TW201516782A - A touch structure and the manufacturing method thereof - Google Patents

Abstract

A touch structure and the manufacturing method thereof are provided, the manufacturing method includes steps of: provided a flexible supporting substrate by roll-to-roll process; coating liquid material on the flexible supporting substrate by roll-to-roll process; solidifying the liquid material coated on the flexible supporting substrate to form a first film on the flexible supporting substrate; forming a touch sensing structure on the first film; and stripping the flexible supporting substrate from the first film, such that the manufacturing method can be used to provide the touch structure of the present invention.

Description

Touch structure and manufacturing method thereof

The present invention relates to a touch structure and a method of fabricating the same, and more particularly to a touch structure and a manufacturing method that can reduce thickness, weight, and ease of manufacture.

With the advancement of the times, personal digital assistants (PDAs), mobile phones, car navigation systems, tablet computers and other electronic products with touch input functions have become more and more popular, and the display screens of these products are generally built. The touch panel is used for the user to input information by using a finger or a stylus, and the touch panel has a plurality of touch technologies, wherein the resistive type and the capacitive type touch the surface of the panel by the user with a finger or an inductive pen. The change of the capacitance value is generated inside the panel of the touched position, thereby detecting the position of the touched surface of the panel to achieve the purpose of touch sensing.

In general, a capacitive touch panel structure generally uses glass or polytrimethylene terephthalate (hereinafter referred to as PTT) as a touch substrate to become a glass/glass (G/G), glass/film/film (G). /F/F), glass/film (G/F) or monolithic glass (OGS), or directly integrate the touch sensor into the display panel, called in-cell (In-cell or On-cell) touch display or touch display device. The monolithic glass scheme (OGS), compared with two sheets of glass (G/G) or (G/F/F), can reduce the overall thickness, but it is still insufficient, and the glass is heavier than the plastic, and the weight of the module is still It is too heavy, although the single-piece plastic sheet solution (OPS) can reduce the weight, the thickness of the plastic sheet used is too thick (>0.5mm) and it is easy to have uneven surface, which may cause the convexity of the display surface when it is fitted. And because the roll-to-roll process cannot be used, and the single When the film is manufactured, it is more difficult than the single-chip glass solution, and it is difficult to manufacture and manufacture, and the manufacturing cost is high. The in-cell touch display, although thinner in thickness and lighter in weight, has signal interference and poor product yield. problem.

To solve the problem, the present invention provides a technical method for manufacturing a touch structure capable of reducing thickness, weight, and ease of manufacture.

To achieve the above objective, the touch structure of the present invention comprises: a first film and a first touch sensing structure, wherein the first film is solidified by a liquid material, and the first touch sensing structure is located at the first On a film.

In order to achieve the above, the touch structure further includes a second touch sensing structure, the second touch sensing structure is located on a second film, and has an adhesive layer located on the first film and the first Two film rooms.

To achieve the above objective, the touch structure further includes a second touch sensing structure, the second touch sensing structure is disposed on a flexible substrate, and has an adhesive layer located on the first film and the soft Between the substrates.

To achieve the above, the touch structure further includes a second touch sensing structure, the first touch sensing structure is located on the upper surface of the first film, and the second touch sensing structure is located under the first film. surface.

To achieve the above object, the method for manufacturing the touch structure of the present invention comprises at least the following steps: providing a soft support substrate for the roll-to-roll; coating the liquid material on the soft support substrate by roll-to-roll; curing the liquid material for soft support Forming a first film on the substrate; forming a first touch sensing structure on the first film by roll-to-roll; and peeling the soft support substrate from the first film.

In order to achieve the above object, the manufacturing method of the touch structure further comprises: providing a soft support substrate for the roll-to-roll; coating the liquid material on the soft support substrate by roll-to-roll; curing the liquid material, forming a soft support substrate; Second film; The roll-to-roll forms a second touch sensing structure on the second film; the flexible support substrate is peeled off from the second film; and the first film and the second film are bonded.

To achieve the above object, the manufacturing method of the touch structure further comprises: forming a second touch sensing structure on a flexible substrate by roll-to-roll; and bonding the first film and the soft substrate.

The above liquid material is polyimine (PI; polyimide).

The liquid material is cured in the above manner by heating at 140 to 350 degrees Celsius.

The soft support substrate described above is polyethylene terephthalate (PET), copper film, stainless steel or a soft heat-resistant material.

110,210,310,410,510,610,710‧‧‧first film

120,220,320,420,520,620,720‧‧‧ first touch sensing structure

121,221,321,421,521,621,721‧‧‧first transparent sensing series

122,222,322,422,522,622,722‧‧‧First perimeter line

230,330,430,630,730‧‧‧second touch sensing structure

231,331,431,631,731‧‧‧Second transparent sensing series

232, 332, 432, 632, 732 ‧ ‧ second peripheral line

240,340,440,640‧‧‧hard transparent substrate

350,650‧‧‧second film

460,760‧‧‧Soft substrate

571,671‧‧‧Soft support substrate

572‧‧‧Liquid materials

573‧‧‧Forming wheel

680,780‧‧‧ adhesive layer

591,691,791‧‧‧Transparent conductive layer

592,692,792‧‧‧metal layer

FIG. 1 is a schematic view showing a first embodiment of a touch structure according to the present invention.

FIG. 2 is a schematic view showing a second embodiment of the touch structure of the present invention.

FIG. 3 is a schematic view showing a third embodiment of the touch structure of the present invention.

FIG. 4 is a schematic view showing a fourth embodiment of the touch structure of the present invention.

5a to 5e are schematic views showing a first embodiment of a method of manufacturing a touch structure according to the present invention.

6a to 6f are schematic views showing a second embodiment of the manufacturing method of the touch structure of the present invention.

7A to 7d are schematic views showing a third embodiment of a method of manufacturing a touch structure according to the present invention.

Please refer to FIG. 1 , which is a schematic diagram of a touch structure according to a first embodiment of the present invention. First, the touch structure of the present invention includes a first film 110 and a first The touch sensing structure 120; wherein the first film 110 is solidified by a liquid material. Its liquid material is polyimine (PI; polyimide).

The first touch sensing structure 120 is located on the first film 110 and has a plurality of first transparent sensing series 121 and a first peripheral line 122 connected to each other. The first transparent sensing series is made of a material having light transmissive ability and electrical conductivity, for example, may be a metal oxide, wherein the metal oxide may be, for example, indium tin oxide (ITO) or indium zinc oxide (indium tin oxide). Indium zinc oxide, IZO), cadmium tin oxide (CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, oxidation Cadmium oxide, hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium oxide (indium gallium) Magnesium oxide, InGaMgO) or indium gallium aluminum oxide (InGaAlO). Of course, the first touch sensing structure can be a single-sided bridging structure of the capacitive touch panel or a resistive touch panel.

As shown in the second embodiment of FIG. 2, the touch structure of the present invention includes a first film 210, a first touch sensing structure 220, and a second touch sensing structure 230. The first touch sensing structure The 220 is located on the upper surface of the first film 210, and has a plurality of first transparent sensing series 221 and a first peripheral circuit 222 connected to each other. The second touch sensing structure 230 is located on the lower surface of the first film 210, and has The plurality of interconnected second transparent sensing series 231 and the second peripheral line 232, the first transparent sensing series 221 and the second transparent sensing series 231 are interlaced; and the first film 210 is attached to the hard The transparent substrate 240 (for example, may be tempered glass).

As shown in the third embodiment of FIG. 3, the touch structure of the present invention includes a first film 310, a first touch sensing structure 320, and a second touch sensing structure 330. The first touch sensing structure 320 is located on the upper surface of the first film 310, which has The first transparent sensing series 321 and the first peripheral circuit 322 are connected to each other, the second touch sensing structure 330 is located on a second film 350, and the second film 350 is adhered and fixed under the first film 310. The second transparent sensing series 331 and the second transparent sensing series 331 are interlaced with each other; the first thin film 310 is pasted It is combined with a hard transparent substrate 340 (for example, it may be tempered glass).

As shown in the fourth embodiment of FIG. 4, the touch structure of the present invention includes a first film 410, a first touch sensing structure 420, and a second touch sensing structure 430. The first touch sensing structure The 420 is located on the upper surface of the first film 410, and has a plurality of first transparent sensing series 421 and a first peripheral circuit 422 connected to each other. The second touch sensing structure 430 is disposed on a flexible substrate 460. The material 460 is adhesively fixed under the first film 410, and has a plurality of interconnected second transparent sensing series 431 and a second peripheral line 432. The first transparent sensing series 421 and the second transparent sensing series The 431 series are interlaced; the first film 410 is attached to the rigid transparent substrate 440 (for example, it may be tempered glass).

The film formed by curing the liquid material can have a thickness of 1 μm to 25 μm and preferably 5 μm to 15 μm. When used as a carrier of the touch structure, the touch panel can greatly reduce the overall size of the touch panel. Thickness to achieve a lighter and thinner demand.

Please refer to FIGS. 5a to 5e for a schematic diagram of a manufacturing method of the touch structure of the present invention. First, the roll-to-roll is provided with a flexible support substrate 571; the flexible support substrate 571 is made of a flexible material and can be crimped into a roll shape. The material of the flexible supporting substrate 571 may be, for example, polyethylene terephthalate (PET), copper film, stainless steel or a soft heat-resistant material.

The liquid material 572 is applied to the flexible support substrate 571 via the roll-to-roll. The liquid material of the surface is polyimine (PI), and a forming wheel 573 is further disposed on the surface of the liquid material 572 on the surface of the flexible supporting substrate 571 to form the liquid material 572 to a predetermined thickness, and the thickness thereof can be 1 μm. 25 μm is preferably 5 μm to 15 μm.

The liquid material 572 is cured, and a first film 510 is formed on the flexible support substrate 571, as shown in FIG. 5b; wherein the curing method can be performed by irradiating a UV lamp or heating, for example, heating 140 degrees Celsius to 350 degrees Celsius. The liquid material 572 is molded by curing.

The roll-to-roll forms a first touch-sensing structure 520 on the first film 510; wherein a transparent conductive layer 591 and a metal layer 592 are sequentially formed on the surface of the first film 510, as shown in FIG. 5c, to form Multi-layer transparent stack structure. The manner in which the transparent stacked structure is formed may be, for example, a roll-to-roll physical vapor deposition (PVD), a roll-to-roll chemical vapor deposition (CVD), a roll-to-roll plating, a roll-to-roll coating process, or the like. The transparent conductive layer 591 can be composed of a metal oxide. The metal oxide can be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), or cadmium tin oxide. CTO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), Indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide , InGaAlO), etc.; the metal layer 592 can be at least one layer of a conductive metal, or a plurality of layers of a conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials.

Then, the patterning process is performed. As shown in FIG. 5d, the patterning process may adopt a roll-to-roll yellow process or a roll-to-roll laser process, preferably a roll-to-roll yellow process, and the above-mentioned multilayer transparent stack structure. A first yellow light process is performed to pattern the transparent conductive layer 591 and the metal layer 592. The first yellow light process includes forming a patterned photoresist layer (not shown) over the metal layer 592. The material of the photoresist layer may be a liquid photoresist or a dry film photoresist. An etching step is then performed to etch away the transparent conductive layer 591 and the metal layer 592 that are not protected by the photoresist layer, and to remove the patterned photoresist layer. Then, a second yellow light process is performed to remove a portion of the metal layer on the transparent conductive layer 591 to form a first transparent sensing series 521 and a first peripheral line 522 connected to each other, and formed on the first film 510. The first touch sensing structure 520.

Finally, the flexible supporting substrate 571 is peeled off from the first film 510, as shown in FIG. 5e, to complete the touch structure. Wherein, the invention is solidified and formed by using a liquid material, and the overall thickness thereof can be greatly reduced and the weight is light, and the thickness thereof can be 1 μm to 25 μm, preferably 5 μm to 15 μm, in order to meet the demand of light and thin products.

Please refer to FIGS. 6a to 6f to illustrate a manufacturing method of a touch structure according to a second embodiment of the present invention. The first film 610 is completed by the above process. The first film 610 has a first touch sensing structure 620. As shown in FIG. 6a, the first transparent sensing series 621 and the first peripheral circuit are connected to each other. 622, the second touch sensing structure is formed by using the above process, and a second film 650 is solidified by using a liquid material on the flexible supporting substrate 671, as shown in FIG. 6b; The sensing structure 630 is on the second film 650, wherein a transparent conductive layer 691 and a metal layer 692 are sequentially formed before the surface of the second film 650, as shown in FIG. 6c, to form a multilayer transparent stack structure. The manner in which the transparent stacked structure is formed may be, for example, a roll-to-roll physical vapor deposition (PVD), a roll-to-roll chemical vapor deposition (CVD), a roll-to-roll plating, a roll-to-roll coating process, or the like. Transparent conductive The layer 691 can be composed of a metal oxide, wherein the metal oxide can be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), Aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), indium gallium oxide Indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO) The metal layer 692 can be at least one layer of conductive metal or a plurality of layers of conductive metal. The material may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials.

Then, patterning is performed. As shown in FIG. 6d, the patterning process may adopt a roll-to-roll yellow process or a roll-to-roll laser process, preferably a roll-to-roll yellow process, and the above-mentioned multilayer transparent stack structure A first yellow light process is performed to pattern the transparent conductive layer 691 and the metal layer 692. The first yellow light process includes forming a patterned photoresist layer (not shown) over the metal layer 692. The material of the photoresist layer may be a liquid photoresist or a dry film photoresist. An etching step is then performed to etch away the transparent conductive layer 691 and the metal layer 692 that are not protected by the photoresist layer, and to remove the patterned photoresist layer. Then, a second yellow light process is performed to remove a portion of the metal layer on the transparent conductive layer 691 to form a second transparent sensing series 631 and a second peripheral line 632 connected to each other, and formed on the second film 650. The second touch sensing structure 630.

The flexible supporting substrate 671 is further peeled off from the second film 650 as shown in FIG. 6e; finally, the first film 610 and the second film are bonded by an adhesive layer 680. 650, as shown in FIG. 6f, to complete the touch structure of the present invention; then, the touch structure can be adhered to the hard transparent substrate 640 by the adhesive layer 680. The material of the rigid transparent substrate 640 can be glass, tempered glass or hard plastic to provide protection. The material of the adhesive layer 680 may be acrylic glue, UV glue, water glue or optical glue.

Please refer to FIGS. 7a to 7d for a schematic view showing a manufacturing method of a touch structure according to a third embodiment of the present invention. The first film 710 is completed by the above process. The first film 710 has a first touch sensing structure 720. As shown in FIG. 7a, the first transparent sensing series 721 and the first peripheral line are connected to each other. 722. The roll-to-roll forms a second touch sensing structure on a flexible substrate, wherein a roll-to-roll soft substrate 760 is first provided, as shown in FIG. 7b, which is formed transparently on the surface of the flexible substrate 760. Conductive layer 791 and metal layer 792 to form a multilayer transparent stack. The manner in which the transparent stacked structure is formed may be, for example, a roll-to-roll physical vapor deposition (PVD), a roll-to-roll chemical vapor deposition (CVD), a roll-to-roll plating, a roll-to-roll coating process, or the like. And then patterned, as shown in FIG. 7c, forming the second transparent sensing series 731 and the second peripheral line 732 connected to each other, and forming the second touch sensing structure 730 on the flexible substrate 760; The first film 710 and the flexible substrate 760 are bonded by an adhesive layer 780, as shown in FIG. 7d, to complete the touch structure of the present invention.

Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. The scope of the present invention is defined by the scope of the claims, and the scope of the invention is intended to be limited by the scope of the invention.

510‧‧‧First film

520‧‧‧First touch sensing structure

571‧‧‧Soft support substrate

572‧‧‧Liquid materials

573‧‧‧Forming wheel

Claims (12)

A touch structure includes: a first film formed by solidification of a liquid material; and a first touch sensing structure disposed on the first film. The touch control structure of claim 1, further comprising a second touch sensing structure, wherein the first touch sensing structure is located on an upper surface of the first film, and the second touch sensing structure is located The lower surface of the first film. The touch structure of claim 1, further comprising a second touch sensing structure, the second touch sensing structure being located on a second film and having an adhesive layer on the first film Between the second film and the second film. The touch control structure of claim 1, further comprising a second touch sensing structure, the second touch sensing structure being on a flexible substrate and having an adhesive layer on the first film Between this soft substrate. The touch structure according to claim 1, wherein the first film has a thickness of 1 μm to 25 μm. A method for manufacturing a touch structure, comprising: providing a soft support substrate on a roll-to-roll; coating a liquid material on the flexible support substrate; and solidifying the liquid material to form a first film on the flexible support substrate Roll-to-roll forming a first touch sensing structure on the first film; and peeling the flexible support substrate from the first film. The method for manufacturing a touch structure according to claim 6, further comprising: providing a flexible support substrate for the roll-to-roll; applying a liquid material to the flexible support substrate by roll-to-roll; curing the liquid material on the flexible support substrate Forming a second film; forming a second touch sensing structure on the second film; winding the flexible support substrate to the second film; and bonding the first film and the second film. The method of manufacturing the touch structure of claim 6, further comprising: forming a second touch sensing structure on the flexible substrate by roll-to-roll; and bonding the first film and the flexible substrate. The method of manufacturing a touch structure according to claim 6, wherein the liquid material is polyimine. The method of manufacturing a touch structure according to claim 6, wherein the liquid material is cured by heating at 140 to 350 degrees Celsius. The method for manufacturing a touch structure according to any one of claims 6 to 10, wherein the flexible support substrate is polyethylene terephthalate (PET), copper film, stainless steel or soft heat resistant material. . The method for manufacturing a touch structure according to any one of claims 6 to 10, wherein the coating thickness of the roll-to-roll coating liquid material on the flexible support substrate may be from 1 μm to 25 μm.