TW201526295A - Method for packaging light emitting diode - Google Patents

Abstract

A method for packaging light emitting diodes includes steps: providing an adhesive film layer and arranging a plurality of light emitting diode chips on the adhesive film layer; two electrodes of each light emitting diode chip positioning on the film layer; forming an encapsulating layer on the adhesive film layer to cover the light emitting diode chips; defining a cutting path via cutting the encapsulating layer between each two adjacent light emitting diode chips and obtaining a light emitting diode element between each two adjacent cutting path, the light diode element includes a light emitting diode chips and an encapsulating layer which covering the light emitting diode chip; removing the film layer and obtaining a plurality of individual light diode elements.

Description

Light emitting diode packaging method

The present invention relates to a semiconductor light emitting device packaging method, and more particularly to a light emitting diode packaging method.

Compared with the conventional light source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution, long life, etc., and as a new type of light source, it has been more and more Applied to various fields, such as street lights, traffic lights, signal lights, spot lights and decorative lights.

A conventional light emitting diode package structure generally includes a lead frame having a metal conductive line and a reflective cup structure, a light emitting diode chip disposed in the reflective cup structure of the lead frame and electrically connected to the metal conductive line, and a filling A package within the reflective cup structure and covering the light emitting diode chip. When manufacturing the light-emitting diode package structure, a conductive copper plate is usually prepared in advance, and then a poly(p-phenylene terephthalamide) (PPA) plastic is injection-molded by an insert molding process, so that the conductive copper plate is embedded in the PPA plastic to form The lead frame of the reflective cup structure is then placed into the reflective cup structure and electrically connected to the conductive copper plate, and finally the encapsulating material is filled into the reflective cup structure and the encapsulating material is cured to form a package.

In the manufacturing method, the step of "embedding the light-emitting diode crystal grains into the reflective cup structure" requires alignment of the light-emitting diode crystal grains with the conductive copper plate, which takes time and affects production efficiency.

In view of this, it is necessary to provide a high efficiency LED package method.

A method for packaging a light-emitting diode, comprising the steps of: providing a viscous film layer and disposing a plurality of light-emitting diode grains on the film layer, and two electrodes of each of the light-emitting diode grains All are disposed on the film layer; in the second step, an encapsulation layer is formed on the film layer and the encapsulation layer covers the plurality of light emitting diode grains; and the third step is in every two adjacent light emitting diodes Cutting the encapsulation layer between the body grains to form a dicing street, the plurality of dicing streets penetrating the encapsulation layer and stopping at the film layer, thereby forming a light-emitting diode unit between each two adjacent dicing streets, each of the light-emitting diodes The body unit includes a light emitting diode die and an encapsulation layer covering the light emitting diode die; and in the fourth step, the thin film layer is removed to obtain a plurality of separate light emitting diode units.

Compared with the prior art, the above packaging method uses a thin film layer to support the light emitting diode die, and then the package layer is disposed, without using the lead frame in the prior art, and the light emitting diode can be avoided in the conventional packaging technology. The circuit structure of the lead frame performs time-consuming processing of the bit, and simplifies the package structure of the light-emitting diode and reduces the cost.

FIG. 1 to FIG. 6 are schematic diagrams of a method for packaging a light emitting diode according to an embodiment of the present invention.

FIG. 7 is a schematic structural diagram of a light emitting diode unit produced by the LED package method according to an embodiment of the present invention.

The LED package method provided by the embodiment of the invention includes the following steps.

In the first step, referring to FIG. 1 and FIG. 2, a viscous film layer 20 is provided and a plurality of light-emitting diode dies 12 are disposed on the film layer 20, and two electrodes of each of the light-emitting diode dies 12 are provided. 120 and 122 are all attached to the film layer 20.

In this embodiment, the thin film layer 20 is a UV film or a polyimide film, and the plurality of light emitting diode grains 12 are disposed on the thin film layer 20 by flip chip.

In the second step, referring to FIG. 3, an encapsulation layer 11 is formed on the thin film layer 20 and the encapsulation layer 11 covers the plurality of light emitting diode crystal grains 12.

The encapsulating layer 11 may be mixed with phosphor powder to emit light different from the emission wavelength of the LED dipole 12 under the light excitation of the LED dipole 12, thereby mixing light to obtain light of a desired color. In this embodiment, the encapsulation layer 11 may be covered with the first thin film layer 20 by using a method of spreading, printing, compression molding or transfer molding. On the surface of the die 12.

In the third step, referring to FIG. 4 and FIG. 5, the encapsulation layer 11 is cut between each two adjacent LED dipoles 12 to form a dicing street 13, and the plurality of dicing streets 13 penetrate the encapsulation layer 11 and stop at the film. a layer 20, such that a light-emitting diode unit 10 is formed between each two adjacent dicing streets 13, each of the light-emitting diode units 10 including a light-emitting diode die 12 and covering the light-emitting diode die 12 encapsulation layer 11.

In the present embodiment, the encapsulation layer 11 is cut away along the position shown by the broken line in FIG. 4 up to the upper surface 200 of the first film layer 20, thereby forming the dicing street 13 above the upper surface 200 without cutting into the first film layer. 20, as shown in Figure 5.

Fourth, referring to FIG. 6, the thin film layer 20 is removed to obtain a plurality of separate light emitting diode units 10.

When the film layer 20 is a UV film, the UV film may be irradiated with UV light to reduce the viscosity, and then the film layer 20 is peeled off to obtain the light-emitting diode unit 10 as shown in FIG.

Compared with the prior art, the above packaging method uses the thin film layer 20 to support the light emitting diode die 12, and then the package layer 11 is disposed, without using the lead frame in the conventional technology, and can avoid the light emitting diode in the conventional packaging technology. The circuit structure of the body and the lead frame performs time-consuming processing of the bit, and simplifies the package structure of the light-emitting diode and reduces the cost.

It is to be understood that those skilled in the art can make various other changes and modifications in accordance with the technical concept of the present invention, and all such changes and modifications are intended to fall within the scope of the appended claims.

10‧‧‧Lighting diode unit

11‧‧‧Encapsulation layer

12‧‧‧Light-emitting diode grains

120, 122‧‧‧ electrodes

13‧‧‧ cutting road

20‧‧‧film layer

200‧‧‧ upper surface

10‧‧‧Lighting diode unit

11‧‧‧Encapsulation layer

12‧‧‧Light-emitting diode grains

120, 122‧‧‧ electrodes

13‧‧‧ cutting road

20‧‧‧film layer

200‧‧‧ upper surface

10‧‧‧Lighting diode unit

no

10‧‧‧Lighting diode unit

11‧‧‧Encapsulation layer

12‧‧‧Light-emitting diode grains

20‧‧‧film layer

Claims (4)

A light emitting diode packaging method includes the following steps:
In the first step, a viscous film layer is provided and a plurality of luminescent diode dies are disposed on the film layer, and two electrodes of each illuminating diode die are attached on the film layer;
In the second step, an encapsulation layer is formed on the thin film layer and the encapsulation layer covers the plurality of light emitting diode crystal grains;
In the third step, the encapsulation layer is cut between each two adjacent LED dies to form a dicing street, and the plurality of dicing streets penetrate the encapsulation layer and stop at the film layer, so that each two adjacent dicing streets Forming a light emitting diode unit, each light emitting diode unit includes a light emitting diode die and an encapsulating layer covering the light emitting diode die;
In the fourth step, the thin film layer is removed to obtain a plurality of separate light emitting diode units. The method of claim 2, wherein the film layer is a UV film or a polyimide film. The method of claim 2, wherein the first step comprises disposing a plurality of light-emitting diode dies on the thin film layer by flip chip. The method of claim 2, wherein the second step is to cover the film layer with a light-emitting diode by coating, printing, laminating or mold-transforming. On the surface of the grain.