TW201522516A - Silane compound polymer, curable composition, cured product, and method for using cured composition - Google Patents

Silane compound polymer, curable composition, cured product, and method for using cured composition Download PDF

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TW201522516A
TW201522516A TW103132586A TW103132586A TW201522516A TW 201522516 A TW201522516 A TW 201522516A TW 103132586 A TW103132586 A TW 103132586A TW 103132586 A TW103132586 A TW 103132586A TW 201522516 A TW201522516 A TW 201522516A
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decane compound
compound polymer
decane
carbon atoms
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Hidekazu Nakayama
Masami Matsui
Mikihiro Kashio
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Lintec Corp
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • HELECTRICITY
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    • H01L2924/1204Optical Diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
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    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

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Abstract

A silane compound copolymer represented by formula (a-1) [In the formula, R1 represents a hydrogen atom or a C1-6 alkyl group; X0 represents a sulfur atom-containing functional group; D represents a C1-20 bivalent organic group having a single bond, or an unsubstituted or substituted group; R2 represents a C1-20 alkyl group having an unsubstituted or substituted group (excluding a sulfur atom-containing functional group), or a phenyl group having an unsubstituted or substituted group; Z1 represents a hydroxyl group or a C1-10 alkoxy group; Z2 represents a hydroxyl group, a C1-10 alkoxy group, or a halogen atom; m represents a positive integer; and n, o, p, q, and r each independently represents a 0 or a positive integer.]; a curable composition containing the aforementioned silane compound polymer; a cured product obtained by curing said composition; and a method for using said composition as an adhesive agent for an optical element or a sealing agent for an optical element. Formula (a-1) is (CHR1X0-D-SiO3/2)m(R2SiO3/2)n(CHR1X0-D-SiZ1O2/2)o(R2SiZ2O2/2)p(CHR1X0-D-SiZ1 2O1/2)q(R2SiZ2 2O1/2)r.

Description

矽烷化合物聚合物、硬化性組成物、硬化物及硬化性組成物的使用方法 Method for using decane compound polymer, curable composition, cured product, and curable composition

本發明係關於有用於作為硬化性組成物的主成分、具有含硫的官能基之矽烷化合物聚合物、含有該矽烷化合物聚合物之硬化性組成物、使該組成物硬化而成之硬化物、以及將前述組成物使用作為光元件用接著劑或光元件用封裝劑之方法。 The present invention relates to a decane compound polymer having a sulfur-containing functional group as a main component of a curable composition, a curable composition containing the decane compound polymer, and a cured product obtained by curing the composition. And a method of using the above composition as an adhesive for an optical element or an encapsulant for an optical element.

近年來,在製造光元件封裝體時,硬化性組成物逐漸被利用作為光元件用接著劑、光元件用封裝劑等的光元件固定材用組成物。 In the production of the optical element package, the curable composition is used as a composition for an optical element fixing material such as an adhesive for an optical element or an encapsulant for an optical element.

光元件係有半導體雷射(LD)等各種雷射、發光二極體(LED)等的發光元件、受光元件、複合光元件、光積體電路等。近年來,已開發發光尖峰波長更短波長的藍色光和白色光之光元件且逐漸被廣泛地使用。此種發光尖峰波長短的發光元件之高亮度化飛躍地進展,伴隨著此情形,光元件的發熱量有進一步變大之傾向。 The optical element includes a light-emitting element such as a semiconductor laser (LD), a light-emitting element such as a light-emitting diode (LED), a light-receiving element, a composite optical element, and an optical unit circuit. In recent years, blue light and white light light elements having shorter wavelengths of light-emitting peak wavelengths have been developed and are gradually being widely used. The high luminance of such a light-emitting element having a short light-emitting peak wavelength is progressing violently, and in this case, the heat generation amount of the optical element tends to be further increased.

近年來,伴隨著光元件的高亮度化,由於光元件固定材用組成物的硬化物長時間被暴露源自更高能量的光線和光元件所產生之更高溫的熱量,而造成劣化且產生龜裂、或 接著力低落之問題。 In recent years, with the increase in the brightness of the optical element, the cured product of the composition for the optical element fixing material is exposed to higher-energy light and higher-temperature heat generated by the optical element for a long period of time, causing deterioration and producing a turtle. Crack, or Then the problem of low power.

為了解決該課題,在專利文獻1~3,提案揭示一種以聚倍半矽氧烷(polysilsesquioxane)化合物作為主成分之光元件固定材用組成物。 In order to solve this problem, Patent Literatures 1 to 3 propose a composition for an optical element fixing material containing a polysilsesquioxane compound as a main component.

但是,在專利文獻1~3所記載之以聚倍半矽氧烷化合物作為主成分之光元件固定材用組成物的硬化物,亦有難以保持充分的接著力之情形。 However, in the cured product of the composition for an optical element fixing material containing a polysilsesquioxane compound as a main component described in Patent Documents 1 to 3, it is difficult to maintain a sufficient adhesion.

因而,被渴望開發一種能夠得到具有更優異的接著性的硬化物之硬化性組成物。 Therefore, it has been desired to develop a curable composition capable of obtaining a cured product having more excellent adhesion.

[先行技術文獻] [Advanced technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2004-359933號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-359933

[專利文獻2]日本特開2005-263869號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-263869

[專利文獻3]日本特開2006-328231號公報 [Patent Document 3] Japanese Laid-Open Patent Publication No. 2006-328231

本發明係鑒於先前技術的實際情形而進行者,以提供有用於作為硬化性組成物的主成分、具有含硫的官能基之矽烷化合物聚合物、含有該矽烷化合物聚合物之能夠得到具有優異的接著性的硬化物之硬化性組成物、將該組成物硬化而成之硬化物、以及將前述組成物使用作為光元件用接著劑或光元件用封裝劑之方法為課題。 The present invention has been made in view of the actual circumstances of the prior art, and is provided with a decane compound polymer having a sulfur-containing functional group as a main component of a curable composition, and a polymer containing the decane compound can be obtained excellent. A curable composition of a cured product, a cured product obtained by curing the composition, and a method of using the composition as an adhesive for an optical element or an encapsulant for an optical element are problems.

為了解決上述課題,本發明者等重複專心研究。其結果,如以下所敘述,發現含有具有含硫原子的官能基之特定矽烷化合物聚合物之硬化性組成物,即便不含有其他添加劑等,亦能夠成為具有非常優異的接著性之硬化物,而完成本發明。 In order to solve the above problems, the inventors of the present invention have repeatedly studied intensively. As a result, as described below, it has been found that a curable composition containing a specific decane compound polymer having a functional group containing a sulfur atom can be a cured product having extremely excellent adhesion without containing other additives. The present invention has been completed.

因此,依照本發明,能夠提供下述[1]~[10]的矽烷化合物聚合物、[11]~[12]的硬化性組成物、[13]、[14]之硬化物、以及[15]、[16]之硬化性組成物的使用方法。 Therefore, according to the present invention, the following decane compound polymers of [1] to [10], the curable composition of [11] to [12], the cured products of [13], [14], and [15] can be provided. The method of using the curable composition of [16].

[1]以下式(a-1)所示的矽烷化合物聚合物 [1] a decane compound polymer represented by the following formula (a-1)

(CHR1X0-D-SiO3/2)m(R2SiO3/2)n(CHR1X0-D-SiZ1O2/2)o(R2SiZ2O2/2)p(CHR1X0-D-SiZ1 2O1/2)q(R2SiZ2 2O1/2)r...(a-1) (CHR 1 X 0 -D-SiO 3/2 ) m (R 2 SiO 3/2 ) n (CHR 1 X 0 -D-SiZ 1 O 2/2 ) o (R 2 SiZ 2 O 2/2 ) p (CHR 1 X 0 -D-SiZ 1 2 O 1/2 ) q (R 2 SiZ 2 2 O 1/2 ) r . . . (a-1)

[式中,R1係表示氫原子或碳數1~6的烷基,X0係表示含硫原子的官能基,D係表示單鍵、或是未取代或具有取代基之碳數1~20之二價有機基,R2係表示未取代或具有取代基(但是不包括含硫原子的官能基)之碳數1~20的烷基、或是未取代或具有取代基之苯基,Z1係表示羥基或碳數1~10的烷氧基,Z2係表示羥基、碳數1~10的烷氧基或鹵素原子,m係表示正整數,n、o、p、q、r係各自獨立表示0或正整數]。 [wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X 0 represents a functional group containing a sulfur atom, and D represents a single bond or a carbon number of an unsubstituted or substituted group 1~ a divalent organic group of 20, and R 2 represents an alkyl group having 1 to 20 carbon atoms which is unsubstituted or has a substituent (but does not include a functional group containing a sulfur atom), or an unsubstituted or substituted phenyl group. Z 1 represents a hydroxyl group or an alkoxy group having 1 to 10 carbon atoms, Z 2 represents a hydroxyl group, an alkoxy group having 1 to 10 carbon atoms or a halogen atom, and m represents a positive integer, n, o, p, q, r Each independently represents 0 or a positive integer].

[2]如[1]所述之矽烷化合物聚合物,其中X0的含硫原子的官能基為下式(i)或是式(ii)表示之基、或該等基衍生之基-SH (i) [2] The decane compound polymer according to [1], wherein the sulfur atom-containing functional group of X 0 is a group represented by the following formula (i) or formula (ii), or a group-derived group-SH (i)

-S-CO-R’ (ii) -S-CO-R’ (ii)

[式中,R’係表示碳數1~20之一價有機基]。 [In the formula, R' represents a one-valent organic group having 1 to 20 carbon atoms].

[3]如[1]所述之矽烷化合物聚合物,其中n為正整數。 [3] The decane compound polymer according to [1], wherein n is a positive integer.

[4]如[1]所述之矽烷化合物聚合物,其中(m+o+q)與(n+p+r)之比例[(m+o+q):(n+p+r)]為5:95~80:20。 [4] The decane compound polymer according to [1], wherein the ratio of (m+o+q) to (n+p+r) [(m+o+q):(n+p+r)] It is 5:95~80:20.

[5]如[1]所述之矽烷化合物聚合物,其中重量平均分子量為1,000~30,000。 [5] The decane compound polymer according to [1], wherein the weight average molecular weight is from 1,000 to 30,000.

[6]一種矽烷化合物聚合物,係將以式(1):R1-CH(X0)-D-Si(OR3)3表示的矽烷化合物(1)之至少一種使用作為單體且藉由縮合反應來得到,[式中,R1係表示氫原子或碳數1~6的烷基、X0係表示含硫原子的官能基,D係表示單鍵、或是未取代或具有取代基之碳數1~20之二價烴基,R3係表示碳數1~10的烷基]。 [6] A decane compound polymer which uses at least one of the decane compound (1) represented by the formula (1): R 1 -CH(X 0 )-D-Si(OR 3 ) 3 as a monomer and It is obtained by a condensation reaction, wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X 0 represents a functional group containing a sulfur atom, and D represents a single bond, or is unsubstituted or substituted. The divalent hydrocarbon group having a carbon number of 1 to 20, and the R 3 group is an alkyl group having 1 to 10 carbon atoms.

[7]如[6]所述之矽烷化合物聚合物,其中X0的含硫原子的官能基為下式(i)或式(ii)表示之基,-SH (i) [7] The decane compound polymer according to [6], wherein the sulfur atom-containing functional group of X 0 is a group represented by the following formula (i) or formula (ii), -SH (i)

-S-CO-R’ (ii) -S-CO-R’ (ii)

[式中,R’係表示碳數1~20之一價有機基]。 [In the formula, R' represents a one-valent organic group having 1 to 20 carbon atoms].

[8]如[6]所述之矽烷化合物聚合物,係使含有前述矽烷化合物(1)的至少一種、及以式(2):R2Si(OR4)v(X1)3-v表示之矽烷化合物(2)的至少一種之矽烷化合物的混合物縮合而得到,[式中,R2係表示未取代或是具有取代基(但是不包括含硫 原子的官能基)之碳數1~20的烷基、或是未取代或具有取代基之苯基,R4係表示碳數1~10的烷基,X1係表示鹵素原子,v係表示0~3的整數]。 [8] The decane compound polymer according to [6], which comprises at least one of the aforementioned decane compound (1) and a formula (2): R 2 Si(OR 4 ) v (X 1 ) 3-v A mixture obtained by condensing a mixture of at least one of the decane compounds of the decane compound (2), wherein R 2 represents a carbon number of 1 to 1 which is unsubstituted or has a substituent (but does not include a sulfur atom-containing functional group). An alkyl group of 20 or an unsubstituted or substituted phenyl group, R 4 represents an alkyl group having 1 to 10 carbon atoms, X 1 represents a halogen atom, and v represents an integer of 0 to 3].

[9]如[8]所述之矽烷化合物聚合物,其中在前述矽烷化合物的混合物所含有的矽烷化合物(1)與矽烷化合物(2)之莫耳比[矽烷化合物(1):矽烷化合物(2)]為5:95~80:20。 [9] The decane compound polymer according to [8], wherein the molar ratio of the decane compound (1) to the decane compound (2) contained in the mixture of the aforementioned decane compounds [the decane compound (1): decane compound ( 2)] is 5:95~80:20.

[10]如[6]所述之矽烷化合物聚合物,其重量平均分子量為1,000~30,000。 [10] The decane compound polymer according to [6], which has a weight average molecular weight of 1,000 to 30,000.

[11]一種硬化性組成物,係含有如前述[1]至[10]項中任一項所述之矽烷化合物聚合物。 [11] A curable composition comprising the decane compound polymer according to any one of the above [1] to [10].

[12]如[11]所述之硬化性組成物,係光元件固定材用組成物。 [12] The curable composition according to [11], which is a composition for an optical element fixing material.

[13]一種硬化物,係將如前述[11]所述之硬化性組成物硬化而成。 [13] A cured product obtained by curing the curable composition according to the above [11].

[14]如[13]所述之硬化物,係光元件固定材。 [14] The cured product according to [13], which is a light element fixing material.

[15]一種將前述[11]所述之硬化性組成物作為光元件固定材用接著劑使用之方法。 [15] A method of using the curable composition according to [11] as an adhesive for an optical element fixing material.

[16]一種前述[11]所述之硬化性組成物作為光元件固定材用封裝劑使用之方法。 [16] A method of using the curable composition according to the above [11] as an encapsulant for an optical element fixing material.

本發明的矽烷化合物聚合物作為光元件用接著劑、光元件用封裝劑等的硬化性組成物的主成分是有用的。 The decane compound polymer of the present invention is useful as a main component of a curable composition such as an adhesive for an optical element or an encapsulant for an optical element.

使用本發明的硬化性組成物,能夠得到具有極優異接著性之硬化物。 By using the curable composition of the present invention, a cured product having extremely excellent adhesion can be obtained.

本發明的硬化性組成物能夠使用於形成光元件固定材之時,特別是能夠作為光元件用接著劑、及光元件用封裝劑而適宜使用。 When the curable composition of the present invention can be used for forming an optical element fixing material, it can be suitably used as an adhesive for an optical element and an encapsulant for an optical element.

用以實施發明之形態 Form for implementing the invention

以下,將本發明分項為1)矽烷化合物聚合物、2)硬化性組成物、3)硬化物、及4)硬化性組成物的使用方法詳細地說明。 Hereinafter, the method of using the present invention as 1) a decane compound polymer, 2) a curable composition, 3) a cured product, and 4) a curable composition will be described in detail.

1)矽烷化合物聚合物 1) decane compound polymer

本發明之矽烷化合物聚合物,係前述式(a-1)表示的矽烷化合物聚合物(以下,稱為「矽烷化合物聚合物(A)」),或是藉由將前述式(1)表示的矽烷化合物(1)的至少一種作為單體使用的縮合反應所得到的矽烷化合物聚合物(以下,稱為「矽烷化合物聚合物(A’)」)。 The decane compound polymer of the present invention is a decane compound polymer represented by the above formula (a-1) (hereinafter referred to as "decane compound polymer (A)"), or by the above formula (1). A decane compound polymer (hereinafter referred to as "decane compound polymer (A')") obtained by a condensation reaction using at least one of the decane compound (1) as a monomer.

[矽烷化合物聚合物(A)] [Chane Compound Polymer (A)]

矽烷化合物聚合物(A)係下式(a-1)表示之矽烷化合物聚合物。 The decane compound polymer (A) is a decane compound polymer represented by the following formula (a-1).

(CHR1X0-D-SiO3/2)m(R2SiO3/2)n(CHR1X0-D-SiZ1O2/2)o(R2SiZ2O2/2)p(CHR1X0-D-SiZ1 2O1/2)q(R2SiZ2 2O1/2)r...(a-1) (CHR 1 X 0 -D-SiO 3/2 ) m (R 2 SiO 3/2 ) n (CHR 1 X 0 -D-SiZ 1 O 2/2 ) o (R 2 SiZ 2 O 2/2 ) p (CHR 1 X 0 -D-SiZ 1 2 O 1/2 ) q (R 2 SiZ 2 2 O 1/2 ) r . . . (a-1)

在上述式(a-1),以式:-(CHR1X0-D-SiO3/2)-表示之重複單元、以式:-(R2SiO3/2)-表示之重複單元、以式: -(CHR1X0-D-SiZ1O2/2)-表示之重複單元、以式:-(R2SiZ2O2/2)-表示之重複單元、以式:-(CHR1X0-D-SiZ1 2O1/2)-表示之重複單元、及以式:-(R2SiZ2 2O1/2)-表示之重複單元,係各自能夠以下述(a11)~(a16)表示。又,在(a11)~(a16),「-O-」係表示隣接的2個Si原子所共有的氧原子。 In the above formula (a-1), a repeating unit represented by the formula: -(CHR 1 X 0 -D-SiO 3/2 )-, a repeating unit represented by the formula: -(R 2 SiO 3/2 )-, A repeating unit represented by the formula: -(CHR 1 X 0 -D-SiZ 1 O 2/2 )-, a repeating unit represented by the formula: -(R 2 SiZ 2 O 2/2 )-, with the formula: -( CHR 1 X 0 -D-SiZ 1 2 O 1/2 )- represents a repeating unit, and a repeating unit represented by the formula: -(R 2 SiZ 2 2 O 1/2 )-, each of which can be as follows (a11 )~(a16) indicates. Further, in (a11) to (a16), "-O-" means an oxygen atom shared by two adjacent Si atoms.

在本發明所使用的矽烷化合物共聚物(A)中,前述式(a-1)中,m、n、o、p、q、r係各自為2個以上時,前述式(a11)~(a16)表示之重複單元間各自可相同亦可不同。 In the decane compound copolymer (A) used in the present invention, in the above formula (a-1), when each of m, n, o, p, q, and r is two or more, the above formula (a11) to (a) Each of the repeating units indicated by a16) may be the same or different.

式(a-1)中,R1係表示氫原子或碳數1~6的烷基。 In the formula (a-1), R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

作為R1的碳數1~6的烷基,可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基等。 Examples of the alkyl group having 1 to 6 carbon atoms of R 1 include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a second butyl group, a t-butyl group, and a n-pentyl group. Base, n-hexyl, etc.

該等之中,作為R1,以氫原子為佳。 Among these, as R 1 , a hydrogen atom is preferred.

X0係表示含硫原子的官能基。 X 0 represents a functional group containing a sulfur atom.

含硫原子的官能基只要含有硫原子之有機基,沒有特別限制。例如,可舉出下式(i)或式(ii)表示之基、或由這些基衍生之基。所謂「從這些基衍生之基」,係意味著由於製造矽烷化合物聚合物時所產生的副反應,反應而生成式(i)或式(ii)表示之基。 The functional group containing a sulfur atom is not particularly limited as long as it contains an organic group of a sulfur atom. For example, a group represented by the following formula (i) or formula (ii) or a group derived from these groups may be mentioned. The term "base derived from these groups" means a reaction represented by the formula (i) or formula (ii) by a side reaction generated when a decane compound polymer is produced.

-SH (i) -SH (i)

-S-CO-R’ (ii) -S-CO-R’ (ii)

式中,R’係表示碳數1~20之一價有機基。作為碳數1~20之一價有機基,只要-CO-R’能夠具有作為保護基之功能者,沒有特別限制。例如,可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基、正十一基、正十二基等的烷基;未取代或具有取代基之苯基等。 In the formula, R' represents a one-valent organic group having 1 to 20 carbon atoms. The one-valent organic group having 1 to 20 carbon atoms is not particularly limited as long as -CO-R' has a function as a protective group. For example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, t-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl An alkyl group such as a fluorenyl group, a n-decyl group, a n-decyl group, a n-undecyl group, a n-dodecyl group; an unsubstituted or substituted phenyl group;

作為R’的未取代或具有取代基之苯基的取代基,可舉出甲基、乙基、正丙基、異丙基、正丁基等的烷基;氟原子、氯原子、溴原子等的鹵素原子;甲氧基、乙氧基等的烷氧基。 Examples of the substituent of the unsubstituted or substituted phenyl group of R' include an alkyl group such as a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a n-butyl group; and a fluorine atom, a chlorine atom or a bromine atom; Or a halogen atom; an alkoxy group such as a methoxy group or an ethoxy group.

作為R’,係以碳數1~20的烷基為佳,以碳數1~10的烷 基為較佳。 R' is preferably an alkyl group having 1 to 20 carbon atoms and an alkyl group having 1 to 10 carbon atoms. The base is preferred.

在本發明,作為X0之含硫原子的官能基,以式(i)表示之基為特佳。 In the present invention, the functional group containing a sulfur atom of X 0 is particularly preferably a group represented by the formula (i).

D係表示單鍵、或是未取代或具有取代基之碳數1~20之二價烴基。 D represents a single bond or an unsubstituted or substituted divalent hydrocarbon group having 1 to 20 carbon atoms.

作為碳數1~20之二價烴基,可舉出碳數1~20的伸烷基、碳數2~20的伸烯基、碳數2~20的伸炔基、碳數6~20的伸芳基、由(伸烷基、伸烯基、或伸炔基)與伸芳基的組合所構成之碳數7~20之二價基等。 Examples of the divalent hydrocarbon group having 1 to 20 carbon atoms include an alkylene group having 1 to 20 carbon atoms, an extended alkenyl group having 2 to 20 carbon atoms, an extended alkynyl group having 2 to 20 carbon atoms, and a carbon number of 6 to 20; An aryl group, a divalent group having 7 to 20 carbon atoms, or the like, which is composed of a combination of an alkyl group, an alkenyl group or an alkynyl group and an extended aryl group.

作為碳數1~20的伸烷基,可舉出亞甲基、伸乙基、伸丙基、三亞甲基、四亞甲基、五亞甲基、六亞甲基等。 Examples of the alkylene group having 1 to 20 carbon atoms include a methylene group, an exoethyl group, a propyl group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group.

作為碳數2~20的伸烯基,可舉出伸乙烯基、伸丙烯基、伸丁烯基、伸戊烯基等。 Examples of the alkenyl group having 2 to 20 carbon atoms include a vinyl group, a propylene group, a butenyl group, and a pentenyl group.

作為碳數2~20的伸炔基,可舉出伸乙炔基、伸丙炔基等。 Examples of the alkynyl group having 2 to 20 carbon atoms include an exetylene group and a propargylene group.

作為碳數6~20的伸芳基,可舉出鄰伸苯基、間伸苯基、對伸苯基、2,6-伸萘基等。 Examples of the extended aryl group having 6 to 20 carbon atoms include an ortho-phenyl group, an exophenyl group, a para-phenyl group, and a 2,6-anthranyl group.

作為該等碳數1~20的伸烷基、碳數2~20的伸烯基、及碳數2~20的伸炔基所具有的取代基,可舉出氟原子、氯原子等的鹵素原子;甲氧基、乙氧基等的烷氧基;甲氧基羰基、乙氧基羰基等的烷氧基羰基等。 Examples of the substituent of the alkylene group having 1 to 20 carbon atoms, the alkenyl group having 2 to 20 carbon atoms, and the alkynyl group having 2 to 20 carbon atoms include halogens such as fluorine atoms and chlorine atoms. An alkoxy group such as a methoxy group or an ethoxy group; an alkoxycarbonyl group such as a methoxycarbonyl group or an ethoxycarbonyl group; and the like.

作為前述碳數6~20的伸芳基的取代基,可舉出硝基;氟原子、氯原子、溴原子等的鹵素原子;甲基、乙基等的烷基;甲氧基、乙氧基等的烷氧基;甲硫基、乙硫基等的烷硫基等。 Examples of the substituent of the aryl group having 6 to 20 carbon atoms include a nitro group; a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom; an alkyl group such as a methyl group or an ethyl group; and a methoxy group and an ethoxy group. An alkoxy group such as a methyl group; an alkylthio group such as a methylthio group or an ethylthio group; and the like.

該等取代基,可鍵結在伸烷基、伸烯基、伸炔基及伸芳基等的基之任意位置,可以相同或不同而鍵結複數個。 These substituents may be bonded to any of the groups of an alkyl group, an alkenyl group, an alkynyl group, and an extended aryl group, and may be bonded in the same or different numbers.

作為未取代或具有取代基之(伸烷基、伸烯基、或伸炔基)與未取代或具有取代基之伸芳基之組合所構成之二價基,可舉出由前述未取代或具有取代基之(伸烷基、伸烯基、或伸炔基)的至少一種、與前述未取代或具有取代基之伸芳基的至少一種直線地鍵結而成之基等。具體而言,可舉出以下述式表示之基等。 The divalent group consisting of a combination of an unsubstituted or substituted (alkyl, alkenyl, or alkynyl group) and an unsubstituted or substituted aryl group may be exemplified by the aforementioned unsubstituted or At least one of a substituent (alkylene group, an alkenyl group, or an alkynylene group) having at least one of the above-mentioned unsubstituted or substituted aryl groups, and the like. Specifically, a base represented by the following formula and the like can be given.

該等之中,作為D,因為能夠得到具有更高接著力之硬化物,以碳數1~10的伸烷基為佳,以碳數1~6的伸烷基為較佳,以亞甲基或伸乙基為特佳。 Among these, as D, since a cured product having a higher adhesion can be obtained, an alkylene group having 1 to 10 carbon atoms is preferred, and an alkylene group having 1 to 6 carbon atoms is preferred, and The base or the ethyl group is particularly preferred.

R2係表示未取代或是具有取代基(但是不包括含硫原子的官能基)之碳數1~20的烷基、或是未取代或具有取代基之苯基。 R 2 represents an alkyl group having 1 to 20 carbon atoms which is unsubstituted or has a substituent (but does not include a functional group containing a sulfur atom), or an unsubstituted or substituted phenyl group.

R2之碳數1~20的烷基,可舉出甲基、乙基、正丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基、正戊基、正己基、正辛基、異辛基、正壬基、正癸基、正十二基等。 The alkyl group having 1 to 20 carbon atoms of R 2 may, for example, be a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a second butyl group, an isobutyl group, a t-butyl group or a n-pentyl group. , n-hexyl, n-octyl, isooctyl, n-decyl, n-decyl, n-decyl and the like.

作為R2之具有取代基之碳數1~20的烷基的取代基,可舉出甲氧基、乙氧基等碳數1~6的烷氧基;苯基、4-甲基苯基、3-甲氧基苯基、2,4-二氯苯基、1-萘基、2-萘基等未取代或具有取代基之芳基;氟原子、氯原子等的鹵素原子;氰基;乙醯氧基、苯甲醯基等以式OG表示之基(式中,G係表示羥基的保護基)等。 Examples of the substituent of the alkyl group having 1 to 20 carbon atoms which has a substituent of R 2 include alkoxy groups having 1 to 6 carbon atoms such as a methoxy group and an ethoxy group; and a phenyl group and a 4-methylphenyl group; , an aryl group having an unsubstituted or substituted group such as a 3-methoxyphenyl group, a 2,4-dichlorophenyl group, a 1-naphthyl group or a 2-naphthyl group; a halogen atom such as a fluorine atom or a chlorine atom; and a cyano group; A group represented by the formula OG, such as an ethoxycarbonyl group or a benzamidine group (wherein G represents a protective group of a hydroxyl group).

作為R2之具有取代基之苯基的取代基,可舉出甲基、乙基、正丙基、異丙基、正丁基等的烷基;甲氧基、乙氧基等的烷氧基;氟原子、氯原子等的鹵素原子等。 Examples of the substituent of the phenyl group having a substituent of R 2 include an alkyl group such as a methyl group, an ethyl group, a n-propyl group, an isopropyl group or a n-butyl group; and an alkoxy group such as a methoxy group or an ethoxy group. A halogen atom such as a fluorine atom or a chlorine atom.

該等之中,R2以碳數1~20的烷基或是未取代或具有取代基之苯基為佳,以碳數1~6的烷基或是未取代或具有取代基之苯基為較佳,以碳數1~6的烷基或苯基為特佳。 Among these, R 2 an alkyl group having 1 to 20 carbon atoms or an unsubstituted or substituted phenyl group of the preferred, an alkyl group having 1 to 6 carbon atoms or unsubstituted or substituted phenyl group of Preferably, it is particularly preferably an alkyl group having 1 to 6 carbon atoms or a phenyl group.

Z1係表示羥基或碳數1~10的烷氧基。 Z 1 represents a hydroxyl group or an alkoxy group having 1 to 10 carbon atoms.

作為Z1之碳數1~10的烷氧基,可舉出甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、第三丁氧基、戊氧基、己氧基、辛氧基等。 Examples of the alkoxy group having 1 to 10 carbon atoms of Z 1 include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a third butoxy group, a pentyloxy group, and a hexyloxy group. Base, octyloxy, etc.

該等之中,Z1係以羥基或碳數1~6的烷氧基為佳。 Among these, Z 1 is preferably a hydroxyl group or an alkoxy group having 1 to 6 carbon atoms.

Z2係表示羥基、碳數1~10的烷氧基或鹵素原子。 Z 2 represents a hydroxyl group, an alkoxy group having 1 to 10 carbon atoms or a halogen atom.

作為Z2之碳數1~10的烷氧基,可舉出與已揭示作為Z1之碳數1~10的烷氧基相同者。 The alkoxy group having 1 to 10 carbon atoms of Z 2 may be the same as the alkoxy group having a carbon number of 1 to 10 which is disclosed as Z 1 .

作為Z2之鹵素原子,可舉出氯原子、溴原子等。 Examples of the halogen atom of Z 2 include a chlorine atom and a bromine atom.

該等之中,Z2係以羥基或碳數1~6的烷氧基為佳。 Among these, Z 2 is preferably a hydroxyl group or an alkoxy group having 1 to 6 carbon atoms.

m係表示正整數。 The m system represents a positive integer.

n、o、p、q、r係各自獨立且表示0或正整數。尤其是n 以正整數為佳。藉由將含有n為正整數之矽烷化合物聚合物(A)的硬化性組成物硬化,能夠得到具有更優異的接著性之硬化物。 n, o, p, q, and r are each independent and represent 0 or a positive integer. Especially n It is better to use a positive integer. By hardening the curable composition containing the decane compound polymer (A) in which n is a positive integer, a cured product having more excellent adhesion can be obtained.

(m+o+q)與(n+p+r)之比例[(m+o+q):(n+p+r)]係以5:95~80:20為佳,以10:90~70:30為較佳,以20:80~65:35為更佳,以30:70~60:40為特佳。藉由將含有(m+o+q)與(n+p+r)之比例為此種範圍內之矽烷化合物聚合物(A)的硬化性組成物硬化,能夠得到具有更優異的接著性之硬化物。 The ratio of (m+o+q) to (n+p+r) [(m+o+q):(n+p+r)] is preferably 5:95~80:20, 10:90 ~70:30 is better, 20:80~65:35 is better, and 30:70~60:40 is especially good. By curing a curable composition containing a ratio of (m+o+q) to (n+p+r) to the decane compound polymer (A) in such a range, it is possible to obtain a more excellent adhesion property. Hardened material.

又,基於同樣的理由,m與n的比例(m:n)係以5:95~80:20為佳,以10:90~70:30為較佳,以20:80~65:35為更佳,以30:70~60:40為特佳。 Moreover, for the same reason, the ratio of m to n (m:n) is preferably 5:95 to 80:20, preferably 10:90 to 70:30, and 20:80 to 65:35. Better, 30:70~60:40 is especially good.

該等值例如能夠測定矽烷化合物聚合物(A)的核磁共振光譜(NMR spectrum)而定量。 The equivalent value can be determined, for example, by measuring the nuclear magnetic resonance spectrum (NMR spectrum) of the decane compound polymer (A).

當矽烷化合物聚合物(A)為共聚物時,矽烷化合物聚合物(A)可以是無規共聚物、嵌段共聚物、接枝共聚物、交替共聚物等的任一種共聚物。該等之中,以無規共聚物為佳,又,矽烷化合物聚合物(A)的構造係可以是梯型(ladder type)構造、雙層結構(double-decker)型構造、籠型構造、部分開裂籠型構造、環狀型構造、無規型構造的任一種構造。 When the decane compound polymer (A) is a copolymer, the decane compound polymer (A) may be any copolymer of a random copolymer, a block copolymer, a graft copolymer, an alternating copolymer or the like. Among these, a random copolymer is preferred, and the structure of the decane compound polymer (A) may be a ladder type structure, a double-decker type structure, a cage structure, Any of the structures of a partially cleft-cage structure, a ring-shaped structure, and a random structure.

矽烷化合物聚合物(A)的重量平均分子量(Mw),係以400~30,000的範圍為佳,較佳為600~10,000,特佳為800~3,000的範圍。藉由將含有具有該此種範圍內的重量平均分子量的矽烷化合物聚合物(A)之硬化性組成物硬化,能夠得到具有更優異的接著性之硬化物。 The weight average molecular weight (Mw) of the decane compound polymer (A) is preferably in the range of 400 to 30,000, preferably 600 to 10,000, particularly preferably in the range of 800 to 3,000. By curing the curable composition containing the decane compound polymer (A) having a weight average molecular weight within such a range, a cured product having more excellent adhesion can be obtained.

重量平均分子量(Mw),例如能夠藉由以四氫呋喃(THF)作為溶劑之凝膠滲透層析法(GPC),以標準聚苯乙烯換算值的方式求取(以下相同)。 The weight average molecular weight (Mw) can be determined, for example, by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent, in terms of standard polystyrene (the same applies hereinafter).

矽烷化合物聚合物(A)的分子量分布(Mw/Mn),沒有特別限制,通常為1.0~3.0,較佳為1.1~2.0的範圍。藉由將含有具有該此種範圍內的分子量分布的矽烷化合物聚合物(A)之硬化性組成物硬化,能夠得到可得到具有更優異的接著性之硬化物。 The molecular weight distribution (Mw/Mn) of the decane compound polymer (A) is not particularly limited, and is usually in the range of 1.0 to 3.0, preferably 1.1 to 2.0. By hardening the curable composition containing the decane compound polymer (A) having the molecular weight distribution within such a range, a cured product having more excellent adhesion can be obtained.

本發明的矽烷化合物聚合物(A),例如能夠以如後述之矽烷化合物聚合物(A’)的製造方法之方式,藉由使矽烷化合物(1)等縮合來製造。 The decane compound (A) of the present invention can be produced, for example, by condensing a decane compound (1) or the like in a method for producing a decane compound (A') as described later.

以如後述矽烷化合物聚合物(A’)的製造方法之方式藉由縮合(反應)而得到矽烷化合物聚合物(A)時,矽烷化合物(1)的OR3之中,未被脫水及/或脫醇的部分係殘留在矽烷化合物聚合物(A)中。亦即,殘留的OR3為1個時,在前述式(a-1),係以(CHR1X0-D-SiZ1O2/2)的方式殘留,殘留的OR3為2個時,在前述式(a-1),係以(CHR1X0-D-SiZ1 2O1/2)的方式殘留。 When the decane compound polymer (A) is obtained by condensation (reaction) in the manner of a method for producing a decane compound polymer (A') to be described later, the OR 3 of the decane compound (1) is not dehydrated and/or The dealcoholated portion remains in the decane compound polymer (A). In other words, when there is one residual OR 3 , the above formula (a-1) is retained as (CHR 1 X 0 -D-SiZ 1 O 2/2 ), and when the remaining OR 3 is two In the above formula (a-1), it is retained as (CHR 1 X 0 -D-SiZ 1 2 O 1/2 ).

針對矽烷化合物(2),同樣地,OR4或X1之中,未脫水及/或脫醇的部分係殘留在矽烷化合物聚合物(A)中。亦即,殘留的OR4或X1為1個時,在式(a-1)係以(R2SiZ2O2/2)的方式殘留,殘留的OR4或X1為2個時,在式(a-1),係以(R2SiZ2 2O1/2)的方式殘留。 Similarly to the decane compound (2), among the OR 4 or X 1 , the undehydrated and/or dealcoholated portion remains in the decane compound polymer (A). In other words, when there is one residual OR 4 or X 1 , the formula (a-1) remains as (R 2 SiZ 2 O 2/2 ), and when the remaining OR 4 or X 1 is two, In the formula (a-1), it remains as (R 2 SiZ 2 2 O 1/2 ).

[矽烷化合物聚合物(A’)] [decane compound polymer (A')]

矽烷化合物聚合物(A’)為,藉由式(1): R1-CH(X0)-D-Si(OR3)3表示之矽烷化合物(1)的至少一種作為單體使用之縮合反應而得到之矽烷化合物聚合物。 The decane compound polymer (A') is a condensation which is used as a monomer by at least one of the decane compound (1) represented by the formula (1): R 1 -CH(X 0 )-D-Si(OR 3 ) 3 The decane compound polymer obtained by the reaction.

[矽烷化合物(1)] [decane compound (1)]

矽烷化合物(1)係式(1):R1-CH(X0)-D-Si(OR3)3表示之化合物。藉由使用矽烷化合物(1),能夠得到在硬化後具有良好的透明性、接著力之矽烷化合物聚合物。 The decane compound (1) is a compound represented by the formula (1): R 1 -CH(X 0 )-D-Si(OR 3 ) 3 . By using the decane compound (1), a decane compound polymer having good transparency and adhesion after curing can be obtained.

式(1)中,R1、X0、及D表示與前述相同意思。R3係表示碳數1~10的烷基。OR3彼此之間可相同亦可不同。 In the formula (1), R 1 , X 0 and D represent the same meaning as described above. R 3 represents an alkyl group having 1 to 10 carbon atoms. OR 3 may be the same or different from each other.

作為R3之碳數1~10的烷基,可舉出甲基、乙基、正丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基、正戊基、及正己基等。 Examples of the alkyl group having 1 to 10 carbon atoms of R 3 include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a second butyl group, an isobutyl group, a t-butyl group, and a n-pentyl group. Base, and hexyl group, etc.

矽烷化合物(1)之中,作為X0係以前述式(i)表示的基之矽烷化合物,可舉出氫硫基甲基三甲氧基矽烷、氫硫基甲基三乙氧基矽烷、氫硫基甲基三丙氧基矽烷、2-氫硫基乙基三甲氧基矽烷、2-氫硫基乙基三乙氧基矽烷、2-氫硫基乙基三丙氧基矽烷、3-氫硫基丙基三甲氧基矽烷、3-氫硫基丙基三乙氧基矽烷、3-氫硫基丙基三丙氧基矽烷等的氫硫基烷基三烷氧基矽烷類。 Among the decane compounds (1), examples of the decane compound represented by the above formula (i) as X 0 include thiomethylmethyltrimethoxydecane, thiomethylmethyltriethoxydecane, and hydrogen. Thiomethyltripropoxydecane, 2-hydrothioethyltrimethoxydecane, 2-hydrothioethyltriethoxydecane, 2-hydrothioethyltripropoxydecane, 3- A thiolalkyltrialkalkoxynonane such as hydrogenthiopropyltrimethoxydecane, 3-hydrothiopropyltriethoxydecane or 3-hydrothiopropyltripropoxydecane.

矽烷化合物(1)之中,作為X0係以前述式(ii)表示的基之矽烷化合物,可舉出2-己醯硫基乙基三甲氧基矽烷、2-己醯硫基乙基三乙氧基矽烷、2-辛醯硫基乙基三甲氧基矽烷、2-辛醯硫基乙基三乙氧基矽烷、2-癸醯硫基乙基三甲氧基矽烷、2-癸醯硫基乙基三乙氧基矽烷、3-己醯硫基丙基三甲氧基矽烷、3-己醯硫基丙基三乙氧基矽烷、3-辛醯硫基丙基三甲氧 基矽烷、3-辛醯硫基丙基三乙氧基矽烷、3-癸醯硫基丙基三甲氧基矽烷、3-癸醯硫基丙基三乙氧基矽烷等的烷醯硫基三烷氧基矽烷化合物類。 Among the decane compounds (1), examples of the decane compound represented by the above formula (ii) as X 0 include 2-hexylthioethyltrimethoxydecane and 2-hexylsulfanylethyl three. Ethoxy decane, 2-octyl thioethyl trimethoxy decane, 2-octyl thioethyl triethoxy decane, 2-decyl thioethyl trimethoxy decane, 2- sulfonium sulphide Base ethyl triethoxy decane, 3-hexyl thiopropyl trimethoxy decane, 3-hexyl thiopropyl triethoxy decane, 3-octyl thiopropyl trimethoxy decane, 3 - alkyl sulfonyl trialkoxy decane such as octyl thiopropyltriethoxy decane, 3-decyl propyl trimethoxy decane, 3-decyl propyl propyl triethoxy decane Compound class.

該等矽烷化合物(1)能夠單獨一種、或組合二種以上而使用。 These decane compounds (1) can be used singly or in combination of two or more.

該等之中,作為矽烷化合物(1),因為能夠得到具有更優異的接著性之硬化物,以X0係以前述式(i)表示的基之矽烷化合物為佳。 Among these, as the decane compound (1), since a cured product having more excellent adhesion can be obtained, a decane compound having a group represented by the above formula (i) as X 0 is preferable.

作為矽烷化合物聚合物(A’),以使含有前述矽烷化合物(1)的至少一種、及式(2):R2Si(OR4)v(X1)3-v表示之矽烷化合物(2)的至少一種之矽烷化合物的混合物縮合而得到者為較佳。藉由將含有使此種混合物縮合而得到的矽烷化合物聚合物(A’)之硬化性組成物硬化,能夠得到可得到具有更優異的接著性之硬化物。在此,「縮合」係以包含水解及聚縮合反應之廣闊的概念而使用。 As the decane compound polymer (A'), at least one of the aforementioned decane compound (1) and a decane compound represented by the formula (2): R 2 Si(OR 4 ) v (X 1 ) 3-v (2) It is preferred that a mixture of at least one of the decane compounds is condensed. By curing the curable composition containing the decane compound polymer (A') obtained by condensing such a mixture, a cured product having more excellent adhesion can be obtained. Here, "condensation" is used in a broad concept including hydrolysis and polycondensation reaction.

[矽烷化合物(2)] [decane compound (2)]

矽烷化合物(2)係式(2):R2Si(OR4)v(X1)3-v表示之化合物。 The decane compound (2) is a compound represented by the formula (2): R 2 Si(OR 4 ) v (X 1 ) 3-v .

式(2)中,R2與前述表示相同意思。R4表示與前述R3同樣之碳數1~10的烷基,X1係表示氯原子、溴原子等的鹵素原子,v係表示0~3的整數。 In the formula (2), R 2 has the same meaning as defined above. R 4 represents an alkyl group having 1 to 10 carbon atoms similar to the above R 3 , X 1 represents a halogen atom such as a chlorine atom or a bromine atom, and v represents an integer of 0 to 3.

v為2以上時,OR4彼此之間可相同亦可不同。又,(3-v)為2以上時,X1彼此之間可相同亦可不同。 When v is 2 or more, OR 4 may be the same or different from each other. Further, when (3-v) is 2 or more, X 1 may be the same or different from each other.

作為矽烷化合物(2)的具體例,可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧 基矽烷、正丙基三甲氧基矽烷、正丁基三乙氧基矽烷、異丁基三甲氧基矽烷、正戊基三乙氧基矽烷、正己基三甲氧基矽烷、異辛基三乙氧基矽烷、十二基三甲氧基矽烷、甲基二甲氧乙氧基矽烷、甲基二乙氧基甲氧基矽烷、氯甲基三甲氧基矽烷、溴甲基三乙氧基矽烷、2-氯乙基三丙氧基矽烷、2-溴乙基三丁氧基矽烷、3-氯丙基三甲氧基矽烷、3-氯丙基三乙氧基矽烷、3-乙醯氧基丙基三甲氧基矽烷、3-乙醯氧基丙基三乙氧基矽烷、3-乙醯氧基丙基三丙氧基矽烷等未取代或具有取代基之烷基三烷氧基矽烷化合物類;甲基氯二甲氧基矽烷、甲基氯二乙氧基矽烷、乙基氯二甲氧基矽烷、正丙基氯二甲氧基矽烷、溴甲基溴二甲氧基矽烷、3-乙醯氧基丙基氯二甲氧基矽烷等未取代或具有取代基之烷基鹵二烷氧基矽烷化合物類;甲基二氯甲氧基矽烷、甲基二氯甲氧基矽烷、乙基二氯甲氧基矽烷、正丙基二氯甲氧基矽烷、2-氯乙基二氯甲氧基矽烷、2-溴乙基二氯乙氧基矽烷、3-氯丙基二氯甲氧基矽烷、3-乙醯氧基丙基二氯甲氧基矽烷、3-乙醯氧基丙基二氯乙氧基矽烷等未取代或具有取代基之烷基二鹵烷氧基矽烷化合物類;甲基三氯矽烷、甲基三溴矽烷、乙基三氯矽烷、乙基三溴矽烷、正丙基三氯矽烷、氯甲基三氯矽烷、3-氯丙基三氯矽烷、3-氯丙基三溴矽烷、3-乙醯氧基丙基三氯矽烷、3-乙醯氧基丙基三溴矽烷等未取代或具有取代基之烷基三鹵矽烷化合物類;苯基三甲氧基矽烷、4-甲氧基苯基三甲氧基矽烷、 2-氯苯基三甲氧基矽烷、苯基三乙氧基矽烷、2-甲氧基苯基三乙氧基矽烷、苯基二甲氧乙氧基矽烷、苯基二乙氧基甲氧基矽烷等未取代或具有取代基之苯基三烷氧基矽烷化合物類;苯基氯二甲氧基矽烷、苯基氯甲氧乙氧基矽烷、苯基氯二乙氧基矽烷等未取代或具有取代基之苯基鹵二烷氧基矽烷化合物類;苯基二氯甲氧基矽烷、苯基二氯乙氧基矽烷等未取代或具有取代基之苯基二鹵烷氧基矽烷化合物類;苯基三氯矽烷、苯基三溴矽烷、4-甲氧基苯基三氯矽烷、苯基三氯矽烷、2-乙氧基苯基三氯矽烷、2-氯苯基三氯矽烷等未取代或具有取代基之苯基三鹵矽烷化合物。 Specific examples of the decane compound (2) include methyltrimethoxydecane, methyltriethoxydecane, ethyltrimethoxydecane, and ethyltriethoxylate. Baseline, n-propyltrimethoxydecane, n-butyltriethoxydecane, isobutyltrimethoxydecane, n-pentyltriethoxydecane, n-hexyltrimethoxydecane, isooctyltriethoxy Base decane, dodecyltrimethoxy decane, methyl dimethoxyethoxy decane, methyl diethoxy methoxy decane, chloromethyl trimethoxy decane, bromomethyl triethoxy decane, 2 -chloroethyltripropoxydecane, 2-bromoethyltributoxydecane, 3-chloropropyltrimethoxydecane, 3-chloropropyltriethoxydecane, 3-ethyloxypropyl An alkyltrialkoxy alkane compound of an unsubstituted or substituted group such as trimethoxydecane, 3-ethoxymethoxypropyltriethoxydecane or 3-ethoxymethoxypropyltripropoxydecane; Methylchlorodimethoxydecane, methylchlorodiethoxydecane, ethylchlorodimethoxydecane, n-propylchlorodimethoxydecane, bromomethylbromodimethoxydecane, 3-B An unsubstituted or substituted alkyl halo dialkoxy decane compound such as methoxypropyl chlorodimethoxy decane; methyl dichloromethoxy decane, methyl dichloro methoxy decane , ethyl dichloromethoxy decane, n-propyl dichloromethoxy decane, 2-chloroethyl dichloromethoxy decane, 2-bromoethyl dichloroethoxy decane, 3-chloropropyl An unsubstituted or substituted alkyl dihaloalkoxy group such as chloromethoxy decane, 3-ethoxymethoxypropyl dichloromethoxy decane, 3-ethoxypropyl propyl dichloroethoxy decane Decane compounds; methyltrichlorodecane, methyltribromodecane, ethyltrichlorodecane, ethyltribromodecane, n-propyltrichlorodecane, chloromethyltrichlorodecane, 3-chloropropyltrichloromethane An unsubstituted or substituted alkyl trihalodecane compound such as 3-chloropropyltribromodecane, 3-ethyloxypropyltrichlorodecane or 3-ethoxymethoxypropyltribromodecane; benzene Trimethoxy decane, 4-methoxyphenyl trimethoxy decane, 2-chlorophenyltrimethoxydecane, phenyltriethoxydecane, 2-methoxyphenyltriethoxydecane, phenyldimethoxyethoxynonane, phenyldiethoxymethoxy An unsubstituted or substituted phenyltrialkoxydecane compound such as decane; unsubstituted or phenylchlorodimethoxydecane, phenylchloromethoxyethoxydecane, phenylchlorodiethoxydecane, or the like a phenyl haloalkoxy decane compound having a substituent; an unsubstituted or substituted phenyl dihalo alkoxy decane compound such as phenyldichloromethoxy decane or phenyldichloroethoxy decane; Phenyltrichloromethane, phenyltribromonane, 4-methoxyphenyltrichlorodecane, phenyltrichlorodecane, 2-ethoxyphenyltrichlorodecane, 2-chlorophenyltrichlorodecane, etc. A phenyl trihalodecane compound which is unsubstituted or has a substituent.

該等矽烷化合物(2)能夠單獨一種、或組合二種以上而使用。 These decane compounds (2) can be used singly or in combination of two or more.

該等之中,作為矽烷化合物(2),係以未取代或具有取代基之碳數1~6的烷基三烷氧基矽烷化合物類、未取代或具有取代基之苯基三烷氧基矽烷化合物類為佳。 Among these, as the decane compound (2), an unsubstituted or substituted alkyltrialkoxydecane compound having 1 to 6 carbon atoms, an unsubstituted or substituted phenyltrialkoxy group Decanated compounds are preferred.

[縮合反應] [condensation reaction]

在製造矽烷化合物聚合物(A’)時,可以只使用矽烷化合物(1)而進行縮合反應,亦可使用由矽烷化合物(1)及矽烷化合物(2)所構成之混合物而進行縮合反應。又,在不阻礙本發明的目的之範圍,亦可進一步使用其他矽烷化合物而進行,但是以不使用矽烷化合物(1)及矽烷化合物(2)以外的矽烷化合物為佳。 In the production of the decane compound polymer (A'), the condensation reaction may be carried out using only the decane compound (1), or a mixture of the decane compound (1) and the decane compound (2) may be used for the condensation reaction. Further, other decane compounds may be further used without departing from the object of the present invention, but it is preferred to use a decane compound other than the decane compound (1) and the decane compound (2).

在由矽烷化合物(1)及矽烷化合物(2)所構成的混合物所含有之矽烷化合物(1)與矽烷化合物(2)之莫耳比[矽烷 化合物(1):矽烷化合物(2),從能夠得到具有更優異的接著性的硬化物之觀點,係以5:95~80:20為佳,以10:90~70:30為較佳,以20:80~65:35為更佳,以30:70~60:40為特佳。 The molar ratio of the decane compound (1) to the decane compound (2) contained in the mixture of the decane compound (1) and the decane compound (2) [decane] The compound (1): the decane compound (2) is preferably from 5:95 to 80:20 and preferably from 10:90 to 70:30 from the viewpoint of obtaining a cured product having more excellent adhesion. It is better to use 20:80~65:35, and 30:70~60:40 is especially good.

藉由將含有在該範圍內反應而得到的矽烷化合物聚合物(A’)之硬化性組成物硬化,能夠得到具有更優異的接著性之硬化物。 By curing the curable composition containing the decane compound polymer (A') obtained by the reaction in this range, a cured product having more excellent adhesion can be obtained.

作為使矽烷化合物(1)等縮合之方法,沒有特別限定,可舉出將矽烷化合物(1)等的矽烷化合物溶解在溶劑中,添加預定量的觸媒且在預定溫度攪拌之方法。 The method of condensing the decane compound (1) or the like is not particularly limited, and a method in which a decane compound such as a decane compound (1) is dissolved in a solvent, and a predetermined amount of a catalyst is added and stirred at a predetermined temperature is mentioned.

所使用的觸媒,係酸觸媒及鹼觸媒的任一者均可。 The catalyst to be used may be either an acid catalyst or an alkali catalyst.

作為酸觸媒,可舉出鹽酸、硫酸、硝酸、磷酸等的無機酸;甲磺酸、三氟甲磺酸、苯磺酸、對甲苯磺酸、乙酸、三氟乙酸等的有機酸等。 Examples of the acid catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, and phosphoric acid; organic acids such as methanesulfonic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, acetic acid, and trifluoroacetic acid.

作為鹼觸媒,可舉出三甲胺、三乙胺、鋰二異丙基醯胺、雙(三甲基矽烷基)醯胺鋰、吡啶、1,8-二氮雜雙環[5.4.0]-7-十一烯、苯胺、甲吡啶、1,4-二氮雜雙環[2.2.2]辛烷、咪唑等的有機鹼;氫氧化四甲銨、氫氧化四乙銨等的有機鹽氫氧化物;甲醇鈉、乙醇鈉、第三丁醇鈉、第三丁醇鉀等的烷醇金屬;氫化鈉、氫化鈣等的金屬氫化物;氫氧化鈉、氫氧化鉀、氫氧化鈣等的金屬氫氧化物;碳酸鈉、碳酸鉀、碳酸鎂等的金屬碳酸鹽;碳酸氫鈉、碳酸氫鉀等的金屬碳酸氫鹽等。 Examples of the base catalyst include trimethylamine, triethylamine, lithium diisopropyl decylamine, lithium bis(trimethyldecyl) guanamine, pyridine, and 1,8-diazabicyclo [5.4.0]. -7-undecene, aniline, pyridyl, 1,4-diazabicyclo[2.2.2]octane, organic base such as imidazole; organic salt hydrogen such as tetramethylammonium hydroxide or tetraethylammonium hydroxide Oxide; metal alkoxide such as sodium methoxide, sodium ethoxide, sodium butoxide or potassium t-butoxide; metal hydride such as sodium hydride or calcium hydride; sodium hydroxide, potassium hydroxide, calcium hydroxide, etc. Metal hydroxide; metal carbonate such as sodium carbonate, potassium carbonate or magnesium carbonate; metal hydrogencarbonate such as sodium hydrogencarbonate or potassium hydrogencarbonate.

觸媒的使用量,相對於矽烷化合物的總莫耳量,通常為0.1mol%~10mol%,較佳為1mol%~5mol%的範圍。 The amount of the catalyst used is usually from 0.1 mol% to 10 mol%, preferably from 1 mol% to 5 mol%, based on the total moles of the decane compound.

所使用的溶劑,能夠按照矽烷化合物的種類等而適當地選擇。例如,可舉出水;苯、甲苯、二甲苯等的芳香族烴類;乙酸甲酯、乙酸乙酯、乙酸丙酯、丙酸甲酯等的酯類;丙酮、甲基乙基酮、甲基異丁基酮、環己酮等的酮類;甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、第二丁醇、第三丁醇等的醇類等。該等溶劑係能夠單獨一種、或混合二種以上而使用。 The solvent to be used can be appropriately selected depending on the type of the decane compound and the like. For example, water, aromatic hydrocarbons such as benzene, toluene, and xylene; esters such as methyl acetate, ethyl acetate, propyl acetate, and methyl propionate; acetone, methyl ethyl ketone, and methyl alcohol A ketone such as isobutyl ketone or cyclohexanone; an alcohol such as methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol or third butanol. These solvents can be used singly or in combination of two or more.

溶劑的使用量,每1升溶劑,矽烷化合物的總莫耳量通常為0.1mol~10mol,較佳為0.5mol~10mol之量。 The amount of the solvent used is usually from 0.1 mol to 10 mol, preferably from 0.5 mol to 10 mol, per 1 liter of the solvent.

使矽烷化合物縮合(反應)時之溫度,通常為0℃至所使用溶劑的沸點為止之溫度範圍,較佳為20℃~100℃的範圍。反應溫度太低時,有縮合反應的進行變為不充分之情形。另一方面,反應溫度太高時,難以抑制凝膠化。反應係通常30分鐘至20小時完成。 The temperature at which the decane compound is condensed (reacted) is usually in the range of from 0 ° C to the boiling point of the solvent to be used, and preferably in the range of from 20 ° C to 100 ° C. When the reaction temperature is too low, the progress of the condensation reaction may become insufficient. On the other hand, when the reaction temperature is too high, it is difficult to suppress gelation. The reaction system is usually completed in 30 minutes to 20 hours.

反應結束後,使用酸觸媒時,藉由在反應溶液添加碳酸氫鈉等的鹼水溶液,使用鹼觸媒時,係藉由在反應溶液添加鹽酸等的酸來進行中和,此時使用過濾分開或水洗等來除去鹽,能夠得到目標矽烷化合物聚合物。 When an acid catalyst is used, when an alkali aqueous solution such as sodium hydrogencarbonate or the like is added to the reaction solution, and an alkali catalyst is used, neutralization is carried out by adding an acid such as hydrochloric acid to the reaction solution, and filtration is used at this time. The target decane compound polymer can be obtained by separating or washing with water or the like to remove the salt.

矽烷化合物聚合物(A’)的重量平均分子量(Mw),從能夠得到具有更優異的接著性的硬化物之觀點,以400~30,000的範圍為佳,較佳為600~10,000,特佳為800~3,000的範圍。 The weight average molecular weight (Mw) of the decane compound polymer (A') is preferably in the range of 400 to 30,000, preferably 600 to 10,000, from the viewpoint of obtaining a cured product having more excellent adhesion, and particularly preferably Range of 800~3,000.

矽烷化合物聚合物(A’)的分子量分布(Mw/Mn),沒有特別限制,從能夠得到具有更優異的接著性的硬化物之觀點,通常為1.0~3.0,較佳為1.1~2.0的範圍。 The molecular weight distribution (Mw/Mn) of the decane compound polymer (A') is not particularly limited, and is usually in the range of 1.0 to 3.0, preferably 1.1 to 2.0, from the viewpoint of obtaining a cured product having more excellent adhesion. .

上述矽烷化合物聚合物(A)及矽烷化合物聚合物(A’)係梯型構造的聚合物時,矽烷化合物聚合物(A)和矽烷化合物聚合物(A’),係在分子內,下式(i)、(ii)及(iii)表示之重複單元之中,以具有(i)及(ii)、(i)及(iii)、(ii)及(iii)、或(i)、(ii)及(iii)的重複單元之矽烷化合物聚合物為佳。 When the above decane compound polymer (A) and the decane compound polymer (A') are ladder-type polymers, the decane compound polymer (A) and the decane compound polymer (A') are intramolecular, and the following formula Among the repeating units indicated in (i), (ii) and (iii), having (i) and (ii), (i) and (iii), (ii) and (iii), or (i), The decane compound polymer of the repeating unit of ii) and (iii) is preferred.

(式中,R1、R2、D、及X0係與前述表示相同意思)。 (wherein R 1 , R 2 , D, and X 0 have the same meanings as defined above).

此時,以式:R1-CH(X0)-D-表示之基的存在量([R1-CH(X0)-D])與R2的存在量([R2])係以莫耳比計,以[R1-CH(X0)-D]:[R2]=5:95~80:20為佳,以10:90~70:30為較佳,20:80~65:35為更佳,以30:70~60:40為特佳。藉由使含有在該範圍內的矽烷化合物聚合物之硬化性組成物,能夠得到具有更優異的接著性之硬化物。 In this case, the formula: R 1 -CH (X 0) -D- represents the group is present in an amount ([R 1 -CH (X 0 ) -D]) and R 2 is present in an amount ([R 2]) based In terms of molar ratio, [R 1 -CH(X 0 )-D]:[R 2 ]=5:95~80:20 is preferred, and 10:90~70:30 is preferred, 20:80 ~65:35 is better, with 30:70~60:40 as the best. By using a curable composition containing a decane compound polymer in this range, a cured product having more excellent adhesion can be obtained.

矽烷化合物聚合物(A)和矽烷化合物聚合物(A’),可以各自具有一種以(i)、(ii)、(iii)表示之重複單元,亦可以具有二種以上。 The decane compound polymer (A) and the decane compound polymer (A') may each have one type of repeating unit represented by (i), (ii), or (iii), or may have two or more types.

2)硬化性組成物 2) Sturdy composition

本發明之第二,係含有本發明的矽烷化合物聚合物之硬化性組成物。 The second aspect of the present invention is a curable composition containing the decane compound polymer of the present invention.

本發明的硬化性組成物,以含有本發明的矽烷化合物聚合物作為主成分為佳。所謂「含有作為主成分」,係指相對於硬化性組成物全體,含有50質量%以上之本發明的矽烷化合物聚合物的一種或二種以上。本發明的矽烷化合物聚合物之含量,係相對於硬化性組成物全體,以70質量%以上為佳,較佳為80質量%以上,更佳為90質量%以上。本發明的矽烷化合物聚合物的含量沒有特別的上限,本發明的硬化性組成物亦可以是由本發明的矽烷化合物聚合物所構成者(本發明的矽烷化合物聚合物的含量為100質量%)。 The curable composition of the present invention preferably contains a decane compound polymer of the present invention as a main component. The term "containing as a main component" means one or two or more kinds of the decane compound polymers of the present invention containing 50% by mass or more of the entire curable composition. The content of the decane compound polymer of the present invention is preferably 70% by mass or more, more preferably 80% by mass or more, and still more preferably 90% by mass or more based on the entire curable composition. The content of the decane compound polymer of the present invention is not particularly limited, and the curable composition of the present invention may be composed of the decane compound polymer of the present invention (the content of the decane compound polymer of the present invention is 100% by mass).

本發明的硬化性組成物含有其他的添加成分時,作為其他的添加成分,可舉出抗氧化劑、紫外線吸收劑、光安定劑、稀釋劑等。 When the curable composition of the present invention contains other additional components, examples of the other additive component include an antioxidant, an ultraviolet absorber, a photostabilizer, and a diluent.

抗氧化劑係為了防止加熱時的氧化劣化而添加。作為抗氧化劑,可舉出磷系抗氧化劑、酚系抗氧化劑、硫系抗氧化劑等。 The antioxidant is added to prevent oxidative degradation during heating. Examples of the antioxidant include a phosphorus-based antioxidant, a phenol-based antioxidant, and a sulfur-based antioxidant.

作為磷系抗氧化劑,可舉出亞磷酸酯類、氧雜磷雜菲氧化物類等。 Examples of the phosphorus-based antioxidant include phosphites and oxaphosphorus oxides.

作為酚系抗氧化劑,可舉出單酚類、雙酚類、高分子型酚類等。 Examples of the phenolic antioxidant include monophenols, bisphenols, and polymeric phenols.

作為硫系抗氧化劑,可舉出二月桂基-3,3’-硫丙酸酯、二肉豆蔻基-3,3’-硫丙酸酯、二硬脂醯基-3,3’-硫丙酸酯等。 Examples of the sulfur-based antioxidant include dilauryl-3,3'-thiopropionate, dimyristyl-3,3'-thiopropionate, distearyl-3,3'-sulfur Propionate and the like.

該等抗氧化劑能夠單獨一種、或組合二種以上而使用。抗氧化劑的使用量係相對於(A)成分(或(A’)成分),通常為10質量%以下。 These antioxidants can be used singly or in combination of two or more. The amount of the antioxidant to be used is usually 10% by mass or less based on the component (A) (or the component (A').

紫外線吸收劑,係為了使所得到的硬化物的耐光性之目的而添加。 The ultraviolet absorber is added for the purpose of light resistance of the obtained cured product.

作為紫外線吸收劑,可舉出柳酸類、二苯基酮類、苯并三唑類、受阻胺類等。 Examples of the ultraviolet absorber include salicylic acid, diphenylketone, benzotriazole, and hindered amine.

紫外線吸收劑係能夠單獨一種、或組合二種以上而使用。 The ultraviolet absorbers can be used singly or in combination of two or more.

紫外線吸收劑的使用量,相對於(A)成分(或(A’)成分),通常為10質量%以下。 The amount of the ultraviolet absorber to be used is usually 10% by mass or less based on the component (A) (or the component (A')).

光安定劑係為了使所得到的硬化物的耐光性提升之目的而添加。 The light stabilizer is added for the purpose of improving the light resistance of the obtained cured product.

作為光安定劑,例如可舉出聚[{6-(1,1,3,3,-四甲基丁基)胺基-1,3,5-三嗪-2,4-二基}{(2,2,6,6-四甲基-4-哌啶)亞胺基}六亞甲基{(2,2,6,6-四甲基-4-哌啶)亞胺基}]等的受阻胺類等。 As the photostabilizer, for example, poly[{6-(1,1,3,3,-tetramethylbutyl)amino-1,3,5-triazine-2,4-diyl}{ (2,2,6,6-tetramethyl-4-piperidine)imido}hexamethylene {(2,2,6,6-tetramethyl-4-piperidine)imido}] Hindered amines, etc.

該等光安定劑能夠單獨一種、或組合二種以上而使用。 These light stabilizers can be used singly or in combination of two or more.

光安定劑的使用量,相對於(A)成分(或(A’)成分),通常為10質量%以下。 The amount of the light stabilizer used is usually 10% by mass or less based on the component (A) (or the component (A')).

稀釋劑係為了調整硬化性組成物的黏度而添加。 The diluent is added to adjust the viscosity of the curable composition.

作為稀釋劑,例如,甘油二環氧丙基醚、丁二醇二環氧丙基醚、二環氧丙基苯胺、新戊四醇環氧丙基醚、環己烷二甲醇二環氧丙基醚、伸烷基二環氧丙基醚、聚乙二醇二環氧丙基醚、聚丙二醇二環氧丙基醚、三羥甲基丙烷三環氧丙基醚、甘 油三環氧丙基醚、一氧化4-乙烯基環己烯、二氧化4-乙烯基環己烯、二氧化甲基化乙烯基環己烯等。 As a diluent, for example, glycerol diepoxypropyl ether, butanediol diepoxypropyl ether, diepoxypropyl aniline, neopentyl alcohol epoxy propyl ether, cyclohexane dimethanol diepoxypropyl Ether, alkyl diepoxypropyl ether, polyethylene glycol diepoxypropyl ether, polypropylene glycol diepoxypropyl ether, trimethylolpropane triepoxypropyl ether, glycine Oil triepoxypropyl ether, 4-vinylcyclohexene oxide, 4-vinylcyclohexene dioxide, methylated vinylcyclohexene, and the like.

該等稀釋劑能夠單獨一種、或組合二種以上而使用。 These diluents can be used singly or in combination of two or more.

本發明的硬化性組成物,例如能夠藉由將前述(A)(或(A’)成分)及依照需要之其他成分,以預定比例調配且依照習知的方法混合、脫泡來得到。 The curable composition of the present invention can be obtained, for example, by blending the above (A) (or (A') component) and other components as needed, in a predetermined ratio, and mixing and defoaming according to a conventional method.

使用如以上進行而得到之本發明的硬化性組成物時,能夠得到即便被高能量的光線照射時和被放置在高溫狀態時,經過長期亦具有高接著力之硬化物。 When the curable composition of the present invention obtained as described above is used, it is possible to obtain a cured product having a high adhesion force over a long period of time even when it is irradiated with high-energy light and when it is placed at a high temperature.

含有以2-氰乙基三甲氧基矽烷等作為原材料而得到的矽烷化合物聚合物之硬化性組成物係能夠提供具有優異的接著性之硬化物。但是因為2-氰乙基三甲氧基矽烷等被指定為低毒性的毒物,所以其使用有受到限制之可能性。雖然本發明的硬化性組成物不使用此種被指定為毒物之原材料而得到之含有矽烷化合物聚合物,但是能夠提供具有非常優異的接著性之硬化物。 The curable composition containing a decane compound polymer obtained by using 2-cyanoethyltrimethoxydecane or the like as a raw material can provide a cured product having excellent adhesion. However, since 2-cyanoethyltrimethoxydecane or the like is designated as a low toxicity poison, its use is limited. Although the curable composition of the present invention does not use such a decane compound polymer obtained as a raw material designated as a poison, it is possible to provide a cured product having excellent excellent adhesion.

因此,本發明的硬化性組成物能夠適合使用作為光學部件和成形體的原料、接著劑、塗覆劑等。特別是因為能夠解決有關隨著光元件的高亮度化引起之光元件固定材產生劣化之問題,所以本發明的硬化性組成物能夠適合使用作為光元件固定用組成物。 Therefore, the curable composition of the present invention can be suitably used as a raw material, an adhesive, a coating agent, or the like as an optical member and a molded body. In particular, since the problem of deterioration of the optical element fixing material due to the increase in luminance of the optical element can be solved, the curable composition of the present invention can be suitably used as the optical element fixing composition.

3)硬化物 3) Hardened material

本發明之第三,係將本發明的硬化性組成物硬化而成之硬化物。 The third aspect of the present invention is a cured product obtained by curing the curable composition of the present invention.

作為將發明的硬化性組成物硬化之方法,可舉出加熱硬化。硬化時的加熱溫度通常為100~200℃,加熱時間通常為10分鐘至20小時,較佳為30分鐘至10小時。 As a method of hardening the hardening composition of the invention, heat hardening is mentioned. The heating temperature at the time of hardening is usually from 100 to 200 ° C, and the heating time is usually from 10 minutes to 20 hours, preferably from 30 minutes to 10 hours.

本發明的硬化物具有優異的接著性者。特別是即便本發明的硬化物使用不含有矽烷偶合劑等的添加劑之硬化性組成物硬化而得到者,亦具有優異的接著性。因而,在使用本發明的矽烷化合物聚合物而製造硬化物時,因為能夠將添加在矽烷化合物聚合物添加添加劑之步驟省略,所以能夠效率良好地得到具有優異的接著性之硬化物。 The cured product of the present invention has excellent adhesion. In particular, even when the cured product of the present invention is cured by using a curable composition containing no additive such as a decane coupling agent, it has excellent adhesion. Therefore, when the cured product is produced by using the decane compound polymer of the present invention, since the step of adding the additive to the decane compound polymer can be omitted, it is possible to efficiently obtain a cured product having excellent adhesion.

將本發明的硬化性組成物硬化而成之硬化物具有高接著力,例如能夠藉由如以下進行而測定接著力來確認。亦即,在矽晶片的鏡面塗布硬化性組成物,將塗布面放置在被接著物之上,壓黏且加熱處理而使其硬化。將其放置在已預先加熱至預定溫度(例如,23℃、100℃)之黏結強度試驗機(bond tester)的測定載物台上30秒鐘,從被接著物起算50μm的高度之位置,對接著面在水平方向(剪切方向)施加應力且測定試片與被接著物之接著力。 The cured product obtained by curing the curable composition of the present invention has a high adhesion, and can be confirmed, for example, by measuring the adhesion force as follows. That is, the curable composition is applied to the mirror surface of the tantalum wafer, and the coated surface is placed on the object to be pressed, pressed and heat treated to be hardened. It is placed on a measuring stage of a bond tester which has been previously heated to a predetermined temperature (for example, 23 ° C, 100 ° C) for 30 seconds, and is at a height of 50 μm from the object to be pressed, Next, stress was applied in the horizontal direction (shear direction) and the adhesion between the test piece and the object to be pressed was measured.

硬化物的接著力,係在23℃以50N/2mm□以上為佳,以100N/2mm□以上為較佳。又,硬化物的接著力,係在100℃以50N/2mm□以上為佳,以70N/2mm□以上為較佳。 The adhesion of the cured product is preferably 50 N/2 mm □ or more at 23 ° C, and preferably 100 N / 2 mm □ or more. Further, the adhesion of the cured product is preferably 50 N/2 mm □ or more at 100 ° C, and preferably 70 N / 2 mm □ or more.

本發明的硬化物,因為能夠解決有關隨著光元件的高亮度化引起光元件固定材產生劣化之問題,所以能夠適合使用作為光元件固定材。例如能夠適合使用作為光學部件和成形體的原料、接著劑、塗覆劑、封裝材等。 The cured product of the present invention can solve the problem of deterioration of the optical element fixing material due to the high luminance of the optical element, and thus can be suitably used as the optical element fixing material. For example, a raw material, an adhesive, a coating agent, a sealing material, or the like, which is an optical member and a molded body, can be suitably used.

4)硬化性組成物的使用方法 4) How to use the hardenable composition

本發明之第四,係將本發明的硬化性組成物作為光元件用接著劑或光元件用封裝劑等的光元件固定材用組成物使用之方法。 In the fourth aspect of the invention, the curable composition of the present invention is used as a composition for an optical element fixing material such as an adhesive for an optical element or an encapsulant for an optical element.

作為光元件,可舉出LED、LD等的發光元件、受光元件、複合光元件、光積體電路等。 Examples of the optical element include a light-emitting element such as an LED or an LD, a light-receiving element, a composite optical element, and an optical unit circuit.

<光元件用接著劑> <Battery for optical element>

本發明的硬化性組成物能夠適合使用作為光元件用接著劑。 The curable composition of the present invention can be suitably used as an adhesive for an optical element.

作為將本發明的硬化性組成物作為光元件用接著劑使用之方法,可舉出將該組成物塗布在接著對象的材料(光元件及其基板等)之一方或雙方的接著面且壓黏之後,使其加熱硬化且使接著對象的材料彼此之間堅固地接著之方法。 As a method of using the curable composition of the present invention as an adhesive for an optical element, the composition is applied to one or both of the materials (optical elements, substrates, and the like) of the target material and is pressure-bonded. Thereafter, the method is such that the heat is hardened and the materials of the following objects are firmly adhered to each other.

作為用以接著光元件之主要的基板材料,可舉出鹼石灰玻璃、耐熱性硬質玻璃等的玻璃類;陶瓷;鐵、銅、鋁、金、銀、鉑、鉻、鈦及該等金屬的合金、不鏽鋼(SUS302、SUS304、SUS304L、SUS309等)等的金屬類;聚對酞酸乙二酯、聚對酞酸丁二酯、聚萘二甲酸乙二酯、乙烯-乙酸乙烯酯共聚物、聚苯乙烯、聚碳酸酯、聚甲基戊烯、聚碸、聚醚醚酮、聚醚碸、聚苯硫(polyphenylene sulfide)、聚醚醯亞胺、聚醯亞胺、聚醯胺、丙烯酸樹脂、降莰烯系樹脂、環烯烴樹脂、玻璃環氧樹脂等的合成樹脂等。 Examples of the main substrate material to be used for the optical element include glass such as soda lime glass and heat-resistant hard glass; ceramics; iron, copper, aluminum, gold, silver, platinum, chromium, titanium, and the like. Metals such as alloys, stainless steels (SUS302, SUS304, SUS304L, SUS309, etc.); polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, ethylene-vinyl acetate copolymer, Polystyrene, polycarbonate, polymethylpentene, polyfluorene, polyetheretherketone, polyether oxime, polyphenylene sulfide, polyether oximine, polyimine, polyamine, acrylic A synthetic resin such as a resin, a decene-based resin, a cycloolefin resin, or a glass epoxy resin.

使其加熱硬化時的加熱溫度,亦取決於所使用的硬化性組成物等,通常為100~200℃。加熱時間係通常為10 分鐘至20小時,較佳為30分鐘至10小時。 The heating temperature at the time of heat curing depends on the curable composition to be used, etc., and is usually 100 to 200 °C. The heating time is usually 10 Minutes to 20 hours, preferably 30 minutes to 10 hours.

<光元件用封裝劑> <Packaging agent for optical components>

本發明的硬化性組成物能夠適合使用作為光元件封裝體的封裝劑。 The curable composition of the present invention can be suitably used as an encapsulant for an optical element package.

作為將本發明的硬化性組成物使用作為光元件用封裝劑之方法,例如可舉出將該組成物形成所需要的形狀而得到內部包含有光元件的成形體之後,藉由使該物加熱硬化來製造光元件封裝體之方法等。 As a method of using the curable composition of the present invention as an encapsulant for an optical element, for example, a shape in which the composition is formed into a shape and a molded body in which the optical element is contained is obtained, and then the object is heated. A method of hardening to manufacture an optical element package or the like.

作為將本發明的硬化性組成物形成所需要的形狀之方法,沒有特別限定,能夠採用通常的轉移成形法、澆鑄法等習知的鑄模法。 The method of forming the shape required for the curable composition of the present invention is not particularly limited, and a conventional molding method such as a normal transfer molding method or a casting method can be employed.

加熱硬化時之加熱溫度,雖然亦取決於所使用的硬化性組成物等,通常為100~200℃。加熱時間通常為10分鐘至20小時,較佳為30分鐘至10小時。 The heating temperature at the time of heat curing is usually 100 to 200 ° C depending on the curable composition to be used and the like. The heating time is usually from 10 minutes to 20 hours, preferably from 30 minutes to 10 hours.

因為所得到的光元件封裝體,係使用本發明的硬化性組成物,所以即便在光元件使用白色、藍色發光LED等發光尖峰波長為短波長之400~490nm者,亦不容易因熱和光引起接著性低落。 Since the obtained optical element package uses the curable composition of the present invention, even when the light-emitting element uses a light-emitting peak wavelength such as a white or blue light-emitting LED of 400 to 490 nm in a short wavelength, it is not easy to be heated and light. Causes a low level of adhesion.

[實施例] [Examples]

其次,藉由實施例及比較例而更詳細地說明本發明,但是本發明不被下述的實施例限定。 Next, the present invention will be described in more detail by way of examples and comparative examples, but the invention is not limited by the examples described below.

(重量平均分子量測定) (weight average molecular weight determination)

在下述製造例所得到的矽烷化合物聚合物之重量平均分子量(Mw),係設作標準聚苯乙烯換算值且在以下的裝置及條件 下測定。 The weight average molecular weight (Mw) of the decane compound polymer obtained in the following production example is set to a standard polystyrene equivalent value and the following apparatus and conditions Determined below.

裝置名:HLC-8220GPC、TOSOH公司製 Device name: HLC-8220GPC, made by TOSOH

管柱:將TSKgelGMHXL、TSKgelGMHXL、及TSKgel2000HXL依序連結而成者 Column: Connect TSKgelGMHXL, TSKgelGMHXL, and TSKgel2000HXL in sequence

溶劑:四氫呋喃 Solvent: tetrahydrofuran

注入量:80μl Injection volume: 80μl

測定溫度:40℃ Measuring temperature: 40 ° C

流速:1ml/分鐘 Flow rate: 1ml/min

檢測器:差示折射計 Detector: Differential Refractometer

(IR光譜的測定) (Measurement of IR spectrum)

在製造例所得到的矽烷化合物聚合物之IR光譜,係使用以下的裝置而測定。 The IR spectrum of the decane compound polymer obtained in the production example was measured using the following apparatus.

傅立葉轉換(Fourier transformation)紅外線分光光度計(Spectrum100、Perkinelmer公司製) Fourier transformation infrared spectrophotometer (Spectrum100, manufactured by Perkinelmer)

(實施例1) (Example 1)

在500ml的茄型燒瓶,添加苯基三甲氧基矽烷(東京化成工業公司製、以下相同)26.77g(135mmol)、3-氫硫基丙基三甲氧基矽烷(信越化學工業公司製、製品名「KBM-803」、以下相同)2.95g(15mmol)、及丙酮120g及蒸餾水30g作為溶劑之後,邊攪拌內容物邊添加磷酸(關東化學公司製、以下相同)0.15g(1.5mmol)作為觸媒,進一步在25℃繼續攪拌16小時攪拌。 In a 500 ml eggplant type flask, 26.77 g (135 mmol) and 3-hydrothiopropyltrimethoxydecane (manufactured by Shin-Etsu Chemical Co., Ltd., product name) were added to phenyltrimethoxydecane (manufactured by Tokyo Chemical Industry Co., Ltd., the same). "KBM-803", the same as the following) 2.95 g (15 mmol), and 120 g of acetone and 30 g of distilled water were used as a solvent, and 0.15 g (1.5 mmol) of phosphoric acid (manufactured by Kanto Chemical Co., Ltd.) was added as a catalyst while stirring the contents. Further stirring was continued at 25 ° C for 16 hours with stirring.

反應結束後,在反應液添加乙酸乙酯100ml且使用飽和碳酸氫鈉水溶液進行中和,暫時靜置之後,分離取得有 機層。其次,使用蒸餾水將有機層洗淨2次之後,使用無水硫酸鎂進行乾燥。將硫酸鎂過濾分開之後,使用蒸發器將濾液濃縮至50ml為止,將所得到的濃縮物滴入大量的正己烷中而使其沈澱且藉由傾析將沈澱物分離。使所得到的沈澱物溶解在甲基乙基酮(MEK)而回收、使用蒸發器將溶劑減壓餾去。藉由將殘留物真空乾燥而得到矽烷化合物聚合物(A1)。 After completion of the reaction, 100 ml of ethyl acetate was added to the reaction mixture, and the mixture was neutralized with a saturated aqueous sodium hydrogencarbonate solution, and the mixture was allowed to stand for a while, and then separated. Machine layer. Next, the organic layer was washed twice with distilled water, and then dried using anhydrous magnesium sulfate. After separating the magnesium sulfate by filtration, the filtrate was concentrated to 50 ml using an evaporator, and the obtained concentrate was dropped into a large amount of n-hexane to precipitate it, and the precipitate was separated by decantation. The obtained precipitate was dissolved in methyl ethyl ketone (MEK), recovered, and the solvent was distilled off under reduced pressure using an evaporator. The decane compound polymer (A1) was obtained by vacuum drying the residue.

矽烷化合物聚合物(A1)的重量平均分子量(Mw)係1,200。 The weight average molecular weight (Mw) of the decane compound polymer (A1) was 1,200.

將矽烷化合物聚合物(A1)的IR光譜數據顯示在以下。 The IR spectrum data of the decane compound polymer (A1) is shown below.

Si-Ph:698cm-1,740cm-1,Si-O:1132cm-1,S-H:(因為源自3-氫硫基丙基三甲氧基矽烷之重複單元量少,所以無法檢測) Si-Ph: 698cm -1, 740cm -1, Si-O: 1132cm -1, SH :( repeating units as derived from a small amount of 3- mercapto propyl trimethoxy Silane it, it is impossible to detect)

(實施例2) (Example 2)

在實施例1,除了將苯基三甲氧基矽烷的使用量設為22.31g(112.5mmol),且將3-氫硫基丙基三甲氧基矽烷的使用量設為7.36g(37.5mmol)以外,與實施例1同樣地進行而得到矽烷化合物聚合物(A2)。 In Example 1, except that the amount of phenyltrimethoxydecane used was 22.31 g (112.5 mmol), and the amount of 3-hydrothiopropyltrimethoxydecane used was 7.36 g (37.5 mmol). The decane compound polymer (A2) was obtained in the same manner as in Example 1.

矽烷化合物聚合物(A2)的重量平均分子量(Mw)係2,700。 The weight average molecular weight (Mw) of the decane compound polymer (A2) was 2,700.

將矽烷化合物聚合物(A2)的IR光譜數據顯示在以下。 The IR spectrum data of the decane compound polymer (A2) is shown below.

Si-Ph:698cm-1,740cm-1,Si-O:1132cm-1,S-H:2567cm-1 Si-Ph: 698 cm -1 , 740 cm -1 , Si-O: 1132 cm -1 , SH: 2567 cm -1

(實施例3) (Example 3)

在實施例1,除了將苯基三甲氧基矽烷的使用量設為14.87g(75.0mmol),且將3-氫硫基丙基三甲氧基矽烷的使用量設為14.72g(75.0mmol)以外,與實施例1同樣地進行而得到矽烷化合物聚合物(A3)。 In Example 1, except that the amount of use of phenyltrimethoxydecane was 14.87 g (75.0 mmol), and the amount of 3-hydrothiopropyltrimethoxydecane used was 14.72 g (75.0 mmol). The decane compound polymer (A3) was obtained in the same manner as in Example 1.

矽烷化合物聚合物(A3)的重量平均分子量(Mw)係1,700。 The weight average molecular weight (Mw) of the decane compound polymer (A3) was 1,700.

又,將矽烷化合物聚合物(A3)的IR光譜數據顯示在以下。 Further, the IR spectrum data of the decane compound polymer (A3) is shown below.

Si-Ph:699cm-1,741cm-1,Si-O:1132cm-1,S-H:2567cm-1 Si-Ph: 699 cm -1 , 741 cm -1 , Si-O: 1132 cm -1 , SH: 2567 cm -1

(實施例4) (Example 4)

在實施例1,除了將苯基三甲氧基矽烷的使用量設為29.45g(148.5mmol),且將3-氫硫基丙基三甲氧基矽烷的使用量設為0.29g(1.5mmol)以外,與實施例1同樣地進行而得到矽烷化合物聚合物(A4)。 In Example 1, except that the amount of use of phenyltrimethoxydecane was 29.45 g (148.5 mmol), and the amount of 3-hydrothiopropyltrimethoxydecane used was set to 0.29 g (1.5 mmol). The decane compound polymer (A4) was obtained in the same manner as in Example 1.

矽烷化合物聚合物(A4)的重量平均分子量(Mw)係900。 The weight average molecular weight (Mw) of the decane compound polymer (A4) is 900.

又,將矽烷化合物聚合物(A4)的IR光譜數據顯示在以下。 Further, the IR spectrum data of the decane compound polymer (A4) is shown below.

Si-Ph:699cm-1,741cm-1,Si-O:1132cm-1,S-H:(因為源自3-氫硫基丙基三甲氧基矽烷之重複單元量少,所以無法檢測) Si-Ph: 699 cm -1 , 741 cm -1 , Si-O: 1132 cm -1 , SH: (Because the amount of repeating units derived from 3-hydrothiopropyltrimethoxydecane is small, it cannot be detected)

(實施例5) (Example 5)

在實施例1,除了將苯基三甲氧基矽烷的使用量設為28.26g(142.5mmol),且將3-氫硫基丙基三甲氧基矽烷的使用量設為1.47g(7.5mmol)以外,與實施例1同樣地進行而得到矽烷化合物聚合物(A5)。 In Example 1, except that the amount of use of phenyltrimethoxydecane was 28.26 g (142.5 mmol), and the amount of 3-hydrothiopropyltrimethoxydecane used was 1.47 g (7.5 mmol). The decane compound polymer (A5) was obtained in the same manner as in Example 1.

矽烷化合物聚合物(A5)的重量平均分子量(Mw)係900。 The weight average molecular weight (Mw) of the decane compound polymer (A5) is 900.

又,矽烷化合物聚合物(A5)的IR光譜數據顯示在以下。 Further, IR spectrum data of the decane compound polymer (A5) is shown below.

Si-Ph:699cm-1,741cm-1,Si-O:1132cm-1,S-H:(因為源自3-氫硫基丙基三甲氧基矽烷之重複單元量少,所以無法檢測) Si-Ph: 699 cm -1 , 741 cm -1 , Si-O: 1132 cm -1 , SH: (Because the amount of repeating units derived from 3-hydrothiopropyltrimethoxydecane is small, it cannot be detected)

(實施例6) (Example 6)

在實施例1,除了不使用苯基三甲氧基矽烷,而使用29.45g(150.0mmol)3-氫硫基丙基三甲氧基矽烷以外,與實施例1同樣地進行而得到矽烷化合物聚合物(A6)。 In the same manner as in Example 1, except that phenyltrimethoxydecane was not used and 29.45 g (150.0 mmol) of 3-hydrothiopropyltrimethoxydecane was used, a decane compound polymer was obtained ( A6).

矽烷化合物聚合物(A6)的重量平均分子量(Mw)係1800。 The weight average molecular weight (Mw) of the decane compound polymer (A6) is 1800.

又,將矽烷化合物聚合物(A6)的IR光譜數據顯示如下。 Further, the IR spectrum data of the decane compound polymer (A6) is shown below.

Si-O:1132cm-1,S-H:2567cm-1 Si-O: 1132cm -1 , SH: 2567cm -1

(實施例7) (Example 7)

在實施例1,除了將苯基三甲氧基矽烷的使用量設為7.43g(37.5mmol),且將3-氫硫基丙基三甲氧基矽烷的使用量設為22.09g(112.5mmol)以外,與實施例1同樣地進行而得到矽烷化合物聚合物(A7)。 In Example 1, except that the amount of use of phenyltrimethoxydecane was 7.43 g (37.5 mmol), and the amount of 3-hydrothiopropyltrimethoxydecane used was 22.09 g (112.5 mmol). The decane compound polymer (A7) was obtained in the same manner as in Example 1.

矽烷化合物聚合物(A7)的重量平均分子量(Mw)係1100。 The weight average molecular weight (Mw) of the decane compound polymer (A7) was 1,100.

又,將矽烷化合物聚合物(A7)的IR光譜數據顯示如下。 Further, IR spectrum data of the decane compound polymer (A7) is shown below.

Si-Ph:699cm-1,741cm-1,Si-O:1132cm-1,S-H:2567cm-1 Si-Ph: 699 cm -1 , 741 cm -1 , Si-O: 1132 cm -1 , SH: 2567 cm -1

(比較例1) (Comparative Example 1)

在300ml的茄型燒瓶,添加苯基三甲氧基矽烷20.2g(102mmol)、2-氰乙基三甲氧基矽烷(AZMAX公司製、以下相同)3.15g(18mmol)、以及丙酮96ml及蒸餾水24ml作為溶劑之後,邊攪拌內容物邊添加磷酸0.15g(1.5mmol)作為觸媒,進一步在25℃繼續攪拌16小時攪拌。 In a 300 ml eggplant type flask, 20.2 g (102 mmol) of phenyltrimethoxydecane, 3.15 g (18 mmol) of 2-cyanoethyltrimethoxydecane (manufactured by AZMAX Co., Ltd.), and 96 ml of acetone and 24 ml of distilled water were added. After the solvent, 0.15 g (1.5 mmol) of phosphoric acid was added as a catalyst while stirring the contents, and further stirring was continued at 25 ° C for 16 hours.

反應結束後,使用蒸發器將反應液濃縮至50ml,在濃縮物添加乙酸乙酯100ml且使用飽和碳酸氫鈉水溶液進行中和。暫時靜置之後,分離取得有機層。其次,使用蒸餾水將有機層洗淨2次之後,使用無水硫酸鎂進行乾燥。將硫酸鎂過濾分開之後,使用蒸發器將濾液濃縮至50ml為止,將所得到的濃縮物滴入大量的正己烷中而使其沈澱且藉由傾析將沈澱物分離。使所得到的沈澱物溶解在甲基乙基酮(MEK)而回 收、使用蒸發器將溶劑減壓餾去。藉由將殘留物真空乾燥而得到矽烷化合物聚合物(A8)。 After completion of the reaction, the reaction mixture was concentrated to 50 ml using an evaporator, and ethyl acetate (100 ml) was added to the concentrate and neutralized using a saturated aqueous sodium hydrogen carbonate solution. After standing for a while, the organic layer was separated. Next, the organic layer was washed twice with distilled water, and then dried using anhydrous magnesium sulfate. After separating the magnesium sulfate by filtration, the filtrate was concentrated to 50 ml using an evaporator, and the obtained concentrate was dropped into a large amount of n-hexane to precipitate it, and the precipitate was separated by decantation. The resulting precipitate is dissolved in methyl ethyl ketone (MEK) and returned The solvent was distilled off under reduced pressure using an evaporator. The decane compound polymer (A8) was obtained by vacuum drying the residue.

矽烷化合物聚合物(A8)的重量平均分子量(Mw)係1,900。 The weight average molecular weight (Mw) of the decane compound polymer (A8) was 1,900.

將矽烷化合物聚合物(A8)的IR光譜數據顯示如下。 The IR spectrum data of the decane compound polymer (A8) is shown below.

Si-Ph:698cm-1,740cm-1,Si-O:1132cm-1,-CN:2259cm-1 Si-Ph: 698 cm -1 , 740 cm -1 , Si-O: 1132 cm -1 , -CN: 2259 cm -1

(比較例2) (Comparative Example 2)

在300ml的茄型燒瓶,添加苯基三甲氧基矽烷20.2g(102mmol)、3-乙醯氧基丙基三甲氧基矽烷(AZMAX公司製)4.0g(18mmol)、和甲苯60ml及蒸餾水30ml作為溶劑之後,邊攪拌內容物邊添加磷酸0.15g(1.5mmol)作為觸媒,進一步在25℃繼續攪拌16小時攪拌。 In a 300 ml eggplant type flask, 20.2 g (102 mmol) of phenyltrimethoxydecane, 4.0 g (18 mmol) of 3-ethoxymethoxypropyltrimethoxydecane (manufactured by AZMAX Co., Ltd.), 60 ml of toluene, and 30 ml of distilled water were added. After the solvent, 0.15 g (1.5 mmol) of phosphoric acid was added as a catalyst while stirring the contents, and further stirring was continued at 25 ° C for 16 hours.

反應結束後,在反應液添加乙酸乙酯100ml且使用飽和碳酸氫鈉水溶液進行中和,暫時靜置之後,分離取得有機層。其次,使用蒸餾水將有機層洗淨2次之後,使用無水硫酸鎂進行乾燥。將硫酸鎂過濾分開之後,使用蒸發器將濾液濃縮至50ml為止,將所得到的濃縮物滴入大量的正己烷中而使其沈澱且藉由傾析將沈澱物分離。使所得到的沈澱物溶解在甲基乙基酮(MEK)而回收、使用蒸發器將溶劑減壓餾去。藉由將殘留物真空乾燥而得到14.7g矽烷化合物聚合物(A9)。 After completion of the reaction, 100 ml of ethyl acetate was added to the reaction mixture, and the mixture was neutralized with a saturated aqueous sodium hydrogencarbonate solution, and the mixture was allowed to stand for a while, and then the organic layer was separated. Next, the organic layer was washed twice with distilled water, and then dried using anhydrous magnesium sulfate. After separating the magnesium sulfate by filtration, the filtrate was concentrated to 50 ml using an evaporator, and the obtained concentrate was dropped into a large amount of n-hexane to precipitate it, and the precipitate was separated by decantation. The obtained precipitate was dissolved in methyl ethyl ketone (MEK), recovered, and the solvent was distilled off under reduced pressure using an evaporator. 14.7 g of a decane compound polymer (A9) was obtained by vacuum drying the residue.

矽烷化合物聚合物(A9)的重量平均分子量(Mw)係2,700。 The weight average molecular weight (Mw) of the decane compound polymer (A9) was 2,700.

又,將矽烷化合物聚合物(A9)的IR光譜數據顯示在以下。 Further, the IR spectrum data of the decane compound polymer (A9) is shown below.

Si-Ph:699cm-1,741cm-1,Si-O:1132cm-1,-CO:1738cm-1 Si-Ph: 699 cm -1 , 741 cm -1 , Si-O: 1132 cm -1 , -CO: 1738 cm -1

(比較例3) (Comparative Example 3)

在300ml的茄型燒瓶,添加苯基三甲氧基矽烷 20.2g(102mmol)、3-氯丙基三甲氧基矽烷(東京化成工業公司製)3.58g(18mmol)、和甲苯60ml及蒸餾水30ml作為溶劑之後,邊攪拌內容物邊添加磷酸0.15g(1.5mmol)作為觸媒,進一步在25℃繼續攪拌16小時攪拌。 In a 300 ml eggplant flask, phenyltrimethoxydecane was added. After adding 20.2 g (102 mmol), 3-chloropropyltrimethoxydecane (manufactured by Tokyo Chemical Industry Co., Ltd.), 3.58 g (18 mmol), and 60 ml of toluene and 30 ml of distilled water as a solvent, 0.15 g (1.5 mmol) of phosphoric acid was added while stirring the contents. As a catalyst, stirring was further continued at 25 ° C for 16 hours.

反應結束後,將反應混合物使用飽和碳酸氫鈉水溶液中和。在此添加乙酸乙酯100ml且攪拌,暫時靜置之後,分離取得有機層。其次,使用蒸餾水將有機層洗淨2次之後,使用無水硫酸鎂進行乾燥。將硫酸鎂過濾分開之後,將濾液滴入大量的正己烷中而使其沈澱月藉由傾析將沈澱物分離。使所得到的沈澱物溶解在甲基乙基酮(MEK)而回收,使用蒸發器將溶劑減壓餾去。藉由將殘留物真空乾燥而得到矽烷化合物聚合物(A10)。 After the reaction was completed, the reaction mixture was neutralized with a saturated aqueous sodium hydrogencarbonate solution. Here, 100 ml of ethyl acetate was added and stirred, and after allowing to stand still, the organic layer was separated and obtained. Next, the organic layer was washed twice with distilled water, and then dried using anhydrous magnesium sulfate. After separating the magnesium sulfate by filtration, the filtrate was dropped into a large amount of n-hexane to precipitate it, and the precipitate was separated by decantation. The obtained precipitate was dissolved in methyl ethyl ketone (MEK) and recovered, and the solvent was distilled off under reduced pressure using an evaporator. The decane compound polymer (A10) was obtained by vacuum drying the residue.

矽烷化合物聚合物(A10)的重量平均分子量(Mw)係3,000。 The weight average molecular weight (Mw) of the decane compound polymer (A10) is 3,000.

又,將矽烷化合物聚合物(A10)的IR光譜數據顯示如下。 Further, IR spectrum data of the decane compound polymer (A10) is shown below.

Si-Ph:700cm-1,741cm-1,Si-O:1132cm-1,-Cl:648cm-1 Si-Ph: 700 cm -1 , 741 cm -1 , Si-O: 1132 cm -1 , -Cl: 648 cm -1

直接使用在實施例1~7及比較例1~3所得到的矽烷化合物聚合物(A1)~(A10),使用下述的方法來測定接著力。將測定結果顯示在下述第1表。 The decane compound polymers (A1) to (A10) obtained in Examples 1 to 7 and Comparative Examples 1 to 3 were used as they are, and the adhesion was measured by the following method. The measurement results are shown in the first table below.

(接著力試驗) (Continue force test)

在2mm四方形的矽晶片之鏡面,將在實施例1~7及比較例1~3所得到的矽烷化合物聚合物各自以成為厚度約2μm的方式塗布,而且使塗布面載置且壓黏在被接著物(鍍銀銅板)之上。隨後,在170℃加熱處理2小時使其硬化而得到附有試片的被接著物。將該附有試片的被接著物放置在已預先加熱至預 定溫度(23℃、100℃)之黏結強度試驗機(Series 4000、Dage公司製)的測定載物台上30秒鐘,從被接著物起算50μm的高度之位置,以速度200μm/s對接著面在水平方法(剪切方向)施加應力,來測定在23℃及100℃之試片與被接著物之接著力(N/2mm□)。 The decane compound polymers obtained in Examples 1 to 7 and Comparative Examples 1 to 3 were coated on the mirror surface of a 2 mm square tantalum wafer so as to have a thickness of about 2 μm, and the coated surface was placed and pressed. Above the substrate (silver plated copper plate). Subsequently, it was heat-treated at 170 ° C for 2 hours to be hardened to obtain an adherend to which a test piece was attached. The substrate to which the test piece is attached is placed in the preheated to pre The bonding strength tester (Series 4000, manufactured by Dage Co., Ltd.) at a constant temperature (23 ° C, 100 ° C) was placed on the stage for 30 seconds, and the height was 50 μm from the substrate, followed by a speed of 200 μm/s. The surface was subjected to stress in a horizontal method (shear direction) to measure the adhesion force (N/2 mm□) between the test piece and the substrate to be tested at 23 ° C and 100 ° C.

從第1表,得知以下的情形。 From the first table, the following cases are known.

使用實施例1~7的矽烷化合物聚合物而得到的硬化物,在23℃、100℃的任一情況,均具有優異的接著性。 The cured product obtained by using the decane compound polymers of Examples 1 to 7 had excellent adhesion at any of 23 ° C and 100 ° C.

另一方面,使用比較例1~3矽烷化合物聚合物而得到的硬化物,在23℃、100℃兩方,接著性差。 On the other hand, the cured product obtained by using the polymer of Comparative Example 1 to 3 decane compound was inferior in both of 23 ° C and 100 ° C.

Claims (16)

一種矽烷化合物聚合物,其係下式(a-1)所示(CHR1X0-D-SiO3/2)m(R2SiO3/2)n(CHR1X0-D-SiZ1O2/2)o(R2SiZ2O2/2)p(CHR1X0-D-SiZ1 2O1/2)q(R2SiZ2 2O1/2)r...(a-1)[式中,R1係表示氫原子或碳數1~6的烷基,X0係表示含硫原子的官能基,D係表示單鍵、或是未取代或具有取代基之碳數1~20之二價有機基,R2係表示未取代或具有取代基(但是不包括含硫原子的官能基)之碳數1~20的烷基、或是未取代或具有取代基之苯基,Z1係表示羥基或碳數1~10的烷氧基,Z2係表示羥基、碳數1~10的烷氧基或鹵素原子,m係表示正整數,n、o、p、q、r係各自獨立表示0或正整數]。 A decane compound polymer represented by the following formula (a-1) (CHR 1 X 0 -D-SiO 3/2 ) m (R 2 SiO 3/2 ) n (CHR 1 X 0 -D-SiZ 1 O 2 / 2 ) o ( R 2 SiZ 2 O 2/2 ) p (CHR 1 X 0 -D-SiZ 1 2 O 1/2 ) q (R 2 SiZ 2 2 O 1/2 ) r . . . (a-1) [the formula, R 1 is a hydrogen atom or a carbon-based alkyl group having 1 to 6, X 0 represents a sulfur atom-based functional group, D represents a single bond system, or an unsubstituted or substituted a divalent organic group having 1 to 20 carbon atoms, and R 2 represents an alkyl group having 1 to 20 carbon atoms which is unsubstituted or has a substituent (but does not include a functional group containing a sulfur atom), or is unsubstituted or substituted. a phenyl group, Z 1 represents a hydroxyl group or an alkoxy group having 1 to 10 carbon atoms, Z 2 represents a hydroxyl group, an alkoxy group having 1 to 10 carbon atoms or a halogen atom, and m represents a positive integer, n, o, p, q, and r each independently represent 0 or a positive integer]. 如申請專利範圍第1項所述之矽烷化合物聚合物,其中X0的含硫原子的官能基係下式(i)或式(ii)表示之基、或由這些基衍生之基-SH (i) -S-CO-R’ (ii)[式中,R’係表示碳數1~20之一價有機基]。 The decane compound polymer according to claim 1, wherein the sulfur atom-containing functional group of X 0 is a group represented by the following formula (i) or formula (ii), or a group derived from the group -SH ( i) -S-CO-R' (ii) [wherein R' represents a one-carbon organic group having 1 to 20 carbon atoms]. 如申請專利範圍第1項所述之矽烷化合物聚合物,其中n為正整數。 The decane compound polymer of claim 1, wherein n is a positive integer. 如申請專利範圍第1項所述之矽烷化合物聚合物,其中(m+o+q)與(n+p+r)之比例[(m+o+q):(n+p+r)]為5:95~80:20。 The decane compound polymer as described in claim 1, wherein the ratio of (m+o+q) to (n+p+r) [(m+o+q):(n+p+r)] It is 5:95~80:20. 如申請專利範圍第1項所述之矽烷化合物聚合物,其重量平均分子量為1,000~30,000。 The decane compound polymer as described in claim 1 has a weight average molecular weight of 1,000 to 30,000. 一種矽烷化合物聚合物,係將下式(1)表示的矽烷化合物(1)之至少一種使用作為單體,藉由縮合反應而得到者式(1):R1-CH(X0)-D-Si(OR3)3[式中,R1係表示氫原子或碳數1~6的烷基、X0係表示含硫原子的官能基,D係表示單鍵、或是未取代或具有取代基之碳數1~20之二價烴基,R3係表示碳數1~10的烷基]。 A decane compound polymer obtained by using at least one of the decane compound (1) represented by the following formula (1) as a monomer, and having a condensation reaction to obtain a formula (1): R 1 -CH(X 0 )-D -Si(OR 3 ) 3 [wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X 0 represents a functional group containing a sulfur atom, and D represents a single bond, or is unsubstituted or has The substituent has a divalent hydrocarbon group having 1 to 20 carbon atoms, and R 3 represents an alkyl group having 1 to 10 carbon atoms. 如申請專利範圍第6項所述之矽烷化合物聚合物,其中X0的含硫原子的官能基係下述式(i)或式(ii)表示之基,-SH (i) -S-CO-R’ (ii)[式中,R’係表示碳數1~20之一價有機基]。 The decane compound polymer according to claim 6, wherein the sulfur atom-containing functional group of X 0 is a group represented by the following formula (i) or formula (ii), -SH (i) -S-CO -R' (ii) [wherein R' represents a one-carbon organic group having 1 to 20 carbon atoms]. 如申請專利範圍第6項所述之矽烷化合物聚合物,係使含有前述矽烷化合物(1)的至少一種及下式(2)表示之矽烷化合物(2)的至少一種之矽烷化合物的混合物縮合而得到者式(2):R2Si(OR4)v(X1)3-v[式中,R2係表示未取代或是具有取代基(但是不包括含硫原子的官能基)之碳數1~20的烷基、或是未取代或具有取代基之苯基,R4係表示碳數1~10的烷基,X1係表示鹵素原子,v係表示0~3的整數]。 The decane compound polymer according to claim 6, wherein the mixture of at least one of the decane compound (1) and at least one decane compound of the decane compound (2) represented by the following formula (2) is condensed. The formula (2): R 2 Si(OR 4 ) v (X 1 ) 3-v [wherein R 2 represents a carbon which is unsubstituted or has a substituent (but does not include a functional group containing a sulfur atom) alkyl having 1 to 20, or an unsubstituted or substituted phenyl group of, R 4 represents alkyl having lines 1 to 10, X 1 represents a halogen atom based, v represents an integer of 0 to 3. Department of]. 如申請專利範圍第8項所述之矽烷化合物聚合物,其中在前述矽烷化合物的混合物所含有的矽烷化合物(1)與矽烷化合物(2)之莫耳比[矽烷化合物(1):矽烷化合物(2)]為5:95~80:20。 The decane compound polymer according to the invention of claim 8, wherein the molar ratio of the decane compound (1) to the decane compound (2) contained in the mixture of the aforementioned decane compounds is a decane compound (1): a decane compound ( 2)] is 5:95~80:20. 如申請專利範圍第6項所述之矽烷化合物聚合物,其重量平均分子量為1,000~30,000。 The decane compound polymer as described in claim 6 has a weight average molecular weight of 1,000 to 30,000. 一種硬化性組成物,係含有如申請專利範圍第1至10項中任一項所述之矽烷化合物聚合物。 A sclerosing composition containing a decane compound polymer as described in any one of claims 1 to 10. 如申請專利範圍第11項所述之硬化性組成物,其係光元件固定材用組成物。 The curable composition according to claim 11, which is a composition for a fixing member for an optical element. 一種硬化物,其係由申請專利範圍第11項所述之硬化性組成物硬化而成者。 A cured product obtained by hardening a curable composition according to claim 11 of the patent application. 如申請專利範圍第13項所述之硬化物,其係光元件固定材。 A cured product according to claim 13 which is a fixing member for an optical element. 一種將申請專利範圍第11項所述之硬化性組成物作為光元件固定材用接著劑使用之方法。 A method of using the curable composition according to Item 11 of the patent application as an adhesive for an optical element fixing material. 一種將申請專利範圍第11項所述之硬化性組成物作為光元件固定材用封裝劑使用之方法。 A method of using the curable composition described in claim 11 as a sealing agent for an optical element fixing material.
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