US20150168082A1 - Heat dissipating fin and heat dissipating device - Google Patents

Heat dissipating fin and heat dissipating device Download PDF

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Publication number
US20150168082A1
US20150168082A1 US14/575,708 US201414575708A US2015168082A1 US 20150168082 A1 US20150168082 A1 US 20150168082A1 US 201414575708 A US201414575708 A US 201414575708A US 2015168082 A1 US2015168082 A1 US 2015168082A1
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United States
Prior art keywords
heat dissipating
dissipating fin
extending portion
bridging portion
hole
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Abandoned
Application number
US14/575,708
Inventor
Yung-Ching Huang
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Asustek Computer Inc
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Asustek Computer Inc
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Assigned to ASUSTEK COMPUTER INC. reassignment ASUSTEK COMPUTER INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, YUNG-CHING
Publication of US20150168082A1 publication Critical patent/US20150168082A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a heat dissipating fin and, more particularly, to a heat dissipating fin applied to a heat dissipating device.
  • Heat is generated when an electronic device operates. To avoid that too much heat are accumulated at the electronic device and affects the performance of the electronic device, a heat dissipating unit is usually applied to the electronic device.
  • a conventional heat dissipating device at least includes a base plate contacted to a heat source, multiple fins and a pipe connected to the base plate and passing through the fins, the heat generated from the electronic device is transferred to the pipe via the base plate to dissipate heat.
  • the fins of the heat dissipating device and the pipe are assembled, the fins are disposed at intervals, and then the pipe and the heat dissipating fins are pressed to be combined via a stamping die.
  • the wear at the connection between the pipe and the fins is not easily avoided via the single-direction stamping, even the micro-structure of the pipe is destroyed, and thus the quality of the heat dissipating device is poor.
  • the wear at the front end (which is stamped first) is more serious, and the holding force between the heat dissipating fin and the worn portion of the pipe is decreased, the holding force between the heat dissipating fin and the pipe is not uniform, and the stability of the whole architecture is affected.
  • a heat dissipating fin including a main body and a through hole is provided.
  • the through hole is formed at the main body.
  • the through hole includes at least two collar portions, and the collar portions are formed on an edge of the through hole.
  • Each of the collar portions includes a first extending portion and a first bridging portion.
  • a first angle is formed between the first extending portion and the first bridging portion.
  • a heat dissipating device is also provided.
  • the heat dissipating device includes a base and a heat dissipating fins set positioned on the base.
  • the heat dissipating fins set includes a plurality of heat dissipating fins.
  • Each of the heat dissipating fins includes a main body and a through hole formed on the main body.
  • the through hole includes at least two collar portions, and the collar portions are formed on an edge of the through hole.
  • Each of the collar portions includes a first extending portion and a first bridging portion, and at least a pipe passing through the through holes of the heat dissipating fins.
  • a first angle is formed between the first extending portion and the first bridging portion.
  • FIG. 1 is a schematic diagram showing a heat dissipating fin in an embodiment of the disclosure
  • FIG. 2 is a schematic diagram showing a cross section of the heat dissipating fin in FIG. 1 along the cross line DD;
  • FIG. 3 is an enlarged view showing a through hole of the heat dissipating fin in FIG. 1 ;
  • FIG. 4 is a schematic diagram showing the assembly of a heat dissipating device in a first embodiment
  • FIG. 5 is a partial exploded view showing a heat dissipating device in a first embodiment
  • FIG. 6A is a schematic diagram showing a side cross section of a heat dissipating device along the cross line AA;
  • FIG. 6B is an enlarged view showing a part of the selected part C of a heat dissipating device in FIG. 6A ;
  • FIG. 6C is a schematic diagram showing a side cross section of a heat dissipating device in FIG. 5 along the cross line BB.
  • a heat dissipating fin and a heat dissipating device will be illustrated with relating drawings, and the same number donates the same component.
  • FIG. 1 is a schematic diagram showing a heat dissipating fin in an embodiment of the disclosure.
  • FIG. 2 is a schematic diagram showing a cross section of the heat dissipating fin in FIG. 1 along the cross line DD.
  • FIG. 3 is an enlarged view showing a through hole of the heat dissipating fin in FIG. 1 .
  • a heat dissipating fin 1 includes a main body 10 and at least a through hole 12 formed on the main body 10 .
  • the number of the through hole 12 is four, however, the number of the through hole 12 is not a limitation herein.
  • the material of the heat dissipating fin 1 is aluminum, copper, aluminum alloy, copper alloy or copper aluminum alloy which is not limited herein.
  • Each through hole 12 at least includes two collar portions 122 , each collar portion 122 forms on the edge of the through hole 12 .
  • the collar portions 122 are formed by punching, and thus one end of the collar portion 122 is connected to the through hole 120 .
  • four collar portions 122 are shown, and the collar portions 12 are arranged at intervals to allow an elastic deformation for the collar portions 122 , so as to decrease accumulated tolerance when multiple heat dissipating fins are assembled.
  • each collar portion 122 includes a first extending portion 122 A and a first bridging portion 122 B.
  • a first angle ⁇ 1 is formed between the first extending portion 122 A and the first bridging portion 122 B.
  • the first angle ⁇ 1 formed between the first extending portion 122 A and the first bridging portion 122 B is an acute angle. That is, the diameter R1 of the first extending portion 122 A is larger than the diameter R2 of the first bridging portion 122 B.
  • the diameter R1 is the diameter of the widest part of the first extending portion 122 A, and the diameter R2 is the diameter of the narrowest part of the first bridging portion 122 B.
  • the first extending portion 122 A of the collar portion 122 bends inwardly towards the extending direction of the center axis of the through hole 12 , thus the first bridging portion 122 B is sleeved into the through hole of another adjacent heat dissipating fin while multiple fins are assembled together.
  • the thickness of the heat dissipating fin 1 is about 0.4 mm, the heat dissipating has a punched hole with the diameter of 0.6 mm to form the first bridging portion 122 B. Then, a punched hole with the diameter of 0.62 mm is punched to form the first extending portion 122 A. In another embodiment, the thickness of the heat dissipating fin 1 is about 0.3 mm, the heat dissipating fin 1 have a punched hole with the diameter of 0.59 mm to form the first bridging portion 122 B. Then, a punched hole with the diameter of 0.60 mm is punched to form the first extending portion 122 A. It is to be understood that the diameters disclosed above are for examples and can be varied according to different requirements, which is not limited herein.
  • the heat dissipating fin 1 at least includes two embedding slots 14 , and each embedding slot 14 cooperates with the base.
  • the embedding slot 14 fastens the adjacent heat dissipating fin 1 , and embedded to the base.
  • the embedding slot 14 is formed at the main body 10 of the heat dissipating fin 1 .
  • the embedding slot 14 is formed at the edge of the main body 10 , and the embedding slot 14 and the collar portions 122 are formed at opposite surfaces.
  • the embedding slot 14 includes a second extending portion 142 A and a second bridging portion 142 B.
  • the second bridging portion 142 B is sleeved at the embedding slot 14 of the adjacent heat dissipating fin 1 .
  • the heat dissipating fin 1 is fastened to the adjacent heat dissipating fin via the first bridging portion 122 B of the collar portions 122 and the second bridging portion 142 B of the embedding slot 14 .
  • the second angle ⁇ 2 formed between the second extending portion 142 A and the second bridging portion 142 B is an acute angle. That is, the diameter R3 of the second extending portion 142 A is larger than the diameter R4 of the second bridging portion 142 B.
  • the diameter R3 is the diameter of the widest part of the second extending portion 142 A
  • the diameter R4 is the diameter of the narrowest part of the second bridging portion 142 B. That is, the second extending portion 142 A of the embedding slot 14 bends inwardly towards the extending direction of the center axis of the through hole 12 , and the second bridging portion 142 B is easily sleeved into the embedding slot of the adjacent heat dissipating fin.
  • the heat dissipating fin 1 further includes at least two flow deflectors 16 , the flow deflectors 16 are disposed at the main body 10 , and they are preferably disposed at the edge of the main body 10 and close to the base.
  • the flow deflectors 16 on the adjacent heat dissipating fins 1 forms an air guiding channel to improve the heat dissipation efficient of the base and avoid the turbulence.
  • FIG. 4 is a schematic diagram showing the assembly of a heat dissipating device in a first embodiment.
  • FIG. 5 is a partial exploded view showing a heat dissipating device in a first embodiment.
  • the heat dissipating device includes a heat dissipating fins set, at least a pipe 2 and a base 3 .
  • the heat dissipating fins set is disposed at the base 3 .
  • the heat dissipating fins set includes multiple heat dissipating fins 1 , and the pipe 2 passes through the through hole 12 of each heat dissipating fin 1 .
  • the heat dissipating device further includes at least a fan 4 , as shown in FIG. 4 , one fan 4 is disposed on the heat dissipating fins set, which is not limited herein.
  • the base 3 is made of a heat conduction material such as aluminum or copper, which is not limited herein.
  • the base 3 contacts a heat source element (not shown) directly such as a display adapter and a chip for a better heat dissipation result.
  • the base 3 further includes multiple ribs 32 for being embedded, fastened, or accommodated to the embedding slot 14 .
  • the embedding slot 14 of the heat dissipating fin 1 is attached to the ribs 32 of the base 3 thus to fix the heat dissipating fins set.
  • the heat dissipation efficient can be improved.
  • the pipe 2 is a vacuum chamber, and the inner wall of the vacuum chamber includes a sinter layer, and the sinter layer includes liquid heat transfer medium therein.
  • multiple pipes 2 are included, and thus the number of the through holes 12 is increased accordingly.
  • the pipe 2 is U-shaped which has a heated end and a condensing end.
  • FIG. 4 the assembly of the heat dissipating device is shown.
  • the heat dissipating fins set with intervals is assembled, and then fixes on the base, and the pipe is assembled to the heat dissipating fins set.
  • the through hole 12 of the heat dissipating fin 1 aims at the pipe 2 , and the pipe 2 passes through the heat dissipating fin 1 .
  • the first bridging portion 122 B of the collar portions 122 of the heat dissipating fin 1 passes through the through hole 12 of the adjacent heat dissipating fin to assemble the adjacent heat dissipating fins 1 at interval.
  • the rib 32 of the base 3 is embedded to the embedding slot 14 of the heat dissipating fin 1 .
  • FIG. 6A and FIG. 6C are schematic diagrams showing a side cross section of a heat dissipating device in FIG. 5 along the cross line AA and the cross line BB, respectively.
  • FIG. 6B is an enlarged view showing a part of the selected part C of a heat dissipating device in FIG. 6A .
  • the embedding slot 14 of the heat dissipating fin 1 is embedded to the rib 32 of the base 3 .
  • the rib 32 is against the second bridging portion 142 B to make the second bridging portion 142 B deformed and embedded to the base 3 , so as to fix the heat dissipating fin 1 to the base 3 .
  • the deformation of the first bridging portion 122 B and the second bridging portion 142 B in FIG. 6C is just an example, the deformation of the second bridging portion 142 B is various according to the material of the heat dissipating fin 1 , the first angle ⁇ 1, the second angle ⁇ 2, the diameter and so on.
  • each of the collar portions includes a first extending portion and a first bridging portion.
  • the pipe would be against the first extending portion in the assembly, and the first extending portion would abut against the pipe, and then the contact area between the heat dissipating fin and the pipe is improved, and the heat dissipation affection is also improved.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
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  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating fin including a main body and a through hole is provided. The through hole is formed at the main body. The through hole includes at least two collar portions, and the collar portions are formed on an edge of the through hole. Each of the collar portions includes a first extending portion and a first bridging portion. A first angle is formed between the first extending portion and the first bridging portion. The heat dissipating fin and the heat dissipating device can form a uniform holding force between the heat dissipating fin and the pipe, reduce the damage of the pipe in the assembly, and improve the heat dissipation efficiency.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims the priority benefit of TW application serial No. 102146943, filed on Dec. 18, 2013. The entirety of the above-mentioned patent application is hereby incorporated by references herein and made a part of specification.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention relates to a heat dissipating fin and, more particularly, to a heat dissipating fin applied to a heat dissipating device.
  • 2. Description of the Related Art
  • Heat is generated when an electronic device operates. To avoid that too much heat are accumulated at the electronic device and affects the performance of the electronic device, a heat dissipating unit is usually applied to the electronic device.
  • A conventional heat dissipating device at least includes a base plate contacted to a heat source, multiple fins and a pipe connected to the base plate and passing through the fins, the heat generated from the electronic device is transferred to the pipe via the base plate to dissipate heat.
  • When the fins of the heat dissipating device and the pipe are assembled, the fins are disposed at intervals, and then the pipe and the heat dissipating fins are pressed to be combined via a stamping die. However, the wear at the connection between the pipe and the fins is not easily avoided via the single-direction stamping, even the micro-structure of the pipe is destroyed, and thus the quality of the heat dissipating device is poor. Additionally, since the wear at the front end (which is stamped first) is more serious, and the holding force between the heat dissipating fin and the worn portion of the pipe is decreased, the holding force between the heat dissipating fin and the pipe is not uniform, and the stability of the whole architecture is affected.
    • BRIEF SUMMARY OF THE INVENTION
  • A heat dissipating fin including a main body and a through hole is provided. The through hole is formed at the main body. The through hole includes at least two collar portions, and the collar portions are formed on an edge of the through hole. Each of the collar portions includes a first extending portion and a first bridging portion. A first angle is formed between the first extending portion and the first bridging portion.
  • A heat dissipating device is also provided. The heat dissipating device includes a base and a heat dissipating fins set positioned on the base. The heat dissipating fins set includes a plurality of heat dissipating fins. Each of the heat dissipating fins includes a main body and a through hole formed on the main body. The through hole includes at least two collar portions, and the collar portions are formed on an edge of the through hole. Each of the collar portions includes a first extending portion and a first bridging portion, and at least a pipe passing through the through holes of the heat dissipating fins. A first angle is formed between the first extending portion and the first bridging portion.
  • In sum, according to the heat dissipating fin and the heat dissipating device in the embodiments of the disclosure, a uniform holding force is formed between the heat dissipating fin and the pipe, the damage of the pipe in the assembly is reduced, and the heat dissipation efficiency is improved.
  • These and other features, aspects and advantages of the present disclosure will become better understood with regard to the following description, appended claims, and accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic diagram showing a heat dissipating fin in an embodiment of the disclosure;
  • FIG. 2 is a schematic diagram showing a cross section of the heat dissipating fin in FIG. 1 along the cross line DD;
  • FIG. 3 is an enlarged view showing a through hole of the heat dissipating fin in FIG. 1;
  • FIG. 4 is a schematic diagram showing the assembly of a heat dissipating device in a first embodiment;
  • FIG. 5 is a partial exploded view showing a heat dissipating device in a first embodiment;
  • FIG. 6A is a schematic diagram showing a side cross section of a heat dissipating device along the cross line AA;
  • FIG. 6B is an enlarged view showing a part of the selected part C of a heat dissipating device in FIG. 6A; and
  • FIG. 6C is a schematic diagram showing a side cross section of a heat dissipating device in FIG. 5 along the cross line BB.
    •  DETAILED DESCRIPTION OF THE EMBODIMENTS
  • A heat dissipating fin and a heat dissipating device will be illustrated with relating drawings, and the same number donates the same component.
  • FIG. 1 is a schematic diagram showing a heat dissipating fin in an embodiment of the disclosure. FIG. 2 is a schematic diagram showing a cross section of the heat dissipating fin in FIG. 1 along the cross line DD. FIG. 3 is an enlarged view showing a through hole of the heat dissipating fin in FIG. 1.
  • In an embodiment, a heat dissipating fin 1 includes a main body 10 and at least a through hole 12 formed on the main body 10. In the embodiment, the number of the through hole 12 is four, however, the number of the through hole 12 is not a limitation herein. In an embodiment, the material of the heat dissipating fin 1 is aluminum, copper, aluminum alloy, copper alloy or copper aluminum alloy which is not limited herein.
  • Each through hole 12 at least includes two collar portions 122, each collar portion 122 forms on the edge of the through hole 12. The collar portions 122 are formed by punching, and thus one end of the collar portion 122 is connected to the through hole 120. In the embodiment, four collar portions 122 are shown, and the collar portions 12 are arranged at intervals to allow an elastic deformation for the collar portions 122, so as to decrease accumulated tolerance when multiple heat dissipating fins are assembled.
  • Please refer to FIG. 2 and FIG. 2, each collar portion 122 includes a first extending portion 122A and a first bridging portion 122B. A first angle θ1 is formed between the first extending portion 122A and the first bridging portion 122B.
  • In an embodiment, the first angle θ1 formed between the first extending portion 122A and the first bridging portion 122B is an acute angle. That is, the diameter R1 of the first extending portion 122A is larger than the diameter R2 of the first bridging portion 122B. The diameter R1 is the diameter of the widest part of the first extending portion 122A, and the diameter R2 is the diameter of the narrowest part of the first bridging portion 122B. That is, the first extending portion 122A of the collar portion 122 bends inwardly towards the extending direction of the center axis of the through hole 12, thus the first bridging portion 122B is sleeved into the through hole of another adjacent heat dissipating fin while multiple fins are assembled together.
  • In an embodiment, the thickness of the heat dissipating fin 1 is about 0.4 mm, the heat dissipating has a punched hole with the diameter of 0.6 mm to form the first bridging portion 122B. Then, a punched hole with the diameter of 0.62 mm is punched to form the first extending portion 122A. In another embodiment, the thickness of the heat dissipating fin 1 is about 0.3 mm, the heat dissipating fin 1 have a punched hole with the diameter of 0.59 mm to form the first bridging portion 122B. Then, a punched hole with the diameter of 0.60 mm is punched to form the first extending portion 122A. It is to be understood that the diameters disclosed above are for examples and can be varied according to different requirements, which is not limited herein.
  • In the embodiment, the heat dissipating fin 1 at least includes two embedding slots 14, and each embedding slot 14 cooperates with the base. When multiple heat dissipating fins 1 are assembled together to form a heat dissipating fin set, the embedding slot 14 fastens the adjacent heat dissipating fin 1, and embedded to the base. The embedding slot 14 is formed at the main body 10 of the heat dissipating fin 1. In this embodiment, the embedding slot 14 is formed at the edge of the main body 10, and the embedding slot 14 and the collar portions 122 are formed at opposite surfaces.
  • The embedding slot 14 includes a second extending portion 142A and a second bridging portion 142B. When multiple heat dissipating fins 1 are assembled together to form a heat dissipating fin set, the second bridging portion 142B is sleeved at the embedding slot 14 of the adjacent heat dissipating fin 1. As a result, the heat dissipating fin 1 is fastened to the adjacent heat dissipating fin via the first bridging portion 122B of the collar portions 122 and the second bridging portion 142B of the embedding slot 14.
  • Similarly, the second angle θ2 formed between the second extending portion 142A and the second bridging portion 142B is an acute angle. That is, the diameter R3 of the second extending portion 142A is larger than the diameter R4 of the second bridging portion 142B. The diameter R3 is the diameter of the widest part of the second extending portion 142A, and the diameter R4 is the diameter of the narrowest part of the second bridging portion 142B. That is, the second extending portion 142A of the embedding slot 14 bends inwardly towards the extending direction of the center axis of the through hole 12, and the second bridging portion 142B is easily sleeved into the embedding slot of the adjacent heat dissipating fin.
  • In the embodiment, the heat dissipating fin 1 further includes at least two flow deflectors 16, the flow deflectors 16 are disposed at the main body 10, and they are preferably disposed at the edge of the main body 10 and close to the base. When multiple heat dissipating fins 1 are assembled to form the heat dissipating fins set, the flow deflectors 16 on the adjacent heat dissipating fins 1 forms an air guiding channel to improve the heat dissipation efficient of the base and avoid the turbulence.
  • FIG. 4 is a schematic diagram showing the assembly of a heat dissipating device in a first embodiment. FIG. 5 is a partial exploded view showing a heat dissipating device in a first embodiment.
  • In the embodiment, the heat dissipating device includes a heat dissipating fins set, at least a pipe 2 and a base 3. The heat dissipating fins set is disposed at the base 3. The heat dissipating fins set includes multiple heat dissipating fins 1, and the pipe 2 passes through the through hole 12 of each heat dissipating fin 1.
  • Additionally, the heat dissipating device further includes at least a fan 4, as shown in FIG. 4, one fan 4 is disposed on the heat dissipating fins set, which is not limited herein.
  • The base 3 is made of a heat conduction material such as aluminum or copper, which is not limited herein. In an embodiment, the base 3 contacts a heat source element (not shown) directly such as a display adapter and a chip for a better heat dissipation result. The base 3 further includes multiple ribs 32 for being embedded, fastened, or accommodated to the embedding slot 14.
  • In Brief, the embedding slot 14 of the heat dissipating fin 1 is attached to the ribs 32 of the base 3 thus to fix the heat dissipating fins set. In addition, the heat dissipation efficient can be improved.
  • In the embodiment, the pipe 2 is a vacuum chamber, and the inner wall of the vacuum chamber includes a sinter layer, and the sinter layer includes liquid heat transfer medium therein. In an embodiment, multiple pipes 2 are included, and thus the number of the through holes 12 is increased accordingly. In an embodiment, the pipe 2 is U-shaped which has a heated end and a condensing end.
  • In FIG. 4, the assembly of the heat dissipating device is shown. In an embodiment, the heat dissipating fins set with intervals is assembled, and then fixes on the base, and the pipe is assembled to the heat dissipating fins set. In the embodiment, after the pipe 2 is assembled to the base 3, the through hole 12 of the heat dissipating fin 1 aims at the pipe 2, and the pipe 2 passes through the heat dissipating fin 1. The first bridging portion 122B of the collar portions 122 of the heat dissipating fin 1 passes through the through hole 12 of the adjacent heat dissipating fin to assemble the adjacent heat dissipating fins 1 at interval. Moreover, the rib 32 of the base 3 is embedded to the embedding slot 14 of the heat dissipating fin 1.
  • There are other configurations of the heat dissipating fin 1 which are similar to above embodiments, and will be omitted herein.
  • Please refer to FIG. 6A to FIG. 6C, FIG. 6A and FIG. 6C are schematic diagrams showing a side cross section of a heat dissipating device in FIG. 5 along the cross line AA and the cross line BB, respectively. FIG. 6B is an enlarged view showing a part of the selected part C of a heat dissipating device in FIG. 6A.
  • Please refer to FIG. 6A and FIG. 6B, when the pipe 2 passes through the through hole 12 of each heat dissipating fin 1, the outer wall of the pipe 2 is against the first bridging portion 122B to make the first bridging portion 122B deformed and abut against the pipe 2. Consequently, the stability of the heat dissipating fins 1 assembly is improved, furthermore, the contact area between the heat dissipating fin 1 and the pipe 2 is increased, and the heat dissipation efficient is also improved.
  • Please refer to FIG. 6C, when the pipe 2 passes through the heat dissipating fin 1 via the through hole 12, the embedding slot 14 of the heat dissipating fin 1 is embedded to the rib 32 of the base 3. Similarly, the rib 32 is against the second bridging portion 142B to make the second bridging portion 142B deformed and embedded to the base 3, so as to fix the heat dissipating fin 1 to the base 3.
  • The deformation of the first bridging portion 122B and the second bridging portion 142B in FIG. 6C is just an example, the deformation of the second bridging portion 142B is various according to the material of the heat dissipating fin 1, the first angle θ1, the second angle θ2, the diameter and so on.
  • In sum, at least two collar portions are disposed at the through hole of the heat dissipating fin, each of the collar portions includes a first extending portion and a first bridging portion. When the first bridging portion passes through the through hole of the adjacent heat dissipating fin, the adjacent heat dissipating fins are fastened and assembled to form a heat dissipating fins set, and the stability of the connection between the heat dissipating fins can be improved in this manner. Then, by passing through the heat dissipating fin at the pipe orderly, a stable holding force can be provided when the heat dissipating fin and the pipe are assembled, and then the pipe would not be damaged in the assembly. Additionally, according to the structure of the heat dissipating fin, the pipe would be against the first extending portion in the assembly, and the first extending portion would abut against the pipe, and then the contact area between the heat dissipating fin and the pipe is improved, and the heat dissipation affection is also improved.
  • Although the present disclosure has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.

Claims (16)

What is claimed is:
1. A heat dissipating fin, comprising:
a main body; and
a plurality of through holes formed at the main body, wherein each of the through holes includes at least two collar portions, and the collar portions are formed on an edge of the through hole, and each of the collar portions includes a first extending portion and a first bridging portion, a first angle is formed between the first extending portion and the first bridging portion.
2. The heat dissipating fin according to claim 1, wherein the first angle is an acute angle.
3. The heat dissipating fin according to claim 1, wherein the diameter of the first extending portion is larger than the diameter of the first bridging portion.
4. The heat dissipating fin according to claim 1, wherein the heat dissipating fin further includes at least two embedding slots formed at the main body, the embedding slot includes a second extending portion and a second bridging portion, and a second angle is formed between the second extending portion and the second bridging portion.
5. The heat dissipating fin according to claim 4, wherein the second angle is an acute angle.
6. The heat dissipating fin according to claim 4, wherein the diameter of the second extending portion is larger than the diameter of the second bridging portion.
7. The heat dissipating fin according to claim 1, further comprising at least two flow deflectors disposed at the main body.
8. A heat dissipating device, comprising:
a base,
a heat dissipating fins set positioned on the base, wherein the heat dissipating fins set includes a plurality of heat dissipating fins, each of the heat dissipating fins includes:
a main body; and
a plurality of through hole formed on the main body, each of the through holes includes at least two collar portions, and the collar portions are formed on an edge of the through hole, and each of the collar portions includes:
a first extending portion and a first bridging portion, wherein a first angle is formed between the first extending portion and the first bridging portion; and
at least a pipe passing through the through holes of the heat dissipating fins.
9. The heat dissipating device according to claim 8, further comprising a fan disposed at the heat dissipating fins set.
10. The heat dissipating device according to claim 8, wherein the base further includes a plurality of ribs.
11. The heat dissipating device according to claim 8, wherein the first angle is an acute angle.
12. The heat dissipating device according to claim 8, wherein the diameter of the first extending portion is larger than the diameter of the first bridging portion.
13. The heat dissipating device according to claim 8, wherein the heat dissipating fin further includes at least two embedding slots disposed at the main body, the embedding slot includes a second extending portion and a second bridging portion, and a second angle is formed between the second extending portion and the second bridging portion.
14. The heat dissipating device according to claim 13, wherein the second angle is an acute angle.
15. The heat dissipating device according to claim 13, wherein the diameter of the second extending portion is larger than the diameter of the second bridging portion.
16. The heat dissipating device according to claim 8, further comprising at least two flow deflectors formed at the main body.
US14/575,708 2013-12-18 2014-12-18 Heat dissipating fin and heat dissipating device Abandoned US20150168082A1 (en)

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TW102146943A TWI531776B (en) 2013-12-18 2013-12-18 Heat dissipating fin and heat dissipating device

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Publication number Priority date Publication date Assignee Title
IT201600099709A1 (en) * 2016-10-05 2018-04-05 Novamet S R L Fin for the production of finned tube heat exchangers and process for the production of finned tube heat exchangers by means of said fin.
US20180297144A1 (en) * 2017-04-13 2018-10-18 Raytheon Company Integration of ultrasonic additive manufactured thermal structures in brazements
US20220107555A1 (en) * 2019-02-19 2022-04-07 Sony Group Corporation Light source unit and projection-type display apparatus

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US20070011877A1 (en) * 2005-07-12 2007-01-18 Kuo-Hsin Chen Method for fabricating cooling device
US20110277965A1 (en) * 2010-05-14 2011-11-17 Asia Vital Components Co., Ltd. Fin and heat sink having the same
US20110315365A1 (en) * 2010-06-23 2011-12-29 Shyh-Ming Chen Heat sink and method for manufacturing the same

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* Cited by examiner, † Cited by third party
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US20070011877A1 (en) * 2005-07-12 2007-01-18 Kuo-Hsin Chen Method for fabricating cooling device
US20110277965A1 (en) * 2010-05-14 2011-11-17 Asia Vital Components Co., Ltd. Fin and heat sink having the same
US20110315365A1 (en) * 2010-06-23 2011-12-29 Shyh-Ming Chen Heat sink and method for manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201600099709A1 (en) * 2016-10-05 2018-04-05 Novamet S R L Fin for the production of finned tube heat exchangers and process for the production of finned tube heat exchangers by means of said fin.
US20180297144A1 (en) * 2017-04-13 2018-10-18 Raytheon Company Integration of ultrasonic additive manufactured thermal structures in brazements
US10766097B2 (en) * 2017-04-13 2020-09-08 Raytheon Company Integration of ultrasonic additive manufactured thermal structures in brazements
US20220107555A1 (en) * 2019-02-19 2022-04-07 Sony Group Corporation Light source unit and projection-type display apparatus
US12001128B2 (en) * 2019-02-19 2024-06-04 Sony Group Corporation Light source unit for projection type display apparatus

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TW201525404A (en) 2015-07-01

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