TW201516326A - Lamp cup module and light emitting device - Google Patents

Lamp cup module and light emitting device Download PDF

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Publication number
TW201516326A
TW201516326A TW102137469A TW102137469A TW201516326A TW 201516326 A TW201516326 A TW 201516326A TW 102137469 A TW102137469 A TW 102137469A TW 102137469 A TW102137469 A TW 102137469A TW 201516326 A TW201516326 A TW 201516326A
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Taiwan
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cup
lamp cup
lamp
module
power conversion
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TW102137469A
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Chinese (zh)
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sheng-yuan Sun
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Genesis Photonics Inc
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Priority to TW102137469A priority Critical patent/TW201516326A/en
Publication of TW201516326A publication Critical patent/TW201516326A/en

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Abstract

A Lamp cup module comprising a cup body having a cup bottom, a partition and a cup wall disposed around the cup bottom, a colloid and a power conversion unit is disclosed. The partition is disposed on the cup bottom and is connected the cup wall to constitute a first accommodation space and a second accommodation space. The cup bottom has a through hole that communicates the second accommodation space with the external. The colloid is filled into the first accommodation space. The power conversion unit is fixed inside the first accommodation space.

Description

燈杯模組及發光裝置 Lamp cup module and illuminating device

本發明是有關於一種燈杯模組及發光裝置,特別是有關於一種藉由燈杯主體的設置搭配膠體以固定電源轉換單元,並藉由選擇具散熱性質之膠體以提高散熱效率的燈杯模組及發光裝置。 The invention relates to a lamp cup module and a light-emitting device, in particular to a lamp cup which is provided with a colloid to fix a power conversion unit by a lamp body and to improve heat dissipation efficiency by selecting a colloid having heat dissipation properties. Module and lighting device.

現在照明燈具在應用範圍上已經得到了廣泛的使用,人們對照明燈具的要求也越來越高,例如要求照明燈具體積小、重量輕、高光效及長壽命。 Nowadays, lighting fixtures have been widely used in applications, and people are increasingly demanding lighting fixtures, such as requiring small size, light weight, high luminous efficiency and long life.

發光二極體(LED)具有體積小、低耗電、耐震盪、反應速度快、壽命長、環保無汞等優良特性,且由於近年來環保及節能意識抬頭,使得發光二極體已廣泛地應用在各種照明設備上。 Light-emitting diodes (LEDs) have excellent characteristics such as small size, low power consumption, shock resistance, fast reaction speed, long life, environmental protection and no mercury, and due to the rising awareness of environmental protection and energy conservation in recent years, the light-emitting diodes have been widely used. Applied to a variety of lighting equipment.

惟,因為LED是固態照明,即是利用晶片通電,量子激態復合以發出能量(光)。但在發光的過程,同時也會產生大量的熱,這些熱的累積會使得LED在高溫環境中產生嚴重光衰的問題,進而影響LED的亮度及壽命。 However, because the LED is solid-state illumination, that is, the wafer is energized, the quantum exciplex is recombined to emit energy (light). However, in the process of illuminating, a large amount of heat is also generated at the same time, and the accumulation of these heats causes the LED to cause severe light decay in a high temperature environment, thereby affecting the brightness and life of the LED.

又,將LED搭配燈杯模組組裝成發光裝置時,位於燈杯內部的電源轉換單元(如變壓器等等)在運作時也會產生熱,由於燈杯為空心結構,氣體的熱傳導速率較差,IED所產生的熱及電 源轉換單元的熱都不易排出而易於導致元件失效,進而影響整體裝置的可靠度。 Moreover, when the LED is matched with the lamp cup module into a light-emitting device, the power conversion unit (such as a transformer, etc.) located inside the lamp cup also generates heat during operation, and since the lamp cup has a hollow structure, the heat conduction rate of the gas is poor. Heat and electricity generated by the IED The heat of the source conversion unit is not easily discharged, which is liable to cause component failure, thereby affecting the reliability of the overall device.

再者,在組合燈杯模組,欲以膠體黏合電源轉換單元與燈杯以固定時,由於習知燈杯為空心結構且具有多個開口,如此一來,膠體的填充變得困難,不易接合。 Furthermore, in the combination of the lamp cup module, when the power conversion unit and the lamp cup are to be fixed by the glue, since the conventional lamp cup has a hollow structure and has a plurality of openings, the filling of the colloid becomes difficult and difficult. Engage.

有鑑於上述習知發光裝置之問題,本發明之目的就是在提供一種燈杯模組及發光裝置,以提高燈杯模組的散熱效率及可靠度。 In view of the above problems of the conventional light-emitting device, the object of the present invention is to provide a lamp cup module and a light-emitting device for improving heat dissipation efficiency and reliability of the lamp cup module.

為達前述目的,本發明提出一種燈杯模組,包括:一燈杯主體,具有一杯底、一分隔件及環設杯底之一杯壁,其中分隔件係設置於杯底上且連接杯壁以構成第一容置空間及第二容置空間,且杯底具有至少一貫穿孔連通第二容置空間與外界;一膠體,填入於第一容置空間中;以及一電源轉換單元,藉由膠體固定於燈杯主體所構成之第一容置空間中。 To achieve the foregoing objective, the present invention provides a lamp cup module comprising: a lamp cup body having a cup bottom, a partition member and a cup wall of the cup bottom, wherein the partition member is disposed on the cup bottom and connected to the cup wall The first accommodating space and the second accommodating space are formed, and the bottom of the cup has at least a continuous through hole communicating with the second accommodating space and the outside; a colloid is filled in the first accommodating space; and a power conversion unit borrows The colloid is fixed in the first accommodating space formed by the body of the lamp cup.

依據本發明之燈杯模組之一實施例,其中,杯底、分隔件及杯壁係一體成型。 According to an embodiment of the lamp cup module of the present invention, the cup bottom, the partition member and the cup wall are integrally formed.

依據本發明之燈杯模組之一實施例,其中,燈杯主體之材質為鋁。 According to an embodiment of the lamp cup module of the present invention, the material of the lamp cup body is aluminum.

依據本發明之燈杯模組之一實施例,其中,膠體之導熱係數介於1~15W/m-k之間。 According to an embodiment of the lamp cup module of the present invention, the thermal conductivity of the colloid is between 1 and 15 W/m-k.

依據本發明之燈杯模組之一實施例,其中,電源轉換單元至少包含一變壓器及一電容。 According to an embodiment of the lamp cup module of the present invention, the power conversion unit comprises at least a transformer and a capacitor.

依據本發明之燈杯模組之一實施例,其中,膠體填入於第一容置空間中的高度大於電源轉換單元的高度的一半且小於杯壁的高度。 According to an embodiment of the lamp cup module of the present invention, the height of the colloid filled in the first accommodating space is greater than half of the height of the power conversion unit and smaller than the height of the cup wall.

依據本發明之燈杯模組之一實施例,其中,膠體對電源轉換單元中的變壓器的覆蓋面積大於60%。 According to an embodiment of the lamp cup module of the present invention, the coverage area of the transformer in the power conversion unit is greater than 60%.

依據本發明之燈杯模組之一實施例,本發明之燈杯模組更包含一散熱層塗佈於燈杯主體之一內表面上。 According to an embodiment of the lamp cup module of the present invention, the lamp cup module of the present invention further comprises a heat dissipation layer coated on an inner surface of the lamp cup body.

依據本發明之燈杯模組之一實施例,本發明之燈杯模組更包含一散熱鰭片設置於杯壁上。 According to an embodiment of the lamp cup module of the present invention, the lamp cup module of the present invention further comprises a heat dissipating fin disposed on the cup wall.

此外,本發明更提出一種發光裝置,包括:一基板;至少一發光單元,設置於基板之一上表面上;一如上述之燈杯模組,其中,基板覆蓋燈杯主體之一上開口,且燈杯模組之電源轉換單元電性連接發光單元;一燈座,連接燈杯模組之燈杯主體,且覆蓋燈杯模組之貫穿孔;以及一電線,電性連接電源轉換單元並經由燈杯主體之杯底之貫穿孔連接燈座。 In addition, the present invention further provides a light-emitting device, comprising: a substrate; at least one light-emitting unit disposed on an upper surface of the substrate; and the light cup module as described above, wherein the substrate covers an opening of one of the body of the lamp cup, And the power conversion unit of the lamp cup module is electrically connected to the light-emitting unit; a lamp holder is connected to the lamp cup body of the lamp cup module and covers the through hole of the lamp cup module; and a wire is electrically connected to the power conversion unit and The lamp holder is connected via a through hole of the cup bottom of the lamp cup body.

依據本發明之發光裝置之一實施例,其中,燈座係以卡扣、鎖固、螺合或黏著之方式連接燈杯主體。 According to an embodiment of the illuminating device of the present invention, the lamp holder is connected to the lamp cup body by snapping, locking, screwing or adhesively.

依據本發明之發光裝置之一實施例,更包含一燈罩設置於基板上,以覆蓋發光單元。 According to an embodiment of the illuminating device of the present invention, a lamp cover is further disposed on the substrate to cover the illuminating unit.

承上所述,依本發明之燈杯模組及發光裝置,其可具有一或多個下述優點: As described above, the lamp cup module and the light-emitting device according to the present invention may have one or more of the following advantages:

(1)本發明之燈杯模組及發光裝置,藉由燈杯主體中分隔件與杯底及杯壁的設置,可提供能容納膠體的容置空間,使得 電源轉換單元能藉由膠體固定於燈杯主體的容置空間中,以減少電源轉換單元內部元件因外力而脫落的機率,提高燈杯模組整體的可靠度。 (1) The lamp cup module and the illuminating device of the present invention can provide a accommodating space for accommodating the colloid by the arrangement of the partitioning member and the cup bottom and the cup wall in the main body of the lamp cup, so that The power conversion unit can be fixed in the accommodating space of the lamp cup body by the colloid, so as to reduce the probability that the internal components of the power conversion unit fall off due to external force, and improve the overall reliability of the lamp cup module.

(2)本發明之燈杯模組及發光裝置,藉由在燈杯主體的容置空間中設置具散熱性質的膠體,可促進燈杯模組的散熱效率。 (2) The lamp cup module and the illuminating device of the present invention can promote the heat dissipation efficiency of the lamp cup module by providing a colloid having a heat dissipating property in the accommodating space of the lamp cup main body.

100‧‧‧燈杯主體 100‧‧‧light cup body

102‧‧‧杯底 102‧‧‧ cup bottom

104‧‧‧分隔件 104‧‧‧Parts

106‧‧‧杯壁 106‧‧‧ cup wall

200‧‧‧膠體 200‧‧‧ colloid

300‧‧‧電源轉換單元 300‧‧‧Power Conversion Unit

S1‧‧‧第一容置空間 S1‧‧‧First accommodation space

S2‧‧‧第二容置空間 S2‧‧‧Second accommodating space

H‧‧‧貫穿孔 H‧‧‧through hole

40‧‧‧散熱層 40‧‧‧heat layer

50‧‧‧散熱鰭片 50‧‧‧ Heat sink fins

400‧‧‧基板 400‧‧‧Substrate

401‧‧‧上表面 401‧‧‧ upper surface

402‧‧‧下表面 402‧‧‧ lower surface

403‧‧‧上開口 403‧‧‧Opening

500‧‧‧發光單元 500‧‧‧Lighting unit

600‧‧‧燈座 600‧‧‧ lamp holder

700、702‧‧‧電線 700, 702‧‧‧ wires

800‧‧‧燈罩 800‧‧‧shade

第1圖 係為本發明之燈杯模組之第一較佳實施例之剖面示意圖。 Figure 1 is a cross-sectional view showing a first preferred embodiment of the lamp cup module of the present invention.

第2圖 係為第1圖之燈杯模組之立體示意圖。 Figure 2 is a perspective view of the lamp cup module of Figure 1.

第3圖 係為本發明之燈杯模組之第二較佳實施例之剖面示意圖。 Figure 3 is a cross-sectional view showing a second preferred embodiment of the lamp cup module of the present invention.

第4圖 係為本發明之發光裝置之第一較佳實施例之剖面示意圖。 Figure 4 is a schematic cross-sectional view showing a first preferred embodiment of the light-emitting device of the present invention.

第5圖 係為本發明之發光裝置之第二較佳實施例之剖面示意圖。 Figure 5 is a schematic cross-sectional view showing a second preferred embodiment of the light-emitting device of the present invention.

請一併參閱第1圖及第2圖,其係為本發明之燈杯模組之第一較佳實施例之剖面示意圖及立體示意圖。如第1圖及第2圖所示,本發明之燈杯模組包含燈杯主體100、膠體200及電源轉換單元300。燈杯主體100具有杯底102、分隔件104及環設杯底102之杯壁106,且分隔件104設置於杯底102上且連接杯壁106以構成第一容置空間S1及第二容置空間S2。杯底102具 有至少一貫穿孔H連通第二容置空間S2與外界,且本發明之燈杯模組並不限定貫穿孔H之尺寸,任何可提供連接電源轉換單元300及外界電力來源之電線通過的貫穿孔皆為本發明所請求保護之範疇。此外,杯底102的貫穿孔H之尺寸也可以等於杯壁106的底部的內側緣大小,如此一來,杯底102的形狀就等同於杯壁106底部的正投影形狀,杯底102與杯壁106將無明顯分界線。膠體200填入於第一容置空間S1中,使得電源轉換單元300可藉由膠體200而固定於燈杯主體100所構成之第一容置空間S1中。如第1圖所示,杯底102、分隔件104及杯壁106係可選擇性地為一體成型。其中,燈杯主體100之材質為散熱材質,例如選自於由金、銀、銅、鐵、鋁、鈷、鎳、鋅、鈦所組成之族群,或者燈杯主體100之材質可例如為陶瓷或是塑膠。較佳地,燈杯主體100之材質為鋁。 Please refer to FIG. 1 and FIG. 2 together, which are schematic cross-sectional views and perspective views of a first preferred embodiment of the lamp cup module of the present invention. As shown in FIGS. 1 and 2, the lamp cup module of the present invention includes a lamp cup body 100, a colloid 200, and a power conversion unit 300. The cup body 100 has a cup bottom 102, a partitioning member 104, and a cup wall 106 that surrounds the cup bottom 102. The partitioning member 104 is disposed on the cup bottom 102 and connects the cup wall 106 to form a first receiving space S1 and a second capacity. Set space S2. Cup bottom 102 At least the perforation H is connected to the second accommodating space S2 and the outside, and the lamp cup module of the present invention does not limit the size of the through hole H. Any through hole that can connect the power conversion unit 300 and the external power source can be provided. All are within the scope of the claimed invention. In addition, the through hole H of the cup bottom 102 may also be equal in size to the inner edge of the bottom of the cup wall 106. Thus, the shape of the cup bottom 102 is equivalent to the orthographic shape of the bottom of the cup wall 106, the cup bottom 102 and the cup. Wall 106 will have no significant dividing line. The colloid 200 is filled in the first accommodating space S1, so that the power conversion unit 300 can be fixed in the first accommodating space S1 formed by the lamp cup main body 100 by the colloid 200. As shown in Fig. 1, the cup bottom 102, the divider 104 and the cup wall 106 are selectively integrally formed. The material of the lamp cup body 100 is a heat dissipation material, for example, selected from the group consisting of gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, and titanium, or the material of the lamp cup body 100 may be, for example, ceramic. Or plastic. Preferably, the material of the lamp cup body 100 is aluminum.

續言之,膠體200可例如為具有散熱性質之膠體,且導熱係數可例如介於1~15W/m-k之間。電源轉換單元300至少包含變壓器及電容,以達電壓轉換及儲存電力之目的。此外,為有效提高本發明之燈杯模組之散熱性質,膠體200填入於第一容置空間S1中的高度可例如大於電源轉換單元300的高度的一半且小於杯壁106的高度。須補充說明的是,電源轉換單元300可例如是至少配置有變壓器及電容的PCB板(印刷電路板),因此電源轉換單元300的高度即為PCB板之長度,或者,膠體200對電源轉換單元300中的變壓器的覆蓋面積可例如大於60%。由於膠體200為具散熱功能之材質,因此,若膠體200與電源轉換單元300之接觸面積越多(即膠體200包覆電源轉換單元300之表面積越高),則可散熱之效率越高,進而提升電源轉換效率,同時電源轉 換單元300也可以較為牢固的與燈杯主體100接合,提高燈杯模組的可靠度。此外,本發明之燈杯模組並不限定分隔件104之高度或形式,只要膠體200填入於第一容置空間S1中的高度大於電源轉換單元300的高度的一半且小於杯壁106的高度,即為本發明所請求保護之範疇,意即,任何可與杯底102及杯壁106構成第一容置空間S1及第二容置空間S2的分隔件104皆為本發明所請求保護之範疇。 In other words, the colloid 200 can be, for example, a colloid having heat dissipation properties, and the thermal conductivity can be, for example, between 1 and 15 W/m-k. The power conversion unit 300 includes at least a transformer and a capacitor for the purpose of voltage conversion and storage of power. In addition, in order to effectively improve the heat dissipation property of the lamp cup module of the present invention, the height of the colloid 200 filled in the first accommodating space S1 may be, for example, greater than half of the height of the power conversion unit 300 and smaller than the height of the cup wall 106. It should be noted that the power conversion unit 300 can be, for example, a PCB board (printed circuit board) configured with at least a transformer and a capacitor. Therefore, the height of the power conversion unit 300 is the length of the PCB board, or the colloid 200 is connected to the power conversion unit. The coverage area of the transformer in 300 can be, for example, greater than 60%. Since the colloid 200 is a material having a heat dissipation function, if the contact area of the colloid 200 with the power conversion unit 300 is increased (that is, the surface area of the colloid 200 covering the power conversion unit 300 is higher), the heat dissipation efficiency is higher, and further Improve power conversion efficiency while power is turned The changing unit 300 can also be firmly engaged with the lamp cup body 100 to improve the reliability of the lamp cup module. In addition, the lamp cup module of the present invention does not limit the height or form of the partition member 104 as long as the height of the colloid 200 filled in the first accommodating space S1 is greater than half of the height of the power conversion unit 300 and smaller than the cup wall 106. The height is the scope of the claimed invention, that is, any partition 104 that can form the first accommodating space S1 and the second accommodating space S2 with the cup bottom 102 and the cup wall 106 is claimed in the present invention. The scope.

此外,為提高本發明之燈杯模組之散熱功效,更可於燈杯主體100之內表面上塗佈散熱層及/或於杯壁上設置一散熱鰭片。請接續參閱第3圖,其係為本發明之燈杯模組之第二較佳實施例之剖面示意圖。如第3圖所示,本發明之燈杯模組之第二較佳實施例與第一較佳實施例之差異處僅在於,在第二較佳實施例中燈杯主體100之內表面(例如杯壁106、杯底102及分隔件104中至少一者)上塗佈有散熱層40以及杯壁106上設置有散熱鰭片50,以提高燈杯模組之散熱功效,較佳地,散熱層的材質為鋁或氧化鋁。在此須說明的是,雖然第4圖中的燈杯模組兼具有散熱層40及散熱鰭片50,然而,使用者可視實際需求選擇性地設置散熱層40及散熱鰭片50中至少一者。亦即,在本發明之燈杯模組中,並不限定須同時設置散熱層40及散熱鰭片50。此外,本發明並不限定散熱層40之厚度及材質,任何可提供散熱功能之散熱層40的厚度及材質皆為本發明所請求保護之範疇。本發明亦不限定散熱鰭片50之形式及數量,任何可提供散熱功能之散熱鰭片50皆為本發明所請求保護之範疇。 In addition, in order to improve the heat dissipation effect of the lamp cup module of the present invention, a heat dissipation layer may be coated on the inner surface of the lamp cup body 100 and/or a heat dissipation fin may be disposed on the cup wall. Please refer to FIG. 3, which is a cross-sectional view of a second preferred embodiment of the lamp cup module of the present invention. As shown in FIG. 3, the second preferred embodiment of the lamp cup module of the present invention differs from the first preferred embodiment only in the inner surface of the lamp cup body 100 in the second preferred embodiment ( For example, at least one of the cup wall 106, the cup bottom 102 and the partition member 104 is coated with the heat dissipation layer 40 and the heat dissipation fin 50 is disposed on the cup wall 106 to improve the heat dissipation effect of the lamp cup module. Preferably, The heat dissipation layer is made of aluminum or aluminum oxide. It should be noted that although the lamp cup module in FIG. 4 has both the heat dissipation layer 40 and the heat dissipation fins 50, the user can selectively provide at least the heat dissipation layer 40 and the heat dissipation fins 50 according to actual needs. One. That is, in the lamp cup module of the present invention, it is not limited to simultaneously provide the heat dissipation layer 40 and the heat dissipation fins 50. In addition, the present invention does not limit the thickness and material of the heat dissipation layer 40. The thickness and material of any heat dissipation layer 40 that can provide a heat dissipation function are within the scope of the claimed invention. The present invention also does not limit the form and number of heat dissipating fins 50. Any heat dissipating fins 50 that provide a heat dissipating function are within the scope of the claimed invention.

值得一提的是,藉由分隔件104將燈杯主體100隔出第一容置空間S1與第二容置空間S2後,可直接填入膠體200於第 一容置空間S1中以固定電源轉換單元300,改善習知技術中在燈杯的兩開口的其中之一必須先覆蓋一燈板才能灌膠之缺點,且習知技術的作法還可能有漏膠問題,造成電源轉換單元固定不牢或者是燈杯外型不美觀。而膠體200選擇導熱係數介於1~15W/m-k的導熱膠,除了固體本身即具有熱傳導速率優於氣體的優點,導熱係數介於1~15W/m-k的導熱膠更能較快地排出電源轉換單元300所產生的熱,尤其是對變壓器而言,維持穩定的操作溫度才能使電源轉換效率維持在較好的水平。 It is worth mentioning that after the lamp cup body 100 is separated from the first accommodating space S1 and the second accommodating space S2 by the partition member 104, the colloid 200 can be directly filled in the first In the accommodating space S1, the power conversion unit 300 is fixed to improve the disadvantages in the prior art that one of the two openings of the lamp cup must cover a light board to fill the glue, and the conventional technique may also have a leak. The problem of glue causes the power conversion unit to be fixed firmly or the appearance of the lamp cup is not beautiful. The colloid 200 selects the thermal conductive adhesive with a thermal conductivity of 1~15W/mk, except that the solid itself has the advantage of better heat transfer rate than the gas, and the thermal conductive adhesive with thermal conductivity of 1~15W/mk can discharge the power faster. The heat generated by unit 300, especially for the transformer, maintains a stable operating temperature to maintain power conversion efficiency at a good level.

請接續參閱第4圖,其係為本發明之發光裝置之第一較佳實施例之剖面示意圖。如第4圖所示,本發明之發光裝置包括基板400、設置於基板400之上表面401上的至少一發光單元500、前述第一較佳實施例中的燈杯模組、燈座600及電線700、702。其中,基板400覆蓋燈杯主體100之一上開口403,且燈杯模組之電源轉換單元300電性連接發光單元500,其電性連接方式可以是在基板400的下表面402設置有電極接墊(未繪示),由電線702連接電源轉換單元300與電極接墊,或者是電源轉換單元300也設有接墊,再將基板400與電源轉換單元300焊接而成,其中基板的上表面401與下表面402須導通,以達到電性連接的功效,又或者是將電線702直接穿過具有孔洞的基板400,如第4圖,以直接與發光單元500電性連接。發光單元500可例如為發光二極體(LED)。燈座600連接燈杯模組之燈杯主體100且覆蓋燈杯主體100之貫穿孔H。電線700電性連接電源轉換單元300的另一端,並經由燈杯模組之杯底102之貫穿孔H連接燈座600,燈座600進一步與外部電源供應器連接(未繪示),外部電源供應器例如是家用插座或電池,可供給發光裝置電力以發光。其中, 燈座600可選擇性地以卡扣、鎖固、螺合或黏著之方式連接燈杯主體100,燈座600與燈杯主體100之間可加裝一絕緣材質之連接頭(未繪示),或是燈座600與燈杯主體100之杯壁106為導電性相異之材料,舉例來說,杯壁106選用自絕緣材料,而燈座600選用金屬材料,如此可避免使用者觸電等安全問題。此外,如第4圖所示,本發明之發光裝置更可包含燈罩800設置於基板400上,以覆蓋發光單元500。其中,燈罩800可例如為透明或半透明罩體,以避免發光單元500所發出之光線的強度因穿透燈罩800而有大幅度的減弱。或者,燈罩800也可以是具波長轉換性質之罩體,以對發光單元500發出之光線進行波長轉換而得特定波長之光線。 Please refer to FIG. 4, which is a cross-sectional view of a first preferred embodiment of the light-emitting device of the present invention. As shown in FIG. 4, the light-emitting device of the present invention includes a substrate 400, at least one light-emitting unit 500 disposed on the upper surface 401 of the substrate 400, the lamp cup module and the lamp holder 600 in the first preferred embodiment, and Wires 700, 702. The substrate 400 covers the opening 403 of the lamp cup body 100, and the power conversion unit 300 of the lamp cup module is electrically connected to the light emitting unit 500. The electrical connection may be performed by providing an electrode connection on the lower surface 402 of the substrate 400. A pad (not shown) is connected to the power conversion unit 300 and the electrode pad by the wire 702, or the power conversion unit 300 is also provided with a pad, and then the substrate 400 is soldered to the power conversion unit 300, wherein the upper surface of the substrate The 401 and the lower surface 402 are to be electrically connected to achieve electrical connection, or the wire 702 is directly passed through the substrate 400 having a hole, as shown in FIG. 4, to be directly electrically connected to the light emitting unit 500. The light emitting unit 500 can be, for example, a light emitting diode (LED). The socket 600 is connected to the lamp cup body 100 of the lamp cup module and covers the through hole H of the lamp cup body 100. The electric wire 700 is electrically connected to the other end of the power conversion unit 300, and is connected to the lamp holder 600 via the through hole H of the cup bottom 102 of the lamp cup module. The lamp holder 600 is further connected to an external power supply (not shown), and the external power supply The supplier is, for example, a household outlet or a battery that can supply power to the lighting device to illuminate. among them, The lamp holder 600 can be selectively connected to the lamp cup body 100 by means of a buckle, a lock, a screw or a glue. A connector of an insulating material can be added between the lamp holder 600 and the lamp cup body 100 (not shown). Or the lamp holder 600 and the cup wall 106 of the lamp cup body 100 are made of a material different in conductivity. For example, the cup wall 106 is made of a self-insulating material, and the lamp holder 600 is made of a metal material, so that the user can avoid electric shock, etc. safe question. In addition, as shown in FIG. 4, the light-emitting device of the present invention may further include a lamp cover 800 disposed on the substrate 400 to cover the light-emitting unit 500. The lampshade 800 can be, for example, a transparent or translucent cover to prevent the intensity of the light emitted by the light-emitting unit 500 from being greatly weakened by penetrating the lamp cover 800. Alternatively, the lamp cover 800 may be a cover having a wavelength conversion property to wavelength-convert the light emitted from the light-emitting unit 500 to obtain light of a specific wavelength.

此外,如同前述本發明之燈杯模組之第二較佳實施例,為提高本發明之發光裝置之散熱功效,更可於燈杯主體之內表面上塗佈散熱層及/或於杯壁上設置一散熱鰭片。如第5圖所示,其係為本發明之發光裝置之第二較佳實施例之剖面示意圖。本發明之發光裝置之第二較佳實施例與第一較佳實施例之差異處僅在於,在第二較佳實施例中燈杯主體100之內表面上塗佈有散熱層40以及杯壁106上設置有散熱鰭片50,以提高燈杯模組之散熱功效,散熱鰭片50更可向上延伸至覆蓋部分的燈罩800,如此可藉由增加散熱面積而提升散熱功效。同樣地,如同前面有關於燈杯模組之第二較佳實施例的說明,雖然第5圖中的發光裝置兼具有散熱層40及散熱鰭片50,使用者可視實際需求選擇性地設置散熱層40及散熱鰭片50中至少一者。亦即,在本發明之發光裝置中,並不限定須同時設置散熱層40及散熱鰭片50。 In addition, as in the second preferred embodiment of the lamp cup module of the present invention, in order to improve the heat dissipation effect of the light-emitting device of the present invention, a heat dissipation layer and/or a cup wall may be coated on the inner surface of the lamp cup body. Set a heat sink fin on it. As shown in Fig. 5, it is a schematic cross-sectional view of a second preferred embodiment of the light-emitting device of the present invention. The second preferred embodiment of the illuminating device of the present invention differs from the first preferred embodiment only in that the inner surface of the lamp cup body 100 is coated with a heat dissipation layer 40 and a cup wall in the second preferred embodiment. The heat dissipation fins 50 are disposed on the 106 to improve the heat dissipation effect of the lamp cup module. The heat dissipation fins 50 can extend upward to the cover portion of the lamp cover 800, so that the heat dissipation effect can be improved by increasing the heat dissipation area. Similarly, as described above with respect to the second preferred embodiment of the lamp cup module, although the light-emitting device of FIG. 5 has both the heat dissipation layer 40 and the heat dissipation fins 50, the user can selectively set according to actual needs. At least one of the heat dissipation layer 40 and the heat dissipation fins 50. That is, in the light-emitting device of the present invention, it is not necessary to provide the heat dissipation layer 40 and the heat dissipation fins 50 at the same time.

綜上所述,本發明之燈杯模組及發光裝置,藉由燈杯主 體中分隔件與杯底及杯壁的設置,提供膠體與電源轉換單元的容置空間,可輕易地固定電源轉換單元於燈杯主體中,解決習知燈杯中難以灌膠之技術問題;另外,選擇具散熱性質的膠體,還可提高燈杯模組及發光裝置之散熱效果。 In summary, the lamp cup module and the illuminating device of the present invention are powered by a lamp cup main The partitioning member and the bottom of the cup and the wall of the cup provide the accommodation space of the colloid and the power conversion unit, and the power conversion unit can be easily fixed in the main body of the lamp cup, thereby solving the technical problem that it is difficult to fill the glue in the conventional lamp cup; In addition, the selection of the colloid with heat dissipation properties can also improve the heat dissipation effect of the lamp cup module and the illuminating device.

以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

100‧‧‧燈杯主體 100‧‧‧light cup body

102‧‧‧杯底 102‧‧‧ cup bottom

104‧‧‧分隔件 104‧‧‧Parts

106‧‧‧杯壁 106‧‧‧ cup wall

200‧‧‧膠體 200‧‧‧ colloid

300‧‧‧電源轉換單元 300‧‧‧Power Conversion Unit

S1‧‧‧第一容置空間 S1‧‧‧First accommodation space

S2‧‧‧第二容置空間 S2‧‧‧Second accommodating space

H‧‧‧貫穿孔 H‧‧‧through hole

Claims (12)

一種燈杯模組,包括:一燈杯主體,具有一杯底、一分隔件及環設該杯底之一杯壁,其中該分隔件係設置於該杯底上且連接該杯壁以構成一第一容置空間及一第二容置空間,且該杯底具有至少一貫穿孔連通該第二容置空間與外界;一膠體,填入於該第一容置空間中;以及一電源轉換單元,藉由該膠體固定於該第一容置空間中。 A lamp cup module includes: a lamp cup body having a cup bottom, a partition member and a cup wall enclosing the cup bottom, wherein the partition member is disposed on the cup bottom and connected to the cup wall to constitute a first An accommodating space and a second accommodating space, wherein the bottom of the cup has at least a continuous through hole communicating with the second accommodating space and the outside; a colloid is filled in the first accommodating space; and a power conversion unit is The gel is fixed in the first accommodating space. 如申請專利範圍第1項所述的燈杯模組,其中該杯底、該分隔件及該杯壁係一體成型。 The lamp cup module of claim 1, wherein the cup bottom, the partition member and the cup wall are integrally formed. 如申請專利範圍第1項所述的燈杯模組,其中該燈杯主體之材質為鋁。 The lamp cup module of claim 1, wherein the lamp cup body is made of aluminum. 如申請專利範圍第1項所述的燈杯模組,更包含一散熱層塗佈於該燈杯主體之一內表面上。 The lamp cup module of claim 1, further comprising a heat dissipation layer coated on an inner surface of the body of the lamp cup. 如申請專利範圍第1項所述的燈杯模組,其中該膠體之導熱係數介於1~15W/m-k之間。 The lamp cup module according to claim 1, wherein the colloid has a thermal conductivity of between 1 and 15 W/m-k. 如申請專利範圍第1項所述的燈杯模組,其中該電源轉換單元至少包含一變壓器及一電容。 The lamp cup module of claim 1, wherein the power conversion unit comprises at least a transformer and a capacitor. 如申請專利範圍第1項所述的燈杯模組,其中該膠體填入於該第一容置空間中的高度大於該電源轉換單元的高度的一半且小於該杯壁的高度。 The lamp cup module of claim 1, wherein a height of the glue filled in the first accommodating space is greater than a half of a height of the power conversion unit and smaller than a height of the cup wall. 如申請專利範圍第6項所述的燈杯模組,其中該膠體對該電源轉換單元中的該變壓器的覆蓋面積大於60%。 The lamp cup module of claim 6, wherein the colloid has a coverage area of the transformer in the power conversion unit of greater than 60%. 如申請專利範圍第1項所述的燈杯模組,更包含一散熱鰭片設置於該杯壁上。 The lamp cup module of claim 1, further comprising a heat dissipating fin disposed on the wall of the cup. 一種發光裝置,包括:一基板;至少一發光單元,設置於該基板之一上表面上;一如申請專利範圍第1至9項中任一項所述之燈杯模組,其中該基板覆蓋該燈杯主體之一上開口,且該燈杯模組之該電源轉換單元電性連接該發光單元;一燈座,連接該燈杯模組之該燈杯主體,且覆蓋該燈杯模組之該貫穿孔;以及至少一電線,電性連接該電源轉換單元,並經由該燈杯主體之該杯底之該貫穿孔連接該燈座。 A light-emitting device comprising: a substrate; at least one light-emitting unit disposed on an upper surface of the substrate; the light cup module according to any one of claims 1 to 9, wherein the substrate is covered One of the body of the lamp cup is open, and the power conversion unit of the lamp cup module is electrically connected to the light unit; a lamp holder is connected to the lamp cup body of the lamp cup module, and the lamp cup module is covered And the at least one electric wire is electrically connected to the power conversion unit, and the lamp holder is connected through the through hole of the cup bottom of the lamp cup body. 如申請專利範圍第10項所述的發光裝置,其中該燈座係以卡扣、鎖固、螺合或黏著之方式連接該燈杯主體。 The illuminating device of claim 10, wherein the lamp holder is connected to the lamp cup body by snapping, locking, screwing or adhesive. 如申請專利範圍第10項所述的發光裝置,更包含一燈罩設置於該基板上,以覆蓋該發光單元。 The illuminating device of claim 10, further comprising a lamp cover disposed on the substrate to cover the illuminating unit.
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