 cP, still more preferably from 1 to 1,000 cP.

(B)係可單獨,亦可併用2種以上。(B1)、 (B2)、(B3)及(B4)係可單獨使用,亦可組合使用。從提高硬化性之觀點,以使用(B1)為較佳。(B)係以(B1)及(B2)之併用、(B1)及(B4)之併用、(B3)及(B2)之併用為較佳,以(B1)及(B2)之併用為更佳。(B)係併用(B1)及(B2)時,從硬化物對於衝擊之應力緩和的觀點,(B1)之氫的量相對於(B1)及(B2)之氫的總量(HB1/(HB1+HB2))以0.05至0.60為較佳,以0.10至0.50為更佳。 (B) may be used alone or in combination of two or more. (B1), (B2), (B3), and (B4) may be used singly or in combination. From the viewpoint of improving the hardenability, it is preferred to use (B1). (B) is a combination of (B1) and (B2), a combination of (B1) and (B4), a combination of (B3) and (B2), and a combination of (B1) and (B2). good. (B) When (B1) and (B2) are used in combination, the amount of hydrogen in (B1) is relative to the total amount of hydrogen in (B1) and (B2) from the viewpoint of stress relaxation of the hardened material against impact (H B1 / (H B1 + H B2 )) is preferably 0.05 to 0.60, more preferably 0.10 to 0.50.

從適當的硬化速度之確保的觀點,(B)中鍵 結於矽原子之氫原子的個數HB之合計對(A)鍵結於矽原子之烯基的個數ViA之合計之比(HB/ViA)為0.5至100,以0.5至50.0為較佳。若(HB/ViA)未達0.5,於硬化時無法擴散充分之交聯劑,故不硬化,而若超過100,則交聯點少而不硬化。 The sum total of ensuring an appropriate view of the curing speed, (B) the hydrogen atom bonded to a silicon atom of the number of H B (A) alkenyl group bonded to a silicon atom of the ratio of the number of Vi A (H B /Vi A ) is from 0.5 to 100, preferably from 0.5 to 50.0. If (H B /Vi A ) is less than 0.5, a sufficient crosslinking agent cannot be diffused at the time of curing, so that it does not harden, and if it exceeds 100, the crosslinking point is small and it is hardened.

組成物所含有之(C)係用以促進(A)之烯基 與(B)之Si-H基之間的加成反應之觸媒。從觸媒活性良好 的觀點,可適宜使用如鉑、銠、鈀之鉑系金屬(鉑族元素)的化合物,較佳係如氯化鉑酸、氯化鉑酸與醇之反應生成物、鉑-烯烴錯合物、鉑-乙烯基矽氧烷錯合物、鉑-酮錯合物、鉑-膦錯合物之鉑化合物;如銠-膦錯合物、銠-亞硫酸鹽錯合物之銠化合物;如鈀-膦錯合物之鈀化合物,以鉑化合物為更佳,以鉑-乙烯基矽氧烷錯合物又更佳。 The composition (C) contained in the composition is used to promote the alkenyl group (A) Catalyst for the addition reaction with the Si-H group of (B). Good activity from catalyst From the viewpoint, a compound of a platinum group metal (platinum group element) such as platinum, rhodium or palladium may be suitably used, and preferably a reaction product such as chloroplatinic acid, chloroplatinic acid and an alcohol, and a platinum-olefin complex. a platinum-vinyl oxane complex, a platinum-ketone complex, a platinum compound of a platinum-phosphine complex; a ruthenium compound such as a ruthenium-phosphine complex or a ruthenium-sulfite complex; The palladium compound of the palladium-phosphine complex is more preferably a platinum compound and more preferably a platinum-vinyloxirane complex.

(C)係從硬化物之透明性的確保及適當的硬 化速度之確保的觀點,相對於(A)至(C)之合計重量,以鉑系金屬原子換算為0.5至1,000ppm,以0.5至500ppm為較佳,以0.5至200ppm為更佳。若(C)之量未達0.5ppm,則硬化慢。若(C)之量超過1,000ppm,則透明性明顯降低,硬化物之變色變顯著,硬化物變成黑色。又,(C)係相對於(A)至(C)之合計重量,以鉑系金屬原子換算,為超過5ppm且1,000ppm以下,亦可超過200ppm且1,000ppm以下,亦可0.5ppm以上未達5ppm,且超過200ppm、1,000ppm以下。 (C) is to ensure the transparency of the cured product and appropriate hard The viewpoint of the securing of the velocities is preferably 0.5 to 1,000 ppm in terms of platinum group metal atoms, more preferably 0.5 to 500 ppm, and more preferably 0.5 to 200 ppm, based on the total weight of (A) to (C). If the amount of (C) is less than 0.5 ppm, the hardening is slow. When the amount of (C) exceeds 1,000 ppm, the transparency is remarkably lowered, the discoloration of the cured product becomes remarkable, and the cured product becomes black. In addition, the total weight of (C) is more than 5 ppm and 1,000 ppm or less, and may be more than 200 ppm and 1,000 ppm or less, or 0.5 ppm or less, in terms of the total weight of (A) to (C). 5 ppm and more than 200 ppm and 1,000 ppm or less.

組成物係在無損本發明之效果的範圍,可 含有(D)具有氮原子之安定化劑、(E)稀釋劑、(F)接著賦予劑、(G)無機質充填劑等。又,組成物係以不含(D)成分者為較佳。 The composition is in a range that does not impair the effects of the present invention, and It contains (D) a stabilizer having a nitrogen atom, (E) a diluent, (F) a subsequent imparting agent, (G) an inorganic filler, and the like. Further, the composition is preferably one which does not contain the component (D).

組成物係亦可含有(D)具有氮原子之安定化 劑。(D)係可使(C)鉑系觸媒安定化。(D)係可舉例如通式:(R1)2N-R3-N(R2)2(式中,R1係分別獨立為C1至C6烷基(例如甲基、乙基、丙基、丁基、戊基、己基),R2係具有與R1相同之意義、或為氫原子,R3係C2至C4亞烷基(例如亞乙 基、三亞甲基、四亞甲基)。)所示之胺化合物。 The composition system may also contain (D) a stabilizer having a nitrogen atom. (D) can stabilize the (C) platinum-based catalyst. (D) is, for example, a formula: (R 1 ) 2 NR 3 -N(R 2 ) 2 (wherein R 1 is independently a C 1 to C 6 alkyl group (for example, methyl group, ethyl group, and C group). Base, butyl, pentyl, hexyl), R 2 has the same meaning as R 1 or is a hydrogen atom, and R 3 is a C 2 to C 4 alkylene group (e.g., ethylene, trimethylene, tetra The amine compound shown by methyl).).

(D)具體上係可舉例如N,N,N’,N’-四甲基 乙二胺、N,N-二甲基乙二胺、N,N-二乙基乙二胺、N,N-二丁基乙二胺、N,N-二丁基-1,3-丙二胺、N,N-二甲基-1,3-丙二胺、N,N,N’,N’-四乙基乙二胺、N,N-二丁基-1,4-丁二胺,以N,N,N’,N’-四甲基乙二胺為較佳。(D)係可單獨或併用2種以上。 (D) specifically, for example, N, N, N', N'-tetramethyl Ethylenediamine, N,N-dimethylethylenediamine, N,N-diethylethylenediamine, N,N-dibutylethylenediamine, N,N-dibutyl-1,3-propane Diamine, N,N-dimethyl-1,3-propanediamine, N,N,N',N'-tetraethylethylenediamine, N,N-dibutyl-1,4-butane The amine is preferably N, N, N', N'-tetramethylethylenediamine. (D) may be used alone or in combination of two or more.

(D)之調配量係相對於(C)之鉑系金屬原子1 莫耳,以0.001至0.5莫耳之範圍為較佳,以0.01至0.1莫耳為更佳。若為如此之範圍,可防止所得觸媒之經時性外觀不良,抑制變色,同時不使(C)之觸媒活性極端降低,而可在所希望之時間達成硬化。 The amount of (D) is relative to the platinum group metal atom of (C) Mohr is preferably in the range of 0.001 to 0.5 mol, more preferably 0.01 to 0.1 mol. If it is such a range, the appearance of the obtained catalyst can be prevented from being poor in appearance, the discoloration can be suppressed, and the catalytic activity of (C) can be prevented from being extremely lowered, and hardening can be achieved at a desired time.

組成物係亦可含有(E)稀釋劑。藉由組成物 含有(E),可調整黏度。(E)較佳係不含有參與硬化反應之烯基的聚矽氧油,兩末端被三甲基矽氧烷單元封閉,中間單元由二甲基矽氧烷單元所構成之聚甲基矽氧烷。(E)係23℃之黏度為1至5,000cP較佳,以5至1,000cP為更佳。 (E)之調配量係相對於組成物中之(A)至(C)之合計100重量份,以50重量份以下為較佳,以30重量份以下為更佳,以20重量份以下又更佳。 The composition system may also contain (E) a diluent. By composition Contains (E), adjustable viscosity. (E) preferably a polyfluorene oxide oil which does not contain an alkenyl group which participates in a hardening reaction, the two ends are blocked by a trimethyloxane unit, and the intermediate unit is a polymethyloxime composed of dimethyloxane units. alkyl. (E) is preferably a viscosity of from 1 to 5,000 cP at 23 ° C, more preferably from 5 to 1,000 cP. The blending amount of (E) is preferably 50 parts by weight or less, more preferably 30 parts by weight or less, and still more preferably 20 parts by weight or less based on 100 parts by weight of the total of (A) to (C) in the composition. Better.

組成物係亦可含有(F)接著賦予劑。(F)接著 賦予劑可舉例如四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷、四丁氧基矽烷、甲基三甲氧基矽烷、二甲基二甲氧基矽烷、甲基三乙氧基矽烷、二甲基二乙氧基矽烷般之二、 三、四烷氧基矽烷類;如3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基(甲基)二甲氧基矽烷、3-環氧丙氧基丙基(甲基)二乙氧基矽烷般之含有3-環氧丙氧基丙基的烷氧基矽烷類;如2-(3,4-環氧基環己基)乙基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三乙氧基矽烷、2-(3,4-環氧基環己基)乙基(甲基)二甲氧基矽烷般之含有2-(3,4-環氧基環己基)乙基的烷氧基矽烷類;如乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基參(2-甲氧基乙氧基)矽烷、甲基乙烯基二甲氧基矽烷、烯丙基三甲氧基矽烷、烯丙基三乙氧基矽烷、甲基烯丙基二甲氧基矽烷般之烯基烷氧基矽烷類;如3-丙烯醯氧基丙基三甲氧基矽烷、3-丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基(甲基)二甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基(甲基)二甲氧基矽烷般之(甲基)丙烯醯氧基丙基烷氧基矽烷類;1,1,3,5,7-五甲基環四矽氧烷與3-甲基丙烯醯氧基丙基三甲氧基矽烷之反應生成物等之有機矽化合物。 The composition system may also contain (F) a subsequent imparting agent. (F) then The imparting agent may, for example, be tetramethoxydecane, tetraethoxydecane, tetrapropoxydecane, tetrabutoxydecane, methyltrimethoxydecane, dimethyldimethoxydecane or methyltriethoxylate. 2, decane, dimethyl diethoxy decane a tris-alkyloxydecane; such as 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, 3-glycidoxypropyl (A) Alkoxydecanes containing 3-glycidoxypropyl groups like dimethoxy decane, 3-glycidoxypropyl (methyl) diethoxy decane; such as 2-(3 , 4-epoxycyclohexyl)ethyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltriethoxydecane, 2-(3,4-epoxycyclohexyl) Alkoxydecanes containing 2-(3,4-epoxycyclohexyl)ethyl as in the case of ethyl (meth)dimethoxydecane; such as vinyltrimethoxydecane, vinyltriethoxy Decane, vinyl ginseng (2-methoxyethoxy) decane, methyl vinyl dimethoxy decane, allyl trimethoxy decane, allyl triethoxy decane, methallyl a methoxy decane-like alkenyl alkoxy decane; such as 3-propenyloxypropyltrimethoxydecane, 3-propenyloxypropyltriethoxydecane, 3-propenyloxypropyl (Meth)dimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane, 3-methylpropenyloxyl Propyltriethoxydecane, 3-methylpropenyloxypropyl (methyl)dimethoxydecane (meth) propylene oxypropyl alkoxy decane; 1,1,3 An organic ruthenium compound such as a reaction product of 5,7-pentamethylcyclotetraoxane and 3-methylpropenyloxypropyltrimethoxydecane.

有機矽化合物例如具體者可舉具有以下述 式: (式中,Q1及Q2表示互相獨立之亞烷基,較佳係表示C1至 C4亞烷基,R3係表示C1至C4烷基)所示之側鏈的有機矽化合物。 The organic hydrazine compound, for example, may be exemplified by the following formula: (wherein, Q 1 and Q 2 represent mutually independent alkylene groups, preferably a C 1 to C 4 alkylene group, and R 3 represents a C 1 to C 4 alkyl group) Compound.

如此之有機矽化合物係以下述之化合物為較佳。 Such an organic phosphonium compound is preferably a compound described below.

組成物係亦可含有(G)無機質充填劑。(G) 無機質充填劑係可例示如煙霧質二氧化矽、電弧二氧化矽般之乾式微粉末二氧化矽,以煙霧質二氧化矽為較佳。又,亦可為使如此之二氧化矽之表面以如六甲基二矽氮烷、1,3-二乙烯基-1,1,3,3-四甲基二矽氮烷般之矽氮烷化合物;如辛基甲基環四矽氧烷般之聚有機矽氧烷等處理者。 The composition may also contain (G) an inorganic filler. (G) The inorganic filler may be exemplified by a dry fine powder of cerium oxide such as aerosol-type cerium oxide or arc cerium oxide, and an aerosol-type cerium oxide is preferred. Further, the surface of such a cerium oxide may be a nitrogen-like nitrogen such as hexamethyldiazepine or 1,3-divinyl-1,1,3,3-tetramethyldiazepine. An alkane compound; a treatment such as a polyorganosiloxane such as octylmethylcyclotetraoxane.

<硬化性聚有機矽氧烷組成物之硬化物> <hardened substance of hardened polyorganosiloxane composition>

硬化性聚有機矽氧烷組成物之硬化物(以下,亦僅稱為「硬化物」。)係硬化前之硬化性聚有機矽氧烷組成物(以下,亦僅稱為「硬化前之組成物」。)包含選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分(以下,亦稱此等為「4個硬化性部分」。)所構成之群中之2個以上之硬化性部分。 The cured product of the curable polyorganosiloxane composition (hereinafter, simply referred to as "cured material") is a hardened polyorganosiloxane composition before curing (hereinafter, simply referred to as "pre-hardening composition" Included in the portion containing (B), the portion containing (B) and (A), the portion containing (C), and the portion containing (C) and (A) (hereinafter also referred to as such It is a "hardening part". Two or more hardening parts of the group consisting of.

此處,含有(C)之部分、以及含有(C)及(A)之部分,係相當於硬化性聚有機矽氧烷組成物中之硬化劑成分。含有(C)之部分、以及含有(C)及(A)之部分,歸納稱為「第1成分」。含有(B)之部分、及含有(B)及(A)之部分,係相當於硬化性聚有機矽氧烷組成物中之主劑成分。含有(B)之部分、及含有(B)及(A)之部分,歸納稱為「第2成分」。 Here, the portion containing (C) and the portion containing (C) and (A) correspond to a hardener component in the curable polyorganosiloxane composition. The part containing (C) and the part containing (C) and (A) are collectively referred to as "first component". The portion containing (B) and the portion containing (B) and (A) correspond to the main component of the curable polyorganosiloxane composition. The part containing (B) and the part containing (B) and (A) are collectively referred to as "the second component".

含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、含有(C)及(A)之部分,係硬化前之組成物所含有之硬化性部分。硬化性部分係單獨不會硬化,但於各部分所含有之(B)及(C)只在硬化時接觸,進行交聯反應。本發明中,硬化性部分係可藉各成分之存在來區別。例如含有(B)及(A)之部分與含有(B)之部分,係可藉由(A)之存在而 區別。又,含有(B)及(A)之部分與含有(C)及(A)之部分,係可藉由(B)及(C)之存在而區別。 The part containing (B), the part containing (B) and (A), the part containing (C), and the part containing (C) and (A) are the hardening part contained in the composition before hardening. The hardenable portion does not harden alone, but the (B) and (C) contained in each portion are only contacted at the time of curing to carry out a crosslinking reaction. In the present invention, the hardenable portion can be distinguished by the presence of each component. For example, the portion containing (B) and (A) and the portion containing (B) may be present by (A) the difference. Further, the portion containing (B) and (A) and the portion containing (C) and (A) can be distinguished by the presence of (B) and (C).

硬化前之組成物係至少1個含有(B)的部分 或含有(B)及(A)之部分接觸於至少1個含有(C)的部分或含有(C)及(A)之部分。硬化前之組成物係第2成分與第1成分非別保存,與適用於基材之前進行混合後使用來作為接著劑之二劑型硬化性組成物相異。 The composition before hardening is at least one part containing (B) Or the portion containing (B) and (A) is in contact with at least one portion containing (C) or containing (C) and (A). The composition before curing is not separately stored in the second component and the first component, and is different from the two-component curable composition which is used as an adhesive before being applied to the substrate.

硬化性部分之數及其種類,只要硬化前之 組成物所含有之硬化性部分的合併組成為上述硬化性聚有機矽氧烷組成物之組成即可,無特別限定。例如硬化前之組成物為由2個硬化性部分所構成時,硬化前之組成物由含有(B)之部分與含有(C)及(A)之部分構成,或由含有(B)及(A)之部分與含有(C)之部分構成,或由含有(B)及(A)之部分與含有(C)及(A)之部分所構成。 The number of hardenable parts and their types, as long as they are hardened The combined composition of the curable portions contained in the composition is not particularly limited as long as it is a composition of the above-mentioned curable polyorganosiloxane composition. For example, when the composition before hardening is composed of two hardenable portions, the composition before curing consists of the portion containing (B) and the portion containing (C) and (A), or contains (B) and ( Part A) consists of a part containing (C) or a part containing (B) and (A) and a part containing (C) and (A).

較佳係硬化前之組成物含有選自由4個硬 化性部分所構成之群中之3個以上之硬化性部分。又,更佳係硬化前之組成物含有(C)之部分、含有(B)及(A)之部分、以及含有(C)之部分等3個硬化性部分所構成。 Preferably, the composition before hardening contains a selected from 4 hard Three or more hardening parts of the group consisting of chemical parts. Moreover, it is more preferable that the composition before hardening contains the part of (C), the part containing (B) and (A), and three hardening parts containing the part of (C).

硬化前之組成物含有複數之含有(C)及(A) 的部分時,為使交聯反應均一地進行,較佳係於各含有(C)及(A)之部分所含有之(A)為相同。依相同之理由,硬化前之組成物含有複數之含有(B)及(A)的部分時,較佳係於各含有(B)及(A)之部分所含有之(A)為相同。 The composition before hardening contains a plurality of (C) and (A) In order to carry out the crosslinking reaction uniformly, it is preferred that (A) contained in each of the portions (C) and (A) is the same. For the same reason, when the composition before hardening contains a plurality of portions containing (B) and (A), it is preferred that (A) contained in each of the portions (B) and (A) is the same.

硬化性部分係可含有上述之(D)至(F)。含有 (C)之部分以及含有(C)及(A)之部分,從速硬化性之觀點以及降低所得硬化物的變色(尤其,黄變)之觀點,以進一步含有(E)為較佳,以進一步含有(E)及(D)為更佳。又,含有(B)之部分以及含有(B)及(A)之部分,從接著性之觀點,以進一步含有(F)為較佳。 The hardenable portion may contain the above (D) to (F). contain The part (C) and the part containing (C) and (A) are preferably further contained in the viewpoint of the quick-curing property and the discoloration (especially yellowing) of the obtained cured product, and further preferably (E). It is more preferable to contain (E) and (D). Further, the portion containing (B) and the portion containing (B) and (A) are preferably further contained in (F) from the viewpoint of adhesion.

硬化性部分之各部分之形狀係無特別限 定,可為線狀、柱狀、圓狀、球狀及層狀。此等係可依照塗布裝置及組成物之黏度而適當選擇。 The shape of each part of the sclerosing part is not limited The shape may be linear, columnar, round, spherical or layered. These can be appropriately selected in accordance with the viscosity of the coating device and the composition.

硬化性部分以層狀為較佳。亦即,較佳係 硬化前之組成物為含有選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層(以下,亦稱此等為「4個硬化性層」)所構成之群中的2個以上之層之積層體。又,本發明中,更佳係硬化前之組成物具有含有(C)之層、含有(B)及(A)之層、以及含有(C)之層等3個硬化性層。 The hardenable portion is preferably in the form of a layer. That is, the preferred system The composition before hardening contains a layer selected from the group consisting of (B), the layer containing (B) and (A), the layer containing (C), and the layer containing (C) and (A) (hereinafter also referred to as These are the laminated bodies of two or more layers in the group consisting of "four hardening layers". Further, in the present invention, the composition before curing is more preferably a layer containing (C), a layer containing (B) and (A), and three layers including (C).

含有(B)之層、含有(B)及(A)之層、含有(C) 之層、以及含有(C)及(A)之層係於硬化前之組成物所含有之硬化性層。硬化前之組成物更佳係使含有(B)及(A)之層及含有(C)之層交互積層之積層體。藉由(A)及(B)共存、(A)及(C)不共存,則(C)易移動至含有(B)成分之部分而易進行硬化反應。又,硬化前之組成物更佳係具有於兩端含有(C)之層或含有(B)及(A)之層的積層體,以具有於兩端含有(C)之層的積層體為尤佳。硬化前之組成物為具有於兩端含有(C)之層的積層體時,從兩端更多之(C)移動至存在於積層 體之內側的含有(B)成分之部分,從兩端更易進行組成物之硬化反應。 Layer containing (B), layer containing (B) and (A), containing (C) The layer and the layer containing (C) and (A) are the hardenable layer contained in the composition before hardening. The composition before hardening is more preferably a laminate comprising layers of (B) and (A) and alternating layers of layers (C). When (A) and (B) coexist, and (A) and (C) do not coexist, (C) is easily moved to a portion containing the component (B) to facilitate the hardening reaction. Further, it is more preferable that the composition before hardening has a layered body containing a layer of (C) or a layer containing (B) and (A) at both ends, and the layered body having a layer containing (C) at both ends is Especially good. When the composition before hardening is a laminate having a layer containing (C) at both ends, more (C) moves from both ends to exist in the laminate The portion containing the component (B) on the inner side of the body is more susceptible to the hardening reaction of the composition from both ends.

積層體之總厚度雖無特別限定,但以2至 2,000μm為較佳,以2至1,000μm為更佳,以10至500μm為尤佳。 The total thickness of the laminate is not particularly limited, but is 2 to More preferably, 2,000 μm, more preferably 2 to 1,000 μm, even more preferably 10 to 500 μm.

又,積層體中各層之厚度,較佳係依硬化 性層之種類而如下述。含有(B)之層之厚度係以10至1000μm為較佳,以20至500μm為更佳。含有(B)及(A)之層之厚度係以1至500μm為較佳,以10至300μm為更佳。 含有(C)之層之厚度係以0.1至1000μm為較佳,以0.1至300μm為更佳。含有(C)及(A)之層之厚度係以0.1至50μm為較佳,以0.5至30μm為更佳。又,積層體含有複數相同硬化性層時,上記之厚度係各硬化性層之厚度。 Moreover, the thickness of each layer in the laminate is preferably hardened by hardening The type of the layer is as follows. The thickness of the layer containing (B) is preferably from 10 to 1000 μm, more preferably from 20 to 500 μm. The thickness of the layer containing (B) and (A) is preferably from 1 to 500 μm, more preferably from 10 to 300 μm. The thickness of the layer containing (C) is preferably 0.1 to 1000 μm, more preferably 0.1 to 300 μm. The thickness of the layer containing (C) and (A) is preferably 0.1 to 50 μm, more preferably 0.5 to 30 μm. Further, when the laminated body contains a plurality of the same curable layer, the thickness described above is the thickness of each of the curable layers.

含有複數之含有(C)及(A)之部分與含有(B) 及(A)之部分時,只要滿足有關組成物規定之HB/ViA比,於含有(C)及(A)之部分與含有(B)及(A)之部分所含有之(A)的含量比係無特別限定。相對於含有(B)及(A)之部分中之(A)100重量份,含有(C)及(A)之部分中之(A)之量係以0.1至300重量份為較佳,以0.1至200重量份為更佳。 When a part containing (C) and (A) and a part containing (B) and (A) are contained in a plurality, the H B /Vi A ratio specified in the composition is satisfied, and (C) and (A) are contained. The content ratio of the portion to the portion (A) contained in the portion containing (B) and (A) is not particularly limited. Preferably, the amount of (A) in the portion containing (C) and (A) is preferably 0.1 to 300 parts by weight, based on 100 parts by weight of (A) in the portion containing (B) and (A), From 0.1 to 200 parts by weight is more preferred.

硬化前之組成物中之第1成分及第2成分之 含量,相對於第1成分之合計100重量份,第2成分之合計以200至100,000重量份為較佳,以200至50,000重量份為更佳,以200至10,000重量份又更佳,以200至5,000重量份為尤佳。從暫時固定時間之速度的觀點,第2成分 之合計係以200至10,000重量份為較佳,以200至5,000重量份為更佳。 The first component and the second component in the composition before hardening The content is preferably 200 to 100,000 parts by weight, more preferably 200 to 50,000 parts by weight, still more preferably 200 to 10,000 parts by weight, even more preferably 200 parts by weight based on 100 parts by weight of the total of the first component. It is especially preferable to be 5,000 parts by weight. From the point of view of the temporary fixed time, the second component The total amount is preferably 200 to 10,000 parts by weight, more preferably 200 to 5,000 parts by weight.

硬化前之組成物中,第1成分在23℃之黏度以1至100,000cP為較佳,以1至10,000cP為更佳,以1至5,000cP又更佳,以1至1,000cP為尤佳,以1至500cP為特佳。若為如此之範圍,形成硬化前之組成物時之作業性提升,於第1成分及第2成分所含有之各成分易混合,反應性提高,硬化時間進一步縮短。又,(A)與(B)之加成反應中,(C)易滲透到(B)與(B)及(A)之區域,藉此,硬化時間進一步縮短,故以聚有機矽氧烷分子鏈小者,亦即,以存在黏度低之(A)者為較佳。從得到如此之第1成分的觀點,較佳係第1成分含有黏度低(例如23℃之黏度為1至500cP)之聚有機矽氧烷作為(A)。又,從得到具有上述黏度之第1成分的觀點,第1成分以進一步含有(E)、或第1成分進一步含有(F)為較佳。又,較佳係含有第1成分為含有(C)之部分,進一步含有(E)或(F),或第1成分為含有(A)及(C)之部分,且以例如23℃之黏度為1至500cP之聚有機矽氧烷作為(A)。 In the composition before hardening, the viscosity of the first component at 23 ° C is preferably from 1 to 100,000 cP, more preferably from 1 to 10,000 cP, even more preferably from 1 to 5,000 cP, and particularly preferably from 1 to 1,000 cP. It is particularly good from 1 to 500 cP. When it is such a range, workability at the time of forming a composition before hardening improves, and each component contained in a 1st component and a 2nd component is mix|blended easily, and reactivity is improved, and hardening time is further shortened. Further, in the addition reaction of (A) and (B), (C) is easily penetrated into the regions of (B) and (B) and (A), whereby the hardening time is further shortened, so that the polyorganosiloxane is used. The smaller molecular chain, that is, the one having a low viscosity (A) is preferred. From the viewpoint of obtaining such a first component, it is preferred that the first component contains a polyorganosiloxane having a low viscosity (for example, a viscosity of from 1 to 500 cP at 23 ° C) as (A). Moreover, it is preferable that the first component further contains (E) or the first component further contains (F) from the viewpoint of obtaining the first component having the above viscosity. Further, it is preferable that the first component contains a portion containing (C), further contains (E) or (F), or the first component contains a portion containing (A) and (C), and has a viscosity of, for example, 23 ° C. A polyorganosiloxane of 1 to 500 cP is used as (A).

第2成分係以23℃之黏度為1至100,000cP者較佳,以100至100,000cP為更佳,以500至50,000cP又更佳,以1,000至50,000cP為尤佳,以3,000至20,000cP為特佳。若為如此之範圍,則作業性提高,塗布時之展延性良好,貼合時第1成分及第2成分所含有之各成分易混合而反應性提高,硬化時間進一步縮短。又,(A)與(B) 之加成反應中,以較少之反應點形成大的交聯構造,藉此,硬化時間進一步縮短,故以含有聚有機矽氧烷分子鏈大者,亦即黏度高之(A)為較佳。從得到如此之第2成分的觀點,較佳係以含有黏度高(例如23℃之黏度為30,000至100,000cP)之聚有機矽氧烷與黏度低(例如23℃之黏度為50至1,000cP)之聚有機矽氧烷之混合物作為(A)。黏度高之聚有機矽氧烷與黏度低之聚有機矽氧烷之混合物中,黏度低之聚有機矽氧烷之量係只要滿足上述之黏度即可,無特別限定,例如相對於黏度高之聚有機矽氧烷100重量份,可為0.1至100重量份。 The second component is preferably a viscosity of from 1 to 100,000 cP at 23 ° C, more preferably from 100 to 100,000 cP, even more preferably from 500 to 50,000 cP, even more preferably from 1,000 to 50,000 cP, and from 3,000 to 20,000 cP. It is especially good. In such a range, the workability is improved, and the ductility at the time of coating is good, and the components contained in the first component and the second component are easily mixed at the time of bonding, and the reactivity is improved, and the curing time is further shortened. Also, (A) and (B) In the addition reaction, a large cross-linking structure is formed with a small number of reaction points, whereby the hardening time is further shortened, so that the molecular chain containing the polyorganosiloxane has a large viscosity, that is, the viscosity (A) is higher. good. From the viewpoint of obtaining such a second component, it is preferred to have a polyorganosiloxane having a high viscosity (for example, a viscosity of 30,000 to 100,000 cP at 23 ° C) and a low viscosity (for example, a viscosity of 50 to 1,000 cP at 23 ° C). A mixture of polyorganosiloxanes is used as (A). In the mixture of a polyorganosiloxane having a high viscosity and a polyorganosiloxane having a low viscosity, the amount of the polyorganosiloxane having a low viscosity is not particularly limited as long as it satisfies the above viscosity, and is, for example, high in viscosity. The polyorganosiloxane may be used in an amount of from 0.1 to 100 parts by weight per 100 parts by weight.

23℃之黏度為1,000至100,000cP之聚有機 矽氧烷與23℃之黏度為50至500cP之聚有機矽氧烷之混合物中,黏度為50至500cP之聚有機矽氧烷之量係只要滿足上述之黏度即可,無特別限定,例如相對於黏度為1,000至100,000cP之聚有機矽氧烷100重量份,可為0.1至1,000重量份。同樣做法,黏度為5,000至100,000cP之聚有機矽氧烷及23℃之黏度為50至1,000cP之聚有機矽氧烷之混合物中,黏度為50至1,000cP之聚有機矽氧烷之量相對於黏度為5,000至100,000cP之聚有機矽氧烷100重量份,可為0.1至1,000重量份。 Polyorganism with a viscosity of 23 to 100,000 cP at 23 ° C In the mixture of a polyoxane having a viscosity of 50 to 500 cP and a viscosity of 50 to 500 cP, the amount of the polyorganosiloxane having a viscosity of 50 to 500 cP is not particularly limited as long as it satisfies the above viscosity, for example, relative It may be 0.1 to 1,000 parts by weight based on 100 parts by weight of the polyorganosiloxane having a viscosity of 1,000 to 100,000 cP. In the same manner, a polyorganosiloxane having a viscosity of 5,000 to 100,000 cP and a polyorganosiloxane having a viscosity of 50 to 1,000 cP at 23 ° C, the amount of polyorganosiloxane having a viscosity of 50 to 1,000 cP is relatively It may be 0.1 to 1,000 parts by weight based on 100 parts by weight of the polyorganosiloxane having a viscosity of 5,000 to 100,000 cP.

藉由第1成分與第2成分接觸,可得到組成 物之硬化物。組成物之硬化物係具有優異的透明性。透明性之指標係可舉例如組成物之硬化物之穿透率為50%以上。組成物之硬化物之穿透率係以80至100%為較佳,以 90至100%為更佳。穿透率係以400nm且以試料厚度180μm測定之值。一般,硬化性聚有機矽氧烷組成物之硬化物中,可見光之波長領域(主要為400至800nm)中之組成物的硬化物之穿透率,係以在400nm之穿透率為最小值。又,一般,硬化性聚有機矽氧烷組成物之硬化物中,若產生黄變、白濁等,對於更短波長之光的穿透率降低。因而,組成物之硬化物在400nm之穿透率為50%以上時,組成物之硬化物在可視光之波長領域的穿透率為50%以上,組成物之硬化物具有優異的透明性。因此,使用組成物,使圖像顯示裝置之具有圖像顯示部之基部與透光性之保護部接著時,在辨識性之觀點亦良好。又,組成物之硬化物的變色程度之黃變指數係無特別限定,但以0.01至15為較佳,以0.01至5.0為更佳。黃變指數為15以下時,組成物之硬化物係可謂變色少。因此,使用可賦予黃變指數為15以下、且具有優異的透明性之硬化物的組成物,使圖像顯示裝置之具有圖像顯示部之基部與透光性之保護部接著時,辨識性更提升。 The composition can be obtained by contacting the first component with the second component. Hardened matter. The cured product of the composition has excellent transparency. The index of transparency is, for example, that the cured product of the composition has a transmittance of 50% or more. The penetration rate of the cured product of the composition is preferably 80 to 100%, 90 to 100% is better. The transmittance was measured at 400 nm and measured at a sample thickness of 180 μm. In general, in the hardened composition of the curable polyorganosiloxane composition, the transmittance of the cured product of the composition in the wavelength range of visible light (mainly 400 to 800 nm) is the minimum at 400 nm. . Further, in general, in the cured product of the curable polyorganosiloxane composition, if yellowing or white turbidity occurs, the transmittance of light having a shorter wavelength is lowered. Therefore, when the cured product of the composition has a transmittance of 400% or more at 400 nm, the cured product of the composition has a transmittance of 50% or more in the wavelength range of visible light, and the cured product of the composition has excellent transparency. Therefore, when the composition of the image display device has the base portion of the image display portion and the translucent protective portion, the composition is excellent in terms of visibility. Further, the yellowing index of the degree of discoloration of the cured product of the composition is not particularly limited, but is preferably 0.01 to 15 and more preferably 0.01 to 5.0. When the yellowing index is 15 or less, the cured product of the composition can be said to have less discoloration. Therefore, the composition of the image display device having the image display portion and the light-transmitting protective portion of the image display device can be used in the composition of the cured product having a yellowing index of 15 or less and having excellent transparency. More improvement.

硬化前之組成物較佳係依後述之接著體的製造方法中之步驟1A、步驟1B及步驟2B所得者。 The composition before hardening is preferably obtained by the steps 1A, 1B and 2B in the method for producing a laminate to be described later.

(附硬化物之基材及接著體) (substrate and bonding body with cured material)

本發明係亦有關在1個基材上積層組成物之硬化物的附硬化物之基材。又,本發明係亦有關透過組成物之硬化物使2個基材接著之含有2個基材的接著體。 The present invention is also directed to a substrate to which a cured product of a cured product of a composition is laminated on one substrate. Further, the present invention relates to a binder in which two substrates are subsequently contained in two substrates by a cured product of the composition.

硬化前之組成物中,硬化性部分可相對於 適用硬化性部分之基材表面,呈垂直方向(縦方向)形成各硬化性部分,亦可相對於適用硬化性部分之基材表面,呈平行方向(横方向)形成各硬化性部分。即使相對於基材呈平行方向形成硬化性部分,亦藉由硬化前之組成物所含有之(B)及(C)接觸,進行硬化反應。又,意指硬化性部分為積層體時,可相對於適用硬化性層之基材表面,呈垂直方向(縦方向)使層積層,亦可相對於適用硬化性層之基材表面,呈平行方向(横方向)使層積層。即使與適用硬化性層之基材表面呈平行積層硬化性層,亦藉由硬化前之組成物所含有之(B)及(C)接觸,進行硬化反應。 In the composition before hardening, the hardenable portion can be relative to The surface of the substrate to which the curable portion is applied forms each of the curable portions in the vertical direction (縦 direction), and each of the curable portions may be formed in the parallel direction (lateral direction) with respect to the surface of the substrate to which the curable portion is applied. Even if a hardenable portion is formed in a direction parallel to the substrate, the hardening reaction is carried out by contacting (B) and (C) contained in the composition before curing. Further, when the curable portion is a laminate, the laminate layer may be formed in a vertical direction (縦 direction) with respect to the surface of the substrate to which the curable layer is applied, or may be parallel to the surface of the substrate to which the curable layer is applied. The direction (horizontal direction) is layered. Even if it is in parallel with the surface of the substrate to which the curable layer is applied, the hardening reaction is carried out by contacting (B) and (C) contained in the composition before curing.

硬化物中,硬化前之組成物係相對於適用 硬化性部分之基材表面呈垂直方向積層之積層體時,與基材接觸之硬化物之層係相當於上述硬化前之積層體的兩端之一方。因而,本發明之附硬化物之基材,以硬化前之組成物為兩端之一方為含有(B)及(A)之層或含有(C)之層的積層體為較佳,兩端皆為含有(B)及(A)之層或含有(C)之層的積層體為更佳,兩端皆為含有(C)之層的積層體為尤佳。 In the hardened body, the composition before hardening is relative to the applicable When the surface of the substrate of the curable portion is a laminate in which the substrate is vertically stacked, the layer of the cured product in contact with the substrate corresponds to one of both ends of the laminate before the curing. Therefore, in the substrate with a cured product of the present invention, it is preferred that the composition before hardening is one of the two ends, and the layer containing the layers (B) and (A) or the layer containing the layer (C) is preferred. It is more preferable that the layered body containing the layer of (B) and (A) or the layer containing (C) is more preferable, and the layered body containing the layer of (C) at both ends is particularly preferable.

就基材而言,可舉例如鋁、鐵、鋅、銅、 鎂合金等金屬;環氧樹脂、丙烯酸樹脂、ABS、PA、PBT、PC、PPS、SPS等塑膠;及玻璃,以陰極射線管、液晶、電漿、有機EL等圖像顯示裝置之圖像顯示部之基部與透光性之保護部為較佳。 As the substrate, for example, aluminum, iron, zinc, copper, Metal such as magnesium alloy; epoxy resin, acrylic resin, ABS, PA, PBT, PC, PPS, SPS, etc.; and glass, image display device of cathode ray tube, liquid crystal, plasma, organic EL, etc. The base of the part and the protective part of the light transmission are preferred.

附硬化物之基材中硬化物之厚度、以及含 有2個基材之接著體中組成物的硬化物之厚度係無特別限 定,但以2至2,000μm為較佳,以2至1,000μm為更佳,以10至500μm為尤佳。 Thickness of hardened material in the substrate with hardened material, and The thickness of the cured product of the composition having the two substrates is not particularly limited. Preferably, it is preferably 2 to 2,000 μm, more preferably 2 to 1,000 μm, still more preferably 10 to 500 μm.

附硬化物之基材中,組成物之硬化物係與 基材接著。又,附硬化物之基材中之組成物的硬化物,較佳係可使用作為壩材。壩材係例如封裝圖像顯示部時,可使用來作為防止封裝劑流出的框。 In the substrate with a hardened material, the hardened material of the composition The substrate is then. Further, a cured product of the composition in the substrate to which the cured material is attached is preferably used as the dam material. When the dam material is, for example, a package image display portion, it can be used as a frame for preventing the encapsulant from flowing out.

又,接著體較佳係可使用後述者。 Further, it is preferable that the following body can be used.

附硬化物之基材較佳係依後述之附硬化物 的基材之製造方法得到。又,接著體較佳係依後述之接著體的製造方法得到。 The substrate with the cured material is preferably a cured product as described later. A method of producing a substrate is obtained. Further, the adhesive body is preferably obtained by a method for producing a laminate to be described later.

<使用硬化性聚有機矽氧烷組成物之含有二個基材的接著體之製造方法> <Method for Producing a Substrate Containing Two Substrates Using a Curable Polyorganosiloxane Mixture Composition>

使用硬化性聚有機矽氧烷組成物之含有二個基材的接著體之製造方法係包括:包含於一方基材上適用本發明之硬化性聚有機矽氧烷組成物後貼合另一方基材之第1製造方法、以及包含於兩方基材上適用本發明之硬化性聚有機矽氧烷組成物之一部後貼合兩方基材之第2製造方法。 A method for producing a binder comprising two substrates using a curable polyorganosiloxane composition comprises: applying a curable polyorganosiloxane composition of the present invention to one substrate and then bonding the other base The first production method of the material and the second production method in which the two base materials are bonded to one of the curable polyorganosiloxane compositions of the present invention on the two substrates.

(第1製造方法) (first manufacturing method)

第1製造方法係包含上述步驟1A至2A。 The first manufacturing method includes the above steps 1A to 2A.

步驟1A係於一方基材之被接著面形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上部分之形成硬化前之硬化性聚有機矽氧烷組成物的步驟。 Step 1A is a step of forming a portion selected from the group consisting of (B), a portion containing (B) and (A), a portion containing (C), and a portion containing (C) and (A). A step of forming a curable polyorganosiloxane composition before curing in two or more portions of the group formed.

2個以上之部分,只要於步驟2A中,硬化 性部分之(B)及(C)接觸進行硬化反應,可得到接著體即可,其形狀無特別限定,如在上述硬化前之組成物中所述般。又,基材中各部分之形成區域,只要在步驟2A中,硬化性部分中之(B)及(C)接觸後進行硬化反應,可得到接著體即可,無特別限定,可形成於基材之一部,亦可形成於基材之接著面全面。 2 or more parts, as long as in step 2A, hardening The (B) and (C) contacts of the sexual moiety are subjected to a hardening reaction to obtain a binder, and the shape thereof is not particularly limited, as described in the composition before the hardening. Further, the formation region of each portion in the substrate may be a hardening reaction after the contact of (B) and (C) in the curable portion in step 2A, and a binder may be obtained, and is not particularly limited, and may be formed on the substrate. One of the materials can also be formed on the entire surface of the substrate.

在步驟1A中,各部分之形成手段係無特別 限定,但可藉由硬化性部分之塗布而形成。塗布方法係只要可精度佳地塗布於作為對象之被接著面之位置,且可於接著體全體形成組成物之方法即可,無特別限定,可舉例如以分注器(dispenser)及狹縫模型塗佈機(slot die coater)之方法。 In step 1A, the formation means of each part is not special. It is defined, but it can be formed by coating of a hardenable portion. The coating method is not particularly limited as long as it can be applied to the position of the target surface to be coated with high precision, and the composition can be formed on the entire body, and examples thereof include a dispenser and a slit. A method of a slot die coater.

塗布於基材係可將硬化性部分塗佈於基材 之接著面之一部或全面。例如,亦可對基材之一部份區域,形成第1成分,而對同一基材之未形成第1成分之區域,形成第2成分。 Coating on a substrate to apply a hardenable portion to a substrate One or the other. For example, the first component may be formed on a part of the substrate, and the second component may be formed in the region of the same substrate where the first component is not formed.

於步驟1A中,各部分之形成量,包含較佳 者皆如上述有關硬化前之組成物中之第1成分及第2成分所述。 In step 1A, the amount of formation of each part is preferably included. All of them are as described above for the first component and the second component in the composition before hardening.

在步驟1A中,第1成分在23℃之黏度以1 至100,000cP為較佳,以1至10,000cP為更佳,以1至1,000cP又更佳,以1至500cP為尤佳。又,第2成分在23℃之黏度以1至100,000cP為較佳,以100至100,000cP為更佳,以1,000至50,000cP又更佳,以3,000至20,000cP為尤佳。 若為如此之第1成分及第2成分之黏度,則作業性提升,塗布時之延展性良好,貼合時第1成分及第2成分所含有之各成分易混合而反應性提升,硬化時間進一步縮短。 In step 1A, the viscosity of the first component at 23 ° C is 1 It is preferably 100,000 cP, more preferably 1 to 10,000 cP, still more preferably 1 to 1,000 cP, and even more preferably 1 to 500 cP. Further, the viscosity of the second component at 23 ° C is preferably from 1 to 100,000 cP, more preferably from 100 to 100,000 cP, even more preferably from 1,000 to 50,000 cP, still more preferably from 3,000 to 20,000 cP. When the viscosity of the first component and the second component is such that the workability is improved, the ductility during coating is good, and the components contained in the first component and the second component are easily mixed at the time of bonding, and the reactivity is improved, and the curing time is improved. Further shortened.

第1成分合計及第2成分之合計之含量,從 暫時固定時間之速度之觀點,第1成分合計:第2成分合計之重量比率,可為1:1,000至1,000:1,以1:500至500:1為較佳,以1:200至200:1為更佳,以1:2至1:100又更佳,以1:2至1:50為尤佳。 The total content of the first component and the total content of the second component are From the viewpoint of the temporary fixed time, the total weight of the first component: the total weight ratio of the second component may be 1:1,000 to 1,000:1, preferably 1:500 to 500:1, and 1:200 to 200: 1 is better, preferably from 1:2 to 1:100, and from 1:2 to 1:50.

就步驟1A而言,步驟1A-1:於一方基材之 被接著面積層選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的2層以上,形成硬化性聚有機矽氧烷組成物之積層體的步驟為較佳。又,就步驟1A而言,步驟1A-2:於一方基材之被接著面依序積層含有(C)之層、含有(B)及(A)之層、以及含有(C)之層之3層而形成硬化性聚有機矽氧烷組成物之積層體的步驟,及1A-3:於一個基材之被接著面依序積層含有(B)及(A)之層、含有(C)之層、以及含有(B)及(A)之層之3層而形成硬化性聚有機矽氧烷組成物之積層體的步驟為更佳。就步驟1A而言,以1A-2為尤佳。 For the step 1A, the step 1A-1: on one of the substrates The layer of the following area is selected from the group consisting of a layer containing (B), a layer containing (B) and (A), a layer containing (C), and a layer containing (C) and (A). The step of forming a laminate of the curable polyorganosiloxane composition is preferred. Further, in the step 1A, the step 1A-2 includes sequentially laminating the layer containing the layer (C), the layer containing the layers (B) and (A), and the layer containing the layer (C) on the succeeding surface of one of the substrates. a step of forming a layered body of a curable polyorganosiloxane composition in three layers, and 1A-3: sequentially layering layers (B) and (A) on a surface of a substrate, containing (C) The step of forming a layered body of the curable polyorganosiloxane composition having three layers of the layers (B) and (A) is more preferable. In the case of step 1A, 1A-2 is preferred.

第1成分及第2成分之塗布厚度係無特別限 定,但分別以1至1,000μm為較佳,從暫時固定時間之速度之觀點,以1至500μm為更佳。從作業性之觀點,第1成分之塗布厚度係以1至50μm為較佳,以2至30μm為更佳。同樣地,第2成分之塗布厚度係以10至300μm為 較佳,以20至200μm為更佳。 The coating thickness of the first component and the second component is not limited Preferably, it is preferably from 1 to 1,000 μm, and more preferably from 1 to 500 μm from the viewpoint of the temporary fixed time. The coating thickness of the first component is preferably from 1 to 50 μm, more preferably from 2 to 30 μm, from the viewpoint of workability. Similarly, the coating thickness of the second component is 10 to 300 μm. Preferably, it is more preferably 20 to 200 μm.

又,形成複數第1成分及第2成分時,上述之塗布厚度係各部分之層厚度。例如,步驟1A-2中,依序形成含有(C)之層、含有(B)及(A)之層、以及含有(C)之層之3層時,2個含有(C)之層之塗布厚度係互相獨立,以1至50μm為較佳,以2至30μm為更佳;含有(B)及(A)之層之塗布厚度係以1至500μm為較佳,以10至300μm為更佳。 Further, when a plurality of the first component and the second component are formed, the thickness of each layer of the thickness is applied as described above. For example, in step 1A-2, when the layer containing (C), the layer containing (B) and (A), and the layer containing (C) are sequentially formed, two layers containing (C) are formed. The coating thickness is independent of each other, preferably from 1 to 50 μm, more preferably from 2 to 30 μm; the coating thickness of the layer containing (B) and (A) is preferably from 1 to 500 μm, more preferably from 10 to 300 μm. good.

第1成分之塗布厚度與第2成分之塗布厚度 之比係無特別限定,但以1:1,000至1,000:1為較佳,以1:500至500:1為更佳,以1:200至200:1又更佳,以1:2至1:100為尤佳,以1:2至1:50為更尤佳。 Coating thickness of the first component and coating thickness of the second component The ratio is not particularly limited, but is preferably 1:1,000 to 1,000:1, more preferably 1:500 to 500:1, still more preferably 1:200 to 200:1, and 1:2 to 1 : 100 is especially good, especially from 1:2 to 1:50.

第1成分及第2成分之塗布厚度之合計,從 透明性之觀點,以2至2000μm為較佳,以2至1000μm為更佳,以10至500μm為尤佳。 The total thickness of the coating thickness of the first component and the second component is The viewpoint of transparency is preferably 2 to 2000 μm, more preferably 2 to 1000 μm, and particularly preferably 10 to 500 μm.

含有(C)之部分以及含有(C)及(A)之部分,係 可使(C)及進一步依需要所調配之其他成分,藉由萬能混練機、捏合機等混合裝置進行均勻混練來調製。又,含有(B)之部分以及含有(B)及(A)之部分,係可使用(B)及進一步依需要所調配之其他成分,與第1成分同樣進行調製。 a part containing (C) and a part containing (C) and (A) The (C) and other components which are further blended as needed can be prepared by uniform kneading by a mixing device such as a universal kneader or a kneader. Further, the portion containing (B) and the portion containing (B) and (A) can be prepared in the same manner as the first component by using (B) and other components which are further blended as needed.

步驟2A係積層另一方基材,透過硬化性聚 有機矽氧烷組成物貼合基材彼此之步驟。藉由步驟2A,可得到以第1製造方法製造之接著體。 Step 2A is to laminate the other substrate and pass the hardening polymerization. The step of adhering the organic siloxane composition to the substrates. By the step 2A, the adherend produced by the first production method can be obtained.

貼合基材彼此之方法係無特別限定,但可 舉例如在真空下貼合之方法及大氣壓下貼合之方法。又, 本發明中,存在於第1成分之(C)與存在於第2成分之(B)接觸後,以1秒至30分進行硬化,可發揮接著力。硬化時間係以1秒至20分為較佳,以1秒至15分為更佳。因此,步驟2A係必須在步驟1A後1秒至30分以內進行,但,步驟1A及步驟2A係可以連續步驟進行。 The method of bonding the substrates to each other is not particularly limited, but may be For example, a method of bonding under vacuum and a method of bonding under atmospheric pressure. also, In the present invention, (C) which is present in the first component and which is in contact with (B) which is present in the second component is cured in an amount of from 1 second to 30 minutes, and the adhesive force can be exhibited. The hardening time is preferably from 1 second to 20 minutes, more preferably from 1 second to 15 minutes. Therefore, step 2A must be performed within 1 second to 30 minutes after step 1A, but steps 1A and 2A can be performed in successive steps.

(第2製造方法) (Second manufacturing method)

本發明之第2製造方法係包含步驟1B至3B。 The second manufacturing method of the present invention includes steps 1B to 3B.

步驟1B係於一方基材之被接著面形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上部分的步驟。 Step 1B is formed on the surface of the substrate to be selected from the portion containing (B), the portion containing (B) and (A), the portion containing (C), and the portion containing (C) and (A). The step of two or more parts in the group formed.

於步驟1B所得之2個以上部分,係只要合併步驟1B所得之2個以上部分與步驟2B所得之1個以上部分的部分之組成為本發明之硬化性聚有機矽氧烷組成物之組成即可,並無特別限定。又,步驟1B所得之2個以上部分之組成亦可為本發明之硬化性聚有機矽氧烷組成物之組成。 The two or more portions obtained in the step 1B are composed of the two or more portions obtained in the step 1B and the one or more portions obtained in the step 2B, which are components of the curable polyorganosiloxane composition of the present invention. However, it is not particularly limited. Further, the composition of the two or more portions obtained in the step 1B may be the composition of the curable polyorganosiloxane composition of the present invention.

於步驟1B中,所形成之部分包含較佳者,如步驟1A所述。在步驟1B中,各部分較佳係以層所形成。因而,步驟1B較佳係為步驟1B-1:於一方基材之被接著面形成選自由含有(B)之層、包含(B)及(A)之層、包含(C)之層、以及包含(C)及(A)之層所構成之群中的2個以上之層而形成積層體之步驟。 In step 1B, the portion formed includes the preferred one, as described in step 1A. In step 1B, the portions are preferably formed in layers. Therefore, step 1B is preferably step 1B-1: forming a layer selected from the group consisting of (B), the layer containing (B) and (A), the layer containing (C), and The step of forming a layered body by including two or more layers in the group consisting of the layers (C) and (A).

步驟2B係於另一方基材之被接著面形成選自由含有(B)之部分、包含(B)及(A)之部分、包含(C)之部分、以及包含(C)及(A)之部分所構成之群中的1個以上部 分的步驟。 Step 2B is formed on the surface of the other substrate to be selected from the portion containing (B), the portion containing (B) and (A), the portion containing (C), and the inclusion of (C) and (A). One or more parts of the group The steps of the points.

在步驟2B中,所形成之部分包含較佳者,如在步驟1A所述。 In step 2B, the formed portion contains the preferred ones as described in step 1A.

在步驟2B中,各部分較佳係以層所形成。因而,步驟2B較佳係為步驟2B-1:於另一方基材之被接著面形成選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的1個以上之層,而形成積層體之步驟。 In step 2B, the portions are preferably formed in layers. Therefore, step 2B is preferably step 2B-1: forming a layer selected from the group consisting of (B), the layer containing (B) and (A), and the layer containing (C) on the surface of the other substrate. And a step of forming a layered body by including one or more layers of the group consisting of the layers (C) and (A).

在第2製造方法中,貼合時(C)與(B)接觸就 速硬化之觀點為較佳,故在步驟1B中於一方基材之接著面所形成之部分與於步驟2B中在另一方基材之接著面所形成部分之組,較佳為包含(C)之部分與包含(B)及(A)之部分之組、包含(C)及(A)之部分與包含(B)之部分之組、以及包含(C)及(A)之部分與包含(B)及(A)之部分之組。即,步驟1B最後所形成之部分及步驟2B最後所形成之部分之組,以前述之組為較佳。 In the second manufacturing method, the contact between (C) and (B) at the time of bonding is From the viewpoint of rapid hardening, it is preferable that the portion formed on the succeeding surface of one of the substrates in the step 1B and the portion formed on the succeeding surface of the other substrate in the step 2B preferably contain (C). And a part comprising (B) and (A), a part comprising (C) and (A) and a part comprising (B), and a part and inclusion comprising (C) and (A) ( Groups of parts B) and (A). That is, the group formed at the end of step 1B and the group formed at the end of step 2B are preferably the above groups.

進一步,於第2製造方法中,以較少步驟得 到所望之接著體,故步驟1B及步驟2B較佳係為步驟1B-2及步驟2B-2、以及步驟1B-3及步驟2B-3。此處,步驟1B-2係於一方基材之被接著面積層含有(C)之層,繼而積層含有(B)及(A)之層,得到積層體之步驟。步驟2B-2係於另一方基材之被接著面積層含有(C)之層而得到積層體之步驟。步驟1B-3係於一方基材之被接著面積層含有(B)及(A)之層,繼而積層含有(C)之層,得到積層體之步驟。步驟2B-3係 於另一方基材之被接著面積層含有(B)及(A)之層而得到積層體之步驟。 Further, in the second manufacturing method, the steps are obtained in a small number of steps. Steps 1B and 2B are preferably steps 1B-2 and 2B-2, and steps 1B-3 and 2B-3. Here, the step 1B-2 is a step of including the layer of (C) in the succeeding area layer of one of the base materials, and then laminating the layers of (B) and (A) to obtain a laminated body. Step 2B-2 is a step of obtaining a layered body by including a layer of (C) in the succeeding area layer of the other substrate. Step 1B-3 is a step of including the layers of (B) and (A) in the succeeding area layer of one of the base materials, and then laminating the layer containing (C) to obtain a laminated body. Step 2B-3 The step of obtaining the layered body by including the layers of (B) and (A) in the succeeding area layer of the other substrate.

例如,於步驟2B-2中,積層含有(C)之層, 繼而積層含有(B)及(A)之層時,含有(C)之層之塗佈厚度係以0.1至50μm為較佳,以0.1至30μm為更佳;含有(B)及(A)之層之塗佈厚度係以1至500μm為較佳,以10至300為更佳。又,步驟2B-2:於另一方基材之被接著面積層含有(C)之層時,含有(C)之層之塗佈厚度係以0.1至50μm為較佳,以0.1至30μm為更佳。 For example, in step 2B-2, the layer contains the layer of (C), When the layer containing (B) and (A) is laminated, the coating thickness of the layer containing (C) is preferably 0.1 to 50 μm, more preferably 0.1 to 30 μm, and (B) and (A) are contained. The coating thickness of the layer is preferably from 1 to 500 μm, more preferably from 10 to 300. Further, in the step 2B-2, when the layer of the (C) layer of the other substrate is contained, the coating thickness of the layer containing (C) is preferably 0.1 to 50 μm, more preferably 0.1 to 30 μm. good.

步驟3B係透過步驟1B所得之2個以上部 分及步驟2B所得之1個以上部分,將步驟1B及步驟2B所得之基材彼此貼合之步驟。藉由步驟3B,可得到依本發明之第2製造方法所製造之接著體。 Step 3B is the passage of two or more parts obtained in step 1B. And the step of bonding the substrates obtained in the steps 1B and 2B to each other in one or more portions obtained in the step 2B. By the step 3B, the adherend produced by the second manufacturing method of the present invention can be obtained.

使步驟3B中之基材彼此貼合之步驟,包含較佳者,如步驟2A所述。 The step of bringing the substrates in step 3B into contact with each other, preferably, is as described in step 2A.

第1及第2製造方法中,貼合基材彼此並使硬化、接著之步驟後,視情況亦可含有以50至80℃之溫度加熱的步驟。藉此,可更促進硬化,接著力更提高。加熱時間係可適宜設定,但可為例如0.1分至3小時。 In the first and second production methods, the substrates are bonded to each other and cured, and the subsequent steps may be followed by a step of heating at a temperature of 50 to 80 ° C as the case may be. Thereby, the hardening can be further promoted, and the force is further increased. The heating time can be suitably set, but can be, for example, 0.1 minute to 3 hours.

第1及第2製造方法係可用於圖像顯示裝置之製造方法。亦即,第1及第2製造方法中,較佳係一方基材為圖像顯示裝置具有圖像顯示部之基部,另一方基材為圖像顯示裝置之透光性之保護部,接著體為圖像顯示裝置。又,上述之較佳製造方法中,圖像顯示部之基部依需 要亦可於外周緣部設置防止組成物流出之高低差。 The first and second manufacturing methods are applicable to a method of manufacturing an image display device. In other words, in the first and second manufacturing methods, it is preferable that the substrate is an image display device having a base portion of the image display portion, and the other substrate is a light-transmitting protective portion of the image display device. It is an image display device. Moreover, in the above preferred manufacturing method, the base of the image display unit is on demand It is also possible to set the height difference at the outer peripheral edge portion to prevent the composition flow.

依本發明之製造方法所得之圖像顯示裝 置,具體上係可舉例如圖像顯示裝置為大型(50至100英寸)之電漿面板顯示器等,或圖像顯示裝置為小型(未達1至50英寸)之行動電話等。又,此等圖像顯示裝置係亦可含有觸控感測器。 Image display device obtained by the manufacturing method of the present invention Specifically, for example, the image display device is a large (50 to 100 inch) plasma panel display or the like, or the image display device is a small (less than 1 to 50 inch) mobile phone or the like. Moreover, these image display devices may also include a touch sensor.

<使用硬化性聚有機矽氧烷組成物之附硬化物的基材之製造方法> <Method for Producing Substrate with Cured Material Using Curable Polyorganosiloxane Mixture Composition>

本發明係亦有關附硬化物的基材之製造方法。本發明之附硬化物的基材之製造方法係包含:步驟1C:於基材上形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上部分,而形成硬化前之硬化性聚有機矽氧烷組成物的步驟。 The present invention is also directed to a method of producing a substrate to which a cured product is attached. The method for producing a cured substrate of the present invention comprises: Step 1C: forming a portion selected from the group containing (B), containing the portion (B) and (A), and containing the portion (C), on the substrate, And a step of forming a curable polyorganosiloxane composition before curing by forming two or more portions of the group consisting of the portions (C) and (A).

藉由使依步驟1C所得之硬化前之硬化性聚有機矽氧烷組成物硬化,可得到附硬化物之基材。又,步驟1C中之條件係如步驟1A所述。 By hardening the hardenable polyorganosiloxane composition before curing obtained in the step 1C, a substrate to which the cured product is obtained can be obtained. Again, the conditions in step 1C are as described in step 1A.

又,第1及第2製造方法中,可於被接著面之一部使用硬化性聚有機矽氧烷組成物而製造接著體。又,亦可於被接著面之一部使用硬化性聚有機矽氧烷組成物,残餘之部分使用與此組成物之組成相異之接著劑(例如反應性低之一劑型聚有機矽氧烷組成物接著劑)而製造接著體。從所得之硬化物的光學特性或接著性等性質的均一性之觀點,本發明之硬化性聚有機矽氧烷組成物所含有之 (A)及(B)及與此組成物之組成相異之接著劑所含有之含有烯基的聚有機矽氧烷及聚有機氫矽氧烷之間,較佳係前者之(A)與後者之含有烯基的聚有機矽氧烷為相同、前者之(B)與後者之聚有機氫矽氧烷為相同。 Further, in the first and second production methods, a cured polyorganosiloxane composition can be used in one of the adhesion faces to produce a laminate. Further, a curable polyorganosiloxane composition may be used in one part of the surface to be coated, and a residual portion may be used as an adhesive having a composition different from that of the composition (for example, a one-component polyorganosiloxane having a low reactivity) The alkane composition is an adhesive) to produce a binder. The curable polyorganosiloxane composition of the present invention contains the viewpoint of uniformity of properties such as optical properties or adhesion of the obtained cured product. (A) and (B) and an alkenyl group-containing polyorganosiloxane and a polyorganohydroquinone which are contained in an adhesive different from the composition of the composition, preferably the former (A) and The latter alkenyl group-containing polyorganosiloxane is the same, the former (B) is the same as the latter polyorganohydroquinone.

又,本發明係亦有關於上述之製造方法所 使用之組成物。具體上,本發明之組成物係用以貼合二個基材之接著劑,可使用來作為貼合包含上記步驟1A至2A之二個基材之接著劑。此處,步驟1A及步驟2A,包含較佳者均如上述。又,本發明之組成物係用以貼合二個基材之接著劑,可使用來作為貼合包含上記步驟1B至3B之二個基材之接著劑。此處,步驟1B至3B,包含較佳者均如上述。如此,本發明之組成物係可使用來作為貼合各種基材之接著劑。本發明之組成物較佳係用以貼合陰極射線管、液晶、電漿、有機EL等圖像顯示裝置之圖像顯示部的基部與透光性之保護部之接著劑。 Moreover, the present invention is also related to the above manufacturing method. The composition used. Specifically, the composition of the present invention is an adhesive for bonding two substrates, and can be used as an adhesive for bonding the two substrates of the above steps 1A to 2A. Here, steps 1A and 2A, including the preferred ones, are as described above. Further, the composition of the present invention is an adhesive for bonding two substrates, and can be used as an adhesive for bonding the two substrates of the above steps 1B to 3B. Here, steps 1B to 3B, including the preferred ones, are as described above. Thus, the composition of the present invention can be used as an adhesive for bonding various substrates. The composition of the present invention is preferably used for bonding an adhesive of a base portion of an image display portion of an image display device such as a cathode ray tube, a liquid crystal, a plasma, or an organic EL to a light-transmitting protective portion.

於組成物中,存在於第1成分之(C)與存在 於第2成分之(B)接觸後,以室溫(例如20至25℃)進行硬化,而發揮接著力。亦即,組成物係使第1成分及第2成分於分別相異之容器中直接貯存,使用時可藉由使此等接觸而使之開始硬化。又,組成物係因含有(A),故第1成分與第2成分之組,排除第1成分含有(C)之部分、第2成分含有(B)之部分時。 In the composition, it exists in the first component (C) and exists After the contact of (B) of the second component, it is hardened at room temperature (for example, 20 to 25 ° C) to exert an adhesive force. That is, the composition allows the first component and the second component to be directly stored in separate containers, and can be hardened by contact with each other during use. Moreover, since the composition contains (A), the group of the first component and the second component excludes the portion containing the component (C) and the component containing the component (B).

[實施例] [Examples]

其次,舉出實施例及比較例,進一步詳細 說明本發明。但,本發明係不受此等實施例限定者。以表1至表3所示之組成,使各成分混合,藉此調製實施例及比較例之由第1成分及第2成分所構成之組成物。 Next, examples and comparative examples will be given, and further details will be given. The invention is illustrated. However, the invention is not limited by the embodiments. The components shown in Tables 1 to 3 were mixed, and the components composed of the first component and the second component of the examples and the comparative examples were prepared.

所使用之各成分係如以下所述。 The components used are as follows.

A1:兩末端被二甲基乙烯基矽氧烷單元封閉、中間單元為二甲基矽氧烷單元所構成之聚甲基乙烯基矽氧烷(23℃之黏度82,000cP) A1: Polymethylvinyl decane consisting of dimethyl methoxy siloxane units at both ends and a dimethyl methoxy siloxane unit in the middle unit (viscosity of 82,000 cP at 23 ° C)

A2:兩末端被二甲基乙烯基矽氧烷單元封閉、中間單元為二甲基矽氧烷單元所構成之聚甲基乙烯基矽氧烷(23℃之黏度420cP) A2: polymethylvinyl fluorene (blocky at 420 cP) composed of dimethyl methoxide units and dimethyl methoxy siloxane units at the ends.

A3:兩末端被二甲基乙烯基矽氧烷單元封閉、中間單元為二甲基矽氧烷單元所構成之聚甲基乙烯基矽氧烷(23℃之黏度15cP) A3: Polymethylvinyl decane consisting of dimethyl methoxide units at the two ends and a dimethyl methoxy siloxane unit in the middle unit (viscosity of 15 cP at 23 ° C)

B1:平均單元式為[H(CH3)2SiO1/2]8[SiO4/2]4(氫量1.05重量%) B1: The average unit formula is [H(CH 3 ) 2 SiO 1/2 ] 8 [SiO 4/2 ] 4 (hydrogen amount: 1.05 wt%)

B2:兩末端被二甲基氫矽氧烷單元封閉、中間單元為二甲基矽氧烷單元所構成之聚甲基氫矽氧烷(23℃之黏度20cP) B2: Polymethylhydroquinone (blocky at 20 ° C) composed of dimethyl hydrooxane units and an intermediate unit of dimethyl methoxy olefin units at both ends

C:使氯化鉑酸與1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷以莫耳比1:4加熱而得、鉑含量為4.91重量%之錯合物。 C: The chloroplatinic acid and 1,3-divinyl-1,1,3,3-tetramethyldioxane are heated at a molar ratio of 1:4, and the platinum content is 4.91% by weight. Compound.

E1:兩末端被三甲基矽氧烷單元封閉、中間單元為二甲基矽氧烷單元所構成之聚甲基矽氧烷(23℃之黏度100cP) E1: Polymethyl oxirane composed of a dimethyl methoxyoxane unit at both ends and a dimethyl methoxy siloxane unit at the end (viscosity of 100 cP at 23 ° C)

F1:3-甲基丙烯醯氧基丙基三甲氧基矽烷 F1: 3-methacryloxypropyltrimethoxydecane

<實施例1至14、比較例1至4> <Examples 1 to 14, Comparative Examples 1 to 4>

物性之評估係如下述進行。 The evaluation of physical properties was carried out as follows.

(1)黏度 (1) Viscosity

使用旋轉黏度計(Bismetron VDA-L)(芝浦system股份公司製),測定23℃之黏度。 The viscosity at 23 ° C was measured using a rotational viscometer (Bismetron VDA-L) (manufactured by Shibaura Systems Co., Ltd.).

(2)暫時固定時間 (2) Temporary fixed time (實施例1至12、比較例1至4) (Examples 1 to 12, Comparative Examples 1 to 4)

使用2片平行板(厚度1mm、直徑25mm、鋁製)作為基材。於第1基材之全面以成為第1成分塗布厚度之量塗布第1成分,於第2基材之全面以成為第1成分塗布厚度之量塗布第1成分。繼而,於塗佈有第1成分之第2基材上以使第2成分成為塗布厚度之量塗布第2成分。使第2成分塗佈於第2基材上之後,使第1基材與第2基材透過第1成分及第2成分、以第1成分及第2成分之合計厚度成為180μm之方式貼合,得到第1基材及第2基材之貼合體。得到貼合體之後,立即開始進行暫時固定時間之測定。 Two parallel plates (thickness: 1 mm, diameter: 25 mm, made of aluminum) were used as the substrate. The first component is applied to the total thickness of the first component, and the first component is applied to the total thickness of the first component. Then, the second component is applied to the second substrate to which the first component is applied so that the second component is applied to the coating thickness. After the second component is applied to the second substrate, the first substrate and the second substrate are passed through the first component and the second component, and the total thickness of the first component and the second component is 180 μm. A laminate of the first substrate and the second substrate is obtained. Immediately after the obtained bonded body was obtained, the measurement of the temporary fixation time was started.

暫時固定時間之測定係25℃中、以頻率10Hz、變形2%、使用黏弾性測定裝置(TA Instrument Japan股份公司製ARES)而進行。貯存弾性率達到150Pa之時間設為暫時固定時間。 The measurement of the temporary fixed time was carried out at 25 ° C at a frequency of 10 Hz and a deformation of 2% using a viscosity measuring device (ARES manufactured by TA Instrument Japan Co., Ltd.). The time during which the storage inertness rate reaches 150 Pa is set as a temporary fixed time.

(實施例13至14) (Examples 13 to 14)

使用2片平行板(厚度1mm、直徑25mm、鋁製)作 為基材。於第1基材之全面以成為第1成分塗布厚度之量塗布第1成分,於第2基材之全面以成為第2成分塗布厚度之量塗布第2成分。使第1基材與第2基材透過第1成分及第2成分、而第1成分及第2成分之合計厚度成為180μm之方式貼合,得到第1基材及第2基材之貼合體。得到貼合體之後,立即開始進行暫時固定時間之測定。暫時固定時間之測定係與上述相同。 Use two parallel plates (thickness 1mm, diameter 25mm, aluminum) As a substrate. The first component is applied to the total thickness of the first component, and the second component is applied to the total thickness of the second component as the coating thickness of the second component. The first base material and the second base material are passed through the first component and the second component, and the total thickness of the first component and the second component is 180 μm, thereby obtaining a bonded body of the first base material and the second base material. . Immediately after the obtained bonded body was obtained, the measurement of the temporary fixation time was started. The measurement of the temporary fixed time is the same as described above.

(3)黃變指數 (3) Yellowing index (實施例1至12、比較例1至4) (Examples 1 to 12, Comparative Examples 1 to 4)

使用玻璃板2片(5cm×5cm×1mm厚)作為基材。使第1成分於第1基材之全面及第2基材之全面以成為第1成分塗布厚度之量塗布。繼而,於塗佈有第1成分之第1基材上,使第2成分以成為第2成分塗布厚度之量塗布。使第2成分塗布於第1基材上之後,立即於25℃中使第1基材與第2基材藉由預先配置於基材之間隔物,以第1成分及第2成分之合計厚度成為180μm之方式,透過第1成分及第2成分貼合,得到第1基材及第2基材之貼合體。使貼合體於25℃中熱處理30分鐘、70℃中熱處理30分鐘,透過第1成分及第2成分之硬化物,得到第1基材及第2基材被接著之接著體。使接著體返回25℃之狀態後,測定變色程度指標的黃變指數。黃變指數之測定係使用分光測試計((股)Minolta製CM-3500d)進行。 Two sheets (5 cm × 5 cm × 1 mm thick) of a glass plate were used as the substrate. The entire composition of the first component and the entire surface of the second substrate are applied in an amount to be the thickness of the first component coating. Then, the second component is applied to the first substrate coated with the first component in an amount to be applied to the thickness of the second component. Immediately after applying the second component to the first substrate, the first substrate and the second substrate are placed on the spacer of the substrate in advance at 25 ° C, and the total thickness of the first component and the second component is In the form of 180 μm, the first component and the second component are bonded together to obtain a bonded body of the first substrate and the second substrate. The bonded body was heat-treated at 25 ° C for 30 minutes, heat-treated at 70 ° C for 30 minutes, and the cured product of the first component and the second component was passed through to obtain a first substrate and a second substrate. After returning the adherend to a state of 25 ° C, the yellowing index of the discoloration degree index was measured. The yellowing index was measured using a spectrophotometer (CM-3500d manufactured by Minolta).

(實施例13至14) (Examples 13 to 14)

使用玻璃板2片(5cm×5cm×1mm厚)作為基材。使第 1成分於第1基材之全面以成為第1成分塗布厚度之量塗布,使第2成分於第2基材之全面以成為第2成分塗布厚度之量塗布。在25℃中,藉由預先配置於基材之間隔物,以第1成分及第2成分之合計厚度成為180μm之方式,於第1基材上貼合第2基材,得到第1基材及第2基材之貼合體。使貼合體於25℃中熱處理30分鐘、70℃中熱處理30分鐘,透過第1成分及第2成分之硬化物,得到第1基材及第2基材被接著之接著體。使接著體返回25℃之狀態後,測定黃變指數。黃變指數之測定係與上述相同。 Two sheets (5 cm × 5 cm × 1 mm thick) of a glass plate were used as the substrate. Make the first The first component is applied to the entire thickness of the first substrate in an amount to be applied as the thickness of the first component, and the second component is applied to the entire thickness of the second substrate in an amount to be applied as the thickness of the second component. At 25 ° C, the second substrate is bonded to the first substrate so that the first substrate and the second component have a total thickness of 180 μm, and the first substrate is obtained. And a bonding body of the second substrate. The bonded body was heat-treated at 25 ° C for 30 minutes, heat-treated at 70 ° C for 30 minutes, and the cured product of the first component and the second component was passed through to obtain a first substrate and a second substrate. After the adherend was returned to a state of 25 ° C, the yellowing index was measured. The yellowing index is determined in the same manner as described above.

(4)穿透率 (4) penetration rate

有關實施例1至14及比較例1至4,以與上述「(3)黃變指數」之相同方法製作接著體。對於接著體,使用分光測試計((株)Minolta製CM-3500d)測定作為透明程度指標之在波長400nm之穿透率。 With respect to Examples 1 to 14 and Comparative Examples 1 to 4, a laminate was produced in the same manner as in the above "(3) Yellowing Index". For the adherend, a transmittance at a wavelength of 400 nm as an index of transparency was measured using a spectroscopic tester (CM-3500d manufactured by Minolta Co., Ltd.).

結果整理於表中。又,在黃變指數、穿透率之測定中,第1成分及第2成分之硬化物之厚度、亦即硬化性聚有機矽氧烷組成物之硬化物之厚度係180μm。 The results are organized in a table. Further, in the measurement of the yellowing index and the transmittance, the thickness of the cured product of the first component and the second component, that is, the thickness of the cured product of the curable polyorganosiloxane composition is 180 μm.

在實施例中,可知若使第1成分及第2成分接觸,任一者均顯示優異的快速硬化性。從此等,若依本發明,硬化反應中不須使用放射線或加熱裝置等特別的裝置,紫外線不穿透之構件或缺乏耐熱性之構件亦可貼合,且不受濕氣等外部環境之影響而可硬化反應,可製造含有 二個基材之接著體。另外,比較例係硬化性聚有機矽氧烷組成物未滿足本發明之規定者。比較例2之硬化物係穿透率低,透明性差。尚且,比較例2之硬化物係黃變指數高,且變色顯著。又,比較例1、3及4係至發揮硬化性及接著性為止經過30分鐘以上。 In the examples, it was found that any of the first component and the second component showed excellent rapid hardenability. From this, according to the present invention, it is not necessary to use a special device such as a radiation or a heating device in the hardening reaction, and members which are not penetrated by ultraviolet rays or members which lack heat resistance can be attached and are not affected by external environment such as moisture. Hardenable reaction, can be made to contain A bond of two substrates. Further, the comparative example hardenable polyorganosiloxane composition does not satisfy the requirements of the present invention. The cured product of Comparative Example 2 had a low transmittance and was inferior in transparency. Further, the cured product of Comparative Example 2 had a high yellowing index and marked discoloration. Further, Comparative Examples 1, 3 and 4 were passed for 30 minutes or more until the curability and the adhesion were exhibited.

[產業上之利用可能性] [Industry use possibility]

本發明之硬化性聚有機矽氧烷組成物之硬化物、及使用硬化性聚有機矽氧烷組成物之接著體之製造方法,係可用於各種基材之接著、尤其陰極射線管、液晶、電漿、有機EL等圖像顯示裝置之具有圖像顯示部之基部與透光性之保護部之接著。 The cured product of the curable polyorganosiloxane composition of the present invention and the method for producing the adhesive using the curable polyorganosiloxane composition can be used for various substrates, especially cathode ray tubes, liquid crystals, An image display device such as a plasma or an organic EL has a base portion of an image display portion and a light-transmitting protective portion.

Claims (17)

一種硬化性聚有機矽氧烷組成物之硬化物,係含有:(A)於分子中含有2個以上烯基的含烯基聚有機矽氧烷;(B)於分子中具有2個以上鍵結於矽原子之氫原子的聚有機氫矽氧烷;及(C)鉑系觸媒;相對於(A)之烯基的個數ViA,鍵結於(B)之矽原子的氫原子個數HB之比為0.5至100,就鉑系金屬原子而言,(C)為0.5至1,000ppm;其中,硬化前之組成物包含選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上之部分。 A cured product of a curable polyorganosiloxane composition comprising: (A) an alkenyl group-containing polyorganosiloxane having two or more alkenyl groups in a molecule; (B) having two or more bonds in a molecule Vi a hydrogen atom with respect to the number (a) of the alkenyl groups, bonded to (B) of the silicon atom; a hydrogen atom at the junction of the silicon atoms in silicon polyorganohydrogen siloxane; and (C) a platinum-based catalyst The ratio of the number H B is from 0.5 to 100, and in the case of a platinum-based metal atom, (C) is from 0.5 to 1,000 ppm; wherein the composition before hardening comprises a portion selected from the group containing (B), containing (B) and Part of (A), part containing (C), and two or more of the group consisting of (C) and (A). 如申請專利範圍第1項所述之硬化性聚有機矽氧烷組成物之硬化物,其中,硬化前之組成物為包含有選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層 所構成之群中的2層以上之積層體。 The cured product of the curable polyorganosiloxane composition according to claim 1, wherein the composition before hardening comprises a layer selected from the group consisting of (B), and (B) and (A) Layer, layer containing (C), and layer containing (C) and (A) Two or more layers of the formed group. 如申請專利範圍第1或2項所述之硬化性聚有機矽氧烷組成物之硬化物,其中,硬化前之組成物為包含有選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的3層以上之積層體。 The cured product of the curable polyorganosiloxane composition according to claim 1 or 2, wherein the composition before hardening comprises a layer selected from the group consisting of (B), containing (B) and A layer of A), a layer containing (C), and a laminate of three or more layers including the layers of (C) and (A). 如申請專利範圍第1至3項中任一項所述之硬化物,其中,硬化前之組成物為含有(B)及(A)之層與含有(C)之層交互積層之積層體。 The cured product according to any one of claims 1 to 3, wherein the composition before hardening is a laminate comprising a layer of (B) and (A) and an interlayer of (C). 如申請專利範圍第1至4項中任一項所述之硬化物,其中,硬化前之組成物為於兩端具有含有(C)之層的積層體。 The cured product according to any one of claims 1 to 4, wherein the composition before hardening is a laminate having a layer containing (C) at both ends. 如申請專利範圍第1至4項中任一項所述之硬化物,其中,硬化前之組成物為於兩端具有含有(B)及(A)之層的積層體。 The cured product according to any one of claims 1 to 4, wherein the composition before hardening is a laminate having layers including (B) and (A) at both ends. 一種附硬化物之基材,其係於1個基材上具有如申請專利範圍第1至6項中任一項所述之硬化物。 A cured substrate comprising a cured product according to any one of claims 1 to 6 on a substrate. 一種含有二個基材之接著體,係透過如申請專利範圍第 1至6項中任一項所述之硬化物接著二個基材。 An adhesive body comprising two substrates, which is passed through the scope of the patent application The hardened material according to any one of items 1 to 6 is followed by two substrates. 一種含有二個基材之接著體的製造方法,該接著體係使用了硬化性聚有機矽氧烷組成物,且該硬化性聚有機矽氧烷組成物包含:(A)於分子中含有2個以上烯基的含烯基聚有機矽氧烷;(B)於分子中具有2個以上鍵結於矽原子之氫原子的聚有機氫矽氧烷;及(C)鉑系觸媒;相對於(A)之烯基的個數ViA,鍵結於(B)之矽原子的氫原子個數HB之比為0.5至100,就鉑系金屬原子而言,(C)為0.5至1,000ppm;該製造方法包含:步驟1A:於一方基材的被接著面,形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的2個以上之部分,而形成硬化前之硬化性聚有機矽氧烷組成物的步驟;及步驟2A:積層另一方基材,透過硬化性聚有機矽氧烷組成物,使基材彼此貼合之步驟。 A method for producing a binder comprising two substrates, wherein the binder system comprises a curable polyorganosiloxane composition, and the curable polyorganosiloxane composition comprises: (A) two molecules in the molecule An alkenyl group-containing polyorganosiloxane having the above alkenyl group; (B) a polyorganohydrohalooxane having two or more hydrogen atoms bonded to a deuterium atom in the molecule; and (C) a platinum-based catalyst; The number of alkenyl groups (A), Vi A , the ratio of the number of hydrogen atoms bonded to the atom of (B), H B , is from 0.5 to 100, and in the case of platinum-based metal atoms, (C) is from 0.5 to 1,000. Ppm; the manufacturing method comprises the following steps: Step 1A: forming a portion selected from the group containing (B), containing (B) and (A), containing (C), and containing a step of forming a hardened polyorganosiloxane composition before curing by forming two or more of the groups consisting of parts C) and (A); and step 2A: laminating the other substrate to pass the hardenability The polyorganosiloxane composition is a step of bonding the substrates to each other. 如申請專利範圍第9項所述之製造方法,其中,步驟1A為步驟1A-1:於一方基材的被接著面,積層選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的2層以上,而形成硬 化性聚有機矽氧烷組成物之積層體的步驟。 The manufacturing method according to claim 9, wherein the step 1A is the step 1A-1: the surface of the substrate is selected from the layer containing the layer (B), and the layer (B) and (A) are contained. The layer, the layer containing (C), and the layer containing the layers of (C) and (A) are two or more layers to form a hard A step of laminating a polyorganosiloxane composition. 如申請專利範圍第9項所述之製造方法,其中,步驟1A為步驟1A-2:於一方基材的被接著面,依序積層含有(C)之層、含有(B)及(A)之層、含有(C)之層的3層,而形成硬化性聚有機矽氧烷組成物之積層體的步驟。 The manufacturing method according to claim 9, wherein the step 1A is the step 1A-2: the layer containing the layer (C) and the layers (B) and (A) are sequentially laminated on the surface of the substrate of one of the substrates. The layer and the three layers containing the layer (C) form a layered body of the curable polyorganosiloxane composition. 如申請專利範圍第9項所述之製造方法,其中,步驟1A為步驟1A-3:於一方基材的被接著面,依序積層含有(B)及(A)之層、含有(C)之層、以及含有(B)及(A)之層的3層,而形成硬化性聚有機矽氧烷組成物之積層體的步驟。 The manufacturing method according to claim 9, wherein the step 1A is the step 1A-3: layer (B) and (A) are sequentially laminated on the surface to be joined of one of the substrates, and (C) is contained. The layer and the three layers including the layers of (B) and (A) form a layered body of the curable polyorganosiloxane composition. 一種含有二個基材之接著體的製造方法,該接著體係使用了硬化性聚有機矽氧烷組成物,且該硬化性聚有機矽氧烷組成物含有:(A)於分子中含有2個以上烯基的含烯基聚有機矽氧烷;(B)於分子中具有2個以上鍵結於矽原子之氫原子的聚有機氫矽氧烷;及(C)鉑系觸媒;相對於(A)之烯基的個數ViA,鍵結於(B)之矽原子的氫原子個數HB之比為0.5至100,就鉑系金屬原子而言,(C)為0.5至1,000ppm;該製造方法包含步驟1B:於一方基材的被接著面,形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、 以及含有(C)及(A)之部分所構成之群中的2個以上之部分的步驟;步驟2B:於另一方基材的被接著面,形成選自由含有(B)之部分、含有(B)及(A)之部分、含有(C)之部分、以及含有(C)及(A)之部分所構成之群中的1個以上之部分的步驟;以及步驟3B:透過步驟1B所得之2個以上的部分及步驟2B所得之1個以上的部分,使步驟1B及步驟2B所得之基材彼此貼合的步驟;步驟1B所得之部分及步驟2B所得之部分的合併部分之組成為硬化性聚有機矽氧烷組成物之組成。 A method for producing a binder comprising two substrates, wherein the binder system comprises a curable polyorganosiloxane composition, and the curable polyorganosiloxane composition comprises: (A) two molecules in the molecule An alkenyl group-containing polyorganosiloxane having the above alkenyl group; (B) a polyorganohydrohalooxane having two or more hydrogen atoms bonded to a deuterium atom in the molecule; and (C) a platinum-based catalyst; The number of alkenyl groups (A), Vi A , the ratio of the number of hydrogen atoms bonded to the atom of (B), H B , is from 0.5 to 100, and in the case of platinum-based metal atoms, (C) is from 0.5 to 1,000. The manufacturing method includes the step 1B of forming a portion selected from the group containing (B), the portion containing (B) and (A), the portion containing (C), and containing (C) on the surface to be bonded of one of the substrates. And a step of two or more of the groups consisting of the parts of (A); and the step 2B: forming the selected surface of the other substrate from the surface containing (B), containing (B) and a part of A), a part containing (C), and a part containing one or more of the groups consisting of (C) and (A); and Step 3B: two or more obtained by the step 1B And a step of bonding the substrates obtained in the step 1B and the step 2B to each other in part and the one or more portions obtained in the step 2B; the portion obtained in the step 1B and the combined portion of the portion obtained in the step 2B are the curable polyorganoindene The composition of the oxyalkylene composition. 如申請專利範圍第13項所述之製造方法,其中,步驟1B係步驟1B-1:於一方基材的被接著面,形成選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的2個以上之層,而形成積層體的步驟;步驟2B係步驟2B-1:於另一方基材的被接著面,形成選自由含有(B)之層、含有(B)及(A)之層、含有(C)之層、以及含有(C)及(A)之層所構成之群中的1個以上之層,而形成積層體的步驟。 The manufacturing method according to claim 13, wherein the step 1B is the step 1B-1: forming a layer selected from the group consisting of (B), containing (B) and (A) a layer, a layer containing (C), and a layer containing two or more layers of the layers (C) and (A) to form a layered body; and Step 2B is a step 2B-1: The surface of the base material of one of the substrates is formed of a layer containing (B), a layer containing (B) and (A), a layer containing (C), and a layer containing (C) and (A). A step of forming a layered body by forming one or more layers in the group. 如申請專利範圍第13或14項所述之製造方法,其中,步驟1B係步驟1B-2:於一方基材的被接著面,積層含有(C)之層,然後積層含有(B)及(A)之層,而得到積層體的步驟; 步驟2B係步驟2B-2:於另一方基材的被接著面,積層含有(C)之層,而得到積層體的步驟。 The manufacturing method according to claim 13 or 14, wherein the step 1B is the step 1B-2: the layer of the layer (C) is laminated on the surface of the substrate, and then the layer contains (B) and a layer of A), and the step of obtaining a layered body; Step 2B is a step 2B-2: a step of laminating the layer containing (C) on the succeeding surface of the other substrate to obtain a laminate. 如申請專利範圍第13或14項所述之製造方法,其中,步驟1B係步驟1B-3:於一方基材的被接著面,積層含有(B)及(A)之層,然後積層含有(C)之層,而得到積層體的步驟;步驟2B係步驟2B-3:於另一方基材的被接著面,積層含有(B)及(A)之層,而得到積層體的步驟。 The manufacturing method according to claim 13 or 14, wherein the step 1B is the step 1B-3: the layer of the substrate (B) and (A) is laminated on the surface of the substrate, and then the layer is contained ( Step CB: Step 2B-3: Step 2B-3: a step of laminating the layers of (B) and (A) on the succeeding surface of the other substrate to obtain a laminate. 如申請專利範圍第9至16項中任一項所述之製造方法,其中,一方之基材為具有圖像顯示裝置之圖像顯示部的基部,另一方之基材為圖像顯示裝置之透光性的保護部,接著體為圖像顯示裝置。 The manufacturing method according to any one of claims 9 to 16, wherein one of the base materials is a base portion having an image display portion of the image display device, and the other substrate is an image display device. The translucent protective portion is followed by an image display device.
TW103134735A 2013-10-04 2014-10-03 Cured product of curable polyorganosiloxane composition, adhered body using the curable polyorganosiloxane composition, method for producing the adhered body using the curable polyorganosiloxane composition, and use thereof TW201527474A (en)

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