CN114402037A

CN114402037A - Curable composition, cured product, and method for using curable composition

Info

Publication number: CN114402037A
Application number: CN202080067180.9A
Authority: CN
Inventors: 森瑶子; 宫胁学
Original assignee: Lintec Corp
Current assignee: Lintec Corp
Priority date: 2019-09-27
Filing date: 2020-09-28
Publication date: 2022-04-26
Also published as: WO2021060561A1; KR20220074817A; JPWO2021060561A1; TW202118832A

Abstract

The present invention relates to: a curable composition containing the following components (A) and (C); the above-mentioned curing property is improvedA cured product obtained by curing the composition; and a method for using the curable composition as an adhesive for optical element-fixing materials or a sealing material for optical element-fixing materials. The curable composition of the present invention has a high refractive index and is suitable for use in the optical field. (A) The components: a polysilsesquioxane compound which is a compound having the following formula (a-1) [ R¹Represents an unsubstituted aryl group having 6 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms and having a substituent.]The repeating unit shown [ repeating unit (1) ]]And with or without the following formula (a-2) [ R ]²Represents an unsubstituted alkyl group having 1 to 10 carbon atoms or an alkyl group having 1 to 10 carbon atoms and having a substituent.]Repeating Unit shown [ repeating Unit (2) ]]The polysilsesquioxane compound of (a), which is characterized by satisfying specific requirements regarding a molecular structure; (C) the components: a silane coupling agent.

Description

Curable composition, cured product, and method for using curable composition

Technical Field

The present invention relates to: a curable composition having a high refractive index and suitable for use in the optical field; a cured product obtained by curing the curable composition; and a method for using the curable composition as an adhesive for optical element-fixing materials or a sealing material for optical element-fixing materials.

Background

Conventionally, curable compositions have been improved variously depending on the application, and are widely used industrially as a raw material, an adhesive, a coating agent, and the like for optical components or molded articles.

The curable composition has also attracted attention as a composition for an optical element fixing material such as an adhesive for an optical element fixing material and a sealing material for an optical element fixing material.

Examples of the optical element include various lasers such as a semiconductor laser (LD, semiconductor laser), a light emitting element such as a Light Emitting Diode (LED), a light receiving element, a composite optical element, and an optical integrated circuit.

In recent years, optical elements that emit blue or white light having a peak wavelength of light emission of a shorter wavelength have been developed and widely used. The increase in luminance of the light-emitting element having a short peak wavelength of light emission has been dramatically advanced, and the amount of heat generated by the optical element tends to increase further.

However, with the recent increase in brightness of optical elements, there has been a problem that the adhesive strength of a cured product of the composition for an optical element-fixing material is reduced by exposure to light of higher energy or heat of higher temperature generated from the optical element for a long time.

In order to solve this problem, patent documents 1 to 3 propose: a composition for optical element fixing material containing polysilsesquioxane compound as main component.

However, when an optical element or the like is fixed using a curable composition, a curable composition having an appropriate refractive index may be selected according to the refractive index of surrounding members in order to improve light extraction efficiency.

For example, in order to suppress reflection at the interface between the sealant and the fixing material and improve light extraction efficiency, it is preferable that the difference between the refractive index of the sealant and the refractive index of the fixing material is small.

Therefore, in the case of using a sealant having a high refractive index, it is also necessary to form a fixing material using a curable composition having a high refractive index.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2004-359933;

patent document 2: japanese patent laid-open publication No. 2005-263869;

patent document 3: japanese patent laid-open No. 2006-328231.

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made in view of the above-described actual situation of the conventional art, and an object thereof is to provide: a curable composition having a high refractive index and suitable for use in the optical field; a cured product obtained by curing the curable composition; and a method for using the curable composition as an adhesive for optical element-fixing materials or a sealing material for optical element-fixing materials.

Means for solving the problems

The present inventors have made intensive studies on a curable composition containing a polysilsesquioxane compound in order to solve the above problems.

As a result, the following were found:

(i) by using a polysilsesquioxane compound containing a large amount of aryl groups as the polysilsesquioxane compound, a curable composition having a high refractive index, a curable resin composition containing the same, and a method for producing the same,

(ii) A cured product of a curable composition containing a polysilsesquioxane compound containing a large amount of aryl groups may be cracked,

(iii) A cured product of a curable composition containing a polysilsesquioxane compound containing a large amount of aryl groups tends to have poor adhesiveness,

(iv) The problems (ii) and (iii) can be solved by introducing a specific molecular structure into a polysilsesquioxane compound containing a large amount of aryl groups and adding a silane coupling agent to a curable composition,

thus, the present invention has been completed.

Thus, the present invention provides the following curable compositions [1] to [7 ]; [8] (iii) a cured product of (1) or (9); and [10] and [11 ].

[1] A curable composition comprising the following components (A) and (C),

(A) the components: a polysilsesquioxane compound which is a polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) [ repeating unit (1) ] and having or not having a repeating unit represented by the following formula (a-2) [ repeating unit (2) ],

[ chemical formula 1]

R¹Represents an unsubstituted aryl group having 6 to 12 carbon atoms or a substituted aryl group having 6 to 12 carbon atoms,

[ chemical formula 2]

R²Represents an unsubstituted alkyl group having 1 to 10 carbon atoms or an alkyl group having 1 to 10 carbon atoms and having a substituent,

the polysilsesquioxane compound is characterized by satisfying the following requirements 1 and 2,

[ element 1]

The amount of the repeating unit (1) is 80 to 100 mol% based on the total amount of the repeating unit (1) and the repeating unit (2),

[ element 2]

The amount of the T2 site is 30 to 70 mol% based on the total amount of the T site (T1 site) represented by the following formula (a-3), the T site (T2 site) represented by the following formula (a-4) and the T site (T3 site) represented by the following formula (a-5),

[ chemical formula 3]

G represents R¹Or R²A group represented by, R³Represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, to which a silicon atom is bonded;

(C) the components: a silane coupling agent.

[2] [1] the curable composition, wherein the component (A) has a mass average molecular weight (Mw) of 500 to 3,000.

[3] [1] the curable composition according to [1] or [2], wherein the total amount of the repeating unit (1) and the repeating unit (2) in the component (A) is 90 to 100 mol% of the total repeating units in the component (A).

[4] The curable composition according to any one of [1] to [3], wherein the content of the component (C) is 0.1 to 70 parts by mass per 100 parts by mass of the component (A).

[5] The curable composition according to any one of [1] to [4], wherein the total amount of the component (A) and the component (C) is 50 to 100% by mass in the solid content of the curable composition.

[6] The curable composition according to any one of [1] to [5], further comprising a diluent, wherein the solid content concentration is 60% by mass or more and less than 100% by mass.

[7] The curable composition according to any one of [1] to [6], wherein the refractive index (nD) at 25 ℃ is 1.500 to 1.600.

[8] A cured product obtained by curing the curable composition according to any one of the above [1] to [7 ].

[9] [8] the cured product of the optical element-fixing material.

[10] A method for using the curable composition according to any one of the above [1] to [7] as an adhesive for an optical element-fixing material.

[11] A method for using the curable composition according to any one of the above [1] to [7] as a sealing material for an optical element-fixing material.

Effects of the invention

According to the present invention, there can be provided: a curable composition having a high refractive index and suitable for use in the optical field; a cured product obtained by curing the curable composition; and a method for using the curable composition as an adhesive for optical element-fixing materials or a sealing material for optical element-fixing materials.

Detailed Description

The invention is divided into the following: 1) a curable composition; 2) curing the product; and 3) a method for using the curable composition will be described in detail.

1) Curable composition

The curable composition of the present invention contains the following components (a) and (C):

(A) the components: a polysilsesquioxane compound which has a repeating unit represented by the above formula (a-1) and may or may not have a repeating unit represented by the above formula (a-2), and a polysilsesquioxane compound [ hereinafter, sometimes referred to as "polysilsesquioxane compound (a)". Is characterized by satisfying the requirements 1 and 2;

(C) the components: a silane coupling agent.

[ (A) component ]

The component (A) constituting the curable composition of the present invention is a polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) [ repeating unit (1) ], and is characterized in that the polysilsesquioxane compound satisfies the above requirements 1 and 2.

[ chemical formula 4]

R¹Represents an unsubstituted aryl group having 6 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms and having a substituent.

Since the repeating unit (1) has R¹And thus the polysilsesquioxane compound having the repeating unit (1) has a high refractive index. Therefore, the curable composition of the present invention has a high refractive index.

As R¹The "unsubstituted aryl group having 6 to 12 carbon atoms" includes: phenyl, 1-naphthyl, 2-naphthyl, and the like.

R¹The "unsubstituted aryl group having 6 to 12 carbon atoms" preferably has 6 carbon atoms.

R¹The "aryl group having 6 to 12 carbon atoms and having a substituent" preferably has 6 carbon atoms. The number of carbons refers to the number of carbons of the portion (aryl group portion) excluding the substituent. Thus, at R¹In the case of "aryl group having 6 to 12 carbon atoms with substituent group", R¹May also exceed 12.

As R¹The "aryl group having 6 to 12 carbon atoms as a substituent" includes: the same contents as those shown as "unsubstituted aryl group having 6 to 12 carbon atoms".

R¹The number of the substituents (excluding the number of hydrogen atoms) of the "aryl group having 6 to 12 carbon atoms having a substituent" in (a) is usually 1 to 30, preferably 1 to 20.

As R¹The substituent for the "aryl group having 6 to 12 carbon atoms and having a substituent" includes: methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutylAlkyl groups such as a tert-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, and an isooctyl group; a halogen atom such as a chlorine atom or a bromine atom; alkoxy groups such as methoxy and ethoxy.

Among these, R is a group represented by the following formula in view of efficiently preparing a curable composition having a high refractive index¹The aryl group is preferably an unsubstituted aryl group having 6 to 12 carbon atoms, and more preferably a phenyl group.

The polysilsesquioxane compound (A) may have 1R¹The compound (homopolymer) of (2) or more R may be used¹The compound (copolymer) of (1).

When the polysilsesquioxane compound (a) is a copolymer, the polysilsesquioxane compound (a) may be any of a random copolymer, a block copolymer, a graft copolymer, an alternating copolymer, and the like, but from the viewpoint of ease of production and the like, a random copolymer is preferable.

The polysilsesquioxane compound (a) may have any structure of a ladder structure, a double-layer structure, a cage structure, a partially split cage structure, a ring structure, or a random structure.

The polysilsesquioxane compound (a) may be a compound (copolymer) further having a repeating unit [ repeating unit (2) ] represented by the following formula (a-2).

[ chemical formula 5]

R²Represents an unsubstituted alkyl group having 1 to 10 carbon atoms or an alkyl group having 1 to 10 carbon atoms and having a substituent.

Generally, when the polysilsesquioxane compound has the repeating unit (2), the molecular weight can be increased and the flexibility of the molecular chain can be improved. Therefore, it is considered that when the curable composition contains the polysilsesquioxane compound having the repeating unit (2), a cured product thereof is less likely to crack.

However, as described later, the present invention uses a polysilsesquioxane compound having a low content ratio of repeating unit (2), and it is expected that this effect by repeating unit (2) is hardly utilized.

R²The "unsubstituted alkyl group having 1 to 10 carbon atoms" preferably has 1 to 6 carbon atoms, more preferably 1 to 3 carbon atoms.

As R²The "unsubstituted alkyl group having 1 to 10 carbon atoms" includes: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, n-hexyl, n-octyl, n-nonyl, n-decyl, and the like.

R²The "alkyl group having 1 to 10 carbon atoms and a substituent" preferably has 1 to 6 carbon atoms, more preferably 1 to 3 carbon atoms. The number of carbons refers to the number of carbons of the portion (alkyl portion) excluding the substituent. Thus, at R²In the case of "alkyl group having 1 to 10 carbon atoms with substituent group", R²May also exceed 10.

As R²Examples of the "alkyl group having 1 to 10 carbon atoms as a substituent" include: the same contents as those shown as "unsubstituted alkyl group having 1 to 10 carbon atoms".

The number of atoms of the substituent (excluding the number of hydrogen atoms) of the "alkyl group having 1 to 10 carbon atoms as a substituent" is usually 1 to 30, preferably 1 to 20.

Examples of the substituent of the "alkyl group having 1 to 10 carbon atoms and having a substituent" include: a halogen atom such as a chlorine atom or a bromine atom; cyano, and the like.

Among these, as R²The alkyl group is preferably an unsubstituted alkyl group having 1 to 10 carbon atoms, more preferably an unsubstituted alkyl group having 1 to 6 carbon atoms, and still more preferably an unsubstituted alkyl group having 1 to 3 carbon atoms.

By using R²The polysilsesquioxane compound (A) is an unsubstituted alkyl group having 1 to 10 carbon atoms, and the molecular weight of the polysilsesquioxane compound (A) can be effectively controlled.

In the case where the polysilsesquioxane compound (A) is a compound having the repeating unit (2), the polysilsesquioxane compound (A) may be a compound having 1R²The compound of (1) may have 2 or more kinds of R²The compound of (1).

The repeating unit (1) or the repeating unit (2) is represented by the following formula (a-6).

[ chemical formula 6]

G represents R¹Or R²The group shown. R¹、R²Each means the same as described above. O is_1/2Indicates that the oxygen atom is common to the adjacent repeating units.

The polysilsesquioxane compound (a) has a partial structure in which 3 oxygen atoms are bonded to a silicon atom and 1 other group (group represented by G) is bonded thereto, which is generally referred to as a T site (T site), as shown in formula (a-6).

Examples of the T site contained in the polysilsesquioxane compound (a) include: a T site (T1 site) represented by the following formula (a-3), a T site (T2 site) represented by the following formula (a-4), and a T site (T3 site) represented by the following formula (a-5).

[ chemical formula 7]

In the formulae (a-3), (a-4) and (a-5), G represents the same meaning as described above. R³Represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. As R³Examples of the "alkyl group having 1 to 10 carbon atoms" include: methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, and the like. Plural R³May be the same or different from each other. In the above formulae (a-3) to (a-5), a silicon atom is bonded thereto.

In the synthesis of the polysilsesquioxane compound (a), the product contained more T1 sites or T2 sites immediately after the start of the reaction, but as the reaction proceeded, the amount of these sites decreased and the amount of T3 sites gradually increased.

Therefore, the polysilsesquioxane compound having a high content ratio at the T1 site or the T2 site is a relatively low molecular weight compound, whereas the polysilsesquioxane compound having a high content ratio at the T3 site is a relatively high molecular weight compound, and the movement of the molecular chain is restricted.

In addition, the residual reactive group (-OR)³) The number of (2) shows that the polysilsesquioxane compound having a high content of the T1 site or the T2 site has sufficient reactivity, whereas the polysilsesquioxane compound having a high content of the T3 site tends to have poor reactivity.

The polysilsesquioxane compound (a) is a compound satisfying the above requirement 1.

That is, the amount of the repeating unit (1) in the polysilsesquioxane compound (A) is 80 to 100 mol% based on the total amount of the repeating unit (1) and the repeating unit (2).

The curable composition of the present invention has a high refractive index because it contains a polysilsesquioxane compound satisfying requirement 1.

The amount of the repeating unit (1) is preferably 92 to 100 mol%, more preferably 98 to 100 mol%, and particularly preferably 100 mol% based on the total amount of the repeating unit (1) and the repeating unit (2) from the viewpoint of obtaining a curable composition having a higher refractive index.

The polysilsesquioxane compound (a) satisfying the requirement 1 contains little or no repeating unit (2). Therefore, the polysilsesquioxane compound satisfying requirement 1 is considered to have almost no characteristics attributable to the repeating unit (2).

That is, when the polysilsesquioxane compound satisfying requirement 1 is contained in the curable composition, cracks may occur in a cured product thereof, or adhesiveness of the cured product may be poor.

As described later, the present invention can solve these problems by satisfying requirement 2 and utilizing the component (C).

The proportion of the repeating unit (1) or the repeating unit (2) in the polysilsesquioxane compound (A) can be determined, for example, by²⁹Si-NMR.

The polysilsesquioxane compound (a) is soluble in various organic solvents as follows: ketone solvents such as acetone; aromatic hydrocarbon solvents such as benzene; dimethyl sulfoxideSulfur-containing solvents such as sulfone; ether solvents such as tetrahydrofuran; ester solvents such as ethyl acetate; halogen-containing solvents such as chloroform; and a mixed solvent composed of 2 or more of them. Therefore, these solvents can be used for measuring the polysilsesquioxane compound (A) in the state of solution²⁹Si-NMR。

The polysilsesquioxane compound (a) is a compound satisfying the above requirement 2.

That is, the polysilsesquioxane compound (a) has the T2 site in an amount of 30 to 70 mol% based on the total amount of the T1 site, the T2 site, and the T3 site, and includes the T2 site in a relatively large amount.

The curable composition of the present invention contains a polysilsesquioxane compound satisfying the above requirement 1, and the effect of the repeating unit (2) is hardly utilized.

However, when the polysilsesquioxane compound satisfying requirement 1 satisfies requirement 2, the cured product of the curable composition of the present invention is less likely to crack.

That is, a curable composition containing a polysilsesquioxane compound satisfying the above requirement 1 and containing a large amount of T1 sites excessively causes a hydrolysis reaction or a condensation reaction during curing, and a cured product thereof is likely to have cracks due to curing shrinkage.

Further, a polysilsesquioxane compound satisfying the above requirement 1 and containing a large number of T3 sites is a relatively high-molecular compound and has poor mobility, and therefore, a cured product of a curable composition containing such a polysilsesquioxane compound is likely to have residual stress and to have cracks.

On the other hand, since the curable composition containing a polysilsesquioxane compound containing a large number of T2 sites can be cured without excessively causing a hydrolysis reaction or a condensation reaction, cracks are less likely to occur in the cured product.

Further, since the polysilsesquioxane compound having a large number of T2 sites has not a very high molecular weight and has an appropriate mobility, a cured product of a curable composition containing a polysilsesquioxane compound having a large number of T2 sites is less likely to have residual stress and is less likely to have cracks.

Further, the use of a polysilsesquioxane compound containing a large number of T2 sites tends to improve the adhesiveness of a cured product of the curable composition.

From the viewpoint of easily obtaining the above-mentioned effects, the amount of the T2 site is 30 to 70 mol%, preferably 35 to 66 mol%, more preferably 40 to 62 mol%, and still more preferably 45 to 58 mol% based on the total amount of the T1 site, the T2 site, and the T3 site.

The amount of the T1 site is preferably 0 to 40 mol%, more preferably 0 to 30 mol%, even more preferably 0 to 20 mol%, and even more preferably 0 to 10 mol% based on the total amount of the T1 site, the T2 site, and the T3 site.

By appropriately including the T1 site in the polysilsesquioxane compound (a), a curable composition having more excellent curability can be obtained.

In addition, the amount of the T3 site is preferably 10 to 80 mol%, more preferably 20 to 70 mol%, and still more preferably 30 to 50 mol% with respect to the total amount of the T1 site, the T2 site, and the T3 site.

By appropriately including the T3 site in the polysilsesquioxane compound (a), the occurrence of by-products generated by condensation reaction during curing can be suppressed.

The content ratio of the T1 site, the T2 site and the T3 site can be determined by measuring the polysilsesquioxane compound (A) in the state of solution²⁹Si-NMR.

For example, in the case of using acetone as a measurement solvent and TMS (tetramethylsilane) as an internal standard, signals derived from a silicon atom in the T site where G is a phenyl group were observed at-65 to-58 ppm at the T1 site, at-74 to-65 ppm at the T2 site, and at-82 to-75 ppm at the T3 site in the formulas (a-3) to (a-6), and signals derived from a silicon atom in the T site where G is a methyl group were observed at-50 to-46 ppm at the T1 site, at-61 to-52 ppm at the T2 site, and at-70 to-61 ppm at the T3 site.

The polysilsesquioxane compound (A) has a mass average molecular weight (Mw) of preferably 500 to 3,000, more preferably 550 to 2,650, still more preferably 600 to 2,300, and still more preferably 650 to 2,000. By using the polysilsesquioxane compound (a) having a mass average molecular weight (Mw) within the above range, a curable composition in which cracks are less likely to occur after curing can be easily obtained.

The molecular weight distribution (Mw/Mn) of the polysilsesquioxane compound (A) is not particularly limited, but is usually 1.0 to 10.0, preferably 1.1 to 6.0, and more preferably 1.1 to 4.0. By using the polysilsesquioxane compound (a) having a molecular weight distribution (Mw/Mn) within the above range, a curable composition that provides a cured product having more excellent heat resistance and adhesiveness can be easily obtained.

The mass average molecular weight (Mw) and the number average molecular weight (Mn) can be determined as standard polystyrene values based on Gel Permeation Chromatography (GPC) using Tetrahydrofuran (THF) as a solvent, for example.

The total amount of the repeating units (1) and (2) in the polysilsesquioxane compound (A) is preferably 90 to 100 mol%, more preferably 95 to 100 mol%, and still more preferably 98 to 100 mol% of the total repeating units in the polysilsesquioxane compound (A).

The polysilsesquioxane compound (A) has a refractive index (nD) at 25 ℃ of preferably 1.500 to 1.600, more preferably 1.505 to 1.590, and still more preferably 1.510 to 1.580.

By setting the refractive index (nD) of the polysilsesquioxane compound (A) at 25 ℃ within the range of 1.500 to 1.600, a curable composition or a cured product having a high refractive index can be easily obtained.

The refractive index (nD) of the polysilsesquioxane compound (a) may be measured using an abbe refractometer.

In the present invention, the polysilsesquioxane compound (a) may be used alone in 1 kind, or in combination with 2 or more kinds.

The method for synthesizing the polysilsesquioxane compound (a) is not particularly limited. For example, the polysilsesquioxane compound (A) can be synthesized by polycondensing at least one silane compound (1) represented by the following formula (a-7).

[ chemical formula 8]

In the formula, R¹The same meanings as described above are indicated. R⁴Represents an alkyl group having 1 to 10 carbon atoms, X¹Represents a halogen atom, and p represents an integer of 0 to 3. Plural R⁴And a plurality of X¹May be respectively the same as or different from each other.

Further, the polysilsesquioxane compound (A) can be synthesized by polycondensing at least one of the silane compounds (1) represented by the formula (a-7) with at least one of the silane compounds (2) represented by the following formula (a-8).

[ chemical formula 9]

In the formula, R²The same meanings as described above are indicated. R⁵Represents an alkyl group having 1 to 10 carbon atoms, X²Represents a halogen atom, and q represents an integer of 0 to 3. Plural R⁵And a plurality of X²May be respectively the same as or different from each other.

As R⁴、R⁵Examples of the "alkyl group having 1 to 10 carbon atoms" include: and as R³The same applies to the "alkyl group having 1 to 10 carbon atoms".

As X¹、X²Examples of the halogen atom of (1) include: chlorine atom and bromine atom, etc.

Specific examples of the silane compound (1) include:

unsubstituted aryltrialkoxysilane compounds such as phenyltrimethoxysilane and phenyltriethoxysilane;

unsubstituted aryl haloalkoxy silane compounds such as phenylchlorodimethoxysilane, phenylchlorodiethoxysilane, phenyldichloromethoxysilane, and phenyldichloroethoxysilane;

unsubstituted aryltrihalosilane compounds such as phenyltrichlorosilane;

aryl trialkoxysilane compounds having a substituent such as 4-methylphenyltrimethoxysilane, 4-methoxyphenyltrimethoxysilane, 4-chlorophenyltrimethoxysilane, 4-methylphenyltriethoxysilane, 4-methoxyphenyltriethoxysilane, and 4-chlorophenyltriethoxysilane;

aryl halogenoalkoxysilane compounds having a substituent such as 4-methylphenylchlorodimethoxysilane, 4-methoxyphenylchlorodimethoxysilane, 4-chlorophenylchlorodimethoxysilane, 4-methylphenyldichloromethoxysilane, 4-methoxyphenyldichloromethoxysilane, 4-chlorophenyldichloromethoxysilane and the like;

and aryl trihalosilane compounds having a substituent such as 4-methylphenyltrichlorosilane, 4-methoxyphenyltrichlorosilane, and 4-chlorophenyltrichlorosilane.

These silane compounds (1) can be used alone in 1 kind, or in combination with 2 or more kinds.

Specific examples of the silane compound (2) include:

unsubstituted alkyltrialkoxysilane compounds such as methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, and ethyltripropoxysilane;

unsubstituted alkylhaloalkoxysilane compounds such as methylchlorodimethoxysilane, methylchlorodiethoxysilane, methyldichlormethoxysilane, methylbromodimethoxysilane, ethylchlorodimethoxysilane, ethylchlorodiethoxysilane, ethyldichloromethoxysilane and ethylbromodimethoxysilane;

unsubstituted alkyltrihalosilane compounds such as methyltrichlorosilane, methyltrtribromosilane, ethyltrichlorosilane, ethyltribromosilane and the like;

alkyltrialkoxysilane compounds having a substituent such as 2-cyanoethyltrimethoxysilane, 3-chloropropyltrimethoxysilane, 2-cyanoethyltriethoxysilane, and 3-chloropropyltriethoxysilane;

alkyl halogenoalkoxysilane compounds having a substituent such as 2-cyanoethylchlorodimethoxysilane, 3-chloropropylchlorodimethoxysilane, 2-cyanoethylchlorodiethoxysilane, 3-chloropropylchlorodiethoxysilane, 2-cyanoethyldichloromethoxysilane, 3-chloropropyldichloromethoxysilane, 2-cyanoethyldichloroethoxysilane, 3-chloropropyldichloroethoxysilane, etc.;

and alkyl trihalosilane compounds having a substituent such as 2-cyanoethyltrichlorosilane and 3-chloropropyltrichlorosilane.

These silane compounds (2) can be used alone in 1 kind, or in combination with 2 or more kinds.

The method for polycondensing the silane compound is not particularly limited. Examples thereof include: a method in which a predetermined amount of a polycondensation catalyst is added to a silane compound in a solvent or without a solvent, and stirring is carried out at a predetermined temperature. More specifically, there may be mentioned: a method in which a predetermined amount of an acid catalyst is added to the silane compound (a) and stirring is carried out at a predetermined temperature; a method in which a predetermined amount of a base catalyst is added to the silane compound (b) and stirring is carried out at a predetermined temperature; a method in which a predetermined amount of an acid catalyst is added to the silane compound (c), stirring is performed at a predetermined temperature, and then an excess amount of a base catalyst is added to make the reaction system basic, and stirring is performed at a predetermined temperature.

Among these, the method (a) is preferable in view of efficiently obtaining the objective polysilsesquioxane compound (a).

The polycondensation catalyst used may be any of an acid catalyst and a base catalyst. In addition, although 2 or more kinds of polycondensation catalysts can be used in combination, it is preferable to use at least an acid catalyst.

Examples of the acid catalyst include: inorganic acids such as phosphoric acid, hydrochloric acid, boric acid, sulfuric acid, and nitric acid; and organic acids such as citric acid, acetic acid, methanesulfonic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, and p-toluenesulfonic acid. Among these, at least one selected from phosphoric acid, hydrochloric acid, boric acid, sulfuric acid, citric acid, acetic acid, and methanesulfonic acid is preferable.

Examples of the base catalyst include: ammonia water; organic bases such as trimethylamine, triethylamine, lithium diisopropylamide, lithium bis (trimethylsilyl) amide, pyridine, 1, 8-diazabicyclo [5.4.0] -7-undecene, aniline, picoline, 1, 4-diazabicyclo [2.2.2] octane, and imidazole; organic hydroxides such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; metal alkoxides such as sodium methoxide, sodium ethoxide, sodium tert-butoxide, and potassium tert-butoxide; metal hydrides such as sodium hydride and calcium hydride; metal hydroxides such as sodium hydroxide, potassium hydroxide, and calcium hydroxide; metal carbonates such as sodium carbonate, potassium carbonate, and magnesium carbonate; and metal hydrogen carbonates such as sodium hydrogen carbonate and potassium hydrogen carbonate.

The amount of the polycondensation catalyst used is usually in the range of 0.05 to 10 mol%, preferably 0.1 to 5 mol%, relative to the total molar amount of the silane compounds.

When a solvent is used for the polycondensation, the solvent to be used may be appropriately selected depending on the kind of the silane compound and the like. Examples thereof include: water; aromatic hydrocarbons such as benzene, toluene, and xylene; esters such as methyl acetate, ethyl acetate, propyl acetate, butyl acetate, and methyl propionate; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; alcohols such as methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, and tert-butanol. These solvents may be used alone in 1 kind, or in combination of 2 or more kinds.

The amount of the solvent used is 0.1 liter or more and 10 liters or less, preferably 0.1 liter or more and 2 liters or less, relative to the total molar amount of the silane compound of 1 mol.

The temperature at which the silane compound is polycondensed is usually in the range of 0 ℃ to the boiling point of the solvent used, and preferably in the range of 20 ℃ to 100 ℃. If the reaction temperature is too low, the progress of the polycondensation reaction may be insufficient. On the other hand, when the reaction temperature is too high, it is difficult to suppress gelation. The reaction is usually completed within 30 minutes to 30 hours.

When the reaction is carried out using a large amount of the compound represented by the formula (a-7), it is difficult to obtain a polymer having a large molecular weight. Furthermore, even if the reaction is carried out for a long time, it is difficult to increase the molecular weight in a state where the T2 site remains.

In addition, in order to obtain the effects of the present invention, the molecular weight of the polysilsesquioxane compound (a) is preferably not necessarily too large.

Therefore, in order to synthesize the polysilsesquioxane compound (a), it is preferable to add a predetermined amount of an acid catalyst to the silane compound, stir the mixture at a predetermined temperature, and terminate the reaction in a short time, as described above.

OR of silane Compound (1) when polysilsesquioxane Compound (A) is synthesized by the above-mentioned method⁴Or X¹OR OR of silane compound (2)⁵Or X²In (4), the portion where dealcoholization or the like does not occur remains in the polysilsesquioxane compound (A). Accordingly, the polysilsesquioxane compound (A) contains repeating units represented by the above-mentioned formulae (a-3) and (a-4) in addition to the repeating unit represented by the above-mentioned formula (a-5).

[ (C) ingredient ]

The component (C) constituting the curable composition of the present invention is a silane coupling agent.

However, since the curable composition of the present invention contains the polysilsesquioxane compound satisfying requirement 1 and component (C), a cured product of the curable composition of the present invention has excellent adhesiveness at room temperature or at high temperature.

The silane coupling agent is a silane compound having a silicon atom, a functional group, and a hydrolyzable group bonded to the silicon atom.

The functional group is a group reactive with other compounds (mainly organic compounds), and examples thereof include: a group having a nitrogen atom such as an amino group, a substituted amino group, an isocyanate group, a ureido group, or a group having an isocyanurate skeleton; acid anhydride group (group having acid anhydride structure); a vinyl group; an allyl group; an epoxy group; a (meth) acryloyl group; mercapto groups, and the like.

In the present invention, 1 kind of silane coupling agent may be used alone, or 2 or more kinds may be used in combination.

The content of the silane coupling agent is preferably 0.1 to 70 parts by mass, more preferably 1 to 60 parts by mass, still more preferably 5 to 55 parts by mass, yet more preferably 10 to 50 parts by mass, and particularly preferably 15 to 45 parts by mass, based on 100 parts by mass of the polysilsesquioxane compound (A).

By using the curable composition in which the content of the silane coupling agent is within the above range, a cured product having more excellent adhesiveness at normal temperature or at high temperature can be formed.

The silane coupling agent is preferably a silane coupling agent having a nitrogen atom in the molecule or a silane coupling agent having an acid anhydride structure in the molecule, and more preferably a silane coupling agent having an isocyanurate structure in the molecule or a silane coupling agent having a succinic anhydride structure in the molecule.

Examples of the silane coupling agent having a nitrogen atom in the molecule include: trialkoxysilane compounds represented by the following formula (c-1), dialkoxyalkylsilane compounds represented by the following formula (c-2), dialkoxyarylsilane compounds, and the like.

[ chemical formula 10]

In the above formula, R^aRepresents an alkoxy group having 1 to 6 carbon atoms such as a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, a tert-butoxy group, etc. Plural R^aMay be the same or different from each other.

R^bAn alkyl group having 1 to 6 carbon atoms such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, etc.; or an unsubstituted or substituted aryl group such as a phenyl group, 4-chlorophenyl group, 4-methylphenyl group, or 1-naphthyl group.

R^cRepresents an organic group having 1 to 10 carbon atoms and having a nitrogen atom. In addition, R^cMay be further bonded with groups containing other silicon atoms.

As R^cSpecific examples of the organic group having 1 to 10 carbon atoms include: n-2- (aminoethyl) -3-aminopropyl, N- (1, 3-dimethyl-butylene) aminopropyl, 3-ureidopropyl, N-phenyl-aminopropyl and the like.

In the compound represented by the above formula (c-1) or (c-2), R is^cBeing bound to groups containing other silicon atomsIn the case of an organic group, there may be mentioned: a compound which forms an isocyanurate-based silane coupling agent by bonding to another silicon atom via an isocyanurate skeleton, or a compound which forms a urea-based silane coupling agent by bonding to another silicon atom via a urea skeleton.

Among these, as a silane coupling agent having a nitrogen atom in the molecule, an isocyanurate-based silane coupling agent and a urea-based silane coupling agent are preferable, and a silane coupling agent having 4 or more alkoxy groups bonded to a silicon atom in the molecule is more preferable, from the viewpoint of easily obtaining a cured product having more excellent adhesiveness.

The alkoxy group having 4 or more bonds to a silicon atom means that the total count of the alkoxy groups bonded to the same silicon atom and the alkoxy groups bonded to different silicon atoms is 4 or more.

Examples of the isocyanurate-based silane coupling agent having 4 or more alkoxy groups bonded to silicon atoms include: a compound represented by the following formula (c-3). Examples of the urea-based silane coupling agent having 4 or more alkoxy groups bonded to a silicon atom include: a compound represented by the following formula (c-4).

[ chemical formula 11]

In the formula, R^aThe same meanings as described above are indicated. t1 to t5 each independently represent an integer of 1 to 10, preferably an integer of 1 to 6, and particularly preferably 3.

Among these, as the silane coupling agent having a nitrogen atom in the molecule, 1,3, 5-N-tris (3-trimethoxysilylpropyl) isocyanurate, 1,3, 5-N-tris (3-triethoxysilylpropyl) isocyanurate (hereinafter, referred to as "isocyanurate compound"), N '-bis (3-trimethoxysilylpropyl) urea, N' -bis (3-triethoxysilylpropyl) urea (hereinafter, referred to as "urea compound"), and a combination of the above-mentioned isocyanurate compound and urea compound are preferably used.

When the curable composition of the present invention contains a silane coupling agent having a nitrogen atom in the molecule, the content thereof is not particularly limited, and the amount thereof is the following amount: the composition is prepared by mixing the component (A) and a silane coupling agent having a nitrogen atom in the molecule in a mass ratio of the component (A) to the component (A) (component (A): silane coupling agent having nitrogen atom in the molecule ], preferably 100: 0.1 to 100: 65. more preferably 100: 0.3-100: 60. more preferably 100: 1-100: 50. more preferably 100: 3-100: 40. particularly preferably 100: 5-100: 35.

a cured product of the curable composition containing the component (a) and the silane coupling agent having a nitrogen atom in the molecule at such a ratio is more excellent in heat resistance and adhesiveness.

The silane coupling agent having an acid anhydride structure in a molecule is an organosilicon compound having both a group having an acid anhydride structure and a hydrolyzable group in one molecule. Specifically, there may be mentioned: a compound represented by the following formula (c-5).

[ chemical formula 12]

Wherein Q represents a group having an acid anhydride structure, R^dR represents an alkyl group having 1 to 6 carbon atoms or a substituted or unsubstituted phenyl group^eRepresents an alkoxy group having 1 to 6 carbon atoms or a halogen atom, i and k represent an integer of 1 to 3, j represents an integer of 0 to 2, and i + j + k is 4. When j is 2, R^dMay be the same or different from each other. When k is 2 or 3, a plurality of R^eMay be the same or different from each other. When i is 2 or 3, Q's may be the same or different from each other.

Examples of Q include: and the group represented by the following formula, and the like, particularly preferably a group represented by (Q1),

[ chemical formula 13]

Wherein h represents an integer of 0 to 10.

Examples of the silane coupling agent having an acid anhydride structure in the molecule include: tri (C1-C6) alkoxysilyl (C2-C8) alkyl succinic anhydrides such as 2- (trimethoxysilyl) ethylsuccinic anhydride, 2- (triethoxysilyl) ethylsuccinic anhydride, 3- (trimethoxysilyl) propylsuccinic anhydride and 3- (triethoxysilyl) propylsuccinic anhydride;

di (C1-C6) alkoxymethylsilyl (C2-C8) alkylsuccinic anhydride such as 2- (dimethoxymethylsilyl) ethylsuccinic anhydride;

(C1-C6) alkoxydimethylsilyl (C2-C8) alkylsuccinic anhydride such as 2- (methoxydimethylsilyl) ethylsuccinic anhydride;

trihalosilyl (2 to 8 carbon atoms) alkyl succinic anhydrides such as 2- (trichlorosilyl) ethyl succinic anhydride and 2- (tribromosilyl) ethyl succinic anhydride;

dihalomethylsilyl (having 2 to 8 carbon atoms) alkylsuccinic anhydrides such as 2- (dichloromethylsilyl) ethylsuccinic anhydride;

and halogenated dimethylsilyl (C2-C8) alkyl succinic anhydrides such as 2- (chlorodimethylsilyl) ethyl succinic anhydride.

Among these, the silane coupling agent having an acid anhydride structure in the molecule is preferably a tri (carbon number 1 to 6) alkoxysilyl (carbon number 2 to 8) alkyl succinic anhydride, and particularly preferably 3- (trimethoxysilyl) propyl succinic anhydride or 3- (triethoxysilyl) propyl succinic anhydride.

When the curable composition of the present invention contains a silane coupling agent having an acid anhydride structure in the molecule, the content thereof is not particularly limited, and the amount thereof is the following amount: the silane coupling agent is prepared by mixing the component (A) and a silane coupling agent having an acid anhydride structure in the molecule in a mass ratio of the component (A) to the component (A) (component (A): silane coupling agent having an acid anhydride structure in the molecule ], preferably 100: 0.1 to 100: 30. more preferably 100: 0.3-100: 20. more preferably 100: 0.5-100: 15. more preferably 100: 1-100: 10.

a cured product of the curable composition containing the component (a) and the silane coupling agent having an acid anhydride structure in the molecule at such a ratio is more excellent in adhesiveness.

[ curable composition ]

The curable composition of the present invention preferably contains 50 to 100% by mass, more preferably 70 to 100% by mass of the total amount of the component (a) and the component (C) in the solid content of the curable composition.

In the present invention, the "solid component" means a component other than the solvent in the curable composition.

The curable composition of the present invention may contain, as the component (B), fine particles having an average primary particle diameter of 5nm or more and 40nm or less (hereinafter, sometimes referred to as "fine particles (B)").

The curable composition containing the fine particles (B) is excellent in workability in the coating step.

From the viewpoint of more easily obtaining this effect, the average primary particle diameter of the fine particles (B) is preferably 5 to 30nm, more preferably 5 to 20 nm.

The average primary particle diameter of the fine particles (B) can be determined by observing the shape of the fine particles using a transmission electron microscope.

Examples of the material of the fine particles (B) include: a metal; a metal oxide; minerals; metal carbonates such as calcium carbonate and magnesium carbonate; metal sulfates such as calcium sulfate and barium sulfate; metal hydroxides such as aluminum hydroxide; metal silicates such as aluminum silicate, calcium silicate, and magnesium silicate; inorganic components such as silica; an organosilicon; organic components such as acrylic polymers.

In addition, the particles (B) used may be particles whose surfaces have been modified.

The fine particles (B) may be used alone in 1 kind or in combination of 2 or more kinds.

When the curable composition of the present invention contains fine particles (B) [ (B) component ], the content of the (B) component is not particularly limited, and the amount thereof is the following amount: the amount of the component (a) to the component (B) is calculated based on the mass ratio of the component (a) to the component (B) [ (component (a): (B) component ], preferably 100: 0.1 to 100: 90. more preferably 100: 0.2-100: 60. more preferably 100: 0.3-100: 50. more preferably 100: 0.5-100: 40. more preferably 100: 0.8-100: 30. by using the component (B) in the above range, the effect of adding the component (B) can be more exhibited.

The curable composition of the present invention may contain other components within a range not interfering with the object of the present invention.

Examples of other components include: antioxidants, ultraviolet absorbers, light stabilizers, and the like.

The antioxidant is added to prevent oxidative deterioration during heating. Examples of the antioxidant include: phosphorus antioxidants, phenol antioxidants, sulfur antioxidants, and the like.

Examples of the phosphorus-based antioxidant include: phosphites, oxaphosphaphenanthrene oxides, and the like. Examples of the phenolic antioxidant include: monophenols, bisphenols, polymeric phenols and the like. Examples of the sulfur-based antioxidant include: dilauryl 3,3 ' -thiodipropionate, dimyristyl 3,3 ' -thiodipropionate, distearyl 3,3 ' -thiodipropionate, and the like.

These antioxidants may be used alone in 1 kind, or in combination of 2 or more kinds. The content of the antioxidant is not particularly limited, and is usually 10% by mass or less relative to the component (a).

The ultraviolet absorber is added for the purpose of improving the light resistance of the resulting cured product.

Examples of the ultraviolet absorber include: salicylic acids, benzophenones, benzotriazoles, hindered amines, and the like.

The ultraviolet absorber may be used alone in 1 kind, or in combination of 2 or more kinds. The content of the ultraviolet absorber is not particularly limited, and is usually 10% by mass or less relative to the component (a).

The light stabilizer is added for the purpose of improving the light resistance of the resulting cured product.

Examples of the light stabilizer include: and hindered amines such as poly [ {6- (1,1,3,3, -tetramethylbutyl) amino-1, 3, 5-triazine-2, 4-diyl } { (2,2,6, 6-tetramethyl-4-piperidine) imino } hexamethylene { (2,2,6, 6-tetramethyl-4-piperidine) imino } ].

These light stabilizers may be used alone in 1 kind, or in combination of 2 or more kinds. The content of the light stabilizer is usually 20% by mass or less based on the component (A).

The curable composition of the present invention may contain a diluent. The diluent is not particularly limited as long as it can dissolve or disperse the components of the curable composition of the present invention. The number of the diluents may be 1, or 2 or more.

When the curable composition of the present invention contains a diluent, the content thereof is the following amount: the solid content concentration is preferably 60 mass% or more and less than 100 mass%, more preferably 65 to 98 mass%, and still more preferably 70 to 95 mass%.

The polysilsesquioxane compound (a) used in the present invention tends to have a relatively small molecular weight. The curable composition containing the polysilsesquioxane compound (a) has good coatability even when a large amount of a diluent is contained (that is, even when the solid content concentration is high).

When a curable composition having a high solid content concentration is used, even if the drying conditions or curing conditions of the coating film are not strictly controlled, the cured product contains almost no solvent, and thus a cured product having certain characteristics can be stably formed.

The curable composition of the present invention contains the polysilsesquioxane compound (a), and therefore has a high refractive index.

The refractive index (nD) of the curable composition of the present invention at 25 ℃ is usually 1.500 or more, preferably 1.500 to 1.600, more preferably 1.505 to 1.590, and still more preferably 1.510 to 1.580.

The refractive index (nD) of the curable composition can be measured by the method described in examples.

The curable composition of the present invention can be prepared, for example, by mixing the above-mentioned component (a) and component (B) and, if necessary, components other than these at a predetermined ratio and defoaming them.

The mixing method and the defoaming method are not particularly limited, and known methods can be used.

2) Cured product

The cured product of the present invention is obtained by curing the curable composition of the present invention.

Examples of the method for curing the curable composition of the present invention include: and (4) heating and curing. The heating temperature during curing is usually 100 to 200 ℃, and the heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours.

The cured product of the present invention is a cured product having excellent heat resistance and adhesiveness.

The cured product of the present invention has these properties, and can be confirmed, for example, as follows. That is, a predetermined amount of the curable composition of the present invention is applied to the mirror surface of a silicon chip, and the applied surface is placed on an adherend and subjected to pressure bonding and heat treatment to be cured. The sample was allowed to stand on a measuring table of a bond tester (bond tester) previously heated to a predetermined temperature (e.g., 23 ℃ C., 100 ℃ C.) for 30 seconds from 50 ℃ to the adherendμThe adhesive surface was stressed in the horizontal direction (shear direction) at the position of m height, and the adhesion between the test piece and the adherend was measured.

The adhesion of the cured product of the present invention is preferably 100N/4mm at 23 ℃²Above, more preferably 120N/4mm²The above.

The adhesion of the cured product of the present invention is preferably 40N/4mm at 100 ℃²Above, more preferably 45N/4mm²The above.

In this specification, "4 mm²"means" 2mm square ", that is, 2mm × 2mm (square with 2mm on one side).

The cured product of the present invention has a high refractive index and excellent adhesiveness. Therefore, the cured product of the present invention is preferably used as an adhesive layer or the like having a high refractive index.

The refractive index (nD) of the cured product of the present invention at 25 ℃ is usually 1.500 or more, preferably 1.500 to 1.600, more preferably 1.505 to 1.590, and still more preferably 1.510 to 1.580.

The refractive index (nD) of the cured product was measured using an Abbe refractometer.

The cured product of the present invention is preferably used as an optical element-fixing material because of the above-described properties.

3) Method for using curable composition

The method of the present invention is a method of using the curable composition of the present invention as an adhesive for an optical element-fixing material or a sealing material for an optical element-fixing material.

Examples of the optical element include: light emitting elements such as LEDs and LDs, light receiving elements, composite optical elements, and optical integrated circuits.

< adhesive for optical element fixing Material >

The curable composition of the present invention can be suitably used as an adhesive for an optical element-fixing material.

Examples of the method for using the curable composition of the present invention as an adhesive for optical element-fixing materials include: a method of applying the composition to one or both bonding surfaces of materials to be bonded (optical elements, substrates thereof, and the like), pressing the materials, and then heating and curing the materials to be bonded to strongly bond the materials to be bonded to each other. The amount of the curable composition of the present invention to be applied is not particularly limited, and may be an amount that can strongly bond materials to be bonded to each other by curing. The thickness of the coating film of the curable composition is usually 0.5 to 5μm is preferably 1 to 3μThe amount of m.

Examples of the substrate material for bonding the optical element include: glasses such as soda-lime glass and heat-resistant hard glass; a ceramic; sapphire; metals such as iron, copper, aluminum, gold, silver, platinum, chromium, titanium, and alloys of these metals, stainless steel (SUS302, SUS 304L, SUS309, etc.); and synthetic resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, ethylene-vinyl acetate copolymers, polystyrene, polycarbonate, polymethylpentene, polysulfone, polyetheretherketone, polyethersulfone, polyphenylene sulfide, polyetherimide, polyimide, polyamide, acrylic resins, norbornene resins, cycloolefin resins, and glass epoxy resins.

The heating temperature during the heat curing is generally 100 to 200 ℃ although it depends on the curable composition used, etc. The heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours.

Sealing material for optical element fixing material

The curable composition of the present invention can be suitably used as a sealing material for an optical element-fixing material.

Examples of the method for using the curable composition of the present invention as a sealing material for an optical element-fixing material include: and a method for producing an optical element sealing body by molding the composition into a desired shape to obtain a molded body enclosing an optical element and then heating and curing the molded body.

The method for molding the curable composition of the present invention into a desired shape is not particularly limited, and a known molding method such as a general transfer molding method or a casting method can be used.

The obtained optical element sealing body is excellent in heat resistance and adhesiveness because the curable composition of the present invention is used.

Examples

The present invention will be described in more detail below with reference to examples. However, the present invention is not limited to the following examples.

(average molecular weight measurement)

The mass average molecular weight (Mw) and the number average molecular weight (Mn) of the polysilsesquioxane compound were measured as standard polystyrene conversion values under the following apparatus and conditions.

Device name: HLC-8220GPC, manufactured by Tosoh corporation;

column: a column obtained by connecting TSKgelGMHXL, TSKgelGMHXL and TSKgel2000HXL in this order;

solvent: tetrahydrofuran;

injection amount: 20μl；

Measuring temperature: 40 ℃;

flow rate: 0.6 ml/min;

a detector: a differential refractometer.

(²⁹Si-NMR measurement)

In order to investigate the repeating units and the amounts thereof of the polysilsesquioxane compound, the following conditions were carried out²⁹Si-NMR measurement.

The device comprises the following steps: AV-500 manufactured by Bruker Biospin;

²⁹Si-NMR resonance frequency: 99.352 MHz;

and (3) probe: 5mmφA solution probe;

measuring temperature: room temperature (25 ℃);

sample rotation speed: 20 kHz;

the determination method comprises the following steps: an inverse gated decoupling method;

²⁹the flip angle of Si: 90 degrees;

²⁹si 90 ° pulse width: 8.0μs；

Repetition time: 5 s;

cumulative number of times: 9200 times;

observation width: 30 kHz.

(²⁹Method for producing Si-NMR sample

In order to shorten the relaxing time, Fe (acac) was added as a relaxing agent₃And (4) carrying out measurement.

Polysilsesquioxane compound concentration: 15 mass%;

Fe(acac)₃concentration: 0.6 mass%;

and (3) determination of a solvent: acetone;

internal standard: TMS.

For each peak of the spectrum after fourier transform, a chemical shift was obtained from the position of the peak top, and the integration of each peak was performed in the following range. From the obtained values, the ratios of the T1 site, the T2 site and the T3 site were calculated.

Has a T site of phenyl (T1: -65 to-58 ppm, T2: 74 to-65 ppm, T3: 82 to-75 ppm);

has a methyl group T site (T1: -50 to-46 ppm, T2: -61 to-52 ppm, T3: -70 to-61 ppm).

(refractive index)

The refractive index (nD) of the polysilsesquioxane compound was measured at 25 ℃ using a multi-wavelength Abbe refractometer (DR-M2, manufactured by ATAGO, K.K.).

Production example 1

28.91g (145.8mmol) of phenyltrimethoxysilane was charged in a 300ml eggplant-shaped flask, and 0.0376g of an aqueous solution prepared by dissolving 35 mass% hydrochloric acid (0.25 mol% HCl based on phenyltrimethoxysilane) in 7.874g of distilled water was added while stirring, and the whole content (total volume) was stirred at 30 ℃ for 2 hours, then heated to 70 ℃ and stirred for 5 hours.

After the reaction solution was allowed to cool to room temperature, 50g of propyl acetate and 100g of water were added thereto to carry out a liquid separation treatment, thereby obtaining an organic layer containing a reaction product. Magnesium sulfate was added to the organic layer to carry out drying treatment. After magnesium sulfate was removed by filtration, the organic layer was concentrated by an evaporator, and then the resulting concentrate was dried in vacuo to obtain a polysilsesquioxane compound (a 1).

Production example 2

In production example 1, hydrochloric acid was added to phenyltrimethoxysilane, and the whole was stirred at 30 ℃ for 2 hours. Thereafter, a polysilsesquioxane compound (a2) was obtained in the same manner as in production example 1, except that the process of raising the temperature to 70 ℃ and stirring for 5 hours was not performed.

(production example 3)

A300 ml eggplant-shaped flask was charged with 28.77g (145.1mmol) of phenyltrimethoxysilane and 0.2675g (1.5mmol) of methyltriethoxysilane, and an aqueous solution prepared by dissolving 0.477g of 35 mass% hydrochloric acid (HCl 3 mol% based on the total amount of silane compounds) in 8.24g of distilled water was added thereto while stirring, and the whole was stirred at 30 ℃ for 2 hours, then heated to 80 ℃ and stirred for 20 hours.

The reaction solution was allowed to cool to room temperature, and then subjected to liquid separation, drying treatment, and the like in the same manner as in production example 1, thereby obtaining a polysilsesquioxane compound (a 3).

Production example 4

A300 ml round bottom flask was charged with 28.10g (141.7mmol) of phenyltrimethoxysilane and 1.337g (7.5mmol) of methyltriethoxysilane, and an aqueous solution prepared by dissolving 0.466g of 35 mass% hydrochloric acid (HCl 3 mol% based on the total amount of silane compounds) in 8.05g of distilled water was added thereto with stirring, and the whole was stirred at 30 ℃ for 2 hours, then heated to 80 ℃ and stirred for 20 hours.

The reaction solution was allowed to cool to room temperature, and then subjected to liquid separation, drying treatment, and the like in the same manner as in production example 1, thereby obtaining a polysilsesquioxane compound (a 4).

Production example 5

A300 ml eggplant-shaped flask was charged with 13.62g (68.7mmol) of phenyltrimethoxysilane and 1.36g (6.3mmol) of methyltriethoxysilane, and an aqueous solution prepared by dissolving 0.02g of 35 mass% hydrochloric acid (0.25 mol% HCl based on the total amount of silane compounds) in 4.12g of distilled water was added thereto with stirring, and the whole was stirred at 30 ℃ for 2 hours, then heated to 80 ℃ and stirred for 20 hours.

The reaction solution was allowed to cool to room temperature, and then subjected to liquid separation, drying treatment, and the like in the same manner as in production example 1, thereby obtaining a polysilsesquioxane compound (a 5).

Comparative production example 1

14.455g (72.9mmol) of phenyltrimethoxysilane was charged in a 300ml eggplant-shaped flask, and an aqueous solution prepared by dissolving 0.0188g of 35 mass% hydrochloric acid (0.25 mol% HCl based on phenyltrimethoxysilane) in 3.937g of distilled water was added thereto with stirring, and the whole was stirred at 30 ℃ for 2 hours, then heated to 70 ℃ and stirred for 22 hours.

While the contents were further stirred, 15g of propyl acetate and 0.0109g of 28 mass% aqueous ammonia (0.25 mol% relative to phenyltriethoxysilane) were added thereto, and the mixture was heated to 80 ℃ and stirred for 20 hours.

The reaction solution was allowed to cool to room temperature, and then subjected to liquid separation, drying treatment, and the like in the same manner as in production example 1, thereby obtaining a polysilsesquioxane compound (a 6).

(reference production example 1)

A300 ml eggplant-shaped flask was charged with 9.34g (47.1mmol) of phenyltrimethoxysilane and 8.40g (47.1mmol) of methyltriethoxysilane, and an aqueous solution prepared by dissolving 0.025g of 35 mass% hydrochloric acid (0.25 mol% HCl based on the total amount of silane compounds) in 5.09g of distilled water was added thereto with stirring, and the whole was stirred at 30 ℃ for 2 hours, then heated to 80 ℃ and stirred for 20 hours.

The reaction solution was allowed to cool to room temperature, and then subjected to liquid separation, drying treatment, and the like in the same manner as in production example 1, thereby obtaining a polysilsesquioxane compound (a 7).

(reference production example 2)

After 12.55g (63.3mmol) of phenyltrimethoxysilane and 4.83g (27.1mmol) of methyltriethoxysilane were charged in a 300ml eggplant-shaped flask, an aqueous solution prepared by dissolving 0.024g 35 mass% hydrochloric acid (0.25 mol% HCl based on the total amount of silane compounds) in 4.88g of distilled water was added thereto with stirring, and the whole was stirred at 30 ℃ for 2 hours, then heated to 80 ℃ and stirred for 20 hours.

While the contents were further stirred, 17g of propyl acetate and 0.149g of 28 mass% aqueous ammonia (2.5 mol% relative to phenyltriethoxysilane) were added thereto, and the mixture was heated to 80 ℃ and stirred for 20 hours.

The reaction solution was allowed to cool to room temperature, and then subjected to liquid separation, drying treatment, and the like in the same manner as in production example 1, thereby obtaining a polysilsesquioxane compound (A8).

Details of the obtained polysilsesquioxane compound (PSQ) are shown in table 1.

[ Table 1]

The compounds used in examples, comparative examples and reference examples are shown below.

(silane coupling agent)

Silane coupling agent (C1): 1,3, 5-N-tris [3- (trimethoxysilyl) propyl ] isocyanurate;

silane coupling agent (C2): 3- (trimethoxysilyl) propylsuccinic anhydride.

(Filler)

Silica fine particles: (product name "AEROSIL RX 300", manufactured by Japan Aerosil corporation, average primary particle diameter: 7nm, specific surface area: 210m²/g)。

(example 1)

To 100 parts by mass of the polysilsesquioxane compound (a1), 5 parts by mass of silica fine particles were added, and diethylene glycol monobutyl ether acetate: tripropylene glycol n-butyl ether 40: 60 (mass ratio), and stirring the whole. After dispersion treatment by a three-roll mill, 30 parts by mass of a silane coupling agent (C1) and 3 parts by mass of a silane coupling agent (C2) were added, and the whole was sufficiently mixed and defoamed to obtain a curable composition having a solid content concentration of 80 mass%.

(example 2)

A curable composition having a solid content of 80 mass% was obtained in the same manner as in example 1, except that the content of the silica fine particles in example 1 was changed to 20 parts by mass and the amount of the mixed solvent was changed.

(example 3)

A curable composition having a solid content concentration of 90 mass% was obtained in the same manner as in example 1, except that the polysilsesquioxane compound (a2) was used in place of the polysilsesquioxane compound (a1) in example 1 and the amount of the mixed solvent was changed.

(example 4)

A curable composition having a solid content of 90 mass% was obtained in the same manner as in example 3, except that the content of the silica fine particles in example 3 was changed to 0 mass part and the amount of the mixed solvent was changed.

(example 5)

A curable composition having a solid content concentration of 82 mass% was obtained in the same manner as in example 1, except that the polysilsesquioxane compound (A3) was used in place of the polysilsesquioxane compound (a1) in example 1 and the amount of the mixed solvent was changed.

(example 6)

A curable composition having a solid content concentration of 82 mass% was obtained in the same manner as in example 1, except that the polysilsesquioxane compound (a4) was used in place of the polysilsesquioxane compound (a1) in example 1 and the amount of the mixed solvent was changed.

(example 7)

A curable composition having a solid content concentration of 80 mass% was obtained in the same manner as in example 1, except that the polysilsesquioxane compound (a5) was used in place of the polysilsesquioxane compound (a1) in example 1 and the amount of the mixed solvent was changed.

Comparative example 1

A curable composition having a solid content of 80 mass% was obtained in the same manner as in example 1, except that the polysilsesquioxane compound (a6) was used in place of the polysilsesquioxane compound (a1), the content of the fine silica particles was changed to 20 parts by mass, and the amount of the mixed solvent was changed.

Comparative example 2

A curable composition having a solid content concentration of 90 mass% was obtained in the same manner as in example 5, except that the silane coupling agent (C1) and the silane coupling agent (C2) were not used in example 5.

(reference example 1)

A curable composition having a solid content concentration of 80 mass% was obtained in the same manner as in example 1, except that the polysilsesquioxane compound (a7) was used in place of the polysilsesquioxane compound (a1) in example 1.

(reference example 2)

A curable composition having a solid content of 80 mass% was obtained in the same manner as in example 1, except that the polysilsesquioxane compound (A8) was used in place of the polysilsesquioxane compound (a1), the content of the fine silica particles was changed to 20 parts by mass, and the amount of the mixed solvent was changed.

The curable compositions obtained in examples, comparative examples and reference examples were used to carry out the following measurements and tests, respectively.

[ measurement of refractive index ]

The refractive index (nD) of the curable composition was measured at 25 ℃ using a multi-wavelength Abbe refractometer (DR-M2, manufactured by ATAGO Co., Ltd.).

[ evaluation of crack resistance ]

The curable compositions obtained in examples and comparative examples were applied to mirror surfaces of square glass chips having a length of 0.5mm on one side to a thickness of about 2μm, the coated surface was placed on an adherend (silver-plated copper plate) and press-bonded. Thereafter, the resultant was heat-treated at 170 ℃ for 2 hours to cure it, thereby obtaining an adherend with a test piece. In addition, 20 adherends with test pieces were prepared for 1 curable composition. The resin portion (rounded portion) protruding from the glass chip was observed using a scanning electron microscope (VE-9800S, manufactured by Keyence corporation), the number of samples having cracks was counted, and the crack incidence rate was evaluated as "a" when the sample had a crack incidence rate of 0% or more and less than 25%, as "B" when the sample had a crack incidence rate of 25% or more and less than 50%, and as "C" when the sample had a crack incidence rate of 50% or more and less than 100%.

[ evaluation of adhesive Strength ]

A square having a length of 2mm on one side (area of 4 mm)²) The curable compositions obtained in examples and comparative examples were applied to the mirror surface of the silicon chip of (1) to a thickness of about 2μm, the coated surface was placed on an adherend (silver-plated copper plate) and press-bonded. Thereafter, the resultant was heat-treated at 170 ℃ for 2 hours to cure it, thereby obtaining an adherend with a test piece. The adherend with the test piece was left on a measuring table of an adhesion tester (series 4000, manufactured by Dage corporation) heated to a predetermined temperature (23 ℃ C., 100 ℃ C.) in advance for 30 seconds from 50 ℃ to the adherendμm height position at speed 200μm/s stress was applied to the adhesive surface in the horizontal direction (shear direction), and the adhesion between the test piece and the adherend (N/4 mm) at 23 ℃ and 100 ℃ was measured²)。

The measurement results and evaluation results are shown in table 2.

[ Table 2]

The following can be understood from the above examples, comparative examples and reference examples.

The curable compositions of examples 1 to 7 have a high refractive index because they contain the polysilsesquioxane compound having a high content of the repeating unit (1).

Similarly, the curable composition of comparative example 1 has a high refractive index because it contains the polysilsesquioxane compound having a high content of the repeating unit (1).

However, the polysilsesquioxane compound (a6) used in comparative example 1 had a low proportion of T2 sites, and therefore the cured product of the curable composition of comparative example 1 had poor crack resistance.

Further, since the curable compositions of examples 1 to 7 contain a silane coupling agent, even when they contain a polysilsesquioxane compound having a high content of the repeating unit (1), the cured products thereof have sufficient adhesive strength.

On the other hand, the curable composition obtained in comparative example 2 does not contain a silane coupling agent, and therefore the cured product thereof does not have sufficient adhesive strength.

It can be seen from a comparison of the results of reference examples 1 and 2 that the refractive index of the curable composition decreases when the proportion of the repeating unit (1) is low, but from the results of examples 1 to 7 and reference example 1, it is considered that: the refractive index is sufficiently high if the amount of the repeating unit (1) is in the range of 80 to 100 mol% relative to the total amount of the repeating unit (1) and the repeating unit (2).

Claims

1. A curable composition comprising the following components (A) and (C),

[ chemical formula 1]

R¹Represents an unsubstituted aryl group having 6 to 12 carbon atoms or a substituted aryl group havingA substituted aryl group having 6 to 12 carbon atoms,

[ chemical formula 2]

[ element 1]

[ element 2]

[ chemical formula 3]

(C) the components: a silane coupling agent.

2. The curable composition according to claim 1, wherein the component (A) has a mass average molecular weight (Mw) of 500 to 3,000.

3. The curable composition according to claim 1 or 2, wherein the total amount of the repeating unit (1) and the repeating unit (2) in the component (A) is 90 to 100 mol% based on the total repeating units of the component (A).

4. The curable composition according to any one of claims 1 to 3, wherein the content of the component (C) is 0.1 to 70 parts by mass based on 100 parts by mass of the component (A).

5. The curable composition according to any one of claims 1 to 4, wherein the total amount of the component (A) and the component (C) is 50 to 100% by mass in the solid content of the curable composition.

6. The curable composition according to any one of claims 1 to 5, further comprising a diluent, wherein the solid content concentration is 60% by mass or more and less than 100% by mass.

7. The curable composition according to any one of claims 1 to 6, wherein the refractive index (nD) at 25 ℃ is 1.500 to 1.600.

8. A cured product obtained by curing the curable composition according to any one of claims 1 to 7.

9. The cured product according to claim 8, which is an optical element-fixing material.

10. A method for using the curable composition according to any one of claims 1 to 7 as an adhesive for an optical element-fixing material.

11. A method for using the curable composition according to any one of claims 1 to 7 as a sealing material for an optical device-fixing material.