TW201525404A - Heat dissipating fin and heat dissipating device - Google Patents
Heat dissipating fin and heat dissipating device Download PDFInfo
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- TW201525404A TW201525404A TW102146943A TW102146943A TW201525404A TW 201525404 A TW201525404 A TW 201525404A TW 102146943 A TW102146943 A TW 102146943A TW 102146943 A TW102146943 A TW 102146943A TW 201525404 A TW201525404 A TW 201525404A
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- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 claims description 82
- 210000003739 neck Anatomy 0.000 claims description 28
- 230000001154 acute effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 4
- 239000002918 waste heat Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本案關於一種散熱鰭片,特別是有關於一種應用於散熱裝置的散熱鰭片。 The present invention relates to a heat dissipating fin, and more particularly to a heat dissipating fin applied to a heat dissipating device.
一般的電子裝置於運作時皆會產生廢熱,為了避免大量廢熱累積於電子裝置而造成工作溫度升高進而影響電子裝置的效能,因此一般電子裝置均需配設一個散熱裝置。 In general, electronic devices generate waste heat during operation. In order to prevent a large amount of waste heat from accumulating in the electronic device and causing an increase in operating temperature and thus affecting the performance of the electronic device, a general heat sink is required for the electronic device.
傳統的散熱裝置,至少包括一接觸熱源的基板、複數鰭片以及連接於該基板上並穿設各鰭片的熱管,透過基板將電子裝置的廢熱傳遞至熱管上,再經由熱管將廢熱傳遞至各鰭片上,以達成散熱的目的。 The conventional heat dissipating device includes at least a substrate contacting the heat source, a plurality of fins, and a heat pipe connected to the substrate and piercing the fins, transmitting waste heat of the electronic device to the heat pipe through the substrate, and transmitting the waste heat to the heat pipe through the heat pipe On each fin to achieve the purpose of heat dissipation.
然而,傳統散熱裝置的鰭片與熱管組裝時,多先將複數個鰭片間隔設置後,再利用沖床模具將熱管直接與該些散熱鰭片沖壓以結合。此種作法的缺點在於,單方向的沖壓方式將會使得熱管與鰭片接合處磨損的情況難以控制,更甚,沖壓的過程更可能破壞熱管內部的微結構,降低整體的良率。此外,此種組裝方式,更會讓熱管先沖壓的區段(前端)磨損較嚴重,使得散熱鰭片與熱管被磨損區間的夾持力降低,故散熱鰭片與熱管之間無法維持一個均勻的夾持力道,進而讓整體架構的穩定性降低。 However, when the fins of the conventional heat sink are assembled with the heat pipe, the plurality of fins are first spaced apart, and then the heat pipe is directly punched and combined with the heat sink fins by using a punch die. The disadvantage of this method is that the one-way stamping method will make the wear of the heat pipe and the fin joint difficult to control. Moreover, the stamping process is more likely to damage the microstructure inside the heat pipe and reduce the overall yield. In addition, this type of assembly will make the section (front end) of the heat pipe first stamped more severe, so that the clamping force of the heat sink fin and the heat pipe is reduced, so that the heat sink fin and the heat pipe cannot maintain a uniformity. The clamping force, which in turn reduces the stability of the overall structure.
本案提供一種散熱鰭片,包括本體以及至少一穿孔。 The present invention provides a heat dissipation fin including a body and at least one through hole.
穿孔設置於本體,且各個穿孔包括至少二凸頸部,且凸頸部環繞穿孔的外徑設置。各個凸頸部可包括第一延伸段以及第一橋接段。第一延伸段與第一橋接段夾一第一夾角,且第一橋接段得以穿設於相鄰的另一散熱鰭片的一穿孔。 The perforations are disposed on the body, and each of the perforations includes at least two convex necks, and the convex neck is disposed around the outer diameter of the perforations. Each of the convex necks can include a first extension and a first bridge. The first extension segment has a first angle with the first bridge segment, and the first bridge segment is disposed through a through hole of the adjacent another heat dissipation fin.
本案更提供一種散熱裝置,散熱裝置包括散熱鰭片組、至 少一熱管以及散熱底座,且散熱鰭片組設置於散熱底座。散熱鰭片組包括複數個散熱鰭片,且各個散熱鰭片包括包括本體以及至少一穿孔。熱管可穿設各個散熱鰭片的各個穿孔。 The present invention further provides a heat dissipating device, the heat dissipating device includes a heat dissipating fin group, and One heat pipe and a heat sink base are provided, and the heat sink fin set is disposed on the heat sink base. The heat dissipation fin set includes a plurality of heat dissipation fins, and each of the heat dissipation fins includes a body and at least one through hole. The heat pipe can pass through the respective perforations of the respective heat dissipation fins.
散熱鰭片的穿孔設置於本體,且各個穿孔包括至少二凸頸部,且凸頸部環繞穿孔的外徑設置。各個凸頸部可包括第一延伸段以及第一橋接段。第一延伸段與第一橋接段夾一第一夾角,且第一橋接段得以穿設於相鄰的另一散熱鰭片的一穿孔。 The perforations of the fins are disposed on the body, and each of the perforations includes at least two convex necks, and the convex neck is disposed around the outer diameter of the perforations. Each of the convex necks can include a first extension and a first bridge. The first extension segment has a first angle with the first bridge segment, and the first bridge segment is disposed through a through hole of the adjacent another heat dissipation fin.
承上所述,本案所提供散熱鰭片以及散熱裝置,能夠使散熱鰭片與熱管間形成均勻夾持力、降低組裝過程中熱管損壞、提高整體散熱效能。 As described above, the fins and the heat dissipating device provided in the present invention can form a uniform clamping force between the fins and the heat pipe, reduce heat pipe damage during assembly, and improve overall heat dissipation performance.
1‧‧‧散熱鰭片 1‧‧‧Heat fins
10‧‧‧本體 10‧‧‧ Ontology
12‧‧‧穿孔 12‧‧‧Perforation
122‧‧‧凸頸部 122‧‧‧ convex neck
122A‧‧‧第一延伸段 122A‧‧‧First extension
122B‧‧‧第一橋接段 122B‧‧‧First bridging section
14‧‧‧嵌槽 14‧‧‧Inlay
142A‧‧‧第二延伸段 142A‧‧‧Second extension
142B‧‧‧第二橋接段 142B‧‧‧Second bridging section
16‧‧‧導流片 16‧‧‧Guide
2‧‧‧熱管 2‧‧‧heat pipe
3‧‧‧散熱底座 3‧‧‧heating base
32‧‧‧凸肋 32‧‧‧ ribs
4‧‧‧風扇 4‧‧‧Fan
R1、R2、R3、R4‧‧‧直徑 R 1 , R 2 , R 3 , R 4 ‧‧‧ diameter
θ1‧‧‧第一夾角 θ 1 ‧‧‧first angle
θ2‧‧‧第二夾角 θ 2 ‧‧‧second angle
AA、BB、DD‧‧‧割線 AA, BB, DD‧‧ secant
C‧‧‧虛線框 C‧‧‧dotted box
圖1為本案散熱鰭片的一實施例立體示意圖。 FIG. 1 is a perspective view of an embodiment of a heat dissipating fin of the present invention.
圖2為圖1的散熱鰭片的沿DD割線的剖面示意圖。 2 is a cross-sectional view of the heat dissipation fin of FIG. 1 along a DD cut line.
圖3為圖1的散熱鰭片的穿孔的放大示意圖。 3 is an enlarged schematic view showing a perforation of the heat dissipation fin of FIG. 1.
圖4為本案散熱裝置的第一實施例的組裝示意圖。 FIG. 4 is an assembled view of the first embodiment of the heat sink of the present invention.
圖5為本案散熱裝置的第一實施例的部份爆炸示意圖。 FIG. 5 is a partial exploded view of the first embodiment of the heat sink of the present invention.
圖6A為圖5的散熱裝置沿AA割線的剖面側視圖。 6A is a cross-sectional side view of the heat sink of FIG. 5 taken along line AA.
圖6B為圖6A的虛線框C的放大示意圖。 FIG. 6B is an enlarged schematic view of the broken line frame C of FIG. 6A.
圖6C為圖5的散熱裝置沿BB割線的剖面側視圖。 Figure 6C is a cross-sectional side view of the heat sink of Figure 5 taken along line BB.
以下將參照相關圖式,說明依本案較佳實施例的散熱鰭片及散熱裝置。其中相同的構件將以相同的參照符號加以說明。且為了便於理解,與本案非直接相關的構件將省略不繪出。 Hereinafter, the heat dissipation fins and the heat dissipation device according to the preferred embodiment of the present invention will be described with reference to the related drawings. The same components will be described with the same reference symbols. And for ease of understanding, components that are not directly related to the present case will be omitted and not drawn.
請先參考圖1至圖3,圖1為本案散熱鰭片的一實施例立體示意圖,圖2為圖1的散熱鰭片的沿DD割線的剖面示意圖。圖3為圖1的散熱鰭片的穿孔的放大示意圖。 Please refer to FIG. 1 to FIG. 3 . FIG. 1 is a perspective view of an embodiment of a heat dissipating fin of the present invention, and FIG. 2 is a cross-sectional view of the heat dissipating fin of FIG. 1 along a DD secant line. 3 is an enlarged schematic view showing a perforation of the heat dissipation fin of FIG. 1.
本案的其一實施例的散熱鰭片1,包括本體10以及至少一穿孔12,且穿孔12設置於本體10。本實施例例示四個穿孔12,但穿孔12 的數量可依據實際上搭配的熱管有所調整。且,本實施例的散熱鰭片1的材料可為鋁、銅、鋁合金、銅合金與銅鋁合金的任一種。 The heat dissipation fin 1 of one embodiment of the present invention includes a body 10 and at least one through hole 12 , and the through hole 12 is disposed on the body 10 . This embodiment illustrates four perforations 12, but perforations 12 The number can be adjusted according to the actual heat pipe. Moreover, the material of the heat dissipation fin 1 of the present embodiment may be any one of aluminum, copper, aluminum alloy, copper alloy, and copper aluminum alloy.
詳細而言,各個穿孔12包括至少二凸頸部122,各個凸頸 部122環繞穿孔12的外徑設置。此外,各個凸頸部122是經由沖孔而形成,故凸頸部122的一端與穿孔12相連結。本實施例例示四個凸頸部122,且各凸頸部12間隔設置,此間隔配置的目的在於可給予各凸頸部122一個彈性形變的空間,以降低複數個散熱鰭片組裝時的累積公差。 In detail, each of the perforations 12 includes at least two convex necks 122, each convex neck The portion 122 is disposed around the outer diameter of the perforation 12. Further, each of the convex neck portions 122 is formed through a punching hole, so that one end of the convex neck portion 122 is coupled to the through hole 12. In this embodiment, four convex neck portions 122 are illustrated, and each convex neck portion 12 is spaced apart. The purpose of the spacing configuration is to give each convex neck portion 122 an elastic deformation space to reduce the accumulation of a plurality of heat dissipating fins during assembly. tolerance.
請繼續參考圖2及圖3,各該凸頸部122可包括第一延伸段 122A以及第一橋接段122B。第一延伸段122A與第一橋接段122B夾一第一夾角θ1。 With continued reference to FIGS. 2 and 3 , each of the convex neck portions 122 can include a first extension 122A and a first bridging section 122B. The first extension 122A and the first bridging section 122B have a first angle θ 1 .
另外,本實施例的凸頸部122的第一延伸段122A與第一橋 接段122B夾的第一夾角θ1為銳角。或者,第一延伸段122A的直徑R1大於第一橋接段122B的直徑R2。此處所定義的直徑R1係指第一延伸段122A的最寬處的直徑,直徑R2係指第一橋接段122B的最窄處的直徑。簡言之,凸頸部122的第一延伸段122A向內、朝向穿孔12的中軸延長線方向彎折,使得第一橋接段122B得以輕易的穿設、套入於相鄰的另一散熱鰭片的穿孔內。 In addition, the first angle θ 1 of the first extension 122A of the convex neck portion 122 of the embodiment and the first bridge segment 122B is an acute angle. Alternatively, the diameter R 1 of the first extension 122A is greater than the diameter R 2 of the first bridge segment 122B. The diameter R 1 as defined herein refers to the diameter at the widest point of the first extension 122A, and the diameter R 2 refers to the diameter of the narrowest portion of the first bridging section 122B. In short, the first extension 122A of the convex neck 122 is bent inwardly toward the central axis extension of the perforation 12, so that the first bridging section 122B can be easily inserted and nested in the adjacent another fin. Inside the piece of perforation.
舉例來說,在一實施例中,散熱鰭片1的板厚為0.4mm, 可先利用衝床模具係先衝出直徑為0.6mm的衝孔以形成第一橋接段122B,接著,再衝出直徑0.62mm的衝孔,以形成第一延伸段122A。或者,亦可有一實施態樣,散熱鰭片1的板厚為0.3mm,可先利用衝床模具係先衝出直徑為0.59mm的衝孔以形成第一橋接段122B,接著,再衝出直徑0.60mm的衝孔,以形成第一延伸段122A。 For example, in one embodiment, the heat sink fin 1 has a thickness of 0.4 mm. The punching die may be used to first punch out a punch having a diameter of 0.6 mm to form a first bridging section 122B, and then punch a punch having a diameter of 0.62 mm to form a first extending section 122A. Alternatively, there may be an embodiment in which the heat sink fin 1 has a thickness of 0.3 mm, and the punching die may first punch out a punch having a diameter of 0.59 mm to form a first bridging section 122B, and then punch out the diameter. A punch of 0.60 mm to form a first extension 122A.
此外,本實施例的散熱鰭片1更包括至少二嵌槽14,各個 嵌槽14得以與散熱底座相配合。此處的嵌槽14作用有二,其一為與相鄰的散熱鰭片1相卡合,其二為將散熱鰭片1與散熱底座相嵌合。嵌槽14設置於散熱鰭片1的本體10,此外,本實施例的嵌槽14設置於本體10邊緣或底緣處,且嵌槽14與凸頸部122設置於相異面。 In addition, the heat dissipation fin 1 of the embodiment further includes at least two slots 14 , each of which The recess 14 is adapted to cooperate with the heat sink base. Here, the recess 14 has two functions, one of which is to engage with the adjacent heat dissipation fins 1 and the other is to fit the heat dissipation fins 1 with the heat dissipation base. The recess 14 is disposed on the body 10 of the heat dissipating fin 1. In addition, the recess 14 of the embodiment is disposed at the edge or the bottom edge of the body 10, and the recess 14 and the convex portion 122 are disposed on the opposite surface.
嵌槽14包括第二延伸段142A以及第二橋接段142B。第二 橋接段142B得以穿設於相鄰的另一散熱鰭片的一嵌槽。故,本實施例的散熱鰭片1除了可透過前述的凸頸部122的第一橋接段122B與相鄰的散熱鰭片1卡合以外,更可透過嵌槽14的第二橋接段142B與相鄰散熱鰭片1卡合。 The slot 14 includes a second extension 142A and a second bridge 142B. second The bridging section 142B can be passed through a recess of another adjacent fin. Therefore, the heat dissipating fins 1 of the present embodiment can pass through the second bridging section 142B of the slot 14 in addition to the first bridging section 122B of the convex neck portion 122 being engaged with the adjacent heat dissipating fins 1 . The adjacent heat dissipation fins 1 are engaged.
相似地,本實施例的第二延伸段142A與第二橋接段142B 的第二夾角θ2為銳角。或者,第二延伸段142A的直徑R3大於第二橋接段142B的直徑R4。此處所定義的直徑R3係指第二延伸段142A的最寬處的直徑,直徑R4係指第二橋接段142B的最窄處的直徑。簡言之,嵌槽14的第二延伸段142A向內、朝向其中軸延長線方向彎折,使得第二橋接段142B得以輕易的穿設、套入於相鄰的另一散熱鰭片的嵌槽內。 Similarly, the second angle θ 2 of the second extension 142A and the second bridge segment 142B of the embodiment is an acute angle. Alternatively, the diameter R 3 of the second extension 142A is greater than the diameter R 4 of the second bridge 142B. The diameter R 3 as defined herein refers to the diameter at the widest point of the second extension 142A, and the diameter R 4 refers to the diameter of the narrowest portion of the second bridging section 142B. In short, the second extension 142A of the slot 14 is bent inwardly and toward the axis extension direction thereof, so that the second bridge section 142B can be easily inserted and nested in the adjacent heat dissipation fin. Inside the slot.
另外,本實施例的散熱鰭片1更可包括至少二導流片16, 且各個導流片16設置於本體10,較佳地,設置於本體10的邊緣、底緣靠近散熱底座處。當複數個散熱鰭片1組裝成散熱鰭片組時,相鄰的散熱鰭片1上的各個導流片16將可形成氣流導流通道,增加散熱底座的散熱效率,且可避免氣流形成亂流。 In addition, the heat dissipation fin 1 of the embodiment may further include at least two flow guiding sheets 16 . Each of the baffles 16 is disposed on the body 10, preferably disposed at an edge of the body 10 and a bottom edge adjacent to the heat dissipation base. When a plurality of heat dissipation fins 1 are assembled into a heat dissipation fin group, each of the air guiding fins 16 on the adjacent heat dissipation fins 1 can form an air flow guiding channel, thereby increasing heat dissipation efficiency of the heat dissipation base and avoiding airflow disorder. flow.
接著,請一併參考圖4及圖5,其分別為本案的散熱裝置的 第一實施例的組裝示意圖以及第一實施例的部份爆炸示意圖。 Next, please refer to FIG. 4 and FIG. 5 together, which are respectively the heat dissipation device of the present case. A schematic view of the assembly of the first embodiment and a partial exploded view of the first embodiment.
本實施例更可提供一種散熱裝置,散熱裝置包括散熱鰭片組、至少一熱管2以及散熱底座3。此外,散熱鰭片組設置於散熱底座3。散熱鰭片組包括複數個如前述的散熱鰭片1,熱管2則可穿設各個散熱鰭片1的各個穿孔12。 The embodiment further provides a heat dissipation device including a heat dissipation fin set, at least one heat pipe 2, and a heat dissipation base 3. In addition, the heat dissipation fin group is disposed on the heat dissipation base 3. The heat dissipation fin group includes a plurality of heat dissipation fins 1 as described above, and the heat pipe 2 can penetrate the respective through holes 12 of each of the heat dissipation fins 1 .
此外,散熱裝置更可包括至少一風扇4,圖面只例示一個風扇4,但不以一個風扇為限制。且風扇4可架設於散熱鰭片組之上。 In addition, the heat sink may further include at least one fan 4, and only one fan 4 is illustrated in the drawing, but is not limited by one fan. And the fan 4 can be mounted on the heat dissipation fin set.
詳細而言,散熱底座3其係以導熱性良好之材質所製成,如鋁、銅等,散熱底座3的底面乃用以與一如顯示卡、晶片等電子發熱元件(圖未示出)作貼合。散熱底座3更更包括複數個凸肋32,以供前述嵌槽14各個凸肋32相嵌合、卡設或埋設。 In detail, the heat dissipation base 3 is made of a material having good thermal conductivity, such as aluminum, copper, etc., and the bottom surface of the heat dissipation base 3 is used for an electronic heating element such as a display card or a wafer (not shown). Make a fit. The heat dissipation base 3 further includes a plurality of ribs 32 for fitting, splicing or embedding the respective ribs 32 of the aforementioned groove 14.
簡言之,各散熱鰭片1的嵌槽14貼接於散熱底座3的複數 個凸肋32,除了可以固定散熱鰭片組以外,更可透過散熱鰭片組與散熱底座3的接觸,以增加散熱效率。 In short, the recess 14 of each of the heat dissipation fins 1 is attached to the plurality of heat dissipation bases 3 The ribs 32 can not only fix the heat dissipation fin group, but also can contact the heat dissipation base 3 through the heat dissipation fin group to increase the heat dissipation efficiency.
本實施例中的熱管2為一真空腔體,且真空腔體內壁可界 定有燒結層,其中,燒結層內具有至少一液態傳熱介質。此外,在本實施例中,熱管2的數量係為複數,故上述穿孔12的數量亦須配合熱管2的數量,各熱管2為「U」字形,且本實施例的熱管2以由「U」字形的一端作為受熱段、另一端作為冷凝段。 The heat pipe 2 in this embodiment is a vacuum chamber, and the inner wall of the vacuum chamber is demarcable There is a sintered layer in which at least one liquid heat transfer medium is present in the sintered layer. In addition, in the present embodiment, the number of the heat pipes 2 is plural, so the number of the perforations 12 must also match the number of the heat pipes 2, and the heat pipes 2 are U-shaped, and the heat pipes 2 of the present embodiment are made of "U". One end of the glyph is used as the heated section and the other end is used as the condensation section.
請參考圖4,顯示散熱裝置的組裝過程。習知是先組裝具有 間隔設置的散熱鰭片組後,再固定散熱鰭片組於散熱底座上,並將熱管壓入散熱鰭片組。而於本實施例則是先將熱管2固定於散熱底座3後,再將散熱鰭片1的穿孔12對準熱管2,依序以將散熱鰭片1套設於其上,其中,散熱鰭片1的凸頸部122的第一橋接段122B將會穿設於相鄰的散熱鰭片1的穿孔12中,以使散熱鰭片1與另一散熱鰭片可等距地間隔設置。且,散熱鰭片1的嵌槽14則可與散熱底座3的凸肋32坎合。 Please refer to Figure 4 for the assembly process of the heat sink. It is customary to assemble first After the fin sets are disposed at intervals, the heat sink fins are fixed on the heat sink base, and the heat pipes are pressed into the heat sink fin groups. In this embodiment, the heat pipe 2 is first fixed to the heat dissipation base 3, and then the through hole 12 of the heat dissipation fin 1 is aligned with the heat pipe 2, and the heat dissipation fin 1 is sequentially disposed thereon, wherein the heat dissipation fin The first bridging section 122B of the convex neck portion 122 of the sheet 1 will pass through the through holes 12 of the adjacent heat dissipating fins 1 so that the heat dissipating fins 1 and the other heat dissipating fins can be equally spaced. Moreover, the recess 14 of the heat dissipation fin 1 can be engaged with the rib 32 of the heat dissipation base 3.
此外,關於散熱鰭片1的其餘配置以及設計與前述實施例相似,將不再此贅述。 Further, the rest of the configuration and design of the heat dissipating fin 1 are similar to those of the foregoing embodiment, and will not be described again.
最後,請一併參考圖6A至圖6C,圖6A及圖6C分別為圖5的散熱裝置沿AA割線、BB割線的剖面側視圖。而,圖6B則為圖6A的虛線框C的放大示意圖。 Finally, please refer to FIG. 6A to FIG. 6C together. FIG. 6A and FIG. 6C are cross-sectional side views of the heat dissipating device of FIG. 5 along the AA secant line and the BB secant line, respectively. 6B is an enlarged schematic view of the broken line frame C of FIG. 6A.
請先參考圖6A及圖6B,當熱管2穿設各個散熱鰭片1的各個穿孔12,熱管2的外壁將會抵頂第一橋接段122B,使其產生形變並貼合熱管2,藉此除了可以強化散熱鰭片1與相鄰的散熱鰭片1卡合的穩定性,更可透過增加散熱鰭片1與熱管2的接觸面積有效的提高散熱效率。 Referring to FIG. 6A and FIG. 6B , when the heat pipe 2 penetrates each of the through holes 12 of each of the heat dissipation fins 1 , the outer wall of the heat pipe 2 will abut the first bridge segment 122B to deform and conform to the heat pipe 2 . In addition to enhancing the stability of the heat dissipation fins 1 and the adjacent heat dissipation fins 1 , the heat dissipation efficiency can be effectively improved by increasing the contact area between the heat dissipation fins 1 and the heat pipes 2 .
請接著參考圖6C,當散熱鰭片1的穿孔12套設於熱管2時,散熱鰭片1的嵌槽14將會與散熱底座3的凸肋32相嵌合。相似地,凸肋32將會抵頂第二橋接段142B,使其產生形變並嵌合散熱底座3,以達到固定散熱鰭片1於散熱底座3之目的。 Referring to FIG. 6C , when the through hole 12 of the heat dissipation fin 1 is sleeved on the heat pipe 2 , the groove 14 of the heat dissipation fin 1 will be engaged with the rib 32 of the heat dissipation base 3 . Similarly, the rib 32 will abut the second bridging section 142B to deform and fit the heat dissipating base 3 to achieve the purpose of fixing the heat dissipating fin 1 to the heat dissipating base 3.
此外,此處所繪製的第一橋接段122B與第二橋接段142B的形變方式僅為例示,實際組裝時,形變的程度以及狀態將會依據散熱鰭 片1的材質、第一夾角θ1、第二夾角θ2、直徑等等不同的情況而有所不同 In addition, the deformation manners of the first bridging section 122B and the second bridging section 142B drawn here are merely examples. In actual assembly, the degree and state of deformation will depend on the material of the fins 1, the first angle θ 1 , and the Different angles θ 2 , diameter, etc.
綜上所述,本案透過在散熱鰭片的穿孔配置至少二凸頸部,各凸頸部則由第一延伸段與第一橋接段所組成,再並透過第一橋接段穿設於相鄰的另一散熱鰭片的穿孔內的方式,使相鄰的散熱鰭片扣合、組裝成一散熱鰭片組,透過此種結合方式可有效的提高散熱鰭片間接合的穩定度。再透過將散熱鰭片依序套設於熱管的組裝方式,更可使散熱鰭片與熱管組裝時可提供一穩定的夾持力,進而避免組裝過程中熱管損壞。此外,此種散熱鰭片的構造,於組裝時熱管將會抵頂第一延伸段,使其貼合於熱管,以增加散熱鰭片與熱管的接觸面積的方式,並提高散熱效率。 In summary, in the present case, at least two convex neck portions are disposed through the perforations of the heat dissipating fins, and each convex neck portion is composed of the first extending portion and the first bridging portion, and is then disposed adjacent to the first bridging portion. The way of the other heat-dissipating fins is such that the adjacent heat-dissipating fins are fastened and assembled into a heat-dissipating fin group, and the bonding manner can effectively improve the stability of the joint between the heat-dissipating fins. By sequentially arranging the heat dissipating fins on the heat pipe assembly, the heat dissipating fins and the heat pipes can be assembled to provide a stable clamping force, thereby avoiding damage to the heat pipes during assembly. In addition, the structure of the heat dissipation fins is such that the heat pipe will abut the first extension portion during assembly, so that it is attached to the heat pipe to increase the contact area between the heat dissipation fin and the heat pipe, and improve the heat dissipation efficiency.
以上所述僅為舉例性,而非為限制性者。任何未脫離本案之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or changes made to the spirit and scope of this case shall be included in the scope of the appended patent application.
1‧‧‧散熱鰭片 1‧‧‧Heat fins
10‧‧‧本體 10‧‧‧ Ontology
12‧‧‧穿孔 12‧‧‧Perforation
122‧‧‧凸頸部 122‧‧‧ convex neck
14‧‧‧嵌槽 14‧‧‧Inlay
16‧‧‧導流片 16‧‧‧Guide
DD‧‧‧割線 DD‧‧ secant
Claims (16)
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TW102146943A TWI531776B (en) | 2013-12-18 | 2013-12-18 | Heat dissipating fin and heat dissipating device |
US14/575,708 US20150168082A1 (en) | 2013-12-18 | 2014-12-18 | Heat dissipating fin and heat dissipating device |
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TW102146943A TWI531776B (en) | 2013-12-18 | 2013-12-18 | Heat dissipating fin and heat dissipating device |
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TW201525404A true TW201525404A (en) | 2015-07-01 |
TWI531776B TWI531776B (en) | 2016-05-01 |
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IT201600099709A1 (en) * | 2016-10-05 | 2018-04-05 | Novamet S R L | Fin for the production of finned tube heat exchangers and process for the production of finned tube heat exchangers by means of said fin. |
US10766097B2 (en) * | 2017-04-13 | 2020-09-08 | Raytheon Company | Integration of ultrasonic additive manufactured thermal structures in brazements |
WO2020170717A1 (en) * | 2019-02-19 | 2020-08-27 | ソニー株式会社 | Light source device and projection-type display device |
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US20070011877A1 (en) * | 2005-07-12 | 2007-01-18 | Kuo-Hsin Chen | Method for fabricating cooling device |
TWI431238B (en) * | 2010-05-14 | 2014-03-21 | Asia Vital Components Co Ltd | Fin structure and its heat sink |
US20110315365A1 (en) * | 2010-06-23 | 2011-12-29 | Shyh-Ming Chen | Heat sink and method for manufacturing the same |
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