TW201518841A - Camera assembly and electronic device - Google Patents

Camera assembly and electronic device Download PDF

Info

Publication number
TW201518841A
TW201518841A TW102140902A TW102140902A TW201518841A TW 201518841 A TW201518841 A TW 201518841A TW 102140902 A TW102140902 A TW 102140902A TW 102140902 A TW102140902 A TW 102140902A TW 201518841 A TW201518841 A TW 201518841A
Authority
TW
Taiwan
Prior art keywords
camera
electronic device
gap
camera module
camera assembly
Prior art date
Application number
TW102140902A
Other languages
Chinese (zh)
Other versions
TWI490624B (en
Inventor
I-Cheng Chuang
Hung-Wen Lin
Original Assignee
Htc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Htc Corp filed Critical Htc Corp
Publication of TW201518841A publication Critical patent/TW201518841A/en
Application granted granted Critical
Publication of TWI490624B publication Critical patent/TWI490624B/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/51Housings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

A camera assembly including at least one holder, at least one camera module and a buffering material is provided. The holder has at least one accommodating recess. The camera module is disposed in the accommodating recess, and a gap is between the camera module and the side wall of the accommodating recess. The buffering material is filled into the gap for positioning the camera module in the accommodating recess of the holder. An electronic device including a casing and an aforementioned camera assembly is also provided.

Description

相機總成與電子裝置 Camera assembly and electronic device

本發明是有關於一種相機總成,且特別是有關一種相機總成與應用此相機總成的電子裝置。 The present invention relates to a camera assembly, and more particularly to a camera assembly and an electronic device to which the camera assembly is applied.

近年來,隨著科技產業日益發達,可攜式(portable)電子裝置,例如智慧型手機(smart phone)、平板電腦(tablet computer)或筆記型電腦(notebook computer)等產品,已頻繁地出現在日常生活中。可攜式電子裝置的型態與使用功能越來越多元,便利性與實用性讓這些可攜式電子裝置更為普及,可針對不同用途使用。 In recent years, as the technology industry has become more developed, portable electronic devices, such as smart phones, tablet computers, or notebook computers, have frequently appeared in In everyday life. The types and functions of portable electronic devices are increasingly diverse, and the convenience and practicality make these portable electronic devices more popular and can be used for different purposes.

除了可攜式電子裝置本身具有的功能之外,可攜式電子裝置通常還會搭配額外的功能組件,以使電子裝置具備額外的使用功能。舉例而言,可攜式電子裝置可以配置相機模組,以藉由相機模組內的感光元件來擷取影像。當上述的可攜式電子裝置配置相機模組時,相機模組之鏡頭的光軸可能會因可攜式電子裝置的掉落、碰撞或受到其他外力影響而產生偏移,進而影響相機模組的成像效果。 In addition to the functions of the portable electronic device itself, the portable electronic device usually has additional functional components to provide additional functions for the electronic device. For example, the portable electronic device can be configured with a camera module to capture images by the photosensitive elements in the camera module. When the portable electronic device is configured with the camera module, the optical axis of the lens of the camera module may be offset due to the falling, collision or other external force of the portable electronic device, thereby affecting the camera module. Imaging effect.

本發明提供一種相機總成,具有良好的操作穩定度。 The invention provides a camera assembly with good operational stability.

本發明提供一種電子裝置,具有良好的操作穩定度。 The invention provides an electronic device with good operational stability.

本發明的相機總成包括至少一固定架(holder)、至少一相機模組以及一緩衝材料。固定架具有至少一容置槽。相機模組配置於容置槽內,且相機模組與容置槽的側壁之間具有一間隙。緩衝材料填充於間隙,以將相機模組定位在固定架的容置槽內。 The camera assembly of the present invention includes at least one holder, at least one camera module, and a cushioning material. The holder has at least one receiving groove. The camera module is disposed in the receiving slot, and a gap is formed between the camera module and the sidewall of the receiving slot. The cushioning material is filled in the gap to position the camera module in the receiving groove of the fixing frame.

本發明的電子裝置包括一機殼以及一相機總成。相機總成配置於機殼內,並暴露於機殼上的至少一開孔。相機總成包括至少一固定架、至少一相機模組以及一緩衝材料。固定架具有至少一容置槽。相機模組配置於容置槽內,且相機模組與容置槽的側壁之間具有一間隙。緩衝材料填充於間隙,以將相機模組定位在固定架的容置槽內。 The electronic device of the present invention includes a housing and a camera assembly. The camera assembly is disposed in the casing and exposed to at least one opening in the casing. The camera assembly includes at least one mount, at least one camera module, and a cushioning material. The holder has at least one receiving groove. The camera module is disposed in the receiving slot, and a gap is formed between the camera module and the sidewall of the receiving slot. The cushioning material is filled in the gap to position the camera module in the receiving groove of the fixing frame.

在本發明的一實施例中,上述緩衝材料的楊氏係數(Young’s modulus)低於固定架的楊氏係數。 In an embodiment of the invention, the Young's modulus of the buffer material is lower than the Young's modulus of the holder.

在本發明的一實施例中,上述的相機模組與容置槽的側壁的內表面之間的最小距離為0.8毫米(millimeter,mm)。 In an embodiment of the invention, the minimum distance between the camera module and the inner surface of the side wall of the receiving groove is 0.8 millimeters (mm).

在本發明的一實施例中,上述的相機模組的數量為兩個。兩相機模組以同一軸線為中心線而左右對稱。 In an embodiment of the invention, the number of the camera modules is two. The two camera modules are bilaterally symmetrical with the same axis as the center line.

在本發明的一實施例中,上述的軸線平行於機殼的一長邊。 In an embodiment of the invention, the axis is parallel to a long side of the casing.

在本發明的一實施例中,上述的容置槽的數量為兩個。 兩相機模組分別配置於兩容置槽內,且各相機模組與對應的容置槽的側壁之間分別具有間隙。緩衝材料填充於間隙。 In an embodiment of the invention, the number of the receiving slots is two. The two camera modules are respectively disposed in the two receiving slots, and each camera module has a gap between the sidewalls of the corresponding receiving slots. The cushioning material is filled in the gap.

在本發明的一實施例中,上述的固定架的數量為兩個。兩相機模組分別配置於對應的固定架的容置槽內,且各相機模組與對應的容置槽的側壁之間分別具有間隙。緩衝材料填充於間隙。 In an embodiment of the invention, the number of the aforementioned fixing brackets is two. The two camera modules are respectively disposed in the receiving slots of the corresponding mounting brackets, and each camera module has a gap between the sidewalls of the corresponding receiving slots. The cushioning material is filled in the gap.

在本發明的一實施例中,上述的兩相機模組具有不同的像素。 In an embodiment of the invention, the two camera modules have different pixels.

在本發明的一實施例中,上述的相機總成更包括一軟性電路板,連接相機模組,且容置槽的側壁具有一開口。軟性電路板經由開口延伸至固定架外。 In an embodiment of the invention, the camera assembly further includes a flexible circuit board connected to the camera module, and the side wall of the receiving slot has an opening. The flexible circuit board extends through the opening to the outside of the holder.

基於上述,本發明的相機總成將相機模組配置於固定架的容置槽內,且在相機模組與容置槽的側壁之間的間隙填充緩衝材料。據此,藉由以緩衝材料填充間隙,可以減緩相機模組因電子裝置的掉落、碰撞或受到其他外力影響而使相機模組的鏡頭的光軸產生偏移的情況。 Based on the above, the camera assembly of the present invention disposes the camera module in the receiving groove of the fixing frame, and fills the buffer material between the gap between the camera module and the side wall of the receiving groove. Accordingly, by filling the gap with the buffer material, it is possible to alleviate the shift of the optical axis of the lens of the camera module due to falling, collision, or other external force of the electronic device.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

50、50a、50b‧‧‧電子裝置 50, 50a, 50b‧‧‧ electronic devices

52‧‧‧機殼 52‧‧‧Shell

52a、52b‧‧‧開孔 52a, 52b‧‧‧ openings

100、100a、100b‧‧‧相機總成 100, 100a, 100b‧‧‧ camera assembly

110、110a‧‧‧固定架 110, 110a‧‧‧ fixed frame

112‧‧‧容置槽 112‧‧‧ accommodating slots

112a‧‧‧側壁 112a‧‧‧ Sidewall

112b‧‧‧開口 112b‧‧‧ openings

120、120a、120b‧‧‧相機模組 120, 120a, 120b‧‧‧ camera module

130‧‧‧緩衝材料 130‧‧‧ cushioning material

140、140a、140b‧‧‧軟性電路板 140, 140a, 140b‧‧‧ flexible circuit board

A‧‧‧軸線 A‧‧‧ axis

d‧‧‧距離 D‧‧‧distance

g‧‧‧間隙 G‧‧‧ gap

L‧‧‧長邊 L‧‧‧Longside

圖1是本發明一實施例的相機總成的示意圖。 1 is a schematic diagram of a camera assembly in accordance with an embodiment of the present invention.

圖2是本發明另一實施例的相機總成的示意圖。 2 is a schematic diagram of a camera assembly in accordance with another embodiment of the present invention.

圖3是本發明又一實施例的相機總成的示意圖。 3 is a schematic diagram of a camera assembly in accordance with still another embodiment of the present invention.

圖4是本發明一實施例的電子裝置的示意圖。 4 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention.

圖5是圖4的電子裝置的後視圖。 FIG. 5 is a rear elevational view of the electronic device of FIG. 4. FIG.

圖6與圖7是本發明其他實施例的電子裝置的後視圖。 6 and 7 are rear views of an electronic device according to another embodiment of the present invention.

圖1是本發明一實施例的相機總成的示意圖。請參考圖1,在本實施例中,相機總成100包括固定架110、相機模組120以及緩衝材料130。固定架110具有容置槽112。相機模組120配置於容置槽112內,且相機模組120與容置槽112的側壁112a之間具有間隙g。緩衝材料130填充於間隙g,以將相機模組120定位在固定架110的容置槽112內。如此,藉由以緩衝材料130填充間隙g,可以減緩相機總成100或後續應用相機總成100的電子裝置50(繪示於圖4)因掉落、碰撞或受到其他外力影響而使得相機模組120之鏡頭的光軸產生偏移的情況。 1 is a schematic diagram of a camera assembly in accordance with an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the camera assembly 100 includes a mounting bracket 110 , a camera module 120 , and a cushioning material 130 . The holder 110 has a receiving groove 112. The camera module 120 is disposed in the accommodating groove 112 , and has a gap g between the camera module 120 and the sidewall 112 a of the accommodating groove 112 . The cushioning material 130 is filled in the gap g to position the camera module 120 in the receiving groove 112 of the fixing frame 110. Thus, by filling the gap g with the cushioning material 130, the camera assembly 100 can be slowed down or the electronic device 50 (shown in FIG. 4) of the subsequent application camera assembly 100 can be caused by falling, collision or other external force. The optical axis of the lens of group 120 is offset.

具體而言,在本實施例中,緩衝材料130的楊氏係數(Young’s modulus)低於固定架110的楊氏係數。換言之,固定架110的材料可選用具有較大的楊氏係數的材料。固定架110的材料例如是金屬(metal)、陶瓷(ceramic)或塑膠(plastic),其中金屬材料可選用不鏽鋼(stainless steel)、鋁合金(aluminum alloy,Al alloy)、銅合金(copper alloy,Cu alloy)、鋯合金(zirconium alloy,Zr alloy)、鈦合金(titanium alloy,Ti alloy)、鋅合金(zinc alloy,Zn alloy)、鎂合金(magnesium alloy,Mg alloy)或鋰合金(lithium alloy,Li alloy)。陶瓷材料可以是氧化鋁(aluminum oxide)、氮化鋁(aluminum nitride)、氧化矽(silicon oxide)、氮化矽(silicon nitride)、氧化鋯(zirconium oxide)、氮化硼(boron nitride)或碳化矽(silicon carbide)。更詳細而言,由於固定架110的楊氏係數較高,因此固定架110比較不容易變形。緩衝材料130具有彈性與可撓性,可吸收衝擊能量,例如是樹脂(resin)、矽膠(silicon rubber)、聚醯胺(polyamide,PA)、聚胺酯(polyurethane,PU)、聚丙烯(poly propylene,PP)或橡膠(rubber)。如此,緩衝材料130具有制震與吸震等功能,可減緩衝擊。即使相機總成100或電子裝置50(繪示於圖4)因掉落、碰撞或受到其他外力影響,相機模組120之鏡頭的光軸產生偏移的情況也能減緩。本發明並不限制固定架110與緩衝材料130的材料,其可依據需求選擇適當材料。 Specifically, in the present embodiment, the Young's modulus of the cushioning material 130 is lower than the Young's modulus of the holder 110. In other words, the material of the holder 110 can be selected from materials having a large Young's modulus. The material of the fixing frame 110 is, for example, metal, ceramic or plastic, wherein the metal material may be stainless steel, aluminum alloy, aluminum alloy or copper alloy. Alloy), zirconium alloy (Zr alloy), titanium alloy (Ti alloy), zinc alloy (zinc) Alloy, Zn alloy), magnesium alloy (Mg alloy) or lithium alloy (Li alloy). The ceramic material may be aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, zirconium oxide, boron nitride or carbonization. Silicon carbide. In more detail, since the Young's modulus of the mount 110 is high, the mount 110 is less likely to be deformed. The cushioning material 130 has elasticity and flexibility and can absorb impact energy, such as resin, silicon rubber, polyamide (PA), polyurethane (PU), polypropylene (polypropylene). PP) or rubber (rubber). Thus, the cushioning material 130 has functions such as shock absorption and shock absorption, and can mitigate the impact. Even if the camera assembly 100 or the electronic device 50 (shown in FIG. 4) is affected by dropping, collision, or other external force, the optical axis of the lens of the camera module 120 may be shifted. The present invention does not limit the material of the holder 110 and the cushioning material 130, and it is possible to select a suitable material according to requirements.

由於高楊氏係數的固定架110搭配低楊氏係數的緩衝材料130,故在相機總成100掉落、碰撞或受到其他外力影響時,固定架110能夠保護相機模組120的完整,而緩衝材料130可減緩相機模組120的鏡頭之光軸產生偏移的情況。較佳地是,相機模組120與容置槽112的所有側壁112a(例如圖1中的容置槽112的四個側壁112a)之間都具有距離,亦即本實施例的相機模組120不接觸容置槽112的側壁112a。如此,在填充緩衝材料130於間隙g之後,可以減緩相機模組120因掉落、碰撞或受到其他外力 影響而使得相機模組120的鏡頭之光軸產生偏移的情況。在本實施例中,相機模組120與容置槽112的側壁112a的內表面之間的最小距離d可以是0.8毫米(millimeter,mm),但本發明並不以此為限制,其可依據需求調整。 Since the high Young's coefficient fixing frame 110 is combined with the low Young's modulus buffer material 130, the fixing frame 110 can protect the integrity of the camera module 120 while the camera assembly 100 is dropped, collided, or subjected to other external forces. The material 130 can slow down the shift of the optical axis of the lens of the camera module 120. Preferably, the camera module 120 has a distance between all the sidewalls 112a of the accommodating slot 112 (for example, the four sidewalls 112a of the accommodating slot 112 in FIG. 1), that is, the camera module 120 of the embodiment. The side wall 112a of the accommodating groove 112 is not contacted. As such, after the buffer material 130 is filled in the gap g, the camera module 120 can be slowed down, collided, or subjected to other external forces. The effect is that the optical axis of the lens of the camera module 120 is shifted. In this embodiment, the minimum distance d between the camera module 120 and the inner surface of the side wall 112a of the accommodating groove 112 may be 0.8 millimeters (mm), but the invention is not limited thereto, and may be based on Demand adjustment.

另一方面,在本實施例中,相機總成100更包括軟性電路板140。軟性電路板140連接相機模組120,且容置槽112的側壁112a具有開口112b。軟性電路板140經由開口112b延伸至固定架110外。換言之,軟性電路板140的一端配置在容置槽112內,而另一端透過容置槽112的側壁112a上的開口112b延伸至固定架110外。然而,在其他實施例中,開口112b也可以位在容置槽112的底部,而使軟性電路板140透過位在底部的開口112b延伸至固定架110外,本發明並不限制開口112b的位置。如此,配置在容置槽112內的相機模組120與軟性電路板140電性連接,並透過軟性電路板140電性連接至電子裝置50(繪示於圖4)的內部機體,其中電子裝置50例如是智慧型手機(smart phone)、平板電腦(tablet computer)或筆記型電腦(notebook computer)。此時,相機總成100可以藉由固定架110固定於電子裝置50中未繪示的內部機架(chassis)上,並藉由軟性電路板140電性連接至電子裝置50中未繪示的機體,以使電子裝置50具有照相功能。 On the other hand, in the present embodiment, the camera assembly 100 further includes a flexible circuit board 140. The flexible circuit board 140 is connected to the camera module 120, and the side wall 112a of the receiving groove 112 has an opening 112b. The flexible circuit board 140 extends outside the holder 110 via the opening 112b. In other words, one end of the flexible circuit board 140 is disposed in the accommodating groove 112, and the other end extends through the opening 112b on the side wall 112a of the accommodating groove 112 to the outside of the fixing frame 110. However, in other embodiments, the opening 112b may also be located at the bottom of the accommodating groove 112, and the flexible circuit board 140 is extended to the outside of the fixing frame 110 through the opening 112b located at the bottom. The present invention does not limit the position of the opening 112b. . The camera module 120 disposed in the accommodating slot 112 is electrically connected to the flexible circuit board 140 and electrically connected to the internal body of the electronic device 50 (shown in FIG. 4 ) through the flexible circuit board 140 , wherein the electronic device 50 is, for example, a smart phone, a tablet computer, or a notebook computer. At this time, the camera assembly 100 can be fixed to the internal chassis (not shown) of the electronic device 50 by the mounting bracket 110, and electrically connected to the electronic device 50 by the flexible circuit board 140. The body is such that the electronic device 50 has a camera function.

圖2是本發明另一實施例的相機總成的示意圖。請參考圖2,在本實施例中,相機總成100a與前述的相機總成100的主要差異在於,相機總成100a的相機模組的數量為兩個,且容置槽 112的數量為兩個。具體而言,在本實施例中,固定架110a具有兩個容置槽112。兩相機模組120a與120b分別配置於兩容置槽112內,且各相機模組120a與120b與對應的容置槽112的側壁112a之間分別具有間隙g。緩衝材料130填充於間隙g。固定架110a與緩衝材料130的材料特性以及固定架110a與相機模組120a與120b之間的位置可參考前述說明,在此不多加贅述。如此,在填充緩衝材料130於間隙g之後,可減緩因掉落、碰撞或受到其他外力影響而使得相機模組120a與120b之鏡頭的光軸產生偏移的情況。此外,本實施例的兩相機模組120a與120b較佳地是以同一軸線A為中心線而左右對稱。再者,本實施例的兩相機模組120a與120b具有不同的像素。舉例而言,相機模組120a的像素可能是1.3M或2.1M,且相機模組120b的外觀尺寸較小。相機模組120b的像素可能是8M、13M或18M,且相機模組120b的外觀尺寸也比較大。如此,當相機總成100a應用於電子裝置50(繪示於圖4)時,相機總成100a可藉由具有不同像素的兩相機模組120a與120b擷取更多的影像資料,以利後續的影像處理以及多樣化的應用。 2 is a schematic diagram of a camera assembly in accordance with another embodiment of the present invention. Referring to FIG. 2, in the present embodiment, the main difference between the camera assembly 100a and the aforementioned camera assembly 100 is that the number of camera modules of the camera assembly 100a is two, and the receiving slot The number of 112 is two. Specifically, in the embodiment, the fixing frame 110a has two receiving grooves 112. The two camera modules 120a and 120b are respectively disposed in the two receiving slots 112, and each of the camera modules 120a and 120b and the sidewall 112a of the corresponding receiving slot 112 have a gap g therebetween. The cushioning material 130 is filled in the gap g. The material characteristics of the holder 110a and the cushioning material 130 and the position between the holder 110a and the camera modules 120a and 120b can be referred to the foregoing description, and will not be further described herein. Thus, after the buffer material 130 is filled in the gap g, the optical axis of the lens of the camera modules 120a and 120b may be shifted due to dropping, collision, or other external force. In addition, the two camera modules 120a and 120b of the present embodiment are preferably bilaterally symmetric with the same axis A as a center line. Furthermore, the two camera modules 120a and 120b of the present embodiment have different pixels. For example, the pixels of the camera module 120a may be 1.3M or 2.1M, and the appearance of the camera module 120b is small. The pixels of the camera module 120b may be 8M, 13M or 18M, and the appearance of the camera module 120b is also relatively large. Thus, when the camera assembly 100a is applied to the electronic device 50 (shown in FIG. 4), the camera assembly 100a can capture more image data by using the two camera modules 120a and 120b having different pixels, so as to facilitate subsequent Image processing and diverse applications.

舉例而言,當相機總成100a應用於電子裝置50時,能以其中一相機模組,例如是相機模組120b,作為主要的相機模組,並以另一相機模組,例如是相機模組120a,作為輔助的相機模組,以提高相機模組120b的對焦速度。此外,由於相機模組120a與相機模組120b配置同一個固定架110a內,因此相機模組120a與 相機模組120b之間的距離能夠保持定值。此外,更配置緩衝材料130以維持相機模組120a與120b之鏡頭的光軸的穩定,因此本實施例的相機總成100a採用兩相機模組120a與120b能夠擷取更多的影像資料,以利後續的影像處理以及多樣化的應用。舉例而言,影像資料是影像中各物件與相機模組120a與120b之間的距離。然而,在其他未繪示的實施例中,相機總成100a的兩相機模組120a與120b可依據需求選擇適當的像素,且兩相機模組120a與120b也可以是像素相同的相機模組,本發明不以此為限制。 For example, when the camera assembly 100a is applied to the electronic device 50, one of the camera modules, for example, the camera module 120b, can be used as the main camera module, and another camera module, such as a camera module. The group 120a serves as an auxiliary camera module to increase the focusing speed of the camera module 120b. In addition, since the camera module 120a and the camera module 120b are disposed in the same holder 110a, the camera module 120a and The distance between the camera modules 120b can be maintained at a constant value. In addition, the buffer material 130 is further configured to maintain the optical axis of the lens of the camera modules 120a and 120b. Therefore, the camera assembly 100a of the embodiment can capture more image data by using the two camera modules 120a and 120b. Subsequent image processing and diverse applications. For example, the image data is the distance between each object in the image and the camera modules 120a and 120b. However, in other embodiments not shown, the two camera modules 120a and 120b of the camera assembly 100a can select appropriate pixels according to requirements, and the two camera modules 120a and 120b can also be camera modules with the same pixel. The invention is not limited thereto.

在本實施例中,相機總成100a更包括軟性電路板140a與140b。軟性電路板140a與140b分別連接兩相機模組120a與120b,且兩容置槽112的側壁112a分別具有開口112b。軟性電路板140a與140b分別經由對應的開口112b延伸至固定架110a外。換言之,軟性電路板140a與140b的一端配置在兩容置槽112內,而另一端透過側壁112a上的開口112b延伸至固定架110a外,以分別將兩相機模組120a與120b電性連接至電子裝置50的機體。然而,本發明並不限制開口112b的位置,其也可以位在容置槽112的底部。再者,在其他未繪示的實施例中,相機總成可以配置單一容置槽112,而兩相機模組120a與120b均配置於此容置槽112內,本發明不限制容置槽112的數量。 In the present embodiment, the camera assembly 100a further includes flexible circuit boards 140a and 140b. The flexible circuit boards 140a and 140b are respectively connected to the two camera modules 120a and 120b, and the side walls 112a of the two receiving slots 112 respectively have openings 112b. The flexible circuit boards 140a and 140b extend outside the holder 110a via the corresponding openings 112b, respectively. In other words, one end of the flexible circuit boards 140a and 140b is disposed in the two receiving slots 112, and the other end extends through the opening 112b of the sidewall 112a to the outside of the fixing frame 110a to electrically connect the two camera modules 120a and 120b, respectively. The body of the electronic device 50. However, the present invention does not limit the position of the opening 112b, and it may also be located at the bottom of the accommodating groove 112. Furthermore, in other embodiments, the camera assembly can be configured with a single accommodating slot 112, and the two camera modules 120a and 120b are disposed in the accommodating slot 112. The present invention does not limit the accommodating slot 112. quantity.

圖3是本發明又一實施例的相機總成的示意圖。請參考圖3,在本實施例中,相機總成100b與前述的相機總成100a同樣具有兩相機模組120a與120b,其主要差異在於,相機總成100b 的固定架110的數量為兩個。具體而言,在本實施例中,相機總成100b包括兩固定架110,而每一固定架110具有一容置槽112。兩相機模組120a與120b分別配置於對應的固定架110的容置槽112內,且各相機模組120a與120b與對應的容置槽112的側壁112a之間分別具有間隙g。緩衝材料130填充於間隙g。固定架110與緩衝材料130的材料特性以及各固定架110與對應的相機模組120a與120b之間的位置可參考前述說明,在此不多加贅述。如此,在填充緩衝材料130於間隙g之後,可減緩因掉落或其他原因而使得相機模組120a與120b之鏡頭的光軸產生偏移的情況。同樣地,本實施例的兩相機模組120a與120b較佳地是以同一軸線A為中心線而左右對稱。再者,本實施例的兩相機模組120a與120b具有不同的像素。如此,當相機總成100b應用於電子裝置50(繪示於圖4)時,相機總成100b可藉由具有不同像素的兩相機模組120a與120b擷取更多的影像資料,以利後續的影像處理以及多樣化的應用。舉例而言,以輔助相機模組(例如是相機模組120a)輔助主要相機模組(例如是相機模組120b)的對焦速度。舉例而言,影像資料可以是影像中各物件與相機模組120a與120b之間的距離。據此,本實施例的相機總成100b具有多樣化的應用。 3 is a schematic diagram of a camera assembly in accordance with still another embodiment of the present invention. Referring to FIG. 3, in the embodiment, the camera assembly 100b has two camera modules 120a and 120b similarly to the camera assembly 100a described above, the main difference being that the camera assembly 100b The number of the mounts 110 is two. Specifically, in the embodiment, the camera assembly 100b includes two mounting brackets 110, and each of the mounting brackets 110 has a receiving slot 112. The two camera modules 120a and 120b are respectively disposed in the receiving slots 112 of the corresponding mounting brackets 110, and each of the camera modules 120a and 120b and the side wall 112a of the corresponding receiving slot 112 have a gap g therebetween. The cushioning material 130 is filled in the gap g. The material characteristics of the fixing frame 110 and the cushioning material 130 and the position between each of the fixing frames 110 and the corresponding camera modules 120a and 120b can be referred to the foregoing description, and will not be further described herein. As such, after the buffer material 130 is filled in the gap g, the optical axis of the lens of the camera modules 120a and 120b may be shifted due to dropping or other reasons. Similarly, the two camera modules 120a and 120b of the present embodiment are preferably bilaterally symmetric with the same axis A as a center line. Furthermore, the two camera modules 120a and 120b of the present embodiment have different pixels. Thus, when the camera assembly 100b is applied to the electronic device 50 (shown in FIG. 4), the camera assembly 100b can capture more image data by using the two camera modules 120a and 120b having different pixels to facilitate subsequent operation. Image processing and diverse applications. For example, the auxiliary camera module (eg, camera module 120a) assists the focus speed of the primary camera module (eg, camera module 120b). For example, the image data may be the distance between each object in the image and the camera modules 120a and 120b. Accordingly, the camera assembly 100b of the present embodiment has a variety of applications.

同樣地,在本實施例中,相機總成100b更包括軟性電路板140a與140b。軟性電路板140a與140b分別連接兩相機模組120a與120b的方式,其連接方式請參考前述內容,在此不多加贅 述。如此,相機總成100b可藉由軟性電路板140a與140b電性連接至電子裝置50的機體。 Similarly, in the present embodiment, the camera assembly 100b further includes flexible circuit boards 140a and 140b. The flexible circuit boards 140a and 140b are respectively connected to the two camera modules 120a and 120b. For the connection method, please refer to the foregoing content. Said. As such, the camera assembly 100b can be electrically connected to the body of the electronic device 50 by the flexible circuit boards 140a and 140b.

圖4是本發明一實施例的電子裝置的示意圖。圖5是圖4的電子裝置的後視圖。圖6與圖7是本發明其他實施例的電子裝置的後視圖。請先參考圖4至圖5,在本實施例中,電子裝置50包括機殼52以及相機總成100a。相機總成100a配置於機殼52內,並暴露於機殼52上的兩開孔52a與52b。有關相機總成100a的敘述請參考前述內容,其中相機總成100a的固定架110a固定於電子裝置50中未繪示的內部機架,而軟性電路板140連接至電子裝置50中未繪示的機體,以使兩相機模組120a與120b透過軟性電路板140電性連接至機體。再者,兩相機模組120a與120b分別對應地暴露於機殼52上的兩開孔52a與52b。如此,電子裝置50的機殼52可以遮蔽相機總成100a的大部分構件,並透過開孔52a與52b暴露出兩相機模組120a與120b,以避免影響兩相機模組120a與120b的照相功能。此時,由於兩相機模組120a與120b與對應的容置槽112的側壁112a之間的間隙g中填充有緩衝材料130,可減緩因掉落、碰撞或受到其他外力影響而使得相機模組120a與120b之鏡頭的光軸產生偏移的情況。 4 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention. FIG. 5 is a rear elevational view of the electronic device of FIG. 4. FIG. 6 and 7 are rear views of an electronic device according to another embodiment of the present invention. Referring to FIG. 4 to FIG. 5, in the embodiment, the electronic device 50 includes a casing 52 and a camera assembly 100a. The camera assembly 100a is disposed in the casing 52 and exposed to the two openings 52a and 52b of the casing 52. For the description of the camera assembly 100a, please refer to the foregoing, wherein the fixing frame 110a of the camera assembly 100a is fixed to an internal frame (not shown) of the electronic device 50, and the flexible circuit board 140 is connected to the electronic device 50. The body is configured to electrically connect the two camera modules 120a and 120b to the body through the flexible circuit board 140. Moreover, the two camera modules 120a and 120b are respectively correspondingly exposed to the two openings 52a and 52b of the casing 52. As such, the housing 52 of the electronic device 50 can shield most of the components of the camera assembly 100a and expose the two camera modules 120a and 120b through the openings 52a and 52b to avoid affecting the camera functions of the two camera modules 120a and 120b. . At this time, since the gap g between the two camera modules 120a and 120b and the side wall 112a of the corresponding accommodating groove 112 is filled with the buffer material 130, the camera module can be slowed down due to falling, collision or other external force. The optical axes of the lenses 120a and 120b are offset.

在本實施例中,在本實施例中,兩相機模組120a與120b以同一軸線A為中心線而左右對稱。較佳地是,軸線A平行於機殼52的長邊L,如圖4與圖5所示。換言之,兩相機模組120a與120b沿軸線A排列並平行於長邊L,且各相機模組120a與120b 以同一軸線A為中心線而左右對稱。再者,相機總成100a是以對應於機殼52的中心線為舉例說明,但本發明並不以此為限制。在圖6與圖7的實施例中,電子裝置50a與電子裝置50b的相機總成100a分別對應於機殼52的相對兩長邊L,同樣也可以具有上述效果。由此可知,本發明並不限制相機總成100a的位置,其可以依據需求調整。 In this embodiment, in the embodiment, the two camera modules 120a and 120b are bilaterally symmetric with the same axis A as a center line. Preferably, the axis A is parallel to the long side L of the casing 52, as shown in FIGS. 4 and 5. In other words, the two camera modules 120a and 120b are arranged along the axis A and parallel to the long side L, and the camera modules 120a and 120b The same axis A is the center line and is bilaterally symmetrical. Furthermore, the camera assembly 100a is exemplified by a center line corresponding to the casing 52, but the invention is not limited thereto. In the embodiment of FIGS. 6 and 7, the camera assembly 100a of the electronic device 50a and the electronic device 50b respectively correspond to the opposite long sides L of the casing 52, and may also have the above effects. As can be seen, the present invention does not limit the position of the camera assembly 100a, which can be adjusted as needed.

綜上所述,本發明的相機總成將相機模組配置於固定架的容置槽內,且在相機模組與容置槽的側壁之間的間隙填充緩衝材料。據此,藉由以緩衝材料填充間隙,可以降低相機模組因電子裝置的掉落、碰撞或受到其他外力影響而使相機模組的鏡頭的光軸產生偏移的情況,而維持影像的品質。再者,當相機總成應用於電子裝置時,相機總成可藉由具有不同像素的兩相機模組與擷取更多的影像資料,以利後續的影像處理以及多樣化的應用。 In summary, the camera assembly of the present invention disposes the camera module in the receiving groove of the fixing frame, and fills the gap between the camera module and the side wall of the receiving groove. Accordingly, by filling the gap with the buffer material, the camera module can be reduced in the optical axis of the lens of the camera module due to the falling, collision or other external force of the electronic device, thereby maintaining the image quality. . Moreover, when the camera assembly is applied to an electronic device, the camera assembly can capture more image data by using two camera modules with different pixels to facilitate subsequent image processing and diverse applications.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧相機總成 100‧‧‧ camera assembly

110‧‧‧固定架 110‧‧‧Retaining frame

112‧‧‧容置槽 112‧‧‧ accommodating slots

112a‧‧‧側壁 112a‧‧‧ Sidewall

112b‧‧‧開口 112b‧‧‧ openings

120‧‧‧相機模組 120‧‧‧ camera module

130‧‧‧緩衝材料 130‧‧‧ cushioning material

140‧‧‧軟性電路板 140‧‧‧Soft circuit board

d‧‧‧距離 D‧‧‧distance

g‧‧‧間隙 G‧‧‧ gap

Claims (17)

一種相機總成,包括:至少一固定架,具有至少一容置槽;至少一相機模組,配置於該容置槽內,且該相機模組與該容置槽的側壁之間具有一間隙;以及一緩衝材料,填充於該間隙,以將該相機模組定位在該固定架的該容置槽內。 A camera assembly includes: at least one mounting bracket having at least one receiving slot; at least one camera module disposed in the receiving slot, and a gap between the camera module and a sidewall of the receiving slot And a buffer material is filled in the gap to position the camera module in the receiving groove of the holder. 如申請專利範圍第1項所述的相機總成,其中該緩衝材料的楊氏係數低於該固定架的楊氏係數。 The camera assembly of claim 1, wherein the cushioning material has a Young's modulus lower than a Young's modulus of the mount. 如申請專利範圍第1項所述的相機總成,其中該相機模組與該容置槽的側壁的內表面之間的最小距離為0.8毫米。 The camera assembly of claim 1, wherein a minimum distance between the camera module and an inner surface of the side wall of the receiving groove is 0.8 mm. 如申請專利範圍第1項所述的相機總成,其中該相機模組的數量為兩個,該兩相機模組以同一軸線為中心線而左右對稱。 The camera assembly of claim 1, wherein the number of the camera modules is two, and the two camera modules are bilaterally symmetric with the same axis as a center line. 如申請專利範圍第4項所述的相機總成,其中該容置槽的數量為兩個,該兩相機模組分別配置於該兩容置槽內,且各該相機模組與對應的該容置槽的側壁之間分別具有該間隙,該緩衝材料填充於該些間隙。 The camera assembly of claim 4, wherein the number of the accommodating slots is two, and the two camera modules are respectively disposed in the two accommodating slots, and each of the camera modules and the corresponding one is The gap between the sidewalls of the accommodating groove is respectively formed, and the buffer material is filled in the gaps. 如申請專利範圍第4項所述的相機總成,其中該固定架的數量為兩個,該兩相機模組分別配置於對應的該固定架的該容置槽內,且各該相機模組與對應的該容置槽的側壁之間分別具有該間隙,該緩衝材料填充於該些間隙。 The camera assembly of claim 4, wherein the number of the mounting brackets is two, and the two camera modules are respectively disposed in the corresponding receiving slots of the mounting bracket, and each of the camera modules The gap is respectively formed between the sidewalls of the corresponding accommodating grooves, and the buffer material is filled in the gaps. 如申請專利範圍第4項所述的相機總成,其中該兩相機模 組具有不同的像素。 The camera assembly of claim 4, wherein the two camera modules Groups have different pixels. 如申請專利範圍第1項所述的相機總成,更包括:一軟性電路板,連接該相機模組,且該容置槽的側壁具有一開口,該軟性電路板經由該開口延伸至該固定架外。 The camera assembly of claim 1, further comprising: a flexible circuit board connected to the camera module, and a sidewall of the receiving slot has an opening through which the flexible circuit board extends to the fixed Off-site. 一種電子裝置,包括:一機殼;以及一相機總成,配置於該機殼內,並暴露於該機殼上的至少一開孔,該相機總成包括:至少一固定架,具有至少一容置槽;至少一相機模組,配置於該容置槽內,且該相機模組與該容置槽的側壁之間具有一間隙;以及一緩衝材料,填充於該間隙,以將該相機模組定位在該固定架的該容置槽內。 An electronic device comprising: a casing; and a camera assembly disposed in the casing and exposed to at least one opening in the casing, the camera assembly comprising: at least one fixing frame having at least one a receiving slot; at least one camera module disposed in the receiving slot, and a gap between the camera module and a sidewall of the receiving slot; and a buffer material filling the gap to the camera The module is positioned in the receiving slot of the fixing frame. 如申請專利範圍第9項所述的電子裝置,其中該緩衝材料的楊氏係數低於該固定架的楊氏係數。 The electronic device of claim 9, wherein the buffer material has a Young's modulus lower than a Young's modulus of the holder. 如申請專利範圍第9項所述的電子裝置,其中該相機模組與該容置槽的側壁的內表面之間的最小距離為0.8毫米。 The electronic device of claim 9, wherein a minimum distance between the camera module and an inner surface of the side wall of the accommodating groove is 0.8 mm. 如申請專利範圍第9項所述的電子裝置,其中該相機模組的數量為兩個,該兩相機模組以同一軸線為中心線而左右對稱。 The electronic device of claim 9, wherein the number of the camera modules is two, and the two camera modules are bilaterally symmetric with the same axis as a center line. 如申請專利範圍第12項所述的電子裝置,其中該軸線平行於該機殼的一長邊。 The electronic device of claim 12, wherein the axis is parallel to a long side of the casing. 如申請專利範圍第12項所述的電子裝置,其中該容置槽 的數量為兩個,該兩相機模組分別配置於該兩容置槽內,且各該相機模組與對應的該容置槽的側壁之間分別具有該間隙,該緩衝材料填充於該些間隙。 The electronic device of claim 12, wherein the receiving slot The two camera modules are respectively disposed in the two accommodating slots, and each of the camera modules and the corresponding sidewall of the accommodating slot respectively have the gap, and the buffer material is filled in the gap. 如申請專利範圍第12項所述的電子裝置,其中該固定架的數量為兩個,該兩相機模組分別配置於對應的該固定架的該容置槽內,且各該相機模組與對應的該容置槽的側壁之間分別具有該間隙,該緩衝材料填充於該些間隙。 The electronic device of claim 12, wherein the number of the holders is two, and the two camera modules are respectively disposed in the corresponding receiving slots of the holder, and each of the camera modules is The gap between the sidewalls of the corresponding receiving groove is respectively formed, and the buffer material is filled in the gaps. 如申請專利範圍第12項所述的電子裝置,其中該兩相機模組具有不同的像素。 The electronic device of claim 12, wherein the two camera modules have different pixels. 如申請專利範圍第9項所述的電子裝置,其中該相機總成更包括:一軟性電路板,連接該相機模組,且該容置槽的側壁具有一開口,該軟性電路板經由該開口延伸至該固定架外。 The electronic device of claim 9, wherein the camera assembly further comprises: a flexible circuit board connected to the camera module, and a sidewall of the receiving slot has an opening through which the flexible circuit board is Extends to the outside of the holder.
TW102140902A 2013-11-08 2013-11-11 Camera assembly and electronic device TWI490624B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/074,722 US9313389B2 (en) 2013-11-08 2013-11-08 Camera assembly and electronic device

Publications (2)

Publication Number Publication Date
TW201518841A true TW201518841A (en) 2015-05-16
TWI490624B TWI490624B (en) 2015-07-01

Family

ID=52991005

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102140902A TWI490624B (en) 2013-11-08 2013-11-11 Camera assembly and electronic device

Country Status (4)

Country Link
US (1) US9313389B2 (en)
CN (1) CN104640405A (en)
DE (1) DE102014010168B4 (en)
TW (1) TWI490624B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI657304B (en) * 2017-10-31 2019-04-21 群光電子股份有限公司 Electronic device and heat drift preventing camera module thereof

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5961770B2 (en) * 2014-01-09 2016-08-02 富士フイルム株式会社 Imaging module, imaging module manufacturing method, electronic device
US9431442B2 (en) 2015-02-02 2016-08-30 Apple Inc. Overmolded reconstructed camera module
US10523854B2 (en) 2015-06-25 2019-12-31 Intel Corporation Array imaging system having discrete camera modules and method for manufacturing the same
CN116567379A (en) * 2015-06-29 2023-08-08 Lg伊诺特有限公司 Dual camera module and optical device
KR102377985B1 (en) * 2015-06-29 2022-03-24 엘지이노텍 주식회사 Dual camera module and Optical apparatus
US9973669B2 (en) * 2015-08-28 2018-05-15 Apple Inc. Dual overmolded reconstructed camera module
CN105338230B (en) * 2015-11-25 2019-12-27 三赢科技(深圳)有限公司 Image forming apparatus and method of assembling the same
TWM552720U (en) * 2016-03-12 2017-12-01 Ningbo Sunny Opotech Co Ltd Split array camera module
CN108270949B (en) * 2016-12-31 2022-05-27 宁波舜宇光电信息有限公司 Split type array camera module and manufacturing method thereof
CN114706261B (en) 2016-11-01 2024-01-30 Lg伊诺特有限公司 Camera module and optical device
KR101823272B1 (en) * 2016-12-01 2018-01-29 삼성전기주식회사 Camera module
CN108243296A (en) * 2016-12-23 2018-07-03 宁波舜宇光电信息有限公司 Circuit board assemblies and camera module and its manufacturing method and the electronic equipment with camera module
US10291830B2 (en) * 2017-04-03 2019-05-14 Denso Corporation Vehicle windshield camera module
US10317651B2 (en) 2017-04-03 2019-06-11 Denso Corporation Camera module

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004120670A (en) 2002-09-30 2004-04-15 Hitachi Ltd Folding type portable terminal equipment
US7619683B2 (en) * 2003-08-29 2009-11-17 Aptina Imaging Corporation Apparatus including a dual camera module and method of using the same
JP2006293060A (en) 2005-04-12 2006-10-26 Sharp Corp Cushioning structure for equipment
KR100652751B1 (en) 2005-08-06 2006-12-01 엘지전자 주식회사 Portable terminal having support member for supporting camera module and board
KR100721167B1 (en) * 2005-08-24 2007-05-23 삼성전기주식회사 Image sensor module and manufacturing method thereof and camera module using thereof
JP2008113066A (en) * 2006-10-27 2008-05-15 Sony Corp Imaging device
GB0808138D0 (en) * 2008-05-03 2008-06-11 Magnum Venus Plastech Ltd Liquid flow sensing systems
KR101445185B1 (en) 2008-07-10 2014-09-30 삼성전자주식회사 Flexible Image Photographing Apparatus with a plurality of image forming units and Method for manufacturing the same
CN101493634B (en) 2009-01-08 2011-02-02 华为终端有限公司 Bidirectional camera shooting module and terminal equipment
KR101594831B1 (en) * 2009-03-26 2016-02-17 삼성전자 주식회사 Structure for fixing camera module on bio drive
TWI439209B (en) 2009-08-10 2014-05-21 Hon Hai Prec Ind Co Ltd Portable electronic device
CN102033387B (en) * 2009-09-28 2014-02-19 鸿富锦精密工业(深圳)有限公司 Image stabilizing module and imaging device
TWI464477B (en) * 2009-12-22 2014-12-11 Hon Hai Prec Ind Co Ltd Lens module and assembly method of the same
KR101149021B1 (en) 2010-10-08 2012-05-24 엘지이노텍 주식회사 Three Dimensional Image Pick-Up Device andManufacturing Method thereof
US9392147B2 (en) 2010-11-18 2016-07-12 Lg Innotek Co., Ltd. Camera module having elastic stiffening material for efficient shock absorbing property and method for manufacturing the same
JP2012109844A (en) 2010-11-18 2012-06-07 Kyocera Corp Electronic apparatus with camera, mobile phone, and control method
KR101843450B1 (en) 2011-08-23 2018-03-29 엘지전자 주식회사 Mobile terminal and method for controlling of the same
KR101300341B1 (en) 2011-12-05 2013-08-28 삼성전기주식회사 Camera module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI657304B (en) * 2017-10-31 2019-04-21 群光電子股份有限公司 Electronic device and heat drift preventing camera module thereof

Also Published As

Publication number Publication date
DE102014010168B4 (en) 2023-02-09
TWI490624B (en) 2015-07-01
US9313389B2 (en) 2016-04-12
US20150130974A1 (en) 2015-05-14
CN104640405A (en) 2015-05-20
DE102014010168A1 (en) 2015-05-13

Similar Documents

Publication Publication Date Title
TWI490624B (en) Camera assembly and electronic device
US10462339B2 (en) Imaging apparatus and imaging system having press bent infrared cut filter holder
US11409075B2 (en) Plastic optical lens assembly, imaging lens module and electronic device
US8066440B2 (en) Camera module
JP5984378B2 (en) Imaging device
US11503748B2 (en) Electromagnetic-wave-shielding sheet capable of dissipating heat of electronic component and electronic device including the same
CN108111643B (en) Mobile terminal
US20160381262A1 (en) Three-dimensional image sensing module with a low z-height
CN219916148U (en) Image capturing device
WO2019075700A1 (en) Camera module and mobile terminal
US11796759B2 (en) Camera module and electronic device
KR102350059B1 (en) Optical apparatus
KR20200000938A (en) A lens moving unit, and camera module and optical instrument including the same
EP4181499A1 (en) Electronic device comprising camera module
JP6045337B2 (en) Imaging device
US20210018818A1 (en) Camera module and optical device comprising same
US9628678B2 (en) Camera module and portable terminal with the same
US20230379582A1 (en) Camera Module and Electronic Device
JP2013197974A (en) Imaging apparatus
TWI559839B (en) Electronic device
JP2017011659A (en) Antenna installation structure and imaging device
CN115933286A (en) Camera module and electronic equipment
JP2012023131A (en) Electronic equipment
CN116060385B (en) Camera module and electronic equipment
TWI811032B (en) Circuit board assembly, camera module and electronic device therefor